TWM631709U - Component carrier comprising an identification mark - Google Patents

Component carrier comprising an identification mark Download PDF

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Publication number
TWM631709U
TWM631709U TW111200786U TW111200786U TWM631709U TW M631709 U TWM631709 U TW M631709U TW 111200786 U TW111200786 U TW 111200786U TW 111200786 U TW111200786 U TW 111200786U TW M631709 U TWM631709 U TW M631709U
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Taiwan
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identification mark
electrically conductive
conductive layer
component carrier
identification
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TW111200786U
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Chinese (zh)
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陳俊杰
王琦瑋
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大陸商奧特斯科技（重慶）有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Detergent Compositions (AREA)

Abstract

A component carrier comprising a stack of at least four electrically insulating layer structures and at least five electrically conductive layer structure stacked along a stacking direction above each other in an alternating manner, wherein one of the electrically conductive layer structures forms a first outer electrically conductive layer of the stack and another one of the electrically conductive layer structures forms a second outer electrically conductive layer of the stack and wherein the first outer electrically conductive layer and the second outer electrically conductive layer are opposed outer layers of the stack. The component carrier further comprises a first identification mark being detectable by a detection device, wherein the first identification mark is formed in an electrically conductive layer structure being arranged closest to the first outer electrically conductive layer, and a second identification mark being detectable by a detection device, wherein the second identification mark is formed in an electrically conductive layer structure being arranged closest to the second outer electrically conductive layer The first identification mark and the second identification mark are formed in stacking direction above each other.

Description

包括識別標記的部件承載件 Part carrier including identification mark

本創作涉及一種包括識別標記的部件承載件。 The present creation relates to a component carrier that includes an identification mark.

在配備有一個或更多個部件的部件承載件的產品功能不斷增加、這些部件逐步小型化以及將要連接至比如印刷電路板之類的部件承載件上的部件的數量不斷增多的情況下，採用了具有多個部件的越來越強大的陣列狀部件或封裝件，這些陣列狀部件或封裝件具有多個接觸部或連接部，其中，這些接觸部之間的間隔越來越小。特別地，部件承載件應具有機械強度和電氣可靠性，以便即使在惡劣條件下也能夠操作。越來越多的功能件集成在部件承載件中。 With the increasing product functionality of component carriers equipped with one or more components, the progressive miniaturization of these components, and the increasing number of components to be connected to component carriers such as printed circuit boards, the use of More and more powerful array-like components or packages with a plurality of components are required, which have a plurality of contacts or connections, wherein the spacing between the contacts is getting smaller and smaller. In particular, the component carrier should have mechanical strength and electrical reliability in order to be able to operate even under harsh conditions. More and more functional components are integrated in component carriers.

在製造諸如印刷電路板(PCB)之類的複雜部件承載件期間，使部件承載件以準確且精確的方式對準和定向是重要的。為了對準部件承載件，可以在部件承載件的層結構 內形成識別標記。識別標記可以通過諸如X射線檢測器之類的相應檢測裝置來測量，其中，基於所測量的識別標記的圖像，可以確定部件承載件的相應的對準。 During the manufacture of complex component carriers such as printed circuit boards (PCBs), it is important to align and orient the component carriers in an accurate and precise manner. In order to align the component carrier, the layer structure of the component carrier can be Identification marks are formed inside. The identification marks can be measured by corresponding detection means, such as X-ray detectors, wherein, based on the measured images of the identification marks, a corresponding alignment of the component carrier can be determined.

然而，如果在製造過程期間包括有識別標記的相應層被若干另外的層覆蓋，則識別標記的圖像(例如，識別標記的圖像中的對比度和輪廓)變得越來越不確定。 However, if the corresponding layer including the identification mark is covered by several further layers during the manufacturing process, the image of the identification mark (eg, the contrast and contours in the image of the identification mark) becomes increasingly uncertain.

因此，可能需要提供可以由檢測裝置適當確定的識別標記，以提供部件承載件的適當對準。 Therefore, it may be necessary to provide identification marks that can be appropriately determined by the detection device to provide proper alignment of the component carrier.

根據本創作的示例性實施方式，描述了一種部件承載件。部件承載件包括疊置件，該疊置件包括至少四個電絕緣層結構和至少五個電傳導層結構，電絕緣層結構和電傳導層結構沿著疊置方向以交替的方式彼此上下疊置。電傳導層結構中的一個電傳導層結構形成疊置件的第一外部電傳導層，而電傳導層結構中的另一個電傳導層結構形成疊置件的第二外部電傳導層，其中，第一外部電傳導層和第二外部電傳導層是疊置件的相反的兩個外部層。 According to an exemplary embodiment of the present creation, a component carrier is described. The component carrier comprises a stack comprising at least four electrically insulating layer structures and at least five electrically conducting layer structures, the electrically insulating layer structures and the electrically conducting layer structures being stacked on top of each other in an alternating manner along the stacking direction set. One of the electrically conductive layer structures forms a first outer electrically conductive layer of the stack and the other of the electrically conductive layer structures forms a second outer electrically conductive layer of the stack, wherein, The first outer electrically conductive layer and the second outer electrically conductive layer are opposite outer layers of the stack.

部件承載件還包括能夠由檢測裝置檢測的第一識別標記，其中，第一識別標記形成在電傳導層結構中。在示例性實施方式中，第一識別標記形成在最靠近第一外部電傳導層佈置的電傳導層結構中，並且第二識別標記能夠由檢測裝置檢測，其中，第二識別標記形成在電傳導層結構中。在示例性實施方式中，第二識別標記形成在最靠近第 二外部電傳導層佈置的電傳導層結構中。第一識別標記和第二識別標記在疊置方向上彼此上下形成。 The component carrier also includes a first identification mark detectable by the detection device, wherein the first identification mark is formed in the electrically conductive layer structure. In an exemplary embodiment, the first identification mark is formed in the electrically conductive layer structure disposed closest to the first outer electrically conductive layer, and the second identification mark is detectable by the detection device, wherein the second identification mark is formed in the electrically conductive layer in the layer structure. In an exemplary embodiment, the second identification mark is formed closest to the first Two external electrically conductive layers are arranged in the electrically conductive layer structure. The first identification mark and the second identification mark are formed on top of each other in the stacking direction.

根據本創作的示例性實施方式，描述了用於製造上述部件承載件的方法。電絕緣層結構和至少五個電傳導層結構沿著疊置方向以交替的方式彼此上下疊置，使得電傳導層結構中的一個電傳導層結構形成疊置件的第一外部電傳導層，而電傳導層結構中的另一個電傳導層結構形成疊置件的第二外部電傳導層，其中，第一外部電傳導層和第二外部電傳導層是疊置件的相反的兩個外部層。此外，在電傳導層結構中形成有能夠由檢測裝置檢測的第一識別標記。在示例性實施方式中，第一識別標記形成在最靠近第一外部電傳導層佈置的電傳導層結構中。能夠由檢測裝置檢測的第二識別標記形成在電傳導層結構中。在示例性實施方式中，第二識別標記形成在最靠近第二外部電傳導層佈置的電傳導層結構中。第一識別標記和第二識別標記在疊置方向上彼此上下形成。 According to an exemplary embodiment of the present creation, a method for manufacturing the above-described component carrier is described. The electrically insulating layer structure and the at least five electrically conductive layer structures are stacked on top of each other in an alternating manner along the stacking direction, such that one of the electrically conductive layer structures forms the first outer electrically conductive layer of the stack, And the other of the electrically conductive layer structures forms the second outer electrically conductive layer of the stack, wherein the first outer electrically conductive layer and the second outer electrically conductive layer are two opposite outer portions of the stack Floor. In addition, a first identification mark detectable by the detection device is formed in the electrically conductive layer structure. In an exemplary embodiment, the first identification mark is formed in the electrically conductive layer structure disposed closest to the first outer electrically conductive layer. A second identification mark detectable by the detection device is formed in the electrically conductive layer structure. In an exemplary embodiment, the second identification mark is formed in the electrically conductive layer structure disposed closest to the second outer electrically conductive layer. The first identification mark and the second identification mark are formed on top of each other in the stacking direction.

在本創作的上下文中，術語“部件承載件”可以特別地表示任何支撐結構，該支撐結構能夠在該支撐結構上和/或支撐結構中容納一個或更多個部件從而用於提供機械支撐和/或電連接。換言之，部件承載件可以被構造為用於部件的機械和/或電子承載件。特別地，部件承載件可以是印刷電路板、有機中介層、金屬芯基板、無機基板和IC(集成電路)基板中的一者。部件承載件也可以是將上述類型的部件承載件中的不同的部件承載件組合的混合板。 In the context of the present creation, the term "component carrier" may specifically refer to any support structure capable of accommodating one or more components on and/or in the support structure for providing mechanical support and /or electrical connection. In other words, the component carrier can be configured as a mechanical and/or electronic carrier for the component. In particular, the component carrier may be one of a printed circuit board, an organic interposer, a metal core substrate, an inorganic substrate, and an IC (integrated circuit) substrate. The component carrier can also be a hybrid plate combining different component carriers of the type described above.

在本創作的上下文中，術語“部件承載件材料”可以具體表示在部件承載件技術中使用的一個或多個電絕緣層結構和/或一個或多個電傳導層結構的連接佈置。更具體地說，這種部件承載件材料可以是用於印刷電路板(PCB)或IC基板的材料。特別地，這種部件承載件材料的導電材料可以包括銅。部件承載件材料的電絕緣材料可以包括樹脂，特別地包括環氧樹脂，電絕緣材料可選地與諸如玻璃纖維或玻璃球之類的增強顆粒結合。 In the context of the present creation, the term "component carrier material" may specifically refer to a connection arrangement of one or more electrically insulating layer structures and/or one or more electrically conductive layer structures used in component carrier technology. More specifically, such component carrier materials may be materials used for printed circuit boards (PCBs) or IC substrates. In particular, the conductive material of such component carrier material may comprise copper. The electrically insulating material of the component carrier material may comprise resins, in particular epoxy resins, optionally combined with reinforcing particles such as glass fibers or glass spheres.

在實施方式中，部件承載件是層壓型部件承載件。在這樣的實施方式中，部件承載件是多層結構件的化合物，多層結構件通過施加壓力和/或熱而疊置和連接在一起。 In an embodiment, the component carrier is a laminate type component carrier. In such embodiments, the component carrier is a compound of multilayer structures that are stacked and joined together by the application of pressure and/or heat.

在實施方式中，至少一個電絕緣層結構包括下述各者中的至少一者：樹脂或聚合物、比如環氧樹脂、氰酸酯樹脂、苯並環丁烯樹脂、胺三嗪樹脂、聚亞苯基衍生物(例如，基於聚苯醚、PPE)、聚醯亞胺(PI)、聚醯胺(PA)、液晶聚合物(LCP)、聚四氟乙烯(PTFE)和/或其組合。還可以使用增強結構，比如網狀件、纖維、球狀件或其他種類的填料顆粒，該填料顆粒例如由玻璃(多層玻璃)製成以便形成複合件。與增強劑相結合的半固化樹脂、例如浸漬有上述樹脂的纖維稱為預浸料。這些預浸料通常以其性能來命名，例如以描述預浸料的耐燃性能來命名的FR4或FR5。儘管對於剛性PCB而言，預浸料、特別是FR4通常是優選的，但是也可以使用其他材料，特別是環氧基積層材料(比如積層膜)或可光成像的介電材料。對於高頻的應用， 諸如聚四氟乙烯、液晶聚合物和/或氰酸酯樹脂之類的高頻材料可以是優選的。除了這些聚合物，低溫共燒陶瓷(LTCC)或其他低DK材料、極低或超低DK材料可以在部件承載件中被實現為電絕緣層結構。 In an embodiment, the at least one electrically insulating layer structure includes at least one of the following: resins or polymers, such as epoxy resins, cyanate ester resins, benzocyclobutene resins, amine triazine resins, poly Phenylene derivatives (eg, based on polyphenylene ether, PPE), polyimide (PI), polyamide (PA), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), and/or combinations thereof . It is also possible to use reinforcing structures, such as meshes, fibers, spheres or other kinds of filler particles, eg made of glass (multilayer glass) in order to form composites. Semi-cured resins combined with reinforcing agents, such as fibers impregnated with the aforementioned resins, are called prepregs. These prepregs are often named for their properties, such as FR4 or FR5, which are named after the flame resistance properties of the prepreg. Although prepregs, especially FR4, are generally preferred for rigid PCBs, other materials, especially epoxy-based build-up materials (such as build-up films) or photoimageable dielectric materials, may also be used. For high frequency applications, High frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate resins may be preferred. In addition to these polymers, low temperature co-fired ceramics (LTCC) or other low DK materials, very low or ultra low DK materials can be implemented as electrically insulating layer structures in component carriers.

在實施方式中，至少一個電傳導層結構包括銅、鋁、鎳、銀、金、鈀鎢和鎂中的至少一者。儘管銅通常是優選的，但是其他的材料或其塗覆的其他類型也是可以的，特別地塗覆有超導材料或傳導聚合物的材料是可能的，超導材料或傳導聚合物比如分別為石墨烯或聚(3,4-乙烯二氧噻吩)(PEDOT)。 In an embodiment, the at least one electrically conductive layer structure includes at least one of copper, aluminum, nickel, silver, gold, palladium tungsten, and magnesium. Although copper is generally preferred, other materials or other types of coating are possible, in particular materials coated with superconducting materials or conducting polymers such as respectively Graphene or poly(3,4-ethylenedioxythiophene) (PEDOT).

第一識別標記和第二識別標記在疊置方向上彼此上下形成。因此，疊置件可以由多個電絕緣層結構和多個電傳導層結構形成，其中，在疊置件的間隔開的電傳導層結構中形成有相應的識別標記。如果第一識別標記和第二識別標記在疊置方向上彼此上下形成，則可以提供由檢測裝置拍攝的識別標記的對準的適當圖像。換句話說，第一識別標記和第二識別標記形成為使得：在具有與疊置方向平行的投影法線的投影平面上，識別標記和另一識別標記彼此完全重疊。 The first identification mark and the second identification mark are formed on top of each other in the stacking direction. Thus, the stack may be formed from a plurality of electrically insulating layer structures and a plurality of electrically conductive layer structures, wherein corresponding identification marks are formed in the spaced apart electrically conductive layer structures of the stack. If the first identification mark and the second identification mark are formed on top of each other in the stacking direction, a suitable image of the alignment of the identification marks taken by the detection device can be provided. In other words, the first identification mark and the second identification mark are formed such that the identification mark and the other identification mark completely overlap each other on a projection plane having a projection normal parallel to the stacking direction.

識別標記形成在電傳導層結構中的一個電傳導層結構中。具體地，通過本方法，識別標記形成在電傳導層結構中的分別最靠近外部電傳導層的電傳導層結構中。因此，(例如，X射線)檢測裝置更容易分別對識別標記的周向形狀和取向進行檢測。 The identification mark is formed in one of the electrically conductive layer structures. Specifically, by the present method, the identification marks are formed in the electrically conductive layer structures of the electrically conductive layer structures which are respectively closest to the outer electrically conductive layer. Therefore, it is easier for the (eg X-ray) detection device to detect the circumferential shape and orientation of the identification marks, respectively.

示例性實施方式的詳細描述DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

根據示例性實施方式，第一識別標記和第二識別標記中的至少一個識別標記包括內部容積，該內部容積沒有電傳導層結構的材料。例如，識別標記的內部容積是中空的，並且例如不含銅。在示例性實施方式中，識別標記的內部容積填充有電絕緣材料。電絕緣材料可以類似於層壓在相應的電傳導層結構的頂部上的電絕緣層結構，電絕緣材料例如為聚丙烯(PP)。 According to an exemplary embodiment, at least one of the first identification indicia and the second identification indicia includes an interior volume devoid of material of the electrically conductive layer structure. For example, the inner volume of the identification mark is hollow and eg free of copper. In an exemplary embodiment, the interior volume of the identification mark is filled with an electrically insulating material. The electrically insulating material may be similar to an electrically insulating layer structure laminated on top of a corresponding electrically conductive layer structure, for example polypropylene (PP).

根據示例性實施方式，識別標記包括三角形形狀。通過提供三角形形狀，更容易檢測識別標記的取向和對準以及相應地檢測部件承載件的取向和對準。 According to an exemplary embodiment, the identification mark comprises a triangular shape. By providing a triangular shape, it is easier to detect the orientation and alignment of the identification marks and, accordingly, the component carrier.

根據另一示例性實施方式，識別標記包括箭頭形狀。通過提供箭頭形狀，更容易檢測識別標記的取向和對準以及相應地檢測部件承載件的取向和對準。 According to another exemplary embodiment, the identification mark comprises an arrow shape. By providing an arrow shape, it is easier to detect the orientation and alignment of the identification marks and, accordingly, the component carrier.

根據另一示例性實施方式，識別標記包括形成三角形形狀的三個識別點，其中，每個識別點包括不含導電材料的內部容積。通過提供例如中空點或輪廓(圓形、橢圓形或矩形)，識別標記的取向也是可能的，中空點或輪廓相對于彼此佈置成使得可以確定特定的方向。例如，三個識別點可以形成在虛擬三角形的角部處。 According to another exemplary embodiment, the identification mark includes three identification points forming a triangular shape, wherein each identification point includes an interior volume free of conductive material. Orientation of the identification marks is also possible by providing, for example, hollow points or contours (circular, oval or rectangular), which are arranged relative to each other such that a specific orientation can be determined. For example, three identification points may be formed at the corners of the virtual triangle.

根據另一示例性實施方式，識別標記形成在一個電傳導層結構的邊緣部分處。 According to another exemplary embodiment, the identification mark is formed at an edge portion of an electrically conductive layer structure.

根據另一示例性實施方式，識別標記形成在一個電傳 導層結構的角部部分處。 According to another exemplary embodiment, the identification mark is formed on a telex at the corner portion of the conductive layer structure.

根據另一示例性實施方式，第一識別標記和第二識別標記包括相同的周向形狀。例如，兩個識別標記具有三角形形狀或箭頭形狀，特別地第一識別標記和第二識別標記具有三角形形狀或箭頭形狀。 According to another exemplary embodiment, the first identification mark and the second identification mark comprise the same circumferential shape. For example, the two identification marks have a triangular shape or an arrow shape, in particular the first identification mark and the second identification mark have a triangular shape or an arrow shape.

根據另一示例性實施方式，第二識別標記填充有導電材料。例如，第二識別標記僅包括沒有導電材料的周向延伸部或路徑。因此，檢測裝置僅對識別標記的周向路徑進行檢測。然而，由於第二識別標記和內部容積不含導電材料的上述識別標記彼此上下形成，因此，從檢測裝置拍攝的圖像上的兩個識別標記的相應的重疊和匹配可以被檢測到。 According to another exemplary embodiment, the second identification mark is filled with a conductive material. For example, the second identification mark includes only circumferential extensions or paths without conductive material. Therefore, the detection device detects only the circumferential path of the identification mark. However, since the second identification mark and the aforementioned identification mark whose inner volume does not contain conductive material are formed on top of each other, a corresponding overlap and match of the two identification marks on the image taken from the detection device can be detected.

根據另一示例性實施方式，第二識別標記包括不含導電材料的內部容積。 According to another exemplary embodiment, the second identification mark includes an interior volume free of conductive material.

根據另一示例性實施方式，部件承載件還包括拆卸芯層，其中，拆卸芯層以可拆卸的方式佈置在一側上的至少一個電絕緣層結構和至少一個電傳導層結構與另一側上的至少一個另外的電絕緣層結構和至少一個另外的電傳導層結構之間。 According to another exemplary embodiment, the component carrier further comprises a dismantling core layer, wherein the dismantling core layer is detachably arranged on one side with at least one electrically insulating layer structure and at least one electrically conducting layer structure on the other side between the at least one further electrically insulating layer structure and the at least one further electrically conducting layer structure thereon.

因此，在拆卸芯層的相反兩側上，具有電傳導層結構和電絕緣層結構的相應的疊置件可以分層形成。在佈置在拆卸芯層的相反兩側上的相應電傳導層結構中，可以佈置有第一識別標記和第二識別標記。在拆卸芯層的兩側上的相應的疊置部分被形成之後，拆卸芯層可以被去除(例 如，通過施加熱或化學溶液)，使得兩個疊置部分可以相應地在一個共同的製造/層壓步驟中形成。通過形成第一識別標記和第二識別標記，可以在將拆卸芯層去除之前以及將拆卸芯層去除之後，對相應的部件承載件的取向進行檢測。 Accordingly, on opposite sides of the disassembled core layer, corresponding stacks with electrically conductive layer structures and electrically insulating layer structures can be formed in layers. In respective electrically conductive layer structures arranged on opposite sides of the dismantled core layer, a first identification mark and a second identification mark may be arranged. After the corresponding overlapping portions on both sides of the debonded core layer are formed, the debonded core layer may be removed (eg For example, by applying heat or chemical solutions) so that the two overlapping parts can be formed in one common fabrication/lamination step, respectively. By forming the first identification mark and the second identification mark, the orientation of the respective component carriers can be detected before and after removal of the disassembly core layer.

在實施方式中，第一識別標記佈置成最靠近第一外部電傳導層，以及/或者第二識別標記佈置成最靠近第二外部電傳導層。 In an embodiment, the first identification mark is arranged closest to the first outer electrically conductive layer and/or the second identification mark is arranged closest to the second outer electrically conductive layer.

在實施方式中，部件承載件還包括：形成在除了第一外部電傳導層和第二外部電傳導層之外的其他電傳導層結構中的每個電傳導層結構中的第一識別標記和/或第二識別標記。 In an embodiment, the component carrier further comprises: a first identification mark and /or a second identification mark.

在實施方式中，部件承載件還包括：能夠由檢測裝置檢測的另外的識別標記，其中，另外的識別標記形成在佈置成最靠近第一外部電傳導層或第二外部電傳導層的相應的電傳導層結構中。 In an embodiment, the component carrier further comprises: a further identification mark detectable by the detection device, wherein the further identification mark is formed on a corresponding one arranged closest to the first outer electrically conductive layer or the second outer electrically conductive layer in the electrically conductive layer structure.

在實施方式中，疊置件包括與所述疊置方向平行的鏡像平面，其中，另外的識別標記關於所述鏡像平面佈置在相對於所述第一識別標記的相反一側處。 In an embodiment, the stack comprises a mirror plane parallel to the stacking direction, wherein further identification marks are arranged at the opposite side relative to the first identification mark with respect to the mirror plane.

在實施方式中，疊置件包括平行於疊置方向的鏡像平面，其中，另外的識別標記關於所述鏡像平面佈置在相對於第二識別標記的同一側處。 In an embodiment, the stack comprises a mirror plane parallel to the stacking direction, wherein the further identification marks are arranged at the same side relative to the second identification mark with respect to the mirror plane.

在實施方式中，另外的識別標記包括不含導電材料的內部容積。 In an embodiment, the additional identification indicia includes an interior volume that is free of conductive material.

在實施方式中，在除了第一外部電傳導層和第二外部電傳導層之外的其他電傳導層結構中的每個電傳導層結構中形成有另外的識別標記。 In an embodiment, additional identification marks are formed in each of the other electrically conductive layer structures other than the first outer electrically conductive layer and the second outer electrically conductive layer.

在實施方式中，另外的識別標記包括不含導電材料的內部容積。 In an embodiment, the additional identification indicia includes an interior volume that is free of conductive material.

在實施方式中，另外的識別標記包括三角形形狀。 In an embodiment, the additional identification mark comprises a triangular shape.

在實施方式中，另外的識別標記包括箭頭形狀。 In an embodiment, the additional identifying indicia includes an arrow shape.

在實施方式中，另外的識別標記包括形成三角形形狀的三個識別點，每個識別點包括不含導電材料的內部容積。 In an embodiment, the additional identification mark includes three identification points forming a triangular shape, each identification point including an interior volume free of conductive material.

在實施方式中，另外的識別標記形成在一個電傳導層結構的邊緣部分處。 In embodiments, additional identification marks are formed at edge portions of an electrically conductive layer structure.

在實施方式中，另外的識別標記形成在電傳導層結構的角部部分處。 In an embodiment, additional identification marks are formed at corner portions of the electrically conductive layer structure.

在實施方式中，另外的識別標記、第一識別標記和/或第二識別標記包括相同的周向形狀。 In an embodiment, the further identification mark, the first identification mark and/or the second identification mark comprise the same circumferential shape.

在實施方式中，另外的識別標記填充有導電材料。 In an embodiment, the further identification marks are filled with conductive material.

在實施方式中，另外的識別標記包括不含導電材料的內部容積。 In an embodiment, the additional identification indicia includes an interior volume that is free of conductive material.

在實施方式中，部件承載件被成形為板。這有助於緊湊的設計，其中儘管如此，部件承載件仍為部件承載件上的安裝部件提供了大的基底。此外，特別地，作為嵌入的電子部件的示例的裸晶片由於其較小的厚度可以方便地嵌入諸如印刷電路板之類的薄板中。 In an embodiment, the component carrier is shaped as a plate. This facilitates a compact design, wherein the component carrier nonetheless provides a large base for mounting components on the component carrier. In addition, in particular, a bare wafer, which is an example of an embedded electronic component, can be easily embedded in a thin plate such as a printed circuit board due to its small thickness.

在實施方式中，部件承載件構造為印刷電路板、基板(特別是IC基板)和中介層中的一者。 In an embodiment, the component carrier is configured as one of a printed circuit board, a substrate (especially an IC substrate), and an interposer.

在本創作的上下文中，術語“印刷電路板”(PCB)可以特別地表示通過例如經由施加壓力和/或供給熱能而將多個電傳導層結構與多個電絕緣層結構層壓而形成的板狀部件承載件。作為用於PCB技術的優選材料，電傳導層結構由銅製成，而電絕緣層結構可以包括樹脂和/或玻璃纖維、所謂的預浸料或FR4材料。通過例如以激光鑽孔或機械鑽孔的方式形成穿過層壓件的通孔，並且通過用電傳導材料(特別是銅)填充該通孔從而形成過孔或任何其他通孔連接部，可以以期望的方式將各電傳導層結構連接至彼此。經填充的孔連接整個疊置件(延伸穿過多層或整個疊置件的通孔連接部)，或者經填充的孔連接至少兩個電傳導層，稱為過孔。類似地，光學互連部可以形成為通過疊置件的各個層，以便接收電光電路板(EOCB)。除了可以被嵌入到印刷電路板中的一個或更多個部件之外，印刷電路板通常被構造成用於在板狀的印刷電路板的一個或兩個相反的表面上容納一個或更多個部件。一個或更多個部件可以通過焊接而被連接到相應的主表面。PCB的的介電部分可以包括具有增強纖維(比如玻璃纖維)的樹脂。 In the context of the present creation, the term "printed circuit board" (PCB) may in particular denote a structure formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, eg via the application of pressure and/or the supply of thermal energy Plate-shaped component carrier. As a preferred material for use in PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or fiberglass, so-called prepregs or FR4 materials. By forming a via hole through the laminate, for example by laser drilling or mechanical drilling, and by filling the via hole with an electrically conductive material, especially copper, to form a via hole or any other via hole connection, it is possible to The various electrically conductive layer structures are connected to each other in the desired manner. Filled holes connect the entire stack (via connections extending through multiple layers or the entire stack), or filled holes connect at least two electrically conductive layers, called vias. Similarly, optical interconnects can be formed through the various layers of the stack to receive an electro-optical circuit board (EOCB). In addition to one or more components that may be embedded in a printed circuit board, a printed circuit board is typically configured to receive one or more on one or both opposing surfaces of a plate-like printed circuit board part. One or more components may be connected to the respective major surfaces by welding. The dielectric portion of the PCB may include resin with reinforcing fibers such as glass fibers.

在本創作的上下文中，術語“基板”可以特別地表示小的部件承載件。相對於PCB，基板可以是相對較小的部件承載件，該部件承載件上可以安裝有一個或更多個部件，並且該部件承載件可以用作一個或更多個芯片與另一PCB 之間的連接介質。例如，基板可以具有與待安裝在基板上的部件(特別是電子部件)大致相同的尺寸(例如在芯片尺寸封裝(CSP)的情況下)。更具體地，基板可以被理解為用於電連接件或電網絡的承載件以及與印刷電路板(PCB)相當但具有相當高密度的橫向和/或豎向佈置的連接件的部件承載件。橫向連接件例如是傳導通道，而豎向連接件可以是例如鑽孔。這些橫向連接件和/或豎向連接件佈置在基板內，並且可以用於提供容置部件或未容置部件(諸如裸晶片)--特別是IC芯片--與印刷電路板或中間印刷電路板的電連接、熱連接和/或機械連接。因此，術語“基板”還包括“IC基板”。基板的介電部分可以包括具有增強顆粒(比如為增強球體，特別是玻璃球體)的樹脂。 In the context of the present creation, the term "substrate" may particularly refer to a small component carrier. Relative to a PCB, a substrate can be a relatively small component carrier on which one or more components can be mounted and which can be used as one or more chips to interface with another PCB connecting medium between. For example, the substrate may have approximately the same dimensions (eg, in the case of a chip scale package (CSP)) as the components (especially electronic components) to be mounted on the substrate. More specifically, a substrate may be understood as a carrier for electrical connections or networks and as a component carrier comparable to a printed circuit board (PCB) but with a rather high density of laterally and/or vertically arranged connections. The transverse connections are, for example, conducting channels, while the vertical connections can be, for example, drilled holes. These lateral and/or vertical connections are arranged within the substrate and can be used to provide housed or unhoused parts (such as bare wafers) - in particular IC chips - with printed circuit boards or intermediate printed circuits Electrical, thermal and/or mechanical connections to the board. Thus, the term "substrate" also includes "IC substrate". The dielectric portion of the substrate may comprise a resin with reinforcing particles, such as reinforcing spheres, especially glass spheres.

基板或中介層可以包括下述各者或由下述各者構成：至少一層玻璃、矽(Si)、可光成像或可幹蝕刻的有機材料如環氧基積層材料(比如環氧基積層膜)、或聚合物化合物(可以或者可以不包括光敏分子和/或熱敏分子)比如聚醯亞胺或聚苯並惡唑。 The substrate or interposer may include or consist of at least one layer of glass, silicon (Si), photoimageable or dry-etchable organic materials such as epoxy-based build-up materials (such as epoxy-based build-up films) ), or polymeric compounds (which may or may not include photosensitive and/or thermosensitive molecules) such as polyimide or polybenzoxazole.

至少一個部件可以嵌入在疊置件中和/或可以表面安裝在疊置件上。這種部件可以選自非導電嵌體、導電嵌體(例如金屬嵌體，優選地包括銅或鋁)、熱傳遞單元(例如熱管)、光引導元件(例如光波導或光導體連接件)、電子部件或其組合。嵌體可以是例如帶有或不帶有絕緣材料塗層的金屬塊(IMS嵌體)，所述嵌體可以被嵌入或表面安裝以便於散熱。根據材料的導熱率限定合適的材料，導熱率應至 少為2W/mK。這種材料通常基於但不限於金屬、金屬氧化物和/或陶瓷，例如銅、氧化鋁(Al2O3)或氮化鋁(AlN)。為了增加熱交換能力，也經常使用具有增加的表面積的其他幾何形狀。此外，部件可以是有源電子部件(具有實現的至少一個p-n結)、無源電子部件如電阻器、電感或電容器、電子芯片、存儲裝置(例如DRAM或其他數據存儲器)、濾波器、集成電路(例如現場可編程門陣列(FPGA)、可編程陣列邏輯(PAL)、通用陣列邏輯(GAL)和複雜可編程邏輯器件(CPLD))、信號處理部件、功率管理部件(例如場效應晶體管(FET)、金屬氧化物半導體場效應晶體管(MOSFET)、互補金屬氧化物半導體(CMOS)、結型場效應晶體管(JFET)、或絕緣柵場效應晶體管(IGFET)，上述功率管理部件全部基於半導體材料，例如碳化矽(SiC)、砷化鎵(GaAs)、氮化鎵(GaN)、氧化鎵(Ga2O3)、砷化銦鎵(InGaAs)和/或任何其他合適的無機複合物)、光電接口元件、發光二極管、光電耦合器、電壓轉換器(例如DC/DC轉換器或AC/DC轉換器)、密碼部件、發射器和/或接收器、機電換能器、傳感器、致動器、微機電系統(MEMS)、微處理器、電容器、電阻器、電感、電池、開關、攝像機、天線、邏輯芯片和能量收集單元。但是，可以在部件承載件中嵌入其他部件。例如，磁性元件可以被用作部件。這種磁性元件可以是永磁元件(諸如鐵磁元件、反鐵磁元件、多鐵性元件或亞鐵磁元件，例如鐵氧體芯)，或者這種磁性元件可以是順磁元件。然而，該部件 也可以是例如呈板中板構型的IC基板、中介層或另外的部件承載件。部件可以被表面安裝在部件承載件上和/或可以被嵌入在部件承載件的內部。此外，也可以使用其他部件作為部件，特別是那些產生和發射電磁輻射和/或對從環境傳播的電磁輻射敏感的部件作為部件。 At least one component may be embedded in the stack and/or may be surface mounted on the stack. Such components may be selected from non-conductive inlays, conductive inlays (eg metal inlays, preferably comprising copper or aluminium), heat transfer elements (eg heat pipes), light guiding elements (eg optical waveguides or optical conductor connectors), Electronic components or combinations thereof. The inlay can be, for example, a metal block with or without a coating of insulating material (IMS inlay), which can be embedded or surface mounted to facilitate heat dissipation. Suitable materials are defined according to their thermal conductivity, which should be at least 2W/mK. Such materials are typically based on, but are not limited to, metals, metal oxides and/or ceramics, such as copper, aluminum oxide (Al 2 O 3 ) or aluminum nitride (AlN). To increase heat exchange capacity, other geometries with increased surface area are also often used. Furthermore, components may be active electronic components (with at least one pn junction implemented), passive electronic components such as resistors, inductors or capacitors, electronic chips, memory devices (eg DRAM or other data storage), filters, integrated circuits (eg Field Programmable Gate Array (FPGA), Programmable Array Logic (PAL), General Array Logic (GAL) and Complex Programmable Logic Device (CPLD)), Signal Processing Components, Power Management Components (eg Field Effect Transistor (FET) ), Metal Oxide Semiconductor Field Effect Transistor (MOSFET), Complementary Metal Oxide Semiconductor (CMOS), Junction Field Effect Transistor (JFET), or Insulated Gate Field Effect Transistor (IGFET), all of which are based on semiconductor materials, For example silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide ( Ga2O3 ), indium gallium arsenide (InGaAs) and/or any other suitable inorganic compound), optoelectronic Interface elements, light emitting diodes, optocouplers, voltage converters (eg DC/DC converters or AC/DC converters), cryptographic components, transmitters and/or receivers, electromechanical transducers, sensors, actuators, Micro Electro Mechanical Systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips and energy harvesting units. However, other components can be embedded in the component carrier. For example, magnetic elements can be used as components. Such magnetic elements may be permanent magnet elements (such as ferromagnetic elements, antiferromagnetic elements, multiferroic elements or ferrimagnetic elements, eg ferrite cores), or such magnetic elements may be paramagnetic elements. However, the component may also be an IC substrate, an interposer or another component carrier, eg in a board-in-board configuration. The components may be surface mounted on the component carrier and/or may be embedded within the component carrier. In addition, other components may also be used as components, particularly those that generate and emit electromagnetic radiation and/or are sensitive to electromagnetic radiation propagating from the environment.

在對部件承載件的內部層結構進行處理之後，可以用一個或更多個另外的電絕緣層結構和/或電傳導層結構對稱地或不對稱地覆蓋(特別是通過層壓)經處理的層結構的一個主表面或相反的兩個主表面。換句話說，可以持續堆積，直到獲得期望的層數為止。 After processing the inner layer structure of the component carrier, the processed layer structure can be symmetrically or asymmetrically covered (in particular by lamination) with one or more further electrically insulating and/or electrically conductive layer structures One major surface or two opposite major surfaces of a layered structure. In other words, the accumulation can continue until the desired number of layers is obtained.

在電絕緣層結構和電傳導層結構的疊置件的形成已完成之後，可以進行對所獲得的層結構或部件承載件的表面處理。 After the formation of the stack of electrically insulating layer structures and electrically conducting layer structures has been completed, a surface treatment of the layer structures or component carriers obtained can be carried out.

特別地，在表面處理方面，可以將電絕緣的阻焊劑施加至層疊置件或部件承載件的一個主表面或相反的兩個主表面。例如，可以在整個主表面上形成該阻焊劑並且隨後對阻焊劑層進行圖案化以暴露一個或更多個電傳導表面部分，這些電傳導表面部分將用於將部件承載件電耦接至電子外圍件。部件承載件的保持被阻焊劑覆蓋的表面部分被有效地保護以免受氧化或腐蝕，特別是包含銅的表面部分可以被有效地保護以免受氧化或腐蝕。 In particular, in terms of surface treatment, an electrically insulating solder resist can be applied to one major surface or to opposite major surfaces of the layer stack or component carrier. For example, the solder resist can be formed over the entire major surface and the solder resist layer then patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to electronic Peripherals. The surface portion of the component carrier that remains covered by the solder resist is effectively protected from oxidation or corrosion, in particular the surface portion containing copper can be effectively protected from oxidation or corrosion.

就表面處理而言，還可以選擇性地將表面修整部施加到部件承載件的暴露的電傳導表面部分。這樣的表面修整部可以是部件承載件的表面上的暴露的電傳導層結構(諸 如墊、傳導跡線等，特別是包括銅或由銅構成)上的電傳導覆蓋材料。如果不保護這樣的暴露的電傳導層結構，暴露的電傳導部件承載件材料(特別是銅)就可能會氧化，從而使部件承載件的可靠性較低。然後，可以將表面修整部形成為例如表面安裝的部件與部件承載件之間的接合部。表面修整部具有保護暴露的電傳導層結構(特別是銅電路)並且例如通過焊接來實現與一個或更多個部件的結合過程的功能。用於表面修整部的合適材料的示例是有機可焊性防腐劑(OSP)、化學鎳浸金(ENIG)、化學鎳浸鈀浸金(ENIPIG)、金(特別是硬金)、化學錫、鎳金、鎳鈀等。 With regard to surface treatments, surface treatments can also be selectively applied to exposed electrically conductive surface portions of the component carrier. Such a surface finish may be an exposed electrically conductive layer structure (such as a surface of the component carrier) such as pads, conductive traces, etc., especially including or consisting of copper, an electrically conductive cover material on it. If such exposed electrically conductive layer structures are not protected, the exposed electrically conductive component carrier material (particularly copper) may oxidize, thereby rendering the component carrier less reliable. The surface finish may then be formed as a joint between, for example, the surface mounted component and the component carrier. The surface finish has the function of protecting exposed electrically conductive layer structures (especially copper circuits) and fulfilling a bonding process with one or more components, eg by soldering. Examples of suitable materials for the surface finish are organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (especially hard gold), electroless tin, Nickel-gold, nickel-palladium, etc.

根據下面將描述的實施方式的示例，本創作的以上限定的方面和其他方面變得明顯，並且參考實施方式的這些示例來說明。 The above-defined and other aspects of the present invention are apparent from the examples of embodiment to be described below and are explained with reference to these examples of embodiment.

100:部件承載件 100: Component Carrier

101:疊置件 101: Stacks

102:電絕緣層結構 102: Electrical insulating layer structure

103:電傳導層結構 103: Electrically Conductive Layer Structure

104:疊置方向 104: Overlay Direction

105:另外的電絕緣層結構 105: Additional Electrically Insulating Layer Structures

106:另外的電傳導層結構 106: Additional Electrically Conductive Layer Structures

107:第一識別標記 107: First identification mark

108:第二識別標記 108: Second identification mark

109:拆卸芯層 109: Remove the core layer

110:X射線圖像 110: X-ray images

111:第一外部電傳導層 111: the first outer electrically conductive layer

112:第二外部電傳導層 112: Second external electrical conduction layer

201:鏡像平面 201: Mirror plane

301:第三識別標記 301: Third identification mark

302:另外的外部電傳導層 302: Additional external electrically conductive layers

[圖1]示出了具有常規識別標記的常規部件承載件的示意圖。 [FIG. 1] A schematic diagram showing a conventional component carrier having conventional identification marks.

[圖2]示出了根據示例性實施方式的包括拆卸芯層和識別標記的部件承載件的示意圖。 [ FIG. 2 ] A schematic diagram showing a component carrier including a core layer detachment and an identification mark according to an exemplary embodiment.

[圖3]示出了根據示例性實施方式的包括三個識別標記的部件承載件的示意圖。 [ FIG. 3 ] A schematic diagram showing a component carrier including three identification marks according to an exemplary embodiment.

[圖4]示出了根據示例性實施方式的包括三個識別標記的部件承載件的示意圖，所述三個識別標記沿著疊置方向彼此上下佈置。 [ FIG. 4 ] A schematic diagram showing a component carrier including three identification marks arranged on top of each other in a stacking direction according to an exemplary embodiment.

[圖5]示出了根據示例性實施方式的箭頭形識別標記的示意圖。 [ FIG. 5 ] A schematic diagram showing an arrow-shaped identification mark according to an exemplary embodiment.

[圖6]示出了根據示例性實施方式的由三點形成的識別標記的示意圖。 [ Fig. 6 ] A schematic diagram showing an identification mark formed of three dots according to an exemplary embodiment.

圖式中的圖示是示意性的。在不同的圖式中，相似或相同的元件具有相同的圖式符號。 The illustrations in the drawings are schematic. In different drawings, similar or identical elements have the same drawing symbols.

圖1示出了具有常規識別標記1001、1002的常規部件承載件1000的示意圖。 FIG. 1 shows a schematic diagram of a conventional component carrier 1000 with conventional identification marks 1001 , 1002 .

常規的部件承載件1000包括具有電絕緣層結構102和電傳導層結構103的疊置件101，該電傳導層結構103由導電材料製成，電絕緣層結構102和電傳導層結構103沿著疊置方向104以交替的方式彼此上下疊置。 A conventional component carrier 1000 comprises a stack 101 having an electrically insulating layer structure 102 and an electrically conductive layer structure 103 made of a conductive material along which the electrically insulating layer structure 102 and the electrically conductive layer structure 103 are formed. The stacking directions 104 are stacked on top of each other in an alternating fashion.

常規的識別標記1001在電傳導層結構103(上層L6，內部圖案鏡像)中形成為呈三角形形狀。另外的常規識別標記1002在電傳導層結構106(下層L6)中形成為呈三角形形狀。識別標記1001、1002填充有導電材料。兩種常規識別標記1001、1002沒有在疊置方向104上彼此上下佈置，並且在疊置方向104上相對於彼此存在偏移。此外，常規識別標記1001、1002是鏡像的並且在上層L6和下層L6中具有相同的圖案。(例如，X射線)檢測裝置拍攝相應的X射線圖像110，並分別檢測第一識別標記107的周向形狀和取向。 A conventional identification mark 1001 is formed in a triangular shape in the electrically conductive layer structure 103 (upper layer L6, mirror image of the inner pattern). Additional conventional identification marks 1002 are formed in the electrically conductive layer structure 106 (lower layer L6) in a triangular shape. The identification marks 1001, 1002 are filled with conductive material. The two conventional identification marks 1001 , 1002 are not arranged on top of each other in the stacking direction 104 and are offset relative to each other in the stacking direction 104 . Furthermore, the conventional identification marks 1001, 1002 are mirror images and have the same pattern in the upper layer L6 and the lower layer L6. The (eg X-ray) detection device captures corresponding X-ray images 110 and detects the circumferential shape and orientation of the first identification marks 107, respectively.

外部覆蓋的電傳導層結構103、106(L7)可以是承載件 銅箔，該承載件銅箔的厚度可以在3μm與18μm之間。由於厚的外部覆蓋的電傳導層結構103、106(L7)，這將影響檢測裝置(例如x射線檢測裝置)的X射線圖像110中的對比度。即使通過調節X射線光源和對比度，在相應的X射線圖像110中，三角形識別標記1001、1002的在芯拆卸之前指向不同方向的兩側將會影響方向識別。 The outer covered electrically conductive layer structures 103, 106 (L7) may be the carriers Copper foil, the thickness of the carrier copper foil may be between 3 μm and 18 μm. Due to the thick outer covering electrically conductive layer structures 103, 106 (L7), this will affect the contrast in the X-ray image 110 of a detection device, eg an x-ray detection device. Even by adjusting the X-ray light source and contrast, in the corresponding X-ray image 110, the two sides of the triangular identification marks 1001, 1002 pointing in different directions before core removal will affect the direction identification.

圖2示出了根據示例性實施方式的包括拆卸芯層109和第一識別標記107、第二識別標記108的部件承載件100的示意圖。 2 shows a schematic diagram of a component carrier 100 including a disassembled core layer 109 and a first identification mark 107, a second identification mark 108, according to an exemplary embodiment.

部件承載件100包括疊置件101，該疊置件101具有四個電絕緣層結構102和至少一個電傳導層結構103、106，電傳導層結構由導電材料製成，四個電絕緣層結構102和至少一個電傳導層結構103、106沿著疊置方向以交替的方式彼此上下疊置。電傳導層結構103、106中的一個電傳導層結構形成疊置件101的第一外部電傳導層111，並且電傳導層結構103、106中的另一個電傳導層結構形成疊置件101的第二外部電傳導層112，其中，第一外電傳導層111和第二外電傳導層112是疊置件101的相反的兩個外部層。形成有可以被檢測裝置檢測的第一識別標記107。第一識別標記107形成在最靠近第一外部電傳導層111佈置的電傳導層結構103中。附加地，第一識別標記107和/或第二識別標記108也可以形成在除了外部電傳導層111、112之外的其他電傳導層結構103、106中的每個電傳導層結構中。 The component carrier 100 comprises a stack 101 having four electrically insulating layer structures 102 and at least one electrically conducting layer structure 103, 106, the electrically conducting layer structures being made of a conductive material, four electrically insulating layer structures 102 and the at least one electrically conductive layer structure 103, 106 are stacked on top of each other in an alternating manner along the stacking direction. One of the electrically conductive layer structures 103 , 106 forms the first outer electrically conductive layer 111 of the stack 101 and the other of the electrically conductive layer structures 103 , 106 forms the The second outer electrically conductive layer 112 , wherein the first outer electrically conductive layer 111 and the second outer electrically conductive layer 112 are two opposite outer layers of the stack 101 . A first identification mark 107 that can be detected by the detection device is formed. The first identification mark 107 is formed in the electrically conductive layer structure 103 arranged closest to the first outer electrically conductive layer 111 . Additionally, the first identification mark 107 and/or the second identification mark 108 may also be formed in each of the other electrically conductive layer structures 103 , 106 in addition to the outer electrically conductive layers 111 , 112 .

此外，第二識別標記108形成為可由檢測裝置檢測， 其中，第二識別標記108形成在最靠近第二外部電傳導層112佈置的電傳導層結構106中。第一識別標記107和第二識別標記108沿著疊置方向104彼此上下形成。 In addition, the second identification mark 108 is formed so as to be detectable by the detection device, Therein, the second identification mark 108 is formed in the electrically conductive layer structure 106 disposed closest to the second outer electrically conductive layer 112 . The first identification mark 107 and the second identification mark 108 are formed on top of each other along the stacking direction 104 .

第一識別標記107和/或第二識別標記108包括不含導電材料的內部容積。第一識別標記107、第二識別標記108沿著相應的電傳導層結構103、106的平面延伸，並且包括與相應的電傳導層結構103、106的平面的法線平行的相應法線。 The first identification mark 107 and/or the second identification mark 108 comprise an interior volume that is free of conductive material. The first identification marks 107 , the second identification marks 108 extend along the plane of the respective electrically conductive layer structures 103 , 106 and include respective normals parallel to the normals of the planes of the respective electrically conductive layer structures 103 , 106 .

為了在圖中示出第一識別標記107、第二識別標記108的形狀，圖中的第一識別標記107、第二識別標記108被示出為傾斜了90°。此外，電傳導層103、106由層號L4至L8表示。 In order to show the shape of the first identification mark 107 and the second identification mark 108 in the figure, the first identification mark 107 and the second identification mark 108 in the figure are shown inclined by 90°. Furthermore, the electrically conductive layers 103, 106 are denoted by layer numbers L4 to L8.

第一識別標記107、第二識別標記108分別至少形成在電傳導層結構103、106(層L6，內部圖案鏡像)中的最靠近外部電傳導層111、112的至少一個電傳導層結構中。具體來說，例如第一識別標記107包括內部容積，該內部容積沒有電傳導層結構的材料。例如，第一識別標記107的內部容積是中空的並且例如沒有銅。電絕緣材料可以類似於電絕緣層結構102，該電絕緣層結構102層壓在相應的電傳導層結構103的頂部上。(例如，X射線)檢測裝置拍攝相應的X射線圖像110並且分別對第一識別標記107的周向形狀和取向進行檢測。 The first identification mark 107, the second identification mark 108 are respectively formed in at least one of the electrically conductive layer structures 103, 106 (layer L6, mirror image of the inner pattern) closest to the outer electrically conductive layers 111, 112, respectively. Specifically, for example, the first identification mark 107 includes an interior volume that is devoid of the material of the electrically conductive layer structure. For example, the inner volume of the first identification mark 107 is hollow and eg free of copper. The electrically insulating material may be similar to the electrically insulating layer structure 102 laminated on top of the corresponding electrically conductive layer structure 103 . The (eg X-ray) detection device captures a corresponding X-ray image 110 and detects the circumferential shape and orientation of the first identification marks 107, respectively.

覆蓋的電傳導層結構103、106(L7)可以是銅箔，銅箔的厚度可以在3μm與18μm之間。 The overlying electrically conductive layer structures 103, 106 (L7) may be copper foils, the thickness of which may be between 3 μm and 18 μm.

第一識別標記107和第二識別標記108在疊置方向104上彼此上下形成。因此，疊置件101可以由多個電絕緣層結構102、105和多個電傳導層結構103、106形成，其中，在疊置件101的間隔開的電傳導層結構103、106中，形成有相應的第一識別標記107、第二識別標記108。如果第一識別標記107和第二識別標記108在疊置方向104上彼此上下形成，則可以提供由檢測裝置拍攝的第一識別標記107、第二識別標記108的對準的適當X射線圖像110。 The first identification mark 107 and the second identification mark 108 are formed on top of each other in the stacking direction 104 . Thus, the stack 101 may be formed from a plurality of electrically insulating layer structures 102, 105 and a plurality of electrically conductive layer structures 103, 106, wherein in the spaced apart electrically conductive layer structures 103, 106 of the stack 101, the formation of There are corresponding first identification marks 107 and second identification marks 108 . If the first identification mark 107 and the second identification mark 108 are formed on top of each other in the stacking direction 104, a suitable X-ray image of the alignment of the first identification mark 107, the second identification mark 108 taken by the detection device can be provided 110.

在所示示例中，第一識別標記107、第二識別標記108包括相同的三角形形狀。換言之，第一識別標記107和第二識別標記108形成為使得：在具有與疊置方向104平行的投影法線的投影平面上，第一識別標記107和第二識別標記108完全彼此重疊。 In the example shown, the first identification mark 107, the second identification mark 108 comprise the same triangular shape. In other words, the first identification mark 107 and the second identification mark 108 are formed such that the first identification mark 107 and the second identification mark 108 completely overlap each other on a projection plane having a projection normal parallel to the stacking direction 104 .

部件承載件100還包括拆卸芯層109，其中，拆卸芯層109以可拆卸的方式佈置在一側上的中央電傳導層結構103(L5)與另一側上的另外的電傳導層結構106(L5)之間。在拆卸芯層109的相反兩側上，由電傳導層結構103、106和電絕緣層結構102、105製成的疊置件101的相應的疊置部分可以分層地形成。在佈置在拆卸芯層109的相反兩側的相應的電傳導層結構103、106中，形成有第一識別標記107和第二識別標記108。在位於拆卸芯層109的兩側上的相應的疊置部分被形成之後，拆卸芯層109可以被移除，使得可以在同一製造/層壓步驟中形成兩個疊置部分。通過形成第一識別標記107、第二識別標記108，可以在去除 拆卸芯層109之前以及去除拆卸芯層109之後，相應的部件承載件100的取向可以被檢測。 The component carrier 100 also comprises a dismantling core layer 109, wherein the dismantling core layer 109 is detachably arranged with a central electrically conductive layer structure 103 (L5) on one side and a further electrically conductive layer structure 106 on the other side (L5). On opposite sides of the dismantled core layer 109 , corresponding stacked portions of the stack 101 made of electrically conductive layer structures 103 , 106 and electrically insulating layer structures 102 , 105 may be formed in layers. In the respective electrically conductive layer structures 103, 106 arranged on opposite sides of the dismantled core layer 109, a first identification mark 107 and a second identification mark 108 are formed. After the respective overlapping portions on both sides of the dismantling core layer 109 are formed, the dismantling core layer 109 can be removed so that the two overlapping portions can be formed in the same manufacturing/lamination step. By forming the first identification mark 107 and the second identification mark 108, it is possible to remove the Before disassembling the core layer 109 and after removing the disassembling core layer 109, the orientation of the corresponding component carrier 100 can be detected.

在圖2中，三個電傳導層結構103、106(L5、L6和L7)是銅層。第一識別標記107、第二識別標記108形成在傳導層結構L6中，因為在這些層結構L6中，圖案處理完成，並且可以在這種相應的圖案處理中形成第一識別標記107、第二識別標記108。在最靠近拆卸芯層109的傳導層結構103、106、即L5和頂部外部電傳導層111、112即L7中，在從拆卸芯層109拆卸之前沒有完成圖案處理。 In Figure 2, the three electrically conductive layer structures 103, 106 (L5, L6 and L7) are copper layers. The first identification marks 107, the second identification marks 108 are formed in the conductive layer structure L6 because in these layer structures L6 the patterning process is completed and the first identification mark 107, the second identification mark 107, the second identification mark can be formed in this respective patterning process Identification mark 108 . In the conductive layer structures 103 , 106 closest to the disassembled core layer 109 , ie L5 and the top outer electrical conductive layers 111 , 112 ie L7 , the patterning process is not completed prior to disassembly from the disassembled core layer 109 .

圖3示出了根據示例性實施方式的包括三個識別標記：第一識別標記107、第三識別標記301的部件承載件100的示意圖。包括傳導層結構L5、L6和L7的疊置件101是圖2中的疊置件101的上部的倒置的疊置部分。該第一識別標記107與圖2中的第一識別標記107相同，圖2中的第一識別標記107可以在將電傳導層結構103(L6)從拆卸芯層109拆卸之前形成在電傳導層結構103(L6)中，而圖3中的第三識別標記301是在將電傳導層結構L5和L7從拆卸芯層109拆卸之後形成在電傳導層結構L5和L7中的附加標記。第三識別標記301可以具有相同的輪廓，例如具有三角形輪廓，並且第三識別標記301在疊置方向104上彼此上下形成，第三識別標記與圖2中所示的第一識別標記107和第二識別標記108類似。疊置件101包括平行於疊置方向104的鏡像平面201，其中，第三識別標記301關於鏡像平面201佈置在相對於第一識別標記107的相反側處。 Figure 3 shows a schematic diagram of a component carrier 100 comprising three identification marks: a first identification mark 107, a third identification mark 301, according to an exemplary embodiment. The stack 101 comprising the conductive layer structures L5, L6 and L7 is an upside-down stack portion of the upper portion of the stack 101 in FIG. 2 . The first identification mark 107 is the same as the first identification mark 107 in FIG. 2 , which may be formed on the electrically conductive layer before disassembling the electrically conductive layer structure 103 ( L6 ) from the disassembly core layer 109 structure 103 ( L6 ), while the third identification mark 301 in FIG. 3 is an additional mark formed in the electrically conductive layer structures L5 and L7 after disassembly of the electrically conductive layer structures L5 and L7 from the disassembled core layer 109 . The third identification marks 301 may have the same outline, eg a triangular outline, and the third identification marks 301 are formed on top of each other in the stacking direction 104, the third identification marks are the same as the first identification marks 107 and the third identification marks shown in FIG. 2 . The two identification marks 108 are similar. The stack 101 comprises a mirror plane 201 parallel to the stacking direction 104 , wherein the third identification mark 301 is arranged at the opposite side with respect to the first identification mark 107 with respect to the mirror plane 201 .

圖3中所示的部件承載件100可以是通過將另外的電絕緣層結構102、105和另外的外部電傳導層302(L4、L8)層壓在外部電傳導層111(L5、L7)的頂部上來形成。第一識別標記107由於圖2中的上部疊置部分的翻轉而佈置在右側，並且第一識別標記107在電傳導層結構103(L6)中現在形成在疊置件101的中央中。因此，儘管第一識別標記107在檢測裝置的X射線圖像110中幾乎不可見，但是附加的第三識別標記301形成在電傳導層結構103、106(L5、L7)中，該電傳導層結構103、106(L5、L7)佈置成最靠近另外的外部電傳導層302(L4、L8)，並且因此最靠近疊置件101的表面。因此，可以在檢測裝置的X射線圖像110中清晰顯示第三識別標記301的形狀。第三識別標記301可以具有不含導電材料的內部容積。另外，第三識別標記301還可以形成在除了外部電傳導層111、112之外的其他電傳導層結構103、106中的每個電傳導層結構中。 The component carrier 100 shown in FIG. 3 may be fabricated by laminating the further electrically insulating layer structures 102, 105 and the further outer electrically conductive layers 302 (L4, L8) to the outer electrically conductive layers 111 (L5, L7) The top comes up to form. The first identification mark 107 is arranged on the right due to the inversion of the upper stack in FIG. 2 , and the first identification mark 107 is now formed in the center of the stack 101 in the electrically conductive layer structure 103 ( L6 ). Thus, although the first identification mark 107 is hardly visible in the X-ray image 110 of the detection device, an additional third identification mark 301 is formed in the electrically conductive layer structures 103, 106 (L5, L7), which The structures 103 , 106 ( L5 , L7 ) are arranged closest to the further outer electrically conductive layers 302 ( L4 , L8 ), and thus closest to the surface of the stack 101 . Therefore, the shape of the third identification mark 301 can be clearly displayed in the X-ray image 110 of the detection device. The third identification mark 301 may have an interior volume free of conductive material. In addition, the third identification mark 301 may also be formed in each of the other electrically conductive layer structures 103 , 106 other than the outer electrically conductive layers 111 , 112 .

圖4示出了根據示例性實施方式的包括三個識別標記第二識別標記108、第三識別標記301的部件承載件的示意圖，三個識別標記第二識別標記108、第三識別標記301沿著疊置方向104彼此上下佈置。圖4中所示的部件承載件100可以通過將另外的電絕緣層結構102、105和另外的外部電傳導層302(L4、L8)層壓在外部電傳導層112(L5、L7)的頂部上來形成。 FIG. 4 shows a schematic diagram of a component carrier comprising three identification marks, second identification mark 108 , third identification mark 301 , along with three identification marks, second identification mark 108 , third identification mark 301 , according to an exemplary embodiment. They are arranged on top of each other in the stacking direction 104 . The component carrier 100 shown in FIG. 4 can be achieved by laminating the further electrically insulating layer structures 102, 105 and the further outer electrically conductive layers 302 (L4, L8) on top of the outer electrically conductive layers 112 (L5, L7) come up to form.

包括傳導層結構L5、L6和L7的疊置件101是圖2中的疊置件101的下部部分的疊置部分。第二識別標記108與圖 2中的第二識別標記108相同，圖2的第二識別標記108可以在將電傳導層結構103(L6)從拆卸芯層109拆卸之前形成在電傳導層結構103(L6)中，而圖4中的第三識別標記301是在將電傳導層結構L5和L7從拆卸芯層109拆卸之後形成在電傳導層結構L5和L7中的附加標記。第三識別標記301可以具有相同的輪廓，例如三角形的輪廓，並且第三識別標記301沿著疊置方向彼此上下形成、與圖2中所示的第一識別標記107和第二識別標記108相似。疊置件101包括平行於疊置方向104的鏡像平面201，其中，第三識別標記301關於鏡像平面201佈置在相對於第二識別標記108的同一側。此外，第三識別標記301還可以形成在除了外部電傳導層111、112之外的其他電傳導層結構103、106中的每個電傳導層結構中。 The stack 101 comprising the conductive layer structures L5, L6 and L7 is a stack portion of the lower portion of the stack 101 in FIG. 2 . The second identification mark 108 and the figure 2, the second identification mark 108 of FIG. 2 may be formed in the electrically conductive layer structure 103 (L6) prior to disassembly of the electrically conductive layer structure 103 (L6) from the disassembly core layer 109, while FIG. The third identification mark 301 in 4 is an additional mark formed in the electrically conductive layer structures L5 and L7 after the electrically conductive layer structures L5 and L7 are detached from the disassembled core layer 109. The third identification marks 301 may have the same outline, eg a triangular outline, and the third identification marks 301 are formed on top of each other along the stacking direction, similar to the first identification marks 107 and the second identification marks 108 shown in FIG. 2 . . The stack 101 comprises a mirror plane 201 parallel to the stacking direction 104 , wherein the third identification mark 301 is arranged on the same side relative to the second identification mark 108 with respect to the mirror plane 201 . Furthermore, the third identification mark 301 may also be formed in each of the other electrically conductive layer structures 103 , 106 other than the outer electrically conductive layers 111 , 112 .

由於第二識別標記108和具有不含導電材料的內部容積的第三識別標記301彼此上下形成，因此由檢測裝置拍攝的X射線圖像110上的第二識別標記108、第三識別標記301的相應的重疊和匹配可以被檢測。 Since the second identification mark 108 and the third identification mark 301 having an inner volume without conductive material are formed on top of each other, the second identification mark 108, the third identification mark 301 on the X-ray image 110 captured by the detection device are Corresponding overlaps and matches can be detected.

圖5示出了根據示例性實施方式的箭頭形的第一識別標記107的示意圖。第一識別標記107包括箭頭形狀。第二識別標記108和第三識別標記301也可以具有相應的形狀。 FIG. 5 shows a schematic diagram of an arrow-shaped first identification mark 107 according to an exemplary embodiment. The first identification mark 107 includes an arrow shape. The second identification mark 108 and the third identification mark 301 may also have corresponding shapes.

圖6示出了根據示例性實施方式的由三點形成的第一識別標記107的示意圖。三個識別點形成三角形形狀，其中，每個識別點包括內部容積，該內部容積不含導電材料。例如，三個識別點可以形成在虛擬三角形的角部處以 便形成第一識別標記107。第二識別標記108和第三識別標記301也可以具有相應的形狀。 FIG. 6 shows a schematic diagram of a first identification mark 107 formed by three points according to an exemplary embodiment. The three identification points form a triangular shape, wherein each identification point includes an interior volume that is free of conductive material. For example, three identification points may be formed at the corners of the virtual triangle to The first identification mark 107 is formed. The second identification mark 108 and the third identification mark 301 may also have corresponding shapes.

應當注意，術語“包括”不排除其他元件或步驟，並且“一”或“一種”不排除多個。而且，可以對與不同實施方式相關聯地描述的元件進行組合。 It should be noted that the term "comprising" does not exclude other elements or steps, and "a" or "an" does not exclude a plurality. Also, elements described in association with different embodiments may be combined.

還應當指出，申請專利範圍中的圖式符號不應被解釋為限制申請專利範圍的範圍。 It should also be noted that the drawing symbols in the claimed scope should not be construed as limiting the scope of the claimed scope.

本創作的實施不限於圖式中所示和上面描述的優選實施方式。相反，使用示出的解決方案和根據本創作的原理的多種變型也是可行的，即使在根本不同的實施方式的情況下，也可以進行多種變型。 The implementation of the present invention is not limited to the preferred embodiments shown in the drawings and described above. Rather, numerous variations are possible using the solutions shown and in accordance with the principles of the present invention, even with radically different implementations.

100:部件承載件 100: Component Carrier

101:疊置件 101: Stacks

102:電絕緣層結構 102: Electrical insulating layer structure

103:電傳導層結構 103: Electrically Conductive Layer Structure

104:疊置方向 104: Overlay Direction

105:另外的電絕緣層結構 105: Additional Electrically Insulating Layer Structures

106:另外的電傳導層結構 106: Additional Electrically Conductive Layer Structures

107:第一識別標記 107: First identification mark

108:第二識別標記 108: Second identification mark

109:拆卸芯層 109: Remove the core layer

110:X射線圖像 110: X-ray images

111:第一外部電傳導層 111: the first outer electrically conductive layer

112:第二外部電傳導層 112: Second external electrical conduction layer

201:鏡像平面 201: Mirror plane

Claims (27)

一種部件承載件，其特徵在於，所述部件承載件(100)包括：疊置件(101)，所述疊置件(101)具有至少四個電絕緣層結構(102)和至少五個電傳導層結構(103、106)，所述電絕緣層結構(102)和所述電傳導層結構(103、106)沿著疊置方向(104)以交替的方式彼此上下疊置，其中，所述電傳導層結構(103、106)中的一個電傳導層結構形成所述疊置件(101)的第一外部電傳導層(111)，並且所述電傳導層結構(103、106)中的另一個電傳導層結構形成所述疊置件(101)的第二外部電傳導層(112)，其中，所述第一外部電傳導層(111)和所述第二外部電傳導層(112)是所述疊置件(101)的相反的兩個外部層，第一識別標記(107)，所述第一識別標記(107)能夠由檢測裝置檢測，其中，所述第一識別標記(107)形成在電傳導層結構(103、106)中，第二識別標記(108)，所述第二識別標記(108)能夠由檢測裝置檢測，其中，所述第二識別標記(108)形成在電傳導層結構(103、106)中，其中，所述第一識別標記(107)和所述第二識別標記(108)在疊置方向(104)上彼此上下形成。 A component carrier, characterized in that the component carrier (100) comprises: a stack (101), the stack (101) having at least four electrically insulating layer structures (102) and at least five electrical Conductive layer structures (103, 106), said electrically insulating layer structures (102) and said electrically conducting layer structures (103, 106) are stacked on top of each other in an alternating manner along a stacking direction (104), wherein all One of the electrically conductive layer structures (103, 106) forms a first outer electrically conductive layer (111) of the stack (101), and one of the electrically conductive layer structures (103, 106) Another electrically conductive layer structure of the stack forms a second outer electrically conductive layer (112) of the stack (101), wherein the first outer electrically conductive layer (111) and the second outer electrically conductive layer ( 112) are the two opposite outer layers of the stack (101), a first identification mark (107), the first identification mark (107) being detectable by a detection device, wherein the first identification mark (107) Formed in the electrically conductive layer structure (103, 106), a second identification mark (108), the second identification mark (108) being detectable by a detection device, wherein the second identification mark (108) is formed in an electrically conductive layer structure (103, 106), wherein the first identification mark (107) and the second identification mark (108) are formed on top of each other in the stacking direction (104). 根據請求項1所述的部件承載件，其中，所述第一識別標記(107)包括不含導電材料的內部容積。 The component carrier of claim 1, wherein the first identification mark (107) comprises an interior volume free of conductive material. 根據請求項2所述的部件承載件，其中， 所述第一識別標記(107)包括三角形形狀。 The component carrier of claim 2, wherein The first identification mark (107) comprises a triangular shape. 根據請求項2所述的部件承載件，其中，所述第一識別標記(107)包括箭頭形狀。 The component carrier of claim 2, wherein the first identification mark (107) comprises an arrow shape. 根據請求項2所述的部件承載件，其中，所述第一識別標記(107)包括形成三角形形狀的三個識別點，其中，每個識別點包括不含導電材料的內部容積。 The component carrier of claim 2, wherein the first identification mark (107) includes three identification points forming a triangular shape, wherein each identification point includes an interior volume free of conductive material. 根據請求項2所述的部件承載件，其中，所述第一識別標記(107)形成在一個電傳導層結構的邊緣部分處。 The component carrier of claim 2, wherein the first identification mark (107) is formed at an edge portion of an electrically conductive layer structure. 根據請求項2所述的部件承載件，其中，所述第一識別標記(107)形成在一個電傳導層結構的角部部分處。 The component carrier of claim 2, wherein the first identification mark (107) is formed at a corner portion of an electrically conductive layer structure. 根據請求項1所述的部件承載件，其中，所述第一識別標記(107)和所述第二識別標記(108)包括相同的周向形狀。 The component carrier of claim 1, wherein the first identification mark (107) and the second identification mark (108) comprise the same circumferential shape. 根據請求項1所述的部件承載件，其中，所述第二識別標記(108)填充有導電材料。 The component carrier of claim 1, wherein the second identification mark (108) is filled with a conductive material. 根據請求項1所述的部件承載件，其中，所述第二識別標記(108)包括不含導電材料的內部容積。 The component carrier of claim 1, wherein the second identification mark (108) comprises an interior volume free of conductive material. 根據請求項1所述的部件承載件，其中，所述部件承載件(100)還包括：拆卸芯層(109)，其中，所述拆卸芯層(109)以可拆卸的方式佈置在一 側上的至少一個所述電絕緣層結構(102)和至少一個所述電傳導層結構與另一側上的至少一個另外的電絕緣層結構(105)和至少一個另外的電傳導層結構之間。 The component carrier according to claim 1, wherein the component carrier (100) further comprises: a detachable core layer (109), wherein the detachable core layer (109) is detachably arranged on a at least one said electrically insulating layer structure (102) and at least one said electrically conducting layer structure on one side and at least one further electrically insulating layer structure (105) and at least one further electrically conducting layer structure on the other side between. 根據請求項1所述的部件承載件，其中，所述第一識別標記(107)佈置成最靠近所述第一外部電傳導層(111)，以及/或者所述第二識別標記(108)佈置成最靠近所述第二外部電傳導層(112)。 Component carrier according to claim 1, wherein the first identification mark (107) is arranged closest to the first outer electrically conductive layer (111), and/or the second identification mark (108) arranged closest to the second outer electrically conductive layer (112). 根據請求項1所述的部件承載件，其中，所述部件承載件(100)還包括：形成在除了所述第一外部電傳導層(111)和所述第二外部電傳導層(112)之外的其他電傳導層結構中的每個電傳導層結構中的所述第一識別標記(107)和/或所述第二識別標記(108)。 The component carrier according to claim 1, wherein the component carrier (100) further comprises: formed in addition to the first outer electrically conductive layer (111) and the second outer electrically conductive layer (112) The first identification mark (107) and/or the second identification mark (108) in each of the electrically conductive layer structures other than the other electrically conductive layer structures. 根據請求項1所述的部件承載件，其中，所述部件承載件(100)還包括：能夠由檢測裝置檢測的第三識別標記(301)，其中，所述第三識別標記(301)形成在最靠近所述第一外部電傳導層(111)或所述第二外部電傳導層(112)佈置的相應的電傳導層結構中。 The component carrier according to claim 1, wherein the component carrier (100) further comprises a third identification mark (301) detectable by the detection device, wherein the third identification mark (301) forms In the respective electrically conductive layer structure arranged closest to said first outer electrically conductive layer (111) or said second outer electrically conductive layer (112). 根據請求項14所述的部件承載件，其中，所述疊置件(101)包括與所述疊置方向(104)平行的鏡 像平面(201)，其中，所述第三識別標記(301)關於所述鏡像平面(201)佈置在相對於所述第一識別標記(107)的相反一側處。 Component carrier according to claim 14, wherein the stack (101) comprises mirrors parallel to the stacking direction (104) Image plane (201), wherein said third identification mark (301) is arranged at the opposite side with respect to said first identification mark (107) with respect to said mirror plane (201). 根據請求項14所述的部件承載件，其中，所述疊置件(101)包括平行於所述疊置方向(104)的鏡像平面(201)，其中，所述第三識別標記(301)關於所述鏡像平面(201)佈置在相對於所述第二識別標記(108)的同一側處。 Component carrier according to claim 14, wherein the stack (101) comprises a mirror plane (201) parallel to the stacking direction (104), wherein the third identification mark (301) The mirror plane (201) is arranged at the same side with respect to the second identification mark (108). 根據請求項14所述的部件承載件，其中，所述第三識別標記(301)包括不含導電材料的內部容積。 The component carrier of claim 14, wherein the third identification mark (301) comprises an interior volume free of conductive material. 根據請求項14所述的部件承載件，其中，在除了所述第一外部電傳導層(111)和所述第二外部電傳導層(112)之外的其他電傳導層結構中的每個電傳導層結構中形成有第三識別標記(301)。 The component carrier of claim 14, wherein each of the other electrically conductive layer structures other than the first outer electrically conductive layer ( 111 ) and the second outer electrically conductive layer ( 112 ) A third identification mark (301) is formed in the electrically conductive layer structure. 根據請求項14所述的部件承載件，其中，所述第三識別標記(301)包括不含導電材料的內部容積。 The component carrier of claim 14, wherein the third identification mark (301) comprises an interior volume free of conductive material. 根據請求項14所述的部件承載件，其中，所述第三識別標記(301)包括三角形形狀。 The component carrier of claim 14, wherein the third identification mark (301) comprises a triangular shape. 根據請求項14所述的部件承載件，其 中，所述第三識別標記(301)包括箭頭形狀。 Component carrier according to claim 14, which is , the third identification mark (301) includes an arrow shape. 根據請求項14所述的部件承載件，其中，所述第三識別標記(301)包括形成三角形形狀的三個識別點，其中，每個識別點包括不含導電材料的內部容積。 The component carrier of claim 14, wherein the third identification mark (301) comprises three identification points forming a triangular shape, wherein each identification point includes an interior volume free of conductive material. 根據請求項14所述的部件承載件，其中，所述第三識別標記(301)形成在一個電傳導層結構的邊緣部分處。 The component carrier of claim 14, wherein the third identification mark (301) is formed at an edge portion of an electrically conductive layer structure. 根據請求項14所述的部件承載件，其中，所述第三識別標記(301)形成在所述電傳導層結構(103、106)的角部部分處。 The component carrier of claim 14, wherein the third identification marks (301) are formed at corner portions of the electrically conductive layer structures (103, 106). 根據請求項14所述的部件承載件，其中，所述第三識別標記(301)、所述第一識別標記(107)和/或所述第二識別標記(108)包括相同的周向形狀。 Component carrier according to claim 14, wherein the third identification mark (301), the first identification mark (107) and/or the second identification mark (108) comprise the same circumferential shape . 根據請求項14所述的部件承載件，其中，所述第三識別標記(301)填充有導電材料。 The component carrier of claim 14, wherein the third identification mark (301) is filled with a conductive material. 根據請求項14所述的部件承載件，其中，所述第三識別標記(301)包括不含導電材料的內部容積。 The component carrier of claim 14, wherein the third identification mark (301) comprises an interior volume free of conductive material.
TW111200786U 2021-01-28 2022-01-20 Component carrier comprising an identification mark TWM631709U (en)

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JP6208054B2 (en) * 2014-03-10 2017-10-04 新光電気工業株式会社 WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING METHOD
SG10201608773PA (en) * 2016-10-19 2018-05-30 Delta Electronics Intl Singapore Pte Ltd Method Of Packaging Semiconductor Device
EP3349247B1 (en) * 2017-01-13 2020-12-23 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Patterned cover layer on base structure defining cavity and alignment marker
CN111200899B (en) * 2018-11-20 2023-09-15 奥特斯科技(重庆)有限公司 Component carrier and method for producing the same
CN112087887B (en) * 2019-06-12 2023-06-09 奥特斯科技(重庆)有限公司 Alignment of component carrier structures by combining evaluation pad and hole type alignment marks

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