US20200368804A1 - Manufacturing process for heat sink composite having heat dissipation function and manufacturing method for its finished product - Google Patents

Manufacturing process for heat sink composite having heat dissipation function and manufacturing method for its finished product Download PDF

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Publication number
US20200368804A1
US20200368804A1 US16/421,751 US201916421751A US2020368804A1 US 20200368804 A1 US20200368804 A1 US 20200368804A1 US 201916421751 A US201916421751 A US 201916421751A US 2020368804 A1 US2020368804 A1 US 2020368804A1
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Prior art keywords
heat
heat sink
conductive material
dissipation function
manufacturing process
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US16/421,751
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Shih Pao Chien
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Trusval Technology Co Ltd
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Trusval Technology Co Ltd
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Priority to US16/421,751 priority Critical patent/US20200368804A1/en
Assigned to TRUSVAL TECHNOLOGY CO., LTD. reassignment TRUSVAL TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIEN, SHIH-PAO
Publication of US20200368804A1 publication Critical patent/US20200368804A1/en
Priority to US17/122,295 priority patent/US11213877B2/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/06—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes composite, e.g. polymers with fillers or fibres
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49366—Sheet joined to sheet

Definitions

  • the present invention relates to a manufacturing process for a heat dissipation heat sink composite having heat dissipation function and a manufacturing method for a finished product thereof, which enables to increase efficiency of 3-dimentional heat dissipation and electromagnetic radiation absorption, maintain a long service life with high performance, reduce a manufacturing cost, and have environmental friendly effect due to its recyclability.
  • the object of the present invention is to provide a manufacturing process for a heat dissipation heat sink composite having heat dissipation function and a manufacturing method for a finished product thereof, which enables to is increase efficiency of 3-dimentional heat dissipation and electromagnetic radiation absorption, maintain a long service life with high performance, reduce a manufacturing cost, and have environmental friendly effect due to its recyclability.
  • FIG. 1 is a flow chart showing a manufacturing process for a heat sink composite having heat dissipation function according to the present invention
  • FIG. 2 is a schematic diagram showing a manufacturing process for a heat sink composite having heat dissipation function according to the present invention
  • FIG. 3 is a sectional view showing a heat sink composite having heat dissipation function according to the present invention
  • FIG. 4 is a first schematic diagram showing a heat sink composite bound and fixed by a heat-resistant insulating tape to be further cut to a size as needed;
  • FIG. 5 is a second schematic diagram showing a heat sink composite bound and fixed by a heat-resistant insulating tape to be further cut to a size as needed;
  • FIG. 6 is a schematic diagram showing a plurality of heat sink composites bonded to an insulating silicone elastic interface material for contacting a component to be cooled;
  • FIG. 7 is a schematic diagram showing a first embodiment for a plurality of heat sink composites wound to a predetermined number of layers
  • FIG. 8 is a schematic diagram showing a second embodiment for a plurality of heat sink composites wound to a predetermined number of layers
  • FIG. 9 is a schematic diagram showing the first embodiment for the plurality of heat sink composites further bonded to two insulating silicone elastic interface materials for contacting a component to be cooled;
  • FIG. 10 is a schematic diagram showing the second embodiment for the plurality of heat sink composites further bonded to two insulating silicone elastic interface materials for contacting a component to be cooled.
  • a manufacturing process for a is heat sink composite having heat dissipation function according to the present invention is disclosed. It mainly comprises the following steps of:
  • the first heat conductive material ( 1 ) is selected from a group consisting of graphite oxide, graphene oxide and carbon materials with functional groups and shaped as a thin film, a flake or a roll
  • the substrate ( 2 ) is a metal film, a metal mesh, a metal sheet, an inorganic film, an inorganic mesh, an organic film, an organic mesh or a non-woven fabric;
  • the second heat conductive material ( 7 ) is selected from a group consisting of graphite oxide, graphene oxide and carbon materials with functional groups and shaped as a thin film, a flake or a roll;
  • a heat sink composite (A) is cut into a size as needed, and then the plurality of heat sink composites (A) of various sizes are combined and arranged to form an array.
  • a heat-resistant insulating tape ( 8 ) is used to bind and fix the plurality of heat sink composites (A) to be further cut into a size as needed.
  • an insulating silicone elastic interface material ( 9 ) is used to bond the plurality of heat sink composites (A) to a component to be cooled so as to achieve excellent heat dissipation.
  • step (a) a plurality of heat sink composites (A) having a predetermined size are arranged to form an array and then one ends of the plurality of heat sink composites (A) are is fixed to a roll for winding.
  • step (b) after the plurality of heat sink composites (A) are wound up to a predetermined number of layers, a heat-resistant insulating tape ( 8 ) is used to bind and fix the plurality of heat sink composites (A).
  • the plurality of heat sink composites (A) are taken off from the roll and then transferred into a vacuum annealing furnace for reduction and annealing In step (c), after cooled down to room temperature, the plurality of heat sink composites (A) are transferred into a cutting mechanism for cutting into a size as needed. In step (d), the plurality of heat sink composites (A) are axially encapsulated. Finally, in step (e), the plurality of heat sink composites (A) are bonded to a component (B) to be cooled by use of an insulating silicone elastic interface material ( 9 ) as shown in FIG. 9 and FIG. 10 so as to achieve excellent heat dissipation.
  • the present invention has the following advantages:
  • the present invention increases efficiency of 3-dimentional heat dissipation and conduction and electromagnetic radiation absorption.
  • the present invention avoids the occurrence of oxidative damage, so it can maintain a long service life with high performance.
  • the present invention is easy to process and manufacture and has low loss and high yield rate, so it can reduce manufacturing cost.
  • the present invention has no environmental damage during the production process and achieves environmental friendly effect due to its recyclability.

Abstract

The invention relates to a manufacturing process for a heat dissipation heat sink composite having heat dissipation function and a manufacturing method for a finished product thereof. It comprises the steps of rolling a first heat conductive material and a substrate to adhere the first heat conductive material to the substrate for fixation; adhering a second heat conductive material to the substrate for combination; and rolling the second heat conductive material and the substrate for firmly combination and fixation to complete the manufacturing of a composite material.

Description

    BACKGROUND OF THE INVENTION 1. Field of the Invention
  • The present invention relates to a manufacturing process for a heat dissipation heat sink composite having heat dissipation function and a manufacturing method for a finished product thereof, which enables to increase efficiency of 3-dimentional heat dissipation and electromagnetic radiation absorption, maintain a long service life with high performance, reduce a manufacturing cost, and have environmental friendly effect due to its recyclability.
    • 2. Description of Related Art
  • With the rapid development of technology, the volume of electronic components tends to be decreased, and the density and performance of electronic components per unit area become increased. As a result, a total heat generation of the electronic component is yearly increased, and a traditional heat dissipating device cannot afford to dissipate the total heat generation quickly. If the heat generated by the electronic component is not removed efficiently, it will leads to an electronic ionization and a thermal stress situation of the electronic component, which reduces an overall stability and a service life of the electronic component. Accordingly, it is imperative to dissipate the heat generated from the electronic component to prevent an overheat situation thereof. In addition, constantly increasing the frequency and transmission speed of electronic components also results in serious situations of electromagnetic interference and electromagnetic wave spillover.
    • SUMMARY OF THE INVENTION
  • In view of the above-mentioned problems, the object of the present invention is to provide a manufacturing process for a heat dissipation heat sink composite having heat dissipation function and a manufacturing method for a finished product thereof, which enables to is increase efficiency of 3-dimentional heat dissipation and electromagnetic radiation absorption, maintain a long service life with high performance, reduce a manufacturing cost, and have environmental friendly effect due to its recyclability.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a flow chart showing a manufacturing process for a heat sink composite having heat dissipation function according to the present invention;
  • FIG. 2 is a schematic diagram showing a manufacturing process for a heat sink composite having heat dissipation function according to the present invention;
  • FIG. 3 is a sectional view showing a heat sink composite having heat dissipation function according to the present invention;
  • FIG. 4 is a first schematic diagram showing a heat sink composite bound and fixed by a heat-resistant insulating tape to be further cut to a size as needed;
  • FIG. 5 is a second schematic diagram showing a heat sink composite bound and fixed by a heat-resistant insulating tape to be further cut to a size as needed;
  • FIG. 6 is a schematic diagram showing a plurality of heat sink composites bonded to an insulating silicone elastic interface material for contacting a component to be cooled;
  • FIG. 7 is a schematic diagram showing a first embodiment for a plurality of heat sink composites wound to a predetermined number of layers;
  • FIG. 8 is a schematic diagram showing a second embodiment for a plurality of heat sink composites wound to a predetermined number of layers;
  • FIG. 9 is a schematic diagram showing the first embodiment for the plurality of heat sink composites further bonded to two insulating silicone elastic interface materials for contacting a component to be cooled;
  • FIG. 10 is a schematic diagram showing the second embodiment for the plurality of heat sink composites further bonded to two insulating silicone elastic interface materials for contacting a component to be cooled.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Hereinafter, an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.
  • As showed in FIG. 1 and FIG. 2, a manufacturing process for a is heat sink composite having heat dissipation function according to the present invention is disclosed. It mainly comprises the following steps of:
  • (a) transferring a first heat conductive material (1) and a substrate (2); preferably, the first heat conductive material (1) is selected from a group consisting of graphite oxide, graphene oxide and carbon materials with functional groups and shaped as a thin film, a flake or a roll, and the substrate (2) is a metal film, a metal mesh, a metal sheet, an inorganic film, an inorganic mesh, an organic film, an organic mesh or a non-woven fabric;
  • (b) rolling the first heat conductive material (1) and the substrate (2) under a high pressure by a rolling mechanism (3) to adhere the substrate (2) on one side of the first heat conductive material (1) for fixation;
  • (c) spraying the other side of the first heat conductive material (1) with an organic or inorganic phase change material (5) by a spraying mechanism (4) for firmly combining the phase change material (5) to the first heat conductive material (1);
  • (d) adhering one side of a second heat conductive material (7) to the substrate (2) by use of its inherent functional groups for combination, or by use of spraying an organic adhesive (6) on an outer surface of the substrate (2) for drying to form adhesiveness and for further bonding the organic adhesive (6) to the second heat conductive material (7), and then rolling the second heat conductive material (7) and the substrate (2) by a high pressure to be firmly bonded to each other so as to complete the preparation of a heat sink composite (A); preferably, the second heat conductive material (7) is selected from a group consisting of graphite oxide, graphene oxide and carbon materials with functional groups and shaped as a thin film, a flake or a roll; and
  • (e) spraying the other side of the second heat conductive material (7) with an organic or inorganic phase change material (5) for firmly combining the phase change material (5) to the second heat conductive material (7) as shown in FIG. 3.
  • In use of the present invention, referring to FIG. 4 and FIG. 5, a heat sink composite (A) is cut into a size as needed, and then the plurality of heat sink composites (A) of various sizes are combined and arranged to form an array. A heat-resistant insulating tape (8) is used to bind and fix the plurality of heat sink composites (A) to be further cut into a size as needed. Referring to FIG. 6, an insulating silicone elastic interface material (9) is used to bond the plurality of heat sink composites (A) to a component to be cooled so as to achieve excellent heat dissipation.
  • Referring to FIG. 7 and FIG. 8, in step (a), a plurality of heat sink composites (A) having a predetermined size are arranged to form an array and then one ends of the plurality of heat sink composites (A) are is fixed to a roll for winding. In step (b), after the plurality of heat sink composites (A) are wound up to a predetermined number of layers, a heat-resistant insulating tape (8) is used to bind and fix the plurality of heat sink composites (A). The plurality of heat sink composites (A) are taken off from the roll and then transferred into a vacuum annealing furnace for reduction and annealing In step (c), after cooled down to room temperature, the plurality of heat sink composites (A) are transferred into a cutting mechanism for cutting into a size as needed. In step (d), the plurality of heat sink composites (A) are axially encapsulated. Finally, in step (e), the plurality of heat sink composites (A) are bonded to a component (B) to be cooled by use of an insulating silicone elastic interface material (9) as shown in FIG. 9 and FIG. 10 so as to achieve excellent heat dissipation.
  • Compared with the technique available now, the present invention has the following advantages:
  • 1. The present invention increases efficiency of 3-dimentional heat dissipation and conduction and electromagnetic radiation absorption.
  • 2. The present invention avoids the occurrence of oxidative damage, so it can maintain a long service life with high performance.
  • 3. The present invention is easy to process and manufacture and has low loss and high yield rate, so it can reduce manufacturing cost.
  • 4. The present invention has no environmental damage during the production process and achieves environmental friendly effect due to its recyclability.

Claims (17)

What is claimed is:
1. A manufacturing process for a heat sink composite having heat dissipation function, comprising the following steps of:
(a) transferring a first heat conductive material and a substrate;
(b) rolling the first heat conductive material and the substrate by a rolling mechanism to adhere the first heat conductive material to the substrate for fixation; and
(c) adhering a second heat conductive material to the substrate for combination and rolling the second heat conductive material and the substrate to be firmly bonded to each other.
2. The manufacturing process for a heat sink composite having heat dissipation function as claimed in claim 1, wherein the first heat conductive material is shaped as a thin film, a flake or a roll.
3. The manufacturing process for a heat sink composite having is heat dissipation function as claimed in claim 1, wherein the first heat conductive material is selected from a group consisting of graphite oxide, graphene oxide and carbon materials with functional groups.
4. The manufacturing process for a heat sink composite having heat dissipation function as claimed in claim 3, wherein the first heat conductive material is shaped as a thin film, a flake or a roll.
5. The manufacturing process for a heat sink composite having heat dissipation function as claimed in claim 1, wherein the substrate is a metal film, a metal mesh, a metal sheet, an inorganic film, an inorganic mesh, an organic film, an organic mesh or a non-woven fabric.
6. The manufacturing process for a heat sink composite having heat dissipation function as claimed in claim 1, wherein the first heat conductive material is sprayed with a phase change material by a spraying mechanism for firmly combining the phase change material to the first heat conductive material.
7. The manufacturing process for a heat sink composite having heat dissipation function as claimed in claim 6, wherein the phase change material is an organic phase change material or an inorganic phase change material.
8. The manufacturing process for a heat sink composite having heat dissipation function as claimed in claim 1, wherein the second heat conductive material is sprayed with a phase change material by a is spraying mechanism for firmly combining the phase change material to the second heat conductive material.
9. The manufacturing process for a heat sink composite having heat dissipation function as claimed in claim 8, wherein the phase change material is an organic phase change material or an inorganic phase change material.
10. The manufacturing process for a heat sink composite having heat dissipation function as claimed in claim 1, wherein the second heat conductive material is shaped as a thin film, a flake or a roll.
11. The manufacturing process for a heat sink composite having heat dissipation function as claimed in claim 1, wherein the second heat conductive material is selected from a group consisting of graphite oxide, graphene oxide and carbon materials with functional groups.
12. The manufacturing process for a heat sink composite having heat dissipation function as claimed in claim 11, wherein the second heat conductive material is shaped as a thin film, a flake or a roll.
13. The manufacturing process for a heat sink composite having heat dissipation function as claimed in claim 1, wherein the second heat conductive material is adhered to the substrate by use of its inherent functional groups.
14. The manufacturing process for a heat sink composite having heat dissipation function as claimed in claim 1, wherein the second heat conductive material is adhered to the substrate by use of an organic adhesive.
15. A manufacturing method for a finished product of the heat sink composite having heat dissipation function as claimed in claim 1, comprising the following steps of:
(a) cutting a plurality of heat sink composites into a size as needed;
(b) arranging the plurality of heat sink composites to form an array;
(c) binding and fixing the plurality of heat sink composites by a heat-resistant insulating tape to be further cut into a size as needed; and
(d) bonding the plurality of heat sink composites to a component to be cooled by use of an insulating silicone elastic interface material.
16. A manufacturing method for a finished product of the heat sink composite having heat dissipation function as claimed in claim 1, comprising the following steps of:
(a) arranging a plurality of heat sink composites having a predetermined size in an array;
(b) winding the plurality of heat sink composites to a predetermined number of layers and binding and fixing the plurality of heat sink composites by a heat-resistant insulating tape;
(c) cutting the plurality of heat sink composites into a size as needed;
(d) axially encapsulating the plurality of heat sink composites; and
(e) bonding the plurality of heat sink composites to a component to is be cooled by use of an insulating silicone elastic interface material.
17. The manufacturing method for a finished product of the heat sink composite having heat dissipation function as claimed in claim 16, further comprises a step of moving plurality of heat sink composites into a vacuum annealing furnace for reduction and annealing after the step (b) and before the step (c) as claimed in claim 16.
US16/421,751 2019-05-24 2019-05-24 Manufacturing process for heat sink composite having heat dissipation function and manufacturing method for its finished product Abandoned US20200368804A1 (en)

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