US4014690A - Gold-colored alloy solders - Google Patents
Gold-colored alloy solders Download PDFInfo
- Publication number
- US4014690A US4014690A US05/686,347 US68634776A US4014690A US 4014690 A US4014690 A US 4014690A US 68634776 A US68634776 A US 68634776A US 4014690 A US4014690 A US 4014690A
- Authority
- US
- United States
- Prior art keywords
- gold
- copper
- gallium
- palladium
- platinum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
Definitions
- This invention relates to alloy solders. More specifically it relates to gold-colored alloy solders which are used with dental gold alloys and gold-colored jewelry alloys.
- Solders for the above uses must possess excellent solderability with excellent flow characteristics in order to produce sound, porous-free joints. These solders must also possess the hardness and strength necessary for use in load bearing adjations which are common in dentistry and in jewelry.
- U.S. Pat. No. 3,892,564 discloses gallium-bearing gold alloys, particularly low melting point alloys, useful as solders for articles of jewelry and in dental work, and containing apart from impurities, 1-10 wt. percent gallium, 0-25 wt. percent copper, 0-33 wt. percent silver and 0-10 wt. percent zinc, the balance in all cases consisting of gold. Specifically disclosed is an alloy containing 10% gallium, 15% copper and 75% gold.
- the relative proportions of the various elements comprising the new alloy solders of the invention have been determined as the result of intensive investigation to obtain an alloy solder having optimum chemical and physical properties. Specifically, we have found that the alloy solder of the invention should contain by weight gold 60-60%, platinum 0-10%, palladium 0-10%, copper 10-25%, gallium 5-10%, and iridium 0-0.01% with the proviso that the total of said platinum and palladium is from about 5-10%.
- Preferred alloy solders are those which contain about 10-15% copper and about 70% gold; and about 20-25% copper and about 60% gold.
- alloy solders of this invention are listed below in Examples I-IX giving especially preferred compositions in percentages by weight. These gold-colored alloy solders have been found particularly useful for soldering dental gold alloys and gold-colored jewelry.
- solders of this invention possess excellent solderability with excellent flow characteristics, resulting in sound, porous-free joints. They also possess the hardness and strength necessary for use in load bearing applications which are common in dentistry and jewelry.
- the use of palladium in the solders of this invention substantially reduces the cost in comparison with those disclosed in U.S. Pat. No. 3,892,564, previously discussed.
- Gold Noble metal addition which improves the corrosion and tarnish resistance of the alloy and contributes to the "gold" color of the alloy.
- Platinum Noble metal addition which improves the corrosion and tarnish resistance of the alloy and also acts as a hardening agent to control the alloy's hardness and strength to specific values.
- Palladium Noble metal addition which improves the corrosion and tarnish resistance of the alloy and also acts as a hardening agent to control the alloy's hardness and strength to specific values.
- Copper Base metal addition which contributes to the "gold" color of the alloys and also acts as a hardening agent to increase the hardness and strength of the alloy.
- Gallium Base metal addition which improves the corrosion and tarnish resistance of the alloy.
- the addition of gallium also acts to enhance the gold color of the alloy by interacting in a way to lessen the red-rose hue typical of similar copper containing alloys without gallium.
- Gallium additions also have the effect of lowering the hardness of the alloys as compared to similar alloys not containing gallium.
- Gallium additions also lower the melting point of the alloy system to improve solderability.
- Iridium Noble metal addition as a grain refiner.
- Test Method the hardness numbers were determined in the as cast condition and converted to Brinell values.
- Test Specimen - Cast piece 1 1/4 inch long, 3/8 inch wide and 0.030-0.040 inch thick.
- Test Method Support stand preheated to within 200° F of anticipated sag temperature. Specimen is placed on stand and allowed to equilibrate. The temperature is then raised in 20° increments until sag is visually observed.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Adornments (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Dental Preparations (AREA)
Abstract
A gold-colored alloy solder for use with dental gold alloys and gold-colored jewelry alloys includes the following ranges of constituents in percentages by weight:
______________________________________
Constituent Proportional Range
______________________________________
Gold 60 - 70%
Platinum 0 - 10%
Palladium 0 - 10%
Copper 10 - 25%
Gallium 5 - 10%
Iridium 0 - 0.01%
______________________________________
With the proviso that the total of said platinum and palladium is from about 5-10%.
Description
This invention relates to alloy solders. More specifically it relates to gold-colored alloy solders which are used with dental gold alloys and gold-colored jewelry alloys.
Solders for the above uses must possess excellent solderability with excellent flow characteristics in order to produce sound, porous-free joints. These solders must also possess the hardness and strength necessary for use in load bearing aplications which are common in dentistry and in jewelry.
U.S. Pat. No. 3,892,564 discloses gallium-bearing gold alloys, particularly low melting point alloys, useful as solders for articles of jewelry and in dental work, and containing apart from impurities, 1-10 wt. percent gallium, 0-25 wt. percent copper, 0-33 wt. percent silver and 0-10 wt. percent zinc, the balance in all cases consisting of gold. Specifically disclosed is an alloy containing 10% gallium, 15% copper and 75% gold.
It has now been discovered that a gold-colored alloy solder for use with dental gold alloys and gold-colored jewelry alloys, having the aforementioned characteristics can be achieved by incorporating the following ranges of constituents in percentages by weight:
______________________________________ Constituent Proportional Range ______________________________________ Gold 60 - 70% Platinum 0 - 10% Palladium 0 - 10% Copper 10 - 25% Gallium 5 - 10% Iridium 0 - 0.01% ______________________________________
WITH THE PROVISO THAT THE TOTAL OF SAID PLATINUM AND PALLADIUM IS FROM ABOUT 5- 10%.
The relative proportions of the various elements comprising the new alloy solders of the invention have been determined as the result of intensive investigation to obtain an alloy solder having optimum chemical and physical properties. Specifically, we have found that the alloy solder of the invention should contain by weight gold 60-60%, platinum 0-10%, palladium 0-10%, copper 10-25%, gallium 5-10%, and iridium 0-0.01% with the proviso that the total of said platinum and palladium is from about 5-10%. Preferred alloy solders are those which contain about 10-15% copper and about 70% gold; and about 20-25% copper and about 60% gold.
Particular examples of the alloy solders of this invention are listed below in Examples I-IX giving especially preferred compositions in percentages by weight. These gold-colored alloy solders have been found particularly useful for soldering dental gold alloys and gold-colored jewelry.
The solders of this invention possess excellent solderability with excellent flow characteristics, resulting in sound, porous-free joints. They also possess the hardness and strength necessary for use in load bearing applications which are common in dentistry and jewelry. The use of palladium in the solders of this invention substantially reduces the cost in comparison with those disclosed in U.S. Pat. No. 3,892,564, previously discussed.
The role of each of the respective alloying elements is believed to be as follows:
Gold: Noble metal addition which improves the corrosion and tarnish resistance of the alloy and contributes to the "gold" color of the alloy.
Platinum: Noble metal addition which improves the corrosion and tarnish resistance of the alloy and also acts as a hardening agent to control the alloy's hardness and strength to specific values.
Palladium: Noble metal addition which improves the corrosion and tarnish resistance of the alloy and also acts as a hardening agent to control the alloy's hardness and strength to specific values.
Copper: Base metal addition which contributes to the "gold" color of the alloys and also acts as a hardening agent to increase the hardness and strength of the alloy.
Gallium: Base metal addition which improves the corrosion and tarnish resistance of the alloy. The addition of gallium also acts to enhance the gold color of the alloy by interacting in a way to lessen the red-rose hue typical of similar copper containing alloys without gallium. Gallium additions also have the effect of lowering the hardness of the alloys as compared to similar alloys not containing gallium. Gallium additions also lower the melting point of the alloy system to improve solderability.
Iridium: Noble metal addition as a grain refiner.
The following specific properties were determined in the manner described below:
Hardness
Equipment - Rockwell Hardness Tester
Test Specimen - cast piece 1/2 inch × 3/4 inch × 1/8 inch thick.
Test Method -- the hardness numbers were determined in the as cast condition and converted to Brinell values.
Sag Temperature
Equipment -- Muffle furnace with two point support stand having 1 inch span.
Test Specimen - Cast piece 1 1/4 inch long, 3/8 inch wide and 0.030-0.040 inch thick.
Test Method -- Support stand preheated to within 200° F of anticipated sag temperature. Specimen is placed on stand and allowed to equilibrate. The temperature is then raised in 20° increments until sag is visually observed.
The following examples are merely illustrative and in no way limit the scope of the claims.
______________________________________ Constituent Composition ______________________________________ Gold 70% Platinum 8.99% Palladium 1% Copper 10% Gallium 10% Iridium 0.01% ______________________________________
Brinell Hardness -- 222
Sag Temperature -- 1000°-1050° F.
______________________________________ Constituent Composition ______________________________________ Gold 70% Platinum 0.99% Palladium 9% Copper 10% Gallium 10% Iridium 0.01% ______________________________________
Brinell Hardness -- 263
Sag Temperature -- 900°-1000° F.
______________________________________ Constituent Composition ______________________________________ Gold 60% Platinum 4.99% Copper 25% Gallium 10% Iridium 0.01% ______________________________________
Brinell Hardness -- 114
Sag Temperature -- 1150°-1200° F.
______________________________________ Constituent Composition ______________________________________ Gold 60% Platinum 0.09% Palladium 4.9% Copper 25% Gallium 10% Iridium 0.01% ______________________________________
Brinell Hardness -- 185
Sag Temperature -- 1150°-1200° F.
______________________________________ Constituent Composition ______________________________________ Gold 60% Platinum 0.99% Palladium 9% Copper 20% Gallium 10% Iridium 0.01% ______________________________________
Brinell Hardness -- 256
Sag Temperature -- 1150°-1200° F.
______________________________________ Constituent Composition ______________________________________ Gold 60% Platinum 8.99% Palladium 1% Copper 20% Gallium 10% Iridium 0.01% ______________________________________
Brinell Hardness -- 242
Sag Temperature -- 1100°-1200° F.
______________________________________ Constituent Composition ______________________________________ Gold 70% Platinum 4.99% Palladium 5% Copper 10% Gallium 10% Iridium 0.01% ______________________________________
Brinell Hardness -- 216
Sag Temperature -- 1000°-1100° F.
______________________________________ Constituent Composition ______________________________________ Gold 70% Platinum 4.99% Palladium 5% Copper 15% Gallium 5% Iridium 0.01% ______________________________________
Brinell Hardness -- 222
Sag Temperature -- 1200-1350° F.
______________________________________ Constituent Composition ______________________________________ Gold 60% Platinum 4.99% Palladium 5% Copper 25% Gallium 5% Iridium 0.01% ______________________________________
Brinell Hardness -- 291
Sag Temperature -- 1500°-1550° F.
Claims (5)
1. A gold-colored alloy solder consisting essentially of the following constituents in the indicated percentages by weight:
______________________________________ Constituent Proportional Range ______________________________________ Gold 60 - 70% Platinum 0 - 10% Palladium 0 - 10% Copper 10 - 25% Gallium 5 - 10% Iridium 0 - 0.01% ______________________________________
with the proviso that the total of said platinum and palladium is from about 5-10%.
2. An alloy in accordance with claim 1 containing about 10-15% copper and about 70% gold.
3. The alloy solder of claim 2 consisting of the following constituents in approximately the indicated percentages by weight:
______________________________________ Constituent Composition ______________________________________ Gold 70% Platinum 4.99% Palladium 5% Copper 10% Gallium 10% Iridium 0.01% ______________________________________
4. An alloy in accordance with claim 1 containing about 20-25% copper and about 60% gold.
5. The alloy solder of claim 4 consisting of the following constituents in approximately the indicated percentages by weight:
______________________________________ Constituent Composition ______________________________________ Gold 60% Platinum 8.99% Palladium 1% Copper 20% Gallium 10% Iridium 0.01% ______________________________________
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/686,347 US4014690A (en) | 1976-05-14 | 1976-05-14 | Gold-colored alloy solders |
| CA276,231A CA1070984A (en) | 1976-05-14 | 1977-04-15 | Gold-colored alloy solders |
| CH565277A CH620245A5 (en) | 1976-05-14 | 1977-05-05 | |
| DE2720493A DE2720493C3 (en) | 1976-05-14 | 1977-05-05 | Gold colored solder alloy |
| SE7705321A SE417166B (en) | 1976-05-14 | 1977-05-06 | GULDFERGAD LODGE ALLOY |
| JP5300077A JPS52138457A (en) | 1976-05-14 | 1977-05-09 | Golden alloy solder |
| GB19618/77A GB1536091A (en) | 1976-05-14 | 1977-05-10 | Gold-coloured alloy solders |
| FR7714782A FR2350918A1 (en) | 1976-05-14 | 1977-05-13 | GOLD ALLOY WELDING |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/686,347 US4014690A (en) | 1976-05-14 | 1976-05-14 | Gold-colored alloy solders |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US4014690A true US4014690A (en) | 1977-03-29 |
Family
ID=24755942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US05/686,347 Expired - Lifetime US4014690A (en) | 1976-05-14 | 1976-05-14 | Gold-colored alloy solders |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4014690A (en) |
| JP (1) | JPS52138457A (en) |
| CA (1) | CA1070984A (en) |
| CH (1) | CH620245A5 (en) |
| DE (1) | DE2720493C3 (en) |
| FR (1) | FR2350918A1 (en) |
| GB (1) | GB1536091A (en) |
| SE (1) | SE417166B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4217137A (en) * | 1978-03-13 | 1980-08-12 | Medtronic, Inc. | Gold based alloy composition and brazing therewith, particularly for ceramic-metal seals in electrical feedthroughs |
| US4266973A (en) * | 1979-12-14 | 1981-05-12 | The J. M. Ney Company | Tarnish-resistant gold color alloy and dental restorations employing same |
| US5217685A (en) * | 1991-10-03 | 1993-06-08 | The Wilkinson Company | Abutment base alloy for jawbone mounted dental implants |
| US6342182B1 (en) * | 1998-12-14 | 2002-01-29 | Metalor Technologies International Sa | Nickel-free grey gold alloy |
| RU2477330C1 (en) * | 2012-03-07 | 2013-03-10 | Юлия Алексеевна Щепочкина | Gold-based alloy |
| RU2507285C1 (en) * | 2013-03-13 | 2014-02-20 | Юлия Алексеевна Щепочкина | Alloy |
| WO2014071583A1 (en) * | 2012-11-08 | 2014-05-15 | Heraeus Ltd. | Nickel containing gold alloys having low nickel releasing rate, master alloys for obtaining them and use of metal elements therein |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55103298A (en) * | 1979-02-01 | 1980-08-07 | Sankin Kogyo Kk | Gold braze alloy for dental |
| JPS5820712B2 (en) * | 1979-10-20 | 1983-04-25 | 株式会社 徳力本店 | Manufacturing method of cladding material |
| JPH0764700B2 (en) * | 1992-09-29 | 1995-07-12 | 九州大学長 | Dental gold alloy age-hardens at oral temperature |
| DE19640168B4 (en) * | 1996-09-28 | 2004-04-29 | Degudent Gmbh | Use of a solder alloy |
| DE19640169B4 (en) * | 1996-09-28 | 2005-07-28 | Degudent Gmbh | Gold-containing yellow solder alloy for dental parts |
| WO2020091082A2 (en) * | 2020-02-04 | 2020-05-07 | 株式会社俄 | White gold alloy brazing material |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3134671A (en) * | 1961-05-18 | 1964-05-26 | Nobilium Products Inc | Noble metals alloy containing gallium |
| US3136634A (en) * | 1962-02-02 | 1964-06-09 | Degussa | Noble metal alloys having a high specific electric resistance |
| US3254279A (en) * | 1963-04-17 | 1966-05-31 | Cohn James | Composite alloy electric contact element |
| US3574611A (en) * | 1968-11-18 | 1971-04-13 | Nobilium Products Inc | High temperature dental gold alloy |
| US3574610A (en) * | 1968-11-01 | 1971-04-13 | Nobilium Products Inc | Dental gold alloy |
| US3667936A (en) * | 1969-03-21 | 1972-06-06 | Aurium Research Corp | Dental alloy |
| US3892564A (en) * | 1972-10-03 | 1975-07-01 | Johnson Matthey Co Ltd | Dental alloys |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE542753A (en) * | 1954-12-16 | |||
| DE1187378B (en) * | 1961-05-18 | 1965-02-18 | Nobilium Products Inc | Precious metal alloy for dental purposes or for use in the jewelry industry |
| SU448239A1 (en) * | 1973-03-05 | 1974-10-30 | Московский Завод По Обрабоке Специальных Сплавов | Gold based alloy |
| GB1469856A (en) * | 1974-05-28 | 1977-04-06 | Johnson Matthey Co Ltd | Solder alloy |
-
1976
- 1976-05-14 US US05/686,347 patent/US4014690A/en not_active Expired - Lifetime
-
1977
- 1977-04-15 CA CA276,231A patent/CA1070984A/en not_active Expired
- 1977-05-05 CH CH565277A patent/CH620245A5/fr not_active IP Right Cessation
- 1977-05-05 DE DE2720493A patent/DE2720493C3/en not_active Expired
- 1977-05-06 SE SE7705321A patent/SE417166B/en unknown
- 1977-05-09 JP JP5300077A patent/JPS52138457A/en active Granted
- 1977-05-10 GB GB19618/77A patent/GB1536091A/en not_active Expired
- 1977-05-13 FR FR7714782A patent/FR2350918A1/en active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3134671A (en) * | 1961-05-18 | 1964-05-26 | Nobilium Products Inc | Noble metals alloy containing gallium |
| US3136634A (en) * | 1962-02-02 | 1964-06-09 | Degussa | Noble metal alloys having a high specific electric resistance |
| US3254279A (en) * | 1963-04-17 | 1966-05-31 | Cohn James | Composite alloy electric contact element |
| US3574610A (en) * | 1968-11-01 | 1971-04-13 | Nobilium Products Inc | Dental gold alloy |
| US3574611A (en) * | 1968-11-18 | 1971-04-13 | Nobilium Products Inc | High temperature dental gold alloy |
| US3667936A (en) * | 1969-03-21 | 1972-06-06 | Aurium Research Corp | Dental alloy |
| US3892564A (en) * | 1972-10-03 | 1975-07-01 | Johnson Matthey Co Ltd | Dental alloys |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4217137A (en) * | 1978-03-13 | 1980-08-12 | Medtronic, Inc. | Gold based alloy composition and brazing therewith, particularly for ceramic-metal seals in electrical feedthroughs |
| US4266973A (en) * | 1979-12-14 | 1981-05-12 | The J. M. Ney Company | Tarnish-resistant gold color alloy and dental restorations employing same |
| US5217685A (en) * | 1991-10-03 | 1993-06-08 | The Wilkinson Company | Abutment base alloy for jawbone mounted dental implants |
| US6342182B1 (en) * | 1998-12-14 | 2002-01-29 | Metalor Technologies International Sa | Nickel-free grey gold alloy |
| US6787102B2 (en) | 1998-12-14 | 2004-09-07 | Metalor Technologies International Sa | Nickel-free grey gold alloy |
| RU2477330C1 (en) * | 2012-03-07 | 2013-03-10 | Юлия Алексеевна Щепочкина | Gold-based alloy |
| WO2014071583A1 (en) * | 2012-11-08 | 2014-05-15 | Heraeus Ltd. | Nickel containing gold alloys having low nickel releasing rate, master alloys for obtaining them and use of metal elements therein |
| RU2507285C1 (en) * | 2013-03-13 | 2014-02-20 | Юлия Алексеевна Щепочкина | Alloy |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2720493B2 (en) | 1978-10-26 |
| JPS561189B2 (en) | 1981-01-12 |
| DE2720493A1 (en) | 1977-11-17 |
| JPS52138457A (en) | 1977-11-18 |
| SE417166B (en) | 1981-03-02 |
| CA1070984A (en) | 1980-02-05 |
| GB1536091A (en) | 1978-12-20 |
| FR2350918B1 (en) | 1980-10-24 |
| FR2350918A1 (en) | 1977-12-09 |
| SE7705321L (en) | 1977-11-15 |
| CH620245A5 (en) | 1980-11-14 |
| DE2720493C3 (en) | 1979-06-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: AUSTENAL INTERNATIONAL, INC., 5101 SOUTH KEELER AV Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:HOMEDICA, INC.;REEL/FRAME:004351/0080 Effective date: 19850703 |
|
| AS | Assignment |
Owner name: LAKE SHORE NATIONAL BANK Free format text: SECURITY INTEREST;ASSIGNOR:AUSTENAL, INC., A CORP. OF IL;REEL/FRAME:006231/0450 Effective date: 19920610 Owner name: AUSTENAL, INC., ILLINOIS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:NOBELPHARMA AB, A SWEDISH CORP.;REEL/FRAME:006188/0135 Effective date: 19920610 |
|
| AS | Assignment |
Owner name: NOBELPHARMA USA, INC., ILLINOIS Free format text: SECURITY INTEREST;ASSIGNOR:AUSTENAL, INC.;REEL/FRAME:006221/0498 Effective date: 19920610 |