TWM254070U - Combination cooler - Google Patents
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- TWM254070U TWM254070U TW93204835U TW93204835U TWM254070U TW M254070 U TWM254070 U TW M254070U TW 93204835 U TW93204835 U TW 93204835U TW 93204835 U TW93204835 U TW 93204835U TW M254070 U TWM254070 U TW M254070U
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g、創作說明(1) 【新型所屬之技術領域】 腦中種組合式散熱器,尤指-種裝設於電 合連社,以^11 、疋件上,利用導熱座與散熱體間之扣 傳件間之接觸緊密度…提昇該散熱 【先前技術】 按,將熱導體運用於電腦相關領 :;傳:其熱:量或;柱;,熱= 性,所w叮、,你☆ 年重里幸工、、、口構間早及多用途等特 可以傳遞大量的熱且不消耗電力,非常 產品的散熱需求,因此將埶 口 敎,P # 1 ^ # 熱導體散熱體組成之組合式散 …、為已成為散熱課題之另一解決方案。 t閱第一圖所示,係為習知組 有一導熱座l〇a、二埶瞢私為Μ 主要包括 座…底面平貼於中二理0:二:,’其中該導熱 兮右-你播、、婆η 為(CPU)之表面上,且其頂面開 設,可分別供熱管2〇3之-端置g. Creation instructions (1) [Technical field to which the new type belongs] A kind of combined radiator in the brain, in particular-a type installed in Dianlian Lianhe Co. The tightness of the contact between the parts ... improving the heat dissipation [Previous technology] Press and use the thermal conductor for the computer related collar :; pass: its heat: amount or; column ;, heat = sex, so wding, you ☆ Fortunately, it is possible to transfer a large amount of heat without consuming electricity, which is very important for the product's heat dissipation requirements. Therefore, it is a combination of P # 1 ^ # thermal conductor heat sink Dispersion ... is another solution that has become a topic of heat dissipation. As shown in the first picture, the system has a thermally conductive base 10a for the conventional group, and the second base is M. The main part includes the base ... The bottom surface is flatly attached to the middle 2nd 0: 2 :, 'where the heat conduction is right-you Sowing, and η are on the surface of (CPU), and the top surface is opened, which can be used for heating tube 203
Qn / ; 另一端則穿設於散熱體30a上,兮埒埶髀 30a係由複數散熱鰭片31a 該政熱體 開設有相互斟旛+ * ^ 各該政熱鰭片31 a上 相互對應之穿孔32a,該 設連接,並於各該元件之接觸面間塗覆有牙 此,以形成一組合式散熱器之組能。 ‘,,、"負,如 問題=而,習知之組合式散熱器Γ基本上仍存在有如下之 其-’由於各該熱管20“系為一小管徑圓柱體… 内部 M254070 、創作說明(2) 一 所能設置之毛細組織及工作流體受到空間所拘限,且1盥 導熱座10a及散熱體3〇a之接觸面積狹小熱阻 了 ς 熱管20a所能帶走之熱量有其侷限性。 其二,該等散熱鰭片31 a之穿孔32a係為一 = 合時,於該穿孔仏内壁面不易將黏膠 匕以:::;觸=熱管心與散一連 生相互撞擊,目而w氣Ά,極易使氣流於流道間產 傳導係數差等不良=象^阻大、噪音大、渦流多及熱對流 經驗,ξ針dm於上述問題點及從事研發多年之 配合實際之運用,廿士 ::之!"便與問題點,乃潛心研究並 設計合理且有改改盖=精益求精之精神,終於提出一種 【新型内容】改善上述問題點之本創作。 本創作之主i a ^ . 其係利用導熱座與散敎體=可”-種組合式散熱器, 之接觸緊密度及減小:阻:結,以增加各元件間 觸部及容置槽之矣;並可將導熱介質均勻塗佈於接 構,進而提昇# ^ ^:提供一熱阻抗性低之散熱結 為了達$熱熱傳導效果。 器,包括有4=1。:::作係提供一種組合式散熱 -孔洞,該孔洞係供一孰;置、其中,該導熱座開設有 ”、、吕置设,於該導熱座外部設有第 Η 第6頁 M254070 、創作說明(3) -扣合部?接觸部,該第一扣合部係連接於散熱體上,該 散熱體由稷數散熱ϋ片所組&,於該等散熱鳍片上設有容 置槽及第二扣合部,該第二扣合部與導熱座之第一 ^合部 對應設置且相互配合,該第一扣合部連結於第二入邛 時,俾令散熱體之容置槽緊密貼合於導熱 :口二, 進而達成上述之目的。 伐順。丨上 【實施方式】 ^為工使> 貴審查委員能更進一步瞭解本創作之特徵及 技術内容,請參閱以下有關本創作之詳細說明與圖, 所附圖式僅提供參考與說明用,並非用來鲁' 你β 制者。 ’用來對本創作加以限 請參閱第二及三圖所示,係分別為本創作第 之^體分解圖及組合剖視圖,本創作係提供一種組合 熱器’其係包括有一導熱座1〇及一散熱體2〇,其中· 、該導熱座10係以鋁、銅或具有良好導熱性^質所製 成,於其外部底端處分別設有二相對應之第一扣合部11, 該第一扣合部11係可為一凹入狀卡槽或凸出狀卡鉤(如’ 六圖所示)之型態,本實施例係為一『V』字形卡槽;於 導熱座1 0上形成有一接觸部i 2,該接觸部丨2係呈一倒Λ 『U』子狀之型態;另於該導熱座i 〇之近上方處開設有— 圓柱狀孔洞13,該孔洞13係與導熱座1〇之接觸部12互相 打,且其可供一熱管14置設連結,該熱管“係為一大管 圓柱? ’纟内部設有毛細組織及工作流體,藉以利用該: 細組織及工作流體之熱傳機^,以㈣源所產生之熱量迅Qn /; The other end is placed on the heat sink 30a, and the heat sink 30a is composed of a plurality of heat sink fins 31a. The government heat bodies are provided with mutual reflections + * ^ Each of the government heat fins 31 a corresponds to each other. The perforations 32a are connected, and teeth are coated between the contact surfaces of the components to form a group heat sink. ',,,, " Negative, such as the problem = and, the conventional combined radiator Γ basically still exists as follows-' Because each of the heat pipes 20 "is a small diameter cylinder ... Internal M254070, creation instructions (2) Capillary tissue and working fluid that can be installed are restricted by space, and the contact area of the heat transfer seat 10a and the heat sink 30a is small. The thermal resistance limits the heat that the heat pipe 20a can take away. Secondly, the perforations 32a of the heat dissipation fins 31a are equal to one, and it is not easy to make the glue dagger on the inner wall surface of the perforation: :::; However, w is frustrated, it is very easy to make the difference between the conduction coefficient between the air flow and the flow channel, etc. = large resistance, high noise, eddy current, and thermal convection experience. Use, 廿 士 :: !! "The problem and the problem, is the spirit of researching and designing reasonably and with the spirit of improvement = perfection, and finally put forward a" new content "to improve the original creation of the above problem. ia ^. It uses a thermally conductive base and a loose body = OK "- Combined heat sink, the contact tightness and reduction: resistance: junction, to increase the contact between each element and the receiving groove; and can evenly apply a thermally conductive medium to the joint structure, thereby improving # ^ ^: Provide A thermal junction with low thermal resistance is used to achieve thermal conductivity. Including 4 = 1. ::: The system provides a combined heat-dissipation hole, which is provided for one frame; where, the heat conduction base is provided ", and Lu is placed, and the heat conduction base is provided on the outside of the heat conduction base. Page 6 M254070, Creation description (3)-a snap-in part? A contact part, the first snap-in part is connected to a heat sink, which is composed of a plurality of heat sink fins, and is provided on the heat sink fins Groove and a second engaging portion, which is correspondingly arranged and cooperates with the first engaging portion of the heat conducting seat. When the first engaging portion is connected to the second entry, the heat sink is accommodated. The groove is closely attached to the heat conduction: the second mouth, thereby achieving the above-mentioned purpose. Fashun. 丨 on the [implementation] ^ For workers > Your reviewers can further understand the characteristics and technical content of this creation, please refer to the following related The detailed descriptions and drawings of this creation are provided for reference and explanation only, and are not intended to be used as a 'you β producer.' To limit this creation, please refer to the second and third pictures, which are based on this. An exploded view of the creative body and a sectional view of the composition, this creative department provides a The combined heater includes a heat-conducting base 10 and a heat-dissipating body 20, wherein the heat-conducting base 10 is made of aluminum, copper, or a material having good thermal conductivity, and is provided at the outer bottom end of the heat-conducting base. There are two corresponding first buckling portions 11, and the first buckling portions 11 can be a recessed latching groove or a protruding latching hook (as shown in FIG. 6). This embodiment is It is a "V" -shaped card slot; a contact portion i 2 is formed on the heat conductive base 10, and the contact portion 2 is in the shape of an inverted Λ "U" sub-shaped; A cylindrical hole 13 is provided at the upper part. The hole 13 is connected with the contact portion 12 of the heat conducting seat 10, and it can be connected by a heat pipe 14. The heat pipe "is a large tube cylinder?" ’纟 Inside is equipped with capillary tissue and working fluid, so as to make use of: The heat transfer machine of the fine tissue and working fluid ^, using the heat generated by the source quickly
第7頁 M254070 四、創作說明(4) 速帶離;另該導熱座10之孔洞13内壁與熱管14之外緣面 間,係可填充或塗覆有導熱介質,該導熱介質可為散熱 膏、鉛、錫、鉛錫合金、金屬或低溫可融化之導熱膏之材 質。 該散熱體20亦係以銘、銅或具有良好導熱性材質所製 成’其係由複數散熱鰭片2 1所組成,於該等散熱鰭片2 1上 開設有圓弧狀之容置槽22,該容置槽22之内緣形狀與導熱 座1 0之接觸部1 2外緣形狀相互配合,且於其下方處設有二 相對稱之第一扣合部23,該等第二扣合部23與導熱座1〇之 第一扣合部11對應設置且相互配合,當該第一扣合部丨丨扣 合連結於第二扣合部23時,俾令散熱體2〇之容置槽22緊密 貼合於導熱座10之接觸部12上;另自該第二扣合部23上方 延伸至容置槽32周緣處形成有一凸環24,該凸環24可增加 散熱鰭片21與導熱座1〇之接觸表面積,且易於將導熱介質 均勻塗覆於凸環2 4與接觸部1 2之間。 藉由上述元件之組合,其組合方式係可為先將該熱管 14置入導熱座1〇之孔洞13中,再與散熱體2〇扣合連接;亦 可為以導熱座10與散熱體20相互扣合連接後,再將熱管14 置入導熱座1 0之孔洞1 3中結合。 請參閱第四及五圖所示,係分別為本創作第一實施例 與固疋座及散熱風扇之分解立體圖及組合剖視圖,其更包 括有一固疋座30及一散熱風扇4,其中,該固定座設於 政熱體20上方’並連接於導熱座1〇上;該固定座3〇可供一 散熱風扇40固設連接,該固定座3〇包含有一主體31及從主Page 7 M254070 IV. Creation instructions (4) Speed-off; In addition, between the inner wall of the hole 13 of the heat conduction base 10 and the outer edge surface of the heat pipe 14, the heat conduction medium can be filled or coated, and the heat conduction medium can be a heat dissipation paste. , Lead, tin, lead-tin alloy, metal or low temperature meltable thermal paste material. The heat sink 20 is also made of inscription, copper, or a material with good thermal conductivity. It is composed of a plurality of heat sink fins 21, and arc-shaped receiving grooves are provided on the heat sink fins 21. 22. The shape of the inner edge of the accommodating groove 22 and the shape of the outer edge of the contact portion 12 of the heat conductive base 10 are matched with each other, and two symmetrical first fastening portions 23 are provided below the second fastening portion. The engaging portion 23 and the first engaging portion 11 of the heat conducting base 10 are correspondingly arranged and cooperate with each other. When the first engaging portion 丨 丨 is fastened and connected to the second engaging portion 23, the heat dissipation body 20 is ordered. The receiving groove 22 is closely attached to the contact portion 12 of the heat conductive base 10; and a convex ring 24 is formed at the periphery of the receiving groove 32 from above the second engaging portion 23, and the convex ring 24 can increase the heat dissipation fin 21 The contact surface area with the heat conducting base 10 is easy to uniformly apply the heat conducting medium between the convex ring 24 and the contact portion 12. With the combination of the above-mentioned components, the combination method may be that the heat pipe 14 is first placed in the hole 13 of the heat conducting seat 10 and then fastened to the heat sink 20; it may also be the heat conducting seat 10 and the heat sink 20 After being fastened and connected to each other, the heat pipe 14 is placed in the hole 13 of the heat conducting seat 10 and combined. Please refer to the fourth and fifth figures, which are respectively an exploded perspective view and a combined sectional view of the first embodiment of the creation and the fixing bracket and the cooling fan, and further include a fixing bracket 30 and a cooling fan 4, wherein, the A fixing seat is disposed above the thermal management body 20 and is connected to the heat conducting seat 10; the fixing seat 30 can be fixedly connected by a cooling fan 40, and the fixing seat 30 includes a main body 31 and a main body 31;
M254070 四、創作說明(5) 體31垂直延伸之平板32,各該平板32設有穿孔33,另於該 導熱座10之前、後端面上各設有螺孔15,該穿孔33與導熱 座1 〇之螺孔1 5對應設置,可以螺絲等固設元件鎖設連結; 再者,該主體31頂面設有一圓孔34及複數螺孔35,該圓孔 3 4位於政熱風扇4 〇正下方,以利氣流向下吹入散熱器中, 另各該複數螺孔35與散熱風扇4〇之定位孔41相互對應,可 以螺栓等元件鎖設連結。 “ ^請參閱第七圖至第十圖所示,係分別為本創作各種實 施例之組合剖視圖,其中該導熱座丨〇之第一扣合部丨丨盥散 熱體2〇+之第二扣合部23對應配合,該等扣合部結構係;^為 矩形(第七圖)或半圓形(第八圖)之組合型態,用以控制散 ,鰭片21嵌入導熱座1〇時,於垂直方向之定位結構;另該 ,2合=亦可為鹄尾形(第九圖)或『τ』字形(第十圖)之" 組^型恶,用以控制散熱鰭片2 1嵌入導熱座1 〇時,於水平 ^ f直方向之定位結構,即該散熱鰭片2 1無法從前述之方 向中拔出分離。 乃 ^ 所述依據本創作之組合式散熱器,至少具有以 型態Τ Ϊ Ϊ道ί由本創作接觸部與容置槽係為非封閉狀 增^ ;;導,、、、介質均勻塗佈於導熱座及散熱體上,以 觸效果及降低熱傳導之阻抗性;且該第二 於組a過r中:合部所形成之扣合結構’可避免散熱鰭片 觸緊i度,使得i::變形,更增加導熱座及散熱體之接 傳導效率;ΐί ,熱阻抗較小,進而提昇該散熱器之熱 ’藉由該導熱座之接觸部形狀,可提供一M254070 IV. Creation instructions (5) Plates 32 of body 31 extending vertically, each plate 32 is provided with perforations 33, and screw holes 15 are provided in front of and behind the heat conductive base 10, and the perforated 33 and heat conductive base 1 〇The screw holes 15 are correspondingly set, and can be fixed by screws and other fixed components. Furthermore, the top surface of the main body 31 is provided with a circular hole 34 and a plurality of screw holes 35, and the circular holes 34 are located in the political heat fan 4 〇 正Below, the airflow is blown downward into the radiator, and each of the plurality of screw holes 35 corresponds to the positioning holes 41 of the cooling fan 40, which can be locked and connected by bolts and other components. "^ Please refer to the seventh to tenth figures, which are combined sectional views of various embodiments of the present invention, in which the first buckling part of the heat conduction seat 丨 〇 丨 丨 the second buckle of the heat sink 20+ The joints 23 correspond to each other, and the structure of the joints is ^ is a combination of rectangular (seventh figure) or semi-circular (eighth figure), which is used to control the dispersion, and the fins 21 are embedded in the heat conducting seat at 10 , Positioning structure in the vertical direction; In addition, the 2 combination = can also be a "tail" (ninth picture) or "τ" (tenth picture) " group ^ type evil to control the heat dissipation fins 2 1 When it is embedded in the heat-conducting seat 10, the positioning structure in the horizontal ^ f straight direction, that is, the radiating fin 21 cannot be pulled out and separated from the aforementioned direction. However, the combined heat sink according to this creation has at least Type T Ϊ Ϊ ί The contact part and the receiving tank are non-enclosed in the creation of this creation ^; guide ,,, and the medium are evenly coated on the heat conductive base and the heat sink to touch the effect and reduce the resistance of heat conduction And the second is in the group a through r: the buckling structure formed by the joint portion can prevent the heat sink fins from being tightly attached, so that I :: deformation, increase the conduction efficiency of the heat conduction base and the heat sink; ΐί, the thermal resistance is small, and the heat of the heat sink is improved. ′ The shape of the contact part of the heat conduction base can provide a
第9頁 M254070 四、創作說明(6) ,佳之流線形結構,使得氣流之流阻小、噪音小, 最佳之熱傳導效果;再者,該熱管之管壁 板,極易於組裝過程中受到碰撞或壓制力過大:為 凹陷或變形之現象,並大幅降低該熱 =):導熱座之孔洞設置,以對熱管形:一專= 可避免熱管遭受損壞之情況。 隻 綜士所述’當知本創作之組合式散熱器已具有 ==性與進步性,又本創作之創作構造亦不 =:i公開使用,申請前更未見於諸類刊物上 付a新型專利申請要件。 即杓Γ:ί所述僅為本創作之較佳可行實施例,並 :内容所為之等效結構變化,或直接或間用二 ,之技術領域,利王里皆包含於本 : 合予陳明。 F w油盍之乾 並達成 一薄 而產生 果,藉 結構, 產業利 曾見於 ’完全 非因此 書及圖 其它相 圍内, M254070 圖式簡單說明 【圖式簡單說明】 第一圖 係為習知組合式散熱器示意圖。 第二圖 係為本創作第一實施例之立體分解圖。 第三圖 係為本創作第一實施例之組合剖視圖。 第四圖 係為本創作第一實施例與固定座及散熱風扇之立 體分解圖。 第五圖 係為第四圖之組合剖視圖。 第六圖 係為本創作第二實施例之組合剖視圖。 第七圖 係為本創作第三實施例之組合剖視圖。 第八圖 係為本創作第四實施例之組合剖視圖。 第九圖 係為本創作第五實施例之組合剖視圖。Page 9 M254070 Fourth, the creation description (6), the streamlined structure of Jia makes the flow resistance of the air flow is small, the noise is small, and the best heat transfer effect; Moreover, the tube wall plate of the heat pipe is extremely easy to be subjected to during assembly. Excessive impact or pressing force: It is a phenomenon of depression or deformation, and the heat is greatly reduced. =): The holes of the heat conduction seat are set to the shape of the heat pipe: a special = can prevent the heat pipe from being damaged. According to the comprehensive scholar, 'When you know that the combined radiator of this creation already has == nature and progress, and the creation structure of this creation is not =: i use it publicly, it has not been seen in various publications before applying a new type Requirements for patent applications. That is, 所述 Γ: The description is only the preferred and feasible embodiment of this creation, and the equivalent structural changes of the content, or direct or indirect use, are included in this technical field of Li Wangli: He Yu Chen Bright. F w oil dries up and achieves a thin result. By the structure, the industrial profit has been found in the 'completely non-relevant books and other figures. M254070 Schematic illustration [Schematic description] The first picture is for practice. Know the schematic diagram of the combined radiator. The second figure is a three-dimensional exploded view of the first embodiment of the creation. The third figure is a combined sectional view of the first embodiment of the creation. The fourth figure is an exploded perspective view of the first embodiment of the creation, the fixed seat and the cooling fan. The fifth figure is a combined sectional view of the fourth figure. The sixth figure is a combined sectional view of the second embodiment of the present invention. The seventh figure is a combined sectional view of the third embodiment of the present invention. The eighth figure is a combined sectional view of the fourth embodiment of the present invention. The ninth figure is a combined sectional view of the fifth embodiment of the present invention.
I 第十圖 係為本創作第六實施例之組合剖視圖。 【元件代表符號】 【習知】 導熱座 10a 槽溝 11a 熱管 20a 散熱體 30a 散熱鰭片 31a 穿孔 32a 【本創作】 導熱座 10 第一扣合部 11 接觸部 12 孔洞 13 熱管 14 螺孔 15I The tenth figure is a combined sectional view of the sixth embodiment of the present invention. [Representative symbols of components] [Knowledge] Heat conduction base 10a Slot 11a Heat pipe 20a Heat sink 30a Heat sink fin 31a Perforation 32a [This creation] Heat conduction base 10 First fastening part 11 Contact part 12 Hole 13 Heat pipe 14 Screw hole 15
M254070 圖式簡單說明 散熱體 20 散熱鰭片 21 容置槽 22 第二扣合部 23 凸環 24 固定座 30 本體 31 平板 32 穿孔 33 圓孔 34 螺孔 35 散熱風扇 40 定位孔 41M254070 Brief description of the diagram Radiator 20 Radiating fin 21 Receiving slot 22 Second engaging portion 23 Convex ring 24 Fixing base 30 Body 31 Flat plate 32 Perforation 33 Round hole 34 Screw hole 35 Cooling fan 40 Positioning hole 41
第12頁Page 12
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW93204835U TWM254070U (en) | 2004-03-30 | 2004-03-30 | Combination cooler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW93204835U TWM254070U (en) | 2004-03-30 | 2004-03-30 | Combination cooler |
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TWM254070U true TWM254070U (en) | 2004-12-21 |
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Family Applications (1)
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TW93204835U TWM254070U (en) | 2004-03-30 | 2004-03-30 | Combination cooler |
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2004
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