US20070256957A1 - Sub-rack with housing for receiving plug-in modules - Google Patents
Sub-rack with housing for receiving plug-in modules Download PDFInfo
- Publication number
- US20070256957A1 US20070256957A1 US11/799,582 US79958207A US2007256957A1 US 20070256957 A1 US20070256957 A1 US 20070256957A1 US 79958207 A US79958207 A US 79958207A US 2007256957 A1 US2007256957 A1 US 2007256957A1
- Authority
- US
- United States
- Prior art keywords
- sub
- plug
- rack
- liquid distributor
- modules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
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Classifications
-
- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45B—WALKING STICKS; UMBRELLAS; LADIES' OR LIKE FANS
- A45B9/00—Details
- A45B9/02—Handles or heads
-
- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45B—WALKING STICKS; UMBRELLAS; LADIES' OR LIKE FANS
- A45B25/00—Details of umbrellas
- A45B25/12—Devices for holding umbrellas closed, e.g. magnetic devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20645—Liquid coolant without phase change within cabinets for removing heat from sub-racks
Definitions
- the present invention pertains to a sub-rack for plugging and unplugging electronic plug-in modules with a housing, which has a front cover plate and a cooling device for the plug-in modules.
- German patent publication DE 43 27 444 A1 describes a cooling device for a switchgear cabinet with electrical devices, which are liquid cooled.
- the liquid cooled components are each connected via a feed line and a return line to a common distributor, which is preferably constructed as a block.
- Disadvantages include a relatively complicated overall construction and likewise heat transfer that is difficult to implement.
- German patent publication DE 20 2004 010 204 U1 describes a sub-rack with a housing and with modular electronic components, which are insertable and removable.
- the sub-rack has at least one liquid distributor in the housing.
- the liquid distributors are arranged in the housing above or below the push-in area of the plug-in modules.
- the housing is designed for pure liquid cooling. In this embodiment, liquid cooling must be provided in the housing of the sub-rack in advance. Subsequent installation in an air cooled sub-rack is not possible or is possible only with much difficulty.
- the problem of the present invention is to create a sub-rack with a housing for receiving electronic plug-in modules, which can be easily equipped with liquid cooling at a later time. This should be possible, in particular for housings with sub-racks installed in an electronics cabinet.
- the present invention provides a sub-rack for plugging and unplugging electronic plug-in modules including a housing with a front cover plate and a cooling device for the plug-in modules.
- the cooling device comprises a heat sink arranged on the plug-in module and a liquid distributor that is in flow connection with the heat sink via a feed line and a return line.
- the liquid distributor is arranged on the outside in the front region of the sub-rack.
- a liquid distributor can be easily arranged on the outside of the sub-rack.
- the liquid distributor is easily accessible.
- the feed line and the return line to the heat sink can be easily coupled and fixed to the liquid distributor on the plug-in module.
- sub-racks installed in switchgear cabinets can be easily expanded. The sub-rack need not be removed from the switchgear cabinet to subsequently install a cooling device for the plug-in modules.
- the liquid distributor is arranged for this purpose detachably in the front region.
- the ability to detach the distributor allows not only simple assembly but also disassembly, if the distributor is no longer necessary, or retrofitting, if, for example, a different liquid distributor is necessary due to changed requirements.
- the sub-rack according to the invention has the advantage that the liquid distributor is freely accessible from the front side of the sub-rack, because it is located in the front region. Maintaining and checking the liquid distributor, especially visual checking, is especially easy to perform also during the operation of the modules.
- the sub-rack according to the invention has a receptacle for receiving the liquid distributor in its front region.
- This receptacle can be constructed, for example, in the form of a flange, into which the liquid distributor is pressed or clipped.
- the receptacle can also consist of one or more bores, so that the liquid distributor can be screwed in the front region of the sub-rack.
- a receptacle for receiving the liquid distributor on the front cover plate of the sub-rack.
- the liquid distributor sits in the front region above or below the plug-in modules. Inserting and removing plug-in modules into and out of the sub-rack is not obstructed by the liquid distributor.
- This arrangement also has the advantage that the feed and return line to the heat sink, which is arranged on the plug-in module, can be relatively short, because the liquid distributor is arranged in the immediate vicinity of the modules.
- a liquid distributor can also be arranged at the edge regions of the sub-rack, that is, on the side of the push in area of the plug-in modules.
- a dummy plate can also be provided, which is arranged next to or between two plug-in modules in the front region of the sub-rack and flush with the front plates of the plug-in modules.
- this embodiment is important only when the sub-rack is not completely equipped with plug-in modules.
- a sub-rack according to the invention is constructed so that several liquid distributors can be arranged in the front region of the sub-rack.
- several liquid distributor can be retrofitted on one sub-rack.
- the sub-rack can also be expanded successively, in which, according to the requirements and number of plug-in modules to be cooled, several or additional liquid distributors are installed.
- the individual liquid distributors are correspondingly small, so that a space saving construction is possible.
- the individual liquid distributors can be coupled to each other, so that, in terms of flow, a large liquid distributor with many connections for several heat sinks is produced.
- additional plug-in modules are retrofitted with liquid cooling, the existing liquid distributors can be kept. Additional liquid distributors are then installed. This can also be realized with a “hot plug method” if the given plug-in modules are exchanged only for plug-in modules with liquid cooling, while the unaffected plug-in modules continue to operate.
- a sub-rack according to the invention is arranged in a cabinet, especially in an electronics cabinet or switchgear cabinet with a nineteen inch format.
- the switchgear cabinet has angular profiles in the front region, so that the liquid distributor is fixed to the angular profiles of the cabinet.
- the liquid distributor can be arranged and mounted directly on the angular profiles or on a special front cover plate, which is fixed, for example, to the two side angular profiles of the switchgear cabinet.
- more space is available for retrofitting liquid distributors, so that large liquid distributors with several feed and return lines can also be used for simultaneously supplying several plug-in modules.
- a cooling device for liquid cooling is also provided. This allows the cooling of “hot spots,” that is, especially hot zones. Plug-in modules can be cooled separately or selectively according to the individual requirements of cooling. For expanding an air cooled sub-rack by liquid cooling, the liquid cooled plug-in module is also still cooled by air cooling, so that the cooling efficiency is increased.
- FIG. 1 is a perspective view of a sub-rack with a housing and two inserted plug-in modules in accordance with the invention
- FIG. 2 is a perspective view showing a sub-rack with a liquid distributor for connecting six liquid cooled plug-in modules;
- FIG. 3 is a perspective view showing a sub-rack with a liquid distributor, and which is completely equipped with liquid cooled plug-in modules;
- FIG. 4 is a perspective view of a plug-in module with two heat sinks
- FIG. 5 is a detail front elevation of the top corner area of the sub-rack shown in FIG. 1 ;
- FIG. 6 is a detail side elevation of the top corner area shown in FIG. 5 .
- FIGS. 1 , 2 , and 3 each show a sub-rack 1 with a housing 2 , into which plug-in modules 3 are pushed.
- a front cover plate 5 is provided above a push in area 6 , which area is for inserting and removing the plug-in modules 3 .
- an air inlet plate 7 Underneath the push in area 6 there is an air inlet plate 7 , which has a screen-like construction, so that several small air inlet openings are provided for air-cooling the sub-rack 1 .
- the two plug-in modules 3 each have two through-holes 9 on their front plates 8 . Cooling fluid feed lines 10 and return lines 11 of a cooling device for liquid cooling are guided through the through-holes 9 , see FIG. 4 also.
- the front cover plate 5 arranged above the push in area 6 for the plug-in modules 3 has a liquid distributor 12 , which is a component of the cooling device.
- the liquid distributor 12 is fixed on the front cover plate 5 of the sub-rack 1 .
- the front cover plate 5 is connected detachably to the housing 2 of the sub-rack 1 at opposed angular profiles of the housing, so that the front cover plate 5 can be exchanged together with the liquid distributor 12 .
- Fixing the liquid distributor 12 on a separate front cover plate 5 , which is fixed detachably to the sub-rack 1 is especially preferred because liquid cooling for a sub-rack can be retrofitted through simple replacement of the front cover plate 5 .
- FIG. 2 likewise shows a sub-rack 1 according to the invention, whose push in area 6 is filled completely with plug-in modules 3 . Five of the plug-in modules 3 are provided with liquid cooling.
- the liquid distributor 12 arranged above the push in area 6 preferably has a distributor housing 13 with a cover side 14 , which is aligned parallel to the front cover plate 5 . At least two line connections 15 for connecting a coupling 22 are provided on the cover side 14 , FIG. 5 .
- the liquid distributor 12 has several line connections 15 , which are arranged in two rows one above the other. Line connections 15 a of the top row are provided for connecting respective feed lines 10 . Lower line connections 15 b , FIGS. 2 and 6 , are provided for connecting to respective return lines 11 . Thus, two line connections 15 are used for connecting the cooling device of each plug-in module 3 .
- a main feed line 17 a and a main return line 17 b which are connected to a not shown heat exchanger, are arranged on one side wall 16 of the distributor housing 13 of the liquid distributor 12 .
- the heat exchanger is arranged in the same switchgear cabinet as the sub-rack.
- FIG. 3 shows a sub-rack 1 with a liquid distributor, which extends over the entire width of the sub-rack 1 and which provides possible connections for each insertable plug-in module 3 .
- a liquid distributor 12 includes possible connections for a total of fourteen plug-in modules 3 in the use of nineteen inch sub-racks.
- the sub-racks 1 shown explicitly in FIGS. 2 and 3 each have a liquid distributor 12 , which extends over the entire width of the sub-rack 1 .
- the liquid distributor 12 may have only connections for a few plug-in modules 3 , especially for three plug-in modules 3 , as shown in FIG. 5 , for example.
- the liquid distributor 12 then extends only over the width of three modules. It is constructed as a small block.
- Such a liquid distributor 12 shown in FIG. 5 , shows the arrangement at the upper left corner of a sub-rack 1 .
- the liquid distributor 12 has line connections 15 for a total of three modules.
- a receptacle 18 on which another liquid distributor 12 can be attached, if additional plug-in modules 3 are to be later provided with liquid cooling.
- a cooperating clip, not shown, of a liquid distributor 12 may be disposed. In this way, the liquid distributor 12 is easy to install.
- FIG. 4 shows in detail a plug-in module 3 with cooling bodies or heat sinks 19 and two through-holes 9 on a front plate 8 for feeding through the feed line 10 and the return line 11 .
- This plug-in module 3 is likewise suitable for holding in a sub-rack 1 .
- the spacing between the feed line 10 and return line 11 in the embodiment shown in FIG. 4 is greater than for the embodiments of the plug-in modules shown in the other drawing figures, but otherwise the embodiments are all constructed in the same way.
- the feed line 10 may be disposed above or below the return line 11 in the various drawing figures. The arrangement of the feed and return lines in this respect may not be important.
- a flexible line section 20 and 21 on each of which a coupling 22 is arranged, is provided at the free end of the feed line 10 and the return line 11 , respectively.
- the couplings 22 have an arc shaped or angled construction. The angle here is advantageously between 60° and 125°. Especially preferred is an angle of 90°, like that of the couplings 22 shown in the drawing figures.
- Such couplings 22 are especially well suited for connecting to a liquid distributor 12 , whose line connections 15 a and 15 b are arranged on the cover side 14 . Bending and resulting damage to the line sections 20 , 21 is reliably prevented.
- the liquid distributor 12 projects only slightly past the front region 4 of the sub-rack 1 , so that the sub-rack 1 with coupling 22 attached to the cooling device is deeper than an air cooled sub-rack.
- the couplings 22 extend only slightly past a cable collection plate 23 , which is arranged above the liquid distributor 12 and which can be provided in sub-racks such as the sub-rack 1 .
- the sub-rack 1 according to FIGS. 1 , 2 , and 3 includes a combined air and liquid cooling system, because the plug-in modules 3 arranged in the sub-rack 1 can be cooled first via air cooling, and second via liquid cooling.
- the cold air for air cooling flows through the air inlet plate 7 in the sub-rack 1 .
- sub-rack housing for receiving plug-in modules The construction and operation of the sub-rack housing for receiving plug-in modules according to the present invention is believed to be within the purview of one skilled in the art based on the foregoing description. Conventional engineering materials and practices may be used to construct the sub-rack with housing for receiving plug-in modules as shown and described.
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202006007275U DE202006007275U1 (de) | 2006-05-06 | 2006-05-06 | Baugruppenträger mit einem Gehäuse zur Aufnahme von Steckbaugruppen |
DE202006007275.6 | 2006-05-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070256957A1 true US20070256957A1 (en) | 2007-11-08 |
Family
ID=37026749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/799,582 Abandoned US20070256957A1 (en) | 2006-05-06 | 2007-05-02 | Sub-rack with housing for receiving plug-in modules |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070256957A1 (de) |
EP (1) | EP1853101B1 (de) |
JP (1) | JP2007300107A (de) |
DE (2) | DE202006007275U1 (de) |
RU (1) | RU2364058C2 (de) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080212265A1 (en) * | 2007-01-23 | 2008-09-04 | Paul Mazura | Switchgear Cabinet for Accommodating Electronic Plug-In Modules with a Heat Exchanger |
US20130025818A1 (en) * | 2011-07-27 | 2013-01-31 | Coolit Systems, Inc. | Modular heat-transfer systems |
US20130299232A1 (en) * | 2012-05-11 | 2013-11-14 | Raytheon Company | Electronics enclosures with high thermal performance and related system and method |
US20140085821A1 (en) * | 2012-09-25 | 2014-03-27 | Liquidcool Solutions, Inc. | Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices |
US9468131B2 (en) | 2014-04-16 | 2016-10-11 | Raytheon Company | Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels |
US9943014B2 (en) | 2013-03-15 | 2018-04-10 | Coolit Systems, Inc. | Manifolded heat exchangers and related systems |
US20180320982A1 (en) * | 2015-10-15 | 2018-11-08 | Nec Platforms, Ltd. | Cooling device and cooling system |
CN109690763A (zh) * | 2016-10-20 | 2019-04-26 | 西门子股份公司 | 具有封闭壳体和冷却装置的开关柜 |
US10364809B2 (en) | 2013-03-15 | 2019-07-30 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
US10765030B2 (en) | 2015-10-30 | 2020-09-01 | Vapor IO Inc. | Adapters for rack-mounted computing equipment |
US20220046827A1 (en) * | 2020-08-10 | 2022-02-10 | Beijing Silicon Based Voyage Technology Co., Ltd. | Server |
US20220124944A1 (en) * | 2019-02-05 | 2022-04-21 | Nec Platform, Ltd. | Pipe protection device and cooling device |
US11395443B2 (en) | 2020-05-11 | 2022-07-19 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
US11452243B2 (en) | 2017-10-12 | 2022-09-20 | Coolit Systems, Inc. | Cooling system, controllers and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
US20220338384A1 (en) * | 2021-04-20 | 2022-10-20 | Dell Products, Lp | Modular horizontal rack manifold for liquid cooling |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007048640A1 (de) | 2007-03-14 | 2008-09-25 | SCHäFER WERKE GMBH | Schaltschrank zur Aufnahme elektronischer Systemkomponenten |
DE102009006924B3 (de) * | 2009-02-02 | 2010-08-05 | Knürr AG | Betriebsverfahren und Anordnung zum Kühlen von elektrischen und elektronischen Bauelementen und Moduleinheiten in Geräteschränken |
CN101873781B (zh) * | 2010-06-28 | 2012-01-04 | 华为技术有限公司 | 插拔机构、具有该插拔机构的成品板和插框 |
Citations (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3481393A (en) * | 1968-01-15 | 1969-12-02 | Ibm | Modular cooling system |
US5285347A (en) * | 1990-07-02 | 1994-02-08 | Digital Equipment Corporation | Hybird cooling system for electronic components |
US5343358A (en) * | 1993-04-26 | 1994-08-30 | Ncr Corporation | Apparatus for cooling electronic devices |
US5731954A (en) * | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
US5740018A (en) * | 1996-02-29 | 1998-04-14 | The United States Of America As Represented By The Secretary Of The Navy | Environmentally controlled circuit pack and cabinet |
US5946191A (en) * | 1997-03-27 | 1999-08-31 | Nec Corporation | Electronic device having a plug-in unit with a heat sink structure |
US6016251A (en) * | 1997-11-27 | 2000-01-18 | Ando Electric Co., Ltd. | Printed circuit board and cooling system therefor |
US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
US6196003B1 (en) * | 1999-11-04 | 2001-03-06 | Pc/Ac, Inc. | Computer enclosure cooling unit |
US6234240B1 (en) * | 1999-07-01 | 2001-05-22 | Kioan Cheon | Fanless cooling system for computer |
US6313990B1 (en) * | 2000-05-25 | 2001-11-06 | Kioan Cheon | Cooling apparatus for electronic devices |
US6407916B1 (en) * | 2000-06-12 | 2002-06-18 | Intel Corporation | Computer assembly for cooling high powered microprocessors |
US6536510B2 (en) * | 2001-07-10 | 2003-03-25 | Thermal Corp. | Thermal bus for cabinets housing high power electronics equipment |
US6563709B2 (en) * | 2000-07-21 | 2003-05-13 | Mitsubishi Materials Corporation | Liquid-cooled heat sink and manufacturing method thereof |
US6657121B2 (en) * | 2001-06-27 | 2003-12-02 | Thermal Corp. | Thermal management system and method for electronics system |
US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
US6747869B2 (en) * | 1999-06-02 | 2004-06-08 | Guangji Dong | Microcomputer heat dissipation system |
US6763880B1 (en) * | 2003-06-26 | 2004-07-20 | Evserv Tech Corporation | Liquid cooled radiation module for servers |
US6798660B2 (en) * | 2003-02-13 | 2004-09-28 | Dell Products L.P. | Liquid cooling module |
US6804117B2 (en) * | 2002-08-14 | 2004-10-12 | Thermal Corp. | Thermal bus for electronics systems |
US6807056B2 (en) * | 2002-09-24 | 2004-10-19 | Hitachi, Ltd. | Electronic equipment |
US6828675B2 (en) * | 2001-09-26 | 2004-12-07 | Modine Manufacturing Company | Modular cooling system and thermal bus for high power electronics cabinets |
US20050133214A1 (en) * | 2003-12-19 | 2005-06-23 | Teradyne, Inc. | Modular rackmount chiller |
US20050250435A1 (en) * | 2001-05-16 | 2005-11-10 | Sharp Anthony C | Cooling airflow distribution device |
US7011143B2 (en) * | 2004-05-04 | 2006-03-14 | International Business Machines Corporation | Method and apparatus for cooling electronic components |
US7012807B2 (en) * | 2003-09-30 | 2006-03-14 | International Business Machines Corporation | Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack |
US7013955B2 (en) * | 2003-07-28 | 2006-03-21 | Thermal Corp. | Flexible loop thermosyphon |
US7024573B2 (en) * | 2002-02-05 | 2006-04-04 | Hewlett-Packard Development Company, L.P. | Method and apparatus for cooling heat generating components |
US7057893B2 (en) * | 2002-03-11 | 2006-06-06 | Rittal Gmbh & Co. Kg | Cooling array |
US7097047B2 (en) * | 2003-09-30 | 2006-08-29 | Dell Products L.P. | Cable management flip tray assembly |
US20070121287A1 (en) * | 2004-02-17 | 2007-05-31 | Doerrich Martin | Housing arrangement |
US7295436B2 (en) * | 2005-12-10 | 2007-11-13 | Kioan Cheon | Cooling system for computer components |
US20070274043A1 (en) * | 2006-05-26 | 2007-11-29 | Younes Shabany | Liquid-Air Hybrid Cooling in Electronics Equipment |
US7318322B2 (en) * | 2003-02-14 | 2008-01-15 | Hitachi, Ltd. | Liquid cooling system for a rack-mount server system |
US7355852B2 (en) * | 2004-09-30 | 2008-04-08 | Amphenol Corporation | Modular liquid cooling of electronic assemblies |
US20080093054A1 (en) * | 2006-08-29 | 2008-04-24 | Tilton Charles L | Manifold for a Two-Phase Cooling System |
US20080212265A1 (en) * | 2007-01-23 | 2008-09-04 | Paul Mazura | Switchgear Cabinet for Accommodating Electronic Plug-In Modules with a Heat Exchanger |
US7428151B2 (en) * | 2004-11-09 | 2008-09-23 | Rittal Res Electronic Systems Gmbh & Co. Kg | Cooling arrangement |
US7450385B1 (en) * | 2007-06-15 | 2008-11-11 | International Business Machines Corporation | Liquid-based cooling apparatus for an electronics rack |
US7457118B1 (en) * | 2003-12-19 | 2008-11-25 | Emc Corporation | Method and apparatus for dispersing heat from high-power electronic devices |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5091765A (de) * | 1973-12-20 | 1975-07-22 | ||
JPS5580399A (en) * | 1978-12-13 | 1980-06-17 | Fujitsu Ltd | Electronic device cooling structure |
GB9215442D0 (en) * | 1992-07-21 | 1992-09-02 | British Aerospace | Cooling of electronic components |
DE4327444A1 (de) * | 1993-08-14 | 1995-02-16 | Indramat Gmbh | Kühleinrichtung für einen Schaltschrank |
DE202004010204U1 (de) * | 2004-06-30 | 2004-09-16 | Schroff Gmbh | Gehäuse mit modularen elektronischen Baugruppen |
-
2006
- 2006-05-06 DE DE202006007275U patent/DE202006007275U1/de not_active Expired - Lifetime
-
2007
- 2007-04-24 DE DE502007000198T patent/DE502007000198D1/de active Active
- 2007-04-24 EP EP07008287A patent/EP1853101B1/de not_active Expired - Fee Related
- 2007-04-26 JP JP2007116979A patent/JP2007300107A/ja active Pending
- 2007-05-02 US US11/799,582 patent/US20070256957A1/en not_active Abandoned
- 2007-05-07 RU RU2007116855/09A patent/RU2364058C2/ru not_active IP Right Cessation
Patent Citations (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3481393A (en) * | 1968-01-15 | 1969-12-02 | Ibm | Modular cooling system |
US5285347A (en) * | 1990-07-02 | 1994-02-08 | Digital Equipment Corporation | Hybird cooling system for electronic components |
US5343358A (en) * | 1993-04-26 | 1994-08-30 | Ncr Corporation | Apparatus for cooling electronic devices |
US5740018A (en) * | 1996-02-29 | 1998-04-14 | The United States Of America As Represented By The Secretary Of The Navy | Environmentally controlled circuit pack and cabinet |
US5731954A (en) * | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
US5946191A (en) * | 1997-03-27 | 1999-08-31 | Nec Corporation | Electronic device having a plug-in unit with a heat sink structure |
US6016251A (en) * | 1997-11-27 | 2000-01-18 | Ando Electric Co., Ltd. | Printed circuit board and cooling system therefor |
US6747869B2 (en) * | 1999-06-02 | 2004-06-08 | Guangji Dong | Microcomputer heat dissipation system |
US6234240B1 (en) * | 1999-07-01 | 2001-05-22 | Kioan Cheon | Fanless cooling system for computer |
US6196003B1 (en) * | 1999-11-04 | 2001-03-06 | Pc/Ac, Inc. | Computer enclosure cooling unit |
US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
US6313990B1 (en) * | 2000-05-25 | 2001-11-06 | Kioan Cheon | Cooling apparatus for electronic devices |
US6407916B1 (en) * | 2000-06-12 | 2002-06-18 | Intel Corporation | Computer assembly for cooling high powered microprocessors |
US6563709B2 (en) * | 2000-07-21 | 2003-05-13 | Mitsubishi Materials Corporation | Liquid-cooled heat sink and manufacturing method thereof |
US20050250435A1 (en) * | 2001-05-16 | 2005-11-10 | Sharp Anthony C | Cooling airflow distribution device |
US6657121B2 (en) * | 2001-06-27 | 2003-12-02 | Thermal Corp. | Thermal management system and method for electronics system |
US6536510B2 (en) * | 2001-07-10 | 2003-03-25 | Thermal Corp. | Thermal bus for cabinets housing high power electronics equipment |
US6828675B2 (en) * | 2001-09-26 | 2004-12-07 | Modine Manufacturing Company | Modular cooling system and thermal bus for high power electronics cabinets |
US7024573B2 (en) * | 2002-02-05 | 2006-04-04 | Hewlett-Packard Development Company, L.P. | Method and apparatus for cooling heat generating components |
US7057893B2 (en) * | 2002-03-11 | 2006-06-06 | Rittal Gmbh & Co. Kg | Cooling array |
US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
US6804117B2 (en) * | 2002-08-14 | 2004-10-12 | Thermal Corp. | Thermal bus for electronics systems |
US6807056B2 (en) * | 2002-09-24 | 2004-10-19 | Hitachi, Ltd. | Electronic equipment |
US6798660B2 (en) * | 2003-02-13 | 2004-09-28 | Dell Products L.P. | Liquid cooling module |
US7318322B2 (en) * | 2003-02-14 | 2008-01-15 | Hitachi, Ltd. | Liquid cooling system for a rack-mount server system |
US6763880B1 (en) * | 2003-06-26 | 2004-07-20 | Evserv Tech Corporation | Liquid cooled radiation module for servers |
US7013955B2 (en) * | 2003-07-28 | 2006-03-21 | Thermal Corp. | Flexible loop thermosyphon |
US7097047B2 (en) * | 2003-09-30 | 2006-08-29 | Dell Products L.P. | Cable management flip tray assembly |
US7012807B2 (en) * | 2003-09-30 | 2006-03-14 | International Business Machines Corporation | Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack |
US20050133214A1 (en) * | 2003-12-19 | 2005-06-23 | Teradyne, Inc. | Modular rackmount chiller |
US7484552B2 (en) * | 2003-12-19 | 2009-02-03 | Amphenol Corporation | Modular rackmount chiller |
US7457118B1 (en) * | 2003-12-19 | 2008-11-25 | Emc Corporation | Method and apparatus for dispersing heat from high-power electronic devices |
US20070121287A1 (en) * | 2004-02-17 | 2007-05-31 | Doerrich Martin | Housing arrangement |
US7466549B2 (en) * | 2004-02-17 | 2008-12-16 | Rittal Gmbh & Co. Kg | Cooling arrangement for server blades |
US7011143B2 (en) * | 2004-05-04 | 2006-03-14 | International Business Machines Corporation | Method and apparatus for cooling electronic components |
US7355852B2 (en) * | 2004-09-30 | 2008-04-08 | Amphenol Corporation | Modular liquid cooling of electronic assemblies |
US7428151B2 (en) * | 2004-11-09 | 2008-09-23 | Rittal Res Electronic Systems Gmbh & Co. Kg | Cooling arrangement |
US7295436B2 (en) * | 2005-12-10 | 2007-11-13 | Kioan Cheon | Cooling system for computer components |
US20070274043A1 (en) * | 2006-05-26 | 2007-11-29 | Younes Shabany | Liquid-Air Hybrid Cooling in Electronics Equipment |
US20080093054A1 (en) * | 2006-08-29 | 2008-04-24 | Tilton Charles L | Manifold for a Two-Phase Cooling System |
US20080212265A1 (en) * | 2007-01-23 | 2008-09-04 | Paul Mazura | Switchgear Cabinet for Accommodating Electronic Plug-In Modules with a Heat Exchanger |
US7450385B1 (en) * | 2007-06-15 | 2008-11-11 | International Business Machines Corporation | Liquid-based cooling apparatus for an electronics rack |
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Also Published As
Publication number | Publication date |
---|---|
RU2007116855A (ru) | 2008-11-20 |
JP2007300107A (ja) | 2007-11-15 |
RU2364058C2 (ru) | 2009-08-10 |
EP1853101B1 (de) | 2008-10-29 |
DE502007000198D1 (de) | 2008-12-11 |
EP1853101A1 (de) | 2007-11-07 |
DE202006007275U1 (de) | 2006-09-07 |
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