US20040246427A1 - Display device - Google Patents

Display device Download PDF

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Publication number
US20040246427A1
US20040246427A1 US10/859,242 US85924204A US2004246427A1 US 20040246427 A1 US20040246427 A1 US 20040246427A1 US 85924204 A US85924204 A US 85924204A US 2004246427 A1 US2004246427 A1 US 2004246427A1
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US
United States
Prior art keywords
bumps
bump
lines
source driver
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/859,242
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English (en)
Inventor
Hirofumi Iwanaga
Shigeaki Noumi
Hitoshi Morishita
Hiroshi Ueda
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IWANAGA, HIROFUMI, MORISHITA, HITOSHI, NOUMI, SHIGEAKI, UEDA, HIROSHI
Publication of US20040246427A1 publication Critical patent/US20040246427A1/en
Priority to US11/585,802 priority Critical patent/US7880853B2/en
Priority to US11/585,801 priority patent/US7760314B2/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a display device, and more particularly to a COG packaging type liquid crystal display comprising an IC chip for driving a thin film transistor (TFT) on a glass substrate.
  • TFT thin film transistor
  • the liquid crystal display device is comprised of a liquid crystal display panel which is further comprised of two substrates between which the liquid crystal layer is held, and a surface light source unit which is installed on the rear face side of the liquid crystal display panel.
  • the liquid crystal display panel is normally constructed by two insulation transparent substrates made of glass, which face each other, where display material, such as liquid crystals, is sandwiched, so that voltage is applied selectively to this display material.
  • One of the substrates is a thin film transistor array substrate (hereafter called TFT array substrate) where switching elements, such as thin film transistors (TFT) and pixel electrodes connecting these switching elements are formed in a matrix.
  • TFT array substrate thin film transistor array substrate
  • the other substrate is a color filter substrate (CF substrate) which further comprises R, G and B color layers provided corresponding to the pixel electrodes, and a black matrix (BM) provided between these color layers.
  • CF substrate color filter substrate
  • BM black matrix
  • source lines and gate lines are crossed via an insulation film to apply signals to the switching elements.
  • a plurality of source lines and gate lines are disposed respectively, corresponding to the number of pixel electrodes.
  • a COG type liquid crystal device where the IC chip for driving the pixel electrodes is directly mounted on the substrate, is known (e.g. Japanese Unexamined Patent Application Publication No. 2000-347206, 2000-81635 and 2001-42282).
  • This IC chip for driving is mounted at the end portion of the glass substrate, outside the display area of the substrate, via the anisotropic conductive film (ACF).
  • ACF anisotropic conductive film
  • FPC is connected to the end portion of the glass substrate, and power and signals are supplied to the IC for driving via the lines provided on the glass substrate.
  • FIG. 14 is a top view depicting the configuration around the source driver IC, which is an IC for driving.
  • the driver IC 101 is provided near the end portion of the glass substrate 27 .
  • a bump for output 16 is provided, and at the other longer side bumps for input are provided.
  • the bump for output 16 is provided at the display area 34 side on the glass substrate, and the bumps for input are provided at the end portion of the substrate.
  • the bumps for input are GND 1 , bump for analog power supply 2 , bump for digital power supply 3 , bump for reference voltage at the positive polarity side 4 and bump for reference voltage at the negative polarity side 5 .
  • a plurality of the driver ICs 101 are disposed on the glass substrate, outside the display area, and FPCs (Flexible Printed Circuit) 21 are connected to the end portion of the substrate corresponding to the respective driver IC 101 .
  • FPCs Flexible Printed Circuit
  • cascade line is formed, by which a plurality of driver ICs are sequentially connected.
  • the resistance value tends to increase. Also many bumps for connection must be provided on the driver IC, so the bump configuration is restricted and the pitch between bumps cannot be freely increased. Therefore the pitch of the signals of the FPC 21 becomes large with respect to the pitch of the bumps for input of the driver IC 101 , lines from the FPC 21 to the driver IC 101 become thin, and the line resistance value increases. By such an increase in the resistance between bumps and the FPC, the driver IC 101 may not operate normally or the desired voltage may not be output. And the operation of the driver IC may have problems, which decreases the display quality. Also in the case of a COG packaging type, the screen border size increases.
  • a display device including a display panel having an insulation substrate; a drive circuit disposed around a display area on the insulation substrate to output signals to the display panel; a plurality of bumps formed on the drive circuit; and a plurality of lines formed on the insulation substrate and connected with the bumps, wherein adjacent two or more of the plurality of bumps are electrically connected on the drive circuit, and the electrically connected two or more bumps are connected with one of the lines via an anisotropic conductive film. This can reduce the connection resistance between lines and bumps.
  • the drive circuit is disposed along an edge of the insulation substrate, and the electrically connected bumps are formed substantially in parallel with the edge. This can increase the width of the input line on a glass substrate, thereby reducing line resistance.
  • the drive circuit may be disposed along an edge of the insulation substrate, and the electrically connected bumps may be formed substantially perpendicular to the edge. This can reduce the connection resistance without increasing a drive circuit size.
  • a display device including a display panel having an insulation substrate; a plurality of drive circuits disposed with a space at an end portion of the insulation substrate along an edge of the insulation substrate to output signals to the display panel; a line section placed at the end portion of the insulation substrate, between the plurality of drive circuits, having external lines for supplying signals or power to the plurality of drive circuits; and a plurality of input lines formed on the insulation substrate and connected with corresponding lines of the plurality of external lines. This can reduce the screen border area.
  • the external line corresponding to the input line for a highest current flow of the plurality of input lines is preferably placed at a very side of the line section. This can reduce an output error.
  • the drive circuit may have a plurality of bumps for input formed at an edge side of the insulation substrate along the edge and connected with a line corresponding to the plurality of input lines, and a bump for input corresponding to an input line for a highest current flow of the plurality of input lines may be placed at an outermost side of the drive circuit. This can prevent a decrease in display quality due to long line.
  • the bumps for input include a bump for GND, a bump for power supply and a bump for reference voltage, the bump for GND and the bump for power supply are placed as one block at a side section and a center of the drive circuit, and the bump for reference voltage is disposed between blocks. This can reduce manufacturing costs.
  • the bump for GND and the bump for power supply may be electrically connected with the bump for GND and the bump for power supply in a different block, respectively, in the drive circuit. This can reduce the number of lines.
  • the bump for GND or the bump for power supply in one block may be electrically connected two rows of bumps. This can reduce the connection resistance.
  • the line section may be disposed at every other space between the drive circuits, and the line section may be connected with the bumps for input of the drive circuits on both sides. This can reduce the number of connection points in the lines.
  • a display device including a display panel having an insulation substrate; a plurality of drive circuits disposed with a space along an edge of the insulation substrate to output signals to the display panel; cascade lines formed on the insulation substrate to connect the drive circuits next to each other; and a plurality of bumps for cascade line formed on the drive circuit along a side to a display area and a side to an adjacent drive circuit and connected with the plurality of cascade lines. This can increase the bump area of the source driver IC.
  • the cascade lines include a clock signal line and a plurality of image data signal lines, and the clock signal line is disposed between the plurality of image data signal lines. This can reduce a difference in the distance of a clock signal and a plurality of image data signals to reduce image data loading error.
  • the above display device may further include bumps for output formed along a side of the drive circuit close to a display area to output signals to the display panel, and the bumps for output or bumps for a cascade line may be placed in a staggered fashion. This can increase the area for bumps.
  • FIG. 1 is a top view depicting a configuration of the liquid crystal display panel
  • FIG. 2 is a plan view depicting a configuration of the end portion of the liquid crystal display panel of the liquid crystal display device according to the first embodiment of the present invention
  • FIG. 3 is a plan view depicting a configuration of the source driver IC of the liquid crystal display device according to the first embodiment of the present invention
  • FIG. 4 is a plan view depicting a configuration of the bumps for GND provided on the source driver IC of the liquid crystal display device according to the first embodiment of the present invention
  • FIG. 5 is a plan view depicting a configuration of the bumps for reference voltage provided on the source driver IC of the liquid crystal display device according to the first embodiment of the present invention
  • FIG. 6 is a plan view depicting another configuration of the bumps for reference voltage provided on the source driver IC of the liquid crystal display device according to the first embodiment of the present invention
  • FIG. 7 is a plan view depicting a configuration of an area around the bumps for input provided on the source driver IC of the liquid crystal display device according to the first embodiment of the present invention.
  • FIG. 8 is a plan view depicting a configuration of an area around the bumps for logic signals provided on the source driver IC of the liquid crystal display device according to the first embodiment of the present invention
  • FIG. 9 is a plan view depicting another configuration of an area around the bumps for logic signals provided on the source driver IC of the liquid crystal display device according to the first embodiment of the present invention.
  • FIG. 10 is a plan view depicting a configuration of an area around the bumps for input provided on the source driver IC of the liquid crystal display device according to the second embodiment of the present invention.
  • FIG. 11 is a plan view depicting a configuration of an area around the bumps for input provided on the source driver IC of the liquid crystal display device according to the third embodiment of the present invention.
  • FIG. 12 is a plan view depicting a configuration of the end portion of the liquid crystal display panel of the liquid crystal display device according to the fourth embodiment of the present invention.
  • FIG. 13 is a plan view depicting a configuration of an area around the bumps for input provided on the source driver IC of the liquid crystal display device according to the fourth embodiment of the present invention.
  • FIG. 14 is a plan view depicting a configuration of an area around the bumps for input provided on the source driver IC of a conventional liquid crystal display device.
  • FIG. 1 is a top view depicting the configuration of the liquid crystal display panel in the COG packaging type liquid crystal display device.
  • the liquid crystal display panel 33 shown in FIG. 1 is comprised of a display area 34 which is further comprised of a plurality of pixels arrayed in a matrix, and a screen border area 35 outside of the display area 34 .
  • the liquid crystal display panel 33 is comprised of an array substrate where an array circuit is formed and the counter substrate thereof, and the liquid crystals are sealed between these two substrates.
  • the active matrix type liquid crystal display panel has switching elements for each pixel to control the input/output of display signals.
  • a typical switching element is a TFT (Thin Film Transistor).
  • the color liquid crystal display device has an RGB color filter layer on the counter substrate.
  • Each pixel of the display area of the liquid crystal display panel 33 displays one of the colors R, G and B. Of course in a monochrome display, each pixel displays either black or white.
  • a plurality of source lines and gate lines are disposed in a matrix. The source lines and the gate lines cross roughly to be perpendicular to each other, and a TFT is disposed near the intersection.
  • a plurality of rectangular source driver ICs 101 are provided in a row along one side of the substrate.
  • a plurality of gate drivers 111 are provided in a raw in the same way.
  • the row where the source driver ICs 101 are provided and the row where the gate driver ICs 111 are provided are perpendicular to each other.
  • One side of the substrate where the source driver ICs 101 are provided is regarded as the edge of the substrate.
  • a surface light source device comprising a light source, light guiding plate and optical sheet is disposed.
  • the liquid crystal panel 33 has a liquid crystal layer which is sandwiched by the TFT array substrate and the CF substrate.
  • switching elements for driving the liquid crystal layer are formed in a matrix.
  • a plurality of gate lines and a plurality of source lines are provided to be perpendicular to each other for supplying signals to the switching elements.
  • the source driver ICs 101 and the gate driver ICs 111 are installed on the glass substrate via the anisotropic conductive film ACF.
  • each driver IC On the bottom face of each driver IC, bumps for input is formed to connect with the terminal of the lines formed on the glass substrate. These bumps for input and the terminals of the lines are electrically connected via the anisotropic conductive film.
  • image data signals, clock signals and power supply for driving ICs are supplied to the gate driver IC 111 and the source driver IC 101 via the FCP and the lines on the glass substrate. Signals from each driver IC are supplied to the gate lines and the source lines to drive the switching elements, and voltage is supplied to the pixel electrodes to drive the liquid crystal layer and display a desired image.
  • 1 is a bump for GND
  • 2 is a bump for the analog power supply
  • 3 is a bump for the digital power supply
  • 4 is a bump for the reference voltage at the positive polarity side
  • 5 is a bump for the reference voltage at the negative polarity side
  • 6 is a bump for the analog power supply
  • 7 is a bump for GND
  • 8 is a bump for the digital power supply
  • 9 is a bump for the reference voltage at the positive polarity side
  • 10 is a bump for the reference voltage at the negative polarity side
  • 11 is a bump for the digital power supply
  • 12 is a bump for the analog power supply
  • 13 is a bump for GND
  • 14 is a bump for the digital signal
  • 15 is a bump for the digital signal
  • 16 is a bump for the output.
  • the source driver IC 101 17 is a control signal line, 18 is an image data signal line, 19 is an image data signal line and 20 is a clock signal line. These are logic signals which are cascade-connected between the source driver IC 101 a and the adjacent source driver IC 101 b . 22 is a reference voltage at the positive polarity side, 23 is an analog voltage, 24 is GND, 25 is a digital power supply and 26 is a reference voltage at the negative reference side. These are lines between the FPC 21 and the source driver IC 101 . 60 is cascade lines and 61 is lines for input, and these are formed by patterning a metal film, a transparent conductive film such as ITO, on the glass substrate.
  • FIG. 2 is a plan view depicting the configuration of the end portion of the substrate where the source driver IC 101 of the liquid crystal panel 33 is provided.
  • the source driver ICs 101 according to the present embodiment are provided on the screen border area 35 along the edge of the substrate.
  • the screen border area where the source driver ICs 101 are provided is called the end portion of the substrate.
  • the long side 102 of the rectangular source driver IC 101 a is in parallel with the substrate edge.
  • the long side 103 at the opposite side is roughly in parallel with the display area 34 . It is assumed that the long side 102 is the long side 102 at the substrate end side, and the long side 103 is the long side 103 at the display area side.
  • the source driver IC 101 b is provided with a space. These source drivers ICs 101 are continuously disposed in a row with a space along one side of the substrate.
  • the cascade line for logic signals 60 for cascade connection is formed in the space between the source driver ICs on the glass substrate, and each source driver IC 101 is cascade-connected.
  • the FPC 21 for supplying signals and power from the external control circuit section 36 , is installed from the substrate end side. By this, the screen borer area can be narrower.
  • GND line line for the digital power supply, line for the analog power supply, line for the reference voltage at the positive polarity side, and line for the reference voltage at the negative polarity side
  • a total of five types are formed for driving the source driver ICs 101 .
  • These five types of lines on the FPC are connected to the corresponding lines of the lines for input 61 respectively.
  • the signals and the power from the FPC 21 are supplied to the source driver IC 101 via the lines for input 61 formed on the glass substrate.
  • a plurality of lines are formed on the glass substrate respectively.
  • FIG. 3 is a plan view depicting the bump array of the source driver IC of the liquid crystal display device according to the present embodiment.
  • the bumps for GND 1 , 7 and 13 the bumps for analog power supply 2 , 6 and 12 , the bumps for digital power supply 3 , 8 and 11 , the bumps for reference voltage at the positive polarity side 4 and 9 , and the bumps for reference voltage at the negative polarity side 5 and 10 are provided in two rows along the long side 102 at the substrate end side of the source driver IC 101 .
  • the bumps for input signals from the FPC are input.
  • the bump for GND 1 , the bump for GND 7 and the bump for GND 13 are electrically connected inside the source driver IC.
  • the bump for analog power supply 2 , the bump for analog power supply 6 , the bump for analog power supply 12 , the bump for digital power supply 3 , the bump for digital power supply 8 and the bump for digital power supply 11 are also electrically connected inside the source driver IC. Low resistance line is used for these connections.
  • the bump for GND 1 , the bump for analog power supply 2 , and the bump for digital power supply 3 form one block, and this block is provided at the left side of the source driver IC 101 .
  • the bump for GND 7 , the bump for analog power supply 6 , and the bump for digital power supply 8 form one block, and this block is provided at the center of the source driver IC 101 .
  • the bump for GND 13 , the bump for analog power supply 12 , and the bump for digital power supply 1 form one block, and this block is provided at the right of the source driver IC 101 .
  • the bump for reference voltage at the positive polarity side 4 and the bump for reference voltage at the negative polarity side 5 , or the bump for reference voltage at the positive polarity side 9 and the bump for reference voltage at the negative polarity side 10 are provided. In this way, five types of bumps for input are formed in one source driver IC 101 .
  • the bump for digital signal 14 and the bump for digital signal 15 are provided around the corner of the display area side of the source driver IC 101 .
  • the bumps for digital signals 14 and 15 are bumps for cascade connection, which have bi-directional functions. In other words, when the digital signal is input to the bump for digital signal 15 , the bump for digital signal 14 outputs the output signal to the next source driver IC. Whereas when the digital signal is input to the bump for digital signal 14 , the bump for digital signal 15 outputs the output signal to the next source driver IC.
  • the digital signal is input to the bump for digital signal 14 , and is output from the bump for digital signal 15 .
  • This connection is continuously made between adjacent source driver ICs to forme a cascade connection. Therefore the bump for digital signal 14 becomes upstream, and the bump for digital signal 15 becomes downstream.
  • a plurality of bumps for digital signals 14 and 15 are provided along the long side 103 at the display area side and along the short side 104 of the adjacent drive circuit side respectively.
  • bumps for output 16 are provided.
  • a plurality of bumps for output 16 are provided along the long side 103 between the bumps for digital signal 14 and the bumps for digital signal 15 .
  • the bumps for output 16 are connected to the respective source line, and outputs the pixel voltage in the TFT of the liquid crystal display panel 33 .
  • the number of bumps for reference voltage at the positive polarity side 4 and 9 , and the bumps for reference voltage at the negative polarity side 5 and 10 is one each, but actually the number of bumps at the positive polarity side and the negative polarity side is m/2 respectively, since m/2 out of m (m is 2 or higher integer) of the voltage lines, which are input from the outside which determines the reference of the source driver IC 101 , are the voltage lines at the positive polarity side, and, the other m/2 are the voltage lines at the negative polarity side.
  • the number of lines thereof is of course m/2.
  • m/2 number of bumps for input are provided at the substrate end side and the inside thereof in two rows.
  • the source driver IC 101 is driven by the power supply voltage, which is input from the bump for digital power supply and the bump for analog power supply, and outputs the image display signals to the liquid crystal display panel based on such digital signals as clock signals, image data and control signals, and reference voltage.
  • FIG. 4 is a plan view depicting the configuration of the bump for GND 1 .
  • the bump for GND 1 is comprised of many bumps, 50 a and 50 b .
  • the bump for GND 1 is comprised of two rows of bumps, that is a row of bumps 50 b , at the substrate end side, and a row of bumps 50 a , provided inside the bumps 50 b , and each row is in parallel with the long side 102 of the source driver IC 101 . Therefore the row of bumps 50 a at the display area side and the row of bumps 50 b at the substrate end side are in parallel with the substrate edge.
  • conductive material such as gold
  • an insulation material For forming these bumps, a normal manufacturing method is used, such as patterning the conductive material, then coating the insulation material, and exposing and developing this to provide holes, and then plating. All the bumps 50 a and 50 b are connected with a low resistance conductive material, and all the bumps 50 a and 50 b are at a same potential.
  • the bumps 50 a and 50 b are formed on the source driver IC 101 , and are connected with the lines on the glass substrate via an anisotropic conductive film (ACF).
  • ACF anisotropic conductive film
  • the line width and the line length on the glass influence the line resistance, it is preferable to make the line width as wide as possible.
  • the line is made of a transparent conductive film, such as ITO, of which the electric characteristics are not as good as metal, the deterioration of line resistance appears more clearly.
  • the line width can be widened up to the length of the row of the bumps 50 b . If the exposed area of the conductive material of the bumps 50 a and 50 b is increased, the uniformity of the exposed faces deteriorates, and the surface of the exposed faces become uneven, this due to manufacturing reasons. This makes the connection resistance between the ACF and the bump higher.
  • the ACF is normally constituted by mixing conductive materials in resin film. Even if the distribution of the particles in the ACF disperses, the deterioration of the connection resistance can be prevented by providing many bumps with a same potential and connecting them with the ACF. If the number of contact points with the ACF is increased by providing a plurality of bumps to be connected with one line, a decrease in the connection resistance can be prevented, since even if certain bumps have connection problems, other bumps can be in connection. By connecting two or more adjacent bumps at a same potential with one line inside the source driver IC 101 , the resistance value can be decreased, and the generation of display defects caused by the resistance deterioration can be prevented.
  • the other bumps for GND 7 and 13 are also comprised of a plurality of bumps respectively in the same way.
  • the bumps for analog power supply 2 , 6 and 12 and the bumps for digital power supply 3 , 8 and 11 are also comprised of a plurality of bumps respectively in the same way, so a similar effect can be obtained.
  • the respective number of bumps to be connected to one line may be a different number, and the length of the row of the bumps can be adjusted corresponding to the width of the line.
  • the bump for reference voltage 4 In the reference voltage line, less current flows compared with the power supply and GND line, so display quality is less influenced, even if the number of bumps for reference voltage is less than the number of bumps of the bumps for GND, the bumps for analog power supply and the bumps for digital power supply. Therefore in the present embodiment, the bumps for reference voltage 4 are comprised of two rows, where two bumps are electrically connected. As FIG. 5 shows, the bumps 50 b are provided at the substrate end side, and the bumps 50 a are provided along with the bumps 50 b , at the inner side of the substrate (display area side).
  • the adjacent bumps 50 a and 50 b are electrically connected. These bumps 50 a and 50 b constitute a set of bumps, and are connected to one of the reference voltage lines at the positive polarity side. Next to these bumps 50 a and 50 b , the bumps 51 a and 51 b are provided, which are also electrically connected. These adjacent bumps 51 a and 51 b constitute a set of bumps, in the same way, and are connected to a different reference voltage line. This is the same for the bumps 52 a and 52 b . The bumps 50 a , 51 a and 52 a are formed in a row along the substrate end.
  • the bumps 50 b , 51 b and 52 b are also formed in a row along the substrate end. In this way, among the bumps arrayed in two rows, two bumps, as a set, are connected with the respective reference voltage line. Therefore the bumps 50 a , 51 a and 52 b are insulated respectively.
  • the bumps 50 a and 50 b are formed on the source drive IC 101 , and are connected to one line for the positive reference voltage provided on the glass substrate via an anisotropic conductive film (ACF). Since bumps are provided for the bumps for reference voltage at the positive polarity side 4 in an actual source driver IC 101 , corresponding to the positive reference voltage lines, the number of bumps in a row is m/2, and two rows are formed along the substrate end. In other words, m/2 sets of bumps are provided corresponding to the positive reference voltage lines, and two rows of these are formed, so a total of m bumps are provided. And two bumps at a same potential are provided in a direction perpendicular to the substrate end. By providing the plurality of bumps in a vertical direction, the number of bumps to be connected with one line can be increased without increasing the external size of the source driver IC 101 . Therefore the connection resistance can be decreased.
  • ACF anisotropic conductive film
  • two bumps are provided vertically, but if it is necessary to reduce the line resistance value, then two bumps with a same potential may be provided in a horizontal direction (in a parallel direction with the substrate edge), as shown in FIG. 6.
  • the m number of bumps are formed in one row along the substrate end.
  • two adjacent bumps e.g. bumps 50 a and 50 b
  • two adjacent bumps are electrically connected as one set, and m/2 sets of bumps with a same potential are formed.
  • a set of bumps with a same potential are connected with the respective reference voltage on the glass substrate via the ACF.
  • FIG. 7 is a plan view depicting the configuration of the source driver IC 101 and the FPC 21 on the glass substrate.
  • the FPC 21 is connected between the source driver IC 101 a and the adjacent source driver IC 101 b .
  • the FPC 21 is connected from the substrate edge between the source driver ICs, and is disposed at the substrate end side from the long side 103 of the source driver IC 101 at the display area side.
  • the FPC 21 and the glass substrate must be connected at a distance that is a predetermined length or more, so narrowing the screen border of the substrate is limited.
  • the FPC 21 By disposing the FPC 21 between the source driver ICs 101 as shown in the present embodiment, the FPC can be formed more to the inner side of the glass substrate 27 than the case of disposing the source driver IC 101 and the FPC facing each other, and disposing the FPC to the outer side from the long side of the substrate end of the source driver IC 101 , which can make the screen border narrower.
  • the source driver IC 101 has a similar configuration as that shown in FIG. 3. Now the configuration and the connection between the source driver ICs 101 a and 101 b and the FPC 21 a will be described.
  • the FPC provided between the source driver IC 101 a and the adjacent source driver IC 101 b is regarded as FPC 21 a
  • the FPC 21 provided between the source driver IC 101 b and the adjacent source driver IC 101 c is regarded as FPC 21 b
  • FPC 21 a and 21 b and the source driver ICs 101 a , 101 b and 101 c have the same configuration respectively, and are connected in the same way, so description is omitted for the configuration around the FPC 21 b .
  • This source driver IC 101 and the FPC 21 are mounted repeatedly along the substrate end.
  • a plurality of external lines for supplying power supply and signals from the control circuit section 36 are provided. These external lines are for GND, analog power supply, digital power supply, reference voltage at the positive polarity side, and reference voltage at the negative polarity side.
  • the terminal for GND 24 c , the terminal for analog power supply 23 c , the terminal for reference voltage at the positive polarity side 22 c , the terminal for reference voltage at the negative polarity side 26 c and the terminal for digital power supply 25 c are provided for connecting the lines on the FPC and the lines for input on the glass substrate.
  • lines for GND 24 d , analog power supply 23 d , digital power supply 25 d , reference voltage at the positive polarity side 22 d , and reference voltage at the negative polarity side 26 d which are lines for input from the terminal to the bumps for input, are provided in parallel with the substrate edge. These lines for input are connected with the corresponding bumps for input respectively, crossing the side section of the FPC (side perpendicular to the substrate edge).
  • the terminal for analog power supply 23 c is connected with the bump for analog power supply 22 b provided on the source driver IC 101 b via the analog power supply 23 d on the glass substrate.
  • the input lines for the GND 24 d , digital power supply 25 d , reference voltage at the positive polarity side 22 d , and reference voltage at the negative polarity side 26 d as well are connected in the same way.
  • the terminal for digital power supply 25 c , the terminal for analog power supply 23 c and the terminal for GND 24 c of the FPC 21 a are connected to the bump for digital power supply 3 b , the bump for analog power supply 2 b , and the bump for GND 1 b in the block at the left of the source driver IC 101 b provided at the right of the FPC 21 a respectively.
  • the terminal for reference voltage at the positive polarity side 22 c and the terminal for reference voltage at the negative polarity side 26 c of the FPC 21 a are connected to the bump for reference voltage at the positive polarity side 9 a and the terminal for reference voltage at the negative polarity side 10 a of the source driver IC 101 a provided at the left of the FPC 21 a respectively.
  • signals or power are supplied to both the source driver IC 101 a and the source driver IC 101 b from the FPC 21 a at one location.
  • power and signals are supplied to all the source driver ICs 101 formed at the end portion of the substrate.
  • the FPC 21 When the FPC 21 is disposed between the source driver ICs, the lines on the glass substrate are formed in parallel with the substrate end. Therefore the thickness and the number of lines provided outside the source driver IC 101 must be restricted in order to decrease the screen border area.
  • the width of the space where lines can be formed can be increased without widening the screen border area. As a result, the lines can be thicker even if the FPC is connected between the source driver ICs, and a drop of the display quality due to the deterioration of the line resistance can be suppressed.
  • the lines of digital power supply and the analog power supply of the power supply system is larger than the current which flows through the lines of the reference voltage, which is a signal system.
  • the lines of the GND 24 d , the digital power supply 25 d and the analog power supply 23 d are thick or short.
  • the line for the reference voltage on the other hand, where the current flow is small, the line may be thinner than those of the GND and the power supply system, because the influence on the display quality is small.
  • the lines for GND, digital power supply and analog power supply are connected with the source driver IC 101 b at the right, and the lines for reference voltage, where there are many lines by where the influence is small even if the line is thin, is connected with the bumps for reference voltage 9 a and 11 a of the source driver IC 101 a at the left.
  • the analog power supply and the digital power supply are connected separately to the source driver ICs 101 at the left and right, so in this way the lines of the GND, analog power supply and digital power supply on the glass substrate can be thicker, and the drop of display quality due to the deterioration of the line resistance can be prevented.
  • the current that flows through lines is normally highest for the GND, then the analog power supply and finally the digital power supply, where the total current that flows through the lines for the analog power supply and the digital power supply is roughly the same as the current that flows through the line for the GND.
  • the terminal for GND 24 c , the terminal for analog power supply 23 c and the terminal for digital power supply 25 c are provided in this sequence from the outer side, at the right of the FPC 21 a .
  • the bump for GND 1 a , the bump for analog power supply 2 a and the bump for digital power supply 3 a are provided in this sequence from the outer side, at the left of the long side 102 at the substrate end side.
  • the size of the bumps for input can be changed according to the thickness of the line.
  • the number of bumps 50 a is adjusted for the line for the GND, where the highest current flows, so that the length of the row of the bumps 50 a shown in FIG. 4 becomes longer.
  • the number of bumps is decreased so that the row thereof becomes shorter than the row of the bumps for GND.
  • the number of bumps is further decreased.
  • line resistance can be decreased without increasing the packaging space.
  • the connection resistance can be decreased by increasing the number of bumps for input to be connected with one line.
  • the logic signal lines 17 , 18 and 19 which are cascade-connected between the source driver IC 101 a and the source driver IC 101 b , are provided at the long side at the display area side and at the short side at the source driver IC side.
  • the logic signal lines between the source driver IC 101 b and the source driver IC 101 c also have a similar configuration, so illustration and description thereof are omitted.
  • the configuration of the above mentioned cascade-connected logic signal lines will now be described with reference to FIG. 8.
  • a bump for digital signals 15 a is formed in an area near the corner at the right at the display area side.
  • a plurality of image data signal lines 18 and 19 and control signal lines 17 are provided respectively corresponding to the number of colors of the liquid crystal display panel.
  • the bump for digital signals 14 b is formed in an area near the corner at the left at the display area side in the source driver IC 101 b .
  • this bump for digital signals 15 a a plurality of bumps are formed along the long side 103 and short side 104 at the display area side.
  • a plurality of bumps are formed along the long side 103 and short side 104 at the display area side.
  • the plurality of bumps of the bumps for digital signals 15 a and the bumps for digital signals 14 b are formed symmetrically, and respective bumps correspond to each other by the image data signal lines 18 and 19 , control signal line 17 and clock signal line 20 .
  • the source driver IC upstream (e.g. source driver IC 101 a ) to the source driver IC downstream (e.g. source driver IC 10 b ) are sequentially cascade-connected by the logic signal lines.
  • the logic signal lines to be cascade-connected used to be formed along the long side 102 at the substrate end side, which restricts the size of the bumps for input. Therefore unless the source driver IC size is increased, the lines to be connected to the bumps become narrow, which deteriorates resistance.
  • the bumps for input become closer to the center of the source driver IC than the bumps for logic signals, which makes the lines to be connected to the bumps for input on the glass substrate longer.
  • the area for forming the bumps of the source driver IC can be increased, and the line resistance can be decreased.
  • Each one of the bumps for digital signals 14 may be laid out zigzag. This allows an increase in the bump size without increasing the source driver IC size. In the same way, the bumps for digital signals 16 and the bumps for output may be laid out zigzag.
  • the control signal line 17 and the image data signal line 18 are connected to the bumps for logic signals 15 a , which are provided at the long side 103 at the display area side of the source driver IC 101 a .
  • the image data signal line 19 and the clock signal line 20 are provided.
  • the total number of image data signal lines 18 and 19 is n (n is 2 or higher integer) according to the number of colors.
  • the number of image data signal lines 18 is n/2, and the number of image data signal lines 19 is n/2. In this configuration, however, a difference is generated in the distances between each one of the n number of image data signal lines and the clock signal line. If there is a difference in the distances between each image data signal line and the clock signal line, image data capturing errors may be generated by delays and waveform distortion, due to the line resistance value of the image data signal lines.
  • the difference in the distances between each image data signal line and clock signal line can be decreased by disposing the clock signal line 20 at the center, between n/2 number of image data signal lines 18 and n/2 number of image data signal lines 19 , as shown in FIG. 8.
  • the bump for digital signals 15 a provided at the long side 103 side (display area side) of the source driver IC 101 a
  • the bump for digital signals 14 b provided at the long side 103 side (display area side) of the source driver IC 101 b via the control signal line 17 and the image data signal line 18 .
  • the bump for digital signals 15 a provided at the short side 104 side of the source driver IC 101 a
  • the bump for digital signals 14 b provided at the short side 104 side of the source driver IC 101 b via the clock signal line 20 and the image data signal line 19 .
  • the adjacent source driver IC side of the source driver IC 101 is a side section.
  • the clock signal line 20 is formed at the center between the image data signal line 19 and the image data signal line 18 .
  • the difference in glass line resistance values of the clock signal and the image data signal can be decreased, which makes it easier to secure margins for setup and hold time.
  • a liquid crystal display device with excellent display quality can be provided by disposing the clock signal line 20 between the image data signal line 18 and the image data signal line 19 .
  • FIG. 10 is a plan view depicting the configuration of the area around the bumps for input provided on the source driver IC of the liquid crystal display device. Compared with the first embodiment, the configuration between the FPC 21 and the bumps for input is different in the present embodiment, and description will be omitted for the configuration the same as the first embodiment.
  • the terminal for GND 24 c and the terminal for analog power supply 23 c are connected to the source driver IC 101 b at the right, and the terminal for digital power supply 25 c , the terminal for reference voltage at the positive polarity side 22 c and the terminal for reference voltage at the negative polarity side 26 c are connected with the source driver IC 101 a at the left.
  • the terminal for digital power supply 25 c at the left of the FPC 21 , the line width of the GND 24 d and the analog power supply 23 d can be increased without increasing the screen border area.
  • the total current that flows through the lines for analog power supply 23 d and the digital power supply line is roughly the same as the current that flow through the line for the GND 24 d , so if the current that flows through the line for digital power supply 25 d is extremely smaller than that of the analog power supply 23 d , the current that flows through the lines for GND 24 d and the analog power supply 23 d become dominant among the current that flows through the source driver IC 101 . Therefore it is preferable to make the lines for the GND 24 d and the analog power supply 23 d to be thicker.
  • the terminal for digital power supply 25 c is provided and is connected with the source driver IC 101 a at the left.
  • lines for input provided in the side section at the right of the FPC 21 a are only two types, lines for GND 24 d and analog power supply 23 d , and compared with the first embodiment, lines of the GND 24 d and the analog power supply 23 d can be thicker for the amount of the line for the digital power supply 25 d.
  • the terminal for GND 24 c is disposed at the furthest outer side, and the terminal for analog power supply 23 c is disposed at the inner side thereof.
  • the bump for GND 1 b is disposed at the furthest left side, and the bump for analog power supply 2 b is disposed next to it.
  • the terminal for digital power supply 25 c is provided at the furthest outer side among the terminal for digital power supply 25 c , terminal for reference voltage at the positive polarity side 22 c and terminal for reference voltage at the negative polarity side 26 c .
  • the bump for digital power supply 11 a is provided at the furthest right side among the bump for digital power supply 11 a , bump for reference voltage at the positive polarity side 9 a and bump for reference voltage at the negative polarity side 10 a .
  • the terminal for analog power supply 23 c is disposed at the inner side and next to the terminal for GND 24 c , and on the source drive IC as well.
  • the bump for analog power supply 2 b is provided at the inner side and next to the bump for GND 1 b .
  • FIG. 11 is a plan view depicting the configuration of the area around the bumps for input provided on the source driver IC of the liquid crystal display device. Compared with the first embodiment, the configuration between the FPC 21 and the bumps for input is different in the present embodiment, and description will be omitted for the configuration the same as the first embodiment.
  • an FPC 21 is mounted at every other space between the source driver ICs, so that one FPC 21 is connected to two source driver ICs.
  • This FPC 21 a supplies all the signals and power for operating both the source driver IC 101 a and the source driver IC 101 b at the left and right.
  • terminals for connecting with the source driver IC 101 a are provided in the side section at the left of the FPC 21 , which connect with the respective bumps for input of the source driver IC 101 a via the line for input on the glass substrate.
  • the block at the right of the bumps for input is used.
  • terminals for connecting with the source driver IC 101 b are provided, which are connected with the respective bumps for input of the source driver IC 101 b via the lines on the glass substrate.
  • the block at the left of the bumps for input is used.
  • lines for input for GND 24 , analog power supply 23 , digital power supply 25 , reference voltage at the negative polarity side 26 , and reference voltage at the positive polarity side 22 are provided on both the side sections of the FPC.
  • roughly half of the FPCs 21 on the source driver IC 101 are connected.
  • the number of connection locations of the FPC 21 can be decreased to half, so the number of components can be decreased, and the FPC mounting time for connection can be decreased. As a result, manufacturing cost can be decreased.
  • the terminal for GND 24 c , terminal for analog power supply 23 c , and terminal for digital power supply 25 c are provided in this sequence from the outer side.
  • This sequence is the sequence of the terminals to which higher current flows, so the line length can be decreased for the sequence of the line for GND 24 d , analog power supply 23 d , and digital power supply 25 d .
  • the terminal for reference voltage at the negative polarity side 26 c and the terminal for reference voltage at the positive polarity side 22 c are provided.
  • the FPC 21 is installed at the substrate end side of the location where the source driver IC 101 is provided, facing the source driver IC 101 , as shown in FIG. 12.
  • the FPC 21 is installed corresponding to each source driver IC 101 , so the number of source driver ICs 101 and the number of locations where the FPC 21 is connected are the same.
  • the FPC 21 is installed on the glass substrate at the substrate end side of the source driver IC 101 .
  • the source driver IC 101 having the bump array shown in FIG. 3, is used, and is connected with the glass substrate 27 via the ACF.
  • FIG. 13 is a plan view depicting the area around the bumps for input provided on the source driver IC of the liquid crystal display device.
  • the FPC 21 is connected near the center of the long side of the source driver IC 101 .
  • the center block (bump for GND 7 a , bump for analog power supply 6 a , and bump for digital power supply 8 a ) is used in the bumps for input of the source driver IC 101 .
  • the bump for reference voltage at the positive polarity side 9 and the bump for reference voltage at the negative polarity side 5 which are disposed on both sides of the central block, are used.
  • the terminal for reference voltage at the positive polarity side 22 a terminal for analog voltage 23 a , terminal for GND 24 a , terminal for digital power supply 25 a , and terminal for reference voltage at the negative polarity side 26 a are provided from the left in this sequence.
  • the terminal for GND 24 a is provided at the center of the FPC 21 .
  • the bump for GND 7 a to be connected with the terminal for GND 24 a via the GND 24 b , is provided. Positions of the bump for GND 7 a and the terminal for GND 24 a are aligned. Therefore the line for the GND 24 b becomes perpendicular to the substrate end, and the line length can be decreased compared with other lines. In the same way, the lines for the digital power supply and the analog power supply can be made shorter than the lines for the reference voltage. By this, a drop of display quality, due to the deterioration of line resistance, can be prevented.
  • both disposing the FPC between the source driver ICs and disposing it facing the source driver IC becomes possible.
  • the resistance value can be decreased in the configuration of the source driver IC, the lines for input and the FPC 21 on the glass substrate, even if the packaging space is restricted.
  • a plurality of source driver ICs 101 can easily be mounted at equal spacing, so that resistance in the logic signal line between the source driver ICs can be uniform, and the display quality can be improved.
  • the same source driver ICs can be used, and the source driver ICs can be common. This can decrease the manufacturing cost of the source driver ICs.
  • the pitch of the bumps for input of the source driver IC 101 is much smaller than the terminal pitch of the FPC 21 .
  • the pitch of the bumps for input can be changed by adjusting the number of bumps provided in the respective bumps for input shown in FIG. 4. By this, the output errors due to a drop of voltage to the source driver IC can be decreased.
  • the FPC is not connected between the source driver ICs, so the space between each source driver IC can be decreased, and the line resistance value of the cascade-connected logic signal lines can be decreased, and high-speed transmission of the signals on the glass substrate becomes possible.
  • the present invention is not limited to the above mentioned embodiments, but can be modified in various ways.
  • the configuration of the lines, bumps and terminals in the reference voltage at the positive polarity side and the reference voltage at the negative polarity side may be reversed.
  • the current that flows through the line for GND 24 is the highest, but if the highest current flows through a different line, then the bump thereof can be provided at the furthest outer side.
  • the terminal of that line in FPC may be provided to be closest to the side section.
  • the present invention can be applied not only to the source driver IC 101 but also to the gate driver IC.
  • the number of FPCs is the number of locations where the FPC and the glass substrate are connected. In other words, if one FPC is branched outside the glass substrate and connected to the glass substrate, the number of connection locations is regarded as the number of FPCs.
  • the terminals of the FPC may be at the left and right sides reversed symmetrically in the configuration. With this configuration as well, the line resistance value in line on the glass substrate can be decreased, and logic processing and desired voltage can be output normally in the source driver IC. Even if the FPC is connected between the source driver ICs, the line length from the substrate end to the center between the source driver ICs can be decreased, and the line resistance value can be decreased.
  • a display device with a narrow screen border area and with excellent display quality can be provided.

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US7760314B2 (en) 2010-07-20
US7880853B2 (en) 2011-02-01
JP4004994B2 (ja) 2007-11-07
TWI251796B (en) 2006-03-21
TW200428321A (en) 2004-12-16
US20070040980A1 (en) 2007-02-22
KR100695641B1 (ko) 2007-03-15
KR20040105585A (ko) 2004-12-16
JP2004361722A (ja) 2004-12-24
US20070040981A1 (en) 2007-02-22

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