US7989563B2 - Resin compositions, films using the same and process for producing the films - Google Patents
Resin compositions, films using the same and process for producing the films Download PDFInfo
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- US7989563B2 US7989563B2 US12/388,077 US38807709A US7989563B2 US 7989563 B2 US7989563 B2 US 7989563B2 US 38807709 A US38807709 A US 38807709A US 7989563 B2 US7989563 B2 US 7989563B2
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- resin composition
- mass
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- meth
- film
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000178 monomer Substances 0.000 claims abstract description 25
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract description 13
- 125000004185 ester group Chemical group 0.000 claims abstract description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 9
- 125000000732 arylene group Chemical group 0.000 claims abstract description 7
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 7
- 238000012719 thermal polymerization Methods 0.000 claims abstract description 7
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 4
- -1 allyl ester Chemical class 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 20
- 239000003999 initiator Substances 0.000 claims description 10
- 238000003892 spreading Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000010408 film Substances 0.000 description 81
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 34
- 239000003795 chemical substances by application Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 11
- 239000010410 layer Substances 0.000 description 9
- 239000002250 absorbent Substances 0.000 description 8
- 230000002745 absorbent Effects 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 8
- 0 C=CCOC(=O)[2*]C(=O)O[1*]OC(=O)[2*]C(=O)OCC=C Chemical compound C=CCOC(=O)[2*]C(=O)O[1*]OC(=O)[2*]C(=O)OCC=C 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 238000005401 electroluminescence Methods 0.000 description 4
- 239000004611 light stabiliser Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000007669 thermal treatment Methods 0.000 description 3
- HGTUJZTUQFXBIH-UHFFFAOYSA-N (2,3-dimethyl-3-phenylbutan-2-yl)benzene Chemical group C=1C=CC=CC=1C(C)(C)C(C)(C)C1=CC=CC=C1 HGTUJZTUQFXBIH-UHFFFAOYSA-N 0.000 description 2
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- CCTFAOUOYLVUFG-UHFFFAOYSA-N 2-(1-amino-1-imino-2-methylpropan-2-yl)azo-2-methylpropanimidamide Chemical compound NC(=N)C(C)(C)N=NC(C)(C)C(N)=N CCTFAOUOYLVUFG-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 229920003180 amino resin Polymers 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- ZXTPJLLIHIDBKQ-UHFFFAOYSA-N bis(prop-2-enyl) cyclohexane-1,4-dicarboxylate Chemical compound C=CCOC(=O)C1CCC(C(=O)OCC=C)CC1 ZXTPJLLIHIDBKQ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 description 2
- 229940080818 propionamide Drugs 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- CZZVAVMGKRNEAT-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)CO.OCC(C)(C)C(O)=O CZZVAVMGKRNEAT-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- UMLWXYJZDNNBTD-UHFFFAOYSA-N 2-(dimethylamino)-1-phenylethanone Chemical compound CN(C)CC(=O)C1=CC=CC=C1 UMLWXYJZDNNBTD-UHFFFAOYSA-N 0.000 description 1
- ALKUXXGWPZGATQ-UHFFFAOYSA-N 2-[(1-amino-1-ethylimino-2-methylpropan-2-yl)diazenyl]-n'-ethyl-2-methylpropanimidamide Chemical compound CCN=C(N)C(C)(C)N=NC(C)(C)C(N)=NCC ALKUXXGWPZGATQ-UHFFFAOYSA-N 0.000 description 1
- UNFZPQBHLFUWDM-UHFFFAOYSA-N 2-[(1-amino-1-imino-2,4-dimethylpentan-2-yl)diazenyl]-2,4-dimethylpentanimidamide Chemical compound CC(C)CC(C)(C(N)=N)N=NC(C)(C(N)=N)CC(C)C UNFZPQBHLFUWDM-UHFFFAOYSA-N 0.000 description 1
- WZHRFIACUJRXNQ-UHFFFAOYSA-N 2-[(1-amino-2-cyclopropyl-1-iminopropan-2-yl)diazenyl]-2-cyclopropylpropanimidamide Chemical compound C1CC1C(C(N)=N)(C)N=NC(C)(C(N)=N)C1CC1 WZHRFIACUJRXNQ-UHFFFAOYSA-N 0.000 description 1
- CZOJDQJZLWOISI-UHFFFAOYSA-N 2-[(1-amino-2-methylpropan-2-yl)diazenyl]-2-methylpropan-1-amine Chemical compound NCC(C)(C)N=NC(C)(C)CN CZOJDQJZLWOISI-UHFFFAOYSA-N 0.000 description 1
- CKSAKVMRQYOFBC-UHFFFAOYSA-N 2-cyanopropan-2-yliminourea Chemical compound N#CC(C)(C)N=NC(N)=O CKSAKVMRQYOFBC-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- 125000003504 2-oxazolinyl group Chemical class O1C(=NCC1)* 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- VFXXTYGQYWRHJP-UHFFFAOYSA-N 4,4'-azobis(4-cyanopentanoic acid) Chemical compound OC(=O)CCC(C)(C#N)N=NC(C)(CCC(O)=O)C#N VFXXTYGQYWRHJP-UHFFFAOYSA-N 0.000 description 1
- WZSFTHVIIGGDOI-UHFFFAOYSA-N 4,5,6,7-tetrachloro-3-[2-methyl-3-[(4,5,6,7-tetrachloro-3-oxoisoindol-1-yl)amino]anilino]isoindol-1-one Chemical compound ClC1=C(Cl)C(Cl)=C(Cl)C2=C1C(NC1=CC=CC(NC=3C4=C(C(=C(Cl)C(Cl)=C4Cl)Cl)C(=O)N=3)=C1C)=NC2=O WZSFTHVIIGGDOI-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000012935 ammoniumperoxodisulfate Substances 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000002928 artificial marble Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 150000001541 aziridines Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000003354 benzotriazolyl group Chemical class N1N=NC2=C1C=CC=C2* 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- JKJWYKGYGWOAHT-UHFFFAOYSA-N bis(prop-2-enyl) carbonate Chemical compound C=CCOC(=O)OCC=C JKJWYKGYGWOAHT-UHFFFAOYSA-N 0.000 description 1
- FPODCVUTIPDRTE-UHFFFAOYSA-N bis(prop-2-enyl) hexanedioate Chemical compound C=CCOC(=O)CCCCC(=O)OCC=C FPODCVUTIPDRTE-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- GYCUTPICSQQWKP-UHFFFAOYSA-N bis[2-(5-methyl-4,5-dihydro-1h-imidazol-2-yl)propan-2-yl]diazene Chemical compound N1C(C)CN=C1C(C)(C)N=NC(C)(C)C1=NCC(C)N1 GYCUTPICSQQWKP-UHFFFAOYSA-N 0.000 description 1
- ADKBGLXGTKOWIU-UHFFFAOYSA-N butanediperoxoic acid Chemical compound OOC(=O)CCC(=O)OO ADKBGLXGTKOWIU-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 150000004662 dithiols Chemical class 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- WVFLGSMUPMVNTQ-UHFFFAOYSA-N n-(2-hydroxyethyl)-2-[[1-(2-hydroxyethylamino)-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCO WVFLGSMUPMVNTQ-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000005385 peroxodisulfate group Chemical group 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/06—Unsaturated polyesters
- C08J2367/07—Unsaturated polyesters having terminal carbon-to-carbon unsaturated bonds
Definitions
- the present invention relates to resin compositions containing a reactive oligomer having allyl ester groups, films using the resin compositions and a process for producing the films.
- Molded articles of an allyl ester resin have excellent heat resistance, transparency, weatherability, electrical properties and mechanical properties and are also recently found to have excellent optical properties. Therefore, the molded articles are advantageously used in various applications such as laminated plastics, artificial marbles and anti-crack materials for unsaturated polyester resins as well as optical materials such as lenses, spectacle lenses, optical discs and prisms.
- the molded articles using such an allyl ester resin are generally produced by cast molding in which the liquid resin is injected into a glass mold or a metal mold and then heated for curing, or by compression molding in which a clay-like mass obtained by mixing the liquid resin with a filler is placed in a metal mold and heated under pressure for curing (for example, refer to Patent Document 1)
- the form of optical materials as required is diversified along with recent development of an optical industry.
- various image display devices such as liquid crystal panels and liquid crystal display devices
- film-shaped molded articles used in self emission type display devices other than liquid crystal display devices such as organic electroluminescence (EL) display, plasma display (PD) and field emission display (FED) devices.
- EL organic electroluminescence
- PD plasma display
- FED field emission display
- As the film-shaped molded articles molded articles of an allyl ester resin having excellent heat resistance, transparency and optical properties are promising.
- Patent Document 1 JP 2002-69035A
- an object of the present invention to provide a resin composition containing a reactive oligomer having allyl ester groups, a film of such a resin composition having excellent transparency, excellent heat resistance and a high thickness precision, and a process for producing the above film.
- the present inventors have made an earnest study for solving the above problem and have found that a resin composition containing a specific reactive oligomer having allyl ester groups is suited for producing a film-like molded article having excellent transparency, excellent heat resistance and a high thickness precision.
- the present invention has been accomplished on the basis of the above finding.
- the present invention provides the following aspects relating to a resin composition, a film of such a resin composition and a process for producing the film:
- a resin composition including the following components (A) to (C):
- R 3 represents an alkanediyl, an alkenediyl group, a cycloalkanediyl group, a cycloalkenediyl group or an arenediyl group.
- the present invention it is possible to provide a resin composition containing a reactive oligomer having allyl ester groups, a film of the resin composition having excellent transparency, excellent heat resistance and high thickness precision, and a process for producing such a film.
- the resin composition of the present invention includes, as component (A), a reactive oligomer having allyl ester groups and represented by the following formula (1):
- R 1 represents an alkanediyl or alkenediyl group having 1 to 4 carbon atoms
- R 2 represents a cycloalkanediyl, cycloalkenediyl or arenediyl group.
- R 1 groups may be the same or different.
- R 2 groups may be the same or different.
- Each of the R 1 and R 2 groups may be straight-chain or branched-chain and may be unsubstituted or substituted with one or more substituent groups.
- the reactive oligomer having allyl ester groups as the component (A) which is represented by the general formula (1) may be synthesized by any suitable known method.
- a method in which a di(meth)allyl ester of a dicarboxylic acid or an anhydride thereof is subjected to transesterification with a polyhydric alcohol in the presence of a catalyst for example, refer to JP 06-73145A
- a method in which a lower ester of allyl alcohol and a saturated polycarboxylic acid is reacted with a polyhydric alcohol
- the thus obtained reactive oligomer contains a residual raw material monomer having a low molecular weight.
- the reactive oligomer may be a product synthesized as above or a commercial product available, for example, under the trade names of PP201, DA101 and BA901 (all manufactured by SHOWA DENKO K.K.).
- the polyfunctional (meth)acrylic monomer is preferably a (meth)acrylate having two or more ethylenically unsaturated bonds within the molecule.
- Specific examples of the polyfunctional (meth)acrylic monomer include ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, neopentyl glycol hydroxypivalic acid di(meth)acrylate, dicyclopentanyl di(meth)acrylate, caprolactone-modified dicyclopentenyl di(meth)acrylate, ethylene oxide-modified phosphoric acid di(meth)acrylate, allylated cyclohexyl di(meth)acrylate, isocyanurate di(meth
- Examples of the polyfunctional (meth)acrylic oligomer include an epoxy(meth)acrylate-based oligomer, a urethane (meth)acrylate-based oligomer, a polyester(meth)acrylate-based oligomer and a polyether(meth)acrylate-based oligomer.
- the epoxy(meth)acrylate-based oligomer may be obtained, for example, by esterifying the oxirane ring of a bisphenol type or a novolak type epoxy resin having a relatively low molecular weight with (meth)acrylic acid.
- the epoxy(meth)acrylate-based oligomer may be partially modified with a dibasic carboxylic anhydride. Such a carboxyl-modified epoxy(meth)acrylate-based oligomer may also be suitably used.
- the thermal polymerization initiator as the component (C) is used for accelerating curing of the resin composition.
- Ordinarily employed thermal polymerization initiators may be used as the component (C) in the present invention without particular limitation.
- component (C) examples include hydrogen peroxide; peroxodisulfate salts such as ammonium peroxodisulfate, sodium peroxodisulfate and potassium peroxodisulfate; azo compounds such as 2,2′-azobis(2-amidinopropane)dihydrochloride, 4,4′-azobis(4-cyanovalelic acid), 2,2′-azobisisobutyronitrile and 2,2′-azobis(4-methoxy-2,4-dimethylvalelonitrile); and organic peroxides such as benzoyl peroxide, lauroyl peroxide, peracetic acid, persuccinic acid, di-t-butyl peroxide, t-butyl hydroperoxide and cumene hydroperoxide. These thermal polymerization initiators may be used singly or in combination of two or more thereof.
- the photopolymerization initiator as the component (D) is preferably used for the purpose of instantaneously curing the resin composition when using UV rays as an energy ray to thereby obtain a film having a high thickness precision.
- Ordinarily employed photopolymerization initiators may be used in the present invention without particular limitation.
- R 3 represents an alkanediyl group, an alkenediyl group, a cycloalkanediyl group, a cycloalkenediyl group or an arenediyl group.
- the R 3 group is preferably an alkanediyl group, a cyclohexanediyl group or a phenylene group.
- the wear resistance improver examples include inorganic particles such as particles of ⁇ -alumina, silica, kaolinite, iron oxide, diamond and silicon carbide; and organic synthetic resin beads such as beads of cross-linked acrylic resin and polycarbonate resin.
- the shape of the particles is not specifically limited and may be, for example, a spherical shape, an oval shape, a polyhedral shape and a scale-like shape. Among them, spherical particles are preferably used although not limited thereto.
- the particle size of the wear resistance improver in the form of particles is generally about 10 to 200% of the thickness of the film to be prepared.
- spherical ⁇ -alumina is especially preferred because it has a high hardness, can exhibit a large effect of improving the wear resistance, and is relatively easily available in the form of spherical particles.
- polymerization inhibitor examples include hydroquinone, p-benzoquinone, hydroquinone monomethyl ether, pyrogallol and t-butylcatechol.
- cross-linking agent examples include polyisocyanate compounds, epoxy compounds, metal chelate compounds, aziridine compounds and oxazoline compounds.
- a semi-cured film of the present invention may be obtained by a process including spreading the resin composition of the present invention on a substrate, and irradiating the spread resin composition with an energy ray to gelate the resin composition.
- the term “semi-cured” means a condition in which part of the monomer or oligomer contained in the resin composition is cross-linked to form a three-dimensional network structure, and unreacted components are held within the network structure.
- the substrate there is no specific limitation on the substrate as long as it is not deteriorated when irradiated with an energy ray.
- the substrate include sheets of a resin such as a polyethylene resin, a polypropylene resin and a polyethylene terephthalate resin.
- the thickness of the substrate is not specifically limited but is generally about 10 to 500 ⁇ m, preferably 20 to 200 ⁇ m, more preferably 25 to 100 ⁇ m.
- the substrate may be in the form of a release sheet provided with a releasing agent layer formed by applying a releasing agent on a surface of the substrate, for the purpose of easily peeling off the semi-cured film from the substrate.
- the release sheet may be provided on one side or both sides of the semi-cured film.
- the resin composition is spread (applied) onto the releasing agent layer of the release sheet to form a coating layer thereof having a given thickness after dried, and the applied resin composition is irradiated with an energy ray from the side of resin composition and gelated to form a semi-cured film.
- another release sheet is laminated to obtain a laminate having two release sheets on both sides of the semi-cured film.
- the releasing agent may be, for example, an alkyd-based resin releasing agent or a silicone-based resin releasing agent, and is applied on the surface of the substrate to form the release agent layer thereon.
- the thickness of the release agent layer is not particularly limited, and generally about 1 to 30 ⁇ m, preferably 1 to 10 ⁇ m.
- the resin composition may be spread on the substrate by various suitable known methods such as roll coating, spray coating or spin coating without particular limitation.
- a coating amount of the resin composition on the substrate may be suitably adjusted so that a film obtained after curing has a desired thickness.
- the energy ray used for curing the resin composition may be, for example, an ionizing radiation such as UV rays or electron beams.
- an ionizing radiation such as UV rays or electron beams.
- light containing UV rays having a wavelength of 190 to 380 nm may be suitably used.
- the UV dose may be suitably determined according to the resin composition and the film thickness and is generally in the range of about 50 to 500 mJ/cm 2 , preferably 100 to 450 mJ/cm 2 , more preferably 100 to 200 mJ/cm 2 .
- the illuminance of the UV rays is generally about 50 to 500 mW/cm 2 , preferably 100 to 450 mW/cm 2 , more preferably 200 to 400 mW/cm 2 .
- Any UV source may be used without particular limitation for the purpose of the present invention. Examples of the UV source include a high pressure mercury-vapor lamp, a low pressure mercury-vapor lamp, a metal halide lamp and a carbon arc lamp.
- the electron beam accelerating voltage may be suitably determined according to the resin composition and the film thickness and is generally in the range of about 70 to 300 kV.
- the irradiation is performed with a dose of the degree to which the resin composition is gelated.
- the irradiation dose is generally in the range of 5 to 300 kGy (0.5 to 30 Mrad), preferably 10 to 50 kGy (1 to 5 Mrad).
- Any electron beam source may be used without particular limitation for the purpose of the present invention.
- Examples of the electron beam source include various electron beam accelerators such as a Cockcroft-Walton accelerator, a van de Graaff accelerator, a resonance transformer accelerator, an insulation core transformer accelerator, a linear accelerator, a dynamitron accelerator and a high frequency accelerator.
- various electron beam accelerators such as a Cockcroft-Walton accelerator, a van de Graaff accelerator, a resonance transformer accelerator, an insulation core transformer accelerator, a linear accelerator, a dynamitron accelerator and a high frequency accelerator.
- the thickness of the semi-cured film may vary depending upon its end use and is generally about 10 to 300 ⁇ m, preferably 50 to 200 ⁇ m, more preferably 50 to 150 ⁇ m.
- the semi-cured film of the present invention is suited for use as optical materials, in particular, as production of display optical films such as plastic substrates for display drive circuits, phase difference films, view-angle enlarging films, luminance improving plates, reflection films and optical guide films.
- the semi-cured film may be used in the form of a laminate with any other suitable film or a glass plate, etc.
- a cured film of the present invention may be obtained by a process including spreading the resin composition of the present invention on a substrate, irradiating the spread resin composition with an energy ray, and thermally treating the spread resin composition. More specifically, the cured film may be obtained by first preparing a semi-cured film by energy ray irradiation of the resin composition of the present invention, and the semi-cured film is thereafter thermally treated to obtain the cured film. Alternatively, the spread resin composition is thermally treated while being irradiated with an energy ray to obtain the cured film.
- the substrate and energy ray irradiation used in the process for producing the cured film are the same as those in the semi-cured film production process.
- the thermal treatment may be carried out using a hot-air dryer, an oven, an autoclave or the like.
- the thermal treatment conditions may be properly determined in consideration of the thickness of the film obtained from the resin composition, etc.
- the thermal treatment is carried out at a temperature of 100 to 150° C., preferably 100 to 135° C., for 1 to 5 hours, preferably 1 to 3 hours to prevent deformation of the substrate.
- the thickness of the cured film may vary depending upon its end use and is generally about 10 to 300 ⁇ m, preferably 50 to 200 ⁇ m, more preferably 50 to 150 ⁇ m.
- the cured film of the present invention is suited for use as optical materials, in particular, components of various image display devices, such as liquid crystal panels and liquid crystal display devices, and components used in self emission type display devices other than liquid crystal display devices, such as organic electroluminescence (EL) display, plasma display (PD) and field emission display (FED) devices.
- image display devices such as liquid crystal panels and liquid crystal display devices
- self emission type display devices other than liquid crystal display devices, such as organic electroluminescence (EL) display, plasma display (PD) and field emission display (FED) devices.
- EL organic electroluminescence
- PD plasma display
- FED field emission display
- the cured film when used as an optical material as described above, preferably has a tensile fracture stress of 30,000 mN/15 mm or more, an in-plane phase difference of 10 nm or less, more preferably 5 nm or less, a transparency of 85% or more, more preferably 90% or more, in terms of a total light transmittance, a heat resistance of 2% or less, more preferably 1% or less, in terms of a change of length as evaluated by the method described hereinafter, and a thickness precision of 20 ⁇ m or less, more preferably 10 ⁇ m or less, in terms of an precision value as measured by the method described hereinafter.
- the cured films obtained in Examples and Comparative Examples were measured for their in-plane phase differences using a phase difference measuring device (KOBRA-WR (trade name) manufactured by Oji Scientific Instrument).
- Total light transmittance of each of the cured films was measured in accordance with JIS K7361-1 using a haze meter (Model NDH2000 manufactured by Nippon Denshoku Industries Co., Ltd.
- each of the cured films was heated from room temperature to 170° C. (film width: 4.5 mm, chuck distance: 15 mm, heating rate 10° C./min, load: 2 mN) and a change (%) of the length at 160° C. relative to the initial length was measured.
- Edges of the semi-cured films and cured films were cut to prepare sheets with a dimension of 210 mm ⁇ 297 mm. Each sheet was measured for its thickness at total 20 points (intersections of four longitudinal lines and five transverse lines), and the average and a difference between the maximum and minimum thicknesses (as thickness precision) were determined.
- a releasing agent (a releasing agent of an alkyd-based resin) was applied onto a PET film (SP-PET38X (trade name) manufactured by Lintec Corporation, thickness: 38 ⁇ m) to form a release agent layer thereon.
- Resin compositions of Examples 1 to 5 and Comparative Example 1 prepared with the formulations and blending ratios (mass ratios) shown in Table 1 were each applied to a surface of the release agent layer with an applicator such that the resin composition layer after curing had a thickness of 100 ⁇ m.
- the applied resin compositions were irradiated with UV rays under conditions of 300 mW/cm 2 and 150 mJ/cm 2 using a UV irradiator (FUSION H LAMP (trade name)) to gelate (semi-cure) the resin compositions, thereby obtaining semi-cured films.
- a UV irradiator FUSION H LAMP (trade name)
- Each of the semi-cured films was overlaid with a PET film (SP-PET381031 (trade name) manufactured by Lintec Corporation, thickness: 38 ⁇ m) having a release agent layer formed by applying a releasing agent of a silicone-based resin onto the PET film, such that the release agent layer was in contact with the semi-cured film.
- the resulting laminate was placed in an oven at 130° C. and allowed to stand for 2 hours. Thereafter, the release films on both sides were removed to obtain cured films each having a thickness of 100 ⁇ m.
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
wherein R1 represents an alkanediyl or alkenediyl group having 1 to 4 carbon atoms with the proviso that a plurality of R1 groups may be the same or different, R2 represents a cycloalkanediyl, cycloalkenediyl or arenediyl group with the proviso that a plurality of R2 groups may be the same or different, and n represents an average degree of polymerization and is a number of 1 to 30; (B) a polyfunctional (meth)acrylic monomer and/or oligomer; and (C) a thermal polymerization initiator.
Description
wherein R1 represents an alkanediyl or alkenediyl group having 1 to 4 carbon atoms with the proviso that a plurality of R1 groups may be the same or different, R2 represents a cycloalkanediyl, cycloalkenediyl or arenediyl group with the proviso that a plurality of R2 groups may be the same or different, and n represents an average degree of polymerization and is a number of 1 to 30;
wherein R3 represents an alkanediyl, an alkenediyl group, a cycloalkanediyl group, a cycloalkenediyl group or an arenediyl group.
4. A semi-cured film obtained by spreading the resin composition as described in the above aspects 1 on a substrate, and then gelating the spread resin composition by energy ray irradiation.
5. A cured film obtained by thermally treating the semi-cured film as described in the above aspect 4.
6. A process for producing a semi-cured film, including the steps of spreading the resin compositions as described in the above aspects 1 on a substrate, and irradiating the spread resin composition with an energy ray.
7. A process for producing a cured film, including the steps of spreading the resin composition as described in the above aspects 1 on a substrate, irradiating the spread resin composition with an energy ray, and thermally treating the spread resin composition.
TABLE 1 | ||||||
Com- | ||||||
Exam- | Exam- | Exam- | Exam- | parative | ||
ple 1 | ple 2 | ple 3 | ple 4 | Example 1 | ||
DA101 *1 | 100 | — | — | — | — |
(Components A + E) | |||||
BA901 *2 | — | 100 | — | — | — |
(Components A + E) | |||||
PP201 *3 | — | — | 100 | 100 | 100 |
(Components A + E) | |||||
A-DPH *4 | 10 | 10 | 5 | 15 | — |
(Component B) | |||||
Irg500 *5 | 0.5 | 2 | 2 | 3 | 2 |
(Component D) | |||||
Dicumyl *6 | 2 | 2 | 2 | 2 | 2 |
(Component C) | |||||
*1: DA101: Composition (manufactured by Showa Denko K. K.) composed of 85% of a reactive oligomer containing allyl ester groups (Component A) and 15% of diallyl 1,4-cyclohexanedicarboxylate (Component E) as an allyl ester monomer | |||||
*2: BA901: Composition (manufactured by Showa Denko K. K.) composed of 60% of a reactive oligomer containing allyl ester groups (Component A) and 40% of diallyl isophthalate (Component E) as an allyl ester monomer | |||||
*3: PP201: Composition (manufactured by Showa Denko K. K.) composed of 55% of a reactive oligomer containing allyl ester groups (Component A) and 45% of diallyl 1,4-cyclohexanedicarboxylate (Component E) as an allyl ester monomer | |||||
*4: A-DPH: Dipentaerythritol hexaacrylate (NK ESTER A-DPH (trade name) manufactured by Shin-Nakamura Chemical Co., Ltd.) | |||||
*5: Irg500: Photopolymerization initiator (IRGACURE 500 (trade name) manufactured by Ciba Speciality Chemicals Inc.) | |||||
*6: Dicumyl: Thermal polymerization initiator (dicumylperoxide manufactured by Sigma-Aldrich Japan K. K.) |
TABLE 2 | |||||||
Tensile | In- | Thickness | Average | ||||
fracture | plane | precision | thickness | ||||
stress | phase | Heat | (μm) | (μm) |
(mN/ | difference | Transparency | resistance | Semi- | Semi- | ||||
15 mm) | (nm) | (%) | (μm) | Cured | cured | Cured | cured | ||
Example 1 | 65,000 | 1.5 | 92 | 0.7 | 5 | 6 | 104 | 105 |
Example 2 | 50,000 | 1.5 | 91 | 0.6 | 6 | 5 | 98 | 100 |
Example 3 | 40,000 | 1.5 | 92 | 0.8 | 6 | 6 | 101 | 103 |
Example 4 | 42,000 | 1.5 | 92 | 0.8 | 6 | 5 | 102 | 103 |
Comp. | — | — | — | — | — | — | — | — |
Example 1 | ||||||||
Claims (11)
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JP2008-039011 | 2008-02-20 | ||
JP2008039011A JP5189379B2 (en) | 2008-02-20 | 2008-02-20 | Resin composition, film using the same, and method for producing film |
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US7989563B2 true US7989563B2 (en) | 2011-08-02 |
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US (1) | US7989563B2 (en) |
JP (1) | JP5189379B2 (en) |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013035891A2 (en) | 2011-09-09 | 2013-03-14 | Showa Denko K.K. | Radically polymerizable compound and radically curable composition |
WO2014133052A1 (en) | 2013-02-28 | 2014-09-04 | 昭和電工株式会社 | Curable composition, transparent heat-resistant material, and use thereof |
US9939677B2 (en) | 2010-12-23 | 2018-04-10 | Lg Innotek Co., Ltd. | Back light unit and liquid crystal display using the same |
Families Citing this family (7)
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WO2011074418A1 (en) * | 2009-12-14 | 2011-06-23 | ダイセル化学工業株式会社 | Laminated body comprising porous layer and functional laminate using same |
JPWO2013047223A1 (en) * | 2011-09-28 | 2015-03-26 | 昭和電工株式会社 | Curable composition |
TWI576374B (en) | 2012-07-31 | 2017-04-01 | Showa Denko Kk | And a method for producing a hardened resin molded article |
CN105263687B (en) | 2013-06-25 | 2017-12-19 | 昭和电工株式会社 | The manufacture device and manufacture method of light-cured resin film |
WO2017013950A1 (en) * | 2015-07-21 | 2017-01-26 | 株式会社大阪ソーダ | Composition for lining |
CN105374924B (en) * | 2015-10-23 | 2018-03-06 | 佛山市中昊光电科技有限公司 | The preparation method of the preparation facilities of glued membrane, preparation method and flip LED chips |
JP2018072644A (en) * | 2016-10-31 | 2018-05-10 | 昭和電工株式会社 | Optical imaging device and method for manufacturing the same |
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US6262211B1 (en) * | 1998-01-30 | 2001-07-17 | Ppg Industries Ohio, Inc. | Polymerizable polyol(allyl carbonate) composition |
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JP4754712B2 (en) | 2000-06-16 | 2011-08-24 | 昭和電工株式会社 | Method for producing alicyclic (meth) allyl ester monomer, alicyclic (meth) allyl ester compound, method for producing the compound, composition for plastic lens containing the compound, and plastic lens obtained by curing the composition And its manufacturing method |
JP4892963B2 (en) * | 2005-12-22 | 2012-03-07 | 住友ベークライト株式会社 | Resin composition and semiconductor device produced using resin composition |
TW200813133A (en) * | 2006-07-18 | 2008-03-16 | Showa Denko Kk | Transparent antireflection plate |
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2008
- 2008-02-20 JP JP2008039011A patent/JP5189379B2/en active Active
-
2009
- 2009-02-17 KR KR1020090012819A patent/KR101604479B1/en active IP Right Grant
- 2009-02-18 TW TW098105055A patent/TWI443168B/en active
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US6262211B1 (en) * | 1998-01-30 | 2001-07-17 | Ppg Industries Ohio, Inc. | Polymerizable polyol(allyl carbonate) composition |
EP0980025A1 (en) * | 1998-08-12 | 2000-02-16 | Agency Of Industrial Science And Technology | Hologram recording material composition, hologram recording medium, and process for producing the same. |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9939677B2 (en) | 2010-12-23 | 2018-04-10 | Lg Innotek Co., Ltd. | Back light unit and liquid crystal display using the same |
USRE49101E1 (en) | 2010-12-23 | 2022-06-07 | Lg Innotek Co., Ltd. | Back light unit and liquid crystal display using the same |
WO2013035891A2 (en) | 2011-09-09 | 2013-03-14 | Showa Denko K.K. | Radically polymerizable compound and radically curable composition |
WO2014133052A1 (en) | 2013-02-28 | 2014-09-04 | 昭和電工株式会社 | Curable composition, transparent heat-resistant material, and use thereof |
US9441064B2 (en) | 2013-02-28 | 2016-09-13 | Showa Denko K.K. | Curable composition, transparent heat-resistant material, and use thereof |
Also Published As
Publication number | Publication date |
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TWI443168B (en) | 2014-07-01 |
KR101604479B1 (en) | 2016-03-17 |
JP5189379B2 (en) | 2013-04-24 |
TW200936726A (en) | 2009-09-01 |
KR20090090272A (en) | 2009-08-25 |
JP2009197102A (en) | 2009-09-03 |
US20090209718A1 (en) | 2009-08-20 |
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