CN212229655U - Fingerprint sensing module - Google Patents
Fingerprint sensing module Download PDFInfo
- Publication number
- CN212229655U CN212229655U CN202021052709.3U CN202021052709U CN212229655U CN 212229655 U CN212229655 U CN 212229655U CN 202021052709 U CN202021052709 U CN 202021052709U CN 212229655 U CN212229655 U CN 212229655U
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- CN
- China
- Prior art keywords
- light
- image sensor
- sensing module
- fingerprint sensing
- collimator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000010410 layer Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 230000000295 complement effect Effects 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The utility model provides a fingerprint sensing module, including an image sensor, a light shield layer and a collimator. The image sensor comprises a plurality of light sensing areas arranged in an array and a circuit area arranged around the light sensing areas. The light shielding layer is arranged on the circuit region and exposes the light sensing regions. The collimator is disposed on the image sensor and the shading layer, wherein the collimator guides light from the outside to the image sensor, and the shading layer blocks the light from being transmitted to the circuit region. The utility model provides a fingerprint sensing module has good SNR.
Description
Technical Field
The utility model relates to a sensing module especially relates to a fingerprint sensing module.
Background
With the development of portable electronic devices toward large screen occupation ratio, the conventional capacitive fingerprint sensor disposed on the front surface of the electronic device is not suitable for use, because the capacitive fingerprint sensor occupies too much area on the front surface of the electronic device, which makes the screen occupation ratio difficult to increase. Under the trend, an on-screen fingerprint sensing module is developed.
The on-screen fingerprint sensing module can be mainly divided into an ultrasonic type and an optical type, wherein the optical type has lower cost and is suitable for mass production. In the conventional optical fingerprint sensing module, a collimator disposed below a display panel transmits a reflected light of a finger pressing the display panel to an image sensor disposed below the collimator, but the reflected light is transmitted to a photo sensing area and a circuit area on the image sensor at the same time, and when the circuit area is irradiated by the reflected light, noise (noise) is generated, so that a signal-to-noise ratio (signal-to-noise ratio) of the image sensor is reduced, resulting in a degradation of a quality of a fingerprint image sensed by the image sensor.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a to a fingerprint sensing module, have good SNR.
An embodiment of the utility model provides a fingerprint sensing module, including an image sensor, a light shield layer and a collimator. The image sensor comprises a plurality of light sensing areas arranged in an array and a circuit area arranged around the light sensing areas. The light shielding layer is arranged on the circuit region and exposes the light sensing regions. The collimator is disposed on the image sensor and the shading layer, wherein the collimator guides light from the outside to the image sensor, and the shading layer blocks the light from being transmitted to the circuit region.
In an embodiment of the present invention, the collimator has a plurality of light channels separated from each other, each of the light channels is surrounded by the light shielding body, and extends from a side of the collimator away from the image sensor to a side close to the image sensor.
In an embodiment of the present invention, the collimator is a lens array.
In an embodiment of the present invention, the fingerprint sensing module further includes a light-transmitting protective layer covering the light-shielding layer and the light sensing regions.
In an embodiment of the present invention, the light shielding layer is a light absorbing layer or a light reflecting layer.
In an embodiment of the present invention, the light shielding layer is a black photoresist layer or a metal layer.
In an embodiment of the present invention, the image sensor is a thin film transistor image sensor.
In an embodiment of the present invention, the image sensor is a cmos image sensor.
In an embodiment of the present invention, the image sensor further includes a substrate, and the pixel electrodes in the light sensing regions and the circuits in the circuit regions are disposed on the substrate.
In an embodiment of the present invention, the substrate is a glass substrate or a silicon substrate.
The utility model discloses an among the fingerprint sensing module of embodiment, owing to adopt the light shield layer to dispose on circuit region, consequently the light shield layer can block the light that comes from the external world to avoid light transmission to circuit region and cause noise interference. Therefore, the fingerprint sensing module of the embodiment of the present invention can have a higher signal-to-noise ratio and better image quality.
Drawings
Fig. 1 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a fingerprint sensing module according to another embodiment of the present invention;
fig. 3 is a schematic cross-sectional view of a fingerprint sensing module according to another embodiment of the present invention.
Description of the reference numerals
40 electronic device
50 display panel
51. 53 light
52 upper surface
60 finger diameter
100. 100a, 100b fingerprint sensing module
110 light-shielding layer
120 transparent protective layer
200. 200a image sensor
210. 210a substrate
220 light sensing area
222 pixel electrode
230 circuit area
232: circuit
300. 300b collimator
310 optical channel
320 light shading body
330 micro lens
Detailed Description
Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
Fig. 1 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention. Referring to fig. 1, the electronic device 40 of the present embodiment includes a display panel 50 and a fingerprint sensing module 100. The electronic device 40 is, for example, a smart phone, a tablet computer, a notebook computer, a Personal Digital Assistant (PDA), or other suitable electronic device. The display panel 50 is, for example, an organic light emitting diode display panel, a liquid crystal display panel, or other suitable display panel.
The fingerprint sensing module 100 includes an image sensor 200, a light shielding layer 110 and a collimator 300. The image sensor 200 includes a plurality of light sensing regions 220 arranged in an array (e.g., a two-dimensional array) and a circuit region 230 disposed around the light sensing regions 220. At least a portion of the circuit regions 230 are located between adjacent light sensing regions 220, and another portion of the circuit regions 230 may be located around the entirety of the light sensing regions 220. In the present embodiment, the image sensor 200 is, for example, a Thin Film Transistor (TFT) image sensor, the image sensor 200 includes a substrate 210, for example, a glass substrate, and the pixel electrode 222 of the light sensing region 220 and the circuit 232 of the circuit region 230 are both disposed on the substrate 210. In the present embodiment, the image sensor 200 is disposed below a partial region of the display panel 50. However, when the image sensor 200 is a thin film transistor image sensor, it may be disposed under the entire display panel 50 or under only a partial region of the display panel 50.
The light-shielding layer 110 is disposed on the circuit region 230 and exposes the photo-sensing regions 220. The collimator 300 is disposed on the image sensor 200 and the light shielding layer 110, wherein the collimator 300 guides the light 51 from the outside to the image sensor 200, the light shielding layer 110 blocks the light 51 to prevent the light 51 from being transmitted to the circuit region 230, and the light 51 that is not blocked enters the light sensing region 220. Specifically, the display panel 50 emits light 53, and the light 53 is transmitted upward to a finger 60 pressed against the upper surface 52 of the display panel 50 and then reflected by the finger 60 into light 51. The light 51 reflected by the finger 60 carries the fingerprint information of the finger 60 and downwardly penetrates the display panel 50, and the collimator 300 collimates and transmits the light 51 to the light sensing area 220, thereby forming an image of the fingerprint. In the present embodiment, the light 53 is emitted from the display panel 50 to illuminate the finger 60, however, in other embodiments, the light 53 may be emitted from a light source different from the display panel 50 to illuminate the finger 60.
In the fingerprint sensing module 100 of the present embodiment, the light shielding layer 110 is disposed on the circuit region 230, so that noise interference caused by the light 51 transmitted to the circuit region 230 can be avoided. As a result, the fingerprint sensing module 100 of the present embodiment has a higher signal-to-noise ratio and a better image quality.
In the present embodiment, the light-shielding layer 110 is a light-absorbing layer or a light-reflecting layer, such as a black photoresist layer, a metal layer, or a film layer formed by other substances capable of shielding the light 51. In addition, the fingerprint sensing module 100 further includes a transparent protection layer 120 covering the light shielding layer 110 and the light sensing regions 220. The light-transmitting protective layer 120 is, for example, an optically transparent adhesive layer.
In the present embodiment, the collimator 300 has a plurality of light channels 310 separated from each other, and each light channel 310 is surrounded by a light shielding body 320 and extends from a side of the collimator 300 away from the image sensor 200 to a side close to the image sensor 200. In the present embodiment, the light channel 310 is formed by, for example, a transparent cylindrical solid, which is, for example, an optical fiber, and the collimator 300 is, for example, a Fiber Optic Plate (FOP). However, in other embodiments, each light channel 310 may be a space filled with air, gas, or liquid, or may be a vacuum. Part of the light 51 is transmitted to the light sensing regions 220 through part of the light channels 310 to form a fingerprint image, and the other part of the light 51 is transmitted to the light-shielding layer 110 through the other part of the light channels 310 and is blocked by the light-shielding layer 110 and is not transmitted to the circuit region 230.
Fig. 2 is a schematic cross-sectional view of a fingerprint sensing module according to another embodiment of the present invention. The fingerprint sensing module 100a of the present embodiment is similar to the fingerprint sensing module 100 of fig. 1, and the difference therebetween is as follows. In the fingerprint sensing module 100a of the present embodiment, the image sensor 200a is, for example, a Complementary Metal Oxide Semiconductor (CMOS) image sensor made of a silicon substrate, and the substrate 210a is a silicon substrate.
Fig. 3 is a schematic cross-sectional view of a fingerprint sensing module according to another embodiment of the present invention. The fingerprint sensing module 100b of the present embodiment is similar to the fingerprint sensing module 100 of fig. 1, and the difference therebetween is as follows. In the fingerprint sensing module 100b of the present embodiment, the collimator 300b is a lens array having a plurality of microlenses 330 arranged in an array (e.g., a two-dimensional array), and the microlenses 330 enable the light 51 carrying fingerprint information to be transmitted to the light sensing areas 220 to form a fingerprint image.
In summary, in the fingerprint sensing module according to the embodiment of the present invention, since the light shielding layer is disposed on the circuit region, the light shielding layer can block the light from the outside so as to avoid the noise interference caused by the light transmitted to the circuit region. Therefore, the fingerprint sensing module of the embodiment of the present invention can have a higher signal-to-noise ratio and better image quality.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. A fingerprint sensing module, comprising:
the image sensor comprises a plurality of light sensing areas arranged in an array and a circuit area configured around the plurality of light sensing areas;
a light shielding layer configured on the circuit region and exposing the plurality of light sensing regions; and
and a collimator disposed on the image sensor and the light shielding layer, wherein the collimator guides light from the outside to the image sensor, and the light shielding layer blocks the light from being transmitted to the circuit region.
2. The fingerprint sensing module of claim 1, wherein the collimator has a plurality of light channels separated from each other, each light channel surrounded by a light shield and extending from a side of the collimator distal from the image sensor to a side proximal to the image sensor.
3. The fingerprint sensing module of claim 1, wherein the collimator is a lens array.
4. The fingerprint sensing module of claim 1, further comprising a light-transmissive protective layer covering the light-shielding layer and the plurality of light sensing regions.
5. The fingerprint sensing module of claim 1, wherein the light shielding layer is a light absorbing layer or a light reflecting layer.
6. The fingerprint sensing module of claim 1, wherein the light shielding layer is a black photoresist layer or a metal layer.
7. The fingerprint sensing module of claim 1, wherein the image sensor is a thin film transistor image sensor.
8. The fingerprint sensing module of claim 1, wherein the image sensor is a complementary metal oxide semiconductor image sensor.
9. The fingerprint sensing module of claim 1, wherein the image sensor further comprises a substrate, and the pixel electrodes in the plurality of light sensing regions and the circuits in the circuit region are disposed on the substrate.
10. The fingerprint sensing module of claim 9, wherein the substrate is a glass substrate or a silicon substrate.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202062961728P | 2020-01-16 | 2020-01-16 | |
US62/961,728 | 2020-01-16 | ||
US202062980438P | 2020-02-24 | 2020-02-24 | |
US62/980,438 | 2020-02-24 |
Publications (1)
Publication Number | Publication Date |
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CN212229655U true CN212229655U (en) | 2020-12-25 |
Family
ID=71810582
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010521785.2A Pending CN111488864A (en) | 2020-01-16 | 2020-06-10 | Fingerprint sensing module |
CN202021052709.3U Expired - Fee Related CN212229655U (en) | 2020-01-16 | 2020-06-10 | Fingerprint sensing module |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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CN202010521785.2A Pending CN111488864A (en) | 2020-01-16 | 2020-06-10 | Fingerprint sensing module |
Country Status (3)
Country | Link |
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CN (2) | CN111488864A (en) |
TW (2) | TWI775094B (en) |
WO (1) | WO2021143036A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111488864A (en) * | 2020-01-16 | 2020-08-04 | 神盾股份有限公司 | Fingerprint sensing module |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220050985A1 (en) * | 2020-08-17 | 2022-02-17 | Au Optronics Corporation | Biometric sensing apparatus |
CN216054731U (en) * | 2021-03-18 | 2022-03-15 | 神盾股份有限公司 | Light sensing module |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109271831B (en) * | 2017-07-17 | 2020-12-18 | 金佶科技股份有限公司 | Image capturing device |
TWI633493B (en) * | 2017-08-08 | 2018-08-21 | Gingy Technology Inc. | Image capture apparatus |
TWI667802B (en) * | 2018-02-05 | 2019-08-01 | 世界先進積體電路股份有限公司 | Optical sensor and the manufacturing method thereof |
US10699092B2 (en) * | 2018-05-08 | 2020-06-30 | Vanguard International Semiconductor Corporation | Optical sensor and manufacturing method thereof |
TWI775094B (en) * | 2020-01-16 | 2022-08-21 | 神盾股份有限公司 | Fingerprint sensing module |
-
2020
- 2020-06-10 TW TW109119464A patent/TWI775094B/en not_active IP Right Cessation
- 2020-06-10 TW TW109207238U patent/TWM603118U/en unknown
- 2020-06-10 CN CN202010521785.2A patent/CN111488864A/en active Pending
- 2020-06-10 WO PCT/CN2020/095297 patent/WO2021143036A1/en active Application Filing
- 2020-06-10 CN CN202021052709.3U patent/CN212229655U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111488864A (en) * | 2020-01-16 | 2020-08-04 | 神盾股份有限公司 | Fingerprint sensing module |
Also Published As
Publication number | Publication date |
---|---|
TW202129536A (en) | 2021-08-01 |
WO2021143036A1 (en) | 2021-07-22 |
TWI775094B (en) | 2022-08-21 |
TWM603118U (en) | 2020-10-21 |
CN111488864A (en) | 2020-08-04 |
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GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201225 |