US20040075986A1 - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
US20040075986A1
US20040075986A1 US10/250,989 US25098903A US2004075986A1 US 20040075986 A1 US20040075986 A1 US 20040075986A1 US 25098903 A US25098903 A US 25098903A US 2004075986 A1 US2004075986 A1 US 2004075986A1
Authority
US
United States
Prior art keywords
printed
circuit board
envelope
filler
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/250,989
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English (en)
Inventor
Marcos Schwarz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Empresa Brasileira de Compressores SA
Original Assignee
Empresa Brasileira de Compressores SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Empresa Brasileira de Compressores SA filed Critical Empresa Brasileira de Compressores SA
Assigned to EMPRESA BRASILEIRA DE COMPRESSORES S.A. - EMBRACO reassignment EMPRESA BRASILEIRA DE COMPRESSORES S.A. - EMBRACO ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCHWARZ, MARCOS GUILHERME
Publication of US20040075986A1 publication Critical patent/US20040075986A1/en
Priority to US11/464,434 priority Critical patent/US7576988B2/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces

Definitions

  • the present invention relates to an electronic device, simultaneously provided with heat dissipation medium and a heat insulation, used in motor-control circuits in general.
  • One of these techniques for providing a good thermal coupling of the electronic component with the environment consists in installing metallic elements thermally coupled to the electronic component, as for example, flaps.
  • This metallic element has the function of a heat dissipator and is provided with a large area exposed to the surrounding air. In this way, it provides a good thermal coupling between the parts, significantly reducing the rise in temperature of the electronic component when the latter releases heat due to the Joule effect caused by the losses.
  • heat tubes Another technique used for transferring heat between the electronic component and the environment are the so-called “heat tubes”, which use cooling fluids that transfer heat by phase change. This is a very efficient way of transferring heat, but it requires a special construction for the dissipator that contains this cooling fluid, thus making it very expensive. In addition, it requires a geometric form as well as a physical space adequate for mounting the parts together.
  • Document U.S. Pat. No. 5,208,733 describes an encapsulation comprising a heat dissipator that supports a structural element.
  • the dissipator is constituted by a metallic plate of considerable thickness, arranged on the electronic components.
  • a layer of polymeric film is placed, by means of a vacuum process, onto the electronic components, which are arranged on a printed-circuit board that in turn is fixed on the structural element.
  • a substance composed of silicone in the form of a gel is added to the envelope so as to fill the space existing between the metallic plate and the components.
  • this substance does not have electric-insulation characteristics, it does not come into direct contact with the electronic components nor with the printed-circuit board, being limited to the contour defined by the polymeric film.
  • This construction requires various associated processes during the manufacture of this envelope, which increase its cost due to the need for much aggregated labor.
  • the envelope has another protecting layer, which makes the release of heat to the environment difficult.
  • a cooling system and the presence of connectors are described, which increases the cost and the physical space occupied by the envelope.
  • the objective of the present invention is to provide a good thermal coupling between the electronic components and the environment, by means of an electronic device having electrical insulation characteristics, which does not need openings for passing metallic components that are responsible for conducting heat to the environment.
  • Another objective of this invention is to eliminate the necessity to install specific components for electric insulation between the energized part s of the components and the dissipator exposed to the environment.
  • a further objective of this invention is to provide effective and simple dissipation of the heat generated in the circuit, substantially reducing the size of the device, facilitating its construction, avoiding the need for mechanical precision and decreasing the manufacture costs.
  • an electronic device comprising an envelope provided with a closed chamber and a printed-circuit board, the latter being positioned in the chamber so as to define a dissipation chamber, the printed-circuit board comprising at least one electronic component positioned in the dissipation chamber, the dissipation chamber comprising a filling simultaneously in contact with the electronic component, the printed-circuit board and a dissipation film.
  • FIG. 1 shows a front view in cross-section of the electronic device of the present invention.
  • the electronic device 1 is formed by an envelope 2 , a closed chamber 4 , a dissipation chamber 4 ′, a printed-circuit board 3 , electronic components 5 a , 5 b , a filling 7 and a dissipation film 10 .
  • the envelope 2 is preferably formed from a rigid polymeric material and can assume different geometric shapes.
  • the polymeric material imparts electric-insulation characteristics to the envelope 2 .
  • the chamber 4 is delimited by the envelope 2 and represents the empty space formed inside the device 1 .
  • the printed-circuit board 3 provided with electronic components 5 a , 5 b , the filling 7 and the dissipation film 10 are inserted into the chamber 4 .
  • the printed-circuit board 3 is positioned inside the device 1 , so as to define a dissipation chamber 4 ′, which comprises the electronic components 5 a , which are associated to the first surface 9 of the plate 3 .
  • the plate 3 has also electronic components 5 b , associated to its second surface 6 , opposed to the first surface 9 .
  • the electronic components 5 a are power electronic components and, due to their characteristics, they are responsible for a relevant portion of the heat dissipated in the circuit. This heat is the result of the Joule effect, present here because of the losses existing in the components.
  • the dissipation film 10 is arranged on the inner surface of the envelope 2 and opposite the first surface 9 of the plate 3 .
  • the dissipation film 10 is preferably constituted by a metallic material, preferably aluminum, of small thickness, for example, about 0.1 mm and embraces a larger area then the projected areas of the electronic components 5 a , that is to say, the area occupied by the dissipation film is larger than that occupied by the sum of the areas of the outer surfaces of the components 5 a , when these are projected, by way of calculation, onto the inner surface of the envelope 2 .
  • the dissipation film 10 is responsible for the transfer of heat to the inner surface of the envelope 2 and by be of a self-adhering type. In this case, one applies a layer of adhesive material onto one of its surfaces, thus facilitating the application and fixation of this film 1 Q onto the Inner surface of the envelope 2 .
  • the filling 7 is arranged inside the dissipation chamber 4 ′, simultaneously in contact with the perimeter of the electronic components 5 a , parts of the first surface 9 of the plate 3 where there Is no associated electronic component, as for example, printed-circuit fillets or tracks, and the dissipation film 10 .
  • the perimeters of the components 5 b in contact with the filling 7 comprise the edges or portions of these components 5 a which are above the surface 9 of the plate 3 .
  • the medium 7 is constituted by gel, elastomer or electrically insulating paste and may be polymeric or not, containing or not containing heat-conducting fillers, The medium 7 should also be electrically insulating, since it is directly in contact with the tracks and terminals of the components of the printed circuit, where there are voltages and heat generation.
  • the medium 7 has elasticity and/or plasticity sufficient to accommodate variations in dimensions due to the thermal expansion undergone by the components 5 a , by the printed-circuit plate 3 and by the envelope 2 . In this way, it prevents the occurrence of cracks or detachment of the material of the filling medium 7 with respect to the components 5 a or the tracks, from where one needs to remove beat, creating a clearance filled by air, which makes the passage of heat difficult.
  • the medium 7 should not be very fluid, so that it will not flow and fail to fill the desired spaces.
  • the heat-conducting fillers When the heat-conducting fillers are present, they constitute heat-conducting and electrically-insulating solid materials in the form of powder or grains, as for example aluminum oxide or an oxide of another metal.
  • the granulation of this material depends only upon the process of producing the filling medium 7 and of the physical stability desired for this medium 7 (either more fluid or more solid). For thus purpose, it is preferable to use the material in the form of a powder.
  • This medium 7 has electric-insulation properties, while conducting, in a very effective way, the heat dissipated by the power electronic components 5 a and their terminals as well as the heat generated by the tracks as far as the dissipation film 10 . From the dissipation film 10 the heat passes through the envelope 2 , being then transferred to the environment.

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Liquid Crystal Substances (AREA)
  • Glass Compositions (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Casings For Electric Apparatus (AREA)
US10/250,989 2001-01-11 2002-01-11 Electronic device Abandoned US20040075986A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/464,434 US7576988B2 (en) 2001-01-11 2006-08-14 Electronic device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
BRPI0100051A BRPI0100051B1 (pt) 2001-01-11 2001-01-11 gabinete de dispositivo eletrônico
BRPI0100051-9 2001-01-11
PCT/BR2002/000005 WO2002056659A1 (en) 2001-01-11 2002-01-11 An electronic device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/464,434 Continuation US7576988B2 (en) 2001-01-11 2006-08-14 Electronic device

Publications (1)

Publication Number Publication Date
US20040075986A1 true US20040075986A1 (en) 2004-04-22

Family

ID=36776505

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/250,989 Abandoned US20040075986A1 (en) 2001-01-11 2002-01-11 Electronic device
US11/464,434 Expired - Fee Related US7576988B2 (en) 2001-01-11 2006-08-14 Electronic device

Family Applications After (1)

Application Number Title Priority Date Filing Date
US11/464,434 Expired - Fee Related US7576988B2 (en) 2001-01-11 2006-08-14 Electronic device

Country Status (11)

Country Link
US (2) US20040075986A1 (zh)
EP (1) EP1360884B1 (zh)
JP (2) JP4410466B2 (zh)
CN (1) CN100459837C (zh)
AT (1) ATE313242T1 (zh)
BR (1) BRPI0100051B1 (zh)
DE (1) DE60207989T2 (zh)
ES (1) ES2256471T3 (zh)
MX (1) MXPA03006187A (zh)
SK (1) SK287825B6 (zh)
WO (1) WO2002056659A1 (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060120054A1 (en) * 2002-07-31 2006-06-08 Endress & Hauser Gmbh & Co. Kg Electronics housing with integrated thermal dissipater
US20070115644A1 (en) * 2005-11-22 2007-05-24 Samsung Electronics Co., Ltd. Method of cooling electronic device and electronic device with improved cooling efficiency
US20090103267A1 (en) * 2007-10-17 2009-04-23 Andrew Dean Wieland Electronic assembly and method for making the electronic assembly
US20130108485A1 (en) * 2011-10-31 2013-05-02 Kabushiki Kaisha Toyota Jidoshokki Motor-driven compressor
US20150195956A1 (en) * 2014-01-08 2015-07-09 Enphase Energy, Inc. Double insulated heat spreader
WO2021158026A1 (ko) * 2020-02-07 2021-08-12 주식회사 케이엠더블유 전장소자의 방열장치
KR20210101153A (ko) * 2020-02-07 2021-08-18 주식회사 케이엠더블유 전장소자의 방열장치
US11284915B2 (en) * 2016-11-16 2022-03-29 Integra Lifesciences Enterprises, Lllp Ultrasonic surgical handpiece having a thermal diffuser

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US6731503B2 (en) * 2001-08-10 2004-05-04 Black & Decker Inc. Electrically isolated module
DE10315299A1 (de) * 2003-04-04 2004-10-14 Hella Kg Hueck & Co. Gehäuse
DE10352705A1 (de) * 2003-11-12 2005-06-23 Diehl Bgt Defence Gmbh & Co. Kg Schaltungsanordnung
WO2008050541A1 (fr) * 2006-10-27 2008-05-02 Murata Manufacturing Co., Ltd. Dispositif d'antenne
JP4333756B2 (ja) * 2007-03-13 2009-09-16 セイコーエプソン株式会社 放熱部材、電気光学装置及び電子機器
DE102007043886A1 (de) * 2007-09-14 2009-04-09 Continental Automotive Gmbh Elektrisches Gerät für den Einsatz in stark schwingenden Umgebungen und Dämpfungsglied
US20090269367A1 (en) * 2008-04-23 2009-10-29 Samuel Bogoch Methods and compounds for mitigating pathogenic outbreaks using replikin count cycles
CN101415316B (zh) * 2008-08-21 2011-04-20 华为终端有限公司 一种电子设备及其制造方法
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
CN101573022B (zh) * 2009-06-17 2011-08-31 杭州华三通信技术有限公司 密闭盒体中的散热结构装置及其加工方法
JP5071447B2 (ja) * 2009-07-14 2012-11-14 株式会社デンソー 電子制御装置
DE102009029260A1 (de) * 2009-09-08 2011-03-10 Robert Bosch Gmbh Elektronikeinheit und Verfahren zum Herstellen derselben
US8264854B2 (en) * 2009-11-12 2012-09-11 Roche Diagnostics Operations, Inc. Consumer electronic device with elastomeric mat
US8358506B2 (en) * 2010-08-27 2013-01-22 Direct Grid Technologies, LLC Mechanical arrangement for use within galvanically-isolated, low-profile micro-inverters for solar power installations
US9317079B2 (en) * 2011-03-29 2016-04-19 Echostar Uk Holdings Limited Media content device with customized panel
US8587945B1 (en) * 2012-07-27 2013-11-19 Outlast Technologies Llc Systems structures and materials for electronic device cooling
US9414530B1 (en) * 2012-12-18 2016-08-09 Amazon Technologies, Inc. Altering thermal conductivity in devices
JP6278695B2 (ja) * 2013-12-26 2018-02-14 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP6198068B2 (ja) 2014-11-19 2017-09-20 株式会社デンソー 電子装置
JP6201966B2 (ja) 2014-11-25 2017-09-27 株式会社デンソー 電子装置
BR202014032719Y1 (pt) * 2014-12-26 2020-04-07 Embraco Ind De Compressores E Solucoes Em Refrigeracao Ltda gabinete de dispositivo eletrônico
CN107112299B (zh) * 2015-01-29 2019-10-01 京瓷株式会社 电路基板以及电子装置
JP6693706B2 (ja) * 2015-04-06 2020-05-13 株式会社デンソー 電子制御装置
JP2016219599A (ja) * 2015-05-20 2016-12-22 株式会社リコー 電子機器および熱拡散体
US10120423B1 (en) * 2015-09-09 2018-11-06 Amazon Technologies, Inc. Unibody thermal enclosure
JP6528620B2 (ja) * 2015-09-15 2019-06-12 株式会社オートネットワーク技術研究所 回路構成体および電気接続箱
US10356948B2 (en) * 2015-12-31 2019-07-16 DISH Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
JP2017188597A (ja) * 2016-04-07 2017-10-12 アズビル株式会社 基板ユニットおよび基板ユニットの製造方法
CN106211553B (zh) * 2016-07-28 2019-04-19 Oppo广东移动通信有限公司 Pcb板组件及具有其的移动终端
CN206472427U (zh) * 2016-09-28 2017-09-05 华为技术有限公司 电子设备散热结构及电子设备
CN106877629A (zh) * 2017-02-17 2017-06-20 华为技术有限公司 一种插脚散热的电源适配器
CN107172840B (zh) * 2017-06-08 2022-11-15 歌尔科技有限公司 一种云台Camera惯性测量单元隔热固定结构
JP6622785B2 (ja) * 2017-12-19 2019-12-18 ファナック株式会社 電子部品ユニット
US10849217B2 (en) * 2018-07-02 2020-11-24 Aptiv Technologies Limited Electrical-circuit assembly with heat-sink
US11121058B2 (en) 2019-07-24 2021-09-14 Aptiv Technologies Limited Liquid cooled module with device heat spreader
US20220217870A1 (en) * 2019-09-06 2022-07-07 Hewlett-Packard Development Company, L.P. Circuit boards for electronic devices
DE102019215696A1 (de) * 2019-10-11 2021-04-15 Continental Teves Ag & Co. Ohg Elektronikeinheit mit verbesserter Kühlung
US11382205B2 (en) 2020-09-16 2022-07-05 Aptiv Technologies Limited Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly
JP2022053699A (ja) * 2020-09-25 2022-04-06 富士通オプティカルコンポーネンツ株式会社 光通信モジュール
WO2022252019A1 (zh) * 2021-05-31 2022-12-08 华为数字能源技术有限公司 一种电源适配器以及电子设备***
CN114071919B (zh) * 2021-11-16 2023-08-18 中国电子科技集团公司第二十九研究所 一种高密度集成的大功率电子模块

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US4604677A (en) * 1977-12-23 1986-08-05 Ngk Insulators, Ltd. Ceramic structural body and a method of manufacturing the same
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US5060114A (en) * 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
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US5311402A (en) * 1992-02-14 1994-05-10 Nec Corporation Semiconductor device package having locating mechanism for properly positioning semiconductor device within package
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US5323292A (en) * 1992-10-06 1994-06-21 Hewlett-Packard Company Integrated multi-chip module having a conformal chip/heat exchanger interface
US5777847A (en) * 1995-09-27 1998-07-07 Nec Corporation Multichip module having a cover wtih support pillar
US6054198A (en) * 1996-04-29 2000-04-25 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US6487073B2 (en) * 1999-12-01 2002-11-26 Cool Options, Inc. Thermally conductive electronic device case

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US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US5060114A (en) * 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
US5245508A (en) * 1990-08-21 1993-09-14 International Business Machines Corporation Close card cooling method
US5208733A (en) * 1990-11-09 1993-05-04 Merlin Gerin Enclosure and printed circuit card with heat sink
US5206792A (en) * 1991-11-04 1993-04-27 International Business Machines Corporation Attachment for contacting a heat sink with an integrated circuit chip and use thereof
US5319244A (en) * 1991-12-13 1994-06-07 International Business Machines Corporation Triazine thin film adhesives
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US5777847A (en) * 1995-09-27 1998-07-07 Nec Corporation Multichip module having a cover wtih support pillar
US6054198A (en) * 1996-04-29 2000-04-25 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US6487073B2 (en) * 1999-12-01 2002-11-26 Cool Options, Inc. Thermally conductive electronic device case

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060120054A1 (en) * 2002-07-31 2006-06-08 Endress & Hauser Gmbh & Co. Kg Electronics housing with integrated thermal dissipater
US20070115644A1 (en) * 2005-11-22 2007-05-24 Samsung Electronics Co., Ltd. Method of cooling electronic device and electronic device with improved cooling efficiency
US20090103267A1 (en) * 2007-10-17 2009-04-23 Andrew Dean Wieland Electronic assembly and method for making the electronic assembly
US20130108485A1 (en) * 2011-10-31 2013-05-02 Kabushiki Kaisha Toyota Jidoshokki Motor-driven compressor
US9879666B2 (en) * 2011-10-31 2018-01-30 Kabushiki Kaisha Toyota Jidoshokki Motor driven compressor
US20150195956A1 (en) * 2014-01-08 2015-07-09 Enphase Energy, Inc. Double insulated heat spreader
US9480185B2 (en) * 2014-01-08 2016-10-25 Enphase Energy, Inc. Double insulated heat spreader
US10098261B2 (en) 2014-01-08 2018-10-09 Enphase Energy, Inc. Double insulated heat spreader
US11284915B2 (en) * 2016-11-16 2022-03-29 Integra Lifesciences Enterprises, Lllp Ultrasonic surgical handpiece having a thermal diffuser
WO2021158026A1 (ko) * 2020-02-07 2021-08-12 주식회사 케이엠더블유 전장소자의 방열장치
KR20210101153A (ko) * 2020-02-07 2021-08-18 주식회사 케이엠더블유 전장소자의 방열장치
KR102505905B1 (ko) * 2020-02-07 2023-03-06 주식회사 케이엠더블유 전장소자의 방열장치

Also Published As

Publication number Publication date
ATE313242T1 (de) 2005-12-15
SK8522003A3 (en) 2003-12-02
DE60207989D1 (de) 2006-01-19
US7576988B2 (en) 2009-08-18
ES2256471T3 (es) 2006-07-16
EP1360884A1 (en) 2003-11-12
DE60207989T2 (de) 2006-08-24
SK287825B6 (sk) 2011-11-04
JP4410466B2 (ja) 2010-02-03
JP2008135771A (ja) 2008-06-12
US20070127217A1 (en) 2007-06-07
BRPI0100051B1 (pt) 2016-11-29
MXPA03006187A (es) 2004-11-12
EP1360884B1 (en) 2005-12-14
CN100459837C (zh) 2009-02-04
BR0100051A (pt) 2002-09-24
WO2002056659A1 (en) 2002-07-18
JP2004517503A (ja) 2004-06-10
CN1484936A (zh) 2004-03-24

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