CN102339943A - Heat-radiating structure for polycrystalline metal base-type light-emitting diode (LED) and method for manufacturing same - Google Patents
Heat-radiating structure for polycrystalline metal base-type light-emitting diode (LED) and method for manufacturing same Download PDFInfo
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- CN102339943A CN102339943A CN2010102365204A CN201010236520A CN102339943A CN 102339943 A CN102339943 A CN 102339943A CN 2010102365204 A CN2010102365204 A CN 2010102365204A CN 201010236520 A CN201010236520 A CN 201010236520A CN 102339943 A CN102339943 A CN 102339943A
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- emitting diode
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- polycrystalline metal
- heat
- formula light
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Abstract
The invention relates to a heat-radiating structure for a polycrystalline metal base-type light-emitting diode (LED) and a method for manufacturing the same. The structure comprises a composite substrate, an insulating heat-conducting glue layer, a printed circuit layer, an electricity-conducting and heat-conducting layer and the polycrystalline metal base-type LED; the composite substrate is connected with the printed circuit layer through the insulating heat-conducting layer; and the printed circuit layer is connected with the polycrystalline metal base-type LED through the electricity-conducting and heat-conducting layer. Thus, the heat-radiating structure for the polycrystalline metal base-type LED is formed. With the adoption of the design provided by the invention, the service life of polycrystalline metal base-type LEDs can be prolonged, and the light decay of the LEDs can be prevented.
Description
Technical field
The present invention relates to a kind of radiator structure and manufacturing approach thereof, particularly a kind of polycrystalline metal base formula light emitting diode (LED) radiating structure and manufacturing approach thereof.
Background technology
Be the response environmental protection, LED (Light Emitting Diode, light-emitting diode) light fixture replaces conventional lamp gradually; And existing LED is for cooperating the demand in various markets; Develop towards polycrystalline encapsulation direction, but that it has a heat radiation is bad or dispel the heat uneven problem, thereby causes LED to produce light decay; Reduce useful life, futile consumes resources.
Summary of the invention
In view of this, how therefore the constantly research of this case inventor process, experiment and improvement, forgo the disappearance of existing LED radiator structure, are the place of the technical difficulties of this case inventor institute desire solution.
The object of the invention promptly provides a kind of polycrystalline metal base formula light emitting diode (LED) radiating structure and manufacturing approach thereof, relies on design of the present invention, can prolong the useful life of polycrystalline metal base formula light-emitting diode and the light decay that can prevent light-emitting diode.
Can reach the manufacturing approach of a kind of polycrystalline metal base formula light emitting diode (LED) radiating structure of foregoing invention purpose, comprise the following step:
(A) on a composite base plate, be provided with a layer printed circuit board;
(B) polycrystalline metal base formula light-emitting diode is incorporated into this layer printed circuit board;
(C) be electrically connected with this layer printed circuit board with a lead.
The present invention provides a kind of polycrystalline metal base formula light emitting diode (LED) radiating structure again, and it includes: a composite base plate, an insulating heat-conductive layer, a layer printed circuit board, a conductive and heat-conductive layer and a polycrystalline metal base formula light-emitting diode.Composite base plate and layer printed circuit board are connected with the insulating heat-conductive layer, and layer printed circuit board combines with the conductive and heat-conductive layer with polycrystalline metal base formula light-emitting diode; Thus, form a kind of polycrystalline metal base formula light emitting diode (LED) radiating structure.
Via the technological means that the present invention adopted; Rely on design of the present invention; The face that the connects heat of polycrystalline metal base formula light-emitting diode is at first spread the even and laterally heat conduction fast of layer printed circuit board of copper, the even again and quick effect that is reached three quick heat radiatings by composite base plate by metal base to large tracts of land; Make polycrystalline metal base formula light-emitting diode not only can reach the effect of quick heat radiating; And between polycrystalline light emitting diode; Because heat radiation is balanced; So have consistent thermoelectric effect, therefore can prolong the useful life of polycrystalline metal base formula light-emitting diode and the light decay that can prevent light-emitting diode.
Description of drawings
Fig. 1-1 is a steps A of the present invention;
Fig. 1-2 is step B of the present invention;
Fig. 1-3 is step C of the present invention;
Fig. 2 is a decomposing schematic representation of the present invention;
Fig. 3 is a configuration schematic diagram of the present invention;
Fig. 4 is embodiments of the invention.
Description of reference numerals: composite base plate 1; Layer printed circuit board 2; Conductive and heat-conductive layer 3; Polycrystalline metal base formula light-emitting diode 4; Lead 41; Insulating heat-conductive layer 5.
Embodiment
For convenient simple and direct understanding other features of the present invention of your auditor and its effect of being reached of advantage can more be manifested,, specify as follows now with conjunction with figs. of the present invention:
Can reach the manufacturing approach of a kind of polycrystalline metal base formula light emitting diode (LED) radiating structure of foregoing invention purpose, comprise the following step:
(A) on a composite base plate, be provided with a layer printed circuit board;
(B) polycrystalline metal base formula light-emitting diode is incorporated into this layer printed circuit board;
(C) be electrically connected with this layer printed circuit board with a lead.
Please refer to Fig. 1-1,, represent among the figure, on a composite base plate 1, be provided with a layer printed circuit board 2, and composite base plate 1 is connected with insulating heat-conductive layer 5 with layer printed circuit board 2 for steps A of the present invention.
Please refer to Fig. 1-2; Be step B of the present invention; Represent among the figure, polycrystalline metal base formula light-emitting diode 4 is incorporated into this layer printed circuit board 2, and the two is connected with conductive and heat-conductive layer 3; And through the heat mode of melting polycrystalline metal base formula light-emitting diode 4 is combined with this layer printed circuit board 2, the heat mode of melting can rely on high frequency or ultrasonic waves means.
Please refer to Fig. 1-3,, represent among the figure, polycrystalline metal base formula light-emitting diode 4 with after this layer printed circuit board 2 combines with the heat mode of melting, is electrically connected this polycrystalline metal base formula light-emitting diode 4 with a lead 41 with this layer printed circuit board 2 for step C of the present invention; This polycrystalline metal base formula light-emitting diode 4 is arranged with average area of dissipation mode and is arranged on the layer printed circuit board 2; This conductive and heat-conductive layer 3 is elargol or tin cream scolder; This composite base plate 1 is composite graphite material or ceramic material; The material of this insulating heat-conductive layer 5 is a glass fiber, so, is manufacturing approach of the present invention.
Please refer to Fig. 2 and Fig. 1-3; Be decomposing schematic representation of the present invention and combination sketch map; Represent among the figure; It includes: a composite base plate 1, a layer printed circuit board 2, a conductive and heat-conductive layer 3, a polycrystalline metal base formula light-emitting diode 4 and an insulating heat-conductive layer 5; Composite base plate 1 is connected with insulating heat-conductive layer 5 with layer printed circuit board 2, and layer printed circuit board 2 and polycrystalline metal base formula light-emitting diode 4 combine with conductive and heat-conductive layer 3, and this polycrystalline metal base formula light-emitting diode 4 and be electrically connected with layer printed circuit board 2 with a lead 41; Thus, form a kind of polycrystalline metal base formula light emitting diode (LED) radiating structure.
Please refer to Fig. 3 and Fig. 4 again; Be configuration schematic diagram of the present invention and embodiment; As shown in the figure; It includes: a composite base plate 1, a layer printed circuit board 2, a conductive and heat-conductive layer 3, a polycrystalline metal base formula light-emitting diode 4 and an insulating heat-conductive layer 5, and composite base plate 1 is connected with insulating heat-conductive layer 5 with layer printed circuit board 2, and layer printed circuit board 2 and polycrystalline metal base formula light-emitting diode 4 combine with conductive and heat-conductive layer 3; And this polycrystalline metal base formula light-emitting diode 4 also is electrically connected with layer printed circuit board 2 with a lead 41, and this polycrystalline metal base formula light-emitting diode 4 is on average to be arranged on the layer printed circuit board 2; Thus, form a kind of polycrystalline metal base formula light emitting diode (LED) radiating structure.As shown in Figure 3, this polycrystalline metal base formula light-emitting diode 4 is arranged with average area of dissipation mode and is arranged on the layer printed circuit board 2 with equal large tracts of land shop copper, and the phase I area of dissipation that reaches each polycrystalline metal base formula light-emitting diode 4 is identical; Make the face that the connects heat of each polycrystalline metal base formula light-emitting diode 4 at first reach evenly and laterally heat conduction fast by the layer printed circuit board 2 of metal base to large tracts of land shop copper.
Please refer to Fig. 4 again, as shown in the figure, polycrystalline metal base formula light-emitting diode 4 removes the large tracts of land shop copper that can rely on layer printed circuit board 2, carries out rapidly outside the heat conduction, also can rely on evenly and reached by composite base plate 1 fast the effect of three quick heat radiatings of second stage; Make polycrystalline metal base formula light-emitting diode 4 not only can reach the effect of quick heat radiating, and 4 of polycrystalline metal base formula light-emitting diodes, because heat radiation is balanced, so have the thermoelectric effect of unanimity.
Yet the above is merely of the present invention one preferable possible embodiments; Non-so promptly arrest limit claim of the present invention; So equivalent structure that uses specification of the present invention and graphic content to do such as; Directly or indirectly apply to other correlative technology field person, all in like manner all ought to be contained in the scope of spiritual category of the present invention, close and give Chen Ming.
Advantage of the present invention:
1, the present invention arranges polycrystalline metal base formula light-emitting diode and is arranged on the layer printed circuit board that equates large tracts of land shop copper with average area of dissipation mode, and the phase I area of dissipation that reaches each polycrystalline metal base formula light-emitting diode is identical; Make the face that the connects heat of each polycrystalline metal base formula light-emitting diode at first reach evenly and laterally heat conduction fast by the layer printed circuit board of metal base to large tracts of land shop copper.
2, the present invention can rely on evenly and reached by the composite graphite substrate fast the effect of three quick heat radiatings of second stage; Make polycrystalline metal base formula light-emitting diode not only can reach the effect of quick heat radiating, and between polycrystalline light emitting diode, because heat radiation is balanced, so have consistent thermoelectric effect.Rely on design of the present invention, can prolong the useful life of polycrystalline metal base formula light-emitting diode and the light decay that can prevent light-emitting diode.
In sum, the present invention is breaking through under the previous technical pattern, has reached the effect that institute's desire is promoted really, and also non-ly is familiar with this easy full of beard of art institute and reaches; Moreover not open before the application of the present invention, the progressive of its tool, practicality show the application important document that has met patent of invention, and the whence proposes the invention application in accordance with the law.
Claims (10)
1. the manufacturing approach of a polycrystalline metal base formula light emitting diode (LED) radiating structure is characterized in that, comprises the following step:
(A) on a composite base plate, be provided with a layer printed circuit board;
(B) polycrystalline metal base formula light-emitting diode is incorporated into this layer printed circuit board;
(C) be electrically connected with this layer printed circuit board with a lead.
2. the manufacturing approach of polycrystalline metal base formula light emitting diode (LED) radiating structure as claimed in claim 1 is characterized in that, this composite base plate combines through the heat mode of melting with this polycrystalline metal base formula light-emitting diode.
3. the manufacturing approach of polycrystalline metal base formula light emitting diode (LED) radiating structure as claimed in claim 2 is characterized in that, heat is melted mode and relied on high frequency or ultrasonic waves means.
4. the manufacturing approach of polycrystalline metal base formula light emitting diode (LED) radiating structure as claimed in claim 3 is characterized in that this composite base plate combines with this layer printed circuit board through an insulating heat-conductive layer, and this composite base plate is composite graphite material or ceramic material.
5. the manufacturing approach of polycrystalline metal base formula light emitting diode (LED) radiating structure as claimed in claim 1 is characterized in that this composite base plate and layer printed circuit board are connected with an insulating heat-conductive layer.
6. the manufacturing approach of polycrystalline metal base formula light emitting diode (LED) radiating structure as claimed in claim 5 is characterized in that the material of this insulating heat-conductive layer is a glass fiber.
7. the manufacturing approach of polycrystalline metal base formula light emitting diode (LED) radiating structure as claimed in claim 5 is characterized in that, the conductive and heat-conductive layer is elargol or tin cream scolder.
8. a polycrystalline metal base formula light emitting diode (LED) radiating structure is characterized in that, includes:
One composite base plate, it combines with a layer printed circuit board;
One polycrystalline metal base formula light-emitting diode, it relies on a conductive and heat-conductive layer to combine with this layer printed circuit board.
9. polycrystalline metal base formula light emitting diode (LED) radiating structure as claimed in claim 8 is characterized in that, this composite base plate relies on an insulating heat-conductive layer to combine with this layer printed circuit board.
10. polycrystalline metal base formula light emitting diode (LED) radiating structure as claimed in claim 9 is characterized in that, this polycrystalline metal base formula light-emitting diode is arranged and is arranged on this composite base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102365204A CN102339943A (en) | 2010-07-22 | 2010-07-22 | Heat-radiating structure for polycrystalline metal base-type light-emitting diode (LED) and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102365204A CN102339943A (en) | 2010-07-22 | 2010-07-22 | Heat-radiating structure for polycrystalline metal base-type light-emitting diode (LED) and method for manufacturing same |
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| Publication Number | Publication Date |
|---|---|
| CN102339943A true CN102339943A (en) | 2012-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102365204A Pending CN102339943A (en) | 2010-07-22 | 2010-07-22 | Heat-radiating structure for polycrystalline metal base-type light-emitting diode (LED) and method for manufacturing same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102692000A (en) * | 2012-06-04 | 2012-09-26 | 山西山地新源科技有限公司 | Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate |
| CN109791286A (en) * | 2016-04-26 | 2019-05-21 | 法雷奥舒适驾驶助手公司 | Display |
| CN114975753A (en) * | 2022-07-28 | 2022-08-30 | 东莞市湃泊科技有限公司 | Optical chip packaging base |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004119515A (en) * | 2002-09-24 | 2004-04-15 | Neo Led Technology Co Ltd | Light emitting diode display module with high heat radiation and its substrate |
| JP2008027979A (en) * | 2006-07-18 | 2008-02-07 | Lumi Tech:Kk | Light-emitting device |
| JP2008294399A (en) * | 2007-05-23 | 2008-12-04 | Augux Co Ltd | Fixing method of light emitting diode by tin solder |
| CN201741726U (en) * | 2010-06-23 | 2011-02-09 | 上海卓凯电子科技有限公司 | Polycrystal metal base type light emitting diode radiating structure |
-
2010
- 2010-07-22 CN CN2010102365204A patent/CN102339943A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004119515A (en) * | 2002-09-24 | 2004-04-15 | Neo Led Technology Co Ltd | Light emitting diode display module with high heat radiation and its substrate |
| JP2008027979A (en) * | 2006-07-18 | 2008-02-07 | Lumi Tech:Kk | Light-emitting device |
| JP2008294399A (en) * | 2007-05-23 | 2008-12-04 | Augux Co Ltd | Fixing method of light emitting diode by tin solder |
| CN201741726U (en) * | 2010-06-23 | 2011-02-09 | 上海卓凯电子科技有限公司 | Polycrystal metal base type light emitting diode radiating structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102692000A (en) * | 2012-06-04 | 2012-09-26 | 山西山地新源科技有限公司 | Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate |
| CN109791286A (en) * | 2016-04-26 | 2019-05-21 | 法雷奥舒适驾驶助手公司 | Display |
| CN114975753A (en) * | 2022-07-28 | 2022-08-30 | 东莞市湃泊科技有限公司 | Optical chip packaging base |
| CN114975753B (en) * | 2022-07-28 | 2022-11-04 | 东莞市湃泊科技有限公司 | Optical chip packaging base |
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Application publication date: 20120201 |