US7135394B2 - Conductive layers and fabrication methods thereof - Google Patents

Conductive layers and fabrication methods thereof Download PDF

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US7135394B2
US7135394B2 US11/002,509 US250904A US7135394B2 US 7135394 B2 US7135394 B2 US 7135394B2 US 250904 A US250904 A US 250904A US 7135394 B2 US7135394 B2 US 7135394B2
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metal
layer
substrate
conductive layer
silver
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Ying-Chang Houng
Hong-Ching Lin
Chi-Jen Shih
Shao-Ju Shih
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Industrial Technology Research Institute ITRI
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof

Definitions

  • the invention relates to conductive layers and fabrication methods thereof and, more particularly, to methods for fabricating high conductive layers at a relatively low curing temperature.
  • the thermal resist temperature or operative temperature for fabricating a conductive layer on substrates of conventional electronic products is less than 350° C. for polyimide substrates, 290° C. for printed circuit boards (PCBs), and lower than 200° C. for other plastic substrates.
  • the curing temperature of conductive pastes for conventional low temperature products are constrained to the thermal resist temperature or operative temperature of the substrates.
  • the resistivity of the conductive layer such as silver on the substrate is 10–50 times that of pure silver, resulting in more power consumption, signal loss, and reduction of transmission distance during signal transmission.
  • U.S. Pat. No. 6,036,889 discloses a method of fabricating a metal layer.
  • a conductive paste comprising organic acidic salt and metal flakes is formed on a substrate.
  • the organic acidic salts such as silver 2-ethylhexanoate (C 8 H 15 O 2 Ag) are decomposed at 250–350° C. to create interlinks between the metal flakes, thereby improving conductivity of the metal layer.
  • U.S. Pat. No. 6,036,889 (Kydd et. al.), the entirety of which is hereby incorporated by reference, further discloses a method of fabricating a metal layer.
  • Organic acidic salts such as silver 2-ethylhexanoate (C 8 H 15 O 2 Ag) are decomposed at 250–350° C. to create interlinks between nanometer colloidal metal flakes, thereby improving conductivity of the metal layer.
  • the decomposition temperature of conventional organic acidic salts is still relatively high, and cannot be held under 200° C. for use in fabrication of conductive layers on plastic substrates.
  • An exemplary embodiment of a conductive layer comprises metal flakes and nanometric metal spheres forming densified compact structure.
  • the conductive layer further comprises inorganic salts and organic acidic salts. Decomposition of the inorganic salts can be exothermic at low temperature to induce another high exothermic reaction of the organic acidic salts, thereby forming continuous conductive layer skeletal network structure, at a temperature of less than 200° C.
  • the resistivity of the conductive layer can achieve less than 7 ⁇ cm.
  • Some embodiments of the invention provide a method for forming a conductive layer on a substrate comprising applying a layer of metal composite on the substrate.
  • the metal composite comprises a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors.
  • the layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature.
  • An exemplary embodiment of a conductive layer structure comprises a main layer formed on a substrate.
  • the main layer comprises a mixture of a plurality of different aspect ratios of metal flakes and a plurality of different diameters of metal spheres.
  • a continuous network skeleton is interposed within the main layer.
  • the continuous network skeleton comprises a plurality of inorganic salts and a plurality of metal precursors.
  • FIG. 1 is a schematic cross-section of an embodiment of a conductive layer on a substrate.
  • FIG. 2 is graph illustrating curves of curing temperature dependent of energy release of exothermic reaction.
  • the continuity of the metal powders must be good enough to ensure lower conductivity of the metal layer. Since the sintering temperature of the metal paste layer, such as silver, is higher than 450° C., low temperature sintered metal layer cannot reach high densification whiling maintaining high conductivity.
  • a layer of metal paste 15 is provided on a substrate 10 .
  • the metal paste layer 15 comprises a main layer comprising a mixture of a plurality of different aspect ratios of metal flakes 12 such as in a range of approximately larger than 1 and less than 20 and a plurality of different diameters of metal spheres 14 .
  • a continuous network skeleton is interposed within the main layer.
  • the network skeleton matrix comprises a plurality of inorganic salts and a plurality of metal precursors 16 .
  • the plurality of metal precursors 16 comprises a mixture of organic acidic salts, such as silver 2-ethylhexanoate (C 8 H 15 O 2 Ag) and inorganic salts.
  • the ratio of the mixture is shown in Table 1.
  • the materials of the metal flakes 12 are selected from the group consisting of Cu, Pt, Ni, Ag, and Au.
  • the ratio of the metal flakes in the mixture is in a range of 60–80%.
  • the ratio of the metal spheres relative to the metal flakes is in a range of approximately 30–60%.
  • An embodiment of a method for forming a conductive layer on a substrate at relative low temperature is provided.
  • a layer of metal paste is applied on the substrate.
  • the metal paste comprises a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors.
  • the layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature.
  • the inorganic salt comprises a silver oxalate (Ag 2 C 2 O 4 ) .
  • the organic acidic salt comprises a silver 2-ethylhexanoate (C 8 H 15 O 2 Ag).
  • FIG. 2 is graph illustrating curves of curing temperature dependent on the energy release of an exothermic reaction.
  • curve 24 exerts exothermic effect 20 at 180° C., compared with conventional method curve 26 at 250° C.
  • the reaction equations are: Ag 2 C 2 O 4 ⁇ 2Ag+2CO 2 + ⁇ H 1 Eq. 1 AgC 8 H 15 O 2 +(43/4)O 2 + ⁇ H 2 ⁇ Ag+8CO 2 +(15/2)H 2 O Eq. 2
  • the decomposition temperature of the mixture of metal precursors is reduced from 250° C. to 180° C. by adding Ag 2 C 2 O 4 into C 8 H 15 O 2 Ag.
  • the heat released from reduction of Ag 2 C 2 O 4 can trigger decomposition of C 8 H 15 O 2 Ag at a temperature less than 200° C., thereby forming continuous silver layer with resistivity less than 7 ⁇ cm.
  • Conductive layers and fabrication methods thereof provide the following potential advantages.

Abstract

Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (<200° C.)

Description

BACKGROUND
The invention relates to conductive layers and fabrication methods thereof and, more particularly, to methods for fabricating high conductive layers at a relatively low curing temperature.
Typically, the thermal resist temperature or operative temperature for fabricating a conductive layer on substrates of conventional electronic products is less than 350° C. for polyimide substrates, 290° C. for printed circuit boards (PCBs), and lower than 200° C. for other plastic substrates. The curing temperature of conductive pastes for conventional low temperature products are constrained to the thermal resist temperature or operative temperature of the substrates. The resistivity of the conductive layer such as silver on the substrate is 10–50 times that of pure silver, resulting in more power consumption, signal loss, and reduction of transmission distance during signal transmission.
U.S. Pat. No. 6,036,889 (Kydd et. al.), the entirety of which is hereby incorporated by reference, discloses a method of fabricating a metal layer. A conductive paste comprising organic acidic salt and metal flakes is formed on a substrate. The organic acidic salts such as silver 2-ethylhexanoate (C8H15O2Ag) are decomposed at 250–350° C. to create interlinks between the metal flakes, thereby improving conductivity of the metal layer. Moreover, U.S. Pat. No. 6,036,889 (Kydd et. al.), the entirety of which is hereby incorporated by reference, further discloses a method of fabricating a metal layer. Organic acidic salts such as silver 2-ethylhexanoate (C8H15O2Ag) are decomposed at 250–350° C. to create interlinks between nanometer colloidal metal flakes, thereby improving conductivity of the metal layer.
The decomposition temperature of conventional organic acidic salts, however, is still relatively high, and cannot be held under 200° C. for use in fabrication of conductive layers on plastic substrates.
SUMMARY
Conductive layers and fabrication methods thereof employing relatively low curing temperature are provided. An exemplary embodiment of a conductive layer comprises metal flakes and nanometric metal spheres forming densified compact structure. The conductive layer further comprises inorganic salts and organic acidic salts. Decomposition of the inorganic salts can be exothermic at low temperature to induce another high exothermic reaction of the organic acidic salts, thereby forming continuous conductive layer skeletal network structure, at a temperature of less than 200° C. The resistivity of the conductive layer can achieve less than 7 μΩcm.
Some embodiments of the invention provide a method for forming a conductive layer on a substrate comprising applying a layer of metal composite on the substrate. The metal composite comprises a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature.
An exemplary embodiment of a conductive layer structure comprises a main layer formed on a substrate. The main layer comprises a mixture of a plurality of different aspect ratios of metal flakes and a plurality of different diameters of metal spheres. A continuous network skeleton is interposed within the main layer. The continuous network skeleton comprises a plurality of inorganic salts and a plurality of metal precursors.
DESCRIPTION OF THE DRAWINGS
Conductive layers and fabrication methods thereof will be better understood reference to the descriptions to be read in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic cross-section of an embodiment of a conductive layer on a substrate; and
FIG. 2 is graph illustrating curves of curing temperature dependent of energy release of exothermic reaction.
 DETAILED DESCRIPTION
As the metal paste becomes thinner and thinner, the continuity of the metal powders must be good enough to ensure lower conductivity of the metal layer. Since the sintering temperature of the metal paste layer, such as silver, is higher than 450° C., low temperature sintered metal layer cannot reach high densification whiling maintaining high conductivity.
Referring to FIG. 1, a layer of metal paste 15 is provided on a substrate 10. The metal paste layer 15 comprises a main layer comprising a mixture of a plurality of different aspect ratios of metal flakes 12 such as in a range of approximately larger than 1 and less than 20 and a plurality of different diameters of metal spheres 14. A continuous network skeleton is interposed within the main layer. The network skeleton matrix comprises a plurality of inorganic salts and a plurality of metal precursors 16.
The plurality of metal precursors 16 comprises a mixture of organic acidic salts, such as silver 2-ethylhexanoate (C8H15O2Ag) and inorganic salts. The ratio of the mixture is shown in Table 1. The materials of the metal flakes 12 are selected from the group consisting of Cu, Pt, Ni, Ag, and Au. The ratio of the metal flakes in the mixture is in a range of 60–80%. The ratio of the metal spheres relative to the metal flakes is in a range of approximately 30–60%.
TABLE 1
Ag2C2O4/C8H15O2Agmetal precursor/silver flake
Figure US07135394-20061114-C00001
 		5% 15% 35% 45%
conductivity of mixture of 20%C8H15O2Ag (μΩcm)
Figure US07135394-20061114-C00002
Figure US07135394-20061114-C00003
Figure US07135394-20061114-C00004
Figure US07135394-20061114-C00005
Figure US07135394-20061114-C00006
conductivity of mixture of 30%C8H15O2Ag (μΩcm)
Figure US07135394-20061114-C00007
 		11.2 18.6 15.8
Figure US07135394-20061114-C00008
conductivity of mixture of 40%C8H15O2Ag (μΩcm)
Figure US07135394-20061114-C00009
 		16.9 24.2 21.3
Figure US07135394-20061114-C00010
curing temperature 15 sec (° C.) 250 190 190 190 190

The preferable ratios of the mixture are shown in the gray area of the Table 1. When a mixture of 20% C8H15O2Ag and the ratios of Ag2C2O4/C8H15O2Ag are in a range of 5% to 35% at 190° C. 15 sec, the conductivity of the metal layer has relatively low resistivity.
An embodiment of a method for forming a conductive layer on a substrate at relative low temperature is provided. A layer of metal paste is applied on the substrate. The metal paste comprises a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature. The inorganic salt comprises a silver oxalate (Ag2C2O4) . The organic acidic salt comprises a silver 2-ethylhexanoate (C8H15O2Ag).
FIG. 2 is graph illustrating curves of curing temperature dependent on the energy release of an exothermic reaction. In FIG. 2, curve 24 exerts exothermic effect 20 at 180° C., compared with conventional method curve 26 at 250° C. The reaction equations are:
Ag2C2O4→2Ag+2CO2+ΔH1   Eq. 1
AgC8H15O2+(43/4)O2+ΔH2→Ag+8CO2+(15/2)H2O   Eq. 2
In Eq. 1, Ag2C2O4 is reduced into silver and CO2, releasing heat ΔH1. In Eq. 2, C8H15O2Ag absorbs heat ΔH1 released from Eq. 1 and is reduced into silver, CO2, and H2O at a temperature less than 200° C. The overall reaction is an exothermic reaction.
The decomposition temperature of the mixture of metal precursors is reduced from 250° C. to 180° C. by adding Ag2C2O4 into C8H15O2Ag. The heat released from reduction of Ag2C2O4 can trigger decomposition of C8H15O2Ag at a temperature less than 200° C., thereby forming continuous silver layer with resistivity less than 7 μΩcm.
Conductive layers and fabrication methods thereof provide the following potential advantages. First, by mixing a plurality of different sizes of metal particles with a plurality of different sizes of metal flakes, the continuity of pure metal in the main layer can be improved. Second, using the mixture of the metal precursors, such as silver oxalate and long chain metal carboxyl compounds, can reduce decomposition at a temperature less than 200° C. Nanometric silver can be potentially reduced from the metal precursors, comprising excellent wieldability at relatively low temperature resulting in increasing the effective conductive traces of pure metal and the conductivity of metal film.
While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the inventions is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Thus, the scope of the appended claims should be accorded the broadest interpretations so as to encompass all such modifications and similar arrangements.

Claims (5)

1. A method for forming a conductive layer on a substrate, comprising:
applying a layer of a metal composite on the substrate; the metal composite comprising a plurality of metal flakes, a plurality of nanometric metal spheres, and a plurality of mixed metal precursors; and
curing the layer of metal composite to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature,
wherein the plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts.
2. The method as claimed in claim 1, wherein the inorganic salt comprises a silver oxalate (Ag2C2O4).
3. The method as claimed in claim 1, wherein the organic acid salt comprises a silver 2-ethylhexanoate (C8H15O2Ag).
4. The method as claimed in claim 1, wherein the curing temperature is approximately less than 200° C.
5. A patterned conductive layer on a substrate, comprising:
a substrate;
a patterned metal layer formed on the substrate, wherein the metal layer is made by the method as claimed in claim 1.
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US8018563B2 (en) 2007-04-20 2011-09-13 Cambrios Technologies Corporation Composite transparent conductors and methods of forming the same
US8049333B2 (en) 2005-08-12 2011-11-01 Cambrios Technologies Corporation Transparent conductors comprising metal nanowires
US8094247B2 (en) 2006-10-12 2012-01-10 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
US9534124B2 (en) 2010-02-05 2017-01-03 Cam Holding Corporation Photosensitive ink compositions and transparent conductors and method of using the same
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US8049333B2 (en) 2005-08-12 2011-11-01 Cambrios Technologies Corporation Transparent conductors comprising metal nanowires
US8865027B2 (en) 2005-08-12 2014-10-21 Cambrios Technologies Corporation Nanowires-based transparent conductors
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US8018563B2 (en) 2007-04-20 2011-09-13 Cambrios Technologies Corporation Composite transparent conductors and methods of forming the same
US10244637B2 (en) 2007-04-20 2019-03-26 Cambrios Film Solutions Corporation Composite transparent conductors and methods of forming the same
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US20070054112A1 (en) 2007-03-08
TW200522811A (en) 2005-07-01

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