CN115527911A - Wafer switching device for semiconductor bulk crystal packaging - Google Patents
Wafer switching device for semiconductor bulk crystal packaging Download PDFInfo
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- CN115527911A CN115527911A CN202211498376.0A CN202211498376A CN115527911A CN 115527911 A CN115527911 A CN 115527911A CN 202211498376 A CN202211498376 A CN 202211498376A CN 115527911 A CN115527911 A CN 115527911A
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- 239000013078 crystal Substances 0.000 title claims abstract description 61
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 4
- 238000005538 encapsulation Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 154
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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Abstract
The invention provides a wafer switching device for semiconductor bulk crystal packaging, which comprises a full wafer table, an empty wafer table and a wafer fixing carrier for transferring a wafer, wherein the wafer fixing carrier is driven by a driving device to move back and forth below the full wafer table and the empty wafer table; a plurality of layers of crystal plates are respectively placed on the full crystal plate workbench and the empty crystal plate workbench, a full crystal plate driving assembly is arranged on the full crystal plate workbench, and the full crystal plate driving assembly drives the crystal plate on the bottom layer of the full crystal plate workbench to be placed on the crystal fixing carrying platform; and the empty wafer tray worktable is provided with an empty wafer tray driving assembly, and the empty wafer tray driving assembly places the wafer trays which are subjected to wafer bonding on the wafer bonding platform on the empty wafer tray worktable and are positioned at the bottom layers of the plurality of layers of wafer trays.
Description
Technical Field
The invention relates to the field of semiconductor packaging, in particular to a wafer switching device for semiconductor bulk crystal packaging.
Background
In semiconductor packaging, two types of wafer blue film packaging and bulk crystal packaging are commonly used for different wafer forms, wherein the bulk crystal packaging is commonly used in the field of packaging of discrete devices such as rectifier bridges, and is most widely applied to high-power rectifier bridges (also referred to as bridges for short).
In the bulk packaging, wafers or dies are orderly arranged in a wafer tray by a tray swing alignment device, and during packaging, the wafers or dies are picked up by a pickup mechanism such as a vacuum suction nozzle or a suction cup to be packaged in a die bonding manner.
In the existing wafer switching device, two wafer disks are generally placed on a turntable for packaging wafers, when a wafer or a crystal grain in one wafer disk is used up, the turntable is rotated, the wafer disk filled with the wafer or the crystal grain is rotated to a wafer fixing position, the wafer disk filled with the wafer or the crystal grain is manually dismounted and mounted, and the wafer disk filled with the wafer or the crystal grain is manually waited by a station for a long time in the process, so that the problems of low working efficiency, large manual workload and the like are caused.
Disclosure of Invention
The invention provides a wafer switching device for semiconductor bulk crystal packaging, which aims to solve the technical problems that the conventional wafer switching device needs to wait by manpower for a long time, the workload is large, workers can only place one wafer every time, and the like.
The technical scheme adopted by the invention for solving the technical problems is as follows: a wafer switching device for semiconductor bulk crystal packaging comprises a full wafer table, an empty wafer table and a wafer fixing carrier for transferring a wafer, wherein the wafer fixing carrier is driven by a driving device to move back and forth below the full wafer table and the empty wafer table; a plurality of layers of crystal plates are placed on the full crystal plate workbench and the empty crystal plate workbench, a full crystal plate driving assembly is arranged on the full crystal plate workbench, and the full crystal plate driving assembly drives the crystal plates on the bottom layer of the full crystal plate workbench to be placed on the crystal fixing platform deck; and the empty wafer tray worktable is provided with an empty wafer tray driving assembly, and the empty wafer tray driving assembly places the wafer trays which are subjected to wafer bonding on the wafer bonding platform on the empty wafer tray worktable and are positioned at the bottom layers of the plurality of layers of wafer trays.
Further: the full-wafer drive assembly comprises a full-wafer carrier and a full-wafer drive device which is arranged on a mounting plate below the full-wafer carrier and can drive the full-wafer carrier to move up and down, a clamping groove is formed in the wafer, and a telescopic block inserted into the clamping groove is arranged on the full-wafer carrier; the full-wafer carrier is provided with a full-wafer window hole for the wafer to pass through, and the Man Jing disk carrier moves downwards under the driving of the full-wafer driving device to place the wafer on the wafer fixing carrier.
Further: the empty wafer tray driving assembly comprises an empty wafer tray carrier, an empty wafer tray driving device which is arranged on the mounting plate and can drive the empty wafer tray carrier to move up and down, and a clamping plate which can bear the wafer tray and can be turned upwards; the empty wafer tray carrier is provided with an empty wafer tray window hole for the wafer tray to pass through, and the empty wafer tray driving device transfers the wafer tray on the solid crystal carrying platform to the clamping plate through the empty wafer tray window hole.
Further: the clamping plate is rotatably arranged on the empty wafer tray carrier through a pin shaft and comprises a guide part, a clamping part and a supporting part for bearing the wafer tray; a limiting table is arranged on the empty wafer tray carrier; when the supporting part is positioned horizontally, the buckling part is attached to the bottom of the limiting table; the crystal plate penetrates through the window hole of the empty crystal plate, and pushes the guide part upwards and pushes the clamping plate to turn upwards; the hinge pin is sleeved with a torsion spring, one end of the torsion spring is clamped on the empty wafer tray carrier, and the other end of the torsion spring is clamped on the clamping plate.
Further: the driving device comprises a transverse driving device for driving the die bonding carrier to move transversely and a longitudinal driving device for driving the transverse driving device to move longitudinally; the transverse driving device comprises a transverse guide rail and a transverse sliding block moving along the transverse guide rail, and the transverse sliding block is provided with the die bonding carrier; the longitudinal driving device comprises a longitudinal guide rail and a longitudinal sliding block which is arranged on the longitudinal guide rail in a sliding manner and fixed below the transverse sliding block; the lower extreme of vertical slider is equipped with the fixed block, wear to be equipped with on the fixed block with the parallel lead screw of longitudinal rail, the one end of lead screw is provided with the lead screw motor, the lead screw motor drive the lead screw rotates to the drive horizontal drive arrangement along longitudinal rail removes.
Further: the mounting plate is provided with a guide sleeve, and the full-wafer-tray carrier and the empty-wafer-tray carrier are provided with guide posts penetrating through the guide sleeve.
Further: and the full wafer tray carrier and the empty wafer tray carrier are provided with limit blocks capable of clamping the wafer trays.
Further: the telescopic block is a clamping cylinder.
The full-wafer-tray workbench and the empty-wafer-tray workbench are simultaneously stacked with a plurality of wafer trays, the wafer trays on the upper bottom layer of the full-wafer-tray workbench are placed on the wafer fixing platform deck through the full-wafer-tray driving assembly, the wafer trays with crystals fixed on the wafer fixing platform deck are transferred to the empty-wafer-tray workbench through the empty-wafer-tray driving assembly, the driving device drives the wafer fixing platform deck to transfer back and forth between the full-wafer-tray workbench and the empty-wafer-tray workbench, the whole process greatly reduces the manual workload, and the wafer tray transfer efficiency is improved.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is another schematic structural view of the present invention;
FIG. 3 is an enlarged partial view of the card;
FIG. 4 is a cross-sectional view of the card;
fig. 5 is a schematic structural view of the expansion block.
In the figure, the wafer loading platform comprises a wafer 1, a wafer 2, a die bonding loading platform 3, a full wafer carrier 4, a mounting plate 5, a full wafer driving device 6, a clamping groove 7, a telescopic block 8, a full wafer window hole 9, an empty wafer carrier 10, an empty wafer driving device 11, a clamping plate 12, an empty wafer window hole 13, a pin shaft 14, a guide part 15, a clamping part 16, a support part 17, a limiting platform 18, a torsion spring 19, a transverse guide rail 20, a transverse slide block 21, a longitudinal guide rail 22, a longitudinal slide block 23, a fixing block 24, a screw rod 25, a screw rod motor 26, a guide sleeve 27, a guide column 28 and a limiting block.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention. On the contrary, the embodiments of the invention include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the present invention.
Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and alternate implementations are included within the scope of the preferred embodiment of the present invention in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present invention.
As shown in fig. 1 and fig. 2, the invention provides a wafer switching device for semiconductor bulk crystal packaging, which includes a full wafer table, an empty wafer table, and a die bonding stage 2 for transferring a wafer 1, wherein the die bonding stage 2 is driven by a driving device to move back and forth below the full wafer table and the empty wafer table; a plurality of layers of crystal plates 1 are respectively arranged on the full crystal plate workbench and the empty crystal plate workbench, a full crystal plate driving assembly is arranged on the full crystal plate workbench, and the full crystal plate driving assembly drives the crystal plates 1 on the bottom layer of the full crystal plate workbench to be arranged on the crystal fixing carrier 2; and an empty wafer tray driving assembly is arranged on the empty wafer tray workbench and is used for placing the wafer trays 1 subjected to wafer bonding on the wafer bonding carrying platform 2 on the empty wafer tray workbench and is positioned at the bottom layers of the plurality of layers of wafer trays 1.
During operation, the driving device drives the die bonding carrier 2 to be located below the full-wafer-disc workbench, the full-wafer-disc driving assembly drives the wafer disc 1 to move downwards, the wafer disc 1 at the bottommost layer is placed on the die bonding carrier 2, then the full-wafer-disc driving assembly drives the wafer disc 1 above the penultimate layer to move upwards, the driving device drives the wafer disc 1 placed on the die bonding carrier 2 to move to the die bonding position, after die bonding of all wafers on the wafer disc 1 is completed, the driving device drives the die bonding carrier 2 to move below the empty-wafer-disc workbench, the empty-wafer-disc driving assembly moves downwards, the empty wafer disc 1 with die bonding completed is stacked on the bottommost layers of the wafer discs 1 on the empty-wafer-disc workbench, then the empty-wafer-disc driving assembly moves upwards, the driving device drives the die bonding carrier 2 to move below the full-wafer-disc workbench, the wafer disc 1 with wafers filled with wafers is continuously moved to the die bonding carrier 2, a plurality of wafer discs 1 are stacked on the full-wafer-disc workbench, and the die bonding workbench is simultaneously, and the die bonding workload of the empty wafer discs 1 is greatly reduced.
The full-wafer drive assembly comprises a full-wafer carrier 3 and a full-wafer drive device 5 which is arranged on a mounting plate 4 below the full-wafer carrier 3 and can drive the full-wafer carrier 3 to move up and down, wherein a clamping groove 6 is arranged on the wafer 1, and a telescopic block 7 inserted into the clamping groove 6 is arranged on the full-wafer carrier 3; the full-wafer carrier 3 is provided with a full-wafer window hole 8 for the wafer 1 to pass through, and the full-wafer carrier 3 moves downwards under the drive of the full-wafer driving device 5 to place the wafer 1 on the wafer fixing carrier 2.
When the full-wafer-tray driving device 5 drives the full-wafer-tray carrier 3 to move upwards so that the telescopic block 7 is flush with the clamping groove 6 of the wafer tray 1 on the penultimate layer, the full-wafer-tray driving device 5 drives the full-wafer-tray carrier 3 to extend out and insert into the clamping groove 6 of the wafer tray 1 on the penultimate layer, the full-wafer-tray driving device 5 drives the full-wafer-tray carrier 3 to move upwards and drives the wafer tray 1 to move upwards, and the driving device drives the wafer tray 1 on the full-wafer-tray 2 to move to a position to be subjected to wafer fixing.
The empty wafer tray driving assembly comprises an empty wafer tray carrier 9, an empty wafer tray driving device 10 which is arranged on the mounting plate 4 and can drive the empty wafer tray carrier 9 to move up and down, and a clamping plate 11 which can bear the wafer tray 1 and can be turned over upwards; the empty wafer carrier 9 is provided with an empty wafer window 12 for the wafer 1 to pass through, and the empty wafer driving device 10 transfers the wafer 1 on the die bonding carrier 2 to the clamping plate 11 through the empty wafer window 12.
During operation, the driving device drives the die bonding platform 2 to move below the empty wafer carrier 9, the empty wafer driving device 10 drives the empty wafer carrier 9 to move downwards, the wafer 1 placed on the die bonding platform 2 upwards pushes the clamping plate 11 and upwards opens the clamping plate 11, so that the wafer 1 placed on the die bonding platform 2 is transferred onto the clamping plate 11, then the empty wafer driving device 10 upwards pushes the empty wafer carrier 9 to return to an initial position, and the driving device continuously drives the die bonding platform 2 to move below the full wafer platform to place the wafer 1 filled with wafers on the die bonding platform 2.
As shown in fig. 3 and 4, the card 11 is rotatably mounted on the empty wafer carrier 9 by a pin 13, and the card 11 includes a guide portion 14, a latch portion 15 and a support portion 16 for carrying the wafer 1; the empty wafer tray carrier 9 is provided with a limiting table 17; when the supporting part 16 is positioned horizontally, the buckling part 15 is attached to the bottom of the limiting table 17; the wafer tray 1 penetrates through the window hole 12 of the empty wafer tray, pushes the guide part 14 upwards and pushes the clamping plate 11 to turn upwards; the hinge pin 13 is sleeved with a torsion spring 18, one end of the torsion spring 18 is clamped on the empty wafer tray carrier 9, and the other end of the torsion spring is clamped on the clamping plate 11.
After the wafer 1 on the die bonding carrier 2 is stacked on the empty wafer table, due to the action of the torsion spring 18, the clamping plate 11 can be rotated and reset along the pin shaft 13, the supporting part 16 can be in a horizontal state after the clamping plate 11 is rotated and reset, and the buckling part 15 is attached to the bottom of the limiting table 17, so that the clamping plate 11 cannot continue to rotate, and the supporting part 16 cannot be opened downwards under the action of gravity of the wafer 1, but plays a role in bearing the wafer 1.
The driving device comprises a transverse driving device for driving the die bonding carrier 2 to move transversely and a longitudinal driving device for driving the transverse driving device to move longitudinally; the transverse driving device comprises a transverse guide rail 19 and a transverse sliding block 20 moving along the transverse guide rail 19, and the die bonding carrier 2 is arranged on the transverse sliding block 20; the longitudinal driving device comprises a longitudinal guide rail 21 and a longitudinal slide block 22 which is arranged on the longitudinal guide rail 21 in a sliding manner and fixed below the transverse slide block 20; the lower end of the longitudinal sliding block 22 is provided with a fixed block 23, a screw rod 24 parallel to the longitudinal guide rail 21 penetrates through the fixed block 23, one end of the screw rod 24 is provided with a screw rod motor 25, and the screw rod motor 25 drives the screw rod 24 to rotate, so that the transverse driving device is driven to move along the longitudinal guide rail 21.
During operation, the transverse driving device drives the die bonding platform 2 to move left and right, when the die bonding platform moves to one side corresponding to the full-wafer-disc working table, the screw rod motor 25 drives the screw rod 24 to rotate so as to drive the transverse driving device arranged on the longitudinal slide block 22 to drive the die bonding platform 2 to move to the position below the full-wafer-disc carrier 3, the full-wafer-disc driving assembly on the full-wafer-disc working table places the wafer 1 on the die bonding platform 2, then the longitudinal driving device drives the die bonding platform 2 to move to the longitudinal coordinate position of die bonding, the transverse driving device drives the die bonding platform 2 to move to the transverse coordinate position of die bonding, after die bonding is completed, the transverse driving device drives the die bonding platform 2 to move to one side of the empty-wafer-disc working table, the longitudinal driving device drives the die bonding platform 2 to move to the position below the empty-wafer-disc working table, and the empty-wafer-disc driving assembly stacks the die-bonded wafer 1 on the die bonding platform 2 to the empty-wafer-disc working table, and the die bonding platform 2 to be transferred to the die bonding platform 2 to be processed.
A guide sleeve 26 is arranged on the mounting plate 4, and guide posts 27 penetrating in the guide sleeve 26 are arranged on the full-wafer carrier 3 and the empty-wafer carrier 9. The mounting plate 4 is fixed during the operation, and the full-wafer carrier 3 can move up and down along the guide post 27 and the guide sleeve 26 under the driving of the full-wafer driving device 5; empty wafer carrier 9 can move up and down along guide pillar 27, guide pin bushing 26 under the drive of empty wafer drive arrangement 10, and the effect that full wafer carrier 3 and empty wafer carrier 9 were led at the in-process that moves up and down is given to guide pillar 27, guide pin bushing 26 to make and fix a position more accurately with solid crystal microscope carrier 2 in the transfer of wafer 1.
And the full-wafer carrier 3 and the empty-wafer carrier 9 are provided with limit blocks 28 which can clamp the wafer 1. The limiting block 28 is used for being clamped at the periphery of the wafer 1, so that the wafer 1 is stacked neatly, and the wafer 1 can be placed on the die bonding carrier 2 by penetrating through the wafer carrier 3. As shown in fig. 5, the telescopic block 7 is a clamping cylinder; screens cylinder evenly sets up a plurality ofly at the periphery of brilliant dish 1 for 1 atress more even of brilliant dish, 1 operation in-process more steady of brilliant dish.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic representation of the term does not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (8)
1. The utility model provides a crystalline substance dish auto-change over device is used in encapsulation of semiconductor scattered crystal, includes full crystalline substance dish workstation, empty crystalline substance dish workstation, is used for moving solid crystal microscope carrier (2) that carry crystalline substance dish (1), its characterized in that: the die bonding carrier (2) is driven by a driving device to move back and forth below the full-wafer-tray workbench and the empty-wafer-tray workbench;
a plurality of layers of crystal plates (1) are respectively placed on the full crystal plate workbench and the empty crystal plate workbench, a full crystal plate driving assembly is arranged on the full crystal plate workbench, and the full crystal plate driving assembly drives the crystal plates (1) on the upper bottom layer of the full crystal plate workbench to be placed on the crystal fixing carrier (2);
and an empty wafer tray driving assembly is arranged on the empty wafer tray workbench and is used for placing the wafer trays (1) which are subjected to wafer bonding on the wafer bonding carrying platform (2) onto the empty wafer tray workbench and is positioned at the bottom layers of the plurality of layers of wafer trays (1).
2. The wafer switching device for the semiconductor die-sinking package as claimed in claim 1, wherein: the full-wafer drive assembly comprises a full-wafer carrier (3) and a full-wafer drive device (5) which is arranged on a mounting plate (4) below the full-wafer carrier (3) and can drive the full-wafer carrier (3) to move up and down, a clamping groove (6) is formed in the wafer (1), and a telescopic block (7) inserted into the clamping groove (6) is arranged on the full-wafer carrier (3);
the full-wafer tray carrier (3) is provided with a full-wafer tray window hole (8) for the wafer tray (1) to pass through, and the full-wafer tray carrier (3) moves downwards under the drive of the full-wafer tray drive device (5) to place the wafer tray (1) on the die bonding carrier (2).
3. The wafer switching device for the semiconductor die-sinking package as claimed in claim 2, wherein: the empty wafer drive assembly comprises an empty wafer carrier (9), an empty wafer drive device (10) which is arranged on the mounting plate (4) and can drive the empty wafer carrier (9) to move up and down, and a clamping plate (11) which can bear the wafer (1) and can be turned over upwards;
the empty wafer tray carrier (9) is provided with an empty wafer tray window hole (12) for the wafer tray (1) to pass through, and the empty wafer tray driving device (10) transfers the wafer tray (1) on the die bonding carrier (2) to the clamping plate (11) through the empty wafer tray window hole (12).
4. The wafer switching device for the semiconductor die-sinking package as claimed in claim 3, wherein: the clamping plate (11) is rotatably arranged on the empty crystal plate carrier (9) through a pin shaft (13), and the clamping plate (11) comprises a guide part (14), a clamping part (15) and a supporting part (16) for bearing the crystal plate (1); a limiting table (17) is arranged on the empty crystal tray carrier (9);
when the supporting part (16) is positioned horizontally, the buckling part (15) is attached to the bottom of the limiting table (17); the crystal plate (1) penetrates through the window hole (12) of the empty crystal plate, and pushes the guide part (14) upwards and pushes the clamping plate (11) to turn upwards;
the hinge pin (13) is sleeved with a torsion spring (18), one end of the torsion spring (18) is clamped on the empty wafer tray carrier (9), and the other end of the torsion spring is clamped on the clamping plate (11).
5. The wafer switching device for the semiconductor die-sinking package as claimed in claim 1, wherein: the driving device comprises a transverse driving device for driving the die bonding carrying platform (2) to move transversely and a longitudinal driving device for driving the transverse driving device to move longitudinally;
the transverse driving device comprises a transverse guide rail (19) and a transverse sliding block (20) moving along the transverse guide rail (19), and the die bonding carrier (2) is arranged on the transverse sliding block (20);
the longitudinal driving device comprises a longitudinal guide rail (21) and a longitudinal sliding block (22) which is arranged on the longitudinal guide rail (21) in a sliding mode and fixed below the transverse sliding block (20);
the lower extreme of vertical slider (22) is equipped with fixed block (23), wear to be equipped with on fixed block (23) with lead screw (24) that longitudinal rail (21) are parallel, the one end of lead screw (24) is provided with lead screw motor (25), lead screw motor (25) drive lead screw (24) rotate, thereby the drive horizontal drive arrangement along longitudinal rail (21) remove.
6. The wafer switching device for the semiconductor bulk wafer packaging according to claim 3, wherein: the mounting plate (4) is provided with a guide sleeve (26), and the full-wafer tray carrier (3) and the empty-wafer tray carrier (9) are provided with guide posts (27) penetrating through the guide sleeve (26).
7. The wafer switching device for the semiconductor die-sinking package as claimed in claim 3, wherein: and the full-wafer tray carrier (3) and the empty-wafer tray carrier (9) are provided with limit blocks (28) which can clamp the wafer trays (1).
8. The wafer switching device for the semiconductor die-sinking package as claimed in claim 2, wherein: the telescopic block (7) is a clamping cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211498376.0A CN115527911A (en) | 2022-11-28 | 2022-11-28 | Wafer switching device for semiconductor bulk crystal packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211498376.0A CN115527911A (en) | 2022-11-28 | 2022-11-28 | Wafer switching device for semiconductor bulk crystal packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115527911A true CN115527911A (en) | 2022-12-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211498376.0A Pending CN115527911A (en) | 2022-11-28 | 2022-11-28 | Wafer switching device for semiconductor bulk crystal packaging |
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| Country | Link |
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| CN (1) | CN115527911A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM298867U (en) * | 2006-03-17 | 2006-10-01 | Gallant Prec Machining Co Ltd | Uninterrupted material feeding apparatus for chips |
| TWM321190U (en) * | 2007-03-09 | 2007-10-21 | Gallant Prec Machining Co Ltd | Feeding-tray storing mechanism and chip screening machine using the same |
| CN104495172A (en) * | 2014-11-21 | 2015-04-08 | 格兰达技术（深圳）有限公司 | Automatic IC (integrated circuit) charging-tray chip transferring machine |
| CN115339903A (en) * | 2022-08-18 | 2022-11-15 | 苏州迈为科技股份有限公司 | Workpiece feeding device and method |
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2022
- 2022-11-28 CN CN202211498376.0A patent/CN115527911A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM298867U (en) * | 2006-03-17 | 2006-10-01 | Gallant Prec Machining Co Ltd | Uninterrupted material feeding apparatus for chips |
| TWM321190U (en) * | 2007-03-09 | 2007-10-21 | Gallant Prec Machining Co Ltd | Feeding-tray storing mechanism and chip screening machine using the same |
| CN104495172A (en) * | 2014-11-21 | 2015-04-08 | 格兰达技术（深圳）有限公司 | Automatic IC (integrated circuit) charging-tray chip transferring machine |
| CN115339903A (en) * | 2022-08-18 | 2022-11-15 | 苏州迈为科技股份有限公司 | Workpiece feeding device and method |
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Application publication date: 20221227 |
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