USRE38223E1 - Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge - Google Patents

Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge Download PDF

Info

Publication number
USRE38223E1
USRE38223E1 US09/504,635 US50463500A USRE38223E US RE38223 E1 USRE38223 E1 US RE38223E1 US 50463500 A US50463500 A US 50463500A US RE38223 E USRE38223 E US RE38223E
Authority
US
United States
Prior art keywords
field emission
carbon nano
emission cathode
cylinders
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US09/504,635
Inventor
Till Keesmann
Hubert Grosse-Wilde
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Nanotech Holdings Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US09/504,635 priority Critical patent/USRE38223E1/en
Priority to US10/408,871 priority patent/USRE38561E1/en
Assigned to KEESMANN, TILL reassignment KEESMANN, TILL ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GROSSE-WILDE, HUBERT
Priority to US10/409,363 priority patent/US20040036402A1/en
Application granted granted Critical
Publication of USRE38223E1 publication Critical patent/USRE38223E1/en
Assigned to NANO-PROPRIETARY, INC. reassignment NANO-PROPRIETARY, INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SI DIAMOND TECHNOLOGY, INC.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02Main electrodes
    • H01J1/30Cold cathodes, e.g. field-emissive cathode
    • H01J1/304Field-emissive cathodes
    • H01J1/3042Field-emissive cathodes microengineered, e.g. Spindt-type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2201/00Electrodes common to discharge tubes
    • H01J2201/30Cold cathodes
    • H01J2201/304Field emission cathodes
    • H01J2201/30403Field emission cathodes characterised by the emitter shape
    • H01J2201/30423Microengineered edge emitters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2201/00Electrodes common to discharge tubes
    • H01J2201/30Cold cathodes
    • H01J2201/304Field emission cathodes
    • H01J2201/30446Field emission cathodes characterised by the emitter material
    • H01J2201/30453Carbon types
    • H01J2201/30469Carbon nanotubes (CNTs)
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/84Manufacture, treatment, or detection of nanostructure
    • Y10S977/849Manufacture, treatment, or detection of nanostructure with scanning probe
    • Y10S977/86Scanning probe structure
    • Y10S977/875Scanning probe structure with tip detail
    • Y10S977/876Nanotube tip
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/902Specified use of nanostructure
    • Y10S977/932Specified use of nanostructure for electronic or optoelectronic application
    • Y10S977/939Electron emitter, e.g. spindt emitter tip coated with nanoparticles

Definitions

  • the invention relates to a field emission cathode device of an electrically conducting material and with a narrow, rod-shaped geometry or a knife edge to achieve high amplification of the electric field strength, such that the electron-emitting part of the field emission cathode has cylindrical molecules.
  • the invention also relates to a method for producing such a field emission cathode device.
  • Field emission means the emission of electrons from the surface of an electric conductor under the action of an electric field exceeding 10 9 V/m. In practice, such field strengths are realized at sharp edges or tips, where the field strength is amplified. High vacuum is necessary to avoid gas discharges.
  • Field emission cathodes are used, for example, in field electron microscopes, in electron accelerators, in high-power switches (OS DE 39 24 745 A1) and in field emission diodes and field emitter arrays for vacuum microelectronics (thus for example Busta, Vacuum microelectronics—1992, Journal of Micromechanics and Microengineering, 2 (1992), pp. 53-60, and Iannazzo, A survey of the present status of vacuum microelectronics, Solid State Electronics, 36 (1993), pp. 301 to 320).
  • a tungsten wire can be used as the field emission cathode, whose tip becomes so fine by etching that it can no longer be seen in an optical microscope. Also by etching, the ends of carbon fibers can be made sufficiently fine (Heinrich, Essig, Geiger, Appl. Phys. (1977) 12, pp. 197-202) to serve as a field emission cathode.
  • field emission cathodes In vacuum microelectronics, field emission cathodes generally are produced by the methods of microprocess technology, by etching and sputtering, using lithographically produced masks (see Busta, Vacuum microelectronics—1992, Journal of Micromechanics and Microengineering, 2 (1992), pp. 53-60). By this method, one can produce conical tips with a radius of curvature of a few nm or wedge-shaped cutting edges with comparable radii of curvature. As materials for the cathode, one can use, for example, molybdenum, lanthanum hexaboride, hafnium, diamond-like carbon (B. C. Djubua, N. N. Chubun, Emission properties of Spindt-type cold cathodes with different emission cone material, IEEE Transactions on Electron Devices, 38 (1991) No. 10, pp. 2314-2316).
  • the like applies to field emission cathodes which are produced by sputtering techniques. The reason for this primarily is that the material structure of the emission tips is not uniquely defined.
  • the geometry and microstructure of the tip and thus the work function of the electrons can vary within such wide limits that the electron streams from several tips, which were produced in one process, can differ by orders of magnitude, and furthermore change with operating time.
  • field emission cathodes for vacuum microelectronics cannot be produced in their optimal geometry by the prior art.
  • Field strength calculations for various geometries of the tips show that the best shape of a field emission cathode is a narrow rod (Utsumi, Vacuum microelectronics: What's new and exciting, IEEE Transactions on Electron Devices 38 (1991), pp. 2276-2283).
  • the present methods of microstructure technology can produce at most wedge-shaped tips in a defined manner.
  • Carbon nano-cylinders were observed for the first time in an electron microscope by Iijima (Nature, 354 (1991), p. 56). They can now be produced in large quantities, for example at the cathode of a visible arc (Iijima, Materials Science and Engineering, B19 (1993), pp. 172-180). In the presence of iron or cobalt, one can produce single-shell carbon nano-cylinders. Theoretical calculations show that, depending on the helicity of the hexagonal ring structure, the walls of the carbon nano-cylinders are electrically conducting or semiconducting (Saito, Fujita, Dresselhaus, Dresselhaus, Materials Science and Engineering, B19 (1993), pp. 185-191). The carbon nano-cylinders can also be filled with metals, for example with lead. Other methods for producing carbon nano-cylinders are described in the literature:
  • Carbon nano-cylinders can be produced by the catalytic decomposition of acetylene through iron particles at about 700° C. (Jose-Yacaman, Miki-Yoshida, Rendon, Applied Physics Letters 62 (6) 1993, pp. 657-659).
  • single-shell carbon nano-cylinders can be found in the carbon deposit on the chamber walls of a visible arc apparatus (Iijima, Nature 363 (1993), pp. 603-605).
  • carbon nano-cylinders By sputtering ultra-pure graphite with electron beams in vacuum, carbon nano-cylinders can be produced on substrates consisting of various materials, such that the carbon nano-cylinders are aligned in the direction of the vapor jet (Kosakovskaya et al., JETP Lett., 56 (1992), p. 26).
  • disordered carbon particles generally are also deposited on the substrate. These can be removed, for example, by treatment in an oxidizing atmosphere at an elevated temperature up to 500° C., preferably 400° C.
  • the carbon nano-cylinders at the end caps can be opened in a similar manner in an oxidizing atmosphere (air, CO 2 , or pure oxygen). This offers the possibility of filling the carbon nano-cylinders with metals, as described for a filling with lead by Ajayan and Iijima in Nature 361, p. 333.
  • the present invention is based on the object or on the technical problem of specifying a field emission cathode which avoids the disadvantages of the prior art, assures high emission quality, makes possible a longer lifetime, and in particular resists bombardment with residual gas ions. Furthermore, the present invention is based on the object or on the technical problem of specifying a method for producing a field emission cathode of the type mentioned in the introduction, so as to assure technically optimal manufacture together with economy.
  • the inventive field emission cathode device consists of an electrically conducting material and having the shape of a narrow rod or a knife edge to achieve high magnification of the electric field strength, such that the electron emitting part of the field emission cathode has cylindrical molecules, wherein the cylindrical molecules are formed at least in part as single-shell or multiple-shell carbon nano-cylinders.
  • the inventive method for producing the field emission cathode device with carbon non-cylinders which have been expanded during the gas phase.
  • An especially preferred design of the inventive field emission cathode is characterized in that carbon nano-cylinders are used as field emission cathodes.
  • Single-shell carbon nano-cylinders with a diameter of about 1 nanometer and a length greater than 1 micrometer, or also multiple-shell ones with a diameter up to several nanometers can be produced. Bundles of single-shell carbon nano-cylinders with diameters of about 5 nanometers can also be produced.
  • the walls of the carbon nano-cylinders consist of carbon atoms in a hexagonal pattern, while the end caps additionally contain 5-ring structures.
  • the individual carbon atoms of the carbon nano-cylinders are strongly bound chemically, as a result of which the carbon nano-cylinders have extremely great mechanical strength. This also results in their high sputtering strength in comparison to randomly grown tips, which are sputtered according to the prior art.
  • the production method can be used to produce either individual field emission cathodes or also field emission cathode arrays.
  • FIG. 1 shows an individual field emission element of a field emitter array, such as can be produced by the prior art.
  • FIG. 2 shows the same element in accordance with the first inventive process step, so as to provide the emission tip with carbon nano-cylinders.
  • FIG. 3 shows the same element after carbon has been sputtered.
  • FIG. 4 shows the same element after the last process step, in its final state.
  • FIG. 5 shows a section of a field emitter array with individually actuatable emission tips.
  • FIG. 6 shows the cross section of a graphite wafer with a knife edge.
  • FIG. 7 shows in cross section a prepared block of ten graphite wafers with a clamping fixture for sputtering carbon nano-cylinders.
  • FIG. 8 shows a diode for the power pulse technique with an inventively prepared field emission cathode.
  • field emission cathodes of carbon nano-cylinders can be produced, such as can be used, for example, as cathodes for diodes or switches.
  • field emission cathodes for a field emitter array can be produced by the methods of microstructure technology.
  • FIG. 6 shows such a graphite wafer 100 with a knife edge 101 , beveled on one side.
  • FIG. 7 shows how ten of these graphite wafers 100 a to 100 j are collected together into a block in a clamping fixture 103 , in such a way that the knife edges 101 a to 101 j on one side of the block lie in one plane and an aluminum foil or Teflon foil is situated between each of the graphite wafers as a spacer 102 a to 102 j.
  • the clamping fixture consists of two brass blocks, into which recesses have been milled to receive the ten graphite wafers with their spacer foils. These blocks are screwed together by two screws 104 .
  • the prepared block is installed in a vacuum apparatus, in which a target of ultra-pure graphite is sputtered with an electron beam.
  • the graphite target and the block are arranged here in such a way that the carbon vapor strikes the plane of the graphite knife edges perpendicularly. Under these conditions, carbon nano-cylinders grow on the knife edges individually and in bundles of several cylinders, in the direction of the carbon vapor beam. When a layer several tenths of a micrometer thick has been reached, the sputtering process is terminated.
  • the knife edges and the beveled surfaces of the graphite wafers are now coated with carbon nano-cylinders, which have extremely high mechanical strength.
  • the microstructure of the surface is characterized by cylindrical elevations with sharp tips which have a radius of curvature of a few nanometers.
  • FIG. 8 shows how a graphite wafer prepared in this manner can be used in a diode that operates as a switching element.
  • An anode 112 with a large surface and a cathode pin 111 are fused in an evacuated glass flask 110 .
  • the graphite wafer 100 with its knife edge 101 is fastened on the cathode pin in such a way that it is situated opposite the anode at a distance of about 1 mm. If a sufficiently high negative voltage is applied to the cathode, an electrical current can flow through the diode.
  • knife edges are characterized in that, in contrast to knife edges without carbon nano-cylinders, they amplify the electric field much more. A consequence of this is that, given the same voltage, the field emission current is much greater. Furthermore, the emission tips are not already destroyed after a brief operating time by the ions of the residual gas.
  • the production method described above can easily be transferred to a rather large number of graphite wafers with longer knife edges. Also, the edge angle and the spacing between the knife edges can be varied within broad limits. This therefore represents a field emission cathode whose electron-emitting surface and current density can be adapted to many applications, for example in power pulse technology.
  • FIG. 1 shows a field emitter cathode with a gate electrode.
  • Reference No. 10 designates the electrically conducting, n-doped silicon substrate, 11 designates a sputtered insulating layer about 2 ⁇ m thick and consisting of SiO 2 .
  • Reference No. 10 designates the electrically conducting, n-doped silicon substrate, 11 designates a sputtered insulating layer about 2 ⁇ m thick and consisting of SiO 2 .
  • the gate openings 14 of the molybdenum layer are preferably chosen to lie between 0.4 and 0.8 ⁇ m.
  • a sacrificial layer of aluminum is applied to the field emitter array which, in this form, already corresponds to the prior art. This is done by rotating the substrate perpendicular to the surface and sputtering it with aluminum at slant incidence. This type of sputtering prevents the aluminum from depositing in the cathode openings.
  • FIG. 2 shows a field emitter element produced in accordance with this process step; the aluminum sacrificial layer is designated by 20 .
  • the graphite target disposed above the field emitter array is sputtered by an electron beam, and the carbon is deposited on the field emitter array.
  • a portion of the carbon atomic beam penetrates through the gate opening and deposits on the cathode tips.
  • cylindrical, parallel graphite fibers thus form in the direction of the incident atomic beam.
  • the growth process is improved if, during this process step, a voltage U G of the order of 50 V is applied between the cathode and gate layer.
  • FIG. 3 shows a field emitter element made in accordance with this process step.
  • 30 designates the deposited carbon layer on the gate electrode
  • 31 designates one or more carbon nano-cylinders on the molybdenum tip.
  • the voltage source to create the field strength at the cathode tip is also shown schematically.
  • the growth of the carbon nano-cylinders can be controlled through the emission current Ic.
  • the process must be terminated at the proper time, when the carbon nano-cylinders have reached a length of several tenths of a ⁇ m. It is here advantageous to modulate the gate voltage V G slightly.
  • the quotient dIc/dU G is designated as the differential slope and can be used as a measure of the quality of the field emitter array.
  • the carbon layer with the aluminum sacrificial layer is etched off, so that, after this step, the field emitter element looks as shown in FIG. 4 .
  • the cathodes instead of producing the cathodes so as to be electrically connected in their totality and lying at the same potential, they can also be produced in such a way that only one row of them is electrically coupled together.
  • the gate electrodes can be produced in such a way that only one row of them is electrically coupled together, although perpendicular to the direction of the row of cathodes that are connected together. This then offers the possibility of driving each cathode individually.
  • This type of circuit is already known and is used, for example, for a screen with digitally actuatable image points, from LETI Company (described in Busta loc. cit., pp. 69-70).
  • This circuit for the case of three rows of cathodes and three rows of gates, is shown schematically, in a top view, in FIG. 5 .
  • Electrically conducting cathode tracks K 1 , K 2 , and K 3 for example consisting of n-doped silicon, are applied on a substrate with an electrically non-conducting surface 1 , along a width of a few micrometers.
  • the following insulating layer of silicon dioxide (not shown), about 2 micrometers thick, corresponds to the arrangement described by Spindt.
  • the gate electrodes G 1 , G 2 , and G 3 are applied in strips just like the cathodes, but perpendicular to the direction of the cathode tracks.
  • the further process steps correspond to the steps used to produce the field emitter cathodes that cannot be individually actuated.
  • the center electrode of the last column in FIG. 5 can now be driven in such a way, for example, that a negative voltage is applied to the cathode strips K 2 and a negative voltage is applied to the gate strips G 3 ; a field emission current will then flow from this electrode, which can be measured in the cathode or gate circuit or which can be detected by a suction anode, which is not shown here.
  • this arrangement of the cathode strips and gate strips can be used to control specifically the production process of each individual cathode. It is then possible to measure the emission current from each field emitter tip during the production process, and not merely the total amount from the entire field emitter array. By turning off the voltage at one field emission cathode, one can favor the formation of an end cap with 5-ring structures, so that no further growth will occur.
  • carbon nano-cylinders it is advantageous for the formation of carbon nano-cylinders to form them at elevated temperatures of 100° to 700° C. (degrees Celsius), preferably 300°-400° C.
  • cathodes produced conventionally—by sputtering in vacuum by the methods of microstructure technology or by etching are coated with electrically conducting host molecules.
  • the host molecules can be fullerenes, hetero-fullerenes, or their derivatives, especially also endohedral or exohedral compounds, for example, of the type M 3 C 60 or M 3 C 70 , where M designates a metal, preferably the alkali metals potassium or sodium.
  • the host molecules can also be applied to the cathode in crystalline form, for example C 60 in the form of fullerite.
  • the field emission cathodes whose resistivity and emission properties have been improved by coating them with carbon nano-cylinders or also with fullerenes and their derivatives, in molecular or crystalline form, can be used wherever thermionic cathodes in vacuum were used previously, and in all applications of vacuum microelectronics. Typical fields of application will be listed below, without this listing being exhaustive, and a person skilled in the art can easily transfer the inventive field emission cathode to similar applications.
  • Single emitter tips, emitter edges, or emitter arrays can be used as electron sources for X-ray tubes, X-ray tubes with planar, drivable cathodes, for example for computer tomography, electron beam lithography, miniature electron microscopes, power switching tubes, diodes or triodes, logic circuit elements, video screens.
  • Field emission cathodes can be used in miniaturized electronic components, such as ultra-high frequency diodes, ultra-high frequency triodes, diodes and triodes in combination with semiconductor components, temperature-stable diodes and triodes in the engines of motor vehicles, temperature-stable logic components, electronic components with diode and triode functions, which are particularly resistant to electromagnetic interference and ionizing radiation, pressure sensors, in which the cathode gate distance is influenced by the pressure, microwave generators and amplifiers.
  • miniaturized electronic components such as ultra-high frequency diodes, ultra-high frequency triodes, diodes and triodes in combination with semiconductor components, temperature-stable diodes and triodes in the engines of motor vehicles, temperature-stable logic components, electronic components with diode and triode functions, which are particularly resistant to electromagnetic interference and ionizing radiation, pressure sensors, in which the cathode gate distance is influenced by the pressure, microwave generators and amplifiers.
  • field emission cathodes can be used preferably as electron sources with a large surface, yielding a high current density, drivable electron sources for planar video screens with a high light density in monochromatic or color designs.

Abstract

A field emission cathode device consisting of an electrically conducting material and with a narrow, rod-shaped geometry or a knife edge, to achieve a high amplification of the electric field strength is characterized in that the electron-emitting part of the field emission cathode at least partly has preferred cylindrical host molecules and/or compounds with host compounds and/or cylindrical atomic networks, possibly with end caps with diameters measuring in the nanometer range.

Description

The invention relates to a field emission cathode device of an electrically conducting material and with a narrow, rod-shaped geometry or a knife edge to achieve high amplification of the electric field strength, such that the electron-emitting part of the field emission cathode has cylindrical molecules. The invention also relates to a method for producing such a field emission cathode device.
Field emission means the emission of electrons from the surface of an electric conductor under the action of an electric field exceeding 109 V/m. In practice, such field strengths are realized at sharp edges or tips, where the field strength is amplified. High vacuum is necessary to avoid gas discharges.
DESCRIPTION OF THE PRIOR ART
Field emission cathodes are used, for example, in field electron microscopes, in electron accelerators, in high-power switches (OS DE 39 24 745 A1) and in field emission diodes and field emitter arrays for vacuum microelectronics (thus for example Busta, Vacuum microelectronics—1992, Journal of Micromechanics and Microengineering, 2 (1992), pp. 53-60, and Iannazzo, A survey of the present status of vacuum microelectronics, Solid State Electronics, 36 (1993), pp. 301 to 320). A tungsten wire can be used as the field emission cathode, whose tip becomes so fine by etching that it can no longer be seen in an optical microscope. Also by etching, the ends of carbon fibers can be made sufficiently fine (Heinrich, Essig, Geiger, Appl. Phys. (1977) 12, pp. 197-202) to serve as a field emission cathode.
In vacuum microelectronics, field emission cathodes generally are produced by the methods of microprocess technology, by etching and sputtering, using lithographically produced masks (see Busta, Vacuum microelectronics—1992, Journal of Micromechanics and Microengineering, 2 (1992), pp. 53-60). By this method, one can produce conical tips with a radius of curvature of a few nm or wedge-shaped cutting edges with comparable radii of curvature. As materials for the cathode, one can use, for example, molybdenum, lanthanum hexaboride, hafnium, diamond-like carbon (B. C. Djubua, N. N. Chubun, Emission properties of Spindt-type cold cathodes with different emission cone material, IEEE Transactions on Electron Devices, 38 (1991) No. 10, pp. 2314-2316).
A disadvantage in the use of tips and edges, which have been produced by the known methods, is that the electron stream declines with operating time, since the tips or edges are destroyed by the positive ions of the unavoidable residual gas in the system. The like applies to field emission cathodes which are produced by sputtering techniques. The reason for this primarily is that the material structure of the emission tips is not uniquely defined. Thus, the geometry and microstructure of the tip and thus the work function of the electrons can vary within such wide limits that the electron streams from several tips, which were produced in one process, can differ by orders of magnitude, and furthermore change with operating time.
Furthermore, field emission cathodes for vacuum microelectronics cannot be produced in their optimal geometry by the prior art. Field strength calculations for various geometries of the tips show that the best shape of a field emission cathode is a narrow rod (Utsumi, Vacuum microelectronics: What's new and exciting, IEEE Transactions on Electron Devices 38 (1991), pp. 2276-2283). The present methods of microstructure technology can produce at most wedge-shaped tips in a defined manner.
Carbon nano-cylinders were observed for the first time in an electron microscope by Iijima (Nature, 354 (1991), p. 56). They can now be produced in large quantities, for example at the cathode of a visible arc (Iijima, Materials Science and Engineering, B19 (1993), pp. 172-180). In the presence of iron or cobalt, one can produce single-shell carbon nano-cylinders. Theoretical calculations show that, depending on the helicity of the hexagonal ring structure, the walls of the carbon nano-cylinders are electrically conducting or semiconducting (Saito, Fujita, Dresselhaus, Dresselhaus, Materials Science and Engineering, B19 (1993), pp. 185-191). The carbon nano-cylinders can also be filled with metals, for example with lead. Other methods for producing carbon nano-cylinders are described in the literature:
Carbon nano-cylinders can be produced by the catalytic decomposition of acetylene through iron particles at about 700° C. (Jose-Yacaman, Miki-Yoshida, Rendon, Applied Physics Letters 62 (6) 1993, pp. 657-659).
In the presence of methane, argon, and iron vapor, single-shell carbon nano-cylinders can be found in the carbon deposit on the chamber walls of a visible arc apparatus (Iijima, Nature 363 (1993), pp. 603-605).
By sputtering a carbon film in high vacuum, multiple-shell carbon nano-cylinders can be deposited on a graphite surface (Ge, Sattler, Science 260 (1993), pp. 515-518).
By sputtering ultra-pure graphite with electron beams in vacuum, carbon nano-cylinders can be produced on substrates consisting of various materials, such that the carbon nano-cylinders are aligned in the direction of the vapor jet (Kosakovskaya et al., JETP Lett., 56 (1992), p. 26).
In addition to the carbon nano-cylinders, disordered carbon particles generally are also deposited on the substrate. These can be removed, for example, by treatment in an oxidizing atmosphere at an elevated temperature up to 500° C., preferably 400° C. The carbon nano-cylinders at the end caps can be opened in a similar manner in an oxidizing atmosphere (air, CO2, or pure oxygen). This offers the possibility of filling the carbon nano-cylinders with metals, as described for a filling with lead by Ajayan and Iijima in Nature 361, p. 333.
In principle, it is possible to fasten these carbon nano-cylinders, produced by one of the above methods, on a suitable substrate, by means of micro-manipulators, and thus to produce a field emission cathode. However, this method is impractical, and in particular is not suited for field electron arrays with many cathode tips, as is desired in vacuum microelectronics.
Field emission cathodes with emission tips of biomolecular microstructures or a metal-semiconductor-eutectic are known from the U.S. Pat. No. 5,138,220. The diameter of these structures measures in the micrometer range, and subsequent metallization is necessary to achieve adequate emission.
The publication IBM Technical Disclosure Bulletin, Vol. 35, No. 7, December 1992, pp. 410-411 describes the use of Buckminster fullerene molecules as the tip of scanning-probe microscopes. Besides spherical C60 molecules, derivatives of C60- and hetero-fullerenes are mentioned, that is host molecules in which individual C-atoms have been substituted by boron or nitrogen.
BRIEF SUMMARY OF THE INVENTION
The present invention is based on the object or on the technical problem of specifying a field emission cathode which avoids the disadvantages of the prior art, assures high emission quality, makes possible a longer lifetime, and in particular resists bombardment with residual gas ions. Furthermore, the present invention is based on the object or on the technical problem of specifying a method for producing a field emission cathode of the type mentioned in the introduction, so as to assure technically optimal manufacture together with economy.
The inventive field emission cathode device consists of an electrically conducting material and having the shape of a narrow rod or a knife edge to achieve high magnification of the electric field strength, such that the electron emitting part of the field emission cathode has cylindrical molecules, wherein the cylindrical molecules are formed at least in part as single-shell or multiple-shell carbon nano-cylinders. The inventive method for producing the field emission cathode device with carbon non-cylinders which have been expanded during the gas phase. Advantageous modifications and developments are the subject of the subclaims.
An especially preferred design of the inventive field emission cathode is characterized in that carbon nano-cylinders are used as field emission cathodes. Single-shell carbon nano-cylinders with a diameter of about 1 nanometer and a length greater than 1 micrometer, or also multiple-shell ones with a diameter up to several nanometers can be produced. Bundles of single-shell carbon nano-cylinders with diameters of about 5 nanometers can also be produced. The walls of the carbon nano-cylinders consist of carbon atoms in a hexagonal pattern, while the end caps additionally contain 5-ring structures. The individual carbon atoms of the carbon nano-cylinders are strongly bound chemically, as a result of which the carbon nano-cylinders have extremely great mechanical strength. This also results in their high sputtering strength in comparison to randomly grown tips, which are sputtered according to the prior art.
Using well-known carbon nano-cylinders as a field emission cathode thus combines the advantage of optimal geometry with high strength, thus assuring that the emission properties of such field emission cathodes will not change during their operation, in contrast to previously used cathode tips.
So that the above advantages of the carbon nano-cylinders can also be used for making the field emission cathode arrays of vacuum microelectronics, the known methods for producing such arrays must be modified according to the invention, in such a way that the carbon nano-cylinders grow on appropriately prepared locations of a substrate.
The production method can be used to produce either individual field emission cathodes or also field emission cathode arrays.
Further embodiments and advantages of the invention derive from the other characteristics cited in the claims, and from the embodiments given below. The characteristics of the inventions can be combined with one another in arbitrary fashion, unless they obviously exclude one another.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention as well as advantageous embodiments and developments thereof are described and elucidated in more detail below in terms of the examples shown in the drawings. The features contained in the description and in the drawings can be used inventively individually by themselves or in various combinations.
FIG. 1 shows an individual field emission element of a field emitter array, such as can be produced by the prior art.
FIG. 2 shows the same element in accordance with the first inventive process step, so as to provide the emission tip with carbon nano-cylinders.
FIG. 3 shows the same element after carbon has been sputtered.
FIG. 4 shows the same element after the last process step, in its final state.
FIG. 5 shows a section of a field emitter array with individually actuatable emission tips.
FIG. 6 shows the cross section of a graphite wafer with a knife edge.
FIG. 7 shows in cross section a prepared block of ten graphite wafers with a clamping fixture for sputtering carbon nano-cylinders.
FIG. 8 shows a diode for the power pulse technique with an inventively prepared field emission cathode.
DETAILED DESCRIPTION OF THE INVENTION
Below it will be explained, by way of an example, how field emission cathodes of carbon nano-cylinders can be produced, such as can be used, for example, as cathodes for diodes or switches. By way of a second example, it will be explained how field emission cathodes for a field emitter array can be produced by the methods of microstructure technology.
Example: Production of individual cathodes on a knife edge
Square graphite wafers about 1 cm (centimeter) on a side, and 1 mm (millimeter) thick are ground or etched to a knife edge on one side. FIG. 6 shows such a graphite wafer 100 with a knife edge 101, beveled on one side. FIG. 7 shows how ten of these graphite wafers 100a to 100j are collected together into a block in a clamping fixture 103, in such a way that the knife edges 101a to 101j on one side of the block lie in one plane and an aluminum foil or Teflon foil is situated between each of the graphite wafers as a spacer 102a to 102j. The clamping fixture consists of two brass blocks, into which recesses have been milled to receive the ten graphite wafers with their spacer foils. These blocks are screwed together by two screws 104.
The prepared block is installed in a vacuum apparatus, in which a target of ultra-pure graphite is sputtered with an electron beam. The graphite target and the block are arranged here in such a way that the carbon vapor strikes the plane of the graphite knife edges perpendicularly. Under these conditions, carbon nano-cylinders grow on the knife edges individually and in bundles of several cylinders, in the direction of the carbon vapor beam. When a layer several tenths of a micrometer thick has been reached, the sputtering process is terminated.
The knife edges and the beveled surfaces of the graphite wafers are now coated with carbon nano-cylinders, which have extremely high mechanical strength. The microstructure of the surface is characterized by cylindrical elevations with sharp tips which have a radius of curvature of a few nanometers.
FIG. 8 shows how a graphite wafer prepared in this manner can be used in a diode that operates as a switching element. An anode 112 with a large surface and a cathode pin 111 are fused in an evacuated glass flask 110. The graphite wafer 100 with its knife edge 101 is fastened on the cathode pin in such a way that it is situated opposite the anode at a distance of about 1 mm. If a sufficiently high negative voltage is applied to the cathode, an electrical current can flow through the diode.
In the same manner, several knife edges instead of a single knife edge can be used as a cathode.
These knife edges are characterized in that, in contrast to knife edges without carbon nano-cylinders, they amplify the electric field much more. A consequence of this is that, given the same voltage, the field emission current is much greater. Furthermore, the emission tips are not already destroyed after a brief operating time by the ions of the residual gas.
The production method described above can easily be transferred to a rather large number of graphite wafers with longer knife edges. Also, the edge angle and the spacing between the knife edges can be varied within broad limits. This therefore represents a field emission cathode whose electron-emitting surface and current density can be adapted to many applications, for example in power pulse technology.
Example: Production of field emission cathodes as an array
First, an array of field emitter cathodes and gate electrodes of molybdenum will be produced on a doped silicon substrate, in accordance with a previously known method, and specifically by the methods of silicon processing technology, as is described, for example, in the article, Spindt et al., J. Appl. Physics 47 (1976), p. 5248ff (see also Busta loc. cit. and Iannazzo loc. cit.). FIG. 1 shows a field emitter cathode with a gate electrode. Reference No. 10 designates the electrically conducting, n-doped silicon substrate, 11 designates a sputtered insulating layer about 2 μm thick and consisting of SiO2. Reference No. 12 designates the sputtered molybdenum gate electrode, about 0.5 μm thick. Reference No. 13 designates the tip-shaped field emission cathode of molybdenum. The gate openings 14 of the molybdenum layer are preferably chosen to lie between 0.4 and 0.8 μm. By means of the above-cited production method, one thus achieves the result that the cathode cone tips lie about 0.5 μm below the gate electrodes.
In a following process step, a sacrificial layer of aluminum is applied to the field emitter array which, in this form, already corresponds to the prior art. This is done by rotating the substrate perpendicular to the surface and sputtering it with aluminum at slant incidence. This type of sputtering prevents the aluminum from depositing in the cathode openings. FIG. 2 shows a field emitter element produced in accordance with this process step; the aluminum sacrificial layer is designated by 20.
In a subsequent process step, the graphite target disposed above the field emitter array is sputtered by an electron beam, and the carbon is deposited on the field emitter array. A portion of the carbon atomic beam penetrates through the gate opening and deposits on the cathode tips. As is known from a publication by Kosakovskaya et al., JETP Lett., 56 (1992) 26, cylindrical, parallel graphite fibers thus form in the direction of the incident atomic beam. The growth process is improved if, during this process step, a voltage UG of the order of 50 V is applied between the cathode and gate layer. The average field strength is then of the order of 50 V/0.5 μm=108 V/m; because the field strength is amplified at the tip, it there rises to over about 109 V/m. The high field strength at the fiber tip evidently causes the fiber ends to remain open and improves the growth of the fibers (Smalley, loc. cit. p. 4). FIG. 3 shows a field emitter element made in accordance with this process step. Here, 30 designates the deposited carbon layer on the gate electrode, and 31 designates one or more carbon nano-cylinders on the molybdenum tip. The voltage source to create the field strength at the cathode tip is also shown schematically.
The growth of the carbon nano-cylinders can be controlled through the emission current Ic. The longer the grown carbon nano-cylinders, the stronger becomes the emission current. The process must be terminated at the proper time, when the carbon nano-cylinders have reached a length of several tenths of a μm. It is here advantageous to modulate the gate voltage VG slightly. The quotient dIc/dUG is designated as the differential slope and can be used as a measure of the quality of the field emitter array.
In a last step, the carbon layer with the aluminum sacrificial layer is etched off, so that, after this step, the field emitter element looks as shown in FIG. 4.
In a modification of the production process described above, instead of producing the cathodes so as to be electrically connected in their totality and lying at the same potential, they can also be produced in such a way that only one row of them is electrically coupled together. In the same manner, the gate electrodes can be produced in such a way that only one row of them is electrically coupled together, although perpendicular to the direction of the row of cathodes that are connected together. This then offers the possibility of driving each cathode individually. This type of circuit is already known and is used, for example, for a screen with digitally actuatable image points, from LETI Company (described in Busta loc. cit., pp. 69-70). This circuit, for the case of three rows of cathodes and three rows of gates, is shown schematically, in a top view, in FIG. 5. Electrically conducting cathode tracks K1, K2, and K3, for example consisting of n-doped silicon, are applied on a substrate with an electrically non-conducting surface 1, along a width of a few micrometers. The following insulating layer of silicon dioxide (not shown), about 2 micrometers thick, corresponds to the arrangement described by Spindt. The gate electrodes G1, G2, and G3 are applied in strips just like the cathodes, but perpendicular to the direction of the cathode tracks. The further process steps correspond to the steps used to produce the field emitter cathodes that cannot be individually actuated.
The center electrode of the last column in FIG. 5 can now be driven in such a way, for example, that a negative voltage is applied to the cathode strips K2 and a negative voltage is applied to the gate strips G3; a field emission current will then flow from this electrode, which can be measured in the cathode or gate circuit or which can be detected by a suction anode, which is not shown here.
In the production method described here, this arrangement of the cathode strips and gate strips can be used to control specifically the production process of each individual cathode. It is then possible to measure the emission current from each field emitter tip during the production process, and not merely the total amount from the entire field emitter array. By turning off the voltage at one field emission cathode, one can favor the formation of an end cap with 5-ring structures, so that no further growth will occur.
It is advantageous for the formation of carbon nano-cylinders to form them at elevated temperatures of 100° to 700° C. (degrees Celsius), preferably 300°-400° C.
It is also advantageous to apply a layer of iron or cobalt, a few atomic layers thick, on the molybdenum cathode tips before sputtering on the carbon. The iron and cobalt evidently have a positive catalytic effect on the formation of carbon nano-cylinders.
As a modification of the invention, one can also dispense with the advantage of the narrow, cylindrical shape of the carbon nano-cylinders and utilize only the advantage of the high mechanical stability of host molecules, that is their resistance to the bombardment of the cathode by positive residual gas ions. In this case, cathodes produced conventionally—by sputtering in vacuum by the methods of microstructure technology or by etching, are coated with electrically conducting host molecules. The host molecules can be fullerenes, hetero-fullerenes, or their derivatives, especially also endohedral or exohedral compounds, for example, of the type M3C60 or M3C70, where M designates a metal, preferably the alkali metals potassium or sodium. The host molecules can also be applied to the cathode in crystalline form, for example C60 in the form of fullerite.
The field emission cathodes, whose resistivity and emission properties have been improved by coating them with carbon nano-cylinders or also with fullerenes and their derivatives, in molecular or crystalline form, can be used wherever thermionic cathodes in vacuum were used previously, and in all applications of vacuum microelectronics. Typical fields of application will be listed below, without this listing being exhaustive, and a person skilled in the art can easily transfer the inventive field emission cathode to similar applications.
Single emitter tips, emitter edges, or emitter arrays can be used as electron sources for X-ray tubes, X-ray tubes with planar, drivable cathodes, for example for computer tomography, electron beam lithography, miniature electron microscopes, power switching tubes, diodes or triodes, logic circuit elements, video screens.
Field emission cathodes can be used in miniaturized electronic components, such as ultra-high frequency diodes, ultra-high frequency triodes, diodes and triodes in combination with semiconductor components, temperature-stable diodes and triodes in the engines of motor vehicles, temperature-stable logic components, electronic components with diode and triode functions, which are particularly resistant to electromagnetic interference and ionizing radiation, pressure sensors, in which the cathode gate distance is influenced by the pressure, microwave generators and amplifiers.
As arrays, field emission cathodes can be used preferably as electron sources with a large surface, yielding a high current density, drivable electron sources for planar video screens with a high light density in monochromatic or color designs.

Claims (16)

What is claimed is:
1. A field emission cathode which consists of an electrically conducting material having the shape of a narrow rod or a knife edge to achieve high magnification of the electric field strength, such that the electron-emitting part of the field emission cathode has cylindrical molecules formed at least in part as single-shell or multiple-shell carbon nano-cylinders.
2. The device of claim 1, wherein the carbon nano-cylinders have end caps.
3. The device of claim 1, wherein the single- or multiple-shell carbon nano-cylinders are collected into bundles.
4. The device of claim 1, wherein the carbon nano-cylinders are filled with metal.
5. The device of claim 1, wherein the carbon nano-cylinders at least partly have endohedral or exohedral compounds with other atoms or molecules.
6. The device of claim 1, wherein the field emission cathode forms the tip of a field electron microscope, a field ion microscope, a scanning tunnel microscope, or a scanning power microscope.
7. The device of claim 1, wherein a plurality of similar field emission cathodes is disposed in a line or a plane, and thereby forms a linear or planar electron source.
8. The device of claim 1, wherein a plurality of similar field emission cathodes is disposed in a plane in the form of a matrix, and the field emission cathodes can be driven individually, and the field emission cathodes represent the electron sources for the image points of a visual display system.
9. The device of claim 8, wherein the plurality of similar field emission cathodes is in the range of 10,000 to 100,000 molecules.
10. A field emission cathode comprising an electron-emitting part which is formed at least in part as a carbon nano-cylinder, wherein the carbon nano-cylinder serves as a coating over a cathode tip structure.
11. A field emission cathode comprising:
a substrate;
a conducting material deposited over the substrate; and
a carbon nano-cylinder deposited over the conducting material.
12. The field emission cathode of claim 11, wherein the carbon nano-cylinder comprises a single-walled carbon nano-cylinder.
13. The field emission cathode of claim 11, wherein the carbon nano-cylinder comprises a multi-walled carbon nano-cylinder.
14. The field emission cathode of claim 11, wherein the carbon nano-cylinder at its end cap is open.
15. The field emission cathode of claim 11, wherein the conducting material is in a form of a cone.
16. The field emission cathode of claim 11, further comprising:
a catalyst material deposited on the conducting material.
US09/504,635 1994-02-23 1995-02-22 Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge Expired - Lifetime USRE38223E1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US09/504,635 USRE38223E1 (en) 1994-02-23 1995-02-22 Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge
US10/408,871 USRE38561E1 (en) 1995-02-22 1995-02-22 Field emission cathode
US10/409,363 US20040036402A1 (en) 1994-02-23 2003-04-08 Field emission cathode using carbon fibers

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE4405768A DE4405768A1 (en) 1994-02-23 1994-02-23 Field emission cathode device and method for its manufacture
DE4405768 1994-02-23
PCT/DE1995/000221 WO1995023424A1 (en) 1994-02-23 1995-02-22 Field-emission cathode and method of manufacturing it
US09/504,635 USRE38223E1 (en) 1994-02-23 1995-02-22 Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge
US08/702,684 US5773921A (en) 1994-02-23 1995-02-22 Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
US08/702,684 Reissue US5773921A (en) 1994-02-23 1995-02-22 Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge
PCT/DE1995/000221 Reissue WO1995023424A1 (en) 1994-02-23 1995-02-22 Field-emission cathode and method of manufacturing it

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US08/702,684 Continuation US5773921A (en) 1994-02-23 1995-02-22 Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge
US10/409,363 Continuation US20040036402A1 (en) 1994-02-23 2003-04-08 Field emission cathode using carbon fibers

Publications (1)

Publication Number Publication Date
USRE38223E1 true USRE38223E1 (en) 2003-08-19

Family

ID=6510961

Family Applications (3)

Application Number Title Priority Date Filing Date
US09/504,635 Expired - Lifetime USRE38223E1 (en) 1994-02-23 1995-02-22 Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge
US08/702,684 Ceased US5773921A (en) 1994-02-23 1995-02-22 Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge
US10/409,363 Abandoned US20040036402A1 (en) 1994-02-23 2003-04-08 Field emission cathode using carbon fibers

Family Applications After (2)

Application Number Title Priority Date Filing Date
US08/702,684 Ceased US5773921A (en) 1994-02-23 1995-02-22 Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge
US10/409,363 Abandoned US20040036402A1 (en) 1994-02-23 2003-04-08 Field emission cathode using carbon fibers

Country Status (5)

Country Link
US (3) USRE38223E1 (en)
EP (1) EP0801805B1 (en)
AT (1) ATE186422T1 (en)
DE (2) DE4405768A1 (en)
WO (1) WO1995023424A1 (en)

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020094064A1 (en) * 2000-10-06 2002-07-18 Zhou Otto Z. Large-area individually addressable multi-beam x-ray system and method of forming same
US20030002627A1 (en) * 2000-09-28 2003-01-02 Oxford Instruments, Inc. Cold emitter x-ray tube incorporating a nanostructured carbon film electron emitter
US20030142790A1 (en) * 2000-10-06 2003-07-31 Zhou Otto Z. X-ray generating mechanism using electron field emission cathode
US20040106220A1 (en) * 2001-02-27 2004-06-03 Merkulov Vladimir I. Carbon tips with expanded bases
US20050064167A1 (en) * 2003-09-12 2005-03-24 Nano-Proprietary, Inc. Carbon nanotubes
US20050136788A1 (en) * 2003-12-18 2005-06-23 Nano-Proprietary, Inc. Bead blast activation of carbon nanotube cathode
US20050281379A1 (en) * 2000-10-06 2005-12-22 Xintek, Inc. Devices and methods for producing multiple x-ray beams from multiple locations
US20060008047A1 (en) * 2000-10-06 2006-01-12 The University Of North Carolina At Chapel Hill Computed tomography system for imaging of human and small animal
US20060274889A1 (en) * 2000-10-06 2006-12-07 University Of North Carolina At Chapel Hill Method and apparatus for controlling electron beam current
US20070053489A1 (en) * 2005-04-25 2007-03-08 The University Of North Carolina At Chapel Hill X-ray imaging systems and methods using temporal digital signal processing for reducing noise and for obtaining multiple images simultaneously
US7227924B2 (en) 2000-10-06 2007-06-05 The University Of North Carolina At Chapel Hill Computed tomography scanning system and method using a field emission x-ray source
US20070227700A1 (en) * 2006-03-29 2007-10-04 Dimitrakopoulos Christos D VLSI chip hot-spot minimization using nanotubes
US20070278925A1 (en) * 2004-09-10 2007-12-06 Nano-Proprietary, Inc. Enhanced electron field emission from carbon nanotubes without activation
US20080012461A1 (en) * 2004-11-09 2008-01-17 Nano-Proprietary, Inc. Carbon nanotube cold cathode
US20080220181A1 (en) * 2006-08-25 2008-09-11 Philadelphia Health & Education Corporation, D/B/A Drexel University College Of Medicine Method of loading a nanotube structure and loaded nanotube structure
US20090022264A1 (en) * 2007-07-19 2009-01-22 Zhou Otto Z Stationary x-ray digital breast tomosynthesis systems and related methods
US20090102046A1 (en) * 2007-10-18 2009-04-23 International Business Machines Corporation On-chip temperature gradient minimization using carbon nanotube cooling structures with variable cooling capacity
US7796999B1 (en) 2006-04-03 2010-09-14 Sprint Spectrum L.P. Method and system for network-directed media buffer-size setting based on device features
US20100239064A1 (en) * 2005-04-25 2010-09-23 Unc-Chapel Hill Methods, systems, and computer program products for multiplexing computed tomography
CN101051596B (en) * 2006-04-07 2010-09-29 清华大学 Carbon nano tube field transmitting electronic source and its producing method
US20100329413A1 (en) * 2009-01-16 2010-12-30 Zhou Otto Z Compact microbeam radiation therapy systems and methods for cancer treatment and research
US8189893B2 (en) 2006-05-19 2012-05-29 The University Of North Carolina At Chapel Hill Methods, systems, and computer program products for binary multiplexing x-ray radiography
US8358739B2 (en) 2010-09-03 2013-01-22 The University Of North Carolina At Chapel Hill Systems and methods for temporal multiplexing X-ray imaging
US8866068B2 (en) 2012-12-27 2014-10-21 Schlumberger Technology Corporation Ion source with cathode having an array of nano-sized projections
US9782136B2 (en) 2014-06-17 2017-10-10 The University Of North Carolina At Chapel Hill Intraoral tomosynthesis systems, methods, and computer readable media for dental imaging
US9916960B2 (en) 2014-12-22 2018-03-13 Siemens Aktiengesellschaft Device for producing an electron beam
US10980494B2 (en) 2014-10-20 2021-04-20 The University Of North Carolina At Chapel Hill Systems and related methods for stationary digital chest tomosynthesis (s-DCT) imaging
US11231651B2 (en) 2017-04-13 2022-01-25 SCREEN Holdings Co., Ltd. Peripheral processing apparatus and peripheral processing method
US11778717B2 (en) 2020-06-30 2023-10-03 VEC Imaging GmbH & Co. KG X-ray source with multiple grids

Families Citing this family (121)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996042101A1 (en) * 1995-06-12 1996-12-27 Ecole Polytechnique Federale De Lausanne Electron source and applications of the same
US6097139A (en) * 1995-08-04 2000-08-01 Printable Field Emitters Limited Field electron emission materials and devices
CA2234429A1 (en) * 1995-11-15 1997-05-22 E.I. Du Pont De Nemours And Company Annealed carbon soot field emitters and field emitter cathodes made therefrom
US5872422A (en) * 1995-12-20 1999-02-16 Advanced Technology Materials, Inc. Carbon fiber-based field emission devices
US6445006B1 (en) 1995-12-20 2002-09-03 Advanced Technology Materials, Inc. Microelectronic and microelectromechanical devices comprising carbon nanotube components, and methods of making same
KR100365444B1 (en) * 1996-09-18 2004-01-24 가부시끼가이샤 도시바 Vacuum micro device and image display device using the same
DE69823441T2 (en) 1997-09-30 2004-09-23 Noritake Co., Ltd., Nagoya Electron emitting source
US6525461B1 (en) * 1997-10-30 2003-02-25 Canon Kabushiki Kaisha Narrow titanium-containing wire, process for producing narrow titanium-containing wire, structure, and electron-emitting device
JP3740295B2 (en) * 1997-10-30 2006-02-01 キヤノン株式会社 Carbon nanotube device, manufacturing method thereof, and electron-emitting device
JP3441397B2 (en) 1998-12-31 2003-09-02 喜萬 中山 Fusion probe for surface signal operation of electronic device and method of manufacturing the same
JP3441396B2 (en) 1998-12-03 2003-09-02 喜萬 中山 Probe for surface signal operation of electronic device and method of manufacturing the same
JPH11273551A (en) * 1998-03-23 1999-10-08 Nec Corp Electron emitting element employing boron nitride and its manufacture
US6630772B1 (en) 1998-09-21 2003-10-07 Agere Systems Inc. Device comprising carbon nanotube field emitter structure and process for forming device
US6146227A (en) * 1998-09-28 2000-11-14 Xidex Corporation Method for manufacturing carbon nanotubes as functional elements of MEMS devices
EP1135792A4 (en) * 1998-09-28 2005-06-08 Xidex Corp Method for manufacturing carbon nanotubes as functional elements of mems devices
US6597090B1 (en) 1998-09-28 2003-07-22 Xidex Corporation Method for manufacturing carbon nanotubes as functional elements of MEMS devices
US6232706B1 (en) * 1998-11-12 2001-05-15 The Board Of Trustees Of The Leland Stanford Junior University Self-oriented bundles of carbon nanotubes and method of making same
US6250984B1 (en) 1999-01-25 2001-06-26 Agere Systems Guardian Corp. Article comprising enhanced nanotube emitter structure and process for fabricating article
US6283812B1 (en) 1999-01-25 2001-09-04 Agere Systems Guardian Corp. Process for fabricating article comprising aligned truncated carbon nanotubes
KR20000074609A (en) * 1999-05-24 2000-12-15 김순택 Carbon nano tube field emission array and fabricating method thereof
EP1061554A1 (en) * 1999-06-15 2000-12-20 Iljin Nanotech Co., Ltd. White light source using carbon nanotubes and fabrication method thereof
US6648711B1 (en) 1999-06-16 2003-11-18 Iljin Nanotech Co., Ltd. Field emitter having carbon nanotube film, method of fabricating the same, and field emission display device using the field emitter
JP2001052652A (en) * 1999-06-18 2001-02-23 Cheol Jin Lee White light source and its manufacture
US6504292B1 (en) 1999-07-15 2003-01-07 Agere Systems Inc. Field emitting device comprising metallized nanostructures and method for making the same
US6538367B1 (en) 1999-07-15 2003-03-25 Agere Systems Inc. Field emitting device comprising field-concentrating nanoconductor assembly and method for making the same
US6312303B1 (en) * 1999-07-19 2001-11-06 Si Diamond Technology, Inc. Alignment of carbon nanotubes
US6277318B1 (en) * 1999-08-18 2001-08-21 Agere Systems Guardian Corp. Method for fabrication of patterned carbon nanotube films
US6741019B1 (en) 1999-10-18 2004-05-25 Agere Systems, Inc. Article comprising aligned nanowires
JP3483526B2 (en) * 1999-10-21 2004-01-06 シャープ株式会社 Image forming device
US6401526B1 (en) 1999-12-10 2002-06-11 The Board Of Trustees Of The Leland Stanford Junior University Carbon nanotubes and methods of fabrication thereof using a liquid phase catalyst precursor
US6989631B2 (en) * 2001-06-08 2006-01-24 Sony Corporation Carbon cathode of a field emission display with in-laid isolation barrier and support
DE10005057C2 (en) * 2000-02-04 2002-10-31 Jisoon Ihm Field emission tips
KR100499120B1 (en) * 2000-02-25 2005-07-04 삼성에스디아이 주식회사 Triode structure field emission display using carbon nanotube
US6456691B2 (en) * 2000-03-06 2002-09-24 Rigaku Corporation X-ray generator
ATE438922T1 (en) * 2000-03-16 2009-08-15 Hitachi Ltd DEVICE FOR GENERATING A FLOW OF CHARGE CARRIERS
US6512235B1 (en) * 2000-05-01 2003-01-28 El-Mul Technologies Ltd. Nanotube-based electron emission device and systems using the same
JP3658342B2 (en) * 2000-05-30 2005-06-08 キヤノン株式会社 Electron emitting device, electron source, image forming apparatus, and television broadcast display apparatus
US6586889B1 (en) 2000-06-21 2003-07-01 Si Diamond Technology, Inc. MEMS field emission device
US6819034B1 (en) 2000-08-21 2004-11-16 Si Diamond Technology, Inc. Carbon flake cold cathode
US6692324B2 (en) * 2000-08-29 2004-02-17 Ut-Battelle, Llc Single self-aligned carbon containing tips
JP3658346B2 (en) * 2000-09-01 2005-06-08 キヤノン株式会社 Electron emitting device, electron source and image forming apparatus, and method for manufacturing electron emitting device
JP3610325B2 (en) * 2000-09-01 2005-01-12 キヤノン株式会社 Electron emitting device, electron source, and method of manufacturing image forming apparatus
JP3639808B2 (en) * 2000-09-01 2005-04-20 キヤノン株式会社 Electron emitting device, electron source, image forming apparatus, and method of manufacturing electron emitting device
JP3639809B2 (en) * 2000-09-01 2005-04-20 キヤノン株式会社 ELECTRON EMITTING ELEMENT, ELECTRON EMITTING DEVICE, LIGHT EMITTING DEVICE, AND IMAGE DISPLAY DEVICE
JP3634781B2 (en) 2000-09-22 2005-03-30 キヤノン株式会社 Electron emission device, electron source, image forming device, and television broadcast display device
US6664728B2 (en) 2000-09-22 2003-12-16 Nano-Proprietary, Inc. Carbon nanotubes with nitrogen content
US20040240616A1 (en) * 2003-05-30 2004-12-02 Applied Nanotechnologies, Inc. Devices and methods for producing multiple X-ray beams from multiple locations
US20050200261A1 (en) * 2000-12-08 2005-09-15 Nano-Proprietary, Inc. Low work function cathode
US6885022B2 (en) * 2000-12-08 2005-04-26 Si Diamond Technology, Inc. Low work function material
JP2002179418A (en) * 2000-12-13 2002-06-26 Tohoku Techno Arch Co Ltd Method for forming carbon nanotube
US7306674B2 (en) * 2001-01-19 2007-12-11 Chevron U.S.A. Inc. Nucleation of diamond films using higher diamondoids
US7276222B2 (en) * 2001-01-19 2007-10-02 Chevron U.S.A. Inc. Diamondoid-containing thermally conductive materials
US6783589B2 (en) * 2001-01-19 2004-08-31 Chevron U.S.A. Inc. Diamondoid-containing materials in microelectronics
JP3768908B2 (en) * 2001-03-27 2006-04-19 キヤノン株式会社 Electron emitting device, electron source, image forming apparatus
GB0109546D0 (en) * 2001-04-18 2001-06-06 Va Tech Transmission & Distrib Vacuum power switches
US6739932B2 (en) * 2001-06-07 2004-05-25 Si Diamond Technology, Inc. Field emission display using carbon nanotubes and methods of making the same
US6756730B2 (en) * 2001-06-08 2004-06-29 Sony Corporation Field emission display utilizing a cathode frame-type gate and anode with alignment method
US7002290B2 (en) * 2001-06-08 2006-02-21 Sony Corporation Carbon cathode of a field emission display with integrated isolation barrier and support on substrate
US6682382B2 (en) * 2001-06-08 2004-01-27 Sony Corporation Method for making wires with a specific cross section for a field emission display
JP3774682B2 (en) * 2001-06-29 2006-05-17 キヤノン株式会社 Electron emitting device, electron source, and image forming apparatus
US6700454B2 (en) 2001-06-29 2004-03-02 Zvi Yaniv Integrated RF array using carbon nanotube cathodes
US6897603B2 (en) * 2001-08-24 2005-05-24 Si Diamond Technology, Inc. Catalyst for carbon nanotube growth
US6890230B2 (en) * 2001-08-28 2005-05-10 Motorola, Inc. Method for activating nanotubes as field emission sources
US7070472B2 (en) * 2001-08-29 2006-07-04 Motorola, Inc. Field emission display and methods of forming a field emission display
US6891319B2 (en) * 2001-08-29 2005-05-10 Motorola, Inc. Field emission display and methods of forming a field emission display
JP3703415B2 (en) * 2001-09-07 2005-10-05 キヤノン株式会社 ELECTRON EMITTING ELEMENT, ELECTRON SOURCE, IMAGE FORMING APPARATUS, AND METHOD FOR MANUFACTURING ELECTRON EMITTING ELEMENT AND ELECTRON SOURCE
JP3605105B2 (en) * 2001-09-10 2004-12-22 キヤノン株式会社 Electron emitting element, electron source, light emitting device, image forming apparatus, and method of manufacturing each substrate
US6902658B2 (en) * 2001-12-18 2005-06-07 Motorola, Inc. FED cathode structure using electrophoretic deposition and method of fabrication
ATE514049T1 (en) 2002-01-15 2011-07-15 Ibm MICROSTRUCTURES
WO2003081694A2 (en) * 2002-03-20 2003-10-02 The Board Of Trustees Of The Leland Stanford Junior University Molybdenum-based electrode with carbon nanotube growth
US6791278B2 (en) * 2002-04-16 2004-09-14 Sony Corporation Field emission display using line cathode structure
US6747416B2 (en) * 2002-04-16 2004-06-08 Sony Corporation Field emission display with deflecting MEMS electrodes
US6873118B2 (en) * 2002-04-16 2005-03-29 Sony Corporation Field emission cathode structure using perforated gate
US6979947B2 (en) * 2002-07-09 2005-12-27 Si Diamond Technology, Inc. Nanotriode utilizing carbon nanotubes and fibers
US6798127B2 (en) 2002-10-09 2004-09-28 Nano-Proprietary, Inc. Enhanced field emission from carbon nanotubes mixed with particles
US7012582B2 (en) * 2002-11-27 2006-03-14 Sony Corporation Spacer-less field emission display
US6958475B1 (en) 2003-01-09 2005-10-25 Colby Steven M Electron source
US20040145299A1 (en) * 2003-01-24 2004-07-29 Sony Corporation Line patterned gate structure for a field emission display
JP3907626B2 (en) * 2003-01-28 2007-04-18 キヤノン株式会社 Manufacturing method of electron source, manufacturing method of image display device, manufacturing method of electron-emitting device, image display device, characteristic adjustment method, and characteristic adjustment method of image display device
US6764874B1 (en) 2003-01-30 2004-07-20 Motorola, Inc. Method for chemical vapor deposition of single walled carbon nanotubes
JP4004973B2 (en) * 2003-02-19 2007-11-07 双葉電子工業株式会社 Carbon material, method for producing the same, electron-emitting device, and composite material
KR20060002871A (en) * 2003-03-26 2006-01-09 엑스오프트 마이크로튜브 인코포레이티드 Miniature x-ray tube with micro cathode
US6987835B2 (en) * 2003-03-26 2006-01-17 Xoft Microtube, Inc. Miniature x-ray tube with micro cathode
US7071629B2 (en) * 2003-03-31 2006-07-04 Sony Corporation Image display device incorporating driver circuits on active substrate and other methods to reduce interconnects
US20040189552A1 (en) * 2003-03-31 2004-09-30 Sony Corporation Image display device incorporating driver circuits on active substrate to reduce interconnects
US20040245224A1 (en) * 2003-05-09 2004-12-09 Nano-Proprietary, Inc. Nanospot welder and method
US7202596B2 (en) * 2003-06-06 2007-04-10 Electrovac Ag Electron emitter and process of fabrication
US7157848B2 (en) * 2003-06-06 2007-01-02 Electrovac Fabrikation Elektrotechnischer Spezialartikel Gmbh Field emission backlight for liquid crystal television
US20050140261A1 (en) * 2003-10-23 2005-06-30 Pinchas Gilad Well structure with axially aligned field emission fiber or carbon nanotube and method for making same
US7312562B2 (en) * 2004-02-04 2007-12-25 Chevron U.S.A. Inc. Heterodiamondoid-containing field emission devices
FR2872826B1 (en) * 2004-07-07 2006-09-15 Commissariat Energie Atomique LOW-TEMPERATURE GROWTH OF CARBON NANOTUBES ORIENTED
US20070158768A1 (en) * 2006-01-06 2007-07-12 Honeywell International, Inc. Electrical contacts formed of carbon nanotubes
US8501136B2 (en) * 2006-02-06 2013-08-06 The University Of North Carolina At Chapel Hill Synthesis and processing of rare-earth boride nanowires as electron emitters
DE102006054206A1 (en) * 2006-11-15 2008-05-21 Till Keesmann Field emission device
DE102007010463B4 (en) * 2007-03-01 2010-08-26 Sellmair, Josef, Dr. Device for field emission of particles
DE102008049654A1 (en) 2008-09-30 2010-04-08 Carl Zeiss Nts Gmbh Electron beam source and method of making the same
FR2946456A1 (en) * 2009-06-05 2010-12-10 Thales Sa COLLIMATE ELECTRONIC BEAM SOURCE WITH COLD CATHODE
CZ305429B6 (en) * 2009-07-01 2015-09-16 Technická univerzita v Liberci X-ray radiator and/or accelerator of electrically charged particles
US8536773B2 (en) 2011-03-30 2013-09-17 Carl Zeiss Microscopy Gmbh Electron beam source and method of manufacturing the same
US9018861B2 (en) 2011-12-29 2015-04-28 Elwha Llc Performance optimization of a field emission device
US9171690B2 (en) 2011-12-29 2015-10-27 Elwha Llc Variable field emission device
US8810161B2 (en) 2011-12-29 2014-08-19 Elwha Llc Addressable array of field emission devices
US8946992B2 (en) 2011-12-29 2015-02-03 Elwha Llc Anode with suppressor grid
US8970113B2 (en) 2011-12-29 2015-03-03 Elwha Llc Time-varying field emission device
US8810131B2 (en) 2011-12-29 2014-08-19 Elwha Llc Field emission device with AC output
US8928228B2 (en) 2011-12-29 2015-01-06 Elwha Llc Embodiments of a field emission device
US8692226B2 (en) 2011-12-29 2014-04-08 Elwha Llc Materials and configurations of a field emission device
US9646798B2 (en) 2011-12-29 2017-05-09 Elwha Llc Electronic device graphene grid
US9349562B2 (en) 2011-12-29 2016-05-24 Elwha Llc Field emission device with AC output
US8575842B2 (en) 2011-12-29 2013-11-05 Elwha Llc Field emission device
WO2013163439A1 (en) * 2012-04-26 2013-10-31 Elwha Llc Variable field emission device
US9659734B2 (en) 2012-09-12 2017-05-23 Elwha Llc Electronic device multi-layer graphene grid
US9659735B2 (en) 2012-09-12 2017-05-23 Elwha Llc Applications of graphene grids in vacuum electronics
US9362078B2 (en) 2012-12-27 2016-06-07 Schlumberger Technology Corporation Ion source using field emitter array cathode and electromagnetic confinement
US20140183349A1 (en) * 2012-12-27 2014-07-03 Schlumberger Technology Corporation Ion source using spindt cathode and electromagnetic confinement
KR20140112270A (en) * 2013-03-13 2014-09-23 삼성전자주식회사 X-ray generator including heat sink block
WO2015079393A1 (en) * 2013-11-27 2015-06-04 Nanox Imaging Plc Electron emitting construct configured with ion bombardment resistant
CN105374654B (en) 2014-08-25 2018-11-06 同方威视技术股份有限公司 Electron source, x-ray source, the equipment for having used the x-ray source
DE102014226814B4 (en) * 2014-12-22 2023-05-11 Siemens Healthcare Gmbh metal beam x-ray tube
US10835199B2 (en) 2016-02-01 2020-11-17 The University Of North Carolina At Chapel Hill Optical geometry calibration devices, systems, and related methods for three dimensional x-ray imaging
US11810774B2 (en) 2020-08-26 2023-11-07 Government Of The United States As Represented By The Secretary Of The Air Force Field emission devices

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089742A (en) * 1990-09-28 1992-02-18 The United States Of America As Represented By The Secretary Of The Navy Electron beam source formed with biologically derived tubule materials
US5138220A (en) * 1990-12-05 1992-08-11 Science Applications International Corporation Field emission cathode of bio-molecular or semiconductor-metal eutectic composite microstructures
US5449970A (en) * 1992-03-16 1995-09-12 Microelectronics And Computer Technology Corporation Diode structure flat panel display
US5495143A (en) * 1993-08-12 1996-02-27 Science Applications International Corporation Gas discharge device having a field emitter array with microscopic emitter elements

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4110612A (en) * 1977-04-27 1978-08-29 General Electric Company Mass spectrometer desorption device including field anode eutectic alloy wire and auxiliary electrical resistance heating means
US5709577A (en) * 1994-12-22 1998-01-20 Lucent Technologies Inc. Method of making field emission devices employing ultra-fine diamond particle emitters
USRE38561E1 (en) * 1995-02-22 2004-08-03 Till Keesmann Field emission cathode
US5872422A (en) * 1995-12-20 1999-02-16 Advanced Technology Materials, Inc. Carbon fiber-based field emission devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089742A (en) * 1990-09-28 1992-02-18 The United States Of America As Represented By The Secretary Of The Navy Electron beam source formed with biologically derived tubule materials
US5138220A (en) * 1990-12-05 1992-08-11 Science Applications International Corporation Field emission cathode of bio-molecular or semiconductor-metal eutectic composite microstructures
US5449970A (en) * 1992-03-16 1995-09-12 Microelectronics And Computer Technology Corporation Diode structure flat panel display
US5495143A (en) * 1993-08-12 1996-02-27 Science Applications International Corporation Gas discharge device having a field emitter array with microscopic emitter elements

Non-Patent Citations (13)

* Cited by examiner, † Cited by third party
Title
Ajayan et al., Nature, 361:333-334, Jan. 1993.* *
Ge et al., Vapor-Condensation Generation and STM Analysis of Fullerence Tubes, Science 260 (Apr. 23, 1993), pp 515-518.* *
Heinrich, et al., Energy Distribution of Post-Accelerated Electrons Field-Emitted from Carbon Fibres, Applied Physics 12, pp 197-202 (1977, no month). *
IBM Technical Disclosure Bulletin, 35:410-411, Dec. 1992.* *
Iijima et al., Single-Shell Carbon Nanotubes of 1-nm diameter, Nature, 363 (Jun. 17, 1993), pp 603-605.* *
Iijima, Growth of Carbon Nanotubes, Materials Science and Engineering, (1993), pp. 172-180.* *
Iijima, Helical Microtubules of Graphite Carbon, Nature, 354 (Nov. 7, 1991), pp 56-58.* *
Jose-Yacaman et al., Catalytic Growtth of Carbon Microtubules with Fullerene Structure, Applied Physics Letters, 62, No. 6 (Feb. 8, 1993) pp 657-659.* *
Kirkpatrick et al., Applied Physics Latters, 60:1556-1558, Mar. 1992.* *
Knife-Edge Thin Film Field Emission Cathodes on (110) Silicon Wafers, PP 644-647, by Elliott et al., Jul. 1993.* *
Kosakovskaya et al., Nanofilament Carbon Structure, JETP Letters, 56 (Jul.-Dec. 1992), pp 26-30.* *
Lin et al., Physics Review, 47:7546-7553, Mar. 1993.* *
Saito et al., Materials Science and Engineering, B19:185-191, 1993. (no month).* *

Cited By (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030002627A1 (en) * 2000-09-28 2003-01-02 Oxford Instruments, Inc. Cold emitter x-ray tube incorporating a nanostructured carbon film electron emitter
US20060274889A1 (en) * 2000-10-06 2006-12-07 University Of North Carolina At Chapel Hill Method and apparatus for controlling electron beam current
US20050281379A1 (en) * 2000-10-06 2005-12-22 Xintek, Inc. Devices and methods for producing multiple x-ray beams from multiple locations
US7359484B2 (en) 2000-10-06 2008-04-15 Xintek, Inc Devices and methods for producing multiple x-ray beams from multiple locations
US20020094064A1 (en) * 2000-10-06 2002-07-18 Zhou Otto Z. Large-area individually addressable multi-beam x-ray system and method of forming same
US7082182B2 (en) 2000-10-06 2006-07-25 The University Of North Carolina At Chapel Hill Computed tomography system for imaging of human and small animal
US6876724B2 (en) 2000-10-06 2005-04-05 The University Of North Carolina - Chapel Hill Large-area individually addressable multi-beam x-ray system and method of forming same
US7227924B2 (en) 2000-10-06 2007-06-05 The University Of North Carolina At Chapel Hill Computed tomography scanning system and method using a field emission x-ray source
US20070009081A1 (en) * 2000-10-06 2007-01-11 The University Of North Carolina At Chapel Hill Computed tomography system for imaging of human and small animal
US6980627B2 (en) 2000-10-06 2005-12-27 Xintek, Inc. Devices and methods for producing multiple x-ray beams from multiple locations
US20060008047A1 (en) * 2000-10-06 2006-01-12 The University Of North Carolina At Chapel Hill Computed tomography system for imaging of human and small animal
US6850595B2 (en) * 2000-10-06 2005-02-01 The University Of North Carolina At Chapel Hill X-ray generating mechanism using electron field emission cathode
US20030142790A1 (en) * 2000-10-06 2003-07-31 Zhou Otto Z. X-ray generating mechanism using electron field emission cathode
US20040106220A1 (en) * 2001-02-27 2004-06-03 Merkulov Vladimir I. Carbon tips with expanded bases
US7109515B2 (en) * 2001-02-27 2006-09-19 Ut-Battelle Llc Carbon containing tips with cylindrically symmetrical carbon containing expanded bases
US20050064167A1 (en) * 2003-09-12 2005-03-24 Nano-Proprietary, Inc. Carbon nanotubes
US7125308B2 (en) 2003-12-18 2006-10-24 Nano-Proprietary, Inc. Bead blast activation of carbon nanotube cathode
US20050136788A1 (en) * 2003-12-18 2005-06-23 Nano-Proprietary, Inc. Bead blast activation of carbon nanotube cathode
US20060096950A1 (en) * 2003-12-18 2006-05-11 Nano-Proprietary, Inc. Bead blast activation of carbon nanotube cathode
US7736209B2 (en) 2004-09-10 2010-06-15 Applied Nanotech Holdings, Inc. Enhanced electron field emission from carbon nanotubes without activation
US20070278925A1 (en) * 2004-09-10 2007-12-06 Nano-Proprietary, Inc. Enhanced electron field emission from carbon nanotubes without activation
US20080012461A1 (en) * 2004-11-09 2008-01-17 Nano-Proprietary, Inc. Carbon nanotube cold cathode
US8155262B2 (en) 2005-04-25 2012-04-10 The University Of North Carolina At Chapel Hill Methods, systems, and computer program products for multiplexing computed tomography
US20070053489A1 (en) * 2005-04-25 2007-03-08 The University Of North Carolina At Chapel Hill X-ray imaging systems and methods using temporal digital signal processing for reducing noise and for obtaining multiple images simultaneously
US7245692B2 (en) 2005-04-25 2007-07-17 The University Of North Carolina At Chapel Hill X-ray imaging systems and methods using temporal digital signal processing for reducing noise and for obtaining multiple images simultaneously
US20100239064A1 (en) * 2005-04-25 2010-09-23 Unc-Chapel Hill Methods, systems, and computer program products for multiplexing computed tomography
US20080316711A1 (en) * 2006-03-29 2008-12-25 International Business Machines Corporation Vlsi hot-spot minimization using nanotubes
US9151550B2 (en) 2006-03-29 2015-10-06 International Business Machines Corporation VLSI hot-spot minimization using nanotubes
US20070227700A1 (en) * 2006-03-29 2007-10-04 Dimitrakopoulos Christos D VLSI chip hot-spot minimization using nanotubes
US7842554B2 (en) 2006-03-29 2010-11-30 International Business Machines Corporation VLSI hot-spot minimization using nanotubes
US7796999B1 (en) 2006-04-03 2010-09-14 Sprint Spectrum L.P. Method and system for network-directed media buffer-size setting based on device features
CN101051596B (en) * 2006-04-07 2010-09-29 清华大学 Carbon nano tube field transmitting electronic source and its producing method
US8189893B2 (en) 2006-05-19 2012-05-29 The University Of North Carolina At Chapel Hill Methods, systems, and computer program products for binary multiplexing x-ray radiography
US20080220181A1 (en) * 2006-08-25 2008-09-11 Philadelphia Health & Education Corporation, D/B/A Drexel University College Of Medicine Method of loading a nanotube structure and loaded nanotube structure
US20090022264A1 (en) * 2007-07-19 2009-01-22 Zhou Otto Z Stationary x-ray digital breast tomosynthesis systems and related methods
US7751528B2 (en) 2007-07-19 2010-07-06 The University Of North Carolina Stationary x-ray digital breast tomosynthesis systems and related methods
US8063483B2 (en) 2007-10-18 2011-11-22 International Business Machines Corporation On-chip temperature gradient minimization using carbon nanotube cooling structures with variable cooling capacity
US20090102046A1 (en) * 2007-10-18 2009-04-23 International Business Machines Corporation On-chip temperature gradient minimization using carbon nanotube cooling structures with variable cooling capacity
US20100329413A1 (en) * 2009-01-16 2010-12-30 Zhou Otto Z Compact microbeam radiation therapy systems and methods for cancer treatment and research
US8600003B2 (en) 2009-01-16 2013-12-03 The University Of North Carolina At Chapel Hill Compact microbeam radiation therapy systems and methods for cancer treatment and research
US8995608B2 (en) 2009-01-16 2015-03-31 The University Of North Carolina At Chapel Hill Compact microbeam radiation therapy systems and methods for cancer treatment and research
US8358739B2 (en) 2010-09-03 2013-01-22 The University Of North Carolina At Chapel Hill Systems and methods for temporal multiplexing X-ray imaging
US8866068B2 (en) 2012-12-27 2014-10-21 Schlumberger Technology Corporation Ion source with cathode having an array of nano-sized projections
US9782136B2 (en) 2014-06-17 2017-10-10 The University Of North Carolina At Chapel Hill Intraoral tomosynthesis systems, methods, and computer readable media for dental imaging
US9907520B2 (en) 2014-06-17 2018-03-06 The University Of North Carolina At Chapel Hill Digital tomosynthesis systems, methods, and computer readable media for intraoral dental tomosynthesis imaging
US10980494B2 (en) 2014-10-20 2021-04-20 The University Of North Carolina At Chapel Hill Systems and related methods for stationary digital chest tomosynthesis (s-DCT) imaging
US9916960B2 (en) 2014-12-22 2018-03-13 Siemens Aktiengesellschaft Device for producing an electron beam
US11231651B2 (en) 2017-04-13 2022-01-25 SCREEN Holdings Co., Ltd. Peripheral processing apparatus and peripheral processing method
US11778717B2 (en) 2020-06-30 2023-10-03 VEC Imaging GmbH & Co. KG X-ray source with multiple grids

Also Published As

Publication number Publication date
ATE186422T1 (en) 1999-11-15
WO1995023424A1 (en) 1995-08-31
EP0801805B1 (en) 1999-11-03
DE59507196D1 (en) 1999-12-09
US20040036402A1 (en) 2004-02-26
EP0801805A1 (en) 1997-10-22
DE4405768A1 (en) 1995-08-24
US5773921A (en) 1998-06-30

Similar Documents

Publication Publication Date Title
USRE38223E1 (en) Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge
USRE38561E1 (en) Field emission cathode
Chernozatonskii et al. Electron field emission from nanofilament carbon films
US6057637A (en) Field emission electron source
Zhu et al. Large current density from carbon nanotube field emitters
US6858521B2 (en) Method for fabricating spaced-apart nanostructures
KR100615103B1 (en) Nanotubes, field emission cathode and cathode ray tube having nanotubes and method for forming them
KR100504971B1 (en) Electron emissive film and method
EP0745265B1 (en) Diamond or diamond-like or glassy carbon fiber field emitter
US6283812B1 (en) Process for fabricating article comprising aligned truncated carbon nanotubes
US7521851B2 (en) Electron emitting composite based on regulated nano-structures and a cold electron source using the composite
US6504292B1 (en) Field emitting device comprising metallized nanostructures and method for making the same
US6087765A (en) Electron emissive film
US7465210B2 (en) Method of fabricating carbide and nitride nano electron emitters
US8604681B2 (en) Cold cathodes and ion thrusters and methods of making and using same
Thong et al. Field-emission induced growth of nanowires
JP2000208029A (en) Electron emitting material, electron emitting element and its manufacture
US8766522B1 (en) Carbon nanotube fiber cathode
US6441550B1 (en) Carbon-based field emission electron device for high current density applications
EP1623443B1 (en) A cathode for an electron source
US6059627A (en) Method of providing uniform emission current
Merkulov et al. Field emission properties of different forms of carbon
KR100668332B1 (en) Fabrication method of device comprising carbide and nitride nano electron emitters
US20040026232A1 (en) Method and apparatus for producing nanostructures
Read et al. Carbon nanotube-based cathodes for microwave tubes

Legal Events

Date Code Title Description
AS Assignment

Owner name: KEESMANN, TILL, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:GROSSE-WILDE, HUBERT;REEL/FRAME:010993/0003

Effective date: 20000720

FPAY Fee payment

Year of fee payment: 8

AS Assignment

Owner name: NANO-PROPRIETARY, INC., TEXAS

Free format text: CHANGE OF NAME;ASSIGNOR:SI DIAMOND TECHNOLOGY, INC.;REEL/FRAME:021117/0020

Effective date: 20030617

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

FPAY Fee payment

Year of fee payment: 12