US8810472B2 - Antenna module for producing a transponder, and a transponder - Google Patents

Antenna module for producing a transponder, and a transponder Download PDF

Info

Publication number
US8810472B2
US8810472B2 US13/063,343 US200913063343A US8810472B2 US 8810472 B2 US8810472 B2 US 8810472B2 US 200913063343 A US200913063343 A US 200913063343A US 8810472 B2 US8810472 B2 US 8810472B2
Authority
US
United States
Prior art keywords
antenna
conductor
substrate surface
arrangement
transponder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US13/063,343
Other languages
English (en)
Other versions
US20110169702A1 (en
Inventor
Jan Wendisch
Egon Konopitzky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linxens Holding SAS
Original Assignee
Smartrac IP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smartrac IP BV filed Critical Smartrac IP BV
Assigned to SMARTRAC IP B.V. reassignment SMARTRAC IP B.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WENDISCH, JAN, KONOPITZKY, EGON
Publication of US20110169702A1 publication Critical patent/US20110169702A1/en
Application granted granted Critical
Publication of US8810472B2 publication Critical patent/US8810472B2/en
Assigned to LINXENS HOLDING S.A.S. reassignment LINXENS HOLDING S.A.S. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SMARTRAC IP B.V.
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the present invention relates to an antenna module for producing a transponder, wherein the antenna module features an antenna conductor arrangement disposed on a substrate surface of a substrate and having an antenna conductor for contacting with a chip. Moreover, the invention relates to a transponder having such an antenna module.
  • an antenna module which features an antenna conductor arrangement disposed on a substrate surface of a substrate for contacting with a chip.
  • the antenna conductor arrangement features an antenna conductor extending longitudinally to the edges of the substrate on the substrate surface to produce a transponder antenna and forming a first and a second terminal end respectively at an inner and an outer winding end, said terminal ends serving for contacting with the chip. Since the terminal ends are disposed on opposing sides of the antenna conductor arrangement, direct contacting with terminal faces of the chip is not possible.
  • a foldable contacting lug is provided in the inner region of the antenna conductor arrangement which, where appropriate, subsequent to contacting with the chip makes it possible to easily produce a contact bridge between the terminal ends of the antenna conductor arrangement.
  • a type of housed arrangement is realized at least for the chip.
  • the antenna module known from the state of the art is used for producing a transponder, it is necessary to furnish the antenna module at least on its substrate surface, on which the antenna conductor arrangement is disposed, with a cover layer to be able to realize a completely housed transponder configuration, which as a rule constitutes a prerequisite for use of the transponder in practical applications.
  • the inventive antenna module exhibits the features of claim 1 .
  • the antenna conductor arrangement features an antenna conductor, which on a first partial area of the substrate surface forms a first antenna part having a first terminal end, and which with a second terminal end extends to a second partial area of the substrate surface to form another antenna part, wherein the first terminal end of the first antenna part forms a first contact device which forms a terminal face arrangement jointly with an adjacently arranged second contact device for contacting with the chip, wherein the second contact device features a first antenna connection contact and the terminal end of the second antenna part forms a second antenna connection contact, wherein the antenna connection contacts are disposed on the respective partial areas such that the antenna connection contacts can be brought into an overlapping position for producing an electrically conductive connection between the antenna connection contacts by swiveling the partial areas with respect to each other.
  • the antenna module designed according to the invention on the one hand enables the simple formation of a contact bridge between the terminal ends of the antenna conductor arrangement and at the same time enables a housed arrangement of the transponder antenna, respectively the antenna conductor arrangement, as a result of swiveling the partial areas having the antenna parts disposed thereon with respect to each other.
  • the antenna module exhibiting the inventive design provides the prerequisite for realizing a housed arrangement with minimal expenditure of components.
  • the application of a separately handable covering substrate onto an antenna conductor arrangement formed on the surface of the antenna substrate beforehand can be dispensed with.
  • the antenna connection contacts of the antenna parts are each disposed in an inner region of the antenna parts, which is limited by the antenna conductor, a comparatively large area for forming the antenna connection contacts is available without thereby necessitating an enlargement of the outer dimensions of the antenna conductor arrangement.
  • the antenna connection contacts are each disposed equidistantly to a swivel axis which separates the partial areas from each other, on a contact axis extending perpendicularly to the swivel axis, a positionally accurate contacting of the antenna connection contacts is enabled in a particularly simple fashion.
  • the formation of a particularly compact transponder arrangement is enabled if the antenna connection contact of the first antenna part is disposed adjacent to the swivel axis and between the swivel axis and the terminal face arrangement, since in this way, a sufficiently large accommodating space for the arrangement of a chip to be contacted with the terminal face arrangement is enabled likewise in the inner region, which is limited by the antenna conductor, of the first antenna part, respectively the antenna conductor arrangement.
  • At least one antenna part features an antenna conductor which is disposed in a plurality of windings.
  • both the first and the second antenna part feature an antenna conductor which is disposed in a plurality of windings.
  • a positioning of the antenna connection contact of the first antenna part which is readily variable as regards the geometry thereof and which can thus be easily adapted to the respective spatial requirements is enabled if the antenna connection contact of the first antenna part is connected to a contact device of the terminal face arrangement via an antenna conductor part.
  • the antenna conductor essentially can be completely or else partially covered by an electrical insulation.
  • the antenna conductor of the first antenna part and the antenna conductor of the second antenna part are designed in the form of a capacitor plate at least in sections, such that the capacitor plates can be brought into an overlapping position to form a plate capacitor by swiveling the partial areas with respect to each other, it is possible to readily integrate a capacitor function without for this purpose necessitating a separately formed component. Instead, even one and the same antenna conductor may serve both for forming the antenna and equally for forming a capacitor.
  • the option to trim the capacitor in a simple manner is available by relatively positioning the capacitor plates such that they are deliberately offset with respect to each other.
  • the antenna conductor can basically be provided by any optional conductor path structure type which is applied to the substrate surface.
  • the conductor path structure in particular for forming particularly flat, respectively thin, antenna modules it proves to be advantageous to form the conductor path structure by coating the substrate surface with a metallization.
  • the conductor path structure is formed by a wire conductor which is applied to the substrate surface.
  • the antenna conductor arrangement in addition to the first antenna part, features a plurality of antenna parts which are disposed on the substrate surface of the substrate on respectively adjacent partial areas of the substrate surface and which feature antenna connection contacts for contacting with the first and the second antenna part such that the antenna connection contacts can be brought into an overlapping position for producing an electrically conductive connection between the antenna connection contacts by swiveling the partial areas with respect to each other in a Leporello-like manner, the number of windings of the antenna coil formed by the antenna conductor arrangement can be increased in highly compact spaces, and the antenna characteristics and in particular the efficiency can be determined for instance by a correspondingly selected number of partial areas.
  • the inventive transponder exhibits the features of claim 15 .
  • the transponder arrangement comprises a chip having chip terminal faces which are contacted with the terminal face arrangement disposed on the first partial area of the substrate surface.
  • the chip itself is also disposed on the first partial area of the substrate surface such that both the production of the antenna conductor arrangement and the subsequent contacting of the chip with the antenna conductor arrangement can be performed on one and the same substrate surface, i.e. can be performed from one side.
  • the chip can be directly contacted with the terminal face arrangement in the manner of a flip-chip contacting.
  • the formation of a housed transponder arrangement is enabled with minimal effort and a minimum number of components.
  • the housed arrangement of the chip in the transponder arrangement is enabled without necessitating the use of a separately handable cover layer or the like for covering the chip.
  • a transponder hermetically sealed in this manner is suitable for use in medical engineering or material analysis and can be used for instance in liquids, such as in particular body fluids.
  • the chip is accommodated in the inner region of the antenna conductor arrangement which is formed by the first antenna part and the second antenna part, the chip is arranged in such a manner that the antenna conductor arrangement peripherally surrounding the chip acts as an outer annular stiffening for the chip, respectively the contact region of the chip having the terminal face arrangement.
  • An accommodation of the chip offering not only mechanical stabilization but also permanent hermetical sealing is enabled if the partial areas are connected with each other in a hermetically sealed manner in a peripheral region surrounding the antenna conductor arrangement and the chip. This can be performed, in particular depending on the material properties of the substrate, by using an adhesive bonding or else a welding process.
  • FIG. 1 shows an antenna module in a first embodiment in a planar arrangement
  • FIG. 2 shows the antenna module depicted in FIG. 1 in a swiveled arrangement swiveled about a swivel axis;
  • FIG. 3 shows an antenna module in a planar arrangement according to another embodiment
  • FIG. 4 shows an antenna module in a planar arrangement according to another embodiment
  • FIG. 5 shows an antenna module in a planar arrangement in another embodiment
  • FIG. 6 shows the antenna module depicted in FIG. 5 in a swiveled arrangement swiveled about a swivel axis
  • FIG. 7 shows a housed transponder arrangement using the antenna module depicted in FIGS. 5 and 6 .
  • FIG. 1 shows an antenna module 10 having an antenna conductor arrangement 13 disposed on a substrate surface 11 of a substrate 12 .
  • the substrate surface 11 is divided into a first partial area 15 and a second partial area 16 by a swivel axis 14 .
  • a first antenna part 17 is disposed, which features an antenna conductor 18 extending from partial area 15 to partial area 16 and here forming a second antenna part 19 .
  • the first antenna part 17 features a terminal face arrangement 20 having a first contact device 21 and a second contact device 22 .
  • the second contact device 22 is provided with a first antenna connection contact 24 while being connected via an antenna conductor part 23 .
  • the second antenna part 19 at the free end thereof features a second antenna connection contact 25 .
  • the antenna connection contacts 24 , 25 with the contact faces 26 , 27 being formed their ends are disposed on a contact axis 28 which is disposed perpendicularly to the swivel axis 14 , wherein the contact faces 26 , 27 are arranged equidistantly with respect to the swivel axis 14 .
  • the antenna connection contacts 24 , 25 and the contact faces 26 , 27 are each disposed in an inner region 29 , 30 of the antenna parts 17 , 19 , wherein the inner region 29 , 30 is respectively limited by the antenna conductor 18 .
  • the inner region 30 of the second antenna part 19 is dimensioned such that the first antenna part 17 is accommodated in the inner region 30 when the first partial area 15 is swiveled about the swivel axis 14 with respect to the second partial area 16 , whereby adjacent to the swivel axis 14 , an overlapping region 31 is realized between the first antenna part 17 and the second antenna part 19 .
  • a contact covering 32 which enables an electrically conductive contacting between the first antenna part 17 and the second antenna part 19 is realized as a result of the equidistant arrangement of the contact faces 26 , 27 with respect to the swivel axis 14 .
  • an accommodating space 33 is produced between the contact covering 32 and the terminal face arrangement 20 due to the adjacent arrangement of the contact face 26 , 27 , respectively the antenna connection contact 24 , 25 with respect to the swivel axis 14 , said accommodating space enabling the arrangement of a chip 40 being depicted in FIG. 2 using dash-dotted lines in the inner region 29 , respectively 30 .
  • the antenna conductor arrangement 13 forms a transponder antenna which, in order to form a functional transponder, only needs to be contacted with a chip 40 being disposed in the accommodating space 33 via the contact devices 21 , 22 of the terminal face arrangement 20 .
  • FIG. 3 shows an antenna module 34 which, in contrast to the antenna module 10 illustrated in FIG. 1 , is provided with a first antenna part 35 and a second antenna part 36 , each having several antenna windings 37 of the antenna conductor 18 and which are otherwise provided with a terminal face arrangement 20 and antenna connection contacts 24 , 25 in conformity with the antenna part 17 and the antenna part 19 of the antenna module 10 .
  • the antenna parts 35 , 36 essentially feature inner regions 38 , 39 of equisized dimensions, wherein the antenna windings 37 are spaced apart from each other at a constant distance.
  • insulation is only necessary in the overlapping region 31 .
  • FIG. 4 in another embodiment illustrates an antenna module 41 in which, in contrast to the antenna module 34 illustrated in FIG. 3 , the antenna parts 42 , 43 do not feature circularly concentrically arranged antenna windings 37 but rather rectangularly extending antenna windings 44 , which in the region of the swivel axis 14 are connected to each other via an antenna conductor part 44 being configured in a step-like manner.
  • the antenna module 41 illustrated in FIG. 4 in conformity with the antenna modules 10 and 34 illustrated in FIGS.
  • the antenna module 41 illustrated in FIG. 4 can also be transferred into a folded configuration corresponding to the illustration in FIG. 2 , in which the antenna connection contacts 24 , 25 are disposed in an overlapping position and can be contacted with each other.
  • FIG. 5 shows an antenna module 45 which on a substrate surface 46 of a substrate 47 features partial areas 48 and 49 being separated from each other by a swivel axis 14 , in which a first antenna part 51 and a second antenna part 52 each formed by an antenna conductor 50 are disposed.
  • the antenna conductor 50 and the antenna parts 51 and 52 in the case of the illustrated exemplary embodiment are composed of a metallization applied to the substrate surface 46 for instance using a deposition process.
  • the antenna part 51 features a terminal face arrangement 53 having a first contact device 54 and a second contact device 55 .
  • the contact device 54 features a first antenna connection contact 57 being connected via an antenna conductor part 56 and extending into an inner region 62 of the antenna part 51 , and a contact face 58 thereof being disposed on a contact axis 28 extending perpendicularly to the swivel axis 14 .
  • the contact device 55 is formed by a free terminal end of the antenna conductor 50 being disposed on the partial area 48 in a circularly spiraled manner to form the antenna part 51 .
  • the antenna conductor 50 in the case at hand firstly describes left-turning antenna windings 59 before changing its winding sense at a transition point 60 disposed on the swivel axis 14 and being transferred on the partial area 49 into right-turning antenna windings 59 which are equally disposed in a circularly spiraled manner, and the free terminal end thereof forming an antenna connection contact 61 which extends into an inner region 63 of the antenna part 52 and the contact face 76 thereof being disposed on the contact axis 28 .
  • the contact devices 54 and 55 of the terminal face arrangement 53 of the first antenna part 51 are contacted with terminal faces 64 , 65 of a chip 66 .
  • the chip 66 is disposed on the contact devices 54 , 55 using flip-chip technology.
  • the partial faces 48 , 49 of the substrate 47 are folded or else swiveled with respect to each other resulting in the contact faces 58 and 76 of the antenna connection contacts 57 and 61 being brought into an overlapping position ( FIG. 6 ), wherein an electrically conductive connection can be produced in a connection region 68 .
  • This connection can be realized for instance by thermal compression, the application of ultrasound, mechanical deformation or else adhesive bonding.
  • At least the outer edges 69 , 70 and 71 not converging with the swivel axis 14 can be hermetically connected with each other, for instance using a hot-sealed joint or adhesive bonding.
  • FIG. 7 illustrates the transponder 67 depicted in FIG. 6 in a cross-sectional view longitudinally to the contact axis 28 .
  • the chip 66 which is contacted with the contact devices 54 , 55 of the first antenna part 51 , is accommodated between the partial areas 48 , 49 of the substrate 47 so as to be housed there between.
  • a folding edge 73 is formed at the left edge of the transponder module 67 in FIG. 7 , which jointly with the hot-sealed joints 72 formed at the remaining outer edges 69 , 70 , 71 ( FIG.
  • the antenna 6 provides for an overall hermetically sealed accommodation of the chip 66 and also of an antenna conductor arrangement 77 formed by the antenna parts 51 , 52 .
  • an overlap is obtained between the antenna windings 59 of the first antenna part 51 and the second antenna part 52 , such that in the present exemplary embodiment, an insulation should be formed between the antenna parts 51 , 52 which may be formed by a baked enamel coating or the like.

Landscapes

  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
US13/063,343 2008-09-11 2009-07-20 Antenna module for producing a transponder, and a transponder Active 2031-06-08 US8810472B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102008047013.9 2008-09-11
DE102008047013A DE102008047013A1 (de) 2008-09-11 2008-09-11 Antennenmodul zur Herstellung eines Transponders sowie Transponder
DE102008047013 2008-09-11
PCT/EP2009/005235 WO2010028716A1 (de) 2008-09-11 2009-07-20 Antennenmodul zur herstellung eines transponders sowie transponder

Publications (2)

Publication Number Publication Date
US20110169702A1 US20110169702A1 (en) 2011-07-14
US8810472B2 true US8810472B2 (en) 2014-08-19

Family

ID=41210652

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/063,343 Active 2031-06-08 US8810472B2 (en) 2008-09-11 2009-07-20 Antenna module for producing a transponder, and a transponder

Country Status (3)

Country Link
US (1) US8810472B2 (de)
DE (1) DE102008047013A1 (de)
WO (1) WO2010028716A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010012603B4 (de) * 2010-03-24 2019-09-12 Snaptrack, Inc. Frontendmodul und Verfahren zum Betrieb in unterschiedlichen Schaltungsumgebungen
JP6056978B2 (ja) * 2013-08-15 2017-01-11 富士通株式会社 Rfidタグ及びその製造方法
DE102013015790A1 (de) * 2013-09-23 2015-03-26 Mühlbauer Ag RFID Transponder und Verfahren zum Herstellen eines RFID Transponders
US10229353B2 (en) * 2014-07-31 2019-03-12 3M Innovative Properties Company RFID tag on stretchable substrate
FR3045955B1 (fr) * 2015-12-17 2018-11-16 Idemia France Module de communication sans fil, plaque adaptee pour etre utilisee pour la fabrication dudit module et procede de fabrication dudit module

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335443A (ja) 1994-06-13 1995-12-22 Hitachi Maxell Ltd コイル装置およびそれを用いたicメモリ装置
DE10052517A1 (de) 2000-04-28 2002-02-07 Multitape Gmbh & Co Kg Transpondemodul und Verfahren zum Herstellen eines Transponders
JP2002366917A (ja) 2001-06-07 2002-12-20 Hitachi Ltd アンテナを内蔵するicカード
JP2003022912A (ja) 2001-03-30 2003-01-24 Mitsubishi Materials Corp アンテナコイル及びそれを用いた識別タグ、リーダライタ装置、リーダ装置及びライタ装置
US20050130389A1 (en) * 2003-12-12 2005-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP1755069A1 (de) 2004-03-16 2007-02-21 Omron Corporation Dünnes ic-etikett und herstellungsverfahren dafür

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4369557A (en) * 1980-08-06 1983-01-25 Jan Vandebult Process for fabricating resonant tag circuit constructions
DE3221500A1 (de) * 1982-06-07 1983-12-08 Max-E. Dipl.-Ing. 7320 Göppingen Reeb Identifizierungsanordnung in form eines an einem gegenstand anbringbaren gebildes und verfahren zur herstellung
JPH11134459A (ja) * 1997-10-29 1999-05-21 Omron Corp 電磁波読取可能な柔軟性のある薄型icカード及びその製造方法
JP3900630B2 (ja) * 1997-12-03 2007-04-04 株式会社デンソー リモートidタグ
JP2002183689A (ja) * 2000-12-11 2002-06-28 Dainippon Printing Co Ltd 非接触データキャリア装置とその製造方法
DE10121126A1 (de) * 2001-04-30 2002-11-07 Intec Holding Gmbh Identifikationsträger und Verfahren zu dessen Herstellung
DE10233927A1 (de) * 2002-07-25 2004-02-12 Giesecke & Devrient Gmbh Datenträger mit Transponderspule
JP2006304184A (ja) * 2005-04-25 2006-11-02 Lintec Corp アンテナ回路、icインレット、icタグ及びicカードならびにicタグの製造方法及びicカードの製造方法
JP4631910B2 (ja) * 2005-08-03 2011-02-16 パナソニック株式会社 アンテナ内蔵型記憶媒体
JP2008003681A (ja) * 2006-06-20 2008-01-10 Tateyama Kagaku Kogyo Kk 無線icタグとその製造方法
EP2102799B1 (de) * 2006-12-18 2011-06-01 Mikoh Corporation Hochfrequenzidentifikationsetikett mit privatsphären- und sicherheitsfähigkeiten

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335443A (ja) 1994-06-13 1995-12-22 Hitachi Maxell Ltd コイル装置およびそれを用いたicメモリ装置
DE10052517A1 (de) 2000-04-28 2002-02-07 Multitape Gmbh & Co Kg Transpondemodul und Verfahren zum Herstellen eines Transponders
JP2003022912A (ja) 2001-03-30 2003-01-24 Mitsubishi Materials Corp アンテナコイル及びそれを用いた識別タグ、リーダライタ装置、リーダ装置及びライタ装置
JP2002366917A (ja) 2001-06-07 2002-12-20 Hitachi Ltd アンテナを内蔵するicカード
US20050130389A1 (en) * 2003-12-12 2005-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP1755069A1 (de) 2004-03-16 2007-02-21 Omron Corporation Dünnes ic-etikett und herstellungsverfahren dafür

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
English Translation of the PCT International Preliminary Report on Patentability, International Application No. PCT/EP2009/005235, mailed Mar. 24, 2011.
The International Search Report as mailed on Nov. 5, 2009 for International Application No. PCT/EP2009/005235.

Also Published As

Publication number Publication date
WO2010028716A1 (de) 2010-03-18
DE102008047013A1 (de) 2010-03-25
US20110169702A1 (en) 2011-07-14

Similar Documents

Publication Publication Date Title
US8810472B2 (en) Antenna module for producing a transponder, and a transponder
TWI275199B (en) Method for manufacturing radio frequency IC tag and antenna
US9431379B2 (en) Signal transmission arrangement
JP6583589B2 (ja) 無線通信デバイス
US20080007918A1 (en) Power semiconductor module with connection elements electrically insulated from one another
US20110090651A1 (en) Package structure
WO2007015353A1 (ja) アンテナ内蔵型記憶媒体
EP1134807B1 (de) Halbleiterbauelement
JP2007281452A (ja) 電子構成要素用の接続装置
US20170092574A1 (en) Method for manufacture a power electronic switching device and power electronic switching device
CN107799651A (zh) 振动装置
US20130114221A1 (en) Housing for an Electric Circuit for a Fuel Pump
US7164201B2 (en) Semiconductor module with scalable construction
JP6540796B2 (ja) 圧電素子およびこれを備える超音波センサ
US10217040B2 (en) Contactless information medium
CN103987192A (zh) 线路布置
TW200427398A (en) Low profile filter
WO2019012678A1 (ja) 電子モジュール
JP5344000B2 (ja) 接触非接触両用icモジュール及びicカード
CN110476343B (zh) 电力转换装置
US20130069427A1 (en) Circuit arrangement and associated controller for a motor vehicle
CN207338430U (zh) 振动装置
US8174169B2 (en) Piezoelectric transformer
US11486904B2 (en) Electronic module
US20130049540A1 (en) Electronic component, polymer actuator, and method for manufacturing electronic component

Legal Events

Date Code Title Description
AS Assignment

Owner name: SMARTRAC IP B.V., NETHERLANDS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WENDISCH, JAN;KONOPITZKY, EGON;SIGNING DATES FROM 20110303 TO 20110309;REEL/FRAME:025934/0586

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551)

Year of fee payment: 4

AS Assignment

Owner name: LINXENS HOLDING S.A.S., FRANCE

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SMARTRAC IP B.V.;REEL/FRAME:049031/0849

Effective date: 20190328

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 8