TW201011849A - Bare die dual-face detector - Google Patents

Bare die dual-face detector Download PDF

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Publication number
TW201011849A
TW201011849A TW097133831A TW97133831A TW201011849A TW 201011849 A TW201011849 A TW 201011849A TW 097133831 A TW097133831 A TW 097133831A TW 97133831 A TW97133831 A TW 97133831A TW 201011849 A TW201011849 A TW 201011849A
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Taiwan
Prior art keywords
bare
die
transparent glass
carrier
image
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TW097133831A
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Chinese (zh)
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TWI376003B (en
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chang-xin Lai
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King Yuan Electronics Co Ltd
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Priority to TW097133831A priority Critical patent/TW201011849A/en
Priority to JP2008271129A priority patent/JP4767302B2/en
Priority to KR1020080115156A priority patent/KR101043705B1/en
Publication of TW201011849A publication Critical patent/TW201011849A/en
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Publication of TWI376003B publication Critical patent/TWI376003B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Die Bonding (AREA)

Abstract

The invention relates to a bare die dual-face detector comprising a loading device, a front image acquisition device, a transparent glass, a back image detection device, a pick-and-place device and a controller. The invention firstly uses the front image acquisition device respectively to capture and detect the front pictures of plural bare dies on the bearing tray. The pick-and-place device then takes the bare dies under test on the bearing tray out and places them on the transparent glass. The back image detection device captures and detects the back pictures of the bare dies under testing upwardly from the bottom. Finally, the detection results are used to classify the bare dies while the pick-and-place device unloads the bare dies. The invention can greatly reduce manpower demand and detection time; furthermore, can reach cost-saving, and enhance operation efficiency and detection accuracy, will not damage the bare dies.

Description

201011849 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種裸晶粒雙面檢測設備，尤指—種適 5 10 15 20 用於半導體封裝測試製程中，用以檢測裸晶粒之正面、及 背面表面狀態之設備。 【先前技術】 半導體之封裝測試製程中，於封裝前之裸晶粒表面的 檢測步驟關係著整個最終產品品質中相當重要的—環。裸 晶粒表面檢測主要係在檢測其正反兩面之表面是否存在有 刮傷、裂痕、或是任何原本就㈣屬於待_晶粒之顆粒、 ，塵等外來物。其主要是因為表面任何的刮傷、裂痕、或 是顆粒、灰塵等外來物將會料產品的運作，嚴重者甚至 會導致完全失去其功效。 以往習知裸晶粒表面的檢測步驟採以人工方式進行， 亦即完全以人工之肉眼來進行檢查裸晶表面狀態，惟此一 方式效率㈣，耗費相當多的人力及時間，而且僅能以抽 檢的方式。再且，隨著製程技術的進步，裸晶粒的尺寸越 來越小’而人工肉眼所能及的視力範圍已無法滿足現代的 製程需求，其必須仰仗其他辅助設備。 另外，傳統肉眼檢查亦有一個嚴重缺點，亦即每一人 工檢測員判斷標準不-，導致常有判斷錯誤之情況發生。 此外’以現有技術μ針對裸晶粒背面之表面檢測仍是採 以人工方式進行倒盤，亦即以人卫方式將裸晶粒㈣後再 5 201011849 5 進仃背面檢測。此方式亦同樣耗費相當多的人力及時間， 而且也同樣會隨著晶粒尺寸越來越小，*到達4尺寸時 :工便無法在執行。其中’人工倒盤更有一個嚴重缺點， 即因人工翻面常反而會造成裸晶粒品質異常，例如因人 員疏忽造成刮傷、或是沾附灰塵、毛髮、皮料外來物、 甚至置放方向錯誤等。 由此可知’如何減少人力、及時間，以節省成本並提 升作業效率，而且又能增加檢_準確度，更不會因為翻 面檢測而造成裸晶粒額外損傷，實在是產業上的一種迫切 需要。 【發明内容】 本發明為—種裸晶粒雙面檢測設備，包括：一載入裝 置、一正面影像擷取裝置、一透明玻璃、一背面影像檢測 15裝^、-取放裝置、以及一控制器。其中，載入裝置包括 有-導引軌道、-滑台、及一承載盤。而滑台係滑移於導 弓丨軌道上並可停留於-第-位置、及一第二位置。且承載 盤係承載於滑台上方，承載盤上容置有複數個裸晶粒。另 外正面影像擷取裝置係位設於導引軌道上方、並對應於 20 位在第一位置之滑台上的承載盤。 再者，透明玻璃係組設於導引軌道之一侧、並鄰近於 位在苐一位置之滑台。而背面影像檢測裝置係組設於透明 玻璃下方，背面影像檢測裝置包括有一攝像鏡頭，攝像鏡 頭朝上面向透明玻璃。此外，取放裝置是選擇式地移動於 6 201011849 位在第二位置之滑台上的承載盤、與透明玻璃之間。其中， 控制器分別與載入裝置、正面影像擷取裝置、背面影像檢 測裝置、及取放裝置電性連接。而控制器控制正面影像掏 取裝置分別拍攝並檢測承載盤上複數個裸晶粒之正面畫 5 面。 再且，控制器控制取放裝置取出承載盤上複數個裸晶 粒其中之一待測裸晶粒並放置於透明玻璃上方。且又控制 器控制背面影像檢測裝置之攝像鏡頭由下往上拍攝並檢測 I 待測裸晶粒之背面晝面。因此，本發明俾能大幅減少人力 10需求、及檢測所需時間，進而節省成本並提升作業效率， 且又能有效增加檢測的準4度，更不會造成裸晶粒絲毫的 損壞。 其中，本發明之透明玻璃可包括有一特定區域，而特 15 ❹ 定區域用以承載著待測裸晶粒，又背面影像檢測裝置之攝 像鏡頭正好龍於透明玻璃之較區域下方。而其特定區 域可包括有-凸透鏡，其主要用以當裸晶粒尺寸於很小的 =下i可藉由凸透鏡Μ影像，而更能進行精確的檢測。 τ.重田發月不限於凸透鏡，其他等效透明透鏡或裝置亦 可運用於本發明中。 转彳透明玻璃又可更包括有另一特定區域，而另一 = : 於特定區域之—側，另-特定區域與上述特 =少其-可包括有—凸透鏡，另—特定區域 特毛區域不同放大倍率。藉由提供不同倍率之透鏡 7 201011849 區域以適用更多不同的裸晶粒尺寸、或不同精密之需求。 當然本發明並不仙二他域為限，亦可以包衫個區域。 此外’本發明之背面影像檢測裝置之攝像鏡頭可與透 月玻璃保肖距離，而攝像鏡頭並可選擇式地移行到 特定區域下方與另-特定區域下方之間。亦即本發明背面 影像檢測裝置之攝像鏡頭可進行三軸移動於透明玻璃的下 方區域，以便針對不同裸晶粒尺寸、不同位置、或不同透 鏡倍率之區域進行檢測。據此，本發明之t面影像檢測裝 置可更包括有-辅助光源，用以提供照明以便協助背面檢 測的進行。 較佳的是，本發明可更包括有一第一載出裝置、及至 少-第二載出裝置。而第一載出裝置上承載有一合格裸晶 粒承載盤，至少一第二載出裝置上承載有至少一瑕庇裸晶 粒承載盤。其主要用以提供檢測後的裸晶粒之合格與否進 15行分類。其中，良品置放於合格裸晶粒承載盤，不良品置 放於瑕疵裸晶粒承載盤。再且，本發明之取放裝置可包括 一真空吸嘴。 另外，本發明之控制器可包括一記憶體，而記憶體内 儲存有一裸晶粒正面標準圖像、及一裸晶粒背面標準圖 20 像。又，控制器可擷取正面影像擷取裝置傳來之複數個裸 晶粒之正面畫面’並據以分別與記憶體中之裸晶粒正面標 準圖像進行分析比對。此外，控制器更可擷取背面影像檢 測裝置傳來之待測裸晶粒之背面畫面，並據以與記憶體中 之該裸晶粒背面標準圖像進行分析比對。 8 25 201011849 ’ 【實施方式】 請同時參閱圖1及圖2,其中圖丨為本發明之裸晶粒雙面 檢測設備較佳實施例之整體設備示意圖，圖2為本發明一較 佳實施例之局部立體圖。圖中顯示有一載入裝置丨，其具有 5 一導引軌道11、一滑台12、及一承載盤13。其中，滑台12 係滑移於導引軌道11上並可停留於一第一位置丨4 '及一第 二位置15。而本實施例中導引轨道丨丨上為滚筒輸送帶，當 然可以依據不同需求而進行替換，例如滑軌等。而承載盤 Φ (tray)13係承載於滑台12上方，其承載盤13上容置有複數個 10待檢測的裸晶粒2。另外，載入裝置1還包括有如圖中顯示 之一夾盤器191，其主要用於自動化載入承載盤13，亦即藉 由夾盤器191從一載入區19來夾取承載盤13而到導引軌道 11上。 此外，圖中另顯示有一正面影像擷取裝置3，其係位設 15 於導引軌道11上方、並對應於位在第一位置14之滑台12上 的承載盤13 »而且，其包括有一移動支架31、及一攝影機 32，攝影機32是滑設於移動支架31上》亦即，在本實施例 中攝影機32是可進行三轴方向的移動，以方便進行影像的 擷取。另外，在本實施例中攝影機32是逐一針對單一裸晶 20粒之正面進行晝面擷取，而本實施例之攝影機32是採I CCD。 其中，圖中上顯示有一個透明玻璃4,其係組設於導引 軌道π之一側、並鄰近於位在第二位置15之滑台12。而本 實施例中透明玻璃4包括有一特定區域41、及另一特定區域 201011849 • 42。而特定區域41、及另一特定區域42是用以承載著待測 裸晶粒20〇其中，特定區域41、及另一特定區域42分別為 不同放大倍率之凸透鏡。而本實施例特別設置凸透鏡主要 目的在於，當裸晶粒尺寸於很小的情況下，可藉由凸透鏡 5來放大影像，而能進行更精確的檢測，並藉由提供不同倍 率之透鏡區域41，42以提供適用更多不同尺寸的裸晶粒。 當然本發明並不僅以二個區域為限，亦可以包括多個 區域。並且，特定區域41、及另一特定區域42之透鏡的配 φ 置可以是平面透鏡與平面透鏡、平面透鏡與凸透鏡、或是 10凸透鏡與凸透鏡，可以依需求搭配適合的透鏡。再者，本 發明亦不限於凸透鏡，其他等效透明透鏡或裝置亦可運用 於本發明中。 請一併參閱圖3，圖3為本發明一較佳實施例之局部側 視示意圖，為求能更明確顯示背面影像檢測裝置5、透明玻 15璃4、與其他元件之配置關係，圖中省略於第二位置15中之 滑台12、承載盤13、及裸晶粒2。圖中之背面影像檢測裝置 5是組設於透明玻璃4下方，而背面影像檢測裝置5具有一攝 像鏡頭51，而攝像鏡頭51朝上且面向透明玻璃4，其主要用 以擷取裸晶粒的背面晝面，而本實施例之攝像鏡頭51是採 20 用 CCD。 其中，背面影像檢測裝置5之攝像鏡頭51係與透明玻璃 4保持一特定距離(1。而攝像鏡頭51並可選擇式地移行到特 定區域41下方與另一特定區域42下方之間。亦即，本實施 例之背面影像檢測裝置5之攝像鏡頭5丨可進行三軸移動於 201011849 透明玻璃4的下方區域，以便針對不同裸晶粒尺 置、或不同透鏡倍率之區域進行檢測。又，圖: 一輔助光源52，其用以楹徂肢nH 另‘，、、員不有 進行。 k供照明以便協助背面晝面梅取的 另外，圖中又顯示有-第-載出裝置16、及一第二載 出裝置17。其中，第一載出裝置16上承载有 承載盤161，第二載出裝π保日日粗 戰出裝置17上承載有一瑕疵裸晶粒承載盤 171。其主要用以提供檢測後的裸晶粒之合格與否進行分 10 15 籲 20 類。於本實施例中另外有一第三載出裝置18，其用以日後 針對不同產品之需求而擴充準備用，抑或可提供不同瑕疯 等級之分料使用。又’圖中顯示有一取放裝置6，其可選擇 式地移動於位在第二位置15之滑台12上的承載盤Η、第一 载出裝置16第一載出裝置17、與透明玻璃4之間。而取放 裝置6具有-真空吸嘴，用以吸取及放置裸晶粒’其優點在 於可快速取放、且又不損傷裸晶粒。 再且，控制器7是分別與載入裝置丨、第一載出裝置16、 第二載出裝置17、正面影像擷取裝置3、背面影像檢測裝置 5、及取放裝置6電性連接。而控制器7控制正面影像擷取裝 置3分別拍攝並檢測承載盤丨3上複數個裸晶粒2之正面畫面 141。另外，控制器7又控制取放裝置6取出承載盤13上複數 個裸晶粒2其中之一待測裸晶粒2〇並放置於透明玻璃4上 方。又’控制器7亦控制背面影像檢測裝置5之攝像鏡頭51 由下往上拍攝並檢測待測裸晶粒20之背面畫面15 1。此外， 11 201011849 控制器7又將已檢測過後的待測裸晶粒2〇分別移動並放置 於第一載出裝置16、或第二載出裝置17其中之一。 5 15 20 據此’本實施例之控制器7其控制細節如下說明。控制 器7具有一 §己憶體71，而記憶體71内儲存有一裸晶粒正面標 準圖像71卜及一裸晶粒背面標準圖像712。而檢測進行時， 控制器7分別擷取正面影像擷取裝置3、及背面影像檢測裝 置5傳來之複數個裸晶粒2之正面畫面丨4卜及待測裸晶粒2 〇 之背面畫面15卜然後，據以分別分析比對其中裸晶粒正面 輮準圖像711與正面晝面141、及裸晶粒背面標準圖像712與 背面晝面151。其中當二者完全符合時，控制器7即驅動取 放裝置6自透明玻璃4取出待測裸晶粒並放置入第一載出裝 置16之合格裸晶粒承載盤161内。若其中有一面有瑕疵、或 二面皆有瑕庇，亦即沒有完全符合時，控制器7即驅動取放 裝置6自透明玻璃4取出待測裸晶粒並放置 Π之瑕隸晶粒承_171内。 載^置 並且 尽貫把例中控制器7還具有一計數器72。而控制 器7是透過計數器72分別計數合格裸晶粒承載盤161、以及 瑕疲裸晶粒承載盤171之上之裸·數量達—特定值時，亦 ^。格裸s曰粒承載盤161、或瑕疲裸晶粒承載盤⑺上承載 :裸晶粒已滿時’即控制第-載出裝置16、或第二載出裝 將合格稞晶粒承載盤161、或瑕疵裸 ^:彳^充新㈣承載盤4外，圖中顯示有一= 空的承載盤13收載入裝置1中經檢測、及取放後之 12 201011849 - 上述實施例僅係為了方便說明而舉例而已，本發明 主張之權利範圍自應以申請專利範圍所述為準，而非僅限 於上述實施例。 5 【圖式簡單說明】 圖1係本發明一較佳實施例之整體設備示意圖。 圖2係本發明一較佳實施例之局部立體圖。 圖3係本發明一較佳實施例之局部側視示意圖。 10 【主要元件符號說明】 1 載入裝置 11 導引軌道 12 滑台 13 承載盤 14 第一位置 141 正面畫面 15 第二位置 151 背面畫面 16 第一載出裝置 161 合格裸晶粒承載盤 17 第二載出裝置 171 瑕疵裸晶粒承栽盤 18 第三載出裝置 19 載入區 191 夾盤器 2 裸晶粒 20 待測裸晶粒 3 正面影像擷取裝置 31 移動支架 32 攝影機 4 透明玻璃 41 特定區域 42 另一特定區域 5 身面衫像檢測裝置 51 攝像鏡頭 52 輔助光源 6 取放裝置 7 控制器 13 201011849 71 記憶體 711 裸晶粒正面標準圖像 712 裸晶粒背面標準圖像 72 計數器 8 回收單元 d 特定距離201011849 IX. Description of the Invention: [Technical Field] The present invention relates to a bare-die double-sided detecting device, and more particularly to a suitable semiconductor package test process for detecting bare die Equipment for front and back surface conditions. [Prior Art] In the semiconductor package test process, the inspection step of the bare die surface before packaging is related to the loop of the final product quality. The surface inspection of bare crystal is mainly to detect whether there are scratches, cracks on the surface of the front and back sides, or any foreign matter such as particles, dust, etc. that are originally (4). The main reason is that any scratches, cracks, or foreign objects such as particles and dust will work on the product, and even severely, it will completely lose its efficacy. In the past, the detection steps of the bare crystal surface were manually performed, that is, the surface state of the bare crystal was completely examined by the artificial naked eye. However, the efficiency of the method (4) consumes a considerable amount of manpower and time, and can only be The way of sampling. Moreover, with the advancement of process technology, the size of the bare die is getting smaller and smaller, and the range of vision that can be achieved by the artificial naked eye can no longer meet the needs of modern processes, and it must rely on other auxiliary equipment. In addition, the traditional visual inspection also has a serious shortcoming, that is, each worker's inspector judges that the standard is not--, which leads to frequent judgment errors. In addition, the surface detection of the back surface of the bare die by the prior art μ is still performed by manual rewinding, that is, the bare die (four) and the rear side of the die are detected by the human guard. This method also consumes a considerable amount of manpower and time, and also as the grain size becomes smaller and smaller. When the * size is reached, the work cannot be performed. Among them, 'manual reversal has a serious disadvantage, that is, the artificial reversal will often cause abnormal quality of the bare crystal, such as scratching due to negligence, or dust, hair, leather, foreign objects, or even placement. The wrong direction, etc. This shows that 'how to reduce manpower and time, to save costs and improve work efficiency, but also to increase the accuracy of inspection, and not to cause additional damage to the bare die due to the flip detection, it is an urgent industry. need. SUMMARY OF THE INVENTION The present invention is a bare-die double-sided detecting device, comprising: a loading device, a front image capturing device, a transparent glass, a back image detecting device, a pick-and-place device, and a Controller. The loading device includes a guide rail, a slide table, and a carrier tray. The slide is slid over the guide rail and can rest in the -first position and a second position. The carrying tray is carried on the upper side of the sliding table, and the plurality of bare crystal grains are accommodated on the carrying tray. In addition, the front image capturing device is located above the guiding track and corresponds to 20 carrying plates on the sliding table in the first position. Further, the transparent glass system is disposed on one side of the guide rail and adjacent to the slide table located at the first position. The back image detecting device is disposed under the transparent glass, and the back image detecting device includes a camera lens with the camera lens facing upward facing the transparent glass. In addition, the pick-and-place device is selectively moved between the carrier tray on the slide table at the second position of the 201011849 position and the transparent glass. The controller is electrically connected to the loading device, the front image capturing device, the back image detecting device, and the pick and place device. The controller controls the front image capturing device to separately capture and detect the front side of the plurality of bare crystals on the carrier. Moreover, the controller controls the pick and place device to take out one of the plurality of bare crystal grains on the carrier disk to be tested and place it on the transparent glass. Moreover, the controller controls the camera lens of the back image detecting device to shoot from the bottom up and detect the back surface of the die to be tested. Therefore, the present invention can greatly reduce the manpower 10 demand and the time required for detection, thereby saving cost and improving work efficiency, and effectively increasing the quasi-four degrees of detection, and causing no damage to the bare crystal. Wherein, the transparent glass of the present invention may comprise a specific area, and the special area for carrying the bare die to be tested, and the image of the back side image detecting device is just below the area of the transparent glass. The specific area may include a lenticular lens, which is mainly used for accurate detection when the size of the bare crystal is small 下 by the convex lens Μ image. τ. 重田发月 is not limited to convex lenses, and other equivalent transparent lenses or devices can also be used in the present invention. The transfer transparent glass may further include another specific area, and the other =: on the side of the specific area, the other - the specific area and the above-mentioned special = less - may include a convex lens, and another - a specific area Different magnifications. By providing different magnifications of the lens 7 201011849 area to accommodate more different bare grain sizes, or different precision requirements. Of course, the present invention is not limited to the scope of the second, and it is also possible to coat an area. Further, the image pickup lens of the back image detecting device of the present invention can be kept away from the moonglass, and the image pickup lens can be selectively moved between the lower portion of the specific region and the lower portion of the other specific region. That is, the image pickup lens of the back image detecting device of the present invention can be moved three-axis to the lower region of the transparent glass to detect the regions of different bare grain sizes, different positions, or different lens magnifications. Accordingly, the t-plane image sensing device of the present invention may further include an auxiliary-light source for providing illumination to assist in the progress of the backside inspection. Preferably, the present invention may further comprise a first carrying device and at least a second carrying device. The first loading device carries a qualified bare grain carrier disk, and at least one second loading device carries at least one of the bare die carrier disks. It is mainly used to provide the classification of the bare die after inspection. Among them, the good products are placed on the qualified bare die carrier, and the defective products are placed on the bare die carrier. Further, the pick-and-place device of the present invention may include a vacuum nozzle. In addition, the controller of the present invention may include a memory in which a standard image of the front side of the bare die and a standard image of the back side of the bare die are stored. Moreover, the controller can capture the front image of the plurality of bare crystals transmitted from the front image capturing device ′ and separately compare and analyze the image with the bare front surface standard in the memory. In addition, the controller can capture the back image of the bare die to be tested transmitted from the back image detecting device, and compare and analyze the standard image of the bare die in the memory. 8 25 201011849 ' Embodiments Please refer to FIG. 1 and FIG. 2 together, wherein FIG. 2 is a schematic diagram of an overall device of a preferred embodiment of a bare die double-sided detecting device of the present invention, and FIG. 2 is a preferred embodiment of the present invention. Partial perspective view. The figure shows a loading device 具有 having a guide rail 11, a slide table 12, and a carrier tray 13. The slide table 12 is slid on the guide rail 11 and can stay in a first position 丨 4 ' and a second position 15. In the embodiment, the guide rail is a roller conveyor belt, and can be replaced according to different requirements, such as a slide rail. The carrier disk Φ (tray) 13 is carried on the sliding table 12, and the carrier disk 13 houses a plurality of bare die 2 to be detected. In addition, the loading device 1 further includes a chuck 191 as shown in the figure, which is mainly used for automatically loading the carrier tray 13, that is, the carrier tray 13 is gripped from a loading area 19 by the chuck 191. And to the guide track 11. In addition, a front image capturing device 3 is further shown, which is positioned 15 above the guiding track 11 and corresponding to the carrier plate 13 on the sliding table 12 of the first position 14 and further comprises The camera holder 32 and the camera 32 are slidably disposed on the mobile holder 31. That is, in the embodiment, the camera 32 is movable in the three-axis direction to facilitate image capture. Further, in the present embodiment, the camera 32 performs face-to-face extraction on the front side of a single bare crystal 20, and the camera 32 of the present embodiment is an I-CCD. Therein, a transparent glass 4 is shown in the figure, which is disposed on one side of the guiding track π and adjacent to the sliding table 12 in the second position 15. In the present embodiment, the transparent glass 4 includes a specific area 41 and another specific area 201011849 • 42. The specific area 41 and the other specific area 42 are used to carry the bare crystals 20 to be tested, and the specific area 41 and the other specific area 42 are convex lenses of different magnifications, respectively. The main purpose of the convex lens in this embodiment is that, when the size of the bare crystal grain is small, the image can be enlarged by the convex lens 5, and more precise detection can be performed, and the lens region 41 of different magnification can be provided. , 42 to provide more different sizes of bare die. Of course, the present invention is not limited to two regions, and may include a plurality of regions. Further, the φ of the lens of the specific region 41 and the other specific region 42 may be a planar lens and a planar lens, a planar lens and a convex lens, or a 10-convex lens and a convex lens, and may be matched with a suitable lens as needed. Furthermore, the invention is not limited to convex lenses, and other equivalent transparent lenses or devices may also be utilized in the present invention. Please refer to FIG. 3 together. FIG. 3 is a partial side elevational view of the preferred embodiment of the present invention. In order to more clearly show the relationship between the back image detecting device 5 and the transparent glass, the arrangement relationship with other components is shown in the figure. The slide table 12, the carrier disk 13, and the bare die 2 in the second position 15 are omitted. The back image detecting device 5 is disposed under the transparent glass 4, and the back image detecting device 5 has an image capturing lens 51, and the image capturing lens 51 faces upward and faces the transparent glass 4, which is mainly used for picking up the bare grain. The back side of the camera lens 51 of the present embodiment is a CCD. The image pickup lens 51 of the back image detecting device 5 is held at a specific distance (1) from the transparent glass 4, and the image pickup lens 51 is selectively moved between the lower portion of the specific region 41 and the lower portion of the other specific region 42. The imaging lens 5 of the back image detecting device 5 of the present embodiment can be moved three-axis to the lower region of the 201011849 transparent glass 4 to detect different regions of the bare die or different lens magnifications. : an auxiliary light source 52, which is used for the limbs nH, and is not carried out by the staff. k is provided for illumination to assist the back surface. In addition, the -first-loading device 16 is shown. a second loading device 17. The first loading device 16 carries a carrier disk 161, and the second loading device π is supported by a bare die carrier disk 171. In order to provide the qualified die or not, the third die-out device 18 is additionally used in the present embodiment to expand the preparation for the needs of different products in the future, or Available differently The use of the mad grade is used. Also shown in the figure is a pick-and-place device 6 that is selectively movable to the carrier tray located on the slide table 12 at the second position 15, the first loading device 16 first loaded The device 17 is disposed between the device and the transparent glass 4. The pick-and-place device 6 has a vacuum nozzle for sucking and placing the bare die. The advantage is that the pick-and-place device can be quickly accessed without damaging the bare die. The controller 7 is electrically connected to the loading device 丨, the first loading device 16, the second loading device 17, the front image capturing device 3, the back image detecting device 5, and the pick-and-place device 6. 7 controlling the front image capturing device 3 to respectively capture and detect the front picture 141 of the plurality of bare dies 2 on the carrying tray 3. In addition, the controller 7 controls the pick and place device 6 to take out the plurality of bare dies 2 on the carrying tray 13. One of the bare crystals to be tested is placed on top of the transparent glass 4. The controller 7 also controls the imaging lens 51 of the back image detecting device 5 to shoot from the bottom up and detect the back side of the bare die 20 to be tested. 15 1. In addition, 11 201011849 controller 7 will be tested again The bare die 2〇 are respectively moved and placed in one of the first carrying device 16 or the second carrying device 17. 5 15 20 According to this, the control details of the controller 7 of the present embodiment are as follows. The memory 71 has a bare crystal front standard image 71 and a bare crystal back standard image 712. When the detection is performed, the controller 7 respectively captures the front image capture. The front side picture of the plurality of bare crystals 2 transmitted from the device 3 and the back image detecting device 5 and the back image 15 of the bare crystal 2 to be tested are then analyzed separately to compare the bare crystal front side thereof. The image 711 and the front surface 141, and the bare back surface standard image 712 and the back surface 151 are formed. When the two are in full compliance, the controller 7 drives the pick-and-place device 6 to take out the bare die to be tested from the transparent glass 4 and place it into the qualified bare die carrier 161 of the first loading device 16. If one of the sides has a flaw, or both sides have a shield, that is, when there is no complete compliance, the controller 7 drives the pick-and-place device 6 to take out the bare die to be tested from the transparent glass 4 and place the die. Within _171. The controller 7 is also provided with a counter 72 in the example. The controller 7 counts the qualified bare die carrier 161 through the counter 72 and the bare number on the bare die carrier 171 to a specific value. The bare bare slab carrier disk 161, or the bare die carrier disk (7) carries: when the bare die is full, that is, the control first-loading device 16, or the second load-out device will be qualified. 161, or 瑕疵 bare ^: 彳 ^ new (4) outside the carrying tray 4, the figure shows an = empty carrier 13 received in the loading device 1 after detection, and pick and place 12 201011849 - the above embodiment is only for For convenience of description, the scope of the claims of the present invention is determined by the scope of the patent application, and is not limited to the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of an overall apparatus according to a preferred embodiment of the present invention. 2 is a partial perspective view of a preferred embodiment of the present invention. 3 is a partial side elevational view of a preferred embodiment of the present invention. 10 [Description of main component symbols] 1 Loading device 11 Guide rail 12 Slide table 13 Carrier tray 14 First position 141 Front screen 15 Second position 151 Back screen 16 First loading device 161 Qualified bare die carrier 17 Two carrying device 171 瑕疵 bare die bearing plate 18 third carrying device 19 loading area 191 chuck 2 bare die 20 bare die to be tested 3 front image capturing device 31 moving bracket 32 camera 4 transparent glass 41 Specific area 42 Another specific area 5 Body image detecting device 51 Camera lens 52 Auxiliary light source 6 Pick and place device 7 Controller 13 201011849 71 Memory 711 Bare die front standard image 712 Bare die back standard image 72 Counter 8 recovery unit d specific distance

Claims (1)

201011849 十、申請專利範圍： i 種裸晶粒雙面檢測設備，包括： 一載入裝置，包括有-導引軌道、-滑台、及-承載 盤，該滑台係滑移於該導引執道上並可停留於一第一位 5置、及一第三位置，該承載盤係承載於該滑台上方，該承 載盤上容置有複數個裸晶粒； 一正面影像擷取裝置，係位設於該導引轨道上方、並 對應於位在該第一位置之該滑台上的該承載盤； 嫌一透明玻璃，係組設於該導引執道之一侧、並鄰近於 10 位在該第二位置之該滑台； 一背面影像檢測裝置，係組設於該透明玻璃下方，誃 背面影像檢測裝置包括有一攝像鏡頭，該攝像 = 向該透明玻璃； 一取放裝置，選擇式地移動於位在該第二位置之該滑 15台上的該承載盤、與該透明玻璃之間；以及 控制益，分別與該載入裝置、該正面影像擷取裝置、 該背面影像檢測裝置、及該取放裝置電性連接，該控制器 控制該正面影像擁取裝置分別拍攝並檢測該承载盤上該複 數個裸晶粒之正面畫面，該控制器控制該取放裝置取出該 承載盤上該複數個裸晶粒其令之一待測裸晶粒並放置於該乂 透明玻璃上方，該控制器控制該背面影像檢測裝置之該攝 像鏡頭由下往上拍攝並檢測該待測裸晶粒之背面畫面。 2.如申請專利範圍第！項所述之裸晶粒雙面檢測設 備，其中’該透明玻璃包括有一特定區域，該特定區域用 15 201011849 承載者該待測裸晶粒 5 15 書 20 頭正好對應於該:二璃:該置之該攝像鏡 3.如申請專利範圍第2項所 儀’：中’該透明玻璃之該特定區域包括;Γ:測設 備，1、如二7二範圍第2項所述之裸晶粗雙面檢測設 U令’該透明玻璃更包括有另_特定區域 疋區域位於該特定區域之一 " ' 區域二者中至少其一包括有」凸:―二疋區域與該特定 有與該特定區域不同放大倍率。〜另一特定區域具 傷，=如申請專利範圍第4項所述之裸晶粒雙面檢測設 地移i兮影像檢測裝置之該攝像鏡頭並可選擇式 仃於該特定區域下方與該另一特定區域下方之間。 備，：更專利範圍第1項所述之裸晶粒雙面檢測設 3其更包括有—第—載出裝置、及至少一第二 =第—載出裝置上承載有—合格裸晶粒^ 第二载出裝置上承載有至少-瑕⑽晶粒承載盤 備L如申請專利範圍第1項所述之裸晶粒雙面檢測設 中’該控制器包括〜記憶體’該記憶體内儲存有一 ^正面&準圖像、及一裸晶粒背面標準圖像，該控制 查面取該正面影像操取裝置傳來之該複數個裸晶粒之正面 ς 乂並據以分別與該記憶體中之該裸晶粒正面標準圖像 仃二析比對’該控制器更操取該背面影像檢測裝置傳來 曰5待剃裸SB粒之背面晝面，並據以與該記憶體中之該裸 晶粒背面標準圖像進行分析比對。 16 201011849 - 8.如申明專利範圍第1項所述之裸晶粒雙面檢測設 備，其中’ 面影像檢測裝置之該攝I鏡頭係與該透明 玻璃保持一特定距離。 5 9.如申凊專利範圍第1項所述之裸晶粒雙面檢測設 備’其中’該背面影像檢測裝置更包括有—辅助光源。 借，巾請專利範圍第1項所述之裸晶粒雙面檢測設 、 ’该取放裝置包括一真空吸嘴。201011849 X. Patent application scope: i type of bare-die double-sided inspection equipment, comprising: a loading device comprising a guided-guide track, a slide table, and a carrier disk, the slide platform sliding on the guide The carrier can be placed in a first position and a third position, and the carrier is carried on the sliding table, and the carrier has a plurality of bare crystals; The carrier is disposed above the guiding track and corresponding to the carrier on the sliding table in the first position; a transparent glass is disposed on one side of the guiding lane and adjacent to 10 slides in the second position; a back image detecting device disposed under the transparent glass, the back image detecting device includes a camera lens, the camera = the transparent glass; a pick and place device, Selectively moving between the carrier tray located on the sliding 15 of the second position, and the transparent glass; and control benefits, respectively, the loading device, the front image capturing device, and the back image Detection device, and the pick-and-place device And the controller controls the front image capturing device to respectively capture and detect the front side of the plurality of bare dies on the carrier, the controller controls the pick and place device to take out the plurality of bare dies on the carrier One of the bare die to be tested is placed on the transparent glass, and the controller controls the camera lens of the back image detecting device to shoot from the bottom up and detect the back image of the die to be tested. 2. If you apply for a patent scope! The bare-die double-sided detecting device described in the item, wherein 'the transparent glass includes a specific area, the specific area is used by 15 201011849 carrier, the bare die to be tested 5 15 book 20 head corresponds exactly to the: two glass: the The image pickup lens 3. As in the scope of the second application of the patent application, the specific region of the transparent glass includes: Γ: measuring equipment, 1, the bare crystal coarse as described in the second item The double-sided detection device has the U command that the transparent glass further includes another region, the region is located in one of the specific regions, and at least one of the regions includes a convex: the second region and the specific Different magnifications for specific areas. ~ Another specific area is injurious, = the bare-lens double-sided detection set as described in claim 4 of the patent application, the camera lens of the image detecting device is selectively attached to the specific area and the other Between a specific area below. Preparation: The bare-die double-sided inspection device 3 described in the first aspect of the patent scope further includes a -first carrying device, and at least a second = first carrying device carrying a qualified bare die ^ The second loading device carries at least a -10 (10) die-carrying disk device L. The bare-die double-sided detecting device described in claim 1 of the patent scope is in the memory device. Storing a front surface and a quasi-image, and a standard image of the back side of the bare die, the control face taking the front side of the plurality of bare crystals from the front image manipulation device and respectively The standard image of the bare crystal on the front side of the memory is compared to the 'the controller'. The controller is operated by the backside image detecting device to transmit the back surface of the bare SB particle to be etched, and according to the memory The standard image of the back side of the bare die is analyzed and compared. The invention relates to a bare-die double-sided detecting device according to claim 1, wherein the photo-detecting device of the 'area image detecting device maintains a certain distance from the transparent glass. 5. The bare-die double-sided detecting device as described in claim 1, wherein the back image detecting device further includes an auxiliary light source. For the naked-die double-sided detection device described in the first item of the patent scope, the pick-and-place device includes a vacuum nozzle. 1717
TW097133831A 2008-09-03 2008-09-03 Bare die dual-face detector TW201011849A (en)

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JP2008271129A JP4767302B2 (en) 2008-09-03 2008-10-21 Double-sided inspection equipment for bare chips
KR1020080115156A KR101043705B1 (en) 2008-09-03 2008-11-19 A double-side inspection equipment for a die

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684226B (en) * 2016-12-27 2020-02-01 日商精工愛普生股份有限公司 Electronic component transport apparatus and electronic component inspection apparatus
CN112213936A (en) * 2020-09-28 2021-01-12 深圳市深科达智能装备股份有限公司 Positioning device and positioning method applied to fitting of round product
TWI780930B (en) * 2021-09-27 2022-10-11 由田新技股份有限公司 Carrier-based semiconductor inspection apparatus and semiconductor classification inspection system thereof

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106483126B (en) * 2015-08-27 2019-12-24 京元电子股份有限公司 Semiconductor element image testing device and testing equipment thereof
JP6849468B2 (en) * 2017-02-13 2021-03-24 ファスフォードテクノロジ株式会社 Semiconductor manufacturing equipment and manufacturing method of semiconductor equipment
CN112129700B (en) * 2020-09-01 2024-03-01 真贺科技(江苏)有限公司 Image detection method and device for flexible circuit board
TWI756142B (en) * 2021-06-15 2022-02-21 博磊科技股份有限公司 Substrate cutting device and operating method of substrate cutting device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH083473B2 (en) * 1988-05-31 1996-01-17 松下電子工業株式会社 Appearance inspection device
JP2891825B2 (en) * 1992-07-27 1999-05-17 大日本スクリーン製造株式会社 Pattern inspection equipment
JP4203164B2 (en) * 1998-01-27 2008-12-24 大日本印刷株式会社 Metal sheet inspection method and apparatus
JP3855733B2 (en) * 2001-10-30 2006-12-13 株式会社村田製作所 Electronic component visual inspection apparatus and visual inspection method
JP2003232750A (en) * 2002-02-06 2003-08-22 Toshiba Corp Apparatus and method for visual inspection
AU2003221328A1 (en) 2002-03-07 2003-09-16 Yamaha Motor Co., Ltd. Electronic part inspection device
KR20060041454A (en) * 2004-11-09 2006-05-12 삼성전자주식회사 Apparatus for automatically inspecting exterior of chip
JP4534025B2 (en) * 2004-11-30 2010-09-01 ルネサスエレクトロニクス株式会社 Appearance inspection apparatus and conveyance section for appearance inspection apparatus
KR100833716B1 (en) 2007-03-30 2008-05-29 (주) 인텍플러스 System for vision inspection of semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684226B (en) * 2016-12-27 2020-02-01 日商精工愛普生股份有限公司 Electronic component transport apparatus and electronic component inspection apparatus
US10591534B2 (en) 2016-12-27 2020-03-17 Seiko Epson Corporation Electronic component transport apparatus and electronic component inspection apparatus
CN112213936A (en) * 2020-09-28 2021-01-12 深圳市深科达智能装备股份有限公司 Positioning device and positioning method applied to fitting of round product
CN112213936B (en) * 2020-09-28 2022-05-10 深圳市深科达智能装备股份有限公司 Positioning device and positioning method applied to fitting of circular product
TWI780930B (en) * 2021-09-27 2022-10-11 由田新技股份有限公司 Carrier-based semiconductor inspection apparatus and semiconductor classification inspection system thereof

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