五、新型說明： 【新型所屬之技術領域】 [0001] [0002] [0003] [0004] [0005] [0006] 本創作係關於一種散熱模組（heat dissipating module)，特別是關於一種良率高、散熱效果佳、成本低 且具可浮動散熱器（movable heat sink)的散熱模組。 【先前技術】 在現今之散熱模組主要是以在基板上直接焊接多個鰭 片的方式，用來對電子元件進行散熱。然而，隨著電子 元件數量之增加，且每一電子元件使用散熱模組來散熱 ，導致整個系統使用空間無法被縮小而逐漸不符小型化 的潮流。 為解決上述問題，習知技術中有提出一種同時具有多 個散熱器之散熱模組，以獲得可以同時對多個電子元件 散熱之效果。然而，因為每一電子元件設置高度不一， 故此種散熱模組必須依據實際電子元件設置高度個別調 整，而無實用性。此外，因為散熱模組需要無縫隙貼合 電子元件才可發揮較佳之散熱效果，故該習知技術所需 求之精密度相當高，此亦造成良率降低、製造成本與時 間提高等問題。 【新型内容】 因此，為解決上述問題，本創作係提出一種散熱模組 ，以提高良率、散熱效果。 本創作再提出一種散熱模組，以降低製造成本。 本創作再提出一種散熱模組，以提供可浮動散熱器。 表單編號A0101 第3頁/共16頁 M377061 [0007] [0008] [0009] [0010] [0011] [0012] 表單編號A0101 為此，本創作係提供一種散熱模組包括一基板及至少 一散熱器。該基板具有多個第一開口。該散熱器於該基 板上浮動，具有一基座與多個第一鰭片，該些第一鰭片 突設於該基座上並對應通過於該些第一開口中。 前述散熱模組更包括至少一第二鰭片，設於該基板上 或與一熱管連接。 前述散熱模組中，該些第一開口形狀呈條狀。 前述散熱模組更包括至少一限拉結構，設於該散熱器 或該基板上，使該散熱器在該基板上作水平、傾斜、垂 直或有曲度地定位移動。該限位結構為螺絲\、扣件或鉚 .(' \ 釘。該限位結構亦可為該基板或該散熱器折彎而成。 ; . / / .............. 前述散熱模組中，該散熱器藉由該些第一鰭片及該限 位結構而對應一電子元件或一熱源高度作位置調整。 前述散熱模組更包括至#芯著熱座:，:政於該基板一側 “ h：二么. 面上，用以與一熱源或一電:手，.元?件接.觸、該基座亦用以 、、少'A 夕。 ~ . , / 與另一熱源或另一電子元該電子元件為中央處 理器（CPU)或圖像處理器（GPU)。該導熱座形成有至 少一散熱鰭片，且該基板上對應形成有至少一孔洞，該 散熱鰭片對應穿設於該孔洞中。前述散熱模組更包括至 少一熱管，設於該基板上，且與該導熱座連接。該基板 亦可形成有一容置槽容置至少部分該熱管。 前述散熱模組更包括一上蓋，與該基板組接並構成一 氣流流道。前述散熱模組，其更包括一風扇，設於該基 板或該上蓋上。該基板或該上蓋對應該風扇之位置上開 第4頁/共16頁 [0013] 設有至少一第二開口。該風扇具有轴流式扇葉或離心式 扇葉。 [0014] 前述散熱模組中，該基板材質為金屬或塑膠。該些第 一鰭片是片型或板型。該基座是片型或板型。 [0015] 前述散熱模組中，該第一開口是由多個細肋條所分隔 而成。該些細肋條兩端均固定於該基板或是僅一端固定 於該基板但另一端未固定於該基板^該些第一鰭片亦可 從該基座一體延伸而出或直接固接於該基座上。 [0016] 前述散熱模組中，該散熱器可對應電子元件或熱源高 度作位置調整。 [0017] 在本創作之散熱模組中，因直接使用可浮動式散熱器 ，故可以在不需使用額外定位結構之情形下，對應不同 熱源或晶片等電子元件高度而自動調整至適當位置，而 使散熱器與熱源可以緊密貼附接觸以達最有效之解熱。 而且，散熱器亦因不需使用額外定位結構，而有生產良 率較高且成本亦較低之優點。此外，在本創作之散熱模 組中，因散熱器之鰭片與底座之間，不需使用中繼導引 結構，故可以獲得較佳之散熱效果。 [0018] 為讓本創作之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉一較佳實施例，並配合所附圖式，作 詳細說明如下： 【實施方式】 [0019] 請參照第1圖及第2圖所示，本創作之散熱模組100包 括一基板102及至少一散熱器104。基板102具有多個第 表單編號A0101 第5頁/共16頁 一開口 106。基板102材質為金屬或塑膠 [0020] 第—開口 106供該散熱器104之多個第一鰭片1〇8對應 通過，且第一開口 1〇6形狀近似條狀。具體而言，該基板 102之多個第一開口106是由多個細肋條所分隔而成，例 如是如第3圖所示之第一開口 i〇6a是由兩端均固定於基板 102的細肋條i26a分隔而成；如第4圖所示之第一開口 l〇6b是由僅一端固定於基板1〇2但另一端未固定於基板 102的細肋條126b分隔而成。此外，第一開口 106數量為 2或2個以上時，也可以是部分第一開口由細肋條126&分 隔而成、部分第一開口由細助條126b分隔而成，甚至部 分第一開口是由細肋條126a、126b分(½而土。 [0〇21] 散熱器10 4用以於基板10 2上浮K菸每—基座1 i 〇 與多個第一鰭片108。第一鰭片ι〇8突設於基座11()上， 且每一第一鰭片108通過於對應之第一開口106中。第一 綠片1〇8可以從基座11〇一轉蜂痛而出，也可以直接固接 於基座110上。第一雜片IQg可H是、:片)型或板型。基座 ·· 夕..>夕.;/ 110可以是片型或板型。基^與熱源或如中央處 理器（CPU)或圖像處理器（GPU)等電子元件接觸，以 對此熱源或電子元件進行導熱。具體而言，如第丨圖及第 2圖所示’基座110是與中央處理器128接觸，然並不以此 為限’也可以依據需求，改與圖像處理器13〇或其他熱源 接觸。 [0022] 該散熱模組丨〇〇更包括至少一限位結構120，設於散熱 器104或基板102上。限位結構12〇為螺絲、扣件 '鉚釘 或為基板102或散熱器1〇4折彎而成。在相對於該基板 表單編號A0101 第6頁/共16頁 [0023] [0024] [0025] [0026] 102板面方向上，限位結構12〇具有使散熱器1〇4於基板 102上作水平、傾斜、垂直或有曲度地定位移動之效果。 散熱器104可以藉由第一鰭片1〇 8及限位結構丨2〇而對應 該電子元件或熱源高度作位置調整，以使該散熱模組1〇〇 可以對不同南度之電子元件或熱源均有較佳之貼合度， 進而有較佳之散熱效能。 該散熱模組100更包括至少一導熱座112。導熱座112 用以與另一熱源或另一如中央處理器或圖像處理器等電 子元件接觸，以對此另一熱源或電子元件進行導熱。具 體而言，如第1圖及第2圖所示，導熱座112是與圖像處理 器1 30接觸，然並不以此為限，也可以依據需求，改與中 央處理器128或其他另一熱源接觸。 V熱座112可以设於基板1〇2 —側面上。該導熱座112 上還可以形成有至少一散熱鰭片112a，此時基板1〇2上對 應形成有至少一孔洞132，該散熱鰭片U2a對應穿設於該 孔洞132中。 還有，基座11 0與導熱座112可以如上述分別對不同電 子元件進行導熱’也可以對同一電子元件進行導熱。 另外，該散熱模組100更包括至少一熱管114。熱管 114設於基板1〇2上，且與導熱座112連接，甚至是直接 連接。熱管114可以更快速有效地將傳遞至導熱座112的 熱導離，而進一步提升散熱模組1〇〇的散熱效果。 此外’基板102還可以形成有一容置槽116容置至少部 分熱管114。容置槽116具有定位或保護熱管114的效果 表單編號A0101 第7頁/共16頁 [0027] M377061 [0028] [0029] [0030] [0031] [0032] 該散熱模組100亦可包括至少一第二鰭片118，第二鰭 片118可以直接設於基板102上或與熱管114連接。第二 鰭片118可以進一步提升散熱模組100的散熱面積及散熱 效果。 該散熱模組100更包括一上蓋124，可與基板102相組 接。上蓋124與基板102組接後可以構成一氣流流道。 該散熱模組100更包括一風扇122，設於該基板102或 上蓋124上，以增加散熱模組100表面氣流速率及氣流流 量。該風扇122可以具有軸流式扇葉或離心式扇葉。 / _ 此外，在對應該風扇122之位置上，基板102上可以開 \ / 設有至少一第二開口 134，或上蓋124上可以開設有至少 一第二開口 136，以增加風扇122的進風量。 在本創作之散熱模組中，因直接,使用可浮動式散熱器 ......? . ’、:·. '' ν < ，故可以在不需使用額外定也結構之情形下，對應不同 ....W / : ν :: V:. 熱源或晶片等電子元件高自動劈整至適當位置，而 使散熱器與熱源可以緊密貼附接觸以達最有效之解熱。 而且，散熱器亦因不需使用額外定位結構，而有生產良 率較高且成本亦較低之優點。此外，在本創作之散熱模 組中，因散熱器之鰭片與底座之間，不需使用中繼導引 結構，故可以獲得較佳之散熱效果。 雖然本創作已以一較佳實施例揭露如上，然其並非用 以限定本創作，任何熟習此技藝者，在不脫離本創作之 精神和範圍内，當可作各種之更動與潤飾，因此本創作 表單編號Α0101 第8頁/共16頁 [0033] M377061 之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖係繪示本創作第一較佳實施例散熱模組與電子 元件的分解示意圖》 第2圖係繪示第1圖各元件組合後沿A Α方向上的側視圖 [0036] 第3圖係繪示本創作散熱模組之基板上第一開口一實 例的局部放大示意圖。 [0037] 第4圖係繪示本創作散熱模組之基板上第一開口另一 實例的局部放大示意圖。 [0038] 【主要元件符號說明】 100 ： 散熱模組 102 ： 基板 104 ： 散熱器 106、 106a、106b :第一開口 108 ： 第一鰭片 110 ： 基座 112 ： 導熱座 112a :散熱鰭片 114 ： 熱管 116 :容置槽 118 ： 第二鰭片 120 ： 限位結構 122 ： 風扇 124 :上蓋 126a 、126b :細肋條 128 ： 中央處理器 130 ： 圖像處理器 132 ： 孔洞 134 ' 136 :第二開口V. New Type Description: [New Technology Field] [0001] [0002] [0004] [0006] [0006] This paper is about a heat dissipating module, especially regarding a yield. A high-efficiency, low-efficiency, low-cost, heat-dissipating module with a removable heat sink. [Prior Art] In today's heat dissipation module, a plurality of fins are directly soldered on a substrate to dissipate heat from electronic components. However, as the number of electronic components increases, and each electronic component uses a heat dissipation module to dissipate heat, the entire system usage space cannot be reduced and gradually becomes inconsistent with the miniaturization trend. In order to solve the above problems, a conventional heat dissipation module having a plurality of heat sinks is proposed in the prior art to obtain an effect of dissipating heat from a plurality of electronic components at the same time. However, since each electronic component is set at a different height, such a heat dissipation module must be individually adjusted according to the actual electronic component setting height, and has no practicality. In addition, since the heat dissipation module requires seamless bonding of the electronic components to achieve a better heat dissipation effect, the precision required by the prior art is relatively high, which also causes problems such as reduced yield, improved manufacturing cost, and time. [New content] Therefore, in order to solve the above problems, the author proposes a heat dissipation module to improve the yield and heat dissipation effect. This creation proposes a heat dissipation module to reduce manufacturing costs. The present invention further proposes a heat dissipation module to provide a floatable heat sink. Form No. A0101 Page 3 of 16 M377061 [0007] [0009] [0011] [0012] Form No. A0101 To this end, the present invention provides a heat dissipation module including a substrate and at least one heat dissipation Device. The substrate has a plurality of first openings. The heat sink is floating on the substrate, and has a base and a plurality of first fins. The first fins are protruded from the base and correspondingly pass through the first openings. The heat dissipation module further includes at least one second fin disposed on the substrate or connected to a heat pipe. In the heat dissipation module, the first openings have a strip shape. The heat dissipation module further includes at least one limiting structure disposed on the heat sink or the substrate to move the heat sink horizontally, obliquely, vertically or flexibly on the substrate. The limit structure is a screw\, a fastener or a rivet. ('\-nail. The limit structure can also be formed by bending the substrate or the heat sink. . . / / .......... In the heat dissipation module, the heat sink is positionally adjusted corresponding to an electronic component or a heat source by the first fins and the limiting structure. The heat dissipation module further includes a heat to the core. Block:,: On the side of the substrate, "h: two. On the surface, for use with a heat source or a battery: hand, . yuan? Contact, the base is also used, less 'A eve ~ . , / with another heat source or another electronic component, the electronic component is a central processing unit (CPU) or a graphics processing unit (GPU). The thermal conduction seat is formed with at least one heat dissipation fin, and the substrate is formed correspondingly The heat dissipation module further includes at least one heat pipe disposed on the substrate and connected to the heat conduction seat. The substrate may also be formed with a receiving groove. The heat dissipation module further includes an upper cover that is coupled to the substrate and constitutes an air flow path. The heat dissipation module further includes a heat dissipation module. The fan or the upper cover is disposed on the substrate or the upper cover. The substrate or the upper cover is disposed at a position corresponding to the fan. The fourth fan/page 16 [0013] is provided with at least one second opening. The fan has an axial flow fan blade or [0014] In the heat dissipation module, the substrate is made of metal or plastic. The first fins are of a sheet type or a plate type. The base is a sheet type or a plate type. In the module, the first opening is formed by a plurality of thin ribs. Both ends of the ribs are fixed to the substrate or only one end is fixed to the substrate but the other end is not fixed to the substrate. The fins may also extend integrally from the base or be directly fixed to the base. [0016] In the heat dissipation module, the heat sink may be positionally adjusted according to the height of the electronic component or the heat source. In the created heat dissipation module, since the floating heat sink is directly used, the height of the electronic components such as different heat sources or wafers can be automatically adjusted to an appropriate position without using an additional positioning structure, so that the heat sink and the heat sink are The heat source can be closely attached to the contact In addition, the heat sink also has the advantages of high production yield and low cost because it does not need to use an additional positioning structure. In addition, in the heat dissipation module of the present invention, the fins of the radiator are Between the bases, there is no need to use a relay guiding structure, so that a better heat dissipation effect can be obtained. [0018] To make the above and other objects, features, and advantages of the present invention more comprehensible, the following is a preferred embodiment. The embodiment and the accompanying drawings are described in detail as follows: [Embodiment] [0019] Referring to FIG. 1 and FIG. 2, the heat dissipation module 100 of the present invention includes a substrate 102 and at least one heat sink. 104. The substrate 102 has a plurality of opening numbers 106 of the first form number A0101, page 5/16 pages. The substrate 102 is made of metal or plastic. [0020] The first opening 106 is corresponding to the plurality of first fins 1〇8 of the heat sink 104, and the first opening 1〇6 is approximately strip-shaped. Specifically, the plurality of first openings 106 of the substrate 102 are separated by a plurality of thin ribs. For example, the first opening i 〇 6a as shown in FIG. 3 is fixed to the substrate 102 by both ends. The thin ribs i26a are separated; the first opening 16b shown in FIG. 4 is partitioned by thin ribs 126b whose one end is fixed to the substrate 1〇2 but the other end is not fixed to the substrate 102. In addition, when the number of the first openings 106 is two or more, the partial first openings may be separated by the thin ribs 126 & the partial first openings are separated by the thin reinforcing strips 126b, and even some of the first openings are The thin fins 126a, 126b are divided into two layers. [0〇21] The heat sink 10 4 is used to float the K smoke per substrate 10 2 to the base 1 i 〇 and the plurality of first fins 108. The first fins The ι 8 is protruded from the pedestal 11 (), and each of the first fins 108 passes through the corresponding first opening 106. The first green sheet 1 〇 8 can be blown from the pedestal 11 It can also be directly fixed to the base 110. The first chip IQg can be H, : piece type or plate type. Base ·· 夕 ..>夕.;/ 110 can be a sheet type or a plate type. The base is in contact with a heat source or an electronic component such as a central processing unit (CPU) or a graphics processor (GPU) to conduct heat to the heat source or electronic component. Specifically, as shown in FIG. 2 and FIG. 2, the pedestal 110 is in contact with the central processing unit 128, but is not limited thereto. It may also be replaced with an image processor 13 or other heat source according to requirements. contact. [0022] The heat dissipation module further includes at least one limiting structure 120 disposed on the heat sink 104 or the substrate 102. The limiting structure 12 is a screw, a fastener 'rivet' or a base plate 102 or a heat sink 1〇4. In the direction of the board surface relative to the substrate form number A0101, page 6 / page 16 [0023] [0024] [0025] [0026] 102, the limiting structure 12〇 has the heat sink 1〇4 on the substrate 102 Position the movement horizontally, obliquely, vertically, or with curvature. The heat sink 104 can adjust the height of the electronic component or the heat source by the first fins 1〇8 and the limiting structure 丨2〇, so that the heat dissipation module 1 can be used for different south electronic components or The heat source has a better fit, and thus has better heat dissipation performance. The heat dissipation module 100 further includes at least one heat conduction seat 112. The thermal pad 112 is used to contact another heat source or another electronic component such as a central processing unit or image processor to conduct heat to the other heat source or electronic component. Specifically, as shown in FIG. 1 and FIG. 2, the thermal conductive seat 112 is in contact with the image processor 130, but not limited thereto, and may be changed to the central processing unit 128 or the like according to requirements. A heat source is in contact. The V hot seat 112 may be disposed on the side surface of the substrate 1〇2. At least one heat dissipating fin 112a is formed on the heat conducting base 112. At least one hole 132 is formed on the substrate 1〇2, and the heat dissipating fin U2a is correspondingly disposed in the hole 132. Further, the pedestal 10 0 and the thermally conductive seat 112 can conduct heat to different electronic components as described above, and can also conduct heat to the same electronic component. In addition, the heat dissipation module 100 further includes at least one heat pipe 114. The heat pipe 114 is disposed on the substrate 1 2 and is connected to the heat conducting block 112 or even directly connected. The heat pipe 114 can conduct the heat transferred to the heat conducting seat 112 more quickly and effectively, and further improve the heat dissipation effect of the heat dissipation module 1〇〇. In addition, the substrate 102 may be formed with a receiving groove 116 for accommodating at least a portion of the heat pipe 114. The accommodating groove 116 has the effect of positioning or protecting the heat pipe 114. Form No. A0101 Page 7 of 16 [0027] [0028] [0032] [0032] The heat dissipation module 100 may also include at least A second fin 118, the second fin 118 may be directly disposed on the substrate 102 or connected to the heat pipe 114. The second fins 118 can further enhance the heat dissipation area and the heat dissipation effect of the heat dissipation module 100. The heat dissipation module 100 further includes an upper cover 124 that can be combined with the substrate 102. The upper cover 124 and the substrate 102 can be combined to form an air flow path. The heat dissipation module 100 further includes a fan 122 disposed on the substrate 102 or the upper cover 124 to increase the surface airflow rate and airflow of the heat dissipation module 100. The fan 122 can have axial flow blades or centrifugal blades. In addition, at a position corresponding to the fan 122, at least one second opening 134 may be opened on the substrate 102, or at least one second opening 136 may be opened in the upper cover 124 to increase the air intake amount of the fan 122. . In the heat dissipation module of this creation, because of the direct use of the floating radiator...?,:·. '' ν < , it can be used without additional structure , corresponding to different .... W / : ν :: V:. Electronic components such as heat sources or wafers are automatically trimmed to the proper position, so that the heat sink and the heat source can be closely attached to each other for the most effective heat release. Moreover, the heat sink has the advantages of high production yield and low cost because it does not require an additional positioning structure. In addition, in the heat dissipation module of the present invention, a relay guiding structure is not required between the fins of the heat sink and the base, so that a better heat dissipation effect can be obtained. Although the present invention has been disclosed in a preferred embodiment as above, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. Creation Form No. Α0101 Page 8 of 16 [0033] The scope of protection of M377061 is subject to the definition of the patent application scope. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing a heat dissipation module and an electronic component according to a first preferred embodiment of the present invention. FIG. 2 is a side view showing the combination of components in the first direction and along the A Α direction. [0036] FIG. 3 is a partially enlarged schematic view showing an example of a first opening on a substrate of the heat dissipation module of the present invention. [0037] FIG. 4 is a partially enlarged schematic view showing another example of the first opening on the substrate of the heat dissipation module of the present invention. [Main component symbol description] 100: heat dissipation module 102: substrate 104: heat sink 106, 106a, 106b: first opening 108: first fin 110: pedestal 112: heat conduction seat 112a: heat dissipation fin 114 : Heat pipe 116 : accommodating groove 118 : second fin 120 : limiting structure 122 : fan 124 : upper cover 126a , 126b : thin rib 128 : central processing unit 130 : image processor 132 : hole 134 ' 136 : second Opening
表單編號A0101 第9頁/共16頁Form No. A0101 Page 9 of 16