US3087870A - Process for plating adherent lead dioxide - Google Patents

Process for plating adherent lead dioxide Download PDF

Info

Publication number
US3087870A
US3087870A US822715A US82271559A US3087870A US 3087870 A US3087870 A US 3087870A US 822715 A US822715 A US 822715A US 82271559 A US82271559 A US 82271559A US 3087870 A US3087870 A US 3087870A
Authority
US
United States
Prior art keywords
metal
lead dioxide
lead
plating
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US822715A
Inventor
Herman M Zimmerman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Union Carbide Corp
Original Assignee
Union Carbide Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Union Carbide Corp filed Critical Union Carbide Corp
Priority to US822715A priority Critical patent/US3087870A/en
Application granted granted Critical
Publication of US3087870A publication Critical patent/US3087870A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00Electrolytic coating other than with metals
    • C25D9/04Electrolytic coating other than with metals with inorganic materials
    • C25D9/06Electrolytic coating other than with metals with inorganic materials by anodic processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/14Electrodes for lead-acid accumulators
    • H01M4/16Processes of manufacture
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Definitions

  • lead dioxide was deposited anodically from aqueous acid solutions of lead nitrate onto base metals such as nickel, stainless steel, terneplate and platinum.
  • base metals such as nickel, stainless steel, terneplate and platinum.
  • the conditions for maximum adherence were unknown, however, and when a plated strip was blanked out in a punch press, the lead dioxide chipped or cracked unpredictably.
  • the main object of this invention is to provide a process for securely depositing lead dioxide onto a base metal.
  • Another object of the invention is to provide a novel process for making lead dioxide positive electrodes.
  • the process in accordance with the present invention and whereby the foregoing objects are attained comprises plating under conditions wherein the base metal, preferably nickel, is actively dissolved anodically, is then suddenly passivated and shifted over to lead dioxide deposition by momentarily applying a greater anode potential or :by lifting the metal strip while still electrically con nected almost entirely from the electrolysis bath, and then slowly replating, after which lead dioxide deposition is continued at a reduced current density.
  • the base metal preferably nickel
  • a modification of this process giving an equivalent product and being more readily susceptible to chemical control and maintenance comprises subjecting a chemically clean and acid-etched nickel or nickel-plated surface to a passivation treatment consisting of a cathodic step and an anodic step in a dilute nitric acid bath followed by the plating of lead dioxide on the metal from nearly neutral lead nitrate solution.
  • the base metal was nickel-clad steel. It was electrolytically cleaned in a proprietary alkaline bath and thoroughly rinsed. It was then anodically etched at about 25 amperes per square foot (a.s.f.) for about fifteen seconds in three percent hydrochloric acid and thoroughly rinsed. The following passivation treatment was performed in a three percent nitric acid bath. The cleaned and etched sample was soaked for about eight seconds, during which time it was made cathodic at about 20 a.s.f. if desired.
  • the cathodic phase of the passivation can be omitted.
  • the cathodic portion of the passivation is employed as insurance against deleterious oxide films previously formed.
  • a process for electrolytically depositing lead dioxide on a base metal comprising anodically dissolving a porn'on of said metal, passivating said metal in a dilute nitric acid bath by making said metal cathodic and then anodic, placing said metal in a warm, almost neutral lead nitrate bath, and plating lead dioxide anodically onto said metal using a low current density.
  • a process for electrolytically depositing lead dioxide on a base metal comprising electrolytically cleaning said metal in an alkaline bath, rinsing said cleaned metal, anodically etching said metal in a dilute hydrochloric acid bath, rinsing said metal, passivating said metal in a dilute nitric acid bath, by making said metal cathodic and then anodic, transferring said metal to a nearly neutral Warm lead nitrate bath, and plating lead dioxide anodically onto said metal using a low current density against lead cathodes.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

United States Patent 3,087,870 PROCESS FOR PLATHNG ADHERENT LEAD DEOXHDE Herman M. Zimmerman, Lakewood, Ohio, assignor to Union Carbide Corporation, a corporation of New York No Drawing. Filed June 22, 1959, Ser. No. 822,715 6 Claims. (Cl. 204--32) This invention relates to a process for plating adherent lead dioxide depolarizers on thin metal strips intended for use as the positive electrode in reserve-type batteries characterized by a high flash current and eificient perform ance at low temperatures.
Heretofore lead dioxide was deposited anodically from aqueous acid solutions of lead nitrate onto base metals such as nickel, stainless steel, terneplate and platinum. The conditions for maximum adherence were unknown, however, and when a plated strip was blanked out in a punch press, the lead dioxide chipped or cracked unpredictably.
The main object of this invention is to provide a process for securely depositing lead dioxide onto a base metal.
Another object of the invention is to provide a novel process for making lead dioxide positive electrodes.
The process in accordance with the present invention and whereby the foregoing objects are attained comprises plating under conditions wherein the base metal, preferably nickel, is actively dissolved anodically, is then suddenly passivated and shifted over to lead dioxide deposition by momentarily applying a greater anode potential or :by lifting the metal strip while still electrically con nected almost entirely from the electrolysis bath, and then slowly replating, after which lead dioxide deposition is continued at a reduced current density.
A modification of this process giving an equivalent product and being more readily susceptible to chemical control and maintenance comprises subjecting a chemically clean and acid-etched nickel or nickel-plated surface to a passivation treatment consisting of a cathodic step and an anodic step in a dilute nitric acid bath followed by the plating of lead dioxide on the metal from nearly neutral lead nitrate solution.
As an example of the practice of the invention, the following typical specification is given:
The base metal was nickel-clad steel. It was electrolytically cleaned in a proprietary alkaline bath and thoroughly rinsed. It was then anodically etched at about 25 amperes per square foot (a.s.f.) for about fifteen seconds in three percent hydrochloric acid and thoroughly rinsed. The following passivation treatment was performed in a three percent nitric acid bath. The cleaned and etched sample was soaked for about eight seconds, during which time it was made cathodic at about 20 a.s.f. if desired.
It was then made anodic at about 80 a.s.f. for about twelve seconds with copious evolution of oxygen from the surface. Anodic treatment was continued for 28 more seconds at 20 a.s.f. The passivated sample Was transferred to a nearly neutral lead nitrate bath (specific gravity 1.300, pH 4.0, temperature 50 C.) and lead 3,087,870 Patented Apr. 30, 1963 dioxide plated anodically at 35 a.s.f. to the thickness desired. Lead cathodes were employed. Additions of lead oxide (PbO) serve to maintain proper pH in this tank.
Relative to the passivation step it has been found that on continuous plating lines, particularly, the cathodic phase of the passivation can be omitted. In batch operations and particularly if for any reason the etch step is omitted, the cathodic portion of the passivation is employed as insurance against deleterious oxide films previously formed.
What is claimed is:
1. A process for electrolytically depositing lead dioxide on a base metal comprising anodically dissolving a porn'on of said metal, passivating said metal in a dilute nitric acid bath by making said metal cathodic and then anodic, placing said metal in a warm, almost neutral lead nitrate bath, and plating lead dioxide anodically onto said metal using a low current density.
2. The process of claim 1 wherein said base metal is nickel-clad steel.
3. A process for electrolytically depositing lead dioxide on a base metal comprising electrolytically cleaning said metal in an alkaline bath, rinsing said cleaned metal, anodically etching said metal in a dilute hydrochloric acid bath, rinsing said metal, passivating said metal in a dilute nitric acid bath, by making said metal cathodic and then anodic, transferring said metal to a nearly neutral Warm lead nitrate bath, and plating lead dioxide anodically onto said metal using a low current density against lead cathodes.
4. The process of claim 3, wherein said base metal is made cathodic for about eight seconds at about 20 amperes per square foot.
5. The process of claim 3 wherein said metal is made anodic for about twelve seconds at about amperes per square foot.
6. The process of claim 3, wherein said nitrate solution has a specific gravity of 1.300 and a pH of 4.
References Cited in the file of this patent UNITED STATES PATENTS 2,571,616 Ruben Oct. 16, 1951 2,711,496 Ruben June 21, 1955 2,846,378 Hoifman Aug. 5, 1958 2,851,405 Dyman et a1. Sept. 9, 1958 2,872,405 Miller et al. Feb. 3, 1959 2,915,444 Meyer Dec. 1, 1959 2,945,790 Grigger July 19, 1960 3,002,900 Henry et a1. Oct. 3, 1961 FOREIGN PATENTS 611,577 Great Britain Nov. 1, 1958 OTHER REFERENCES The Metal Industry (Haas et al.), volume 23, No. 11, November 1925, pages 451 and 452.
Plating (Brune et 211.), September 1955, pages 1127 and 1128.

Claims (1)

1. A PROCESS FOR ELECTROLYTICALLY DEPOSITING LEAD DIOXIDE ON A BASE METAL COMPRISING ANDICALLY DISSOLVING A PORTION OF SAID METAL, PASSIVATING SAID METAL IN A DILUTE NITRIC ACID BATH BY MAKING SAID METAL CATHODIC AND THEN ANODIC, PLACING SAID METAL IN A WARM, ALMOST NEUTRAL LEAD NITRATE BATH, AND PLATING LEAD DIOXIDE ANODICALLY ONTO SAID METAL USING A LOW CURRENT DENSITY.
US822715A 1959-06-22 1959-06-22 Process for plating adherent lead dioxide Expired - Lifetime US3087870A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US822715A US3087870A (en) 1959-06-22 1959-06-22 Process for plating adherent lead dioxide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US822715A US3087870A (en) 1959-06-22 1959-06-22 Process for plating adherent lead dioxide

Publications (1)

Publication Number Publication Date
US3087870A true US3087870A (en) 1963-04-30

Family

ID=25236767

Family Applications (1)

Application Number Title Priority Date Filing Date
US822715A Expired - Lifetime US3087870A (en) 1959-06-22 1959-06-22 Process for plating adherent lead dioxide

Country Status (1)

Country Link
US (1) US3087870A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3819414A (en) * 1972-10-02 1974-06-25 Gen Electric Storage battery and positive electrode therefor
FR2682817A1 (en) * 1991-10-22 1993-04-23 Gorodskoi Studenchesko Molodez Method of manufacture of an electrode for a lead accumulator and lead accumulator comprising such an electrode

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB611577A (en) *
US2571616A (en) * 1951-04-06 1951-10-16 Ruben Samuel Electric current producing cell
US2711496A (en) * 1952-09-27 1955-06-21 Ruben Samuel Lead peroxide rectifiers and method of making the same
US2846378A (en) * 1956-02-07 1958-08-05 American Potash & Chem Corp Electrode and its manufacture
US2851405A (en) * 1953-07-03 1958-09-09 Sylvania Electric Prod Titanate rectifiers
US2872405A (en) * 1955-12-14 1959-02-03 Pennsalt Chemicals Corp Lead dioxide electrode
US2915444A (en) * 1955-12-09 1959-12-01 Enthone Process for cleaning and plating ferrous metals
US2945790A (en) * 1955-12-14 1960-07-19 Pennsalt Chemicals Corp Method of electroplating lead dioxide
US3002900A (en) * 1949-10-07 1961-10-03 James W Henry Preparation of plates for deferred action type batteries

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB611577A (en) *
US3002900A (en) * 1949-10-07 1961-10-03 James W Henry Preparation of plates for deferred action type batteries
US2571616A (en) * 1951-04-06 1951-10-16 Ruben Samuel Electric current producing cell
US2711496A (en) * 1952-09-27 1955-06-21 Ruben Samuel Lead peroxide rectifiers and method of making the same
US2851405A (en) * 1953-07-03 1958-09-09 Sylvania Electric Prod Titanate rectifiers
US2915444A (en) * 1955-12-09 1959-12-01 Enthone Process for cleaning and plating ferrous metals
US2872405A (en) * 1955-12-14 1959-02-03 Pennsalt Chemicals Corp Lead dioxide electrode
US2945790A (en) * 1955-12-14 1960-07-19 Pennsalt Chemicals Corp Method of electroplating lead dioxide
US2846378A (en) * 1956-02-07 1958-08-05 American Potash & Chem Corp Electrode and its manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3819414A (en) * 1972-10-02 1974-06-25 Gen Electric Storage battery and positive electrode therefor
FR2682817A1 (en) * 1991-10-22 1993-04-23 Gorodskoi Studenchesko Molodez Method of manufacture of an electrode for a lead accumulator and lead accumulator comprising such an electrode

Similar Documents

Publication Publication Date Title
US3654099A (en) Cathodic activation of stainless steel
US2987453A (en) Method of electrodepositing chromium
US2814589A (en) Method of plating silicon
US2596307A (en) Process of electrostripping electrodeposited metals
US3492210A (en) Electrolytic stripping of nonferrous metals from a ferrous metal base
US3554881A (en) Electrochemical process for the surface treatment of titanium,alloys thereof and other analogous metals
US3203879A (en) Method for preparing positive electrodes
US3087870A (en) Process for plating adherent lead dioxide
US3257299A (en) Composition and method for electrolytic stripping of coatings from metals
US4925538A (en) Method of electrolytic treatment of metals
US2325660A (en) Electrodeposition of manganese and cathode therefor
US2578898A (en) Electrolytic removal of metallic coatings from various base metals
US3632490A (en) Method of electrolytic descaling and pickling
US2154027A (en) Electrolytic device and method of making same
JPS5825218A (en) Method of producing low voltage electrolytic condenser electrode foil
US2725353A (en) Electropolishing metallic articles
US3334029A (en) Process for selectively anodically dissolving copper from zirconium
US2456281A (en) Removing incrustations from lead anodes used for chromium plating
US1566984A (en) Electroplating method and electroplated articles
US2879210A (en) Process of electroplating on aluminum
US3006827A (en) Method of pickling titanium and compositions used therein
US3689385A (en) Method for the surface treatment of aluminum electrodes for the electrolytic production of zinc,and electrodes thus treated
US3320139A (en) Method for preparing negative electrodes
US3260660A (en) Electrolytic stripping of platings from aluminum and zinc articles
JPH0885894A (en) Electrode