FI10980U1 - Cooling module and cooling element - Google Patents

Cooling module and cooling element

Info

Publication number
FI10980U1
FI10980U1 FIU20154037U FIU20154037U FI10980U1 FI 10980 U1 FI10980 U1 FI 10980U1 FI U20154037 U FIU20154037 U FI U20154037U FI U20154037 U FIU20154037 U FI U20154037U FI 10980 U1 FI10980 U1 FI 10980U1
Authority
FI
Finland
Prior art keywords
cooling
module
cooling element
cooling module
Prior art date
Application number
FIU20154037U
Other languages
Finnish (fi)
Swedish (sv)
Inventor
Wei-Te Wang
Chi-Yuan Hsiao
yao-sheng Guo
Original Assignee
Aic Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aic Inc filed Critical Aic Inc
Application granted granted Critical
Publication of FI10980U1 publication Critical patent/FI10980U1/en

Links

FIU20154037U 2014-10-24 2015-02-19 Cooling module and cooling element FI10980U1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW103218885 2014-10-24
TW103222139U TWM499745U (en) 2014-10-24 2014-12-12 Heat sink module and heat sink thereof

Publications (1)

Publication Number Publication Date
FI10980U1 true FI10980U1 (en) 2015-08-26

Family

ID=53441487

Family Applications (1)

Application Number Title Priority Date Filing Date
FIU20154037U FI10980U1 (en) 2014-10-24 2015-02-19 Cooling module and cooling element

Country Status (3)

Country Link
FI (1) FI10980U1 (en)
RU (2) RU158861U1 (en)
TW (1) TWM499745U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI742942B (en) * 2020-11-25 2021-10-11 微星科技股份有限公司 Motherboard assembly and heat dissipation module

Also Published As

Publication number Publication date
RU158861U1 (en) 2016-01-20
TWM499745U (en) 2015-04-21
RU158860U1 (en) 2016-01-20

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