US5900106A - Bonding apparatus - Google Patents

Bonding apparatus Download PDF

Info

Publication number
US5900106A
US5900106A US08/977,708 US97770897A US5900106A US 5900106 A US5900106 A US 5900106A US 97770897 A US97770897 A US 97770897A US 5900106 A US5900106 A US 5900106A
Authority
US
United States
Prior art keywords
optical path
path housing
camera
temperature
heating block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US08/977,708
Inventor
Kuniyuki Takahashi
Hideya Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Assigned to KABUSHIKI KAISHA SHINKAWA reassignment KABUSHIKI KAISHA SHINKAWA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAKAMURA, HIDEYA, TAKAHASHI, KUNIYUKI
Application granted granted Critical
Publication of US5900106A publication Critical patent/US5900106A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/32—Wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Definitions

  • the present invention relates to a bonding apparatus such as a wire bonding apparatus, die bonding apparatus or tape bonding apparatus and more particularly to a bonding apparatus that includes a means which takes images of a workpiece to be bonded.
  • a bonding apparatus is generally equipped with a heating block which heats the semiconductor workpieces and a bonding tool which performs bonding on the semiconductor workpieces along with a camera and an optical path housing which are used to obtain the images of the semiconductor workpieces.
  • the bonding tool and the optical path housing are installed in close proximity to each other.
  • the optical path housing is installed in close proximity to the semiconductor workpiece.
  • the optical path housing is in an environment of radiant heat or a high-temperature atmosphere, etc. generated in the vicinity of the semiconductor workpiece, which is heated to a high temperature by the heating block.
  • the camera Since the camera is generally designed so as to work at room temperatures, when the optical path housing is exposed to such a heated environment, thermal expansion occurs therein, and a positional deviation tends to occur in the optical path housing during the object recognition or image obtaining process.
  • the optical path housing which is connected to the camera, is installed on an XY table, and it may be positioned above the heating block during the process of recognizing the semiconductor workpiece. On the other hand, the optical path housing may be positioned away from the heating block when the type of workpiece to be handled is changed.
  • the object of the present invention is to provide a bonding apparatus in which deformation which caused by the heat changes of the optical path housing is suppressed, thus preventing a shift in the image recognition position and avoiding early deterioration of the constituting elements of the optical path housing.
  • the above object is accomplished by a unique structure for a bonding apparatus in which images of semiconductor workpieces placed and carried on a heating block are taken by means of a camera through an optical path housing, wherein a heating means is installed on at least the optical path housing so as to maintain the temperature of the optical path housing at a constant value.
  • FIG. 1 is a perspective view which illustrates the essential portion of one embodiment of the bonding apparatus of the present invention.
  • FIG. 1 a semiconductor workpiece 2 is placed on a heating block I.
  • a camera supporting arm 4 to which a camera 3 is attached is fastened to a bonding head (not shown) which is driven in the X and Y directions, and an optical path housing 5 is fastened to this camera supporting arm 4.
  • the optical path housing 5 is comprised of an angled main housing 5a and a tubular member 5b; and the angled main housing 5a includes a horizontal section 5a H and a vertical section 5a V.
  • a plurality of heaters 6 and 7 and temperature-sensing elements 8 and 9 are mounted on the optical path housing 5.
  • the wiring of the heaters 6 and 7 and the temperature-sensing elements 8 and 9 are connected to a temperature controller (not shown).
  • the optical path housing 5 is heated by supplying electric power to the heaters 6 and 7.
  • the heating temperature of the heaters 6 and 7 is controlled so that the optical path housing 5 is heated, when it is positioned above the heating block 1, to a temperature which is higher than the temperature at which the optical path housing 5 is heated by high-temperature atmosphere or radiant heat from the heating block 1, etc.
  • a test shows that in a case, for instance, where the temperature of the heating block 1 is 280° C., and the lower edge of the vertical section 5a V of the optical path housing 5 is positioned approximately 10 mm above the heating block 1, then the optical path housing 5 heated by the high-temperature atmospheres and radiant heat from the heating block 1, etc. at points A through D thereof were as follows: point A: 57° C., point B: 40° C., points C and D: 36° C. Accordingly, in such a case, it is controlled so that the optical path housing 5 is heated by the heater 6 to be greater than 57° C. (60° C., for instance) at point A; and the optical path housing 5 is further heated by the heater 7 to be greater than 36° C. (40° C., for instance) at point C.
  • the optical path housing 5 is heated beforehand by the heaters 6 and 7.
  • the respective heating temperatures in this case are, as described above, controlled so that the optical path housing 5 is heated to respective temperature values that are higher than the temperature values at which the optical path housing 5 is heated by the high-temperature atmosphere and radiant heat from the heating block, etc. Accordingly, the optical path housing 5 is not affected by the high-temperature atmosphere and radiant heat and kept at a constant temperature by the heaters 6 and 7; and therefore, the expansion of the optical path housing 5 is stabilized, and the shift in the recognition position can be suppressed.
  • the temperature-sensing elements 8 and 9 are provided in the respective vicinities of the heaters 6 and 7, the temperature of the camera mirror tube 5 are monitored by these temperature-sensing elements 8 and 9.
  • the heating temperature by the heaters 6 and 7 is controlled by a heat controller (not shown) so that the heating temperature by the heaters 6 and 7 is maintained at a desired temperature.
  • a heat controller not shown
  • the heaters 6 and 7 and temperature-sensing elements 8 and 9 are installed only on the optical path housing 5; however, it goes without saying that heaters and temperature-sensing elements can be installed on the camera supporting arm 4 as well.
  • a heating means is installed on the optical path housing, deformation of the optical path housing that is caused by heat changes in the optical path housing can be suppressed, a positional shift in the image recognition position can be prevented, and an early deterioration of the constituting elements can be prevented.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

In a wire bonding apparatus in which images of workpieces placed on a heating block so as to be bonded are taken by a camera through an optical path housing in which an optical path from the workpiece to the camera is established, heaters are installed on the optical path housing so as to heat the optical path housing at a constant temperature which is higher than the temperature that is affected by the heating block.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a bonding apparatus such as a wire bonding apparatus, die bonding apparatus or tape bonding apparatus and more particularly to a bonding apparatus that includes a means which takes images of a workpiece to be bonded.
2. Prior Art
A bonding apparatus is generally equipped with a heating block which heats the semiconductor workpieces and a bonding tool which performs bonding on the semiconductor workpieces along with a camera and an optical path housing which are used to obtain the images of the semiconductor workpieces.
In order to perform high precision bonding with such a bonding apparatus, it is necessary to specifically recognize the positions of the semiconductor workpieces. Meanwhile, in order to shorten the time which the bonding tool takes to move to perform bonding, it is necessary to shorten the distance between the bonding point for each semiconductor workpiece and the recognition point where the semiconductor workpiece is recognized.
Accordingly, the bonding tool and the optical path housing are installed in close proximity to each other. However, this means that the optical path housing is installed in close proximity to the semiconductor workpiece. As a result, the optical path housing is in an environment of radiant heat or a high-temperature atmosphere, etc. generated in the vicinity of the semiconductor workpiece, which is heated to a high temperature by the heating block.
Since the camera is generally designed so as to work at room temperatures, when the optical path housing is exposed to such a heated environment, thermal expansion occurs therein, and a positional deviation tends to occur in the optical path housing during the object recognition or image obtaining process.
One example of a conventional means for preventing thermal expansion of the optical path housing is to blow cooling air onto the optical path housing, and this is disclosed in Japanese Patent Application Laid-open (Kokai) No. H7-147297.
Generally, the optical path housing, which is connected to the camera, is installed on an XY table, and it may be positioned above the heating block during the process of recognizing the semiconductor workpiece. On the other hand, the optical path housing may be positioned away from the heating block when the type of workpiece to be handled is changed.
Accordingly, in the prior art described above, periodic or irregular heat changes inevitably occur in the optical path housing as a result of repeated heating, which is when the optical path housing is moved near the heat source, and as a result of cooling, which when the optical path housing is moved away from the heat source and when cooling air is blown thereon. As a result, an unexpected positional shift in the recognition position occurs due to the deformation of the optical path housing. In addition, deterioration in the parts of the optical path housing progresses rapidly. Furthermore, even if cooled by the cooling air, if automatic operation is initiated while the optical path housing is at room temperature, thermal expansion of the optical path housing gradually proceeds, so that the recognition results obtained after several hours of automatic operation differ from those obtained immediately after the initiation of automatic operation.
SUMMARY OF THE INVENTION
Accordingly, the object of the present invention is to provide a bonding apparatus in which deformation which caused by the heat changes of the optical path housing is suppressed, thus preventing a shift in the image recognition position and avoiding early deterioration of the constituting elements of the optical path housing.
The above object is accomplished by a unique structure for a bonding apparatus in which images of semiconductor workpieces placed and carried on a heating block are taken by means of a camera through an optical path housing, wherein a heating means is installed on at least the optical path housing so as to maintain the temperature of the optical path housing at a constant value.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view which illustrates the essential portion of one embodiment of the bonding apparatus of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
In FIG. 1, a semiconductor workpiece 2 is placed on a heating block I.
A camera supporting arm 4 to which a camera 3 is attached is fastened to a bonding head (not shown) which is driven in the X and Y directions, and an optical path housing 5 is fastened to this camera supporting arm 4. The optical path housing 5 is comprised of an angled main housing 5a and a tubular member 5b; and the angled main housing 5a includes a horizontal section 5a H and a vertical section 5a V. With this structure, recognized images of the semiconductor workpiece 2 are introduced into the camera 3 along the optical path P which is provided in the optical path housing 5 and camera supporting arm 4.
In addition, a plurality of heaters 6 and 7 and temperature-sensing elements 8 and 9 (such as CA wires, etc.) are mounted on the optical path housing 5. The wiring of the heaters 6 and 7 and the temperature- sensing elements 8 and 9 are connected to a temperature controller (not shown).
The optical path housing 5 is heated by supplying electric power to the heaters 6 and 7. The heating temperature of the heaters 6 and 7 is controlled so that the optical path housing 5 is heated, when it is positioned above the heating block 1, to a temperature which is higher than the temperature at which the optical path housing 5 is heated by high-temperature atmosphere or radiant heat from the heating block 1, etc.
A test shows that in a case, for instance, where the temperature of the heating block 1 is 280° C., and the lower edge of the vertical section 5a V of the optical path housing 5 is positioned approximately 10 mm above the heating block 1, then the optical path housing 5 heated by the high-temperature atmospheres and radiant heat from the heating block 1, etc. at points A through D thereof were as follows: point A: 57° C., point B: 40° C., points C and D: 36° C. Accordingly, in such a case, it is controlled so that the optical path housing 5 is heated by the heater 6 to be greater than 57° C. (60° C., for instance) at point A; and the optical path housing 5 is further heated by the heater 7 to be greater than 36° C. (40° C., for instance) at point C.
In operation, the optical path housing 5 is heated beforehand by the heaters 6 and 7. The respective heating temperatures in this case are, as described above, controlled so that the optical path housing 5 is heated to respective temperature values that are higher than the temperature values at which the optical path housing 5 is heated by the high-temperature atmosphere and radiant heat from the heating block, etc. Accordingly, the optical path housing 5 is not affected by the high-temperature atmosphere and radiant heat and kept at a constant temperature by the heaters 6 and 7; and therefore, the expansion of the optical path housing 5 is stabilized, and the shift in the recognition position can be suppressed.
Furthermore, since the temperature- sensing elements 8 and 9 are provided in the respective vicinities of the heaters 6 and 7, the temperature of the camera mirror tube 5 are monitored by these temperature- sensing elements 8 and 9. In addition, the heating temperature by the heaters 6 and 7 is controlled by a heat controller (not shown) so that the heating temperature by the heaters 6 and 7 is maintained at a desired temperature. Thus, dimensional changes in the expansion of the optical path housing 5 can be kept to a minimum.
In the above embodiment, the heaters 6 and 7 and temperature-sensing elements 8 and 9 are installed only on the optical path housing 5; however, it goes without saying that heaters and temperature-sensing elements can be installed on the camera supporting arm 4 as well.
As seen from the above, according to the present invention, since a heating means is installed on the optical path housing, deformation of the optical path housing that is caused by heat changes in the optical path housing can be suppressed, a positional shift in the image recognition position can be prevented, and an early deterioration of the constituting elements can be prevented.

Claims (2)

What is claimed is:
1. A bonding apparatus in which images of work pieces positioned and placed on a heating block are recognized by a camera and related optical path housing comprising:
a camera supporting means on which is supported a camera, said camera supporting means with supported camera being fastened to a bonding head which is driven in the X and Y directions;
an optical path housing means fastened to said camera supporting means, said optical path housing means forming an optical path between said camera supported on said camera supporting means and said work pieces positioned on said heating block;
said optical path housing means further comprising a heating means mounted on said optical path housing means, said heating means acting to maintain said optical path housing means at a constant temperature.
2. The bonding apparatus according to claim 1 wherein said heating means mounted on said optical path housing means acts to maintain said optical path housing means at a constant temperature which is higher than a temperature it would be heated by said heating block.
US08/977,708 1996-11-29 1997-11-25 Bonding apparatus Expired - Fee Related US5900106A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8-334911 1996-11-29
JP33491196A JP3347621B2 (en) 1996-11-29 1996-11-29 Bonding equipment

Publications (1)

Publication Number Publication Date
US5900106A true US5900106A (en) 1999-05-04

Family

ID=18282623

Family Applications (1)

Application Number Title Priority Date Filing Date
US08/977,708 Expired - Fee Related US5900106A (en) 1996-11-29 1997-11-25 Bonding apparatus

Country Status (4)

Country Link
US (1) US5900106A (en)
JP (1) JP3347621B2 (en)
KR (1) KR100273838B1 (en)
TW (1) TW373810U (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010051394A1 (en) * 1998-09-30 2001-12-13 Sang-Geun Kim Die bonding equipment
US6408090B1 (en) * 1998-09-28 2002-06-18 Siemens Production And Logistics System Aktiengesellschaft Method for position recognition of components equipped on a substrate in an automatic equipping unit
US20120111923A1 (en) * 2010-11-05 2012-05-10 Yong-Je Lee Wire bonding apparatus and method using the same
US8530539B2 (en) 2008-02-14 2013-09-10 Daicel Chemical Industries, Ltd. Curable resin composition for nanoimprint
US20130256385A1 (en) * 2011-09-28 2013-10-03 Kaijo Corporation Bonding apparatus
US8958011B2 (en) 2012-03-30 2015-02-17 Samsung Electronics Co., Ltd. Bi-directional camera module and flip chip bonder including the same
CN109605053A (en) * 2018-12-04 2019-04-12 洁华控股股份有限公司 Jet pipe for gaseous pollutant cleaning equipment welds unit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101643704B1 (en) 2015-11-12 2016-08-11 주식회사 투엠모터스 Automotive and Fixing Lashing Hook or toeing hook method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07147297A (en) * 1993-11-25 1995-06-06 Shinkawa Ltd Wire bonding device
US5667130A (en) * 1994-02-03 1997-09-16 Matsushita Electric Industrial Co., Ltd. Ultrasonic wire bonding apparatus and method
US5720424A (en) * 1995-05-30 1998-02-24 Kabushiki Kaisha Shinkawa Wire bonding apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07147297A (en) * 1993-11-25 1995-06-06 Shinkawa Ltd Wire bonding device
US5501388A (en) * 1993-11-25 1996-03-26 Kabushiki Kaisha Shinkawa Wire bonding apparatus
US5667130A (en) * 1994-02-03 1997-09-16 Matsushita Electric Industrial Co., Ltd. Ultrasonic wire bonding apparatus and method
US5720424A (en) * 1995-05-30 1998-02-24 Kabushiki Kaisha Shinkawa Wire bonding apparatus

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6408090B1 (en) * 1998-09-28 2002-06-18 Siemens Production And Logistics System Aktiengesellschaft Method for position recognition of components equipped on a substrate in an automatic equipping unit
US20010051394A1 (en) * 1998-09-30 2001-12-13 Sang-Geun Kim Die bonding equipment
US6820792B2 (en) * 1998-09-30 2004-11-23 Samsung Electronics Co., Ltd. Die bonding equipment
US8530539B2 (en) 2008-02-14 2013-09-10 Daicel Chemical Industries, Ltd. Curable resin composition for nanoimprint
US20120111923A1 (en) * 2010-11-05 2012-05-10 Yong-Je Lee Wire bonding apparatus and method using the same
US8245902B2 (en) * 2010-11-05 2012-08-21 Samsung Electronics Co., Ltd. Wire bonding apparatus and method using the same
US20130256385A1 (en) * 2011-09-28 2013-10-03 Kaijo Corporation Bonding apparatus
US8651355B2 (en) * 2011-09-28 2014-02-18 Kaijo Corporation Bonding apparatus
US8958011B2 (en) 2012-03-30 2015-02-17 Samsung Electronics Co., Ltd. Bi-directional camera module and flip chip bonder including the same
CN109605053A (en) * 2018-12-04 2019-04-12 洁华控股股份有限公司 Jet pipe for gaseous pollutant cleaning equipment welds unit

Also Published As

Publication number Publication date
KR100273838B1 (en) 2001-01-15
KR19980041838A (en) 1998-08-17
JP3347621B2 (en) 2002-11-20
TW373810U (en) 1999-11-01
JPH10163277A (en) 1998-06-19

Similar Documents

Publication Publication Date Title
EP1462189B1 (en) Method and apparatus for incremental forming
US5968382A (en) Laser cleavage cutting method and system
US5900106A (en) Bonding apparatus
US4160893A (en) Individual chip joining machine
US6998572B2 (en) Light energy processing device and method
KR19990074014A (en) Surface processing automation device of hull shell
US5501388A (en) Wire bonding apparatus
JPH10315057A (en) Wire electric discharge machine
US5622304A (en) Tape bonding apparatus
US11602817B2 (en) Machining system and machining method
KR100707961B1 (en) Method and apparatus for laser manufacturing
JPH0490319A (en) Cutting apparatus for molded item
JP2002001567A (en) Laser beam machining device
JP3475801B2 (en) Electronic component bonding equipment
US7389903B2 (en) Device and method for soldering contacts on semiconductor chips
WO2020054619A1 (en) Soldering device
JPH06285661A (en) Laser beam machine
JP4146140B2 (en) Camera temperature control device for image recognition
JP2010010547A (en) Flip-chip bonder device
KR100247132B1 (en) Automatic welding method and apparatus
JP3381610B2 (en) Thermocompression bonding equipment for electronic components
JP2003115503A (en) Adjusting/assembling unit for high-temperature treated part
US20220068729A1 (en) Laser processing apparatus and method of correcting converged spot position
JPH03163838A (en) Die-bonding device
JP2005079412A (en) Method for manufacturing semiconductor device, and wire bonder used therefor

Legal Events

Date Code Title Description
AS Assignment

Owner name: KABUSHIKI KAISHA SHINKAWA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TAKAHASHI, KUNIYUKI;NAKAMURA, HIDEYA;REEL/FRAME:008847/0934

Effective date: 19971121

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

FEPP Fee payment procedure

Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20110504