M352073 八、新型說明： 【新型所屬之技術領域】 成的散熱模組定位 要求的設計。 本創作涉及一種包含晶片、散熱片與扣具所組 裝置 ’特別是一種適用於輕薄短小電子用品之、熱 【先前技術】 散熱模組是普遍觀驗諸如電齡鱗具钱_設備，藉以 將熱量排除，以避免對電子元件造成損壞。—般電腦的晶片組（包括 脱，及CPU等），在啟動運算時會產生高溫，若不能將其及時排 除’則會影性能，甚至敎，尤其速絲快之“組所產生 之熱量愈高，其影較為騎；因此，任何電耻機均必須設有散熱 裝置以排除晶片組所產生之熱量。 -般對於運算速度㈣之晶版均有散餘置設計，主要係直接 在晶片組上設置具有複數則之散熱片，甚至在該散熱片上設置風 扇’該晶片組運算嗔產生之大部份熱量乃由散熱片所錄，而晶片 組在運算的_啟動風扇運轉而吹襲散熱片，以達到散熱作用。曰 較早期將散熱片組合於晶片組的方式，主要是姻金屬彈片將散 熱片扣固於晶片基座（俗稱SOCKET )(如台灣專利公告第31668月? 號）。細，傳統用以將散熱片扣·晶片組之金屬彈^構較為複 雜，組錄不便，製造成本較高，且容易彈性疲乏，使得電腦在運輸 ，卸貝％谷㈣振動峨落，若操作不慎以致於施力過大時即很容易 傷及精密且脆弱m若是晶片組與主機板之結合沒有^座 M352073 (SOCKET )， 可扣住彈片 而係採BG A基絲直麟上時，職本沒有任何地方 一般的晶片組獅焊接設社機板上時，該⑼組與主機板之間 僅約〇· 25咖高度，由於空間十分有限，故讀從未有任何薇商思考如 何利用該紐_纽_的散制題，轉把散数 谬布貼於散熱片底部再黏貼於晶片上面，或是以螺絲鎖於主機板（如 台灣專利公告第257346號）；但由於膠布遇高溫後極易老化而脫落， φ因而有廠商請主機板製造商在主機板上預留孔位以便用螺絲固定，其 效果雖絲散歸布佳’但翻孔位乃有魏_難，因為並非每種 線路佈局辦如願，且麟縣域板製造朗驗合翻孔位，又 其組裝成本高且費時，因而預留螺絲孔於主機板上與上述型式之散熱 片之流通性實有困難。 因此’台灣專利申娜8721779〇號乃針對上述傳統晶片組與散熱 片在、、且叙上所具有之缺失加以改良，使其能適用於任何型式之主機板 籲裴设。該前專利案所提供的散熱片固定座係在中央設有一洞孔，其下 -面各端邊分別向下延設有一側板（共有四個側板），並於側板分別設 有朝向内側之扣鉤；使散熱片由下往上穿過該固定座之洞孔，並使散 熱片之板麟住於_孔之邊緣，再使顧定座之扣鉤迫合扣住該晶 片組之相對二側邊緣’以防止散熱片與固定座之間滑動而能組合固定。 雖然前述前專利案的固定座可將散熱片與晶片做結合固定，但由 於散熱片在製造過程中難免有些誤差，以致於造成其底面並非十分平 因而在與晶片接觸時仍然無法完全密切地貼合，造成晶片所產生 /M352073 的熱量無法快速地傳導至散熱片而影響散熱效率。 者，由於該前專 B曰 上 利案的固定座在四邊均設有侧板，但僅藉由其中的相對兩側板4 片的兩侧邊且同時阻撞散熱片的兩邊，其餘的兩邊則产在j文熱 面，故必須在散熱片上的鰭片開設橫貫兩側的槽道，以供兮相對的工 侧板跨置在該槽道内；但是，又由於該固定座的四側板均為相同高I# 以致於在組裝散熱片與固定座時，必須在該散熱片的槽道上先門 賴板穿過_孔，使得具有扣鉤_板扣住晶片的_時，亦同2 讓另外兩側板穿過該槽孔而將固定座完全地與散熱片組人。作如此、 來，散熱片在開設槽孔後將會減少傳熱面積，因而降低散熱效果 台灣公告第880248號專利案所提供的設計則是針對前述的缺失 加以改良者’其結構包括有-矩形框體，該矩形_的相對兩侧下方 分別向下垂直延設有-側板’該二側板的相對内側面下邊分別形成有 二個突出的扣釣’該矩形框體的另外械_的下方分別向下延設有 凸柱，又於該矩形框體的内側壁設有複數彈性桿，該彈性桿的下=設 有突部。在組裝時，係將散刻的則由下往上穿過該矩形框體的^ 孔’再使該矩雜體姉q狀扣规合扣住晶版之相對二側邊 緣，而該些凸柱則穿過預先鑽設於散熱片之穿孔，並使該彈性桿下方 的突部壓掣於散熱片上而固定。 台灣專利顧96G號所提供的設計，除了在扣具的兩側設有用來 固定晶片組的扣鉤外’另外兩側則設有播柱或播片，以防止扣具與散 熱片相對移動而滑落。細，為了迎合電子產品的設計理念日漸朝向 紐小、fe、薄」的趨勢，電子產品中所包含的電路板(p⑻尺寸也 7 M352073 曰盈縮小，但為使PCB增加更多功能，在日益縮小的PCB上反而設計 並組衣了更多的零件；然而，根據JEDC設計規範，設於PCB上的晶片 四周應保留各約3刪的淨空空間，以防止電訊相互干擾，以及線路承 載過密造成電路發熱現象，但在無多餘空間情況下，很多零組件只好 越來越接i〇GA晶片基底四周，因此，台灣專利M329960號之扣具上 的擒柱或擒# ’便容易干涉而把扣具的矩形框體撐冑，造成散熱片無 法緊貼在晶片之上，或散熱片與扣具產生滑動情形。 【新型内容】 本創作的目的’在於解決台灣專利M329960號，其用來將散熱片 固定於晶版的扣鱗設的齡缝片，容轩涉而把扣具的矩形框 體撐高，導致散熱片姐緊貼在晶片之上，或散熱片與扣具產生滑動 的問題。 本創作的特徵’是直接在散熱片底部設置絲和晶片組定位的結 •構，同時去除習知扣具設於侧邊的擔柱或播片，使得散熱片被扣具固 -定於晶片組時，能獲得有效的緊貼及定位效果。 基於此’本創作的其中—技術手段，包括有—晶片組、一具有複 數縛片的散糾與-扣具，所紐糾座下面对對應該晶片組 的上表面雜，並且可供該“__巾蚊位凹部；所述扣具係 在-矩形框體的相對兩侧分別向下垂直延設有—下端内側具有扣釣的 側板，以及在該矩形框體内徑的相對兩側設有水平延伸的彈性臂，該 彈性臂設雜下方延伸的柱體；所述散熱片蚊位凹部置於該晶片二 8 M352073 上，再將扣具置於該散熱片上，使兩扣鉤扣於晶片组的相對兩侧邊’ 並使該柱體壓迫於該議的基座上面，得以避免散熱片與晶片組相 對移位。 纟的另技術手段，是將設於散熱片基座底面的定位凹部， $成為在平仃於基座上面之鰭片的方向，呈貫通散熱片基座兩側，使 付扣具配合固定於散熱片時不會產生干涉。 本的再—技術手段，係不在散熱#底藏置定㈣部，而直 •細，底面的相對兩側分別設置—定位牆，蚊位牆之間的空間 可、合H纟且’使彳$晶片組❹丨兩定位牆阻擋而定位，再配合前述 的扣具將散熱片固定於晶片組。 【實施方式】 、下配σ ®式對本創作的實施例做更詳細的綱，俾使任何熟習 該項技藝者在·本翻酬書魏據以實施。 #曰參第一圖與第四圖，本創作提供之散熱模組的定位裝置，包括有 ^ 月欠熱片1與一扣具2 ;其中，晶片組與主機板之結合係 採BGA基座，或直接焊接組合。 所逑散熱片1可以是一種在呂擠型的導熱及散熱元件，其具有形成 於-基座上_複數彼此平行的鰭片12，以及在基座的下面設有對應 該晶片組3的上表_狀，並且可供該晶片組3容納其巾的定位凹部 U ;換言之，該粒凹部11的下表面形狀係對應晶片組3之晶片32 與主機板3!共同構成的上表面；本創作的較佳實施例，可以使該定位 9 M352073 凹部11平行於所述鰭片12的方向，呈現貫通散熱片丨義座兩側 所述扣具2具有一矩形框體20，該矩形框體 向下垂直延設有一侧板21 ’且該側板21的下邊内側設有 矩形框體21内徑的相對兩側設有水平延伸的彈性臂沒，生臂22 的自由端設有往下方延伸的柱體221。 參閱第二、三、五®所示，本創作職供㈣述散雜组，豆组 合的方式，是將直接將散熱片丨放置於晶片組3上面，使得晶片组3 ‘套入定位凹部U，藉由定位凹部11的下表面與晶片組3的^表面具 有對應形狀而獲得定位，又由於定位凹部u的兩端相互貫通i可以 依實際需要做位置的適當微調，然後將扣具2套於散熱片1上，口 具2兩側板21的扣細扣於晶片組3的主機板3ι蝴兩邊緣5 ==丨板21齡主機板31的兩邊’而定位凹_的相對兩内侧 機板31的另外兩邊，讓晶片組3無法和散熱片ι產生相對滑 ==扣具2扣固於晶片組的同時，其柱體221則壓迫於敎熱 22 lit使得卿22適當地_形，更藉此將彈性臂 、彈力透過柱體221施加於散敎片上讀 持密合狀態。 …片上讓放熱片1與晶片組3恆保 設置圖所Γ本創作的另一實施例，係^ 的定位二3疋I:和而是在散熱片底面的相對兩側形成往下方延伸 兩側的=了牆13之_賴乎等於晶_之主機板31 定位牆丨㈣^片底面放置娜32蝴時，利用該兩 搭主機板31的兩側，以L θ u 。 乂防止日日片組3和散熱片1相對移 M352073 位，並配合前述的扣具’將散熱片1固定於晶片組3。 以上所述者僅為用以解釋本創作之較佳實施例’並非企圖據r 本創作作任何形式上之限制，是以，凡有在相同之創作精神二所^對 關本創作之任何修飾或變更，皆仍應包括在本創作意圖保護之範嘴。M352073 VIII. New description: [New technical field] The design of the thermal module positioning required. The present invention relates to a device comprising a wafer, a heat sink and a buckle, in particular, a heat suitable for thin and light electronic products. [Prior Art] A heat dissipation module is a universal inspection device such as an electric age scale device. Heat is removed to avoid damage to electronic components. The computer chipset (including the off, and the CPU, etc.) will generate high temperature when starting the calculation. If it can't be removed in time, it will be able to eliminate the performance of the film, and even the smashing, especially the speed of the wire. High, its shadow is more riding; therefore, any shame machine must be equipped with a heat sink to eliminate the heat generated by the chipset. - Generally, the crystal plate of the calculation speed (4) has a residual design, mainly in the wafer set. A heat sink having a plurality of heat sinks is disposed on the heat sink, and a fan is disposed on the heat sink. The majority of heat generated by the chipset operation is recorded by the heat sink, and the chipset is operated by the fan to blow the heat sink. In order to achieve the heat dissipation effect, the way to combine the heat sinks into the chipset is mainly to ensure that the heat sink is fastened to the wafer base (commonly known as SOCKET) (such as the Taiwan Patent Publication No. 31668). Traditionally, the metal elastic structure of the heat sink buckle and the chip set is complicated, the assembly is inconvenient, the manufacturing cost is high, and the elasticity is easy to be fatigued, so that the computer is transported, and the unloading of the shell is broken. If the operation is inadvertent, the force is too easy to damage the precision and fragility. If the combination of the chipset and the motherboard is not M352073 (SOCKET), the spring can be buckled and the BG A base wire is used. There is no place for the general chipset lion welding machine set on the machine board. The (9) group and the motherboard are only about 〇·25 coffee height. Because the space is very limited, there has never been any Wei business thinking about how to read. Using the hash problem of the New Zealand_New_, the scatter cloth is attached to the bottom of the heat sink and then pasted on the wafer, or screwed to the motherboard (such as Taiwan Patent Publication No. 257346); After high temperature, it is easy to aging and fall off. φ Therefore, manufacturers have to ask the motherboard manufacturer to reserve the hole position on the motherboard for screwing. The effect is loose, but the hole is difficult. It is not the case that every line layout is fulfilled, and the Linxian domain board manufactures the rams and turns holes, and the assembly cost is high and time-consuming. Therefore, it is difficult to reserve the screw holes on the main board and the above-mentioned type of heat sink. Therefore 'Taiwan patent Shenna 87 The 21779 nickname is modified for the above-mentioned conventional chipset and heat sink, and can be applied to any type of motherboard. The heat sink mount provided in the prior patent. The utility model is provided with a hole in the center, and one side plate (four side plates) extending downwardly from each of the lower end faces, and the side plate is respectively provided with an outwardly facing hook; the heat sink is passed from bottom to top. The hole of the fixing seat, and the plate of the heat sink is placed at the edge of the hole, and then the hook of the seat is forced to buckle against the opposite side edges of the chip group to prevent the heat sink and the fixed seat Although the above-mentioned prior patent holder can fix the heat sink and the wafer, the heat sink is inevitably subject to some errors in the manufacturing process, so that the bottom surface is not very flat and thus is in contact with the wafer. At this time, it is still impossible to completely close the bonding, so that the heat generated by the wafer/M352073 cannot be quickly conducted to the heat sink and affects the heat dissipation efficiency. Because the fixed seat of the front special B case is provided with side plates on all four sides, only the two sides of the opposite side plates 4 and the two sides of the heat sink are simultaneously blocked, and the other two sides are It is produced on the hot side of the j. Therefore, the fins on the heat sink must be provided with channels running across the two sides so that the opposite side plates are placed in the channel; however, because the four side plates of the fixed seat are The same height I# is such that when assembling the heat sink and the fixing seat, the door must be passed through the hole in the channel of the heat sink, so that when the hook_plate is fastened to the wafer, the same The two side plates pass through the slot to completely seat the mount with the heat sink. In this way, the heat sink will reduce the heat transfer area after opening the slot, thus reducing the heat dissipation effect. The design provided by the Taiwan Patent No. 880248 is to improve the aforementioned defects. The structure includes a rectangle. a frame body, the opposite sides of the rectangle _ are respectively vertically downwardly provided with a side plate. The lower side edges of the opposite side faces of the two side plates are respectively formed with two protruding buckles. A plurality of elastic rods are disposed on the inner side wall of the rectangular frame, and a lower portion of the elastic rod is provided with a protrusion. When assembled, the hole is passed through the hole of the rectangular frame from bottom to top, and the second body is snapped to the opposite side edges of the crystal plate, and the convex The column is passed through a through hole that is pre-drilled in the heat sink, and the protrusion under the elastic rod is pressed against the heat sink to be fixed. The design provided by Taiwan Patent No. 96G, except that there are hooks on both sides of the clip for fixing the chip set, and the other sides are provided with a soot column or a broadcast piece to prevent the clip from moving relative to the heat sink. Sliding down. In order to cater to the trend of electronic products, the design concept of electronic products is becoming smaller, fe, and thin. The board (p(8) size of electronic products is also reduced by 7 M352073, but in order to increase the functionality of the PCB, it is increasingly On the reduced PCB, more parts are designed and assembled; however, according to the JEDC design specification, about 3 blanks of clearance space should be reserved around the wafer on the PCB to prevent mutual interference of telecommunication and excessive load on the line. The circuit is hot, but in the absence of excess space, many components have to be connected more and more around the base of the i〇GA wafer. Therefore, the mast or 擒# ' on the buckle of Taiwan Patent No. M329960 is easy to interfere with. The rectangular frame body is supported, so that the heat sink cannot be closely attached to the wafer, or the heat sink and the buckle are slid. [New content] The purpose of the creation is to solve the Taiwan patent M329960, which is used for heat dissipation. The piece is fixed to the stencil of the stencil of the stencil, and Rong Xuan is involved in raising the rectangular frame of the buckle, so that the heat sink is attached to the wafer, or the heat sink and the buckle are produced. The problem of sliding. The feature of this creation is that the structure of the wire and the wafer set is directly placed at the bottom of the heat sink, and the support or the piece of the clip on the side is removed, so that the heat sink is fastened. - When it is set in the chipset, it can obtain effective closeness and positioning effect. Based on this - the technical means of this creation, including the - chip group, a scatter and a buckle with a plurality of slabs, The upper surface of the corresponding wafer group is miscellaneous, and is available for the "__ towel mosquito recess; the buckle is vertically extended downward on opposite sides of the rectangular frame - the inner side of the lower end has a side panel of the buckle fishing, and a horizontally extending elastic arm on opposite sides of the inner diameter of the rectangular frame, the elastic arm is provided with a column extending downward; the heat sinking mosquito seat is placed on the wafer 2 8 M352073 Then, the clip is placed on the heat sink, so that the two hooks are fastened to the opposite sides of the wafer set and the cylinder is pressed against the base of the stack to avoid relative displacement of the heat sink and the wafer set. Another technical means of sputum is to be placed on the heat sink. The positioning concave portion of the bottom surface of the seat is formed in the direction of the fins on the bottom of the base, and penetrates the two sides of the base of the heat sink, so that the fastener is not fixed when it is fixed to the heat sink. Means, the system is not in the heat dissipation # bottom set (four) part, and the straight and thin, the opposite sides of the bottom surface are respectively set - the positioning wall, the space between the mosquito bit walls can be combined with the H 纟 晶片 $ chip group ❹丨The two positioning walls are blocked and positioned, and the heat sink is fixed to the wafer set in conjunction with the above-mentioned fasteners. [Embodiment] The σ® type is used to make a more detailed outline of the embodiment of the creation, so that any skilled person can be skilled in the art. In the first and fourth figures of the 翻 , , , 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一The combination of the group and the motherboard is a BGA base or a direct welding combination. The heat sink 1 may be a heat-conducting and heat-dissipating component of the squeezing type, having fins 12 formed on the pedestal _ a plurality of parallel to each other, and having an upper surface corresponding to the wafer set 3 under the pedestal Form_shaped, and the wafer set 3 can accommodate the positioning recess U of the towel; in other words, the lower surface shape of the granular recess 11 corresponds to the upper surface of the wafer 32 of the wafer set 3 and the motherboard 3! In a preferred embodiment, the positioning 9 M352073 recess 11 is parallel to the direction of the fin 12, and the fasteners 2 are provided on both sides of the heat sink. The clip 2 has a rectangular frame 20, and the rectangular frame is oriented. A side plate 21' is vertically extended, and a lower side inner side of the side plate 21 is provided with a horizontally extending elastic arm on opposite sides of the inner diameter of the rectangular frame 21. The free end of the artificial arm 22 is provided with a column extending downward. Body 221. Referring to the second, third, and fifth®, the creative job (4) describes the method of mixing the beans, and the combination of the beans is to directly place the heat sink on the wafer set 3, so that the wafer set 3' is nested in the positioning recess U. The positioning of the lower surface of the positioning recess 11 and the surface of the wafer set 3 has a corresponding shape, and since the two ends of the positioning recess u are mutually penetrated, the position can be appropriately fine-tuned according to actual needs, and then the sleeve is set 2 On the heat sink 1, the buckles of the two side plates 21 of the mouthpiece 2 are fastened to the opposite sides of the main board 3 of the wafer set 3, and the two inner sides of the motherboard 31 are replaced by two sides of the motherboard 31. On the other two sides of the 31, the wafer set 3 cannot be relatively slippery with the heat sink ι == the buckle 2 is fastened to the wafer set, and the cylinder 221 is pressed against the heat 22 lit to make the Qing 22 properly _ shape, Thereby, the elastic arm and the elastic force are transmitted through the column 221 to the dilated sheet to be in a state of close contact. In another embodiment of the present invention, the positioning of the heat-dissipating sheet 1 and the wafer set 3 is described. The positioning of the system is two 疋I: and the two sides of the bottom surface of the heat sink are formed to extend downwardly on both sides. = The wall 13 _ depends on the crystal _ the motherboard 31 positioning wall 四 (four) ^ when the bottom of the film is placed on the bottom 32, use the two sides of the motherboard 31 to L θ u.乂 Prevent the day slice group 3 and the heat sink 1 from moving relative to the M352073 position, and fix the heat sink 1 to the wafer set 3 in conjunction with the aforementioned fasteners. The above description is only for explaining the preferred embodiment of the present invention. It is not intended to impose any form of restriction on the creation of the book. Therefore, any modification of the creation of the same creation spirit Or changes, should still be included in the protection of this creative intention.
11 M352073 【圖式簡單說明】 第一圖為顯示本創作之主要元件組合關係之立體分解圖。 第二圖為顯示第一圖之元件組合後之狀態之立體圖。 第三圖為沿第二圖之A-A割線的平面剖視圖。 第四圖為顯示第三圖之元件組合關係的平面剖視分解圖。 第五圖為沿第二圖之B-B割線的平面剖視圖。 第六圖為顯示本創作之散熱片另一結構，並且組合於晶片組之實施例 φ平面剖視圖。 【主要元件符號說明】 1···· ••散熱片 ll·.· …定位凹部 12··· …韓片 13··· …定位牆 2…. ••扣具 20… …矩形框體 2l·.. …側板 211. .....扣鉤 22··· …彈性臂 221. •…·柱體 3…. ••日日片組 31··· …主機板 晶片 32 1211 M352073 [Simple description of the diagram] The first figure shows the exploded view of the main component combination relationship of this creation. The second figure is a perspective view showing a state in which the components of the first figure are combined. The third figure is a plan sectional view taken along line A-A of the second figure. The fourth figure is a plan sectional exploded view showing the component combination relationship of the third figure. The fifth figure is a plan sectional view taken along line B-B of the second figure. Fig. 6 is a plan sectional view showing another structure of the heat sink of the present invention and combined with the wafer group. [Description of main component symbols] 1····•• Heat sink ll··· ... positioning recess 12··· ... Korean film 13··· ... positioning wall 2.... •• buckle 20... ...rectangular frame 2l ·.. ... side plate 211. ..... clasp 22··· ... elastic arm 221. •...·column 3..••Japanese-day film set 31···... motherboard chip 32 12