TWM487432U - Temperature sensing system having a plurality of quartz crystal temperature sensors and temperature-sensing apparatus - Google Patents
Temperature sensing system having a plurality of quartz crystal temperature sensors and temperature-sensing apparatus Download PDFInfo
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Description
本新型是有關於一種溫度感測系統及其溫度感測裝置，特別是指一種具有複數個石英晶體溫度感測器而可用於分別測量複數個待測電子元件之溫度感測系統及其溫度感測裝置。The invention relates to a temperature sensing system and a temperature sensing device thereof, in particular to a temperature sensing system with a plurality of quartz crystal temperature sensors for measuring a plurality of electronic components to be tested and a sense of temperature thereof. Measuring device.
目前，通常是透過一溫度測試系統1中來對電子元件15(例如封裝元件)進行溫度測試，藉此檢測電子元件15是否有達致所欲的目標溫度，並且評估電子元件15在該目標溫度下是否能正常作用。參閱圖1，該溫度測試系統1具有一烘箱11(oven)、複數個設置於該烘箱11頂角的溫度感測器12、複數置放於該烘箱11中的測試電路板13、複數設置於該等測試電路板13上的測試插座14，及複數置放於該等測試插座14上且可通過該等測試插座14而與該等測試電路板13呈電連接的待測電子元件15。At present, the electronic component 15 (for example, the package component) is usually subjected to a temperature test through a temperature test system 1, thereby detecting whether the electronic component 15 has reached a desired target temperature, and evaluating the electronic component 15 at the target temperature. Whether it works normally. Referring to FIG. 1, the temperature testing system 1 has an oven 11 (venven), a plurality of temperature sensors 12 disposed at the top corner of the oven 11, a plurality of test boards 13 placed in the oven 11, and a plurality of The test sockets 14 on the test circuit board 13 and the plurality of test electronic components 15 placed on the test sockets 14 and electrically connected to the test circuit boards 13 through the test sockets 14.
當該烘箱11進行加熱或冷卻時，該等溫度感測器12可用以感測烘箱11中的溫度並將所測得的溫度訊號傳送給一處理器(圖未示)來進行監控。然而，該等溫度感測器12僅能用於感測局部區域的溫度，而在距離該等溫度感 測器12較遠的區域的溫度則無法精準地被測量，因而致使這些區域的待測電子元件15在整個測試的過程中並無法受到精準的溫度檢測。When the oven 11 is heated or cooled, the temperature sensors 12 can be used to sense the temperature in the oven 11 and transmit the measured temperature signals to a processor (not shown) for monitoring. However, the temperature sensors 12 can only be used to sense the temperature of a local area, while at the distance The temperature of the area farther away from the detector 12 cannot be accurately measured, so that the electronic component 15 to be tested in these areas is not subjected to accurate temperature detection throughout the test.
因此，本新型之目的，即在提供一種溫度感測裝置，該溫度感測裝置可分別精準地測量出多個待測電子元件的溫度。Therefore, the object of the present invention is to provide a temperature sensing device that can accurately measure the temperatures of a plurality of electronic components to be tested, respectively.
於是本新型溫度感測裝置，適用於複數個待測電子元件的溫度測試，該溫度感測裝置包含一電路基板及複數個設置且電連接於該電路基板上的溫度感測元件。該等溫度感測元件是石英晶體溫度感測器(quartz crystal temperature sensor)且供用於感測該等相對應的待測電子元件的溫度。Therefore, the novel temperature sensing device is applicable to temperature testing of a plurality of electronic components to be tested, and the temperature sensing device comprises a circuit substrate and a plurality of temperature sensing components disposed and electrically connected to the circuit substrate. The temperature sensing elements are quartz crystal temperature sensors and are used to sense the temperatures of the corresponding electronic components to be tested.
本新型之另一目的，即在提供一種溫度感測系統，該溫度感測系統在對複數個待測電子元件進行溫度測試的過程中可分別精準地測量出該等待測電子元件的溫度。Another object of the present invention is to provide a temperature sensing system that can accurately measure the temperature of the electronic component to be tested, respectively, during temperature testing of a plurality of electronic components to be tested.
於是本新型溫度感測系統，適用於複數個待測電子元件的溫度測試，每一待測電子元件具有複數個導電接觸部，該溫度感測系統包含至少一測試電路板、複數個測試插座，及至少一如上所述的溫度感測裝置。Therefore, the novel temperature sensing system is applicable to temperature testing of a plurality of electronic components to be tested, each electronic component to be tested has a plurality of conductive contacts, and the temperature sensing system comprises at least one test circuit board and a plurality of test sockets. And at least one temperature sensing device as described above.
該等測試插座設置於該測試電路板上。每一測試插座包括一絕緣座體，及複數個穿設該絕緣座體的探針。該絕緣座體具有一供該相對應的待測電子元件容置的容置 槽。各該探針的底端焊接於該測試電路板，各該探針的頂端抵接於相對應的待測電子元件的該等導電接觸部。該溫度感測裝置包含一電路基板，及複數個設置且電連接於該電路基板上的溫度感測元件。該等溫度感測元件是石英晶體溫度感測器且供用於感測該等相對應的待測電子元件的溫度。The test sockets are disposed on the test circuit board. Each test socket includes an insulating base and a plurality of probes that pass through the insulating base. The insulating base has a receiving space for the corresponding electronic component to be tested groove. The bottom end of each of the probes is soldered to the test circuit board, and the top end of each of the probes abuts the corresponding conductive contacts of the electronic component to be tested. The temperature sensing device includes a circuit substrate and a plurality of temperature sensing elements disposed and electrically connected to the circuit substrate. The temperature sensing elements are quartz crystal temperature sensors and are used to sense the temperatures of the corresponding electronic components to be tested.
本新型之功效在於：藉由該等溫度感測元件與該等相對應的待測電子元件之間的一對一感測，因而可分別精準地被測量出該等相對應的待測電子元件的溫度。The utility model has the advantages that: by the one-to-one sensing between the temperature sensing elements and the corresponding electronic components to be tested, the corresponding electronic components to be tested can be accurately measured respectively. temperature.
2‧‧‧溫度感測裝置2‧‧‧Temperature sensing device
21‧‧‧電路基板21‧‧‧ circuit board
211‧‧‧訊號傳輸部211‧‧‧Signal Transmission Department
22‧‧‧溫度感測元件22‧‧‧Temperature sensing components
221‧‧‧接觸面221‧‧‧Contact surface
3‧‧‧測試電路板3‧‧‧Test circuit board
31‧‧‧訊號傳輸部31‧‧‧Signal Transmission Department
4‧‧‧測試插座4‧‧‧Test socket
41‧‧‧絕緣座體41‧‧‧Insulated body
411‧‧‧容置槽411‧‧‧ accommodating slots
412‧‧‧圍繞部412‧‧‧ Surrounding
413‧‧‧貫孔413‧‧‧through holes
42‧‧‧探針42‧‧‧Probe
5‧‧‧待測電子元件5‧‧‧Electronic components to be tested
51‧‧‧本體51‧‧‧Ontology
52‧‧‧導電接觸部52‧‧‧Electrical contact
6‧‧‧烘箱6‧‧‧ oven
本新型之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中：圖1是一側視示意圖，說明習知對複數待測電子元件進行溫度測試時的狀態；圖2是一側視圖，說明本新型的具有一溫度感測裝置的溫度感測系統之一較佳實施例；圖3是一正視圖，說明本新型的溫度感測裝置之一較佳實施例；圖4是一正視圖，說明該溫度感測系統的一測試電路板及複數測試插座；圖5是一側視分解圖，說明該測試電路板、該測試插座及其複數探針、一待測電子元件及該溫度感測裝置在裝設之前的態樣；及圖6是一側視圖，說明該測試電路板、該測試插座及 該等探針、一待測電子元件及該溫度感測裝置在裝設之後的態樣。Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is a side elevational view showing the state of conventionally performing temperature testing of a plurality of electronic components to be tested; Is a side view illustrating a preferred embodiment of the temperature sensing system of the present invention having a temperature sensing device; and FIG. 3 is a front elevational view showing a preferred embodiment of the temperature sensing device of the present invention; 4 is a front view illustrating a test circuit board and a plurality of test sockets of the temperature sensing system; FIG. 5 is a side exploded view showing the test circuit board, the test socket and its plurality of probes, and an electron to be tested The component and the temperature sensing device before the installation; and FIG. 6 is a side view illustrating the test circuit board, the test socket and The probes, an electronic component to be tested, and the temperature sensing device are mounted.
參閱圖2、圖3與圖5，本新型溫度感測裝置2之一較佳實施例，適用於複數個待測電子元件5的溫度測試，該等待測電子元件5可為封裝元件、頻率元件、邏輯元件、開關元件、增益元件或其他類型的電子元件。較佳地，該等待測電子元件5為石英晶體振盪器。該溫度感測裝置2之較佳實施例包含一電路基板21及複數個溫度感測元件22。Referring to FIG. 2, FIG. 3 and FIG. 5, a preferred embodiment of the temperature sensing device 2 is applicable to temperature testing of a plurality of electronic components to be tested 5, which may be package components and frequency components. , logic elements, switching elements, gain elements or other types of electronic components. Preferably, the standby electronic component 5 is a quartz crystal oscillator. The preferred embodiment of the temperature sensing device 2 includes a circuit substrate 21 and a plurality of temperature sensing elements 22.
該電路基板21具有一訊號傳輸部211，供用以將該等溫度感測元件22所產生的訊號傳送至一與該訊號傳輸部211電連接的處理器(圖未示)，藉此該處理器可進一步分析該等訊號並將之換算為所代表的溫度，俾以用來監測該等待測電子元件5的溫度。The circuit board 21 has a signal transmission unit 211 for transmitting signals generated by the temperature sensing elements 22 to a processor (not shown) electrically connected to the signal transmission unit 211, whereby the processor The signals can be further analyzed and converted to the temperature represented to monitor the temperature of the electronic component 5 to be monitored.
該等溫度感測元件22設置且電連接於該電路基板21上。該等溫度感測元件22是石英晶體溫度感測器，且可供用於接觸地感測該等相對應的待測電子元件5的溫度。較佳地，每一溫度感測元件22具有一可抵接於該相對應的待測電子元件5的接觸面221(如圖5所示)。當該等溫度感測元件22的接觸面221與該等待電子元件5抵接時，該等溫度感測元件22所產生的訊號是藉由該電路基板21上的電路佈線(圖未示)匯流至該訊號傳輸部211，繼而傳送至與該訊號傳輸部211電連接的處理器(圖未示)。The temperature sensing elements 22 are disposed and electrically connected to the circuit substrate 21. The temperature sensing elements 22 are quartz crystal temperature sensors and are available for sensing to sense the temperatures of the corresponding electronic components 5 to be tested. Preferably, each of the temperature sensing elements 22 has a contact surface 221 (shown in FIG. 5) that can abut against the corresponding electronic component 5 to be tested. When the contact surface 221 of the temperature sensing element 22 abuts the waiting electronic component 5, the signals generated by the temperature sensing components 22 are converged by circuit wiring (not shown) on the circuit substrate 21. The signal transmission unit 211 is then transmitted to a processor (not shown) that is electrically connected to the signal transmission unit 211.
在本較佳實施例中，該等溫度感測元件22是石英晶體溫度感測器，但不以此為限，該等溫度感測元件22也可以是熱電阻溫度感測器、熱電偶溫度感測器或半導體溫度感測器。In the preferred embodiment, the temperature sensing elements 22 are quartz crystal temperature sensors, but not limited thereto. The temperature sensing elements 22 may also be thermal resistance temperature sensors and thermocouple temperatures. Sensor or semiconductor temperature sensor.
當該等石英晶體溫度感測器與該等待測電子元件5(例如石英晶體振盪器)接觸時，該等石英晶體溫度感測器會藉由溫度變化而產生相對應的頻率訊號，由此所產生的頻率訊號可進一步經由該電路基板21而傳送至一處理器(圖未示)來進行分析。特別地，該等石英晶體溫度感測器所產生的頻率訊號與所代表的溫度通常是呈一多次方程式的對應關係，因此藉由分析該等頻率訊號所分別對應到的溫度，即可得到該等待測電子元件5的溫度。而不同的石英晶體溫度感測器具有不同的溫度解析度以及溫度感測範圍，因此可依據所欲的溫度解析度(例如溫度解析度達0.1℃以下)以及溫度感測範圍(例如目標溫度為-55至125℃)來選用適合的石英晶體溫度感測器。When the quartz crystal temperature sensors are in contact with the standby electronic component 5 (for example, a quartz crystal oscillator), the quartz crystal temperature sensors generate corresponding frequency signals by temperature changes, thereby The generated frequency signal can be further transmitted to the processor (not shown) via the circuit substrate 21 for analysis. In particular, the frequency signals generated by the quartz crystal temperature sensors are usually in a plurality of equations corresponding to the temperature represented by the plurality of equations. Therefore, by analyzing the temperatures corresponding to the frequency signals, respectively, This waits for the temperature of the electronic component 5. Different quartz crystal temperature sensors have different temperature resolutions and temperature sensing ranges, so they can be based on the desired temperature resolution (for example, temperature resolution below 0.1 ° C) and temperature sensing range (for example, the target temperature is -55 to 125 ° C) to choose the appropriate quartz crystal temperature sensor.
參閱圖2、圖3、圖4及圖5，本新型溫度感測系統之一較佳實施例，適用於複數個待測電子元件5的溫度測試。每一待測電子元件5具有一本體51，及複數個設置於該本體51底面且彼此相間隔的導電接觸部52，本實施例的各導電接觸部52是以金屬墊作為例示說明。該溫度感測系統之較佳實施例包含一烘箱6、複數個測試電路板3、複數個測試插座4，及複數個如上所述的溫度感測裝置2。Referring to FIG. 2, FIG. 3, FIG. 4 and FIG. 5, a preferred embodiment of the novel temperature sensing system is applicable to temperature testing of a plurality of electronic components to be tested 5. Each of the electronic components 5 to be tested has a body 51 and a plurality of conductive contacts 52 disposed on the bottom surface of the body 51 and spaced apart from each other. The conductive contacts 52 of the present embodiment are exemplified by metal pads. A preferred embodiment of the temperature sensing system includes an oven 6, a plurality of test circuit boards 3, a plurality of test sockets 4, and a plurality of temperature sensing devices 2 as described above.
該等測試電路板3置放於該烘箱6之中。每一 測試電路板3具有一訊號傳輸部31，該訊號傳輸部31可進一步與一處理器(圖未示)電連接，藉此該處理器可用於監控與評估該等待測電子元件5在一目標溫度下是否具有正常作用。The test boards 3 are placed in the oven 6. Each The test circuit board 3 has a signal transmission unit 31. The signal transmission unit 31 can be further electrically connected to a processor (not shown), whereby the processor can be used to monitor and evaluate the electronic component 5 at a target temperature. Does it have a normal effect?
該等測試插座4設置於該等測試電路板3上。每一測試插座4包括一絕緣座體41，及複數個穿設該絕緣座體41的探針42。該絕緣座體41具有一供該相對應的待測電子元件5容置的容置槽411、一界定出該容置槽411的圍繞部412，及複數個與該容置槽411相連通且供該等探針42穿設的貫孔413。各該探針42的底端焊接於該測試電路板3，各該探針42的頂端抵接於相對應的待測電子元件5的該等導電接觸部52，藉此各該探針42電性連接於該測試電路板3以及該相對應的待測電子元件5的該等導電接觸部52之間。該等探針42可將待測電子元件5的輸出訊號進一步經由該等測試電路板3的訊號傳輸部31而傳送至一處理器(圖未示)。The test sockets 4 are disposed on the test circuit boards 3. Each test socket 4 includes an insulating base 41 and a plurality of probes 42 that pass through the insulating base 41. The insulating base 41 has a receiving groove 411 for receiving the corresponding electronic component 5 to be tested, a surrounding portion 412 defining the receiving groove 411, and a plurality of communicating with the receiving groove 411. A through hole 413 is provided for the probes 42 to pass through. The bottom end of each of the probes 42 is soldered to the test circuit board 3, and the top end of each of the probes 42 abuts against the corresponding conductive contacts 52 of the electronic component 5 to be tested, whereby the probes 42 are electrically The connection between the test circuit board 3 and the corresponding conductive contacts 52 of the corresponding electronic component 5 to be tested is connected. The probes 42 can further transmit the output signals of the electronic component 5 to be tested to the processor (not shown) via the signal transmitting portion 31 of the test circuit board 3.
每一溫度感測裝置2包含一電路基板21，及複數設置且電連接於該電路基板21上的溫度感測元件22。該等溫度感測元件22是石英晶體溫度感測器，且可供用於接觸地感測該等相對應的待測電子元件5的溫度。該電路基板21及該等溫度感測元件22具有如上面所述的構造與作用。Each temperature sensing device 2 includes a circuit substrate 21 and a temperature sensing element 22 disposed in plurality and electrically connected to the circuit substrate 21. The temperature sensing elements 22 are quartz crystal temperature sensors and are available for sensing to sense the temperatures of the corresponding electronic components 5 to be tested. The circuit substrate 21 and the temperature sensing elements 22 have the configuration and function as described above.
參閱圖6，當該待測電子元件5裝設於該測試插座41上時，該等探針42電連接於該測試電路板3及該等 導電接觸部52之間，之後藉由該溫度感測裝置2的溫度感測元件22抵接於該相對應的待測電子元件5，因而可用以測量出該相對應的待測電子元件5的溫度。Referring to FIG. 6, when the electronic component 5 to be tested is mounted on the test socket 41, the probes 42 are electrically connected to the test circuit board 3 and the like. Between the conductive contacts 52, the temperature sensing component 22 of the temperature sensing device 2 is then abutted against the corresponding electronic component 5 to be tested, and thus can be used to measure the corresponding electronic component 5 to be tested. temperature.
特別一提的是，該電路基板21上的該等溫度感測元件22與該測試電路板3上的該等測試插座4之數量與排列位置彼此相對應(如圖3與圖4所示)，但其數量與排列位置不以本實施例為限，本領域中熟習此技藝者可依據其專業素養與需求來調整該等溫度感測元件22與該等測試插座4的數量與排列位置。In particular, the number and arrangement positions of the temperature sensing elements 22 on the circuit substrate 21 and the test sockets 4 on the test circuit board 3 correspond to each other (as shown in FIGS. 3 and 4). However, the number and arrangement positions are not limited to the embodiment. Those skilled in the art can adjust the number and arrangement positions of the temperature sensing elements 22 and the test sockets 4 according to their professional literacy and needs.
在本較佳實施例中，該等測試插座4是各自獨立地設置於該相對應的測試電路板3上。然而，該等測試插座4的設置方式並不以此為限，另外還可以利用多個測試插座4彼此相連接或者一體成型的方式來進行設置，例如：該等測試插座4的絕緣座體41可以是以彼此相連接或者是以一體成型的方式而形成一長條狀的測試插座單元(圖未示)，該長條狀的測試插座單元上形成有多個彼此相間隔且可供該等待測電子元件容置的容置槽(圖未示)，而該等探針的設置方式與上面所述者相同(圖未示)。In the preferred embodiment, the test sockets 4 are independently disposed on the corresponding test circuit board 3. However, the manner in which the test sockets 4 are disposed is not limited thereto, and the plurality of test sockets 4 may be connected to each other or integrally formed, for example, the insulating base 41 of the test sockets 4 The test socket unit (not shown) may be formed by being connected to each other or integrally formed, and the plurality of test socket units are formed with a plurality of intervals spaced apart from each other and available for waiting The accommodating slots (not shown) in which the electronic components are accommodated are disposed, and the probes are disposed in the same manner as described above (not shown).
綜上所述，藉由設置且電連接於該電路基板21上的該等溫度感測元件22，該等相對應的待測電子元件5可分別被進行測量，因而可在溫度測試的過程中精準地得到該等待測電子元件5的溫度值，故確實能達成本新型之目的。In summary, the corresponding electronic components 5 to be tested can be separately measured by the temperature sensing elements 22 disposed on the circuit substrate 21, and thus can be measured during the temperature test. The temperature value of the electronic component 5 to be measured is accurately obtained, so that the object of the present invention can be achieved.
惟以上所述者，僅為本新型之較佳實施例而已， 當不能以此限定本新型實施之範圍，即大凡依本新型申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾皆仍屬本新型專利涵蓋之範圍內。However, the above is only the preferred embodiment of the present invention. The scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made in accordance with the scope of the present patent application and the contents of the patent specification are still within the scope of the present patent.
2‧‧‧溫度感測裝置2‧‧‧Temperature sensing device
21‧‧‧電路基板21‧‧‧ circuit board
22‧‧‧溫度感測元件22‧‧‧Temperature sensing components
3‧‧‧測試電路板3‧‧‧Test circuit board
4‧‧‧測試插座4‧‧‧Test socket
5‧‧‧待測電子元件5‧‧‧Electronic components to be tested
6‧‧‧烘箱6‧‧‧ oven
Claims (3)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103210127U TWM487432U (en) | 2014-06-09 | 2014-06-09 | Temperature sensing system having a plurality of quartz crystal temperature sensors and temperature-sensing apparatus |
| CN201420353096.5U CN203949741U (en) | 2014-06-09 | 2014-06-27 | Temperature sensing system with quartz crystal temperature sensor and temperature sensing device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103210127U TWM487432U (en) | 2014-06-09 | 2014-06-09 | Temperature sensing system having a plurality of quartz crystal temperature sensors and temperature-sensing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM487432U true TWM487432U (en) | 2014-10-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103210127U TWM487432U (en) | 2014-06-09 | 2014-06-09 | Temperature sensing system having a plurality of quartz crystal temperature sensors and temperature-sensing apparatus |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203949741U (en) |
| TW (1) | TWM487432U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109828151A (en) * | 2019-03-07 | 2019-05-31 | 李德成 | A kind of quartz clock twin crystal vibration temperature compensation calibration method |
| CN115902498B (en) * | 2023-01-03 | 2023-05-16 | 天津伍嘉联创科技发展股份有限公司 | Quartz crystal temperature characteristic tester |
-
2014
- 2014-06-09 TW TW103210127U patent/TWM487432U/en not_active IP Right Cessation
- 2014-06-27 CN CN201420353096.5U patent/CN203949741U/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN203949741U (en) | 2014-11-19 |
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