US20170011854A1 - Laminated electronic component and circuit board for mounting the same - Google Patents
Laminated electronic component and circuit board for mounting the same Download PDFInfo
- Publication number
- US20170011854A1 US20170011854A1 US15/065,521 US201615065521A US2017011854A1 US 20170011854 A1 US20170011854 A1 US 20170011854A1 US 201615065521 A US201615065521 A US 201615065521A US 2017011854 A1 US2017011854 A1 US 2017011854A1
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- US
- United States
- Prior art keywords
- electronic component
- ceramic body
- laminated electronic
- capacitor
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 98
- 239000003990 capacitor Substances 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000005534 acoustic noise Effects 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910002370 SrTiO3 Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
Definitions
- the present disclosure relates to a laminated electronic component and a circuit board on which the laminated electronic component is mounted.
- Ceramic components formed of ceramic materials such as capacitors, inductors, piezoelectric devices, varistors, or thermistors, include a ceramic body formed of ceramic materials, an internal electrode formed in the ceramic body, and an external electrode formed on a surface of the ceramic body and electrically connected to the internal electrode.
- a laminated ceramic capacitor includes a plurality of laminated dielectric layers, internal electrodes disposed to oppose each other with one dielectric layer therebetween, and external electrodes electrically connected to the internal electrodes.
- a volume increase irrelevant to a capacitance increase may occur during a process of stacking or bonding the laminated ceramic capacitors.
- ESL equivalent series inductance
- An aspect of the present inventive concept provides a laminated electronic component capable of reducing a volume increase irrelevant to a capacitance increase and implementing low equivalent series inductance, and a mounting board mounting the laminated electronic component is also provided.
- a laminated electronic component includes a first capacitor and a second capacitor disposed on the first capacitor and electrically connected to the first capacitor. Internal electrodes and external electrodes of the first capacitor and the second capacitor may be disposed to form a current loop in a plane perpendicular to amounting surface when the laminated electronic component is mounted on a board.
- a mounting board mounting the laminated electronic component is provided.
- FIG. 1 is a perspective view schematically illustrating a laminated electronic component according to an exemplary embodiment of the present inventive concept
- FIG. 2 is a cross-sectional view taken along line A-A′ of FIG. 1 ;
- FIG. 3 is an exploded perspective view illustrating a first ceramic body of a first capacitor according to an exemplary embodiment of the present inventive concept
- FIG. 4 is an exploded perspective view of a second ceramic body of a second capacitor according to an exemplary embodiment of the present inventive concept
- FIG. 5 is a perspective view of a laminated electronic component mounted on a printed circuit board according to an exemplary embodiment of the present inventive concept
- FIG. 6 is a cross-sectional view taken along line B-B′ of FIG. 5 ;
- FIG. 7 is a cross-sectional view of a mounting board mounting a laminated electronic component according to a modified embodiment of the present inventive concept.
- FIG. 8 is a cross-sectional view of a mounting board mounting a laminated electronic component according to another modified embodiment of the present inventive concept.
- first, second, third, etc. may be used herein to describe various members, components, regions, layers and/or sections, these members, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one member, component, region, layer, or section from another region, layer, or section. Thus, a first member, component, region, layer, or section discussed below could be termed a second member, component, region, layer, or section without departing from the teachings of the exemplary embodiments.
- spatially relative terms such as “above,” “upper,” “below,” and “lower” and the like, may be used herein for ease of description to describe one element's relationship to another element(s) as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “upper,” or “above” other elements would then be oriented “lower,” or “below” the other elements or features. Thus, the term “above” can encompass both the above and below orientations depending on a particular direction of the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.
- a laminated electronic component includes a first capacitor and a second capacitor arranged in a vertical direction.
- the second capacitor is electrically connected to the first capacitor and disposed on the first capacitor.
- the first capacitor and the second capacitor may be electrically connected through an upper surface of a first ceramic body and a lower surface of a second ceramic body to form a current loop in a plane perpendicular to a mounting surface of a board when the laminated electronic component is mounted on the board.
- a size of the current loop of the first and second capacitors included in the laminated electronic component may be reduced, and thus equivalent series inductance (ESL) of the first and second capacitors may be reduced.
- ESL equivalent series inductance
- the first capacitor and the second capacitor may be connected in series.
- L, W, and T may respectively indicate length, width, and thickness directions of a ceramic body.
- the thickness direction may be used as the same concept as a direction perpendicular to a mounting plane when the laminated electronic component is mounted on the board.
- surfaces opposing each other in a thickness direction of a ceramic body included in the laminated electronic component are defined as upper and lower surfaces.
- FIG. 1 is a perspective view schematically illustrating a laminated electronic component according to an exemplary embodiment
- FIG. 2 is a cross-sectional view taken along line A-A′ of FIG. 1 .
- a laminated electronic component 100 includes a first capacitor 101 a and a second capacitor 101 b disposed on the first capacitor 101 a.
- the first capacitor 101 a includes a first ceramic body 110 a and first external electrodes 131 a and 131 a ′ and second external electrodes 132 a and 132 a′.
- the first external electrodes 131 a and 131 a ′ include a lower-surface first external electrode 131 a disposed on a lower surface of the first ceramic body 110 a and an upper-surface first external electrode 131 a ′ disposed on an upper surface of the first ceramic body 110 a.
- the second external electrodes 132 a and 132 a ′ include a lower-surface second external electrode 132 a disposed on the lower surface of the first ceramic body 110 a and an upper-surface second external electrode 132 a ′ disposed on the upper surface of the first ceramic body 110 a.
- the second capacitor 101 b includes a second ceramic body 110 b and third and fourth external electrodes 131 b and 132 b .
- the third external electrode 131 b is disposed on a lower surface of the second ceramic body 110 b
- the fourth external electrode 132 b is disposed on the lower surface of the second ceramic body 110 b.
- FIG. 3 is an exploded perspective view illustrating a first ceramic body 110 a of a first capacitor 101 a according to an exemplary embodiment.
- the first ceramic body 110 a includes a first internal electrode 121 a and a second internal electrode 122 a , and the first and second internal electrodes 121 a and 122 a may be alternately disposed on a first dielectric layer 111 a , with the first dielectric layer 111 a disposed therebetween.
- the first ceramic body 110 a may be formed by stacking a plurality of first dielectric layers 111 a and the first and second electrodes 121 a and 122 a , and sintering the stacked structure.
- the first dielectric layers 111 a may include a ceramic powder having a high dielectric constant, such as BaTiO 3 -based powder or SrTiO 3 -based powder, but the present inventive concept is not limited thereto.
- the first and second internal electrodes 121 a and 122 a are electrodes having different polarities from each other, which may be formed by printing a conductive paste including a conductive metal on the first dielectric layers 111 a at a predetermined thickness.
- the conductive metal included in the conductive paste may be, for example, nickel (Ni), copper (Cu), palladium (Pd), or alloys thereof, but the present inventive concept is not limited thereto.
- the conductive paste may be printed by screen printing or gravure printing, for example, but the present inventive concept is not limited thereto.
- the first and second internal electrodes 121 a and 122 a may be alternately stacked to oppose each other in a stacking direction of the first dielectric layers 111 a in the first ceramic body 110 a.
- the first dielectric layers 111 a may be stacked in the width direction of the first ceramic body 110 a , and the first and second electrodes 121 a and 122 a may be disposed perpendicularly to upper and lower surfaces of the first ceramic body 110 a.
- the first and second electrodes 121 a and 122 a are drawn to the upper and lower surfaces of the first ceramic body 110 a . That is, the first internal electrode 121 a includes a first lead part drawn to the upper and lower surfaces of the first ceramic body 110 a , and the second internal electrode 122 a includes a second lead part drawn to the upper and lower surfaces of the first ceramic body 110 a.
- the first external electrodes 131 a ′ and 131 a of the first capacitor 101 a are respectively disposed on the upper and lower surfaces of the first ceramic body 110 a to be connected to the first internal electrode 121 a drawn to the upper and lower surfaces of the first ceramic body 110 a
- the second external electrodes 132 a ′ and 132 a of the first capacitor 101 a are respectively disposed apart from the first external electrodes 131 a ′ and 131 a on the upper and lower surfaces of the first ceramic body to be connected to the second internal electrode 122 a drawn to the upper and lower surfaces of the first ceramic body 110 a.
- FIG. 4 is an exploded perspective view of a second ceramic body 110 b of a second capacitor 101 b according to an exemplary embodiment.
- the second ceramic body 110 b includes a third internal electrode 121 b and a fourth internal electrode 122 b , and the third and fourth internal electrodes 121 b and 122 b may be alternately disposed on a second dielectric layer 111 b with the second dielectric layer 111 b therebetween.
- the second ceramic body 110 b may be formed by stacking a plurality of second dielectric layers 111 b and the third and fourth internal electrodes 121 b and 122 b , and sintering the stacked structure.
- the second dielectric layers 111 b may be formed of the same material as or a different dielectric material from the above-described first dielectric layers 111 a , but the present inventive concept is not limited thereto.
- the third and fourth internal electrodes 121 b and 122 b are electrodes having different polarities from each other, which may be formed by printing a conductive paste including a conductive metal on the second dielectric layers 111 b at a predetermined thickness.
- the third and fourth internal electrodes 121 b and 122 b may be formed by a similar method to the above-described first and second electrodes 121 a and 122 a , but the present inventive concept is not limited thereto.
- the third and fourth internal electrodes 121 b and 122 b may be alternately stacked to oppose each other in a stacking direction of the second dielectric layers 111 b in the second ceramic body 110 b.
- the second dielectric layer 111 b may be stacked in the width direction of the second ceramic body 110 b , and the third and fourth internal electrodes 121 b and 122 b may be disposed perpendicularly to upper and lower surfaces of the second ceramic body 110 b.
- the third and fourth internal electrodes 121 b and 122 b are drawn to the lower surface of the second ceramic body 110 b . That is, the third internal electrode 121 b includes a third lead part drawn to the lower surface of the second ceramic body 110 b , and the fourth internal electrode 122 b includes a fourth lead part drawn to the lower surface of the second ceramic body 110 b.
- the third external electrode 131 b of the second capacitor 101 b is disposed on the lower surface of the second ceramic body 110 b to be connected to the third internal electrode 121 b drawn to the lower surface of the second ceramic body 110 b
- the fourth external electrode 132 b of the second capacitor 101 b is disposed apart from the third external electrode 131 b on the lower surface of the second ceramic body 110 b and connected to the fourth internal electrode 122 b drawn to the lower surface of the second ceramic body 110 b.
- a chip size against a capacity of the electronic component may be decreased due to reduced areas of the external electrodes 131 a , 131 a ′, 132 a , 132 a ′, 131 b , and 132 b .
- the capacity against the chip size of the electronic component may be increased.
- a volume increase of a laminated electronic component regardless of a capacitance increase thereof may be reduced, compared to a case in which the external electrodes 131 a , 131 a ′, 132 a , 132 a ′, 131 b , and 132 b of the first and second capacitors 101 a and 101 b are disposed on side surfaces of the ceramic bodies 110 a and 110 b.
- the first to fourth external electrodes 131 a , 131 a ′, 132 a , 132 a ′, 131 b , and 132 b of the first and second capacitors 101 a and 101 b may extend to both side surfaces in the width direction from the upper and lower surfaces of the ceramic bodies 110 a and 110 b.
- the first to fourth external electrodes 131 a , 131 a ′, 132 a , 132 a ′, 131 b , and 132 b of the first and second capacitors 101 a and 101 b may be formed of a conductive paste including a conductive metal.
- the conductive metal may be, for example, nickel (Ni), copper (Cu), palladium (Pd), gold (Au), or alloys thereof, but the present inventive concept is not limited thereto.
- the upper-surface first external electrode 131 a ′ of the first capacitor 101 a may be electrically connected to the third external electrode 131 b of the second capacitor 101 b
- the upper-surface second external electrode 132 a ′ of the first capacitor 101 a may be electrically connected to the fourth external electrode 132 b of the second capacitor 101 b.
- the upper-surface first external electrode 131 a ′ of the first capacitor 101 a and the upper-surface second external electrode 132 a ′ of the first capacitor 101 a may be attached and electrically connected to the third external electrode 131 b of the second capacitor 101 b and the fourth external electrode 132 b of the second capacitor 101 b , respectively, by conductive adhesives 151 and 152 .
- the conductive adhesives 151 and 152 may be solders, but are not limited thereto.
- the conductive adhesives 151 and 152 may include conductive particles and a base resin.
- the conductive particles may be, but are not limited to, silver (Ag) particles, and the base resin may be a thermosetting resin such as an epoxy resin.
- the conductive adhesives 151 and 152 may include copper (Cu) as the conductive metal, but is not limited thereto.
- An external voltage may be applied to the laminated electronic component via the lower-surface first external electrode 131 a and lower-surface second external electrode 132 a disposed on the lower surface of the first ceramic body 110 a , among the external electrodes 131 a , 131 a ′, 132 a , and 132 a ′ of the first capacitor 101 a.
- a voltage applied to the first capacitor 101 a may be transferred to the second capacitor 101 b via the upper-surface first external electrode 131 a ′ and upper-surface second external electrode 132 a ′ disposed on the upper surface of the first ceramic body 110 a , among the external electrodes 131 a , 131 a ′, 132 a , and 132 a ′ of the first capacitor 101 a.
- the second capacitor 101 b may receive the voltage transferred from the first capacitor 101 a via the third external electrode 131 b and fourth external electrode 132 b disposed on the lower surface of the second ceramic body 110 b of the second capacitor 101 b.
- a current loop of the laminated electronic component may be formed in a plane perpendicular to a mounting surface of the board. Accordingly, the size of the current loop formed in the laminated electronic component may be reduced, thus reducing the ESL of the laminated electronic component.
- FIG. 5 is a perspective view of a laminated electronic component mounted on a printed circuit board according to an exemplary embodiment
- FIG. 6 is a cross-sectional view taken along line B-B′ of FIG. 5 .
- a mounting board 200 mounting a laminated electronic component includes a printed circuit board 210 on which electrode pads 221 and 222 are disposed, a laminated electronic component 100 mounted on the printed circuit board 210 , and a solder 230 connecting the electrode pads 221 and 222 to the laminated electronic component 100 .
- the mounting board 200 mounting the laminated electronic component includes the printed circuit board 210 on which the laminated electronic component 100 is mounted, and two or more electrode pads 221 and 222 formed on an upper surface of the printed circuit board 210 .
- the electrode pads 221 and 222 may include first and second electrode pads 221 and 222 , and the first electrode pad 221 may be connected to a lower-surface first external electrode 131 a of a first capacitor 101 a disposed at a lower part of the laminated electronic component 100 , and the second electrode pad 222 may be connected to a lower-surface second external electrode 132 a of the first capacitor 101 a.
- the lower-surface first external electrode 131 a and the lower-surface second external electrode 132 a may be respectively disposed on the first and second electrode pads 221 and 222 to be in contact therewith, and electrically connected to the printed circuit board 210 by the solder 230 .
- FIG. 7 is a cross-sectional view of a mounting board mounting a laminated electronic component according to a modified embodiment of the present inventive concept.
- the mounting board 200 ′ mounting the laminated electronic component according to the modified embodiment may further include a ceramic substrate 170 disposed between a laminated electronic component 100 and a printed circuit board 210 .
- the ceramic substrate 170 may include an insulating body 173 and first and second conductive layers 171 and 172 formed on an outer surface of the insulating body 173 .
- the first conductive layer 171 may be connected to a lower-surface first external electrode 131 a of a first capacitor 101 a and a first electrode pad 221 of the printed circuit board 210
- the second conductive layer 172 may be connected to a lower-surface second external electrode 132 a of the first capacitor 101 a and a second electrode pad 222 of the printed circuit board 210 .
- the first conductive layer 171 may extend from one surface in the length direction of the insulating body 173 to an upper surface and a lower surface of the insulating body 173
- the second conductive layer 172 may extend from the other surface in the length direction of the insulating body 173 to the upper surface and the lower surface of the insulating body 173 .
- the present inventive concept is not limited thereto.
- Electronic components having piezoelectric and electrostrictive characteristics may generate acoustic noise when they are mounted on a board.
- the laminated electronic component 100 according to the exemplary embodiment may also generate acoustic noise when it is directly mounted on a board.
- the laminated electronic component 100 is not directly mounted on the printed circuit board 210 , but mounted on the printed circuit board 210 with the ceramic substrate 170 interposed therebetween, thus reducing acoustic noise generated by the laminated electronic component.
- the lower-surface first external electrode 131 a of the first capacitor 101 a and the lower-surface second external electrode 132 a of the first capacitor 101 a may be attached and electrically connected to the first conductive layer 171 of the ceramic substrate 170 and the second conductive layer 172 of the ceramic substrate 170 , respectively, by conductive adhesives 161 and 162 .
- the conductive adhesives 161 and 162 may be solders, but are not limited thereto.
- the conductive adhesives 161 and 162 may include conductive particles and a base resin.
- the conductive particles may be, but are not limited to, silver (Ag) particles, and the base resin may be a thermosetting resin such as an epoxy resin.
- the conductive adhesives 161 and 162 may include copper (Cu) as the conductive metal, but is not limited thereto.
- FIG. 8 is a cross-sectional view of a mounting board mounting a laminated electronic component according to another modified embodiment of the present inventive concept.
- a mounting board 200 ′′ mounting a laminated electronic component may further include conductive vias 174 and 175 passing through the insulating body 173 of the ceramic substrate 170 ′ in addition to the configuration of the mounting board 200 ′ of the modified example of FIG. 7 .
- a ceramic substrate 170 ′ disposed between the laminated electronic component 100 and the printed circuit board 210 may include a first conductive via 174 connecting a portion of the first conductive layer 171 extending to an upper surface of the insulating body 173 to a portion of the first conductive layer 171 extending to a lower surface of the insulating body 173 , and passing through the insulating body 173 , and a second conductive via 175 connecting a portion of the second conductive layer 172 extending to the upper surface of the insulating body 173 to a portion of the second conductive layer 172 extending to the lower surface of the insulating body 173 .
- a ceramic substrate may be disposed between a laminated electronic component and a printed circuit board. Acoustic noise generated by the laminated electronic component may be reduced, but ESL may increase because a voltage applied via an electrode pad of the printed circuit board is applied to the laminated electronic component via the ceramic substrate.
- a laminated electronic component capable of reducing a volume increase irrelevant to a capacitance increase and implementing low ESL, and a mounting board mounting the laminated electronic component, may be provided.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US16/267,678 US10714265B2 (en) | 2015-07-06 | 2019-02-05 | Laminated electronic component and circuit board for mounting the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020150096169A KR102183424B1 (ko) | 2015-07-06 | 2015-07-06 | 적층 전자부품 및 적층 전자부품의 실장 기판 |
KR10-2015-0096169 | 2015-07-06 |
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US16/267,678 Continuation US10714265B2 (en) | 2015-07-06 | 2019-02-05 | Laminated electronic component and circuit board for mounting the same |
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US20170011854A1 true US20170011854A1 (en) | 2017-01-12 |
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US15/065,521 Abandoned US20170011854A1 (en) | 2015-07-06 | 2016-03-09 | Laminated electronic component and circuit board for mounting the same |
US16/267,678 Active US10714265B2 (en) | 2015-07-06 | 2019-02-05 | Laminated electronic component and circuit board for mounting the same |
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US16/267,678 Active US10714265B2 (en) | 2015-07-06 | 2019-02-05 | Laminated electronic component and circuit board for mounting the same |
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KR (1) | KR102183424B1 (ko) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US20170105283A1 (en) * | 2015-10-12 | 2017-04-13 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and board having electronic component mounted thereon |
US20170163929A1 (en) * | 2015-12-04 | 2017-06-08 | Livestream LLC | Video stream encoding system with live crop editing and recording |
US10178770B1 (en) * | 2017-12-22 | 2019-01-08 | Kemet Electronics Corporation | Higher density multi-component and serial packages |
US20220384098A1 (en) * | 2021-05-31 | 2022-12-01 | Murata Manufacturing Co., Ltd. | Electronic component |
US11640876B2 (en) * | 2020-11-02 | 2023-05-02 | Samsung Electro-Mechanics Co., Ltd. | Electronic component |
Families Citing this family (2)
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KR102516763B1 (ko) * | 2017-08-29 | 2023-03-31 | 삼성전기주식회사 | 복합 전자부품, 그 실장 기판 |
CN112004316A (zh) * | 2020-07-17 | 2020-11-27 | 苏州浪潮智能科技有限公司 | 一种元件堆叠设计的印刷电路板结构及焊接方法 |
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Also Published As
Publication number | Publication date |
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KR102183424B1 (ko) | 2020-11-26 |
US10714265B2 (en) | 2020-07-14 |
KR20170005723A (ko) | 2017-01-16 |
US20190172651A1 (en) | 2019-06-06 |
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