TWM482251U - Circuit board heat dissipation component - Google Patents
Circuit board heat dissipation component Download PDFInfo
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- TWM482251U TWM482251U TW103202081U TW103202081U TWM482251U TW M482251 U TWM482251 U TW M482251U TW 103202081 U TW103202081 U TW 103202081U TW 103202081 U TW103202081 U TW 103202081U TW M482251 U TWM482251 U TW M482251U
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- circuit board
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- uniform temperature
- thermal conductive
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本創作是有關一種電路板散熱組件，尤指一種可有效避免熱量直接沿輻射方向擴散，並有效增加整體散熱效率之散熱組件。The present invention relates to a circuit board heat dissipating component, and more particularly to a heat dissipating component which can effectively prevent heat from being directly diffused in the radiation direction and effectively increase the overall heat dissipating efficiency.
隨著電子科技的不斷進步，各種電子產品的使用亦逐漸頻繁，同時，伴隨操作使用時的聲光效果複雜及精緻化等需求，所需運算分析、光源及功率放大（中央處理器、發光元件、功率晶體或其它類似之元件）等電子元件亦被廣泛地運用，而在使用時，上述各電子元件皆難以避免地會產生大量的熱能，若令該熱能直接擴散，則會造成熱源附近產生熱量堆積，致使機殼表面局部位置之溫度會過高；針對此種情形，較常見的解決方式，除了直接以散熱元件局部接觸於該熱源上，以增加其整體之散熱效果外，亦有利用一導熱效率較佳之快速導熱元件（例如：導熱管）以其局部接觸於該熱源，且該快速導熱元件另結合一散熱組件（例如：散熱片、風扇），利用該快速導熱元件將熱源之熱量傳輸至遠端，並由該散熱組件加以發散，如此，雖可減緩熱量過度集中，但由於該熱源之熱量仍會持續地以輻射方式發散，而難以避免地會造成局部位置溫度過高之情形。With the continuous advancement of electronic technology, the use of various electronic products has become more frequent. At the same time, with the complex and refined sound and light effects required for operation, the required computational analysis, light source and power amplification (central processing unit, light-emitting element) Electronic components such as power crystals or other similar components are also widely used. In use, each of the above electronic components inevitably generates a large amount of thermal energy. If the thermal energy is directly diffused, it will cause a heat source to be generated nearby. The heat is accumulated, causing the temperature of the local position of the surface of the casing to be too high. In this case, the common solution is to directly contact the heat source with the heat dissipating component to increase the overall heat dissipation effect. A rapid thermal conduction element (for example, a heat transfer tube) having a heat conduction efficiency is partially contacted with the heat source, and the rapid heat conduction element is further combined with a heat dissipation component (for example, a heat sink and a fan), and the heat of the heat source is utilized by the rapid heat conduction element. Transfer to the far end and dissipate by the heat sink component, thus reducing heat excess But because of the heat of the heat source will continue to radiatively divergence, and is difficult to avoid the localized position can cause high temperature circumstances.
再者，隨著各種電子產品小巧、精緻化的潮流，其內部所能提供容納各種電子元件之空間亦隨之縮小，如何能在有限的容納空間中設置相關導熱、散熱組件，亦考驗相關業者之產品設計能。Furthermore, with the trend of small and sophisticated electronic products, the space for accommodating various electronic components is also reduced. How to set relevant heat conduction and heat dissipation components in a limited accommodation space, and test related operators The product design can.
有鑑於習見之快速導熱元件及散熱組件的應用有上述缺點，創作人乃針對該些缺點研究改進之道，終於有本創作產生。In view of the above shortcomings of the application of the rapid thermal conduction element and the heat dissipating component, the creator has researched and improved the shortcomings of these shortcomings, and finally the creation of this creation.
本創作之主要目的在於提供一種電路板散熱組件，其可有效阻隔預設熱源所產生之熱量直接沿輻射方向擴散，並快速地將該熱量向四周傳遞擴散，以避免熱量累積，且迅速導引熱量發散。The main purpose of the present invention is to provide a circuit board heat dissipating component, which can effectively block the heat generated by the preset heat source to directly diffuse in the radiation direction, and quickly transfer the heat to the periphery to avoid heat accumulation and quickly guide. The heat is diverging.
本創作之另一目的在於提供一種電路板散熱組件，其可有效降低整體組合之高度，並減少佔用之空間，以更能適用於較小巧、精緻化的電子產品中。Another object of the present invention is to provide a circuit board heat dissipating component, which can effectively reduce the height of the overall combination and reduce the occupied space, so as to be more suitable for small and refined electronic products.
為達成上述目的及功效，本創作所採行的技術手段包括：至少一均溫導熱片，係以至少局部接近或貼靠於一電路板上預設之熱源；至少一導熱特性優於該均溫導熱片之快速導熱元件，係貼設接觸於該均溫導熱片朝向該電路板一側表面上至少一接近該熱源及一遠離該熱源之二區域。In order to achieve the above objectives and effects, the technical means adopted by the present invention include: at least one uniform temperature thermal conductive sheet, which is at least partially close to or abutted against a preset heat source on a circuit board; at least one thermal conductivity characteristic is superior to the average The rapid thermal conduction component of the thermal conductive sheet is in contact with at least one of the heat-radiating sheet facing the surface of the circuit board at least adjacent to the heat source and away from the heat source.
依上述結構，其中該導熱元件則係呈一管狀體。According to the above structure, the heat conducting member is in a tubular shape.
依上述結構，其中該快速導熱元件具有一與該均溫導熱片相接觸之平面。According to the above structure, the rapid thermal conductive element has a plane in contact with the uniform temperature thermal conductive sheet.
依上述結構，其中該快速導熱元件係為一扁平之管狀體。According to the above structure, the rapid thermal conductive element is a flat tubular body.
依上述結構，其中該熱源外周側與該均溫導熱片之間設有一導熱之隔離罩蓋。According to the above structure, a heat-dissipating cover cover is disposed between the outer peripheral side of the heat source and the temperature-regulating heat-conductive sheet.
依上述結構，其中該均溫導熱片係接觸於該隔離罩蓋表面。According to the above structure, the uniform temperature thermal conductive sheet is in contact with the surface of the spacer cover.
依上述結構，其中該均溫導熱片與電路板之間設有至少一支撐件。According to the above structure, at least one support member is disposed between the uniform temperature heat conducting sheet and the circuit board.
依上述結構，其中該支撐件係直接撐抵於快速導熱元件下方。According to the above structure, the support member is directly supported under the rapid thermal conduction member.
為使本創作的上述目的、功效及特徵可獲致更具體的暸解，茲依下列附圖說明如下：In order to achieve a more specific understanding of the above objectives, effects and features of this creation, the following figures are illustrated as follows:
1‧‧‧均溫導熱片1‧‧‧Homothermal sheet
2‧‧‧快速導熱元件2‧‧‧Quick thermal conduction element
21‧‧‧平面21‧‧‧ plane
3‧‧‧熱源3‧‧‧heat source
30‧‧‧隔離罩蓋30‧‧‧Isolation cover
4‧‧‧電路板4‧‧‧ boards
41‧‧‧支撐件41‧‧‧Support
第１圖係本創作之構造分解圖。Figure 1 is an exploded view of the structure of the creation.
第２圖係本創作之組合剖面圖。Figure 2 is a combined sectional view of the creation.
請參第１、２圖所示，可知本創作係為一適用於設置於預設電路板４上之熱源３的熱量阻隔及發散的組合結構，主要包括：均溫導熱片１與快速導熱元件２等部份，其中該均溫導熱片１係為一具快速橫向熱傳導（熱量可沿均溫導熱片１延伸方向快速傳導）特性之片狀體，且其係以至少局部部位接近於一電路板４上預設之熱源３；而該快速導熱元件２係為一導熱特性優於該均溫導熱片１之管狀體，其可為一目前被廣泛應用的內部具有導熱流體（冷媒）之導熱管，或為板型之超導元件，於該快速導熱元件２表面設有具有至少一平面２１（於實際應用時，該快速導熱元件２亦可為於二對側具有相對平面之扁平管狀體），以與該均溫導熱片１上之至少二區域形成較大面積之接觸結合。Referring to Figures 1 and 2, it can be seen that the present invention is a combined structure for heat dissipation and divergence of the heat source 3 disposed on the preset circuit board 4, and mainly includes: the uniform temperature heat conductive sheet 1 and the rapid thermal conduction element. 2, wherein the temperature-regulating heat-conducting sheet 1 is a sheet-like body having a characteristic of rapid lateral heat conduction (heat can be rapidly transmitted along the extending direction of the uniform temperature heat-conducting sheet 1), and is at least partially close to a circuit. The heat source 3 is preset on the board 4; and the rapid heat conducting element 2 is a tubular body having a heat conducting property superior to that of the temperature-regulating heat conducting sheet 1, which can be a heat conduction fluid (refrigerant) inside a widely used interior. a tube, or a superconducting element of a plate type, having at least one plane 21 on the surface of the rapid thermal conduction element 2 (in practical applications, the rapid thermal conduction element 2 may also be a flat tubular body having opposite planes on two opposite sides) And bonding in contact with at least two regions on the uniform temperature thermally conductive sheet 1 to form a large area.
上述結構中，該熱源３係可設置於一導熱之隔離罩蓋３０內，且該均溫導熱片１係以其局部接觸於隔離罩蓋３０表面；而該快速導熱元件２係以該平面２１貼合於均溫導熱片１朝向接近該熱源３之一側表面；在實際應用時，可依需要於該均溫導熱片１與電路板４之間設置複數支撐件４１（該支撐件４１亦可直接撐抵於快速導熱元件２下方），以使該均溫導熱片１形成穩固的支撐。In the above structure, the heat source 3 can be disposed in a heat-conducting isolation cover 30, and the temperature-regulated thermal conductive sheet 1 is partially in contact with the surface of the isolation cover 30; and the rapid thermal conduction element 2 is in the plane 21 The heat conductive sheet 1 is attached to the side surface of the heat source 3; in practical applications, a plurality of support members 41 may be disposed between the heat conductive sheet 1 and the circuit board 4 as needed (the support member 41 is also It can be directly supported under the rapid thermal conductive element 2) to form the uniform temperature thermal conductive sheet 1 to form a stable support.
於使用時，熱源３所產生之熱量可直接發散（或經由隔離罩蓋３０傳輸）至均溫導熱片１，利用該均溫導熱片１對熱量形成輻射方向之阻隔，並使熱量得以沿該均溫導熱片１延伸方向擴散傳輸，可有效避免熱量過度集中於熱源３附近之部位；而當部份熱量沿該均溫導熱片１傳導至該快速導熱元件２，則可藉由該快速導熱元件２使熱量由其中一區域（如：接近該熱源３之區域）快速均勻地擴散傳導至另一區域（如：遠離該熱源３之區域），以達到迅速散熱之功效。In use, the heat generated by the heat source 3 can be directly diverged (or transmitted via the isolation cover 30) to the uniform temperature thermal conductive sheet 1, and the uniform temperature thermal conductive sheet 1 is used to block the heat from the heat direction, and the heat can be along the The uniform temperature conductive sheet 1 is diffused and transmitted in the extending direction, which can effectively prevent the heat from being excessively concentrated in the vicinity of the heat source 3; and when a part of the heat is conducted along the uniform temperature heat conducting sheet 1 to the rapid heat conducting element 2, the rapid heat conduction can be utilized. The component 2 allows heat to be quickly and uniformly diffused from one of the regions (eg, the region close to the heat source 3) to another region (eg, a region away from the heat source 3) to achieve rapid heat dissipation.
本創作之上述結構，其利用將快速導熱元件２設置於均溫導熱片１朝向熱源３之一側表面上，可有效縮減整體組件之高度，使其減少佔用之空間，進而更能適用於較小巧、精緻化的電子產品中，以提昇產品之競爭力。The above structure of the present invention utilizes the rapid thermal conduction element 2 on the side surface of the uniform temperature heat conduction sheet 1 facing the heat source 3, which can effectively reduce the height of the overall assembly, thereby reducing the occupied space, and thus is more suitable for comparison. Small, refined electronic products to enhance the competitiveness of products.
綜合以上所述，本創作之電路板散熱組件確可達成避免熱量於熱源附近累積而造成異常溫昇，且可增加整體散熱效率之功效，實為一具新穎性及進步性之創作，爰依法提出申請新型專利；惟上述說明之內容，僅為本創作之較佳實施例說明，舉凡依本創作之技術手段與範疇所延伸之變化、修飾、改變或等效置換者，亦皆應落入本創作之專利申請範圍內。In summary, the circuit board heat dissipation component of the present invention can achieve the effect of avoiding the accumulation of heat in the vicinity of the heat source and causing abnormal temperature rise, and can increase the overall heat dissipation efficiency, which is a novel and progressive creation. The application for a new type of patent is filed; however, the above description is only for the description of the preferred embodiment of the present invention. Any changes, modifications, changes or equivalent replacements that extend according to the technical means and scope of the creation should also fall into the category. Within the scope of this patent application.
1‧‧‧均溫導熱片 1‧‧‧Homothermal sheet
2‧‧‧快速導熱元件 2‧‧‧Quick thermal conduction element
21‧‧‧平面 21‧‧‧ plane
3‧‧‧熱源 3‧‧‧heat source
30‧‧‧隔離罩蓋 30‧‧‧Isolation cover
4‧‧‧電路板 4‧‧‧ boards
41‧‧‧支撐件 41‧‧‧Support
Claims (12)
至少一均溫導熱片，係以至少局部接近或貼靠於一電路板上預設之熱源；
至少一導熱特性優於該均溫導熱片之快速導熱元件，係貼設接觸於該均溫導熱片朝向該電路板一側表面上，且至少伸展接觸於一接近該熱源及一遠離該熱源之二區域之間。A circuit board heat dissipation assembly comprising at least:
At least one uniform temperature thermal conductive sheet is at least partially adjacent to or abutted against a predetermined heat source on a circuit board;
The at least one thermal conductive element having a thermal conductivity superior to that of the uniform temperature thermal conductive sheet is disposed in contact with the uniform temperature conductive sheet toward a side surface of the circuit board, and is at least in contact with a heat source and a heat source away from the heat source. Between the two regions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103202081U TWM482251U (en) | 2014-01-29 | 2014-01-29 | Circuit board heat dissipation component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103202081U TWM482251U (en) | 2014-01-29 | 2014-01-29 | Circuit board heat dissipation component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM482251U true TWM482251U (en) | 2014-07-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103202081U TWM482251U (en) | 2014-01-29 | 2014-01-29 | Circuit board heat dissipation component |
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| TW (1) | TWM482251U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578706A (en) * | 2014-09-24 | 2016-05-11 | 纬创资通股份有限公司 | circuit board assembly |
| TWI614476B (en) * | 2016-07-29 | 2018-02-11 | 雙鴻科技股份有限公司 | Loop heat pipe and electronic device having the same |
-
2014
- 2014-01-29 TW TW103202081U patent/TWM482251U/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578706A (en) * | 2014-09-24 | 2016-05-11 | 纬创资通股份有限公司 | circuit board assembly |
| TWI562687B (en) * | 2014-09-24 | 2016-12-11 | Wistron Corp | Circuit board assembly |
| CN105578706B (en) * | 2014-09-24 | 2018-08-17 | 纬创资通股份有限公司 | circuit board assembly |
| TWI614476B (en) * | 2016-07-29 | 2018-02-11 | 雙鴻科技股份有限公司 | Loop heat pipe and electronic device having the same |
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