TWM473685U - Heat absorbing and dissipating device with fins - Google Patents
Heat absorbing and dissipating device with fins Download PDFInfo
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- TWM473685U TWM473685U TW102205675U TW102205675U TWM473685U TW M473685 U TWM473685 U TW M473685U TW 102205675 U TW102205675 U TW 102205675U TW 102205675 U TW102205675 U TW 102205675U TW M473685 U TWM473685 U TW M473685U
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Description
本創作是與熱交換裝置有關，特別是指使用於具發熱體之裝置如伺服器、桌上型電腦、手提電腦、個人數位助理(PDA)、發光二極體(LED)燈具或機器設備等之中央處理器(CPU)或電子元件之一種附鰭片型吸散熱器。This creation is related to heat exchange devices, especially for devices with heating elements such as servers, desktop computers, laptop computers, personal digital assistants (PDAs), light-emitting diode (LED) lamps or machinery, etc. A fuse-type heat sink with a central processing unit (CPU) or electronic components.
一電子設備或一機器設備之吸散熱的作法已有風扇吹送空氣冷卻方式及/或熱管(heat pipe)冷卻方式，進一步有液體冷卻方式，用以應付這些設備的電子元件所產生的高熱，這些電子元件外側通常須設置一吸散熱器(heat sink)，用以迅速地將熱導引出來並散熱。The heat dissipation method of an electronic device or a machine device has a fan blowing air cooling method and/or a heat pipe cooling method, and further a liquid cooling method for coping with the high heat generated by the electronic components of the devices. A heat sink is usually provided on the outside of the electronic component to quickly guide heat and dissipate heat.
如第一圖所示，習用一均熱板(Vapor Chamber)(91)的功效是迅速地將熱導引出來並擴大熱的分佈，用以迅速地將熱導引出，均熱板基本原理是一個內部具一微結構(毛細結構)(92)的真空腔體，當熱由熱源傳導至蒸發區時，該腔體裡面的液體工質在低真空度的環境中，便會開始產生液相變氣相的現象，此時工質吸收熱能並且體積迅速膨脹，氣相的工質會很快充滿整個腔體，當氣相工質接觸到一個比較冷的區域如該均熱板(91)之一外側面抵接一散熱鰭片(93)時便會產生凝結的現象，藉由凝結的現象釋 放出在蒸發時累積的熱，凝結後的液相工質會藉由該微結構(92)的毛細現象再回到蒸發熱源處，此運作將在腔體內週而復始進行，這就是均熱板(或稱均溫板)的運作方式。As shown in the first figure, the effect of the Vapor Chamber (91) is to quickly direct the heat and expand the heat distribution to quickly guide the heat out. The basic principle of the soaking plate It is a vacuum chamber with a microstructure (capillary structure) (92). When the heat is conducted from the heat source to the evaporation zone, the liquid working fluid in the cavity starts to generate liquid in a low vacuum environment. Phase-change gas phase phenomenon, when the working medium absorbs thermal energy and the volume expands rapidly, the working medium of the gas phase will quickly fill the entire cavity, when the gas phase working medium contacts a relatively cold area such as the soaking plate (91 When one of the outer sides abuts a heat sink fin (93), condensation occurs, which is explained by the phenomenon of condensation. The heat accumulated during evaporation is released, and the condensed liquid phase fluid is returned to the evaporation heat source by the capillary phenomenon of the microstructure (92), and the operation will be repeated in the cavity, which is the soaking plate (or The operation of the average temperature plate).
另外，由於工質在蒸發時微結構可以產生毛細力，所以均熱板的運作可不受重力的影響。In addition, since the microstructure can generate capillary force when the working medium evaporates, the operation of the soaking plate can be prevented from being affected by gravity.
然而，一冷卻系統之一吸散熱器的結構係影響該冷卻系統之散熱效率，如何更降低該吸散熱器之熱阻值(Thermal Resistance Value)係業者所努力的目標，對於一液體冷卻系統，如何有效地導引一流體在一吸散熱器內部的流動方向或/及提升該流體與該吸散熱器的熱交換效率，更是能提升該液體冷卻系統之散熱效率。However, the structure of one of the cooling systems that absorbs the heat sink affects the heat dissipation efficiency of the cooling system, and how to further reduce the goal of the heat resistance value of the heat sink. For a liquid cooling system, How to effectively guide the flow direction of a fluid inside a heat sink or/and enhance the heat exchange efficiency between the fluid and the heat sink can improve the heat dissipation efficiency of the liquid cooling system.
本創作之主要目的即在提供一種附鰭片型吸散熱器，其具有較佳的吸散熱效率。The main purpose of this creation is to provide a fin-type heat sink with better heat dissipation efficiency.
緣是，為達成前述之目的，本創作係提供一種附鰭片型吸散熱器，其至少包含有一第一板件、一第二板件、一毛細結構、一工作流體及複數散熱鰭片；該第二板件係與該第一板件結合而形成一密閉腔體，該毛細結構係設於該第二板件內側面，該工作流體係設於該腔體，其可吸收熱能轉變成氣態，氣態之工作流體經冷卻而流向該第二板件內側面；該些散熱鰭片係可以鏟削方式一體成形於及位於該第一板件外側面之一鰭片區域。Therefore, in order to achieve the foregoing objective, the present invention provides a fin-type heat sink having at least a first plate member, a second plate member, a capillary structure, a working fluid and a plurality of heat dissipation fins; The second plate is combined with the first plate to form a closed cavity, the capillary structure is disposed on the inner side of the second plate, and the working flow system is disposed in the cavity, and the heat energy is converted into The gaseous, gaseous working fluid flows to the inner side of the second plate by cooling; the heat dissipating fins are integrally formed in a shoveling manner and located in a fin region on the outer side of the first plate.
以下，茲舉本創作之若干較佳實施例，並配合圖式做進一步 詳細說明如后：In the following, some preferred embodiments of the present invention are presented, and further Details are as follows:
91‧‧‧均熱板91‧‧‧Homothermal board
92‧‧‧微結構92‧‧‧Microstructure
93‧‧‧散熱鰭片93‧‧‧Heat fins
11‧‧‧第一板件11‧‧‧First board
12‧‧‧第二板件12‧‧‧Second board
13‧‧‧毛細結構13‧‧‧Capillary structure
14‧‧‧工作流體14‧‧‧Working fluid
15‧‧‧散熱鰭片15‧‧‧ Heat sink fins
22‧‧‧腔體22‧‧‧ cavity
24‧‧‧鰭片區域24‧‧‧Fin area
31‧‧‧第三板件31‧‧‧ third board
32‧‧‧腔體32‧‧‧ cavity
33‧‧‧流體入口33‧‧‧ fluid inlet
34‧‧‧流體出口34‧‧‧ Fluid outlet
35‧‧‧工作流體35‧‧‧Working fluid
第一圖為習用均熱板之剖視圖。The first picture is a cross-sectional view of a conventional soaking plate.
第二圖為本創作較佳實施例(一)之部分分解立體圖。The second drawing is a partially exploded perspective view of the preferred embodiment (1) of the present invention.
第三圖為本創作較佳實施例(一)之正視圖。The third figure is a front view of the preferred embodiment (1) of the present invention.
第四圖為第三圖在A-A方向之剖視圖。The fourth figure is a cross-sectional view of the third figure in the A-A direction.
第五圖為本創作較佳實施例(二)之剖視圖。Figure 5 is a cross-sectional view of the preferred embodiment (II) of the present invention.
第六圖為本創作較佳實施例(三)之立體圖Figure 6 is a perspective view of the preferred embodiment (3) of the present invention.
請參閱第二至四圖，本創作所揭附鰭片型吸散熱器，其至少包含有一第一板件(11)、一第二板件(12)、一毛細結構(13)、一工作流體(14)及複數散熱鰭片(15)。Please refer to the second to fourth figures. The fin-type heat sink of the present invention includes at least a first plate member (11), a second plate member (12), a capillary structure (13), and a working Fluid (14) and a plurality of fins (15).
該第一板件(11)係概成矩形。The first panel (11) is generally rectangular.
該第二板件(12)係概成矩形，其周邊係二次延伸彎折，用以結合該第一板件(11)周邊而形成一密閉腔體(22)。The second plate member (12) is generally rectangular in shape, and the periphery thereof is bent in a secondary extension for forming a closed cavity (22) in combination with the periphery of the first plate member (11).
該毛細結構(13)係設於該第二板件(12)內側面。The capillary structure (13) is disposed on an inner side surface of the second plate member (12).
該工作流體(14)係設於該腔體(22)，其可吸收熱能轉變成氣態，氣態之工作流體(14)經冷卻而流向該第二板件(12)內側面。The working fluid (14) is disposed in the cavity (22), which absorbs thermal energy into a gaseous state, and the gaseous working fluid (14) is cooled to flow to the inner side of the second plate member (12).
該第一板件(11)之外側面係設有一鰭片區域(24)。A fin region (24) is disposed on the outer side of the first plate member (11).
該些散熱鰭片(15)係可以鏟削方式一體成形於該第一板件 外側面之該鰭片區域(24)。The heat dissipation fins (15) can be integrally formed on the first plate in a shoveling manner The fin area (24) on the outer side.
請再參閱第四圖，本創作所揭附鰭片型吸散熱器，其中各該散熱鰭片(15)係概成矩形而間隔排列。Referring to FIG. 4 again, the present invention discloses a fin-type heat sink, wherein each of the heat sink fins (15) is rectangular and spaced.
對應該鰭片區域(24)之該第二板件(12)外側面係用以抵接一熱源。The outer side of the second plate member (12) corresponding to the fin region (24) is used to abut a heat source.
本創作藉由該些散熱鰭片(15)及該毛細結構(13)的多工效應而具有較佳熱傳導效率。The present invention has better heat transfer efficiency by the multiplex effect of the heat dissipation fins (15) and the capillary structure (13).
本創作所揭附鰭片型吸散熱器，其中該毛細結構(13)可為粉末燒結或網目式之多孔質結構，亦可為混合粉末燒結及網目式之多孔質結構，其中該粉末係可設為銅粉末。The present invention discloses a fin type heat sink, wherein the capillary structure (13) may be a powder sintered or a mesh type porous structure, or may be a mixed powder sintered and a mesh type porous structure, wherein the powder system may be Set to copper powder.
請參閱第五圖，本創作所揭附鰭片型吸散熱器，其中該第一板件(11)在該鰭片區域(24)內之厚度係小於該鰭片區域(24)外之厚度，用以更加快熱傳導效率。Referring to FIG. 5, the present invention discloses a fin-type heat sink, wherein the thickness of the first plate member (11) in the fin region (24) is smaller than the thickness of the fin region (24). To speed up heat transfer efficiency.
請參閱第六圖，本創作所揭附鰭片型吸散熱器，其中該第一板件外側面，係設有一第三板件(31)及一另一工作流體(35)；該第三板件係以預定形狀緊密結合於該第一板件(11)周邊而形成一另一腔體(32)，該另一腔體(32)並設有一流體入口(33)及一流體出口(34)；該另一工作流體(35)係由該流體入口(33)進入該另一腔體(32)，而與該散熱鰭片(15)接觸並產生熱交換，再將熱由該流體出口(34)帶出該另一腔體(32)，使本創作具較佳之散熱效果。Referring to the sixth figure, the fin-type heat sink of the present invention is disclosed, wherein the outer side of the first plate is provided with a third plate member (31) and a further working fluid (35); The plate member is tightly coupled to the periphery of the first plate member (11) in a predetermined shape to form a further cavity (32), and the other cavity (32) is provided with a fluid inlet (33) and a fluid outlet ( 34); the other working fluid (35) enters the other cavity (32) from the fluid inlet (33), contacts the heat sink fin (15) and generates heat exchange, and then heats the fluid The outlet (34) carries out the other cavity (32), so that the creation has a better heat dissipation effect.
11‧‧‧第一板件11‧‧‧First board
12‧‧‧第二板件12‧‧‧Second board
13‧‧‧毛細結構13‧‧‧Capillary structure
14‧‧‧工作流體14‧‧‧Working fluid
15‧‧‧散熱鰭片15‧‧‧ Heat sink fins
22‧‧‧腔體22‧‧‧ cavity
24‧‧‧鰭片區域24‧‧‧Fin area
Claims (17)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102205675U TWM473685U (en) | 2013-03-27 | 2013-03-27 | Heat absorbing and dissipating device with fins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102205675U TWM473685U (en) | 2013-03-27 | 2013-03-27 | Heat absorbing and dissipating device with fins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM473685U true TWM473685U (en) | 2014-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102205675U TWM473685U (en) | 2013-03-27 | 2013-03-27 | Heat absorbing and dissipating device with fins |
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| TW (1) | TWM473685U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108495540A (en) * | 2018-06-08 | 2018-09-04 | 广东工业大学 | A kind of heat-radiating device of electric component with soaking plate |
| TWI640554B (en) * | 2016-11-28 | 2018-11-11 | 林紫綺 | Isothermal extrusion molding system and isothermal roller structure thereof |
-
2013
- 2013-03-27 TW TW102205675U patent/TWM473685U/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI640554B (en) * | 2016-11-28 | 2018-11-11 | 林紫綺 | Isothermal extrusion molding system and isothermal roller structure thereof |
| CN108495540A (en) * | 2018-06-08 | 2018-09-04 | 广东工业大学 | A kind of heat-radiating device of electric component with soaking plate |
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