TWM456523U - Multifunctional type heat absorber and sink - Google Patents
Multifunctional type heat absorber and sink Download PDFInfo
- Publication number
- TWM456523U TWM456523U TW101224520U TW101224520U TWM456523U TW M456523 U TWM456523 U TW M456523U TW 101224520 U TW101224520 U TW 101224520U TW 101224520 U TW101224520 U TW 101224520U TW M456523 U TWM456523 U TW M456523U
- Authority
- TW
- Taiwan
- Prior art keywords
- region
- heat sink
- plate
- sink according
- thickness
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本創作是與熱交換裝置有關,特別是指使用於具發熱體之裝置如伺服器、桌上型電腦、手提電腦、個人數位助理(PDA)、發光二極體(LED)燈具或機器設備等之中央處理器(CPU)或電子元件之一種多功型吸散熱器。This creation is related to heat exchange devices, especially for devices with heating elements such as servers, desktop computers, laptop computers, personal digital assistants (PDAs), light-emitting diode (LED) lamps or machinery, etc. A multi-function heat sink for a central processing unit (CPU) or electronic component.
一電子設備或一機器設備之吸散熱的作法已有風扇吹送空氣冷卻方式及/或熱管(heat pipe)冷卻方式,進一步有液體冷卻方式,用以應付這些設備的電子元件所產生的高熱,這些電子元件外側通常須設置一吸散熱器(heat sink),用以迅速地將熱導引出來並散熱。The heat dissipation method of an electronic device or a machine device has a fan blowing air cooling method and/or a heat pipe cooling method, and further a liquid cooling method for coping with the high heat generated by the electronic components of the devices. A heat sink is usually provided on the outside of the electronic component to quickly guide heat and dissipate heat.
請參閱第一圖,習用一均熱板(Vapor Chamber)(91)的功效是迅速地將熱導引出來並擴大熱的分佈,用以迅速地將熱導引出,均熱板基本原理是一個內部具一微結構(毛細結構)(92)的真空腔體,當熱由熱源傳導至蒸發區時,該腔體裡面的液體工質在低真空度的環境中,便會開始產生液相變氣相的現象,此時工質吸收熱能並且體積迅速膨脹,氣相的工質會很快充滿整個腔體,當氣相工質接觸到一個比較冷的區域如該均熱板(91)之一外側面抵接一散熱鰭片(93)時便會產生凝結的現象,藉由凝結的現象釋放出在蒸發時累積的熱,凝結後的液相工質會藉由該微結構(92)的毛細現象再回到蒸發熱源處,此運作將在腔體內週而復始進行,這 就是均熱板(或稱均溫板)的運作方式。又由於工質在蒸發時微結構可以產生毛細力,所以均熱板的運作可不受重力的影響Referring to the first figure, the function of a Vapor Chamber (91) is to quickly guide the heat out and expand the heat distribution to quickly guide the heat out. The basic principle of the soaking plate is a vacuum chamber having a microstructure (capillary structure) (92). When heat is conducted from the heat source to the evaporation zone, the liquid working fluid in the cavity begins to produce a liquid phase in a low vacuum environment. The phenomenon of gas phase change, when the working medium absorbs thermal energy and the volume expands rapidly, the working medium of the gas phase will quickly fill the entire cavity, when the gas phase working medium contacts a relatively cold area such as the soaking plate (91) When one of the outer sides abuts a fin (93), condensation occurs, and the condensation accumulates the heat accumulated during evaporation. The condensed liquid phase will pass through the microstructure (92). The capillary phenomenon is returned to the evaporation heat source, and the operation will be repeated in the cavity. It is the operation mode of the soaking plate (or the soaking plate). Moreover, since the microstructure can generate capillary force when the working medium evaporates, the operation of the soaking plate can be prevented from being affected by gravity.
一冷卻系統之一吸散熱器的結構係影響該冷卻系統之散熱效率,如何更降低該吸散熱器之熱阻值(Thermal Resistance Value)係業者所努力的目標,對於一液體冷卻系統,如何有效地導引一流體在一吸散熱器內部的流動方向或/及提升該流體與該吸散熱器的熱交換效率,更是能提升該液體冷卻系統之散熱效率。The structure of one of the cooling systems absorbs the heat sink, affecting the heat dissipation efficiency of the cooling system, how to reduce the heat resistance value of the heat sink, and how effective it is for a liquid cooling system. The flow guiding direction of a fluid inside a heat sink or/and the heat exchange efficiency between the fluid and the heat sink is improved, and the heat dissipation efficiency of the liquid cooling system can be improved.
本創作之主要目的即在提供一種多功型吸散熱器,其具有較佳的吸散熱效率。The main purpose of the present invention is to provide a multi-function heat sink with better heat dissipation efficiency.
緣是,為達成前述之目的,本創作係提供一種多功型吸散熱器,其至少包含有一第一板件、一第二板件、一毛細結構、一工作流體及複數鏟削式鰭片;該第二板件係與該第一板件結合而形成一密閉腔體,該毛細結構係設於該腔體而對應於該第二板件內側面上之一第一區域,該工作流體係設於該腔體,其可吸收熱能轉變成氣態,氣態之工作流體經冷卻而流向該第二板件內側面,該些鏟削式鰭片係以鏟削方式形成於及位於該第二板件內側面之一第二區域。Therefore, in order to achieve the foregoing objectives, the present invention provides a multi-functional heat sink having at least a first plate member, a second plate member, a capillary structure, a working fluid, and a plurality of scraping fins. The second plate is combined with the first plate to form a closed cavity, the capillary structure is disposed on the cavity and corresponds to a first area on the inner side of the second plate, the workflow The system is disposed in the cavity, and the absorbing heat energy is converted into a gaseous state, and the gaseous working fluid is cooled to flow to the inner side surface of the second plate member, and the shovel fins are formed by being scraped and located at the second A second area of the inner side of the panel.
以下,茲舉本創作之若干較佳實施例,並配合圖式做進一步之詳細說明如后: 第一圖為習用均熱板之剖視示意圖。In the following, some preferred embodiments of the present invention are described, and further detailed descriptions are made in conjunction with the drawings: The first picture is a schematic cross-sectional view of a conventional soaking plate.
第二圖為本創作較佳實施例(一)之部分分解立體示意圖。The second figure is a partially exploded perspective view of the preferred embodiment (1) of the present invention.
第三圖為本創作較佳實施例(一)之正視示意圖。The third figure is a front view of the preferred embodiment (1) of the present invention.
第四圖為第三圖在A-A方向之剖視示意圖。The fourth figure is a schematic cross-sectional view of the third figure in the A-A direction.
第五圖為本創作較佳實施例(二)之剖視示意圖。The fifth figure is a schematic cross-sectional view of a preferred embodiment (2) of the present invention.
第六圖為本創作較佳實施例(三)之剖視示意圖。Figure 6 is a schematic cross-sectional view showing a preferred embodiment (3) of the present invention.
請參閱第二至四圖,本創作所揭多功型吸散熱器,其至少包含有一第一板件(11)、一第二板件(12)、一毛細結構(13)、一工作流體(14)及複數鏟削式鰭片(15)。Referring to Figures 2 to 4, the multi-functional heat sink of the present invention comprises at least a first plate member (11), a second plate member (12), a capillary structure (13), and a working fluid. (14) and multiple scraping fins (15).
該第一板件(11)係概成矩形。The first panel (11) is generally rectangular.
該第二板件(12)係概成矩形,其周邊係二次延伸彎折,用以結合該第一板件(11)周邊而形成一密閉腔體(22)。The second plate member (12) is generally rectangular in shape, and the periphery thereof is bent in a secondary extension for forming a closed cavity (22) in combination with the periphery of the first plate member (11).
該毛細結構(13)係設於該腔體(22)而對應於該第二板件(12)內側面上之一第一區域(24)。The capillary structure (13) is disposed on the cavity (22) and corresponds to a first region (24) on the inner side of the second plate member (12).
該工作流體(14)係設於該腔體(22),其可吸收熱能轉變成氣態,氣態之工作流體(14)經冷卻而流向該第二板件(12)內側面。The working fluid (14) is disposed in the cavity (22), which absorbs thermal energy into a gaseous state, and the gaseous working fluid (14) is cooled to flow to the inner side of the second plate member (12).
該些鏟削式鰭片(15)係以鏟削方式形成於及位於該第二板件(12)內側面之一第二區域(26),其中對應該第二區域(26)之該第二板件(12)外側面係用以抵接一熱源。The shoveling fins (15) are formed in a shoveling manner and located in a second region (26) of the inner side of the second panel (12), wherein the second region (26) corresponds to the first The outer side of the two plates (12) is used to abut a heat source.
請再參閱第二圖,本創作所揭多功型吸散熱器,其中該第一區域(24)係圍繞該第二區域(26)。Referring to the second figure, the multi-functional heat sink of the present invention is disclosed, wherein the first area (24) surrounds the second area (26).
請再參閱第四圖,本創作所揭多功型吸散熱器,其中各該鏟削式鰭片(15)係概成矩形而間隔排列。Referring to the fourth figure, the multi-functional heat sink of the present invention is disclosed, wherein each of the shoveling fins (15) is arranged in a rectangular shape and spaced apart.
本創作藉由該些鏟削式鰭片(15)及該毛細結構(13)的多工效應而具有較佳熱傳導效率。The present invention has better heat transfer efficiency by the multiplexed fins (15) and the multiplex effect of the capillary structure (13).
本創作所揭多功型吸散熱器,其中該毛細結構(13)可為粉末燒結或網目式之多孔質結構,亦可為混合粉末燒結及網目式之多孔質結構,其中該粉末係可設為銅粉末。The multi-functional heat sink of the present invention, wherein the capillary structure (13) can be a powder sintered or mesh type porous structure, or a mixed powder sintered and mesh type porous structure, wherein the powder system can be set It is a copper powder.
請參閱第五圖,本創作所揭多功型吸散熱器,其中該第二板件(12)在該第二區域(26)之厚度係小於在該第一區域(24)之厚度,用以更加快熱傳導效率。Referring to FIG. 5, the multi-functional heat sink of the present invention discloses that the thickness of the second plate member (12) in the second region (26) is smaller than the thickness of the first region (24). To accelerate the heat transfer efficiency.
請參閱第六圖,本創作所揭多功型吸散熱器,其中該第二板件(12)在該第二區域(26)之外側面係凸出而高於該第一區域(24)之外側面,用以能更確實抵接一熱源。Referring to the sixth figure, the multi-functional heat sink of the present invention is disclosed, wherein the second plate member (12) protrudes from the outer side of the second region (26) and is higher than the first region (24). The outer side is used to more reliably abut a heat source.
(91)‧‧‧均熱板(91) ‧‧‧Homothermal board
(92)‧‧‧微結構(92)‧‧‧Microstructure
(93)‧‧‧散熱鰭片(93)‧‧‧Heat fins
(11)‧‧‧第一板件(11)‧‧‧First board
(12)‧‧‧第二板件(12)‧‧‧Second board
(13)‧‧‧毛細結構(13) ‧‧‧Capillary structure
(14)‧‧‧工作流體(14)‧‧‧Working fluid
(15)‧‧‧鏟削式鰭片(15)‧‧‧Scraped fins
(22)‧‧‧腔體(22) ‧‧‧ cavity
(24)‧‧‧第一區域(24) ‧‧‧First area
(26)‧‧‧第二區域(26)‧‧‧Second area
第一圖為習用均熱板之剖視示意圖。The first picture is a schematic cross-sectional view of a conventional soaking plate.
第二圖為本創作較佳實施例(一)之部分分解立體示意圖。The second figure is a partially exploded perspective view of the preferred embodiment (1) of the present invention.
第三圖為本創作較佳實施例(一)之正視示意圖。The third figure is a front view of the preferred embodiment (1) of the present invention.
第四圖為第三圖在A-A方向之剖視示意圖。The fourth figure is a schematic cross-sectional view of the third figure in the A-A direction.
第五圖為本創作較佳實施例(二)之剖視示意圖。The fifth figure is a schematic cross-sectional view of a preferred embodiment (2) of the present invention.
第六圖為本創作較佳實施例(三)之剖視示意圖。Figure 6 is a schematic cross-sectional view showing a preferred embodiment (3) of the present invention.
(11)‧‧‧第一板件(11)‧‧‧First board
(12)‧‧‧第二板件(12)‧‧‧Second board
(13)‧‧‧毛細結構(13) ‧‧‧Capillary structure
(14)‧‧‧工作流體(14)‧‧‧Working fluid
(15)‧‧‧鏟削式鰭片(15)‧‧‧Scraped fins
(22)‧‧‧腔體(22) ‧‧‧ cavity
(24)‧‧‧第一區域(24) ‧‧‧First area
(26)‧‧‧第二區域(26)‧‧‧Second area
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101224520U TWM456523U (en) | 2012-12-18 | 2012-12-18 | Multifunctional type heat absorber and sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101224520U TWM456523U (en) | 2012-12-18 | 2012-12-18 | Multifunctional type heat absorber and sink |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM456523U true TWM456523U (en) | 2013-07-01 |
Family
ID=49227067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101224520U TWM456523U (en) | 2012-12-18 | 2012-12-18 | Multifunctional type heat absorber and sink |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM456523U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI645155B (en) * | 2018-02-27 | 2018-12-21 | 雙鴻科技股份有限公司 | Heat sink device |
-
2012
- 2012-12-18 TW TW101224520U patent/TWM456523U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI645155B (en) * | 2018-02-27 | 2018-12-21 | 雙鴻科技股份有限公司 | Heat sink device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9261309B2 (en) | Loop heat pipe and manufacturing method thereof | |
US8982559B2 (en) | Heat sink, cooling module and coolable electronic board | |
US20120120604A1 (en) | Heat dissipation device | |
TW200643362A (en) | Loop-type heat exchange apparatus | |
US9170058B2 (en) | Heat pipe heat dissipation structure | |
TWI645155B (en) | Heat sink device | |
CN108271332B (en) | Radiator | |
US8371700B2 (en) | Heat dissipation module and projection apparatus using the same | |
TW201040485A (en) | Improved heat-dissipation structure | |
TWI624218B (en) | Thermosyphon radiating plate and electronic device having the same | |
Elnaggar et al. | Heat pipes for computer cooling applications | |
US20150129175A1 (en) | Thermosyphon heat sink | |
JP2013007501A (en) | Cooling device | |
US20050135061A1 (en) | Heat sink, assembly, and method of making | |
TWM455152U (en) | Micro-loop type isothermal heat dissipation device | |
TWM473685U (en) | Heat absorbing and dissipating device with fins | |
TWM456523U (en) | Multifunctional type heat absorber and sink | |
CN201039655Y (en) | Heat radiator structure | |
CN216385225U (en) | Loop heat pipe | |
TW201041492A (en) | Heat dissipation device | |
CN102480899A (en) | Cooling device | |
US20090219691A1 (en) | Heat sink capable of internal deflection | |
WO2019168146A1 (en) | Heat sink | |
TWM498303U (en) | Vapor chamber | |
KR101749927B1 (en) | Fast Heat Transferring Device Using Refrigerant |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |