TWI642735B - Conductive ink, circuit board and method for manufacturing the same - Google Patents
Conductive ink, circuit board and method for manufacturing the same Download PDFInfo
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Abstract
本發明提供一種導電油墨的製造方法並將其覆蓋於電路板導線上以增加散熱功能，其步驟如下。提供多數個石墨烯片。每一石墨烯片具有相對的第一表面與第二表面。對上述石墨烯片進行表面處理，使得每一石墨烯片的第一表面與第二表面皆吸附多數個金屬粒子，以形成多數個表面改質的石墨烯片。將上述表面改質的石墨烯片與導電高分子溶液混合，以形成導電油墨。完成後，將導電油墨覆蓋於電路板導線上用以取代內埋厚銅導線層的設計，以提升電路板的導熱性與減少銅的使用量。 The invention provides a method for manufacturing a conductive ink and covering it on a circuit board wire to increase the heat dissipation function, the steps of which are as follows. A plurality of graphene sheets are provided. Each graphene sheet has opposing first and second surfaces. The above graphene sheets are surface-treated such that a plurality of metal particles are adsorbed on the first surface and the second surface of each graphene sheet to form a plurality of surface-modified graphene sheets. The surface-modified graphene sheet is mixed with a conductive polymer solution to form a conductive ink. After completion, the conductive ink is overlaid on the circuit board wires to replace the buried thick copper wire layer design to improve the thermal conductivity of the circuit board and reduce the amount of copper used.
Description
本發明是有關於一種具有較佳散熱功能的導電油墨、電路板及其製造方法。 The invention relates to a conductive ink with a better heat dissipation function, a circuit board and a manufacturing method thereof.
隨著科技的進步，各類電子產品皆朝著輕薄短小的趨勢發展。然而，高功率的電子產品無可避免地產生大量的熱能，其使得上述熱能可能會殘留在電路板上，進而導致所屬電子產品短路的問題。為了避免上述問題發生，一般而言，常在電路板上形成較厚的銅層(約莫40μm~400μm)，以移除上述熱能。但較厚的銅層則會造成電路板重量增加、厚度增厚以及成本增加等的問題，其亦與現今電子產品輕薄短小的趨勢背道而馳。因此，如何提升電路板的散熱效能，同時又可減少整體電路板的厚度與重量將變成相當重要的一門課題。 With the advancement of technology, all kinds of electronic products are developing towards a light and short trend. However, high-power electronic products inevitably generate a large amount of thermal energy, which may cause the above-mentioned thermal energy to remain on the circuit board, thereby causing a problem of short-circuiting of the associated electronic products. In order to avoid the above problems, in general, a thick copper layer (about 40 μm to 400 μm) is often formed on the circuit board to remove the above thermal energy. However, thicker copper layers can cause problems such as increased board weight, thicker thickness, and increased cost, which is also contrary to the current trend of thin and light electronic products. Therefore, how to improve the heat dissipation performance of the circuit board, while reducing the thickness and weight of the overall circuit board will become a very important issue.
本發明提供一種導電油墨、電路板及其製造方法，其具 有較佳的散熱功能，且不會增加電子產品的厚度與重量，進而降低製程成本。 The invention provides a conductive ink, a circuit board and a manufacturing method thereof, It has a better heat dissipation function and does not increase the thickness and weight of the electronic product, thereby reducing the process cost.
本發明的提供一種導電油墨的製造方法，其步驟如下。提供多數個石墨烯片。每一石墨烯片具有相對的第一表面與第二表面。對上述石墨烯片進行表面處理，使得每一石墨烯片的第一表面與第二表面皆吸附多數個金屬粒子，以形成多數個表面改質的石墨烯片。將上述表面改質的石墨烯片與導電高分子溶液混合，以形成導電油墨。 The present invention provides a method of producing a conductive ink, the steps of which are as follows. A plurality of graphene sheets are provided. Each graphene sheet has opposing first and second surfaces. The above graphene sheets are surface-treated such that a plurality of metal particles are adsorbed on the first surface and the second surface of each graphene sheet to form a plurality of surface-modified graphene sheets. The surface-modified graphene sheet is mixed with a conductive polymer solution to form a conductive ink.
在本發明的一實施例中，上述表面處理的步驟如下。氧化石墨烯片，以形成多數個石墨烯氧化物。同時加入還原劑以及金屬離子溶液，使得上述石墨烯氧化物進行還原反應。 In an embodiment of the invention, the step of surface treatment described above is as follows. Graphene oxide sheets are formed to form a plurality of graphene oxides. The reducing agent and the metal ion solution are simultaneously added to cause the above graphene oxide to undergo a reduction reaction.
在本發明的一實施例中，上述表面處理的步驟如下。將上述石墨烯片與酸液混合，以得到石墨烯混合液。於石墨烯混合液中加入金屬離子溶液。進行乾燥處理，以形成表面改質的石墨烯片。 In an embodiment of the invention, the step of surface treatment described above is as follows. The above graphene sheet was mixed with an acid liquid to obtain a graphene mixture. A metal ion solution is added to the graphene mixture. A drying treatment is performed to form a surface-modified graphene sheet.
在本發明的一實施例中，上述金屬離子溶液包括硝酸銀溶液、硝酸鎳溶液、硝酸銅溶液、硝酸鈀溶液或其組合。 In an embodiment of the invention, the metal ion solution comprises a silver nitrate solution, a nickel nitrate solution, a copper nitrate solution, a palladium nitrate solution, or a combination thereof.
在本發明的一實施例中，上述酸液包括硫酸(H2SO4)、鹽酸(HCl)、硝酸或其組合。 In an embodiment of the invention, the acid solution comprises sulfuric acid (H 2 SO 4 ), hydrochloric acid (HCl), nitric acid or a combination thereof.
在本發明的一實施例中，上述金屬粒子的材料包括銀、鎳、銅、金、鈀或其組合。 In an embodiment of the invention, the material of the metal particles comprises silver, nickel, copper, gold, palladium or a combination thereof.
在本發明的一實施例中，上述導電高分子溶液包括聚 (3,4-伸乙二氧基噻吩)：聚苯乙烯磺酸(PEDOT：PSS)聚乙烯二氧噻吩(Polyethylene dioxythiophene)或其組合。 In an embodiment of the invention, the conductive polymer solution comprises a poly (3,4-Exoethylenedioxythiophene): Polystyrenesulfonic acid (PEDOT:PSS) Polyethylene dioxythiophene or a combination thereof.
在本發明的一實施例中，上述表面改質的石墨烯片的含量為1wt%至10wt%。 In an embodiment of the invention, the surface-modified graphene sheet is contained in an amount of from 1% by weight to 10% by weight.
本發明提供一種電路板，包括：核心層、兩圖案化的第一導體層以及兩第二導體層。核心層具有相對的兩側。兩圖案化的第一導體層分別位於核心層的兩側上。兩第二導體層分別位於兩圖案化的第一導體層上。每一第二導體層具有導電油墨。上述導電油墨包括：導電高分子溶液以及多數個表面改質的石墨烯片。表面改質的石墨烯片位於導電高分子溶液中。每一表面改質的石墨烯片包括石墨烯片。上述石墨烯片的第一表面與第二表面皆吸附多數個金屬粒子。 The invention provides a circuit board comprising: a core layer, two patterned first conductor layers and two second conductor layers. The core layer has opposite sides. The two patterned first conductor layers are respectively located on both sides of the core layer. The two second conductor layers are respectively located on the two patterned first conductor layers. Each of the second conductor layers has a conductive ink. The conductive ink includes a conductive polymer solution and a plurality of surface-modified graphene sheets. The surface modified graphene sheet is located in a conductive polymer solution. Each surface modified graphene sheet includes a graphene sheet. The first surface and the second surface of the graphene sheet adsorb a plurality of metal particles.
在本發明的一實施例中，上述石墨烯片帶負電，金屬粒子帶正電，而兩圖案化的第一導體層帶負電，其使得金屬粒子與所對應的圖案化的第一導體層之間具有靜電吸引力。 In an embodiment of the invention, the graphene sheet is negatively charged, the metal particles are positively charged, and the two patterned first conductor layers are negatively charged, such that the metal particles and the corresponding patterned first conductor layer are There is electrostatic attraction between them.
在本發明的一實施例中，上述兩圖案化的第一導體層的材料分別包括：銀、鎳、銅、金、鈀或其組合。 In an embodiment of the invention, the materials of the two patterned first conductor layers respectively comprise: silver, nickel, copper, gold, palladium or a combination thereof.
在本發明的一實施例中，上述兩圖案化的第一導體層的材料分別包括導電油墨。 In an embodiment of the invention, the materials of the two patterned first conductor layers respectively comprise a conductive ink.
本發明提供一種電路板的製造方法，其步驟如下。提供核心層，其具有相對的兩側。於核心層的兩側上分別形成兩圖案化的第一導體層及兩第二導體層，且上述兩第二導體層位於兩圖 案化的第一導體層上。每一第二導體層具有導電油墨。上述導電油墨包括：導電高分子溶液以及多數個表面改質的石墨烯片。表面改質的石墨烯片位於導電高分子溶液中。每一表面改質的石墨烯片包括石墨烯片。上述石墨烯片的第一表面與第二表面皆吸附多數個金屬粒子。 The present invention provides a method of manufacturing a circuit board, the steps of which are as follows. A core layer is provided that has opposite sides. Forming two patterned first conductor layers and two second conductor layers on both sides of the core layer, and the two second conductor layers are located on two sides On the first conductor layer. Each of the second conductor layers has a conductive ink. The conductive ink includes a conductive polymer solution and a plurality of surface-modified graphene sheets. The surface modified graphene sheet is located in a conductive polymer solution. Each surface modified graphene sheet includes a graphene sheet. The first surface and the second surface of the graphene sheet adsorb a plurality of metal particles.
在本發明的一實施例中，形成上述兩圖案化的第一導體層及兩第二導體層的步驟如下。於上述核心層的兩側上先分別形成兩圖案化的第一導體層。分別在兩圖案化的第一導體層上直接注入(directly injecting)導電油墨。進行乾燥處理，以於上述兩圖案化的第一導體層上分別形成兩第二導體層。 In an embodiment of the invention, the step of forming the two patterned first conductor layers and the two second conductor layers is as follows. Two patterned first conductor layers are respectively formed on both sides of the core layer. The conductive ink is directly injected on the two patterned first conductor layers. Drying is performed to form two second conductor layers on the two patterned first conductor layers.
在本發明的一實施例中，形成上述兩圖案化的第一導體層及兩第二導體層的步驟如下。於核心層的兩側上分別形成兩第一導體層。於上述兩第一導體層上分別塗佈(coating)導電油墨，使得導電油墨分別覆蓋兩第一導體層的表面。對上述導電油墨進行乾燥處理。同時圖案化上述兩第一導體層以及分別覆蓋在兩第一導體層上的導電油墨，以形成兩圖案化的第一導體層及兩第二導體層。 In an embodiment of the invention, the step of forming the two patterned first conductor layers and the two second conductor layers is as follows. Two first conductor layers are respectively formed on both sides of the core layer. Conductive inks are respectively coated on the two first conductor layers such that the conductive ink covers the surfaces of the two first conductor layers, respectively. The above conductive ink is dried. Simultaneously patterning the two first conductor layers and the conductive ink respectively covering the two first conductor layers to form two patterned first conductor layers and two second conductor layers.
在本發明的一實施例中，於上述兩第一導體層上塗佈導電油墨的方法包括：噴灑法(spray)、印刷法(print)或其組合。 In an embodiment of the invention, the method of coating the conductive ink on the two first conductor layers comprises: spraying, printing, or a combination thereof.
在本發明的一實施例中，上述兩圖案化的第一導體層的材料分別包括導電油墨。 In an embodiment of the invention, the materials of the two patterned first conductor layers respectively comprise a conductive ink.
基於上述，本發明可利用多數個表面改質的石墨烯片與 導電高分子溶液混合，以形成具有高熱導率的導電油墨。而此導電油墨所形成的導體層可取代先前技術中的厚銅層，以提升電路板的散熱效能，同時又可減少整體電路板的厚度與重量，進而降低製程成本。 Based on the above, the present invention can utilize a plurality of surface-modified graphene sheets and The conductive polymer solution is mixed to form a conductive ink having a high thermal conductivity. The conductive layer formed by the conductive ink can replace the thick copper layer in the prior art to improve the heat dissipation performance of the circuit board, and at the same time reduce the thickness and weight of the overall circuit board, thereby reducing the process cost.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.
10‧‧‧石墨烯片 10‧‧‧graphene tablets
15a‧‧‧第一表面 15a‧‧‧ first surface
15b‧‧‧第二表面 15b‧‧‧second surface
20‧‧‧金屬粒子 20‧‧‧Metal particles
30‧‧‧導電高分子溶液 30‧‧‧ Conductive polymer solution
40‧‧‧表面改質的石墨烯片 40‧‧‧Surface-modified graphene sheets
50‧‧‧導電油墨 50‧‧‧Conductive ink
100、200、300‧‧‧核心層 100, 200, 300‧‧‧ core layers
102、202、302‧‧‧第一導體層 102, 202, 302‧‧‧ first conductor layer
102a、202a‧‧‧圖案化的第一導體層 102a, 202a‧‧‧ patterned first conductor layer
104、204‧‧‧第二導體層 104, 204‧‧‧Second conductor layer
106、206、306‧‧‧增層結構 106, 206, 306‧‧‧ layered structure
108、116、208、216、308‧‧‧介電層 108, 116, 208, 216, 308‧‧ dielectric layers
110、210‧‧‧第三導體層 110, 210‧‧‧ third conductor layer
112、212‧‧‧第四導體層 112, 212‧‧‧ fourth conductor layer
114、214‧‧‧外增層結構 114, 214‧‧ ‧ outer layer structure
118、218‧‧‧圖案化的第五導體層 118, 218‧‧‧ patterned fifth conductor layer
120、220、320‧‧‧通孔 120, 220, 320‧‧‧ through holes
130、230、330‧‧‧導體層 130, 230, 330‧‧‧ conductor layers
204a、310‧‧‧圖案化的第二導體層 204a, 310‧‧‧ patterned second conductor layer
206a‧‧‧圖案化的增層結構 206a‧‧‧ patterned layered structure
210a‧‧‧圖案化的第三導體層 210a‧‧‧ patterned third conductor layer
212a‧‧‧圖案化的第四導體層 212a‧‧‧ patterned fourth conductor layer
S001~S003‧‧‧步驟 S001~S003‧‧‧Steps
S1‧‧‧第一側 S1‧‧‧ first side
S2‧‧‧第二側 S2‧‧‧ second side
圖1為依照本發明實施例之導電油墨之製造方法的流程圖。 1 is a flow chart of a method of manufacturing a conductive ink in accordance with an embodiment of the present invention.
圖2A至圖2G為依照本發明第一實施例所繪示的電路板之製造流程的剖面示意圖。 2A to 2G are schematic cross-sectional views showing a manufacturing process of a circuit board according to a first embodiment of the present invention.
圖3A至圖3G為依照本發明第二實施例所繪示的電路板之製造流程的剖面示意圖。 3A to 3G are schematic cross-sectional views showing a manufacturing process of a circuit board according to a second embodiment of the present invention.
圖4A至圖4D為依照本發明第三實施例所繪示的電路板之製造流程的剖面示意圖。 4A-4D are schematic cross-sectional views showing a manufacturing process of a circuit board according to a third embodiment of the present invention.
圖1為依照本發明實施例之導電油墨之製造方法的流程圖。 1 is a flow chart of a method of manufacturing a conductive ink in accordance with an embodiment of the present invention.
請參照圖1，本發明實施例提供一種導電油墨的製造方法，其步驟如下。首先，如步驟S001所示，提供多數個石墨烯片。 每一石墨烯片具有相對的第一表面與第二表面。然後，對上述石墨烯片進行表面處理，使得每一石墨烯片的第一表面與第二表面皆吸附多數個金屬粒子，以形成多數個表面改質的石墨烯片(步驟S002)。接著，如步驟S003所示，將上述表面改質的石墨烯片與導電高分子溶液混合，以形成導電油墨。在本實施例中，表面改質的石墨烯片的含量可例如是1wt%至10wt%。當表面改質的石墨烯片的含量過高，可能會造成聚集(aggregation)；而當表面改質的石墨烯片的含量過低，則可能會使得所形成的導電油墨的電導率(electric conductivity)降低，亦影響導熱效果。在本實施例中，金屬粒子的材料包括銀、鎳、銅、金、鈀或其組合。導電高分子溶液包括聚(3,4-伸乙二氧基噻吩)：聚苯乙烯磺酸(PEDOT：PSS)、聚乙烯二氧噻吩(Polyethylene dioxythiophene)或其組合。 Referring to FIG. 1, an embodiment of the present invention provides a method for manufacturing a conductive ink, the steps of which are as follows. First, as shown in step S001, a plurality of graphene sheets are provided. Each graphene sheet has opposing first and second surfaces. Then, the above graphene sheets are surface-treated such that the first surface and the second surface of each graphene sheet adsorb a plurality of metal particles to form a plurality of surface-modified graphene sheets (step S002). Next, as shown in step S003, the surface-modified graphene sheet is mixed with a conductive polymer solution to form a conductive ink. In the present embodiment, the content of the surface-modified graphene sheet may be, for example, 1% by weight to 10% by weight. When the content of the surface-modified graphene sheet is too high, aggregation may occur; and when the content of the surface-modified graphene sheet is too low, the conductivity of the formed conductive ink may be made. ) Lowering also affects the thermal conductivity. In this embodiment, the material of the metal particles includes silver, nickel, copper, gold, palladium or a combination thereof. The conductive polymer solution includes poly(3,4-ethylenedioxythiophene): polystyrenesulfonic acid (PEDOT: PSS), polyethylene dioxythiophene or a combination thereof.
此外，上述表面處理可利用兩種表面處理的方法來進行。其一，先氧化上述石墨烯片，以形成多數個石墨烯氧化物，其氧化方法可以利用熱氧化法或化學還原法。接著，同時加入還原劑以及金屬離子溶液，使得上述石墨烯氧化物進行還原反應，以形成表面改質的石墨烯片。由於上述石墨烯片的表面型態改變，其與金屬離子溶液中的金屬離子產生鍵結，而使得每一石墨烯片的第一表面與第二表面皆吸附多數個金屬粒子。在本實施例中，上述還原劑可例如是聯胺(hydrazine)、硼氫化鈉(sodium borohydride)或其組合。金屬離子溶液可例如是硝酸銀溶液、硝 酸鎳溶液、硝酸銅溶液、硝酸鈀溶液或其組合。 Further, the above surface treatment can be carried out by using two surface treatment methods. First, the above graphene sheet is first oxidized to form a plurality of graphene oxides, and the oxidation method may be a thermal oxidation method or a chemical reduction method. Next, a reducing agent and a metal ion solution are simultaneously added to cause the above graphene oxide to undergo a reduction reaction to form a surface-modified graphene sheet. Due to the surface morphology change of the above graphene sheet, it is bonded to the metal ions in the metal ion solution, so that the first surface and the second surface of each graphene sheet adsorb a plurality of metal particles. In the present embodiment, the reducing agent may be, for example, hydrazine, sodium borohydride or a combination thereof. The metal ion solution can be, for example, a silver nitrate solution, nitrate A nickel acid solution, a copper nitrate solution, a palladium nitrate solution or a combination thereof.
其二，則是先將石墨烯片與酸液混合，以得到石墨烯混合液。在本實施例中，酸液可例如是硫酸(H2SO4)、鹽酸(HCl)、硝酸或其組合。然後，於石墨烯混合液中加入金屬離子溶液。接著，進行乾燥處理，以形成表面改質的石墨烯片。上述乾燥處理可以利用爐管通入氫氣當作反應氣體來乾燥之。在本實施例中，上述金屬離子溶液可例如是硝酸銀溶液、硝酸鎳溶液、硝酸銅溶液、硝酸鈀溶液或其組合。 The second is to first mix the graphene sheets with the acid solution to obtain a graphene mixture. In the present embodiment, the acid liquid may be, for example, sulfuric acid (H 2 SO 4 ), hydrochloric acid (HCl), nitric acid, or a combination thereof. Then, a metal ion solution is added to the graphene mixture. Next, a drying treatment is performed to form a surface-modified graphene sheet. The above drying treatment can be carried out by using a furnace tube to pass hydrogen gas as a reaction gas. In the present embodiment, the metal ion solution may be, for example, a silver nitrate solution, a nickel nitrate solution, a copper nitrate solution, a palladium nitrate solution, or a combination thereof.
圖2A至圖2G為依照本發明第一實施例所繪示的電路板之製造流程的剖面示意圖。 2A to 2G are schematic cross-sectional views showing a manufacturing process of a circuit board according to a first embodiment of the present invention.
請參照圖2A，本發明第一實施例提供一種電路板的製造方法，其步驟如下。提供核心層100，其具有相對的第一側S1與第二側S2。核心層100的材料可包括介電材料，介電材料可例如是膠片(prepreg)、ABF(Ajinomoto build-up film)膜或其組合。接著，於核心層100的第一側S1與第二側S2上分別形成兩第一導體層102。在本實施例中，第一導體層102的厚度可例如是40μm至400μm。第一導體層102的材料可包括金屬材料，金屬材料可例如是銀、鎳、銅、金、鈀或其組合。舉例來說，當第一導體層102的材料為銅，則核心層100以及分別位於核心層100相對兩側的兩第一導體層102可構成銅箔基板(Copper Clad Laminate，CCL)。 Referring to FIG. 2A, a first embodiment of the present invention provides a method of manufacturing a circuit board, the steps of which are as follows. A core layer 100 is provided having opposing first side S1 and second side S2. The material of the core layer 100 may include a dielectric material, which may be, for example, a prepreg, an ABF (Ajinomoto build-up film) film, or a combination thereof. Next, two first conductor layers 102 are formed on the first side S1 and the second side S2 of the core layer 100, respectively. In the present embodiment, the thickness of the first conductor layer 102 may be, for example, 40 μm to 400 μm. The material of the first conductor layer 102 may include a metal material, which may be, for example, silver, nickel, copper, gold, palladium, or a combination thereof. For example, when the material of the first conductor layer 102 is copper, the core layer 100 and the two first conductor layers 102 respectively located on opposite sides of the core layer 100 may constitute a copper foil substrate (CCL).
請參照圖2B，經由微影與蝕刻製程圖案化兩第一導體層 102，暴露部分核心層100的表面，以於核心層100的第一側S1與第二側S2上分別形成兩圖案化的第一導體層102a。在本實施例中，所形成的兩圖案化的第一導體層102a可視為電路板上的導線，其可依據所需的線路佈局(layout)來設計。 Referring to FIG. 2B, the two first conductor layers are patterned via a lithography and etching process. 102, the surface of the portion of the core layer 100 is exposed, so that the first patterned first conductor layer 102a is formed on the first side S1 and the second side S2 of the core layer 100, respectively. In the present embodiment, the formed two patterned first conductor layers 102a can be regarded as wires on the circuit board, which can be designed according to the required layout of the circuit.
請參照圖2C，分別在兩圖案化的第一導體層102a上直接注入(directly injecting)導電油墨50。然後，對導電油墨50進行乾燥處理，以於兩圖案化的第一導體層102a上分別形成兩第二導體層104。在本實施例中，第二導體層104的厚度可例如是20nm至200nm，但本發明並不以此為限。導電油墨50包括導電高分子溶液30以及多數個表面改質的石墨烯片40。表面改質的石墨烯片40位於導電高分子溶液30中。每一表面改質的石墨烯片40包括石墨烯片10以及多數個金屬粒子20。每一石墨烯片10的第一表面15a與第二表面15b皆吸附多數個金屬粒子20。 Referring to FIG. 2C, the conductive ink 50 is directly injected onto the two patterned first conductor layers 102a. Then, the conductive ink 50 is dried to form two second conductor layers 104 on the two patterned first conductor layers 102a. In this embodiment, the thickness of the second conductor layer 104 may be, for example, 20 nm to 200 nm, but the invention is not limited thereto. The conductive ink 50 includes a conductive polymer solution 30 and a plurality of surface-modified graphene sheets 40. The surface-modified graphene sheet 40 is located in the conductive polymer solution 30. Each surface modified graphene sheet 40 includes a graphene sheet 10 and a plurality of metal particles 20. Each of the first surface 15a and the second surface 15b of each graphene sheet 10 adsorbs a plurality of metal particles 20.
值得注意的是，由於石墨烯片10帶負電，而金屬粒子20帶正電，因此，石墨烯片10與金屬粒子20具有靜電吸引力，以提升石墨烯片10與金屬粒子20之間的附著力(adhesion)。同樣地，在本實施例中，可將兩圖案化的第一導體層102a帶負電，其使得金屬粒子20與所對應的圖案化的第一導體層102a之間具有靜電吸引力，進而提升金屬粒子20與所對應的圖案化的第一導體層102a之間附著力(adhesion)。如此一來，圖案化的第一導體層102a與所對應的第二導體層104之間便不容易發生剝離(peeling)或脫落的現象，進而提昇所屬電子產品的可靠度(reliability)。 It is to be noted that since the graphene sheet 10 is negatively charged and the metal particles 20 are positively charged, the graphene sheet 10 and the metal particles 20 have electrostatic attraction to enhance adhesion between the graphene sheet 10 and the metal particles 20. Adhesion. Similarly, in the present embodiment, the two patterned first conductor layers 102a can be negatively charged, which causes electrostatic attraction between the metal particles 20 and the corresponding patterned first conductor layer 102a, thereby lifting the metal. Adhesion between the particles 20 and the corresponding patterned first conductor layer 102a. As a result, the phenomenon of peeling or falling off between the patterned first conductor layer 102a and the corresponding second conductor layer 104 is less likely to occur, thereby improving the reliability of the electronic product.
另一方面，由於石墨烯片10的理論熱導率(thermal conductivity)可高達4000W/mK。當圖案化的第一導體層102a以及金屬粒子20的材料皆為金屬材料(即具有相似的熱導率)時，高功率的電子產品所產生的熱能，可經由圖案化的第一導體層102a中的金屬離子碰撞(collision)傳導至金屬粒子20。接著，上述熱能再經由高熱導率之石墨烯片10而移除。如此一來，本發明之表面改質的石墨烯片40便可取代先前技術中的厚銅層，其不僅可提升電路板的散熱效能，同時又可減少整體電路板的厚度與重量，進而降低製程成本。 On the other hand, since the theoretical thermal conductivity of the graphene sheet 10 can be as high as 4000 W/mK. When the materials of the patterned first conductor layer 102a and the metal particles 20 are all metallic materials (ie, have similar thermal conductivity), thermal energy generated by the high-power electronic product may pass through the patterned first conductor layer 102a. Metal ions in the collision are conducted to the metal particles 20. The thermal energy is then removed via the graphene sheet 10 of high thermal conductivity. In this way, the surface-modified graphene sheet 40 of the present invention can replace the thick copper layer in the prior art, which not only improves the heat dissipation performance of the circuit board, but also reduces the thickness and weight of the overall circuit board, thereby reducing Process cost.
請參照圖2D，本實施例可利用增層(built up)法來增加導體層的層數，其可依據設計需求來進行調整，本發明並不設限。詳細地說，壓合兩增層結構106於對應的兩第二導體層104上(如圖2D所示)。每一增層結構106包括介電層108以及圖案化的第三導體層110。介電層108的材料可包括介電材料，介電材料可例如是膠片(prepreg)、ABF膜或其組合。圖案化的第三導體層110的厚度、材料以及形成方法與圖案化的第一導體層102a的厚度、材料以及形成方法相同，於此便不再贅述。介電層108覆蓋核心層100與第二導體層104的頂面，以及第二導體層104與圖案化的第一導體層102a的側壁。在本實施例中，圖案化的第三導體層110的位置對應於圖案化的第一導體層102a的位置。但本發明並不設限，在其他實施例中，圖案化的第三導體層110的位置可依設計需求來進行調整。在本實施例中，圖案化的第三導體層110 與圖案化的第一導體層102a可以電性連接，但由於圖案化的第三導體層110與圖案化的第一導體層102a的連接關係是採取平面繞線的方式，故在此一剖面並未示出。 Referring to FIG. 2D, the present embodiment can increase the number of layers of the conductor layer by using a built-up method, which can be adjusted according to design requirements, and the invention is not limited thereto. In detail, the two build-up structures 106 are pressed onto the corresponding two second conductor layers 104 (as shown in Figure 2D). Each buildup structure 106 includes a dielectric layer 108 and a patterned third conductor layer 110. The material of the dielectric layer 108 may comprise a dielectric material, which may be, for example, a prepreg, an ABF film, or a combination thereof. The thickness, material, and formation method of the patterned third conductor layer 110 are the same as those of the patterned first conductor layer 102a, and the method of forming the same, and will not be described herein. The dielectric layer 108 covers the top surfaces of the core layer 100 and the second conductor layer 104, and the sidewalls of the second conductor layer 104 and the patterned first conductor layer 102a. In the present embodiment, the position of the patterned third conductor layer 110 corresponds to the position of the patterned first conductor layer 102a. However, the present invention is not limited. In other embodiments, the position of the patterned third conductor layer 110 can be adjusted according to design requirements. In the embodiment, the patterned third conductor layer 110 The first conductive layer 102a can be electrically connected to the patterned first conductor layer 102a. However, since the connection relationship between the patterned third conductive layer 110 and the patterned first conductive layer 102a is a planar winding, the cross section is Not shown.
此外，請參照圖2E，每一增層結構106更包括第四導體層112位於圖案化的第三導體層110上。其形成方法可分別在兩圖案化的第三導體層110上直接注入(directly injecting)導電油墨50。然後，對導電油墨50進行乾燥處理，以於兩圖案化的第三導體層110上分別形成兩第四導體層112。在本實施例中，第四導體層112的厚度可例如是20nm至200nm，但本發明並不以此為限。 In addition, referring to FIG. 2E, each of the build-up structures 106 further includes a fourth conductor layer 112 on the patterned third conductor layer 110. The forming method can directly inject the conductive ink 50 on the two patterned third conductor layers 110, respectively. Then, the conductive ink 50 is dried to form two fourth conductor layers 112 on the two patterned third conductor layers 110, respectively. In the present embodiment, the thickness of the fourth conductor layer 112 may be, for example, 20 nm to 200 nm, but the invention is not limited thereto.
請參照圖2F，壓合兩外增層結構114於對應的兩第四導體層112上。每一外增層結構114包括介電層116以及圖案化的第五導體層118。介電層116的材料與介電層108的材料相同；而圖案化的第五導體層118的材料以及形成方法與圖案化的第三導體層110的材料以及形成方法相同，於此便不再贅述。在本實施例中，圖案化的第五導體層118的厚度可例如是15μm至25μm。 Referring to FIG. 2F, the two outer build-up structures 114 are pressed onto the corresponding two fourth conductor layers 112. Each outer buildup structure 114 includes a dielectric layer 116 and a patterned fifth conductor layer 118. The material of the dielectric layer 116 is the same as the material of the dielectric layer 108; and the material and formation method of the patterned fifth conductor layer 118 are the same as the material and formation method of the patterned third conductor layer 110, and thus no longer Narration. In the present embodiment, the thickness of the patterned fifth conductor layer 118 may be, for example, 15 μm to 25 μm.
請參照圖2G，於核心層100、兩增層結構106以及兩外增層結構114中形成通孔120。在本實施例中，形成通孔120的步驟包括機械鑽孔、雷射鑽孔製程等，但本發明不以此為限。接著，在通孔120以及部分外增層結構114的表面上形成導體層130。導體層130的材料可包括金屬材料，金屬材料可例如是銀、鎳、銅、金、鈀或其組合。在本實施例中，形成導體層130的步驟包括電 鍍製程，但本發明不以此為限。通孔120中的導體層130可用以導通各層(即圖案化的第一導體層102a、增層結構106以及外增層結構114)，以形成多層電路板結構。 Referring to FIG. 2G, a via hole 120 is formed in the core layer 100, the two build-up structures 106, and the two outer build-up structures 114. In the present embodiment, the step of forming the through hole 120 includes a mechanical drilling, a laser drilling process, and the like, but the invention is not limited thereto. Next, a conductor layer 130 is formed on the surface of the via hole 120 and the portion of the outer buildup structure 114. The material of the conductor layer 130 may include a metal material, which may be, for example, silver, nickel, copper, gold, palladium, or a combination thereof. In this embodiment, the step of forming the conductor layer 130 includes electricity Plating process, but the invention is not limited thereto. The conductor layer 130 in the via 120 can be used to turn on the layers (i.e., the patterned first conductor layer 102a, the build-up structure 106, and the outer build-up structure 114) to form a multilayer circuit board structure.
請回頭參照圖2C，本發明第一實施例提供一種電路板，其包括：核心層100、兩圖案化的第一導體層102a以及兩第二導體層104。兩圖案化的第一導體層102a分別位於核心層100的相對的第一側S1與第二側S2上。兩第二導體層104分別位於兩圖案化的第一導體層102a上。每一第二導體層104具有導電油墨50。導電油墨50包括導電高分子溶液30以及多數個表面改質的石墨烯片40。表面改質的石墨烯片40位於導電高分子溶液30中。每一表面改質的石墨烯片40包括石墨烯片10以及多數個金屬粒子20。每一石墨烯片10的第一表面15a與第二表面15b皆吸附多數個金屬粒子20。在本實施例中，第二導體層104的厚度可例如是20nm至200nm，其可取代先前技術中的厚銅層(約莫40μm~400μm)，其不僅可提升電路板的散熱效能，同時又可減少整體電路板的厚度與重量，進而降低製程成本。 Referring back to FIG. 2C, a first embodiment of the present invention provides a circuit board including a core layer 100, two patterned first conductor layers 102a, and two second conductor layers 104. The two patterned first conductor layers 102a are respectively located on the opposite first side S1 and second side S2 of the core layer 100. The two second conductor layers 104 are respectively located on the two patterned first conductor layers 102a. Each of the second conductor layers 104 has a conductive ink 50. The conductive ink 50 includes a conductive polymer solution 30 and a plurality of surface-modified graphene sheets 40. The surface-modified graphene sheet 40 is located in the conductive polymer solution 30. Each surface modified graphene sheet 40 includes a graphene sheet 10 and a plurality of metal particles 20. Each of the first surface 15a and the second surface 15b of each graphene sheet 10 adsorbs a plurality of metal particles 20. In this embodiment, the thickness of the second conductor layer 104 can be, for example, 20 nm to 200 nm, which can replace the thick copper layer (about 40 μm to 400 μm) in the prior art, which can not only improve the heat dissipation performance of the circuit board, but also Reduce the thickness and weight of the overall board, thereby reducing process costs.
此外，由於石墨烯片10帶負電，而金屬粒子20帶正電，因此，石墨烯片10與金屬粒子20具有靜電吸引力，以提升石墨烯片10與金屬粒子20之間的附著力。同樣地，在本實施例中，可將兩圖案化的第一導體層102a帶負電，其使得金屬粒子20與所對應的圖案化的第一導體層102a之間具有靜電吸引力，進而提升金屬粒子20與所對應的圖案化的第一導體層102a之間附著 力。如此一來，圖案化的第一導體層102a與所對應的第二導體層104之間便不容易發生剝離或脫落的現象，進而提昇所屬電子產品的可靠度。 Further, since the graphene sheet 10 is negatively charged and the metal particles 20 are positively charged, the graphene sheets 10 and the metal particles 20 have an electrostatic attraction force to enhance the adhesion between the graphene sheets 10 and the metal particles 20. Similarly, in the present embodiment, the two patterned first conductor layers 102a can be negatively charged, which causes electrostatic attraction between the metal particles 20 and the corresponding patterned first conductor layer 102a, thereby lifting the metal. Attachment between the particles 20 and the corresponding patterned first conductor layer 102a force. As a result, the phenomenon that the patterned first conductor layer 102a and the corresponding second conductor layer 104 are less likely to peel off or fall off, thereby improving the reliability of the electronic product.
在以下的實施例中，相同或相似的元件、構件、層以相似的元件符號來表示。舉例來說，核心層100與核心層200、300皆為相同或相似的構件；第一導體層102與第一導體層202、302亦為相同或相似的構件。於此不再逐一贅述。 In the following embodiments, the same or similar elements, members, and layers are denoted by like reference numerals. For example, the core layer 100 and the core layers 200, 300 are all the same or similar members; the first conductor layer 102 and the first conductor layers 202, 302 are also the same or similar members. This will not be repeated here.
圖3A至圖3G為依照本發明第二實施例所繪示的電路板之製造流程的剖面示意圖。 3A to 3G are schematic cross-sectional views showing a manufacturing process of a circuit board according to a second embodiment of the present invention.
請參照圖3A，本發明第二實施例提供另一種電路板的製造方法，其步驟如下。提供核心層200，其具有相對的第一側S1與第二側S2。接著，分別於核心層200的第一側S1與第二側S2上形成兩第一導體層202。在本實施例中，第一導體層202的厚度可例如是40μm至400μm。 Referring to FIG. 3A, a second embodiment of the present invention provides a method of fabricating another circuit board, the steps of which are as follows. A core layer 200 is provided having opposing first side S1 and second side S2. Next, two first conductor layers 202 are formed on the first side S1 and the second side S2 of the core layer 200, respectively. In the present embodiment, the thickness of the first conductor layer 202 may be, for example, 40 μm to 400 μm.
請參照圖3B，在兩第一導體層202上分別塗佈(coating)導電油墨50，使得導電油墨50分別覆蓋兩第一導體層202的表面。在本實施例中，塗佈導電油墨50的方法包括：噴灑法(spray)、印刷法(print)或其組合。 Referring to FIG. 3B, conductive inks 50 are respectively coated on the two first conductor layers 202 such that the conductive inks 50 cover the surfaces of the two first conductor layers 202, respectively. In the present embodiment, the method of coating the conductive ink 50 includes a spray, a print, or a combination thereof.
請參照圖3C，對導電油墨50進行乾燥處理，接著，經由微影與蝕刻製程同時圖案化兩第一導體層202以及分別覆蓋在兩第一導體層202上的導電油墨50，暴露部分核心層200的表面，以於核心層200的第一側S1與第二側S2上分別形成兩圖案化的 第一導體層202a以及兩圖案化的第二導體層204a。在本實施例中，圖案化的第二導體層204a的厚度可例如是20nm至200nm。 Referring to FIG. 3C, the conductive ink 50 is dried. Then, the two first conductor layers 202 and the conductive ink 50 respectively covering the two first conductor layers 202 are simultaneously patterned via a lithography and etching process to expose a portion of the core layer. The surface of the second layer S1 and the second side S2 of the core layer 200 respectively form two patterned The first conductor layer 202a and the two patterned second conductor layers 204a. In the present embodiment, the thickness of the patterned second conductor layer 204a may be, for example, 20 nm to 200 nm.
與上述圖2C相似，由於導電油墨50中的石墨烯片10帶負電，而金屬粒子20帶正電，因此，石墨烯片10與金屬粒子20具有靜電吸引力，以提升石墨烯片10與金屬粒子20之間的附著力。同樣地，在本實施例中，可將兩圖案化的第一導體層202a帶負電，其使得金屬粒子20與所對應的圖案化的第一導體層202a之間具有靜電吸引力，進而提升金屬粒子20與所對應的圖案化的第一導體層202a之間附著力。如此一來，圖案化的第一導體層202a與所對應的圖案化的第二導體層204a之間便不容易發生剝離或脫落的現象，進而提昇所屬電子產品的可靠度。 Similar to FIG. 2C described above, since the graphene sheets 10 in the conductive ink 50 are negatively charged and the metal particles 20 are positively charged, the graphene sheets 10 and the metal particles 20 have electrostatic attraction to enhance the graphene sheets 10 and metal. Adhesion between particles 20. Similarly, in the present embodiment, the two patterned first conductor layers 202a can be negatively charged, which causes electrostatic attraction between the metal particles 20 and the corresponding patterned first conductor layer 202a, thereby lifting the metal. Adhesion between the particles 20 and the corresponding patterned first conductor layer 202a. As a result, the phenomenon that the patterned first conductor layer 202a and the corresponding patterned second conductor layer 204a are not easily peeled off or peeled off, thereby improving the reliability of the electronic product.
請參照圖3D，本實施例可利用增層法來增加導體層的層數，其可依據設計需求來進行調整，本發明並不設限。詳細地說，壓合兩增層結構206於對應的兩圖案化的第二導體層204a上。每一增層結構206包括介電層208、第三導體層210以及第四導體層212。第四導體層212具有導電油墨50。 Referring to FIG. 3D, the present embodiment can increase the number of layers of the conductor layer by using a build-up method, which can be adjusted according to design requirements, and the invention is not limited thereto. In detail, the two build-up structures 206 are pressed onto the corresponding two patterned second conductor layers 204a. Each buildup structure 206 includes a dielectric layer 208, a third conductor layer 210, and a fourth conductor layer 212. The fourth conductor layer 212 has a conductive ink 50.
請參照圖3E，經由微影與蝕刻製程圖案化兩增層結構206，以於圖案化的第二導體層204a上形成兩圖案化的增層結構206a。每一圖案化的增層結構206a包括介電層208、圖案化的第三導體層210a以及圖案化的第四導體層212a。圖案化的第三導體層210a的厚度、材料以及形成方法與圖案化的第一導體層202a的厚度、材料以及形成方法相同；而圖案化的第四導體層212的 厚度、材料以及形成方法與圖案化的第二導體層204a的厚度、材料以及形成方法相同，於此便不再贅述。在本實施例中，圖案化的第三導體層210a與圖案化的第一導體層202a可以電性連接，但由於圖案化的第三導體層210a與圖案化的第一導體層202a的連接關係是採取平面繞線的方式，故在此一剖面並未示出。 Referring to FIG. 3E, the two build-up structures 206 are patterned via a lithography and etching process to form two patterned build-up structures 206a on the patterned second conductor layer 204a. Each patterned build-up structure 206a includes a dielectric layer 208, a patterned third conductor layer 210a, and a patterned fourth conductor layer 212a. The thickness, material, and formation method of the patterned third conductor layer 210a are the same as the thickness, material, and formation method of the patterned first conductor layer 202a; and the patterned fourth conductor layer 212 The thickness, material, and formation method are the same as the thickness, material, and formation method of the patterned second conductor layer 204a, and will not be described herein. In this embodiment, the patterned third conductor layer 210a and the patterned first conductor layer 202a may be electrically connected, but due to the connection relationship between the patterned third conductor layer 210a and the patterned first conductor layer 202a. It is a plane winding method, so it is not shown here.
請參照圖3F，壓合兩外增層結構214於對應的兩圖案化的第四導體層212a上。每一外增層結構214包括介電層216以及圖案化的第五導體層218。介電層216的材料與圖2F之介電層116的材料相同；而圖案化的第五導體層218的厚度、材料以及形成方法與圖2F之圖案化的第五導體層118的厚度、材料以及形成方法相同，於此便不再贅述。 Referring to FIG. 3F, the two outer build-up structures 214 are pressed onto the corresponding two patterned fourth conductor layers 212a. Each outer buildup structure 214 includes a dielectric layer 216 and a patterned fifth conductor layer 218. The material of the dielectric layer 216 is the same as the material of the dielectric layer 116 of FIG. 2F; and the thickness, material, and formation method of the patterned fifth conductor layer 218 and the thickness and material of the patterned fifth conductor layer 118 of FIG. 2F. And the formation method is the same, and will not be described here.
請參照圖3G，於核心層200、兩圖案化的增層結構206a以及兩外增層結構214中形成通孔220。在本實施例中，形成通孔220的步驟包括機械鑽孔、雷射鑽孔製程等，但本發明不以此為限。接著，在通孔220以及部分外增層結構214的表面上形成導體層230。導體層130的材料可包括金屬材料，金屬材料可例如是銀、鎳、銅、金、鈀或其組合。在本實施例中，形成導體層230的步驟包括電鍍製程，但本發明不以此為限。通孔220中的導體層230可用以導通各層，以形成多層電路板結構。 Referring to FIG. 3G, a via 220 is formed in the core layer 200, the two patterned build-up structures 206a, and the two outer build-up structures 214. In the embodiment, the step of forming the through hole 220 includes a mechanical drilling, a laser drilling process, and the like, but the invention is not limited thereto. Next, a conductor layer 230 is formed on the surface of the via 220 and a portion of the outer buildup structure 214. The material of the conductor layer 130 may include a metal material, which may be, for example, silver, nickel, copper, gold, palladium, or a combination thereof. In the present embodiment, the step of forming the conductor layer 230 includes an electroplating process, but the invention is not limited thereto. The conductor layer 230 in the via 220 can be used to turn on the layers to form a multilayer circuit board structure.
圖4A至圖4D為依照本發明第三實施例所繪示的電路板之製造流程的剖面示意圖。 4A-4D are schematic cross-sectional views showing a manufacturing process of a circuit board according to a third embodiment of the present invention.
請參照圖4A，本發明第三實施例提供又一種電路板的製 造方法，其步驟如下。提供核心層300，其具有相對的第一側S1與第二側S2。接著，分別於核心層200的第一側S1與第二側S2上形成兩圖案化的第一導體層302，其可利用直接注入導電油墨50的形成方法來形成。第三實施例與第一實施例不同之處在於：第三實施例直接利用具有高熱導率之導電油墨50的圖案化的第一導體層302來取代第一實施例中的圖案化的第一導體層102a以及第二導體層104的複合層。在本實施例中，圖案化的第一導體層302的單一層厚度可例如是20nm至200nm。順帶一提的是，雖然圖4A僅繪示單一層的圖案化的第一導體層302，但本發明並不設限，在其他實施例中，圖案化的第一導體層302亦可例如是兩層或更多層的導電油墨50所構成的複合層。每一圖案化的第一導體層302包括導電油墨50。導電油墨50包括導電高分子溶液30以及多數個表面改質的石墨烯片40。表面改質的石墨烯片40位於導電高分子溶液30中。每一表面改質的石墨烯片40包括石墨烯片10以及多數個金屬粒子20。每一石墨烯片10的第一表面15a與第二表面15b皆吸附多數個金屬粒子20。 Referring to FIG. 4A, a third embodiment of the present invention provides another circuit board system. The method is as follows. A core layer 300 is provided having opposing first side S1 and second side S2. Next, two patterned first conductor layers 302 are formed on the first side S1 and the second side S2 of the core layer 200, respectively, which can be formed by a method of directly injecting the conductive ink 50. The third embodiment is different from the first embodiment in that the third embodiment directly replaces the patterned first conductor in the first embodiment by using the patterned first conductor layer 302 of the conductive ink 50 having high thermal conductivity. A composite layer of the conductor layer 102a and the second conductor layer 104. In the present embodiment, the single layer thickness of the patterned first conductor layer 302 may be, for example, 20 nm to 200 nm. Incidentally, although FIG. 4A only shows a single layer of the patterned first conductor layer 302, the present invention is not limited thereto. In other embodiments, the patterned first conductor layer 302 may also be, for example, A composite layer of two or more layers of conductive ink 50. Each patterned first conductor layer 302 includes a conductive ink 50. The conductive ink 50 includes a conductive polymer solution 30 and a plurality of surface-modified graphene sheets 40. The surface-modified graphene sheet 40 is located in the conductive polymer solution 30. Each surface modified graphene sheet 40 includes a graphene sheet 10 and a plurality of metal particles 20. Each of the first surface 15a and the second surface 15b of each graphene sheet 10 adsorbs a plurality of metal particles 20.
請同時參照圖4B與圖4C，壓合兩增層結構306於對應的兩圖案化的第一導體層302上。每一增層結構306包括介電層308以及圖案化的第二導體層310。在本實施例中，圖案化的第二導體層310的單一層厚度可例如是20nm至200nm。同上述，雖然圖4B與圖4C僅繪示單一層的圖案化的第二導體層310，但本發明並不設限，在其他實施例中，圖案化的第二導體層310亦可 例如是兩層或更多層的導電油墨50所構成的複合層。圖案化的第二導體層310亦具有導電油墨50。在本實施例中，是以含有導電油墨50的圖案化的第一導體層302以及圖案化的第二導體層310直接當作電路板上的導線。由於石墨烯片10的熱導率較高，相較於先前技術中以銅箔(copper foil)或銅層當作導線，本實施例具有較佳的散熱效能。 Referring to FIG. 4B and FIG. 4C simultaneously, the two build-up structures 306 are pressed onto the corresponding two patterned first conductor layers 302. Each buildup structure 306 includes a dielectric layer 308 and a patterned second conductor layer 310. In the present embodiment, the single layer thickness of the patterned second conductor layer 310 may be, for example, 20 nm to 200 nm. 4B and FIG. 4C, only a single layer of the patterned second conductor layer 310 is illustrated. However, the present invention is not limited thereto. In other embodiments, the patterned second conductor layer 310 may also be used. For example, a composite layer composed of two or more layers of conductive ink 50. The patterned second conductor layer 310 also has a conductive ink 50. In the present embodiment, the patterned first conductor layer 302 containing the conductive ink 50 and the patterned second conductor layer 310 are directly used as the wires on the circuit board. Since the graphene sheet 10 has a high thermal conductivity, this embodiment has better heat dissipation performance than a copper foil or a copper layer as a wire in the prior art.
請參照圖4D，於核心層300以及兩增層結構306中形成通孔320。在本實施例中，形成通孔320的步驟包括機械鑽孔、雷射鑽孔製程等，但本發明不以此為限。接著，在通孔320以及部分增層結構306的表面上形成導體層330。導體層330的材料可包括金屬材料，金屬材料可例如是銀、鎳、銅、金、鈀或其組合。在本實施例中，形成導體層330的步驟包括電鍍製程，但本發明不以此為限。通孔320中的導體層330可用以導通各層，以形成多層電路板結構。 Referring to FIG. 4D, a via 320 is formed in the core layer 300 and the two build-up structures 306. In the embodiment, the step of forming the through hole 320 includes a mechanical drilling, a laser drilling process, and the like, but the invention is not limited thereto. Next, a conductor layer 330 is formed on the surface of the via 320 and the portion buildup structure 306. The material of the conductor layer 330 may include a metal material, which may be, for example, silver, nickel, copper, gold, palladium, or a combination thereof. In the present embodiment, the step of forming the conductor layer 330 includes an electroplating process, but the invention is not limited thereto. The conductor layer 330 in the via 320 can be used to turn on the layers to form a multilayer circuit board structure.
綜上所述，本發明可利用多數個表面改質的石墨烯片與導電高分子溶液混合，以形成具有高熱導率的導電油墨。而此導電油墨所形成的導體層可取代先前技術中的厚銅層，以提升電路板的散熱效能，同時又可減少整體電路板的厚度與重量，進而降低製程成本。此外，本發明還將圖案化的第一導體層(可例如是銅箔基板中的銅箔)帶負電，其使得導電油墨中的金屬粒子與所對應的圖案化的第一導體層之間具有靜電吸引力，進而提升金屬粒子與所對應的圖案化的第一導體層之間附著力。如此一來，圖 案化的第一導體層與所對應的第二導體層之間便不容易發生剝離或脫落的現象，進而提昇所屬電子產品的可靠度。 In summary, the present invention can utilize a plurality of surface-modified graphene sheets mixed with a conductive polymer solution to form a conductive ink having high thermal conductivity. The conductive layer formed by the conductive ink can replace the thick copper layer in the prior art to improve the heat dissipation performance of the circuit board, and at the same time reduce the thickness and weight of the overall circuit board, thereby reducing the process cost. Furthermore, the present invention also negatively charges the patterned first conductor layer (which may be, for example, a copper foil in a copper foil substrate) such that there is a metal particle in the conductive ink and the corresponding patterned first conductor layer The electrostatic attraction increases the adhesion between the metal particles and the corresponding patterned first conductor layer. In this way, the picture The phenomenon that the first conductor layer and the corresponding second conductor layer are not easily peeled off or peeled off, thereby improving the reliability of the electronic product.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
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