US20060182638A1 - Vacuum device and vacuum pump - Google Patents

Vacuum device and vacuum pump Download PDF

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Publication number
US20060182638A1
US20060182638A1 US10/548,225 US54822505A US2006182638A1 US 20060182638 A1 US20060182638 A1 US 20060182638A1 US 54822505 A US54822505 A US 54822505A US 2006182638 A1 US2006182638 A1 US 2006182638A1
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United States
Prior art keywords
pump
vacuum
pumps
ejector
vacuum pump
Prior art date
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Abandoned
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US10/548,225
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English (en)
Inventor
Tadahiro Ohmi
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Foundation for Advancement of International Science
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Foundation for Advancement of International Science
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Assigned to FOUNDATION FOR ADVANCEMENT OF INTERNATIONAL SCIENCE reassignment FOUNDATION FOR ADVANCEMENT OF INTERNATIONAL SCIENCE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OHMI, TADAHIRO
Publication of US20060182638A1 publication Critical patent/US20060182638A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
    • F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/005—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of dissimilar working principle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • F04D19/046—Combinations of two or more different types of pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
    • F04F5/00—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow
    • F04F5/14—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid
    • F04F5/16—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid displacing elastic fluids
    • F04F5/20—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid displacing elastic fluids for evacuating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
    • F04F5/00—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow
    • F04F5/54—Installations characterised by use of jet pumps, e.g. combinations of two or more jet pumps of different type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C18/00—Rotary-piston pumps specially adapted for elastic fluids
    • F04C18/08—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing
    • F04C18/12—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type
    • F04C18/14—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type with toothed rotary pistons
    • F04C18/16—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type with toothed rotary pistons with helical teeth, e.g. chevron-shaped, screw type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2220/00—Application
    • F04C2220/10—Vacuum
    • F04C2220/12—Dry running

Definitions

  • Vacuum apparatuses have been used in the semiconductor manufacturing field and many other industrial fields.
  • the vacuum apparatuses each generally comprise a vacuum chamber and a vacuum pump for keeping the inside of the vacuum chamber in a vacuum or pressure-reduced state.
  • the vacuum apparatus is disposed in a clean room and is configured to perform predetermined processing while introducing and exhausting a predetermined process gas into and from the vacuum chamber.
  • This vacuum apparatus comprises a plurality of reaction chambers (vacuum chambers) 10 , 11 , and 12 , high vacuum pumps 1 , 2 , and 3 as first vacuum pumps one or a plurality of which are arranged for each of the reaction chambers 10 , 11 , and 12 in order to bring the inside thereof into a pressure-reduced or vacuum state, and booster pumps 4 a , 5 a , and 6 a as second vacuum pumps and back pumps 4 b , 5 b , and 6 b as third vacuum pumps that are arranged at subsequent stages of the high vacuum pumps, respectively.
  • valves 22 , 23 , and 24 are provided between the high vacuum pumps 1 , 2 , and 3 and the booster pumps 4 a , 5 a , and 6 a , respectively.
  • load lock chambers 13 and 14 for transferring processing objects such as wafers to the reaction chambers 10 , 11 , and 12 and a transfer chamber 15 provided therein with a robot (transfer apparatus) that transfers the processing objects, brought into the load lock chamber 13 , into the reaction chambers 10 , 11 , and 12 and transfers them from the reaction chambers 10 , 11 , and 12 into the load lock chamber 14 .
  • a robot transfer apparatus
  • a booster pump 8 a and a back pump 8 b are connected to the load lock chamber 13
  • a booster pump 7 a and a back pump 7 b are connected to the load lock chamber 14
  • a booster pump 9 a and a back pump 9 b are connected to the transfer chamber 15 , thereby being capable of bringing those chambers into pressure-reduced or vacuum states, respectively.
  • reaction chambers 10 , 11 , and 12 are each provided with a gas inlet and heating means such as a heater to thereby carry out predetermined processing such as film formation while introducing a predetermined gas under heating.
  • symbols A 1 denote pipes between the high vacuum pumps 1 , 2 , and 3 and the booster pumps 4 a , 5 a , and 6 a , respectively
  • symbols A 2 denote pipes between the reaction chambers 10 , 11 , and 12 and the high vacuum pumps 1 , 2 , and 3 , respectively.
  • symbol R denotes a clean room.
  • a cassette with a plurality of processing objects such as wafers placed therein is brought into the load lock chamber 13 from the atmosphere outside the apparatus and the load lock chamber 13 is exhausted.
  • a gate valve (not illustrated) between the load lock chamber 13 and the transfer chamber 15 is opened and the processing object transfer robot uses its transfer arm to pick up one of the processing objects from the cassette and transfer it into the transfer chamber 15 .
  • a gate valve (not illustrated) between the reaction chamber 10 and the transfer chamber 15 is opened and the processing object is placed on a stage in the reaction chamber 10 by the use of the transfer arm.
  • the processed object is transferred into the other reaction chamber 11 or 12 or the load lock chamber 14 by the use of the transfer arm.
  • the processed object is finally transferred to the exterior from the load lock chamber 14 .
  • the high vacuum pump of a high vacuum pump that operates in the molecular area of ultimate vacuum ( 10 ⁇ 7 torr or less).
  • a turbomolecular pump or a thread groove pump is generally used as the high vacuum pump.
  • the turbomolecular pump and the thread groove pump each generally have a low allowable back pressure of 1 torr or less (specifically 0.5 torr or less and more specifically about 0.4 torr) while the pumping speed is high even with a small size. Therefore, there is/are provided, at the subsequent stage of the high vacuum pump, an intermediate/low vacuum pump or intermediate/low vacuum pumps in one or two stages which each operate at a relatively low back pressure while the ultimate vacuum is relatively low.
  • a booster pump or the like is provided subsequent to the high vacuum pump as an intermediate vacuum pump and, further, a Roots pump or the like is provided subsequent to the booster pump as a low vacuum pump that operates at a relatively low back pressure while the ultimate vacuum is low.
  • a vacuum apparatus of this type having a plurality of stages of vacuum pumps for use in the semiconductor device manufacturing field is disclosed, for example, in Japanese Unexamined Patent Application Publication (JP-A) No. 2002-39061.
  • vacuum apparatus for use in manufacturing semiconductor devices
  • These vacuum pumps often have mutually different structures as described above, but are all driven by electric motors. Accordingly, in the vacuum apparatus of this type where the number of vacuum pumps used is large, the power consumption increases. Since the power consumption of the vacuum apparatus resultantly affects the manufacturing cost of the semiconductor device, it is desired to reduce the power consumption.
  • the low vacuum pump (back pump) at the last stage among the multistage vacuum pumps is required to have a large capacity, the power consumption thereof is also large. Therefore, it is effective to suppress the power consumption of the back pump for a reduction in power consumption of the whole vacuum apparatus and thus a reduction in manufacturing cost of the semiconductor device, which is thus desirable.
  • a vacuum apparatus comprising a vacuum chamber having a gas inlet and a gas outlet, and mechanical vacuum pumps arranged in a plurality of stages in series and connected to the vacuum chamber for reducing a pressure inside the vacuum chamber and maintaining a pressure-reduced state.
  • the vacuum apparatus comprises an ejector pump connected to a discharge port of the vacuum pump at the last stage in the vacuum pumps for assisting a pressure reducing operation of the vacuum pump at the last stage and suppressing back diffusion from the discharge port.
  • the vacuum apparatus wherein the auxiliary pump is the ejector pump additionally attached to the discharge port of the pump at the last stage.
  • the vacuum apparatus wherein the auxiliary pump is the ejector pump incorporated in the pump at the last stage so as to form a device integral with the pump at the last stage.
  • a vacuum apparatus comprising a vacuum chamber having a gas inlet and a gas outlet and mechanical vacuum pumps in a plurality of stages connected to the vacuum chamber for reducing a pressure inside the vacuum chamber and maintaining a pressure-reduced state.
  • the vacuum apparatus comprises an ejector pump connected to a discharge port of the vacuum pump at the last stage in the vacuum pumps.
  • a vacuum apparatus comprising a vacuum chamber having a gas inlet and a gas outlet, a first vacuum pump for maintaining the inside of the vacuum chamber to be reduced in pressure, a second vacuum pump connected at a subsequent stage of the first vacuum pump, and a third vacuum pump connected at a subsequent stage of the second vacuum pump.
  • the first vacuum pump is a turbomolecular pump or a thread groove pump
  • the second vacuum pump is a booster pump
  • the third vacuum pump is a dry pump and that an ejector pump is added to the inside or the outside of the third vacuum pump.
  • a vacuum pump comprising an ejector pump portion at a discharge port exposed to the atmospheric side.
  • the vacuum pump wherein the ejector pump portion is additionally attached to the outside of the vacuum pump.
  • the vacuum pump wherein the ejector pump portion is incorporated in the vacuum pump.
  • the vacuum pump wherein the vacuum pump is a screw pump or a Roots pump.
  • the vacuum apparatus or the vacuum pump of this invention it is possible to suppress the power consumption of the vacuum pump as compared with conventional and, as a result, to reduce the manufacturing cost of a semiconductor device.
  • FIG. 1 is a schematic diagram showing a vacuum apparatus for semiconductor manufacturing to be applied with this invention
  • FIGS. 2 ,( a ) and ( b ) are sectional views showing a screw pump as a last-stage vacuum pump in a vacuum apparatus according to an embodiment 1 of this invention
  • FIG. 3 is a sectional view showing an ejector pump in the vacuum apparatus according to the embodiment 1 of this invention.
  • FIGS. 4 ,( a ) and ( b ) are sectional views showing a screw pump as a last-stage vacuum pump in a vacuum apparatus according to an embodiment 2 of this invention.
  • FIG. 5 is a diagram showing the relationship between inlet pressure and power consumption of the pump along with that of a comparative example for explaining the operation and effect of this invention.
  • a vacuum apparatus according to each embodiment of this invention is systemically the same as the vacuum apparatus shown in FIG. 1 . Therefore, explanation about the same structure as that in FIG. 1 is omitted.
  • This invention particularly has a feature in the back pumps 4 b , 5 b , and 6 b serving as the last-stage (third) vacuum pumps in FIG. 1 .
  • the back pumps 4 b , 5 b , and 6 b are each provided with an ejector pump that can mainly assist a pressure reducing operation by the back pump or suppress back diffusion from a discharge port, as will be described in detail later.
  • screw pumps A are used as the back pumps 4 b , 5 b , and 6 b in FIG. 1 , respectively.
  • a male rotor 25 and a female rotor 26 of the screw pump A are received in a main casing 42 and rotatably supported by bearings 35 and 36 attached to an end plate 43 sealing the main casing 42 on its one end side and bearings 37 and 38 attached to an auxiliary casing 46 , respectively.
  • Timing gears 31 and 32 accommodated in the auxiliary casing 46 are mounted on rotation shafts 27 and 28 of the male and female rotors 25 and 26 , respectively, and a gap between the male rotor 25 and the female rotor 26 is adjusted so that both rotors do not contact each other. Further, a motor M is attached to the rotation shaft of the male rotor 25 through a coupling or timing gear. It is configured that the rotation of the motor M is transmitted to the male rotor 25 and rotates the female rotor 26 through the timing gears 31 and 32 .
  • An auxiliary casing 55 provided with an inlet port 56 is attached to the main casing 42 on its one end side. Further, the end plate 43 of the main casing 42 is formed with a discharge port 57 for discharging a gas compressed by the male rotor 25 and the female rotor 26 .
  • a cooling jacket 33 is formed on the outside of the main casing 42 .
  • a coolant such as water is caused to flow in the cooling jacket 33 to thereby cool the main casing 42 , the compressed gas, and so on.
  • an ejector pump 60 connected to the discharge port 57 of each screw pump A so as to suppress back diffusion through the discharge port 57 from the exterior at the atmospheric pressure.
  • the ejector pump 60 is additionally attached to the discharge port 57 of the screw pump A as a component different from the screw pump A.
  • the ejector pump 60 comprises an inlet port 62 , a gas inlet 63 , a diffuser 64 , and a discharge port 65 .
  • an inert gas is constantly introduced from the gas inlet 63 toward the diffuser 61 of each ejector pump 60 under a pressure of 0.1 MPa to 0.5 MPa regardless of whether or not the gas is introduced into the reaction chambers 10 , 11 , and 12 ( FIG. 1 ).
  • the pressure near the inlet port 62 and the discharge port 57 of the screw pump A becomes several 1000 Pa to several 10000 Pa. Since the ejector pump principle about generation of following flow, generation of shock wave in the diffuser, and so on is known, explanation thereof is omitted here.
  • the back diffusion heading toward the inlet port 56 of the screw pump A from the exterior at the atmospheric pressure through the discharge port 65 and the inlet port 62 of the ejector pump 60 and the discharge port 57 of the screw pump A is extremely reduced.
  • the high vacuum pumps 1 , 2 , and 3 , the booster pumps 4 a , 5 a , and 6 a , and the back pumps 4 b , 5 b , and 6 b , particularly the back pumps 4 b , 5 b , and 6 b efficiently operate so that the power consumption thereof can be largely reduced.
  • the back pressure (atmospheric pressure) at the discharge port 65 can be reduced to about 300 torr at the inlet port 62 .
  • FIG. 5 shows the result of examining the relationship between the pressure at the inlet port 56 of the screw pump A and the power consumption of the screw pump A when the screw pumps A were applied as the back pumps 4 b , 5 b , and 6 b in the vacuum apparatus shown in FIG. 1 .
  • pumps each having the same structure as the screw pump A except having no ejector pump were applied as the back pumps 4 b , 5 b , and 6 b in the vacuum apparatus of FIG. 1 as a comparative example and the same measurement was carried out.
  • the power consumption is low overall regardless of the value of the inlet pressure as compared with the screw pump having no ejector pump.
  • the power consumption of the screw pump A having the ejector pump 60 is reduced by approximately 50% as compared with that of the screw pump having no ejector pump.
  • screw pumps B are used as the back pumps 4 b , 5 b , and 6 b in FIG. 1 , respectively.
  • a male rotor 25 and a female rotor 26 are received in a main casing 42 and rotatably supported by bearings 35 and 36 attached to an end plate 43 sealing the main casing 42 on its one end side and bearings 37 and 38 attached to an auxiliary casing 46 , respectively.
  • Timing gears 31 and 32 accommodated in the auxiliary casing 46 are mounted on rotation shafts 27 and 28 of the male and female rotors 25 and 26 , respectively, and a gap between the male rotor 25 and the female rotor 26 is adjusted so that both rotors do not contact each other. Further, a motor M is attached to the rotation shaft of the male rotor 25 through a coupling or timing gear. It is configured that the rotation of the motor M is transmitted to the male rotor 25 and rotates the female rotor 26 through the timing gears 31 and 32 .
  • An auxiliary casing 55 provided with an inlet port 56 is attached to the main casing 42 on its one end side. Further, the end plate 43 of the main casing 42 is formed with a discharge port 57 for discharging a gas compressed by the male rotor 25 and the female rotor 26 .
  • a cooling jacket 33 is formed on the outside of the main casing 42 .
  • a coolant such as water is caused to flow in the cooling jacket 33 to thereby cool the main casing 42 , the compressed gas, and so on.
  • each screw pump B is incorporated with an ejector pump portion 60 connected to the discharge port 57 so as to suppress back diffusion through the discharge port 57 from the exterior at the atmospheric pressure. That is, the ejector pump portion 60 is incorporated at the discharge port 57 portion in the end plate 43 of the screw pump B as a component integral with the screw pump B.
  • the ejector pump portion 60 comprises an inlet port 62 , a gas inlet 63 , a diffuser 64 , and a discharge port 65 .
  • an inert gas is constantly introduced from the gas inlet 63 toward the diffuser 61 of each ejector pump portion 60 under a pressure of 0.1 MPa to 0.5 MPa regardless of whether or not the gas is introduced into the reaction chambers 10 , 11 , and 12 ( FIG. 1 ).
  • the pressure near the inlet port 62 and the discharge port 57 of the screw pump B becomes several 100 Pa to several 1000 Pa.
  • the back diffusion heading toward the inlet port 56 of the screw pump B from the exterior at the atmospheric pressure through the discharge port 65 and the inlet port 62 of the ejector pump portion 60 and the discharge port 57 of the screw pump B is extremely reduced.
  • the high vacuum pumps 1 , 2 , and 3 , the booster pumps 4 a , 5 a , and 6 a , and the back pumps 4 b , 5 b , and 6 b , particularly the back pumps 4 b , 5 b , and 6 b efficiently operate so that the power consumption thereof can be largely reduced.
  • the power consumption is low overall regardless of the value of the inlet pressure as compared with the screw pump having no ejector pump.
  • the power consumption of the screw pump B having the ejector pump portion 60 is reduced by approximately 50% as compared with that of the screw pump having no ejector pump.
  • the screw pump according to this embodiment is incorporated with the ejector pump portion, it is compact as compared with the screw pump externally mounted with the ejector pump like in the embodiment 1. Accordingly, when applied to a vacuum apparatus having a plurality of back pumps, it is possible to reduce the occupying space of the whole vacuum apparatus.
  • the screw pump is cited as the example of the back pump.
  • the vacuum pump according to this invention that is attached with or incorporated with the ejector pump may be a Roots pump or the like.
  • the vacuum pump according to this invention is not limited to the back pump in the multistage structure but can be used as a vacuum pump in a single-stage structure as long as the back pressure thereof is within a pressure area over which the effect of the ejector pump appears. Moreover, the use thereof is not limited to the vacuum apparatus for manufacturing semiconductor devices.
  • a vacuum pump according to this invention is not limited to a back pump in a multistage structure but can be used as a vacuum pump in a single-stage structure as long as the back pressure thereof is within a pressure area over which the effect of an ejector pump appears. Further, a use thereof is not limited to a vacuum apparatus for manufacturing semiconductor devices.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Jet Pumps And Other Pumps (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Non-Positive Displacement Air Blowers (AREA)
US10/548,225 2003-03-03 2004-03-01 Vacuum device and vacuum pump Abandoned US20060182638A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003055749A JP2004263635A (ja) 2003-03-03 2003-03-03 真空装置および真空ポンプ
JP2003-055749 2003-03-03
PCT/JP2004/002484 WO2004079192A1 (ja) 2003-03-03 2004-03-01 真空装置および真空ポンプ

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US20060182638A1 true US20060182638A1 (en) 2006-08-17

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US10/548,225 Abandoned US20060182638A1 (en) 2003-03-03 2004-03-01 Vacuum device and vacuum pump

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US (1) US20060182638A1 (de)
EP (1) EP1609990B1 (de)
JP (1) JP2004263635A (de)
DE (1) DE602004022519D1 (de)
TW (1) TW200506205A (de)
WO (1) WO2004079192A1 (de)

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US20080089793A1 (en) * 2004-08-20 2008-04-17 Coles Stuart C Evacuation of a Load Lock Enclosure
US20120219443A1 (en) * 2009-11-18 2012-08-30 Adixen Vacuum Products Method And Device For Pumping With Reduced Power Use
US20120261011A1 (en) * 2011-04-14 2012-10-18 Young Man Cho Energy reduction module using a depressurizing vacuum apparatus for vacuum pump
DE102012220442A1 (de) * 2012-11-09 2014-05-15 Oerlikon Leybold Vacuum Gmbh Vakuumpumpensystem zur Evakuierung einer Kammer sowie Verfahren zur Steuerung eines Vakuumpumpensystems
US20170183112A1 (en) * 2015-12-28 2017-06-29 William Terence Birch Apparatus for Vacuum Sealing Products
US20170284394A1 (en) * 2014-10-02 2017-10-05 Ateliers Busch Sa Pumping system for generating a vacuum and method for pumping by means of this pumping system
US10760573B2 (en) 2014-06-27 2020-09-01 Ateliers Busch Sa Method of pumping in a system of vacuum pumps and system of vacuum pumps

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TW201118259A (en) * 2009-11-19 2011-06-01 Ji Ee Industry Co Ltd Water pump
CN102062088B (zh) * 2011-01-19 2012-11-28 西安交通大学 一种适应用高含气率工况的双螺杆混输泵装置
EP2644264A1 (de) * 2012-03-28 2013-10-02 Aurotec GmbH Druckreguliertes Mehrreaktorsystem
FR3008145B1 (fr) * 2013-07-04 2015-08-07 Pfeiffer Vacuum Sas Pompe a vide primaire seche
CN103900376B (zh) * 2014-04-15 2015-11-18 吴江市赛纳电子科技有限公司 一种手动真空炉
US11209024B2 (en) 2015-06-24 2021-12-28 Itt Manufacturing Enterprises Llc Discharge casing insert for pump performance characteristics control
FR3077343B1 (fr) * 2018-01-29 2020-02-14 Norauto France Centrale d'aspiration pour la collecte de fluides uses d'un vehicule automobile, dispositif comprenant la centrale et procede de collecte

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EP1609990B1 (de) 2009-08-12
TW200506205A (en) 2005-02-16
EP1609990A4 (de) 2007-07-18
WO2004079192A1 (ja) 2004-09-16
DE602004022519D1 (de) 2009-09-24
JP2004263635A (ja) 2004-09-24

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