TWM559977U - 發光二極體燈具 - Google Patents
發光二極體燈具 Download PDFInfo
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- TWM559977U TWM559977U TW106215561U TW106215561U TWM559977U TW M559977 U TWM559977 U TW M559977U TW 106215561 U TW106215561 U TW 106215561U TW 106215561 U TW106215561 U TW 106215561U TW M559977 U TWM559977 U TW M559977U
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S10/00—Lighting devices or systems producing a varying lighting effect
- F21S10/002—Lighting devices or systems producing a varying lighting effect using liquids, e.g. water
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
本創作係關於一種發光二極體(LED)燈具,該發光二極體燈具包括一發光二極體裝置及一燈頭,該發光二極體裝置包含複數發光二極體晶粒、複數導電基板、一封裝層、一保護套,該複數個導電基板呈間隔設置,各發光二極體晶粒係由兩兩相鄰的導電基板共同承載並形成電性連接;該封裝層係包覆該複數個發光二極體晶粒以及覆蓋在各導電基板的部分區域上,該保護套係包覆該複數個發光二極體晶粒以及該複數個導電基板,形成一可彎曲之發光二極體裝置;由於該些發光二極體晶粒貼近該保護套,使該些發光二極體晶粒所產生的熱能可快速散發至空氣中,提高散熱性;以及利用各發光二極體晶粒的排列方式,讓該發光二極體裝置能達到光連續及光均勻的效果。
Description
本創作係有關一種照明燈具,尤指一種發光二極體燈具。
請參見圖16,為現有的發光二極體燈泡80,該發光二極體燈泡80包含一發光二極體燈條81、一燈座82、一燈頭85及一燈罩86,該發光二極體燈條81架設在該燈座82上,並透過複數個固定件83將該發光二極體燈條81固定在該燈座82上;該燈座82安裝在該燈頭85上;該燈罩86與該燈座82相連接,使該發光二極體燈條81及該燈座82包覆在該燈罩86之內。
一般而言,該燈罩86係由玻璃製造,在遭受碰撞或壓力下容易產生裂痕甚至破裂;再者,該發光二極體燈條81放置的位置與該燈罩86之間有一段距離,使得該發光二極體燈條81自體產生的熱能容易集中在該燈罩86中,不易散熱。
請參見圖17,為現有的發光二極體燈條90,其包含一基板91、複數個發光二極體晶粒92及複數個電阻93,該些電阻93為限流電阻,用以減少流過該些發光二極體晶粒92之電流,避免該些發光二極體晶粒92因為負載電流過大而造成溫度過高,甚至燒毀,該些發光二極體晶粒92及該些電阻93皆安裝在該基板91之一面且彼此交錯放置,其中該些發光二極體晶粒92及該些電阻93電性連接。
由於該些發光二極體晶粒92之發光型態屬於點光源,且該些電阻93安插在該些發光二極體晶粒92之間,讓各發光二極體晶粒92彼此的間距太長,以至於在發光時,兩相鄰發光二極體晶粒92所發出來之光照範圍相鄰但不相交,使得該燈條90所呈現出來為連續之點光源,造成光照不連續的問題。
有鑑於上述現有發光二極體燈泡存在散熱性不佳且光照不連續等問題,本創作的主要目的係提出一種發光二極體燈具,利用保護套作為燈罩,使燈條自體產生的熱量能有效散發,提高散熱性,以及加裝封裝層與該些發光二極體晶粒的排列方式等特徵,不但容易散熱,達到節省能源,同時可達到光連續及光均勻的效果。
為達成前述目的,本創作發光二極體燈具包含有:一發光二極體裝置,包括:複數個發光二極體晶粒;複數個導電基板,各複數導電基板為一金屬薄片,該複數個導電基板呈間隔設置,各發光二極體晶粒由兩相鄰的導電基板共同承載並且形成電性連接,其中各發光二極體晶粒的長度為W1,兩相鄰發光二極體晶粒的間距為W2,且W2<2W1;一上封裝層,係呈透光且包覆該複數個發光二極體晶粒且同時覆蓋在各導電基板之上表面,該封裝層與該複數個發光二極體晶粒及該複數個導電基板係形成一燈條;一保護套,其為一絕緣可透光且呈彎曲形狀之管體,該保護套係包覆該燈條;一固定塊,具有至少一穿孔,係供該燈條的至少一端穿設,用以固定該發光二極體裝置;一電路板,係電性連接該燈條之至少一端,用以控制該燈條;一燈頭,其內部供設置該固定塊及電路板。
一種發光二極體燈具,包含:一發光二極體裝置,包括:
複數個發光二極體晶粒;複數個導電基板,其包含複數個正極導電基板極一負極導電基板,該些正極導電基板呈間隔設置,各發光二極體晶粒由兩相鄰的正極導電基板以及該負極導電基板共同承載並且形成電性連接,其中各發光二極體晶粒的長度為W1,兩相鄰發光二極體晶粒的間距為W2,且W2<2W1;該負極導電基板設置於該些正極導電基板之一邊;一上封裝層,係呈透光且包覆該複數個發光二極體晶粒且同時覆蓋在各導電基板之部分上表面及部分下表面,使各正極導電基板之至少一側邊及該負極導電基板之至少一側邊延伸至該封裝層之外,該封裝層與該複數個發光二極體晶粒及該複數個導電基板係形成一燈條;一保護套,為一透明可透光且具可撓性之管體,該保護套係包覆該燈條;一固定塊,具有一開孔,供該發光二極體裝置之一端穿射,用以固定該發光二極體裝置;一電路板,係電性連接該燈條之一端,用以控制該燈條;一燈頭,其內部供設置該固定塊及電路板設置。
由於各發光二極體晶粒屬於點狀發光,將各發光二極體晶粒的間距控制在小於各發光二極體的長度的兩倍之內,可在發光時讓該燈條呈現連續發光,且該複數個發光二極體晶粒與該複數個導電基板串聯連接之燈條具撓曲性,大幅增加該發光二極體裝置之彎曲程度,可在製作過程中形成多種不同的燈條造型,提供多樣化的選擇;此外,透過該上封裝層的橢圓形狀,能使光線由該上封裝層內向外平均散出,達到光均勻的效果;此外,由於該保護套緊
包覆著該燈條,讓該燈條與該保護套之間的距離極為接近,使該燈條自體產生的熱量能快速散發至空氣中而不易累積於該保護套中,進而提高散熱效果。
10‧‧‧發光二極體裝置
11‧‧‧發光二極體晶粒
111‧‧‧上出光面
12‧‧‧導電基板
121‧‧‧第一導電部
122‧‧‧第二導電部
125‧‧‧第一導電部
126‧‧‧第二導電部
13‧‧‧封裝層
131‧‧‧上封裝層
132‧‧‧下封裝層
14‧‧‧燈條
15‧‧‧下透光板
151‧‧‧下出光面
16‧‧‧保護套
20‧‧‧固定塊
22‧‧‧穿孔
24‧‧‧凸緣
30‧‧‧電路板
311a、311b‧‧‧電極連接點
33a、33b‧‧‧電極連接端
50‧‧‧燈頭
51‧‧‧第一電性連接部
53‧‧‧第二電性連接部
55‧‧‧階梯部
80‧‧‧發光二極體燈泡
81‧‧‧發光二極體燈條
82‧‧‧燈座
83‧‧‧固定件
85‧‧‧燈頭
86‧‧‧燈罩
90‧‧‧發光二極體燈條
91‧‧‧基板
92‧‧‧發光二極體晶粒
93‧‧‧電阻
W1‧‧‧長度
W2‧‧‧間距
L1‧‧‧第一長度
L2‧‧‧第二長度
D1‧‧‧寬度
D3‧‧‧內直徑
C1‧‧‧中心軸
圖1:本創作發光二極體燈具之分解示意圖。
圖2:本創作之燈條示意圖。
圖3:本創作之燈條側視圖。
圖4:本創作之燈條立體示意圖。
圖5A:本創作之燈條剖面圖。
圖5B:本創作之發光二極體裝置剖面圖。
圖6:本創作之示意圖。
圖7:本創作另一實施例發光二極體燈具之分解示意圖。
圖8:本創作另一實施例發光二極體燈具示意圖。
圖9:本創作應用圖7、圖8的另一實施例燈條示意圖。
圖10:本創作另一實施例發光二極體燈具之分解示意圖。
圖11:本創作另一實施例發光二極體燈具示意圖。
圖12~圖15:本創作發光二極體燈具之不同造型示意圖。
圖16:為現有發光二極體燈具之示意圖。
圖17:為現有發光二極體燈條之示意圖。
請參見圖6,為本創作發光二極體燈具,為實現本創作,請進一步參考圖1,本創作包含一發光二極體裝置10、一固定塊20、一電路板30以及一燈頭50。
請進一步參考圖2及圖3,該發光二極體裝置10包含一燈條14,該燈條14具有複數個發光二極體晶粒11(Light Emitting Diode Chip,LED)、複數
個導電基板12及一封裝層13,本實施例中,該封裝層13包含一上封裝層131,該複數個發光二極體晶粒11可為上下雙面發光二極體,其具有至少一上出光面111,該發光二極體晶粒11可透過該上出光面111將產生的光線向外投射,其中該上出光面111位於各發光二極體晶粒11之頂部。各導電基板12為一金屬導電薄片,各導電基板12呈間距依序排列,各發光二極體晶粒11搭載在兩相鄰的導電基板12之間且電性連接該兩相鄰的導電基板12,以形成一燈條14。具體而言,為一導電基板12、一發光二極體晶粒11、一導電基板12、一發光二極體晶粒11…交替排列的方式串聯連接;本實施例中,該燈條14具有可撓性。在本實施例中,該燈條14之一端的導電基板12延伸形成一第一導電部121,該燈條14另一端的導電基板12延伸形成一第二導電部122,該第一導電部121與該第二導電部122互為電極相異之兩端。
請參見圖4,在本實施例中,該複數個發光二極體晶粒11分別具有一長度W1,兩兩發光二極體晶粒11之間有一間距W2,其中該間距W2小於該長度W1的兩倍。如此可兼具充分增加該複數個發光二極體晶粒11的數量,以及達到連續出光的成效。
如圖5A所示,為該燈條14之另一實施例,其中該燈條14進一步包含一下封裝層132及一下透光板15,該下透光板15設置於各導電基板12之下表面,其中該下透光板15具有一下出光面151,使光線能由該下出光面151向外散發;該下透光板15之面積大於等於各導電基板12的面積;該上封裝層131為半橢圓狀,且設置於該導電基板12之上表面並完全包覆該複數個發光二極體晶粒11,該下封裝層132為半橢圓狀,且設置於該下透光板15之下表面,其中各導電基板12之兩側邊外露於該些封裝層131、132,未受該些封裝層131、132包覆。藉由該上封裝層131及該下封裝層132的結合,能提高對於該複數個發光二極體晶粒11及該複數個導電基板12之保護能力,以及提高各發光二極體晶粒11
與各導電基板12之接合強度,使該燈條14更不容易斷裂;此外,如圖所示,由該導電基板12之中點向該上出光面111及該下出光面151垂直延伸有一中心軸C1,由於該上封裝層131自側面視之為半橢圓形狀,其中該上封裝層131從各導電基板12之上表面朝各發光二極體晶粒11之出光面方向延伸之高度定義為一第一長度L1,從該中心軸C1向各導電基板12之寬度方向側向延伸至該上封裝層131的厚度定義為一第二長度L2,該第一長度L1的三倍大於該第二長度L2(即3*L1>L2),同時該下封裝層132也具有上述規格,如此可使該複數個發光二極體晶粒11發光時,光線能沿著該些封裝層131、132的徑向方向平均朝外散發,以減少光線被該些封裝層131、132所反射的量,使得透光量增加且均勻穿透,達到出光亮均勻的成效。
在本實施例中,該複數個發光二極體晶粒11及該複數個導電基板12電性連接且裝設固定後,將高黏稠度的一封裝材料覆蓋該複數個發光二極體晶粒11及該複數個導電基板12的表面,使該封裝材料完全包覆各發光二極體晶粒11,再控制該封裝材料的流動狀況及硬化時間,使其固化後形成該上封裝層131及該下封裝層132,該上封裝層131與該下封裝層132所使用的該封裝材料可分別為透光的樹脂材料(resin-material)、透光的矽膠材料(silicone material)或透光的高分子材料。
請參見圖5B,該保護套16可為一長型透明結構,在本實施例中,該保護套16之內直徑可介於3mm~15mm之間,該保護套16之外直徑可為4mm~16mm之間;該保護套16為一透光中空管體並用於包覆該燈條14,該保護套16具撓曲性,可配合該燈條14彎折成不同形狀,使之不容易斷裂;在本實施例中,該保護套16為一絕緣體,在使用時避免使用者與該燈條14接觸而產生觸電之風險;此外,該些導電基板具有一寬度D1,該寬度D1為兩兩相鄰導電基板之相鄰的側邊,該保護套之內直徑長為D3,其中,0.3<(D1/D3)<1,當該些
導電基板12的寬度D1與該保護套16之內直徑長D3之比值在0.3至1之間時,能達到最大的出光量;另外,該保護套16可利用押出成型的方式製造出其管體,再透過熱塑工法等加熱方式使其產生型變,再放入模具中成型。將該燈條14置入該保護套16時,由於各導電基板12之兩邊緣外露出該些封裝層131、132,可降低該保護套16與該些封裝層131、132之間的摩擦,藉由兩側邊與該保護套16之內壁的接觸運動,進而減少該燈條14置入保護套16的過程中所遇之阻力。除此之外,由於各導電基板12之兩側邊與該保護套16之內壁接觸,可作為該保護套16之支撐架構,讓該保護套16大致呈現圓形狀或橢圓形狀,減少該保護套16施加在各發光二極體晶粒11上的壓力;此外,在本實施例中,該保護套為一透光或透明材料,在保護該燈條14時亦能保持良好的透光效果。
本創作由於各導電基板12之兩側邊露出於該封裝層13之外,使其能與該保護套16之內壁接觸,又,各導電基板12與該保護套16之間的摩擦力小於該封裝層13與該保護套16之間的摩擦力,將該燈條14裝設至該保護套16時,能藉由各導電基板12與該保護套16之間的小摩擦力,使裝設過程更為順利,減少時間成本及作業困難度。
請參見圖1,連接該發光二極體裝置10,本實施例中,該固定塊20係由一絕緣材質所構成,該固定塊20為一圓形塊體,且在該固定塊20上形成有複數個穿孔22,本實施例中,該固定塊20具有兩個穿孔22,在一較佳實施例中,各穿孔22為一圓孔,各穿孔22之孔徑與該發光二極體裝置10相配合,可使該發光二極體裝置10兩端的第一導電部121及第二導電部122分別***兩穿孔22,並固定在該穿孔22內部,例如透過黏合固定,使該發光二極體裝置10在彎折時得以維持牢固狀態;該固定塊20之外緣形成有一凸緣24。
該電路板30上設有複數個電極連接點,本實施例中包含兩個電極連接點311a、311b,各電極連接點311a、311b互為相異極性,例如一正極連
接點與一負極連接點,該正極連接點可與該第一導電部121電性連接,該負極連接點可與該第二導電部122電性連接;該電路板30上可設有電子元件,例如電容、電阻等而構成一控制電路。
該燈頭50的底部具有一第一電性連接部51,該燈頭50之側邊具有一第二電性連接部53,該第一電性連接部51與該第二電性連接部53互為相異極性且分別連接一外部電源,本實施例中,該第二電性連接部53為螺紋結構;該燈頭50之頂部內壁形成一階梯部55,使該固定塊20之該凸緣24能對應在該階梯部55;除此之外,該第一電性連接部51與該第二電性連接部53於該燈頭50內部分別與該電路板30之各電極連接端33a、33b電性連接。
請參見圖7至圖8,為該發光二極體燈具另一較佳實施例,與前一實施例之差異在於該發光二極體裝置僅一端***該固定塊20進行固定。
為了實現圖7及圖8之發光二極體燈具,本實施例所採用圖9之燈條14,該燈條14具有複數個發光二極體晶粒11、複數個導電基板12及一封裝層13,該封裝層13包含一上封裝層131,本實施例中,該些導電基板12更包含一第一導電部125及一第二導電部126,該第一導電部125位於該燈條14之任一末端,並與末端之該導電基板12電性連接。各發光二極體晶粒11搭載在兩相鄰的導電基板12之間且電性連接該兩相鄰的導電基板12,以形成該燈條14,具體而言,為一正極導電基板12、一發光二極體晶粒11、一導電基板12、一發光二極體晶粒11…交替排列的方式串聯連接;該第二導電部126為一長條型導電板,其設置於該些導電基板12之一邊,與該些導電基板12相鄰但不相連,其中一端與該燈條14之另一末端之該些發光二極體晶粒11電性連接,且該第二導電部126之部分面積被該上封裝層131覆蓋而固定;本實施例藉由該些導電基板12及該第二導電部126分離的方式,使電流由該第一導電部125進入後通過該些發光
二極體晶粒11,最後流經該第二導電部126形成電流迴路,使得該燈條14可以單端置入該固定塊20中連接該電路板30後,依然達到發光的效果。
請參見圖10至圖11,為該發光二極體燈具之另一較佳實施例,與前述實施例之差異在於其具有兩條該發光二極體裝置10;為達成此實施例,該固定塊20上之穿孔數目增加為四個,藉以將各發光二極體裝置10之兩端穿入該固定塊20內。
請參見圖12至圖15,由於該發光二極體裝置具可撓性,可彎折成不同的造型,如圖12所示,該發光二極體裝置10即彎折一圓形狀,以形成如同一般燈泡之形狀;如圖13所示,該發光二極體裝置10彎折成一蕈狀;如圖14所示,該發光二極體裝置10彎折成一愛心形狀;如圖15所示,該發光二極體裝置10彎折成一梨形;藉由將該發光二極體裝置10彎曲成數種不同的造型,以提供使用者多樣化的造型選擇。
由於各發光二極體晶粒11屬於點狀發光,將各發光二極體晶粒11的間距控制在小於各發光二極體晶粒11的長度的兩倍之內,可在發光時讓該燈條14呈現連續發光,且該複數個發光二極體晶粒11與該複數個導電基板12串聯連接之燈條14具撓曲性,大幅增加該發光二極體裝置10之彎曲程度,可在製作過程中形成多種不同的發光二極體裝置10造型,提供多樣化的選擇。
Claims (20)
- 一種發光二極體燈具,包含:一發光二極體裝置,包括:複數個發光二極體晶粒;複數個導電基板,各複數導電基板為一金屬薄片,該複數個導電基板呈間隔設置,各發光二極體晶粒由兩相鄰的導電基板共同承載並且形成電性連接,其中各發光二極體晶粒的長度為W1,兩相鄰發光二極體晶粒的間距為W2,且W2<2W1;一封裝層,係包含一上封裝層,該上封裝層係呈透光且包覆該複數個發光二極體晶粒且同時覆蓋在各導電基板之上表面,該上封裝層與該複數個發光二極體晶粒及該複數個導電基板係形成一燈條;一保護套,為一絕緣可透光且呈彎曲形狀之管體,該保護套係包覆該燈條;一固定塊,具有至少一穿孔,係供該燈條的至少一端穿設,用以固定該發光二極體裝置;一電路板,係電性連接該燈條之至少一端,用以控制該燈條;一燈頭,其內部供設置該固定塊及電路板設置。
- 如請求項1所述之發光二極體燈具,該上封裝層係由螢光膠、樹脂、塑膠、玻璃、橡膠、矽樹脂、高分子聚合物或有機物質等其中任一種絕緣材料所構成。
- 如請求項1所述之發光二極體燈具,該保護套係透過押出成型等工法生成一管體後,再將該管體利用熱塑等加熱方式使其結構軟化,接著放進一塑型模具成型。
- 如請求項1所述之發光二極體燈具,該些導電基板的兩側邊皆延伸出該上封裝層。
- 如請求項1所述之發光二極體燈具,該些發光二極體晶粒之上表面及下表面皆能出光。
- 如請求項1所述之發光二極體燈具,該些導電基板具有一寬度D1,該保護套之內直徑為D3,其中,0.3<(D1/D3)<1。
- 如請求項1所述之發光二極體燈具,該上封裝層具有一第一長度L1,該第一長度L1為該上封裝層從各導電基板之上表面向發光二極體晶粒之出光面方向延伸之厚度;該上封裝層具有一第二長度L2,該第二長度L2為該上封裝層從各導電基板中心向各導電基板之寬度方向延伸之厚度;其中,3L1>L2。
- 如請求項7所述之發光二極體燈具,進一步包含一下封裝層,該下封裝層包覆在該複數個發光二極體晶粒及該複數個導電基板之下表面。
- 如請求項8所述之發光二極體燈具,該上封裝層及該下封裝層具有厚度且均為半橢圓弧形狀。
- 如請求項1所述之發光二極體燈具,該燈條進一步包含一下透光板,該下透光板為絕緣透光且設置於該些導電基板之下表面。
- 一種發光二極體燈具,包含:一發光二極體裝置,包括:複數個發光二極體晶粒;複數個導電基板,其包含複數個正極導電基板及一負極導電基板,該些正極導電基板呈間隔設置,各發光二極體晶粒由兩相鄰的正極導電基板以及該負極導電基板共同承載並且形成電性連接,其中各發光二極體晶粒的長度為W1,兩相鄰發光二極體晶粒的間距為W2,且W2<2W1;該負極導電基板設置於該些正極導電基板之一邊;一封裝層,係包含一上封裝層,該上封裝層係呈透光且包覆該複數個發光二極體晶粒且同時覆蓋在各導電基板之部分上表面,使各正極導電基板之至少一側邊及該負極導電基板之至少一側邊延伸至該封裝層之外,該封裝層與該複數個發光二極體晶粒及該複數個導電基板係形成一燈條;一保護套,為一透明可透光且具可撓性之管體,該保護套係包覆該燈條;一固定塊,具有一穿孔,係供該燈條之一端穿設,用以固定該發光二極體裝置;一電路板,係電性連接該燈條之一端,用以控制該燈條;一燈頭,其內部供設置該固定塊及電路板。
- 如請求項11所述之發光二極體燈具,該上封裝層係由螢光膠、樹脂、塑膠、玻璃、橡膠、矽樹脂、高分子聚合物或有機物質等其中任一種絕緣材料所構成。
- 如請求項11所述之發光二極體燈具,該保護套係透過押出成型等工法生成一管體後,再將該管體利用熱塑等加熱方式使其結構軟化,接著放進一塑型模具成型。
- 如請求項11所述之發光二極體燈具,該些導電基板的兩側邊皆延伸出該上封裝層。
- 如請求項11所述之發光二極體燈具,該些發光二極體晶粒之上表面及下出光面皆能出光。
- 如請求項11所述之發光二極體燈具,該些導電基板具有一寬度D1,該寬度D1為兩兩相鄰導電基板之相鄰的側邊,該保護套之內直徑長為D3,其中,0.3<(D1/D3)<1。
- 如請求項11所述之發光二極體燈具,該上封裝層具有一第一長度L1,該第一長度L1為從各導電基板之上表面向各發光二極體晶粒之出光面方向延伸之該上封裝層厚度;該上封裝層具有一第二長度L2,該第二長度L2為從各導電基板中心向各導電基板之寬度方向延伸之該上封裝層厚度;其中,3L1>L2。
- 如請求項17所述之發光二極體燈具,進一步包含一下封裝層,該下封裝層包覆在該複數個發光二極體晶粒及該複數個導電基板之下表面。
- 如請求項18所述之發光二極體燈具,該上封裝層及該下封裝層具有厚度且為半橢圓弧形狀,使光線能均勻散發至該上封裝層及該下封裝層外。
- 如請求項11所述之發光二極體燈具,該燈條進一步包含一下透光板,該下透光板設置於該些導電基板之下表面,其為絕緣透光。
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TWM559977U (zh) * | 2017-03-31 | 2018-05-11 | Liquidleds Lighting Corp | 發光二極體燈具 |
-
2017
- 2017-10-23 TW TW106215561U patent/TWM559977U/zh unknown
- 2017-10-23 TW TW106136278A patent/TWI678495B/zh active
- 2017-11-09 CN CN201711099503.9A patent/CN108662446B/zh active Active
- 2017-12-20 US US15/848,003 patent/US10598314B2/en active Active
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2018
- 2018-01-09 ES ES18150711T patent/ES2784922T3/es active Active
- 2018-01-09 DK DK18150711.2T patent/DK3301354T3/da active
- 2018-02-02 JP JP2018017323A patent/JP6630381B2/ja active Active
- 2018-02-14 TW TW107202433U patent/TWM563517U/zh unknown
- 2018-02-14 TW TW107105600A patent/TWI638118B/zh active
- 2018-03-09 CN CN201820322059.6U patent/CN208312001U/zh not_active Expired - Fee Related
- 2018-03-09 CN CN201810192991.6A patent/CN108692200B/zh active Active
- 2018-03-26 US US15/935,547 patent/US10619798B2/en active Active
- 2018-03-27 ES ES18164133T patent/ES2734873T3/es active Active
- 2018-03-27 DK DK18164133.3T patent/DK3343098T3/da active
- 2018-03-27 EP EP18164133.3A patent/EP3343098B1/en active Active
- 2018-03-28 JP JP2018061657A patent/JP6517974B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI778860B (zh) * | 2021-11-11 | 2022-09-21 | 液光固態照明股份有限公司 | 發光二極體燈泡 |
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JP6517974B2 (ja) | 2019-05-22 |
CN108692200B (zh) | 2020-06-02 |
TWI638118B (zh) | 2018-10-11 |
JP2018174135A (ja) | 2018-11-08 |
US10619798B2 (en) | 2020-04-14 |
ES2734873T3 (es) | 2019-12-12 |
DK3301354T3 (da) | 2020-05-11 |
US20180283619A1 (en) | 2018-10-04 |
ES2784922T3 (es) | 2020-10-02 |
EP3343098B1 (en) | 2019-06-05 |
JP6630381B2 (ja) | 2020-01-15 |
TW201837374A (zh) | 2018-10-16 |
CN108692200A (zh) | 2018-10-23 |
CN108662446A (zh) | 2018-10-16 |
TWI678495B (zh) | 2019-12-01 |
CN108662446B (zh) | 2020-06-23 |
CN208312001U (zh) | 2019-01-01 |
TWM563517U (zh) | 2018-07-11 |
TW201812205A (zh) | 2018-04-01 |
JP2018174126A (ja) | 2018-11-08 |
DK3343098T3 (da) | 2019-08-19 |
EP3343098A1 (en) | 2018-07-04 |
US10598314B2 (en) | 2020-03-24 |
US20180283674A1 (en) | 2018-10-04 |
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