M298867 八、新型說明： 充弓區動^而4 i覆晶鍵結製程時避免鍵結裝置因等待補 充驅動aa “造錢結裝置停止 ^ 一種晶片不斷料供料裝置。 (_低稼動率相失之 【先前技術】 Η ^ 所不’該圖係為習用晶片供給模組上視示音 圖。该晶片供給模組包括有—減u、 一 盤架取放部13以及—坌-沪加而# A 弟一 右_目#” 取放部14。該承載台10係承載 有兩個具有複數個凹槽則、之晶片請、1〇2，2 :個晶片盤102以凹槽1021承載有源極驅動晶片测 1〇1〇 〇 戰口 10係叹置於该執迢lljL。該第一晶片取放部13 -晶片取放部14係設置在執道u之—側，其中該第— 放部13係負責供應放置有閘極驅動晶片之晶片盤以及：收处 :晶片二晶片取放部14係負責供應放置有源極驅： 曰曰片之晶片盤以及回收空的晶片盤。 當該承載台1G上之晶片盤m、1G2上的驅動晶片被 7〇畢日守，，亥承載台1〇會沿軌道至該第一盤架取放部a或者曰 戎第二盤架取放部14作回收空盤架以及承載新盤 疋 以該第-盤架取放部13為例，#該_10上‘^= 動晶片被取用完畢之後，承載台1〇藉由軌道丨丨回到該第一般 架取放部13 ,將空的晶片盤放置於盤架回收區132，然後再: 盤架供應區131取得新的晶片盤，最後再回到晶片鍵結工作區 M298867 •域。 '如前述之運作模式，可以了解在傳統液晶顯示器後段模組 的覆晶（Chip on Glass, COG)鍵結製程中，晶片供給模組在晶 片盤内的驅動晶片（Dr i ver IC)用完時，需要更換新的晶片盤， 而在更換晶片盤的等待時間中，晶片供給模組並無法提供晶片 給負責鍵結之鍵結裝置（Bonder)。該鍵結裝置需等待該晶片供 給模組更換完畢之後回到鍵結（Bonding)工作區時，鍵結裝置 才可以恢復作動。如此一來，再更換過程的等待時間就造成了 參鍵結裝置時間上的浪費，進而影響產量。 綜合上述，因此亟需一種晶片不斷料供料裝置，來增加鍵 結裝置之架動率，解決習用技術所產生之問題。 【新型内容】 本創作的主要目的是提供一種晶片不斷料供料裝置，其係 透過增設一承載台，使鍵結裝置可以不間斷的取得驅動晶片， 達到解決斷料、提升設備產能之目的。 * 為了達到上述之目的，本創作提供一種晶片不斷料供料裝 置，其係用以供應液晶模組段製程之玻璃覆晶鍵結裝置所需要 之驅動晶片，該晶片不斷料供料裝置包括有一第一承載台，其 係設置於一第一執道上，該第一承載台承載有至少一第一晶片 盤，該晶片不斷料供料裝置其特徵在於：具有一第二承載台， | 其係設置於該第一承載台之一側，該第二承載台上更承載有至 少一第二晶片盤。其中，該第二承載台可於該第一承載台更換 該第一晶片盤時，提供該玻璃覆晶鍵結裝置所需之驅動晶片以 維持該玻璃覆晶鍵結裝置不間斷之運作。 6 M298867 為了達到上述之目的，本創 裝置’其係用以供應液晶模片不斷料供料 :片不斯料供料裝置包括有：-第二 有至少-第-晶片盤，該第—晶：::，弟-承載台承載 L7 'H m /U ^ ΑΛ- '、糸口又置於该弟一軌道之一側， r擇匕亥弟一承裁台容置有複 片盤以及接收該第—承載台所料之空第^般2 ΐ 更承載有至少_第4^ ^之—側’该弟二承載台上 钯動曰片 弟-曰曰片盤’该弟二晶片盤内係容置有複數個 【實施方式】 一為使貴審查委員能對本創作之特徵、目的及功能有更進 -二的認知與瞭解，下文特將本創作之裝置的相關細部結構以 =。又。十的理心原由進行說明，以使得審查委員可以了解本創 作之特點，詳細說明陳述如下： 一立π苓閱圖一所示，該圖係為本創作之第一較佳實施例俯視 ，意圖。為了解決習用技術之待料問題，本創作提供—晶片不 斷料供料裝置2a包括一第一承載台2〇其係設置於一第一轨道 22上，邊第一承載台2〇可於該第一轨道22上進行線性位移運 動。在該第一轨道22 一側設置有二個第一盤架取放部23a、 23b，其中之一第一盤架取放部23a係負責供應以及回收閘極 驅動晶片盤，另一第一盤架取放部23b則負責供應以及回收源 極驅動晶片盤。該第一盤架取放部23a更具有一盤架供應部 M298867 以及—盤架置放部23卜該盤架供應部23G係供應裝滿驅 動晶片之盤架，而該盤架置放部231則負責存放空的盤苹。該 第二承載台20上放置有兩個第一晶片盤21a、21b，其中一第 曰曰片盤21a放置為閘極驅動晶片，而另一第一晶片盤训放 極驅動晶片。該兩第一晶片#仙可：應鍵結 k置所需之驅動晶片。 在該第，台2〇 —側設置有一第二執道Μ，該第二軌 ϊΓΛ ί可在該第"執道26進行線性位移運動之第二 二:5°5亥第一承載纟25上也同樣承載有兩個第二晶片般 27:其配置與該第-承載台2。上之第-晶片盤配置相同： 用巧：：=!0一上之第-晶片盤21a或2ib内之驅動晶片使 盤架取放部23&或2北放置空第一晶片盤以 =二第一晶片盤時’對鍵結裝置而言會有空槽。為 產生閒置，該鍵結裝置會移至緩衝區於該第二 八口上取侍所需之驅動晶片。當該第一承載台2〇更換曰 ::;=r㈣一置則再_= ^此=之動作，便可使得該鍵結裝置不會斷料，進而提 幵產月匕〇另外，各兮笛一 後，便可退至換心28—: 驅動晶片供應完畢之 續衝區，耸= 由人工進行更換新的晶片盤，再回到 、 4待5亥乐一承載台2〇之換料空檔，進行供庫該鍵社 裝置驅動晶片。圖一々Μ 土 /4_ — 疋4丁仏愿β鍵、、、口 神，由該精神更可二施例係為編^ 該圖係為本創作之第二；：；!種貫施方式。請參閱圖三所示， 施例之晶二 ，、枓衣置2b係在弟一較佳實施例之基礎 M298867 ‘ 上，更增設了兩第二盤架取放部24a、24b，以取代第一較佳實 -施力以人工更換晶片盤之缺點。 該第二盤架取放部24a、24b之結構係與第一盤架取放部 23a、23b之結構相同，在此不作贅述。至於設置該第二盤架取 放部24a、24b之目的係為自動更換該第二承載台25上之第二 晶片盤27。利用兩組相同系統相互搭配，達到不斷料之目的。 請參閱圖四所示，係為本創作之第三較佳實施例俯視示意圖。 該實施例之晶片不斷料供料裝置2c係為第二較佳實施例之延 _ 伸，將該第二承載台25以及該第二盤架取放部24a、24b設置 於該第一軌道22上，進而控制第一承載台20以及該第二承載 台25相互搭配，達到不斷料之目的。 請參閱圖五A所示，該圖係為本創作之第一較佳實施例結 構立體組合示意圖。在圖中係以前述第一較佳實施例之概念完 成之實體裝置，該晶片不斷料供料裝置3包括有一第一承載台 32，其係設置於第一軌道31上◦該第一執道31係設置於一機 台座體30上。該第一承載台32承載有二第一晶片盤39(途中 • 僅顯示其一），該第一晶片盤39内係容置有複數個驅動晶片。 另外，在該機台座體30 —侧之框架33上，具有兩第一盤架取 放部35、36,該框架33設置於該第一執道31之一側且距離該 第一執道31 —個高度以讓該第一承載台32通過，進而選擇提 供該第一承載台32容置有複數個驅動晶片之該第一晶片盤以 及接收該第一承載台所回送之空第一晶片盤。此外，該裝置3 更包括一第二承載台37，其係設置於該第一承載台32之一 側，該第二承載台37上更承載有至少一第二晶片盤，該第二 晶片盤内係容置有複數個驅動晶片。 9 M298867 ^ 如圖五B至圖五C所示，該圖係為本創作之第一較佳實施 • 例之盤架取放部立體示意圖。以該第一盤架取放部35來作說 明。該第一盤架取放部35更包括架設於該框架33上之一支撐 台350、一盤架供應部352以及一盤架置放部351 ◦該盤架供 應部352係可承載複數個放滿驅動晶片之第一晶片盤（圖中未 示）◦該盤架供應部352具有一開設於該支撐台350上之一開 孔3520以及一盤架支撐部。由於該支撐台350設置於該框架 33上，因此該支撐台350下方可提供該第一承載台通過，使該 φ 第一承載台與該開孔3520相對應。該盤架支撐部，其係設置 於該支撐台350上，該盤架支撐部係可選擇支撐以及釋放複數 個該第一晶片盤。該開孔3520之一側邊上連接有一板體 3521，該盤架支撐部係設置於該板體3521上，該盤架支撐部 更具有一對支撐架3523、一對制動塊3524以及一驅動塊 3526。該對支撐架3523,其係分別設置於該開孔3520之兩側； 該對制動塊3524，其係設置於該板體3521上之一軌道3525 上，該對制動塊3524係分別與該對支撐架3523相連接，該對 φ 制動塊3524之間係相距一區域，在該區域間更設置有一彈性 體3527，其兩端分別與該對制動塊3524相連接。 該驅動塊3524，其係設置該板體3521上且於該對制動塊 3524之一侧且具有一錐部3526，該驅動塊3524係可藉由該錐 部3526於該區域内進行一第一方向線性運動90以控制該對制 動塊3524產生一第二方向線性運動91進而控制該對支撐架 i 3523之間的距離以選擇支撐以及釋放該複數個一第一晶片 盤◦如圖五C所示，該對支撐架3523上之一侧更分別具有一 支撐凸板3528以藉由該第二方向線性運動91進行選擇與該第 M298867 晶 片盤底靠或者是分離達到支稽以及釋放該複—味一 晶片盤之目的。 u 弟一 再回到圖五B所示，該餘置放部351設置於該 應部352的旁邊，該盤架置放部351包括有開設於該支^ 上之-開孔351〇以及-對盤架支撐部3511、3512，盆牙口 於該支擇台350上，該盤架支撐部35u、3512係可^ j 至少-第-晶片盤。請參閱圖五D所示，該圖係為本創：: -較佳實施例之承載台立體示意圖。㈣—承載 座體⑽設置於該第一導軌31上。在該座體32〇上且二 體奶，其係具有兩容置槽以提供容置該第片盤如， 该谷置槽中間區域更開設有—通孔3212。對應該通孔^下 方，具有-托台323。該第-承載台32更包括有—升降裝置 =4 ’其係設置於該座體32〇内與該托台挪相連接，対 衣置324可控制該托台323進行升降運動。 如圖七Α所示，當該第一承載台％上之第一晶片般内的 =置放部351，該托台323係與該 么二二後該升降裝置324會上升頂起在該第-35】丨Γ的弟一晶片盤6’當該第一晶片盤6與該支撐座 ；：5Lsr I , ? 324 #^,,^, 323 往上頂而超越了該支撐座洲、㈣時， 即可將9第日日1^至原來位置，此時該升降裝置324再下降， 即晶片盤6放置在該支擇座35u、35i2上。 曰心#載台將該第一晶片盤放置在該盤架放置部上 M298867 的時候，該第一承載台會往該盤架供應部移動，當該托台與該 •開口對應時，則進行拿取新的第一晶片盤的動作。請參閱圖六 A至圖六C所示，該圖係為本創作之第一較佳實施例之盤架支 撐部動作示意圖；以及參閱圖五B所示。當該驅動塊3522之 錐部3526未進入至該對制動塊3524間之區域時，該支撐架 3523之支撐凸板3528係呈現閉合狀態，所以支撐著複數個第 一晶片盤所形成之晶片盤堆疊5,當該第一承載台32欲取新的 第一晶片盤51時，該托台323會透過該升降裝置324上升與 • 該第一晶片盤51接觸（如圖六A所示）。 此時圖五B之驅動塊3 5 2 2向下運動利用其錐部3 5 2 6於該 區域中頂靠該對制動塊3524，由於該錐部3526下小上大之外 形會驅動該制動塊3524向外運動而帶動該支撐架3523打開， 進而使該支撐凸板3528離開該晶片盤堆疊5,此時該晶片盤堆 疊5係全部由該托台323支撐。之後，該升降裝置324控制該 托台323下降至一適當位置，亦即該支撐凸板3528可以頂靠 該第一晶片盤5 2之位置（如圖六B所示）◦接著該驅動塊3 5 2 2 φ 向上運動，該制動塊3524因受到該彈性體3527之恢復力，而 帶動該支撐架3823閉合，進而支撐其餘之複數個第一晶片盤。 此時該托台323繼續下降至該第一晶片盤51放置該第一承載 台32之容置槽3210上◦至於本創作之第二以及第三較佳實施 .例，以可根據前述予以實施，在此不作贅述。 由前述得之，再第一承載台更換第一晶片盤時，由於動作 \ 繁多，因此相當耗時，此時該第二承載台洽可以輔助補充料 件，以防止鍵結裝置斷料。唯以上所述者，僅為本創作之較佳 實施例，當不能以之限制本創作範圍。即大凡依本創作申請專 12 M298867 :範圍所做之鱗變化及㈣，仍料失本 =脫離本創作之精神和範圍，故都應視為本創作的進一步在 施狀況。 、 、=合上述’本創作晶片不斷料供料裝置由於結構簡單，成 解決習用技術斷料之缺點所以可以滿足業界之 ΐ:創作所:以產業之競爭力，誠已#合創作專利法所規定 靖"主審備之要件，故妥依法呈提創作專利之中請，謹 貝番查委貝允撥時間惠予審視，並賜準專利為禱。 【圖式簡單說明】 圖-係為習用之晶片供應模組示意圖。 圖二係為本創作之第—較佳實施例俯視示意圖。 -係為本創作之第二較佳實施例俯視示意圖。 =四係為本創作之第三較佳實_俯視示意圖。 ==本創作之第—較佳實施例結構立體組合示意圖。 體示意圖口。五c係為本創作之第一較佳實施例之盤架取放部立 圖五D係為本創作之莖 作之乐—較佳實施例之承載台立體示意圖。 S /、A至圖六c係為本創 _ 作示意圖。 H 乍之弟一較佳貫施例之盤架支撐部動 圖七A至圖七B係為本創作 意圖。 之乐一較佳實施例之支撐座動作示 主要元件符號說明】 13 M298867 1-晶片供給模組 3-晶片不斷料供料裝置 10-承載台 30-機台座體 101、102-晶片盤 31-第一執道 1010、1020 -驅動晶片 32-第一承載台 1011、1021-凹槽 320-座體 11 -軌道 321-板體 13-第一盤架取放部 3210-容置槽 131-盤架供應區 3212-通孔 φ 132-盤架回收區 323-托盤 14-第二盤架取放部 324-升降裝置 2a、2b、2c-晶片不斷料供料 33-框架 裝置 35、36-盤架取放部 20-第一承載台 350-支撐台 21a、21b-第一晶片盤 351-盤架置放部 22-第一執道 3510-開孔 • 23a、23b-第一盤架取放部 3511、3512-支撐座 230-盤架供應部 352-盤架供應部 231-盤架置放部 3520-開孔 24a、24b-第二盤架取放部 3521-板體 25-第二承載台 3522-驅動塊 • 26-第二執道 3523-支撐架 27-第二晶片盤 3524-制動塊 28-換料區 3 5 2 5 -執道 14 M298867 3526-錐部 39-第一晶片盤 3527-彈性體 5-晶片盤堆疊 3528 -支撐凸板 51、52-晶片盤 37-第二承載台 90-第一線性運動 38-第二軌道 91-第二線性運動M298867 VIII, new description: Filling the bow area moving ^ and 4 i flip-chip bonding process to avoid the bonding device waiting for the supplementary drive aa "money knot device stop ^ a wafer continuous feed device. (_ low crop rate phase Lost [Prior Art] Η ^ No' This picture is a view on the conventional chip supply module. The chip supply module includes - minus u, a tray pick and place part 13 and - 坌 - Hu Jia And #A弟一右_目#" picking and placing portion 14. The carrying platform 10 carries two wafers having a plurality of grooves, and the wafers are 1〇2, 2: the wafer trays 102 are carried by the grooves 1021. The source driving chip test 1 〇 1 〇〇 〇〇 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 — The discharge unit 13 is responsible for supplying the wafer tray on which the gate drive wafer is placed and the reception: the wafer two wafer access portion 14 is responsible for supplying the source drive: the wafer tray of the wafer and the empty wafer tray. When the driving chips on the wafer trays m, 1G2 on the carrier 1G are held by the 日 , , , , , , , , , , , , The first tray pick-and-place portion a or the second tray pick-and-place portion 14 is used for recycling the empty tray and carrying the new tray. The first tray-receiving portion 13 is taken as an example, #该_10上'^ After the movable wafer is taken out, the carrier 1 is returned to the first general rack access portion 13 by the track, and the empty wafer tray is placed in the tray recovery area 132, and then: the tray supply area 131 Obtain a new wafer disc, and finally return to the wafer bonding work area M298867 • Domain. 'As mentioned above, you can understand the chip on glass (COG) bonding process in the back panel of the traditional LCD. When the wafer supply module runs out of the drive chip (Dr i ver IC) in the wafer tray, a new wafer tray needs to be replaced, and during the waiting time for replacing the wafer tray, the wafer supply module cannot provide the wafer for the responsible bonding. The bonding device (Bonder). The bonding device waits for the bonding of the wafer supply module to return to the bonding work area, and the bonding device can resume operation. Thus, the replacement process waits. Time is a waste of time in the bonding device In turn, it affects the production. In view of the above, there is a need for a wafer continuous feeding device to increase the frame rate of the bonding device and solve the problems caused by the conventional technology. [New content] The main purpose of the creation is to provide a wafer continuously The material feeding device is provided with a loading platform, so that the bonding device can continuously obtain the driving wafer, thereby achieving the purpose of solving the material breaking and improving the production capacity of the device. * In order to achieve the above purpose, the present invention provides a wafer continuous feeding. a feeding device for supplying a driving wafer required for a glass flip-chip bonding device of a liquid crystal module segment process, the wafer continuous feeding device comprising a first carrying platform disposed on a first way The first loading platform carries at least one first wafer tray, and the wafer continuous feeding device is characterized in that: a second loading platform is disposed on one side of the first loading platform, the second The carrier table further carries at least one second wafer disk. The second carrier can provide the driving wafer required for the glass flip-chip bonding device to maintain the uninterrupted operation of the glass flip-chip bonding device when the first carrier replaces the first wafer. 6 M298867 In order to achieve the above purpose, the present device is used to supply a liquid crystal die for continuous feeding: the chip feeding device comprises: - a second at least - a first wafer disk, the first crystal :::, the brother-bearing station carries L7 'H m /U ^ ΑΛ- ', and the sputum is placed on one side of the track of the younger brother. The first-bearing station is expected to carry more than _ 4th ^ ^ - side 'the second two-stage palladium-moving 曰 弟 曰曰 曰曰 ' ' 该 该 该 该There are a plurality of [Embodiment]. In order to enable your review committee to have a more in-depth understanding and understanding of the features, purposes and functions of this creation, the relevant detailed structure of the device of this creation is hereinafter. also. The reason for the tenth reason is explained so that the reviewing committee can understand the characteristics of the creation. The detailed explanation is as follows: As shown in Figure 1, the figure is the first preferred embodiment of the creation. . In order to solve the problem of the conventional technology, the present invention provides that the wafer continuous feeding device 2a includes a first loading platform 2, which is disposed on a first rail 22, and the first loading platform 2 A linear displacement motion is performed on a track 22. Two first tray pick-and-place portions 23a, 23b are disposed on one side of the first rail 22, and one of the first tray pick-and-place portions 23a is responsible for supplying and recovering the gate drive wafer tray, and the other first tray The rack pick-and-place portion 23b is responsible for supplying and recycling the source drive wafer tray. The first tray pick-and-place portion 23a further has a tray supply portion M298867 and a tray placement portion 23 for supplying the tray for filling the drive wafer, and the tray placement portion 231 It is responsible for storing empty disks. Two second wafer trays 21a, 21b are placed on the second stage 20, one of which is placed as a gate drive wafer and the other first wafer is driven to drive the wafer. The two first wafers can be connected to the desired driver wafer. In the first stage, a second track is disposed on the side of the table, and the second track ί ί can perform the second displacement of the linear displacement motion in the first line: 5° 5 第一 first load 纟 25 It also carries two second wafers 27 as well: it is arranged with the first carrier 2 . The first-disc disk configuration is the same: use the drive chip in the first-wafer disk 21a or 2ib on the chip: 21 or 2 ib to place the disk pick-and-place portion 23 & or 2 north to place the first wafer disk to = 2 The first wafer disc will have an empty slot for the bonding device. In order to generate idleness, the bonding device moves to the buffer to pick up the driver chip required for the second eight ports. When the first carrier 2 is replaced with 曰::;=r(four), then the action of _= ^this=, the bonding device can be prevented from being broken, and the product is not damaged. After the flute, you can retreat to the heart-changing 28—: the continuous punching area of the driver chip supply, the towering = replacing the new wafer disc by hand, and then returning to the 4th In the neutral position, the library is driven by the key device. Figure 1 々Μ土 /4_ — 疋4丁仏β key,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Referring to FIG. 3, the second embodiment of the embodiment, the second set of clothes 2b is on the base M298867' of the preferred embodiment, and two second tray pick-and-place portions 24a and 24b are added to replace the second A better-to-force force to manually replace the wafer disc. The structure of the second tray pick-and-place portions 24a, 24b is the same as that of the first tray pick-and-place portions 23a, 23b, and will not be described herein. The purpose of providing the second tray access portions 24a, 24b is to automatically replace the second wafer tray 27 on the second carrier 25. Using the same two systems of the same system to match each other, to achieve the purpose of continuous expectations. Please refer to FIG. 4, which is a top view of a third preferred embodiment of the present invention. The wafer continuous feeding device 2c of this embodiment is an extension of the second preferred embodiment, and the second carrier 25 and the second tray pick-and-place portions 24a, 24b are disposed on the first rail 22 In addition, the first carrier 20 and the second carrier 25 are controlled to match each other for the purpose of continuous use. Please refer to FIG. 5A, which is a schematic perspective view of the first preferred embodiment of the present invention. In the figure, the physical device is completed by the concept of the first preferred embodiment, and the wafer continuous feeding device 3 includes a first carrying platform 32 disposed on the first track 31. The 31 series is disposed on a machine base body 30. The first carrier 32 carries two first wafer trays 39 (only one of which is shown in the middle), and the first wafer tray 39 houses a plurality of driving wafers. In addition, on the side frame 33 of the machine base body 30, there are two first tray pick-and-place portions 35 and 36. The frame 33 is disposed on one side of the first lane 31 and is away from the first lane 31. a height for passing the first stage 32, and then selecting the first wafer tray that houses the plurality of drive wafers on the first stage 32 and receiving the first wafer tray that is returned by the first stage. In addition, the device 3 further includes a second carrier 37 disposed on one side of the first carrier 32, and the second carrier 37 further carries at least one second wafer tray, the second wafer tray The internal system houses a plurality of drive wafers. 9 M298867 ^ As shown in Figure 5B to Figure 5C, this figure is a perspective view of the first preferred embodiment of the creation. The first tray pick-and-place portion 35 will be described. The first tray pick-and-place portion 35 further includes a support table 350 mounted on the frame 33, a tray supply portion 352, and a tray placement portion 351. The tray supply portion 352 can carry a plurality of The first wafer tray (not shown) of the full drive wafer, the tray supply portion 352 has an opening 3520 and a tray support portion formed on the support table 350. Since the support table 350 is disposed on the frame 33, the first stage can be provided under the support table 350 so that the φ first stage corresponds to the opening 3520. The tray support portion is disposed on the support table 350, and the tray support portion can selectively support and release a plurality of the first wafer trays. A plate body 3521 is connected to one side of the opening 3520. The tray support portion is disposed on the plate body 3521. The tray support portion further has a pair of support frames 3523, a pair of brake blocks 3524, and a drive. Block 3526. The pair of support blocks 3523 are respectively disposed on two sides of the opening 3520; the pair of brake blocks 3524 are disposed on one of the tracks 3525 of the plate 3521, and the pair of brake blocks 3524 are respectively associated with the pair The support frames 3523 are connected, and the pair of φ brake blocks 3524 are separated from each other by an area between the regions, and an elastic body 3527 is further disposed between the two ends, and the two ends are respectively connected to the pair of brake blocks 3524. The driving block 3524 is disposed on the plate body 3521 and on one side of the pair of braking blocks 3524 and has a tapered portion 3526. The driving block 3524 can be firstly performed in the region by the tapered portion 3526. The linear motion 90 is controlled to generate a second direction linear motion 91 of the pair of brake pads 3524 to control the distance between the pair of support frames i 3523 to select support and release the plurality of first wafer disks as shown in FIG. 5C. It is shown that one side of the pair of support frames 3523 further has a supporting convex plate 3528 to be selected by the linear movement 91 in the second direction to be separated or separated from the bottom of the M298867 wafer plate to release the release and release the complex. The purpose of a wafer dish. U has repeatedly returned to FIG. 5B, the remaining placement portion 351 is disposed beside the response portion 352, and the tray placement portion 351 includes an opening 351〇 and a pair opened on the support The tray support portions 3511, 3512 and the basin mouths are on the support table 350, and the tray support portions 35u, 3512 are at least - first-disc trays. Please refer to FIG. 5D, which is a schematic view of the present invention: - a preferred embodiment of the carrying platform. (4) The carrier body (10) is disposed on the first rail 31. The body 32 has two accommodating grooves for accommodating the first plate. For example, the intermediate portion of the valley is further provided with a through hole 3212. Corresponding to the through hole ^, there is - the table 323. The first carrier 32 further includes a lifting device = 4 ′, which is disposed in the base 32 与 and is connected to the cradle. The shed 324 can control the gantry 323 to perform lifting movement. As shown in FIG. 7A, when the first wafer is in the first wafer-like area 135, the tray 323 and the lifting device 324 will rise and rise in the first -35] The younger brother of a wafer tray 6' when the first wafer tray 6 and the support base; 5Lsr I, ? 324 #^,, ^, 323 are topped up and beyond the support seat, (4) Then, the 9th day can be adjusted to the original position, and at this time, the lifting device 324 is lowered again, that is, the wafer tray 6 is placed on the sockets 35u, 35i2. When the stage is placed on the shelf placement portion M298867, the first carrier will move to the tray supply portion, and when the tray corresponds to the opening, Take the action of the new first wafer disc. Please refer to FIG. 6A to FIG. 6C, which are diagrams showing the operation of the tray support portion of the first preferred embodiment of the present invention; and FIG. 5B. When the tapered portion 3526 of the driving block 3522 does not enter the region between the pair of braking blocks 3524, the supporting convex plate 3528 of the supporting frame 3523 is in a closed state, so that the wafer disk formed by the plurality of first wafer disks is supported. The stack 5, when the first stage 32 is to take a new first wafer tray 51, the tray 323 is lifted through the lifting device 324 to contact the first wafer tray 51 (as shown in Fig. 6A). At this time, the driving block 3 5 2 2 of FIG. 5B moves downward by the taper portion 3 5 2 6 in the region against the pair of brake pads 3524, and the shape is driven by the taper portion 3526 being smaller and larger. The block 3524 moves outward to drive the support frame 3523 to open, thereby causing the support tab 3528 to exit the wafer disc stack 5, at which time the wafer disc stack 5 is all supported by the pallet 323. Thereafter, the lifting device 324 controls the tray 323 to descend to a proper position, that is, the supporting convex plate 3528 can abut against the first wafer disk 52 (as shown in FIG. 6B), and then the driving block 3 5 2 2 φ moves upward, and the brake block 3524 is driven by the restoring force of the elastic body 3527 to drive the support frame 3823 to close, thereby supporting the remaining plurality of first wafer disks. At this time, the pallet 323 continues to descend to the first wafer tray 51 to place the accommodating groove 3210 of the first carrier 32, and the second and third preferred embodiments of the present invention can be implemented according to the foregoing. I will not repeat them here. As a result of the foregoing, when the first carrier is replaced by the first carrier, it is quite time consuming due to the numerous actions, and the second carrier can assist the replenishment to prevent the bonding device from breaking. Only the above-mentioned ones are only preferred embodiments of the present invention, and the scope of the present invention cannot be limited. That is to say, according to this creation application 12 M298867: the scale changes made by the scope and (4), still missing the original = out of the spirit and scope of the creation, it should be regarded as the further implementation of the creation. The above-mentioned 'distribution device of the creation of the wafer is simple because it has the shortcomings of the conventional technology, so it can meet the shortcomings of the industry: Creation Institute: With the competitiveness of the industry, Cheng has #合创作专利法In order to stipulate the requirements of the main review, it is necessary to submit the patents in accordance with the law. Please be sure to allow the time to review and grant the patent as a prayer. [Simple diagram of the diagram] Figure - is a schematic diagram of the conventional wafer supply module. Figure 2 is a top plan view of a preferred embodiment of the present invention. - is a top view of a second preferred embodiment of the present invention. = The four series is the third best example of the creation. == The first embodiment of the present invention is a three-dimensional combination of the structure of the preferred embodiment. Body diagram mouth. The fifth c is the tray pick-and-place portion of the first preferred embodiment of the present invention. FIG. 5D is a perspective view of the carrying platform of the preferred embodiment. S /, A to Figure 6 c is a schematic diagram of this creation. H 乍 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的The support of the preferred embodiment shows the main component symbol description] 13 M298867 1-wafer supply module 3-wafer continuous feeding device 10 - carrier 30 - machine base 101, 102 - wafer tray 31- First way 1010, 1020 - drive wafer 32 - first stage 1011, 1021 - groove 320 - seat body 11 - track 321 - plate body 13 - first tray pick and place portion 3210 - accommodating groove 131 - disk Shelf supply area 3212 - through hole φ 132 - tray recovery area 323 - tray 14 - second tray pick-and-place portion 324 - lifting device 2a, 2b, 2c - wafer continuous feeding 33 - frame device 35, 36 - disk Shelf pick-and-place portion 20 - first carrier table 350 - support table 21a, 21b - first wafer tray 351 - tray placement portion 22 - first lane 3510 - opening hole 23a, 23b - first tray pick and place Port 3511, 3512-support base 230-chassis supply portion 352-chassis supply portion 231-chassis placement portion 3520-openings 24a, 24b-second tray pick-and-place portion 3521-plate 25-second load Table 3522 - Drive Block • 26 - Second Lane 3523 - Support Frame 27 - Second Chip Plate 3542 - Brake Block 28 - Refueling Area 3 5 2 5 - Road 14 M298867 3526 - Cone 39 - First Chip Plate3527-Elastomer 5-Fiber Disc Stack 3528 - Supporting Convex Plate 51, 52 - Wafer Disc 37 - Second Stage 90 - First Linear Motion 38 - Second Track 91 - Second Linear Motion
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