TWM279913U - Cooling device and radiating fin thereof - Google Patents

Cooling device and radiating fin thereof Download PDF

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Publication number
TWM279913U
TWM279913U TW94210401U TW94210401U TWM279913U TW M279913 U TWM279913 U TW M279913U TW 94210401 U TW94210401 U TW 94210401U TW 94210401 U TW94210401 U TW 94210401U TW M279913 U TWM279913 U TW M279913U
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TW
Taiwan
Prior art keywords
heat
heat sink
creation
conducting
sink
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TW94210401U
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Chinese (zh)
Inventor
Tzung Wu
Jia-Hau Jeng
Chi-Jung Tzeng
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Chaun Choung Technology Corp
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Application filed by Chaun Choung Technology Corp filed Critical Chaun Choung Technology Corp
Priority to TW94210401U priority Critical patent/TWM279913U/en
Publication of TWM279913U publication Critical patent/TWM279913U/en

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M279913 創作說明(1) 【新型所屬之技術領域】 本創作係提供一種散熱器及其散熱片,尤指一種設於 挪子發熱兀件上,以不同的導熱及散熱速度帶離,俾令發 …、元件可維持在一允許的工作溫度下繼續運作。 【先前技術】 隨2資訊科技與電腦產業之發展進步,電子元件如中 杏=理1"、B曰片、5己憶體之發熱量愈來愈高,而尺寸卻愈 1俾:t小二4 了將此㈣熱量有效散發導出,以維持發熱元 件传以在許可的溫度之下繼綠 座而接夕私也u 卜、、k績運作,通常係以具有較大底 風發熱元件之表面上,或以增加散熱 出d:來=總體散熱效率:然…此將衍生 :二方統複雜度等相關問題,使得前述 <合这万案並非解決電子埶 、 限的使用空間中配置有導熱[散埶政熱良策’故能在有 合成之散熱器結構,已成為從;;項佳之散熱片或其所組 重要課題。 事4項行業之人士所研究之 習知散熱器結構,主要包夕 座,其中各該散埶片伤々 夕數散熱片及一導熱 Τ合々政熱片係以銅或鋁 板片狀本體,於該本體之上、 何、貝所製成,其具有一 曲形成有折緣,將各該散熱片之分別向同-方向彎 後,平貼於導熱座之頂面上, ^主抹錫膏等導熱介質 合成一散熱器結構。 /JKL熱熔之方式,以組 然而,上述散熱器結構,& f 社貝際使用上仍存在有下述M279913 Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is to provide a radiator and its heat sink, especially a heat-dissipating element set on a heat carrier, which is separated by different heat conduction and heat dissipation speeds. …, The components can continue to operate at a permissible operating temperature. [Previous technology] With the development of 2 information technology and computer industry, the electronic components such as Zhong Xing = Li 1 ", B film, 5 have more and more heat, but the size is 1 俾: t small In order to maintain the heating element, it can effectively dissipate and dissipate the heat, so as to maintain the heating element to pass the green seat at the allowable temperature, and then operate at the same time. Usually, it is based on the heating element with a large bottom wind. On the surface, or to increase heat dissipation, d: come = overall heat dissipation efficiency: then ... this will lead to related issues such as the complexity of the two-party system, so that the aforementioned < combined case is not a solution to the limited use of electronic space There is thermal conductivity [good strategy for dissipating heat from the government ', so it is possible to have a synthetic radiator structure; Xiang Jia's heat sink or its important group of topics. The conventional heat sink structure studied by people in 4 industries mainly includes the base block, where each of the scattered fins hurts the number of heat sinks and a thermally conductive T-coated thermal sheet is a copper or aluminum plate-like body, It is made by He and Bei on the body, and it has a bend to form a folding edge. After bending each of the heat sinks in the same direction, it is flatly attached to the top surface of the heat conduction base. A heat-conducting medium such as a paste forms a heat sink structure. / JKL hot-melt method, in groups However, the above heat sink structure, & f

第5頁 M279913 四、創作說明(2) 之問題點, 本低之優點 内,並無法 執行高速運 熱當機或燒 有導熱速度 發熱元件或 薄、短、小 於是, 之經驗,並 實際之運用 理且有效改 以鋁材質所製成之散熱片’雖呈 ,但其導熱速度不佳,且里二、成 ”地加大其散熱面積,因此當該發 鼻時,經常由於導埶性$ _ …、午在 …、f玍不良,而使發敎元株晶 燬之情況;另以銅材質所f 二、 ^ .,L 貝汀衣成之散熱片,雖呈 快之優點,但其比重大、忐 - ,-、灰本曰a去丄 成本南,易產生壓壞 經濟考置之重大困I,且與電子產、 」之訴求相背離。 1 本創作人有感力上述問題點及從事該行業多年 針對3進行改善之問題點,乃潛心研究並配合 ’本者精i求精之精神,、終於提出二 善上述問題點之本創作。 χ °τ 口 【新型 本 片,其 及散熱 度下繼 為 散熱片 熱片及 本體包 熱部, 一導熱 内容】 創作之主 係可將發 速度帶離 續運作。 了達成上 ,用於電 一導熱座 含有一第 該第二導 部之熱傳 要目的,在於可提供一種散埶哭 熱元件運作所產生之熱量,以^ ’俾令發熱元件可保持在一允許 述之目的,本創作係提供一種散 腦之發熱元件上,該散熱器包括 ’其中各該散熱片具有一板片狀 一導熱部及一具有二相互對應面 熱部係連接於第一導熱部之外側 導係數大於第二導熱部之熱傳導 及其散勢 同的導勒 的工作還 熱器及其 有多數勒 H Μ 之第二導 ’且該第 係、數,而Page 5 M279913 Fourth, the problem of creation description (2), within the advantages of low cost, can not perform high-speed heat transfer crash or burned heat-conducting speed heating element or thin, short, less than yes, experience, and practical The heat sink made of aluminum material is effective and effective. Although it is presented, its heat transfer speed is not good, and its heat dissipation area is enlarged. Therefore, when the nose is swollen, it is often due to the conductivity. $ _…, Noon…, f 玍 is bad, and the hairpin crystals are destroyed; another is made of copper material. F. ^., L The heat sink made of Beiting clothing is fast, but It has a high specific gravity, which means that it will cost a lot of money to go to the south, which is likely to cause major difficulties that can undermine economic considerations. It also runs counter to the demands of electronics production. 1 The author has the above-mentioned problems and has been working in the industry for many years to improve the 3 problems. He has concentrated on researching and cooperating with the spirit of ‘refinement and refinement’, and finally put forward the two original problems. χ ° τ mouth [new type of film, its heat dissipation degree is followed by the heat sink and the body package heat section, a thermal conductive content] The main creator of the creation can speed up the operation of the belt. In order to achieve this, the main purpose of the heat transfer for the electrically-conductive seat containing a first and second guide is to provide a method for dissipating the heat generated by the operation of the cryogenic element, so that the heating element can be maintained at a To allow the purpose described, the present invention is to provide a heat dissipating element on the brain. The heat sink includes' wherein each of the heat sinks has a plate-like heat conducting part and a heat part having two mutually corresponding surfaces is connected to the first heat conducting part. The coefficient of conductance of the outer side of the part is greater than the heat conduction of the second heat conducting part and the homogeneous divergence of the work.

M279913 ***面之第二導熱部 導熱部1 1 2係連接於第一導熱部1 1 1之外側, 熱部111之熱傳導係數大於第二導熱部1 1 2之熱 該第一導熱部111係可為銅材質之薄片、金屬 狀石墨(如第五圖)或其他具有高導熱性之材質 實施例係為一薄銅片;而該第二導熱部1 1 2則 或其他具有高散熱性之材質所製成,本實施例 片,且該第二導熱部11 2係以一體成型製成, [J」狀之型態。 座2亦可為銅材質或其他具有高導熱性之材質 其頂面開設有多數相互平行之槽道2 1,該槽道 與散熱片1之厚度相應配合,令各該散熱片1之M279913 Explaination of Creation and Creation (3) The heat-conducting seat is used to connect one end of each of the heat sinks, and a heat dissipation channel is formed between two adjacent heat sinks, thereby achieving the above purpose. [The embodiment is related to the present invention and the drawings. The creation is restricted to read the exploded views and views. The original creation includes a large number of scattered and scattered first thermally conductive 112, and the conductive braid can be made by the system and presented. For the characteristics and technical contents of the creation of the system 21, please refer to the detailed description below. The attached drawings are only for reference and explanation, and are not intended for the system producer. The first to fourth figures show a vertical sectional view of the combined heat sink, a three-dimensional exploded view of the heat sink, and a sectional view of the heat sink. The heat sink includes heat sinks 1 and 1. The heat conduction base 2, wherein: the second first conductivity coefficient is formed of a mesh and a sheet, and the aluminum material is made of a thin aluminum material. The heat conduction element has a plate-shaped body 11 in a width-type heat sheet 1, and the body 11 includes There is a portion 111 and a second heat conducting portion having two mutually corresponding planes. The heat conducting portion 1 1 2 is connected to the outer side of the first heat conducting portion 1 1 1. The thermal conductivity of the heat portion 111 is greater than that of the second heat conducting portion 1 1 2. The first thermally conductive portion 111 may be a thin sheet of copper material, metallic graphite (as shown in the fifth figure), or other materials with high thermal conductivity. The embodiment is a thin copper sheet; and the second thermally conductive portion 1 1 2 or It is made of other materials with high heat dissipation properties. In this embodiment, the second heat-conducting portion 112 is made in one piece, in the shape of a "J" shape. The seat 2 can also be made of copper or other materials with high thermal conductivity. The top surface is provided with a plurality of parallel channels 21, which are matched with the thickness of the heat sink 1 so that each of the heat sinks 1

M279913 、創作說明(4) 底端得以嵌入連接於槽道2 1内 形成有散熱通道3。 並於一相鄰政熱片i之間 ,用¥係將導熱座2之底面平貼於電腦之發熱元件 斤,^發熱凡件在執行高速運算而急速產生高熱量時,哕 弟:ί熱部111可快速地把此等熱量導出帶離,再經由第〆 :部112之高散熱特性而將熱量散逸排出,俾令該發 =件可維持在-允許的工作溫度下繼續運作,不產 過熱而當機或燒燬之情形。 u 請參閱第六及七圖所示,係為本創作散熱片之又 施例及再一實施例組合剖視圖,本創作之散熱片1除可為、 f述:實施例夕卜’該散熱片r之本體η係可由-金屬編織 =t Y導熱部111及二「门」形薄片之第二導熱部112所 構成,同理,該第二導熱部112亦可由二「L」形薄片 圖未示)。另第七圖所示之散熱片”則係由 2之,二Ϊ熱部112夾固連接於第一導熱部111之外側所ί 成’精以簡化製造之程序而大幅降低成本。 綜上所述,當知本創作之散熱器及 業利用性、新I員性與進步性,又本創作之二二二^2有產 :類產品及公開使a,完全符合新型 ;J ::: 專利法提出申請。 受件友依 惟以上所述僅為本創作之較佳可 即拘限本創作之專利範目,故舉凡運用本創丄兒 式内容所為之等效結構變化,或直接月曰及圖 關之技術領域,均同理皆包含於本創作 於其它相 M乍所涵盍之範圍内,M279913, Creation Note (4) The bottom end can be embedded and connected to the channel 2 1 to form a heat dissipation channel 3. And between an adjacent political and thermal film i, the bottom surface of the heat conducting seat 2 is flatly attached to the heating element of the computer with ¥. When the heating element performs high-speed operations and generates high heat rapidly, my brother: ί heat The unit 111 can quickly remove such heat, and then dissipate the heat through the high heat dissipation characteristics of the first unit: unit 112, so that the unit can be maintained at the -permissible operating temperature and continue to operate without production. Overheated and crashed or burned. u Please refer to the sixth and seventh figures, which are cross-sectional views of another embodiment and another embodiment of the heat sink of this creation. In addition, the heat sink 1 of this creation can be described as: f. Example of the heat sink The body η of r can be composed of-metal braid = t Y heat conducting portion 111 and a second "door" shaped second heat conducting portion 112. Similarly, the second heat conducting portion 112 can also be composed of two "L" shaped thin plates. Show). In addition, the heat sink shown in the seventh figure is formed by two, the second heat section 112 is clamped and connected to the outer side of the first heat conducting section 111 to simplify the manufacturing process and greatly reduce the cost. It is stated that when you know the radiator, industrial utilization, new members and progressiveness of this creation, and the production of 2222 of this creation: products and publicity a, fully in line with the new type; J ::: patent According to the above, the recipients described above are only the best patents of this creation, but the patent scope of this creation is restricted. Therefore, the equivalent structural changes made by using the creative content of this creation, or directly And the technical fields of Tuguan are similarly included in the scope of this creation in other phases.

M279913 四、創作說明(5) 合予陳明。M279913 IV. Creation Instructions (5) Jointly with Chen Ming.

'11111 M279913 圖式簡單說明 【圖式簡單說明】 第一圖 係本創作散熱片之立體分解圖。 第二圖 係本創作散熱片之組合剖視圖。 第三圖 係本創作散熱片與導熱座之立體分解圖。 第四圖 係本創作散熱片與導熱座之組合剖視圖。 第五圖 係本創作散熱片之另一實施例組合剖視圖 第六圖 係本創作散熱片之又一實施例組合剖視圖 第七圖 係本創作散熱片之再一實施例組合剖視圖 【主要元件符號說明 【本創作】 第一導熱部111 散熱片1、1 ’ 、Γ 本體11 第二導熱部1 1 2 導熱座2 槽道21 散熱通道3 #'11111 M279913 Simple illustration of the drawing [Simplified illustration of the drawing] The first picture is a three-dimensional exploded view of the heat sink of this creation. The second figure is a sectional view of the combined heat sink. The third picture is a three-dimensional exploded view of the radiating fins and the heat conducting seat of this creation. The fourth figure is a cross-sectional view of the combined heat sink and heat sink in this creation. The fifth figure is a combined sectional view of another embodiment of the creative heat sink. The sixth figure is a combined sectional view of another embodiment of the creative heat sink. The seventh figure is a combined sectional view of another embodiment of the creative heat sink. [This creation] The first heat-conducting part 111, the heat sink 1, 1 ', Γ body 11 The second heat-conducting part 1 1 2 The heat-conducting seat 2 The channel 21 The heat-dissipating channel 3 #

第10頁Page 10

Claims (1)

M279913M279913 M279913 五、申請專利範圍 9.如申請專利範圍第4項所述之散熱片 導熱部係為一體成型並呈一「U」形。 1 0.如申請專利範圍第4項所述之散熱片 導熱部係由二「门」形薄片所構成。 11.如申請專利範圍第4項所述之散熱片 導熱部係由二「L」形薄片所構成。 1 2.如申請專利範圍第4項所述之散熱片 導熱部係由二平板型薄片所構成。 〇 其中該第 其中該第 其中該第 其中該第M279913 5. Scope of patent application 9. The heat sink as described in item 4 of the scope of patent application. The heat conduction part is integrally formed and has a "U" shape. 10. The heat sink as described in item 4 of the scope of patent application. The heat conducting part is composed of two "door" shaped sheets. 11. The heat sink as described in item 4 of the scope of patent application. The heat conducting part is composed of two "L" shaped sheets. 1 2. The heat sink as described in item 4 of the scope of patent application. The heat-conducting part is composed of two flat-plate sheets. 〇 where the first where the first where the first where the first 第12頁Page 12
TW94210401U 2005-06-21 2005-06-21 Cooling device and radiating fin thereof TWM279913U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107819373A (en) * 2017-12-01 2018-03-20 丹阳荣嘉精密机械有限公司 A kind of good electric machine casing of thermal diffusivity

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107819373A (en) * 2017-12-01 2018-03-20 丹阳荣嘉精密机械有限公司 A kind of good electric machine casing of thermal diffusivity

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