US20230023699A1 - Test carrier and electronic component testing apparatus - Google Patents
Test carrier and electronic component testing apparatus Download PDFInfo
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- US20230023699A1 US20230023699A1 US17/681,039 US202217681039A US2023023699A1 US 20230023699 A1 US20230023699 A1 US 20230023699A1 US 202217681039 A US202217681039 A US 202217681039A US 2023023699 A1 US2023023699 A1 US 2023023699A1
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- test
- pusher
- flow passage
- dut
- carrier
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Definitions
- the present invention relates to a test carrier carried in a state of accommodating an electronic component to be tested (hereinafter simply referred to as a “device under test” (DUT) such as a semiconductor integrated circuit device at the time of testing the DUT, and an electronic component testing apparatus.
- DUT device under test
- An electronic component testing apparatus has a mechanism for heating and cooling the IC (Integrated Circuit) under test and performs a temperature load test of the IC under test (for example, see Patent Document 1).
- the above-mentioned electronic component testing apparatus directly blow hot air or cold air to the IC under test to adjust temperature of the IC under test.
- the above-mentioned testing apparatus performs the test of the DUT in a state of being accommodated in the test carrier, it is impossible to directly blow cold air to the DUT. That is, the test carrier behaves as thermal resistance. For this reason, the DUT may be damaged due to insufficient cooling of the DUT.
- One or more embodiments of the present invention provide a test carrier and an electronic component testing apparatus capable of improving the efficiency of adjustment of the DUT temperature.
- a test carrier is carried in a state of accommodating a device under test (DUT).
- the test carrier comprises a first flow passage through which fluid supplied from an outside of the test carrier flows.
- the first flow passage may comprise: a flow hole formed in the test carrier; a first connection hole communicated with a first end of the flow hole; a second connection hole communicated with a second end of the flow hole. Fluid is supplied to the flow hole from the first connection hole and exhausted from the second connection hole.
- the test carrier may further comprise: a carrier body holding the DUT; and a lid member (i.e., a lid) covering the DUT and detachably attaching to the carrier body.
- the flow hole may be formed in the lid member.
- the first connection hole and the second connection hole may be formed on the lid member.
- fluid may be supplied to the first flow passage from a pusher, and the pusher may press the test carrier to a socket of a test head.
- the first connection hole and the second connection hole may be disposed on the test carrier to face the pusher.
- the carrier body may comprise: contactors provided to correspond to terminals of the DUT; external terminals electrically connected to contactors; and a main body holding contactors and external terminals.
- the lid member may comprise a contact surface contacting the DUT.
- the DUT may be sandwiched between the contact surface and contactors.
- the test carrier may further comprise: a carrier body holding the DUT; and a lid member covering the DUT and detachably attaching to the carrier body.
- the flow hole may be formed in the carrier body, and the first connection hole and the second connection hole may be formed on the carrier body.
- a test head of the electronic component testing apparatus for testing the DUT may supply fluid to the first flow passage.
- the first connection hole and the second connection hole may be disposed at a position facing the test head in the test carrier.
- the first connection hole and the second connection hole may be disposed on the test carrier to face a socket of the test head.
- the carrier body may comprise: contactors provided to correspond to terminals of the DUT; external terminals electrically connected to contactors; and a main body holding contactors and external terminals.
- the lid member may comprise a contact surface.
- the DUT may be sandwiched between the contact surface and contactors.
- the test carrier may comprise the first connecting holes.
- the test carrier may include the second connecting holes.
- the test carrier may comprise the flow holes.
- An electronic component testing apparatus tests a DUT.
- the electronic component testing apparatus comprises: a test head comprising a socket; and a pusher pressing the above-mentioned test carrier to the socket.
- the pusher supplies fluid to the first flow passage.
- the pusher may comprise: a third connection hole communicated with the first flow passage with the pusher contacting the test carrier; a second flow passage communicated with the third connection hole. Fluid may be supplied to the first flow passage through the second flow passage with the pusher pressing the test carrier to the socket.
- the pusher may comprise a fourth connection hole detachably connected to the test head and receiving fluid from the test head.
- the fourth connection hole may be connected to the second flow passage. Fluid may be supplied to the first flow passage through the second flow passage from the test head with the pusher pressing the test carrier to the socket.
- the pusher may comprise a first connection pin capable of fitting into a first fitting hole.
- the first fitting hole may be formed on a socket guide of the test head.
- a part of the second flow passage may be formed in the first connection pin.
- the third connection hole may be formed on the first connection pin.
- the pusher may comprise: a fifth connection hole communicated with the first flow passage with the pusher contacting to the carrier; and a third flow passage communicated with the fifth connection hole. Fluid supplied to the first flow passage flows into the third flow passage with the pusher pressing the test carrier to the socket.
- the pusher may exhaust fluid supplied to the first flow passage to the outside of the pusher from the third flow passage.
- the pusher may further comprise a sixth connection hole detachably attaching the test head and exhausting fluid to the test head.
- the third flow passage may connect the fifth connection hole and the sixth connection hole. Fluid supplied to the first flow passage may be exhausted to the test head through the third flow passage.
- the pusher may comprise a second connection pin capable of fitting into a second fitting hole.
- the second fitting hole may be formed on a socket guide of the test head.
- a part of the third flow passage may be formed in the second connection pin.
- the sixth connection hole may be formed on the second connection pin.
- An electronic component testing apparatus for testing the DUT comprises: a test head comprising a socket; and a pusher pressing the above-mentioned test carrier to the socket.
- the test head supplies fluid to the first flow passage.
- the test head may supply fluid to the flow hole through the first connection hole. Fluid may be exhausted from the second connection hole to the test head.
- the test carrier includes a first flow passage through which a fluid supplied from the outside flows. Since fluid flows in the vicinity of the DUT accommodated in the test carrier, thermal resistance is reduced. Therefore, it is possible to improve the efficiency of adjustment of the DUT temperature.
- FIG. 1 is a schematic cross-sectional view showing an entire configuration of an electronic component testing apparatus in one or more embodiments of the present invention
- FIG. 2 is a perspective view of a test carrier in one or more embodiments of the present invention from above;
- FIG. 3 is a perspective view of a test carrier in one or more embodiments of the present invention from below;
- FIG. 4 is an exploded perspective view of a test carrier in one or more embodiments of the present invention.
- FIG. 5 is a cross-sectional view showing a test carrier in one or more embodiments of the present invention, is a diagram taken along the line V-V of FIG. 2 ;
- FIG. 6 is a sectional view showing a test carrier in one or more embodiments of the present invention, is a diagram taken along VI-VI of FIG. 2 ;
- FIG. 7 is an exploded cross-sectional view showing a test carrier in one or more embodiments of the present invention.
- FIG. 8 is a sectional view showing a pogo pin of the test carrier in one or more embodiments of the present invention, is an enlarged view of VIII portion of FIG. 7 ;
- FIG. 9 is an exploded sectional view showing a modification of the carrier body of the test carrier in one or more embodiments of the present invention.
- FIG. 10 is a cross-sectional view showing a state of testing by the electronic component testing apparatus in one or more embodiments of the present invention (Part 1), an enlarged sectional view showing the X portion of FIG. 1 .
- FIG. 11 is a cross-sectional view showing a state of test by the electronic component testing apparatus according to one or more embodiments of the present invention (Part 2);
- FIG. 12 is a diagram showing a first modification of the electronic component testing apparatus according to one or more embodiments of the present invention.
- FIG. 13 is a diagram showing a modification of the second modification and the test carrier of the electronic component testing apparatus in one or more embodiments of the present invention.
- FIG. 14 is a diagram showing a third modification of the electronic component testing apparatus in one or more embodiments of the present invention.
- FIG. 1 is a schematic cross-sectional view showing the overall configuration of the electronic component testing apparatus in one or more embodiments.
- An electronic component testing apparatus 100 in one or more embodiments is an apparatus for testing electrical properties of a DUT 90 .
- the electronic component testing apparatus 100 includes a handler 200 for pressing the DUT to the socket 320 .
- the handler 200 includes a positioning mechanism for mechanically positioning the DUT with respect to the socket 320 .
- the handler 200 doesn't include a high-precision positioning mechanism using image processing for the so-called fine pitch DUT.
- the DUT 90 in one or more embodiments is a die produced by dicing a semiconductor wafer.
- the DUT 90 has pads 91 with fine pitch. Therefore, when the electronic component testing apparatus 100 performs the test of the DUT 90 , the test carrier 1 is used.
- the DUT 90 when the semiconductor wafer is diced to form the DUT 90 , first, the DUT 90 is accommodated in the test carrier 1 using a carrier assembling apparatus (not illustrated). Then, the test carrier 1 accommodating the DUT 90 is carried to a test tray (not illustrated) for carrying the device. The test carrier 1 mounted on the test tray is pressed to the socket 320 of the test head 300 of the electronic component testing apparatus 100 to electrically connect the DUT 90 and the socket 320 via the test carrier 1 . Then, the test of the DUT 90 is executed. When this test is completed, the test carrier 1 is taken out from the test tray, the test carrier 1 is disassembled, and the DUT 90 is taken out. The test carrier 1 from which the DUT 90 is taken out is reused for testing of another DUT 90 .
- test tray a test tray used for existing packaged devices can be used.
- Such test tray includes a frame-shaped frame, inserts 600 held in the frame (described later).
- the inserts 600 of the test tray hold the carrier 1 .
- the outer shape of the insert 600 is made to match the outer shape of the existing device, it is possible to load and carry the test carrier 1 to the existing test tray by using the insert 600 .
- the test tray and the insert 600 for example, known test tray and insert described in WO 2003/075024 and WO 2009/069189 and the like can be used.
- test carrier 1 in one or more embodiments will be described below with FIGS. 2 to 7 .
- FIGS. 2 and 3 are perspective view showing the test carrier in one or more embodiments
- FIG. 4 is an exploded perspective view of the test carrier in one or more embodiments
- FIGS. 5 and 6 are a cross-sectional view showing the test carrier in one or more embodiments
- FIG. 7 is an exploded cross-sectional view showing the test carrier in one or more embodiments
- FIG. 8 is a cross-sectional view showing a pogo pin of the test carrier in one or more embodiments.
- the test carrier 1 in one or more embodiments includes a carrier body 10 for holding the DUT 90 and a lid member 60 which covers the DUT 90 and is detachably attached to the carrier body 10 .
- the test carrier 1 can accommodate the DUT 90 by sandwiching the DUT 90 between the carrier body 10 and the lid member 60 .
- the test carrier 1 basically has the same configurations as that of the carrier described in JP 2019-197012 A.
- the test carrier 1 corresponds to an example of “a test carrier” in one or more embodiments of the present invention.
- the carrier body 10 includes a main body 15 and a tubular body 40 attached to the main body 15 .
- the carrier body 10 corresponds to an example of “a carrier body” in one or more embodiments of the present invention.
- the main body 15 includes a holding plate 20 and an interposer 30 .
- the main body 15 holds pogo pins 21 (described later) and external terminals 32 (described later) to the carrier body 10 .
- the main body 15 corresponds to an example of “a main body” in one or more embodiments of the present invention.
- the holding plate 20 holds the pogo pins 21 .
- the pogo pins 21 are arranged in a pitch P 1 so as to face the pads 91 of the DUT 90 (refer to FIG. 4 ).
- Each pogo pin 21 as shown in FIG. 8 , includes a plunger 22 , a fixing portion 23 , a coil spring 24 .
- the pogo pins 21 corresponds to an example of “contactors” in one or more embodiments of the present invention.
- Each pogo pin 21 is disposed inside an each holding hole 20 a of the holding plate 20 .
- a flange 22 a of the plunger 22 is engaged with a step 20 b of the holding hole 20 a , whereby an upper limit position of the plunger 22 is restricted. At this upper limit position, a distal end of the plunger 22 protrudes from a hole 20 c on an upper side of the holding hole 20 a .
- the fixing portion 23 includes a rear end 23 a positioned in the opposite side hole 20 d of the holding hole 20 a and a shaft portion 23 b extending from the rear end 23 a toward the distal end (upward).
- the shaft portion 23 b is inserted into the coil spring 24 , and the coil spring 24 is interposed between the flange 22 a of the plunger 22 and the rear end 23 a of the fixing portion 23 .
- the plunger 22 comes into contact with the pad 91 of the DUT 90 , the plunger 22 presses the pad 91 by an elastic force of the coil spring 24 , and the DUT 90 is held by the pogo pin 21 .
- each of the holes 25 is disposed to face a bump 92 positioned at a corner among the plurality of bumps 92 arranged in the rectangular shape on a lower surface of the DUT 90 .
- the interposer 30 is stacked on the lower surface of the holding plate 20 and fixed to the holding plate 20 by thread fastening, etc. As illustrated in FIG. 4 to FIG. 6 , the interposer 30 includes internal terminals 31 , external terminals 32 , and wiring patterns 33 .
- the internal terminals 31 are provided on an upper surface of the interposer 30 .
- the internal terminals 31 are arranged at a pitch P 1 to face the pogo pins 21 held by the holding plate 20 , and the fixing portions 23 of the pogo pins 21 are in contact with the internal terminals 31 .
- the external terminals 32 are disposed on the lower surface of the interposer 30 , and are exposed to the outside of the test carrier 1 .
- the external terminals 32 are terminals that electrically connect contactors 321 (see FIGS. 10 to 12 ) of the socket 320 of the electronic component testing apparatus 100 during the test of the DUT 90 .
- the external terminals 32 are arranged with a pitch P 2 wider than the pitch P 1 of inner terminals 31 (see FIG. 3 ) (P 2 >P 1 ).
- the internal terminals 31 and the external terminals 32 are connected by wiring patterns 33 .
- the external terminals 32 corresponds to an example of “external terminals” in one or more embodiments of the present invention.
- the interposer 30 includes four holes 34 penetrating the interposer 30 .
- Each of holes 34 is disposed to be substantially coincident with the hole 25 of the holding plate 20 described above. Therefore, first through-holes 11 linearly penetrating the carrier body 10 are formed by the holes 25 and 34 .
- a part of the DUT 90 can be seen from the outside through the first through-holes 11 .
- the first through-holes 11 are used for positioning the DUT 90 with high accuracy with respect to the test carrier 1 during assembling the test carrier 1 .
- pogo pins 21 are used, but it may be used other than the pogo pins 21 as contactors.
- cantilever-type probe needles 21 B may be used as the contactors. This probe needle 21 B is mounted on the interposer 30 and is electrically connected to the inner terminal 31 of the interposer 30 .
- a contactor including an anisotropic conductive rubber sheet, a membrane type contactor having bumps formed on the insulating film may be used.
- the main body 15 includes the holding plate 20 for holding the pogo pins 21 .
- the main body 15 may include only the interposer 30 .
- the interposer 30 corresponds to an example of “a main body” in one or more embodiments of the present invention
- the probe needles 21 B correspond to an example of “contactors” in one or more embodiments of the present invention.
- the tubular body 40 is provided on the upper surface of the holding plate 20 and is fixed to the holding plate 20 by thread fastening, etc.
- the tubular body 40 has a rectangular tubular shape having an inner hole 41 larger than the outer shape of the DUT 90 and can surround a periphery of the DUT 90 held by the holding plate 20 .
- a recess 42 is formed on a side surface of the tubular body 40 to correspond to a latch 70 (described below) of the lid member 60 .
- the latch 70 is engaged with the recess 42 , whereby the lid member 60 is detachably attached to the carrier body 10 .
- the lid member 60 includes a plate-like main body 61 , a convex portion 62 protruding downward from the main body 61 in a convex shape, and a pair of latches 70 protruding downward from both ends of the main body 61 .
- the lid member 60 corresponds to an example of “a lid member” in one or more embodiments of the present invention.
- the convex portion 62 has a contact surface 621 which contacts the upper surface of the DUT 90 held by the holding plate 20 .
- the convex portion 62 presses the DUT 90 .
- a pressing amount of the DUT 90 by the pusher 62 is limited by the tubular body 40 of the carrier body 10 abutting against the main body 61 of the lid member 60 .
- a pressing force of the pogo pin 21 with respect to the pad 91 of the DUT 90 is set to an optimum value.
- the DUT 90 accommodated in the test carrier 1 is sandwiched between the pogo pins 21 and the convex portion 62 .
- the contact surface 621 of the convex portion 62 corresponds to an example of “a contact surface” in one or more embodiments of the present invention.
- a second through-hole 67 penetrating through the main body 61 and the convex portion 62 is formed substantially at a center of the main body 61 .
- the second through-hole 67 is used for sucking and holding the DUT 90 by the carrier assembling apparatus (not illustrated).
- the flow passages 63 are formed in the lid member 60 .
- Each flow passage 63 includes a supply hole (inlet) 64 , an exhaust hole (outlet) 65 , and a flow hole 66 .
- the flow passage 63 corresponds to an example of “a first flow passage” in one or more embodiments of the present invention.
- the supply hole 64 is provided on the upper surface of the lid member 60 and opens toward the upper portion of the lid member 60 .
- the supply hole 64 can communicate with the carrier connection hole 230 of the pusher 210 (described later) by the test carrier 1 contacting the pusher 210 of the handler 200 during the test of the DUT 90 . From the supply hole 64 , air enters into the test carrier 1 through the pusher 210 and circulates to the flow hole 66 .
- two supply hole 64 are formed on the lid member 60 .
- the supply hole 64 corresponds to an example of “a first connection hole” in one or more embodiments of the present invention.
- the exhaust hole 65 is disposed on the upper surface of the lid member 60 and opens toward the upper portion of the lid member 60 .
- the exhaust hole 65 can communicate with the carrier connection hole 240 of the pusher 210 (described later) by the test carrier 1 contacting the pusher 210 of the handler 200 during the test of the DUT 90 . From the exhaust hole 65 , air is exhausted to the outside of the test carrier 1 .
- two exhaust holes 65 are formed on the lid member 60 .
- the exhaust hole 65 corresponds to an example of “a second connection hole” in one or more embodiments of the present invention.
- the flow hole 66 is a hole formed in the main body 61 of the lid member 60 .
- One end of the flow hole 66 communicates with the supply hole 64
- the other end of the flow hole 66 communicates with the exhaust hole 65 . That is, the flow hole 66 is a flow passage embedded within the lid member 60 .
- Air supplied from the pusher 210 of the handler 200 performs heat exchange with the DUT 90 accommodated in the test carrier 1 by passing through the flow hole 66 . Thereby the DUT 90 is cooled.
- one of the flow holes 66 connects one of the supply holes 64 and one of the exhaust holes 65 , and two flow holes are formed in the lid member 60 .
- the flow hole 66 corresponds to an example of “a flow hole” in one or more embodiments of the present invention.
- the number of the supply hole 64 and the exhaust hole 65 is not particularly limited thereto. Further, the number of the supply hole 64 may be different from the number of the exhaust hole 65 .
- the flow hole 66 is formed inside the main body 61 of the lid member 60 , the arrangement of the flow hole 66 is not particularly limited thereto.
- the flow hole 66 may be formed over the inside of the main body 61 and the inside of the convex portion 62 . If the flow hole 66 is formed inside the convex portion 62 in contact with the DUT 90 , since the air circulates in the vicinity of the DUT 90 , it is possible to cool the DUT 90 more efficiently.
- the configuration of the flow hole 66 is not particularly limited thereto.
- supply holes 64 and exhaust holes 65 may be communicated.
- the flow hole 66 connected to one supply hole 64 may be branched in the middle and may be connected to the exhaust holes 65 .
- the flow hole 66 connected to the supply holes 64 may merges and be connected to one exhaust hole 65 .
- the size of the inside of the flow hole 66 is not particularly limited.
- the flow hole 66 may be a linear through-hole having an inner diameter comparable to the inner diameter of the supply hole 64 and the exhaust hole 65 .
- the flow hole 66 may be a space having a large width several times the inner diameter of the supply hole 64 and the exhaust hole 65 .
- the flow hole 66 is extended in a straight line, the shape of the flow hole 66 is not particularly limited thereto.
- the flow hole 66 may have a serpentine shape.
- protrusions such as fins may be formed in the flow hole 66 .
- the latches 70 are rotatably supported by shafts 71 at both ends of the main body 61 , and each of the latches extends downward. Each of the latches 70 is urged inward by a spring (not particularly illustrated). A claw 72 protruding inward is provided at a distal end of each of the latches 70 .
- the lid member 60 is attached to the carrier body 10 by the claw 72 engaged with the recess 42 of the carrier body 10 .
- test carrier 1 described above is assembled by the method described in JP 2019-197012 A using an assembly apparatus having an image processing apparatus.
- FIG. 10 is a cross-sectional view showing a state of testing by the electronic component testing apparatus in one or more embodiments (No. 1), and is an enlarged sectional view showing the X portion of FIG. 1 .
- FIG. 11 is a cross-sectional view showing a state of testing by the electronic component testing apparatus in one or more embodiments (No. 2).
- the electronic component testing apparatus 100 in one or more embodiments includes a handler 200 , a test head 300 , a tester 400 , and a supply device 500 . As described above, the electronic component testing apparatus 100 executes the test of the DUT 90 . In this time, the DUT 90 is accommodated the DUT 90 in the test carrier 1 .
- Handler 200 includes a Z-axis drive unit 201 and a pusher 210 .
- the Z-axis drive unit 201 includes an actuator for vertical drive (not illustrated), the z-axis drive unit 201 can move in the vertical direction.
- the handler 200 includes pushers 210 corresponding to test carriers 1 mounted on the test tray, the pushers 210 are attached to single Z-axis drive unit 201 .
- the pusher 210 attached to the Z-axis drive unit 201 contacts the test carrier 1 by the Z-axis drive unit 201 lowering, and the pusher 210 presses the test carrier 1 to the socket 320 (described later) of the test head 300 .
- the pusher 210 corresponds to an example of “a pusher” in one or more embodiments of the present invention.
- the pusher 210 is inserted into the through-hole 203 formed in a match plate 202 , is held in floating state (a state in which relative movement to the vertical is allowed) by the match plate 202 .
- the pusher 210 includes a main body 215 , a first connection pin 220 , a carrier connection holes 230 , 240 , and a vent passages 250 , 260 .
- the first connecting pin 220 extends downward from the main body 215 of the pusher 210 .
- the shape of the lower end of the first connecting pin 220 is narrower toward the lower.
- the first connecting pin 220 penetrates the through-hole 601 of the insert 600 placed on the test head 300 with the lowering of the pusher 210 , the first connecting pin 220 is detachably fitted into the first fitting hole 331 (described later) of the socket guide 330 (described later).
- the test carrier 1 held in the insert 600 is positioned with respect to the socket 320 .
- the first connection pin 220 corresponds to an example of “a first connection pin” in one or more embodiments of the present invention.
- a part of the ventilation passage 250 is formed inside the first connection pin 220 , a hole 221 is formed at the tip of the first connection pin 220 .
- the pusher goes down, the lower end of the first connection pin 220 is communicated with the first fitting hole 331 of the socket guide 330 .
- the ventilation passage 250 communicates with the ventilation passage 332 (described later) inside the socket guide 330 . This allows air supplied from the socket guide 330 of the test head 300 to flow through the ventilation passage 250 .
- the hole 221 of the first connection pin 220 corresponds to an example of “a fourth connection hole” in one or more embodiments of the present invention.
- Carrier connection holes 230 are formed on the lower portion of the main body 215 of the pusher 210 .
- the carrier connection hole 230 corresponds to the supply hole 64 of the test carrier 1 .
- the carrier connection hole 230 communicates with the supply hole 64 of the test carrier 1 with the pusher 210 going down and contacting to the test carrier 1 .
- the carrier connection hole 230 corresponds to an example of “a third connection hole” in one or more embodiments of the present invention.
- the carrier connection holes 240 also is formed on the lower portion of the main body 215 of the pusher 210 .
- the carrier connection hole 240 corresponds to the exhaust hole 65 of the test carrier 1 .
- the carrier connection hole 240 communicates with the exhaust hole 65 with the pusher 210 going down and contacting the test carrier 1 .
- the carrier connection hole 240 corresponds to an example of “a fifth connection hole” in one or more embodiments of the present invention.
- the ventilation passage 250 as described above, a portion thereof is formed inside the first connection pin 220 , the other portion is formed inside the main body 215 of the pusher 210 .
- One end of the ventilation passage 250 communicates with the ventilation passage 332 of the socket guide 330 with the first connecting pin 220 connecting to the socket guide 330 during testing of the DUT 90 .
- the other end of the ventilation passage 250 is communicates with the carrier connection hole 230 . Air supplied from the socket guide 330 is supplied to the test carrier 1 through the ventilation passage 250 .
- the ventilation passage 250 corresponds to an example of “a second flow passage” in one or more embodiments of the present invention.
- the ventilation passage 260 is disposed inside the main body 215 of the pusher 210 , one end of the ventilation passage 260 communicates with the carrier connection hole 240 , the other end of the ventilation passage 260 communicates with the outside of the pusher 210 .
- the carrier connection hole 240 communicates with the exhaust hole 65 of the test carrier 1 with the pusher 210 going down and contacting the test carrier 1 .
- air exhausted from the test carrier 1 is exhausted to the outside of the pusher 210 through the ventilation passage 260 .
- the ventilation passage 260 corresponds to an example of “a third flow passage” in one or more embodiments of the present invention.
- the test head 300 includes a main body 310 , a socket 320 , and a socket guide 330 .
- the main body 310 is connected to the tester 400 via a cable 401 , and sends a test signal to the DUT 90 during the test of the DUT 90 .
- the pin electronics card which is electrically connected to the socket 320 is housed in the main body 310 .
- the socket 320 is disposed on the main body 310 .
- the socket 320 includes contactors 321 disposed so as to correspond to the external terminals 32 of the test carrier 1 .
- Pogo pin or anisotropic conductive rubber sheet can be used as the contactor 321 , but the contactor 321 is not limited thereto.
- the test carrier 1 held by the insert 600 of the test tray is pressed to the socket 320 by the pusher 210 , the external terminals 32 of the test carrier 1 contact to the contactors 321 of the socket 320 , and the DUT 90 and the socket 320 is electrically connected via the test carrier 1 .
- the test signal is sent from the main body 310 to the DUT 90 through the socket 320 .
- the socket guide 330 is disposed around the socket 320 .
- the socket guide 330 includes a first fitting hole 331 and a ventilation passage 332 .
- the socket guide 330 positions the test carrier 1 with respect to the socket 320 .
- the socket guide 330 also positions the pusher 210 with respect to the socket 320 .
- the first fitting hole 331 is disposed on the upper surface of the socket guide 330 and disposed at a position corresponding to the first connection pin 220 .
- the first fitting hole 331 has a shape that fits the first connection pin 220 .
- This first fitting hole 331 opens upward.
- the first fitting hole 331 corresponds to an example of “a first fitting hole” in one or more embodiments of the present invention.
- the ventilation passage 332 is formed in the socket guide 330 .
- One end of the ventilation passage 332 communicates with the first fitting hole 331 .
- the other end of the ventilation passage 332 also communicates with the supply passage 501 .
- the first connection pin 220 is fitted into the first fitting hole 331 , the ventilation passage 250 communicates with the ventilation passage 332 .
- a supply device 500 although not illustrated in particular, includes a pump for supplying air, a valve for adjusting the flow rate, and a temperature controller for adjusting the temperature of the air. As illustrated in FIGS. 1 , 10 and 11 , the supply device 500 communicates with the ventilation passage 332 of the socket guide 330 through a supply passage 501 . The supply device adjusts a temperature of air to an appropriate temperature according to the conditions of the test. The supply device supplies the temperature adjusted air to the socket guide 330 . In one or more embodiments, the supply device 500 is disposed inside the handler 200 , but it is not particularly limited thereto, the supply device 500 may be disposed inside the test head 300 or the like.
- the insert 600 of the test tray accommodates the test carrier 1 accommodating the DUT 90 .
- the test carrier 1 is transferred to the test tray from the customer tray (not shown) with the pick-and-place device provided in the handler 200 , the test carrier 1 is accommodated in the insert 600 of the test tray.
- the customer tray is a tray to be transported to the handler 200 from the pre-process, the test carrier 1 is assembled by the method described in JP 2019-197012A, then the test carrier 1 is accommodated in the customer tray.
- the transport apparatus of the handler 200 transfers the test tray to a position facing the test head 300 .
- the Z-axis drive unit 201 is driven, the pusher 210 goes down, the pusher 210 presses the test carrier 1 held in the insert 600 of the test tray.
- the first connecting pin 220 penetrates the through-hole 601 of the insert 600 , fitting to the first fitting hole 331 of the socket guide 330 .
- the test carrier 1 held in the insert 600 is positioned with respect to the socket 320 .
- the ventilation passage 250 formed in the first connection pin 220 of the pusher 210 and the ventilation passage 332 formed in the socket guide 330 are communicated with.
- the pusher 210 presses the test carrier 1 to the socket 320 , the external terminals 32 of the test carrier 1 contact the contactors 321 of the socket 320 . Further, the carrier connection hole 230 of the pusher 210 is communicated with the supply hole 64 , the carrier connection hole 240 is communicated with the exhaust hole 65 of the test carrier 1 .
- the valve of the supply device 500 is opened and the supply device 500 starts to supply air. Air is supplied to the flow hole 66 from the supply hole 64 of the test carrier 1 through the supply passage 501 , the ventilation passage 332 of the socket guide 330 , the ventilation passage 250 of the pusher 210 .
- the test signal outputted from the tester 400 is sent to the DUT 90 through the contactors 321 of the socket 320 , the test of the DUT 90 is performed.
- the DUT 90 When the DUT 90 is applied electricity, the DUT 90 generates heat (self-heating). Air supplied to the flow hole 66 absorbs heat generated by the DUT 90 to cool the DUT 90 . Air passing through the flow hole 66 of the test carrier 1 enters the ventilation passage 260 from the exhaust hole 65 and the carrier connection hole 240 , is exhausted to the outside (for example, the interior of the chamber) of the pusher 210 .
- the pusher 210 is moved upward by the Z-axis drive unit 201 , the test tray (not illustrated) holding the insert 600 accommodating the test carrier 1 is moved upward.
- the test tray is removed from the position facing the test head 300 by the carry apparatus of the handler 200 , then the test carrier 1 is transferred to the customer tray from the test tray by the pick-and-place device.
- the DUT 90 is taken out by disassembling the test carrier 1 . The process of testing the DUT 90 is completed.
- the DUT 90 is accommodated in the test carrier 1 , the test of DUT 90 is performed while the DUT 90 is sealed in the inner space of the test carrier 1 . Therefore, devices or bare dies that require a high level of cleanliness (Class 5-6/Class 100-1000) in the handling environment can be tested using a handler in a lower cleanliness environment (Class 7/Class 10000).
- FIGS. 12 to 14 are diagrams showing a modification of the electronic component testing apparatus according to one or more embodiments.
- the pusher 210 includes a second connection pin 270 in addition to the first connection pin 220 , the hole 271 is formed at the tip of the second connection pin 270 , air can be exhausted to the outside of the test head 300 via the socket guide 330 .
- the second connection pin 270 passes through the through-hole 602 formed in the insert 600 and is fitted to the second fitting hole 333 formed in the test head 300 .
- a portion of the ventilation passage 260 in communication with the carrier connection hole 240 is formed inside the second connection pin 270 .
- the first connection pin 220 is fitted to the first fitting hole 331
- the second connection pin 270 is fitted to the second fitting hole 333 .
- air supplied from the supply device 500 is exhausted from the ventilation passage 334 to the outside of the test head 300 through the ventilation passage 250 , the flow hole 66 , and the ventilation passage 260 .
- the second connection pin 270 corresponds to an example of “a second connection pin” in one or more embodiments of the present invention
- the hole 271 of the second connection pin 270 corresponds to an example of “a sixth connection hole” in one or more embodiments of the present invention
- the second fitting hole 333 corresponds to an example of “a second fitting hole” in one or more embodiments of the present invention.
- the flow passage 63 is formed in the lid member 60 of the test carrier 1 , it is not particularly limited thereto.
- the flow passage 63 ′ may be formed in the carrier body 10 .
- the flow passage 63 ′ is formed in the interposer 30 .
- the supply hole 64 ′ and the exhaust hole 65 ′ is formed on the lower surface of the interposer 30
- the flow hole 66 ′ is formed inside the interposer 30 .
- the ventilation passage 322 that communicates with the ventilation passage 332 of the socket guide 330 and the flow hole 66 ′ of the interposer 30 is formed.
- the vent passage 323 communicating with the vent passage 334 of the socket guide 330 and the flow hole 66 ′ of the interposer 30 is formed. Air supplied from the supply device 500 is exhausted to the outside of the test head 300 through the ventilation passage 332 , the ventilation passage 322 , the flow passage 63 ′, the ventilation passage 323 , and the ventilation passage 334 .
- the flow passage 63 ′ is not particularly limited as far as it is formed in the main body 15 of the carrier body 10 .
- the flow passage 63 ′ may be formed only on the holding plate 20 .
- the flow passage 63 ′ may be formed on both the holding plate 20 and the interposer 30 .
- the ventilation passage is not formed in the pusher 210 , the pusher 210 doesn't include the connection pin having the ventilation passage. Therefore, it is possible to simplify the structure of the pusher 210 .
- the test carrier 1 includes both of a flow passage 63 formed in the lid member 60 and the flow passage 63 ′ formed in the carrier body 10 .
- air is supplied from the test head 300 to the test carrier 1 through the pusher 210 , but is not particularly limited thereto.
- the pusher 210 doesn't include a connection pin 220
- the ventilation passage 250 may be formed only in the main body 215 of the pusher 210 .
- the ventilation passage 250 is connected to the supply device disposed outside the pusher 210 .
- air supplied from the supply device is supplied from the pusher 210 to the test carrier 1 without passing through the test head 300 .
- the die is exemplified as a specific example of the DUT 90 , but the present invention is not particularly limited thereto.
- the DUT 90 may be a packaged device.
- the DUT 90 in the above-described embodiments is a memory-based device but is not particularly limited thereto.
- the DUT 90 may be SoCs (System on a chip) or logic-based devices.
- the electronic component testing apparatus 100 in the above-described embodiments has a handler 200 of the type that presses the DUT 90 to the socket 320 while holding the DUT 90 in the test tray
- the configuration of the handler 200 is not particularly limited thereto.
- the handler 200 may be a type of handler that presses the DUT against a socket by an arm that sucks and holds the DUT.
- the test carrier 1 may include the supply hole 64 and the exhaust hole 65 , and the pusher 210 may also include a carrier connection holes 230 , 240 , it is not particularly limited thereto.
- the pusher 210 may include a connecting tube, the test carrier may include a supply hole where the connecting tube can be fitted.
- the test carrier 1 may include a connecting tube, the pusher 210 may include the fitting hole where the connection pin can be fitted.
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Abstract
A test carrier that accommodates a DUT and includes a first flow passage through which fluid supplied from an outside of the test carrier flows.
Description
- The present application claims priority from Japanese Patent Application No. 2021-120855 filed on Jul. 21, 2021, the contents of which are incorporated herein by reference in their entirety.
- The present invention relates to a test carrier carried in a state of accommodating an electronic component to be tested (hereinafter simply referred to as a “device under test” (DUT) such as a semiconductor integrated circuit device at the time of testing the DUT, and an electronic component testing apparatus.
- An electronic component testing apparatus has a mechanism for heating and cooling the IC (Integrated Circuit) under test and performs a temperature load test of the IC under test (for example, see Patent Document 1).
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- Patent Document 1: JP 2000-162268 A
- The above-mentioned electronic component testing apparatus directly blow hot air or cold air to the IC under test to adjust temperature of the IC under test. When the above-mentioned testing apparatus performs the test of the DUT in a state of being accommodated in the test carrier, it is impossible to directly blow cold air to the DUT. That is, the test carrier behaves as thermal resistance. For this reason, the DUT may be damaged due to insufficient cooling of the DUT.
- One or more embodiments of the present invention provide a test carrier and an electronic component testing apparatus capable of improving the efficiency of adjustment of the DUT temperature.
- [1] A test carrier according to one or more embodiments of the present invention is carried in a state of accommodating a device under test (DUT). The test carrier comprises a first flow passage through which fluid supplied from an outside of the test carrier flows.
- [2] In the above embodiments, the first flow passage may comprise: a flow hole formed in the test carrier; a first connection hole communicated with a first end of the flow hole; a second connection hole communicated with a second end of the flow hole. Fluid is supplied to the flow hole from the first connection hole and exhausted from the second connection hole.
- [3] In the above embodiments, the test carrier may further comprise: a carrier body holding the DUT; and a lid member (i.e., a lid) covering the DUT and detachably attaching to the carrier body. The flow hole may be formed in the lid member. The first connection hole and the second connection hole may be formed on the lid member.
- [4] In the above embodiments, fluid may be supplied to the first flow passage from a pusher, and the pusher may press the test carrier to a socket of a test head.
- [5] In the above embodiments, the first connection hole and the second connection hole may be disposed on the test carrier to face the pusher.
- [6] In the above embodiments, the carrier body may comprise: contactors provided to correspond to terminals of the DUT; external terminals electrically connected to contactors; and a main body holding contactors and external terminals.
- [7] In the above embodiments, the lid member may comprise a contact surface contacting the DUT. The DUT may be sandwiched between the contact surface and contactors.
- [8] In the above embodiments, the test carrier may further comprise: a carrier body holding the DUT; and a lid member covering the DUT and detachably attaching to the carrier body. The flow hole may be formed in the carrier body, and the first connection hole and the second connection hole may be formed on the carrier body.
- [9] In the above embodiments, a test head of the electronic component testing apparatus for testing the DUT may supply fluid to the first flow passage.
- [10] In the above embodiments, the first connection hole and the second connection hole may be disposed at a position facing the test head in the test carrier.
- [11] In the above embodiments, the first connection hole and the second connection hole may be disposed on the test carrier to face a socket of the test head.
- [12] In the above embodiments, the carrier body may comprise: contactors provided to correspond to terminals of the DUT; external terminals electrically connected to contactors; and a main body holding contactors and external terminals.
- [13] In the above embodiments, the lid member may comprise a contact surface. The DUT may be sandwiched between the contact surface and contactors.
- [14] In the above embodiments, the test carrier may comprise the first connecting holes.
- [15] In the above embodiments, the test carrier may include the second connecting holes.
- [16] In the above embodiments, the test carrier may comprise the flow holes.
- [17] An electronic component testing apparatus according to one or more embodiments of the present invention tests a DUT. The electronic component testing apparatus comprises: a test head comprising a socket; and a pusher pressing the above-mentioned test carrier to the socket. The pusher supplies fluid to the first flow passage.
- [18] In the above embodiments, the pusher may comprise: a third connection hole communicated with the first flow passage with the pusher contacting the test carrier; a second flow passage communicated with the third connection hole. Fluid may be supplied to the first flow passage through the second flow passage with the pusher pressing the test carrier to the socket.
- [19] In the above embodiments, the pusher may comprise a fourth connection hole detachably connected to the test head and receiving fluid from the test head. The fourth connection hole may be connected to the second flow passage. Fluid may be supplied to the first flow passage through the second flow passage from the test head with the pusher pressing the test carrier to the socket.
- [20] In the above embodiments, the pusher may comprise a first connection pin capable of fitting into a first fitting hole. The first fitting hole may be formed on a socket guide of the test head. A part of the second flow passage may be formed in the first connection pin. The third connection hole may be formed on the first connection pin.
- [21] In the above embodiments, the pusher may comprise: a fifth connection hole communicated with the first flow passage with the pusher contacting to the carrier; and a third flow passage communicated with the fifth connection hole. Fluid supplied to the first flow passage flows into the third flow passage with the pusher pressing the test carrier to the socket.
- [22] In the above embodiments, the pusher may exhaust fluid supplied to the first flow passage to the outside of the pusher from the third flow passage.
- [23] In the above embodiments, the pusher may further comprise a sixth connection hole detachably attaching the test head and exhausting fluid to the test head. The third flow passage may connect the fifth connection hole and the sixth connection hole. Fluid supplied to the first flow passage may be exhausted to the test head through the third flow passage.
- [24] In the above embodiments, the pusher may comprise a second connection pin capable of fitting into a second fitting hole. The second fitting hole may be formed on a socket guide of the test head. A part of the third flow passage may be formed in the second connection pin. The sixth connection hole may be formed on the second connection pin.
- [25] An electronic component testing apparatus for testing the DUT according to one or more embodiments of the present invention, comprises: a test head comprising a socket; and a pusher pressing the above-mentioned test carrier to the socket. The test head supplies fluid to the first flow passage.
- [26] In the above embodiments, the test head may supply fluid to the flow hole through the first connection hole. Fluid may be exhausted from the second connection hole to the test head.
- The test carrier according to one or more embodiments of the present invention includes a first flow passage through which a fluid supplied from the outside flows. Since fluid flows in the vicinity of the DUT accommodated in the test carrier, thermal resistance is reduced. Therefore, it is possible to improve the efficiency of adjustment of the DUT temperature.
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FIG. 1 is a schematic cross-sectional view showing an entire configuration of an electronic component testing apparatus in one or more embodiments of the present invention; -
FIG. 2 is a perspective view of a test carrier in one or more embodiments of the present invention from above; -
FIG. 3 is a perspective view of a test carrier in one or more embodiments of the present invention from below; -
FIG. 4 is an exploded perspective view of a test carrier in one or more embodiments of the present invention; -
FIG. 5 is a cross-sectional view showing a test carrier in one or more embodiments of the present invention, is a diagram taken along the line V-V ofFIG. 2 ; -
FIG. 6 is a sectional view showing a test carrier in one or more embodiments of the present invention, is a diagram taken along VI-VI ofFIG. 2 ; -
FIG. 7 is an exploded cross-sectional view showing a test carrier in one or more embodiments of the present invention; -
FIG. 8 is a sectional view showing a pogo pin of the test carrier in one or more embodiments of the present invention, is an enlarged view of VIII portion ofFIG. 7 ; -
FIG. 9 is an exploded sectional view showing a modification of the carrier body of the test carrier in one or more embodiments of the present invention; -
FIG. 10 is a cross-sectional view showing a state of testing by the electronic component testing apparatus in one or more embodiments of the present invention (Part 1), an enlarged sectional view showing the X portion ofFIG. 1 . -
FIG. 11 is a cross-sectional view showing a state of test by the electronic component testing apparatus according to one or more embodiments of the present invention (Part 2); -
FIG. 12 is a diagram showing a first modification of the electronic component testing apparatus according to one or more embodiments of the present invention; -
FIG. 13 is a diagram showing a modification of the second modification and the test carrier of the electronic component testing apparatus in one or more embodiments of the present invention; and -
FIG. 14 is a diagram showing a third modification of the electronic component testing apparatus in one or more embodiments of the present invention. - Hereinafter, embodiments of the present invention will be described with reference to the drawings.
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FIG. 1 is a schematic cross-sectional view showing the overall configuration of the electronic component testing apparatus in one or more embodiments. - An electronic
component testing apparatus 100 in one or more embodiments is an apparatus for testing electrical properties of aDUT 90. The electroniccomponent testing apparatus 100 includes ahandler 200 for pressing the DUT to thesocket 320. Thehandler 200 includes a positioning mechanism for mechanically positioning the DUT with respect to thesocket 320. Thehandler 200 doesn't include a high-precision positioning mechanism using image processing for the so-called fine pitch DUT. On the other hand, theDUT 90 in one or more embodiments is a die produced by dicing a semiconductor wafer. TheDUT 90 haspads 91 with fine pitch. Therefore, when the electroniccomponent testing apparatus 100 performs the test of theDUT 90, thetest carrier 1 is used. - In one or more embodiments, when the semiconductor wafer is diced to form the
DUT 90, first, theDUT 90 is accommodated in thetest carrier 1 using a carrier assembling apparatus (not illustrated). Then, thetest carrier 1 accommodating theDUT 90 is carried to a test tray (not illustrated) for carrying the device. Thetest carrier 1 mounted on the test tray is pressed to thesocket 320 of thetest head 300 of the electroniccomponent testing apparatus 100 to electrically connect theDUT 90 and thesocket 320 via thetest carrier 1. Then, the test of theDUT 90 is executed. When this test is completed, thetest carrier 1 is taken out from the test tray, thetest carrier 1 is disassembled, and theDUT 90 is taken out. Thetest carrier 1 from which theDUT 90 is taken out is reused for testing of anotherDUT 90. - As this test tray, a test tray used for existing packaged devices can be used. Such test tray includes a frame-shaped frame, inserts 600 held in the frame (described later). The
inserts 600 of the test tray hold thecarrier 1. The outer shape of theinsert 600 is made to match the outer shape of the existing device, it is possible to load and carry thetest carrier 1 to the existing test tray by using theinsert 600. As the test tray and theinsert 600, for example, known test tray and insert described in WO 2003/075024 and WO 2009/069189 and the like can be used. - Next, the configuration of the
test carrier 1 in one or more embodiments will be described below withFIGS. 2 to 7 . -
FIGS. 2 and 3 are perspective view showing the test carrier in one or more embodiments,FIG. 4 is an exploded perspective view of the test carrier in one or more embodiments,FIGS. 5 and 6 are a cross-sectional view showing the test carrier in one or more embodiments,FIG. 7 is an exploded cross-sectional view showing the test carrier in one or more embodiments,FIG. 8 is a cross-sectional view showing a pogo pin of the test carrier in one or more embodiments. - As shown in
FIGS. 2 to 7 , thetest carrier 1 in one or more embodiments includes acarrier body 10 for holding theDUT 90 and alid member 60 which covers theDUT 90 and is detachably attached to thecarrier body 10. Thetest carrier 1 can accommodate theDUT 90 by sandwiching theDUT 90 between thecarrier body 10 and thelid member 60. Thetest carrier 1 basically has the same configurations as that of the carrier described in JP 2019-197012 A. Thetest carrier 1 corresponds to an example of “a test carrier” in one or more embodiments of the present invention. - The
carrier body 10 includes amain body 15 and atubular body 40 attached to themain body 15. Thecarrier body 10 corresponds to an example of “a carrier body” in one or more embodiments of the present invention. - The
main body 15 includes a holdingplate 20 and aninterposer 30. Themain body 15 holds pogo pins 21 (described later) and external terminals 32 (described later) to thecarrier body 10. Themain body 15 corresponds to an example of “a main body” in one or more embodiments of the present invention. - The holding
plate 20 holds the pogo pins 21. The pogo pins 21 are arranged in a pitch P1 so as to face thepads 91 of the DUT 90 (refer toFIG. 4 ). Eachpogo pin 21, as shown inFIG. 8 , includes aplunger 22, a fixingportion 23, acoil spring 24. The pogo pins 21 corresponds to an example of “contactors” in one or more embodiments of the present invention. - Each
pogo pin 21 is disposed inside an each holdinghole 20 a of the holdingplate 20. A flange 22 a of theplunger 22 is engaged with astep 20 b of the holdinghole 20 a, whereby an upper limit position of theplunger 22 is restricted. At this upper limit position, a distal end of theplunger 22 protrudes from ahole 20 c on an upper side of the holdinghole 20 a. The fixingportion 23 includes arear end 23 a positioned in theopposite side hole 20 d of the holdinghole 20 a and ashaft portion 23 b extending from therear end 23 a toward the distal end (upward). Theshaft portion 23 b is inserted into thecoil spring 24, and thecoil spring 24 is interposed between the flange 22 a of theplunger 22 and therear end 23 a of the fixingportion 23. When theDUT 90 is accommodated in thetest carrier 1, theplunger 22 comes into contact with thepad 91 of theDUT 90, theplunger 22 presses thepad 91 by an elastic force of thecoil spring 24, and theDUT 90 is held by thepogo pin 21. - In addition, four
holes 25 penetrating the holdingplate 20 are formed in the holding plate 20 (seeFIG. 5 ). Each of theholes 25 is disposed to face abump 92 positioned at a corner among the plurality ofbumps 92 arranged in the rectangular shape on a lower surface of theDUT 90. - The
interposer 30 is stacked on the lower surface of the holdingplate 20 and fixed to the holdingplate 20 by thread fastening, etc. As illustrated inFIG. 4 toFIG. 6 , theinterposer 30 includesinternal terminals 31,external terminals 32, andwiring patterns 33. - The
internal terminals 31 are provided on an upper surface of theinterposer 30. Theinternal terminals 31 are arranged at a pitch P1 to face the pogo pins 21 held by the holdingplate 20, and the fixingportions 23 of the pogo pins 21 are in contact with theinternal terminals 31. - The
external terminals 32 are disposed on the lower surface of theinterposer 30, and are exposed to the outside of thetest carrier 1. Theexternal terminals 32 are terminals that electrically connect contactors 321 (seeFIGS. 10 to 12 ) of thesocket 320 of the electroniccomponent testing apparatus 100 during the test of theDUT 90. Theexternal terminals 32 are arranged with a pitch P2 wider than the pitch P1 of inner terminals 31 (seeFIG. 3 ) (P2>P1). Theinternal terminals 31 and theexternal terminals 32 are connected bywiring patterns 33. Theexternal terminals 32 corresponds to an example of “external terminals” in one or more embodiments of the present invention. - Further, as shown in
FIG. 3 , theinterposer 30 includes fourholes 34 penetrating theinterposer 30. Each ofholes 34 is disposed to be substantially coincident with thehole 25 of the holdingplate 20 described above. Therefore, first through-holes 11 linearly penetrating thecarrier body 10 are formed by theholes DUT 90 can be seen from the outside through the first through-holes 11. The first through-holes 11 are used for positioning theDUT 90 with high accuracy with respect to thetest carrier 1 during assembling thetest carrier 1. -
FIG. 9 is an exploded sectional view showing a modification of the main body of the test carrier in one or more embodiments. - In one or more embodiments, as contactors for contacting the
pads 91 of theDUT 90, pogo pins 21 are used, but it may be used other than the pogo pins 21 as contactors. For example, as shown inFIG. 9 , cantilever-type probe needles 21B may be used as the contactors. Thisprobe needle 21B is mounted on theinterposer 30 and is electrically connected to theinner terminal 31 of theinterposer 30. Alternatively, although not shown in particular, as the contactor of thetest carrier 1, a contactor including an anisotropic conductive rubber sheet, a membrane type contactor having bumps formed on the insulating film may be used. - In the case of using the pogo pins 21 as contactors, as described above, the
main body 15 includes the holdingplate 20 for holding the pogo pins 21. In contrast, as shown inFIG. 9 , in the case of using the probe needles 21B as contactor, themain body 15 may include only theinterposer 30. In this modification, theinterposer 30 corresponds to an example of “a main body” in one or more embodiments of the present invention, and the probe needles 21B correspond to an example of “contactors” in one or more embodiments of the present invention. - Returning to
FIG. 2 toFIG. 6 , thetubular body 40 is provided on the upper surface of the holdingplate 20 and is fixed to the holdingplate 20 by thread fastening, etc. Thetubular body 40 has a rectangular tubular shape having aninner hole 41 larger than the outer shape of theDUT 90 and can surround a periphery of theDUT 90 held by the holdingplate 20. Arecess 42 is formed on a side surface of thetubular body 40 to correspond to a latch 70 (described below) of thelid member 60. Thelatch 70 is engaged with therecess 42, whereby thelid member 60 is detachably attached to thecarrier body 10. - The
lid member 60 includes a plate-likemain body 61, aconvex portion 62 protruding downward from themain body 61 in a convex shape, and a pair oflatches 70 protruding downward from both ends of themain body 61. Thelid member 60 corresponds to an example of “a lid member” in one or more embodiments of the present invention. - The
convex portion 62 has acontact surface 621 which contacts the upper surface of theDUT 90 held by the holdingplate 20. Theconvex portion 62 presses theDUT 90. A pressing amount of theDUT 90 by thepusher 62 is limited by thetubular body 40 of thecarrier body 10 abutting against themain body 61 of thelid member 60. In this state, a pressing force of thepogo pin 21 with respect to thepad 91 of theDUT 90 is set to an optimum value. TheDUT 90 accommodated in thetest carrier 1 is sandwiched between the pogo pins 21 and theconvex portion 62. Thecontact surface 621 of theconvex portion 62 corresponds to an example of “a contact surface” in one or more embodiments of the present invention. - A second through-
hole 67 penetrating through themain body 61 and theconvex portion 62 is formed substantially at a center of themain body 61. The second through-hole 67 is used for sucking and holding theDUT 90 by the carrier assembling apparatus (not illustrated). - In one or more embodiments, the
flow passages 63 are formed in thelid member 60. Eachflow passage 63 includes a supply hole (inlet) 64, an exhaust hole (outlet) 65, and aflow hole 66. Theflow passage 63 corresponds to an example of “a first flow passage” in one or more embodiments of the present invention. - The
supply hole 64 is provided on the upper surface of thelid member 60 and opens toward the upper portion of thelid member 60. Thesupply hole 64 can communicate with thecarrier connection hole 230 of the pusher 210 (described later) by thetest carrier 1 contacting thepusher 210 of thehandler 200 during the test of theDUT 90. From thesupply hole 64, air enters into thetest carrier 1 through thepusher 210 and circulates to theflow hole 66. In one or more embodiments, twosupply hole 64 are formed on thelid member 60. Thesupply hole 64 corresponds to an example of “a first connection hole” in one or more embodiments of the present invention. - The
exhaust hole 65 is disposed on the upper surface of thelid member 60 and opens toward the upper portion of thelid member 60. Theexhaust hole 65 can communicate with thecarrier connection hole 240 of the pusher 210 (described later) by thetest carrier 1 contacting thepusher 210 of thehandler 200 during the test of theDUT 90. From theexhaust hole 65, air is exhausted to the outside of thetest carrier 1. In one or more embodiments, twoexhaust holes 65 are formed on thelid member 60. Theexhaust hole 65 corresponds to an example of “a second connection hole” in one or more embodiments of the present invention. - The
flow hole 66 is a hole formed in themain body 61 of thelid member 60. One end of theflow hole 66 communicates with thesupply hole 64, the other end of theflow hole 66 communicates with theexhaust hole 65. That is, theflow hole 66 is a flow passage embedded within thelid member 60. Air supplied from thepusher 210 of thehandler 200 performs heat exchange with theDUT 90 accommodated in thetest carrier 1 by passing through theflow hole 66. Thereby theDUT 90 is cooled. In one or more embodiments, one of the flow holes 66 connects one of the supply holes 64 and one of the exhaust holes 65, and two flow holes are formed in thelid member 60. Theflow hole 66 corresponds to an example of “a flow hole” in one or more embodiments of the present invention. - In one or more embodiments, although two
supply holes 64 and twoexhaust hole 65 are formed on thelid member 60, the number of thesupply hole 64 and theexhaust hole 65 is not particularly limited thereto. Further, the number of thesupply hole 64 may be different from the number of theexhaust hole 65. - In one or more embodiments, the
flow hole 66 is formed inside themain body 61 of thelid member 60, the arrangement of theflow hole 66 is not particularly limited thereto. For example, theflow hole 66 may be formed over the inside of themain body 61 and the inside of theconvex portion 62. If theflow hole 66 is formed inside theconvex portion 62 in contact with theDUT 90, since the air circulates in the vicinity of theDUT 90, it is possible to cool theDUT 90 more efficiently. - In one or more embodiments, although the
flow hole 66 is formed so as to connect one of the supply holes 64 and one of the exhaust holes 65, the configuration of theflow hole 66 is not particularly limited thereto. For example, with respect to oneflow hole 66, supply holes 64 andexhaust holes 65 may be communicated. Alternatively, theflow hole 66 connected to onesupply hole 64 may be branched in the middle and may be connected to the exhaust holes 65. Alternatively, theflow hole 66 connected to the supply holes 64 may merges and be connected to oneexhaust hole 65. - Further, as far as the
flow hole 66 penetrates thelid member 60 so as to connect thesupply hole 64 and theexhaust hole 65, the size of the inside of theflow hole 66 is not particularly limited. For example, theflow hole 66 may be a linear through-hole having an inner diameter comparable to the inner diameter of thesupply hole 64 and theexhaust hole 65. Alternatively, theflow hole 66 may be a space having a large width several times the inner diameter of thesupply hole 64 and theexhaust hole 65. - In one or more embodiments, the
flow hole 66 is extended in a straight line, the shape of theflow hole 66 is not particularly limited thereto. For example, theflow hole 66 may have a serpentine shape. Further, in order to increase the heat exchange efficiency, protrusions such as fins may be formed in theflow hole 66. - The
latches 70 are rotatably supported byshafts 71 at both ends of themain body 61, and each of the latches extends downward. Each of thelatches 70 is urged inward by a spring (not particularly illustrated). Aclaw 72 protruding inward is provided at a distal end of each of thelatches 70. Thelid member 60 is attached to thecarrier body 10 by theclaw 72 engaged with therecess 42 of thecarrier body 10. - The
test carrier 1 described above is assembled by the method described in JP 2019-197012 A using an assembly apparatus having an image processing apparatus. - Next, the configuration of the electronic
component testing apparatus 100 in one or more embodiments will be described below with reference toFIGS. 1, 10 and 11 . -
FIG. 10 is a cross-sectional view showing a state of testing by the electronic component testing apparatus in one or more embodiments (No. 1), and is an enlarged sectional view showing the X portion ofFIG. 1 . Further,FIG. 11 is a cross-sectional view showing a state of testing by the electronic component testing apparatus in one or more embodiments (No. 2). - As shown in
FIG. 1 , the electroniccomponent testing apparatus 100 in one or more embodiments includes ahandler 200, atest head 300, atester 400, and asupply device 500. As described above, the electroniccomponent testing apparatus 100 executes the test of theDUT 90. In this time, theDUT 90 is accommodated theDUT 90 in thetest carrier 1. -
Handler 200 includes a Z-axis drive unit 201 and apusher 210. The Z-axis drive unit 201 includes an actuator for vertical drive (not illustrated), the z-axis drive unit 201 can move in the vertical direction. Although not illustrated, thehandler 200 includespushers 210 corresponding to testcarriers 1 mounted on the test tray, thepushers 210 are attached to single Z-axis drive unit 201. In thehandler 200, thepusher 210 attached to the Z-axis drive unit 201 contacts thetest carrier 1 by the Z-axis drive unit 201 lowering, and thepusher 210 presses thetest carrier 1 to the socket 320 (described later) of thetest head 300. Thepusher 210 corresponds to an example of “a pusher” in one or more embodiments of the present invention. - As shown in
FIG. 10 , thepusher 210 is inserted into the through-hole 203 formed in amatch plate 202, is held in floating state (a state in which relative movement to the vertical is allowed) by thematch plate 202. Thepusher 210 includes amain body 215, afirst connection pin 220, a carrier connection holes 230,240, and avent passages - The first connecting
pin 220 extends downward from themain body 215 of thepusher 210. The shape of the lower end of the first connectingpin 220 is narrower toward the lower. When the test of theDUT 90 is executed, the first connectingpin 220 penetrates the through-hole 601 of theinsert 600 placed on thetest head 300 with the lowering of thepusher 210, the first connectingpin 220 is detachably fitted into the first fitting hole 331 (described later) of the socket guide 330 (described later). Thus, thetest carrier 1 held in theinsert 600 is positioned with respect to thesocket 320. Thefirst connection pin 220 corresponds to an example of “a first connection pin” in one or more embodiments of the present invention. - Further, a part of the
ventilation passage 250 is formed inside thefirst connection pin 220, ahole 221 is formed at the tip of thefirst connection pin 220. The pusher goes down, the lower end of thefirst connection pin 220 is communicated with the firstfitting hole 331 of thesocket guide 330. Thereby, theventilation passage 250 communicates with the ventilation passage 332 (described later) inside thesocket guide 330. This allows air supplied from thesocket guide 330 of thetest head 300 to flow through theventilation passage 250. Thehole 221 of thefirst connection pin 220 corresponds to an example of “a fourth connection hole” in one or more embodiments of the present invention. - Carrier connection holes 230 are formed on the lower portion of the
main body 215 of thepusher 210. Thecarrier connection hole 230 corresponds to thesupply hole 64 of thetest carrier 1. Thecarrier connection hole 230 communicates with thesupply hole 64 of thetest carrier 1 with thepusher 210 going down and contacting to thetest carrier 1. Thecarrier connection hole 230 corresponds to an example of “a third connection hole” in one or more embodiments of the present invention. - The carrier connection holes 240 also is formed on the lower portion of the
main body 215 of thepusher 210. Thecarrier connection hole 240 corresponds to theexhaust hole 65 of thetest carrier 1. Thecarrier connection hole 240 communicates with theexhaust hole 65 with thepusher 210 going down and contacting thetest carrier 1. Thecarrier connection hole 240 corresponds to an example of “a fifth connection hole” in one or more embodiments of the present invention. - The
ventilation passage 250, as described above, a portion thereof is formed inside thefirst connection pin 220, the other portion is formed inside themain body 215 of thepusher 210. One end of theventilation passage 250 communicates with theventilation passage 332 of thesocket guide 330 with the first connectingpin 220 connecting to thesocket guide 330 during testing of theDUT 90. The other end of theventilation passage 250 is communicates with thecarrier connection hole 230. Air supplied from thesocket guide 330 is supplied to thetest carrier 1 through theventilation passage 250. Theventilation passage 250 corresponds to an example of “a second flow passage” in one or more embodiments of the present invention. - The
ventilation passage 260 is disposed inside themain body 215 of thepusher 210, one end of theventilation passage 260 communicates with thecarrier connection hole 240, the other end of theventilation passage 260 communicates with the outside of thepusher 210. Thecarrier connection hole 240 communicates with theexhaust hole 65 of thetest carrier 1 with thepusher 210 going down and contacting thetest carrier 1. On the other hand, air exhausted from thetest carrier 1 is exhausted to the outside of thepusher 210 through theventilation passage 260. Theventilation passage 260 corresponds to an example of “a third flow passage” in one or more embodiments of the present invention. - The
test head 300 includes amain body 310, asocket 320, and asocket guide 330. - The
main body 310, as shown inFIG. 1 , is connected to thetester 400 via acable 401, and sends a test signal to theDUT 90 during the test of theDUT 90. Although not illustrated, the pin electronics card which is electrically connected to thesocket 320 is housed in themain body 310. - The
socket 320, as shown inFIGS. 10 and 11 , is disposed on themain body 310. Thesocket 320 includescontactors 321 disposed so as to correspond to theexternal terminals 32 of thetest carrier 1. Pogo pin or anisotropic conductive rubber sheet can be used as thecontactor 321, but thecontactor 321 is not limited thereto. Thetest carrier 1 held by theinsert 600 of the test tray is pressed to thesocket 320 by thepusher 210, theexternal terminals 32 of thetest carrier 1 contact to thecontactors 321 of thesocket 320, and theDUT 90 and thesocket 320 is electrically connected via thetest carrier 1. The test signal is sent from themain body 310 to theDUT 90 through thesocket 320. - The
socket guide 330 is disposed around thesocket 320. Thesocket guide 330 includes a firstfitting hole 331 and aventilation passage 332. Thesocket guide 330 positions thetest carrier 1 with respect to thesocket 320. Thesocket guide 330 also positions thepusher 210 with respect to thesocket 320. - The first
fitting hole 331 is disposed on the upper surface of thesocket guide 330 and disposed at a position corresponding to thefirst connection pin 220. The firstfitting hole 331 has a shape that fits thefirst connection pin 220. This firstfitting hole 331 opens upward. The firstfitting hole 331 corresponds to an example of “a first fitting hole” in one or more embodiments of the present invention. - The
ventilation passage 332 is formed in thesocket guide 330. One end of theventilation passage 332 communicates with the firstfitting hole 331. The other end of theventilation passage 332 also communicates with thesupply passage 501. As illustrated inFIGS. 10 and 11 , thefirst connection pin 220 is fitted into the firstfitting hole 331, theventilation passage 250 communicates with theventilation passage 332. - A
supply device 500, although not illustrated in particular, includes a pump for supplying air, a valve for adjusting the flow rate, and a temperature controller for adjusting the temperature of the air. As illustrated inFIGS. 1, 10 and 11 , thesupply device 500 communicates with theventilation passage 332 of thesocket guide 330 through asupply passage 501. The supply device adjusts a temperature of air to an appropriate temperature according to the conditions of the test. The supply device supplies the temperature adjusted air to thesocket guide 330. In one or more embodiments, thesupply device 500 is disposed inside thehandler 200, but it is not particularly limited thereto, thesupply device 500 may be disposed inside thetest head 300 or the like. - Hereinafter, the process of testing the
DUT 90 using thetest carrier 1 and the electroniccomponent testing apparatus 100 in one or more embodiments will be described below withFIGS. 10 and 11 . - First, the
insert 600 of the test tray (not shown) accommodates thetest carrier 1 accommodating theDUT 90. Specifically, thetest carrier 1 is transferred to the test tray from the customer tray (not shown) with the pick-and-place device provided in thehandler 200, thetest carrier 1 is accommodated in theinsert 600 of the test tray. Incidentally, the customer tray is a tray to be transported to thehandler 200 from the pre-process, thetest carrier 1 is assembled by the method described in JP 2019-197012A, then thetest carrier 1 is accommodated in the customer tray. - Then, the transport apparatus of the
handler 200 transfers the test tray to a position facing thetest head 300. Then, as shown inFIG. 10 , the Z-axis drive unit 201 is driven, thepusher 210 goes down, thepusher 210 presses thetest carrier 1 held in theinsert 600 of the test tray. - With the lowering of the
pusher 210, the first connectingpin 220 penetrates the through-hole 601 of theinsert 600, fitting to the firstfitting hole 331 of thesocket guide 330. Thus, thetest carrier 1 held in theinsert 600 is positioned with respect to thesocket 320. Theventilation passage 250 formed in thefirst connection pin 220 of thepusher 210 and theventilation passage 332 formed in thesocket guide 330 are communicated with. - Further, with the lowering of the
pusher 210, thepusher 210 presses thetest carrier 1 to thesocket 320, theexternal terminals 32 of thetest carrier 1 contact thecontactors 321 of thesocket 320. Further, thecarrier connection hole 230 of thepusher 210 is communicated with thesupply hole 64, thecarrier connection hole 240 is communicated with theexhaust hole 65 of thetest carrier 1. - Then, the valve of the
supply device 500 is opened and thesupply device 500 starts to supply air. Air is supplied to theflow hole 66 from thesupply hole 64 of thetest carrier 1 through thesupply passage 501, theventilation passage 332 of thesocket guide 330, theventilation passage 250 of thepusher 210. - In this state, the test signal outputted from the
tester 400 is sent to theDUT 90 through thecontactors 321 of thesocket 320, the test of theDUT 90 is performed. - When the
DUT 90 is applied electricity, theDUT 90 generates heat (self-heating). Air supplied to theflow hole 66 absorbs heat generated by theDUT 90 to cool theDUT 90. Air passing through theflow hole 66 of thetest carrier 1 enters theventilation passage 260 from theexhaust hole 65 and thecarrier connection hole 240, is exhausted to the outside (for example, the interior of the chamber) of thepusher 210. - When the test of the
DUT 90 is completed, thepusher 210 is moved upward by the Z-axis drive unit 201, the test tray (not illustrated) holding theinsert 600 accommodating thetest carrier 1 is moved upward. Next, the test tray is removed from the position facing thetest head 300 by the carry apparatus of thehandler 200, then thetest carrier 1 is transferred to the customer tray from the test tray by the pick-and-place device. Then, after the customer tray accommodating thetest carrier 1 is carried out from thehandler 200, theDUT 90 is taken out by disassembling thetest carrier 1. The process of testing theDUT 90 is completed. - As described above, in one or more embodiments, when the test of the
DUT 90, since air supplied from the outside of thetest carrier 1 flows through theflow passage 63 formed in thetest carrier 1, air circulates in the vicinity of theDUT 90. Thus, as compared with the case where air flows only inside the pusher, it is possible to reduce the thermal resistance of thetest carrier 1. Therefore, it is possible to cool theDUT 90 efficiently, it is possible to suppress the rapid temperature rise due to heat generation of theDUT 90. In extension, it is possible to suppress the damage and yield reduction of theDUT 90 due to heat generation of theDUT 90. - Further, in one or more embodiments, air flows through the
flow passage 63 formed in thetest carrier 1, air doesn't be blown to theDUT 90 directly. As a result, it is possible to suppress the adhesion of dirt to theDUT 90 due to direct air contact with theDUT 90 and the electrification of theDUT 90 due to friction with air. - Further, in one or more embodiments, the
DUT 90 is accommodated in thetest carrier 1, the test ofDUT 90 is performed while theDUT 90 is sealed in the inner space of thetest carrier 1. Therefore, devices or bare dies that require a high level of cleanliness (Class 5-6/Class 100-1000) in the handling environment can be tested using a handler in a lower cleanliness environment (Class 7/Class 10000). - It should be appreciated that the embodiments explained heretofore are described to facilitate understanding of the present invention and are not described to limit the present invention. It is therefore intended that the elements disclosed in the above embodiments include all design changes and equivalents to fall within the technical scope of the present invention.
-
FIGS. 12 to 14 are diagrams showing a modification of the electronic component testing apparatus according to one or more embodiments. - In the above embodiments, air is exhausted from the
test carrier 1 is exhausted from thepusher 210 to the outside of thepusher 210, but the location for exhausting air is not particularly limited thereto. For example, as illustrated inFIG. 12 , thepusher 210 includes asecond connection pin 270 in addition to thefirst connection pin 220, thehole 271 is formed at the tip of thesecond connection pin 270, air can be exhausted to the outside of thetest head 300 via thesocket guide 330. Thesecond connection pin 270 passes through the through-hole 602 formed in theinsert 600 and is fitted to the secondfitting hole 333 formed in thetest head 300. A portion of theventilation passage 260 in communication with thecarrier connection hole 240 is formed inside thesecond connection pin 270. In the example ofFIG. 12 , with the lowering of thepusher 210, thefirst connection pin 220 is fitted to the firstfitting hole 331, thesecond connection pin 270 is fitted to the secondfitting hole 333. During the test of theDUT 90, air supplied from thesupply device 500 is exhausted from theventilation passage 334 to the outside of thetest head 300 through theventilation passage 250, theflow hole 66, and theventilation passage 260. Thesecond connection pin 270 corresponds to an example of “a second connection pin” in one or more embodiments of the present invention, thehole 271 of thesecond connection pin 270 corresponds to an example of “a sixth connection hole” in one or more embodiments of the present invention, the secondfitting hole 333 corresponds to an example of “a second fitting hole” in one or more embodiments of the present invention. - In the above-described embodiments, although the
flow passage 63 is formed in thelid member 60 of thetest carrier 1, it is not particularly limited thereto. For example, as shown inFIG. 13 , instead of thelid member 60, theflow passage 63′ may be formed in thecarrier body 10. In the form shown inFIG. 13 , theflow passage 63′ is formed in theinterposer 30. Thesupply hole 64′ and theexhaust hole 65′ is formed on the lower surface of theinterposer 30, theflow hole 66′ is formed inside theinterposer 30. In thesocket 320, theventilation passage 322 that communicates with theventilation passage 332 of thesocket guide 330 and theflow hole 66′ of theinterposer 30 is formed. Further, in thesocket 320, thevent passage 323 communicating with thevent passage 334 of thesocket guide 330 and theflow hole 66′ of theinterposer 30 is formed. Air supplied from thesupply device 500 is exhausted to the outside of thetest head 300 through theventilation passage 332, theventilation passage 322, theflow passage 63′, theventilation passage 323, and theventilation passage 334. - Incidentally, the
flow passage 63′ is not particularly limited as far as it is formed in themain body 15 of thecarrier body 10. For example, theflow passage 63′ may be formed only on the holdingplate 20. Alternatively, theflow passage 63′ may be formed on both the holdingplate 20 and theinterposer 30. - In this modification, the ventilation passage is not formed in the
pusher 210, thepusher 210 doesn't include the connection pin having the ventilation passage. Therefore, it is possible to simplify the structure of thepusher 210. - Incidentally, the
test carrier 1 includes both of aflow passage 63 formed in thelid member 60 and theflow passage 63′ formed in thecarrier body 10. - In the above-described embodiments, air is supplied from the
test head 300 to thetest carrier 1 through thepusher 210, but is not particularly limited thereto. For example, as illustrated inFIG. 14 , thepusher 210 doesn't include aconnection pin 220, theventilation passage 250 may be formed only in themain body 215 of thepusher 210. Although not illustrated, theventilation passage 250 is connected to the supply device disposed outside thepusher 210. In the example illustrated inFIG. 14 , air supplied from the supply device is supplied from thepusher 210 to thetest carrier 1 without passing through thetest head 300. - Further, for example, in the above-described embodiments, the die is exemplified as a specific example of the
DUT 90, but the present invention is not particularly limited thereto. For example, theDUT 90 may be a packaged device. TheDUT 90 in the above-described embodiments is a memory-based device but is not particularly limited thereto. For example, theDUT 90 may be SoCs (System on a chip) or logic-based devices. - Further, although the electronic
component testing apparatus 100 in the above-described embodiments has ahandler 200 of the type that presses theDUT 90 to thesocket 320 while holding theDUT 90 in the test tray, the configuration of thehandler 200 is not particularly limited thereto. For example, thehandler 200 may be a type of handler that presses the DUT against a socket by an arm that sucks and holds the DUT. - Further, in the above embodiments, the
test carrier 1 may include thesupply hole 64 and theexhaust hole 65, and thepusher 210 may also include a carrier connection holes 230,240, it is not particularly limited thereto. Thepusher 210 may include a connecting tube, the test carrier may include a supply hole where the connecting tube can be fitted. Alternatively, thetest carrier 1 may include a connecting tube, thepusher 210 may include the fitting hole where the connection pin can be fitted. - Although the disclosure has been described with respect to only a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that various other embodiments may be devised without departing from the scope of the present invention. Accordingly, the scope of the invention should be limited only by the attached claims.
-
- 1 . . . TEST CARRIER
- 10 . . . CARRIER BODY
- 15 . . . MAIN BODY
- 20 . . . HOLDING PLATE
- 21 . . . POGO PINS
- 21B . . . PROBE NEEDLES
- 30 . . . INTERPOSER
- 31 . . . INTERNAL TERMINALS
- 32 . . . EXTERNAL TERMINALS
- 33 . . . WIRING PATTERN
- 40 . . . TUBULAR BODY
- 60 . . . LID MEMBER
- 61 . . . MAIN BODY
- 62 . . . CONVEX PORTION
- 621 . . . CONTACT SURFACE
- 63 . . . FIRST FLOW PASSAGES
- 64 . . . SUPPLY HOLE
- 65 . . . EXHAUST HOLE
- 66 . . . FLOW HOLE
- 70 . . . LATCH
- 90 . . . DUT
- 91 . . . PADS
- 92 . . . BUMPS
- 100 . . . ELECTRONIC COMPONENT TESTING APPARATUS
- 200 . . . HANDLER
- 210 . . . PUSHER
- 215 . . . MAIN BODY
- 220 . . . FIRST CONNECTION PIN
- 221 . . . HOLES
- 230,240 . . . CARRIER CONNECTION HOLE
- 250,260 . . . VENTILATION PASSAGE
- 270 . . . SECOND CONNECTION PIN
- 271 . . . HOLE
- 300 . . . TEST HEAD
- 310 . . . MAIN BODY
- 320 . . . SOCKET
- 321 . . . CONTACTORS
- 322,323 . . . VENTILATION PASSAGE
- 330 . . . SOCKET GUIDE
- 331 . . . FIRST FITTING HOLE
- 332 . . . VENTILATION PASSAGE
- 333 . . . SECOND FITTING HOLE
- 334 . . . VENTILATION PASSAGE
- 400 . . . TESTER
- 500 . . . SUPPLY DEVICE
- 501 . . . SUPPLY PASSAGE
- 600 . . . INSERT
- 601,602 . . . THROUGH-HOLE
Claims (17)
1. (canceled)
2. A test carrier that accommodates a device under test (DUT), comprising:
a first flow passage through which fluid supplied from an outside of the test carrier flows; and
an accommodating space that accommodates the DUT inside the test carrier, wherein
the first flow passage comprises:
a flow hole;
a first connection hole that communicates with a first end of the flow hole; and
a second connection hole that communicates with a second end of the flow hole,
the test carrier is pressed by a pusher to a socket of a test head in a state that the accommodating space accommodates the DUT, and
the fluid is supplied to the flow hole from the first connection hole and exhausted from the second connection hole.
3. The test carrier according to claim 2 , further comprising:
a carrier body that holds the DUT; and
a lid that covers the DUT and is detachably attached to the carrier body, wherein
the flow hole, the first connection hole, and the second connection hole are formed in the lid.
4. The test carrier according to claim 2 , wherein
the fluid is supplied to the first flow passage from the pusher.
5. The test carrier according to claim 4 , wherein the first connection hole and the second connection hole face the pusher.
6. The test carrier according to claim 3 , wherein
the carrier body comprises:
contactors correspond to terminals of the DUT;
external terminals electrically connected to the contactors; and
a main body that holds the contactors and the external terminals.
7. The test carrier according to claim 6 , wherein
the lid comprises:
a contact surface that contacts the DUT, and
the DUT is sandwiched between the contact surface and the contactors.
8. The test carrier according to claim 2 , further comprising:
a carrier body that holds the DUT; and
a lid that covers the DUT and is detachably attached to the carrier body, wherein
the flow hole, the first connection hole, and the second connection hole are formed in the carrier body.
9. An electronic component testing apparatus for testing a device under test (DUT), comprising:
the test carrier according to claim 2 ;
the test head that comprises the socket; and
the pusher that presses the test carrier to the socket, wherein
the pusher supplies the fluid to the first flow passage.
10. The electronic component testing apparatus according to claim 9 , wherein
the pusher comprises:
a third connection hole that communicates with the first flow passage while the pusher is contacting the test carrier;
a second flow passage that communicates with the third connection hole, and
the fluid is supplied to the first flow passage through the second flow passage while the pusher is pressing the test carrier to the socket.
11. An electronic component testing apparatus for testing a device under test (DUT), comprising:
a test carrier that:
accommodates the DUT, and
comprises a first flow passage through which fluid supplied from an outside of the test carrier flows;
a test head that comprises a socket; and
a pusher that presses the test carrier to the socket, wherein
the pusher supplies the fluid to the first flow passage,
the pusher comprises:
a third connection hole that communicates with the first flow passage while the pusher is contacting the test carrier;
a second flow passage that communicates with the third connection hole, wherein
the fluid is supplied to the first flow passage through the second flow passage while the pusher is pressing the test carrier to the socket; and
a fourth connection hole that connects to the test head and receives the fluid from the test head while the pusher is contacting the test head,
the fourth connection hole communicates with the second flow passage, and
the fluid is supplied to the first flow passage from the test head through the second flow passage while the pusher is pressing the test carrier to the socket.
12. The electronic component testing apparatus according to claim 11 , wherein
the pusher comprises:
a first connection pin that fits into a first fitting hole formed in a socket guide of the test head, and
the third connection hole and a part of the second flow passage are formed in the first connection pin.
13. The electronic component testing apparatus according to claim 9 , wherein
the pusher comprises:
a fifth connection hole that communicates with the first flow passage while the pusher is contacting the test carrier; and
a third flow passage that communicates with the fifth connection hole, and
the fluid supplied to the first flow passage flows into the third flow passage while the pusher is pressing the test carrier to the socket.
14. The electronic component testing apparatus according to claim 13 , wherein the pusher exhausts the fluid supplied to the first flow passage to an outside of the pusher from the third flow passage.
15. An electronic component testing apparatus for testing a device under test (DUT), comprising:
a test carrier that:
accommodates the DUT, and
comprises a first flow passage through which fluid supplied from an outside of the test carrier flows;
a test head that comprises a socket; and
a pusher that presses the test carrier to the socket, wherein
the pusher supplies the fluid to the first flow passage,
the pusher comprises:
a fifth connection hole that communicates with the first flow passage while the pusher is contacting the test carrier;
a third flow passage that communicates with the fifth connection hole, wherein the fluid supplied to the first flow passage flows into the third flow passage while the pusher is pressing the test carrier to the socket; and
a sixth connection hole that connects to the test head and exhausts the fluid to the test head while the pusher is contacting the test head,
the third flow passage connects to the fifth connection hole and the sixth connection hole, and
the fluid supplied to the first flow passage is exhausted to the test head through the third flow passage.
16. The electronic component testing apparatus according to claim 15 , wherein
the pusher comprises:
a second connection pin that fits into a second fitting hole formed in a socket guide of the test head,
the sixth connection hole and a part of the third flow passage are formed in the second connection pin.
17. An electronic component testing apparatus for testing a device under test (DUT), comprising:
the test carrier according to claim 2 ;
the test head that comprises the socket; and
the pusher that presses the test carrier to the socket, wherein
the test head supplies the fluid to the first flow passage.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2021120855A JP7143491B1 (en) | 2021-07-21 | 2021-07-21 | Test carrier and electronic component test equipment |
JP2021-120855 | 2021-07-21 | ||
JPJP2021-120855 | 2021-07-21 |
Publications (2)
Publication Number | Publication Date |
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US20230023699A1 true US20230023699A1 (en) | 2023-01-26 |
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US17/681,039 Active US11579187B1 (en) | 2021-07-21 | 2022-02-25 | Test carrier and electronic component testing apparatus |
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US (1) | US11579187B1 (en) |
JP (1) | JP7143491B1 (en) |
KR (1) | KR102630695B1 (en) |
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TW (1) | TW202305379A (en) |
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JP2017003413A (en) * | 2015-06-10 | 2017-01-05 | 株式会社リコー | Electronic component feature testing socket, electronic component feature testing device and electronic component feature testing method |
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JP7143246B2 (en) * | 2019-05-23 | 2022-09-28 | 株式会社アドバンテスト | Electronic component handling equipment and electronic component testing equipment |
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2021
- 2021-07-21 JP JP2021120855A patent/JP7143491B1/en active Active
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2022
- 2022-02-22 KR KR1020220022908A patent/KR102630695B1/en active IP Right Grant
- 2022-02-23 TW TW111106511A patent/TW202305379A/en unknown
- 2022-02-25 US US17/681,039 patent/US11579187B1/en active Active
- 2022-03-16 CN CN202210258276.4A patent/CN115684866A/en active Pending
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US7100389B1 (en) * | 2002-07-16 | 2006-09-05 | Delta Design, Inc. | Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test |
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KR102630695B1 (en) | 2024-01-29 |
KR20230014615A (en) | 2023-01-30 |
JP2023016503A (en) | 2023-02-02 |
JP7143491B1 (en) | 2022-09-28 |
CN115684866A (en) | 2023-02-03 |
US11579187B1 (en) | 2023-02-14 |
TW202305379A (en) | 2023-02-01 |
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