M315853 八、新型說明： •【新型所屬之技術領域】 本創作關於一種卡筍式散熱裝置，尤指一種在與記憶體中央 晶片接觸位置設有可換中央散熱板之散熱裝置。 【先前技術】 在§作祠服器用的記憶體中，在電路板的中央設一個體積較 大的主要運算晶片，並在其主要晶片兩侧排列有多數個體積較小 的晶片。在運算時’在中央的主要晶片產生較高的溫度，約在8〇 l〇〇C ’而週圍的晶片溫度約在5〇〜70。〇這樣的溫度，需要散 熱裝置來幫助散熱。 目月ί)市埸上的記憶體散熱裝置，係由兩片—體成型的散熱片 夾制記憶體而成，例如中華民國專利公告號隨727「記憶體之散 熱轉結構」、隨224「記憶體散熱組件」、Μ265763「用於記憶 體之散熱裝置」、Μ261971「記憶體散熱裝置之結構改良」、脱56523 :辅助記憶體散熱之裝置」等等前案，其中的散熱片皆係為一體 f型的金屬片’對於具有巾央主晶片的記紐*言，這些傳統的 散熱震置使用，會將主晶片的高溫傳導至其他晶片上，反而影響 整個記憶體的功能，有待改善。 【新型内容】 緣此，本創作提供了—種可換中央散熱板之散熱裝置，具有 5 M315853 ' 兩片散熱片’其中與記憶體晶片接觸的散熱片上，在相對記憶體 中央晶片位置，形成-開π ;該開口設有—可換中央散熱板，利 用該散熱板使得記憶體中溫度最高之中央晶片之熱能可快速發 -散，並且該中央散熱板僅以四個角隅的卡塊與散熱片連接，使接 觸部位很小，因而中央散熱板之高溫不會傳導到散熱片上影燮到 其他晶片溫度。 本創作所提供的散熱裝置中的中央散熱板，可在其四角形成 卡塊以對應散熱中央開口週圍開設的槽孔，而可將散熱板快速穩 固的組裝於散熱片上。 " 另外，本創作可在散熱片開口週圍設有多數個切口，以減少 散熱板與散熱片接觸面積，減少熱能之傳導。 以下，將依據圖面所示之實施例而詳加說明本創作之結構特 徵及使用功效。 B【實施】 請參見第一圖至第三圖，本創作之散熱裝置丄〇主要係包括 了-前散熱片11及-後散熱片！2，兩散熱片係夾制於記憶體 2 0之兩侧，每一散熱片i1或12與記憶體2〇接觸面貼上具 導熱效用的緩衝材i 5，一方面保護I c有緩衝的效用，另一方 面可加強傳導效用。其中前散熱片i i與記憶體2 〇之晶片2工 相接觸，而後散熱片i 2則與記憶體2 〇電路板2 2後侧接觸。 -組背炎13係自兩散熱片上方扣人，以將兩散熱片穩固爽制記 6 M315853 憶體2 0。 在兩片散熱片U、12的上緣形成相對的卡荀6〇結構以 達成連接，卡S結構係由透孔i i ii 2 i及扣片丄i 2、工 2 2相互卡接而成。 本創作最重要的⑤#點，參見第三圖，係在與記憶體晶片2 1接觸的前散熱片1i上在相對記憶體中央主要晶片2 3位置， 开/成開π 1 1 3 ’該開ο 1 1 3外侧設有-可換中央散熱板1 4。參見第四圖，散熱板i 4與記憶體2 〇中溫度最高之中央主 要晶片2 3相接觸，使其熱能可快速發散，而不會影響到其他晶 片21溫度。 散熱板14四角形成卡塊141以對應前散熱片11中央開 口1 13週圍開設的槽孔1 14，而可將散熱板14快速穩固的 組裝於前散熱片開口1 13上。並且由於中央散熱板14僅以四 個角隅的卡塊141與散熱片1 1連接，使中央散熱板14與散 熱片1 1之接觸部位很小，因而中央散熱板14之高溫不會傳導 到散熱片上影響到其他晶片溫度。 進者’參見第五圖，其係在前散熱片1 1之開口1 13週圍 設有多數個切口115，以減少散熱板14與散熱片11之接觸 面積’減少散熱板14之熱能之傳導至散熱片1 1上影響其他晶 片2 1 〇 請參見第六A圖至第六c圖，其係顯示了散熱板14之卡塊 141不同設計。在第六a圖之卡塊141 a與散熱板14垂直 7 M315853 翻折後，向上及下沖出突點，利用兩突點最長距離大於關口工工 3週圍的槽孔1 14高度，使卡塊141 a可扣制於槽孔1 14 上0 第/、B圖之卡塊1 4 1 b與散熱板1 4垂直翻折後，向内再 彎折，利用彎折部與槽孔i i 4内侧壁接觸，使卡塊i 4丄b可 扣制於槽孔114上。M315853 VIII. New description: • [New technical field] This creation relates to a card-type heat sink, especially a heat sink with a replaceable central heat sink in contact with the central wafer of the memory. [Prior Art] In the memory for the server, a large-sized main arithmetic wafer is disposed in the center of the circuit board, and a plurality of smaller-sized wafers are arranged on both sides of the main wafer. At the time of the operation, the main wafer in the center produces a relatively high temperature of about 8 〇 l 〇〇 C ′ while the surrounding wafer temperature is about 5 〇 70 70. At such temperatures, heat sinks are needed to help dissipate heat.目月) The memory heat sink on the market is made up of two pieces of body-formed heat sinks. For example, the Republic of China Patent Bulletin No. 727 "Memory Cooling Structure", with 224" "Memory Cooling Unit", Μ 265763 "Heat Dissipating Device for Memory", Μ 261971 "Structural Improvement of Memory Heat Dissipating Device", 脱565: Device for Auxiliary Memory Cooling, etc., the heat sinks are The integral f-type metal piece's are used for the main wafer of the towel. These conventional heat-dissipating effects will transfer the high temperature of the main chip to other wafers, which will affect the function of the entire memory and need to be improved. [New content] Therefore, this creation provides a heat sink for the central heat sink, which has 5 M315853 'two heat sinks' on the heat sink that is in contact with the memory chip, and is formed at the center wafer position relative to the memory. - Opening π; the opening is provided with a replaceable central heat sink, by which the thermal energy of the central wafer having the highest temperature in the memory can be quickly dissipated, and the central heat sink has only four corners The connection to the heat sink makes the contact area small, so that the high temperature of the central heat sink does not conduct to the heat sink and affects other wafer temperatures. The central heat sink in the heat sink provided by the present invention can form a block at four corners thereof corresponding to the slot formed around the central opening of the heat dissipation, and the heat sink can be quickly and stably assembled on the heat sink. " In addition, this creation can provide a plurality of slits around the opening of the heat sink to reduce the contact area between the heat sink and the heat sink and reduce the conduction of heat energy. Hereinafter, the structural features and functions of the present invention will be described in detail based on the embodiments shown in the drawings. B [Implementation] Please refer to the first to third figures. The heat sink of this creation mainly includes the front heat sink 11 and the rear heat sink! 2. The two heat sinks are clamped on both sides of the memory 20, and each of the heat sinks i1 or 12 and the memory 2〇 contact surface are pasted with a heat-dissipating cushioning material i 5 to protect the I c from being buffered. Utility, on the other hand, enhances conductivity. The front heat sink i i is in contact with the wafer 2 of the memory 2 , and the rear heat sink i 2 is in contact with the rear side of the memory 2 〇 the circuit board 2 2 . - The group of back inflammation 13 series buckles from the top of the two heat sinks to stabilize the two heat sinks. 6 M315853 Remembrance 2 0. The opposite edges of the two fins U, 12 are formed with opposite latching structures to achieve a connection. The card S structure is formed by the through holes i i ii 2 i and the cleats i 2 and 2 . The most important point #5 of this creation, see the third figure, is on the front heat sink 1i in contact with the memory chip 2 1 at the position of the main wafer 23 in the center of the memory, opening/opening π 1 1 3 ' Open ο 1 1 3 Outside - Replaceable central heat sink 14 4 . Referring to the fourth figure, the heat sink i 4 is in contact with the central main wafer 23 having the highest temperature in the memory 2, so that the heat energy can be quickly dissipated without affecting the temperature of the other wafers 21. The heat sink 14 is formed at the four corners to form a block 141 corresponding to the slot 1 14 formed around the central opening 1 13 of the front fin 11 to assemble the heat sink 14 to the front fin opening 1 13 quickly and stably. Moreover, since the central heat dissipation plate 14 is connected to the heat sink 11 by only the four corners of the block 141, the contact portion between the central heat dissipation plate 14 and the heat sink 11 is small, and the high temperature of the central heat dissipation plate 14 is not transmitted to The heat sink affects other wafer temperatures. Referring to the fifth figure, a plurality of slits 115 are provided around the opening 1 13 of the front fin 1 1 to reduce the contact area between the heat sink 14 and the fins 11 to reduce the conduction of heat energy of the heat sink 14 to The other wafers 2 1 are affected on the heat sink 1 1 . Referring to FIGS. 6A to 6C , the different designs of the blocks 141 of the heat dissipation plate 14 are shown. After the card block 141a of the sixth figure is folded perpendicularly to the heat sink 14 7 M315853, the bump is punched up and down, and the longest distance between the two bumps is greater than the height of the slot 1 14 around the gate worker 3, so that the card is made. The block 141a can be fastened to the slot 1 14 . The block 1 1 1 b of the first and second diagrams is folded vertically and the heat sink 1 4 is folded vertically, and then bent inwardly, using the bent portion and the slot ii 4 The inner side wall contacts, so that the block i 4丄b can be buckled on the slot 114.
第八C圖之卡塊141 c與散熱板丄4垂直翻抓後形成音又 形，並在端部形成半箭頭狀結構，以方便插扣於槽孔1 14中。 此口又4之好處，是不需對整片的散熱板1 4進行沖壓變形製造。 顯然地’摘狀主要技㈣在提供了—可換巾絲熱板之 卡旬式散絲置，破此技術所叙簡轉輕化，仍屬本創作 專利保濩範圍之中。 【圖式簡單說明】 之分解圖， =-圖代表摘倾絲置與雜 第三圖代表本創作散熱裝置之分解圖/ 相圖代表本創作散熱裝置之剖視圖， 同設計結構。 ^創作散熱裝置之散熱板卡塊之不 8 M315853 【主要元件符號說明】 10.........散熱裝置 11 .........前散熱片 1 1 1、1 2 1··……透孔 1 1 2、1 2 2·········扣片 12 .........後散熱片 13··…·…背夾 14.·.......散熱板 14 1.........卡塊 15··……緩衝材 2 0………記憶體 2 1…· 2 2…· .....電路板 2 3…· .··.·中央主要晶片 9The block 141c of the eighth figure C is folded perpendicularly to the heat sink 丄4 to form a sound and shape, and a half-arrow-like structure is formed at the end to facilitate the insertion into the slot 144. The advantage of this port is that it does not need to stamp and deform the entire heat sink 14 . Obviously, the main technique of the pick-up is to provide the card-type loose wire of the hot-striped hot plate, which is simplified by the technology and is still in the scope of patent protection. [Simplified illustration of the diagram] The exploded view, =- diagram represents the picking and placing of the wire. The third figure represents the exploded view of the heat sink of the creation / phase diagram represents the cross-sectional view of the heat sink of the creation, the same design structure. ^The heat sink block of the heat sink is not 8 M315853 [Main component symbol description] 10.........heat sink 11 ......... front heat sink 1 1 1 , 1 2 1··......through hole 1 1 2,1 2 2····························································· ...heat sink 14 1.........block 15··· cushioning material 2 0......memory 2 1...· 2 2...·.....circuit board 2 3...· .····Central main wafer 9