TWM499745U - Heat sink module and heat sink thereof - Google Patents
Heat sink module and heat sink thereof Download PDFInfo
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- TWM499745U TWM499745U TW103222139U TW103222139U TWM499745U TW M499745 U TWM499745 U TW M499745U TW 103222139 U TW103222139 U TW 103222139U TW 103222139 U TW103222139 U TW 103222139U TW M499745 U TWM499745 U TW M499745U
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Description
本創作係有關於一種散熱器，尤指一種散熱器模組及散熱器。This creation is about a radiator, especially a radiator module and a radiator.
隨著科技進步，主機板上安裝的電子元件數量也越多越密集，以工業電腦為例，其主機板上安裝有並列排列的複數中央處理器(CPU)及配置在各中央處理器(CPU)兩側的複數記憶體插槽組，進而增加主機板之效能及擴充能力。With the advancement of technology, the number of electronic components installed on the motherboard is also more and more dense. Taking industrial computers as an example, a plurality of central processing units (CPUs) arranged side by side are mounted on the motherboard, and are disposed in each central processing unit (CPU). ) Multiple memory slot groups on both sides, which in turn increases the performance and expansion capabilities of the motherboard.
然而，因現今主機板多追求體積縮小之目的，導致中央處理器(CPU)與記憶體插槽組的排列更加密集，但卻造成中央處理器(CPU)容易發生熱累積問題，而影響中央處理器(CPU)之運作。因此，如何在電子元件密集排列的主機板上安裝散熱器，係業者主要的研究課題之一。However, due to the pursuit of volume reduction for today's motherboards, the central processing unit (CPU) and the memory slot group are arranged more densely, but the central processing unit (CPU) is prone to heat accumulation problems, which affects central processing. The operation of the device (CPU). Therefore, how to install a heat sink on a motherboard with densely arranged electronic components is one of the main research topics of the system.
有鑑於此，本創作人遂針對上述現有技術，特潛心研究並配合學理的運用，盡力解決上述之問題點，即成為本創作人改良之目標。In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.
本創作之一目的，在於提供一種散熱器模組及散熱器，其係 利用基座與可拆式導風件能相互組接或拆卸，使散熱器模組及散熱器能安裝在電子元件密集排列的主機板上，並基座與可拆式導風件能有效地導引風流進入導風通道，使散熱器模組及散熱器可以獲得最大風流。One of the purposes of this creation is to provide a heat sink module and a heat sink. The base and the detachable air guiding member can be assembled or disassembled with each other, so that the heat sink module and the heat sink can be mounted on the main board with densely arranged electronic components, and the base and the detachable air guiding member can effectively The guiding airflow enters the air guiding channel, so that the radiator module and the radiator can obtain the maximum airflow.
為了達成上述之目的，本創作係提供一種散熱器，包括：一基座，包含一導熱板及固接在該導熱板相對兩側的二導風板，該導熱板及該二導風板之間形成一導風通道，該導熱板連接有複數鰭片，每一該導風板一端朝外側彎折延伸有一擋風板，另一端具有一連接部；以及一可拆式導風件，可組卸式連接於該基座，該可拆式導風件包含二直向板，每一該直向板一端與該連接部相互連接，另一端朝外側彎折延伸一橫向板。In order to achieve the above object, the present invention provides a heat sink, comprising: a base, comprising a heat conducting plate and two air guiding plates fixed on opposite sides of the heat conducting plate, the heat conducting plate and the two air guiding plates Forming a wind guide channel, the heat conducting plate is connected with a plurality of fins, each of the wind deflecting plates has a wind deflector extending outwardly at one end, a connecting portion at the other end, and a detachable air guiding member. The detachable air guiding member is configured to be connected to the base. The detachable air guiding member comprises two straight plates, one end of each of the straight plates is connected to the connecting portion, and the other end is bent outward to extend a horizontal plate.
為了達成上述之目的，本創作係提供一種散熱器模組，包括：二基座，每一該基座包含一導熱板及固接在該導熱板相對兩側的二導風板，該導熱板及該二導風板之間形成一導風通道，其一該導熱板連接有複數第一鰭片，另一該導熱板連接有複數第二鰭片，每一該導風板一端朝外側彎折延伸有一擋風板，其一相對的該二導風板另一端具有一連接部；以及一可拆式導風件，設置在該二基座之間，該可拆式導風件包含二直向板，每一該直向板一端與該連接部相互連接，另一端朝外側彎折延伸一橫向板。In order to achieve the above object, the present invention provides a heat sink module comprising: two bases, each of the bases comprising a heat conducting plate and two air guiding plates fixed on opposite sides of the heat conducting plate, the heat conducting plate An air guiding channel is formed between the two air guiding plates, wherein the heat conducting plate is connected with a plurality of first fins, and the other heat conducting plate is connected with a plurality of second fins, one end of each of the air guiding plates facing outward a wind deflector is extended, an opposite end of the two air deflectors has a connecting portion; and a detachable air guiding member is disposed between the two bases, the detachable air guiding member comprises Two straight plates, one end of each of the straight plates is connected to the connecting portion, and the other end is bent outward to extend a horizontal plate.
100‧‧‧散熱器模組100‧‧‧heatsink module
10‧‧‧散熱器10‧‧‧ radiator
1‧‧‧基座1‧‧‧Base
11‧‧‧導熱板11‧‧‧heat conducting plate
111‧‧‧鰭片111‧‧‧Fins
111’‧‧‧第一鰭片111’‧‧‧First fin
111”‧‧‧第二鰭片111”‧‧‧second fin
112‧‧‧頂面112‧‧‧ top surface
112’‧‧‧第一頂面112’‧‧‧ first top
112”‧‧‧第二頂面112”‧‧‧Second top
113‧‧‧底面113‧‧‧ bottom
114‧‧‧固定孔114‧‧‧Fixed holes
12‧‧‧導風板12‧‧‧Air deflector
121‧‧‧擋風板121‧‧‧wind shield
122‧‧‧連接部122‧‧‧Connecting Department
123‧‧‧卡槽123‧‧‧ card slot
124‧‧‧頂緣124‧‧‧Top edge
125‧‧‧嵌槽125‧‧‧ slotted
13‧‧‧導風通道13‧‧‧Guideway
14、14’‧‧‧凹槽14, 14' ‧ ‧ grooves
15‧‧‧透空槽15‧‧‧Through empty slot
16、16’‧‧‧無鰭片區16, 16'‧‧‧Finless area
17‧‧‧輔助導風板17‧‧‧Auxiliary air deflector
2‧‧‧可拆式導風件2‧‧‧Removable air guiding parts
21‧‧‧直向板21‧‧‧Direct board
211‧‧‧頂部211‧‧‧ top
212‧‧‧彈片212‧‧‧Shrap
213‧‧‧凸部213‧‧‧ convex
214‧‧‧倒勾214‧‧‧
22‧‧‧橫向板22‧‧‧ Horizontal board
23‧‧‧橫桿23‧‧‧crossbar
231‧‧‧凸片231‧‧‧ 片片
232‧‧‧穿孔232‧‧‧Perforation
3‧‧‧熱管3‧‧‧heat pipe
4‧‧‧均溫板4‧‧‧Wall plate
5‧‧‧固定元件5‧‧‧Fixed components
200‧‧‧主機板200‧‧‧ motherboard
201‧‧‧電路板201‧‧‧ circuit board
202‧‧‧中央處理器202‧‧‧Central processor
203‧‧‧記憶體插槽組203‧‧‧Memory Slot Set
204‧‧‧扳塊204‧‧‧ wrench
300‧‧‧風扇300‧‧‧fan
θ 1、θ 2‧‧‧夾角θ 1, θ 2‧‧‧ angle
a、b‧‧‧間距a, b‧‧‧ spacing
圖1 係本創作散熱器第一實施例之立體分解圖。1 is an exploded perspective view of a first embodiment of the present heat sink.
圖2 係本創作散熱器第一實施例之立體組合圖。2 is a perspective assembled view of the first embodiment of the present heat sink.
圖3 係本創作散熱器第一實施例之組合俯視圖。Figure 3 is a combined plan view of the first embodiment of the present heat sink.
圖4係本創作散熱器第二實施例之剖面示意圖。4 is a schematic cross-sectional view showing a second embodiment of the heat sink of the present invention.
圖5 係本創作散熱器第三實施例之剖面示意圖。Fig. 5 is a schematic cross-sectional view showing a third embodiment of the heat sink of the present invention.
圖6係本創作散熱器第四實施例之剖面示意圖。Fig. 6 is a schematic cross-sectional view showing a fourth embodiment of the heat sink of the present invention.
圖7係本創作散熱器第五實施例之剖面示意圖。Fig. 7 is a schematic cross-sectional view showing a fifth embodiment of the heat sink of the present invention.
圖8係本創作散熱器第六實施例之剖面示意圖。Figure 8 is a cross-sectional view showing a sixth embodiment of the heat sink of the present invention.
圖9係本創作散熱器第七實施例之剖面示意圖。Figure 9 is a cross-sectional view showing a seventh embodiment of the heat sink of the present invention.
圖10 係本創作散熱器模組第一實施例之立體分解圖。Figure 10 is an exploded perspective view of the first embodiment of the present heat sink module.
圖11係本創作散熱器模組第一實施例之立體組合圖。Figure 11 is a perspective assembled view of the first embodiment of the heat sink module of the present invention.
圖12 係本創作散熱器模組第一實施例之使用狀態示意圖。Figure 12 is a schematic view showing the state of use of the first embodiment of the heat sink module of the present invention.
圖13 係本創作散熱器模組第一實施例之另一使用狀態示意圖。FIG. 13 is a schematic view showing another use state of the first embodiment of the present heat sink module.
圖14 係本創作散熱器模組第一實施例之又一使用狀態示意圖。FIG. 14 is a schematic view showing still another use state of the first embodiment of the present heat sink module.
圖15 係本創作散熱器模組第二實施例之使用狀態示意圖。Figure 15 is a schematic view showing the state of use of the second embodiment of the heat sink module of the present invention.
圖16 係本創作散熱器模組第三實施例之使用狀態示意圖。Figure 16 is a schematic view showing the state of use of the third embodiment of the present heat sink module.
圖17 係本創作散熱器模組第八實施例之立體分解圖。Figure 17 is an exploded perspective view of an eighth embodiment of the present heat sink module.
圖18 係本創作散熱器模組第八四實施例之立體組合圖。Figure 18 is a perspective assembled view of the eighth embodiment of the present heat sink module.
圖19 係本創作散熱器模組第九實施例之立體分解圖。Figure 19 is an exploded perspective view showing a ninth embodiment of the heat sink module of the present invention.
圖20 係本創作散熱器模組第九實施例之立體組合圖。Figure 20 is a perspective assembled view of a ninth embodiment of the heat sink module of the present invention.
有關本創作之詳細說明及技術內容，將配合圖式說明如下，然而所附圖式僅作為說明用途，並非用於侷限本創作。The detailed description and technical content of the present invention will be described below in conjunction with the drawings, but the drawings are for illustrative purposes only and are not intended to limit the present invention.
請參考圖1至圖3所示，本創作係提供一種散熱器，此散熱器10主要包括一基座1及一可拆式導風件2。Referring to FIG. 1 to FIG. 3 , the present invention provides a heat sink. The heat sink 10 mainly includes a base 1 and a detachable air guiding member 2 .
基座1包含一導熱板11及固定並連接在導熱板11相對兩側的二導風板12，導熱板11及二導風板12之間形成一導風通道13，導熱板11連接有複數鰭片111，每一導風板12一端朝外側彎折延伸有一擋風板121，另一端具有一連接部122。The pedestal 1 includes a heat conducting plate 11 and two air guiding plates 12 fixed and connected to opposite sides of the heat conducting plate 11. The air guiding channel 13 is formed between the heat conducting plate 11 and the two air guiding plates 12, and the heat conducting plate 11 is connected with a plurality of air guiding plates 11 The fins 111 each have a wind deflector 121 bent outward at one end and a connecting portion 122 at the other end.
詳細說明如下，每一連接部122包含自導風板12上開設的一卡槽123，且各鰭片111設置在導風通道13中。其中，每一導風板12與擋風板121之間的夾角θ 1介於90°~150°之間，本實施例之每一導風板12與擋風板121之間的夾角θ 1最佳為90°，但不以此為限制。For details, each of the connecting portions 122 includes a slot 123 formed in the air deflector 12 , and each fin 111 is disposed in the air guiding passage 13 . The angle θ 1 between each air deflector 12 and the wind deflector 121 is between 90° and 150°, and the angle θ 1 between each air deflector 12 and the wind deflector 121 in this embodiment. The best is 90°, but not limited to this.
可拆式導風件2可組卸式連接於基座1，可拆式導風件2包含二直向板21，每一直向板21一端與連接部122相互連接，另一端朝外側彎折延伸一橫向板22。The detachable air guiding member 2 is detachably connected to the base 1. The detachable air guiding member 2 includes two straight plates 21, and each end of the straight plate 21 is connected to the connecting portion 122 and the other end is bent outward. The fold extends a transverse plate 22.
進一步說明如下，可拆式導風件2更包含一橫桿23，二直向板21固定並連接在橫桿23的兩端，且每一直向板21的頂部211延伸並反摺有一彈片212，每一彈片212具有一凸部213，各凸部213與各卡槽123相互卡合。其中，每一直向板21與橫向板22之間的夾角θ 2為90°。Further, the detachable air guiding member 2 further includes a cross bar 23 fixed to the two ends of the cross bar 23 and extending to the top 211 of the plate 21 and folded back with a resilient piece 212. Each of the elastic pieces 212 has a convex portion 213, and each convex portion 213 and the respective card slots 123 are engaged with each other. Here, the angle θ 2 between each of the straight plates 21 and the transverse plates 22 is 90°.
本創作散熱器10之組合，其係利用基座1包含導熱板11及固接在導熱板11相對兩側的導風板12，導熱板11及各導風板12之間形成導風通道13，導熱板11連接有複數鰭片111，每一導風板12一端朝外側彎折延伸有擋風板121，另一端具有連接部122；可拆式導風件2可組卸式連接於基座1，可拆式導風件2包含二直向板21，每一直向板21一端與連接部122相互連接，另一端朝外側彎折延伸橫向板22。藉此，基座1與可拆式導風件2能相互組接或拆卸，使散熱器10能安裝在電子元件密集排列的主機板上，並基座1與可拆式導風件2能有效地導引風流進入導風通道13，讓散熱器10可以獲得最大風流，以提升散熱器10之散熱效率。The combination of the heat sink 10 of the present invention comprises a heat conducting plate 11 and a wind deflecting plate 12 fixed to opposite sides of the heat conducting plate 11 by the base 1, and a wind guiding passage 13 is formed between the heat conducting plate 11 and each of the wind deflecting plates 12. The heat conducting plate 11 is connected with a plurality of fins 111. One end of each of the wind deflecting plates 12 is bent outwardly and has a wind deflector 121, and the other end has a connecting portion 122. The detachable air guiding member 2 is detachably connected to the wind deflecting plate 2 The susceptor 1, the detachable air guiding member 2 comprises two straight plates 21, and each end of the straight plate 21 is connected to the connecting portion 122, and the other end is bent outward to extend the transverse plate 22. Thereby, the base 1 and the detachable air guiding member 2 can be assembled or detached from each other, so that the heat sink 10 can be mounted on the main board with densely arranged electronic components, and the base 1 and the detachable air guiding member 2 can The airflow is effectively guided into the air guiding passage 13, so that the radiator 10 can obtain the maximum airflow to improve the heat dissipation efficiency of the radiator 10.
另外，散熱器10呈板狀結構，使散熱器10的厚度輕薄而能夠固定在任何地方，例如：主機板或機殼上。In addition, the heat sink 10 has a plate-like structure, so that the thickness of the heat sink 10 can be fixed at any place, such as a motherboard or a casing.
請參考圖3至圖6所示，係本創作散熱器10之第二、三、四實施例，第二、三、四實施例與第一實施例大致相同，但第二、三、四實施例與第一實施例不同之處在於散熱器10更包括一熱管3。Please refer to FIG. 3 to FIG. 6 , which are the second, third and fourth embodiments of the present heat sink 10 , and the second, third and fourth embodiments are substantially the same as the first embodiment, but the second, third and fourth embodiments are implemented. The example differs from the first embodiment in that the heat sink 10 further includes a heat pipe 3.
詳細說明如下，如圖4所示，係本創作散熱器10第二實施例，導熱板11具有頂面112，頂面112設有凹槽14，熱管3嵌固於凹槽14；如圖5所示，係本創作散熱器10第三實施例，導熱板11具有底面113，底面113設有凹槽14’，熱管3嵌固於凹槽14’；如圖6所示，係本創作散熱器10第四實施例，導熱 板11具有頂面112及底面113，導熱板11設有貫通頂面112及底面113的透空槽15，熱管3嵌固於透空槽15。藉此，導熱板11嵌固有熱管3，進而更加強散熱器10之散熱效率。A detailed description is as follows. As shown in FIG. 4, in the second embodiment of the present invention, the heat conducting plate 11 has a top surface 112. The top surface 112 is provided with a recess 14 and the heat pipe 3 is embedded in the recess 14; As shown in the third embodiment of the heat sink 10, the heat conducting plate 11 has a bottom surface 113, and the bottom surface 113 is provided with a groove 14', and the heat pipe 3 is embedded in the groove 14'; as shown in FIG. Fourth embodiment of the device 10, heat conduction The plate 11 has a top surface 112 and a bottom surface 113. The heat conducting plate 11 is provided with a through-groove 15 penetrating through the top surface 112 and the bottom surface 113. The heat pipe 3 is embedded in the transparent groove 15. Thereby, the heat conducting plate 11 is embedded in the intrinsic heat pipe 3, thereby further enhancing the heat dissipation efficiency of the heat sink 10.
請參考圖7至圖9所示，係本創作散熱器10之第五、六、七實施例，第五、六、七實施例與第一實施例大致相同，但第五、六、七實施例與第一實施例不同之處在於散熱器10更包括一均溫板4。Referring to FIG. 7 to FIG. 9 , the fifth, sixth, and seventh embodiments, the fifth, sixth, and seventh embodiments of the present heat sink 10 are substantially the same as the first embodiment, but the fifth, sixth, and seventh embodiments are implemented. The difference from the first embodiment is that the heat sink 10 further includes a temperature equalizing plate 4.
進一步說明如下，如圖7所示，係本創作散熱器10第五實施例，導熱板11具有頂面112，頂面112設有凹槽14，均溫板4嵌固於凹槽14；如圖8所示，係本創作散熱器10第六實施例，導熱板11具有底面113，底面113設有凹槽14’，均溫板4嵌固於凹槽14’；如圖9所示，係本創作散熱器10第七實施例，導熱板11具有頂面112及底面113，導熱板11設有貫通頂面112及底面113的透空槽15，均溫板4嵌固於透空槽15。藉此，導熱板11嵌固有均溫板4，進而更加強散熱器10之散熱效率。Further, as shown in FIG. 7 , in the fifth embodiment of the heat sink 10 , the heat conducting plate 11 has a top surface 112 , and the top surface 112 is provided with a groove 14 , and the temperature equalizing plate 4 is embedded in the groove 14 ; 8 is a sixth embodiment of the heat sink 10 of the present invention, the heat conducting plate 11 has a bottom surface 113, the bottom surface 113 is provided with a groove 14', and the temperature equalizing plate 4 is embedded in the groove 14'; as shown in FIG. According to a seventh embodiment of the present invention, the heat conducting plate 11 has a top surface 112 and a bottom surface 113. The heat conducting plate 11 is provided with a through-groove 15 penetrating through the top surface 112 and the bottom surface 113. The temperature equalizing plate 4 is embedded in the through-hole slot. 15. Thereby, the heat conducting plate 11 is embedded with the inherent temperature equalizing plate 4, thereby further enhancing the heat dissipation efficiency of the heat sink 10.
請參考圖10至圖14所示，本創作係提供一種散熱器模組，此散熱器模組100主要包括二基座1及一可拆式導風件2。Referring to FIG. 10 to FIG. 14 , the present invention provides a heat sink module. The heat sink module 100 mainly includes two bases 1 and a detachable air guiding member 2 .
每一基座1包含導熱板11及固定並連接在導熱板11相對兩側的二導風板12，導熱板11及二導風板12之間形成導風通道13，其一導熱板11連接有複數第一鰭片111’，另一導熱板11連接有複數第二鰭片111”，每一導風板12一端朝外側彎折延伸有擋風板121，其一相對的二導風板12另一端具有連 接部122。Each of the pedestals 1 includes a heat conducting plate 11 and two air guiding plates 12 fixed to and connected to opposite sides of the heat conducting plate 11. The air guiding channel 13 is formed between the heat conducting plate 11 and the two air guiding plates 12, and a heat conducting plate 11 is connected. There is a plurality of first fins 111', and another heat conducting plate 11 is connected with a plurality of second fins 111". One end of each of the wind deflecting plates 12 is bent outwardly and has a wind deflector 121, and a relative wind guide 121 The other end of the board 12 has a connection The connecting portion 122.
詳細說明如下，每一連接部122包含自導風板12上開設的一卡槽123，且各第一鰭片111’與各第二鰭片111”分別設置在導風通道13中。其中，每一導風板12與擋風板121之間的夾角θ 1介於90°~150°之間，本實施例之每一導風板12與擋風板121之間的夾角θ 1最佳為90°，但不以此為限制。Each of the connecting portions 122 includes a card slot 123 formed in the air guiding plate 12, and each of the first fins 111' and each of the second fins 111' is disposed in the air guiding channel 13 respectively. The angle θ 1 between each of the air deflector 12 and the wind deflector 121 is between 90° and 150°, and the angle θ 1 between each of the air deflector 12 and the wind deflector 121 of the embodiment is optimal. It is 90°, but it is not limited to this.
另外，其一導熱板11具有一第一頂面112’，各第一鰭片111’連接在於第一頂面112’的一部分，第一頂面112’在各第一鰭片111’與其一導風板12之間形成一無鰭片區16，另一導熱板11具有一第二頂面112”，各第二鰭片111”連接在於第二頂面112”全部。In addition, a heat conducting plate 11 has a first top surface 112 ′, each first fin 111 ′ is connected to a portion of the first top surface 112 ′, and the first top surface 112 ′ is in each of the first fins 111 ′. A finless region 16 is formed between the wind deflectors 12, and another heat conducting plate 11 has a second top surface 112", and each of the second fins 111" is connected to all of the second top surface 112".
可拆式導風件2設置在二基座1之間，可拆式導風件2包含二直向板21，每一直向板21一端與連接部122相互連接，另一端朝外側彎折延伸一橫向板22。The detachable air guiding member 2 is disposed between the two bases 1. The detachable air guiding member 2 includes two straight guiding plates 21, and each end of the straight plate 21 is connected to the connecting portion 122 and the other end is bent outward. A transverse plate 22 is extended.
進一步說明如下，可拆式導風件2更包含一橫桿23，二直向板21固定並連接在橫桿23的兩端，且每一直向板21的頂部211延伸並反摺有一彈片212，每一彈片212具有一凸部213，各凸部213與各卡槽123相互卡合。其中，每一直向板21與橫向板22之間的夾角θ 2為90°。Further, the detachable air guiding member 2 further includes a cross bar 23 fixed to the two ends of the cross bar 23 and extending to the top 211 of the plate 21 and folded back with a resilient piece 212. Each of the elastic pieces 212 has a convex portion 213, and each convex portion 213 and the respective card slots 123 are engaged with each other. Here, the angle θ 2 between each of the straight plates 21 and the transverse plates 22 is 90°.
本創作散熱器模組100之組合，其係利用每一基座1包含導熱板11及固接在導熱板11相對兩側的導風板12，導熱板11及二導風板12之間形成導風通道13，其一導熱板11連接有各第一 鰭片111’，另一導熱板11連接有各第二鰭片111”，每一導風板12一端朝外側彎折延伸有擋風板121，其一相對的二導風板12另一端具有連接部122；可拆式導風件2設置在二基座1之間，可拆式導風件2包含直向板21，每一直向板21一端與連接部122相互連接，另一端朝外側彎折延伸橫向板22。藉此，基座1與可拆式導風件2能相互組接或拆卸，使散熱器模組100能安裝在電子元件密集排列的主機板200上，並基座1與可拆式導風件2能有效地導引風流進入導風通道13，使散熱器模組100可以獲得最大風流，以提升散熱器模組100之散熱效率。The combination of the heat sink module 100 of the present invention comprises a heat conducting plate 11 and a wind deflecting plate 12 fixed to opposite sides of the heat conducting plate 11 , and a heat conducting plate 11 and two wind deflecting plates 12 are formed between each base 1 . The air guiding channel 13 has a heat conducting plate 11 connected with each first The fins 111' are connected to each of the second fins 111'. The other end of each of the air deflectors 12 is bent outwardly and has a wind deflector 121, and the opposite ends of the two opposite wind deflectors 12 The connecting portion 122 is provided; the detachable air guiding member 2 is disposed between the two bases 1, and the detachable air guiding member 2 comprises a straight plate 21, and each end of the straight plate 21 is connected to the connecting portion 122, and the other end is opposite The outer side bends and extends the horizontal plate 22. Thereby, the base 1 and the detachable air guiding member 2 can be assembled or detached from each other, so that the heat sink module 100 can be mounted on the motherboard 200 in which the electronic components are densely arranged, and The pedestal 1 and the detachable air guiding member 2 can effectively guide the wind flow into the air guiding channel 13, so that the heat sink module 100 can obtain the maximum airflow to improve the heat dissipation efficiency of the heat sink module 100.
本創作散熱器模組100之使用狀態，其係用於一主機板200及一風扇300，主機板200包含一電路板201、並列排列在電路板201上的二中央處理器(CPU)202及設置在各中央處理器202兩側的四記憶體插槽組203，每一記憶體插槽組203兩端具有二扳塊204，風扇300對應主機板200配置。The use state of the heat sink module 100 is used for a motherboard 200 and a fan 300. The motherboard 200 includes a circuit board 201, two central processing units (CPUs) 202 arranged side by side on the circuit board 201, and A four-memory slot group 203 is disposed on each side of each central processing unit 202. Each of the memory slot groups 203 has two wrench blocks 204. The fan 300 is configured corresponding to the motherboard 200.
首先，如圖10所示，將二基座1固定在各中央處理器202上方及二記憶體插槽組203之間，擋風板121沿著記憶體插槽組203的外側配置。First, as shown in FIG. 10, the two pedestals 1 are fixed between the central processing unit 202 and the two memory slot groups 203, and the windshield 121 is disposed along the outer side of the memory slot group 203.
再者，如圖10至圖11所示，將可拆式導風件2設置在二基座1之間，各凸部213與各卡槽123相互卡合，而令每一直向板21可組卸式連接於連接部122，並二橫向板22設置在各二記憶體插槽組203之間。Furthermore, as shown in FIG. 10 to FIG. 11 , the detachable air guiding member 2 is disposed between the two bases 1 , and the convex portions 213 and the respective card slots 123 are engaged with each other, so that each of the straight plates 21 can be The stacking unit is connected to the connecting portion 122, and the two horizontal plates 22 are disposed between the two memory slot groups 203.
最後，如圖12所示，風扇300與導風通道13呈相對配置，並擋風板121與可拆式導風件2填補了各記憶體插槽組203的間隙，以導引風流確實地進入導風通道13，再利用風流將中央處理器202傳遞到第一鰭片111’及第二鰭片111”的熱量帶至外部環境。Finally, as shown in FIG. 12, the fan 300 and the air guiding channel 13 are arranged opposite each other, and the wind deflector 121 and the detachable air guiding member 2 fill the gap between the memory slot groups 203 to guide the wind flow reliably. The air guiding channel 13 is entered, and the heat transferred from the central processing unit 202 to the first fin 111' and the second fin 111" is brought to the external environment by the wind flow.
另外，如圖13所示，因現今主機板200多追求體積縮小之目的，導致中央處理器202與記憶體插槽組203的排列更加密集，使記憶體插槽組203之間的間隙僅夠橫向板22的厚度伸入，卻造成扳塊204無法正常扳動使用；但是，如圖14所示，可拆式導風件2能相互組接或拆卸於基座1，所以將可拆式導風件2自基座1上拆卸下來，扳塊204即可正常扳動使用。In addition, as shown in FIG. 13, since the current motherboard 200 pursues the purpose of volume reduction, the arrangement of the central processing unit 202 and the memory slot group 203 is more dense, so that the gap between the memory slot groups 203 is only enough. The thickness of the transverse plate 22 extends, but the wrench 204 cannot be used normally; however, as shown in FIG. 14, the detachable air guiding members 2 can be assembled or detached from each other, so the detachable type is detachable. The air guiding member 2 is detached from the base 1, and the wrench 204 can be normally used for pulling.
再者，如圖12所示，風扇300可鄰近第一鰭片111’配置或鄰近第二鰭片111”配置，不以本實施例為限制，但風扇300不管鄰近第一鰭片111’或第二鰭片111”配置，風扇300皆會產生自第一鰭片111’吹向第二鰭片111”的風流，因此第一頂面112’在各第一鰭片111’與其一導風板12之間形成無鰭片區16，以確實讓風流順利地由第一鰭片111’吹向第二鰭片111”，進而提高散熱器模組100的導風能力及散熱功效。Moreover, as shown in FIG. 12, the fan 300 may be disposed adjacent to or adjacent to the first fin 111', which is not limited by the embodiment, but the fan 300 is adjacent to the first fin 111' or The second fins 111 ′′ are configured, and the fan 300 generates a wind flow from the first fins 111 ′ to the second fins 111 ′′, so that the first top surface 112 ′ is guided by the first fins 111 ′. A fin-free region 16 is formed between the plates 12 to ensure that the wind flow is smoothly blown from the first fins 111' to the second fins 111", thereby improving the air guiding capability and heat dissipation efficiency of the heat sink module 100.
同理，若風扇300產生自第二鰭片111”吹向第一鰭片111’的風流，則第二頂面112”在各第二鰭片111”與其一導風板12之間也會形成無鰭片區，以確實讓風流順利地由第二鰭片 111”吹向第一鰭片111’。Similarly, if the fan 300 generates a wind flow from the second fin 111" to the first fin 111', the second top surface 112" between the second fins 111" and a wind deflector 12 thereof Forming a finless zone to ensure that the wind flow is smoothly from the second fin 111" is blown toward the first fin 111'.
請參考圖15所示，係本創作散熱器模組100之第二實施例，第二實施例與第一實施例大致相同，但第二實施例與第一實施例不同之處在於無鰭片區16’的位置不同。Please refer to FIG. 15 , which is a second embodiment of the present heat sink module 100 . The second embodiment is substantially the same as the first embodiment, but the second embodiment is different from the first embodiment in that there is no fin region. The location of 16' is different.
詳細說明如下，風扇300產生自第一鰭片111’吹向第二鰭片111”的風流，因此各第一鰭片111’連接在於第一頂面112’的兩側，第一頂面112’在各第一鰭片111’之間形成無鰭片區16’，各第二鰭片111”連接在於第二頂面112”全部。藉此，以確實讓風流順利地由第一鰭片111’吹向第二鰭片111”。As described in detail below, the fan 300 generates a wind flow from the first fin 111 ′ to the second fin 111 ′′, so that the first fins 111 ′ are connected on both sides of the first top surface 112 ′, and the first top surface 112 A fin-free region 16' is formed between each of the first fins 111', and each of the second fins 111" is connected to all of the second top surface 112". Thereby, the wind flow is surely made smoothly by the first fins 111. 'Blowing toward the second fin 111'.
同理，若風扇300產生自第二鰭片111”吹向第一鰭片111’的風流，則第二頂面112”在各第二鰭片111”之間也會形成無鰭片區，以確實讓風流順利地由第二鰭片111”吹向第一鰭片111’。Similarly, if the fan 300 generates a wind flow from the second fin 111" to the first fin 111', the second top surface 112" also forms a fin-free region between the second fins 111" to It is true that the wind flow is smoothly blown by the second fins 111" toward the first fins 111'.
請參考圖16所示，係本創作散熱器模組100之第三實施例，第三實施例與第一實施例大致相同，但第三實施例與第一實施例不同之處在於各第一鰭片111’之間的間距a大於各第二鰭片111”之間的間距b。Please refer to FIG. 16 , which is a third embodiment of the present heat sink module 100 . The third embodiment is substantially the same as the first embodiment, but the third embodiment is different from the first embodiment in that each first The spacing a between the fins 111' is greater than the spacing b between the second fins 111'.
進一步說明如下，風扇300產生自第一鰭片111’吹向第二鰭片111”的風流，因此各第一鰭片111’彼此間隔連接在於第一頂面112’的全部，各第二鰭片111”彼此間隔連接在於第二頂面112”全部，相鄰二第一鰭片111’之間的間距a大於 相鄰二第二鰭片111”之間的間距b。藉此，以確實讓風流順利地由第一鰭片111’吹向第二鰭片111”。Further, as described below, the fan 300 generates a wind flow from the first fin 111 ′ to the second fin 111 ′′, so that each of the first fins 111 ′ is spaced apart from each other by all of the first top surface 112 ′, and each second fin The sheets 111" are spaced apart from each other in the second top surface 112", and the spacing a between the adjacent two first fins 111' is greater than The spacing b between adjacent two second fins 111". Thereby, it is ensured that the wind flow is smoothly blown by the first fins 111' toward the second fins 111".
同理，若風扇300產生自第二鰭片111”吹向第一鰭片111’的風流，則相鄰二第一鰭片111’之間的間距a會小於相鄰二第二鰭片111”之間的間距b，以確實讓風流順利地由第二鰭片111”吹向第一鰭片111’。Similarly, if the fan 300 generates a wind flow from the second fin 111" to the first fin 111', the spacing a between the adjacent two first fins 111' will be smaller than the adjacent two second fins 111. The spacing b between them is such that the wind flow is surely blown smoothly by the second fins 111" toward the first fins 111'.
請參考圖17至圖18所示，係本創作散熱器10之第八實施例，第八實施例與第一實施例大致相同，但第八實施例與第一實施例不同之處在於可拆式導風件2更以鎖固方式固定於基座1。Referring to FIG. 17 to FIG. 18, the eighth embodiment of the heat sink 10 is substantially the same as the first embodiment, but the eighth embodiment is different from the first embodiment in that it is detachable. The air guiding member 2 is further fixed to the base 1 in a locking manner.
詳細說明如下，散熱器10更包括一固定元件5(例如：螺絲、扣具等)，橫桿23延伸有一凸片231，凸片231設有一穿孔232，導熱板11設有一固定孔114，固定元件5穿設並固定於穿孔232及固定孔114，而令可拆式導風件2以鎖固方式固定於基座1。The heat sink 10 is further provided with a fixing piece 5 (for example, a screw, a buckle, etc.), the cross bar 23 is extended with a protruding piece 231, the protruding piece 231 is provided with a through hole 232, and the heat conducting plate 11 is provided with a fixing hole 114, which is fixed. The component 5 is disposed and fixed to the through hole 232 and the fixing hole 114, and the detachable air guiding member 2 is fixed to the base 1 in a locking manner.
另外，如圖1至圖3所示，每一連接部122可為包含自導風板12上開設的卡槽123；如圖17至圖18所示，每一連接部122也可為包含自導風板12頂緣124向下開設的嵌槽125，每一直向板21的頂部211延伸並反摺有倒勾214，各倒勾214與各嵌槽125相互嵌合。In addition, as shown in FIG. 1 to FIG. 3, each connecting portion 122 may include a card slot 123 formed on the air deflector 12; as shown in FIG. 17 to FIG. 18, each connecting portion 122 may also include The recesses 125 formed by the top edge 124 of the wind deflector 12 extend downwardly from the top 211 of the panel 21 and are folded back with the barbs 214. The barbs 214 and the recesses 125 are fitted to each other.
請參考圖19至圖20所示，係本創作散熱器10之第九實施例，第九實施例與第一實施例大致相同，但第九實施例與第一實 施例不同之處在於基座1更包含二輔助導風板17。Referring to FIG. 19 to FIG. 20, the ninth embodiment of the present heat sink 10 is substantially the same as the first embodiment, but the ninth embodiment and the first embodiment The difference in the embodiment is that the base 1 further includes two auxiliary wind deflectors 17.
進一步說明如下，二輔助導風板17固接在導熱板11相對兩側，且二輔助導風板17與二導風板12呈間隔並列排列，讓二輔助導風板17與二導風板12並列在導熱板11的前、後、左、右側。因二輔助導風板17與二導風板12呈間隔並列，使兩者之間具有一缺口，可拆式導風件2設置在二導風板12與該二輔助導風板17之間，以遮蔽二輔助導風板17與二導風板12之間的缺口，讓基座1與可拆式導風件2能有效地導引風流進入導風通道13，使散熱器10可以獲得最大風流，以提升散熱器10之散熱效率。Further, as follows, the two auxiliary air deflectors 17 are fixed on opposite sides of the heat conducting plate 11, and the two auxiliary wind deflecting plates 17 are arranged side by side with the two wind deflecting plates 12, and the second auxiliary wind deflecting plates 17 and the second air guiding plates are arranged. 12 is juxtaposed on the front, rear, left, and right sides of the heat conducting plate 11. The detachable air guiding member 2 is disposed between the two air guiding plates 12 and the two auxiliary air guiding plates 17 because the two auxiliary air guiding plates 17 are juxtaposed with the two air guiding plates 12 so as to be spaced apart from each other. In order to shield the gap between the two auxiliary air deflectors 17 and the two air deflectors 12, the base 1 and the detachable air guiding member 2 can effectively guide the wind flow into the air guiding passage 13, so that the heat sink 10 can be obtained. Maximum airflow to increase the heat dissipation efficiency of the heat sink 10.
綜上所述，本創作之散熱器模組及散熱器，確可達到預期之使用目的，而解決習知之缺失，並具有產業利用性、新穎性與進步性，完全符合新型專利申請要件，爰依專利法提出申請，敬請詳查並賜准本案專利，以保障創作人之權利。In summary, the heat sink module and the heat sink of the present invention can achieve the intended use purpose, and solve the lack of conventional knowledge, and have industrial utilization, novelty and progress, and fully comply with the requirements of the new patent application. To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the creator.
10‧‧‧散熱器10‧‧‧ radiator
1‧‧‧基座1‧‧‧Base
111‧‧‧鰭片111‧‧‧Fins
12‧‧‧導風板12‧‧‧Air deflector
121‧‧‧擋風板121‧‧‧wind shield
122‧‧‧連接部122‧‧‧Connecting Department
123‧‧‧卡槽123‧‧‧ card slot
13‧‧‧導風通道13‧‧‧Guideway
2‧‧‧可拆式導風件2‧‧‧Removable air guiding parts
21‧‧‧直向板21‧‧‧Direct board
211‧‧‧頂部211‧‧‧ top
212‧‧‧彈片212‧‧‧Shrap
213‧‧‧凸部213‧‧‧ convex
22‧‧‧橫向板22‧‧‧ Horizontal board
23‧‧‧橫桿23‧‧‧crossbar
Claims (22)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103222139U TWM499745U (en) | 2014-10-24 | 2014-12-12 | Heat sink module and heat sink thereof |
| FIU20154037U FI10980U1 (en) | 2014-10-24 | 2015-02-19 | Cooling module and cooling element |
| RU2015109432/02U RU158860U1 (en) | 2014-10-24 | 2015-03-18 | COOLING MODULE |
| RU2015109392/02U RU158861U1 (en) | 2014-10-24 | 2015-03-18 | RADIATOR |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103218885 | 2014-10-24 | ||
| TW103222139U TWM499745U (en) | 2014-10-24 | 2014-12-12 | Heat sink module and heat sink thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM499745U true TWM499745U (en) | 2015-04-21 |
Family
ID=53441487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103222139U TWM499745U (en) | 2014-10-24 | 2014-12-12 | Heat sink module and heat sink thereof |
Country Status (3)
| Country | Link |
|---|---|
| FI (1) | FI10980U1 (en) |
| RU (2) | RU158860U1 (en) |
| TW (1) | TWM499745U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI742942B (en) * | 2020-11-25 | 2021-10-11 | 微星科技股份有限公司 | Motherboard assembly and heat dissipation module |
-
2014
- 2014-12-12 TW TW103222139U patent/TWM499745U/en not_active IP Right Cessation
-
2015
- 2015-02-19 FI FIU20154037U patent/FI10980U1/en active IP Right Grant
- 2015-03-18 RU RU2015109432/02U patent/RU158860U1/en not_active IP Right Cessation
- 2015-03-18 RU RU2015109392/02U patent/RU158861U1/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI742942B (en) * | 2020-11-25 | 2021-10-11 | 微星科技股份有限公司 | Motherboard assembly and heat dissipation module |
| CN114546071A (en) * | 2020-11-25 | 2022-05-27 | 恩斯迈电子(深圳)有限公司 | Motherboard assembly and heat dissipation module |
| CN114546071B (en) * | 2020-11-25 | 2023-10-03 | 恩斯迈电子(深圳)有限公司 | Motherboard assembly and heat dissipation module |
Also Published As
| Publication number | Publication date |
|---|---|
| RU158860U1 (en) | 2016-01-20 |
| RU158861U1 (en) | 2016-01-20 |
| FI10980U1 (en) | 2015-08-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |