M381175 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱器之設計，特別是關於一種用以將 所產生的熱予以散逸之陶瓷散熱器結構改良。 【先前技術】 近年來由於LED燈的製造技術曰趨成熟，而且jjgD具有耗電 量低、發熱度低、使用壽命長、啟動速率快、色彩豐富以及亮度 佳之優點，能大量節省照明燈具的用電量。也因此，於環保觀念 曰趨受到重視之今日’LE1D已漸漸取代傳統燈具成為未來市場的主 流0 LED雖然有者上述的種種優點，但是當led使用於照明用途 時，係以複數個LED燈模組化而形成LED燈具，由模組化之LED 燈具提供所需之照明，而LED燈具在發光提供照明的同時也會產 # 生熱能，其所產生之熱能若無法有效散逸，長期下來將會影響LED 燈具的使用壽命。 在習知的LED散熱技術中，一般都是以陶瓷散熱器散熱或是 以鋁製鰭片散熱；其中，鋁製鰭片的散熱方式係將鋁製的散熱鰭 片裝設於LE：D模組之表面，當le：D模組發光時，由鋁製的散熱鰭 片將LED模組所產生的熱予以散逸。這樣的散熱方式雖然可以散 發LED模組所產生的熱’但是鋁製的散熱鰭片除了可以散熱之外， 也具有導電的功能’因此必須在LE：D模組與散熱鰭片之間做好絕 M381175 緣的工作’以防止Ί擊的情況發生。 而傳統_£散熱雜讀雜電路印製於喊散熱器，並 :Ρ衣元成後以700度以上之向溫長日寺間燒結，使電路固化於 陶变政熱g。然而’這制製作方式不但耗費時間過長，製造過 也相當繁複’而且製造過程巾所制之設備及麟成本都相當 向。 . 由此可見，習知的LED散熱器所衍生之問題及不足，實非一 籲良善之設計者’而亟待加以改良。 本案創作人鑑於上述U：D散熱器所衍生的各項問題及不足， 乃亟思加以改良觸’並經多年苦心'猶旨批研究後，終於成功 研發完成本件陶瓷散熱器結構改良。 【新型内容】 本創作之一目的即是提供一種陶究散熱器結構改良，藉由本 •創作所提供之陶竞散熱體，不但具有良好之絕緣效果，而且可以 將發光元件所產生的熱予以散逸。 本創作之另一目的即是提供一種陶瓷散熱器結構改良，將可 烊錫性銅膠層以網版印刷之方式形成於陶瓷散熱體表面，並經由 100至300度之溫度燒烤固化而形成電路，並黏貼於陶瓷散熱體， 以簡化製作過程，並降低成本。 可達成上述創作目的之陶瓷散熱器結構改良，包括一陶瓷散 熱體、一可焊錫性銅膠層、一焊錫層及一個以上之發光元件；可 4 mjo丄丄/j k錫性銅膠層係以’印刷之方式形成於喊散熱體表面，並經 ^ 100至300度之溫度燒烤固化而形成電路，並黏貼於陶究散熱 紅錫層係形絲可焊錫性娜層之上，碰將發統件設置 於電路層’並由焊錫制定魏元件；其中，可焊錫性銅膠層透 過焊錫層導通電力至發歧件，使發光元件在接收到電力而發 光’而且#光凡件在4光時所產±的熱能可直接經由陶曼散熱體 予以散逸。 經由本創作所細之技術手段，由於本創作係將可焊錫性銅 膠層直接印刷於陶錄熱體表面，再經由100至300度之溫度燒 烤而固化後即形成魏，並獅於陶紐紐，使發光树可直 接设置於可焊雜娜層卿成之電路上，並且由焊錫層固定發 光元件，然後由可焊錫性銅膠層透過焊錫層導通電力至發光元 件，使發光tl件接收電力而發光，而發光元件發光時所產生的設 可直接由陶曼放熱體予以散逸；因此，本創作不但簡化了製作過 程’也縮短了製作過程中所耗費的時間，無形中也降低了製作成 本，取代了傳統以銀膠將電路印製於陶兗散熱器，而且必須以· 度以上之高溫長時間燒結導致製作過程繁複，以及製作成本提高 的問題。 ° 其次’由於本創作係藉由陶兗散熱體將發光元件於發光時所 產生的熱能予以散逸’取代了習知技術以㈣散熱鰭片散熱之方 式，藉此，解決了習知技術之散熱器與LED模组組裝過程繁複， 而且生產成本較高㈣題；此外’由於本創作細喊作為散熱 5 L75 ^質’不朗樣具有良狀散熱效果，而且由於喊本身 緣政果，解決了紹製散熱縛片所產生的電擊的問題。、、巴 【實施方式】 為使貴審查委員方便瞭解本創作之其他特徵内絲優點， 成之功效能夠更為顯現，兹將本創作配合關，詳細說 請同時參閱第-圖至第_，第—圖係顯示本創作第一實施 例^分離示_，第二_顯示電路層職於喃散熱體表^之 不意圖，第三圖係顯示本創作第—實施例之結合示意圖，第四圖 係顯示本創作第—實施例之剖制。如圖所示，本創作之陶究散 熱器結構改良包括-陶錄熱體卜—可焊錫性銅膠層2、一 焊錫層3及複油發光元件4 絲體丨肋散熱·可賴性 銅膠層2形成於陶纽熱體丨表面，且具有二導線如、加用 以導通電力；烊錫層3形成於可桿錫性銅膠層2之上用以固定 發光元件4，並且將電力導通至發歧件4;發紅件4係為·， 用以接收電力而發光；在本實關巾，陶錄越丨係為導熱陶 究，亦可為多孔陶Μ者是石墨喊之―，而其形狀在本實施例 為方形’亦可視情況變換為其他形狀。 當可谭錫性銅膠層2形成於陶絲熱體i表面後，則00至 300度之溫度燒烤固化而形成電路，並黏貼於陶錄熱體i，接著 使焊錫層3形餘啊紐轉層2社，絲將發光元件4設 η 置於可焊紐_層2，並且由焊錫们將發光元件㈣定於 錫性銅膠層2 ’藉此’即可完成本編赚細嫩良刚； 其中’可焊錫性_層2亦可射焊錫性齡或可焊錫性峨之 而其形成於喊散熱體丨表面之方式亦可㈣網版印刷、鋼 板印刷、倾、轉印之方式形成於喊散熱體丨表面；另外，焊 踢層3可簡—般焊錫或錫膏以表祕著技術製作 錫性銅膠層2之上。 ~ 田本創作陶竞散熱器結構改良1〇〇組裝完成後，由可焊錫性 銅膠層2之二導線21a、21b導通電力’並透過焊錫層3將電力傳 送至發光元件4，使發光元件4在接收到電力後而發光。另外，當 發光元件4接收電力而發光的同時，發光元件4也會產生熱能^ 而發光轉4職生輪能讀導·越丨，_紐熱體 1將發光元件4所產生的熱能予以散逸。 一請參閱第五圖’其係顯示本創作第二實施例之示意圖。如圖 所示’本實施例之組成與作用原理與第—實施例大致相同，故在 此不再贅述。其差異在於本實施例陶究散熱器結構改良觸之陶 究散熱體la係為_形，而可焊鍚性_層2係形成於陶莞散熱 體1a之頂面’在可焊錫性銅膠層2上形成有一焊錫層3，並設置 有複數個發光元件4;可焊錫性銅朦層2透過焊錫層3導通電力至 :光元件4使發光元件4接收電力後而發光，而發光元件4發光 時所產生_可直接_統難la散逸。 請參閱第六圖，其係顯示本創作第三實施例之示意圖。如圖 M381175 所示，本實施綱錄熱H結構改良3⑽之喊與侧原理虚第 -實施例大致_，故在此。其差異在於本實施例之發 光元件4a係為高功率LED，設置於可焊錫性銅膠層2，用以錢 電力而發光；當發光元件4a接收電力而發光時，發光元件如所 產生的熱可由陶瓷散熱體1予以散逸。 上列詳細說_制糊狀—可行實闕之频說明，惟 該實施例並非__本創作之專·圍，凡未麟本創作技蔽 精_為之等效實施或變更，均應包含於本案之專利範圍中。； 。綜上所述’本案不但在技術思想上確屬織，並能較習用物 :增進上述多項功效，應已充分符合新雛及進步性之法定創作 =利要件，妥依法提出申請，懇請責局核准本件新型專利申請 案，以勵創作，至感德便。 月 【圖式簡單說明】 第一圖係顯示本創作第—實施例之分離示意圖。 ^二圖係顯示電路層形成於喊散熱體表面之示意圖 第三圖係顯示本創作第—實施例之結合示意圖。〜 第四圖係顯示本創作第—實施例之剖視圖。 第五圖係顯示本創作g二實施例之示意圖。 第六圖係顯示本創作第三實施例之示意圖。 【主要元件符號說明】 8 M381175 100、200、300...陶瓷散熱器結構改良 1、la...陶瓷散熱體 2.. .可焊錫性銅膠層 21a、21b...導線 3.. .焊錫層 4、4a...發光元件M381175 V. New Description: [New Technology Field] This creation is about the design of a heat sink, especially regarding a ceramic heat sink structure for dissipating the generated heat. [Prior Art] In recent years, due to the maturity of LED lamp manufacturing technology, and jjgD has the advantages of low power consumption, low heat generation, long service life, fast startup rate, rich color and good brightness, it can save a lot of lighting fixtures. Electricity. Therefore, the concept of environmental protection has become more and more important today. 'LE1D has gradually replaced the traditional lamps to become the mainstream of the future market. 0 Although there are some advantages of the above LEDs, when LED is used for lighting purposes, it is a plurality of LED lamp modules. Grouped to form LED luminaires, which provide the required illumination by modular LED luminaires, while LED luminaires provide heat generation while illuminating, and the heat generated by them will not be effectively dissipated. Affect the life of LED luminaires. In the conventional LED heat dissipation technology, the heat dissipation of the ceramic heat sink or the heat dissipation of the aluminum fins is generally performed; among them, the heat dissipation method of the aluminum fins is to install the aluminum heat dissipation fins on the LE:D mode. On the surface of the group, when the le:D module emits light, the heat generated by the LED module is dissipated by the heat radiating fins made of aluminum. Although such a heat dissipation method can dissipate the heat generated by the LED module, the aluminum heat sink fin has a conductive function in addition to heat dissipation, so it is necessary to do well between the LE:D module and the heat sink fin. The work of the M381175 edge is 'to prevent sniping. The traditional _£ heat-dissipating miscellaneous circuit is printed on the shouting radiator, and: After the Ρ衣元成, it is sintered to the temperature-changing temple with more than 700 degrees, so that the circuit is solidified in the ceramics. However, the production method of this system not only takes a long time, but also is quite complicated to manufacture. The equipment and the cost of the manufacturing process towel are quite similar. It can be seen that the problems and deficiencies derived from the conventional LED heatsinks are not a good designer and need to be improved. In view of the problems and deficiencies arising from the above-mentioned U:D radiator, the creators of this case have succeeded in researching and developing the structural improvement of this ceramic radiator after they have improved their experience and have been painstakingly researched for many years. [New content] One of the purposes of this creation is to provide a ceramic structure improvement. With the Tao Jing heat body provided by the creation, not only has good insulation effect, but also can dissipate the heat generated by the light-emitting elements. . Another object of the present invention is to provide a ceramic heat sink structure improvement, which can form a tin-filled copper adhesive layer on the surface of a ceramic heat sink by screen printing, and form a circuit by baking at a temperature of 100 to 300 degrees. And adhere to the ceramic heat sink to simplify the manufacturing process and reduce costs. The ceramic heat sink structure improvement can achieve the above-mentioned creation purpose, including a ceramic heat sink, a solderable copper adhesive layer, a solder layer and more than one light-emitting component; 4 mjo丄丄/jk tin-copper adhesive layer can be used 'Printing method is formed on the surface of the shouting heat sink, and is cured by a temperature of 100 to 300 degrees to form a circuit, and is adhered to the ceramic red-tin layered wire to be solderable on the layer of soldering. The component is disposed on the circuit layer 'and the solder component is made of solder; wherein the solderable copper paste layer conducts power to the hairpin through the solder layer, so that the light-emitting component emits light upon receiving power and the light component is in 4 light The heat energy produced can be dissipated directly through the Tauman heat sink. Through the technical means of this creation, the creation of the solderable copper layer directly on the surface of the ceramic hot body, and then cured by the temperature of 100 to 300 degrees, then formed Wei, and the lion in the Tao New, so that the illuminating tree can be directly placed on the circuit of the solderable layer, and the illuminating element is fixed by the solder layer, and then the solderable copper layer is used to conduct power to the illuminating element through the solder layer, so that the illuminating element is received. Electricity emits light, and the light-emitting element emits light when it is directly dissipated by the Tauman heat radiator; therefore, this creation not only simplifies the production process, but also shortens the time spent in the production process, and invisibly reduces the production. The cost replaces the traditional method of printing the circuit on the ceramic enamel radiator with silver glue, and it must be sintered at a high temperature for a long time, resulting in complicated production process and increased production cost. ° Secondly, because this creation system dissipates the heat energy generated by the illuminating element when it is illuminated by the ceramic heat sink, it replaces the conventional technology to dissipate heat from the fins, thereby solving the heat dissipation of the conventional technology. The assembly process of the LED module and the LED module is complicated, and the production cost is high (4). In addition, because of the creation of the product, the heat is 5 L75 ^ quality, which has a good heat dissipation effect, and is solved due to the slogan itself. The problem of electric shock generated by the heat-dissipating tab. 、,巴 [Embodiment] In order to make it easier for your review committee to understand the advantages of other features of this creation, the effect can be more obvious. Please cooperate with this creation. Please refer to the first to the _ in detail. The first figure shows that the first embodiment of the present invention is separated from the display _, the second _ display circuit layer is not intended to be used in the heat dissipation body table, and the third figure shows the combination of the first embodiment of the present creation, and the fourth The figure shows the section of the first embodiment of the present creation. As shown in the figure, the structural improvement of the ceramics radiator of this creation includes - ceramic recording heat body - solderable copper adhesive layer 2, a solder layer 3 and re-lighting light-emitting element 4 silk body rib heat dissipation and reliable copper The glue layer 2 is formed on the surface of the ceramic heat enthalpy, and has two wires, for example, for conducting electric power; the bismuth tin layer 3 is formed on the tin-copper-copper layer 2 for fixing the light-emitting element 4, and the electric power is Conducted to the hair-distributing part 4; the red-haired part 4 is ·, used to receive electricity and emit light; in the actual-cut towel, the Taolu Yue is a heat-conducting ceramics, or the porous pottery is a graphite shouting- The shape of the square in this embodiment can also be changed to other shapes as the case may be. When the tan tin-like copper layer 2 is formed on the surface of the ceramic hot body i, the temperature is 00 to 300 degrees, and the salt is cured to form a circuit, and is adhered to the ceramic heat body i, and then the solder layer is formed into a shape. In the layer 2, the wire is placed on the light-emitting element 4 in the solderable layer _ layer 2, and the solder element (four) is set on the tin-copper layer 2 'by this' to complete the book to earn a tender and tender; The 'weldable _ layer 2 can also be soldered to the age of solder or solderable, and it can be formed on the surface of the heat sink. (4) Screen printing, steel printing, tilting, transfer, etc. The heat sink body surface; in addition, the solder layer 3 can be simply soldered or solder paste to form a tin-like copper layer 2 on the surface. ~ Tian Ben's creation of Tao Jing's heat sink structure is improved. After the assembly is completed, the electric wires are turned on by the two wires 21a and 21b of the solderable copper clad layer 2, and the electric power is transmitted to the light-emitting element 4 through the solder layer 3, so that the light-emitting element is made. 4 emits light after receiving power. In addition, when the light-emitting element 4 receives power and emits light, the light-emitting element 4 also generates heat energy, and the light-emitting element 4 can read and guide the lighter, and the heat-heating element 1 dissipates the heat energy generated by the light-emitting element 4. . Please refer to the fifth figure, which shows a schematic diagram of a second embodiment of the present creation. As shown in the figure, the composition and operation principle of the present embodiment are substantially the same as those of the first embodiment, and therefore will not be described again. The difference lies in the fact that the heat sink structure of the heat sink structure of the embodiment is _ shape, and the solderable layer _ layer 2 is formed on the top surface of the ceramic heat sink 1a 'in the solderable copper glue A solder layer 3 is formed on the layer 2, and a plurality of light-emitting elements 4 are disposed. The solderable copper layer 2 is electrically connected to the solder layer 3 until the light-emitting element 4 receives the power and emits light, and the light-emitting element 4 emits light. When the light is generated, it can be directly _ difficult to dissipate. Please refer to the sixth figure, which is a schematic view showing a third embodiment of the present creation. As shown in Fig. M381175, this embodiment shows that the hot H structure improvement 3 (10) shouting and the side principle virtual - the embodiment is roughly _, therefore here. The difference is that the light-emitting element 4a of the present embodiment is a high-power LED, which is disposed on the solderable copper adhesive layer 2 for emitting light with power; when the light-emitting element 4a receives power and emits light, the light-emitting element generates heat. It can be dissipated by the ceramic heat sink 1. The above is a detailed description of the _ paste--------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- In the scope of the patent in this case. ; To sum up, 'this case is not only technically woven, but also better than the conventional use: to enhance the above-mentioned multiple functions, it should have fully complied with the new chicks and progressive statutory creation=profits, and apply in accordance with the law, please be responsible Approving this new type of patent application, in order to encourage creation, to the sense of virtue. Month [Simple Description of the Drawings] The first figure shows the separation diagram of the first embodiment of the present creation. ^The second figure shows a schematic diagram of the circuit layer formed on the surface of the shattering heat sink. The third figure shows a combination of the first embodiment of the present invention. ~ The fourth figure shows a cross-sectional view of the first embodiment of the present creation. The fifth figure shows a schematic diagram of the second embodiment of the present creation. The sixth figure shows a schematic view of a third embodiment of the present creation. [Main component symbol description] 8 M381175 100, 200, 300... Ceramic heat sink structure improvement 1, la... Ceramic heat sink 2. Solderable copper adhesive layer 21a, 21b... Wire 3.. Solder layer 4, 4a... light-emitting element