US20130126139A1 - Heat transporting unit, electronic circuit board and electronic device - Google Patents
Heat transporting unit, electronic circuit board and electronic device Download PDFInfo
- Publication number
- US20130126139A1 US20130126139A1 US13/641,580 US201113641580A US2013126139A1 US 20130126139 A1 US20130126139 A1 US 20130126139A1 US 201113641580 A US201113641580 A US 201113641580A US 2013126139 A1 US2013126139 A1 US 2013126139A1
- Authority
- US
- United States
- Prior art keywords
- heat
- region
- axis direction
- transporting unit
- ducts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the Present Disclosure relates, generally, to a heat transporting unit and an electronic device that efficiently transports heat received from a heat emitting object such as a semiconductor integrated circuit, an LED element, a power device or an electronic component.
- a heat emitting object such as a semiconductor integrated circuit, an LED element, a power device or an electronic component.
- Electronic components such as semiconductor integrated circuits, LED elements and power devices are used in electronic devices, industrial devices, automobiles and the like. These electronic components become heat emitting objects that emit heat due to the electric currents that flow therein. When the heat emitted from the heat emitting object rises above a specific temperature, problems arise in that the operation of the electronic component cannot be guaranteed, and the possibility of an adverse effect on other components exists, and, as a result, the possibility of causing a breakdown of performance of the electronic device itself.
- a cooling device for diffusing a heat pipe that has a cooling effect through the vaporization and condensation of a sealed refrigerant.
- heat is removed from the heat emitting object when the refrigerant sealed therein is vaporized.
- the vaporized refrigerant is condensed through the radiation of heat, and the condensed refrigerant moves back.
- the heat pipe cools the heat emitting object through cycling of this vaporization and condensation. That is, the heat pipe diffuses and transports heat.
- the heat that is diffused and transported by the heat pipe is cooled through combination with a heat radiating member.
- a heat pipe is able to diffuse and transport heat more efficiently using a refrigerant.
- the electronic components that require cooling have not been limited only to relatively large semiconductor integrated circuits such as central processing units (CPUs) or specialty ICs, but are often are extremely small electronic components, such as light emitting devices (LEDs).
- This type of small electronic component not only is small in terms of its size, but also often a plurality of electronic components together comprise a single set. Because of this, the cooling device which diffuses the heat pipe must cool a plurality of electronic components.
- a refrigerant In such a heat pipe, heat that has been removed from a heat emitting object, a refrigerant is sealed in an interior space that is formed from an upper plate and a lower plate that are joined together, and the heat of the heat emitting object is transported by the cycle of movement of this sealed refrigerant.
- a cooling device diffuses a heat pipe, it is important, in increasing the cooling capability, to increase the heat transporting efficiency (which is determined by the per-cycle speed of the movement of the vaporized refrigerant and the movement of the condensed refrigerant, and by the number of cycles per unit time).
- the refrigerant that is sealed in the interior space vaporizes due to the heat from the heat emitting object to move within the interior space, and eventually cools and condenses, and moves within the interior space. Because of this, the vaporized refrigerant and the condensed refrigerant interfere with each other while moving in mutually opposite directions within the interior space. When the effects of this interference become large, there is a problem in that this produces an adverse effect on the speed of cycling of the movement of the vaporized refrigerant and the movement of the condensed refrigerant, reducing the speed of transport of the heat and reducing the transportation efficiency. In order to prevent this interference between the movement of the vaporized refrigerant and the movement of the condensed refrigerant, it is desirable to increase the size of the interior space and to have no obstructions.
- the heat pipe would be nothing but the upper plate and the lower plate, and thus extremely weak. Because in a heat pipe the heat emitting object is cooled through the repetitive cycling of vaporizing and condensing the refrigerant that is sealed therein, the heat pipe is subjected to cycling of extremely high internal pressures. If the strength of the heat pipe were weak in such a severe operating environment, the heat pipe would break due to a “popcorn” phenomenon produced through the vaporization of the refrigerant, so that there would be a problem in that the refrigerant would leak out onto the electronic components and the electronic circuit board. If the refrigerant were to leak out, there would be a problem in that it would damage the electronic components or electronic circuit board, and could cause a malfunction of the electronic device.
- the heat pipe disclosed in the '585 Application discloses a flat heat pipe wherein there is an array of pores (which are actually more ducts then pores).
- the individual ducts perform the movement of the vaporized refrigerant and the movement of the condensed refrigerant.
- the heat pipe disclosed in the '585 Application is able to transport the heat towards the specific direction through these pores. That is, the vaporized refrigerant moves from a first end to a second end of the pores, and the condensed refrigerant moves from the second end to the first end of these pores.
- the strength of the heat pipe as a whole is maintained by the layering of the ducts in the crosswise direction.
- the heat pipe disclosed in the '693 Application forms movement paths for the vaporized refrigerant and movement paths for the condensed refrigerant through mutually offsetted slits that are provided in layered members. These slits are formed in a specific direction, so that the movement of the refrigerant and the movement will be performed in a specific direction. The result is that the heat pipe disclosed in the '693 Application is able to transport the heat in a specific direction.
- the '693 Application has the same problem as in the '585 Application, in that, as with the '585 Application, the individual ducts, which are formed by the slits, are independent of each other.
- a plurality of plate members are stacked together, in a disclosure of a heat pipe that transports heat through producing capillary forces through the stacking of plate members provided with channels and plate members provided with holes.
- the end portion of the heat pipe that transports the heat must achieve either the function of receiving heat from the heat emitting object, the function of cooling the heat that is transported from the other end portion, for both. Because of this, regardless of the size of the heat emitting object and regardless of the size of the cooling member, it is desirable for the heat that is received from the heat emitting object, and the heat that is transported, to diffuse in the crosswise direction.
- the heat pipes disclosed in the '585 Application through the '905 Application do not have such a function, so that only heat from a specific location is received and cooled. Because of this, the heat pipes in the '585 Application and the '693 Application have a problem in that they cannot be applied to cooling small heat emitting objects.
- the '864 Application discloses a heat pipe with stacked plate members that are provided with channels in the short direction at the end portions and plate members that are provided with ducts in the lengthwise direction across the entirety. These heat pipes allow the diffusion of heat in the short direction at the end portions, and the movement of heat in the lengthwise direction otherwise.
- the refrigerant can move in the lengthwise direction only in an extremely narrow width, reducing the heat transporting efficiency.
- the ducts that are provided in the short direction only partially overlap the ducts that are provided in the lengthwise direction, so there is a problem in that the transmission of heat between the ducts is poor.
- the ducts are formed unbalanced within the heat pipe, there is also a problem in that the heat pipe is not strong.
- the technology of the '864 Application also has a problem in that it is unable to transport the heat of the heat emitting object efficiently in the specific direction.
- the heat pipes for transporting heat from a heat emitting object in a specific direction have problems in that they cannot achieve the maximum performances thereof.
- they have problems in that the cooling by transporting heat from small heat emitting objects is inadequate.
- they cannot both ensure the strength of the heat pipe and transport heat efficiently while handling flexibly the sizes of the heat emitting objects and the contact positions thereof.
- a heat transporting unit able to transport efficiently heat from a small heat emitting object, while achieving the maximum performance thereof, through: (1) ensuring strength through column portions and reinforcing portions, (2) minimizing obstructions to movement of the refrigerant in the sealed space by the column portions and reinforcing portions, (3) achieving movement of the refrigerant in the required X-axis, Y-axis, and Z-axis directions while minimizing impediments to the movement of the refrigerant, and (4) handling flexibly the sizes of the heat emitting objects and the contact positions thereof.
- a heat pipe is provided that can be mounted easily, even in electronic devices and industrial devices with high-density mounting.
- the heat transporting unit has a heat pipe structure diffuses vaporization and condensation of a sealed refrigerant.
- a space is defined by the mutually orthogonal X axis, Y axis, and Z axis, and comprises: an upper plate; a lower plate that faces the upper plate; an interior space that is formed by the upper plate and the lower plate and wherein a refrigerant can be sealed; a first region, that is a region that is part of the interior space and that is provided with a first column portion that forms a plurality of first ducts that extend in the X-axis direction; and a second region that is provided with a second column portion that forms a plurality of second ducts that extend in the X-axis direction and the Y-axis direction, that is a region that is other than the first region within the interior space; wherein: the first ducts and second ducts connect at a boundary between the first region and the second region.
- the heat transporting unit according to the Present Disclosure is provided with column portions that are different in the first region and the second region, in a sealed space wherein refrigerant is sealed, to thereby not only ensure strength, but to also achieve optimal diffusion and transportation of heat in the X-axis, Y-axis, and Z-axis directions.
- the heat transporting unit is able to transport efficiently the heat from the heat emitting object while achieving the maximum performance as a heat pipe.
- the heat transporting unit according to the Present Disclosure is able to transport efficiently heat from a small heat emitting object.
- the heat transporting unit according to the Present Disclosure is also able to transport at high speeds the heat from the heat emitting object while handling also changes in the locations of disposition of the heat emitting objects.
- FIG. 1 is a perspective diagram of a heat transporting unit according to a first form of embodiment according to the Present Disclosure
- FIG. 2 is an interior perspective diagram of the heat transporting unit according to the first form of embodiment according to the Present Disclosure
- FIG. 3 is an explanatory diagram for the operation of the heat transporting unit according to the first form of embodiment according to the Present Disclosure
- FIG. 4 is a conceptual diagram for the operation of the heat transporting unit according to the first form of embodiment according to the Present Disclosure
- FIG. 5 is an interior perspective diagram of the heat transporting unit according to a second form of embodiment according to the Present Disclosure
- FIG. 6 is a cross-sectional diagram of the end portion of a heat transporting unit according to a second form of embodiment according to the Present Disclosure
- FIG. 7 is an interior schematic diagram of the heat transporting unit according to a second form of embodiment according to the Present Disclosure.
- FIG. 8 is an enlarged diagram in the vicinity of the second region in a heat transporting unit according to a second form of embodiment according to the Present Disclosure
- FIG. 9 is a plan view diagram of a heat transporting unit according to a second form of embodiment according to the Present Disclosure.
- FIG. 10 is a perspective diagram of a heat transporting unit according to a second form of embodiment according to the Present Disclosure.
- FIG. 11 is an assembly perspective diagram of a heat transporting unit according to a third form of embodiment according to the Present Disclosure.
- FIG. 12 is an explanatory diagram lining up an example of embodiment and comparative examples
- FIG. 13 is a graph illustrating measurement results for the example of embodiment and the comparative examples
- FIG. 14 is a side view diagram of a heat transporting unit according to a forth example of embodiment according to the Present Disclosure.
- FIG. 15 is a schematic diagram of an electronic device according to a fifth form of embodiment according to the Present Disclosure.
- representations of directions such as up, down, left, right, front and rear, used for explaining the structure and movement of the various elements of the Present Disclosure are not absolute, but relative. These representations are appropriate when the elements are in the position shown in the Figures. If the description of the position of the elements changes, however, these representations are to be changed accordingly.
- a heat transporting unit is one wherein a space is defined by the mutually orthogonal X axis, Y axis, and Z axis; and comprises: an upper plate; a lower plate that faces the upper plate; an interior space that is formed by the upper plate and the lower plate and wherein a refrigerant can be sealed; a first region, that is a region that is part of the interior space and that is provided with a first column portion that forms a plurality of first ducts that extend in the X-axis direction; and a second region that is provided with a second column portion that forms a plurality of second ducts that extend in the X-axis direction and the Y-axis direction, that is a region that is other than the first region within the interior space; wherein: the first ducts and second ducts connect at a boundary between the first region and the second region.
- the heat transporting unit able to have improved strength, but is also able to transport, in the lengthwise direction, the heat removed from the heat emitting object using fully the short direction of the heat transporting unit, even with a small heat emitting object.
- a first duct in addition to the first invention, in a first duct, not only does a vaporized refrigerant move in the X-axis direction, but a condensed refrigerant also moves in the X-axis direction, and in a second duct, not only does the vaporized refrigerant move in the X-axis direction and the Y-axis direction, but the condensed refrigerant also moves in the X-axis direction and the Y-axis direction.
- the heat transporting unit is able to transport, in the long direction, the heat removed from the heat emitting object, while using the short direction fully.
- a heat transporting unit in addition to the first and second inventions, not only does vaporized refrigerant move mutually in the first duct and the second, but also the condensed refrigerant moves mutually in the first duct and the second duct.
- the heat transporting unit is able to transport heat through using efficiently the first region and the second region, which have different functions.
- a second region is provided at at least one of the two end portions of the interior space, and a first region is provided in a region other than the second region in the interior space.
- the heat transporting unit is able to transport heat from a heat emitting object that is disposed on one end portion to the other end portion.
- a second region is provided in the center portion of the interior space, and a first region is provided in a region other than the second region in the interior space.
- the heat transporting unit is able to transport, towards both ends, heat of a heat emitting object that is disposed at the middle thereof.
- a second region in addition to the first through fifth inventions, not only diffuses heat received from a heat emitting object in the X-axis direction and the Y-axis direction, but also moves it to the first region, and the first region transports, in the X-axis direction, the heat moved from the second region.
- the heat transporting unit is able to use the Y-axis direction fully, upon diffusion of the heat removed from the heat emitting object, to transport that heat in the X-axis direction.
- the second region of the first end portion side when the second region is provided at a first end portion and at a second end portion that is opposite from the first end portion, within the interior space, the second region of the first end portion side not only causes the diffusion, in the X-axis direction and the Y-axis direction, of the heat received from the heat emitting object, but also causes it to move to the first region, and the first region transports, in the X-axis direction, the heat moved from the second region on the first end portion side, and the second region on the second end portion side diffuses, in the X-axis direction and the Y-axis direction, the heat that has been transported by the first region.
- the heat transporting unit diffuses, in the X-axis direction and the Y-axis direction, using the second region, the heat removed from the heat emitting object, and transports it in the X-axis direction using the first region. Furthermore, the heat transporting unit radiates heat using the second region wherein no heat emitting object is disposed. The result is the ability of the heat transporting unit to cool the heat emitting object.
- the second region is provided in the center of the interior space, and when the first region is provided at a first end portion and at a second end portion that is on the opposite side from the first end portion, in the interior space, the second region not only diffuses in the X-axis direction and the Y-axis direction the heat that is received from the heat emitting object, but also moves it to the first region, and the first region transports, in the X-direction, the heat moved from the second region.
- the heat transporting unit uses the second region that is positioned at the center to diffuse, in the X-axis direction and the Y-axis direction, the heat of the heat emitting object, and uses the first region, positioned at both ends, to transport it to both ends of the heat transporting unit along the X-axis direction. This is used in a case wherein one wishes to transport the heat of the heat emitting object in multiple directions.
- the upper plate and/or the lower plate in addition to any of the first through eighth inventions, additionally, also has a heat receiving portion that contacts the heat emitting object thermally, and the heat receiving portion is provided spanning the first region and the second region.
- the heat transporting unit receives the heat efficiently from the heat emitting object, enabling transportation in the specific direction. Additionally, this increases the heat transportation efficiency of the heat transporting unit.
- a first column portion has a cutout to connect together adjacent first ducts within a plurality of first ducts.
- the refrigerant can be exchanged between first ducts.
- the second region has one or more intermediate plates layered in the Z-axis direction, where the intermediate plates form a second column portion that is stacked in the Z-axis direction, and the second column portion forms second ducts in the X-axis direction, the Y-axis direction, and the Z-axis direction.
- the second region can diffuse heat three-dimensionally.
- the second column portion comprises a large column member and a small column member that is smaller than the large column member.
- the second ducts have a more complex structure, and produce strong capillary forces. As a result, the second ducts diffuse the vaporized refrigerant and move the condensed refrigerant efficiently.
- At least a portion of the first ducts and the second ducts have capillary forces that move the condensed refrigerant.
- the heat transporting unit is able to move the condensed refrigerant, enabling transportation of the heat of the heat emitting object through a cycle of transporting the vaporized refrigerant and moving the condensed refrigerant.
- At least a portion of the upper plate, the lower plate, the first column portion, and/or the second column portion has a channel in a surface that is exposed to the interior space.
- the capillary forces of the first duct and the second duct are increased given this structure.
- the upper plate and/or the lower plate is further equipped with a heat radiating portion for radiating the transported heat, in a region that faces at least a portion of the first region and/or the second region.
- the heat transporting unit is able to cool the transported heat quickly.
- At least a portion of the upper plate, the lower plate, the first column portion, and/or the second column portion has metal plating on a surface that is exposed to the interior space.
- the width of the first region in the Y-axis direction and the width of the second region in the Y-axis direction are essentially identical.
- the heat transporting unit is able to transport the heat using the short direction maximally as well. Because of this, the heat transporting unit does not require excessive mounting space.
- a heat pipe is a member, component, apparatus, or device that achieves a function of cooling a heat emitting object by repetitively vaporizing a refrigerant that is sealed within an interior space, by receiving heat from the heat emitting object, and cooling and condensing the vaporized refrigerant.
- the heat transporting unit in the present specification refers to a member, component, device, or apparatus for transmitting heat from a heat emitting unit through the movement of a refrigerant.
- the heat pipe has a refrigerant sealed into the interior thereof, where a surface that is a heat receiving surface contacts a heat emitting object, such as an electronic component.
- the refrigerant in the interior receives the heat from the heat emitting object, to be vaporized, where the heat of the heat emitting object is removed at the time of the vaporization.
- the vaporized refrigerant moves within the heat pipe.
- the vaporized refrigerant that has moved then is cooled at a heat radiating surface (or due to a secondary cooling member such as a heat sink or a cooling fan, or the like) to thus condense.
- the refrigerant, which has become a liquid through condensation moves within the heat pipe to again move to the heat receiving surface.
- the refrigerant that has moved to the heat receiving surface is vaporized again to remove the heat of the heat emitting object.
- the heat pipe transports the heat from the heat emitting object, to thereby cool the heat emitting object.
- the heat pipe causes the vaporized refrigerant to move and causes the condensed refrigerant to move within the interior space wherein the refrigerant is sealed, doing so along a specific direction, so that the heat pipe is able to transport, in a specific direction, the heat removed from the heat emitting object.
- FIG. 1 and FIG. 2 An overall summary of a heat transporting unit according to a first form of embodiment will be explained using FIG. 1 and FIG. 2 .
- FIG. 1 is a perspective view of a heat transporting unit according to a first form of embodiment according to the Present Disclosure.
- FIG. 2 is an interior perspective view of the heat transporting unit in the first form of embodiment according to the Present Disclosure, shown in a prospective cross-sectional diagram enabling viewing of the interior of the unit during the transportation of heat.
- a three-dimensional space is defined by the mutually orthogonal X axis, Y axis, and Z axis.
- the structure of the heat transporting unit 1 will be explained using the X axis, Y axis, and Z axis. Additionally, while the heat transporting unit 1 has a variety of structures therein, it has, when viewed from the outside, a flat rectangular shape, as in the example illustrated in FIG. 1 . Of course, a variety of treatments may also be performed on the surface.
- the heat transporting unit 1 is provided with an upper plate 2 , a lower plate 3 that faces the upper plate 2 , and an interior space 4 , wherein a refrigerant can be sealed, formed by the upper plate 2 and the lower plate 3 .
- the interior space 4 has a first region 5 in a region in a portion thereof, and second regions 6 and 7 in regions that form the remaining portion that is not the first region 5 .
- the first region is provided in the vicinity of the center in the long direction (the X-axis direction) of the heat transporting unit 1
- the second regions 6 and 7 are provided at both ends in the long direction (the X-axis direction) of the heat transporting unit 1 .
- the first region 5 is provided with a first column portion 8 wherein a plurality of first ducts 9 is formed along the X-axis direction.
- the first column portion 8 is a three-dimensional member having a long direction along the X-axis direction in the first region 5 , and regions that are interposed between a plurality of first column portions 8 form the first ducts 9 .
- each of a plurality of first column portions 8 which are three-dimensional members having a long direction, is disposed lined up along the X-axis direction, to form a plurality of first ducts 9 that extend in the X-axis direction.
- the second regions 6 and 7 are provided with second column portions 10 that form a plurality of second ducts 11 that run in the X-axis direction and the Y-axis direction.
- the second column portions 8 are a plurality of three-dimensional members that are lined up in the X-axis direction and the Y-axis direction in the second regions 6 and 7 .
- the regions that are interposed between the plurality of second column portions 10 that are lined up in the X-axis direction form ducts that run in the Y-axis direction
- the regions that are interposed between the plurality of second column portions 10 that are lined up in the Y-axis direction form ducts that run in the X-axis direction, where the ducts that run in the X-axis direction and the ducts that run in the Y-axis direction combine into a grid shape.
- These grid-shaped ducts form the second ducts 11 .
- a refrigerant is sealed within the interior space 4 , and heat from the heat emitting object is transported in a specific direction by repeated vaporization and condensation of the sealed refrigerant.
- the interior space 4 were the entirety of the space, then there would be the possibility that the heat transporting unit 1 would be damaged or would break due to the expansion and contraction thereof due to the loads of increasing and decreasing pressure, produced by the vaporization and condensation of the refrigerant.
- the first column portions 8 and the second column portions 10 not only ensure the strength of the heat transporting unit 1 , but also form the first ducts 9 and the second ducts 11 that are able to diffuse and transport the heat well in the X-axis direction and the Y-axis direction.
- the first ducts 9 and the second ducts 11 connect at a boundary 12 between the first region 5 and the second region 6 , and at a boundary 13 between the first region 5 and the second region 7 . These connections enable the refrigerant that moves from the second ducts 11 (the vaporized refrigerant and/or the condensed refrigerant) to move into the first ducts 9 , to then move through the first ducts 9 . Additionally, the Y-axis direction width of the first region 5 in the interior space 4 and the Y-axis direction widths of the second regions 6 and 7 (that is, the widths in the short direction) are essentially identical.
- codes are assigned to only a portion of the elements, for preserving clarity in the diagram, in regards to the first column portions 8 , the second column portions 10 , the first ducts 9 , and the second ducts 11 ; however, those elements that are not labeled with codes correspond, respectively, to the first column portions 8 , the second column portions 10 , the first ducts 9 , and the second ducts 11 .
- the standing members that have shapes identical to those of the first column portions 8 , unless specified especially otherwise, are all also first column portions 8 . This is true in FIG. 3 and beyond as well.
- FIG. 3 will be used next to explain the operation of the heat transporting unit 1 .
- FIG. 3 is an operation explanatory diagram for the heat transporting unit in the first form of embodiment according to the Present Disclosure. While the schematic structure of the interior of the heat transporting unit 1 is illustrated in FIG. 3 , the movement of the refrigerant that is sealed in the interior space 4 (that is, the diffusion and transportation of heat) will be explained by the arrows.
- the upper plate 2 and the lower plate 3 have a flat plate shape having a long direction and a short direction, where the X-axis direction is along the long direction and the Y-axis direction is along the short direction.
- This type of shape for the upper plate 2 and the lower plate 3 causes the heat transporting unit 1 to have a flat shape having a long direction and a short direction.
- a heat emitting object 20 is disposed at the bottom surface of the heat transporting unit 1 (the bottom surface of the lower plate 3 ). Additionally, the heat emitting object 20 is disposed at a position facing the second region 6 of the bottom surface. Note that the heat emitting object 20 is an element that produces heat, such as an electronic component, an electronic element, a semiconductor integrated circuit, a light emitting element, an electronic circuit board, a mechanical component, a mechanical element, or the like. Additionally, the heat emitting object 20 is disposed in a position facing the second region 6 at the bottom surface.
- the first region 5 has first ducts 9 that run in the X-axis direction, as described above, and the second regions 6 and 7 have second ducts 11 that run in the X-axis direction and the Y-axis direction.
- the heat transporting unit 1 in the second region 6 removes heat from the heat emitting object 20 , because refrigerant is sealed within the interior space 4 , the heat from the heat emitting object 20 vaporizes the refrigerant.
- the evaporating refrigerant moves in the X-axis direction and the Y-axis direction in the second ducts 11 of the second region 6 . That is, in the second region 6 , the heat removed from the heat emitting object 20 uses the second ducts 11 to diffuse along the direction of Arrow A (the X-axis direction) and the direction of Arrow B (the Y-axis direction).
- a three-dimensional interior space 4 is formed, structured with an X-axis, a Y-axis, and a Z-axis, and thus the vaporized refrigerant moves, and the heat diffuses, also in the Z-axis direction; however, in the first form of embodiment according to the Present Disclosure, the explanation will use the X-axis direction and Y-axis direction, the directions in which the refrigerant moves primarily.
- the second ducts 11 connect to the first ducts 9 . Because of this, the vaporized refrigerant moves from the second ducts 11 into the first ducts 9 .
- the first ducts 9 are formed along the X-axis direction in the first region 5 , and the vaporized refrigerant moves in the direction indicated by the Arrow C in the first ducts 9 .
- the Arrow C is drawn for only one of the first ducts 9 ; however, the vaporized refrigerant moves similarly in the direction of the Arrow C in the other first ducts 9 as well.
- the result of the movement is that the heat of the heat emitting object 20 is transported from the second region 6 , which is one end portion of the heat transporting unit 1 , to the second region 7 , which is the other end portion thereof.
- the first ducts 9 and the second ducts 11 connect at the boundary 13 between the first region 5 and the second region 7 . Because of this, as illustrated by Arrow C, the vaporized refrigerant that has moved along the first duct 9 moves into the second ducts 11 of the second region 7 .
- the second ducts 11 run along the X-axis direction and the Y-axis direction, and thus the vaporized refrigerant that has moved from the first ducts 9 moves along the Arrow D (the X-axis direction) and the Arrow E (the Y-axis direction). That is, in the second ducts 11 of the second region 7 , the vaporized refrigerant moves broadly in the short direction and the long direction.
- the second ducts 11 are used to move the vaporized refrigerant broadly in the X-axis direction and the Y-axis direction, enabling the vaporized refrigerant to cool. This is because the vaporized refrigerant moving broadly through the second region 7 , wherein the heat emitting object 20 is not disposed causes the heat that is included therein to escape.
- the vaporized refrigerant that moves through the second region 7 in this way condenses due to the cooling, changing into a refrigerant that is a liquid.
- the result is that the condensed refrigerant moves in the X-axis direction and the Y-axis direction along the second ducts 11 in the second region 7 .
- the flow is as indicated by the Arrow D and the Arrow E.
- the second ducts 11 of the second region 7 are extremely narrow ducts, and thus can exhibit capillary forces wherein the liquid is moved through capillary action.
- the condensed refrigerant after moving in the X-axis direction and the Y-axis direction within the second region 7 through the plurality of second ducts 11 , arrives at the boundary 13 between the first region 5 and the second region 7 . Because the second ducts 11 of the second region 7 are connected to the first ducts 9 of the first region 5 , the condensed refrigerant moves from the second ducts 11 into the first ducts 9 , as indicated by the Arrow F. At this time, the condensed refrigerant moves in the second ducts 11 not only in the X-axis direction, but in the Y-axis direction as well, and thus the condensed refrigerant spreads in the short direction in the interior space 4 as well. Because of this, at the boundary 13 , the condensed refrigerant is able to move within each of the plurality of the first ducts 9 that are lined up in the short direction within the interior space 4 .
- the condensed refrigerant that has moved into the first ducts 9 moves along the X-axis direction through the first ducts 9 , as indicated by the Arrow G. That is, the condensed refrigerant moves through the first ducts 9 from the end portion positioned within the second region 7 towards the end portion positioned within the second region 6 .
- the first ducts 9 are fine ducts with closed peripheries, and thus the first ducts 9 can exhibit capillary forces.
- the first ducts 9 cause the condensed refrigerant to move in the X-axis direction through these capillary forces.
- the condensed refrigerant that has moved through the first ducts 9 in the X-axis direction arrives at the second region 6 wherein there are extremely fine ducts, and, in this second region 6 , receives heat from the heat emitting object 20 , to be vaporized again.
- the vaporized refrigerant moves again through the second ducts 11 in the X-axis direction and the Y-axis direction. In this way, the cycling of the movement of the vaporized refrigerant and the movement of the condensed refrigerant enables the heat transporting unit 1 to transport the heat from the heat emitting object 20 from the end portion positioned in the second region 6 to the end portion positioned in the second region 7 .
- the heat of the heat emitting object 20 diffuses in the long direction and the short direction of the heat transporting unit 1 within the second region 6 , and the first region 5 transports the heat in the long direction of the heat transporting unit 1 . Because of this, the heat transporting unit 1 is able to transport the heat of the heat emitting object 20 using the entirety of the interior space 4 , while maintaining the strength of the heat transporting unit 1 by the first column portions 8 and the second column portions 10 .
- the heat transporting unit 1 even when transporting heat in the long direction, must be able to move the refrigerant using maximally both the long direction and the short direction of the interior space 4 (and other words, of the heat transporting unit 1 ).
- the refrigerant that has been vaporized by the heat from the heat emitting object 20 that is disposed at the second region 6 is moved not just in the X-axis direction, but in the Y-axis direction as well, by the second ducts 11 of the second region 6 .
- the plurality of first ducts 9 is lined up in the short direction within the interior space 4 .
- the movement of the vaporized refrigerant in the Y-axis direction through the second ducts 11 in the second region 6 enables the vaporized refrigerant, at the boundary 12 , to move into each of the plurality of first ducts 9 (while it may be all of them or a portion of them, still it is a plurality of first ducts 9 corresponding to a width that is wider than that of the heat emitting object 20 ).
- the vaporized refrigerant that has so move moves using the plurality of first ducts 9 fully.
- the plurality of first ducts 9 is used fully to transport the heat in the X-axis direction (that is, from the end portion positioned at the second region 6 to the end portion positioned at the second region 7 ).
- the second ducts 11 can move the vaporized refrigerant, that has been moved from the first ducts 9 , three-dimensionally in the X-axis direction and the Y-axis direction. Because of this, in the second region 7 , the vaporized refrigerant can move through a wide space in a short time. As a result, the second region 7 enables the rapid cooling and condensation of the vaporized refrigerant.
- the condensed refrigerant moves along the X-axis direction and the Y-axis direction in the second ducts 11 . Because of this, the condensed refrigerant can move from a plurality of second ducts 11 to a plurality of first ducts 9 at the boundary 13 between the second region 7 and the first region 5 . That is, at the boundary 13 , the condensed refrigerant moves in the plurality of individual first ducts 9 (either through all of them or part of them), which are lined up in the short direction of the interior space 4 .
- This cycle of movement of the vaporized refrigerant and movement of the condensed refrigerant is the function of heat transportation achieved by the heat transporting unit 1 .
- the heat transporting unit 1 is able to transport the heat of the heat emitting object in the specific direction (which here is the X-axis direction), efficiently, using fully the heat transporting unit 1 , regardless of the size or shape of the heat emitting object 20 .
- FIG. 4 is a diagram illustrating schematically the operation of the heat transporting unit in the first form of embodiment according to the Present Disclosure.
- the heat emitting object 20 is disposed at the bottom surface of the second region 6 , which is the bottom surface of the lower plate 3 .
- the heat emitting object 20 and the bottom surface are in thermal contact, so the second region 6 removes heat from the heat emitting object 20 .
- the refrigerant which is a liquid, is vaporized by this heat, and the vaporized refrigerant moves in the X-axis direction through the first region 5 following the Arrow H.
- the vaporized refrigerant that arrives at the second region 7 from the first region 5 is cooled and condenses in the second region 7 .
- This cooled refrigerant moves towards the second region 6 from the second region 7 through capillary forces that are produced by the first ducts 9 and the second ducts 11 . This is as indicated by the Arrow I.
- the heat transporting unit 1 can transport the heat of the heat emitting object 20 efficiently along the X-axis direction.
- the upper plate 2 will be explained next.
- the upper plate 2 is illustrated in a perspective state in FIG. 2 .
- the upper plate 2 has a flat shape, and preferably is a rectangle having a short direction and a long direction. Of course, it may have a shape that differs from a rectangle in parts, or may have a curved shape or an indented shape.
- having the upper plate 2 be a rectangle having a short direction and a long direction causes the heat transporting unit 1 to be a rectangle having a short direction and a long direction, thus making it possible for the heat transporting unit 1 to transport heat in a specific direction from a heat emitting object that is disposed at the end portion thereof.
- the upper plate 2 has a structure that matches the outer dimensional shape of the heat transporting unit 1 .
- the upper plate 2 is formed out of metal, plastic, or the like, but preferably is formed out of a metal with high thermal conductivity or high resistance to corrosion (or durability thereto), such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, stainless steel, or the like.
- the upper plate 2 together with the lower plate 3 , forms the interior space 4 .
- the upper plate 2 or the lower plate 3 has raised portions or wall members, for forming the interior space 4 , at the peripheral edges thereof, where the upper plate 2 and the lower plate 3 form the interior space 4 between the upper plate 2 and the lower plate 3 through being joined together through these raised portions or wall members.
- these raised portions or wall members become the side walls encompassing the interior space 4 .
- these raised portions or wall members may be either different members or the same member as the upper plate 2 .
- the upper plate 2 preferably has metal plating on at least the surface that contacts the interior space 4 (the surface that contacts the vaporized refrigerant and/or the condensed refrigerant). This is because the provision of the metal plating modifies the state of the surface, expediting the movement of the vaporized refrigerant.
- a metal such as gold, silver, copper, aluminum, nickel, cobalt, or an alloy thereof, or the like, may be selected as this metal plating. Of course, it may be a single layer plating, a multilayer plating, electrolytic plating, or non-electrolytic plating.
- the upper plate 2 is nominally “upper,” physically it need not necessarily be disposed at the top, but rather this is a term for convenience.
- the heat emitting object may be in contact with the upper plate 2 , or may be in contact with the lower plate 3 .
- the upper plate 2 preferably is provided also with a filling opening, not shown, for filling the refrigerant. This is because it is necessary to seal the refrigerant into the interior space 4 when the upper plate 2 and the lower plate 3 are joined together to form the interior space 4 .
- the filling opening is sealed after the filling of the refrigerant.
- the refrigerant may be filled from the filling opening after the joining together of the upper plate 2 and the lower plate 3 , or may be filled at the time of joining.
- the filling of the refrigerant preferably is performed under a vacuum or at a reduced pressure. Performing the filling under a vacuum or at a reduced pressure causes the refrigerant to be sealed within the interior space 4 in a vacuum or low-pressure state.
- a reduced pressure there is the benefit of a reduction in the vaporization/condensation temperature of the refrigerant, causing greater activity in the cycling of the vaporization/condensation of the refrigerant.
- the upper plate 2 and/or the lower plate 3 is provided with the first column portions 8 and the second column portions 10 .
- the interior space 4 is formed from the upper plate 2 and the lower plate 3
- the provision of the first column portions 8 and the second column portions 10 on the upper plate 2 and/or the lower plate 3 makes it possible to provide the interior space 4 with the first column portions 8 and the second column portions 10 , or in other words, the first ducts 9 and the second ducts 11 , through joining together the upper plate 2 and the lower plate 3 .
- the lower plate 3 described below.
- the lower plate 3 is a member that is symmetrical to the upper plate 2 , and has the same structure and shape as the upper plate 2 , and, in FIG. 2 , is shown in an oblique state.
- the lower plate 3 has a flat shape, and preferably is a rectangle having a short direction and a long direction.
- the lower plate 3 faces the upper plate 2 and is joined thereto, preferably it has the identical shape and area of the upper plate 2 .
- the lower plate 3 can form the interior space 4 with the upper plate 2 , it may have an area or shape that is different from that of the upper plate 2 .
- it may have a shape that differs from a rectangle in parts, or may have a curved shape or an indented shape.
- having the lower plate 3 be a rectangle having a short direction and a long direction causes the heat transporting unit 1 to be a rectangle having a short direction and a long direction, thus making it possible for the heat transporting unit 1 to transport heat in a specific direction from a heat emitting object that is disposed at the end portion thereof.
- the lower plate 3 is formed out of metal, plastic, or the like, but preferably is formed out of a metal with high thermal conductivity or high resistance to corrosion (or durability thereto), such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, stainless steel, or the like.
- the lower plate 3 is joined to the upper plate 2 perform the interior space, and may have raised portions or wall members for forming the interior space 4 around the periphery edges thereof. When joined to the upper plate 2 , these raised portions or wall members form the side walls surrounding the interior space 4 . Of course, these raised portions or wall members may be either different members or the same member as the lower plate 3 . Note that both the upper plate 2 and the lower plate 3 may have the raised portions or wall members, or only either the upper plate 2 or the lower plate 3 may have the raised portions or wall members.
- the lower plate 3 may be provided with a refrigerant filling opening.
- the lower plate 3 is joined together facing the upper plate 2 to form the interior space 4 .
- the lower plate 3 preferably has metal plating on at least the surface that contacts the interior space 4 (the surface that contacts the vaporized refrigerant and/or the condensed refrigerant). This is because the provision of the metal plating modifies the state of the surface, expediting the movement of the vaporized refrigerant.
- a metal such as gold, silver, copper, aluminum, nickel, cobalt, or an alloy thereof, or the like, may be selected as this metal plating. Of course, it may be a single layer plating, a multilayer plating, electrolytic plating, or non-electrolytic plating.
- the lower plate 3 is nominally “lower,” physically it need not necessarily be disposed at the bottom, but rather this is a term for convenience.
- the heat emitting object may be in contact with the lower plate 3 , or may be in contact with the upper plate 2 .
- the interior space is formed by the upper plate 2 and the lower plate 3 .
- the upper plate 2 and the lower plate 3 have protrusions or columns around the peripheral edges, and the upper plate 2 and the lower plate 3 are joined together facing each other to form the interior space 4 . Additionally, when joining together the upper plate 2 and the lower plate 3 , the first column portions 8 and second column portions 10 that are provided on the upper plate 2 and/or the lower plate 3 contact the facing upper plate 2 or lower plate 3 . The result is that the first column portions 8 or the second column portions 10 connect between the upper plate 2 and the lower plate 3 . The first column portions 8 and second column portions 10 are columns that reach from the upper plate 2 to the lower plate 3 within the interior space 4 .
- the refrigerant is sealed within the interior space 4 .
- the refrigerant uses antifreeze, alcohol, pure water, or the like.
- the interior space 4 has a first region 5 and second regions 6 and 7 .
- the interior space 4 is divided into the first region 5 and the second regions 6 and 7 .
- the Y-axis direction widths of the first region 5 and the second regions 6 and 7 are essentially identical, and thus the first region 5 and the second regions 6 and 7 are connected, at the boundaries 12 and 13 , across the entire width in the Y-axis direction. That is, the first ducts 9 and boundaries 12 connect across the entirety of the width in the Y-axis direction.
- the heat of the heat emitting object is transported in a specific direction through the filled refrigerant the vaporizing and condensing. At this time, the interior space 4 is able to transport the heat of the heat emitting object efficiently through the provision of the first region 5 and the second regions 6 and 7 that have different functions depending on the direction of transportation of the heat (the direction of movement of the refrigerant).
- the region 5 is provided with a plurality of first column portions 8 that form a plurality of first ducts 9 along the X-axis direction.
- the plurality of first column portions 8 are provided along the X-axis direction.
- the first column portions 8 are standing members with protruding shapes that are provided on the upper plate 2 and/or the lower plate 3 , and when the upper plate 2 and the lower plate 3 are thermally joined, they are joined to the facing member (either the upper plate 2 or the lower plate 3 ), so that, within the interior space 4 , they become standing members that reach from the upper plate 2 to the lower plate 3 . The result is that they become reinforcing portions for reinforcing the interior space 4 .
- first column portions 8 may be provided on either the upper plate 2 or the lower plate 3 , and may be standing members that reach from the upper plate 2 to the lower plate 3 within the interior space 4 when the upper plate 2 and the lower plate 3 are jointed together. Conversely, only portions of the required first column portions 8 may be provided on the upper plate 2 and on the lower plate 3 , so that when the upper plate 2 and the lower plate 3 are joined together, all of the required first column portions 8 will be provided within the interior space 4 .
- facing portions of the first column portions 8 may be provided at identical positions on both the upper plate 2 and the lower plate 3 , so that the portions of the first column portions 8 that are provided on the upper plate 2 and the portions of the first column portions 8 that are provided on the lower plate 3 contact each other to form, together, the required first column portions 8 .
- a plurality of first column portions 8 is provided along the X-axis direction, and thus a plurality of first ducts 9 is formed, along the X-axis direction, by adjacent first column portions 8 .
- the plurality of first ducts 9 are the gaps formed by the first column portions 8 .
- first ducts 9 run in the X-axis direction in the first region 5 , and thus preferably have lengths that are about the same as the X-axis direction lengths of the first region 5 . Doing so enables the first region 5 to move the refrigerant along the X-axis direction within the first region 5 .
- the first column portions 8 are formed out of metal, plastic, or the like, but preferably are formed out of a metal with high thermal conductivity or high resistance to corrosion (or durability thereto), such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, stainless steel, or the like. Additionally, preferably the metal plating is performed on at least a portion of the surfaces of the first column portions 8 (and, in particular, on a portion or all of the surfaces that are exposed to the interior space 4 ). This is because the provision of the metal plating modifies the state of the surface, expediting the movement of the vaporized refrigerant.
- a metal such as gold, silver, copper, aluminum, nickel, cobalt, or an alloy thereof, or the like, may be selected as this metal plating.
- this metal plating may be a single layer plating, a multilayer plating, electrolytic plating, or non-electrolytic plating.
- the provision of a plurality of first ducts 9 in the first region 5 in this way causes the refrigerant to move while dividing the refrigerant (the vaporized refrigerant or condensed refrigerant) between the plurality of pathways between the boundary 12 and the boundary 13 . That is, the first region 5 is able to transport the heat of the heat emitting object 20 between the boundary 12 and the boundary 13 .
- the first region 5 has the function of transporting, in the X-axis direction, the heat from the heat emitting object 20 through using efficiently the entire width in the Y-axis direction.
- the second regions 6 and 7 are provided in the remainder of the interior space 4 that is not the first region 5 . Because of this, the interior space 4 has the first region 5 and the second regions 6 and 7 . Note that region 5 and second regions 6 and 7 are spaces having mutually differing functions, and this does not exclude the interior space 4 from including other regions that are unrelated to the first region 5 and to the second regions 6 and 7 .
- the first region and the second regions are elements that indicate that they are regions within the interior space 4 that exhibit their own respective functions, and these are not terms that indicate that the interior space 4 is physically partitioned.
- the second regions 6 and 7 are provided with a plurality of second column portions 10 that form a plurality of second ducts 11 that run in the X-axis direction and the Y-axis direction.
- the plurality of second column portions 10 is provided along the X-axis direction.
- the plurality of second column portions 10 is provided in a given line in the X-axis direction.
- two second column portions 10 are lined up along the X-axis direction.
- four second column portions 10 are lined up in the X-axis direction.
- the plurality of second column portions 10 that is provided in a line in the X-axis direction in this way is lined up in a plurality along the Y-axis direction.
- the provision of the plurality of second column portions 10 in both the X-axis direction and the Y-axis direction enables the plurality of second column portions 10 to form gaps in both the X-axis direction and the Y-axis direction.
- the respective gaps in the X-axis direction and the Y-axis direction form a plurality of second ducts 11 that run in the X-axis direction and the Y-axis direction.
- the vaporized refrigerant and condensed refrigerant move along the X-axis direction and the Y-axis direction in accordance with the gaps in the second column portions 10 .
- the second column portions 10 are standing members with protruding shapes that are provided on the upper plate 2 and/or the lower plate 3 , and when the upper plate 2 and the lower plate 3 are thermally joined, they are joined to the facing member (either the upper plate 2 or the lower plate 3 ), so that, within the interior space 4 , they become standing members that reach from the upper plate 2 to the lower plate 3 . The result is that they become reinforcing portions for reinforcing the interior space 4 .
- the second column portions 10 may be provided on either the upper plate 2 or the lower plate 3 , and may be standing members that reach from the upper plate 2 to the lower plate 3 within the interior space 4 when the upper plate 2 and the lower plate 3 are jointed together. Conversely, only portions of the required second column portions 10 may be provided on the upper plate 2 and on the lower plate 3 , so that when the upper plate 2 and the lower plate 3 are joined together, all of the required second column portions 10 will be provided within the interior space 4 .
- facing portions of the second column portions 10 may be provided at identical positions on both the upper plate 2 and the lower plate 3 , so that the portions of the second column portions 10 that are provided on the upper plate 2 and the portions of the second column portions 10 that are provided on the lower plate 3 contact each other to form, together, the required second column portions 10 .
- the second column portions 10 are formed out of metal, plastic, or the like, but preferably are formed out of a metal with high thermal conductivity or high resistance to corrosion (or durability thereto), such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, stainless steel, or the like. Additionally, preferably the metal plating is performed on at least a portion of the surfaces of the second column portions 10 (and, in particular, on a portion or all of the surfaces that are exposed to the interior space 4 ). This is because the provision of the metal plating modifies the state of the surface, expediting the movement of the vaporized refrigerant.
- a metal such as gold, silver, copper, aluminum, nickel, cobalt, or an alloy thereof, or the like, may be selected as this metal plating.
- this metal plating may be a single layer plating, a multilayer plating, electrolytic plating, or non-electrolytic plating.
- the provision of the plurality of second ducts 11 in this way in the second regions 6 and 7 causes the vaporized refrigerant and the condensed refrigerant to be divided, to be moved through fully using the plurality of the first ducts 9 , which are lined up in the Y-axis direction, at the boundary 12 and the boundary 13 .
- the second regions 6 and 7 achieve the function of exchanging the refrigerant, while using fully the plurality of individual first ducts 9 that are lined up in the Y-axis direction, while achieving the function of moving the vaporized refrigerant and the condensed refrigerant in the X-axis direction and Y-axis direction in the second regions 6 and 7 .
- the second column portions 10 that are provided in the second regions 6 and 7 achieve the function of reinforcing the interior space 4 .
- the heat transporting unit 1 in the first form of embodiment is able to diffuse the heat from the heat emitting object 20 in the X-axis direction and the Y-axis direction, and is able to transport the heat from the heat emitting object 20 in the X-axis direction. While the object is for the heat transporting unit 1 to transport the heat from the heat emitting object 20 along the X-axis direction (that is, to transport heat along the X-axis direction towards the far end from the position wherein the heat from the heat emitting object 20 is received), it is desirable to transport in the X-axis direction while using the entire width of the Y-axis direction of the heat transporting unit 1 .
- the second region 6 that is in thermal contact with the heat emitting object 20 diffuses, in the X-axis direction and the Y-axis direction, the heat from the heat emitting object 20 , to use the entire width in the Y-axis direction to move the heat to the first region 5 .
- the first region 5 is able to transport the heat along the X-axis direction, so that, as a result, the heat transporting unit 1 is able to transport the heat from the heat emitting object 20 along the X-axis direction while using the entire width thereof in the Y-axis direction.
- the first column portions 8 and the second column portions 10 are able to ensure the strength of the interior space 4 (or in other words, of the heat transporting unit 1 ).
- FIG. 5 is an interior perspective view of a heat transporting unit according to a second form of embodiment according to the Present Disclosure.
- FIG. 5 shows a state wherein a portion of the interior of the heat transporting unit 1 is visible.
- Second region 6 is provided with second column portions 10 , where gaps along the X-axis direction and the Y-axis direction are produced by the second column portions 10 , where these gaps form second ducts 11 .
- the vaporized refrigerant moves in the X-axis direction and the Y-axis direction in these second ducts 11
- the condensed refrigerant moves in the X-axis direction and in the Y-axis direction in these second ducts 11 .
- the second column portions 10 are preferably provided with large column members 30 and small column members 31 that are smaller than the large column members 30 .
- the large column members 30 are disposed within the second region 6 , and the small column members 31 are provided in locations other than those of the large column members 30 .
- the large column members 30 may have a size that is larger than that of the small column members 31 , and the large column members 30 and the small column members 31 may be lined up in a line, or may be lined up randomly.
- the second column portions 10 be structured from a mixture of the large column members 30 and the small column members 31 in this way, makes the shape of the second ducts 11 more complex.
- the multiple second ducts 11 are adjacent to each other with respective gaps in the X-axis direction and the Y-axis direction. Because a plurality of gaps is formed through the mixture of the large column members 30 and the small column members 31 , the adjacent distances between gaps is made smaller, and the intersections between the gaps is made larger.
- the second ducts 11 which are formed through the combination of these complex gaps, has strong capillary forces.
- the second ducts 11 are able to move the condensed refrigerant efficiently and rapidly through these strong capillary forces.
- the second ducts 11 that are formed by the combination of the complex gaps together are able to retain, across a broad range, the refrigerant that is a liquid in the second region 6 . Because of this, it becomes easier for the second region 6 , which receives the heat from the heat emitting object 20 , to vaporize the refrigerant quickly. Of course, the vaporized refrigerant can move quickly and in a broad range within the second ducts 11 .
- structuring the second column portions 10 from the large column members 30 and the small column members 31 further increases the strength of the second regions 6 . Because of the thermal contact with the heat emitting object 20 , the expansion and contraction of the second region 6 due to temperature variations is large. Because of this, a greater degree of strength is required, and thus increased strength is desirable.
- the difference in size between the large column members 30 and the small column members 31 is defined by the differences in the size of the cross-sectional areas in the vertical direction relative to the standing direction. Because of this, the “large” and “small” terminology for the large column members 30 and the small column members 31 can be defined for both the cases wherein there are differences in the cross-sectional areas through different shapes, and differences in the cross-sectional areas with identical shapes.
- channels are provided on the surfaces that are exposed to the interior space 4 in at least a portion of the first column portions 8 , second column portions 10 , and the upper plate 2 and the lower plate 3 .
- FIG. 6 is a cross-sectional diagram of an end portion of a heat transporting unit in a second form of embodiment according to the Present Disclosure.
- FIG. 6 illustrates a state wherein surfaces that are exposed to the interior space 4 of the heat transporting unit 1 are provided with channels 40 through 42 . Note that while FIG. 6 , for convenience in illustrating in a cross-section, shows only the second region 6 , similarly channels are provided also in the first region 5 and the first column portions 8 .
- the second column portions 10 are provided with channels 41 on the surfaces that are exposed to the interior space 4 .
- the channels 41 may be formed through cutting or milling the surfaces of the second column portions 10 , or the channels 41 may be formed in advance when the second column portions 10 are formed. Note that although not shown in FIG. 6 , channels are formed similarly also in the surfaces of the first column portions 8 that are exposed to the interior space 4 .
- the formation of channels in this way in at least a portion of the upper plate 2 , the lower plate 3 , the first column portions 8 , and the second column portions 10 provides the first ducts 9 and the second ducts 11 with channels.
- the provision of the first ducts 9 and the second ducts 11 with channels makes it possible to increase the capillary forces, thereby facilitating the movement of the condensed refrigerant along the channels.
- the condensed refrigerant and the vaporized refrigerant are moved by the first ducts 9 and the second ducts 11 , respectively, and thus when it is possible to move the condensed refrigerant along the channels, the first ducts 9 and the second ducts 11 use the space other than the channels to facilitate the movement of the vaporized refrigerant.
- the first ducts 9 and the second ducts 11 are able to move the vaporized refrigerant and the condensed refrigerant while preventing interference between the respective refrigerants. That is, the first ducts 9 move the vaporized refrigerant along the X-axis direction from the second region 6 to the second region 7 . On the other hand, the first ducts 9 move the condensed refrigerant along the X-axis direction from the second region 7 to the second region 6 . At this time, the channels are able to reduce the interference between the vaporized refrigerant and the condensed refrigerant in the first ducts 9 .
- the heat transporting unit 1 As described above, at least a portion of the upper plate 2 , the lower plate 3 , the first column portions 8 , and the second column portions 10 are provided with channels, thus making it possible for the heat transporting unit 1 to accelerate the cycle of the movement of the vaporized refrigerant and the movement of the condensed refrigerant, enabling the heat to be transported more quickly.
- the plurality of first column portions 8 form a plurality of first ducts 9 through the gaps that are formed between adjacent first column portions 8 . Because the refrigerant moves in the X-axis direction in each of the plurality of first ducts 9 , ducts are formed along the X-axis direction in the range of the first region 5 . This will be explained using FIG. 7 . In FIG. 7 , a cutout 35 that connects between adjacent first ducts 9 are provided part way through the first column portions 8 .
- FIG. 7 is an interior schematic diagram of the heat transporting unit 1 in the second form of embodiment according to the Present Disclosure.
- the cutout 35 connects between adjacent first ducts 9 , thus making it possible for the vaporized refrigerant or condensed refrigerant that is passing through the first duct 9 to pass through the cutout 35 to move to another first duct 9 .
- the heat emitting object 20 is extremely small (to take one example, the heat emitting object 20 may be a light-emitting diode element (hereinafter termed an “LED”)), then there may be cases where, in the second region 6 , the diffusion will be inadequate even when the heat from the heat emitting object 20 is diffused by the second ducts 11 . It in such a case, it would be necessary to transport a large amount of heat through those first ducts 9 that are positioned near to the position wherein the heat emitting object 20 is disposed, from among the plurality of first ducts 9 , where the other first ducts 9 would not have to transport a large amount of heat. In this case, the first ducts 9 that are positioned near to the heat emitting object 20 would require more refrigerant, requiring movement of refrigerant beyond the capability thereof.
- LED light-emitting diode element
- the one first duct 9 and the other first duct 9 are able to exchange the needed refrigerant and the unneeded refrigerant through the cutout 35 .
- FIG. 7 further illustrates a state wherein one first duct 9 A and another first duct 9 exchange refrigerant.
- an extremely small heat emitting object 20 is disposed in essentially the center, in the Y-axis direction, of the bottom surface of the second regions 6 .
- the second region 6 removes heat from the heat emitting object 20 , the refrigerant is vaporized, and the vaporized refrigerant moves through the second ducts 11 in the X-axis direction and the Y-axis direction.
- the heat emitting object 20 is extremely small, and thus the ability of the vaporized refrigerant to diffuse in the Y-axis direction in the second ducts 11 tends to be smaller than the ability to diffuse in the X-axis direction. Because of this, the vaporized refrigerant tends to move in the first duct 9 A that is near to the position at which the heat emitting object 20 is disposed, when moving from the second region 6 to the first region 5 .
- the first duct 9 A has the primary responsibility in the transportation of heat (noting that this is not to say that the other first ducts 9 do not transport heat, but rather the heat that diffuses in the Y-axis direction through the second ducts 11 is transported in the X-axis direction through most of the plurality of first ducts 9 , where saying that the first duct 9 A has the primary responsibility is just stating a comparative level), and thus the first duct 9 A requires more refrigerant than in the other first ducts 9 .
- the first duct 9 A transports vaporized refrigerant (heat) in the X-axis direction, as illustrated by the Arrow N.
- refrigerant can be received through the cutouts 35 from the other first ducts 9 , as with Arrow K and Arrow M. The reception of the refrigerant makes it possible for the first duct 9 A to transport heat using a greater amount of refrigerant.
- the first duct 9 A must transport a greater amount of vaporized refrigerant in order to transport a greater amount of heat.
- the area of the first duct 9 A is limited, there is a limit to the transportation capacity of the vaporized refrigerant in the first duct 9 A.
- the first duct 9 A is able to move vaporized refrigerant to other first ducts 9 through the cutouts 35 . The result is that the vaporized refrigerant that transports the heat is moved efficiently in the X-axis direction through the plurality of first ducts 9 .
- the refrigerant that is in the vicinity of the heat emitting object 20 which produces a greater amount of heat than in the other regions, to be vaporized, meaning that there will be a high likelihood that the amount of condensed refrigerant will be inadequate.
- the provision of the cutouts 35 makes it possible for the first duct 9 A to receive, through the cutout 35 , the deficient amount of condensed refrigerant from the other first ducts 9 . By receiving this refrigerant, the first duct 9 A becomes able to move a greater amount of refrigerant to the vicinity of the heat emitting object 20 , resulting in the ability to transport a great amount of heat.
- the provision of the cutouts 35 makes it possible to further increase the efficiency with which the heat transporting unit 1 transports the heat of the heat emitting object 20 .
- the heat transporting unit 1 is provided further with an intermediate plate that is stacked between the upper plate 2 and the lower plate 3 , where the second regions 6 and 7 are stacked in different positions in the Z-axis direction, where, preferably, the second ducts are provided with a structure along the Z-axis direction as well.
- FIG. 8 is an enlargement of the vicinity of the second region of a heat transporting unit according to a second form of embodiment according to the Present Disclosure.
- the heat transporting unit 1 is stacked with an intermediate plate 50 between the upper plate 2 and the lower plate 3 .
- the lower plate 3 is provided with large column members 30 and small column members 31 that structure the second column portions 10 .
- the upper plate 2 is provided with large column members 51 and small column members 52 that structure second column portions 54 .
- the intermediate plate 50 is provided with opening portions 53 for connecting between the gaps that are formed, respectively, between the second column portions 10 that are formed on the lower plate 3 and the second column portions 54 that are formed on the upper plate 2 .
- second ducts 11 are formed by the second column portions 10 .
- second ducts 55 are formed by the second column portions 54 .
- the second column portions 10 and the second column portions 54 (or in other words, the large column members 30 and large column members 51 , and the small column members 31 and the small column members 52 ), are provided facing each other in different locations relative to the Z-axis direction. Because of this, when the upper plate 2 , the first region 50 , and the lower plate 3 are stacked together, the second ducts 11 and the second ducts 55 are connected in a state wherein each is slightly shifted.
- the opening portions 53 connect the second ducts 11 and the second ducts 55 , which are connected in a state wherein they are each slightly shifted.
- the entirety of the second ducts (the ducts that are the second ducts 11 and the second ducts 55 together) are structured along the Z-axis direction, in addition to the X-axis direction and the Y-axis direction. Because of this, in the entirety of the second ducts, the vaporized refrigerant can move, and the condensed refrigerant can move, in the X-axis direction, the Y-axis direction, and the Z-axis direction.
- the second region 6 is able to diffuse in three dimensions the heat removed from the heat emitting object 20 .
- the ability of the second region 6 to diffuse in three dimensions the heat of the heat emitting object 20 makes it possible for the second region 6 to move heat across a broader range to the first region 5 .
- the first region 5 is able to use fully the plurality of first ducts 9 to move the vaporized refrigerant (to transport the heat).
- the entirety of the second ducts is able to diffuse the refrigerant in three dimensions, and thus, in the second region 7 , the vaporized refrigerant can be cooled while diffusing in three dimensions, to efficiently condense the vaporized refrigerant. Additionally, in the second region 7 , the condensed refrigerant can move three-dimensionally, and thus the condensed refrigerant can move to the first region 5 at a high speed.
- the condensed refrigerant can move to the first region 5 across a broad range, enabling the first region 5 to move the condensed refrigerant using the plurality of first ducts 9 fully.
- the first region 50 is stacked between the upper plate 2 and the lower plate 3 , so the provision of the first region 50 further increases the strength of the heat transporting unit 1 , and more clearly partitions between the ducts of the first ducts 9 and the second ducts 11 and 55 , enabling the first ducts 9 and the second ducts 11 and 55 to transport the heat more reliably.
- the interior space 4 is provided with a first region and a second region have different functions in heat transportation.
- the first region is positioned in any region in the interior space 4
- the second region is positioned in another portion that is not the first region.
- the positioning of the first region and the second region may be determined in a variety of ways.
- FIG. 2 which was used in the first form of embodiment, illustrates a heat transporting unit 1 wherein the second region 6 and the second region 7 are provided at both ends of the interior space 4 , and the first region 5 is provided interposed between these second region 6 and second region 7 .
- the heat from the heat emitting object that is disposed facing the second region 6 is received by the second regions 6 and diffuses in the X-axis direction and the Y-axis direction (and further, in the Z-axis direction). Moreover, the second region 6 moves the heat to the first region 5 .
- the first region 5 which has received the heat from the second region 6 , transports the heat in the X-axis direction.
- the first region 5 transports, to the second region 7 , the heat that has been transported in the X-axis direction.
- the second region 7 that has received the heat from the first region 5 performs cooling while the heat diffuses in the X-axis direction and Y-axis direction (and further, in the Z-axis direction).
- the refrigerant condenses through being cooled, and the second region 7 moves the refrigerant, through the first region 5 , to the second region 6 .
- the heat transporting unit 1 which has a structure that is provided with the second regions 6 and 7 at both end portions and that is provided with the first region 5 interposed between the second regions 6 and 7 , is able to allocate the three roles of diffusing the heat, transporting the heat, and cooling the heat into the respective regions.
- the result is that the heat transporting unit 1 , having such a structure, is able to transport the heat efficiently.
- the second region 6 may be provided at one end portion in the interior space 4 and the first region 5 may be provided in the regions thereof other than the second region 6 . That is, the heat transporting unit 1 , as illustrated in FIG. 9 , may be provided with a second region 6 at only one end portion in the interior space 4 , with a structure wherein the remaining portion is provided as first regions 5 .
- FIG. 9 is a plan view diagram of a heat transporting unit according to a second form of embodiment according to the Present Disclosure.
- FIG. 9 shows the interior of the heat transporting unit 1 in a visible state.
- the heat transporting unit 1 illustrated in FIG. 9 has a second region 6 at only one end portion within the interior space 4 , and a first region 5 in the region that is not the second region 6 .
- the heat emitting object 20 is disposed facing the second region 6 .
- the second region 6 as explained in the first and second forms of embodiment, is provided with second column portions 10 and second ducts 11 .
- the second region 6 uses the second ducts 11 to diffuse the heat removed from the heat emitting object 20 in the X-axis direction and the Y-axis direction (and further, in the Z-axis direction). Additionally, the second region 6 moves the diffused heat to the first region 5 . Specifically, it moves the vaporized refrigerant to the first region 5 .
- the first region 5 transports the heat in the X-axis direction using the first ducts 9 .
- the first region 5 is provided with first ducts 9 along the long direction (the X-axis direction), so the first region 5 is able to cool the heat during the transportation of the heat using the long first ducts 9 .
- the vaporized refrigerant is condensed through the cooling of the heat in the first ducts 9 . Because the first ducts 9 have capillary forces, the condensed refrigerant moves along the X-axis direction towards the second region 6 .
- the heat transporting unit 1 that is provided with the second region 6 at only one end of the interior space 4 in this way has a simple structure, and thus can reduce manufacturing costs. Additionally, if there is little difference between the width of the heat emitting object 20 in the Y-axis direction and the width of the heat transporting unit 1 in the Y-axis direction (the length in the short direction), then the second region 6 can adequately diffuse the vaporized refrigerant in the Y-axis direction, enabling movement of the vaporized refrigerant to all of the first ducts 9 . Because of this, the vaporized refrigerant is more easily cooled, during movement, within the first ducts 9 , so the second region 7 becomes unnecessary. From this point as well, preferably the heat transporting unit 1 is provided with a structure such as in FIG. 9 .
- FIG. 10 is a perspective diagram of a heat transporting unit according to a second form of embodiment according to the Present Disclosure.
- FIG. 10 illustrates the internal structures in a visible state.
- the heat transporting unit 1 illustrated in FIG. 10 has a structure that is provided with a second region 60 in the center portion of the interior space 4 , and provided with first regions 61 and 62 at both ends of the second region 60 (that is, at both ends of the interior space 4 ).
- the second region 60 has structures and functions identical to those of the second regions 6 and 7 explained in the first and second forms of embodiment. That is, it is provided with second column portions 10 , and with second ducts 11 that are formed by the second column portions 10 .
- the first regions 61 and 62 have structures and functions that are identical to those of the first region 5 that was explained in the first and second forms of embodiment. That is, they are provided with first column portions 8 , and provided with first ducts 9 that are formed by the first column portions 8 .
- the heat emitting object 20 (not shown, both in FIG. 10 and below) is disposed facing the bottom surface of the second region 60 .
- the second region 60 removes heat from the heat emitting object 20 .
- the second region 60 has second ducts 11 along the X-axis direction and the Y-axis direction (and further, along the Z-axis direction), and thus is able to move, in the X-axis direction and Y-axis direction (and further, in the Z-axis direction), the refrigerant that is vaporized by the heat of the heat emitting object 20 . Furthermore, the second region 60 moves the vaporized refrigerant to the first regions 61 and 62 .
- the first regions 61 and 62 are provided at both sides of the second region 60 , and the second region 60 moves the vaporized refrigerant in the X-axis direction as well, and thus the second region 60 moves the vaporized refrigerant to both the first region 61 and the first region 62 . Additionally, the second region 60 moves the vaporized refrigerant in the Y-axis direction as well, and thus moves the vaporized refrigerant from the second region 60 using fully the crosswise direction of the Y-axis direction of the first regions 61 and 62 . That is, in both the first regions 61 and 62 , the plurality of first ducts 9 that are provided are used fully to enable movement of the vaporized refrigerant in the X-axis direction.
- the vaporized refrigerant that has moved to both the first region 61 and the first region 62 is moved in the X-axis direction by the plurality of first ducts 9 in both the first region 61 and the first region 62 .
- the vaporized refrigerant is moved towards the respective end portions, so as to move away from the second region 60 .
- the vaporized refrigerant is cooled during the movement towards the end portions.
- the refrigerant is condensed through this cooling.
- the condensed refrigerant moves along the X-axis direction due to the capillary forces of the first ducts 9 .
- the contents refrigerant is moved towards the second region 60 .
- the heat transporting unit 1 illustrated in FIG. 10 transports the heat of the heat emitting object 20 , disposed at the center portion thereof, towards both ends.
- a heat transporting unit 1 having the structure illustrated in FIG. 10 will be used.
- the heat transporting unit 1 in the second form of embodiment is able to transport and exhaust heat of a heat emitting object while being compatible with a variety of structures, shapes, sizes, mounting conditions, and the like, of the heat-emitting object to which it is applied.
- FIG. 11 is a perspective assembly diagram of a heat transporting unit according to the third form of embodiment according to the Present Disclosure.
- FIG. 11 illustrates a state wherein the upper plate 2 is at the bottom and the lower plate 3 is at the top, and, in order to cause the interior to be visible, illustrates a state wherein the outer surface of the lower plate 3 has been removed.
- the heat transporting unit 1 is provided with a heat receiving portion 70 for making thermal contact with a heat emitting object at the upper plate 2 and/or at the lower plate 3 .
- the heat transporting unit 1 in FIG. 11 is provided with the heat receiving region 70 at the lower plate 3 .
- the heat receiving region 70 is positioned where the heat emitting object is disposed, and the heat transporting unit 1 removes heat from the heat emitting object through the heat receiving region 70 . Thereafter, the heat transporting unit 1 transports the heat of the heat emitting object in the X-axis direction from the second region 6 through the first region 5 .
- the heat receiving region 70 may be provided as a member for positioning the heat emitting object, as illustrated in FIG. 11 .
- the heat receiving region 70 may have a flat shape or a frame shape of members having high thermal conductivity, such as a metal, and alloy, or the like.
- the heat transporting unit 1 may be provided with a heat receiving region 70 as a target position for positioning the heat emitting object, without having to provide a separate element or member as the heat receiving region 70 . That is, in the heat receiving region 70 , there is no need for the explicit provision of a member on the surface of the lower plate 3 , but rather it may be a position, region, or location for the placement of the heat emitting object 20 .
- the heat receiving region 70 the region or location for positioning that selects the position for the placement of the heat emitting object 20 , in order to use the functions of the heat transporting unit 1 .
- the responsibility of the party providing the heat transporting unit 1 to recommend the position for placing the heat emitting object 20 is defined identically to that for recommending the heat receiving region 70 .
- the provision of the heat receiving region 70 in the heat transporting unit 1 is because this facilitates the definition of the target for the position for the placement of the heat emitting object, and because this facilitates the achievement of cooling the heat emitting object more efficiently, as in the experimental results, described below.
- the heat receiving region 70 being provided spanning the boundary 12 of the first region 5 and the second region 6 is preferred from the perspective of the efficiency of heat transportation in the heat transporting unit 1 .
- FIG. 12 is an explanatory diagram listing an example of embodiment and comparative examples.
- the heat emitting object 20 (that is, the heat receiving region 70 ) is provided spanning the boundary 12 of the second region 6 and the first region 5 .
- the heat emitting object 20 (that is, the heat receiving region 70 ) is provided at the bottom surface of the second region 6 , where the heat emitting object 20 is in a state that is essentially within the bottom surface of the second region 6 .
- the heat emitting object 20 (that is, the heat receiving region 70 ) is provided at the bottom surface of the second region 6 , and the heat emitting object 20 is included further within the bottom surface of the second region 6 than in the first comparative example, and the heat emitting object 20 covers the second region 6 more broadly than in the case of the second comparative example.
- Heat was actually applied to the heat emitting object 20 , and the surface temperature of the heat emitting object 20 was measured, based on these three types of structures.
- FIG. 13 is a graph showing the measurement results in the example of embodiment and in the comparative examples. As is clear from the graph in FIG. 13 , in the example of embodiment the surface temperature of the heat emitting object 20 was 73.4° C. In the first comparative example, the surface temperature of the heat emitting object 20 was 73.8° C. In the second comparative example, the surface temperature of the heat emitting object 20 was 76.0° C.
- the structure of the example of embodiment was most able to cool the heat of the heat emitting object (that is, most able to transport the heat). That is, the heat receiving region 70 preferably is provided spanning the boundary 12 of the first region 5 and the second region 6 .
- the position of placement of the heat receiving region 70 does not depend on only the cooling effect of this type of heat emitting object, and thus should be determined in accordance with parameters such as, for example, the size, shape, mounting position, and the like of the heat emitting object 20 , and the third form of embodiment does not limit particularly the position of placement of the heat receiving region 70 .
- the surface temperatures obtained through the measurement results are only examples, and, of course, will vary depending on a variety of parameters such as the size, shape, and mounting position of the heat emitting object, and on measurement environment conditions, type of refrigerant, and so forth.
- the heat transporting unit 1 in the third form of embodiment is able to transport heat of the heat emitting object more efficiently through the specification of the position of placement of the heat emitting object.
- FIG. 14 is a side view diagram of a heat transporting unit according to a fourth form of embodiment according to the Present Disclosure.
- the heat transporting unit 1 as with that which was explained in FIG. 2 , is provided with a first region 5 , a second region 6 , and a second region 7 within the interior space 4 .
- a heat emitting object 20 is positioned in the vicinity of the boundary between the second region 6 and the first region 5 , and the second region 6 diffuses the heat removed from the heat emitting object 20 .
- the heat diffused by the second region 6 moves to the first region 5 , and the first region 5 transports the heat towards the second region 7 .
- the heat that arrives at the second region 7 diffuses within the second region 7 .
- a cooling fan 80 is illustrated in FIG. 14 as an example of a heat radiating portion.
- the cooling fan 80 cools the second region 7 .
- the heat that was transported from the heat emitting object 20 arrives and is cooled, to condense the vaporized refrigerant.
- the cooling fan 80 expedites the condensation of the refrigerant.
- the condensed refrigerant moves from the second region 7 to the second region 6 .
- the heat transporting unit 1 through producing this movement, produces heat cycling, enabling the effective transportation and cooling of the heat of the heat emitting object 20 .
- the heat transportation effectiveness of the heat transporting unit 1 is improved involves the transportation of the cooled heat in the opposite direction (that is, the movement of the condensed refrigerant) in addition to the transportation of the heat of the heat emitting object 20 (that is, the movement of the vaporized refrigerant). Because of this, the heat transporting efficiency of the heat transporting unit 1 is improved through increasing the efficiency and the speed of movement of the condensed refrigerant through the heat radiating portion.
- the provision of the additional heat radiating portion enables the heat transporting unit 1 to transport the heat with high efficiency.
- cooling fan was shown in FIG. 14 as an example of a heat radiating portion, instead of a cooling fan, a liquid-cooled jacket, a Peltier element, a heat sink, or any other member capable of radiating heat can be used as the heat radiating portion.
- the heat transporting unit 1 can replace a heat radiating fin or liquid cooling device, or the like, that is mounted in a notebook PC, a mobile terminal, a computer terminal, or the like, and can replace a cooling device that is mounted in an industrial device, or replace a heat radiating case or a cooling device that is mounted in a control computer unit, or the like.
- the heat transporting unit 1 can transport heat at a higher speed than a heat pipe that has been used conventionally, and thus can be applied to cooling a variety of electronic components. The result is that the heat transporting unit 1 can be used in a broad scope of applications.
- the heat transporting unit 1 in the fourth form of embodiment transports the heat of the heat emitting object more efficiently.
- a heat transporting unit 1 as explained in any of the first through fourth forms of embodiment can be applied well to an electronic device that is provided with a heat transporting unit 1 , a heat emitting object 20 that is in thermal contact with at least a portion of the surface of the heat transporting unit 1 (or which may be in contact with the heat receiving portion explained in the third form of embodiment), an electronic circuit board whereon the heat emitting object 20 is mounted, and a case for housing the electronic circuit board.
- FIG. 15 is a schematic diagram of an electronic device according to the fifth form of embodiment according to the Present Disclosure.
- the electronic device 90 houses, within a case 91 , a heat transporting unit 1 for cooling an electronic circuit board 92 and a heat emitting object 20 , mounted thereon.
- the electronic circuit board 92 has a variety of electronic components mounted thereon, so the heat transporting unit 1 transports heat, with those electronic components requiring the transportation of heat as the heat emitting object 20 .
- the heat transporting unit 1 may be provided with a heat radiating portion, as represented by the cooling fan 80 .
- This type of electronic device 90 can be cooled when the heat of the heat emitting object is transported in a specific direction, thus making it possible to prevent malfunction of or damage to the electronic device, enabling higher performance to be achieved.
- the electronic device is of a thin shape such as an automobile television or personal monitor, or may be a mobile terminal that must be of a small size.
- the electronic device includes also mobile telephones, mobile music playing equipment, mobile mail terminals, PDAs, digital cameras, digital video cameras, mobile recorders, smartphones, and mobile video recording equipment.
- the electronic device 90 in the fifth form of embodiment is able to transport effectively, to the periphery, the heat of those electronic components and mechanical components that have high heat production, thus making it possible to prevent in advance malfunctions or failures of the electronic device 90 .
- the heat emitting object was thermally connected to either the upper plate or the lower plate, instead it may be thermally connected to both the upper plate and the lower plate. Furthermore, the heat emitting object may be connected thermally through a heat receiving member, having high thermal conductivity, which is a separate member, to the upper plate and/or the lower plate.
- the provision of the heat receiving member enables its use as a positioner or a securing member when connecting thermally to the heat emitting object.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The heat transporting unit according to the Present Disclosure comprises: an upper plate; a lower plate that faces the upper plate; an interior space that is formed by the upper plate and the lower plate and wherein a refrigerant can be sealed; a first region, that is a region that is part of the interior space and that is provided with a first column portion that forms a plurality of first ducts that extend in the X-axis direction; and a second region that is provided with a second column portion that forms a plurality of second ducts that extend in the X-axis direction and the Y-axis direction, that is a region that is other than the first region within the interior space; wherein: the first ducts and second ducts connect at a boundary between the first region and the second region.
Description
- The Present Application claims priority to prior-filed Japanese Patent Application No. 2010-095565, entitled “Heat Transporting Unit, Electronic Circuit Board And Electronic Device,” filed on 17 Apr. 2010 with the Japanese Patent Office. The contents of the aforementioned Patent Application is fully incorporated in its entirety herein.
- The Present Disclosure relates, generally, to a heat transporting unit and an electronic device that efficiently transports heat received from a heat emitting object such as a semiconductor integrated circuit, an LED element, a power device or an electronic component.
- Electronic components such as semiconductor integrated circuits, LED elements and power devices are used in electronic devices, industrial devices, automobiles and the like. These electronic components become heat emitting objects that emit heat due to the electric currents that flow therein. When the heat emitted from the heat emitting object rises above a specific temperature, problems arise in that the operation of the electronic component cannot be guaranteed, and the possibility of an adverse effect on other components exists, and, as a result, the possibility of causing a breakdown of performance of the electronic device itself.
- In order to cool such a heat emitting object, there has been a proposal for a cooling device for diffusing a heat pipe that has a cooling effect through the vaporization and condensation of a sealed refrigerant. In a heat pipe, heat is removed from the heat emitting object when the refrigerant sealed therein is vaporized. The vaporized refrigerant is condensed through the radiation of heat, and the condensed refrigerant moves back. The heat pipe cools the heat emitting object through cycling of this vaporization and condensation. That is, the heat pipe diffuses and transports heat. Moreover, the heat that is diffused and transported by the heat pipe is cooled through combination with a heat radiating member. When compared to a metal heat diffusing member, a heat pipe is able to diffuse and transport heat more efficiently using a refrigerant.
- In recent years, the electronic components that require cooling have not been limited only to relatively large semiconductor integrated circuits such as central processing units (CPUs) or specialty ICs, but are often are extremely small electronic components, such as light emitting devices (LEDs). This type of small electronic component not only is small in terms of its size, but also often a plurality of electronic components together comprise a single set. Because of this, the cooling device which diffuses the heat pipe must cool a plurality of electronic components.
- Often small electronic components of this type are mounted in one portion of an electronic circuit board, leaving no extra room in the location of the mounting, so that the heat cannot diffuse or escape therefrom. Because of this, after the heat has been removed from the electronic components, it is necessary to transport that heat at high speed, and then to perform cooling at the transportation destination. That is, a heat transporting member for transporting heat at a high speed in a specific direction, being a heat transporting member diffuses the vaporization and condensation of a refrigerant, is desirable. There have been proposals for heat pipes that transport, in a specific direction, heat that has been removed from a heat emitting object. See, for example, Japanese Patent Application Nos. H11-101585; 2002-039693; 2010-007905; and 2007-113864.
- In such a heat pipe, heat that has been removed from a heat emitting object, a refrigerant is sealed in an interior space that is formed from an upper plate and a lower plate that are joined together, and the heat of the heat emitting object is transported by the cycle of movement of this sealed refrigerant. In a cooling device diffuses a heat pipe, it is important, in increasing the cooling capability, to increase the heat transporting efficiency (which is determined by the per-cycle speed of the movement of the vaporized refrigerant and the movement of the condensed refrigerant, and by the number of cycles per unit time).
- At this time, the refrigerant that is sealed in the interior space vaporizes due to the heat from the heat emitting object to move within the interior space, and eventually cools and condenses, and moves within the interior space. Because of this, the vaporized refrigerant and the condensed refrigerant interfere with each other while moving in mutually opposite directions within the interior space. When the effects of this interference become large, there is a problem in that this produces an adverse effect on the speed of cycling of the movement of the vaporized refrigerant and the movement of the condensed refrigerant, reducing the speed of transport of the heat and reducing the transportation efficiency. In order to prevent this interference between the movement of the vaporized refrigerant and the movement of the condensed refrigerant, it is desirable to increase the size of the interior space and to have no obstructions.
- On the other hand, in a structure wherein there are no obstructions within the interior space, the heat pipe would be nothing but the upper plate and the lower plate, and thus extremely weak. Because in a heat pipe the heat emitting object is cooled through the repetitive cycling of vaporizing and condensing the refrigerant that is sealed therein, the heat pipe is subjected to cycling of extremely high internal pressures. If the strength of the heat pipe were weak in such a severe operating environment, the heat pipe would break due to a “popcorn” phenomenon produced through the vaporization of the refrigerant, so that there would be a problem in that the refrigerant would leak out onto the electronic components and the electronic circuit board. If the refrigerant were to leak out, there would be a problem in that it would damage the electronic components or electronic circuit board, and could cause a malfunction of the electronic device.
- Although it is necessary to increase the strength, if, for example, the strength of the upper plate and lower plate themselves were to be increased, this would engender an increase in cost and an increase in thickness, which would be unsuitable for the Present Disclosure, and would also be accompanied by difficulties in assembly. This is because a heat pipe that is excessively thick is not suited to the space wherein light emitting diodes, and the like, are mounted, because of the lack of extra space.
- Because of this, an increase in the strength of the heat pipe necessitates the provision of reinforcing members, such as columns or partitioning plates, within the interior space of the heat pipe. However, the provision of a reinforcing member would interfere with the freedom of movement of the vaporized refrigerant and of the condensed refrigerant within the interior space. The '585 Application and the '693 Application are intended to transport heat from a heat emitting object in a specific direction while increasing the strength of the heat pipe.
- The heat pipe disclosed in the '585 Application discloses a flat heat pipe wherein there is an array of pores (which are actually more ducts then pores). In the heat pipe disclosed in the '585 Application, the individual ducts perform the movement of the vaporized refrigerant and the movement of the condensed refrigerant. The heat pipe disclosed in the '585 Application is able to transport the heat towards the specific direction through these pores. That is, the vaporized refrigerant moves from a first end to a second end of the pores, and the condensed refrigerant moves from the second end to the first end of these pores. In the technology disclosed in the '585 Application the strength of the heat pipe as a whole is maintained by the layering of the ducts in the crosswise direction.
- However, in the heat pipe disclosed in the '585 Application, adjacent ducts are completely separated from each other, so the movement of the refrigerant only occurs in the lengthwise direction of the heat pipe (the direction along the ducts). Because of this, there is a problem in that there is no cooling effect in the crosswise direction for a small heat emitting object. Moreover, when the heat pipe disclosed in the '585 Application cools a small heat emitting object, the cooling load is applied only to the heat pipe that contacts the heat emitting object directly. That is, only the refrigerant that is in the duct that contacts the heat emitting object directly will be vaporized and move, and will condensed and move. Because of this, the heat pipe disclosed in the '585 Application has a problem in that it is unable to achieve its full performance.
- The heat pipe disclosed in the '693 Application forms movement paths for the vaporized refrigerant and movement paths for the condensed refrigerant through mutually offsetted slits that are provided in layered members. These slits are formed in a specific direction, so that the movement of the refrigerant and the movement will be performed in a specific direction. The result is that the heat pipe disclosed in the '693 Application is able to transport the heat in a specific direction.
- The '693 Application has the same problem as in the '585 Application, in that, as with the '585 Application, the individual ducts, which are formed by the slits, are independent of each other.
- In the '905 Application, a plurality of plate members are stacked together, in a disclosure of a heat pipe that transports heat through producing capillary forces through the stacking of plate members provided with channels and plate members provided with holes.
- However, while the heat pipe disclosed in the '905 Application is able to transport heat in the long direction, it is difficult for heat to diffuse in the short direction. Because of this, when the heat emitting objects are small, it is possible to transport, in the long direction, the heat of the heat emitting object only in the vicinity that contacts the heat emitting object. Additionally, heat can diffuse non-directionally from a heat emitting object through holes that are provided across the entire surface, making it difficult to transport heat in the specific direction.
- Not only is it not possible for any of the technologies in the '585 Application through the '905 Application to achieve the full performance of the heat pipe when transporting heat from one end portion to the other end portion, but they also cannot achieve their maximum heat pipe performance when transporting heat towards one end portion from the center portion. This is because although the cooling is only for heat that is transported through a specific duct, the cooling will apply also to ducts that are not involved in the transporting of the heat, and thus the cooling member for cooling the heat that is transported by the heat pipe will not be able to exhibit its maximum performance.
- Additionally, the end portion of the heat pipe that transports the heat must achieve either the function of receiving heat from the heat emitting object, the function of cooling the heat that is transported from the other end portion, for both. Because of this, regardless of the size of the heat emitting object and regardless of the size of the cooling member, it is desirable for the heat that is received from the heat emitting object, and the heat that is transported, to diffuse in the crosswise direction.
- However, the heat pipes disclosed in the '585 Application through the '905 Application do not have such a function, so that only heat from a specific location is received and cooled. Because of this, the heat pipes in the '585 Application and the '693 Application have a problem in that they cannot be applied to cooling small heat emitting objects.
- The '864 Application discloses a heat pipe with stacked plate members that are provided with channels in the short direction at the end portions and plate members that are provided with ducts in the lengthwise direction across the entirety. These heat pipes allow the diffusion of heat in the short direction at the end portions, and the movement of heat in the lengthwise direction otherwise.
- However, in the heat pipe disclosed in the '864 Application, the refrigerant can move in the lengthwise direction only in an extremely narrow width, reducing the heat transporting efficiency. In addition, the ducts that are provided in the short direction only partially overlap the ducts that are provided in the lengthwise direction, so there is a problem in that the transmission of heat between the ducts is poor. Furthermore, because the ducts are formed unbalanced within the heat pipe, there is also a problem in that the heat pipe is not strong. As a result, the technology of the '864 Application also has a problem in that it is unable to transport the heat of the heat emitting object efficiently in the specific direction. In addition, the in the heat pipe disclosed in the '864 Application, there are structural limitations to the position of the contact with the heat emitting object, and thus there is a problem in that it is difficult to use this heat pipe in electronic devices or industrial devices wherein there is high-density packaging.
- As described above, the heat pipes for transporting heat from a heat emitting object in a specific direction according to the conventional technologies have problems in that they cannot achieve the maximum performances thereof. In particular, they have problems in that the cooling by transporting heat from small heat emitting objects is inadequate. Furthermore, they cannot both ensure the strength of the heat pipe and transport heat efficiently while handling flexibly the sizes of the heat emitting objects and the contact positions thereof.
- In contemplation of the problem areas set forth above, the object of the Present Disclosure is provided a heat transporting unit able to transport efficiently heat from a small heat emitting object, while achieving the maximum performance thereof, through: (1) ensuring strength through column portions and reinforcing portions, (2) minimizing obstructions to movement of the refrigerant in the sealed space by the column portions and reinforcing portions, (3) achieving movement of the refrigerant in the required X-axis, Y-axis, and Z-axis directions while minimizing impediments to the movement of the refrigerant, and (4) handling flexibly the sizes of the heat emitting objects and the contact positions thereof. In addition, a heat pipe is provided that can be mounted easily, even in electronic devices and industrial devices with high-density mounting.
- Note that the heat transporting unit has a heat pipe structure diffuses vaporization and condensation of a sealed refrigerant.
- In contemplation of the problem areas set forth above, in the heat transporting unit according to the Present Disclosure, a space is defined by the mutually orthogonal X axis, Y axis, and Z axis, and comprises: an upper plate; a lower plate that faces the upper plate; an interior space that is formed by the upper plate and the lower plate and wherein a refrigerant can be sealed; a first region, that is a region that is part of the interior space and that is provided with a first column portion that forms a plurality of first ducts that extend in the X-axis direction; and a second region that is provided with a second column portion that forms a plurality of second ducts that extend in the X-axis direction and the Y-axis direction, that is a region that is other than the first region within the interior space; wherein: the first ducts and second ducts connect at a boundary between the first region and the second region.
- The heat transporting unit according to the Present Disclosure is provided with column portions that are different in the first region and the second region, in a sealed space wherein refrigerant is sealed, to thereby not only ensure strength, but to also achieve optimal diffusion and transportation of heat in the X-axis, Y-axis, and Z-axis directions.
- Additionally, by diffusing, in the long direction and in the short direction, the heat that is received at the location of thermal contact with the heat emitting object while transporting the diffused heat in the long direction, the heat transporting unit is able to transport efficiently the heat from the heat emitting object while achieving the maximum performance as a heat pipe.
- The result is that the heat transporting unit according to the Present Disclosure is able to transport efficiently heat from a small heat emitting object.
- Additionally, the heat transporting unit according to the Present Disclosure is also able to transport at high speeds the heat from the heat emitting object while handling also changes in the locations of disposition of the heat emitting objects.
- The organization and manner of the structure and operation of the Present Disclosure, together with further objects and advantages thereof, may best be understood by reference to the following Detailed Description, taken in connection with the accompanying Figures, wherein like reference numerals identify like elements, and in which:
-
FIG. 1 is a perspective diagram of a heat transporting unit according to a first form of embodiment according to the Present Disclosure; -
FIG. 2 is an interior perspective diagram of the heat transporting unit according to the first form of embodiment according to the Present Disclosure; -
FIG. 3 is an explanatory diagram for the operation of the heat transporting unit according to the first form of embodiment according to the Present Disclosure; -
FIG. 4 is a conceptual diagram for the operation of the heat transporting unit according to the first form of embodiment according to the Present Disclosure; -
FIG. 5 is an interior perspective diagram of the heat transporting unit according to a second form of embodiment according to the Present Disclosure; -
FIG. 6 is a cross-sectional diagram of the end portion of a heat transporting unit according to a second form of embodiment according to the Present Disclosure; -
FIG. 7 is an interior schematic diagram of the heat transporting unit according to a second form of embodiment according to the Present Disclosure; -
FIG. 8 is an enlarged diagram in the vicinity of the second region in a heat transporting unit according to a second form of embodiment according to the Present Disclosure; -
FIG. 9 is a plan view diagram of a heat transporting unit according to a second form of embodiment according to the Present Disclosure; -
FIG. 10 is a perspective diagram of a heat transporting unit according to a second form of embodiment according to the Present Disclosure; -
FIG. 11 is an assembly perspective diagram of a heat transporting unit according to a third form of embodiment according to the Present Disclosure; -
FIG. 12 is an explanatory diagram lining up an example of embodiment and comparative examples; -
FIG. 13 is a graph illustrating measurement results for the example of embodiment and the comparative examples; -
FIG. 14 is a side view diagram of a heat transporting unit according to a forth example of embodiment according to the Present Disclosure; and -
FIG. 15 is a schematic diagram of an electronic device according to a fifth form of embodiment according to the Present Disclosure. - While the Present Disclosure may be susceptible to embodiment in different forms, there is shown in the Figures, and will be described herein in detail, specific embodiments, with the understanding that the disclosure is to be considered an exemplification of the principles of the
- Present Disclosure, and is not intended to limit the Present Disclose to that as illustrated.
- In the embodiments illustrated in the Figures, representations of directions such as up, down, left, right, front and rear, used for explaining the structure and movement of the various elements of the Present Disclosure, are not absolute, but relative. These representations are appropriate when the elements are in the position shown in the Figures. If the description of the position of the elements changes, however, these representations are to be changed accordingly.
- A heat transporting unit according to a first invention according to the Present Disclosure is one wherein a space is defined by the mutually orthogonal X axis, Y axis, and Z axis; and comprises: an upper plate; a lower plate that faces the upper plate; an interior space that is formed by the upper plate and the lower plate and wherein a refrigerant can be sealed; a first region, that is a region that is part of the interior space and that is provided with a first column portion that forms a plurality of first ducts that extend in the X-axis direction; and a second region that is provided with a second column portion that forms a plurality of second ducts that extend in the X-axis direction and the Y-axis direction, that is a region that is other than the first region within the interior space; wherein: the first ducts and second ducts connect at a boundary between the first region and the second region.
- Given this structure, not only is the heat transporting unit able to have improved strength, but is also able to transport, in the lengthwise direction, the heat removed from the heat emitting object using fully the short direction of the heat transporting unit, even with a small heat emitting object.
- In a heat transporting unit according to a second invention according to the Present
- Disclosure, in addition to the first invention, in a first duct, not only does a vaporized refrigerant move in the X-axis direction, but a condensed refrigerant also moves in the X-axis direction, and in a second duct, not only does the vaporized refrigerant move in the X-axis direction and the Y-axis direction, but the condensed refrigerant also moves in the X-axis direction and the Y-axis direction.
- Given this structure, the heat transporting unit is able to transport, in the long direction, the heat removed from the heat emitting object, while using the short direction fully.
- In a heat transporting unit according to a third invention according to the Present Disclosure, in addition to the first and second inventions, not only does vaporized refrigerant move mutually in the first duct and the second, but also the condensed refrigerant moves mutually in the first duct and the second duct.
- Given this structure, the heat transporting unit is able to transport heat through using efficiently the first region and the second region, which have different functions.
- In a heat transporting unit according to a fourth invention according to the Present Disclosure, in addition to any of the first through third inventions, a second region is provided at at least one of the two end portions of the interior space, and a first region is provided in a region other than the second region in the interior space.
- Given this structure, the heat transporting unit is able to transport heat from a heat emitting object that is disposed on one end portion to the other end portion.
- In a heat transporting unit according to a fifth invention according to the Present Disclosure, in addition to any of the first through fourth inventions, a second region is provided in the center portion of the interior space, and a first region is provided in a region other than the second region in the interior space.
- Given this structure, the heat transporting unit is able to transport, towards both ends, heat of a heat emitting object that is disposed at the middle thereof.
- In a heat transporting unit according to a sixth invention according to the Present Disclosure, in addition to the first through fifth inventions, a second region not only diffuses heat received from a heat emitting object in the X-axis direction and the Y-axis direction, but also moves it to the first region, and the first region transports, in the X-axis direction, the heat moved from the second region.
- Given this structure, the heat transporting unit is able to use the Y-axis direction fully, upon diffusion of the heat removed from the heat emitting object, to transport that heat in the X-axis direction.
- In a heat transporting unit according to a seventh invention according to the Present Disclosure, in addition to the sixth invention, when the second region is provided at a first end portion and at a second end portion that is opposite from the first end portion, within the interior space, the second region of the first end portion side not only causes the diffusion, in the X-axis direction and the Y-axis direction, of the heat received from the heat emitting object, but also causes it to move to the first region, and the first region transports, in the X-axis direction, the heat moved from the second region on the first end portion side, and the second region on the second end portion side diffuses, in the X-axis direction and the Y-axis direction, the heat that has been transported by the first region.
- Given this structure, the heat transporting unit diffuses, in the X-axis direction and the Y-axis direction, using the second region, the heat removed from the heat emitting object, and transports it in the X-axis direction using the first region. Furthermore, the heat transporting unit radiates heat using the second region wherein no heat emitting object is disposed. The result is the ability of the heat transporting unit to cool the heat emitting object.
- In a heat transporting unit according to an eight invention according to the Present Disclosure, in addition to the sixth invention, the second region is provided in the center of the interior space, and when the first region is provided at a first end portion and at a second end portion that is on the opposite side from the first end portion, in the interior space, the second region not only diffuses in the X-axis direction and the Y-axis direction the heat that is received from the heat emitting object, but also moves it to the first region, and the first region transports, in the X-direction, the heat moved from the second region.
- Given this structure, the heat transporting unit uses the second region that is positioned at the center to diffuse, in the X-axis direction and the Y-axis direction, the heat of the heat emitting object, and uses the first region, positioned at both ends, to transport it to both ends of the heat transporting unit along the X-axis direction. This is used in a case wherein one wishes to transport the heat of the heat emitting object in multiple directions.
- In a heat transporting device according to a ninth invention according to the Present Disclosure, in addition to any of the first through eighth inventions, additionally, the upper plate and/or the lower plate also has a heat receiving portion that contacts the heat emitting object thermally, and the heat receiving portion is provided spanning the first region and the second region.
- Given the structure, the heat transporting unit receives the heat efficiently from the heat emitting object, enabling transportation in the specific direction. Additionally, this increases the heat transportation efficiency of the heat transporting unit.
- In a heat transporting unit according to a 10th invention according to the Present Disclosure, in addition to any of the first through ninth inventions, a first column portion has a cutout to connect together adjacent first ducts within a plurality of first ducts.
- Given this structure, the refrigerant can be exchanged between first ducts.
- In a heat transporting unit according to an 11th invention according to the Present Disclosure, in addition to any of the first through 10th inventions, the second region has one or more intermediate plates layered in the Z-axis direction, where the intermediate plates form a second column portion that is stacked in the Z-axis direction, and the second column portion forms second ducts in the X-axis direction, the Y-axis direction, and the Z-axis direction.
- Given this structure, the second region can diffuse heat three-dimensionally.
- In a heat transporting unit according to a 12 invention according to the Present Disclosure, in addition to any of the first through 11th inventions, the second column portion comprises a large column member and a small column member that is smaller than the large column member.
- Given this structure, the second ducts have a more complex structure, and produce strong capillary forces. As a result, the second ducts diffuse the vaporized refrigerant and move the condensed refrigerant efficiently.
- In a heat transporting unit according to a 13th invention according to the Present Disclosure, in addition to any of the first through 12th inventions, at least a portion of the first ducts and the second ducts have capillary forces that move the condensed refrigerant.
- Given this structure, the heat transporting unit is able to move the condensed refrigerant, enabling transportation of the heat of the heat emitting object through a cycle of transporting the vaporized refrigerant and moving the condensed refrigerant.
- In a heat transporting unit according to a 14th invention according to the Present
- Disclosure, in addition to any of the first through 13th inventions, at least a portion of the upper plate, the lower plate, the first column portion, and/or the second column portion has a channel in a surface that is exposed to the interior space.
- The capillary forces of the first duct and the second duct are increased given this structure.
- In a heat transporting unit according to a 15th invention according to the Present Disclosure, in addition to any of the first through 14 inventions, the upper plate and/or the lower plate is further equipped with a heat radiating portion for radiating the transported heat, in a region that faces at least a portion of the first region and/or the second region.
- Given this structure, the heat transporting unit is able to cool the transported heat quickly. As a result, it is possible to increase the efficiency of the cycle for transporting the vaporized refrigerant and moving the condensed refrigerant, enabling the heat transporting unit to transport the heat with high efficiency.
- In a heat transporting unit according to a 16th invention according to the Present Disclosure, in addition to any of the first through 15th inventions, at least a portion of the upper plate, the lower plate, the first column portion, and/or the second column portion has metal plating on a surface that is exposed to the interior space.
- In a heat transporting unit according to a 17th invention according to the Present Disclosure, in addition to any of the first through 16th inventions, the width of the first region in the Y-axis direction and the width of the second region in the Y-axis direction are essentially identical.
- Given this structure, the heat transporting unit is able to transport the heat using the short direction maximally as well. Because of this, the heat transporting unit does not require excessive mounting space.
- Forms of embodiment according to the Present Disclosure will be explained below in reference to the drawings.
- Note that a heat pipe is a member, component, apparatus, or device that achieves a function of cooling a heat emitting object by repetitively vaporizing a refrigerant that is sealed within an interior space, by receiving heat from the heat emitting object, and cooling and condensing the vaporized refrigerant. The heat transporting unit in the present specification refers to a member, component, device, or apparatus for transmitting heat from a heat emitting unit through the movement of a refrigerant.
- Because the heat transporting unit according to the Present Disclosure uses the function and operation of a heat pipe, the concept of the heat pipe will be explained first.
- The heat pipe has a refrigerant sealed into the interior thereof, where a surface that is a heat receiving surface contacts a heat emitting object, such as an electronic component. The refrigerant in the interior receives the heat from the heat emitting object, to be vaporized, where the heat of the heat emitting object is removed at the time of the vaporization. The vaporized refrigerant moves within the heat pipe. The vaporized refrigerant that has moved then is cooled at a heat radiating surface (or due to a secondary cooling member such as a heat sink or a cooling fan, or the like) to thus condense. The refrigerant, which has become a liquid through condensation, moves within the heat pipe to again move to the heat receiving surface. The refrigerant that has moved to the heat receiving surface is vaporized again to remove the heat of the heat emitting object.
- Through the repetition of the vaporization and condensation of the refrigerant in this way, the heat pipe transports the heat from the heat emitting object, to thereby cool the heat emitting object. In particular, the heat pipe causes the vaporized refrigerant to move and causes the condensed refrigerant to move within the interior space wherein the refrigerant is sealed, doing so along a specific direction, so that the heat pipe is able to transport, in a specific direction, the heat removed from the heat emitting object.
- An overall summary of a heat transporting unit according to a first form of embodiment will be explained using
FIG. 1 andFIG. 2 . -
FIG. 1 is a perspective view of a heat transporting unit according to a first form of embodiment according to the Present Disclosure.FIG. 2 is an interior perspective view of the heat transporting unit in the first form of embodiment according to the Present Disclosure, shown in a prospective cross-sectional diagram enabling viewing of the interior of the unit during the transportation of heat. - First, as illustrated in
FIG. 1 andFIG. 2 , a three-dimensional space is defined by the mutually orthogonal X axis, Y axis, and Z axis. The structure of theheat transporting unit 1 will be explained using the X axis, Y axis, and Z axis. Additionally, while theheat transporting unit 1 has a variety of structures therein, it has, when viewed from the outside, a flat rectangular shape, as in the example illustrated inFIG. 1 . Of course, a variety of treatments may also be performed on the surface. - The
heat transporting unit 1 is provided with anupper plate 2, alower plate 3 that faces theupper plate 2, and aninterior space 4, wherein a refrigerant can be sealed, formed by theupper plate 2 and thelower plate 3. Theinterior space 4 has afirst region 5 in a region in a portion thereof, andsecond regions first region 5. InFIG. 2 , the first region is provided in the vicinity of the center in the long direction (the X-axis direction) of theheat transporting unit 1, and thesecond regions heat transporting unit 1. Thefirst region 5 is provided with afirst column portion 8 wherein a plurality offirst ducts 9 is formed along the X-axis direction. Thefirst column portion 8 is a three-dimensional member having a long direction along the X-axis direction in thefirst region 5, and regions that are interposed between a plurality offirst column portions 8 form thefirst ducts 9. In this way, each of a plurality offirst column portions 8, which are three-dimensional members having a long direction, is disposed lined up along the X-axis direction, to form a plurality offirst ducts 9 that extend in the X-axis direction. - On the other hand, the
second regions second column portions 10 that form a plurality ofsecond ducts 11 that run in the X-axis direction and the Y-axis direction. Thesecond column portions 8 are a plurality of three-dimensional members that are lined up in the X-axis direction and the Y-axis direction in thesecond regions second column portions 10 that are lined up in the X-axis direction form ducts that run in the Y-axis direction, and the regions that are interposed between the plurality ofsecond column portions 10 that are lined up in the Y-axis direction form ducts that run in the X-axis direction, where the ducts that run in the X-axis direction and the ducts that run in the Y-axis direction combine into a grid shape. These grid-shaped ducts form thesecond ducts 11. - A refrigerant is sealed within the
interior space 4, and heat from the heat emitting object is transported in a specific direction by repeated vaporization and condensation of the sealed refrigerant. However, if theinterior space 4 were the entirety of the space, then there would be the possibility that theheat transporting unit 1 would be damaged or would break due to the expansion and contraction thereof due to the loads of increasing and decreasing pressure, produced by the vaporization and condensation of the refrigerant. Thefirst column portions 8 and thesecond column portions 10 not only ensure the strength of theheat transporting unit 1, but also form thefirst ducts 9 and thesecond ducts 11 that are able to diffuse and transport the heat well in the X-axis direction and the Y-axis direction. - The
first ducts 9 and thesecond ducts 11 connect at aboundary 12 between thefirst region 5 and thesecond region 6, and at aboundary 13 between thefirst region 5 and thesecond region 7. These connections enable the refrigerant that moves from the second ducts 11 (the vaporized refrigerant and/or the condensed refrigerant) to move into thefirst ducts 9, to then move through thefirst ducts 9. Additionally, the Y-axis direction width of thefirst region 5 in theinterior space 4 and the Y-axis direction widths of thesecond regions 6 and 7 (that is, the widths in the short direction) are essentially identical. Being essentially identical causes the respective widths of thefirst region 5, for transporting the heat in the X-axis direction, and of thesecond regions interior space 4 that can be formed by the dimensions of theheat transporting unit 1 can be used for transporting the heat. - Note that in
FIG. 2 , codes are assigned to only a portion of the elements, for preserving clarity in the diagram, in regards to thefirst column portions 8, thesecond column portions 10, thefirst ducts 9, and thesecond ducts 11; however, those elements that are not labeled with codes correspond, respectively, to thefirst column portions 8, thesecond column portions 10, thefirst ducts 9, and thesecond ducts 11. For example, the standing members that have shapes identical to those of thefirst column portions 8, unless specified especially otherwise, are all alsofirst column portions 8. This is true inFIG. 3 and beyond as well. -
FIG. 3 will be used next to explain the operation of theheat transporting unit 1. -
FIG. 3 is an operation explanatory diagram for the heat transporting unit in the first form of embodiment according to the Present Disclosure. While the schematic structure of the interior of theheat transporting unit 1 is illustrated inFIG. 3 , the movement of the refrigerant that is sealed in the interior space 4 (that is, the diffusion and transportation of heat) will be explained by the arrows. - The
upper plate 2 and thelower plate 3 have a flat plate shape having a long direction and a short direction, where the X-axis direction is along the long direction and the Y-axis direction is along the short direction. This type of shape for theupper plate 2 and thelower plate 3 causes theheat transporting unit 1 to have a flat shape having a long direction and a short direction. - A
heat emitting object 20 is disposed at the bottom surface of the heat transporting unit 1 (the bottom surface of the lower plate 3). Additionally, theheat emitting object 20 is disposed at a position facing thesecond region 6 of the bottom surface. Note that theheat emitting object 20 is an element that produces heat, such as an electronic component, an electronic element, a semiconductor integrated circuit, a light emitting element, an electronic circuit board, a mechanical component, a mechanical element, or the like. Additionally, theheat emitting object 20 is disposed in a position facing thesecond region 6 at the bottom surface. Thefirst region 5 hasfirst ducts 9 that run in the X-axis direction, as described above, and thesecond regions second ducts 11 that run in the X-axis direction and the Y-axis direction. - The
heat transporting unit 1 in thesecond region 6 removes heat from theheat emitting object 20, because refrigerant is sealed within theinterior space 4, the heat from theheat emitting object 20 vaporizes the refrigerant. The evaporating refrigerant moves in the X-axis direction and the Y-axis direction in thesecond ducts 11 of thesecond region 6. That is, in thesecond region 6, the heat removed from theheat emitting object 20 uses thesecond ducts 11 to diffuse along the direction of Arrow A (the X-axis direction) and the direction of Arrow B (the Y-axis direction). Of course, in theheat transporting unit 1, a three-dimensionalinterior space 4 is formed, structured with an X-axis, a Y-axis, and a Z-axis, and thus the vaporized refrigerant moves, and the heat diffuses, also in the Z-axis direction; however, in the first form of embodiment according to the Present Disclosure, the explanation will use the X-axis direction and Y-axis direction, the directions in which the refrigerant moves primarily. - Next, at the
boundary 12 between thesecond region 6 and thefirst region 5, thesecond ducts 11 connect to thefirst ducts 9. Because of this, the vaporized refrigerant moves from thesecond ducts 11 into thefirst ducts 9. - The
first ducts 9 are formed along the X-axis direction in thefirst region 5, and the vaporized refrigerant moves in the direction indicated by the Arrow C in thefirst ducts 9. Here, inFIG. 3 , the Arrow C is drawn for only one of thefirst ducts 9; however, the vaporized refrigerant moves similarly in the direction of the Arrow C in the otherfirst ducts 9 as well. The result of the movement is that the heat of theheat emitting object 20 is transported from thesecond region 6, which is one end portion of theheat transporting unit 1, to thesecond region 7, which is the other end portion thereof. - The
first ducts 9 and thesecond ducts 11 connect at theboundary 13 between thefirst region 5 and thesecond region 7. Because of this, as illustrated by Arrow C, the vaporized refrigerant that has moved along thefirst duct 9 moves into thesecond ducts 11 of thesecond region 7. - The
second ducts 11 run along the X-axis direction and the Y-axis direction, and thus the vaporized refrigerant that has moved from thefirst ducts 9 moves along the Arrow D (the X-axis direction) and the Arrow E (the Y-axis direction). That is, in thesecond ducts 11 of thesecond region 7, the vaporized refrigerant moves broadly in the short direction and the long direction. - In the
second region 7, thesecond ducts 11 are used to move the vaporized refrigerant broadly in the X-axis direction and the Y-axis direction, enabling the vaporized refrigerant to cool. This is because the vaporized refrigerant moving broadly through thesecond region 7, wherein theheat emitting object 20 is not disposed causes the heat that is included therein to escape. - The vaporized refrigerant that moves through the
second region 7 in this way condenses due to the cooling, changing into a refrigerant that is a liquid. The result is that the condensed refrigerant moves in the X-axis direction and the Y-axis direction along thesecond ducts 11 in thesecond region 7. Here the flow is as indicated by the Arrow D and the Arrow E. - Here the
second ducts 11 of thesecond region 7 are extremely narrow ducts, and thus can exhibit capillary forces wherein the liquid is moved through capillary action. - The condensed refrigerant, after moving in the X-axis direction and the Y-axis direction within the
second region 7 through the plurality ofsecond ducts 11, arrives at theboundary 13 between thefirst region 5 and thesecond region 7. Because thesecond ducts 11 of thesecond region 7 are connected to thefirst ducts 9 of thefirst region 5, the condensed refrigerant moves from thesecond ducts 11 into thefirst ducts 9, as indicated by the Arrow F. At this time, the condensed refrigerant moves in thesecond ducts 11 not only in the X-axis direction, but in the Y-axis direction as well, and thus the condensed refrigerant spreads in the short direction in theinterior space 4 as well. Because of this, at theboundary 13, the condensed refrigerant is able to move within each of the plurality of thefirst ducts 9 that are lined up in the short direction within theinterior space 4. - The condensed refrigerant that has moved into the
first ducts 9 moves along the X-axis direction through thefirst ducts 9, as indicated by the Arrow G. That is, the condensed refrigerant moves through thefirst ducts 9 from the end portion positioned within thesecond region 7 towards the end portion positioned within thesecond region 6. Thefirst ducts 9 are fine ducts with closed peripheries, and thus thefirst ducts 9 can exhibit capillary forces. Thefirst ducts 9 cause the condensed refrigerant to move in the X-axis direction through these capillary forces. - The condensed refrigerant that has moved through the
first ducts 9 in the X-axis direction arrives at thesecond region 6 wherein there are extremely fine ducts, and, in thissecond region 6, receives heat from theheat emitting object 20, to be vaporized again. The vaporized refrigerant moves again through thesecond ducts 11 in the X-axis direction and the Y-axis direction. In this way, the cycling of the movement of the vaporized refrigerant and the movement of the condensed refrigerant enables theheat transporting unit 1 to transport the heat from theheat emitting object 20 from the end portion positioned in thesecond region 6 to the end portion positioned in thesecond region 7. At this time, the heat of theheat emitting object 20 diffuses in the long direction and the short direction of theheat transporting unit 1 within thesecond region 6, and thefirst region 5 transports the heat in the long direction of theheat transporting unit 1. Because of this, theheat transporting unit 1 is able to transport the heat of theheat emitting object 20 using the entirety of theinterior space 4, while maintaining the strength of theheat transporting unit 1 by thefirst column portions 8 and thesecond column portions 10. - The benefits and features of the heat transportation by the
heat transporting unit 1 will be explained in further detail next. - Depending on the shape and size of the
heat emitting object 20, theheat transporting unit 1, even when transporting heat in the long direction, must be able to move the refrigerant using maximally both the long direction and the short direction of the interior space 4 (and other words, of the heat transporting unit 1). - The refrigerant that has been vaporized by the heat from the
heat emitting object 20 that is disposed at thesecond region 6 is moved not just in the X-axis direction, but in the Y-axis direction as well, by thesecond ducts 11 of thesecond region 6. The plurality offirst ducts 9 is lined up in the short direction within theinterior space 4. The movement of the vaporized refrigerant in the Y-axis direction through thesecond ducts 11 in thesecond region 6 enables the vaporized refrigerant, at theboundary 12, to move into each of the plurality of first ducts 9 (while it may be all of them or a portion of them, still it is a plurality offirst ducts 9 corresponding to a width that is wider than that of the heat emitting object 20). The vaporized refrigerant that has so move moves using the plurality offirst ducts 9 fully. - As a result, in the
first region 5, the plurality offirst ducts 9 is used fully to transport the heat in the X-axis direction (that is, from the end portion positioned at thesecond region 6 to the end portion positioned at the second region 7). - Additionally, at the
second region 7, thesecond ducts 11 can move the vaporized refrigerant, that has been moved from thefirst ducts 9, three-dimensionally in the X-axis direction and the Y-axis direction. Because of this, in thesecond region 7, the vaporized refrigerant can move through a wide space in a short time. As a result, thesecond region 7 enables the rapid cooling and condensation of the vaporized refrigerant. - In the
second region 7, the condensed refrigerant moves along the X-axis direction and the Y-axis direction in thesecond ducts 11. Because of this, the condensed refrigerant can move from a plurality ofsecond ducts 11 to a plurality offirst ducts 9 at theboundary 13 between thesecond region 7 and thefirst region 5. That is, at theboundary 13, the condensed refrigerant moves in the plurality of individual first ducts 9 (either through all of them or part of them), which are lined up in the short direction of theinterior space 4. Additionally, of the plurality of thefirst ducts 9, only a little of the condensed refrigerant enters into thosefirst ducts 9 wherein there exists primarily a large amount of the vaporized refrigerant, and a large amount of the condensed refrigerant enters into the otherfirst ducts 9 wherein there is not a large amount of the vaporized refrigerant. - In this way, it is possible to move the condensed refrigerant in the X-axis direction (that is, from the end portion positioned at the
second region 7 towards the end portion positioned at the second region 6) through fully using the plurality offirst ducts 9 in thefirst region 5. - This cycle of movement of the vaporized refrigerant and movement of the condensed refrigerant is the function of heat transportation achieved by the
heat transporting unit 1. In other words, theheat transporting unit 1 is able to transport the heat of the heat emitting object in the specific direction (which here is the X-axis direction), efficiently, using fully theheat transporting unit 1, regardless of the size or shape of theheat emitting object 20. - Note that “using fully” here refers not to the use of all of the plurality of
first ducts 9, but rather refers to the use of those first ducts, among the plurality of individualfirst ducts 9, that fulfill conditions for easy movement of vaporized refrigerant or easy movement of condensed refrigerant (temperature, flow speed, flow rate, pressure, etc.). - The transportation of heat in the
heat transporting unit 1 is illustrated schematically inFIG. 4 .FIG. 4 is a diagram illustrating schematically the operation of the heat transporting unit in the first form of embodiment according to the Present Disclosure. - The
heat emitting object 20 is disposed at the bottom surface of thesecond region 6, which is the bottom surface of thelower plate 3. Theheat emitting object 20 and the bottom surface are in thermal contact, so thesecond region 6 removes heat from theheat emitting object 20. In thesecond region 6, the refrigerant, which is a liquid, is vaporized by this heat, and the vaporized refrigerant moves in the X-axis direction through thefirst region 5 following the Arrow H. - The vaporized refrigerant that arrives at the
second region 7 from thefirst region 5, is cooled and condenses in thesecond region 7. This cooled refrigerant moves towards thesecond region 6 from thesecond region 7 through capillary forces that are produced by thefirst ducts 9 and thesecond ducts 11. This is as indicated by the Arrow I. In this way, as can be understood by viewing theheat transporting unit 1 from the side, theheat transporting unit 1 can transport the heat of theheat emitting object 20 efficiently along the X-axis direction. - The details of each portion will be explained below.
- The
upper plate 2 will be explained next. Theupper plate 2 is illustrated in a perspective state inFIG. 2 . Theupper plate 2 has a flat shape, and preferably is a rectangle having a short direction and a long direction. Of course, it may have a shape that differs from a rectangle in parts, or may have a curved shape or an indented shape. However, having theupper plate 2 be a rectangle having a short direction and a long direction causes theheat transporting unit 1 to be a rectangle having a short direction and a long direction, thus making it possible for theheat transporting unit 1 to transport heat in a specific direction from a heat emitting object that is disposed at the end portion thereof. Theupper plate 2 has a structure that matches the outer dimensional shape of theheat transporting unit 1. - The
upper plate 2 is formed out of metal, plastic, or the like, but preferably is formed out of a metal with high thermal conductivity or high resistance to corrosion (or durability thereto), such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, stainless steel, or the like. - The
upper plate 2, together with thelower plate 3, forms theinterior space 4. For example, theupper plate 2 or thelower plate 3 has raised portions or wall members, for forming theinterior space 4, at the peripheral edges thereof, where theupper plate 2 and thelower plate 3 form theinterior space 4 between theupper plate 2 and thelower plate 3 through being joined together through these raised portions or wall members. When joined together with thelower plate 3, these raised portions or wall members become the side walls encompassing theinterior space 4. Of course, these raised portions or wall members may be either different members or the same member as theupper plate 2. - Additionally, the
upper plate 2 preferably has metal plating on at least the surface that contacts the interior space 4 (the surface that contacts the vaporized refrigerant and/or the condensed refrigerant). This is because the provision of the metal plating modifies the state of the surface, expediting the movement of the vaporized refrigerant. A metal such as gold, silver, copper, aluminum, nickel, cobalt, or an alloy thereof, or the like, may be selected as this metal plating. Of course, it may be a single layer plating, a multilayer plating, electrolytic plating, or non-electrolytic plating. - While the
upper plate 2 is nominally “upper,” physically it need not necessarily be disposed at the top, but rather this is a term for convenience. The heat emitting object may be in contact with theupper plate 2, or may be in contact with thelower plate 3. - Additionally, the
upper plate 2 preferably is provided also with a filling opening, not shown, for filling the refrigerant. This is because it is necessary to seal the refrigerant into theinterior space 4 when theupper plate 2 and thelower plate 3 are joined together to form theinterior space 4. The filling opening is sealed after the filling of the refrigerant. - Note that the refrigerant may be filled from the filling opening after the joining together of the
upper plate 2 and thelower plate 3, or may be filled at the time of joining. Moreover, the filling of the refrigerant preferably is performed under a vacuum or at a reduced pressure. Performing the filling under a vacuum or at a reduced pressure causes the refrigerant to be sealed within theinterior space 4 in a vacuum or low-pressure state. When under a reduced pressure, there is the benefit of a reduction in the vaporization/condensation temperature of the refrigerant, causing greater activity in the cycling of the vaporization/condensation of the refrigerant. - Furthermore, the
upper plate 2 and/or thelower plate 3 is provided with thefirst column portions 8 and thesecond column portions 10. Because theinterior space 4 is formed from theupper plate 2 and thelower plate 3, the provision of thefirst column portions 8 and thesecond column portions 10 on theupper plate 2 and/or thelower plate 3 makes it possible to provide theinterior space 4 with thefirst column portions 8 and thesecond column portions 10, or in other words, thefirst ducts 9 and thesecond ducts 11, through joining together theupper plate 2 and thelower plate 3. The same is true for thelower plate 3, described below. - The
lower plate 3 will be explained next. Thelower plate 3 is a member that is symmetrical to theupper plate 2, and has the same structure and shape as theupper plate 2, and, inFIG. 2 , is shown in an oblique state. - The
lower plate 3 has a flat shape, and preferably is a rectangle having a short direction and a long direction. In particular, because thelower plate 3 faces theupper plate 2 and is joined thereto, preferably it has the identical shape and area of theupper plate 2. However, insofar as thelower plate 3 can form theinterior space 4 with theupper plate 2, it may have an area or shape that is different from that of theupper plate 2. Of course, it may have a shape that differs from a rectangle in parts, or may have a curved shape or an indented shape. Note that, as withupper plate 2, having thelower plate 3 be a rectangle having a short direction and a long direction causes theheat transporting unit 1 to be a rectangle having a short direction and a long direction, thus making it possible for theheat transporting unit 1 to transport heat in a specific direction from a heat emitting object that is disposed at the end portion thereof. - The
lower plate 3 is formed out of metal, plastic, or the like, but preferably is formed out of a metal with high thermal conductivity or high resistance to corrosion (or durability thereto), such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, stainless steel, or the like. - The
lower plate 3 is joined to theupper plate 2 perform the interior space, and may have raised portions or wall members for forming theinterior space 4 around the periphery edges thereof. When joined to theupper plate 2, these raised portions or wall members form the side walls surrounding theinterior space 4. Of course, these raised portions or wall members may be either different members or the same member as thelower plate 3. Note that both theupper plate 2 and thelower plate 3 may have the raised portions or wall members, or only either theupper plate 2 or thelower plate 3 may have the raised portions or wall members. - As with the
upper plate 2, thelower plate 3 may be provided with a refrigerant filling opening. - The
lower plate 3 is joined together facing theupper plate 2 to form theinterior space 4. - Additionally, the
lower plate 3 preferably has metal plating on at least the surface that contacts the interior space 4 (the surface that contacts the vaporized refrigerant and/or the condensed refrigerant). This is because the provision of the metal plating modifies the state of the surface, expediting the movement of the vaporized refrigerant. A metal such as gold, silver, copper, aluminum, nickel, cobalt, or an alloy thereof, or the like, may be selected as this metal plating. Of course, it may be a single layer plating, a multilayer plating, electrolytic plating, or non-electrolytic plating. - While the
lower plate 3 is nominally “lower,” physically it need not necessarily be disposed at the bottom, but rather this is a term for convenience. The heat emitting object may be in contact with thelower plate 3, or may be in contact with theupper plate 2. - Additionally, when it comes to the provision of the
first column portions 8 and thesecond column portions 10, the same is true as for theupper plate 2. - The interior space is formed by the
upper plate 2 and thelower plate 3. - The
upper plate 2 and thelower plate 3 have protrusions or columns around the peripheral edges, and theupper plate 2 and thelower plate 3 are joined together facing each other to form theinterior space 4. Additionally, when joining together theupper plate 2 and thelower plate 3, thefirst column portions 8 andsecond column portions 10 that are provided on theupper plate 2 and/or thelower plate 3 contact the facingupper plate 2 orlower plate 3. The result is that thefirst column portions 8 or thesecond column portions 10 connect between theupper plate 2 and thelower plate 3. Thefirst column portions 8 andsecond column portions 10 are columns that reach from theupper plate 2 to thelower plate 3 within theinterior space 4. - The refrigerant is sealed within the
interior space 4. The refrigerant uses antifreeze, alcohol, pure water, or the like. - Additionally, the
interior space 4 has afirst region 5 andsecond regions interior space 4 is divided into thefirst region 5 and thesecond regions first region 5 and thesecond regions first region 5 and thesecond regions boundaries first ducts 9 andboundaries 12 connect across the entirety of the width in the Y-axis direction. - In the
interior space 4, the heat of the heat emitting object is transported in a specific direction through the filled refrigerant the vaporizing and condensing. At this time, theinterior space 4 is able to transport the heat of the heat emitting object efficiently through the provision of thefirst region 5 and thesecond regions - The
region 5 is provided with a plurality offirst column portions 8 that form a plurality offirst ducts 9 along the X-axis direction. The plurality offirst column portions 8 are provided along the X-axis direction. Thefirst column portions 8 are standing members with protruding shapes that are provided on theupper plate 2 and/or thelower plate 3, and when theupper plate 2 and thelower plate 3 are thermally joined, they are joined to the facing member (either theupper plate 2 or the lower plate 3), so that, within theinterior space 4, they become standing members that reach from theupper plate 2 to thelower plate 3. The result is that they become reinforcing portions for reinforcing theinterior space 4. - Note that as another structure, the
first column portions 8 may be provided on either theupper plate 2 or thelower plate 3, and may be standing members that reach from theupper plate 2 to thelower plate 3 within theinterior space 4 when theupper plate 2 and thelower plate 3 are jointed together. Conversely, only portions of the requiredfirst column portions 8 may be provided on theupper plate 2 and on thelower plate 3, so that when theupper plate 2 and thelower plate 3 are joined together, all of the requiredfirst column portions 8 will be provided within theinterior space 4. Conversely, facing portions of thefirst column portions 8 may be provided at identical positions on both theupper plate 2 and thelower plate 3, so that the portions of thefirst column portions 8 that are provided on theupper plate 2 and the portions of thefirst column portions 8 that are provided on thelower plate 3 contact each other to form, together, the requiredfirst column portions 8. - As illustrated in
FIG. 2 andFIG. 3 , a plurality offirst column portions 8 is provided along the X-axis direction, and thus a plurality offirst ducts 9 is formed, along the X-axis direction, by adjacentfirst column portions 8. The plurality offirst ducts 9 are the gaps formed by thefirst column portions 8. - Additionally, the
first ducts 9 run in the X-axis direction in thefirst region 5, and thus preferably have lengths that are about the same as the X-axis direction lengths of thefirst region 5. Doing so enables thefirst region 5 to move the refrigerant along the X-axis direction within thefirst region 5. - Additionally, as with the
upper plate 2 and thelower plate 3, thefirst column portions 8 are formed out of metal, plastic, or the like, but preferably are formed out of a metal with high thermal conductivity or high resistance to corrosion (or durability thereto), such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, stainless steel, or the like. Additionally, preferably the metal plating is performed on at least a portion of the surfaces of the first column portions 8 (and, in particular, on a portion or all of the surfaces that are exposed to the interior space 4). This is because the provision of the metal plating modifies the state of the surface, expediting the movement of the vaporized refrigerant. A metal such as gold, silver, copper, aluminum, nickel, cobalt, or an alloy thereof, or the like, may be selected as this metal plating. Of course, it may be a single layer plating, a multilayer plating, electrolytic plating, or non-electrolytic plating. - The provision of a plurality of
first ducts 9 in thefirst region 5 in this way causes the refrigerant to move while dividing the refrigerant (the vaporized refrigerant or condensed refrigerant) between the plurality of pathways between theboundary 12 and theboundary 13. That is, thefirst region 5 is able to transport the heat of theheat emitting object 20 between theboundary 12 and theboundary 13. Thefirst region 5 has the function of transporting, in the X-axis direction, the heat from theheat emitting object 20 through using efficiently the entire width in the Y-axis direction. - The second regions will be explained next.
- The
second regions interior space 4 that is not thefirst region 5. Because of this, theinterior space 4 has thefirst region 5 and thesecond regions region 5 andsecond regions interior space 4 from including other regions that are unrelated to thefirst region 5 and to thesecond regions interior space 4 that exhibit their own respective functions, and these are not terms that indicate that theinterior space 4 is physically partitioned. - The
second regions second column portions 10 that form a plurality ofsecond ducts 11 that run in the X-axis direction and the Y-axis direction. The plurality ofsecond column portions 10 is provided along the X-axis direction. At this time, in thesecond regions second column portions 10 is provided in a given line in the X-axis direction. For example, inFIG. 2 , in thesecond region 6, twosecond column portions 10 are lined up along the X-axis direction. Additionally, in thesecond region 7, foursecond column portions 10 are lined up in the X-axis direction. Moreover, the plurality ofsecond column portions 10 that is provided in a line in the X-axis direction in this way is lined up in a plurality along the Y-axis direction. - The provision of the plurality of
second column portions 10 in both the X-axis direction and the Y-axis direction enables the plurality ofsecond column portions 10 to form gaps in both the X-axis direction and the Y-axis direction. The respective gaps in the X-axis direction and the Y-axis direction form a plurality ofsecond ducts 11 that run in the X-axis direction and the Y-axis direction. In thesesecond ducts 11, the vaporized refrigerant and condensed refrigerant move along the X-axis direction and the Y-axis direction in accordance with the gaps in thesecond column portions 10. - The
second column portions 10 are standing members with protruding shapes that are provided on theupper plate 2 and/or thelower plate 3, and when theupper plate 2 and thelower plate 3 are thermally joined, they are joined to the facing member (either theupper plate 2 or the lower plate 3), so that, within theinterior space 4, they become standing members that reach from theupper plate 2 to thelower plate 3. The result is that they become reinforcing portions for reinforcing theinterior space 4. - Note that as another structure, the
second column portions 10 may be provided on either theupper plate 2 or thelower plate 3, and may be standing members that reach from theupper plate 2 to thelower plate 3 within theinterior space 4 when theupper plate 2 and thelower plate 3 are jointed together. Conversely, only portions of the requiredsecond column portions 10 may be provided on theupper plate 2 and on thelower plate 3, so that when theupper plate 2 and thelower plate 3 are joined together, all of the requiredsecond column portions 10 will be provided within theinterior space 4. Conversely, facing portions of thesecond column portions 10 may be provided at identical positions on both theupper plate 2 and thelower plate 3, so that the portions of thesecond column portions 10 that are provided on theupper plate 2 and the portions of thesecond column portions 10 that are provided on thelower plate 3 contact each other to form, together, the requiredsecond column portions 10. - Additionally, as with the
upper plate 2 and thelower plate 3, thesecond column portions 10 are formed out of metal, plastic, or the like, but preferably are formed out of a metal with high thermal conductivity or high resistance to corrosion (or durability thereto), such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, stainless steel, or the like. Additionally, preferably the metal plating is performed on at least a portion of the surfaces of the second column portions 10 (and, in particular, on a portion or all of the surfaces that are exposed to the interior space 4). This is because the provision of the metal plating modifies the state of the surface, expediting the movement of the vaporized refrigerant. A metal such as gold, silver, copper, aluminum, nickel, cobalt, or an alloy thereof, or the like, may be selected as this metal plating. Of course, it may be a single layer plating, a multilayer plating, electrolytic plating, or non-electrolytic plating. - The provision of the plurality of
second ducts 11 in this way in thesecond regions first ducts 9, which are lined up in the Y-axis direction, at theboundary 12 and theboundary 13. - In this way, the
second regions first ducts 9 that are lined up in the Y-axis direction, while achieving the function of moving the vaporized refrigerant and the condensed refrigerant in the X-axis direction and Y-axis direction in thesecond regions second column portions 10 that are provided in thesecond regions interior space 4. - As described above, the
heat transporting unit 1 in the first form of embodiment is able to diffuse the heat from theheat emitting object 20 in the X-axis direction and the Y-axis direction, and is able to transport the heat from theheat emitting object 20 in the X-axis direction. While the object is for theheat transporting unit 1 to transport the heat from theheat emitting object 20 along the X-axis direction (that is, to transport heat along the X-axis direction towards the far end from the position wherein the heat from theheat emitting object 20 is received), it is desirable to transport in the X-axis direction while using the entire width of the Y-axis direction of theheat transporting unit 1. Because of this, thesecond region 6 that is in thermal contact with theheat emitting object 20 diffuses, in the X-axis direction and the Y-axis direction, the heat from theheat emitting object 20, to use the entire width in the Y-axis direction to move the heat to thefirst region 5. Thefirst region 5 is able to transport the heat along the X-axis direction, so that, as a result, theheat transporting unit 1 is able to transport the heat from theheat emitting object 20 along the X-axis direction while using the entire width thereof in the Y-axis direction. - At this time, the
first column portions 8 and thesecond column portions 10 are able to ensure the strength of the interior space 4 (or in other words, of the heat transporting unit 1). - In this way, by innovating the structure of the column portions for reinforcing the
interior space 4 in the regions ininterior space 4 it is possible to have theheat transporting unit 1 in the first form of embodiment secure increases in both strength and in heat transportation efficiency. - Second forms of embodiment will be explained next.
- Various examples of modifications of the
heat transporting unit 1 will be explained in the second forms of embodiment. -
FIG. 5 is an interior perspective view of a heat transporting unit according to a second form of embodiment according to the Present Disclosure.FIG. 5 shows a state wherein a portion of the interior of theheat transporting unit 1 is visible.Second region 6 is provided withsecond column portions 10, where gaps along the X-axis direction and the Y-axis direction are produced by thesecond column portions 10, where these gaps formsecond ducts 11. The vaporized refrigerant moves in the X-axis direction and the Y-axis direction in thesesecond ducts 11, and the condensed refrigerant moves in the X-axis direction and in the Y-axis direction in thesesecond ducts 11. - Here, as illustrated in
FIG. 5 , thesecond column portions 10 are preferably provided withlarge column members 30 andsmall column members 31 that are smaller than thelarge column members 30. As illustrated inFIG. 5 , thelarge column members 30 are disposed within thesecond region 6, and thesmall column members 31 are provided in locations other than those of thelarge column members 30. Thelarge column members 30 may have a size that is larger than that of thesmall column members 31, and thelarge column members 30 and thesmall column members 31 may be lined up in a line, or may be lined up randomly. - Having the
second column portions 10 be structured from a mixture of thelarge column members 30 and thesmall column members 31 in this way, makes the shape of thesecond ducts 11 more complex. In particular, the multiplesecond ducts 11 are adjacent to each other with respective gaps in the X-axis direction and the Y-axis direction. Because a plurality of gaps is formed through the mixture of thelarge column members 30 and thesmall column members 31, the adjacent distances between gaps is made smaller, and the intersections between the gaps is made larger. Thesecond ducts 11, which are formed through the combination of these complex gaps, has strong capillary forces. - The
second ducts 11 are able to move the condensed refrigerant efficiently and rapidly through these strong capillary forces. - Additionally, the
second ducts 11 that are formed by the combination of the complex gaps together are able to retain, across a broad range, the refrigerant that is a liquid in thesecond region 6. Because of this, it becomes easier for thesecond region 6, which receives the heat from theheat emitting object 20, to vaporize the refrigerant quickly. Of course, the vaporized refrigerant can move quickly and in a broad range within thesecond ducts 11. - Additionally, structuring the
second column portions 10 from thelarge column members 30 and thesmall column members 31 further increases the strength of thesecond regions 6. Because of the thermal contact with theheat emitting object 20, the expansion and contraction of thesecond region 6 due to temperature variations is large. Because of this, a greater degree of strength is required, and thus increased strength is desirable. - Note that the difference in size between the
large column members 30 and thesmall column members 31 is defined by the differences in the size of the cross-sectional areas in the vertical direction relative to the standing direction. Because of this, the “large” and “small” terminology for thelarge column members 30 and thesmall column members 31 can be defined for both the cases wherein there are differences in the cross-sectional areas through different shapes, and differences in the cross-sectional areas with identical shapes. - Preferably channels are provided on the surfaces that are exposed to the
interior space 4 in at least a portion of thefirst column portions 8,second column portions 10, and theupper plate 2 and thelower plate 3. -
FIG. 6 is a cross-sectional diagram of an end portion of a heat transporting unit in a second form of embodiment according to the Present Disclosure.FIG. 6 illustrates a state wherein surfaces that are exposed to theinterior space 4 of theheat transporting unit 1 are provided withchannels 40 through 42. Note that whileFIG. 6 , for convenience in illustrating in a cross-section, shows only thesecond region 6, similarly channels are provided also in thefirst region 5 and thefirst column portions 8. - The
second column portions 10 are provided withchannels 41 on the surfaces that are exposed to theinterior space 4. Thechannels 41 may be formed through cutting or milling the surfaces of thesecond column portions 10, or thechannels 41 may be formed in advance when thesecond column portions 10 are formed. Note that although not shown inFIG. 6 , channels are formed similarly also in the surfaces of thefirst column portions 8 that are exposed to theinterior space 4. - The formation of channels in this way in at least a portion of the
upper plate 2, thelower plate 3, thefirst column portions 8, and thesecond column portions 10 provides thefirst ducts 9 and thesecond ducts 11 with channels. The provision of thefirst ducts 9 and thesecond ducts 11 with channels makes it possible to increase the capillary forces, thereby facilitating the movement of the condensed refrigerant along the channels. The condensed refrigerant and the vaporized refrigerant are moved by thefirst ducts 9 and thesecond ducts 11, respectively, and thus when it is possible to move the condensed refrigerant along the channels, thefirst ducts 9 and thesecond ducts 11 use the space other than the channels to facilitate the movement of the vaporized refrigerant. - The result is that the
first ducts 9 and thesecond ducts 11 are able to move the vaporized refrigerant and the condensed refrigerant while preventing interference between the respective refrigerants. That is, thefirst ducts 9 move the vaporized refrigerant along the X-axis direction from thesecond region 6 to thesecond region 7. On the other hand, thefirst ducts 9 move the condensed refrigerant along the X-axis direction from thesecond region 7 to thesecond region 6. At this time, the channels are able to reduce the interference between the vaporized refrigerant and the condensed refrigerant in thefirst ducts 9. - As described above, at least a portion of the
upper plate 2, thelower plate 3, thefirst column portions 8, and thesecond column portions 10 are provided with channels, thus making it possible for theheat transporting unit 1 to accelerate the cycle of the movement of the vaporized refrigerant and the movement of the condensed refrigerant, enabling the heat to be transported more quickly. - A modified example wherein the
first column portions 8 are provided with cutouts will be explained next. - The plurality of
first column portions 8 form a plurality offirst ducts 9 through the gaps that are formed between adjacentfirst column portions 8. Because the refrigerant moves in the X-axis direction in each of the plurality offirst ducts 9, ducts are formed along the X-axis direction in the range of thefirst region 5. This will be explained usingFIG. 7 . InFIG. 7 , acutout 35 that connects between adjacentfirst ducts 9 are provided part way through thefirst column portions 8.FIG. 7 is an interior schematic diagram of theheat transporting unit 1 in the second form of embodiment according to the Present Disclosure. - The
cutout 35 connects between adjacentfirst ducts 9, thus making it possible for the vaporized refrigerant or condensed refrigerant that is passing through thefirst duct 9 to pass through thecutout 35 to move to anotherfirst duct 9. - If, for example, the
heat emitting object 20 is extremely small (to take one example, theheat emitting object 20 may be a light-emitting diode element (hereinafter termed an “LED”)), then there may be cases where, in thesecond region 6, the diffusion will be inadequate even when the heat from theheat emitting object 20 is diffused by thesecond ducts 11. It in such a case, it would be necessary to transport a large amount of heat through thosefirst ducts 9 that are positioned near to the position wherein theheat emitting object 20 is disposed, from among the plurality offirst ducts 9, where the otherfirst ducts 9 would not have to transport a large amount of heat. In this case, thefirst ducts 9 that are positioned near to theheat emitting object 20 would require more refrigerant, requiring movement of refrigerant beyond the capability thereof. - When one
first duct 9 and anotherfirst duct 9 are connected through acutout 35, the onefirst duct 9 and the otherfirst duct 9 are able to exchange the needed refrigerant and the unneeded refrigerant through thecutout 35. -
FIG. 7 further illustrates a state wherein onefirst duct 9A and anotherfirst duct 9 exchange refrigerant. InFIG. 7 , an extremely smallheat emitting object 20 is disposed in essentially the center, in the Y-axis direction, of the bottom surface of thesecond regions 6. Thesecond region 6 removes heat from theheat emitting object 20, the refrigerant is vaporized, and the vaporized refrigerant moves through thesecond ducts 11 in the X-axis direction and the Y-axis direction. Here theheat emitting object 20 is extremely small, and thus the ability of the vaporized refrigerant to diffuse in the Y-axis direction in thesecond ducts 11 tends to be smaller than the ability to diffuse in the X-axis direction. Because of this, the vaporized refrigerant tends to move in thefirst duct 9A that is near to the position at which theheat emitting object 20 is disposed, when moving from thesecond region 6 to thefirst region 5. - On the other hand, in order to transport larger amounts of heat, it is necessary to have a greater amount of refrigerant. In the state in
FIG. 7 , thefirst duct 9A has the primary responsibility in the transportation of heat (noting that this is not to say that the otherfirst ducts 9 do not transport heat, but rather the heat that diffuses in the Y-axis direction through thesecond ducts 11 is transported in the X-axis direction through most of the plurality offirst ducts 9, where saying that thefirst duct 9A has the primary responsibility is just stating a comparative level), and thus thefirst duct 9A requires more refrigerant than in the otherfirst ducts 9. Because the vaporized refrigerant moves to the plurality of individualfirst ducts 9 from thesecond ducts 11, if thefirst duct 9A is able to obtain vaporized refrigerant from the otherfirst ducts 9, then thefirst duct 9A will be able to transport a greater amount of heat. Thefirst duct 9A transports vaporized refrigerant (heat) in the X-axis direction, as illustrated by the Arrow N. Here refrigerant can be received through thecutouts 35 from the otherfirst ducts 9, as with Arrow K and Arrow M. The reception of the refrigerant makes it possible for thefirst duct 9A to transport heat using a greater amount of refrigerant. Additionally, thefirst duct 9A must transport a greater amount of vaporized refrigerant in order to transport a greater amount of heat. However, because the area of thefirst duct 9A is limited, there is a limit to the transportation capacity of the vaporized refrigerant in thefirst duct 9A. In this case, as indicated by Arrow J and Arrow L, thefirst duct 9A is able to move vaporized refrigerant to otherfirst ducts 9 through thecutouts 35. The result is that the vaporized refrigerant that transports the heat is moved efficiently in the X-axis direction through the plurality offirst ducts 9. - Moreover, in order to hold a greater amount of the condensed refrigerant in the vicinity of the
heat emitting object 20, it is necessary to move the condensed refrigerant into the vicinity of theheat emitting object 20. Because the refrigerant is vaporized by the heat of theheat emitting object 20, there will always be a state wherein the amount of condensed refrigerant in the vicinity of theheat emitting object 20 will be small. Because of this, a greater amount of condensed refrigerant, when compared to the otherfirst ducts 9 will move into the vicinity of theheat emitting object 20 along thefirst duct 9A through capillary forces. At this time, there will be a tendency for the refrigerant that is in the vicinity of theheat emitting object 20, which produces a greater amount of heat than in the other regions, to be vaporized, meaning that there will be a high likelihood that the amount of condensed refrigerant will be inadequate. Here the provision of thecutouts 35 makes it possible for thefirst duct 9A to receive, through thecutout 35, the deficient amount of condensed refrigerant from the otherfirst ducts 9. By receiving this refrigerant, thefirst duct 9A becomes able to move a greater amount of refrigerant to the vicinity of theheat emitting object 20, resulting in the ability to transport a great amount of heat. - As described above, the provision of the
cutouts 35 makes it possible to further increase the efficiency with which theheat transporting unit 1 transports the heat of theheat emitting object 20. - An example of modification of the second ducts will be explained next.
- The
heat transporting unit 1 is provided further with an intermediate plate that is stacked between theupper plate 2 and thelower plate 3, where thesecond regions -
FIG. 8 is an enlargement of the vicinity of the second region of a heat transporting unit according to a second form of embodiment according to the Present Disclosure. InFIG. 8 , theheat transporting unit 1 is stacked with anintermediate plate 50 between theupper plate 2 and thelower plate 3. - The
lower plate 3 is provided withlarge column members 30 andsmall column members 31 that structure thesecond column portions 10. Moreover, theupper plate 2 is provided withlarge column members 51 andsmall column members 52 that structure second column portions 54. Furthermore, theintermediate plate 50 is provided with openingportions 53 for connecting between the gaps that are formed, respectively, between thesecond column portions 10 that are formed on thelower plate 3 and the second column portions 54 that are formed on theupper plate 2. - In the
lower plate 3,second ducts 11 are formed by thesecond column portions 10. Moreover, in theupper plate 2, second ducts 55 are formed by the second column portions 54. Thesecond column portions 10 and the second column portions 54 (or in other words, thelarge column members 30 andlarge column members 51, and thesmall column members 31 and the small column members 52), are provided facing each other in different locations relative to the Z-axis direction. Because of this, when theupper plate 2, thefirst region 50, and thelower plate 3 are stacked together, thesecond ducts 11 and the second ducts 55 are connected in a state wherein each is slightly shifted. The openingportions 53 connect thesecond ducts 11 and the second ducts 55, which are connected in a state wherein they are each slightly shifted. - The result is that the entirety of the second ducts (the ducts that are the
second ducts 11 and the second ducts 55 together) are structured along the Z-axis direction, in addition to the X-axis direction and the Y-axis direction. Because of this, in the entirety of the second ducts, the vaporized refrigerant can move, and the condensed refrigerant can move, in the X-axis direction, the Y-axis direction, and the Z-axis direction. - By the entirety of the second ducts being able to diffuse heat in the X-axis direction, the Y-axis direction, and the Z-axis direction, the
second region 6 is able to diffuse in three dimensions the heat removed from theheat emitting object 20. The ability of thesecond region 6 to diffuse in three dimensions the heat of theheat emitting object 20 makes it possible for thesecond region 6 to move heat across a broader range to thefirst region 5. As a result, thefirst region 5 is able to use fully the plurality offirst ducts 9 to move the vaporized refrigerant (to transport the heat). - While the vaporized refrigerant received from the
first region 5 is condensed in thesecond region 7, the entirety of the second ducts is able to diffuse the refrigerant in three dimensions, and thus, in thesecond region 7, the vaporized refrigerant can be cooled while diffusing in three dimensions, to efficiently condense the vaporized refrigerant. Additionally, in thesecond region 7, the condensed refrigerant can move three-dimensionally, and thus the condensed refrigerant can move to thefirst region 5 at a high speed. Additionally, in the entirety of the second ducts of thesecond region 7, the condensed refrigerant can move to thefirst region 5 across a broad range, enabling thefirst region 5 to move the condensed refrigerant using the plurality offirst ducts 9 fully. - Additionally, the
first region 50 is stacked between theupper plate 2 and thelower plate 3, so the provision of thefirst region 50 further increases the strength of theheat transporting unit 1, and more clearly partitions between the ducts of thefirst ducts 9 and thesecond ducts 11 and 55, enabling thefirst ducts 9 and thesecond ducts 11 and 55 to transport the heat more reliably. - An example wherein there is a modification that to the
first region 5 and thesecond regions - The
interior space 4 is provided with a first region and a second region have different functions in heat transportation. The first region is positioned in any region in theinterior space 4, and the second region is positioned in another portion that is not the first region. The positioning of the first region and the second region may be determined in a variety of ways. -
FIG. 2 , which was used in the first form of embodiment, illustrates aheat transporting unit 1 wherein thesecond region 6 and thesecond region 7 are provided at both ends of theinterior space 4, and thefirst region 5 is provided interposed between thesesecond region 6 andsecond region 7. - In a
heat transporting unit 1 having this type of structure, the heat from the heat emitting object that is disposed facing thesecond region 6 is received by thesecond regions 6 and diffuses in the X-axis direction and the Y-axis direction (and further, in the Z-axis direction). Moreover, thesecond region 6 moves the heat to thefirst region 5. - Following this, the
first region 5, which has received the heat from thesecond region 6, transports the heat in the X-axis direction. Thefirst region 5 transports, to thesecond region 7, the heat that has been transported in the X-axis direction. Moreover, thesecond region 7 that has received the heat from thefirst region 5 performs cooling while the heat diffuses in the X-axis direction and Y-axis direction (and further, in the Z-axis direction). The refrigerant condenses through being cooled, and thesecond region 7 moves the refrigerant, through thefirst region 5, to thesecond region 6. - In this way, the
heat transporting unit 1, which has a structure that is provided with thesecond regions first region 5 interposed between thesecond regions heat transporting unit 1, having such a structure, is able to transport the heat efficiently. - Additionally, the
second region 6 may be provided at one end portion in theinterior space 4 and thefirst region 5 may be provided in the regions thereof other than thesecond region 6. That is, theheat transporting unit 1, as illustrated inFIG. 9 , may be provided with asecond region 6 at only one end portion in theinterior space 4, with a structure wherein the remaining portion is provided asfirst regions 5. -
FIG. 9 is a plan view diagram of a heat transporting unit according to a second form of embodiment according to the Present Disclosure.FIG. 9 shows the interior of theheat transporting unit 1 in a visible state. Theheat transporting unit 1 illustrated inFIG. 9 has asecond region 6 at only one end portion within theinterior space 4, and afirst region 5 in the region that is not thesecond region 6. Theheat emitting object 20 is disposed facing thesecond region 6. Thesecond region 6, as explained in the first and second forms of embodiment, is provided withsecond column portions 10 andsecond ducts 11. - The
second region 6 uses thesecond ducts 11 to diffuse the heat removed from theheat emitting object 20 in the X-axis direction and the Y-axis direction (and further, in the Z-axis direction). Additionally, thesecond region 6 moves the diffused heat to thefirst region 5. Specifically, it moves the vaporized refrigerant to thefirst region 5. - The
first region 5 transports the heat in the X-axis direction using thefirst ducts 9. Thefirst region 5 is provided withfirst ducts 9 along the long direction (the X-axis direction), so thefirst region 5 is able to cool the heat during the transportation of the heat using the longfirst ducts 9. The vaporized refrigerant is condensed through the cooling of the heat in thefirst ducts 9. Because thefirst ducts 9 have capillary forces, the condensed refrigerant moves along the X-axis direction towards thesecond region 6. This is because in the vicinity of thesecond region 6, the refrigerant is vaporized by the heat of theheat emitting object 20, causing a state wherein there is little condensed refrigerant, and thus the condensed refrigerant tends to be moved to thesecond region 6 by the capillary forces. - The
heat transporting unit 1 that is provided with thesecond region 6 at only one end of theinterior space 4 in this way has a simple structure, and thus can reduce manufacturing costs. Additionally, if there is little difference between the width of theheat emitting object 20 in the Y-axis direction and the width of theheat transporting unit 1 in the Y-axis direction (the length in the short direction), then thesecond region 6 can adequately diffuse the vaporized refrigerant in the Y-axis direction, enabling movement of the vaporized refrigerant to all of thefirst ducts 9. Because of this, the vaporized refrigerant is more easily cooled, during movement, within thefirst ducts 9, so thesecond region 7 becomes unnecessary. From this point as well, preferably theheat transporting unit 1 is provided with a structure such as inFIG. 9 . - Yet another example of a modification to the first region and the second region will be explained next. A structure will be explained wherein a second region is provided in the center of the
interior space 4, and first regions are provided at both ends of theinterior space 4. -
FIG. 10 is a perspective diagram of a heat transporting unit according to a second form of embodiment according to the Present Disclosure.FIG. 10 illustrates the internal structures in a visible state. Theheat transporting unit 1 illustrated inFIG. 10 has a structure that is provided with a second region 60 in the center portion of theinterior space 4, and provided with first regions 61 and 62 at both ends of the second region 60 (that is, at both ends of the interior space 4). Note that the second region 60 has structures and functions identical to those of thesecond regions second column portions 10, and withsecond ducts 11 that are formed by thesecond column portions 10. The first regions 61 and 62 have structures and functions that are identical to those of thefirst region 5 that was explained in the first and second forms of embodiment. That is, they are provided withfirst column portions 8, and provided withfirst ducts 9 that are formed by thefirst column portions 8. - The heat emitting object 20 (not shown, both in
FIG. 10 and below) is disposed facing the bottom surface of the second region 60. The second region 60 removes heat from theheat emitting object 20. The second region 60 hassecond ducts 11 along the X-axis direction and the Y-axis direction (and further, along the Z-axis direction), and thus is able to move, in the X-axis direction and Y-axis direction (and further, in the Z-axis direction), the refrigerant that is vaporized by the heat of theheat emitting object 20. Furthermore, the second region 60 moves the vaporized refrigerant to the first regions 61 and 62. The first regions 61 and 62 are provided at both sides of the second region 60, and the second region 60 moves the vaporized refrigerant in the X-axis direction as well, and thus the second region 60 moves the vaporized refrigerant to both the first region 61 and the first region 62. Additionally, the second region 60 moves the vaporized refrigerant in the Y-axis direction as well, and thus moves the vaporized refrigerant from the second region 60 using fully the crosswise direction of the Y-axis direction of the first regions 61 and 62. That is, in both the first regions 61 and 62, the plurality offirst ducts 9 that are provided are used fully to enable movement of the vaporized refrigerant in the X-axis direction. - The vaporized refrigerant that has moved to both the first region 61 and the first region 62 is moved in the X-axis direction by the plurality of
first ducts 9 in both the first region 61 and the first region 62. - At this time, in the respective first region 61 and first region 62, the vaporized refrigerant is moved towards the respective end portions, so as to move away from the second region 60. In the respective first regions 61 and 62, the vaporized refrigerant is cooled during the movement towards the end portions. The refrigerant is condensed through this cooling. In the respective first regions 61 and 62, the condensed refrigerant moves along the X-axis direction due to the capillary forces of the
first ducts 9. At this time, in the respective first regions 61 and 62, the contents refrigerant is moved towards the second region 60. - As described above, the
heat transporting unit 1 illustrated inFIG. 10 transports the heat of theheat emitting object 20, disposed at the center portion thereof, towards both ends. For example, when one wishes to exhaust, to the periphery, heat that is produced by a given electronic component or mechanical component, then preferably aheat transporting unit 1 having the structure illustrated inFIG. 10 will be used. - The
heat transporting unit 1 in the second form of embodiment is able to transport and exhaust heat of a heat emitting object while being compatible with a variety of structures, shapes, sizes, mounting conditions, and the like, of the heat-emitting object to which it is applied. - A third form of embodiment will be explained next.
- Various relationships between the position of the heat-emitting object and the heat transporting unit will be explained using the third form of embodiment.
-
FIG. 11 is a perspective assembly diagram of a heat transporting unit according to the third form of embodiment according to the Present Disclosure.FIG. 11 illustrates a state wherein theupper plate 2 is at the bottom and thelower plate 3 is at the top, and, in order to cause the interior to be visible, illustrates a state wherein the outer surface of thelower plate 3 has been removed. - The
heat transporting unit 1 is provided with aheat receiving portion 70 for making thermal contact with a heat emitting object at theupper plate 2 and/or at thelower plate 3. Theheat transporting unit 1 inFIG. 11 is provided with theheat receiving region 70 at thelower plate 3. - The
heat receiving region 70 is positioned where the heat emitting object is disposed, and theheat transporting unit 1 removes heat from the heat emitting object through theheat receiving region 70. Thereafter, theheat transporting unit 1 transports the heat of the heat emitting object in the X-axis direction from thesecond region 6 through thefirst region 5. - The
heat receiving region 70 may be provided as a member for positioning the heat emitting object, as illustrated inFIG. 11 . In this case, theheat receiving region 70 may have a flat shape or a frame shape of members having high thermal conductivity, such as a metal, and alloy, or the like. Conversely, theheat transporting unit 1 may be provided with aheat receiving region 70 as a target position for positioning the heat emitting object, without having to provide a separate element or member as theheat receiving region 70. That is, in theheat receiving region 70, there is no need for the explicit provision of a member on the surface of thelower plate 3, but rather it may be a position, region, or location for the placement of theheat emitting object 20. What is necessary is for the user of theheat transporting unit 1 to understand, as theheat receiving region 70, the region or location for positioning that selects the position for the placement of theheat emitting object 20, in order to use the functions of theheat transporting unit 1. In this point, the responsibility of the party providing theheat transporting unit 1 to recommend the position for placing theheat emitting object 20 is defined identically to that for recommending theheat receiving region 70. - The provision of the
heat receiving region 70 in theheat transporting unit 1 is because this facilitates the definition of the target for the position for the placement of the heat emitting object, and because this facilitates the achievement of cooling the heat emitting object more efficiently, as in the experimental results, described below. - Here the
heat receiving region 70 being provided spanning theboundary 12 of thefirst region 5 and thesecond region 6 is preferred from the perspective of the efficiency of heat transportation in theheat transporting unit 1. - The inventors performed experiments regarding this point, and the experimental results will be described.
FIG. 12 is an explanatory diagram listing an example of embodiment and comparative examples. - In the example of embodiment, the heat emitting object 20 (that is, the heat receiving region 70) is provided spanning the
boundary 12 of thesecond region 6 and thefirst region 5. - In the first comparative example, the heat emitting object 20 (that is, the heat receiving region 70) is provided at the bottom surface of the
second region 6, where theheat emitting object 20 is in a state that is essentially within the bottom surface of thesecond region 6. - In the second comparative example, the heat emitting object 20 (that is, the heat receiving region 70) is provided at the bottom surface of the
second region 6, and theheat emitting object 20 is included further within the bottom surface of thesecond region 6 than in the first comparative example, and theheat emitting object 20 covers thesecond region 6 more broadly than in the case of the second comparative example. - Heat was actually applied to the
heat emitting object 20, and the surface temperature of theheat emitting object 20 was measured, based on these three types of structures. -
FIG. 13 is a graph showing the measurement results in the example of embodiment and in the comparative examples. As is clear from the graph inFIG. 13 , in the example of embodiment the surface temperature of theheat emitting object 20 was 73.4° C. In the first comparative example, the surface temperature of theheat emitting object 20 was 73.8° C. In the second comparative example, the surface temperature of theheat emitting object 20 was 76.0° C. - As can be understood from these results, the structure of the example of embodiment was most able to cool the heat of the heat emitting object (that is, most able to transport the heat). That is, the
heat receiving region 70 preferably is provided spanning theboundary 12 of thefirst region 5 and thesecond region 6. - Note that the position of placement of the
heat receiving region 70 does not depend on only the cooling effect of this type of heat emitting object, and thus should be determined in accordance with parameters such as, for example, the size, shape, mounting position, and the like of theheat emitting object 20, and the third form of embodiment does not limit particularly the position of placement of theheat receiving region 70. Moreover, the surface temperatures obtained through the measurement results are only examples, and, of course, will vary depending on a variety of parameters such as the size, shape, and mounting position of the heat emitting object, and on measurement environment conditions, type of refrigerant, and so forth. - As described above, the
heat transporting unit 1 in the third form of embodiment is able to transport heat of the heat emitting object more efficiently through the specification of the position of placement of the heat emitting object. - A fourth form of embodiment will be explained next.
- A case wherein the heat transporting unit is further provided with a heat radiating portion for radiating the transported heat will be explained using the fourth form of embodiment.
-
FIG. 14 is a side view diagram of a heat transporting unit according to a fourth form of embodiment according to the Present Disclosure. Theheat transporting unit 1, as with that which was explained inFIG. 2 , is provided with afirst region 5, asecond region 6, and asecond region 7 within theinterior space 4. Aheat emitting object 20 is positioned in the vicinity of the boundary between thesecond region 6 and thefirst region 5, and thesecond region 6 diffuses the heat removed from theheat emitting object 20. - The heat diffused by the
second region 6 moves to thefirst region 5, and thefirst region 5 transports the heat towards thesecond region 7. The heat that arrives at thesecond region 7 diffuses within thesecond region 7. - A cooling
fan 80 is illustrated inFIG. 14 as an example of a heat radiating portion. The coolingfan 80 cools thesecond region 7. In thesecond region 7, the heat that was transported from theheat emitting object 20 arrives and is cooled, to condense the vaporized refrigerant. The coolingfan 80 expedites the condensation of the refrigerant. The condensed refrigerant moves from thesecond region 7 to thesecond region 6. Theheat transporting unit 1, through producing this movement, produces heat cycling, enabling the effective transportation and cooling of the heat of theheat emitting object 20. - The heat transportation effectiveness of the
heat transporting unit 1 is improved involves the transportation of the cooled heat in the opposite direction (that is, the movement of the condensed refrigerant) in addition to the transportation of the heat of the heat emitting object 20 (that is, the movement of the vaporized refrigerant). Because of this, the heat transporting efficiency of theheat transporting unit 1 is improved through increasing the efficiency and the speed of movement of the condensed refrigerant through the heat radiating portion. - In this way, the provision of the additional heat radiating portion enables the
heat transporting unit 1 to transport the heat with high efficiency. - While a cooling fan was shown in
FIG. 14 as an example of a heat radiating portion, instead of a cooling fan, a liquid-cooled jacket, a Peltier element, a heat sink, or any other member capable of radiating heat can be used as the heat radiating portion. - The
heat transporting unit 1 can replace a heat radiating fin or liquid cooling device, or the like, that is mounted in a notebook PC, a mobile terminal, a computer terminal, or the like, and can replace a cooling device that is mounted in an industrial device, or replace a heat radiating case or a cooling device that is mounted in a control computer unit, or the like. Theheat transporting unit 1 can transport heat at a higher speed than a heat pipe that has been used conventionally, and thus can be applied to cooling a variety of electronic components. The result is that theheat transporting unit 1 can be used in a broad scope of applications. - The
heat transporting unit 1 in the fourth form of embodiment transports the heat of the heat emitting object more efficiently. - A
heat transporting unit 1 as explained in any of the first through fourth forms of embodiment can be applied well to an electronic device that is provided with aheat transporting unit 1, aheat emitting object 20 that is in thermal contact with at least a portion of the surface of the heat transporting unit 1 (or which may be in contact with the heat receiving portion explained in the third form of embodiment), an electronic circuit board whereon theheat emitting object 20 is mounted, and a case for housing the electronic circuit board. -
FIG. 15 is a schematic diagram of an electronic device according to the fifth form of embodiment according to the Present Disclosure. Theelectronic device 90 houses, within acase 91, aheat transporting unit 1 for cooling anelectronic circuit board 92 and aheat emitting object 20, mounted thereon. Theelectronic circuit board 92 has a variety of electronic components mounted thereon, so theheat transporting unit 1 transports heat, with those electronic components requiring the transportation of heat as theheat emitting object 20. - Additionally, the
heat transporting unit 1, if necessary, may be provided with a heat radiating portion, as represented by the coolingfan 80. - This type of
electronic device 90 can be cooled when the heat of the heat emitting object is transported in a specific direction, thus making it possible to prevent malfunction of or damage to the electronic device, enabling higher performance to be achieved. - The electronic device is of a thin shape such as an automobile television or personal monitor, or may be a mobile terminal that must be of a small size. Conversely, the electronic device includes also mobile telephones, mobile music playing equipment, mobile mail terminals, PDAs, digital cameras, digital video cameras, mobile recorders, smartphones, and mobile video recording equipment.
- The
electronic device 90 in the fifth form of embodiment is able to transport effectively, to the periphery, the heat of those electronic components and mechanical components that have high heat production, thus making it possible to prevent in advance malfunctions or failures of theelectronic device 90. - Note that while in the forms of embodiment in the Present Disclosure the heat emitting object was thermally connected to either the upper plate or the lower plate, instead it may be thermally connected to both the upper plate and the lower plate. Furthermore, the heat emitting object may be connected thermally through a heat receiving member, having high thermal conductivity, which is a separate member, to the upper plate and/or the lower plate. The provision of the heat receiving member enables its use as a positioner or a securing member when connecting thermally to the heat emitting object.
- While a preferred embodiment of the Present Disclosure is shown and described, it is envisioned that those skilled in the art may devise various modifications without departing from the spirit and scope of the foregoing Description and the appended Claims.
Claims (27)
1. A heat transporting unit having a space defined by mutually orthogonal X, Y and Z axes, comprising:
an upper plate;
a lower plate that faces the upper plate;
an interior space that is formed by the upper plate and the lower plate and wherein a refrigerant can be sealed;
a first region, that is a region that is part of the interior space and that is provided with a first column portion that forms a plurality of first ducts that extend in the X-axis direction; and
a second region that is provided with a second column portion that forms a plurality of second ducts that extend in the X-axis direction and the Y-axis direction, that is a region that is other than the first region within the interior space;
wherein the first ducts and second ducts connect at a boundary between the first region and the second region.
2. The heat transporting unit of claim 1 , wherein, in the first duct, not only does a vaporized refrigerant move in the X-axis direction, but a condensed refrigerant also moves in the X-axis direction.
3. The heat transporting unit of claim 2 , wherein, in the second duct, not only does the vaporized refrigerant move in the X-axis direction and the Y-axis direction, but the condensed refrigerant also moves in the X-axis direction and the Y-axis direction.
4. The heat transporting unit of claim 3 , wherein not only does vaporized refrigerant move mutually at the boundary between the first duct and the second duct, but also the condensed refrigerant moves mutually at the boundary between the first duct and the second duct.
5. The heat transporting unit of claim 4 , wherein a second region is provided at at least one of the two end portions of the interior space.
6. The heat transporting unit of claim 5 , wherein a first region is provided in a region other than the second region in the interior space.
7. The heat transporting unit of claim 4 , wherein a second region is provided in the center portion of the interior space.
8. The heat transporting unit of claim 7 , wherein a first region is provided in a region other than the second region in the interior space.
9. The heat transporting unit of claim 4 , wherein a second region not only diffuses heat received from a heat emitting object in the X-axis direction and the Y-axis direction, but also moves it to the first region.
10. The heat transporting unit of claim 9 , wherein the first region transports, in the X-axis direction, the heat moved from the second region.
11. The heat transporting unit of claim 10 , wherein, when the second region is provided at a first end portion and at a second end portion that is opposite from the first end portion, within the interior space, the second region of the first end portion side not only causes the diffusion, in the X-axis direction and the Y-axis direction, of the heat received from the heat emitting object, but also causes it to move to the first region.
12. The heat transporting unit of claim 11 , wherein, when the second region is provided at a first end portion and at a second end portion that is opposite from the first end portion, within the interior space, the first region transports, in the X-axis direction, the heat moved from the second region on the first end portion side.
13. The heat transporting unit of claim 12 , wherein, when the second region is provided at a first end portion and at a second end portion that is opposite from the first end portion, within the interior space, the second region on the second end portion side diffuses, in the X-axis direction and the Y-axis direction, the heat that has been transported by the first region.
14. The heat transporting unit of claim 10 , wherein, when the second region is provided in the center of the interior space, and the first region is provided at a first end portion and at a second end portion that is on the opposite side from the first end portion, in the interior space, the second region not only diffuses in the X-axis direction and the Y-axis direction the heat that is received from the heat emitting object, but also moves it to the first region.
15. The heat transporting unit of claim 14 , wherein, when the second region is provided in the center of the interior space, and the first region is provided at a first end portion and at a second end portion that is on the opposite side from the first end portion, in the interior space, the first region transports, in the X-direction, the heat moved from the second region.
16. The heat transporting unit of claim 10 , wherein the upper plate and/or the lower plate also has a heat receiving portion that contacts the heat emitting object thermally.
17. The heat transporting unit of claim 16 , wherein the heat receiving portion is provided spanning the first region and the second region.
18. The heat transporting unit of claim 17 , wherein a first column portion has a cutout to connect together adjacent first ducts within a plurality of first ducts.
19. The heat transporting unit of claim 18 , wherein the second region has one or more intermediate plates layered in the Z-axis direction.
20. The heat transporting unit of claim 19 , wherein the intermediate plates form the second column portion that is stacked in the Z-axis direction.
21. The heat transporting unit of claim 20 , wherein the second column portion forms second ducts in the X-axis direction, the Y-axis direction, and the Z-axis direction.
22. The heat transporting unit of claim 21 , wherein the second column portion comprises a large column member and a small column member that is smaller than the large column member.
23. The heat transporting unit of claim 22 , wherein at least a portion of the first ducts and the second ducts have capillary forces that move the condensed refrigerant.
24. The heat transporting unit of claim 23 , wherein at least a portion of the upper plate, the lower plate, the first column portion, and/or the second column portion has a channel in a surface that is exposed to the interior space.
25. The heat transporting unit of claim 24 , wherein the upper plate and/or the lower plate is further equipped with a heat radiating portion for radiating the transported heat, in a region that faces at least a portion of the first region and/or the second region.
26. The heat transporting unit of claim 25 , wherein at least a portion of the upper plate, the lower plate, the first column portion, and/or the second column portion has metal plating on a surface that is exposed to the interior space.
27. The heat transporting unit of claim 26 , wherein the width of the first region in the Y-axis direction and the width of the second region in the Y-axis direction are essentially identical.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-095565 | 2010-04-17 | ||
JP2010095565A JP5714836B2 (en) | 2010-04-17 | 2010-04-17 | Heat transport unit, electronic board, electronic equipment |
PCT/US2011/032919 WO2011130748A2 (en) | 2010-04-17 | 2011-04-18 | Heat transporting unit, electronic circuit board and electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130126139A1 true US20130126139A1 (en) | 2013-05-23 |
Family
ID=44799380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/641,580 Abandoned US20130126139A1 (en) | 2010-04-17 | 2011-04-18 | Heat transporting unit, electronic circuit board and electronic device |
Country Status (5)
Country | Link |
---|---|
US (1) | US20130126139A1 (en) |
JP (1) | JP5714836B2 (en) |
CN (1) | CN203416546U (en) |
TW (1) | TWM423989U (en) |
WO (1) | WO2011130748A2 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160209122A1 (en) * | 2015-01-20 | 2016-07-21 | Chaun-Choung Technology Corp. | Slim-type vapor chamber and capillary structure thereof |
US20170023308A1 (en) * | 2015-07-20 | 2017-01-26 | Delta Electronics, Inc. | Slim vapor chamber |
CN106376214A (en) * | 2015-07-20 | 2017-02-01 | 台达电子工业股份有限公司 | Slim vapor chamber |
US20170350657A1 (en) * | 2016-06-02 | 2017-12-07 | Tai-Sol Electronics Co., Ltd. | Heat spreader with a liquid-vapor separation structure |
US20180163561A1 (en) * | 2016-09-12 | 2018-06-14 | Rolls-Royce Plc | Apparatus for insertion into a cavity of an object |
US10633993B2 (en) * | 2016-08-26 | 2020-04-28 | Rolls-Royce Plc | Apparatus for insertion into a cavity of an object |
US11105562B2 (en) * | 2018-12-19 | 2021-08-31 | Shinko Electric Industries Co., Ltd. | Loop-type heat pipe |
US11448470B2 (en) | 2018-05-29 | 2022-09-20 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
US11454454B2 (en) * | 2012-03-12 | 2022-09-27 | Cooler Master Co., Ltd. | Flat heat pipe structure |
US11913725B2 (en) | 2018-12-21 | 2024-02-27 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2995073A1 (en) * | 2012-09-05 | 2014-03-07 | Air Liquide | EXCHANGER ELEMENT FOR HEAT EXCHANGER, HEAT EXCHANGER COMPRISING SUCH AN EXCHANGER MEMBER, AND METHOD FOR MANUFACTURING SUCH EXCHANGER MEMBER |
JP6485075B2 (en) * | 2015-01-29 | 2019-03-20 | 富士通株式会社 | Loop heat pipe and method of manufacturing loop heat pipe |
JP2016156584A (en) * | 2015-02-25 | 2016-09-01 | 株式会社フジクラ | Thin plate heat pipe type heat diffusion plate |
WO2017037921A1 (en) * | 2015-09-03 | 2017-03-09 | 富士通株式会社 | Loop heat pipe, manufacturing method for same, and electronic device |
JP6248171B1 (en) * | 2016-11-30 | 2017-12-13 | 古河電気工業株式会社 | Vapor chamber |
KR102561617B1 (en) | 2017-02-24 | 2023-08-01 | 다이니폰 인사츠 가부시키가이샤 | Vapor chamber, electronic device, metal sheet for vapor chamber, and method for manufacturing vapor chamber |
KR101817894B1 (en) * | 2017-04-07 | 2018-01-11 | 주식회사 인지디스플레이 | Method for manufacturing heat plate of display device |
KR20230079250A (en) * | 2017-09-28 | 2023-06-05 | 다이니폰 인사츠 가부시키가이샤 | Vapor chamber, electronic device, metal sheet for vapor chamber, and method for manufacturing vapor chamber |
JP7148889B2 (en) * | 2017-10-06 | 2022-10-06 | 大日本印刷株式会社 | metal sheets for vapor chambers, electronics and vapor chambers |
JP7099094B2 (en) * | 2018-07-05 | 2022-07-12 | 大日本印刷株式会社 | Vapor chamber and electronic equipment |
TWI726765B (en) * | 2020-07-08 | 2021-05-01 | 雙鴻科技股份有限公司 | Vapor chamber |
CN112396818B (en) * | 2020-11-12 | 2021-09-24 | 贵州电网有限责任公司 | Portable mobile detection terminal |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020056542A1 (en) * | 1995-12-21 | 2002-05-16 | Masaaki Yamamoto | Flat type heat pipe |
US20030024691A1 (en) * | 2001-07-31 | 2003-02-06 | Leu-Wen Tsay | High efficiency heat sink |
US20040188066A1 (en) * | 2002-11-01 | 2004-09-30 | Cooligy, Inc. | Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange |
US20070056711A1 (en) * | 2005-09-01 | 2007-03-15 | Fuchigami Mirco Co., Ltd. | Heat pipe and method for manufacturing same |
US7215545B1 (en) * | 2003-05-01 | 2007-05-08 | Saeed Moghaddam | Liquid cooled diamond bearing heat sink |
US7237337B2 (en) * | 2004-06-29 | 2007-07-03 | Industrial Technology Research Institute | Heat dissipating apparatus having micro-structure layer and method of fabricating the same |
US20080236795A1 (en) * | 2007-03-26 | 2008-10-02 | Seung Mun You | Low-profile heat-spreading liquid chamber using boiling |
WO2008146129A2 (en) * | 2007-05-25 | 2008-12-04 | Boston Cooltec Corporation | Flat heat pipe and cooling bodies using said heat pipe |
US20090250195A1 (en) * | 2006-06-14 | 2009-10-08 | Toyota Jidosha Kabushiki Kaisha | Heat sink and cooler |
US20090250196A1 (en) * | 2006-08-09 | 2009-10-08 | Batty J Clair | Relieved-channel, bonded heat exchanger |
US20100071879A1 (en) * | 2008-09-19 | 2010-03-25 | Foxconn Technology Co., Ltd. | Method for manufacturing a plate-type heat pipe and a plate-type heat pipe obtained thereby |
US20100132923A1 (en) * | 2006-08-09 | 2010-06-03 | Batty J Clair | Minimal-Temperature-Differential, Omni-Directional-Reflux, Heat Exchanger |
US20100243214A1 (en) * | 2007-12-04 | 2010-09-30 | Electronics and Telecommunications Research Insti tute | Flat plate type micro heat transport device |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4235287A (en) * | 1975-05-02 | 1980-11-25 | Olin Corporation | Heat exchange panel |
JPS6266061A (en) * | 1985-09-18 | 1987-03-25 | Showa Alum Corp | Solar heat water heater utilizing heat pipe |
JP3041447B2 (en) * | 1996-08-29 | 2000-05-15 | 昭和アルミニウム株式会社 | Radiator for portable electronic equipment |
KR100505279B1 (en) * | 2003-05-31 | 2005-07-29 | 아이큐리랩 홀딩스 리미티드 | Cooling device of thin plate type for preventing dry-out |
US7411290B2 (en) * | 2005-08-05 | 2008-08-12 | Delphi Technologies, Inc. | Integrated circuit chip and method for cooling an integrated circuit chip |
JP4112602B2 (en) * | 2005-09-01 | 2008-07-02 | 株式会社渕上ミクロ | heat pipe |
JP2007150013A (en) * | 2005-11-29 | 2007-06-14 | Matsushita Electric Ind Co Ltd | Sheet-shaped heat pipe and structure for cooling electronic equipment |
EP2051032A1 (en) * | 2006-07-28 | 2009-04-22 | Molex Kiire Co., Ltd. | Heat pipe and method of manufacturing it |
JP2008116180A (en) * | 2006-11-07 | 2008-05-22 | Denso Corp | Boil cooling device, and manufacturing method for the same |
US8100170B2 (en) * | 2007-08-01 | 2012-01-24 | Advanced Thermal Device Inc. | Evaporator, loop heat pipe module and heat generating apparatus |
JP2010086071A (en) * | 2008-09-29 | 2010-04-15 | Toshiba Corp | Electronic apparatus |
TWI436019B (en) * | 2010-07-21 | 2014-05-01 | Asia Vital Components Co Ltd | The structure of the heat siphon plate is improved |
-
2010
- 2010-04-17 JP JP2010095565A patent/JP5714836B2/en not_active Expired - Fee Related
-
2011
- 2011-04-18 US US13/641,580 patent/US20130126139A1/en not_active Abandoned
- 2011-04-18 TW TW100206785U patent/TWM423989U/en not_active IP Right Cessation
- 2011-04-18 CN CN201190000569.8U patent/CN203416546U/en not_active Expired - Fee Related
- 2011-04-18 WO PCT/US2011/032919 patent/WO2011130748A2/en active Application Filing
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020056542A1 (en) * | 1995-12-21 | 2002-05-16 | Masaaki Yamamoto | Flat type heat pipe |
US20030024691A1 (en) * | 2001-07-31 | 2003-02-06 | Leu-Wen Tsay | High efficiency heat sink |
US20040188066A1 (en) * | 2002-11-01 | 2004-09-30 | Cooligy, Inc. | Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange |
US7215545B1 (en) * | 2003-05-01 | 2007-05-08 | Saeed Moghaddam | Liquid cooled diamond bearing heat sink |
US7237337B2 (en) * | 2004-06-29 | 2007-07-03 | Industrial Technology Research Institute | Heat dissipating apparatus having micro-structure layer and method of fabricating the same |
US20070056711A1 (en) * | 2005-09-01 | 2007-03-15 | Fuchigami Mirco Co., Ltd. | Heat pipe and method for manufacturing same |
US20090250195A1 (en) * | 2006-06-14 | 2009-10-08 | Toyota Jidosha Kabushiki Kaisha | Heat sink and cooler |
US20090250196A1 (en) * | 2006-08-09 | 2009-10-08 | Batty J Clair | Relieved-channel, bonded heat exchanger |
US20100132923A1 (en) * | 2006-08-09 | 2010-06-03 | Batty J Clair | Minimal-Temperature-Differential, Omni-Directional-Reflux, Heat Exchanger |
US20080236795A1 (en) * | 2007-03-26 | 2008-10-02 | Seung Mun You | Low-profile heat-spreading liquid chamber using boiling |
WO2008146129A2 (en) * | 2007-05-25 | 2008-12-04 | Boston Cooltec Corporation | Flat heat pipe and cooling bodies using said heat pipe |
US20100243214A1 (en) * | 2007-12-04 | 2010-09-30 | Electronics and Telecommunications Research Insti tute | Flat plate type micro heat transport device |
US20100071879A1 (en) * | 2008-09-19 | 2010-03-25 | Foxconn Technology Co., Ltd. | Method for manufacturing a plate-type heat pipe and a plate-type heat pipe obtained thereby |
Non-Patent Citations (1)
Title |
---|
Baxmann, WO2008146129TRANS (English Translation) , 12-2008, WIPO * |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11454454B2 (en) * | 2012-03-12 | 2022-09-27 | Cooler Master Co., Ltd. | Flat heat pipe structure |
US20160209122A1 (en) * | 2015-01-20 | 2016-07-21 | Chaun-Choung Technology Corp. | Slim-type vapor chamber and capillary structure thereof |
US10502498B2 (en) * | 2015-07-20 | 2019-12-10 | Delta Electronics, Inc. | Slim vapor chamber |
US20170023308A1 (en) * | 2015-07-20 | 2017-01-26 | Delta Electronics, Inc. | Slim vapor chamber |
CN106376214A (en) * | 2015-07-20 | 2017-02-01 | 台达电子工业股份有限公司 | Slim vapor chamber |
US11561050B2 (en) | 2015-07-20 | 2023-01-24 | Delta Electronics, Inc. | Slim vapor chamber |
US20170350657A1 (en) * | 2016-06-02 | 2017-12-07 | Tai-Sol Electronics Co., Ltd. | Heat spreader with a liquid-vapor separation structure |
US10633993B2 (en) * | 2016-08-26 | 2020-04-28 | Rolls-Royce Plc | Apparatus for insertion into a cavity of an object |
US10472984B2 (en) * | 2016-09-12 | 2019-11-12 | Rolls-Royce Plc | Apparatus for insertion into a cavity of an object |
US20180163561A1 (en) * | 2016-09-12 | 2018-06-14 | Rolls-Royce Plc | Apparatus for insertion into a cavity of an object |
US11448470B2 (en) | 2018-05-29 | 2022-09-20 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
US11680752B2 (en) | 2018-05-29 | 2023-06-20 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
US11105562B2 (en) * | 2018-12-19 | 2021-08-31 | Shinko Electric Industries Co., Ltd. | Loop-type heat pipe |
US11913725B2 (en) | 2018-12-21 | 2024-02-27 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
Also Published As
Publication number | Publication date |
---|---|
JP2011226686A (en) | 2011-11-10 |
WO2011130748A3 (en) | 2012-02-16 |
TWM423989U (en) | 2012-03-01 |
JP5714836B2 (en) | 2015-05-07 |
WO2011130748A2 (en) | 2011-10-20 |
CN203416546U (en) | 2014-01-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20130126139A1 (en) | Heat transporting unit, electronic circuit board and electronic device | |
US9240365B2 (en) | Cooling device and electronic device | |
US11725883B2 (en) | Heat sink | |
JP5413735B2 (en) | Heat transport unit, electronic equipment | |
US9057565B2 (en) | Cooling device and electronic device | |
TWI722736B (en) | Heat sink | |
US8220527B2 (en) | Heat dissipation device with heat pipe | |
US20200326131A1 (en) | Heat sink | |
US11287192B2 (en) | Heat sink | |
US20130056178A1 (en) | Ebullient cooling device | |
WO2010121230A1 (en) | Cooling device, electronic substrate and electronic device | |
US7343963B2 (en) | Hybrid heat sink performance enhancement using recirculating fluid | |
JP5455503B2 (en) | Heat transport unit, electronic equipment | |
KR20110103387A (en) | Heat pipe and electronic device | |
JP5449801B2 (en) | Heat transport unit and electronic equipment | |
JP4494879B2 (en) | Heat sink using carbon graphite | |
CN115551285A (en) | Vapor chamber, heat sink, and electronic apparatus | |
JP2022143797A (en) | Evaporative cooling device | |
JP5193403B2 (en) | Waste heat socket | |
WO2013102974A1 (en) | Cooling system | |
WO2022180909A1 (en) | On-vehicle electronic device | |
JP7299441B1 (en) | boiling cooler | |
CN219741077U (en) | Heat radiation module and immersed liquid-cooled electronic equipment with same | |
JP5735594B2 (en) | Cooling system | |
US20220074675A1 (en) | Heat transport system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: MOLEX INCORPORATED, ILLINOIS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TSURUTA, KATSUYA;OHSAWA, KENJI;FUKUNAGA, RINKOU;REEL/FRAME:029435/0051 Effective date: 20121204 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |