TWI437216B - Thermal transmitter and thermal detecting system - Google Patents
Thermal transmitter and thermal detecting system Download PDFInfo
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- TWI437216B TWI437216B TW99134639A TW99134639A TWI437216B TW I437216 B TWI437216 B TW I437216B TW 99134639 A TW99134639 A TW 99134639A TW 99134639 A TW99134639 A TW 99134639A TW I437216 B TWI437216 B TW I437216B
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Description
本發明係關於一種溫度感測器，特別是指數位式的溫度傳訊器。The invention relates to a temperature sensor, in particular an index-type temperature transmitter.
習知溫度偵測器依量測原理分為膨脹式、電阻式、熱電偶式及熱敏電阻式等，分別運用在不同量測領域，例如偵測下水道的水管溫度、空調設備的冷卻水溫度、原料輸送管線的液體溫度或漁塭養殖業的水溫等。Conventional temperature detectors are classified into expansion, resistance, thermocouple and thermistor according to the measurement principle, which are used in different measurement fields, such as detecting the water temperature of the sewer and the cooling water temperature of the air conditioning equipment. The liquid temperature of the raw material transfer line or the water temperature of the fish farming industry.
其中，膨脹式溫度偵測器例如雙金屬溫度計或填充式溫度計，分別為利用金屬或液體在不同溫度下具有不同的體積，以體積大小來取得量測溫度；而電阻式溫度偵測器是利用金屬材質因溫度變化而產生電阻的變化，由電阻的變化取得量測溫度；熱電偶式溫度偵測器則是使用兩種不同材質接點受熱時會產生電壓信號，當所量測的溫度產生變化時，熱電偶溫度偵測器會發生電壓變化，藉以取得量測溫度；而熱敏電阻式溫度偵測器則是利用半導體其電阻值因溫度上升而下降，由電阻值變化可量測到微小的溫度變化。Wherein, the expansion type temperature detectors, such as bimetal thermometers or filled thermometers, respectively use different volumes of metal or liquid at different temperatures to obtain the measured temperature by volume; and the resistive temperature detector utilizes The metal material changes in resistance due to temperature changes, and the temperature is measured by the change of the resistance; the thermocouple type temperature detector generates a voltage signal when the two different materials are heated, when the measured temperature is generated. When changing, the thermocouple temperature detector will change voltage to obtain the measured temperature; while the thermistor type temperature detector uses the semiconductor whose resistance value decreases due to temperature rise, and can be measured by the change of the resistance value. Minor temperature changes.
無論是電阻式或膨脹式溫度偵測器，其溫度的量測皆以類比訊號取得，因此，具有量測反應慢及不夠精準的缺點。Whether it is a resistive or expansion type temperature detector, the temperature measurement is obtained by analog signals, so it has the disadvantage of slow measurement response and insufficient accuracy.
本發明提供一種溫度傳訊器，以數位式訊號輸出待測物的溫度，可提升量測的精準度，減少量測誤差，並達到快速地取得量測溫度。The invention provides a temperature transmitter, which outputs the temperature of the object to be tested by the digital signal, can improve the precision of the measurement, reduce the measurement error, and achieve the rapid measurement temperature.
為了達成上述目的，根據本發明的其中一項技術方案，提供一種溫度傳訊器，用以量測一待測物，溫度傳訊器包括一殼體及一數位溫度偵測模組，其中殼體具有一密閉空間，數位溫度偵測模組設置在此密閉空間內，藉由數位溫度偵測模組偵測殼體外部的溫度，感測一數位溫度訊號，並將此數位溫度訊號經過處理後輸出一溫度偵測訊號。藉此，達到快速並精確地量測待測溫度的效果。In order to achieve the above object, according to one of the technical solutions of the present invention, a temperature transmitter is provided for measuring a test object, and the temperature transmitter includes a casing and a digital temperature detecting module, wherein the casing has In a confined space, the digital temperature detecting module is disposed in the sealed space, and the digital temperature detecting module detects the temperature outside the casing, senses a digital temperature signal, and processes the digital temperature signal to output A temperature detection signal. Thereby, the effect of measuring the temperature to be measured quickly and accurately is achieved.
所述的數位溫度偵測模組包括一數位溫度偵測晶片、一第一訊號傳輸介面及一訊號處理單元。其中，數位溫度偵測晶片用以偵測殼體外部的溫度，並根據偵測結果輸出上述之數位溫度訊號；訊號處理單元分別與數位溫度偵測晶片及第一訊號傳輸介面電性連接，訊號處理單元用以根據數位溫度訊號產生上述之溫度偵測訊號，並透過第一訊號傳輸介面輸出溫度偵測訊號。The digital temperature detecting module comprises a digital temperature detecting chip, a first signal transmission interface and a signal processing unit. The digital temperature detecting chip is configured to detect the temperature outside the casing, and output the digital temperature signal according to the detection result; the signal processing unit is electrically connected to the digital temperature detecting chip and the first signal transmission interface, respectively. The processing unit is configured to generate the temperature detection signal according to the digital temperature signal and output the temperature detection signal through the first signal transmission interface.
此外，上述之殼體包括一上殼體及一下殼體，下殼體可為一金屬導熱鞘管或一金屬導熱盤，用以傳導熱能並保護數位溫度偵測晶片。In addition, the housing includes an upper housing and a lower housing. The lower housing can be a metal heat conducting sheath or a metal thermal pad for conducting thermal energy and protecting the digital temperature detecting wafer.
為了達成上述目的，根據本發明的另一項技術方案，提供一種溫度監測系統，用以監測複數區域的待測溫度，此溫度監測系統包括複數上述之溫度傳訊器及一主機，其中，主機與多個溫度傳訊器可互相通訊來取得不同區域的待測溫度。In order to achieve the above object, according to another aspect of the present invention, a temperature monitoring system is provided for monitoring a temperature to be measured in a plurality of regions, the temperature monitoring system includes a plurality of the temperature transmitters and a host, wherein the host and the host Multiple temperature transmitters can communicate with each other to obtain the temperature to be measured in different areas.
所述的多個溫度傳訊器用以分別偵測多個區域的待測溫度，並根據偵測結果輸出溫度偵測訊號；主機包括一第二訊號傳輸介面，此第二訊號傳輸介面用以接收來自多個溫度傳訊器的第一訊號傳輸介面之多個溫度偵測訊號。The plurality of temperature transmitters are configured to respectively detect the temperature to be tested in the plurality of regions, and output a temperature detection signal according to the detection result; the host includes a second signal transmission interface, and the second signal transmission interface is configured to receive the A plurality of temperature detection signals of the first signal transmission interface of the plurality of temperature transmitters.
所述的主機根據多個溫度偵測訊號顯示一溫度監測資訊，當多個溫度傳訊器中的一個輸出一異常訊號時，主機輸出一控制訊號至一電氣負載，以控制此電氣負載執行一溫度控制程序，以調整多個區域的待測溫度。The host displays a temperature monitoring information according to the plurality of temperature detecting signals. When one of the plurality of temperature transmitters outputs an abnormal signal, the host outputs a control signal to an electrical load to control the electrical load to perform a temperature. Control the program to adjust the temperature to be measured in multiple areas.
關於本發明之技術手段的詳細說明，請參閱以下的實施方式，並配合所附圖式一併參照。For a detailed description of the technical means of the present invention, refer to the following embodiments, and refer to the accompanying drawings.
本發明係為了讓使用者更精確地且快速地得知待測物的待測溫度，而提供一種數位式的溫度傳訊器，以下將配合圖式分別說明本發明之溫度傳訊器及利用此溫度傳訊器的溫度監測系統的實施方式及其原理。The present invention provides a digital temperature transmitter for the user to know the temperature of the object to be tested more accurately and quickly, and the temperature transmitter of the present invention will be separately described with reference to the drawings. The implementation of the temperature monitoring system of the transmitter and its principles.
請參考第一A圖，第一A圖顯示了本發明的一種溫度傳訊器的第一實施例的示意圖。如第一A圖所示，待測物為水管2，溫度傳訊器1可與水管2互相接合，藉由溫度傳訊器1量測水管2內的液體溫度，以供使用者參考。Please refer to FIG. 1A, which shows a schematic diagram of a first embodiment of a temperature transmitter of the present invention. As shown in FIG. A, the object to be tested is the water pipe 2, and the temperature transmitter 1 can be engaged with the water pipe 2, and the temperature of the liquid in the water pipe 2 is measured by the temperature transmitter 1 for reference by the user.
其中，溫度傳訊器1包括一殼體10及一數位溫度偵測模組(圖未示)，殼體10包括一上殼體13及一下殼體11，上殼體13與下殼體11形成一密閉空間，數位溫度偵測模組設置在此密閉空間內；水管2包括一凹槽21，凹槽21用以容置下殼體11，同時保護殼體10不受外部壓力壓迫及化學物質腐蝕。The temperature transmitter 1 includes a housing 10 and a digital temperature detecting module (not shown). The housing 10 includes an upper housing 13 and a lower housing 11. The upper housing 13 and the lower housing 11 are formed. a sealed space, the digital temperature detecting module is disposed in the sealed space; the water pipe 2 includes a recess 21 for receiving the lower casing 11 while protecting the casing 10 from external pressure and chemicals corrosion.
在本實施例中，下殼體11為一金屬導熱鞘管，其材料 可為鋁、銅或不繡鋼等剛性材質，以保護數位溫度偵測模組中的數位溫度偵測晶片(圖未示)，下殼體11的外觀近似一探針。殼體10具有一開口端111及一密封端113，在開口端111設置有一鎖固單元12，此鎖固單元12與凹槽21互相鎖合；密封端113與凹槽21抵觸。In this embodiment, the lower casing 11 is a metal heat conducting sheath tube, and the material thereof It can be a rigid material such as aluminum, copper or stainless steel to protect the digital temperature detecting chip (not shown) in the digital temperature detecting module, and the lower casing 11 has a similar appearance to a probe. The housing 10 has an open end 111 and a sealing end 113. A locking unit 12 is disposed at the open end 111. The locking unit 12 and the recess 21 are interlocked with each other; and the sealing end 113 is in contact with the recess 21.
實際實施時，鎖固單元12可為一中空的六腳雙牙固定螺栓，包括一上螺紋121及一下螺蚊123，其中，上螺紋121與上殼體13接合，下螺紋123與凹槽21接合，同時，在上殼體13具有一第一螺母135與上螺紋121相對應，而凹槽21具有一第二螺母211與下螺紋123相對應。本發明的鎖固單元12的結構不限於此，其他可分別與上殼體13及凹槽21互相鎖合的結構皆可以作為鎖固單元12。In actual implementation, the locking unit 12 can be a hollow six-legged double-fixing bolt, including an upper thread 121 and a lower screw 123, wherein the upper thread 121 is engaged with the upper casing 13, and the lower thread 123 and the groove 21 At the same time, the upper housing 13 has a first nut 135 corresponding to the upper thread 121, and the recess 21 has a second nut 211 corresponding to the lower thread 123. The structure of the locking unit 12 of the present invention is not limited thereto, and other structures that can be interlocked with the upper casing 13 and the recess 21 respectively can be used as the locking unit 12.
本發明的技術特點在於，溫度傳訊器1具有數位溫度偵測晶片設置在下殼體11內，用以偵測水管2內的溫度，並根據偵測結果輸出一數位溫度訊號，透過一訊號傳輸線152傳輸此數位溫度訊號至一訊號處理單元(圖未示)。其中，訊號傳輸線152是穿過中空的鎖固單元12來連接數位溫度偵測晶片與訊號處理單元，訊號處理單元設置在一電路板17上，而電路板17是設置在上殼體13內。在一實施例中，數位溫度偵測晶片與訊號處理單元之間的傳輸協定為內部整合電路(Inner Integrate Circuit,I2C)的通訊協定，也就是數位溫度偵測晶片與訊號處理單元之間是透過兩條訊號傳輸線152來互相溝通。The technical feature of the present invention is that the temperature transmitter 1 has a digital temperature detecting chip disposed in the lower casing 11 for detecting the temperature in the water pipe 2, and outputting a digital temperature signal according to the detection result through a signal transmission line 152. The digital temperature signal is transmitted to a signal processing unit (not shown). The signal transmission line 152 is connected to the digital temperature detecting chip and the signal processing unit through the hollow locking unit 12. The signal processing unit is disposed on a circuit board 17, and the circuit board 17 is disposed in the upper casing 13. In one embodiment, the transmission protocol between the digital temperature detecting chip and the signal processing unit is a communication protocol of an Inner Integrate Circuit (I2C), that is, a digital temperature detecting chip and a signal processing unit are transmitted through Two signal transmission lines 152 communicate with each other.
在本實施例中，上殼體13包括一蓋板131及一本體133，其中，電路板17透過螺絲(圖未示)或黏膠(圖未示)固定地設置在本體133內側；第一螺母135設置在本體133下緣 的內側，本體133的上緣與蓋板131互相接合，蓋板131用以防止外部灰塵或雨水進入本體133內而損壞電路板17上的電子元件。本體133上設置有一連接部137，用以讓電路板17的輸出訊號傳輸線(圖未示)通過。In this embodiment, the upper casing 13 includes a cover plate 131 and a body 133, wherein the circuit board 17 is fixedly disposed inside the body 133 via a screw (not shown) or an adhesive (not shown); The nut 135 is disposed at the lower edge of the body 133 On the inner side, the upper edge of the body 133 and the cover plate 131 are engaged with each other, and the cover plate 131 is for preventing external dust or rain from entering the body 133 to damage the electronic components on the circuit board 17. The body 133 is provided with a connecting portion 137 for allowing the output signal transmission line (not shown) of the circuit board 17 to pass.
此外，為了使下殼體11的密封端113與凹槽21的內側壁確實地抵觸，實際實施時，位於下殼體11的開口端111與鎖固單元12之間設置有一接觸調節器元件(圖未示)，此接觸調節器元件用以使下殼體11的開口端111在鎖固單元12內可小範圍地伸縮，舉例來說，接觸調節器元件可為彈簧等彈性元件。也就是說，下殼體11與鎖固單元12是活動地接合，上殼體13與鎖固單元12是固定地接合，藉此，以適應不同深度的凹槽21，讓下殼體11的密封端113牢固地與凹槽21底部牢固地接觸。In addition, in order to make the sealing end 113 of the lower casing 11 and the inner side wall of the groove 21 reliably interfere with each other, in practice, a contact adjuster element is disposed between the open end 111 of the lower casing 11 and the locking unit 12 ( The contact adjuster element is used to allow the open end 111 of the lower housing 11 to be telescoped in a small range within the locking unit 12. For example, the contact adjuster element can be an elastic element such as a spring. That is, the lower housing 11 is movably engaged with the locking unit 12, and the upper housing 13 is fixedly engaged with the locking unit 12, thereby accommodating the grooves 21 of different depths, allowing the lower housing 11 to The sealing end 113 is firmly in firm contact with the bottom of the recess 21.
接著，請配合參考第一B圖，為本發明的一種溫度傳訊器的第一實施例的內部部分示意圖。如第一B圖所示，下殼體11的密封端113內設置有上述之數位溫度偵測晶片151，在數位溫度偵測晶片151外部設有一絕緣層141，此絕緣層141用以隔絕數位溫度偵測晶片151與下殼體11，避免數位溫度偵測晶片151與具有導電性的殼體10內側壁互相電性導通，而影響數位溫度偵測晶片151偵測的精確度。實際實施時，此絕緣層141可為一熱縮套管，具有特定的熱膨脹係數，可緊密地包覆住數位溫度偵測晶片151。Next, please refer to the first B diagram, which is a schematic diagram of the internal part of the first embodiment of the temperature transmitter of the present invention. As shown in FIG. B, the digital temperature detecting wafer 151 is disposed in the sealing end 113 of the lower casing 11, and an insulating layer 141 is disposed outside the digital temperature detecting wafer 151. The insulating layer 141 is used to isolate the digital position. The temperature detecting chip 151 and the lower casing 11 prevent the digital temperature detecting chip 151 from electrically conducting with the inner side wall of the conductive housing 10, thereby affecting the accuracy of the digital temperature detecting wafer 151 detection. In actual implementation, the insulating layer 141 can be a heat shrinkable sleeve having a specific coefficient of thermal expansion to closely cover the digital temperature detecting wafer 151.
此外，下殼體11內還包括一導熱層143，此導熱層143填充滿下殼體11的內側壁，並包覆住絕緣層141以及與數位溫度偵測晶片151連接的訊號傳輸線152。此導熱層143 用以均勻地傳導下殼體11的金屬殼體上所具有的熱能，使數位溫度偵測晶片151所偵測的溫度更為準確。實際實施時，此導熱層143的材質可為氧化鎂粉等熱傳導性佳的化合物。In addition, the lower casing 11 further includes a heat conducting layer 143 which fills the inner sidewall of the casing 11 and covers the insulating layer 141 and the signal transmission line 152 connected to the digital temperature detecting wafer 151. This heat conductive layer 143 The heat energy on the metal casing for uniformly conducting the lower casing 11 makes the temperature detected by the digital temperature detecting wafer 151 more accurate. In actual implementation, the material of the heat conductive layer 143 may be a compound having good thermal conductivity such as magnesium oxide powder.
在本實施例中，在下殼體11的開口端111內側具有一防水層145，此防水層145用以封住下殼體11的開口端111，來預防殼體10外部的水滲透進下殼體11內，或是因殼體10內外溫度差過大而造成下殼體11內部結露，而影響數位溫度偵測晶片151的偵測。實際實施時，防水層145可為一環氧樹脂等塑膠材料。In the present embodiment, a waterproof layer 145 is disposed inside the open end 111 of the lower casing 11, and the waterproof layer 145 is used to seal the open end 111 of the lower casing 11 to prevent water outside the casing 10 from penetrating into the lower casing. In the body 11, the condensation inside the lower casing 11 is caused by the temperature difference between the inside and the outside of the casing 10, which affects the detection of the digital temperature detecting wafer 151. In actual implementation, the waterproof layer 145 may be a plastic material such as an epoxy resin.
請參考第二圖，第二圖顯示了本發明的一種溫度傳訊器的第二實施例的示意圖。如第二圖所示，溫度傳訊器1'與第一實施例的溫度傳訊器1大致相同，其差異在於，第二實施例的殼體10'所包括的下殼體11'為一金屬導熱盤，由上殼體13'與下殼體11'互相鎖合或接合以形成一密閉空間，而此密閉空間內不需填充任何絕緣層或導熱層；溫度傳訊器1'可設置在室內之天花板或電器產品，或室外溫度量測站等，溫度傳訊器1'用以偵測周圍環境的氣體溫度，例如室內或室外的氣體溫度等。另一個差異在於，電路板17'是設置在下殼體11'內側底部，而數位溫度偵測模組15設置在電路板17'上。Please refer to the second figure, which shows a schematic view of a second embodiment of a temperature transmitter of the present invention. As shown in the second figure, the temperature transmitter 1' is substantially the same as the temperature transmitter 1 of the first embodiment, with the difference that the lower casing 11' included in the casing 10' of the second embodiment is a metal heat conduction. The disk is interlocked or joined with the upper casing 13' and the lower casing 11' to form a sealed space, and the sealed space does not need to be filled with any insulating layer or heat conductive layer; the temperature transmitter 1' can be disposed indoors. The ceiling or electrical product, or an outdoor temperature measuring station, etc., the temperature transmitter 1' is used to detect the temperature of the surrounding environment, such as indoor or outdoor gas temperature. Another difference is that the circuit board 17' is disposed at the inner bottom of the lower casing 11', and the digital temperature detecting module 15 is disposed on the circuit board 17'.
在本實施例中，電路板17'透過一導熱膠147固定在下殼體11'內側底部，導熱膠147同時用以均勻地傳導下殼體11'所具有的熱能。另外，電路板17'還可透過螺絲(圖未示)來與下殼體11'鎖合，以固定地設置在下殼體11'內，預防電路板17'脫落後，造成數位溫度偵測模組15因碰撞而損壞。In the present embodiment, the circuit board 17' is fixed to the inner bottom of the lower casing 11' through a thermal conductive adhesive 147, and the thermal conductive adhesive 147 is simultaneously used to uniformly conduct the thermal energy of the lower casing 11'. In addition, the circuit board 17' can also be locked with the lower casing 11' by screws (not shown) to be fixedly disposed in the lower casing 11' to prevent the digital board from being broken after the circuit board 17' is detached. Group 15 was damaged by the collision.
接下來將說明溫度傳訊器的第一實施例與第二實施例中的數位溫度偵測模組的操作原理。請參考第三圖，為本發明的溫度傳訊器的數位溫度偵測模組的第一實施例之功能方塊圖。如第三圖所示，數位溫度偵測模組15a包括訊號處理單元150、數位溫度偵測晶片151、一第一訊號傳輸介面153及一記憶單元155。其中，訊號處理單元150分別與數位溫度偵測晶片151、第一訊號傳輸介面153及記憶單元155電性連接。Next, the operation principle of the digital temperature detecting module in the first embodiment of the temperature transmitter and the second embodiment will be explained. Please refer to the third figure, which is a functional block diagram of a first embodiment of the digital temperature detecting module of the temperature transmitter of the present invention. As shown in the third figure, the digital temperature detecting module 15a includes a signal processing unit 150, a digital temperature detecting chip 151, a first signal transmission interface 153, and a memory unit 155. The signal processing unit 150 is electrically connected to the digital temperature detecting chip 151, the first signal transmission interface 153 and the memory unit 155, respectively.
數位溫度偵測晶片151用以偵測殼體10、10'外部的溫度，並根據偵測結果輸出一數位溫度訊號；訊號處理單元150用以接收此數位溫度訊號，並根據數位溫度訊號產生一溫度偵測訊號，此溫度偵測訊號可單純包含數位溫度訊號，或具有一身份識別碼，其中，此身分識別碼儲存在記憶單元155。當訊號處理單元150定時地輸出溫度偵測訊號同時，將身分識別碼整合在溫度偵測訊號的封包內，透過第一訊號傳輸介面153傳輸至溫度傳訊器1、1'外。The digital temperature detecting chip 151 is configured to detect the temperature outside the housing 10, 10', and output a digital temperature signal according to the detection result; the signal processing unit 150 is configured to receive the digital temperature signal and generate a digital temperature signal according to the digital temperature signal The temperature detection signal may include a digital temperature signal or an identification code, wherein the identity identification code is stored in the memory unit 155. When the signal processing unit 150 periodically outputs the temperature detection signal, the identity identification code is integrated into the packet of the temperature detection signal, and transmitted to the temperature transmitter 1 and 1' through the first signal transmission interface 153.
在本實施例中，記憶單元155還儲存一參考溫度值，當訊號處理單元150接收數位溫度訊號後，將數位溫度訊號與參考溫度值相比較，當數位溫度訊號超過此參考溫度值時，訊號處理單元150透過第一訊號傳輸介面153輸出一異常訊號。實際實施時，此參考溫度值可由使用者設定或為出廠時內建，若由使用者設定，則數位偵測模組15a更包括一顯示單元(圖未示)及一操作單元(圖未示)，以提供使用者設定。而訊號處理單元150可依實際需求參設不同模式，第一種模式為當訊號處理單元150判斷數位溫度訊號高於參考溫度值時，則輸出異常訊號；第二種模式為當訊號處理單元150判斷數位溫度訊號低於參考溫度值時，則輸出異常訊號。In this embodiment, the memory unit 155 further stores a reference temperature value. When the signal processing unit 150 receives the digital temperature signal, the digital temperature signal is compared with the reference temperature value. When the digital temperature signal exceeds the reference temperature value, the signal is The processing unit 150 outputs an abnormal signal through the first signal transmission interface 153. In actual implementation, the reference temperature value can be set by the user or built in the factory. If set by the user, the digital detection module 15a further includes a display unit (not shown) and an operation unit (not shown) ) to provide user settings. The signal processing unit 150 can set different modes according to actual requirements. The first mode is when the signal processing unit 150 determines that the digital temperature signal is higher than the reference temperature value, and then outputs an abnormal signal; the second mode is when the signal processing unit 150 When it is judged that the digital temperature signal is lower than the reference temperature value, an abnormal signal is output.
接著，請參考第四圖，為本發明的溫度監測系統的第一實施例之方塊圖。如第四圖所示，溫度監測系統5包括一主機51及複數個溫度傳訊器1a1 、1a2 至1an ，其中，n為1~256中的任一整數，多個溫度傳訊器1a1 、1a2 至1an 分別設置在不同區域，用以監測多個區域內的待測溫度。且多個溫度傳訊器1a1 、1a2 至1an 串在同一條傳輸線上，並透過此傳輸線與主機51互相通訊。其中，主機51可為一行動式電子裝置、電腦或伺服器。Next, please refer to the fourth figure, which is a block diagram of a first embodiment of the temperature monitoring system of the present invention. As shown in the fourth figure, the temperature monitoring system 5 includes a host 51 and a plurality of temperature transmitters 1a 1 , 1a 2 to 1a n , wherein n is any integer from 1 to 256, and a plurality of temperature transmitters 1a 1 1a 2 to 1a n are respectively disposed in different areas for monitoring the temperature to be measured in a plurality of areas. And the plurality of temperature transmitters 1a 1 , 1a 2 to 1 a n are on the same transmission line, and communicate with the host 51 through the transmission line. The host 51 can be a mobile electronic device, a computer or a server.
在本實施例中，多個溫度傳訊器1a1 、1a2 至1an 可依實際量測種類配置為溫度傳訊器1或溫度傳訊器1'，即待測溫度為一液體溫度或一氣體溫度。其中，多個溫度傳訊器1a1 、1a2 至1an 分別包括數位溫度偵測模組15a，多個溫度傳訊器1a1 、1a2 至1an 透過個別的第一訊號傳輸介面153與主機51中的第二訊號傳輸介面(圖未示)互相通訊，其中，每一個第一訊號傳輸介面153與第二訊號傳輸介面分別為RS-485或RS-232等有線訊號傳輸介面。在一較佳的實施例中，每一個第一訊號傳輸介面153與第二訊號傳輸介面為RS-485介面，兩者互相進行半雙工傳輸，即一問一答地輪流傳送與接收，藉此，主機51可依序地對多個溫度傳訊器1a1 、1a2 至1an 進行輪詢(polling)。而主機51與多個溫度傳訊器1a1 、1a2 至1an 之間的訊號傳輸協定可為一傳輸控制/網路通訊協定(Transmission Control Protocol/Internet Protocol；TCP/IP)或一儀錶通訊協定(ModBus-RTU)。In this embodiment, the plurality of temperature transmitters 1a 1 , 1a 2 to 1a n can be configured as the temperature transmitter 1 or the temperature transmitter 1 ′ according to the actual measurement type, that is, the temperature to be measured is a liquid temperature or a gas temperature. . The plurality of temperature transmitters 1a 1 , 1a 2 to 1 a n respectively include a digital temperature detecting module 15 a , and the plurality of temperature transmitters 1 a 1 , 1 a 2 to 1 a n pass through the respective first signal transmitting interface 153 and the host 51 The second signal transmission interface (not shown) communicates with each other, wherein each of the first signal transmission interface 153 and the second signal transmission interface are respectively wired signal transmission interfaces such as RS-485 or RS-232. In a preferred embodiment, each of the first signal transmission interface 153 and the second signal transmission interface is an RS-485 interface, and the two perform half-duplex transmission, that is, one-to-one transmission and reception in turn, borrowing Thus, the host 51 can poll the plurality of temperature transmitters 1a 1 , 1a 2 to 1a n sequentially. The signal transmission protocol between the host 51 and the plurality of temperature transmitters 1a 1 , 1a 2 to 1 a n may be a Transmission Control Protocol/Internet Protocol (TCP/IP) or a meter communication protocol. (ModBus-RTU).
舉例來說，主機51透過第二訊號傳輸介面定時地發出一輪詢訊號(Polly signal)至多個溫度傳訊器1a1 、1a2 至1an ，每一個訊號處理單元150接收到輪詢訊號後，輸出溫度偵測訊號至主機51，其中，溫度偵測訊號分別包括多個溫度傳訊器1a1 、1a2 至1an 的其中一個身分識別碼。當多個溫度傳訊器1a1 、1a2 至1an 中的一個訊號處理單元150判斷數位溫度訊號為異常溫度時，則即時輸出異常訊號至主機51，或由多個溫度傳訊器1a1 、1a2 至1an 中偵測到異常溫度的一個發出警示訊號，其中，警示訊號可由設置在多個溫度傳訊器1a1 、1a2 至1an 上的蜂鳴器或喇叭發出。For example, the host 51 periodically sends a polling signal to the plurality of temperature transmitters 1a 1 , 1a 2 to 1 a n through the second signal transmission interface, and each signal processing unit 150 receives the polling signal and outputs the signal. The temperature detection signal is sent to the host 51, wherein the temperature detection signals respectively comprise one of the plurality of temperature transmitters 1a 1 , 1a 2 to 1 a n . When one of the plurality of temperature transmitters 1a 1 , 1a 2 to 1 a n determines that the digital temperature signal is abnormal temperature, the abnormal signal is immediately output to the host 51, or by the plurality of temperature transmitters 1a 1 , 1a A warning signal is detected in the abnormal temperature detected in 2 to 1 a n , wherein the warning signal can be emitted by a buzzer or a horn provided on the plurality of temperature transmitters 1a 1 , 1a 2 to 1 a n .
當主機51接收到異常訊號時，主機51根據發出異常訊號所具有的身分識別碼來判斷發生異常溫度的位置，並輸出一通知訊號至使用者。通知訊號如文字簡訊或語音廣播；或是由主機51輸出一控制訊號至相關的電氣負載執行一溫度控制程序，以控制待測物的周圍溫度，例如控制空調設備的啟動或灑水設備的啟動。When the host 51 receives the abnormal signal, the host 51 determines the location where the abnormal temperature occurs based on the identity identifier of the abnormal signal, and outputs a notification signal to the user. The notification signal is a text message or a voice broadcast; or the host 51 outputs a control signal to the relevant electrical load to execute a temperature control program to control the ambient temperature of the object to be tested, for example, controlling the startup of the air conditioner or the startup of the sprinkler device. .
請參考第五圖，為本發明之數位溫度偵測模組之第二實施例之功能方塊圖，並配合參考六圖，為本發明之溫度監測系統的第二實施例之示意圖。數位溫度偵測模組15b與第一實施例之數位溫度偵測模組15a大致相同，其差異在於，數位溫度偵測模組15b具有一無線傳輸介面153'與訊號處理單元150'電性連接，取代了第一訊號傳輸介面150；另一個差異在於，數位溫度偵測模組15b更包括一定位單元157與訊號處理單元150'電性連接。而數位溫度偵測晶片151'與記憶單元155'的操作原理皆與第一實施例相同。Please refer to FIG. 5 , which is a functional block diagram of a second embodiment of the digital temperature detecting module of the present invention, and with reference to FIG. 6 , is a schematic diagram of a second embodiment of the temperature monitoring system of the present invention. The digital temperature detecting module 15b is substantially the same as the digital temperature detecting module 15a of the first embodiment. The difference is that the digital temperature detecting module 15b has a wireless transmission interface 153' electrically connected to the signal processing unit 150'. The first signal transmission module 15b further includes a positioning unit 157 electrically connected to the signal processing unit 150'. The operation principle of the digital temperature detecting wafer 151' and the memory unit 155' is the same as that of the first embodiment.
在本實施例中，定位單元157可為GPS、GPRS或AGPS等，用以接收一衛星訊號並根據衛星訊號輸出一定位訊號至訊號處理單元150'，訊號處理單元150'輸出溫度偵測訊號時，同時將定位訊號整合在溫度偵測訊號的封包內，透過無線傳輸介面153'無線輸出溫度偵測訊號。In this embodiment, the positioning unit 157 can be GPS, GPRS or AGPS, etc., for receiving a satellite signal and outputting a positioning signal to the signal processing unit 150 ′ according to the satellite signal, and the signal processing unit 150 ′ outputs the temperature detecting signal. At the same time, the positioning signal is integrated into the temperature detecting signal packet, and the temperature detecting signal is wirelessly output through the wireless transmission interface 153'.
溫度監測系統5'與第一實施例的溫度監測系統大致相同，其差異在於，主機51'外接複數個無線傳輸模組53b1 、53b2 至53bm ，多個無線傳輸模組53b1 、53b2 至53bm 與主機51'作有線傳輸，而與多個溫度傳訊器1b1 、1b2 至1bm 作無線傳輸，其中，多個溫度傳訊器1b1 、1b2 至1bm 分別包括數位溫度偵測模組15b。實際實施時，多個無線傳輸模組53b1 、53b2 至53bm 與多個溫度傳訊器1b1 、1b2 至1bm 之間的通訊協定為Zigbee或RF等無線傳輸。其中，m為1~256中的任一個整數，多個無線傳輸模組53b1 、53b2 至53bm 與多個溫度傳訊器1b1 、1b2 至1bm 的個數可相同或不同。The temperature monitoring system 5' is substantially the same as the temperature monitoring system of the first embodiment, except that the host 51' is externally connected to a plurality of wireless transmission modules 53b 1 , 53b 2 to 53b m , and a plurality of wireless transmission modules 53b 1 , 53b 2 to 53b m and the host 51' for wired transmission, and for wireless transmission with a plurality of temperature transmitters 1b 1 , 1b 2 to 1b m , wherein the plurality of temperature transmitters 1b 1 , 1b 2 to 1b m respectively include a digital temperature Detection module 15b. In actual implementation, the communication protocol between the plurality of wireless transmission modules 53b 1 , 53b 2 to 53b m and the plurality of temperature transmitters 1b 1 , 1b 2 to 1b m is wireless transmission such as Zigbee or RF. Wherein, m is any one of 1 to 256, and the number of the plurality of wireless transmission modules 53b 1 , 53b 2 to 53b m and the plurality of temperature transmitters 1b 1 , 1b 2 to 1b m may be the same or different.
多個溫度傳訊器1b1 、1b2 至1bm 中的每一個可選擇地與多個無線傳輸模組53b1 、53b2 至53bm 中最近的一個互相通訊，多個無線傳輸模組53b1 、53b2 至53bm 分別暫時地儲存多個溫度傳訊器1b1 、1b2 至1bm 所輸出的溫度偵測訊號，並當多個無線傳輸模組53b1 、53b2 至53bm 接收到主機51'的輪詢訊號後，將溫度偵測訊號回傳至主機51'。藉此，溫度監測系統5'利用無線傳輸可使多個溫度傳訊器1b1 、1b2 至1bm 設置的位置更加具有彈性，並擴大了溫度偵測的區域範圍。Each of the plurality of temperature transmitters 1b 1 , 1b 2 to 1b m is selectively communicable with a nearest one of the plurality of wireless transmission modules 53b 1 , 53b 2 to 53b m , and the plurality of wireless transmission modules 53b 1 , 53b 2 to 53b m temporarily store the temperature detection signals outputted by the plurality of temperature transmitters 1b 1 , 1b 2 to 1b m respectively , and receive the host when the plurality of wireless transmission modules 53b 1 , 53b 2 to 53b m After the 51' polling signal, the temperature detection signal is transmitted back to the host 51'. Thereby, the temperature monitoring system 5' can make the positions of the plurality of temperature transmitters 1b 1 , 1b 2 to 1b m more flexible by wireless transmission, and expand the range of temperature detection.
綜合上述，已揭露了本發明所提供的溫度傳訊器及具有數位溫度傳訊器之溫度監測系統所使用的技術手段，利用數位溫度偵測晶片量測精確的溫度值後，利用有線或無線的傳輸介面將數位溫度訊號輸出，以提供使用者掌握正確的溫度值。並且利用主機遠端通知或控制電氣負載以排除發生溫度異常的情況，藉此，有效監控多個區域內的待測物的溫度。In summary, the technical means used by the temperature transmitter and the temperature monitoring system with the digital temperature transmitter provided by the present invention have been disclosed, and the accurate temperature value is measured by the digital temperature detecting chip, and then the wired or wireless transmission is utilized. The interface outputs a digital temperature signal to provide the user with the correct temperature value. And the remote end of the host is used to notify or control the electrical load to eliminate the occurrence of temperature abnormality, thereby effectively monitoring the temperature of the object to be tested in the plurality of areas.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
5、5'‧‧‧溫度監測系統5, 5'‧‧‧ Temperature Monitoring System
51、51'‧‧‧主機51, 51'‧‧‧ host
53b1 、53b2 、53bm ‧‧‧無線傳輸模組53b 1 , 53b 2 , 53b m ‧‧‧ wireless transmission module
1、1'、1a1 、1a2 、1an 、1b1 、1b2 、1bm ‧‧‧溫度傳訊器1, 1', 1a 1 , 1a 2 , 1a n , 1b 1 , 1b 2 , 1b m ‧‧ ‧ temperature transmitter
10、10'‧‧‧殼體10, 10'‧‧‧ shell
11、11'‧‧‧下殼體11, 11'‧‧‧ lower casing
111‧‧‧開口端111‧‧‧Open end
113‧‧‧密封端113‧‧‧ Sealed end
13、13'‧‧‧上殼體13, 13'‧‧‧ upper casing
131‧‧‧蓋板131‧‧‧ Cover
133‧‧‧本體133‧‧‧Ontology
135‧‧‧第一螺母135‧‧‧First nut
137‧‧‧連接部137‧‧‧Connecting Department
12‧‧‧鎖固單元12‧‧‧Locking unit
121‧‧‧上螺紋121‧‧‧Threading
123‧‧‧下螺紋123‧‧‧Threading
15、15a、15b‧‧‧數位溫度偵測模組15, 15a, 15b‧‧‧ digital temperature detection module
150、150'‧‧‧訊號處理單元150, 150'‧‧‧ signal processing unit
151、151'‧‧‧數位溫度偵測晶片151, 151'‧‧‧ digital temperature detection wafer
152‧‧‧訊號傳輸線152‧‧‧Signal transmission line
153‧‧‧第一訊號傳輸介面153‧‧‧First signal transmission interface
153'‧‧‧無線傳輸介面153'‧‧‧Wireless transmission interface
155、155'‧‧‧記憶單元155, 155'‧‧‧ memory unit
157‧‧‧定位單元157‧‧‧ Positioning unit
17、17'‧‧‧電路板17, 17'‧‧‧ boards
141‧‧‧絕緣層141‧‧‧Insulation
143‧‧‧導熱層143‧‧‧thermal layer
145‧‧‧防水層145‧‧‧Waterproof layer
147‧‧‧導熱膠147‧‧‧thermal adhesive
2‧‧‧水管2‧‧‧ water pipes
21‧‧‧凹槽21‧‧‧ Groove
211‧‧‧第二螺母211‧‧‧second nut
第一A圖：本發明的一種溫度傳訊器的第一實施例之示意圖；第一B圖：本發明的一種溫度傳訊器的第一實施例之部分示意圖；第二圖：本發明的一種溫度傳訊器的第二實施例之示意圖；第三圖：本發明的一種溫度傳訊器之數位溫度偵測模組的第一實施例之方塊圖；第四圖：本發明的一種溫度監測系統的第一實施例之方塊圖；第五圖：本發明的一種溫度傳訊器之數位溫度偵測模組的第二實施例之方塊圖；及第六圖：本發明的一種溫度監測系統的第二實施例之方塊圖。1A is a schematic view of a first embodiment of a temperature transmitter of the present invention; a first B: a partial schematic view of a first embodiment of a temperature transmitter of the present invention; and a second diagram: a temperature of the present invention A schematic diagram of a second embodiment of a transmitter; a third diagram: a block diagram of a first embodiment of a digital temperature detecting module of a temperature transmitter of the present invention; and a fourth diagram: a temperature monitoring system of the present invention Block diagram of an embodiment; fifth diagram: block diagram of a second embodiment of a digital temperature sensing module of a temperature transmitter of the present invention; and sixth diagram: second embodiment of a temperature monitoring system of the present invention Example block diagram.
1．．．溫度傳訊器1. . . Temperature transmitter
10．．．殼體10. . . case
11．．．下殼體11. . . Lower housing
111．．．開口端111. . . Open end
113．．．密封端113. . . Sealed end
13．．．上殼體13. . . Upper housing
131．．．蓋板131. . . Cover
133．．．本體133. . . Ontology
135．．．第一螺母135. . . First nut
137．．．連接體137. . . Connector
12．．．鎖固單元12. . . Locking unit
121．．．上螺紋121. . . Upper thread
123．．．下螺紋123. . . Lower thread
152．．．訊號傳輸線152. . . Signal transmission line
17．．．電路板17. . . Circuit board
2．．．水管2. . . Water pipe
21．．．凹槽twenty one. . . Groove
211．．．第二螺母211. . . Second nut
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99134639A TWI437216B (en) | 2010-10-11 | 2010-10-11 | Thermal transmitter and thermal detecting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99134639A TWI437216B (en) | 2010-10-11 | 2010-10-11 | Thermal transmitter and thermal detecting system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201215859A TW201215859A (en) | 2012-04-16 |
| TWI437216B true TWI437216B (en) | 2014-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99134639A TWI437216B (en) | 2010-10-11 | 2010-10-11 | Thermal transmitter and thermal detecting system |
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| Country | Link |
|---|---|
| TW (1) | TWI437216B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI552116B (en) * | 2015-09-10 | 2016-10-01 | Condensation prevention and treatment methods | |
| TWI790621B (en) * | 2021-05-21 | 2023-01-21 | 宏碁股份有限公司 | Thermometer |
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2010
- 2010-10-11 TW TW99134639A patent/TWI437216B/en active
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| Publication number | Publication date |
|---|---|
| TW201215859A (en) | 2012-04-16 |
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