TWM482252U - Multiple heat-source heat-dissipating assembly - Google Patents
Multiple heat-source heat-dissipating assembly Download PDFInfo
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- TWM482252U TWM482252U TW103202082U TW103202082U TWM482252U TW M482252 U TWM482252 U TW M482252U TW 103202082 U TW103202082 U TW 103202082U TW 103202082 U TW103202082 U TW 103202082U TW M482252 U TWM482252 U TW M482252U
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Description
本創作是有關一種多熱源散熱組件，尤指一種適用於具有多個熱源，且可有效避免熱量直接沿輻射方向擴散，並使各熱源之熱量擴散分佈更均勻的散熱組件。The present invention relates to a multi-heat source heat dissipating component, in particular to a heat dissipating component which has multiple heat sources and can effectively prevent heat from diffusing directly in the radiation direction and makes the heat diffusion distribution of each heat source more uniform.
隨著電子科技的不斷進步，各種電子產品的使用亦逐漸頻繁，同時，伴隨操作使用時的聲光效果複雜及精緻化等需求，所需運算分析、光源及功率放大（中央處理器、發光元件、功率晶體或其它類似之元件）等電子元件亦被廣泛地運用，而在使用時，上述各電子元件皆難以避免地會產生大量的熱能，若令該熱能直接擴散，則會造成熱源附近產生熱量堆積，致使機殼表面局部位置之溫度會過高；針對此種情形，較常見的解決方式，除了直接以散熱元件局部接觸於該熱源上，以增加其整體之散熱效果外，亦有利用一導熱效率較佳之快速導熱元件（例如：導熱管）以其局部接觸於該熱源，且該快速導熱元件另結合一散熱組件（例如：散熱片、風扇），利用該快速導熱元件將熱源之熱量傳輸至遠端，並由該散熱組件加以發散，如此，雖可減緩熱量過度集中，但由於該熱源之熱量仍會持續地以輻射方式發散，而難以避免地會造成局部位置溫度過高之情形。With the continuous advancement of electronic technology, the use of various electronic products has become more frequent. At the same time, with the complex and refined sound and light effects required for operation, the required computational analysis, light source and power amplification (central processing unit, light-emitting element) Electronic components such as power crystals or other similar components are also widely used. In use, each of the above electronic components inevitably generates a large amount of thermal energy. If the thermal energy is directly diffused, it will cause a heat source to be generated nearby. The heat is accumulated, causing the temperature of the local position of the surface of the casing to be too high. In this case, the common solution is to directly contact the heat source with the heat dissipating component to increase the overall heat dissipation effect. A rapid thermal conduction element (for example, a heat transfer tube) having a heat conduction efficiency is partially contacted with the heat source, and the rapid heat conduction element is further combined with a heat dissipation component (for example, a heat sink and a fan), and the heat of the heat source is utilized by the rapid heat conduction element. Transfer to the far end and dissipate by the heat sink component, thus reducing heat excess But because of the heat of the heat source will continue to radiatively divergence, and is difficult to avoid the localized position can cause high temperature circumstances.
再者，由於單一電子電路中往往具有多個熱源，加以上述傳統散熱組件的體積較為龐大，而隨著各種電子產品小巧、精緻化的潮流，其內部所能提供容納各種電子元件之空間亦隨之縮小，如何能在有限的容納空間中設置相關導熱、散熱組件，亦考驗相關業者之產品設計能力。Moreover, since a single electronic circuit often has multiple heat sources, the conventional heat dissipating component is relatively bulky, and with the trend of small and refined electronic products, the space for accommodating various electronic components is also provided. The reduction, how to set the relevant heat conduction and heat dissipation components in a limited accommodation space, also test the product design capabilities of the relevant industry.
有鑑於習見之快速導熱元件及散熱組件的應用有上述缺點，創作人乃針對該些缺點研究改進之道，終於有本創作產生。In view of the above shortcomings of the application of the rapid thermal conduction element and the heat dissipating component, the creator has researched and improved the shortcomings of these shortcomings, and finally the creation of this creation.
本創作之主要目的在於提供一種多熱源散熱組件，其可有效阻隔多個不同熱源所產生之熱量直接沿輻射方向擴散，並可快速地將各熱量向四周傳遞擴散，以避免熱量累積。The main purpose of the present invention is to provide a multi-heat source heat dissipating component, which can effectively block the heat generated by a plurality of different heat sources to directly diffuse in the radiation direction, and can quickly transfer the heat to all sides to avoid heat accumulation.
本創作之另一目的在於提供一種多熱源散熱組件，其可有效減少整體組合體積，以更能適用於較小巧、精緻化的電子產品中。Another object of the present invention is to provide a multi-heat source heat dissipating assembly, which can effectively reduce the overall combined volume, and is more suitable for use in smaller and more refined electronic products.
為達成上述目的及功效，本創作所採行的技術手段包括：至少一均溫導熱片，係以不同之局部部位分別接近於至少二個預設的熱源；至少一導熱特性優於該均溫導熱片之快速導熱元件，係貼設接觸於該均溫導熱片表面上至少接近及遠離該二熱源其中之一的二區域。In order to achieve the above objectives and effects, the technical means adopted by the present invention include: at least one uniform temperature thermal conductive sheet, which is respectively close to at least two preset heat sources by different local parts; at least one thermal conductivity characteristic is superior to the uniform temperature The rapid thermal conductive element of the thermal conductive sheet is affixed to the two regions on the surface of the uniform temperature thermal conductive sheet at least close to and away from one of the two heat sources.
依上述結構，其中該快速導熱元件則係呈一管狀體。According to the above structure, the rapid thermal conductive element is in a tubular shape.
依上述結構，其中該快速導熱元件具有一與該均溫導熱片相接觸之平面。According to the above structure, the rapid thermal conductive element has a plane in contact with the uniform temperature thermal conductive sheet.
依上述結構，其中該等熱源外周側分別設有一導熱之殼罩。According to the above structure, the outer peripheral sides of the heat sources are respectively provided with a heat conducting cover.
依上述結構，其中該均溫導熱片係接觸於各殼罩表面。According to the above structure, the uniform temperature thermal conductive sheet is in contact with each of the cover surfaces.
依上述結構，其中該等熱源係設置於一電路板上。According to the above structure, the heat sources are disposed on a circuit board.
依上述結構，其中該均溫導熱片與電路板之間設有至少一支撐件。According to the above structure, at least one support member is disposed between the uniform temperature heat conducting sheet and the circuit board.
依上述結構，其中該支撐件係直接撐抵於均溫導熱片對應於快速導熱元件下方之位置。According to the above structure, the support member directly supports the position of the uniform temperature heat conductive sheet corresponding to the lower portion of the rapid heat conduction element.
為使本創作的上述目的、功效及特徵可獲致更具體的暸解，茲依下列附圖說明如下：In order to achieve a more specific understanding of the above objectives, effects and features of this creation, the following figures are illustrated as follows:
1‧‧‧均溫導熱片1‧‧‧Homothermal sheet
10‧‧‧支撐件10‧‧‧Support
2‧‧‧快速導熱元件2‧‧‧Quick thermal conduction element
21‧‧‧平面21‧‧‧ plane
30‧‧‧第一熱源30‧‧‧First heat source
3、4‧‧‧殼罩3, 4‧‧‧ cover
31、41‧‧‧遮蔽殼座31, 41‧‧‧ shade housing
32、42‧‧‧遮蔽罩蓋32, 42‧‧‧ Shadow cover
40‧‧‧第二熱源
5‧‧‧電路板40‧‧‧second heat source
5‧‧‧Circuit board
第１圖係本創作之構造分解圖。Figure 1 is an exploded view of the structure of the creation.
第２圖係本創作之組合示意圖。Figure 2 is a schematic diagram of the combination of the creation.
第３圖係本創作之組合剖面圖。Figure 3 is a combined sectional view of the creation.
請參第１至３圖所示，可知本創作係為一適用於多個獨立熱源３的熱量阻隔及發散的組合結構，其主要包括：均溫導熱片１與快速導熱元件２等部份，其中該均溫導熱片１係為一具快速橫向熱傳導（熱量可沿均溫導熱片１延伸方向快速傳導）特性之片狀體，且其係以至少局部部位分別接近或接觸於至少二個預設之熱源（圖示之實施例中，係包含有第一熱源３０及一第二熱源４０，該第一、二熱源３０、４０係可為分別設置於電路板５上之電子元件，於實際應用時，可依需要具有更多數量的不同熱源）；而該快速導熱元件２係為一導熱特性優於該均溫導熱片１之管狀體，或為板型之超導元件，其可為一目前被廣泛應用的內部具有熱交換流體（冷媒）之導熱管，於該導熱元件２表面設有具有至少一平面２１（於實際應用時，該快速導熱元件２亦可為於二對側具有相對平面之扁平管狀體），以與該阻熱元件１之至少二區域形成較大面積之接觸結合。Referring to Figures 1 to 3, it can be seen that the present invention is a combined structure for heat blocking and divergence applicable to a plurality of independent heat sources 3, and mainly includes: a uniform temperature heat conducting sheet 1 and a rapid heat conducting element 2, The uniform temperature thermal conductive sheet 1 is a sheet-like body with rapid lateral heat conduction (heat can be rapidly transmitted along the extending direction of the uniform temperature thermal conductive sheet 1), and is close to or in contact with at least two pre-positions at least in part. The heat source (the embodiment shown in the figure includes a first heat source 30 and a second heat source 40, and the first and second heat sources 30, 40 can be electronic components respectively disposed on the circuit board 5, in practice When applied, a larger number of different heat sources may be provided as needed; and the rapid thermal conductive element 2 is a tubular body having a thermal conductivity superior to that of the uniform temperature thermal conductive sheet 1, or a plate type superconducting element, which may be A heat pipe having a heat exchange fluid (refrigerant) inside is widely used, and at least one plane 21 is provided on the surface of the heat conducting component 2 (in practical applications, the rapid heat conducting component 2 can also be used. On two opposite sides having a relatively flat plane of the tubular body) to be in contact with a large area is formed of at least two of the heat resistant member binding region.
上述結構中，該第一、二熱源３０、４０係可分別設置於一導熱之殼罩３、４內，該殼罩３、４係可由分別設置於熱源３０、４０周側之遮蔽殼座３１、４１，以及一蓋合於該遮蔽殼座３１、４１上方之遮蔽罩蓋３２、４２所組成，且該均溫導熱片１係以其局部部位接觸於殼罩３、４（遮蔽罩蓋３２、４２）表面；該快速導熱元件２係以該平面２１貼合於均溫導熱片１朝向遠離該熱源３０、４０之一側表面（圖中該快速導熱元件２係設置於距離該熱源３一適當距離之位置）；在實際應用時，可依需要於該均溫導熱片１朝向熱源３之一側設置複數支撐件１０，且使該等複數支撐件１０係直接支撐於均溫導熱片１對應於快速導熱元件２位置下方，以使該均溫導熱片１形成穩固的支撐。In the above structure, the first and second heat sources 30, 40 can be respectively disposed in a heat-conducting casing 3, 4, and the casings 3, 4 can be provided by the shielding shells 31 respectively disposed on the circumferential sides of the heat sources 30, 40. And 41, and a cover cover 32, 42 covering the cover shells 31, 41, and the temperature-regulating heat-conductive sheet 1 is in contact with the cover 3, 4 (the cover cover 32) The surface of the rapid thermal conduction element 2 is disposed on the side surface of the heat-conducting heat-conducting sheet 1 facing away from the heat source 30, 40 (the fast thermal conduction element 2 is disposed at a distance from the heat source 3) In the actual application, the plurality of support members 10 may be disposed on one side of the heat-conductive sheet 1 toward the heat source 3 as needed, and the plurality of support members 10 are directly supported on the uniform temperature heat-conductive sheet 1 Corresponding to the position of the rapid thermal conduction element 2, the uniform temperature thermal conductive sheet 1 forms a stable support.
於使用時，第一、二熱源３０、４０所產生之熱量可直接發散（或經由殼罩３、４傳輸）至均溫導熱片１，利用該均溫導熱片１對熱量形成輻射方向之阻隔，並使熱量得以沿該均溫導熱片１延伸方向擴散傳輸，可有效避免熱量過度集中於第一、二熱源３０、４０附近之部位；而當部份熱量沿該均溫導熱片１傳導至該快速導熱元件２，則可藉由該快速導熱元件２使熱量由其中一區域（如：接近熱源３０或熱源４０之區域）快速均勻地擴散傳導至另一區域（如：遠離熱源３０或熱源４０之區域），以達到迅速散熱之功效。In use, the heat generated by the first and second heat sources 30, 40 can be directly diverged (or transmitted through the casings 3, 4) to the uniform temperature thermal conductive sheet 1, and the uniform temperature thermal conductive sheet 1 is used to block the radiation direction of heat. And allowing heat to be diffused and transmitted along the extending direction of the uniform temperature heat conducting sheet 1, which can effectively prevent the heat from being excessively concentrated in the vicinity of the first and second heat sources 30, 40; and when a part of the heat is conducted along the uniform temperature heat conducting sheet 1 to The rapid thermal conduction element 2 can quickly and uniformly diffuse heat from one region (for example, a region close to the heat source 30 or the heat source 40) to another region (for example, away from the heat source 30 or the heat source). 40 area) to achieve rapid heat dissipation.
於實際應用時，上述該快速導熱元件２更可依需要貼合設置於均溫導熱片１接近第一、二熱源３０、４０之一側表面，藉以使其組合結構具有較小的結合高度，以適用於具有高度限制的容納空間中。In a practical application, the rapid thermal conductive element 2 can be disposed on the side surface of the uniform temperature heat conducting sheet 1 close to the first and second heat sources 30 and 40, so that the combined structure has a small bonding height. It is suitable for use in a height-contained accommodation space.
綜合以上所述，本創作之多熱源散熱組件確可達成避免熱量於各熱源附近累積而造成異常溫度上昇，且可快速使熱量均勻分佈之功效，實為一具新穎性及進步性之創作，爰依法提出申請新型專利；惟上述說明之內容，僅為本創作之較佳實施例說明，舉凡依本創作之技術手段與範疇所延伸之變化、修飾、改變或等效置換者，亦皆應落入本創作之專利申請範圍內。In summary, the multi-heat source heat dissipating component of the present invention can achieve the effect of avoiding the accumulation of heat in the vicinity of each heat source and causing abnormal temperature rise, and can quickly distribute the heat evenly, which is a novel and progressive creation.提出 Apply for a new type of patent in accordance with the law; however, the contents of the above description are only for the description of the preferred embodiment of the present invention. Any changes, modifications, alterations or equivalent replacements that extend from the technical means and scope of the creation should also be It falls within the scope of the patent application of this creation.
1‧‧‧均溫導熱片 1‧‧‧Homothermal sheet
10‧‧‧支撐件 10‧‧‧Support
2‧‧‧快速快速導熱元件 2‧‧‧Quick and fast thermal conduction elements
21‧‧‧平面 21‧‧‧ plane
30‧‧‧第一熱源 30‧‧‧First heat source
3、4‧‧‧殼罩 3, 4‧‧‧ cover
31、41‧‧‧遮蔽殼座 31, 41‧‧‧ shade housing
32、42‧‧‧遮蔽罩蓋 32, 42‧‧‧ Shadow cover
40‧‧‧第二熱源 40‧‧‧second heat source
5‧‧‧電路板 5‧‧‧Circuit board
Claims (17)
至少一均溫導熱片，係以不同之局部部位分別接近於至少二個預設的熱源；
至少一導熱特性優於該均溫導熱片之快速導熱元件，係貼設接觸於該均溫導熱片表面上，且伸展接觸於至少接近及遠離該二熱源其中之一的二區域。之間A multi-heat source heat dissipating assembly comprising at least:
At least one uniform temperature thermal conductive sheet is respectively close to at least two preset heat sources by different local parts;
The at least one thermal conductive element having a thermal conductivity superior to the uniform temperature thermal conductive sheet is attached to the surface of the uniform temperature thermal conductive sheet and is in contact with at least two regions proximate to and away from one of the two heat sources. between
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| Application Number | Priority Date | Filing Date | Title |
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| TW103202082U TWM482252U (en) | 2014-01-29 | 2014-01-29 | Multiple heat-source heat-dissipating assembly |
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| Application Number | Priority Date | Filing Date | Title |
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| TW103202082U TWM482252U (en) | 2014-01-29 | 2014-01-29 | Multiple heat-source heat-dissipating assembly |
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| TWM482252U true TWM482252U (en) | 2014-07-11 |
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| TW (1) | TWM482252U (en) |
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