US20100294463A1 - Heat dissipation device having a fan thereon - Google Patents
Heat dissipation device having a fan thereon Download PDFInfo
- Publication number
- US20100294463A1 US20100294463A1 US12/507,781 US50778109A US2010294463A1 US 20100294463 A1 US20100294463 A1 US 20100294463A1 US 50778109 A US50778109 A US 50778109A US 2010294463 A1 US2010294463 A1 US 2010294463A1
- Authority
- US
- United States
- Prior art keywords
- base
- heat sink
- blower
- frame
- dissipation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the disclosure relates generally to a heat dissipation device for removing heat from an electronic component mounted on a periphery card, and particularly to a heat dissipation device comprising a blower facing a base of a heat sink in contact with the electronic component to define an airflow passage between the base of the heat sink and the blower, wherein airflow can pass through the airflow passage.
- CPUs central processing units
- a heat dissipation device which can quickly remove the heat from the electronic device is needed.
- a heat dissipation device is particularly necessary for a periphery card of a computer, for example, a video graphic array (VGA) card.
- a periphery card is usually crowded with other periphery cards whereby only a limited space is available for an airflow to flow through a heat sink thereof.
- the heat dissipation device usually includes the heat sink and a blower mounted to the heat sink. Since the periphery card has a limited space, accordingly, the heat sink is designed to have a flat-shaped base and fins with a limited height. The blower is desired to guide airflow to pass through the fins of the heat sink from one side to an opposite side thereof.
- the blower usually includes a fan frame and a cover covering and mounted to the fan frame. Airflow produced by the blower only flows along a passage cooperatively defined by the fan frame and the cover of the blower. That is to say, when the blower is mounted to the base of the heat sink, the airflow produced by the blower fails to directly blow towards the base of the heat sink under the blower, the heat accumulated at the base of the heat sink under the blower fails to be quickly dissipated.
- FIG. 1 is an exploded, isometric view of a heat dissipation device in accordance with an embodiment of the disclosure.
- FIG. 2 is an assembled view of the heat dissipation device of FIG. 1 .
- FIG. 3 is a similar view of FIG. 1 , with arrows showing paths of airflow entering and leaving the heat dissipation device.
- the heat dissipation device is mounted to a heat-generating electronic element (not shown) to dissipate heat from the heat-generating electronic element.
- the heat-generating electronic element is a graphic processing unit (GPU) mounted on a periphery card of a computer, for example, a video graphic array (VGA) card.
- the heat dissipation device comprises a heat sink 10 , a blower 20 and a guiding plate 30 .
- the heat sink 10 is integrally formed by a metal with a good heat conductivity, such as copper or aluminum.
- the heat sink 10 comprises a flat base 12 .
- the base 12 comprises three portions: a first portion located in a middle of the base 12 , a second portion extending forth from an end of the first portion and a third portion extending rearwards from an opposite end of the first portion.
- the first portion of the base 12 has a semicircular shape with a size corresponding to that of the blower 20 , for supporting the blower 20 thereon.
- a semicircular first airflow inlet 120 is defined in the first portion of the base 12 .
- a pair of mounting poles 16 is formed at two opposite ends of a front side of the first portion of the base 12 , and another mounting pole 16 is formed on a middle portion of a top surface of the third portion of the base 12 , adjacent to the rear side of the first portion of the base 12 .
- Each mounting pole 16 defines a mounting hole 160 therein.
- a plurality of fins 14 are integrally formed on a top surface of the second portion of the base 12 .
- the fins 14 have a gradually increased lengths from a left lateral side to a right lateral side of the second portion of the base 12 , wherein the fins 14 are located at a position and occupy a size corresponding to those of an outlet of the blower 20 .
- Each fin 14 defines a recessed edge at a top thereof and all recessed edges of all the fins 14 cooperatively define a recessed slot 140 in a top of the fins 14 .
- the front side 142 of the second portion of the base 12 under the fins 14 is inclined downwardly in respect to the first portion of the base 12 , wherein airflow from the outlet of the blower 20 blowing towards channels defined between the fins 14 can be guided to downwardly blow other heat-generating electronic elements mounted on the periphery card and adjacent to the front side of the base 12 of the heat sink 10 .
- the blower 20 comprises a frame 22 and an impeller 24 .
- the frame 22 comprises a panel plate 220 and a lateral sidewall 222 downwardly and vertically extending from an edge side of the panel plate 220 .
- the impeller 24 is rotatably secured to an inner surface of the panel plate 220 of the frame 22 .
- a plurality of second airflow inlets 2200 are defined in the panel plate 220 , corresponding to the first airflow inlet 120 of the base 12 of the heat sink 10 .
- Three fixing portions 224 horizontal and outwardly extend from the lateral sidewall 222 and are evenly located along a periphery of the frame 22 of the blower 20 , corresponding to the mounting poles 16 of the base 12 of the heat sink 10 .
- Each fixing portion 224 defines a through hole 2240 therein, in alignment with the mounting hole 160 of a corresponding mounting pole 16 of the base 12 of the heat sink 10 , for receiving a fastener 90 extending therethrough.
- the fasteners 90 extend through the through holes 2240 of the fixing portions 224 of the frame 22 of the blower 20 and screw into the mounting holes 160 of the mounting poles 16 to mount the frame 22 of the blower 20 on the first portion of the base 12 of the heat sink 10 , wherein the base 12 of the heat sink 10 and the frame 22 of the blower 20 cooperatively define an airflow passage along a length direction of the base 12 of the heat sink 10 and the outlet of the blower 20 faces the channels defined between the fins 14 of the heat sink 10 .
- the guiding plate 30 has a size corresponding to that of a top surface of the fins 14 of the heat sink 10 .
- the guiding plate 30 comprises a main body 32 and a recessed portion 34 extending outwardly and downwardly from a front side of the main body 32 .
- the guiding plate 30 covers the top surface of the fins 14 with the recessed portion 34 being received in the recessed slot 140 to guide the airflow from the outlet of the blower 20 to downwardly flow to the channels defined between the fins 14 of the heat sink 10 .
- cooled airflow flows into the airflow passage between the frame 22 of the blower 20 and the base 12 of the heat sink 10 via the first and second airflow inlets 120 , 2200 , wherein the cooled airflow can directly blow a top surface of the base 12 of the heat sink 10 , so heat generated by the heat-generating electronic element attached on a bottom of the base 12 of the heat sink 10 can be effectively taken away.
- the blower 20 By provision of the frame 22 of the blower 20 engaging the base 12 of the heat sink 10 , the blower 20 not only can directly blow the base 12 of the heat sink 10 , but also saves a cover covering the frame 22 to define the airflow passage, whereby the cost of the blower 20 is decreased.
- the base 12 of the heat sink 10 defines the first airflow inlet 120 therethrough, wherein the cooled airflow flowing into the airflow passage via the first airflow inlet 120 can cause air around the heat-generating electronic element to flow through the heat-generating electronic element; thus, the heat generated by the heat-generating electronic element can be taken away as quickly as possible. Heat accumulated at the base 12 of the heat sink 10 under the blower 20 can be quickly dissipated.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009103025118A CN101896054A (zh) | 2009-05-21 | 2009-05-21 | 散热装置 |
CN200910302511.8 | 2009-05-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100294463A1 true US20100294463A1 (en) | 2010-11-25 |
Family
ID=43105058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/507,781 Abandoned US20100294463A1 (en) | 2009-05-21 | 2009-07-22 | Heat dissipation device having a fan thereon |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100294463A1 (zh) |
CN (1) | CN101896054A (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110310315A1 (en) * | 2010-06-18 | 2011-12-22 | Akifumi Yamaguchi | Television apparatus and electronic device |
US20120125570A1 (en) * | 2010-11-19 | 2012-05-24 | Inventec Corporation | Heat dissipating device |
US20120175079A1 (en) * | 2011-01-06 | 2012-07-12 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device having centrifugal fan |
US10285303B2 (en) * | 2017-07-14 | 2019-05-07 | Apple Inc. | Electronic device with integrated passive and active cooling |
US10375853B2 (en) | 2016-09-06 | 2019-08-06 | Apple Inc. | Electronic device with cooling fan |
US10757809B1 (en) * | 2017-11-13 | 2020-08-25 | Telephonics Corporation | Air-cooled heat exchanger and thermal arrangement for stacked electronics |
CN112556269A (zh) * | 2017-03-08 | 2021-03-26 | 青岛海尔特种电冰柜有限公司 | 卧式风冷冷柜 |
US11249523B2 (en) * | 2020-05-06 | 2022-02-15 | Quanta Computer Inc. | Adjustable air baffle for directing air flow in a computer system |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102588346A (zh) * | 2011-01-10 | 2012-07-18 | 鸿富锦精密工业(深圳)有限公司 | 导流装置及具有该导流装置的散热模组 |
CN103853251A (zh) * | 2012-12-04 | 2014-06-11 | 鸿富锦精密工业(深圳)有限公司 | 电子装置组合 |
TWI495425B (zh) * | 2013-04-17 | 2015-08-01 | Sunonwealth Electr Mach Ind Co | 散熱模組及其導流結構 |
CN105208841A (zh) * | 2015-11-11 | 2015-12-30 | 林炳彩 | 一种可减震的防尘式电路板装置组件 |
WO2017090671A1 (ja) * | 2015-11-24 | 2017-06-01 | 三菱電機株式会社 | 空気調和機 |
CN111665910A (zh) * | 2020-07-06 | 2020-09-15 | 惠州市五荣五金电子有限公司 | 一种电脑散热器 |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4953634A (en) * | 1989-04-20 | 1990-09-04 | Microelectronics And Computer Technology Corporation | Low pressure high heat transfer fluid heat exchanger |
US5077601A (en) * | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
US5810072A (en) * | 1995-09-08 | 1998-09-22 | Semipower Systems, Inc. | Forced air cooler system |
US5867365A (en) * | 1997-06-10 | 1999-02-02 | Chiou; Ming Chin | CPU heat sink assembly |
US6421239B1 (en) * | 2000-06-06 | 2002-07-16 | Chaun-Choung Technology Corp. | Integral heat dissipating device |
US20020172008A1 (en) * | 2001-05-15 | 2002-11-21 | Mihalis Michael | High-performance heat sink for printed circuit boards |
US6688379B2 (en) * | 2001-06-13 | 2004-02-10 | Delta Electronics, Inc. | Heat dissipation device with high efficiency |
US20060039113A1 (en) * | 2004-08-19 | 2006-02-23 | Compal Electronics, Inc. | Heat dissipating device with dust-collecting mechanism |
US20060082968A1 (en) * | 2004-10-15 | 2006-04-20 | Inventec Corporation | Fool-proof device on heatsink thermal module for the notebook computer |
US7040384B2 (en) * | 2004-01-27 | 2006-05-09 | Molex Incorporated | Heat dissipation device |
US20060144558A1 (en) * | 2004-12-30 | 2006-07-06 | Inventec Corporation | Fan-driven heat dissipating device with enhanced air blowing efficiency |
US20070121291A1 (en) * | 2005-11-30 | 2007-05-31 | Inventec Corporation | Heat sink module of a notebook computer |
US7327568B2 (en) * | 2004-05-10 | 2008-02-05 | Asustek Computer Inc. | Heat sink assembly with rotatable fins |
US7333332B2 (en) * | 2005-02-14 | 2008-02-19 | Inventec Corporation | Heatsink thermal module with noise improvement |
US7492588B2 (en) * | 2007-04-06 | 2009-02-17 | Furui Precise Component (Kunshan) Co., Ltd. | Heat dissipation apparatus with porous type heat dissipater |
US7568517B2 (en) * | 2005-08-05 | 2009-08-04 | Foxconn Technology Co., Ltd. | Thermal module |
-
2009
- 2009-05-21 CN CN2009103025118A patent/CN101896054A/zh active Pending
- 2009-07-22 US US12/507,781 patent/US20100294463A1/en not_active Abandoned
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5077601A (en) * | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
US4953634A (en) * | 1989-04-20 | 1990-09-04 | Microelectronics And Computer Technology Corporation | Low pressure high heat transfer fluid heat exchanger |
US5810072A (en) * | 1995-09-08 | 1998-09-22 | Semipower Systems, Inc. | Forced air cooler system |
US5867365A (en) * | 1997-06-10 | 1999-02-02 | Chiou; Ming Chin | CPU heat sink assembly |
US6421239B1 (en) * | 2000-06-06 | 2002-07-16 | Chaun-Choung Technology Corp. | Integral heat dissipating device |
US20020172008A1 (en) * | 2001-05-15 | 2002-11-21 | Mihalis Michael | High-performance heat sink for printed circuit boards |
US6688379B2 (en) * | 2001-06-13 | 2004-02-10 | Delta Electronics, Inc. | Heat dissipation device with high efficiency |
US7040384B2 (en) * | 2004-01-27 | 2006-05-09 | Molex Incorporated | Heat dissipation device |
US7327568B2 (en) * | 2004-05-10 | 2008-02-05 | Asustek Computer Inc. | Heat sink assembly with rotatable fins |
US20060039113A1 (en) * | 2004-08-19 | 2006-02-23 | Compal Electronics, Inc. | Heat dissipating device with dust-collecting mechanism |
US20060082968A1 (en) * | 2004-10-15 | 2006-04-20 | Inventec Corporation | Fool-proof device on heatsink thermal module for the notebook computer |
US20060144558A1 (en) * | 2004-12-30 | 2006-07-06 | Inventec Corporation | Fan-driven heat dissipating device with enhanced air blowing efficiency |
US7333332B2 (en) * | 2005-02-14 | 2008-02-19 | Inventec Corporation | Heatsink thermal module with noise improvement |
US7568517B2 (en) * | 2005-08-05 | 2009-08-04 | Foxconn Technology Co., Ltd. | Thermal module |
US20070121291A1 (en) * | 2005-11-30 | 2007-05-31 | Inventec Corporation | Heat sink module of a notebook computer |
US7492588B2 (en) * | 2007-04-06 | 2009-02-17 | Furui Precise Component (Kunshan) Co., Ltd. | Heat dissipation apparatus with porous type heat dissipater |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110310315A1 (en) * | 2010-06-18 | 2011-12-22 | Akifumi Yamaguchi | Television apparatus and electronic device |
US8531838B2 (en) * | 2010-06-18 | 2013-09-10 | Kabushiki Kaisha Toshiba | Television apparatus and electronic device |
US20120125570A1 (en) * | 2010-11-19 | 2012-05-24 | Inventec Corporation | Heat dissipating device |
US20120175079A1 (en) * | 2011-01-06 | 2012-07-12 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device having centrifugal fan |
US10375853B2 (en) | 2016-09-06 | 2019-08-06 | Apple Inc. | Electronic device with cooling fan |
CN112556269A (zh) * | 2017-03-08 | 2021-03-26 | 青岛海尔特种电冰柜有限公司 | 卧式风冷冷柜 |
US10285303B2 (en) * | 2017-07-14 | 2019-05-07 | Apple Inc. | Electronic device with integrated passive and active cooling |
US10757809B1 (en) * | 2017-11-13 | 2020-08-25 | Telephonics Corporation | Air-cooled heat exchanger and thermal arrangement for stacked electronics |
US11249523B2 (en) * | 2020-05-06 | 2022-02-15 | Quanta Computer Inc. | Adjustable air baffle for directing air flow in a computer system |
Also Published As
Publication number | Publication date |
---|---|
CN101896054A (zh) | 2010-11-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NIE, WEI-CHENG;YANG, HONG-CHENG;CAO, LEI;REEL/FRAME:022993/0583 Effective date: 20090710 Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NIE, WEI-CHENG;YANG, HONG-CHENG;CAO, LEI;REEL/FRAME:022993/0583 Effective date: 20090710 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |