TWM603118U

TWM603118U - Fingerprint sensing module

Info

Publication number: TWM603118U
Application number: TW109207238U
Authority: TW
Inventors: 范成至; 周正三
Original assignee: 神盾股份有限公司
Priority date: 2020-01-16
Filing date: 2020-06-10
Publication date: 2020-10-21
Also published as: CN111488864A; TWI775094B; CN212229655U; WO2021143036A1; TW202129536A

Abstract

A fingerprint sensing module including an image sensor, a light shielding layer, and a collimator is provided. The image sensor includes a plurality of light sensing regions arranged in an array and a circuit region disposed around the light sensing regions. The light shielding layer is disposed on the circuit region and exposes the light sensing regions. The collimator is disposed on the image sensor and the shielding layer. The collimator guides light from an outside to the image sensor, wherein the light shielding layer blocks the light from being transmitted to the circuit region.

Description

指紋感測模組Fingerprint sensor module

本新型創作是有關於一種感測模組，且特別是有關於一種指紋感測模組。The present invention relates to a sensing module, and in particular to a fingerprint sensing module.

隨著可攜式電子裝置朝向大屏佔比發展，傳統配置於電子裝置的正面的電容式指紋感測器便不在適用，這是因為電容式指紋感測器會佔用電子裝置正面過多的面積，而導致屏佔比難以提升。在此趨勢之下，屏下式指紋感測模組便被發展出來。With the development of portable electronic devices towards a larger screen ratio, the traditional capacitive fingerprint sensor arranged on the front of the electronic device is no longer suitable. This is because the capacitive fingerprint sensor will occupy too much area on the front of the electronic device. It is difficult to increase the screen-to-body ratio. Under this trend, under-screen fingerprint sensing modules have been developed.

屏下式指紋感測模組主要可分為超音波式與光學式，其中又以光學式的成本較低，較適合量產。在習知的光學式指紋感測模組中，配置於顯示面板下方的準直器將按壓於顯示面板上的手指的反射光傳遞至配置於準直器下方的影像感測器，然而，卻同時將反射光傳遞至影像感測器上的光感測區與電路區，電路區被反射光照射到時會產生雜訊，進而降低了影像感測器的訊雜比，導致影像感測器所感測到的指紋影像的品質下降。The under-screen fingerprint sensor module can be divided into ultrasonic type and optical type. Among them, the optical type has lower cost and is more suitable for mass production. In the conventional optical fingerprint sensor module, the collimator arranged under the display panel transmits the reflected light of the finger pressed on the display panel to the image sensor arranged under the collimator. However, At the same time, the reflected light is transmitted to the light sensing area and the circuit area on the image sensor. When the circuit area is irradiated by the reflected light, noise will be generated, thereby reducing the signal-to-noise ratio of the image sensor, resulting in the image sensor The quality of the sensed fingerprint image is degraded.

本新型創作提供一種指紋感測模組，具有良好的訊雜比。This new creation provides a fingerprint sensing module with a good signal-to-noise ratio.

本新型創作的一實施例提出一種指紋感測模組，包括一影像感測器、一遮光層及一準直器。影像感測器包括多個排成陣列的光感測區及配置於這些光感測區周圍的電路區。遮光層配置於電路區上，且暴露出這些光感測區。準直器配置於影像感測器與遮光層上，其中準直器將來自外界的光導引至影像感測器，其中，遮光層阻擋光傳遞至電路區。An embodiment of the present invention proposes a fingerprint sensor module, which includes an image sensor, a light shielding layer and a collimator. The image sensor includes a plurality of light sensing areas arranged in an array and a circuit area arranged around the light sensing areas. The light-shielding layer is disposed on the circuit area and exposes these light sensing areas. The collimator is disposed on the image sensor and the light shielding layer, wherein the collimator guides light from the outside to the image sensor, and the light shielding layer blocks the light from being transmitted to the circuit area.

在本新型創作的實施例的指紋感測模組中，由於採用遮光層配置於電路區上，因此遮光層可以阻擋來自外界的光，以避免光傳遞至電路區而造成雜訊干擾。如此一來，本新型創作的實施例的指紋感測模組便可以具有較高的訊雜比與較佳的影像品質。In the fingerprint sensing module of the embodiment of the present invention, since the light-shielding layer is disposed on the circuit area, the light-shielding layer can block light from the outside to avoid light transmission to the circuit area and cause noise interference. In this way, the fingerprint sensing module of the embodiment of the invention can have a higher signal-to-noise ratio and better image quality.

圖1為本新型創作的一實施例的電子裝置的剖面示意圖。請參照圖1，本實施例的電子裝置40包括一顯示面板50及一指紋感測模組100。電子裝置40例如是智慧型手機、平板電腦、筆記型電腦、個人數位助理（personal digital assistant, PDA）或其他適當的電子裝置。顯示面板50例如為有機發光二極體顯示面板、液晶顯示面板或其他適當的顯示面板。FIG. 1 is a schematic cross-sectional view of an electronic device according to an embodiment of the new creation. Please refer to FIG. 1, the electronic device 40 of this embodiment includes a display panel 50 and a fingerprint sensing module 100. The electronic device 40 is, for example, a smart phone, a tablet computer, a notebook computer, a personal digital assistant (PDA) or other appropriate electronic devices. The display panel 50 is, for example, an organic light emitting diode display panel, a liquid crystal display panel or other suitable display panels.

指紋感測模組100包括一影像感測器200、一遮光層110及一準直器300。影像感測器200包括多個排成陣列（例如是二維陣列）的光感測區220及配置於這些光感測區220周圍的電路區230。至少部分的電路區230位於相鄰的光感測區220之間，也可以有另一部分的電路區230在這些光感測區220的整體的周圍。在本實施例中，影像感測器200例如為薄膜電晶體影像感測器（thin film transistor image sensor, TFT sensor），而影像感測器200包括一基板210，例如為玻璃基板，而光感測區220的像素電極222與電路區230的電路232皆配置於基板210上。在本實施例中，影像感測器200上配置於顯示面板50的部分區域下方。然而，當影像感測器200為薄膜電晶體影像感測器時，其也可以是布滿整個顯示面板50的下方，或只在顯示面板50的局部區域下方。The fingerprint sensor module 100 includes an image sensor 200, a light shielding layer 110 and a collimator 300. The image sensor 200 includes a plurality of light sensing regions 220 arranged in an array (for example, a two-dimensional array) and a circuit region 230 disposed around the light sensing regions 220. At least part of the circuit area 230 is located between the adjacent light sensing areas 220, and there may also be another part of the circuit area 230 around the whole of these light sensing areas 220. In this embodiment, the image sensor 200 is, for example, a thin film transistor image sensor (TFT sensor), and the image sensor 200 includes a substrate 210, such as a glass substrate, and the light sensor The pixel electrode 222 of the measurement area 220 and the circuit 232 of the circuit area 230 are both disposed on the substrate 210. In this embodiment, the image sensor 200 is disposed under a partial area of the display panel 50. However, when the image sensor 200 is a thin film transistor image sensor, it can also cover the entire bottom of the display panel 50 or only below a partial area of the display panel 50.

遮光層110配置於電路區230上，且暴露出這些光感測區220。準直器300配置於影像感測器200與遮光層110上，其中準直器300將來自外界的光51導引至影像感測器200，遮光層110阻擋光51，避免光51傳遞至電路區230，而未被阻擋之光51則進入光感測區220。具體而言，顯示面板50發出光53，而光53往上傳遞至按壓於顯示面板50的上表面52的手指60後，被手指60反射成光51。而被手指60反射的光51攜帶手指60的指紋資訊而往下穿透顯示面板50，準直器300將光51準直地傳遞至光感測區220，進而形成指紋的影像。在本實施例中，是以顯示面板50發出光53來照明手指60，然而，在其他實施例中，也可以是透過其他不同於顯示面板50的光源發出光53來照明手指60。The light shielding layer 110 is disposed on the circuit area 230 and exposes the light sensing areas 220. The collimator 300 is disposed on the image sensor 200 and the light shielding layer 110, wherein the collimator 300 guides light 51 from the outside to the image sensor 200, and the light shielding layer 110 blocks the light 51 to prevent the light 51 from being transmitted to the circuit Area 230, and unblocked light 51 enters the light sensing area 220. Specifically, the display panel 50 emits light 53, and the light 53 is transmitted upward to the finger 60 pressing on the upper surface 52 of the display panel 50, and then is reflected by the finger 60 as light 51. The light 51 reflected by the finger 60 carries the fingerprint information of the finger 60 and penetrates the display panel 50 downward. The collimator 300 transmits the light 51 to the light sensing area 220 in a collimated manner to form an image of the fingerprint. In this embodiment, the display panel 50 emits light 53 to illuminate the finger 60. However, in other embodiments, the finger 60 may be illuminated by emitting light 53 through another light source different from the display panel 50.

在本實施例的指紋感測模組100中，由於遮光層110係配置於電路區230上，可避免光51傳遞至電路區230而造成雜訊干擾。如此一來，本實施例的指紋感測模組100便可以具有較高的訊雜比與較佳的影像品質。In the fingerprint sensing module 100 of this embodiment, since the light shielding layer 110 is disposed on the circuit area 230, it can prevent the light 51 from being transmitted to the circuit area 230 and causing noise interference. In this way, the fingerprint sensor module 100 of this embodiment can have a higher signal-to-noise ratio and better image quality.

在本實施例中，遮光層110為吸光層或光反射層，例如為黑色光阻層、金屬層或其他可遮擋光51的物質所形成的膜層。此外，指紋感測模組100更包括一透光保護層120，覆蓋遮光層110與這些光感測區220。透光保護層120例如是光學透明膠層。In this embodiment, the light-shielding layer 110 is a light-absorbing layer or a light-reflecting layer, such as a black photoresist layer, a metal layer, or a film layer formed by other materials that can shield the light 51. In addition, the fingerprint sensing module 100 further includes a light-transmitting protective layer 120 covering the light-shielding layer 110 and the light sensing regions 220. The light-transmitting protective layer 120 is, for example, an optically transparent adhesive layer.

在本實施例中，準直器300具有多個彼此分離的光通道310，每一光通道310被一遮光體320所圍繞，且從準直器300的遠離影像感測器200的一側往靠近影像感測器200的一側延伸。在本實施例中，光通道310例如是由透明柱狀固體形成，其例如為光纖，而準直器300例如為光纖光學板（fiber optical plate, FOP）。然而，在其他實施例中，每一光通道310也可以是一空間，其中可以填充有空氣、氣體或液體，也可以是真空。部分的光51經由部分的光通道310傳遞至這些光感測區220而形成指紋影像，而另一部分的光51經由另一部分的光通道310傳遞至遮光層110，並受到遮光層110的阻擋而不會傳遞至電路區230。In this embodiment, the collimator 300 has a plurality of light channels 310 separated from each other. Each light channel 310 is surrounded by a light shielding body 320 and extends from the side of the collimator 300 away from the image sensor 200. The side close to the image sensor 200 extends. In this embodiment, the optical channel 310 is, for example, formed of a transparent cylindrical solid, which is, for example, an optical fiber, and the collimator 300 is, for example, a fiber optical plate (FOP). However, in other embodiments, each optical channel 310 may also be a space, which may be filled with air, gas or liquid, or a vacuum. Part of the light 51 is transmitted to the light sensing regions 220 through a part of the light channel 310 to form a fingerprint image, and another part of the light 51 is transmitted to the light shielding layer 110 through another part of the light channel 310, and is blocked by the light shielding layer 110. Will not be passed to the circuit area 230.

圖2為本新型創作的另一實施例的指紋感測模組的剖面示意圖。本實施例的指紋感測模組100a類似於圖1的指紋感測模組100，而兩者的差異如下所述。在本實施例的指紋感測模組100a中，影像感測器200a例如是以矽基板製成的互補式金屬氧化物半導體影像感測器（complementary metal oxide semiconductor image sensor, CMOS image sensor），而其基板210a為矽基板。2 is a schematic cross-sectional view of a fingerprint sensing module according to another embodiment of the new creation. The fingerprint sensing module 100a of this embodiment is similar to the fingerprint sensing module 100 of FIG. 1, and the difference between the two is as follows. In the fingerprint sensor module 100a of this embodiment, the image sensor 200a is, for example, a complementary metal oxide semiconductor image sensor (CMOS image sensor) made of a silicon substrate, and The substrate 210a is a silicon substrate.

圖3為本新型創作的又一實施例的指紋感測模組的剖面示意圖。本實施例的指紋感測模組100b類似於圖1的指紋感測模組100，而兩者的差異如下所述。在本實施例的指紋感測模組100b中，準直器300b為透鏡陣列，其具有多個排成陣列（例如二維陣列）的微透鏡330，這些微透鏡330能使攜帶指紋資訊的光51傳遞至這些光感測區220以形成指紋影像。3 is a schematic cross-sectional view of a fingerprint sensing module according to another embodiment of the new creation. The fingerprint sensing module 100b of this embodiment is similar to the fingerprint sensing module 100 of FIG. 1, and the difference between the two is as follows. In the fingerprint sensor module 100b of this embodiment, the collimator 300b is a lens array, which has a plurality of microlenses 330 arranged in an array (for example, a two-dimensional array). These microlenses 330 can make the light carrying fingerprint information 51 is transferred to these light sensing areas 220 to form fingerprint images.

綜上所述，在本新型創作的實施例的指紋感測模組中，由於採用遮光層配置於電路區上，因此遮光層可以阻擋來自外界的光，以避免光傳遞至電路區而造成雜訊干擾。如此一來，本新型創作的實施例的指紋感測模組便可以具有較高的訊雜比與較佳的影像品質。In summary, in the fingerprint sensing module of the inventive embodiment of the present invention, since the light shielding layer is configured on the circuit area, the light shielding layer can block light from the outside to prevent light from being transmitted to the circuit area and causing impurities. News interference. In this way, the fingerprint sensing module of the embodiment of the invention can have a higher signal-to-noise ratio and better image quality.

40:電子裝置 50:顯示面板 51、53:光 52:上表面 60:手指 100、100a、100b:指紋感測模組 110:遮光層 120:透光保護層 200、200a:影像感測器 210、210a:基板 220:光感測區 222:像素電極 230:電路區 232:電路 300、300b:準直器 310:光通道 320:遮光體 330:微透鏡 40: electronic device 50: display panel 51, 53: light 52: upper surface 60: finger 100, 100a, 100b: fingerprint sensor module 110: shading layer 120: Translucent protective layer 200, 200a: image sensor 210, 210a: substrate 220: light sensing area 222: pixel electrode 230: circuit area 232: Circuit 300, 300b: collimator 310: optical channel 320: Shading body 330: Micro lens

圖1為本新型創作的一實施例的電子裝置的剖面示意圖。圖2為本新型創作的另一實施例的指紋感測模組的剖面示意圖。圖3為本新型創作的又一實施例的指紋感測模組的剖面示意圖。 FIG. 1 is a schematic cross-sectional view of an electronic device according to an embodiment of the new creation. 2 is a schematic cross-sectional view of a fingerprint sensing module according to another embodiment of the new creation. 3 is a schematic cross-sectional view of a fingerprint sensing module according to another embodiment of the new creation.

40:電子裝置 40: electronic device

50:顯示面板 50: display panel

51、53:光 51, 53: light

52:上表面 52: upper surface

60:手指 60: finger

100:指紋感測模組 100: Fingerprint sensor module

110:遮光層 110: shading layer

120:透光保護層 120: Translucent protective layer

200:影像感測器 200: image sensor

210:基板 210: substrate

220:光感測區 220: light sensing area

222:像素電極 222: pixel electrode

230:電路區 230: circuit area

232:電路 232: Circuit

300:準直器 300: collimator

310:光通道 310: optical channel

320:遮光體 320: Shading body

Claims

一種指紋感測模組，包括：一影像感測器，包括多個排成陣列的光感測區及配置於該些光感測區周圍的電路區；一遮光層，配置於該電路區上，且暴露出該些光感測區；以及一準直器，配置於該影像感測器與該遮光層上，其中該準直器將來自外界的光導引至該影像感測器，其中，該遮光層阻擋該光傳遞至該電路區。 A fingerprint sensing module includes: An image sensor including a plurality of light sensing areas arranged in an array and a circuit area arranged around the light sensing areas; A light-shielding layer disposed on the circuit area and exposing the light sensing areas; and A collimator is disposed on the image sensor and the light shielding layer, wherein the collimator guides light from the outside to the image sensor, and the light shielding layer blocks the light from being transmitted to the circuit area .

如請求項1所述的指紋感測模組，其中該準直器具有多個彼此分離的光通道，每一光通道被一遮光體所圍繞，且從該準直器的遠離該影像感測器的一側往靠近該影像感測器的一側延伸。The fingerprint sensor module according to claim 1, wherein the collimator has a plurality of light channels separated from each other, and each light channel is surrounded by a light-shielding body, and the image sensor is remote from the collimator The side of the sensor extends toward the side close to the image sensor.

如請求項1所述的指紋感測模組，其中該準直器為透鏡陣列。The fingerprint sensing module according to claim 1, wherein the collimator is a lens array.

如請求項1所述的指紋感測模組，更包括一透光保護層，覆蓋該遮光層與該些光感測區。The fingerprint sensing module according to claim 1, further comprising a light-transmitting protective layer covering the light-shielding layer and the light sensing areas.

如請求項1所述的指紋感測模組，其中該遮光層為吸光層或光反射層。The fingerprint sensing module according to claim 1, wherein the light shielding layer is a light absorption layer or a light reflection layer.

如請求項1所述的指紋感測模組，其中該遮光層為黑色光阻層或金屬層。The fingerprint sensing module according to claim 1, wherein the light shielding layer is a black photoresist layer or a metal layer.

如請求項1所述的指紋感測模組，其中該影像感測器為薄膜電晶體影像感測器。The fingerprint sensor module according to claim 1, wherein the image sensor is a thin film transistor image sensor.

如請求項1所述的指紋感測模組，其中該影像感測器為互補式金屬氧化物半導體影像感測器。The fingerprint sensor module according to claim 1, wherein the image sensor is a complementary metal oxide semiconductor image sensor.

如請求項1所述的指紋感測模組，其中該影像感測器更包括一基板，且該些光感測區中的像素電極與該電路區中的電路皆配置於該基板上。The fingerprint sensing module according to claim 1, wherein the image sensor further includes a substrate, and the pixel electrodes in the light sensing regions and the circuits in the circuit region are all disposed on the substrate.

如請求項9所述的指紋感測模組，其中該基板為玻璃基板或矽基板。The fingerprint sensing module according to claim 9, wherein the substrate is a glass substrate or a silicon substrate.