TWM482250U - Enhanced diffusion thermally conductive component - Google Patents
Enhanced diffusion thermally conductive component Download PDFInfo
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- TWM482250U TWM482250U TW103202079U TW103202079U TWM482250U TW M482250 U TWM482250 U TW M482250U TW 103202079 U TW103202079 U TW 103202079U TW 103202079 U TW103202079 U TW 103202079U TW M482250 U TWM482250 U TW M482250U
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Description
本創作是有關一種強化擴散導熱組件，尤指一種可有效避免熱量直接沿輻射方向擴散，並可增加整體散熱效率之導熱組件。The present invention relates to a reinforced diffusion heat conducting component, and more particularly to a heat conducting component which can effectively prevent heat from diffusing directly in the radiation direction and can increase the overall heat dissipation efficiency.
隨著電子科技的不斷進步，各種電子產品的使用亦逐漸頻繁，同時，伴隨操作使用時的聲光效果複雜及精緻化等需求，所需運算分析、光源及功率放大（中央處理器、發光元件、功率晶體或其它類似之元件）等電子元件亦被廣泛地運用，而在使用時，上述各電子元件皆難以避免地會產生大量的熱能，若令該熱能直接擴散，則會造成熱源附近產生熱量堆積，致使機殼表面局部位置之溫度會過高；針對此種情形，較常見的解決方式，除了直接以散熱元件局部接觸於該熱源上，以增加其整體之散熱效果外，亦有利用一導熱效率較佳之快速導熱元件（例如：導熱管）以其局部接觸於該熱源，且該快速導熱元件另結合一散熱組件（例如：散熱片、風扇），利用該快速導熱元件將熱源之熱量傳輸至遠端，並由該散熱組件加以發散，如此，雖可減緩熱量過度集中，但由於該熱源之熱量仍會持續地以輻射方式發散，而難以避免地會造成局部位置溫度過高之情形。With the continuous advancement of electronic technology, the use of various electronic products has become more frequent. At the same time, with the complex and refined sound and light effects required for operation, the required computational analysis, light source and power amplification (central processing unit, light-emitting element) Electronic components such as power crystals or other similar components are also widely used. In use, each of the above electronic components inevitably generates a large amount of thermal energy. If the thermal energy is directly diffused, it will cause a heat source to be generated nearby. The heat is accumulated, causing the temperature of the local position of the surface of the casing to be too high. In this case, the common solution is to directly contact the heat source with the heat dissipating component to increase the overall heat dissipation effect. A rapid thermal conduction element (for example, a heat transfer tube) having a heat conduction efficiency is partially contacted with the heat source, and the rapid heat conduction element is further combined with a heat dissipation component (for example, a heat sink and a fan), and the heat of the heat source is utilized by the rapid heat conduction element. Transfer to the far end and dissipate by the heat sink component, thus reducing heat excess But because of the heat of the heat source will continue to radiatively divergence, and is difficult to avoid the localized position can cause high temperature circumstances.
有鑑於習見之快速導熱元件及散熱組件的應用有上述缺點，創作人乃針對該些缺點研究改進之道，終於有本創作產生。In view of the above shortcomings of the application of the rapid thermal conduction element and the heat dissipating component, the creator has researched and improved the shortcomings of these shortcomings, and finally the creation of this creation.
本創作之主要目的在於提供一種強化擴散導熱組件，其可有效阻隔預設熱源所產生之熱量直接沿輻射方向擴散，並快速地將該熱量向四周傳遞擴散，以避免熱量累積，並迅速導引熱量發散。The main purpose of the present invention is to provide a reinforced diffusion heat conducting component, which can effectively block the heat generated by the preset heat source to directly diffuse in the radiation direction, and quickly spread the heat to the periphery to avoid heat accumulation and quickly guide. The heat is diverging.
為達成上述目的及功效，本創作所採行的技術手段包括：一導熱之殼罩，係罩蓋概於一預設熱源之外周側；至少一均溫導熱片，係以至少局部接近或貼靠於該殼罩上；至少一導熱特性優於該均溫導熱片之快速導熱元件，係貼設接觸於該均溫導熱片之一側表面上至少一接近該殼罩及一遠離該殼罩之二區域。In order to achieve the above objectives and effects, the technical means adopted by the present invention include: a heat-conducting cover, the cover is disposed on the outer side of a predetermined heat source; at least one uniform thermal plate is at least partially adjacent or attached. Relying on the cover; at least one thermal conductive element having better thermal conductivity than the uniform thermal conductive sheet is attached to at least one of the side surfaces of the temperature-regulating thermal sheet and close to the housing and away from the housing The second area.
依上述結構，其中該快速導熱元件則係呈一管狀體，且該快速導熱元件具有與該均溫導熱片相接觸之平面。According to the above structure, the rapid thermal conductive element is in a tubular shape, and the rapid thermal conductive element has a plane in contact with the uniform temperature thermal conductive sheet.
依上述結構，其中該快速導熱元件係為一扁平之管狀體。According to the above structure, the rapid thermal conductive element is a flat tubular body.
依上述結構，其中該快速導熱元件係設置於均溫導熱片上遠離熱源之一側表面。According to the above structure, the rapid thermal conductive element is disposed on the temperature-regulating heat-conducting sheet away from one side surface of the heat source.
依上述結構，其中該快速導熱元件係設置於均溫導熱片上接近熱源之一側表面。According to the above structure, the rapid thermal conductive element is disposed on the uniform temperature heat conducting sheet near one side surface of the heat source.
依上述結構，其中該均溫導熱片於至少局部邊緣設有一垂直彎折之折緣，且該快速導熱元件係設置於該折緣上。According to the above structure, the temperature-regulating heat-conducting sheet is provided with a vertically bent flange at at least a part of the edge, and the rapid heat-conducting element is disposed on the flange.
依上述結構，其中該均溫導熱片之折緣係設置於遠離熱源之一側邊緣。According to the above structure, the flange of the uniform temperature heat conducting sheet is disposed away from one side edge of the heat source.
依上述結構，其中該快速導熱元件係設置於該折緣上遠離熱源之一側表面。According to the above structure, the rapid heat conduction element is disposed on the flange from a side surface of the heat source.
依上述結構，其中該快速導熱元件係設置於該折緣上接近熱源之一側表面。According to the above structure, the rapid thermal conduction element is disposed on the flange near a side surface of the heat source.
依上述結構，其中該熱源外周側設有一導熱之殼罩，且該均溫導熱片係接觸於該殼罩表面。According to the above structure, a heat conducting cover is disposed on the outer peripheral side of the heat source, and the temperature uniform heat conductive sheet is in contact with the surface of the cover.
為使本創作的上述目的、功效及特徵可獲致更具體的暸解，茲依下列附圖說明如下：In order to achieve a more specific understanding of the above objectives, effects and features of this creation, the following figures are illustrated as follows:
１、１ａ、１ｂ‧‧‧均溫導熱片1, 1a, 1b ‧ ‧ uniform temperature thermal film
１１ｂ‧‧‧折緣11b‧‧‧Folding
２、２ａ、２ｂ‧‧‧快速導熱元件2, 2a, 2b‧‧‧ fast thermal conduction components
２１‧‧‧平面21‧‧‧ plane
３‧‧‧熱源3‧‧‧heat source
３０‧‧‧殼罩30‧‧‧Shell cover
３１‧‧‧遮蔽殼座31‧‧‧shade housing
３２‧‧‧遮蔽罩蓋32‧‧‧ Shadow cover
４、４１‧‧‧支撐件4, 41‧‧‧ support
第１圖係本創作第一實施例之構造分解圖。Fig. 1 is an exploded perspective view showing the first embodiment of the present creation.
第２圖係本創作第一實施例之組合示意圖。Fig. 2 is a schematic view showing the combination of the first embodiment of the present creation.
第３圖係本創作第一實施例之組合剖面圖。Figure 3 is a combined sectional view of the first embodiment of the present creation.
第４圖係本創作第二實施例之組合剖面圖。Fig. 4 is a sectional view showing the combination of the second embodiment of the present creation.
第５圖係本創作第三實施例之組合剖面圖。Fig. 5 is a sectional view showing the combination of the third embodiment of the present creation.
請參第１至３圖所示，可知本創作第一實施例之結構主要包括：均溫導熱片１與快速導熱元件２等部份，其中該均溫導熱片１係為一具快速橫向熱傳導（熱量可沿均溫導熱片１延伸方向快速傳導）特性之片狀體，且其係以至少局部部位接近於一預設之熱源３；而該快速導熱元件２係為一導熱特性優於該均溫導熱片１之管狀體，其可為一目前被廣泛應用的內部具有導熱流體（冷媒）之導熱管，或為板型之超導元件，於該快速導熱元件２表面設有具有至少一平面２１（於實際應用時，該快速導熱元件２亦可為於二對側具有相對平面之扁平管狀體），以與該均溫導熱片１上之至少二區域形成較大面積之接觸結合。Referring to Figures 1 to 3, it can be seen that the structure of the first embodiment of the present invention mainly includes: a uniform temperature thermal conductive sheet 1 and a rapid thermal conduction element 2, wherein the uniform temperature thermal conduction sheet 1 is a rapid lateral heat conduction. a sheet-like body having a characteristic that heat can be rapidly transmitted along the direction in which the heat-conductive sheet 1 is uniformly extended, and which is close to a predetermined heat source 3 at least in part; and the rapid heat-conducting element 2 is superior in heat conductivity. a tubular body of the uniform temperature thermal conductive sheet 1, which may be a heat-conducting tube having a heat-conducting fluid (refrigerant) inside or a superconducting element having a plate type, and having at least one surface on the surface of the rapid thermal conductive element 2 The flat surface 21 (in the practical application, the rapid thermal conductive element 2 may also be a flat tubular body having opposite planes on two opposite sides) to form a large-area contact bond with at least two regions on the uniform temperature thermal conductive sheet 1.
於本實施例中，上述結構中該熱源３係可設置於一導熱之殼罩３０內，該殼罩３０係可由一設置於熱源３周側之遮蔽殼座３１，以及一蓋合於該遮蔽殼座３１上方之遮蔽罩蓋３２所組成，且該均溫導熱片１係以其局部接觸於殼罩３０（遮蔽罩蓋３２）表面；且該快速導熱元件２係以該平面２１貼合於均溫導熱片１朝向遠離該熱源３之一側表面（圖中該快速導熱元件２係設置於距離該熱源３一適當距離之位置）；在實際應用時，於該均溫導熱片１與快速導熱元件２之間可依需要設有一導電膠層（未繪出），以使該快速導熱元件２可經由該均溫導熱片１形成接地，且可於該均溫導熱片１朝向熱源３之一側設置複數支撐件４，以使該均溫導熱片１形成穩固的支撐。In the above embodiment, the heat source 3 can be disposed in a heat-conducting cover 30, and the cover 30 can be covered by a shielding shell 31 disposed on the circumferential side of the heat source 3, and a cover is attached thereto. a cover 32 is disposed above the housing 31, and the temperature-regulating thermal conductive sheet 1 is partially in contact with the surface of the cover 30 (the cover 32); and the rapid thermal conductive element 2 is adhered to the flat surface 21 The uniform temperature heat conducting sheet 1 faces away from one side surface of the heat source 3 (the fast heat conducting element 2 is disposed at a suitable distance from the heat source 3 in the figure); in practical application, the uniform temperature heat conducting sheet 1 is fast A conductive adhesive layer (not shown) may be disposed between the heat-conducting elements 2 so that the rapid thermal conductive element 2 can be grounded via the temperature-regulating thermal conductive sheet 1 and the thermally-conductive thermally conductive sheet 1 can be oriented toward the heat source 3 A plurality of support members 4 are provided on one side to form a stable support for the uniform temperature heat conductive sheet 1.
於使用時，熱源３所產生之熱量可直接發散（或經由殼罩３０傳輸）至均溫導熱片１，利用該均溫導熱片１對熱量形成輻射方向之阻隔，並使熱量得以沿該均溫導熱片１延伸方向擴散傳輸，可有效避免熱量過度集中於熱源３附近之部位；而當部份熱量沿該均溫導熱片１傳導至該快速導熱元件２，則可藉由該快速導熱元件２使熱量由其中一區域（如：接近該殼罩３０之區域）快速地擴散傳導至另一區域（如：遠離該殼罩３０之區域），以達到迅速散熱之功效。When in use, the heat generated by the heat source 3 can be directly diverged (or transmitted through the casing 30) to the uniform temperature heat conducting sheet 1, and the heat conductive sheet 1 is used to block the heat from the heat, and the heat can be along the same. The heat conductive sheet 1 is diffused and transmitted in the extending direction, thereby effectively preventing the heat from being excessively concentrated in the vicinity of the heat source 3; and when a part of the heat is conducted along the uniform temperature heat conducting sheet 1 to the rapid heat conducting element 2, the rapid heat conducting element can be utilized 2 allows heat to be rapidly diffused from one of the regions (eg, the region proximate to the shroud 30) to another region (eg, away from the shroud 30) for rapid heat dissipation.
請參第４圖所示，可知本創作第二實施例之結構主要包括：與前述第一實施例之均溫導熱片１、快速導熱元件２相同的均溫導熱片１ａ、快速導熱元件２ａ，且該均溫導熱片１ａ係以相同之方式接近熱源３（或接觸結合於殼罩３０上）；而該快速導熱元件２則係貼合設置於均溫導熱片１接近熱源３之一側表面，且可依需要於快速導熱元件２ａ下方設置複數支撐件４１，以使該均溫導熱片１ａ形成穩固的支撐。Referring to FIG. 4, it can be seen that the structure of the second embodiment of the present invention mainly includes: the uniform temperature thermal conductive sheet 1a and the rapid thermal conductive element 2a which are the same as the uniform temperature thermal conductive sheet 1 and the rapid thermal conductive element 2 of the first embodiment. And the uniform temperature thermal conductive sheet 1a is in the same manner as the heat source 3 (or the contact is bonded to the cover 30); and the rapid thermal conductive element 2 is disposed on the side surface of the uniform temperature thermal conductive sheet 1 near the heat source 3. And a plurality of support members 41 may be disposed under the rapid thermal conductive element 2a as needed to form the uniform temperature thermal conductive sheet 1a to form a stable support.
與該第一實施例之均溫導熱片１、快速導熱元件２相較，上述此種第二實施例之均溫導熱片１ａ、快速導熱元件２ａ組合結構具有較小的結合高度，更適用於具有高度限制的容納空間中。Compared with the uniform thermal conductive sheet 1 and the rapid thermal conductive element 2 of the first embodiment, the combined structure of the uniform thermal conductive sheet 1a and the rapid thermal conductive element 2a of the second embodiment has a smaller bonding height, and is more suitable for It has a height-restricted accommodation space.
請參第５圖所示，可知本創作第三實施例之結構主要包括：一均溫導熱片１ｂ，以及一與前述第一實施例之快速導熱元件２相同的快速導熱元件２ｂ；其中該均溫導熱片１ｂ係以相同之方式接近熱源３（或接觸結合於殼罩３０上），於該均溫導熱片１ｂ遠離熱源３之一側邊緣設有一彎折（圖示中係為垂直彎折）之折緣１１ｂ，而該快速導熱元件２ｂ則係貼設於該折緣１１ｂ上遠離熱源３之一側表面。Referring to FIG. 5, it can be seen that the structure of the third embodiment of the present invention mainly includes: a uniform temperature thermal conductive sheet 1b, and a rapid thermal conduction element 2b which is the same as the rapid thermal conduction element 2 of the foregoing first embodiment; The heat conductive sheet 1b is adjacent to the heat source 3 (or the contact is bonded to the cover 30) in the same manner, and the heat-conductive sheet 1b is provided with a bend away from the side edge of the heat source 3 (the figure is vertically bent) The flange 11b is attached to the flange 11b on a side surface of the heat source 3.
上述此種第三實施例之結構於實際應用時，該快速導熱元件２ｂ亦可依需要而貼設於該折緣１１ｂ上接近熱源３之一側表面，藉此，以形成另一種不同之組合形態。When the structure of the third embodiment is used in practical applications, the rapid thermal conductive element 2b may be attached to the flange 11b as needed to approach one side surface of the heat source 3, thereby forming another different combination. form.
綜合以上所述，本創作之強化擴散導熱組件確可達成避免熱量於熱源附近累積，且可增加整體散熱效率之功效，實為一具新穎性及進步性之創作，爰依法提出申請新型專利；惟上述說明之內容，僅為本創作之較佳實施例說明，舉凡依本創作之技術手段與範疇所延伸之變化、修飾、改變或等效置換者，亦皆應落入本創作之專利申請範圍內。In summary, the enhanced diffusion heat conduction component of the present invention can achieve the effect of avoiding heat accumulation near the heat source and increasing the overall heat dissipation efficiency, which is a novelty and progressive creation, and proposes to apply for a new type of patent according to law; However, the contents of the above descriptions are only for the description of the preferred embodiments of the present invention. Any changes, modifications, changes or equivalent replacements that extend from the technical means and scope of the creation should also fall into the patent application of this creation. Within the scope.
1‧‧‧均溫導熱片 1‧‧‧Homothermal sheet
2‧‧‧快速導熱元件 2‧‧‧Quick thermal conduction element
21‧‧‧平面 21‧‧‧ plane
3‧‧‧熱源 3‧‧‧heat source
30‧‧‧殼罩 30‧‧‧Shell cover
31‧‧‧遮蔽殼座 31‧‧‧shade housing
32‧‧‧遮蔽罩蓋 32‧‧‧ Shadow cover
4‧‧‧支撐件 4‧‧‧Support
Claims (11)
一導熱之殼罩，係罩蓋概於一預設熱源之外周側；
至少一均溫導熱片，係以至少局部接近或貼靠於該殼罩上；
至少一導熱特性優於該均溫導熱片之快速導熱元件，係貼設接觸於該均溫導熱片之一側表面上，且至少伸展接觸於一接近該殼罩及一遠離該殼罩之二區域之間。A reinforced diffusion heat conducting component comprising at least:
a heat-conducting cover, the cover is disposed on a peripheral side of a predetermined heat source;
At least one uniform temperature thermal sheet is at least partially adjacent to or abutted against the casing;
The at least one thermal conductive element having a thermal conductivity superior to that of the uniform temperature thermal conductive sheet is attached to one side surface of the uniform temperature thermal conductive sheet, and is at least in contact with a shell that is close to the housing and a second away from the housing Between the regions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103202079U TWM482250U (en) | 2014-01-29 | 2014-01-29 | Enhanced diffusion thermally conductive component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103202079U TWM482250U (en) | 2014-01-29 | 2014-01-29 | Enhanced diffusion thermally conductive component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM482250U true TWM482250U (en) | 2014-07-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW103202079U TWM482250U (en) | 2014-01-29 | 2014-01-29 | Enhanced diffusion thermally conductive component |
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| TW (1) | TWM482250U (en) |
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2014
- 2014-01-29 TW TW103202079U patent/TWM482250U/en not_active IP Right Cessation
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |