US20170011854A1 - Laminated electronic component and circuit board for mounting the same - Google Patents
Laminated electronic component and circuit board for mounting the same Download PDFInfo
- Publication number
- US20170011854A1 US20170011854A1 US15/065,521 US201615065521A US2017011854A1 US 20170011854 A1 US20170011854 A1 US 20170011854A1 US 201615065521 A US201615065521 A US 201615065521A US 2017011854 A1 US2017011854 A1 US 2017011854A1
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- United States
- Prior art keywords
- electronic component
- ceramic body
- laminated electronic
- capacitor
- disposed
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- Abandoned
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 98
- 239000003990 capacitor Substances 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000005534 acoustic noise Effects 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910002370 SrTiO3 Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
Definitions
- the present disclosure relates to a laminated electronic component and a circuit board on which the laminated electronic component is mounted.
- Ceramic components formed of ceramic materials such as capacitors, inductors, piezoelectric devices, varistors, or thermistors, include a ceramic body formed of ceramic materials, an internal electrode formed in the ceramic body, and an external electrode formed on a surface of the ceramic body and electrically connected to the internal electrode.
- a laminated ceramic capacitor includes a plurality of laminated dielectric layers, internal electrodes disposed to oppose each other with one dielectric layer therebetween, and external electrodes electrically connected to the internal electrodes.
- a volume increase irrelevant to a capacitance increase may occur during a process of stacking or bonding the laminated ceramic capacitors.
- ESL equivalent series inductance
- An aspect of the present inventive concept provides a laminated electronic component capable of reducing a volume increase irrelevant to a capacitance increase and implementing low equivalent series inductance, and a mounting board mounting the laminated electronic component is also provided.
- a laminated electronic component includes a first capacitor and a second capacitor disposed on the first capacitor and electrically connected to the first capacitor. Internal electrodes and external electrodes of the first capacitor and the second capacitor may be disposed to form a current loop in a plane perpendicular to amounting surface when the laminated electronic component is mounted on a board.
- a mounting board mounting the laminated electronic component is provided.
- FIG. 1 is a perspective view schematically illustrating a laminated electronic component according to an exemplary embodiment of the present inventive concept
- FIG. 2 is a cross-sectional view taken along line A-A′ of FIG. 1 ;
- FIG. 3 is an exploded perspective view illustrating a first ceramic body of a first capacitor according to an exemplary embodiment of the present inventive concept
- FIG. 4 is an exploded perspective view of a second ceramic body of a second capacitor according to an exemplary embodiment of the present inventive concept
- FIG. 5 is a perspective view of a laminated electronic component mounted on a printed circuit board according to an exemplary embodiment of the present inventive concept
- FIG. 6 is a cross-sectional view taken along line B-B′ of FIG. 5 ;
- FIG. 7 is a cross-sectional view of a mounting board mounting a laminated electronic component according to a modified embodiment of the present inventive concept.
- FIG. 8 is a cross-sectional view of a mounting board mounting a laminated electronic component according to another modified embodiment of the present inventive concept.
- first, second, third, etc. may be used herein to describe various members, components, regions, layers and/or sections, these members, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one member, component, region, layer, or section from another region, layer, or section. Thus, a first member, component, region, layer, or section discussed below could be termed a second member, component, region, layer, or section without departing from the teachings of the exemplary embodiments.
- spatially relative terms such as “above,” “upper,” “below,” and “lower” and the like, may be used herein for ease of description to describe one element's relationship to another element(s) as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “upper,” or “above” other elements would then be oriented “lower,” or “below” the other elements or features. Thus, the term “above” can encompass both the above and below orientations depending on a particular direction of the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.
- a laminated electronic component includes a first capacitor and a second capacitor arranged in a vertical direction.
- the second capacitor is electrically connected to the first capacitor and disposed on the first capacitor.
- the first capacitor and the second capacitor may be electrically connected through an upper surface of a first ceramic body and a lower surface of a second ceramic body to form a current loop in a plane perpendicular to a mounting surface of a board when the laminated electronic component is mounted on the board.
- a size of the current loop of the first and second capacitors included in the laminated electronic component may be reduced, and thus equivalent series inductance (ESL) of the first and second capacitors may be reduced.
- ESL equivalent series inductance
- the first capacitor and the second capacitor may be connected in series.
- L, W, and T may respectively indicate length, width, and thickness directions of a ceramic body.
- the thickness direction may be used as the same concept as a direction perpendicular to a mounting plane when the laminated electronic component is mounted on the board.
- surfaces opposing each other in a thickness direction of a ceramic body included in the laminated electronic component are defined as upper and lower surfaces.
- FIG. 1 is a perspective view schematically illustrating a laminated electronic component according to an exemplary embodiment
- FIG. 2 is a cross-sectional view taken along line A-A′ of FIG. 1 .
- a laminated electronic component 100 includes a first capacitor 101 a and a second capacitor 101 b disposed on the first capacitor 101 a.
- the first capacitor 101 a includes a first ceramic body 110 a and first external electrodes 131 a and 131 a ′ and second external electrodes 132 a and 132 a′.
- the first external electrodes 131 a and 131 a ′ include a lower-surface first external electrode 131 a disposed on a lower surface of the first ceramic body 110 a and an upper-surface first external electrode 131 a ′ disposed on an upper surface of the first ceramic body 110 a.
- the second external electrodes 132 a and 132 a ′ include a lower-surface second external electrode 132 a disposed on the lower surface of the first ceramic body 110 a and an upper-surface second external electrode 132 a ′ disposed on the upper surface of the first ceramic body 110 a.
- the second capacitor 101 b includes a second ceramic body 110 b and third and fourth external electrodes 131 b and 132 b .
- the third external electrode 131 b is disposed on a lower surface of the second ceramic body 110 b
- the fourth external electrode 132 b is disposed on the lower surface of the second ceramic body 110 b.
- FIG. 3 is an exploded perspective view illustrating a first ceramic body 110 a of a first capacitor 101 a according to an exemplary embodiment.
- the first ceramic body 110 a includes a first internal electrode 121 a and a second internal electrode 122 a , and the first and second internal electrodes 121 a and 122 a may be alternately disposed on a first dielectric layer 111 a , with the first dielectric layer 111 a disposed therebetween.
- the first ceramic body 110 a may be formed by stacking a plurality of first dielectric layers 111 a and the first and second electrodes 121 a and 122 a , and sintering the stacked structure.
- the first dielectric layers 111 a may include a ceramic powder having a high dielectric constant, such as BaTiO 3 -based powder or SrTiO 3 -based powder, but the present inventive concept is not limited thereto.
- the first and second internal electrodes 121 a and 122 a are electrodes having different polarities from each other, which may be formed by printing a conductive paste including a conductive metal on the first dielectric layers 111 a at a predetermined thickness.
- the conductive metal included in the conductive paste may be, for example, nickel (Ni), copper (Cu), palladium (Pd), or alloys thereof, but the present inventive concept is not limited thereto.
- the conductive paste may be printed by screen printing or gravure printing, for example, but the present inventive concept is not limited thereto.
- the first and second internal electrodes 121 a and 122 a may be alternately stacked to oppose each other in a stacking direction of the first dielectric layers 111 a in the first ceramic body 110 a.
- the first dielectric layers 111 a may be stacked in the width direction of the first ceramic body 110 a , and the first and second electrodes 121 a and 122 a may be disposed perpendicularly to upper and lower surfaces of the first ceramic body 110 a.
- the first and second electrodes 121 a and 122 a are drawn to the upper and lower surfaces of the first ceramic body 110 a . That is, the first internal electrode 121 a includes a first lead part drawn to the upper and lower surfaces of the first ceramic body 110 a , and the second internal electrode 122 a includes a second lead part drawn to the upper and lower surfaces of the first ceramic body 110 a.
- the first external electrodes 131 a ′ and 131 a of the first capacitor 101 a are respectively disposed on the upper and lower surfaces of the first ceramic body 110 a to be connected to the first internal electrode 121 a drawn to the upper and lower surfaces of the first ceramic body 110 a
- the second external electrodes 132 a ′ and 132 a of the first capacitor 101 a are respectively disposed apart from the first external electrodes 131 a ′ and 131 a on the upper and lower surfaces of the first ceramic body to be connected to the second internal electrode 122 a drawn to the upper and lower surfaces of the first ceramic body 110 a.
- FIG. 4 is an exploded perspective view of a second ceramic body 110 b of a second capacitor 101 b according to an exemplary embodiment.
- the second ceramic body 110 b includes a third internal electrode 121 b and a fourth internal electrode 122 b , and the third and fourth internal electrodes 121 b and 122 b may be alternately disposed on a second dielectric layer 111 b with the second dielectric layer 111 b therebetween.
- the second ceramic body 110 b may be formed by stacking a plurality of second dielectric layers 111 b and the third and fourth internal electrodes 121 b and 122 b , and sintering the stacked structure.
- the second dielectric layers 111 b may be formed of the same material as or a different dielectric material from the above-described first dielectric layers 111 a , but the present inventive concept is not limited thereto.
- the third and fourth internal electrodes 121 b and 122 b are electrodes having different polarities from each other, which may be formed by printing a conductive paste including a conductive metal on the second dielectric layers 111 b at a predetermined thickness.
- the third and fourth internal electrodes 121 b and 122 b may be formed by a similar method to the above-described first and second electrodes 121 a and 122 a , but the present inventive concept is not limited thereto.
- the third and fourth internal electrodes 121 b and 122 b may be alternately stacked to oppose each other in a stacking direction of the second dielectric layers 111 b in the second ceramic body 110 b.
- the second dielectric layer 111 b may be stacked in the width direction of the second ceramic body 110 b , and the third and fourth internal electrodes 121 b and 122 b may be disposed perpendicularly to upper and lower surfaces of the second ceramic body 110 b.
- the third and fourth internal electrodes 121 b and 122 b are drawn to the lower surface of the second ceramic body 110 b . That is, the third internal electrode 121 b includes a third lead part drawn to the lower surface of the second ceramic body 110 b , and the fourth internal electrode 122 b includes a fourth lead part drawn to the lower surface of the second ceramic body 110 b.
- the third external electrode 131 b of the second capacitor 101 b is disposed on the lower surface of the second ceramic body 110 b to be connected to the third internal electrode 121 b drawn to the lower surface of the second ceramic body 110 b
- the fourth external electrode 132 b of the second capacitor 101 b is disposed apart from the third external electrode 131 b on the lower surface of the second ceramic body 110 b and connected to the fourth internal electrode 122 b drawn to the lower surface of the second ceramic body 110 b.
- a chip size against a capacity of the electronic component may be decreased due to reduced areas of the external electrodes 131 a , 131 a ′, 132 a , 132 a ′, 131 b , and 132 b .
- the capacity against the chip size of the electronic component may be increased.
- a volume increase of a laminated electronic component regardless of a capacitance increase thereof may be reduced, compared to a case in which the external electrodes 131 a , 131 a ′, 132 a , 132 a ′, 131 b , and 132 b of the first and second capacitors 101 a and 101 b are disposed on side surfaces of the ceramic bodies 110 a and 110 b.
- the first to fourth external electrodes 131 a , 131 a ′, 132 a , 132 a ′, 131 b , and 132 b of the first and second capacitors 101 a and 101 b may extend to both side surfaces in the width direction from the upper and lower surfaces of the ceramic bodies 110 a and 110 b.
- the first to fourth external electrodes 131 a , 131 a ′, 132 a , 132 a ′, 131 b , and 132 b of the first and second capacitors 101 a and 101 b may be formed of a conductive paste including a conductive metal.
- the conductive metal may be, for example, nickel (Ni), copper (Cu), palladium (Pd), gold (Au), or alloys thereof, but the present inventive concept is not limited thereto.
- the upper-surface first external electrode 131 a ′ of the first capacitor 101 a may be electrically connected to the third external electrode 131 b of the second capacitor 101 b
- the upper-surface second external electrode 132 a ′ of the first capacitor 101 a may be electrically connected to the fourth external electrode 132 b of the second capacitor 101 b.
- the upper-surface first external electrode 131 a ′ of the first capacitor 101 a and the upper-surface second external electrode 132 a ′ of the first capacitor 101 a may be attached and electrically connected to the third external electrode 131 b of the second capacitor 101 b and the fourth external electrode 132 b of the second capacitor 101 b , respectively, by conductive adhesives 151 and 152 .
- the conductive adhesives 151 and 152 may be solders, but are not limited thereto.
- the conductive adhesives 151 and 152 may include conductive particles and a base resin.
- the conductive particles may be, but are not limited to, silver (Ag) particles, and the base resin may be a thermosetting resin such as an epoxy resin.
- the conductive adhesives 151 and 152 may include copper (Cu) as the conductive metal, but is not limited thereto.
- An external voltage may be applied to the laminated electronic component via the lower-surface first external electrode 131 a and lower-surface second external electrode 132 a disposed on the lower surface of the first ceramic body 110 a , among the external electrodes 131 a , 131 a ′, 132 a , and 132 a ′ of the first capacitor 101 a.
- a voltage applied to the first capacitor 101 a may be transferred to the second capacitor 101 b via the upper-surface first external electrode 131 a ′ and upper-surface second external electrode 132 a ′ disposed on the upper surface of the first ceramic body 110 a , among the external electrodes 131 a , 131 a ′, 132 a , and 132 a ′ of the first capacitor 101 a.
- the second capacitor 101 b may receive the voltage transferred from the first capacitor 101 a via the third external electrode 131 b and fourth external electrode 132 b disposed on the lower surface of the second ceramic body 110 b of the second capacitor 101 b.
- a current loop of the laminated electronic component may be formed in a plane perpendicular to a mounting surface of the board. Accordingly, the size of the current loop formed in the laminated electronic component may be reduced, thus reducing the ESL of the laminated electronic component.
- FIG. 5 is a perspective view of a laminated electronic component mounted on a printed circuit board according to an exemplary embodiment
- FIG. 6 is a cross-sectional view taken along line B-B′ of FIG. 5 .
- a mounting board 200 mounting a laminated electronic component includes a printed circuit board 210 on which electrode pads 221 and 222 are disposed, a laminated electronic component 100 mounted on the printed circuit board 210 , and a solder 230 connecting the electrode pads 221 and 222 to the laminated electronic component 100 .
- the mounting board 200 mounting the laminated electronic component includes the printed circuit board 210 on which the laminated electronic component 100 is mounted, and two or more electrode pads 221 and 222 formed on an upper surface of the printed circuit board 210 .
- the electrode pads 221 and 222 may include first and second electrode pads 221 and 222 , and the first electrode pad 221 may be connected to a lower-surface first external electrode 131 a of a first capacitor 101 a disposed at a lower part of the laminated electronic component 100 , and the second electrode pad 222 may be connected to a lower-surface second external electrode 132 a of the first capacitor 101 a.
- the lower-surface first external electrode 131 a and the lower-surface second external electrode 132 a may be respectively disposed on the first and second electrode pads 221 and 222 to be in contact therewith, and electrically connected to the printed circuit board 210 by the solder 230 .
- FIG. 7 is a cross-sectional view of a mounting board mounting a laminated electronic component according to a modified embodiment of the present inventive concept.
- the mounting board 200 ′ mounting the laminated electronic component according to the modified embodiment may further include a ceramic substrate 170 disposed between a laminated electronic component 100 and a printed circuit board 210 .
- the ceramic substrate 170 may include an insulating body 173 and first and second conductive layers 171 and 172 formed on an outer surface of the insulating body 173 .
- the first conductive layer 171 may be connected to a lower-surface first external electrode 131 a of a first capacitor 101 a and a first electrode pad 221 of the printed circuit board 210
- the second conductive layer 172 may be connected to a lower-surface second external electrode 132 a of the first capacitor 101 a and a second electrode pad 222 of the printed circuit board 210 .
- the first conductive layer 171 may extend from one surface in the length direction of the insulating body 173 to an upper surface and a lower surface of the insulating body 173
- the second conductive layer 172 may extend from the other surface in the length direction of the insulating body 173 to the upper surface and the lower surface of the insulating body 173 .
- the present inventive concept is not limited thereto.
- Electronic components having piezoelectric and electrostrictive characteristics may generate acoustic noise when they are mounted on a board.
- the laminated electronic component 100 according to the exemplary embodiment may also generate acoustic noise when it is directly mounted on a board.
- the laminated electronic component 100 is not directly mounted on the printed circuit board 210 , but mounted on the printed circuit board 210 with the ceramic substrate 170 interposed therebetween, thus reducing acoustic noise generated by the laminated electronic component.
- the lower-surface first external electrode 131 a of the first capacitor 101 a and the lower-surface second external electrode 132 a of the first capacitor 101 a may be attached and electrically connected to the first conductive layer 171 of the ceramic substrate 170 and the second conductive layer 172 of the ceramic substrate 170 , respectively, by conductive adhesives 161 and 162 .
- the conductive adhesives 161 and 162 may be solders, but are not limited thereto.
- the conductive adhesives 161 and 162 may include conductive particles and a base resin.
- the conductive particles may be, but are not limited to, silver (Ag) particles, and the base resin may be a thermosetting resin such as an epoxy resin.
- the conductive adhesives 161 and 162 may include copper (Cu) as the conductive metal, but is not limited thereto.
- FIG. 8 is a cross-sectional view of a mounting board mounting a laminated electronic component according to another modified embodiment of the present inventive concept.
- a mounting board 200 ′′ mounting a laminated electronic component may further include conductive vias 174 and 175 passing through the insulating body 173 of the ceramic substrate 170 ′ in addition to the configuration of the mounting board 200 ′ of the modified example of FIG. 7 .
- a ceramic substrate 170 ′ disposed between the laminated electronic component 100 and the printed circuit board 210 may include a first conductive via 174 connecting a portion of the first conductive layer 171 extending to an upper surface of the insulating body 173 to a portion of the first conductive layer 171 extending to a lower surface of the insulating body 173 , and passing through the insulating body 173 , and a second conductive via 175 connecting a portion of the second conductive layer 172 extending to the upper surface of the insulating body 173 to a portion of the second conductive layer 172 extending to the lower surface of the insulating body 173 .
- a ceramic substrate may be disposed between a laminated electronic component and a printed circuit board. Acoustic noise generated by the laminated electronic component may be reduced, but ESL may increase because a voltage applied via an electrode pad of the printed circuit board is applied to the laminated electronic component via the ceramic substrate.
- a laminated electronic component capable of reducing a volume increase irrelevant to a capacitance increase and implementing low ESL, and a mounting board mounting the laminated electronic component, may be provided.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
Abstract
A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.
Description
- This application claims the benefit of priority to Korean Patent Application No. 10-2015-0096169, filed on Jul. 6, 2015 with the Korean Intellectual Property Office, the entirety of which is incorporated herein by reference.
- The present disclosure relates to a laminated electronic component and a circuit board on which the laminated electronic component is mounted.
- Electronic components formed of ceramic materials, such as capacitors, inductors, piezoelectric devices, varistors, or thermistors, include a ceramic body formed of ceramic materials, an internal electrode formed in the ceramic body, and an external electrode formed on a surface of the ceramic body and electrically connected to the internal electrode.
- Among the ceramic electronic components, a laminated ceramic capacitor includes a plurality of laminated dielectric layers, internal electrodes disposed to oppose each other with one dielectric layer therebetween, and external electrodes electrically connected to the internal electrodes.
- In a laminated electronic component in which two or more laminated ceramic capacitors are stacked, a volume increase irrelevant to a capacitance increase may occur during a process of stacking or bonding the laminated ceramic capacitors.
- Furthermore, the level of equivalent series inductance (ESL) is an important characteristic in the laminated electronic component including the laminated ceramic capacitors. Electronic components having low ESL are desirable depending on the use thereof.
- An aspect of the present inventive concept provides a laminated electronic component capable of reducing a volume increase irrelevant to a capacitance increase and implementing low equivalent series inductance, and a mounting board mounting the laminated electronic component is also provided.
- According to an aspect of the present inventive concept, a laminated electronic component includes a first capacitor and a second capacitor disposed on the first capacitor and electrically connected to the first capacitor. Internal electrodes and external electrodes of the first capacitor and the second capacitor may be disposed to form a current loop in a plane perpendicular to amounting surface when the laminated electronic component is mounted on a board.
- According to another aspect of the present inventive concept, a mounting board mounting the laminated electronic component is provided.
- The above and other aspects, features, and advantages will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
-
FIG. 1 is a perspective view schematically illustrating a laminated electronic component according to an exemplary embodiment of the present inventive concept; -
FIG. 2 is a cross-sectional view taken along line A-A′ ofFIG. 1 ; -
FIG. 3 is an exploded perspective view illustrating a first ceramic body of a first capacitor according to an exemplary embodiment of the present inventive concept; -
FIG. 4 is an exploded perspective view of a second ceramic body of a second capacitor according to an exemplary embodiment of the present inventive concept; -
FIG. 5 is a perspective view of a laminated electronic component mounted on a printed circuit board according to an exemplary embodiment of the present inventive concept; -
FIG. 6 is a cross-sectional view taken along line B-B′ ofFIG. 5 ; -
FIG. 7 is a cross-sectional view of a mounting board mounting a laminated electronic component according to a modified embodiment of the present inventive concept; and -
FIG. 8 is a cross-sectional view of a mounting board mounting a laminated electronic component according to another modified embodiment of the present inventive concept. - Hereinafter, embodiments will be described as follows with reference to the attached drawings.
- The present inventive concept may, however, be exemplified in many different forms and should not be construed as being limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
- Throughout the specification, it will be understood that when an element, such as a layer, region or wafer (substrate), is referred to as being “on,” “connected to,” or “coupled to” another element, it can be directly “on,” “connected to,” or “coupled to” the other element or other elements intervening therebetween may be present. In contrast, when an element is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element, there may be no elements or layers intervening therebetween. Like numerals refer to like elements throughout. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
- It will be apparent that though the terms first, second, third, etc. may be used herein to describe various members, components, regions, layers and/or sections, these members, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one member, component, region, layer, or section from another region, layer, or section. Thus, a first member, component, region, layer, or section discussed below could be termed a second member, component, region, layer, or section without departing from the teachings of the exemplary embodiments.
- Spatially relative terms, such as “above,” “upper,” “below,” and “lower” and the like, may be used herein for ease of description to describe one element's relationship to another element(s) as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “upper,” or “above” other elements would then be oriented “lower,” or “below” the other elements or features. Thus, the term “above” can encompass both the above and below orientations depending on a particular direction of the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.
- The terminology used herein is for describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” and/or “comprising” when used in this specification, specify the presence of stated features, integers, steps, operations, members, elements, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, members, elements, and/or groups thereof.
- Hereinafter, embodiments will be described with reference to schematic views illustrating embodiments. In the drawings, for example, due to manufacturing techniques and/or tolerances, modifications of the shape shown may be estimated. Thus, embodiments should not be construed as being limited to the particular shapes of regions shown herein, for example, to include a change in shape results in manufacturing. The following embodiments may also be constituted by one or a combination thereof.
- A laminated electronic component according to an exemplary embodiment includes a first capacitor and a second capacitor arranged in a vertical direction.
- The second capacitor is electrically connected to the first capacitor and disposed on the first capacitor.
- According to the exemplary embodiment, the first capacitor and the second capacitor may be electrically connected through an upper surface of a first ceramic body and a lower surface of a second ceramic body to form a current loop in a plane perpendicular to a mounting surface of a board when the laminated electronic component is mounted on the board.
- Therefore, a size of the current loop of the first and second capacitors included in the laminated electronic component may be reduced, and thus equivalent series inductance (ESL) of the first and second capacitors may be reduced. Thereby, the ESL of the laminated electronic component may be reduced.
- The first capacitor and the second capacitor may be connected in series.
- Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings, but the present inventive concept is not limited thereto.
- Directions may be defined to clearly describe the exemplary embodiments. In the drawings, L, W, and T may respectively indicate length, width, and thickness directions of a ceramic body. Here, the thickness direction may be used as the same concept as a direction perpendicular to a mounting plane when the laminated electronic component is mounted on the board.
- In addition, for convenience of description, surfaces opposing each other in a thickness direction of a ceramic body included in the laminated electronic component are defined as upper and lower surfaces.
-
FIG. 1 is a perspective view schematically illustrating a laminated electronic component according to an exemplary embodiment, andFIG. 2 is a cross-sectional view taken along line A-A′ ofFIG. 1 . - Referring to
FIGS. 1 and 2 , a laminatedelectronic component 100 according to the exemplary embodiment includes afirst capacitor 101 a and asecond capacitor 101 b disposed on thefirst capacitor 101 a. - The
first capacitor 101 a includes a firstceramic body 110 a and firstexternal electrodes external electrodes - The first
external electrodes external electrode 131 a disposed on a lower surface of the firstceramic body 110 a and an upper-surface firstexternal electrode 131 a′ disposed on an upper surface of the firstceramic body 110 a. - The second
external electrodes external electrode 132 a disposed on the lower surface of the firstceramic body 110 a and an upper-surface secondexternal electrode 132 a′ disposed on the upper surface of the firstceramic body 110 a. - The
second capacitor 101 b includes a secondceramic body 110 b and third and fourthexternal electrodes external electrode 131 b is disposed on a lower surface of the secondceramic body 110 b, and the fourthexternal electrode 132 b is disposed on the lower surface of the secondceramic body 110 b. -
FIG. 3 is an exploded perspective view illustrating a firstceramic body 110 a of afirst capacitor 101 a according to an exemplary embodiment. - Referring to
FIGS. 2 and 3 , the firstceramic body 110 a includes a firstinternal electrode 121 a and a secondinternal electrode 122 a, and the first and secondinternal electrodes dielectric layer 111 a, with thefirst dielectric layer 111 a disposed therebetween. - The first
ceramic body 110 a may be formed by stacking a plurality of firstdielectric layers 111 a and the first andsecond electrodes - The first
dielectric layers 111 a may include a ceramic powder having a high dielectric constant, such as BaTiO3-based powder or SrTiO3-based powder, but the present inventive concept is not limited thereto. - The first and second
internal electrodes dielectric layers 111 a at a predetermined thickness. - Here, the conductive metal included in the conductive paste may be, for example, nickel (Ni), copper (Cu), palladium (Pd), or alloys thereof, but the present inventive concept is not limited thereto.
- In addition, the conductive paste may be printed by screen printing or gravure printing, for example, but the present inventive concept is not limited thereto.
- The first and second
internal electrodes dielectric layers 111 a in the firstceramic body 110 a. - According to the exemplary embodiment, the first
dielectric layers 111 a may be stacked in the width direction of the firstceramic body 110 a, and the first andsecond electrodes ceramic body 110 a. - According to the exemplary embodiment, the first and
second electrodes ceramic body 110 a. That is, the firstinternal electrode 121 a includes a first lead part drawn to the upper and lower surfaces of the firstceramic body 110 a, and the secondinternal electrode 122 a includes a second lead part drawn to the upper and lower surfaces of the firstceramic body 110 a. - The first
external electrodes 131 a′ and 131 a of thefirst capacitor 101 a are respectively disposed on the upper and lower surfaces of the firstceramic body 110 a to be connected to the firstinternal electrode 121 a drawn to the upper and lower surfaces of the firstceramic body 110 a, and the secondexternal electrodes 132 a′ and 132 a of thefirst capacitor 101 a are respectively disposed apart from the firstexternal electrodes 131 a′ and 131 a on the upper and lower surfaces of the first ceramic body to be connected to the secondinternal electrode 122 a drawn to the upper and lower surfaces of the firstceramic body 110 a. -
FIG. 4 is an exploded perspective view of a secondceramic body 110 b of asecond capacitor 101 b according to an exemplary embodiment. - Referring to
FIGS. 2 and 4 , the secondceramic body 110 b includes a thirdinternal electrode 121 b and a fourthinternal electrode 122 b, and the third and fourthinternal electrodes second dielectric layer 111 b with thesecond dielectric layer 111 b therebetween. - The second
ceramic body 110 b may be formed by stacking a plurality of seconddielectric layers 111 b and the third and fourthinternal electrodes - The second
dielectric layers 111 b may be formed of the same material as or a different dielectric material from the above-described firstdielectric layers 111 a, but the present inventive concept is not limited thereto. - The third and fourth
internal electrodes dielectric layers 111 b at a predetermined thickness. The third and fourthinternal electrodes second electrodes - The third and fourth
internal electrodes dielectric layers 111 b in the secondceramic body 110 b. - According to the exemplary embodiment, the
second dielectric layer 111 b may be stacked in the width direction of the secondceramic body 110 b, and the third and fourthinternal electrodes ceramic body 110 b. - According to the exemplary embodiment, the third and fourth
internal electrodes ceramic body 110 b. That is, the thirdinternal electrode 121 b includes a third lead part drawn to the lower surface of the secondceramic body 110 b, and the fourthinternal electrode 122 b includes a fourth lead part drawn to the lower surface of the secondceramic body 110 b. - The third
external electrode 131 b of thesecond capacitor 101 b is disposed on the lower surface of the secondceramic body 110 b to be connected to the thirdinternal electrode 121 b drawn to the lower surface of the secondceramic body 110 b, and the fourthexternal electrode 132 b of thesecond capacitor 101 b is disposed apart from the thirdexternal electrode 131 b on the lower surface of the secondceramic body 110 b and connected to the fourthinternal electrode 122 b drawn to the lower surface of the secondceramic body 110 b. - According to the exemplary embodiment, since the
external electrodes second capacitors ceramic bodies external electrodes - In addition, a volume increase of a laminated electronic component regardless of a capacitance increase thereof may be reduced, compared to a case in which the
external electrodes second capacitors ceramic bodies - The first to fourth
external electrodes second capacitors ceramic bodies - The first to fourth
external electrodes second capacitors - Here, the conductive metal may be, for example, nickel (Ni), copper (Cu), palladium (Pd), gold (Au), or alloys thereof, but the present inventive concept is not limited thereto.
- According to the exemplary embodiment, the upper-surface first
external electrode 131 a′ of thefirst capacitor 101 a may be electrically connected to the thirdexternal electrode 131 b of thesecond capacitor 101 b, and the upper-surface secondexternal electrode 132 a′ of thefirst capacitor 101 a may be electrically connected to the fourthexternal electrode 132 b of thesecond capacitor 101 b. - The upper-surface first
external electrode 131 a′ of thefirst capacitor 101 a and the upper-surface secondexternal electrode 132 a′ of thefirst capacitor 101 a may be attached and electrically connected to the thirdexternal electrode 131 b of thesecond capacitor 101 b and the fourthexternal electrode 132 b of thesecond capacitor 101 b, respectively, byconductive adhesives - The
conductive adhesives - Alternatively, the
conductive adhesives - The conductive particles may be, but are not limited to, silver (Ag) particles, and the base resin may be a thermosetting resin such as an epoxy resin. In addition, the
conductive adhesives - An external voltage may be applied to the laminated electronic component via the lower-surface first
external electrode 131 a and lower-surface secondexternal electrode 132 a disposed on the lower surface of the firstceramic body 110 a, among theexternal electrodes first capacitor 101 a. - In addition, a voltage applied to the
first capacitor 101 a may be transferred to thesecond capacitor 101 b via the upper-surface firstexternal electrode 131 a′ and upper-surface secondexternal electrode 132 a′ disposed on the upper surface of the firstceramic body 110 a, among theexternal electrodes first capacitor 101 a. - The
second capacitor 101 b may receive the voltage transferred from thefirst capacitor 101 a via the thirdexternal electrode 131 b and fourthexternal electrode 132 b disposed on the lower surface of the secondceramic body 110 b of thesecond capacitor 101 b. - In this manner, when the laminated electronic component is mounted on a board, a current loop of the laminated electronic component may be formed in a plane perpendicular to a mounting surface of the board. Accordingly, the size of the current loop formed in the laminated electronic component may be reduced, thus reducing the ESL of the laminated electronic component.
-
FIG. 5 is a perspective view of a laminated electronic component mounted on a printed circuit board according to an exemplary embodiment, andFIG. 6 is a cross-sectional view taken along line B-B′ ofFIG. 5 . - Referring to
FIGS. 5 and 6 , a mountingboard 200 mounting a laminated electronic component according to another exemplary embodiment includes a printedcircuit board 210 on whichelectrode pads electronic component 100 mounted on the printedcircuit board 210, and asolder 230 connecting theelectrode pads electronic component 100. - The mounting
board 200 mounting the laminated electronic component according to the exemplary embodiment includes the printedcircuit board 210 on which the laminatedelectronic component 100 is mounted, and two ormore electrode pads circuit board 210. - The
electrode pads second electrode pads first electrode pad 221 may be connected to a lower-surface firstexternal electrode 131 a of afirst capacitor 101 a disposed at a lower part of the laminatedelectronic component 100, and thesecond electrode pad 222 may be connected to a lower-surface secondexternal electrode 132 a of thefirst capacitor 101 a. - Here, the lower-surface first
external electrode 131 a and the lower-surface secondexternal electrode 132 a may be respectively disposed on the first andsecond electrode pads circuit board 210 by thesolder 230. -
FIG. 7 is a cross-sectional view of a mounting board mounting a laminated electronic component according to a modified embodiment of the present inventive concept. - The mounting
board 200′ mounting the laminated electronic component according to the modified embodiment may further include aceramic substrate 170 disposed between a laminatedelectronic component 100 and a printedcircuit board 210. - The
ceramic substrate 170 may include an insulatingbody 173 and first and secondconductive layers body 173. The firstconductive layer 171 may be connected to a lower-surface firstexternal electrode 131 a of afirst capacitor 101 a and afirst electrode pad 221 of the printedcircuit board 210, and the secondconductive layer 172 may be connected to a lower-surface secondexternal electrode 132 a of thefirst capacitor 101 a and asecond electrode pad 222 of the printedcircuit board 210. - The first
conductive layer 171 may extend from one surface in the length direction of the insulatingbody 173 to an upper surface and a lower surface of the insulatingbody 173, and the secondconductive layer 172 may extend from the other surface in the length direction of the insulatingbody 173 to the upper surface and the lower surface of the insulatingbody 173. However, the present inventive concept is not limited thereto. - Electronic components having piezoelectric and electrostrictive characteristics may generate acoustic noise when they are mounted on a board. The laminated
electronic component 100 according to the exemplary embodiment may also generate acoustic noise when it is directly mounted on a board. - According to the modified embodiment, the laminated
electronic component 100 is not directly mounted on the printedcircuit board 210, but mounted on the printedcircuit board 210 with theceramic substrate 170 interposed therebetween, thus reducing acoustic noise generated by the laminated electronic component. - The lower-surface first
external electrode 131 a of thefirst capacitor 101 a and the lower-surface secondexternal electrode 132 a of thefirst capacitor 101 a may be attached and electrically connected to the firstconductive layer 171 of theceramic substrate 170 and the secondconductive layer 172 of theceramic substrate 170, respectively, byconductive adhesives - The
conductive adhesives - Alternatively, the
conductive adhesives - The conductive particles may be, but are not limited to, silver (Ag) particles, and the base resin may be a thermosetting resin such as an epoxy resin. In addition, the
conductive adhesives -
FIG. 8 is a cross-sectional view of a mounting board mounting a laminated electronic component according to another modified embodiment of the present inventive concept. - According to a modified example, a mounting
board 200″ mounting a laminated electronic component may further includeconductive vias body 173 of theceramic substrate 170′ in addition to the configuration of the mountingboard 200′ of the modified example ofFIG. 7 . - For example, as illustrated in
FIG. 8 , aceramic substrate 170′ disposed between the laminatedelectronic component 100 and the printedcircuit board 210 may include a first conductive via 174 connecting a portion of the firstconductive layer 171 extending to an upper surface of the insulatingbody 173 to a portion of the firstconductive layer 171 extending to a lower surface of the insulatingbody 173, and passing through the insulatingbody 173, and a second conductive via 175 connecting a portion of the secondconductive layer 172 extending to the upper surface of the insulatingbody 173 to a portion of the secondconductive layer 172 extending to the lower surface of the insulatingbody 173. - As shown in the modified embodiment illustrated in
FIG. 7 , a ceramic substrate may be disposed between a laminated electronic component and a printed circuit board. Acoustic noise generated by the laminated electronic component may be reduced, but ESL may increase because a voltage applied via an electrode pad of the printed circuit board is applied to the laminated electronic component via the ceramic substrate. - When a conductive via passes through an insulating body of a ceramic substrate as in the modified exemplary embodiment illustrated in
FIG. 8 , however, the increase in the ESL may be reduced. - As set forth above, according to the exemplary embodiment, a laminated electronic component capable of reducing a volume increase irrelevant to a capacitance increase and implementing low ESL, and a mounting board mounting the laminated electronic component, may be provided.
- While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the invention as defined by the appended claims.
Claims (17)
1. A laminated electronic component, comprising:
a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body; and
a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor,
wherein a current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.
2. The laminated electronic component of claim 1 ,
wherein the current loop is formed in a plane perpendicular to a mounting surface when the laminated electronic component is mounted on a board.
3. The laminated electronic component of claim 1 , wherein the first capacitor and the second capacitor are connected in series.
4. The laminated electronic component of claim 1 , wherein the first external electrode on the upper surface of the first ceramic body is electrically connected to the third external electrode, and the second external electrode on the upper surface of the first ceramic body is electrically connected to the fourth external electrode.
5. The laminated electronic component of claim 1 , wherein the first ceramic body comprises:
a first internal electrode drawn to the upper and lower surfaces of the first ceramic body to be connected to the first external electrodes; and
a second internal electrode overlapping the first internal electrode to form capacitance, and drawn to the upper and lower surfaces of the first ceramic body to be connected to the second external electrodes.
6. The laminated electronic component of claim 5 , wherein the first and second internal electrodes are disposed to be perpendicular to the lower surface of the first ceramic body.
7. The laminated electronic component of claim 1 , wherein the second ceramic body comprises:
a third internal electrode drawn to the lower surface of the second ceramic body to be connected to the third external electrode; and
a fourth internal electrode overlapping the third internal electrode to form capacitance, and drawn to the lower surface of the second ceramic body to be connected to the fourth external electrode.
8. The laminated electronic component of claim 7 , wherein the third and fourth internal electrodes are disposed to be perpendicular to the lower surface of the second ceramic body.
9. The laminated electronic component of claim 4 , wherein the first and second external electrodes are electrically connected to the third and fourth external electrodes, respectively, by a conductive adhesive.
10. A mounting board mounting a laminated electronic component, comprising:
a printed circuit board including an electrode pad disposed thereon;
a laminated electronic component mounted on the printed circuit board; and
a solder connecting the electrode pad to the laminated electronic component,
wherein the laminated electronic component comprises:
a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body; and
a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor,
wherein a current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.
11. The mounting board mounting a laminated electronic component of claim 10 , further comprising a ceramic substrate disposed between the laminated electronic component and the printed circuit board.
12. The mounting board mounting a laminated electronic component of claim 11 , wherein the ceramic substrate includes an insulating body, and first and second conductive layers formed on an outer surface of the insulating body,
the first conductive layer is connected to the first external electrode on the lower surface of the first capacitor and the first electrode pad of the printed circuit board, and
the second conductive layer is connected to the second external electrode on the lower surface of the first capacitor and the second electrode pad of the printed circuit board.
13. The mounting board mounting a laminated electronic component of claim 12 , wherein the first conductive layer extends from one surface in a length direction of the insulating body to upper and lower surfaces of the insulating body, and the second conductive layer extends from the other surface in the length direction of the insulating body to the upper and lower surfaces of the insulating body.
14. The mounting board mounting a laminated electronic component of claim 12 , wherein the ceramic substrate comprises:
a first conductive via connecting a portion of the first conductive layer disposed on the upper surface of the insulating body to a portion of the first conductive layer disposed on the lower surface of the insulating body and passing through the insulating body, and
a second conductive via connecting a portion of the second conductive layer disposed on the upper surface of the insulating body to a portion of the second conductive layer disposed on the lower surface of the insulating body and passing through the insulating body.
15. The mounting board mounting a laminated electronic component of claim 10 , wherein the current loop is formed in a plane perpendicular to a mounting surface of the printed circuit board.
16. The mounting board mounting a laminated electronic component of claim 10 , wherein the first capacitor and the second capacitor are connected in series.
17. The mounting board mounting a laminated electronic component of claim 12 , wherein the first and second external electrodes are electrically connected to the first and second conductive layers, respectively, by a conductive adhesive.
Priority Applications (1)
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US16/267,678 US10714265B2 (en) | 2015-07-06 | 2019-02-05 | Laminated electronic component and circuit board for mounting the same |
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KR1020150096169A KR102183424B1 (en) | 2015-07-06 | 2015-07-06 | stacked electronic component and and circuit board for mounting the same |
KR10-2015-0096169 | 2015-07-06 |
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US11640876B2 (en) * | 2020-11-02 | 2023-05-02 | Samsung Electro-Mechanics Co., Ltd. | Electronic component |
US20220384098A1 (en) * | 2021-05-31 | 2022-12-01 | Murata Manufacturing Co., Ltd. | Electronic component |
US11942273B2 (en) * | 2021-05-31 | 2024-03-26 | Murata Manufacturing Co., Ltd. | Electronic component |
Also Published As
Publication number | Publication date |
---|---|
US20190172651A1 (en) | 2019-06-06 |
KR102183424B1 (en) | 2020-11-26 |
KR20170005723A (en) | 2017-01-16 |
US10714265B2 (en) | 2020-07-14 |
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