TWM628025U - 在溫度處理期間對部件承載件結構進行操縱以抑制部件承載件結構的變形 - Google Patents

在溫度處理期間對部件承載件結構進行操縱以抑制部件承載件結構的變形 Download PDF

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Publication number
TWM628025U
TWM628025U TW110213006U TW110213006U TWM628025U TW M628025 U TWM628025 U TW M628025U TW 110213006 U TW110213006 U TW 110213006U TW 110213006 U TW110213006 U TW 110213006U TW M628025 U TWM628025 U TW M628025U
Authority
TW
Taiwan
Prior art keywords
clamp
component carrier
carrier structure
handling device
magnet
Prior art date
Application number
TW110213006U
Other languages
English (en)
Chinese (zh)
Inventor
黎振川
Original Assignee
大陸商奧特斯科技（重慶）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商奧特斯科技（重慶）有限公司 filed Critical 大陸商奧特斯科技（重慶）有限公司
Publication of TWM628025U publication Critical patent/TWM628025U/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Pinball Game Machines (AREA)
TW110213006U 2020-11-06 2021-11-04 在溫度處理期間對部件承載件結構進行操縱以抑制部件承載件結構的變形 TWM628025U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011231684.8 2020-11-06
CN202011231684.8A CN114449756B (zh) 2020-11-06 2020-11-06 在温度处理期间对部件承载件结构进行操纵以抑制部件承载件结构的变形

Publications (1)

Publication Number Publication Date
TWM628025U true TWM628025U (zh) 2022-06-11

Family

ID=80111334

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110213006U TWM628025U (zh) 2020-11-06 2021-11-04 在溫度處理期間對部件承載件結構進行操縱以抑制部件承載件結構的變形

Country Status (4)

Country Link
JP (1) JP3235830U (ko)
KR (1) KR200497050Y1 (ko)
CN (1) CN114449756B (ko)
TW (1) TWM628025U (ko)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6175243B1 (en) * 1998-08-12 2001-01-16 Aql Manufacturing Services, Inc. Apparatus and method for assembling test fixtures
US6237832B1 (en) * 1999-10-18 2001-05-29 Henry Chung Wave soldering fixture
JP3514437B2 (ja) * 2000-02-22 2004-03-31 Ｔｄｋ株式会社 被加工物の加工装置および方法
US7517419B2 (en) * 2004-04-16 2009-04-14 Panasonic Corporation Substrate support jig, circuit board production apparatus, and method of producing circuit board
JP2006005106A (ja) * 2004-06-16 2006-01-05 Sumitomo Metal Micro Devices Inc 基板固定用治具及び基板固定方法
CN200944704Y (zh) * 2006-09-15 2007-09-05 深圳市宝安区西乡华兴新精密电子厂 一种柔性电路基板(fpc)装联用的夹具
KR100893124B1 (ko) * 2007-09-05 2009-04-14 백운재 인쇄회로기판 고정용 지그
JP5244701B2 (ja) * 2009-05-20 2013-07-24 株式会社 大昌電子 基板保持搬送用治具、基板押さえ部材、押さえ部材取り外し治具、メタルマスク版、プリント配線基板の搬送方法、電子部品付き配線基板の製造方法、基板搬送装置
KR101079277B1 (ko) * 2010-04-06 2011-11-04 (주)엠이씨 인쇄회로기판 고정용 지그
KR101306303B1 (ko) * 2011-12-08 2013-09-17 배상신 카메라 모듈 솔더링 장치
US20140055969A1 (en) * 2012-08-21 2014-02-27 Apple Inc. Board assemblies with minimized warpage and systems and methods for making the same
JP2014225593A (ja) * 2013-05-17 2014-12-04 パナソニック株式会社 電子部品実装装置および電子部品実装方法
JP6019406B2 (ja) * 2013-05-17 2016-11-02 パナソニックＩｐマネジメント株式会社 電子部品実装装置および電子部品実装方法
KR101422063B1 (ko) * 2014-01-08 2014-08-13 주식회사 에스제이솔루션 Ｐｃｂ 고정 지그 및 이를 이용한 pcb 제조 공정
JP6521678B2 (ja) * 2015-03-11 2019-05-29 Juki株式会社 基板支持装置、及び電子部品実装装置
KR101646546B1 (ko) * 2015-04-07 2016-08-08 주식회사 큐디씨솔루션 인쇄회로기판용 지그
JP6516889B2 (ja) * 2018-01-29 2019-05-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板スタックを取り扱うための、収容システム及び装置及び方法
EP3763175A1 (en) * 2018-03-07 2021-01-13 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Electronic device having an electronic component packaged in a compact component carrier with shielding cavities
KR101881897B1 (ko) * 2018-03-13 2018-07-25 주식회사 정일써키트 이어잭과 fpcb의 솔더링 지그장치 및 그를 이용한 솔더링 방법
CN209787552U (zh) * 2019-03-01 2019-12-13 奥特斯(中国)有限公司 部件承载件结构

Also Published As

Publication number Publication date
CN114449756B (zh) 2024-03-26
KR200497050Y1 (ko) 2023-07-10
CN114449756A (zh) 2022-05-06
JP3235830U (ja) 2022-01-13
KR20220001075U (ko) 2022-05-13

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