TWM468796U - 連接器 - Google Patents

連接器 Download PDF

Info

Publication number
TWM468796U
TWM468796U TW102215717U TW102215717U TWM468796U TW M468796 U TWM468796 U TW M468796U TW 102215717 U TW102215717 U TW 102215717U TW 102215717 U TW102215717 U TW 102215717U TW M468796 U TWM468796 U TW M468796U
Authority
TW
Taiwan
Prior art keywords
substrate
conductive
plating layer
connector
layer
Prior art date
Application number
TW102215717U
Other languages
English (en)
Chinese (zh)
Inventor
Shinichi Hashimoto
Fumiaki Uzaki
Original Assignee
Tyco Electronics Japan G K
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Japan G K filed Critical Tyco Electronics Japan G K
Publication of TWM468796U publication Critical patent/TWM468796U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
TW102215717U 2012-10-31 2013-08-22 連接器 TWM468796U (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012240799A JP6208935B2 (ja) 2012-10-31 2012-10-31 コネクタ

Publications (1)

Publication Number Publication Date
TWM468796U true TWM468796U (zh) 2013-12-21

Family

ID=50156408

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102215717U TWM468796U (zh) 2012-10-31 2013-08-22 連接器

Country Status (4)

Country Link
JP (1) JP6208935B2 (ja)
CN (1) CN104769781A (ja)
TW (1) TWM468796U (ja)
WO (1) WO2014068848A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9870806B2 (en) 2016-03-24 2018-01-16 Western Digital Technologies, Inc. Hermetic sealing with high-speed transmission for hard disk drive

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2018003866A (es) * 2015-09-28 2018-06-15 Tactotek Oy Estructura de capas multiples y metodo de fabricacion relacionado para componentes electronicos.
EP3470681B1 (de) * 2017-10-10 2021-09-22 Pfeiffer Vacuum Gmbh Elektrische durchführung für ein vakuumgerät, in der form einer dichtungsplatine
JP6768730B2 (ja) * 2018-03-30 2020-10-14 株式会社東芝 電子機器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2833642B2 (ja) * 1994-02-15 1998-12-09 日立電線株式会社 多層配線基板及びその製造方法
JP3648021B2 (ja) * 1997-07-23 2005-05-18 株式会社山武 気密端子およびその形成方法
JP2003255017A (ja) * 2002-02-28 2003-09-10 Dainippon Printing Co Ltd 電子デバイス検査用コンタクトシート
JP4266326B2 (ja) * 2003-05-21 2009-05-20 タイコエレクトロニクスアンプ株式会社 電気接続構造および電気接続システム
CA2528889C (en) * 2003-06-26 2010-05-11 Formation, Inc. Environmental protection of serial ata and other electronic devices
JP4214068B2 (ja) * 2004-03-09 2009-01-28 パナソニック株式会社 多層ガラス基板の製造方法
CN101193502B (zh) * 2006-11-22 2012-07-04 欣兴电子股份有限公司 电路板结构的制作方法
JP4905983B2 (ja) * 2007-10-03 2012-03-28 北川工業株式会社 表面実装コンタクト
US8610001B2 (en) * 2010-05-21 2013-12-17 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
CN103477501A (zh) * 2011-04-20 2013-12-25 泰科电子日本合同会社 连接器以及连接器的制造方法
JP5845006B2 (ja) * 2011-06-29 2016-01-20 タイコエレクトロニクスジャパン合同会社 電気接続構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9870806B2 (en) 2016-03-24 2018-01-16 Western Digital Technologies, Inc. Hermetic sealing with high-speed transmission for hard disk drive

Also Published As

Publication number Publication date
WO2014068848A1 (ja) 2014-05-08
JP6208935B2 (ja) 2017-10-04
CN104769781A (zh) 2015-07-08
JP2014093121A (ja) 2014-05-19

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees