WO2022180909A1 - On-vehicle electronic device - Google Patents

On-vehicle electronic device Download PDF

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Publication number
WO2022180909A1
WO2022180909A1 PCT/JP2021/035480 JP2021035480W WO2022180909A1 WO 2022180909 A1 WO2022180909 A1 WO 2022180909A1 JP 2021035480 W JP2021035480 W JP 2021035480W WO 2022180909 A1 WO2022180909 A1 WO 2022180909A1
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WO
WIPO (PCT)
Prior art keywords
heat
circuit board
generating component
phase change
electronic device
Prior art date
Application number
PCT/JP2021/035480
Other languages
French (fr)
Japanese (ja)
Inventor
恵子 上之
義夫 河合
Original Assignee
日立Astemo株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立Astemo株式会社 filed Critical 日立Astemo株式会社
Priority to JP2023502051A priority Critical patent/JPWO2022180909A1/ja
Publication of WO2022180909A1 publication Critical patent/WO2022180909A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to an in-vehicle electronic device.
  • phase change coolers such as vapor chambers or heat pipes are used as means for cooling heat-generating components such as CPUs.
  • This type of phase-change cooler has an evaporator that takes heat from heat-generating parts by changing the phase of a liquid-phase refrigerant to a gas phase without using power as described in Patent Document 1, and a vapor-phase refrigerant. and a condensing section for releasing heat from the gaseous refrigerant into the air by changing the phase to the liquid phase.
  • Patent Document 2 describes a portable computer having a heat dissipation structure using a heat pipe as a heat dissipation structure for releasing heat from heat-generating components mounted on a circuit board to a housing.
  • heat-generating components are connected to a heat receiving plate, the heat receiving plate is connected to a heat pipe, the heat pipe is connected to a connector, the connector is connected to a hinge, and the hinge is connected to a case.
  • a heat dissipation structure is realized to release the heat of the heat-generating parts to the housing.
  • the vehicle electronic device of the present invention has one surface mounted on a circuit board and the other surface opposite to the one surface in the board thickness direction of the circuit board.
  • a connector mounted on the circuit board and connected to an external device; a housing for housing the circuit board on which the heat generating component and the connector are mounted; and the A phase-change cooler that extends from the heat-generating component toward the connector and transfers heat with a phase change of a refrigerant, and contacts the other surface of the heat-generating component and the housing or the phase-change cooler. and a heat transfer member.
  • FIG. 1 is an exploded perspective view showing the configuration of the in-vehicle electronic device of Embodiment 1.
  • FIG. FIG. 2 is an explanatory view schematically showing a cross section of the in-vehicle electronic device taken along line A-A′ shown in FIG. 1;
  • FIG. 4 is an explanatory diagram of an in-vehicle electronic device according to a second embodiment;
  • FIG. 10 is an explanatory diagram of an in-vehicle electronic device according to Embodiment 3;
  • FIG. 11 is a perspective view showing an external configuration of an in-vehicle electronic device according to Embodiment 4;
  • FIG. 6 is a perspective view showing a cross section of the in-vehicle electronic device taken along line B-B' shown in FIG. 5;
  • FIG. 5 is an explanatory diagram of an arrangement structure of a cover having a first top plate portion and a second top plate portion, and a low-height heat-generating component and a high-height heat-generating component
  • FIG. 5 is an explanatory diagram of an arrangement structure of a cover that does not have a first top plate portion and a second top plate portion, and a low-height heat-generating component and a high-height heat-generating component
  • FIG. 11 is an explanatory diagram of an example of an in-vehicle electronic device according to Embodiment 5
  • FIG. 11 is an explanatory diagram of another example of the in-vehicle electronic device of Embodiment 5
  • FIG. 11 is an explanatory diagram of an in-vehicle electronic device according to Embodiment 6;
  • FIG. 11 is an explanatory diagram of an example of an in-vehicle electronic device according to a seventh embodiment;
  • FIG. 12 is an explanatory diagram of another example of the in-vehicle electronic device of Embodiment 7;
  • FIG. 1 is an exploded perspective view showing the configuration of an in-vehicle electronic device 100 of Embodiment 1.
  • FIG. FIG. 2 is an explanatory view schematically showing a cross section of the in-vehicle electronic device 100 taken along line AA' shown in FIG.
  • the in-vehicle electronic device 100 is an electronic device, such as an ECU, mounted in a vehicle.
  • the in-vehicle electronic device 100 includes a housing 1, a circuit board 4 such as a printed circuit board housed in the housing 1, a connector 5 mounted on the circuit board 4, a heat generating component 6 and an electronic component 7, and a heat generating component. 6 and a phase change cooler 9 for dissipating heat from the heat generating component 6 .
  • the housing 1 is a box-shaped member that accommodates the circuit board 4 on which the connector 5, the heat-generating component 6, and the electronic component 7 are mounted.
  • the housing 1 is made of a metal material such as aluminum, copper, or stainless steel, or a resin material.
  • the housing 1 includes a box-shaped cover 2 and a box-shaped case 3 (or a plate-shaped base) whose bottom is shallower than the cover 2 .
  • the cover 2 covers the circuit board 4 while being separated from the heat-generating components 6 mounted on the circuit board 4 in the thickness direction of the circuit board 4 .
  • the cover 2 includes a top plate portion 21 that intersects the circuit board 4 in the thickness direction and faces the circuit board 4 , and side plate portions 22 that are connected to the top plate portion 21 and extend along the thickness direction of the circuit board 4 . have.
  • the outer surface of the top plate portion 21 may be provided with heat radiating fins.
  • the portion of the top plate 21 that covers the connector 5 is farther away from the circuit board 4 in the thickness direction of the circuit board 4 than the portion of the top plate 21 that covers the heat generating component 6 is. may be formed to be longer.
  • the side plate portion 22 includes a first side plate portion 22a adjacent to one end portion 4a of the circuit board 4 in the direction along the circuit board 4 (the in-plane direction of the circuit board 4) and a circuit board portion 22a in the direction along the circuit board 4.
  • the first side plate portion 22a may be a side plate portion 22 having an opening 23 for exposing the connector 5 mounted on the circuit board 4 to the outside.
  • the second side plate portion 22b may be the side plate portion 22 parallel to the first side plate portion 22a.
  • the side plate portion 22 and the opening portion 23 may be provided in the case 3 instead of the cover 2, or may be provided in each of the cover 2 and the case 3.
  • the side plate portion 22 and the opening portion 23 may be portions that constitute the side plate portion and the opening portion of the housing 1 .
  • the top plate portion 21 may also be any part as long as it constitutes the top plate portion of the housing 1 .
  • the connector 5 is a connector mounted on the circuit board 4 and connected to an external device of the in-vehicle electronic device 100 .
  • the connector 5 may be connected to a harness 51 (see FIG. 3) in which wires forming a signal transmission path for communicating with an external device are bundled.
  • the connector 5 is mounted at least on one end 4a of the circuit board 4 in the direction along the circuit board 4, as shown in FIG. That is, the connector 5 is mounted on one of a pair of parallel sides of the rectangular circuit board 4 .
  • the heat generating component 6 is an electronic component that generates a relatively large amount of heat (high heat generating component) among the electronic components mounted on the circuit board 4 .
  • the heat-generating component 6 is an electronic component whose junction temperature (Tj) when energized is higher than that of other electronic components mounted on the circuit board 4 .
  • the heat-generating component 6 is an electronic component in which the difference between the junction temperature (Tjmax) at the maximum rating and the junction temperature (Tj) during energization is smaller than other electronic components.
  • the heat-generating component 6 may be configured by an arithmetic processing device including a processor such as a CPU, MPU, or GPU.
  • the heat-generating component 6 is formed in a plate shape, and as shown in FIG.
  • the heat-generating component 6 is mounted at least on the other end 4b of the circuit board 4 in the direction along the circuit board 4, as shown in FIG. That is, the heat-generating component 6 is mounted on the other of a pair of parallel sides of the rectangular circuit board 4 .
  • the electronic component 7 is an electronic component mounted on the circuit board 4 other than the connector 5 and the heat generating component 6.
  • the electronic component 7 is an electronic component that generates less heat than the heat-generating component 6 .
  • the electronic component 7 may be configured by an electronic component including, for example, an interface circuit such as a communication IC, or a power supply circuit such as a power supply IC.
  • the heat transfer member 8 is a heat transfer member that contacts the other surface 6 b of the heat generating component 6 and the housing 1 or the phase change cooler 9 .
  • the heat transfer member 8 is a member that releases the heat of the heat generating component 6 to the housing 1 or the phase change cooler 9 .
  • the heat transfer member 8 is arranged between the other surface 6b of the heat-generating component 6 and the phase-change cooler 9, and is positioned between the other surface 6b of the heat-generating component 6 and the phase-change cooler 9.
  • the heat transfer member 8 may be composed of, for example, heat dissipating grease or a heat dissipating sheet. It is preferable that the heat transfer member 8 be made of a material having as high a thermal conductivity as possible.
  • the heat transfer member 8 of the present embodiment is preferably made of a material having a level of hardness that does not affect the reliability of the joint between the heat-generating component 6 and the circuit board 4 . From the viewpoint of reliability and heat resistance, the heat transfer member 8 is preferably made of a material that can deform following thermal deformation of the heat generating component 6 and the circuit board 4 .
  • the phase change cooler 9 is a cooler that transports heat with a phase change of the refrigerant.
  • the phase-change cooler 9 includes an evaporator that absorbs heat from the heat-generating component 6 by changing the phase of the liquid-phase refrigerant to the gas phase without using power, and an evaporator that removes heat from the heat-generating component 6 by changing the phase of the liquid-phase refrigerant to the gas phase. and a condenser for releasing heat from the refrigerant to the air.
  • the phase change cooler 9 may be configured by, for example, a vapor chamber or a heat pipe.
  • the phase change cooler 9 is provided in the housing 1.
  • the phase change cooler 9 is joined to the inner surface of the top plate portion 21 of the cover 2 of the housing 1, as shown in FIG.
  • the phase-change cooler 9 is arranged between the heat transfer member 8 contacting the other surface 6 b of the heat-generating component 6 and the top plate portion 21 and contacts the heat transfer member 8 and the top plate portion 21 .
  • Phase change cooler 9 is formed to extend from heat generating component 6 mounted on circuit board 4 toward connector 5, as shown in FIG.
  • Phase change cooler 9 is formed to extend from the other end 4b of circuit board 4 in the direction along circuit board 4 toward one end 4a.
  • Phase-change cooler 9 has one end 9 a closer to connector 5 in the direction along circuit board 4 and the other end 9 b remote from connector 5 in the direction along circuit board 4 .
  • phase change cooler 9 may be the end closer to heat generating component 6 .
  • the phase change cooler 9 may be formed in a plate shape.
  • the phase-change cooler 9 absorbs heat from the heat-generating component 6 via the heat transfer member 8, diffuses the heat throughout the phase-change cooler 9, and transmits the heat to the top plate portion 21 to release it to the outside.
  • the following heat dissipation phenomenon occurs.
  • the heat of the heat generating component 6 is transferred to the phase change cooler 9 via the heat transfer member 8 and transferred to the liquid phase refrigerant inside the other end 9b of the phase change cooler 9 .
  • This liquid-phase refrigerant flows to one end portion 9a of the phase-change cooler 9 while undergoing a phase change to a vapor phase.
  • the refrigerant that has undergone a phase change to gas phase reaches one end portion 9a of the phase change cooler 9, it releases heat and undergoes a phase change to a liquid phase.
  • the refrigerant phase-changed to the liquid phase flows to the other end 9b of the phase-change cooler 9 by capillary action.
  • the refrigerant circulates between the other end portion 9b and the one end portion 9a with a phase change in this way, the heat of the heat-generating component 6 is rapidly diffused and released to the outside. temperature is reduced.
  • the heat dissipation phenomenon described above continues smoothly as long as the heat-generating component 6 generates heat by forming the phase-change cooler 9 so as to extend from the heat-generating component 6 mounted on the circuit board 4 toward the connector 5 . This is because the characteristics of the phase-change cooler 9 and the characteristics of the temperature distribution of the circuit board 4 are utilized, as will be described in detail below.
  • the phase-change cooler 9 is a heat sink in which a refrigerant is enclosed, and due to minute temperature differences on the inner surface, the refrigerant repeats phase changes between the liquid phase and the gas phase, thereby diffusing heat over a wide range. .
  • the phase-change cooler 9 has a heat diffusion capacity that is much higher than that of, for example, a heat sink made of copper or aluminum. This high heat diffusion capability allows the phase change cooler 9 to quickly reduce the temperature of the heat generating component 6 .
  • One of the important things to maintain the high heat diffusion capability of the phase change cooler 9 is to maintain a state of temperature difference along the extending direction of the phase change cooler 9 .
  • the temperature distribution of the entire phase-change cooler 9 becomes uniform. Since the phase change cooler 9 diffuses heat by changing the phase of the refrigerant due to a minute temperature difference on the inner surface, if the temperature distribution of the entire phase change cooler 9 becomes uniform, its heat diffusion capacity will decrease. . Therefore, it is important to configure the phase change cooler 9 so as to maintain a state in which there is a temperature difference along the direction in which the phase change cooler 9 extends.
  • the electronic components 7 including the power supply circuit etc. are often mounted at a position close to the connector 5, and the heat generating components 6 such as the arithmetic processing unit are mounted at a position separated from the connector 5. is often implemented in Also, the heat of the circuit board 4 is radiated by the harness 51 connected to the connector 5 . For these reasons, the temperature distribution of the circuit board 4 is often low near the connector 5 .
  • phase change cooler 9 of Embodiment 1 Since the phase change cooler 9 of Embodiment 1 is formed to extend from the heat generating component 6 mounted on the circuit board 4 toward the connector 5, there is a temperature difference along the direction in which the phase change cooler 9 extends. state can be maintained. As a result, in the in-vehicle electronic device 100 of the first embodiment, the coolant in the phase change cooler 9 can be efficiently circulated between the other end 9b and the one end 9a. can maintain a high heat diffusion capacity. Therefore, in the in-vehicle electronic device 100 of Embodiment 1, the heat diffusion capability of the phase change cooler 9 can be maximized, and high heat dissipation performance can be ensured.
  • the phase change cooler 9 of the first embodiment extends from the other end 4b of the circuit board 4 on which the heat generating component 6 is mounted toward the one end 4a of the circuit board 4 on which the connector 5 is mounted. formed in That is, the phase-change cooler 9 of the first embodiment can be formed long enough to extend over both ends 4 a and 4 b of the circuit board 4 .
  • the in-vehicle electronic device 100 of the first embodiment can increase the temperature difference along the direction in which the phase change cooler 9 extends, and further maintain the high heat diffusion capability of the phase change cooler 9. can. Therefore, in the in-vehicle electronic device 100 of Embodiment 1, the heat diffusion capability of the phase-change cooler 9 can be further extracted, and high heat radiation performance can be further ensured.
  • FIG. 3 is an explanatory diagram of the in-vehicle electronic device 100 of the second embodiment.
  • one phase change cooler 9 diffuses the heat of a plurality of heat-generating components 6 .
  • the heat-generating component 6 of the second embodiment is composed of a plurality of heat-generating components 6 having different heat generation amounts.
  • the plurality of heat-generating components 6 includes a maximum heat-generating component that generates the largest amount of heat and a minimum heat-generating component that generates the smallest amount of heat.
  • the component that generates the maximum heat is mounted at a position that is farther away from the connector 5 in the direction along the circuit board 4 than the component that generates the minimum heat.
  • the heat transfer member 8 of the second embodiment is composed of a plurality of heat transfer members 8 in contact with the other surfaces 6b of the plurality of heat generating components 6, respectively.
  • the phase change cooler 9 of Embodiment 2 extends from the maximum heat generating component to the minimum heat generating component.
  • the phase change cooler 91 on the right side of the figure diffuses the heat of the plurality of heat-generating components 61-63.
  • the heat generating components 61 to 63 have a relationship of magnitude of heat generation as follows: heat generating component 61>heat generating component 62>heat generating component 63.
  • FIG. Among the plurality of heat-generating components 61 to 63 the heat-generating component 61 is the maximum heat-generating component, and the heat-generating component 63 is the minimum heat-generating component.
  • a heat-generating component 61 that is the largest heat-generating component is mounted at a position farthest from the connector 5 .
  • a heat-generating component 62 that generates the next largest amount of heat after the heat-generating component 61 is mounted at a position closer to the connector 5 than the heat-generating component 61 .
  • a heat-generating component 63 that is the smallest heat-generating component is mounted at a position closest to the connector 5 . That is, the plurality of heat-generating components 61 to 63 are arranged so that the amount of heat generated increases as the distance from the connector 5 increases.
  • Phase change cooler 91 is formed to extend from heat generating component 61, which is the maximum heat generating component, toward heat generating component 63, which is the minimum heat generating component.
  • phase change cooler 92 on the left side of the figure diffuses the heat of the plurality of heat-generating components 64-65.
  • the heat generating components 64 to 65 have a heat generating component 64>heat generating component 65, and the heat generating component 64, which is the largest heat generating component, is mounted at a position farthest from the connector 5.
  • FIG. Phase-change cooler 92 is formed to extend from heat-generating component 64, which is the maximum heat-generating component, toward heat-generating component 65, which is the minimum heat-generating component.
  • the refrigerant of the phase change cooler 91 takes heat from the heat generating component 61, which is the largest heat generating component mounted at the farthest position from the connector 5, and then takes heat from the heat generating component 62 ⁇ heat generating component 63 in order. 5 to one end 91a.
  • the refrigerant in the phase change cooler 92 takes heat from the heat generating component 64, which is the largest heat generating component mounted at the farthest position from the connector 5, and then moves to the connector 5 while taking heat from the heat generating component 65. It flows to the near one end 92a.
  • the heat generation amounts of the plurality of heat-generating components 61 to 63 are not in the above-described relationship in which the heat generation amounts increase sequentially as the distance from the connector 5 increases, but for example, the reverse relationship (heat-generating component 61 ⁇ heat-generating component 62 ⁇ heat-generating component 63), the refrigerant in the phase change cooler 91 may not flow to the one end 91 a closer to the connector 5 .
  • the plurality of heat generating components 61 to 63 are arranged so that the heat generation amount increases as the distance from the connector 5 increases. They can flow to one end 92a near the connector 5 while taking away their heat. The same applies to the plurality of heat-generating components 64-65 and the phase change cooler 92 as well.
  • the phase-change cooler 9 of the second embodiment is provided in the housing 1 and formed to extend from the largest heat-generating component included in the plurality of heat-generating components 6 toward the smallest heat-generating component.
  • the in-vehicle electronic device 100 of the second embodiment includes a plurality of heat-generating components 6 having different heat generation amounts, the heat diffusion capability of the phase-change cooler 9 can be maximized and a plurality of heat-generating components can be generated.
  • the heat of each component 6 can be spread by a minimal phase change cooler 9 .
  • the heat diffusion capability of the phase-change cooler 9 can be maximized, and high heat dissipation performance can be achieved. can be secured.
  • FIG. 4 is an explanatory diagram of the in-vehicle electronic device 100 of the third embodiment. Note that FIG. 4 is a diagram corresponding to FIG.
  • the phase change cooler 9 is integrally provided inside the housing 1 .
  • the phase change cooler 9 of the third embodiment is integrally provided inside the top plate portion 21 of the cover 2 .
  • the phase change cooler 9 of Embodiment 3 may be made of a material having the same coefficient of linear expansion as the cover 2, preferably the same material as the cover 2.
  • the in-vehicle electronic device 100 of Embodiment 3 there is no joint between the phase change cooler 9 and the housing 1 .
  • the in-vehicle electronic device 100 of the third embodiment it is possible to suppress deterioration in heat dissipation performance due to thermal resistance at the junction between the phase change cooler 9 and the housing 1 .
  • the vehicle-mounted electronic device 100 is used in a harsher environment (in particular, vibration, temperature, etc.) than general-purpose or industrial-use electronic devices. It's not easy.
  • the mechanical reliability can be improved.
  • FIG. 5 is a perspective view showing the external configuration of the in-vehicle electronic device 100 of Embodiment 4.
  • FIG. 6 is a perspective view showing a cross section of the in-vehicle electronic device 100 taken along line BB' shown in FIG. FIG.
  • FIG. 7 is an explanatory diagram of the arrangement structure of the cover 2 having the first top plate portion 21a and the second top plate portion 21b and the low-height heat-generating component 66 and the high-height heat-generating component 67.
  • FIG. 8 is an explanatory diagram of an arrangement structure of the cover 2 that does not have the first top plate portion 21a and the second top plate portion 21b, the low-height heat-generating component 66, and the high-height heat-generating component 67.
  • FIG. 6 the illustration of the hatching of a cross section is abbreviate
  • the top plate portion 21 of the cover 2 may have an uneven shape.
  • the top plate portion 21 of the cover 2 of the fourth embodiment includes a first top plate portion 21a separated from the circuit board 4 by a first distance D1, and a circuit gap by a second distance D2 longer than the first distance D1. and a second top plate portion 21 b separated from the substrate 4 .
  • the phase change cooler 9 of Embodiment 4 is integrally provided inside the first top plate portion 21a and the second top plate portion 21b.
  • the length of the gap G between the heat generating component 6 and the top plate portion 21 can be appropriately designed according to the height of the heat generating component 6 from the circuit board 4. can be done.
  • the height of the heat-generating component 6 from the circuit board 4 is the height of the heat-generating component 6 with respect to the surface of the circuit board 4 on which the heat-generating component 6 is mounted.
  • the heat generating component 6 is separated from the circuit board 4 as shown in FIG. It may be composed of a plurality of heat-generating components 6 having different heights.
  • the multiple heat generating components 6 include a low heat generating component 66 having a low height from the circuit board 4 and a high heat generating component 67 having a high height from the circuit board 4 .
  • the low-profile heat-generating component 66 is arranged between the first top plate portion 21 a and the circuit board 4 in the board thickness direction of the circuit board 4 .
  • the tall heat-generating component 67 is arranged between the second top plate portion 21b and the circuit board 4 in the board thickness direction of the circuit board 4 .
  • the length of the gap G between each of the low-height heat-generating component 66 and the high-height heat-generating component 67 and the top plate portion 21 can be set to an appropriate length. It is possible to suppress an increase in the thermal resistance of the gap G between.
  • the gap G′ between the low-profile heat-generating component 66 and the top plate portion 21 is a heat transfer member. 8 must be thickened and filled. This is because it is not easy to provide a heat radiation pedestal on the cover 2 having the phase change cooler 9 .
  • Thermal resistance of gap G length of gap G/(thermal conductivity of heat transfer member 8 ⁇ area)
  • the cover 2 has the first top plate portion 21a and the second top plate portion 21b, and the low-height heat-generating component 66 and the high-height heat-generating component 67 are respectively connected to the top plate portion 21.
  • the in-vehicle electronic device 100 of the fourth embodiment includes a plurality of heat-generating components 6 having different heights from the circuit board 4, it is possible to suppress an increase in the thermal resistance of the gap G. Therefore, the heat diffusion capability of the phase change cooler 9 can be maximized, and the heat of each of the plurality of heat generating components 6 can be diffused by the phase change cooler 9 .
  • the heat diffusion capability of the phase-change cooler 9 can be maximized. , can ensure high heat dissipation performance.
  • FIG. 9 is an explanatory diagram of an example of the in-vehicle electronic device 100 according to the fifth embodiment.
  • FIG. 10 is an explanatory diagram of another example of the in-vehicle electronic device 100 of the fifth embodiment. 9 and 10 are diagrams corresponding to FIG.
  • the circuit board 4 is a circuit board that can be mounted on both sides.
  • the connector 5 is an electronic component whose height from the circuit board 4 is higher than that of the heat-generating component 6 .
  • the heat-generating component 6 is mounted on the surface 4d of the circuit board 4 opposite to the surface 4c on which the connector 5 is mounted.
  • the phase change cooler 9 is provided on the top plate portion 21 of the cover 2 facing the surface 4d of the circuit board 4 on which the heat generating component 6 is mounted.
  • the electronic components 7 mounted on the circuit board 4 other than the connector 5 and the heat-generating component 6 may include a low-profile electronic component 71 and a high-profile electronic component 72 .
  • the low-profile electronic component 71 is the electronic component 7 whose height from the circuit board 4 is equal to or less than the heat-generating component 6 .
  • the low-profile electronic component 71 is mounted on the surface 4d of the circuit board 4 on which the heat-generating component 6 is mounted.
  • a tall electronic component 72 is an electronic component 7 whose height from the circuit board 4 is higher than that of the heat-generating component 6 .
  • the tall electronic component 72 is mounted on the surface 4c of the circuit board 4 on which the connector 5 is mounted.
  • the tall electronic component 72 is, for example, an aluminum electrolytic capacitor.
  • the cover 2 of Embodiment 5 As shown in FIGS. need not be stepped. That is, as shown in FIG. 9, the cover 2 of the fifth embodiment has a top plate portion 21 in a flat plate shape from the second side plate portion 22b to the first side plate portion 22a beyond the heat-generating component 6 and the connector 5.
  • the vehicle-mounted electronic device 100 of the fifth embodiment can expand the phase-change cooler 9 extending from the heat-generating component 6 toward the connector 5 along the direction in which the phase-change cooler 9 extends.
  • the phase change cooler 9 can be enlarged so that the distance L1 from the phase change cooler 9 to the outer surface of the first side plate portion 22a is as short as possible.
  • the heat-generating component 6 can be mounted at a position close to the end surface. Therefore, in the on-vehicle electronic device 100 of Embodiment 5, the area of the phase change cooler 9 can be increased, so that the heat dissipation area can be increased. Furthermore, the vehicle-mounted electronic device 100 of Embodiment 5 can increase the temperature difference along the extending direction of the phase-change cooler 9, and can further maintain the high heat diffusion capability of the phase-change cooler 9. . Therefore, in the in-vehicle electronic device 100 of Embodiment 5, the heat diffusion capability of the phase change cooler 9 can be further extracted, and high heat radiation performance can be further ensured.
  • the phase change cooler 9 is integrally provided inside the top plate portion 21 of the cover 2.
  • the container 9 may be joined to the inner surface of the top plate portion 21 .
  • FIG. 11 is an explanatory diagram of the in-vehicle electronic device 100 of the sixth embodiment. Note that FIG. 11 is a diagram corresponding to FIG.
  • the circuit board 4 is a circuit board that can be mounted on both sides.
  • the circuit board 4 includes thermal vias 41 penetrating in the thickness direction of the circuit board 4 inside the region where the heat-generating component 6 is mounted.
  • the phase change cooler 9 is composed of a first phase change cooler 93 and a second phase change cooler 94 . Each of the first phase change cooler 93 and the second phase change cooler 94 is formed to extend from the heat generating component 6 mounted on the circuit board 4 toward the connector 5 .
  • the first phase change cooler 93 is the phase change cooler 9 provided in the housing 1 .
  • the first phase change cooler 93 may be provided on the top plate portion 21 of the cover 2 facing the surface 4d of the circuit board 4 on which the heat generating component 6 is mounted, as in the fifth embodiment.
  • the second phase change cooler 94 is provided on the surface 4 c of the circuit board 4 opposite to the surface 4 d of the circuit board 4 on which the heat generating component 6 is mounted, and contacts the thermal via 41 .
  • the second phase change cooler 94 may be bonded to the surface 4c of the circuit board 4 so as to cover the thermal vias 41 .
  • the second phase change cooler 94 and the surface 4c of the circuit board 4 may be joined using lead-free solder, a conductive adhesive, or the like.
  • the heat-generating component 6 may be mounted on the surface 4d of the circuit board 4 opposite to the surface 4c on which the connector 5 is mounted, as in the fifth embodiment. .
  • the first phase change cooler 93 can diffuse the heat of the heat-generating component 6 as in the fifth embodiment.
  • the second phase change cooler 94 can diffuse the heat transferred from the heat-generating component 6 to the circuit board 4 in the same manner as the first phase change cooler 93 . Therefore, in the in-vehicle electronic device 100 of the sixth embodiment, the heat dissipation performance can be greatly improved as compared with the fifth embodiment.
  • the first phase change cooler 93 is integrally provided inside the top plate portion 21 of the cover 2.
  • a variable cooler 93 may be joined to the inner surface of the top plate portion 21 .
  • FIG. 12 is an explanatory diagram of an example of the in-vehicle electronic device 100 according to the seventh embodiment.
  • the phase change cooler 9 is not provided in the housing 1 including the cover 2, but is provided only in the circuit board 4.
  • the circuit board 4 is a circuit board that can be mounted on both sides.
  • the circuit board 4 includes thermal vias 41 penetrating in the thickness direction of the circuit board 4 inside the region where the heat-generating component 6 is mounted.
  • the phase change cooler 9 is provided on the surface 4c of the circuit board 4 opposite to the surface 4d of the circuit board 4 on which the heat generating component 6 is mounted, and contacts the thermal via 41. As shown in FIG. Phase change cooler 9 is formed to extend from heat generating component 6 mounted on circuit board 4 toward connector 5 .
  • the heat-generating component 6 may be in contact with the case 3 via the heat transfer member 8 .
  • the heat-generating component 6 may be mounted on the surface 4c of the circuit board 4 on which the connector 5 is mounted.
  • the heat-generating component 6 may be in contact with the top plate portion 21 of the cover 2 via the heat transfer member 8 .
  • the phase change cooler 9 can be introduced. high heat dissipation performance can be ensured by utilizing the heat diffusion capability of the phase change cooler 9 .
  • the present invention is not limited to the above-described embodiments, and includes various modifications.
  • the above embodiments have been described in detail in order to explain the present invention in an easy-to-understand manner, and are not necessarily limited to those having all the configurations described.
  • it is possible to replace part of the configuration of one embodiment with the configuration of another embodiment and it is also possible to add the configuration of another embodiment to the configuration of one embodiment.

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Abstract

The present invention provides an on-vehicle electronic device capable of maximizing the heat diffusion ability of a phase change cooler and ensuring high heat dissipation performance. This on-vehicle electronic device 100 is provided with a heating component 6 having a surface 6a mounted to a circuit board 4 and another surface 6b on the opposite side from the surface 6a in the thickness direction of the circuit board 4, a connector 5 mounted to the circuit board 4 and to be connected to an external device, a housing 1 containing the circuit board 4 to which the heating component 6 and the connector 5 are mounted, a phase change cooler 9 extending from the heating component 6 mounted to the circuit board 4 toward the connector 5 and transferring heat by a phase change of a coolant, and a heat transfer member 8 in contact with the other surface 6b of the heating component 6 and the housing 1 or the phase change cooler 9.

Description

車載用電子装置In-vehicle electronic equipment
　本発明は、車載用電子装置に関する。 The present invention relates to an in-vehicle electronic device.
　コンピュータ等の電子装置において、ＣＰＵ等の発熱部品を冷却する手段として、例えば、ベーパーチャンバ又はヒートパイプ等の相変化冷却器が使用されている。この種の相変化冷却器は、特許文献１に記載されるような動力を用いることなく、液相冷媒を気相に相変化させることにより発熱部品の熱を奪う蒸発部と、気相冷媒を液相に相変化させることにより気相冷媒から空気中に放熱する凝縮部とを含む冷却器である。 In electronic devices such as computers, phase change coolers such as vapor chambers or heat pipes are used as means for cooling heat-generating components such as CPUs. This type of phase-change cooler has an evaporator that takes heat from heat-generating parts by changing the phase of a liquid-phase refrigerant to a gas phase without using power as described in Patent Document 1, and a vapor-phase refrigerant. and a condensing section for releasing heat from the gaseous refrigerant into the air by changing the phase to the liquid phase.
　特許文献２には、回路基板に実装された発熱部品の熱を筐体へ逃がすための放熱構造として、ヒートパイプを用いた放熱構造を有する携帯型のコンピュータが記載されている。特許文献２のコンピュータは、発熱部品が受熱板に接続され、受熱板がヒートパイプに接続され、ヒートパイプがコネクタに接続され、コネクタがヒンジに接続され、ヒンジがケースに接続されることによって、発熱部品の熱を筐体へ逃がすための放熱構造を実現している。 Patent Document 2 describes a portable computer having a heat dissipation structure using a heat pipe as a heat dissipation structure for releasing heat from heat-generating components mounted on a circuit board to a housing. In the computer of Patent Document 2, heat-generating components are connected to a heat receiving plate, the heat receiving plate is connected to a heat pipe, the heat pipe is connected to a connector, the connector is connected to a hinge, and the hinge is connected to a case. A heat dissipation structure is realized to release the heat of the heat-generating parts to the housing.
特開２０１７－９２０７４号公報JP 2017-92074 A 特開平１１－１０２２３５号公報JP-A-11-102235
　しかしながら、特許文献２の放熱構造は、その構成要素の数が多いので、構成要素同士の接続部分において熱抵抗が増加してしまう。特に、特許文献２のコンピュータよりも高い放熱性能が要求される車載用電子装置では、特許文献２の放熱構造を採用しても、放熱性能の要求に応えることが難しい。 However, since the heat dissipation structure of Patent Document 2 has a large number of components, the thermal resistance increases at the connecting portions between the components. In particular, in a vehicle electronic device that requires higher heat dissipation performance than the computer of Patent Document 2, even if the heat dissipation structure of Patent Document 2 is adopted, it is difficult to meet the demand for heat dissipation performance.
　本発明は、上記に鑑みてなされたものであり、相変化冷却器の熱拡散能力を最大限に引き出し、高い放熱性能を確保することが可能な車載用電子装置を提供することを目的とする。 SUMMARY OF THE INVENTION It is an object of the present invention to provide an in-vehicle electronic device capable of maximizing the heat diffusion capability of a phase change cooler and ensuring high heat dissipation performance. .
　上記課題を解決するために、本発明の車載用電子装置は、回路基板に実装される一方の面と、前記回路基板の板厚方向において前記一方の面とは反対側にある他方の面とを有する発熱部品と、前記回路基板に実装され、外部装置に接続されるコネクタと、前記発熱部品及び前記コネクタが実装された前記回路基板を収容する筐体と、前記回路基板に実装された前記発熱部品から前記コネクタに向かって延び、冷媒の相変化を伴って熱を輸送する相変化冷却器と、前記発熱部品の前記他方の面と、前記筐体又は前記相変化冷却器とに接触する熱伝達部材と、を備える。 In order to solve the above-mentioned problems, the vehicle electronic device of the present invention has one surface mounted on a circuit board and the other surface opposite to the one surface in the board thickness direction of the circuit board. a connector mounted on the circuit board and connected to an external device; a housing for housing the circuit board on which the heat generating component and the connector are mounted; and the A phase-change cooler that extends from the heat-generating component toward the connector and transfers heat with a phase change of a refrigerant, and contacts the other surface of the heat-generating component and the housing or the phase-change cooler. and a heat transfer member.
　本発明によれば、相変化冷却器の熱拡散能力を最大限に引き出し、高い放熱性能を確保することが可能な車載用電子装置を提供することができる。
　上記以外の課題、構成および効果は、以下の実施形態の説明により明らかにされる。 ADVANTAGE OF THE INVENTION According to this invention, the heat-diffusion capability of a phase-change cooler can be maximized, and the vehicle-mounted electronic device which can ensure high heat dissipation performance can be provided.
Problems, configurations, and effects other than those described above will be clarified by the following description of the embodiments.
実施形態１の車載用電子装置の構成を示す分解斜視図。1 is an exploded perspective view showing the configuration of the in-vehicle electronic device of Embodiment 1. FIG. 図１に示すＡ－Ａ’線による車載用電子装置の断面を模式的に示す説明図。FIG. 2 is an explanatory view schematically showing a cross section of the in-vehicle electronic device taken along line A-A′ shown in FIG. 1; 実施形態２の車載用電子装置の説明図。FIG. 4 is an explanatory diagram of an in-vehicle electronic device according to a second embodiment; 実施形態３の車載用電子装置の説明図。FIG. 10 is an explanatory diagram of an in-vehicle electronic device according to Embodiment 3; 実施形態４の車載用電子装置の外観構成を示す斜視図。FIG. 11 is a perspective view showing an external configuration of an in-vehicle electronic device according to Embodiment 4; 図５に示すＢ－Ｂ’線による車載用電子装置の断面を示す斜視図。FIG. 6 is a perspective view showing a cross section of the in-vehicle electronic device taken along line B-B' shown in FIG. 5; 第１天板部及び第２天板部を有するカバーと低背発熱部品及び高背発熱部品との配置構造についての説明図。FIG. 5 is an explanatory diagram of an arrangement structure of a cover having a first top plate portion and a second top plate portion, and a low-height heat-generating component and a high-height heat-generating component; 第１天板部及び第２天板部を有しないカバーと低背発熱部品及び高背発熱部品との配置構造についての説明図。FIG. 5 is an explanatory diagram of an arrangement structure of a cover that does not have a first top plate portion and a second top plate portion, and a low-height heat-generating component and a high-height heat-generating component; 実施形態５の車載用電子装置の一例についての説明図。FIG. 11 is an explanatory diagram of an example of an in-vehicle electronic device according to Embodiment 5; 実施形態５の車載用電子装置の他の一例についての説明図。FIG. 11 is an explanatory diagram of another example of the in-vehicle electronic device of Embodiment 5; 実施形態６の車載用電子装置の説明図。FIG. 11 is an explanatory diagram of an in-vehicle electronic device according to Embodiment 6; 実施形態７の車載用電子装置の一例についての説明図。FIG. 11 is an explanatory diagram of an example of an in-vehicle electronic device according to a seventh embodiment; 実施形態７の車載用電子装置の他の一例についての説明図。FIG. 12 is an explanatory diagram of another example of the in-vehicle electronic device of Embodiment 7;
　以下、本発明の実施形態について図面を用いて説明する。なお、各実施形態において同一の符号を付された構成は、特に言及しない限り、各実施形態において同様の機能を有し、その説明を省略する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. It should be noted that components denoted by the same reference numerals in each embodiment have the same functions in each embodiment unless otherwise specified, and the description thereof will be omitted.
［実施形態１］
　図１～図２を用いて、実施形態１の車載用電子装置１００について説明する。
　図１は、実施形態１の車載用電子装置１００の構成を示す分解斜視図である。図２は、図１に示すＡ－Ａ’線による車載用電子装置１００の断面を模式的に示す説明図である。 [Embodiment 1]
An in-vehicle electronic device 100 according to the first embodiment will be described with reference to FIGS. 1 and 2. FIG.
FIG. 1 is an exploded perspective view showing the configuration of an in-vehicle electronic device 100 of Embodiment 1. FIG. FIG. 2 is an explanatory view schematically showing a cross section of the in-vehicle electronic device 100 taken along line AA' shown in FIG.
　車載用電子装置１００は、ＥＣＵ等の、車両に搭載される電子装置である。車載用電子装置１００は、筐体１と、筐体１に収容されるプリント回路基板等の回路基板４と、回路基板４に実装されるコネクタ５、発熱部品６及び電子部品７と、発熱部品６に接触する熱伝達部材８と、発熱部品６を放熱するための相変化冷却器９とを備える。 The in-vehicle electronic device 100 is an electronic device, such as an ECU, mounted in a vehicle. The in-vehicle electronic device 100 includes a housing 1, a circuit board 4 such as a printed circuit board housed in the housing 1, a connector 5 mounted on the circuit board 4, a heat generating component 6 and an electronic component 7, and a heat generating component. 6 and a phase change cooler 9 for dissipating heat from the heat generating component 6 .
　筐体１は、コネクタ５、発熱部品６及び電子部品７が実装された回路基板４を収容する箱状の部材である。筐体１は、アルミ、銅若しくはステンレス等の金属材料、又は、樹脂材料によって形成される。筐体１は、箱状のカバー２と、カバー２よりも底の浅い箱状のケース３（又は板状のベース）とを含む。 The housing 1 is a box-shaped member that accommodates the circuit board 4 on which the connector 5, the heat-generating component 6, and the electronic component 7 are mounted. The housing 1 is made of a metal material such as aluminum, copper, or stainless steel, or a resin material. The housing 1 includes a box-shaped cover 2 and a box-shaped case 3 (or a plate-shaped base) whose bottom is shallower than the cover 2 .
　カバー２は、回路基板４に実装された発熱部品６から回路基板４の板厚方向に離隔した状態で回路基板４を覆う。カバー２は、回路基板４の板厚方向に交差し回路基板４に対向する天板部２１と、天板部２１に連接して回路基板４の板厚方向に沿って延びる側板部２２とを有する。 The cover 2 covers the circuit board 4 while being separated from the heat-generating components 6 mounted on the circuit board 4 in the thickness direction of the circuit board 4 . The cover 2 includes a top plate portion 21 that intersects the circuit board 4 in the thickness direction and faces the circuit board 4 , and side plate portions 22 that are connected to the top plate portion 21 and extend along the thickness direction of the circuit board 4 . have.
　図１に示すように、天板部２１の外表面には、放熱フィンが設けられていてもよい。図１及び図２に示すように、天板部２１のコネクタ５を覆う部分は、天板部２１の発熱部品６を覆う部分よりも、回路基板４の板厚方向における回路基板４からの距離が長くなるように形成されてもよい。側板部２２は、回路基板４に沿った方向（回路基板４の面内方向）における回路基板４の一方の端部４ａに隣接する第１側板部２２ａと、回路基板４に沿った方向における回路基板４の他方の端部４ｂに隣接する第２側板部２２ｂとを含む。第１側板部２２ａは、回路基板４に実装されたコネクタ５を外部に露出させる開口部２３を有する側板部２２であってもよい。第２側板部２２ｂは、第１側板部２２ａと並行な側板部２２であってもよい。 As shown in FIG. 1, the outer surface of the top plate portion 21 may be provided with heat radiating fins. As shown in FIGS. 1 and 2, the portion of the top plate 21 that covers the connector 5 is farther away from the circuit board 4 in the thickness direction of the circuit board 4 than the portion of the top plate 21 that covers the heat generating component 6 is. may be formed to be longer. The side plate portion 22 includes a first side plate portion 22a adjacent to one end portion 4a of the circuit board 4 in the direction along the circuit board 4 (the in-plane direction of the circuit board 4) and a circuit board portion 22a in the direction along the circuit board 4. a second side plate portion 22b adjacent to the other end portion 4b of the substrate 4; The first side plate portion 22a may be a side plate portion 22 having an opening 23 for exposing the connector 5 mounted on the circuit board 4 to the outside. The second side plate portion 22b may be the side plate portion 22 parallel to the first side plate portion 22a.
　なお、側板部２２及び開口部２３は、カバー２ではなくケース３に設けられたり、カバー２及びケース３のそれぞれに設けられたりしてもよい。すなわち、側板部２２及び開口部２３は、筐体１の側板部及び開口部を構成する部分であればよい。天板部２１も、筐体１の天板部を構成する部分であればよい。 Note that the side plate portion 22 and the opening portion 23 may be provided in the case 3 instead of the cover 2, or may be provided in each of the cover 2 and the case 3. In other words, the side plate portion 22 and the opening portion 23 may be portions that constitute the side plate portion and the opening portion of the housing 1 . The top plate portion 21 may also be any part as long as it constitutes the top plate portion of the housing 1 .
　コネクタ５は、回路基板４に実装され、車載用電子装置１００の外部装置に接続されるコネクタである。コネクタ５には、外部装置と通信するための信号の伝送経路を構成するワイヤを束ねたハーネス５１（図３を参照）が接続されてもよい。コネクタ５は、図１に示すように、少なくとも、回路基板４に沿った方向における回路基板４の一方の端部４ａに実装される。すなわち、コネクタ５は、矩形状の回路基板４において互いに並行する一対の辺部分の一方に実装される。 The connector 5 is a connector mounted on the circuit board 4 and connected to an external device of the in-vehicle electronic device 100 . The connector 5 may be connected to a harness 51 (see FIG. 3) in which wires forming a signal transmission path for communicating with an external device are bundled. The connector 5 is mounted at least on one end 4a of the circuit board 4 in the direction along the circuit board 4, as shown in FIG. That is, the connector 5 is mounted on one of a pair of parallel sides of the rectangular circuit board 4 .
　発熱部品６は、回路基板４に実装される電子部品のうち、発熱量が比較的大きい電子部品（高発熱部品）である。発熱部品６は、通電時のジャンクション温度（Ｔｊ）が、回路基板４に実装される他の電子部品よりも高温になる電子部品である。発熱部品６は、最大定格におけるジャンクション温度（Ｔｊｍａｘ）と通電時のジャンクション温度（Ｔｊ）との差が、他の電子部品よりも小さい電子部品である。発熱部品６は、ＣＰＵ、ＭＰＵ又はＧＰＵ等のプロセッサを含む演算処理装置によって構成されてもよい。発熱部品６は、板状に形成され、図２に示すように、回路基板４に実装される一方の面６ａと、回路基板４の板厚方向において一方の面６ａとは反対側にある他方の面６ｂとを有する。発熱部品６は、図１に示すように、少なくとも、回路基板４に沿った方向における回路基板４の他方の端部４ｂに実装される。すなわち、発熱部品６は、矩形状の回路基板４において互いに並行する一対の辺部分の他方に実装される。 The heat generating component 6 is an electronic component that generates a relatively large amount of heat (high heat generating component) among the electronic components mounted on the circuit board 4 . The heat-generating component 6 is an electronic component whose junction temperature (Tj) when energized is higher than that of other electronic components mounted on the circuit board 4 . The heat-generating component 6 is an electronic component in which the difference between the junction temperature (Tjmax) at the maximum rating and the junction temperature (Tj) during energization is smaller than other electronic components. The heat-generating component 6 may be configured by an arithmetic processing device including a processor such as a CPU, MPU, or GPU. The heat-generating component 6 is formed in a plate shape, and as shown in FIG. and a surface 6b of The heat-generating component 6 is mounted at least on the other end 4b of the circuit board 4 in the direction along the circuit board 4, as shown in FIG. That is, the heat-generating component 6 is mounted on the other of a pair of parallel sides of the rectangular circuit board 4 .
　電子部品７は、コネクタ５及び発熱部品６以外の回路基板４に実装される電子部品である。電子部品７は、発熱部品６よりも発熱量が小さい電子部品である。電子部品７は、例えば、通信ＩＣ等のインターフェース回路、又は、電源ＩＣ等の電源回路等を含む電子部品によって構成されてもよい。 The electronic component 7 is an electronic component mounted on the circuit board 4 other than the connector 5 and the heat generating component 6. The electronic component 7 is an electronic component that generates less heat than the heat-generating component 6 . The electronic component 7 may be configured by an electronic component including, for example, an interface circuit such as a communication IC, or a power supply circuit such as a power supply IC.
　熱伝達部材８は、発熱部品６の他方の面６ｂと、筐体１又は相変化冷却器９とに接触する熱伝達部材である。熱伝達部材８は、発熱部品６の熱を、筐体１又は相変化冷却器９へ逃がす部材である。熱伝達部材８は、図２に示すように、発熱部品６の他方の面６ｂと相変化冷却器９との間に配置され、発熱部品６の他方の面６ｂと相変化冷却器９とに接触する。熱伝達部材８は、例えば、放熱グリス又は放熱シート等によって構成されてもよい。熱伝達部材８は、できるだけ熱伝導率の高い材料によって形成されることが好ましい。しかし、熱伝導率が高い熱伝達部材の多くは、硬い材料によって形成されており、発熱部品６と回路基板４との接合部の信頼性に影響を及ぼす。本実施形態の熱伝達部材８は、発熱部品６と回路基板４との接合部の信頼性に影響を与えないレベルの硬度を有する材料によって形成されることが好ましい。当該信頼性及び熱抵抗の観点から、熱伝達部材８は、発熱部品６及び回路基板４の熱変形に追従して変形可能な材料によって形成されることが好ましい。 The heat transfer member 8 is a heat transfer member that contacts the other surface 6 b of the heat generating component 6 and the housing 1 or the phase change cooler 9 . The heat transfer member 8 is a member that releases the heat of the heat generating component 6 to the housing 1 or the phase change cooler 9 . As shown in FIG. 2, the heat transfer member 8 is arranged between the other surface 6b of the heat-generating component 6 and the phase-change cooler 9, and is positioned between the other surface 6b of the heat-generating component 6 and the phase-change cooler 9. Contact. The heat transfer member 8 may be composed of, for example, heat dissipating grease or a heat dissipating sheet. It is preferable that the heat transfer member 8 be made of a material having as high a thermal conductivity as possible. However, most heat transfer members with high thermal conductivity are made of hard materials, which affects the reliability of the joint between the heat generating component 6 and the circuit board 4 . The heat transfer member 8 of the present embodiment is preferably made of a material having a level of hardness that does not affect the reliability of the joint between the heat-generating component 6 and the circuit board 4 . From the viewpoint of reliability and heat resistance, the heat transfer member 8 is preferably made of a material that can deform following thermal deformation of the heat generating component 6 and the circuit board 4 .
　相変化冷却器９は、冷媒の相変化を伴って熱を輸送する冷却器である。相変化冷却器９は、動力を用いることなく、液相冷媒を気相に相変化させることにより発熱部品６の熱を奪う蒸発部と、気相冷媒を液相に相変化させることにより気相冷媒から空気中に放熱する凝縮部とを含む冷却器である。相変化冷却器９は、例えば、ベーパーチャンバ又はヒートパイプ等によって構成されてもよい。 The phase change cooler 9 is a cooler that transports heat with a phase change of the refrigerant. The phase-change cooler 9 includes an evaporator that absorbs heat from the heat-generating component 6 by changing the phase of the liquid-phase refrigerant to the gas phase without using power, and an evaporator that removes heat from the heat-generating component 6 by changing the phase of the liquid-phase refrigerant to the gas phase. and a condenser for releasing heat from the refrigerant to the air. The phase change cooler 9 may be configured by, for example, a vapor chamber or a heat pipe.
　相変化冷却器９は、筐体１に設けられる。相変化冷却器９は、図２に示すように、筐体１のカバー２の天板部２１の内表面に接合される。相変化冷却器９は、発熱部品６の他方の面６ｂに接触する熱伝達部材８と天板部２１との間に配置され、熱伝達部材８と天板部２１とに接触する。相変化冷却器９は、図１に示すように、回路基板４に実装された発熱部品６からコネクタ５に向かって延びるように形成される。相変化冷却器９は、回路基板４に沿った方向における回路基板４の他方の端部４ｂから一方の端部４ａに向かって延びるように形成される。相変化冷却器９は、回路基板４に沿った方向においてコネクタ５に近い一方の端部９ａと、回路基板４に沿った方向においてコネクタ５から離隔した他方の端部９ｂとを有する。相変化冷却器９の他方の端部９ｂは、発熱部品６に近い端部であり得る。相変化冷却器９は、板状に形成されてもよい。相変化冷却器９は、発熱部品６の熱を、熱伝達部材８を介して奪い、相変化冷却器９の全体に亘って拡散させると共に、天板部２１に伝えて外部に放出させる。 The phase change cooler 9 is provided in the housing 1. The phase change cooler 9 is joined to the inner surface of the top plate portion 21 of the cover 2 of the housing 1, as shown in FIG. The phase-change cooler 9 is arranged between the heat transfer member 8 contacting the other surface 6 b of the heat-generating component 6 and the top plate portion 21 and contacts the heat transfer member 8 and the top plate portion 21 . Phase change cooler 9 is formed to extend from heat generating component 6 mounted on circuit board 4 toward connector 5, as shown in FIG. Phase change cooler 9 is formed to extend from the other end 4b of circuit board 4 in the direction along circuit board 4 toward one end 4a. Phase-change cooler 9 has one end 9 a closer to connector 5 in the direction along circuit board 4 and the other end 9 b remote from connector 5 in the direction along circuit board 4 . The other end 9 b of phase change cooler 9 may be the end closer to heat generating component 6 . The phase change cooler 9 may be formed in a plate shape. The phase-change cooler 9 absorbs heat from the heat-generating component 6 via the heat transfer member 8, diffuses the heat throughout the phase-change cooler 9, and transmits the heat to the top plate portion 21 to release it to the outside.
　上記構成の車載用電子装置１００では、次のような放熱現象が生じる。発熱部品６の熱は、熱伝達部材８を介して相変化冷却器９へと伝わり、相変化冷却器９の他方の端部９ｂの内部の液相冷媒へと伝わる。この液相冷媒は、気相に相変化しつつ相変化冷却器９の一方の端部９ａへ流れる。気相に相変化した冷媒は、相変化冷却器９の一方の端部９ａへ到達すると放熱して液相に相変化する。液相に相変化した冷媒は、毛細管現象によって相変化冷却器９の他方の端部９ｂへ流れる。このように冷媒が相変化を伴って他方の端部９ｂと一方の端部９ａとの間を循環することによって、発熱部品６の熱が迅速に拡散して外部に放出され、発熱部品６の温度が低減される。 In the in-vehicle electronic device 100 configured as described above, the following heat dissipation phenomenon occurs. The heat of the heat generating component 6 is transferred to the phase change cooler 9 via the heat transfer member 8 and transferred to the liquid phase refrigerant inside the other end 9b of the phase change cooler 9 . This liquid-phase refrigerant flows to one end portion 9a of the phase-change cooler 9 while undergoing a phase change to a vapor phase. When the refrigerant that has undergone a phase change to gas phase reaches one end portion 9a of the phase change cooler 9, it releases heat and undergoes a phase change to a liquid phase. The refrigerant phase-changed to the liquid phase flows to the other end 9b of the phase-change cooler 9 by capillary action. As the refrigerant circulates between the other end portion 9b and the one end portion 9a with a phase change in this way, the heat of the heat-generating component 6 is rapidly diffused and released to the outside. temperature is reduced.
　上記の放熱現象は、相変化冷却器９が回路基板４に実装された発熱部品６からコネクタ５に向かって延びるように形成されることによって、発熱部品６が発熱する限りは滞りなく持続する。これは、以下に詳述するように、相変化冷却器９の特徴と回路基板４の温度分布の特徴を利用しているからである。 The heat dissipation phenomenon described above continues smoothly as long as the heat-generating component 6 generates heat by forming the phase-change cooler 9 so as to extend from the heat-generating component 6 mounted on the circuit board 4 toward the connector 5 . This is because the characteristics of the phase-change cooler 9 and the characteristics of the temperature distribution of the circuit board 4 are utilized, as will be described in detail below.
　相変化冷却器９は、内部に冷媒が封入されたヒートシンクであり、内表面の微小な温度差によって、冷媒が液相と気相との間の相変化を繰り返して、熱を広範囲に拡散させる。相変化冷却器９は、例えば、銅製又はアルミ製の放熱板と比べても桁違いに高い熱拡散能力を有する。この高い熱拡散能力により、相変化冷却器９は、発熱部品６の温度を迅速に低減することが可能である。相変化冷却器９の高い熱拡散能力を維持するために重要なことの１つは、相変化冷却器９の延びる方向に沿って温度差のある状態を維持することである。発熱部品６を備える車載用電子装置１００の場合、相変化冷却器９の熱容量を超える程の熱が相変化冷却器９に伝えられると、相変化冷却器９全体の温度分布が均一になる。相変化冷却器９は、内表面の微小な温度差による冷媒の相変化によって熱を拡散させることから、相変化冷却器９全体の温度分布が均一になると、その熱拡散能力が低下してしまう。よって、相変化冷却器９は、相変化冷却器９の延びる方向に沿って温度差のある状態を維持するよう構成することが重要である。 The phase-change cooler 9 is a heat sink in which a refrigerant is enclosed, and due to minute temperature differences on the inner surface, the refrigerant repeats phase changes between the liquid phase and the gas phase, thereby diffusing heat over a wide range. . The phase-change cooler 9 has a heat diffusion capacity that is much higher than that of, for example, a heat sink made of copper or aluminum. This high heat diffusion capability allows the phase change cooler 9 to quickly reduce the temperature of the heat generating component 6 . One of the important things to maintain the high heat diffusion capability of the phase change cooler 9 is to maintain a state of temperature difference along the extending direction of the phase change cooler 9 . In the case of the in-vehicle electronic device 100 including the heat-generating component 6, when heat is transferred to the phase-change cooler 9 so as to exceed the heat capacity of the phase-change cooler 9, the temperature distribution of the entire phase-change cooler 9 becomes uniform. Since the phase change cooler 9 diffuses heat by changing the phase of the refrigerant due to a minute temperature difference on the inner surface, if the temperature distribution of the entire phase change cooler 9 becomes uniform, its heat diffusion capacity will decrease. . Therefore, it is important to configure the phase change cooler 9 so as to maintain a state in which there is a temperature difference along the direction in which the phase change cooler 9 extends.
　一方、車載用電子装置１００の回路基板４では、電源回路等を含む電子部品７がコネクタ５から近い位置に実装されることが多く、演算処理装置等の発熱部品６がコネクタ５から離隔した位置に実装されることが多い。また、回路基板４の熱は、コネクタ５に接続されるハーネス５１によって放熱される。これらのことから、回路基板４の温度分布は、コネクタ５付近が低温となることが多い。 On the other hand, in the circuit board 4 of the in-vehicle electronic device 100, the electronic components 7 including the power supply circuit etc. are often mounted at a position close to the connector 5, and the heat generating components 6 such as the arithmetic processing unit are mounted at a position separated from the connector 5. is often implemented in Also, the heat of the circuit board 4 is radiated by the harness 51 connected to the connector 5 . For these reasons, the temperature distribution of the circuit board 4 is often low near the connector 5 .
　実施形態１の相変化冷却器９は、回路基板４に実装された発熱部品６からコネクタ５に向かって延びるように形成されるので、相変化冷却器９の延びる方向に沿って温度差のある状態を維持することができる。これにより、実施形態１の車載用電子装置１００では、相変化冷却器９の冷媒を他方の端部９ｂと一方の端部９ａとの間において効率よく循環させることができ、相変化冷却器９の高い熱拡散能力を維持することができる。よって、実施形態１の車載用電子装置１００では、相変化冷却器９の熱拡散能力を最大限に引き出し、高い放熱性能を確保することができる。 Since the phase change cooler 9 of Embodiment 1 is formed to extend from the heat generating component 6 mounted on the circuit board 4 toward the connector 5, there is a temperature difference along the direction in which the phase change cooler 9 extends. state can be maintained. As a result, in the in-vehicle electronic device 100 of the first embodiment, the coolant in the phase change cooler 9 can be efficiently circulated between the other end 9b and the one end 9a. can maintain a high heat diffusion capacity. Therefore, in the in-vehicle electronic device 100 of Embodiment 1, the heat diffusion capability of the phase change cooler 9 can be maximized, and high heat dissipation performance can be ensured.
　特に、実施形態１の相変化冷却器９は、発熱部品６が実装された回路基板４の他方の端部４ｂからコネクタ５が実装された回路基板４の一方の端部４ａに向かって延びるように形成される。すなわち、実施形態１の相変化冷却器９は、回路基板４の両端部４ａ，４ｂに亘るほどに相変化冷却器９を長尺に形成することができる。これにより、実施形態１の車載用電子装置１００は、相変化冷却器９の延びる方向に沿って温度差を大きくすることができ、相変化冷却器９の高い熱拡散能力を更に維持することができる。よって、実施形態１の車載用電子装置１００では、相変化冷却器９の熱拡散能力を更に引き出し、高い放熱性能を更に確保することができる。 In particular, the phase change cooler 9 of the first embodiment extends from the other end 4b of the circuit board 4 on which the heat generating component 6 is mounted toward the one end 4a of the circuit board 4 on which the connector 5 is mounted. formed in That is, the phase-change cooler 9 of the first embodiment can be formed long enough to extend over both ends 4 a and 4 b of the circuit board 4 . As a result, the in-vehicle electronic device 100 of the first embodiment can increase the temperature difference along the direction in which the phase change cooler 9 extends, and further maintain the high heat diffusion capability of the phase change cooler 9. can. Therefore, in the in-vehicle electronic device 100 of Embodiment 1, the heat diffusion capability of the phase-change cooler 9 can be further extracted, and high heat radiation performance can be further ensured.
［実施形態２］
　図３を用いて、実施形態２の車載用電子装置１００について説明する。実施形態２の車載用電子装置１００において、従前の実施形態と同様の構成及び動作については、説明を省略する。
　図３は、実施形態２の車載用電子装置１００の説明図である。 [Embodiment 2]
A vehicle-mounted electronic device 100 according to the second embodiment will be described with reference to FIG. In the in-vehicle electronic device 100 of the second embodiment, descriptions of the same configurations and operations as those of the previous embodiments are omitted.
FIG. 3 is an explanatory diagram of the in-vehicle electronic device 100 of the second embodiment.
　実施形態２の車載用電子装置１００では、１つの相変化冷却器９によって複数の発熱部品６の熱を拡散させる。具体的には、実施形態２の発熱部品６は、発熱量に差がある複数の発熱部品６によって構成される。複数の発熱部品６は、発熱量が最も大きい最大発熱部品と、発熱量が最も小さい最小発熱部品とを含む。最大発熱部品は、回路基板４に沿った方向において最小発熱部品よりもコネクタ５から離隔した位置に実装される。実施形態２の熱伝達部材８は、複数の発熱部品６のそれぞれの他方の面６ｂに接触する複数の熱伝達部材８によって構成される。実施形態２の相変化冷却器９は、最大発熱部品から最小発熱部品に向かって延びる。 In the in-vehicle electronic device 100 of the second embodiment, one phase change cooler 9 diffuses the heat of a plurality of heat-generating components 6 . Specifically, the heat-generating component 6 of the second embodiment is composed of a plurality of heat-generating components 6 having different heat generation amounts. The plurality of heat-generating components 6 includes a maximum heat-generating component that generates the largest amount of heat and a minimum heat-generating component that generates the smallest amount of heat. The component that generates the maximum heat is mounted at a position that is farther away from the connector 5 in the direction along the circuit board 4 than the component that generates the minimum heat. The heat transfer member 8 of the second embodiment is composed of a plurality of heat transfer members 8 in contact with the other surfaces 6b of the plurality of heat generating components 6, respectively. The phase change cooler 9 of Embodiment 2 extends from the maximum heat generating component to the minimum heat generating component.
　図３の例では、図中右側の相変化冷却器９１によって複数の発熱部品６１～６３の熱を拡散させる。発熱部品６１～６３における発熱量の大小関係は、発熱部品６１＞発熱部品６２＞発熱部品６３という関係になっている。複数の発熱部品６１～６３のうち、発熱部品６１は最大発熱部品であり、発熱部品６３は最小発熱部品である。最大発熱部品である発熱部品６１は、コネクタ５から最も離隔した位置に実装される。発熱部品６１の次に発熱量が大きい発熱部品６２は、発熱部品６１よりもコネクタ５に近い位置に実装される。最小発熱部品である発熱部品６３は、コネクタ５から最も近い位置に実装される。すなわち、複数の発熱部品６１～６３は、コネクタ５から離隔するに従って発熱量が順次大きくなるように配置される。相変化冷却器９１は、最大発熱部品である発熱部品６１から最小発熱部品である発熱部品６３に向かって延びるように形成される。 In the example of FIG. 3, the phase change cooler 91 on the right side of the figure diffuses the heat of the plurality of heat-generating components 61-63. The heat generating components 61 to 63 have a relationship of magnitude of heat generation as follows: heat generating component 61>heat generating component 62>heat generating component 63. FIG. Among the plurality of heat-generating components 61 to 63, the heat-generating component 61 is the maximum heat-generating component, and the heat-generating component 63 is the minimum heat-generating component. A heat-generating component 61 that is the largest heat-generating component is mounted at a position farthest from the connector 5 . A heat-generating component 62 that generates the next largest amount of heat after the heat-generating component 61 is mounted at a position closer to the connector 5 than the heat-generating component 61 . A heat-generating component 63 that is the smallest heat-generating component is mounted at a position closest to the connector 5 . That is, the plurality of heat-generating components 61 to 63 are arranged so that the amount of heat generated increases as the distance from the connector 5 increases. Phase change cooler 91 is formed to extend from heat generating component 61, which is the maximum heat generating component, toward heat generating component 63, which is the minimum heat generating component.
　同様に、図３の例では、図中左側の相変化冷却器９２によって複数の発熱部品６４～６５の熱を拡散させる。発熱部品６４～６５における発熱量の大小関係は、発熱部品６４＞発熱部品６５という関係になっており、最大発熱部品である発熱部品６４がコネクタ５から最も離隔した位置に実装される。相変化冷却器９２は、最大発熱部品である発熱部品６４から最小発熱部品である発熱部品６５に向かって延びるように形成される。 Similarly, in the example of FIG. 3, the phase change cooler 92 on the left side of the figure diffuses the heat of the plurality of heat-generating components 64-65. The heat generating components 64 to 65 have a heat generating component 64>heat generating component 65, and the heat generating component 64, which is the largest heat generating component, is mounted at a position farthest from the connector 5. FIG. Phase-change cooler 92 is formed to extend from heat-generating component 64, which is the maximum heat-generating component, toward heat-generating component 65, which is the minimum heat-generating component.
　相変化冷却器９１の冷媒は、コネクタ５から最も離れた位置に実装された最大発熱部品である発熱部品６１の熱を奪った後、発熱部品６２→発熱部品６３の順に熱を奪いながら、コネクタ５に近い一方の端部９１ａへと流れていく。同様に、相変化冷却器９２の冷媒は、コネクタ５から最も離れた位置に実装された最大発熱部品である発熱部品６４の熱を奪った後、発熱部品６５の熱を奪いながら、コネクタ５に近い一方の端部９２ａへと流れていく。 The refrigerant of the phase change cooler 91 takes heat from the heat generating component 61, which is the largest heat generating component mounted at the farthest position from the connector 5, and then takes heat from the heat generating component 62→heat generating component 63 in order. 5 to one end 91a. Similarly, the refrigerant in the phase change cooler 92 takes heat from the heat generating component 64, which is the largest heat generating component mounted at the farthest position from the connector 5, and then moves to the connector 5 while taking heat from the heat generating component 65. It flows to the near one end 92a.
　ここで、複数の発熱部品６１～６３の発熱量が、コネクタ５から離隔するに従って発熱量が順次大きくなるような上記の関係ではなく、例えば逆の関係（発熱部品６１＜発熱部品６２＜発熱部品６３）である場合、相変化冷却器９１の冷媒がコネクタ５に近い一方の端部９１ａへと流れない可能性がある。本実施形態では、複数の発熱部品６１～６３が、コネクタ５から離隔するに従って発熱量が順次大きくなるように配置されるので、相変化冷却器９１の冷媒が、複数の発熱部品６１～６３のそれぞれの熱を奪いながらコネクタ５に近い一方の端部９２ａへと流れ得る。複数の発熱部品６４～６５及び相変化冷却器９２についても同様である。 Here, the heat generation amounts of the plurality of heat-generating components 61 to 63 are not in the above-described relationship in which the heat generation amounts increase sequentially as the distance from the connector 5 increases, but for example, the reverse relationship (heat-generating component 61<heat-generating component 62<heat-generating component 63), the refrigerant in the phase change cooler 91 may not flow to the one end 91 a closer to the connector 5 . In this embodiment, the plurality of heat generating components 61 to 63 are arranged so that the heat generation amount increases as the distance from the connector 5 increases. They can flow to one end 92a near the connector 5 while taking away their heat. The same applies to the plurality of heat-generating components 64-65 and the phase change cooler 92 as well.
　このように、実施形態２の相変化冷却器９は、筐体１に設けられ、複数の発熱部品６に含まれる最大発熱部品から最小発熱部品に向かって延びるように形成される。これにより、実施形態２の車載用電子装置１００では、発熱量に差がある複数の発熱部品６を備える場合であっても、相変化冷却器９の熱拡散能力を最大限引き出し、複数の発熱部品６のそれぞれの熱を最小限の相変化冷却器９によって拡散させることができる。よって、実施形態２の車載用電子装置１００では、発熱量に差がある複数の発熱部品６を備える場合であっても、相変化冷却器９の熱拡散能力を最大限引き出し、高い放熱性能を確保することができる。 Thus, the phase-change cooler 9 of the second embodiment is provided in the housing 1 and formed to extend from the largest heat-generating component included in the plurality of heat-generating components 6 toward the smallest heat-generating component. As a result, even when the in-vehicle electronic device 100 of the second embodiment includes a plurality of heat-generating components 6 having different heat generation amounts, the heat diffusion capability of the phase-change cooler 9 can be maximized and a plurality of heat-generating components can be generated. The heat of each component 6 can be spread by a minimal phase change cooler 9 . Therefore, in the vehicle-mounted electronic device 100 of the second embodiment, even when a plurality of heat-generating components 6 having different heat generation amounts are provided, the heat diffusion capability of the phase-change cooler 9 can be maximized, and high heat dissipation performance can be achieved. can be secured.
［実施形態３］
　図４を用いて、実施形態３の車載用電子装置１００について説明する。実施形態３の車載用電子装置１００において、従前の実施形態と同様の構成及び動作については、説明を省略する。
　図４は、実施形態３の車載用電子装置１００の説明図である。なお、図４は、図２に対応する図である。 [Embodiment 3]
A vehicle-mounted electronic device 100 according to the third embodiment will be described with reference to FIG. In the in-vehicle electronic device 100 of Embodiment 3, descriptions of the same configurations and operations as those of the previous embodiments are omitted.
FIG. 4 is an explanatory diagram of the in-vehicle electronic device 100 of the third embodiment. Note that FIG. 4 is a diagram corresponding to FIG.
　実施形態３の車載用電子装置１００では、相変化冷却器９が、筐体１の内部に一体的に設けられる。具体的には、実施形態３の相変化冷却器９は、カバー２の天板部２１の内部に一体的に設けられる。実施形態３の相変化冷却器９は、カバー２と同じ線膨張係数を有する材料、好ましくは、カバー２と同じ材料によって形成されてもよい。 In the in-vehicle electronic device 100 of Embodiment 3, the phase change cooler 9 is integrally provided inside the housing 1 . Specifically, the phase change cooler 9 of the third embodiment is integrally provided inside the top plate portion 21 of the cover 2 . The phase change cooler 9 of Embodiment 3 may be made of a material having the same coefficient of linear expansion as the cover 2, preferably the same material as the cover 2.
　これにより、実施形態３の車載用電子装置１００では、相変化冷却器９と筐体１との接合部が無くなる。この結果、実施形態３の車載用電子装置１００では、相変化冷却器９と筐体１との接合部における熱抵抗によって、放熱性能が低下することを抑制することができる。車載用電子装置１００は、一般用又は産業用の電子装置と比べて、使用される環境（特に振動や温度等の環境）が過酷であるので、接合部の機械的信頼性を確保することは容易ではない。実施形態３の車載用電子装置１００では、相変化冷却器９と筐体１との接合部が無くなるので、実施形態１のように相変化冷却器９を筐体１に接合する場合と比べて、機械的信頼性を向上させることができる。 Accordingly, in the in-vehicle electronic device 100 of Embodiment 3, there is no joint between the phase change cooler 9 and the housing 1 . As a result, in the in-vehicle electronic device 100 of the third embodiment, it is possible to suppress deterioration in heat dissipation performance due to thermal resistance at the junction between the phase change cooler 9 and the housing 1 . The vehicle-mounted electronic device 100 is used in a harsher environment (in particular, vibration, temperature, etc.) than general-purpose or industrial-use electronic devices. It's not easy. In the in-vehicle electronic device 100 of the third embodiment, since there is no joint between the phase change cooler 9 and the housing 1, compared to the case where the phase change cooler 9 is joined to the housing 1 as in the first embodiment, , the mechanical reliability can be improved.
［実施形態４］
　図５～図８を用いて、実施形態４の車載用電子装置１００について説明する。実施形態４の車載用電子装置１００において、従前の実施形態と同様の構成及び動作については、説明を省略する。
　図５は、実施形態４の車載用電子装置１００の外観構成を示す斜視図である。図６は、図５に示すＢ－Ｂ’線による車載用電子装置１００の断面を示す斜視図である。図７は、第１天板部２１ａ及び第２天板部２１ｂを有するカバー２と低背発熱部品６６及び高背発熱部品６７との配置構造についての説明図である。図８は、第１天板部２１ａ及び第２天板部２１ｂを有しないカバー２と低背発熱部品６６及び高背発熱部品６７との配置構造についての説明図である。なお、図６では、断面のハッチングの図示を省略している。 [Embodiment 4]
An in-vehicle electronic device 100 according to the fourth embodiment will be described with reference to FIGS. 5 to 8. FIG. In the in-vehicle electronic device 100 of the fourth embodiment, descriptions of the same configurations and operations as those of the previous embodiments are omitted.
FIG. 5 is a perspective view showing the external configuration of the in-vehicle electronic device 100 of Embodiment 4. As shown in FIG. 6 is a perspective view showing a cross section of the in-vehicle electronic device 100 taken along line BB' shown in FIG. FIG. 7 is an explanatory diagram of the arrangement structure of the cover 2 having the first top plate portion 21a and the second top plate portion 21b and the low-height heat-generating component 66 and the high-height heat-generating component 67. As shown in FIG. FIG. 8 is an explanatory diagram of an arrangement structure of the cover 2 that does not have the first top plate portion 21a and the second top plate portion 21b, the low-height heat-generating component 66, and the high-height heat-generating component 67. As shown in FIG. In addition, in FIG. 6, the illustration of the hatching of a cross section is abbreviate|omitted.
　実施形態４の車載用電子装置１００では、カバー２の天板部２１が、凹凸形状を有していてもよい。具体的には、実施形態４のカバー２の天板部２１は、第１距離Ｄ１だけ回路基板４から離隔した第１天板部２１ａと、第１距離Ｄ１よりも長い第２距離Ｄ２だけ回路基板４から離隔した第２天板部２１ｂとを有する。実施形態４の相変化冷却器９は、第１天板部２１ａ及び第２天板部２１ｂの内部に一体的に設けられる。これにより、実施形態４の車載用電子装置１００では、発熱部品６の回路基板４からの高さに応じて、発熱部品６と天板部２１とのギャップＧの長さを適切に設計することができる。なお、発熱部品６の回路基板４からの高さとは、発熱部品６が実装された回路基板４の面を基準とする発熱部品６の高さである。 In the in-vehicle electronic device 100 of Embodiment 4, the top plate portion 21 of the cover 2 may have an uneven shape. Specifically, the top plate portion 21 of the cover 2 of the fourth embodiment includes a first top plate portion 21a separated from the circuit board 4 by a first distance D1, and a circuit gap by a second distance D2 longer than the first distance D1. and a second top plate portion 21 b separated from the substrate 4 . The phase change cooler 9 of Embodiment 4 is integrally provided inside the first top plate portion 21a and the second top plate portion 21b. Thus, in the in-vehicle electronic device 100 of Embodiment 4, the length of the gap G between the heat generating component 6 and the top plate portion 21 can be appropriately designed according to the height of the heat generating component 6 from the circuit board 4. can be done. The height of the heat-generating component 6 from the circuit board 4 is the height of the heat-generating component 6 with respect to the surface of the circuit board 4 on which the heat-generating component 6 is mounted.
　このような第１天板部２１ａ及び第２天板部２１ｂを有するカバー２を備える実施形態４の車載用電子装置１００では、図７に示すように、発熱部品６が、回路基板４からの高さに差がある複数の発熱部品６によって構成されてもよい。複数の発熱部品６は、回路基板４からの高さが低い低背発熱部品６６と、回路基板４からの高さが高い高背発熱部品６７とを含む。低背発熱部品６６は、回路基板４の板厚方向において第１天板部２１ａと回路基板４との間に配置される。高背発熱部品６７は、回路基板４の板厚方向において第２天板部２１ｂと回路基板４との間に配置される。これにより、実施形態４の車載用電子装置１００では、低背発熱部品６６及び高背発熱部品６７のそれぞれと天板部２１とのギャップＧの長さを適切な長さとすることができ、これらのギャップＧの熱抵抗の増加を抑制することができる。 In the in-vehicle electronic device 100 of Embodiment 4 including the cover 2 having the first top plate portion 21a and the second top plate portion 21b, the heat generating component 6 is separated from the circuit board 4 as shown in FIG. It may be composed of a plurality of heat-generating components 6 having different heights. The multiple heat generating components 6 include a low heat generating component 66 having a low height from the circuit board 4 and a high heat generating component 67 having a high height from the circuit board 4 . The low-profile heat-generating component 66 is arranged between the first top plate portion 21 a and the circuit board 4 in the board thickness direction of the circuit board 4 . The tall heat-generating component 67 is arranged between the second top plate portion 21b and the circuit board 4 in the board thickness direction of the circuit board 4 . As a result, in the in-vehicle electronic device 100 of Embodiment 4, the length of the gap G between each of the low-height heat-generating component 66 and the high-height heat-generating component 67 and the top plate portion 21 can be set to an appropriate length. It is possible to suppress an increase in the thermal resistance of the gap G between.
　すなわち、図８に示すように、カバー２が第１天板部２１ａ及び第２天板部２１ｂを有しない場合、低背発熱部品６６と天板部２１とのギャップＧ’は、熱伝達部材８を厚くして埋める必要がある。これは、相変化冷却器９を備えるカバー２には、放熱台座を設けることが容易ではないからである。低背発熱部品６６の回路基板４からの高さが低い程、ギャップＧ’の長さは長くなり、熱伝達部材８の厚さは厚くなる。熱伝達部材８の熱伝導率はカバー２及び相変化冷却器９よりも低いことから、ギャップＧ’の長さが長くなる程、次式に示すように、ギャップＧの熱抵抗が増加する。よって、ギャップＧの熱抵抗の増加を抑制するためには、ギャップＧの長さを如何に短くするかが重要となる。
　　ギャップＧの熱抵抗＝ギャップＧの長さ／（熱伝達部材８の熱伝導率×面積） That is, as shown in FIG. 8, when the cover 2 does not have the first top plate portion 21a and the second top plate portion 21b, the gap G′ between the low-profile heat-generating component 66 and the top plate portion 21 is a heat transfer member. 8 must be thickened and filled. This is because it is not easy to provide a heat radiation pedestal on the cover 2 having the phase change cooler 9 . The shorter the height of the low-profile heat-generating component 66 from the circuit board 4, the longer the length of the gap G' and the thicker the thickness of the heat transfer member 8. FIG. Since the thermal conductivity of the heat transfer member 8 is lower than that of the cover 2 and the phase-change cooler 9, the thermal resistance of the gap G increases as the length of the gap G' increases, as shown in the following equation. Therefore, in order to suppress the increase in the thermal resistance of the gap G, how to shorten the length of the gap G is important.
Thermal resistance of gap G=length of gap G/(thermal conductivity of heat transfer member 8×area)
　実施形態４の車載用電子装置１００では、カバー２が第１天板部２１ａ及び第２天板部２１ｂを有し、低背発熱部品６６及び高背発熱部品６７のそれぞれと天板部２１とのギャップＧの長さを適切な長さとすることができる。これにより、実施形態４の車載用電子装置１００では、回路基板４からの高さに差がある複数の発熱部品６を備える場合であっても、ギャップＧの熱抵抗の増加を抑制することができるので、相変化冷却器９の熱拡散能力を最大限引き出し、複数の発熱部品６のそれぞれの熱を相変化冷却器９によって拡散させることができる。よって、実施形態４の車載用電子装置１００では、回路基板４からの高さに差がある複数の発熱部品６を備える場合であっても、相変化冷却器９の熱拡散能力を最大限引き出し、高い放熱性能を確保することができる。 In the in-vehicle electronic device 100 of the fourth embodiment, the cover 2 has the first top plate portion 21a and the second top plate portion 21b, and the low-height heat-generating component 66 and the high-height heat-generating component 67 are respectively connected to the top plate portion 21. can be an appropriate length. As a result, even if the in-vehicle electronic device 100 of the fourth embodiment includes a plurality of heat-generating components 6 having different heights from the circuit board 4, it is possible to suppress an increase in the thermal resistance of the gap G. Therefore, the heat diffusion capability of the phase change cooler 9 can be maximized, and the heat of each of the plurality of heat generating components 6 can be diffused by the phase change cooler 9 . Therefore, in the vehicle-mounted electronic device 100 of Embodiment 4, even when a plurality of heat-generating components 6 having different heights from the circuit board 4 are provided, the heat diffusion capability of the phase-change cooler 9 can be maximized. , can ensure high heat dissipation performance.
［実施形態５］
　図９～図１０を用いて、実施形態５の車載用電子装置１００について説明する。実施形態５の車載用電子装置１００において、従前の実施形態と同様の構成及び動作については、説明を省略する。
　図９は、実施形態５の車載用電子装置１００の一例についての説明図である。図１０は、実施形態５の車載用電子装置１００の他の一例についての説明図である。なお、図９及び図１０のそれぞれは、図２に対応する図である。 [Embodiment 5]
An in-vehicle electronic device 100 according to Embodiment 5 will be described with reference to FIGS. 9 and 10. FIG. In the in-vehicle electronic device 100 of the fifth embodiment, descriptions of the same configurations and operations as those of the previous embodiments are omitted.
FIG. 9 is an explanatory diagram of an example of the in-vehicle electronic device 100 according to the fifth embodiment. FIG. 10 is an explanatory diagram of another example of the in-vehicle electronic device 100 of the fifth embodiment. 9 and 10 are diagrams corresponding to FIG.
　実施形態５の車載用電子装置１００では、回路基板４が、両面実装が可能な回路基板である。コネクタ５は、回路基板４からの高さが発熱部品６よりも高い電子部品である。発熱部品６は、コネクタ５が実装された面４ｃとは反対側の回路基板４の面４ｄに実装される。相変化冷却器９は、発熱部品６が実装された回路基板４の面４ｄに対向するカバー２の天板部２１に設けられる。 In the in-vehicle electronic device 100 of Embodiment 5, the circuit board 4 is a circuit board that can be mounted on both sides. The connector 5 is an electronic component whose height from the circuit board 4 is higher than that of the heat-generating component 6 . The heat-generating component 6 is mounted on the surface 4d of the circuit board 4 opposite to the surface 4c on which the connector 5 is mounted. The phase change cooler 9 is provided on the top plate portion 21 of the cover 2 facing the surface 4d of the circuit board 4 on which the heat generating component 6 is mounted.
　また、実施形態５の車載用電子装置１００では、コネクタ５及び発熱部品６以外の回路基板４に実装される電子部品７として、低背電子部品７１と高背電子部品７２とを含んでもよい。低背電子部品７１は、回路基板４からの高さが発熱部品６以下の電子部品７である。低背電子部品７１は、発熱部品６が実装された回路基板４の面４ｄに実装される。高背電子部品７２は、回路基板４からの高さが発熱部品６よりも高い電子部品７である。高背電子部品７２は、コネクタ５が実装された回路基板４の面４ｃに実装される。高背電子部品７２は、例えば、アルミ電解コンデンサ等である。 Further, in the vehicle-mounted electronic device 100 of Embodiment 5, the electronic components 7 mounted on the circuit board 4 other than the connector 5 and the heat-generating component 6 may include a low-profile electronic component 71 and a high-profile electronic component 72 . The low-profile electronic component 71 is the electronic component 7 whose height from the circuit board 4 is equal to or less than the heat-generating component 6 . The low-profile electronic component 71 is mounted on the surface 4d of the circuit board 4 on which the heat-generating component 6 is mounted. A tall electronic component 72 is an electronic component 7 whose height from the circuit board 4 is higher than that of the heat-generating component 6 . The tall electronic component 72 is mounted on the surface 4c of the circuit board 4 on which the connector 5 is mounted. The tall electronic component 72 is, for example, an aluminum electrolytic capacitor.
　このような構成により、実施形態５のカバー２では、図１及び図２に示すように、発熱部品６及びコネクタ５のそれぞれの回路基板４からの高さの差に応じて、天板部２１を段付き形状とする必要がない。すなわち、実施形態５のカバー２は、図９に示すように、天板部２１を、第２側板部２２ｂから発熱部品６及びコネクタ５を越えて第１側板部２２ａに至るまで平坦な平板形状とすることができる。これにより、実施形態５の車載用電子装置１００は、発熱部品６からコネクタ５に向かって延びる相変化冷却器９を、相変化冷却器９の延びる方向に沿って拡大することができる。例えば図９に示すように、相変化冷却器９から第１側板部２２ａの外表面までの距離Ｌ１が可能な限り短くなるように、相変化冷却器９を拡大することができる。相変化冷却器９を当該方向に沿って拡大することにより、例えば図１０に示すように、発熱部品６から回路基板４の他方の端部４ｂ側の端面までの距離Ｌ２が可能な限り短くなるように、発熱部品６を当該端面に近い位置に実装することができる。したがって、実施形態５の車載用電子装置１００では、相変化冷却器９の面積を拡大することができるので、放熱面積を拡大することができる。更に、実施形態５の車載用電子装置１００は、相変化冷却器９の延びる方向に沿って温度差を大きくすることができ、相変化冷却器９の高い熱拡散能力を更に維持することができる。よって、実施形態５の車載用電子装置１００では、相変化冷却器９の熱拡散能力を更に引き出し、高い放熱性能を更に確保することができる。 With such a configuration, in the cover 2 of Embodiment 5, as shown in FIGS. need not be stepped. That is, as shown in FIG. 9, the cover 2 of the fifth embodiment has a top plate portion 21 in a flat plate shape from the second side plate portion 22b to the first side plate portion 22a beyond the heat-generating component 6 and the connector 5. can be As a result, the vehicle-mounted electronic device 100 of the fifth embodiment can expand the phase-change cooler 9 extending from the heat-generating component 6 toward the connector 5 along the direction in which the phase-change cooler 9 extends. For example, as shown in FIG. 9, the phase change cooler 9 can be enlarged so that the distance L1 from the phase change cooler 9 to the outer surface of the first side plate portion 22a is as short as possible. By enlarging the phase change cooler 9 along this direction, the distance L2 from the heat-generating component 6 to the end surface of the circuit board 4 on the other end 4b side becomes as short as possible, as shown in FIG. 10, for example. Thus, the heat-generating component 6 can be mounted at a position close to the end surface. Therefore, in the on-vehicle electronic device 100 of Embodiment 5, the area of the phase change cooler 9 can be increased, so that the heat dissipation area can be increased. Furthermore, the vehicle-mounted electronic device 100 of Embodiment 5 can increase the temperature difference along the extending direction of the phase-change cooler 9, and can further maintain the high heat diffusion capability of the phase-change cooler 9. . Therefore, in the in-vehicle electronic device 100 of Embodiment 5, the heat diffusion capability of the phase change cooler 9 can be further extracted, and high heat radiation performance can be further ensured.
　なお、実施形態４、５の車載用電子装置１００では、相変化冷却器９がカバー２の天板部２１の内部に一体的に設けられていたが、実施形態１と同様に、相変化冷却器９が天板部２１の内表面に接合されていてもよい。 In the vehicle electronic device 100 of Embodiments 4 and 5, the phase change cooler 9 is integrally provided inside the top plate portion 21 of the cover 2. The container 9 may be joined to the inner surface of the top plate portion 21 .
［実施形態６］
　図１１を用いて、実施形態６の車載用電子装置１００について説明する。実施形態６の車載用電子装置１００において、従前の実施形態と同様の構成及び動作については、説明を省略する。
　図１１は、実施形態６の車載用電子装置１００の説明図である。なお、図１１は、図２に対応する図である。 [Embodiment 6]
A vehicle-mounted electronic device 100 according to the sixth embodiment will be described with reference to FIG. 11 . In the in-vehicle electronic device 100 of Embodiment 6, descriptions of the same configurations and operations as those of the previous embodiments are omitted.
FIG. 11 is an explanatory diagram of the in-vehicle electronic device 100 of the sixth embodiment. Note that FIG. 11 is a diagram corresponding to FIG.
　実施形態６の車載用電子装置１００では、回路基板４が、両面実装が可能な回路基板である。回路基板４は、発熱部品６が実装された領域の内部を、回路基板４の板厚方向に貫通するサーマルビア４１を含む。相変化冷却器９は、第１相変化冷却器９３と、第２相変化冷却器９４とによって構成される。第１相変化冷却器９３及び第２相変化冷却器９４のそれぞれは、回路基板４に実装された発熱部品６からコネクタ５に向かって延びるように形成される。 In the vehicle-mounted electronic device 100 of Embodiment 6, the circuit board 4 is a circuit board that can be mounted on both sides. The circuit board 4 includes thermal vias 41 penetrating in the thickness direction of the circuit board 4 inside the region where the heat-generating component 6 is mounted. The phase change cooler 9 is composed of a first phase change cooler 93 and a second phase change cooler 94 . Each of the first phase change cooler 93 and the second phase change cooler 94 is formed to extend from the heat generating component 6 mounted on the circuit board 4 toward the connector 5 .
　第１相変化冷却器９３は、筐体１に設けられた相変化冷却器９である。例えば、第１相変化冷却器９３は、実施形態５と同様に、発熱部品６が実装された回路基板４の面４ｄに対向するカバー２の天板部２１に設けられてもよい。第２相変化冷却器９４は、発熱部品６が実装された回路基板４の面４ｄとは反対側の回路基板４の面４ｃに設けられ、サーマルビア４１に接触する。例えば、第２相変化冷却器９４は、サーマルビア４１を覆うように回路基板４の面４ｃに接合されてもよい。第２相変化冷却器９４と回路基板４の面４ｃとは、鉛フリーはんだ又は導電性接着材等を用いて接合されてもよい。 The first phase change cooler 93 is the phase change cooler 9 provided in the housing 1 . For example, the first phase change cooler 93 may be provided on the top plate portion 21 of the cover 2 facing the surface 4d of the circuit board 4 on which the heat generating component 6 is mounted, as in the fifth embodiment. The second phase change cooler 94 is provided on the surface 4 c of the circuit board 4 opposite to the surface 4 d of the circuit board 4 on which the heat generating component 6 is mounted, and contacts the thermal via 41 . For example, the second phase change cooler 94 may be bonded to the surface 4c of the circuit board 4 so as to cover the thermal vias 41 . The second phase change cooler 94 and the surface 4c of the circuit board 4 may be joined using lead-free solder, a conductive adhesive, or the like.
　また、実施形態６の車載用電子装置１００は、実施形態５と同様に、発熱部品６が、コネクタ５が実装された面４ｃとは反対側の回路基板４の面４ｄに実装されてもよい。 Further, in the in-vehicle electronic device 100 of the sixth embodiment, the heat-generating component 6 may be mounted on the surface 4d of the circuit board 4 opposite to the surface 4c on which the connector 5 is mounted, as in the fifth embodiment. .
　このような構成により、実施形態６の車載用電子装置１００は、第１相変化冷却器９３が、実施形態５と同様に、発熱部品６の熱を拡散させることができる。更に、実施形態６の車載用電子装置１００は、第２相変化冷却器９４が、発熱部品６から回路基板４に伝わる熱を、第１相変化冷却器９３と同様に拡散させることができる。よって、実施形態６の車載用電子装置１００では、実施形態５よりも放熱性能を大幅に向上させることができる。 With such a configuration, in the vehicle-mounted electronic device 100 of the sixth embodiment, the first phase change cooler 93 can diffuse the heat of the heat-generating component 6 as in the fifth embodiment. Furthermore, in the vehicle-mounted electronic device 100 of Embodiment 6, the second phase change cooler 94 can diffuse the heat transferred from the heat-generating component 6 to the circuit board 4 in the same manner as the first phase change cooler 93 . Therefore, in the in-vehicle electronic device 100 of the sixth embodiment, the heat dissipation performance can be greatly improved as compared with the fifth embodiment.
　なお、実施形態６の車載用電子装置１００では、第１相変化冷却器９３がカバー２の天板部２１の内部に一体的に設けられていたが、実施形態１と同様に、第１相変化冷却器９３が天板部２１の内表面に接合されていてもよい。 In addition, in the vehicle-mounted electronic device 100 of the sixth embodiment, the first phase change cooler 93 is integrally provided inside the top plate portion 21 of the cover 2. A variable cooler 93 may be joined to the inner surface of the top plate portion 21 .
［実施形態７］
　図１２～図１３を用いて、実施形態７の車載用電子装置１００について説明する。実施形態７の車載用電子装置１００において、従前の実施形態と同様の構成及び動作については、説明を省略する。
　図１２は、実施形態７の車載用電子装置１００の一例についての説明図である。図１３は、実施形態７の車載用電子装置１００の他の一例についての説明図である。なお、図１２及び図１３のそれぞれは、図２に対応する図である。 [Embodiment 7]
An in-vehicle electronic device 100 according to Embodiment 7 will be described with reference to FIGS. 12 and 13. FIG. In the vehicle-mounted electronic device 100 of Embodiment 7, the description of the same configuration and operation as those of the previous embodiments will be omitted.
FIG. 12 is an explanatory diagram of an example of the in-vehicle electronic device 100 according to the seventh embodiment. FIG. 13 is an explanatory diagram of another example of the in-vehicle electronic device 100 of the seventh embodiment. 12 and 13 are diagrams corresponding to FIG. 2. FIG.
　実施形態７の車載用電子装置１００では、相変化冷却器９が、カバー２を含む筐体１には設けられず、回路基板４だけに設けられる。具体的には、実施形態７の車載用電子装置１００では、回路基板４が、両面実装が可能な回路基板である。回路基板４は、発熱部品６が実装された領域の内部を、回路基板４の板厚方向に貫通するサーマルビア４１を含む。相変化冷却器９は、発熱部品６が実装された回路基板４の面４ｄとは反対側の回路基板４の面４ｃに設けられ、サーマルビア４１に接触する。相変化冷却器９は、回路基板４に実装された発熱部品６からコネクタ５に向かって延びるように形成される。 In the vehicle-mounted electronic device 100 of Embodiment 7, the phase change cooler 9 is not provided in the housing 1 including the cover 2, but is provided only in the circuit board 4. Specifically, in the in-vehicle electronic device 100 of Embodiment 7, the circuit board 4 is a circuit board that can be mounted on both sides. The circuit board 4 includes thermal vias 41 penetrating in the thickness direction of the circuit board 4 inside the region where the heat-generating component 6 is mounted. The phase change cooler 9 is provided on the surface 4c of the circuit board 4 opposite to the surface 4d of the circuit board 4 on which the heat generating component 6 is mounted, and contacts the thermal via 41. As shown in FIG. Phase change cooler 9 is formed to extend from heat generating component 6 mounted on circuit board 4 toward connector 5 .
　また、実施形態７の車載用電子装置１００は、例えば図１２に示すように、発熱部品６が、コネクタ５が実装された面４ｃとは反対側の回路基板４の面４ｄに実装されてもよい。そして、発熱部品６は、熱伝達部材８を介してケース３に接触していてもよい。 Further, in the vehicle-mounted electronic device 100 of Embodiment 7, for example, as shown in FIG. good. The heat-generating component 6 may be in contact with the case 3 via the heat transfer member 8 .
　或いは、実施形態７の車載用電子装置１００は、例えば図１３に示すように、発熱部品６が、コネクタ５が実装された回路基板４の面４ｃに実装されてもよい。そして、発熱部品６は、熱伝達部材８を介してカバー２の天板部２１に接触していてもよい。 Alternatively, in the in-vehicle electronic device 100 of Embodiment 7, for example, as shown in FIG. 13, the heat-generating component 6 may be mounted on the surface 4c of the circuit board 4 on which the connector 5 is mounted. The heat-generating component 6 may be in contact with the top plate portion 21 of the cover 2 via the heat transfer member 8 .
　このような構成により、実施形態７の車載用電子装置１００では、カバー２を含む筐体１に相変化冷却器９を設けることができない場合であっても、相変化冷却器９を導入することができ、相変化冷却器９の熱拡散能力を利用して高い放熱性能を確保することができる。 With such a configuration, in the in-vehicle electronic device 100 of Embodiment 7, even if the phase change cooler 9 cannot be provided in the housing 1 including the cover 2, the phase change cooler 9 can be introduced. high heat dissipation performance can be ensured by utilizing the heat diffusion capability of the phase change cooler 9 .
［その他］
　なお、本発明は上記の実施形態に限定されるものではなく、様々な変形例が含まれる。例えば、上記の実施形態は本発明を分かりやすく説明するために詳細に説明したものであり、必ずしも説明した全ての構成を備えるものに限定されるものではない。また、或る実施形態の構成の一部を他の実施形態の構成に置き換えることが可能であり、また、或る実施形態の構成に他の実施形態の構成を加えることも可能である。また、各実施形態の構成の一部について、他の構成の追加・削除・置換をすることが可能である。 [others]
In addition, the present invention is not limited to the above-described embodiments, and includes various modifications. For example, the above embodiments have been described in detail in order to explain the present invention in an easy-to-understand manner, and are not necessarily limited to those having all the configurations described. Moreover, it is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. Moreover, it is possible to add, delete, or replace part of the configuration of each embodiment with another configuration.
　１…筐体、２…カバー、２１ａ…第１天板部、２１ｂ…第２天板部、４…回路基板、４１…サーマルビア、５…コネクタ、６…発熱部品、８…熱伝達部材、９…相変化冷却器、９３…第１相変化冷却器、９４…第２相変化冷却器、１００…車載用電子装置 REFERENCE SIGNS LIST 1 housing 2 cover 21a first top plate portion 21b second top plate portion 4 circuit board 41 thermal via 5 connector 6 heat generating component 8 heat transfer member 9 phase change cooler, 93 first phase change cooler, 94 second phase change cooler, 100 in-vehicle electronic device

Claims (8)

  1. 　回路基板に実装される一方の面と、前記回路基板の板厚方向において前記一方の面とは反対側にある他方の面とを有する発熱部品と、
    　前記回路基板に実装され、外部装置に接続されるコネクタと、
    　前記発熱部品及び前記コネクタが実装された前記回路基板を収容する筐体と、
    　前記回路基板に実装された前記発熱部品から前記コネクタに向かって延び、冷媒の相変化を伴って熱を輸送する相変化冷却器と、
    　前記発熱部品の前記他方の面と、前記筐体又は前記相変化冷却器とに接触する熱伝達部材と、を備える
    　ことを特徴とする車載用電子装置。     a heat-generating component having one surface mounted on a circuit board and the other surface opposite to the one surface in the thickness direction of the circuit board;
    a connector mounted on the circuit board and connected to an external device;
    a housing that houses the circuit board on which the heat-generating component and the connector are mounted;
    a phase-change cooler that extends from the heat-generating component mounted on the circuit board toward the connector and transports heat with a phase change of a coolant;
    An in-vehicle electronic device, comprising: a heat transfer member that contacts the other surface of the heat-generating component and the housing or the phase change cooler.
  2. 　前記コネクタは、少なくとも前記回路基板の一方の端部に実装され、
    　前記発熱部品は、少なくとも前記回路基板の他方の端部に実装され、
    　前記相変化冷却器は、前記筐体に設けられ、前記他方の端部から前記一方の端部に向かって延びる
    　ことを特徴とする請求項１に記載の車載用電子装置。     The connector is mounted on at least one end of the circuit board,
    The heat-generating component is mounted at least on the other end of the circuit board,
    The in-vehicle electronic device according to claim 1, wherein the phase change cooler is provided in the housing and extends from the other end toward the one end.
  3. 　前記発熱部品は、発熱量に差がある複数の前記発熱部品によって構成され、
    　前記複数の発熱部品は、前記発熱量が最も大きい最大発熱部品と、前記発熱量が最も小さい最小発熱部品とを含み、
    　前記最大発熱部品は、前記回路基板に沿った方向において前記最小発熱部品よりも前記コネクタから離隔した位置に実装され、
    　前記熱伝達部材は、前記複数の発熱部品のそれぞれの前記他方の面に接触する複数の前記熱伝達部材によって構成され、
    　前記相変化冷却器は、前記筐体に設けられ、前記最大発熱部品から前記最小発熱部品に向かって延びる
    　ことを特徴とする請求項１に記載の車載用電子装置。     The heat-generating component is composed of a plurality of heat-generating components having different heat generation amounts,
    The plurality of heat-generating components includes a maximum heat-generating component with the largest heat generation amount and a minimum heat-generating component with the smallest heat generation amount,
    The maximum heat generating component is mounted at a position further away from the connector than the minimum heat generating component in a direction along the circuit board,
    the heat transfer member is configured by a plurality of the heat transfer members contacting the other surface of each of the plurality of heat generating components,
    2. The in-vehicle electronic device according to claim 1, wherein the phase change cooler is provided in the housing and extends from the maximum heat generating component toward the minimum heat generating component.
  4. 　前記筐体は、前記回路基板に実装された前記発熱部品から前記回路基板の板厚方向に離隔した状態で前記回路基板を覆うカバーを含み、
    　前記カバーは、第１距離だけ前記回路基板から離隔した第１天板部と、前記第１距離よりも長い第２距離だけ前記回路基板から離隔した第２天板部とを有し、
    　前記発熱部品は、前記回路基板からの高さに差がある複数の前記発熱部品によって構成され、
    　前記複数の発熱部品は、前記回路基板からの前記高さが低い低背発熱部品と、前記回路基板からの前記高さが高い高背発熱部品と、を含み、
    　前記低背発熱部品は、前記板厚方向において前記第１天板部と前記回路基板との間に配置され、
    　前記高背発熱部品は、前記板厚方向において前記第２天板部と前記回路基板との間に配置され、
    　前記相変化冷却器は、前記第１天板部及び前記第２天板部に設けられる
    　ことを特徴とする請求項１に記載の車載用電子装置。     The housing includes a cover that covers the circuit board while being separated from the heat-generating component mounted on the circuit board in the thickness direction of the circuit board,
    The cover has a first top plate portion separated from the circuit board by a first distance and a second top plate portion separated from the circuit board by a second distance longer than the first distance,
    The heat-generating component is composed of a plurality of heat-generating components having different heights from the circuit board,
    The plurality of heat generating components includes a low heat generating component having a low height from the circuit board and a high heat generating component having a high height from the circuit board,
    The low-profile heat-generating component is arranged between the first top plate portion and the circuit board in the plate thickness direction,
    The tall heat-generating component is arranged between the second top plate portion and the circuit board in the plate thickness direction,
    The in-vehicle electronic device according to claim 1, wherein the phase change cooler is provided on the first top plate portion and the second top plate portion.
  5. 　前記筐体は、前記回路基板に実装された前記発熱部品から前記回路基板の板厚方向に離隔した状態で前記回路基板を覆うカバーを含み、
    　前記相変化冷却器は、前記カバーの内部に一体的に設けられる
    　ことを特徴とする請求項１に記載の車載用電子装置。     The housing includes a cover that covers the circuit board while being separated from the heat-generating component mounted on the circuit board in the thickness direction of the circuit board,
    The in-vehicle electronic device according to claim 1, wherein the phase change cooler is integrally provided inside the cover.
  6. 　前記回路基板は、両面実装が可能な回路基板であり、
    　前記コネクタは、前記回路基板からの高さが前記発熱部品よりも高い電子部品であり、　前記発熱部品は、前記コネクタが実装された面とは反対側の前記回路基板の面に実装される
    　ことを特徴とする請求項１に記載の車載用電子装置。     The circuit board is a circuit board that can be mounted on both sides,
    The connector is an electronic component whose height from the circuit board is higher than the heat-generating component, and the heat-generating component is mounted on the surface of the circuit board opposite to the surface on which the connector is mounted. The in-vehicle electronic device according to claim 1, characterized by:
  7. 　前記回路基板は、両面実装が可能な回路基板であり、前記発熱部品が実装された領域の内部を前記回路基板の板厚方向に貫通するサーマルビアを含み、
    　前記相変化冷却器は、前記発熱部品が実装された面とは反対側の前記回路基板の面に設けられ、前記サーマルビアに接触する
    　ことを特徴とする請求項１に記載の車載用電子装置。     The circuit board is a circuit board that can be mounted on both sides, and includes a thermal via that penetrates the inside of the area where the heat generating component is mounted in the thickness direction of the circuit board,
    2. The in-vehicle electronic device according to claim 1, wherein the phase-change cooler is provided on the surface of the circuit board opposite to the surface on which the heat-generating component is mounted, and is in contact with the thermal via. .
  8. 　前記回路基板は、両面実装が可能な回路基板であり、前記発熱部品が実装された領域の内部を前記回路基板の板厚方向に貫通するサーマルビアを含み、
    　前記相変化冷却器は、前記筐体に設けられた第１相変化冷却器と、前記発熱部品が実装された面とは反対側の前記回路基板の面に設けられ前記サーマルビアに接触する第２相変化冷却器とによって構成される
    　ことを特徴とする請求項１に記載の車載用電子装置。     The circuit board is a circuit board that can be mounted on both sides, and includes a thermal via that penetrates the inside of the area where the heat generating component is mounted in the thickness direction of the circuit board,
    The phase change cooler includes a first phase change cooler provided in the housing and a second phase change cooler provided on the surface of the circuit board opposite to the surface on which the heat generating component is mounted and in contact with the thermal via. 2. The in-vehicle electronic device according to claim 1, further comprising a two-phase change cooler.
PCT/JP2021/035480 2021-02-24 2021-09-28 On-vehicle electronic device WO2022180909A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218573A (en) * 2002-12-18 2003-07-31 Hitachi Ltd Method for manufacturing electronic unit casing
JP2008262974A (en) * 2007-04-10 2008-10-30 Sumitomo Electric Ind Ltd Semiconductor device
JP2009272353A (en) * 2008-04-30 2009-11-19 Yushin Precision Equipment Co Ltd Cooling structure for controller
JP2018085528A (en) * 2017-12-27 2018-05-31 日立オートモティブシステムズ株式会社 Box shaped on-vehicle control device
JP2018198335A (en) * 2018-09-11 2018-12-13 日立オートモティブシステムズ株式会社 Electronic control equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218573A (en) * 2002-12-18 2003-07-31 Hitachi Ltd Method for manufacturing electronic unit casing
JP2008262974A (en) * 2007-04-10 2008-10-30 Sumitomo Electric Ind Ltd Semiconductor device
JP2009272353A (en) * 2008-04-30 2009-11-19 Yushin Precision Equipment Co Ltd Cooling structure for controller
JP2018085528A (en) * 2017-12-27 2018-05-31 日立オートモティブシステムズ株式会社 Box shaped on-vehicle control device
JP2018198335A (en) * 2018-09-11 2018-12-13 日立オートモティブシステムズ株式会社 Electronic control equipment

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