CN111432573B - Circuit board needle implanting device and method - Google Patents
Circuit board needle implanting device and method Download PDFInfo
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- CN111432573B CN111432573B CN202010371828.3A CN202010371828A CN111432573B CN 111432573 B CN111432573 B CN 111432573B CN 202010371828 A CN202010371828 A CN 202010371828A CN 111432573 B CN111432573 B CN 111432573B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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Abstract
A circuit board needle implanting device, comprising: the base is fixed on the vibrating table, a first vacuum pumping cavity is formed in the base, a first planting needle plate placing platform is arranged at the top of the base, a first through hole which is in the vertical direction and corresponds to a needle planting area of the first planting needle plate is formed in the placing platform, and the first through hole is communicated with the first vacuum pumping cavity; the pressing cover is used for pressing the first needle planting plate and is provided with a second through hole which is in the vertical direction and corresponds to the needle planting area; a hold-down mechanism depressible and lockable to apply a continuous hold-down force to the gland. The invention has high needle implantation efficiency and is suitable for needles with various diameters or lengths.
Description
Technical Field
The invention relates to the technical field of circuit board needle implanting, in particular to a circuit board needle implanting device and method.
Background
With the progress of packaging technology, chip integration is continuously improved, the number of I/O pins is rapidly increased, power consumption is increased, and the requirements for integrated circuit packaging are more strict, so that ball grid array packages (i.e. BGA packages) are beginning to be applied to production in the 90 th 20 th century, and the technology becomes the best choice for high-density, high-performance and multi-pin packages such as CPUs, south-board chips and north-bridge chips of motherboards. However, because of the characteristics of the ball-shaped pins, the area of the substrate occupied by the BGA package is large, and in order to make the volume of the packaged substrate smaller and the integration level higher, the packaging industry is turning to the application and development of the needle-shaped pin array package. The biggest difference of the needle implantation relative to the ball implantation is that the ball has no directionality, and the needle has a certain direction, so the needle implantation is more difficult and more demanding relative to the ball implantation.
The existing needle implanting technology mainly uses mechanical pins, namely a high-speed motion mechanism is used, a gripper is arranged at the tail end, the pins are sequentially implanted on a substrate, 10 pins can be implanted into the substrate at the fastest speed per second, the efficiency is low, the consumed time is long, and the pins which are smaller than a certain diameter or length cannot be correspondingly implanted.
Disclosure of Invention
Based on this, to the above technical problem, a circuit board needle implanting device and method are provided.
In order to solve the technical problems, the invention adopts the following technical scheme:
a circuit board needle implanting device, comprising:
the base is fixed on the vibrating table, a first vacuumizing cavity capable of vacuumizing through vacuumizing equipment is formed in the base, a first planting needle plate placing platform is arranged at the top of the base, a first through hole which is in the vertical direction and corresponds to a needle planting area of the first planting needle plate is formed in the placing platform, and the first through hole is communicated with the first vacuumizing cavity;
the pressing cover is used for pressing the first needle planting plate and is provided with a second through hole which is in the vertical direction and corresponds to the needle planting area;
a hold-down mechanism depressible and lockable to apply a continuous hold-down force to the gland.
This scheme still includes:
the vacuum seat is used for being fixed with the first planting needle plate at the lower part, a first groove corresponding to the planting needle area of the first planting needle plate is formed in the upper surface of the vacuum seat, and a second vacuumizing cavity capable of being vacuumized through vacuumizing equipment is formed;
a carrier for fixing the second planting needle plate;
and the lifting mechanism is used for driving the vacuum seat turned by 180 degrees to descend to be close to the carrier so as to enable the needles on the first needle planting plate to be just planted into the lifting mechanisms on the second needle planting plate under the action of the vibrator on the vacuum seat, and the lifting mechanisms are fixed with the vacuum seat turned by 180 degrees.
The first through hole and the second through hole are slightly larger than the needle implanting area.
The gland comprises a positioning plate and a pressing plate, the lower surface of the positioning plate is provided with a limiting groove which is used for covering the first needle planting plate and limiting the front, the back, the left and the right, the positioning plate is provided with a third through hole which is in the vertical direction and corresponds to the needle planting area, the third through hole is slightly larger than the needle planting area, the pressing plate is pressed on the positioning plate, the second through hole is formed in the positioning plate, the second through hole is provided with an annular extending part which extends downwards into the third through hole to press the first needle planting plate, and the outer diameter of the annular extending part is matched with the inner diameter of the third through hole;
the first needle planting plate placing platform is provided with a positioning piece for positioning the positioning plate, and the positioning piece is positioned around the first through hole.
The depth of the second through hole is greater than or equal to the length of the needle.
The pressing plate is made of graphite.
The locating piece includes four reference columns that bilateral symmetry arranged and four location platforms that front and back symmetrical arranged, pushing down the mechanism and be four, four pushing down the mechanism and fix respectively four location platforms are last.
And the upper surface of the carrier is provided with a second groove corresponding to the needle implanting area of the second needle implanting plate, so that a third vacuum pumping cavity capable of being vacuumized through vacuum pumping equipment is formed.
The invention also relates to a circuit board needle implanting method adopting the circuit board needle implanting device, wherein the first needle implanting plate is a circuit board, and the method comprises the following steps:
fixing the base on a vibration table;
placing the circuit board on a first needle implanting plate placing platform of the base, aligning a needle implanting area of the circuit board with the first through hole, pressing a pressing cover on the circuit board through a pressing mechanism, and aligning the second through hole with the needle implanting area;
pouring needles with the quantity at least 2 times that of the circuit boards to be implanted into the needle implantation area through the second through holes;
and starting the vibrating table, and vacuumizing the first vacuumizing cavity in the base through vacuumizing equipment to implant the needle into the circuit board.
The invention also relates to a circuit board needle implanting method adopting the circuit board needle implanting device, wherein the first needle implanting plate is a needle implanting jig plate, the second needle implanting plate is a circuit board, and the method comprises the following steps:
fixing the base on a vibration table;
placing the needle planting jig plate on a first needle planting plate placing platform of the base, aligning a needle planting area of the needle planting jig plate with the first through hole, pressing a pressing cover on the needle planting jig plate through a pressing mechanism, and aligning the second through hole with the needle planting area;
needles with the quantity at least 2 times of that of the needle implanting jig plates are poured into the needle implanting area through the second through holes;
starting the vibration table, and vacuumizing a first vacuumizing cavity in the base through vacuumizing equipment to implant the needles into the needle implanting jig plate;
taking down the needle planting jig plate from the base, fixing the needle planting jig plate on a vacuum seat, and vacuumizing a second vacuumizing cavity of the vacuum seat through vacuumizing equipment;
turning the needle implanting jig plate 180 degrees under the vacuum state, and fixing the needle implanting jig plate on a lifting mechanism;
fixing the circuit board on the carrier;
the lifting mechanism drives the vacuum seat to descend to be close to the carrier;
and stopping vacuumizing the second vacuumizing cavity of the vacuum seat, and vibrating the two sides of the vacuum seat through a vibrator to separate the pins in the pin implanting jig plate and implant the pins into the circuit board.
The invention has high needle implantation efficiency and is suitable for needles with various diameters or lengths.
Drawings
The invention is described in detail below with reference to the following figures and detailed description:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is an exploded view of the present invention;
FIG. 4 is a schematic structural diagram of a positioning plate according to the present invention;
FIG. 5 is a schematic view of the construction of the platen of the present invention;
FIG. 6 is a schematic structural view of a hold-down mechanism of the present invention;
FIG. 7 is a schematic structural diagram of the lifting mechanism of the present invention;
FIG. 8 is a front view of the lift mechanism of the present invention;
FIG. 9 is a schematic side view of the lifting mechanism of the present invention;
FIG. 10 is a transverse cross-sectional view of FIG. 8;
FIG. 11 is a schematic structural view of a vacuum seat according to the present invention.
Detailed Description
As shown in fig. 1, a circuit board needle implanting device includes a base 1100, a pressing cover 1200 and a pressing mechanism 1300.
As shown in fig. 2 and 3, the base 1100 is a rectangular box fixed on the vibrating table 1700 and has a first vacuum chamber therein.
The base 1100 has a first planting needle plate placing platform 1110 at the top, a fixing plate 1120 fixed with the vibrating table 1700 at the bottom, and a first vacuum-pumping connector 1130 at the rear side.
As shown in fig. 3, the first needle implanting plate 20 is a circuit board or a needle implanting jig plate, and has a needle implanting area 21 thereon, the needle implanting area 21 has a plurality of needle implanting holes therein, the needle implanting holes are stepped holes having a wide upper section and a narrow lower end, the upper section is used for introducing needles, the diameter of the needle implanting holes is generally 2.5mm, and the lower section is used for fixing needles, the diameter of the needle implanting holes is generally 1.5 mm.
The placing platform 1110 is provided with a first through hole 1111 which is arranged in the vertical direction and corresponds to the needle implanting region 21 of the first needle implanting plate 20, and the first through hole 1111 is communicated with the first vacuum pumping cavity.
The pressing cover 1200 is used for pressing the first needle implanting plate 20, and has a second through hole 1210 in the vertical direction corresponding to the needle implanting region 21.
The pressing mechanism 1300 may be pressed and locked, thereby applying a continuous pressing force to the pressing cover 1200.
During the use, fix base 1100 on shaking table 1700 to press the circuit board on first planting faller place the platform 1110 through pushing down mechanism 1300 and gland 1200, pour the needle into the planting needle region of circuit board through second through-hole 1210, start shaking table 1700, simultaneously, carry out the evacuation through first evacuation equipment 1810 to first evacuation chamber, under the effect of vibration and vacuum suction, the circuit board is planted to the needle, plants the needle efficiency height.
In the present embodiment, the first through hole 1111 and the second through hole 1210 are slightly larger than the needle implanting area 21.
In this embodiment, in order to prevent the needle from jumping out of the second through hole 1210, the depth of the second through hole 1210 is equal to or greater than the length of the needle.
In this embodiment, the pressing cover 1210 includes a positioning plate 1220 and a pressing plate 1230, the positioning plate 1220 limits the front, back, left and right of the first planting needle plate 20, and the pressing plate 1230 limits the first planting needle plate 20 up and down.
Preferably, the pressing plate 1230 is made of graphite, so that the needles are prevented from being rubbed to generate static electricity and being gathered and adsorbed when vibrated, and the gland 1210 is composed of the positioning plate 1220 and the pressing plate 1230, so that when the needles are pressed on the first needle planting plates with different sizes, only the corresponding positioning plate 1220 needs to be replaced, the whole gland does not need to be replaced, and the cost is reduced (the cost of the graphite plate is higher).
Specifically, as shown in fig. 3 and 4, the lower surface of the positioning plate 1220 has a limiting groove 1221 for covering the first needle implanting plate 20 and limiting the position, and the positioning plate 1220 has a third through hole 1222 corresponding to the needle implanting region 21 in the up-down direction, the hole of the third through hole 1222 is slightly larger than the needle implanting region 21, as shown in fig. 3 and 5, the pressing plate 1230 is pressed on the positioning plate 1220, and the second through hole 1210 is formed thereon, the second through hole 1210 has an annular extension 1211 extending downward into the third through hole 1222 to press the first needle implanting plate 20, and the outer diameter of the annular extension 1211 is adapted to the inner diameter of the third through hole 1222, so that the annular extension 1211 not only can limit the first needle implanting plate 20 up and down, but also can position the pressing plate 1230.
Correspondingly, the first planting needle plate placing platform 1110 is provided with a positioning piece for positioning the positioning plate 1220, and the positioning piece is positioned around the first through hole 1111.
Specifically, as shown in fig. 2 and fig. 3, the positioning element includes four positioning pillars 1112 arranged in bilateral symmetry and four positioning stages 1113 arranged in front-back symmetry, the number of the pressing mechanisms 1300 is four, and the four pressing mechanisms 1300 are respectively fixed on the four positioning stages 1113.
The positioning plate 20 is positioned by positioning the positioning plates 1220 through the four positioning posts 1112 and the four positioning platforms 1113, and the pressing plate 1230 is positioned by the annular extension 1211 to ensure that the needle planting area is aligned with the first through hole 1111 and the second through hole 1210 up and down (the central lines are overlapped) when the needle is planted.
In this embodiment, as shown in fig. 6, the pressing mechanism 1300 includes a hinge base 1310, a movable arm 1320, a pressing head 1330, a driving arm 1340, and a handle 1350.
A hinged base 1310 fixed on the positioning table 1113, a movable arm 1320 having a first fixed end 1321 and a second fixed end 1322, the first fixed end 1321 and the second fixed end 1322 located at the rear side of the free end, and the second fixed end 1322 lower than the first fixed end 1321, the second fixed end 1322 hinged to the front side of the hinged base 1310 in a back-and-forth rotation manner, a pressure head 1330 fixed to the free end of the movable arm 1320, a front end of an actuator arm 1340 hinged to the first fixed end 1321 in a back-and-forth rotation manner, a handle 1350 having a third fixed end 1351 and a fourth fixed end 1352, the third fixed end 1351 and the fourth fixed end 1352 located below the free end of the handle 1350, and the fourth fixed end 1352 lower than the third fixed end 1351, the free end of the handle 1350 forming a handle 1353, the third fixed end 1351 hinged to the rear end of the actuator arm 1340 in a back-and-back rotation manner, wherein the middle of the hinged end 1352 faces the rear side of the base 1310, and the middle of the hinged base 1310 has a rear side facing the base 1310, When the handle portion 1353 is operated to rotate the handle 1350 forward and backward to move the driving arm 1340 forward and backward and further to rotate the movable arm 1320 forward and backward, the pressing head 1330 on the movable arm 1320 is just pressed against the pressing cover 1200 when the rear end of the driving arm 1340 is stopped by the stopping slope 1311.
Specifically, the hinge base 1310 is formed by a support plate 1311, the support plate 1311 is vertically disposed, and has a fixing piece at a lower end thereof, the fixing piece is fixed to the positioning table 1113 by a bolt, a first hinge angle 1311a is formed at a front portion of an upper side of the support plate 1311, a second hinge angle 1311b is formed at a rear portion of the upper side, the first hinge angle 1311a is higher than the second hinge angle 1311b, the first hinge angle 1311a is hinged to the second fixed end 1322, the second hinge angle 1311b is hinged to the fourth fixed end 1352, and the stopper slope 1311 is a rear slope of the second hinge angle 1311 b.
The actuator arm 1340 is obliquely arranged high in front and low in rear, and its rear end forms a projection 1341 that engages with the stopper slope 1311.
Considering the special reason that the surface of the circuit board has devices and the like, the device of the present invention can not directly vibrate, as shown in fig. 7, the device further comprises a vacuum base 1400, a carrier 1500, a lifting mechanism 1600, a second vacuum extractor 1820, a third vacuum extractor 1830, a vibrator (not shown), and a bottom plate 1900 for fixing the carrier 1500, the lifting mechanism 1600, the second vacuum extractor 1820 and the third vacuum extractor 1830.
As shown in fig. 7 and 11, the vacuum base 1400 is used to fix the first needle implanting plate 20 at the lower part, the upper surface of the vacuum base 1400 has a first groove 1410 corresponding to the needle implanting region 21 of the first needle implanting plate 20 to form a second vacuum pumping chamber, and the lower surface has a second vacuum pumping connector 1420.
The carrier 1500 is used to fix a second planting needle plate (not shown).
The lifting mechanism 1600 is used to drive the vacuum seat 1400 turned over by 180 degrees to descend close to the carrier 1500, so that the needles on the first needle implanting plate 20 are just implanted into the second needle implanting plate under the action of the vibrator on the vacuum seat 1400.
The lifting mechanism 1600 is fixed with the vacuum base 1400 after being turned over by 180 degrees, and after the fixing, the needle planting holes on the first needle planting plate 20 are in up-down one-to-one correspondence with the needle planting holes on the second needle planting plate.
During the use, fix base 1100 on shaking table 1700 to press the needle of planting the tool board through pushing down mechanism 1300 and gland 1200 and plant on first faller place the platform 1110 of planting, pour the needle into the needle region of planting the needle tool board through second through-hole 1210, start shaking table 1700, simultaneously, carry out the evacuation through first evacuation equipment 1810 to first evacuation chamber, under the effect of vibration and vacuum suction, the needle is planted the tool board of planting the needle.
The needle implantation jig plate is taken down and fixed on the vacuum seat 1400, the second vacuumizing cavity of the vacuum seat 1400 is vacuumized through the second vacuumizing equipment 1820, the needle implantation jig plate is turned over 180 degrees and fixed on the lifting mechanism 1600 under the condition of keeping the vacuumizing state, the circuit board is fixed on the carrier 1500, the lifting mechanism 1600 drives the vacuum seat 1400 to descend to be close to the carrier 1500, the vacuum pumping of the vacuum seat 1400 is stopped, the two sides of the vacuum seat 1400 are vibrated through the vibrators, needles in the needle implantation jig plate are separated from and implanted on the circuit board, and the needle implantation efficiency is high.
In the present embodiment, the upper surface of the carrier 1500 has a second groove 1510 corresponding to the needle implanting region of the second needle implanting plate, forming a third vacuum pumping chamber. When the needle is implanted, the third vacuum-pumping device 1830 is used for vacuum-pumping to prevent the needle from warping.
In this embodiment, as shown in fig. 7-10, the lifting mechanism 1600 includes a support bracket 1610, a lead screw 1620, a movable block 1630 and a fixing base 1640.
The support frame 1610 is fixed on the bottom plate 1900, the lead screw 1620 is vertically arranged and rotationally fixed on the support frame 1610, the movable block 1630 is fixed on the nut seat 1621 of the lead screw 1620, the fixed seat 1640 is fixed on the movable block 1630, the vacuum seat 1400 which is turned over by 180 degrees is fixed on the fixed seat 1640, and the movable block 1630 and the fixed seat 1640 can be driven to lift by rotating the lead screw 1620, so that the vacuum seat 1400 is driven.
The support frame 1610 includes two support columns 1611, an upper side plate 1612 and a back plate 1613 arranged at left and right intervals, the upper side plate 1612 is fixed to the upper ends of the two support columns 1611, the back plate 1613 is connected to the rear sides of the two support columns 1611, and a right-angle connector 1613a is arranged between the rear side of the back plate 1613 and the bottom plate 1900 to support the support frame 1610.
The lead screw 1620 passes through the upper side plate 1612 and is rotatably connected to the upper side plate 1612 by a bearing block 1612a, and a hand wheel 1622 is provided at the upper end thereof for a user to operate and rotate the lead screw 1620.
The movable block 1630 is vertically slidably engaged with the supporting columns 1611, specifically, a vertical connecting plate 1631 is provided at the front side of the movable block 1630, sliders 1631a are provided at the left and right sides of the back surface of the connecting plate 1631, and slide rails 1611a vertically slidably engaged with the sliders 1631a are provided at the front sides of the two supporting columns 1611.
The fixing base 1640 includes a first fixing plate 1641 and a second fixing plate 1642, the first fixing plate 1641 is vertically arranged and fixed with the connecting plate 1631, the second fixing plate 1642 is horizontally arranged and connected with the first fixing plate 1641 through a connecting arm 1643, and the connecting arm 1643 is formed by plate bodies arranged at left and right intervals.
The invention also relates to a circuit board needle implanting method adopting the circuit board needle implanting device.
Example 1
In this embodiment, the first needle implanting plate is a circuit board, the circuit board can be vibrated, and the needle implanting method includes the following steps:
1. the base 1100 is fixed to the vibration table 1700.
2. The circuit board is placed on the first needle implanting plate placing platform 1110 of the base 1100 with the needle implanting area of the circuit board aligned with the first through hole 1111, and the pressing cover 1200 is pressed against the circuit board by the pressing mechanism 1300 with the second through hole 1210 aligned with the needle implanting area.
3. At least 2 times as many needles as the number of circuit boards to be implanted are poured into the needle implanting area through the second through holes 1210. In this embodiment, the number of needles is 2-3 times the number of circuit boards to be implanted.
4. The vibration table 1700 is started, and the first vacuum-pumping chamber in the base 1100 is evacuated by the first vacuum-pumping device 1810, so that the needles are implanted into the circuit board. The needle can be erected in the vibration process, and then the needle is sucked into the needle implanting hole through vacuum pumping.
5. After the needle implantation is completed, the pressing cover 1200 is removed, and the remaining needles are brushed into a prepared recovery box by using a brush.
6. And (5) taking down the circuit board, and finishing the whole needle implanting process.
Example 2
In this embodiment, the first needle planting plate is a needle planting jig plate, the second needle planting plate is a circuit board, and the needle planting method includes the following steps:
1. the base 1100 is fixed to the vibration table 1700.
2. The needle implanting jig plate is placed on the first needle implanting plate placing platform 1110 of the base 1100, the needle implanting area of the needle implanting jig plate is aligned with the first through hole 1111, and the pressing cover 1200 is pressed on the needle implanting jig plate by the pressing mechanism 1300, so that the second through hole 1210 is aligned with the needle implanting area.
3. Needles at least 2 times the number of the needle implanting jig plates required to be implanted are poured into the needle implanting area through the second through holes 1210. In this embodiment, the number of needles is 2-3 times the number of the needle implanting jig plates to be implanted.
4. The vibration table 1700 is started, and the first vacuum pumping chamber in the base 1100 is vacuumized by the first vacuum pumping device 1810, so that the needles are implanted into the needle implanting jig plate.
5. The needle implanting jig plate is taken down from the base 1100 and fixed on the vacuum base 1400, and the second vacuum chamber of the vacuum base 1400 is evacuated by the second vacuum apparatus 1820.
6. And the needle planting jig plate is turned over by 180 degrees and fixed on the lifting mechanism 1600 under the condition of keeping the vacuumizing state.
7. The circuit board is fixed on the carrier 1500.
8. The vacuum base 1400 is driven to descend close to the carrier by the lifting mechanism 1600.
9. And stopping vacuumizing the second vacuumizing cavity of the vacuum seat 1400, and vibrating the two sides of the vacuum seat 1400 through the vibrator to separate the pins in the pin implanting jig plate and implant the pins into the circuit board.
When the needle is implanted, the third vacuum pumping chamber of the carrier 1500 may be evacuated by the third vacuum pumping apparatus 1830, so as to prevent the needle from warping.
The invention has high needle implantation efficiency and is suitable for needles with various diameters or lengths.
However, those skilled in the art should realize that the above embodiments are illustrative only and not limiting to the present invention, and that changes and modifications to the above described embodiments are intended to fall within the scope of the appended claims, provided they fall within the true spirit of the present invention.
Claims (8)
1. A circuit board needle implanting device is characterized by comprising:
the base is fixed on the vibrating table, a first vacuumizing cavity capable of vacuumizing through vacuumizing equipment is formed in the base, a first planting needle plate placing platform is arranged at the top of the base, a first through hole which is in the vertical direction and corresponds to a needle planting area of the first planting needle plate is formed in the placing platform, and the first through hole is communicated with the first vacuumizing cavity;
the pressing cover is used for pressing the first needle planting plate and is provided with a second through hole which is in the vertical direction and corresponds to the needle planting area;
a pressing mechanism which can be pressed and locked to apply continuous pressing force to the gland;
the vacuum seat is used for being fixed with the first planting needle plate at the lower part, a first groove corresponding to the planting needle area of the first planting needle plate is formed in the upper surface of the vacuum seat, and a second vacuumizing cavity capable of being vacuumized through vacuumizing equipment is formed;
a carrier for fixing the second planting needle plate;
and the lifting mechanism is used for driving the vacuum seat turned by 180 degrees to descend to be close to the carrier so as to enable the needles on the first needle planting plate to be just planted into the lifting mechanisms on the second needle planting plate under the action of the vibrator on the vacuum seat, and the lifting mechanisms are fixed with the vacuum seat turned by 180 degrees.
2. The circuit board needle implanting device according to claim 1, wherein the first through hole and the second through hole are slightly larger than the needle implanting area.
3. The circuit board needle implanting device according to claim 2, wherein the pressing cover comprises a positioning plate and a pressing plate, the lower surface of the positioning plate is provided with a limiting groove for covering the first needle implanting plate and limiting front, back, left and right, the positioning plate is provided with a third through hole which is in vertical direction and corresponds to the needle implanting area, the third through hole is slightly larger than the needle implanting area, the pressing plate is pressed on the positioning plate and is provided with the second through hole, the second through hole is provided with an annular extension part which extends downwards into the third through hole to press the first needle implanting plate, and the outer diameter of the annular extension part is matched with the inner diameter of the third through hole;
the first needle planting plate placing platform is provided with a positioning piece for positioning the positioning plate, and the positioning piece is positioned around the first through hole.
4. The circuit board needle implanting device according to claim 3, wherein the depth of the second through hole is greater than or equal to the length of the needle.
5. The circuit board needling device according to claim 4, wherein the pressing plate is made of graphite.
6. The circuit board needle implanting device according to claim 5, wherein the positioning member comprises four positioning columns symmetrically arranged left and right and four positioning tables symmetrically arranged front and back, the number of the pressing mechanisms is four, and the four pressing mechanisms are respectively fixed on the four positioning tables.
7. The circuit board needle implanting device of claim 6, wherein the upper surface of the carrier has a second groove corresponding to the needle implanting region of the second needle implanting plate, forming a third vacuum pumping chamber capable of being vacuumized by a vacuum pumping device.
8. The method for implanting needles in circuit boards of the circuit board implanting device according to any one of claims 2 to 7, wherein the first implanting plate is a implanting jig plate and the second implanting plate is a circuit board, the method comprising:
fixing the base on a vibration table;
placing the needle planting jig plate on a first needle planting plate placing platform of the base, aligning a needle planting area of the needle planting jig plate with the first through hole, pressing a pressing cover on the needle planting jig plate through a pressing mechanism, and aligning the second through hole with the needle planting area;
needles with the quantity at least 2 times of that of the needle implanting jig plates are poured into the needle implanting area through the second through holes;
starting the vibration table, and vacuumizing a first vacuumizing cavity in the base through vacuumizing equipment to implant the needles into the needle implanting jig plate;
taking down the needle planting jig plate from the base, fixing the needle planting jig plate on a vacuum seat, and vacuumizing a second vacuumizing cavity of the vacuum seat through vacuumizing equipment;
turning the needle implanting jig plate 180 degrees under the vacuum state, and fixing the needle implanting jig plate on a lifting mechanism;
fixing the circuit board on the carrier;
the lifting mechanism drives the vacuum seat to descend to be close to the carrier;
and stopping vacuumizing the second vacuumizing cavity of the vacuum seat, and vibrating the two sides of the vacuum seat through a vibrator to separate the pins in the pin implanting jig plate and implant the pins into the circuit board.
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| CN202010371828.3A CN111432573B (en) | 2020-05-06 | 2020-05-06 | Circuit board needle implanting device and method |
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| CN202010371828.3A CN111432573B (en) | 2020-05-06 | 2020-05-06 | Circuit board needle implanting device and method |
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| CN111432573B true CN111432573B (en) | 2021-07-30 |
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| CN108471705A (en) * | 2018-06-04 | 2018-08-31 | 深圳市鹰飞科技开发有限公司 | A kind of automatically slotting miaow machine |
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| CN111432573A (en) | 2020-07-17 |
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Address after: 201600 Building 1, No. 76, Jinma Road, Jiuting Town, Songjiang District, Shanghai Patentee after: Shanghai Shiyu Precision Equipment Co.,Ltd. Address before: 201600 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Patentee before: SHANGHAI SHIYU PRECISION MACHINERY Co.,Ltd. |
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