TWI843378B - Pick-and-place tool, testing system with the same and testing method - Google Patents

Abstract

The present disclosure relates to a pick-and-place tool, a testing system with the same and a testing method. The pick-and-place tool includes a first suction nozzle and a second suction nozzle. The first suction nozzle is configured to pick up a workpiece loaded on a first loading apparatus. The second suction nozzle is configured to pick up the workpiece from the first loading apparatus when the workpiece cannot be picked up by the first suction nozzle.

Description

取放工具、具有其之測試系統及測試方法Pick-and-place tool, test system having the same, and test method

本發明係關於一種取放工具、具有其之測試系統及測試方法，尤其係可排除無法被正常吸取或放置之工件。 The present invention relates to a pick-and-place tool, a testing system and a testing method having the same, and in particular, can eliminate workpieces that cannot be normally picked up or placed.

一產品之製造或一些裝置之組裝通常涉及工件(例如待組裝組件)之處置。特定言之，此等工件在其等經歷製程時，需在不同位置(如組裝台、檢驗台、封裝台或運送構件)之間運送。在現代自動或半自動製造中，通常由機器手臂完成此工件處置。可並行處置大量組件。例如，通常在模製矩陣載體(例如，JEDEC托盤)中運送電子組件。電子組件定位於托盤之凹穴或單元中。通常由取放機器手臂完成將組件放置至凹穴中或自凹穴提取組件以將其等轉移至一不同位置(即，用於檢驗或組裝)。一取放機器手臂通常包括一或若干個所謂之取放工具，該一或若干個所謂之取放工具可自一托盤之一凹穴提取一電子組件且亦將一電子組件放置至一托盤之一凹穴中。取放工具常使用真空吸嘴進行電子組件之提取與放置。 The manufacture of a product or the assembly of some device often involves the handling of workpieces (e.g., components to be assembled). Specifically, these workpieces need to be transported between different locations (such as assembly stations, inspection stations, packaging stations, or shipping units) as they go through the manufacturing process. In modern automated or semi-automated manufacturing, this workpiece handling is often accomplished by robotic arms. Large numbers of components can be handled in parallel. For example, electronic components are often transported in molded matrix carriers (e.g., JEDEC trays). The electronic components are positioned in recesses or cells of the tray. Placing components into recesses or extracting components from recesses to transfer them to a different location (i.e., for inspection or assembly) is often accomplished by pick-and-place robotic arms. A pick-and-place robot arm usually includes one or more so-called pick-and-place tools, which can extract an electronic component from a recess in a tray and also place an electronic component into a recess in a tray. The pick-and-place tool often uses a vacuum nozzle to extract and place the electronic component.

然，在以取放工具之真空吸嘴將電子組件自托盤吸取及將已吸取之電子組件正確放置於運送載具時，常會因機構(如機械手臂)之控制穩定度或定位精度不佳，或因電子組件在來料時已呈歪斜狀態，而導致 取放工具之真空吸嘴無法正常自托盤吸取該電子組件或無法將電子組件正確地放置於運送載具上，如此會導致系統設備暫停運作，進而造成產能之損失。 However, when the vacuum nozzle of the pick-and-place tool is used to pick up the electronic components from the tray and correctly place the picked up electronic components on the transport carrier, the control stability or positioning accuracy of the mechanism (such as a robot arm) is often poor, or the electronic components are already skewed when they are delivered, which causes the vacuum nozzle of the pick-and-place tool to be unable to normally pick up the electronic components from the tray or to be unable to correctly place the electronic components on the transport carrier. This will cause the system equipment to stop operating, thereby causing a loss of productivity.

在一些實施例當中，本揭露提供一種取放裝置，其包括：一第一吸嘴及一第二吸嘴。該第一吸嘴經組態以吸取位於一第一承載裝置上之一工件，而該第二吸嘴經組態以於該工件無法被該第一吸嘴自該第一承載裝置吸取時，自該第一承載裝置吸取該工件。 In some embodiments, the present disclosure provides a pick-and-place device, which includes: a first suction nozzle and a second suction nozzle. The first suction nozzle is configured to suck a workpiece located on a first carrier, and the second suction nozzle is configured to suck the workpiece from the first carrier when the workpiece cannot be sucked from the first carrier by the first suction nozzle.

在一些實施例當中，本揭露提供一種取放裝置，其包括：一第一吸嘴及一第二吸嘴。該第一吸嘴經組態以將一工件放置於一第二承載裝置上，而該第二吸嘴經組態以於該工件無法被該第一吸嘴正確地放置於該第二承載裝置上時，自該第二承載裝置吸取該工件。 In some embodiments, the present disclosure provides a pick-and-place device, which includes: a first suction nozzle and a second suction nozzle. The first suction nozzle is configured to place a workpiece on a second carrier, and the second suction nozzle is configured to pick up the workpiece from the second carrier when the workpiece cannot be correctly placed on the second carrier by the first suction nozzle.

在一些實施例當中，本揭露提供一種測試系統，其包含一第一承載裝置、一第二承載裝置、一回收裝置及一取放工具。該第二承載裝置與該第一承載裝置隔開設置，且該回收裝置與該第一承載裝置及該第二承載裝置間隔開設置，且經組態以存放一工件。該取放工具經組態以將該工件自該第一承載裝置吸取並擺放至該第二承載裝置，及將該工件自該第一承載裝置吸取並擺放至該回收裝置。 In some embodiments, the present disclosure provides a testing system, which includes a first carrier, a second carrier, a recovery device, and a pick-and-place tool. The second carrier is separated from the first carrier, and the recovery device is separated from the first carrier and the second carrier, and is configured to store a workpiece. The pick-and-place tool is configured to suck the workpiece from the first carrier and place it on the second carrier, and to suck the workpiece from the first carrier and place it on the recovery device.

在一些實施例當中，本揭露提供一種測試方法，其包含：一第一步驟，包括使用一取放工具拾取一位於一第一位置之工件並擺放至一測試裝置；及一第二步驟，包括使用該取放工具拾取無法自該第一位置拾取之該工件並擺放至一第二位置。 In some embodiments, the present disclosure provides a testing method, which includes: a first step, including using a pick-and-place tool to pick up a workpiece at a first position and place it on a testing device; and a second step, including using the pick-and-place tool to pick up the workpiece that cannot be picked up from the first position and place it to a second position.

上文已相當廣泛地概述本揭露之技術特徵，俾使下文之本 揭露詳細描述得以獲得較佳瞭解。構成本揭露之申請專利範圍標的之其他技術特徵將描述於下文。本揭露所屬技術領域中具有通常知識者應瞭解，可相當容易地利用下文揭示之概念與特定實施例作為修改或設計其他結構或製程而實現與本揭露相同之目的。本揭露所屬技術領域中具有通常知識者亦應瞭解，這類等效建構無法脫離後附之申請專利範圍所界定之本揭露的精神和範圍。 The above has been a fairly broad overview of the technical features of the present disclosure, so that the detailed description of the present disclosure below can be better understood. Other technical features that constitute the subject matter of the patent application scope of the present disclosure will be described below. Those with ordinary knowledge in the technical field to which the present disclosure belongs should understand that the concepts and specific embodiments disclosed below can be easily used to modify or design other structures or processes to achieve the same purpose as the present disclosure. Those with ordinary knowledge in the technical field to which the present disclosure belongs should also understand that such equivalent constructions cannot deviate from the spirit and scope of the present disclosure as defined by the attached patent application scope.

1:真空取放工具 1: Vacuum pick-and-place tool

1':真空取放工具 1': Vacuum pick and place tool

1":真空取放工具 1": Vacuum pick and place tool

2:進料承載裝置 2: Material feeding device

3:運送載具 3: Transport vehicle

4:測試裝置 4: Test equipment

5:暫放收納裝置 5: Temporary storage device

6:出料承載裝置 6: Material discharging and carrying device

9:工件 9: Workpiece

10:主體 10: Subject

11:真空吸嘴 11: Vacuum nozzle

11-1:真空吸嘴 11-1: Vacuum nozzle

11-2:真空吸嘴 11-2: Vacuum nozzle

13:真空/放氣供應管線 13: Vacuum/air supply line

15:回收吸嘴 15: Recycling nozzle

15-1:回收吸嘴 15-1: Recycling nozzle

15-2:回收吸嘴 15-2: Recycling nozzle

17:真空/放氣供應管線 17: Vacuum/air supply line

21:進料機器臂 21: Feeding machine arm

41:測試機器臂 41: Testing the machine arm

61:出料機械臂 61: Discharging robot arm

90:載具 90: Vehicles

91:表面 91: Surface

92:凹槽 92: Groove

100:測試系統 100:Test system

110:管體 110: Tube body

111:內部管路 111: Internal pipeline

113:吸嘴件 113: Nozzle piece

150:管體 150: Tube body

151:內部管路 151: Internal pipeline

153:吸罩 153: Suction hood

153-1:吸罩 153-1: Suction hood

153-2:吸罩 153-2: Suction hood

157:偵測裝置 157: Detection device

1530:通氣孔 1530:Ventilation hole

1530-1:通氣孔 1530-1: Ventilation hole

1530-2:通氣孔 1530-2: Ventilation hole

1531:罩體 1531:Hood

1531-1:罩體 1531-1: Shield

1531-2:罩體 1531-2: Shield

從下列實施方式、連同附圖將更瞭解本揭露的態樣。應注意，根據業界的標準實務，各種特徵件並未按實際比例繪製。事實上，為了清楚說明，各種特徵件的尺寸可任意放大或縮小。 The following embodiments, together with the accompanying drawings, will provide a better understanding of the present disclosure. It should be noted that, in accordance with standard industry practice, the various features are not drawn to scale. In fact, for the sake of clarity, the sizes of the various features may be arbitrarily enlarged or reduced.

圖1A所示為根據本揭露之實施例之真空取放工具(Pick-and-Place Tool)之示意圖。 FIG. 1A is a schematic diagram of a vacuum pick-and-place tool according to an embodiment of the present disclosure.

圖1B所示為根據本揭露之實施例之真空取放工具之仰視示意圖。 FIG. 1B is a schematic bottom view of a vacuum pick-and-place tool according to an embodiment of the present disclosure.

圖2A所示為根據本揭露之實施例之真空取放工具之真空吸嘴之剖面示意圖。 FIG2A is a schematic cross-sectional view of a vacuum nozzle of a vacuum pick-and-place tool according to an embodiment of the present disclosure.

圖2B所示為根據本揭露之實施例之真空吸嘴吸取一工件之剖面示意圖。 FIG2B is a cross-sectional schematic diagram of a vacuum nozzle sucking a workpiece according to an embodiment of the present disclosure.

圖3A所示為根據本揭露之實施例之真空取放工具之回收吸嘴之剖面示意圖。 FIG3A is a schematic cross-sectional view of a recovery nozzle of a vacuum pick-and-place tool according to an embodiment of the present disclosure.

圖3B所示為根據本揭露之實施例之真空取放工具之回收吸嘴之仰視示意圖。 FIG. 3B is a schematic diagram of a bottom view of the recovery nozzle of the vacuum pick-and-place tool according to an embodiment of the present disclosure.

圖3C所示為根據本揭露之實施例之真空取放工具之回收吸 嘴之仰視示意圖。 FIG. 3C is a schematic diagram of a top view of a recovery nozzle of a vacuum pick-and-place tool according to an embodiment of the present disclosure.

圖3D所示為根據本揭露之實施例之回收吸嘴吸取一工件之剖面示意圖。 FIG3D is a cross-sectional schematic diagram of a recovery nozzle sucking a workpiece according to an embodiment of the present disclosure.

圖3E所示為根據本揭露之實施例之回收吸嘴吸取一工件之仰視示意圖。 FIG3E is a schematic diagram of a recovery nozzle sucking a workpiece according to an embodiment of the present disclosure from a bottom view.

圖3F所示為根據本揭露之實施例之回收吸嘴吸取一工件之仰視示意圖。 FIG. 3F is a schematic diagram of a recovery nozzle sucking a workpiece according to an embodiment of the present disclosure from a bottom view.

圖4所示為根據本揭露之實施例之測試系統之示意圖。 FIG4 is a schematic diagram of a test system according to an embodiment of the present disclosure.

圖5A所示為根據本揭露之實施例之測試系統之執行步驟之流程圖。 FIG5A is a flow chart showing the execution steps of the test system according to an embodiment of the present disclosure.

圖5B所示為根據本揭露之實施例之測試系統之執行步驟之流程圖 FIG5B is a flowchart showing the execution steps of the test system according to the embodiment of the present disclosure.

為瞭解本發明之目的、特徵及功效，茲由下述具體之實施例，配合圖式說明，對於本揭露詳細地說明如下。 In order to understand the purpose, features and effects of the present invention, the following specific embodiments are used in conjunction with the illustrations to explain the present disclosure in detail.

圖1A所示為根據本揭露之實施例之真空取放工具1(Pick-and-Place Tool)之示意圖。如圖1A所示，真空取放工具1具有一主體10及複數個真空吸嘴11。在本揭露的一些實施例中，真空取放工具1之主體10係與一機械手臂或其他傳動機制裝配，使得真空存取工具1可在X、Y及Z軸方向上移動。複數個真空吸嘴11係通過真空/放氣供應管線(未繪示)與真空供應裝置(未繪示)連接，如此真空供應裝置可對真空吸嘴11施加真空，以使得真空吸嘴11可進行工件之吸附及提取。在本揭露的一些實施例中，複數個真空吸嘴11可共同與單一個真空供應裝置連接。在本揭露的一些實施 例中，複數個真空吸嘴11之各個係獨立地與個別真空供應裝置連接。換言之，真空吸嘴11為真空取放工具1之一拾取件，其可經組態拾取工件。 FIG. 1A is a schematic diagram of a vacuum pick-and-place tool 1 according to an embodiment of the present disclosure. As shown in FIG. 1A , the vacuum pick-and-place tool 1 has a main body 10 and a plurality of vacuum nozzles 11. In some embodiments of the present disclosure, the main body 10 of the vacuum pick-and-place tool 1 is assembled with a robot arm or other transmission mechanism so that the vacuum pick-and-place tool 1 can move in the X, Y and Z axis directions. The plurality of vacuum nozzles 11 are connected to a vacuum supply device (not shown) through a vacuum/degassing supply pipeline (not shown), so that the vacuum supply device can apply vacuum to the vacuum nozzle 11 so that the vacuum nozzle 11 can absorb and extract the workpiece. In some embodiments of the present disclosure, the plurality of vacuum nozzles 11 can be connected to a single vacuum supply device. In some embodiments of the present disclosure, each of the plurality of vacuum nozzles 11 is independently connected to a respective vacuum supply device. In other words, the vacuum nozzle 11 is a pick-up component of the vacuum pick-and-place tool 1, which can be configured to pick up workpieces.

在本揭露的一些實施例中，真空存取工具1可同時使用多個真空吸嘴11以吸取或放置工件。在本揭露的一些實施例中，真空存取工具1可使用單一真空吸嘴11以吸取或放置工件。 In some embodiments of the present disclosure, the vacuum access tool 1 can use multiple vacuum nozzles 11 to simultaneously pick up or place a workpiece. In some embodiments of the present disclosure, the vacuum access tool 1 can use a single vacuum nozzle 11 to pick up or place a workpiece.

在參圖1A，真空取放工具1具有一回收吸嘴15。回收吸嘴15係通過真空/放氣供應管線與真空供應裝置連接，如此真空供應裝置可對回收吸嘴15建立負壓以施加真空，使得回收吸嘴15可進行工件之吸附及提取。換言之，回收吸嘴15為真空取放工具1之另一拾取件，其可經組態拾取工件。 Referring to FIG. 1A , the vacuum pick-and-place tool 1 has a recovery nozzle 15. The recovery nozzle 15 is connected to the vacuum supply device through a vacuum/deflation supply line, so that the vacuum supply device can establish a negative pressure on the recovery nozzle 15 to apply a vacuum, so that the recovery nozzle 15 can adsorb and extract the workpiece. In other words, the recovery nozzle 15 is another pick-up part of the vacuum pick-and-place tool 1, which can be configured to pick up the workpiece.

在本揭露的一些實施例中，回收吸嘴15之結構與真空吸嘴11不同。在本揭露的一些實施例中，回收吸嘴15與真空吸嘴11不相互連通。在本揭露的一些實施例中，回收吸嘴15所連接之真空供應裝置與真空吸嘴11所連接之真空供應裝置不同。 In some embodiments of the present disclosure, the structure of the recovery nozzle 15 is different from that of the vacuum nozzle 11. In some embodiments of the present disclosure, the recovery nozzle 15 and the vacuum nozzle 11 are not connected to each other. In some embodiments of the present disclosure, the vacuum supply device connected to the recovery nozzle 15 is different from the vacuum supply device connected to the vacuum nozzle 11.

在本揭露的一些實施例中，真空存取工具1可利用機械手臂等傳動機制帶動以使之在X、Y方向上移動，且真空吸嘴11與回收吸嘴15可個別在Z方向上移動。 In some embodiments of the present disclosure, the vacuum access tool 1 can be driven by a transmission mechanism such as a robot arm to move in the X and Y directions, and the vacuum nozzle 11 and the recovery nozzle 15 can be moved in the Z direction respectively.

圖1B所示為根據本揭露之實施例之真空取放工具1(Pick-and-Place Tool)之仰視示意圖。參圖1B，真空取放工具1之真空吸嘴11具有複數個沿著線L1排成一列之真空吸嘴11-1及複數個沿著線L2排成一列之真空吸嘴11-2。線L1及線L2係彼此大致平行，複數個真空吸嘴11-1係彼此間隔且對準排列，且複數個真空吸嘴11-2係彼此間隔且對準排列。在本揭露的一些實施例中，真空取放工具1具有四個真空吸嘴11-1及四個真 空吸嘴11-2，真空吸嘴11-1在垂直於線L1或線L2之一方向上係分別彼此對準。在本揭露的一些實施例中，最接近真空取放工具1之主體10之一側邊101之真空吸嘴11-1或真空吸嘴11-2與主體10之側邊101之間之一距離係小於最接近真空取放工具1之主體10之一側邊102之真空吸嘴11-1或真空吸嘴11-2與主體10之側邊102之間之一距離，其中主體10之側邊101與側邊102係彼此相對。 FIG. 1B is a schematic bottom view of a vacuum pick-and-place tool 1 according to an embodiment of the present disclosure. Referring to FIG. 1B , the vacuum nozzle 11 of the vacuum pick-and-place tool 1 has a plurality of vacuum nozzles 11-1 arranged in a row along a line L1 and a plurality of vacuum nozzles 11-2 arranged in a row along a line L2. The line L1 and the line L2 are substantially parallel to each other, the plurality of vacuum nozzles 11-1 are spaced apart and aligned with each other, and the plurality of vacuum nozzles 11-2 are spaced apart and aligned with each other. In some embodiments of the present disclosure, the vacuum pick-and-place tool 1 has four vacuum nozzles 11-1 and four vacuum nozzles 11-2, and the vacuum nozzles 11-1 are aligned with each other in a direction perpendicular to the line L1 or the line L2. In some embodiments of the present disclosure, a distance between the vacuum nozzle 11-1 or the vacuum nozzle 11-2 closest to a side 101 of the main body 10 of the vacuum pick-and-place tool 1 and the side 101 of the main body 10 is smaller than a distance between the vacuum nozzle 11-1 or the vacuum nozzle 11-2 closest to a side 102 of the main body 10 of the vacuum pick-and-place tool 1 and the side 102 of the main body 10, wherein the side 101 and the side 102 of the main body 10 are opposite to each other.

再參圖1B，真空取放工具1之回收吸嘴15係大致設置靠近主體10之側邊102；在本揭露的一些實施例中，回收吸嘴15係大致設置在主體10之側邊102及最接近真空取放工具1之主體10之側邊102之真空吸嘴11-1或真空吸嘴11-2之間。在本揭露的一些實施例中，在垂直於線L1或線L2之方向上觀察，回收吸嘴15係至少部分地與真空吸嘴11-1或真空吸嘴11-2重疊。在本揭露的一些實施例中，在垂直於線L1或線L2之方向上觀察，回收吸嘴15之形心C1係不與真空吸嘴11-1或真空吸嘴11-2重疊。在本揭露的一些實施例中，回收吸嘴15與線L1之間之一距離小於回收吸嘴15與線L2之間之一距離。在本揭露的一些實施例中，回收吸嘴15之形心C1與線L1之間之一距離D1小於回收吸嘴15之形心C2與線L2之間之一距離D2。 Referring again to FIG. 1B , the recovery nozzle 15 of the vacuum pick-and-place tool 1 is generally disposed near the side 102 of the main body 10; in some embodiments of the present disclosure, the recovery nozzle 15 is generally disposed between the side 102 of the main body 10 and the vacuum nozzle 11-1 or the vacuum nozzle 11-2 of the side 102 of the main body 10 closest to the vacuum pick-and-place tool 1. In some embodiments of the present disclosure, when viewed in a direction perpendicular to the line L1 or the line L2, the recovery nozzle 15 at least partially overlaps with the vacuum nozzle 11-1 or the vacuum nozzle 11-2. In some embodiments of the present disclosure, when viewed in a direction perpendicular to the line L1 or the line L2, the centroid C1 of the recovery nozzle 15 does not overlap with the vacuum nozzle 11-1 or the vacuum nozzle 11-2. In some embodiments of the present disclosure, a distance between the recovery nozzle 15 and the line L1 is smaller than a distance between the recovery nozzle 15 and the line L2. In some embodiments of the present disclosure, a distance D1 between the centroid C1 of the recovery nozzle 15 and the line L1 is smaller than a distance D2 between the centroid C2 of the recovery nozzle 15 and the line L2.

圖2A所示為根據本揭露之實施例之真空取放工具1之真空吸嘴11之剖面示意圖。如圖2A所示，真空吸嘴11具有一管體110、位於管體110內之內部管路111及與內部管路111流體連通之吸嘴件113；其中，內部管路111係經過真空/放氣供應管線13與真空供應裝置耦接。在本揭露的一些實施例中，吸嘴件113具有一吸嘴瓣膜。 FIG2A is a cross-sectional schematic diagram of a vacuum nozzle 11 of a vacuum pick-and-place tool 1 according to an embodiment of the present disclosure. As shown in FIG2A , the vacuum nozzle 11 has a tube body 110, an internal pipeline 111 located in the tube body 110, and a nozzle piece 113 in fluid communication with the internal pipeline 111; wherein the internal pipeline 111 is coupled to a vacuum supply device via a vacuum/deflation supply line 13. In some embodiments of the present disclosure, the nozzle piece 113 has a nozzle valve.

圖2B係繪示真空吸嘴11自一載具90之表面91吸取工件9之 實施例。在本揭露的一些實施例中，工件9包含晶粒、電子元件或芯片。在本揭露的一些實施例中，載具90包括一載台或一托盤。參圖2B，真空吸嘴11之吸嘴件113與工件9之上表面進行實體接觸。當接觸發生後，真空供應裝置對真空吸嘴11之內部管路111施加真空，如此以將工件9固定至真空吸嘴11之吸嘴件113。真空供應裝置經過真空/放氣供應管線13施予真空至真空吸嘴11之內部管路111以形成一真空路徑，而該真空之強度使得與真空吸嘴11之吸嘴件113實體接觸之工件9被吸嘴件113所吸附。 FIG. 2B shows an embodiment of a vacuum nozzle 11 sucking a workpiece 9 from a surface 91 of a carrier 90. In some embodiments of the present disclosure, the workpiece 9 includes a die, an electronic component, or a chip. In some embodiments of the present disclosure, the carrier 90 includes a carrier or a tray. Referring to FIG. 2B , the nozzle piece 113 of the vacuum nozzle 11 is in physical contact with the upper surface of the workpiece 9. When the contact occurs, the vacuum supply device applies vacuum to the internal pipeline 111 of the vacuum nozzle 11, thereby fixing the workpiece 9 to the nozzle piece 113 of the vacuum nozzle 11. The vacuum supply device applies vacuum to the internal pipeline 111 of the vacuum nozzle 11 through the vacuum/degassing supply line 13 to form a vacuum path, and the strength of the vacuum causes the workpiece 9 in physical contact with the nozzle piece 113 of the vacuum nozzle 11 to be sucked by the nozzle piece 113.

真空吸嘴11之吸附力的理論計算方式為負壓壓力乘以吸嘴件113(及其瓣膜)之面積。就本揭露之實施例之操作，在真空吸嘴11之吸嘴件113預先接觸工件9初步定位之後，再開啟真空供應裝置使真空吸嘴11產生負壓，如此使工件9在負壓產生後將於原本的接觸位置被直接吸附，可讓吸附後的工件9座標位置與其原先所放置之位置座標不偏移，並確保移動後的放置座標無誤；又，在工件9被真空吸嘴11所吸附後，工件9可封閉吸嘴件113以將內部管路111與外部完全阻隔，如此可以小流量的負壓完成吸附，且亦可節省用於單一個真空吸嘴11的氣體流量，可在有限的流量中同時對多個真空吸嘴11產生負壓，能降低作業與設備成本，並提高產能。因此，真空吸嘴11之吸嘴件113需小於欲吸附之工件9，且真空吸嘴11之吸嘴件113在接觸工件9時需精準，不可超出工件9之表面範圍，即真空吸嘴11的有效吸取範圍小於工件9的投影面積，如此可避免真空吸嘴11吸取到鄰近之其他工件9；此外，工件9在被真空吸嘴11所吸附前需位於一預定待吸位置，不可偏移，否則真空吸嘴11之吸嘴件113無法確實與工件9之上表面進行實體接觸。 The theoretical calculation method of the suction force of the vacuum suction nozzle 11 is to multiply the negative pressure by the area of the suction nozzle part 113 (and its valve). In the operation of the embodiment disclosed in the present invention, after the suction nozzle piece 113 of the vacuum suction nozzle 11 pre-contacts the workpiece 9 for initial positioning, the vacuum supply device is turned on to generate negative pressure for the vacuum suction nozzle 11, so that the workpiece 9 will be directly adsorbed at the original contact position after the negative pressure is generated, so that the coordinate position of the workpiece 9 after adsorption will not deviate from the coordinates of the position where it was originally placed, and ensure that the placement coordinates after the move are correct; in addition, after the workpiece 9 is adsorbed by the vacuum suction nozzle 11, the workpiece 9 can close the suction nozzle piece 113 to completely block the internal pipeline 111 from the outside, so that the adsorption can be completed with a small flow of negative pressure, and the gas flow used for a single vacuum suction nozzle 11 can also be saved. Negative pressure can be generated for multiple vacuum suction nozzles 11 at the same time within a limited flow, which can reduce operation and equipment costs and improve productivity. Therefore, the suction nozzle 113 of the vacuum suction nozzle 11 must be smaller than the workpiece 9 to be sucked, and the suction nozzle 113 of the vacuum suction nozzle 11 must be accurate when contacting the workpiece 9 and must not exceed the surface range of the workpiece 9, that is, the effective suction range of the vacuum suction nozzle 11 is smaller than the projection area of the workpiece 9, so as to prevent the vacuum suction nozzle 11 from sucking other adjacent workpieces 9; in addition, the workpiece 9 must be located in a predetermined waiting position before being sucked by the vacuum suction nozzle 11 and must not be offset, otherwise the suction nozzle 113 of the vacuum suction nozzle 11 cannot actually make physical contact with the upper surface of the workpiece 9.

當要釋放工件9時，可關閉真空供應裝置以解除真空吸嘴 11之真空(負壓)狀態，如此即能使工件9脫離真空吸嘴11，而不需要進一步以其他手段移動工件9。 When the workpiece 9 is to be released, the vacuum supply device can be turned off to release the vacuum (negative pressure) state of the vacuum nozzle 11, so that the workpiece 9 can be separated from the vacuum nozzle 11 without further moving the workpiece 9 by other means.

圖3A所示為根據本揭露之實施例之真空取放工具之回收吸嘴15之剖面示意圖。如圖3A所示，回收吸嘴15具有一管體150、位於管體150內之內部管路151及與內部管路151流體連通之吸罩153；其中，內部管路151係經過真空/放氣供應管線17與真空供應裝置耦接。又，吸罩153具有多個通氣孔1530位於其內部上表面，且與真空/放氣供應管線17流體連通。在本揭露的一些實施例中，吸罩153之罩體1531具有可彈性壓縮的材質，如不透氣之海綿、泡棉、橡膠等。在本揭露的一些實施例中，一偵測裝置157係與回收吸嘴15訊號連接。在本揭露的一些實施例中，偵測裝置157係包含一壓力偵測裝置。 FIG3A is a schematic cross-sectional view of the recovery nozzle 15 of the vacuum pick-and-place tool according to an embodiment of the present disclosure. As shown in FIG3A , the recovery nozzle 15 has a tube body 150, an internal pipeline 151 located in the tube body 150, and a suction hood 153 in fluid communication with the internal pipeline 151; wherein the internal pipeline 151 is coupled to the vacuum supply device via the vacuum/deflation supply pipeline 17. In addition, the suction hood 153 has a plurality of vents 1530 located on its inner upper surface, and is in fluid communication with the vacuum/deflation supply pipeline 17. In some embodiments of the present disclosure, the cover body 1531 of the suction hood 153 has an elastically compressible material, such as airtight sponge, foam, rubber, etc. In some embodiments of the present disclosure, a detection device 157 is signal-connected to the recovery nozzle 15. In some embodiments of the present disclosure, the detection device 157 includes a pressure detection device.

圖3B所示為本揭露之一實施例之回收吸嘴15-1之仰視示意圖，其中，回收吸嘴15-1具有相同或相似於如圖3A所示之回收吸嘴15之結構；換言之，圖3B所示之回收吸嘴15-1為圖3A所示之回收吸嘴15之一實施例。如圖3B所示，自仰視觀之，回收吸嘴15-1之吸罩153-1之罩體1531-1大致呈一矩形，且罩體1531-1具有一壁厚。又，回收吸嘴15-1之吸罩153-1具有複數個通氣孔1530-1，且通氣孔1530-1可與圖3A所示之內部管路151流體連通。在本揭露的一些實施例中，回收吸嘴15-1之吸罩153-1具有13個通氣孔1530-1。 FIG. 3B is a schematic diagram of a recycling nozzle 15-1 in an embodiment of the present disclosure, wherein the recycling nozzle 15-1 has a structure that is the same as or similar to the recycling nozzle 15 shown in FIG. 3A; in other words, the recycling nozzle 15-1 shown in FIG. 3B is an embodiment of the recycling nozzle 15 shown in FIG. 3A. As shown in FIG. 3B, from a bottom view, the cover 1531-1 of the suction cover 153-1 of the recycling nozzle 15-1 is roughly rectangular, and the cover 1531-1 has a wall thickness. In addition, the suction cover 153-1 of the recycling nozzle 15-1 has a plurality of vents 1530-1, and the vents 1530-1 can be fluidly connected to the internal pipeline 151 shown in FIG. 3A. In some embodiments of the present disclosure, the suction cover 153-1 of the recycling nozzle 15-1 has 13 vents 1530-1.

再參圖3B，回收吸嘴15-1之吸罩153-1之罩體1531-1之壁之內部所呈之面積即為回收吸嘴15-1之可有效吸取之範圍。就圖3B所揭露之實施例，回收吸嘴15-1之可有效吸取之範圍大於工件9之一投影面積。進一步言，回收吸嘴15-1之可有效吸取之範圍大於真空吸嘴11之可有 效吸取之範圍。 Referring to FIG. 3B again, the area of the inner wall of the cover 1531-1 of the suction cover 153-1 of the recovery suction nozzle 15-1 is the effective suction range of the recovery suction nozzle 15-1. In the embodiment disclosed in FIG. 3B, the effective suction range of the recovery suction nozzle 15-1 is larger than the projection area of the workpiece 9. Furthermore, the effective suction range of the recovery suction nozzle 15-1 is larger than the effective suction range of the vacuum suction nozzle 11.

圖3C所示為本揭露之一實施例之回收吸嘴15-2之仰視示意圖，其中，回收吸嘴15-2具有相同或相似於如圖3A所示之回收吸嘴15之結構；換言之，圖3C所示之回收吸嘴15-2為圖3A所示之回收吸嘴15之一實施例。如圖3C所示，自仰視觀之，回收吸嘴15-2之吸罩153-2之罩體1531-2大致呈一圓形，且罩體1531-2具有一壁厚。又，回收吸嘴15-2之吸罩153-2具有複數個通氣孔1530-2，且通氣孔1530-2可與圖3A所示之內部管路151流體連通。在本揭露的一些實施例中，回收吸嘴15-2之吸罩153-2具有13個通氣孔1530-2。 FIG. 3C is a schematic diagram of a recycling nozzle 15-2 in an embodiment of the present disclosure, wherein the recycling nozzle 15-2 has a structure that is the same as or similar to the recycling nozzle 15 shown in FIG. 3A; in other words, the recycling nozzle 15-2 shown in FIG. 3C is an embodiment of the recycling nozzle 15 shown in FIG. 3A. As shown in FIG. 3C, from a bottom view, the cover 1531-2 of the suction cover 153-2 of the recycling nozzle 15-2 is roughly circular, and the cover 1531-2 has a wall thickness. In addition, the suction cover 153-2 of the recycling nozzle 15-2 has a plurality of vents 1530-2, and the vents 1530-2 can be fluidly connected to the internal pipeline 151 shown in FIG. 3A. In some embodiments of the present disclosure, the suction cover 153-2 of the recycling nozzle 15-2 has 13 vents 1530-2.

再參圖3C，回收吸嘴15-2之吸罩153-2之罩體1531-2之壁之內部所呈之面積即為回收吸嘴15-2之可有效吸取之範圍。就圖3C所揭露之實施例，回收吸嘴15-2之可有效吸取之範圍係大於工件9之一投影面積。進一步言，回收吸嘴15-2之可有效吸取之範圍大於真空吸嘴11之可有效吸取之範圍。 Referring to FIG. 3C again, the area of the inner wall of the cover 1531-2 of the suction cover 153-2 of the recovery suction nozzle 15-2 is the effective suction range of the recovery suction nozzle 15-2. In the embodiment disclosed in FIG. 3C, the effective suction range of the recovery suction nozzle 15-2 is larger than the projection area of the workpiece 9. Furthermore, the effective suction range of the recovery suction nozzle 15-2 is larger than the effective suction range of the vacuum suction nozzle 11.

圖3D係繪示回收吸嘴15自一載具90之表面91吸取工件9之實施例。在本揭露的一些實施例中，工件9包含晶粒、電子元件或芯片。參圖3D，回收吸嘴15之罩體153罩住工件9，且未與工件9有實體接觸。隨後，真空供應裝置對回收吸嘴15之內部管路151施加負壓，真空供應裝置經過真空/放氣供應管線17施予真空至回收吸嘴15之內部管路151以形成一真空路徑，如此以使回收吸嘴15可吸取工件9。 FIG3D shows an embodiment of the recovery nozzle 15 sucking the workpiece 9 from the surface 91 of a carrier 90. In some embodiments of the present disclosure, the workpiece 9 includes a die, an electronic component or a chip. Referring to FIG3D, the cover 153 of the recovery nozzle 15 covers the workpiece 9 and has no physical contact with the workpiece 9. Subsequently, the vacuum supply device applies negative pressure to the internal pipeline 151 of the recovery nozzle 15, and the vacuum supply device applies vacuum to the internal pipeline 151 of the recovery nozzle 15 through the vacuum/degassing supply line 17 to form a vacuum path, so that the recovery nozzle 15 can suck the workpiece 9.

如圖3D所示，回收吸嘴15之罩體153之內徑大於工件9之長度及/或寬度，即回收吸嘴15之可有效吸取之範圍大於工件9之面積；如此，工件9不需精準地位在一預定待吸位置，回收吸嘴15仍可吸取工件 9；換言之，即使工件9相對於該預定待吸位置偏移，回收吸嘴15之吸罩153仍可罩住工件9，並進行有效地吸取。 As shown in FIG. 3D , the inner diameter of the cover 153 of the recovery nozzle 15 is larger than the length and/or width of the workpiece 9, that is, the effective suction range of the recovery nozzle 15 is larger than the area of the workpiece 9; thus, the workpiece 9 does not need to be precisely positioned at a predetermined suction position, and the recovery nozzle 15 can still suck the workpiece 9; in other words, even if the workpiece 9 is offset relative to the predetermined suction position, the suction cover 153 of the recovery nozzle 15 can still cover the workpiece 9 and effectively suck it.

又，因回收吸嘴15之吸罩153罩住工件9時，回收吸嘴15係不與工件9有實體接觸，故在真空供應裝置施加負壓於回收吸嘴15以吸取工件9後，被回收吸嘴15吸取後之工件9所位於之座標位置與其原先在載具90上之座標位置可能不同；因此，工件9在被回收吸嘴15吸取及放置，當真空解除後，其被放置後之位置並無法精確的控制。 Furthermore, since the suction cover 153 of the recovery nozzle 15 covers the workpiece 9, the recovery nozzle 15 does not have physical contact with the workpiece 9. Therefore, after the vacuum supply device applies negative pressure to the recovery nozzle 15 to absorb the workpiece 9, the coordinate position of the workpiece 9 after being absorbed by the recovery nozzle 15 may be different from its original coordinate position on the carrier 90; therefore, after the workpiece 9 is absorbed and placed by the recovery nozzle 15, when the vacuum is released, its position after being placed cannot be accurately controlled.

再者，當回收吸嘴15之吸罩153罩住工件9並抵頂載具9之表面91時，因載具90可具有凹槽92，如此吸罩153與載具90之凹槽92之間存有間隙，以使得吸罩153之內部可與例如為位在回收吸嘴15外部的空氣之外部流體連通，如此，在真空供應裝置施加負壓於回收吸嘴15時，氣流僅能自吸罩153之外部通過該間隙流入吸罩153之內部以形成負壓，如此以使得工件9可被回收吸嘴15所吸取。如上所述，吸罩153之罩體1531具有可彈性壓縮的材質，且在本揭露的一些實施例中，載具90之表面91具有凹槽92，故當吸罩153欲吸取載具90上之工件9且下壓至載具90之表面時，則會有氣流自吸罩153之外部通過載具90之凹槽92與吸罩153之間之間隙進入吸罩153之內部以形成負壓，如此回收吸嘴15則可吸取載具90上之工件9。根據以上，可了解在回收吸嘴15吸取工件9之過程中，回收吸嘴15之內部管路151係與回收吸嘴15(之吸罩153)之外部流體連通。 Furthermore, when the suction hood 153 of the recovery nozzle 15 covers the workpiece 9 and presses against the surface 91 of the carrier 9, since the carrier 90 may have a groove 92, a gap exists between the suction hood 153 and the groove 92 of the carrier 90, so that the interior of the suction hood 153 can be connected to an external fluid such as air located outside the recovery nozzle 15. In this way, when the vacuum supply device applies negative pressure to the recovery nozzle 15, the air flow can only flow from the outside of the suction hood 153 through the gap into the inside of the suction hood 153 to form a negative pressure, so that the workpiece 9 can be sucked by the recovery nozzle 15. As described above, the cover body 1531 of the suction cover 153 has a material that can be elastically compressed, and in some embodiments of the present disclosure, the surface 91 of the carrier 90 has a groove 92, so when the suction cover 153 wants to suck the workpiece 9 on the carrier 90 and presses down to the surface of the carrier 90, air will flow from the outside of the suction cover 153 through the gap between the groove 92 of the carrier 90 and the suction cover 153 into the inside of the suction cover 153 to form a negative pressure, so that the recovery nozzle 15 can suck the workpiece 9 on the carrier 90. Based on the above, it can be understood that in the process of the recovery nozzle 15 sucking the workpiece 9, the internal pipeline 151 of the recovery nozzle 15 is connected to the external fluid of the recovery nozzle 15 (the suction cover 153).

又，當回收吸嘴15將工件9吸取後，工件9會被吸附並抵頂吸罩153之內部上表面；而在工件9被吸附於吸罩153之內部的上表面時，工件9可能會遮蔽回收吸嘴15之部分的通氣孔1530並露出部分的通氣孔1530(可參圖3E、3F)；如此，可了解，即使工件9已被吸附於吸罩153之 內部的上表面，回收吸嘴15之內部管路151仍會通過未被工件9遮蔽之通氣孔1530而與回收吸嘴15(之吸罩153)之外部流體連通。 Furthermore, after the recovery nozzle 15 absorbs the workpiece 9, the workpiece 9 will be sucked and pressed against the inner upper surface of the suction cover 153; and when the workpiece 9 is sucked on the inner upper surface of the suction cover 153, the workpiece 9 may cover part of the vent 1530 of the recovery nozzle 15 and expose part of the vent 1530 (see Figures 3E and 3F); thus, it can be understood that even if the workpiece 9 has been sucked on the inner upper surface of the suction cover 153, the internal pipeline 151 of the recovery nozzle 15 will still be connected to the external fluid of the recovery nozzle 15 (the suction cover 153) through the vent 1530 not blocked by the workpiece 9.

如上所述，在回收吸嘴15吸取工件9之過程及其將工件9吸取後，回收吸嘴15之內部管路151會與回收吸嘴15(之吸罩153)之外部流體連通，如此一來，真空供應裝置需施與回收吸嘴15大流量的真空氣壓才可完成工件9之吸附。在本揭露的一些實施例中，回收吸嘴15所提供之真空氣壓流量係大於真空吸嘴11所提供之真空氣壓流量。換言之，回收吸嘴15所提供之吸力係大於真空吸嘴11所提供之吸力，或回收吸嘴15可建立之負壓係大於真空吸嘴11可建立之負壓，或回收吸嘴15所建立之負壓係大於真空吸嘴11所建立之負壓。 As described above, during the process of the recovery nozzle 15 sucking the workpiece 9 and after the workpiece 9 is sucked, the internal pipe 151 of the recovery nozzle 15 will be connected to the external fluid of the recovery nozzle 15 (the suction cover 153), so that the vacuum supply device needs to apply a large flow of vacuum pressure to the recovery nozzle 15 to complete the adsorption of the workpiece 9. In some embodiments of the present disclosure, the vacuum pressure flow provided by the recovery nozzle 15 is greater than the vacuum pressure flow provided by the vacuum nozzle 11. In other words, the suction force provided by the recovery nozzle 15 is greater than the suction force provided by the vacuum nozzle 11, or the negative pressure that the recovery nozzle 15 can establish is greater than the negative pressure that the vacuum nozzle 11 can establish, or the negative pressure established by the recovery nozzle 15 is greater than the negative pressure established by the vacuum nozzle 11.

此外，在回收吸嘴15吸取工件9後，工件9會吸附於吸罩153之內部的上表面並遮蔽部分或全部之通氣孔1530，而在通氣孔1530被遮蔽後，回收吸嘴15之內部管路151之內部壓力會產生變化；如此，當連接回收吸嘴15之偵測裝置157偵測到回收吸嘴15之內部管路151之內部壓力產生變化，則可確認回收吸嘴15已經將工件9吸取。 In addition, after the recovery nozzle 15 absorbs the workpiece 9, the workpiece 9 will be adsorbed on the upper surface of the interior of the suction cover 153 and cover part or all of the vent 1530. After the vent 1530 is covered, the internal pressure of the internal pipeline 151 of the recovery nozzle 15 will change. In this way, when the detection device 157 connected to the recovery nozzle 15 detects that the internal pressure of the internal pipeline 151 of the recovery nozzle 15 has changed, it can be confirmed that the recovery nozzle 15 has absorbed the workpiece 9.

圖3E係繪示本揭露之一實施例之回收吸嘴15-1吸取工件9之實施例。參圖3E，回收吸嘴15-1之吸罩153-1之罩體1531-1大致呈矩形，且具有複數個通氣孔1530-1。在本揭露的一些實施例中，回收吸嘴15-1之吸罩153-1之通氣孔1530-1之數量及配置經組態以使一半以上之數量的通氣孔1530-1被由回收吸嘴15-1所吸取之工件9所遮蔽時，如圖3D所示之偵測裝置157則可偵測到回收吸嘴15-1之內部管路(如圖3D之內部管路151)之內部壓力變化，如此以確認回收吸嘴15-1已完全將工件9吸取。 FIG. 3E shows an embodiment of the recovery nozzle 15-1 sucking the workpiece 9 of one embodiment of the present disclosure. Referring to FIG. 3E, the cover 1531-1 of the suction cover 153-1 of the recovery nozzle 15-1 is roughly rectangular and has a plurality of vents 1530-1. In some embodiments of the present disclosure, the number and arrangement of the vents 1530-1 of the suction cover 153-1 of the recovery nozzle 15-1 are configured so that when more than half of the vents 1530-1 are covered by the workpiece 9 sucked by the recovery nozzle 15-1, the detection device 157 shown in FIG. 3D can detect the internal pressure change of the internal pipeline of the recovery nozzle 15-1 (such as the internal pipeline 151 of FIG. 3D), thereby confirming that the recovery nozzle 15-1 has completely sucked the workpiece 9.

圖3F係繪示本揭露之一實施例之回收吸嘴15-2吸取工件9 之實施例。參圖3F，回收吸嘴15-2之吸罩153-2之罩體1531-2大致呈圓形，且具有複數個通氣孔1530-2。在本揭露的一些實施例中，回收吸嘴15-2之吸罩153-2之通氣孔1530-2之數量及配置經組態以使一半以上之數量的通氣孔1530-2被由回收吸嘴15-2所吸取之工件9所遮蔽時，如圖3D所示之偵測裝置157則可偵測到回收吸嘴15-2之內部管路(如圖3D之內部管路151)之內部壓力變化，如此以確認回收吸嘴15-2已完全將工件9吸取。 FIG. 3F shows an embodiment of the recovery nozzle 15-2 sucking the workpiece 9 of one embodiment of the present disclosure. Referring to FIG. 3F, the cover 1531-2 of the suction cover 153-2 of the recovery nozzle 15-2 is roughly circular and has a plurality of vents 1530-2. In some embodiments of the present disclosure, the number and arrangement of the vents 1530-2 of the suction cover 153-2 of the recovery nozzle 15-2 are configured so that when more than half of the vents 1530-2 are covered by the workpiece 9 sucked by the recovery nozzle 15-2, the detection device 157 shown in FIG. 3D can detect the internal pressure change of the internal pipeline (such as the internal pipeline 151 in FIG. 3D) of the recovery nozzle 15-2, thereby confirming that the recovery nozzle 15-2 has completely sucked the workpiece 9.

圖4所示為根據本揭露之實施例之測試系統100之示意圖。測試系統100包括真空取放工具1、1'、1"、進料承載裝置2、進料機器臂21、運送載具3、測試裝置4、測試機器臂41、暫放收納裝置5、出料承載裝置6及出料機器臂61。在本揭露的一些實施例中，進料承載裝置2、運送載具3、測試裝置4、暫放收納裝置5及出料承載裝置6係彼此分隔設置。在本揭露的一些實施例中，進料承載裝置2與運送載具3隔開設置，暫放收納裝置5又與進料承載裝置2與運送載具3隔開設置。 FIG4 is a schematic diagram of a test system 100 according to an embodiment of the present disclosure. The test system 100 includes a vacuum pick-and-place tool 1, 1', 1", a feed carrier 2, a feed machine arm 21, a transport carrier 3, a test device 4, a test machine arm 41, a temporary storage device 5, a discharge carrier 6 and a discharge machine arm 61. In some embodiments of the present disclosure, the feed carrier 2, the transport carrier 3, the test device 4, the temporary storage device 5 and the discharge carrier 6 are separated from each other. In some embodiments of the present disclosure, the feed carrier 2 is separated from the transport carrier 3, and the temporary storage device 5 is separated from the feed carrier 2 and the transport carrier 3.

在本揭露的一些實施例中，進料承載裝置2包括一進料承載托盤，多個工件9可以矩陣排列之方式收納於進料承載裝置2(及進料承載托盤)中。真空取放工具1係與進料機器臂21配置，進料機器臂21經組態以控制真空取放工具1，如控制真空取放工具1自進料承載裝置2吸取工件9、控制真空取放工具1在進料承載裝置2、運送載具3及暫放收納裝置5之間移動、控制真空取放工具1以將其所吸取之工件9放置於運送載具3或暫放收納裝置5等等。 In some embodiments of the present disclosure, the feed carrier 2 includes a feed carrier tray, and multiple workpieces 9 can be stored in the feed carrier 2 (and the feed carrier tray) in a matrix arrangement. The vacuum pick-and-place tool 1 is configured with the feed robot arm 21, and the feed robot arm 21 is configured to control the vacuum pick-and-place tool 1, such as controlling the vacuum pick-and-place tool 1 to pick up the workpiece 9 from the feed carrier 2, controlling the vacuum pick-and-place tool 1 to move between the feed carrier 2, the transport carrier 3 and the temporary storage device 5, and controlling the vacuum pick-and-place tool 1 to place the workpiece 9 it picks up on the transport carrier 3 or the temporary storage device 5, etc.

參閱圖2B與圖4，進料機器臂21經組態以控制真空取放工具1，以使真空取放工具1之真空吸嘴11自進料承載裝置2吸取工件9，隨後將被真空取放工具1之真空吸嘴11所吸取之工件9放置至運送載具3，再 使真空取放工具1之真空吸嘴11所吸取之工件9正確地放置於運送載具3上。在真空取放工具1之真空吸嘴11吸取工件9後至將工件9放置於運送載具3上前，皆保持接觸工件9。如之前所述，真空取放工具1之真空吸嘴11之吸嘴件113小於工件9之面積，故則需要精準且穩定地控制真空取放工具1之真空吸嘴11才可將工件9自進料承載裝置2吸取，若控制之精準度或穩定度不佳，真空取放工具1之真空吸嘴11則無法成功地將工件9自進料承載裝置2吸取。再者，真空取放工具1之真空吸嘴11亦須穩定且精確地將其所吸取之工件9正確的擺放於運送載具3上，若控制之精準度或穩定度不佳，真空取放工具1之真空吸嘴11則無法將工件9擺正於運送載具3上。在本揭露的某些實施例中，運送載具3具有光感測器，其經組態以偵測工件9是否有正確地擺放於運送載具3上。例如，當光感測去感測光被工件9阻斷時即表示工件9未位在正確位置。 Referring to FIG. 2B and FIG. 4 , the feeder robot arm 21 is configured to control the vacuum pick-and-place tool 1 so that the vacuum nozzle 11 of the vacuum pick-and-place tool 1 picks up the workpiece 9 from the feeder carrier 2, then places the workpiece 9 picked up by the vacuum nozzle 11 of the vacuum pick-and-place tool 1 on the transport carrier 3, and then correctly places the workpiece 9 picked up by the vacuum nozzle 11 of the vacuum pick-and-place tool 1 on the transport carrier 3. The vacuum nozzle 11 of the vacuum pick-and-place tool 1 keeps in contact with the workpiece 9 after picking up the workpiece 9 and before placing the workpiece 9 on the transport carrier 3. As described above, the nozzle piece 113 of the vacuum nozzle 11 of the vacuum pick-and-place tool 1 is smaller than the area of the workpiece 9, so the vacuum nozzle 11 of the vacuum pick-and-place tool 1 needs to be accurately and stably controlled to suck the workpiece 9 from the feed carrier 2. If the control accuracy or stability is not good, the vacuum nozzle 11 of the vacuum pick-and-place tool 1 cannot successfully suck the workpiece 9 from the feed carrier 2. Furthermore, the vacuum nozzle 11 of the vacuum pick-and-place tool 1 must also stably and accurately place the sucked workpiece 9 correctly on the transport carrier 3. If the control accuracy or stability is not good, the vacuum nozzle 11 of the vacuum pick-and-place tool 1 cannot place the workpiece 9 correctly on the transport carrier 3. In some embodiments of the present disclosure, the transport carrier 3 has a photo sensor configured to detect whether the workpiece 9 is correctly placed on the transport carrier 3. For example, when the light sensing light is blocked by the workpiece 9, it means that the workpiece 9 is not in the correct position.

參閱圖1A與圖4，當真空取放工具1之真空吸嘴11在將工件9自進料承載裝置2吸取並放置至運送載具3時(參路徑W1)，若有工件9無法被真空取放工具1之真空吸嘴11所吸取，即吸貨失敗，真空取放工具1之真空吸嘴11會持續地將其餘的工件9自進料承載裝置2吸取並將其放置至運送載具3，直至進料承載裝置2中可被正確吸取之工件9都被吸取且放置至運送載具3，真空取放工具1之真空吸嘴11會被收回並啟動回收吸嘴15，而回收吸嘴15可將無法成功被真空取放工具1之真空吸嘴11所吸取之工件9自進料承載裝置2吸取並將其放置至暫放收納裝置5中(參路徑W2)。如此，一旦真空取放工具1之真空吸嘴11無法成功地將工件9自進料承載裝置2吸取(吸貨失敗)，無須將測試系統100關閉以排除該些被吸取失敗之工件9。在本揭露的一些實施例中，暫放收納裝置5為一回收裝置。而在真空取 放工具1之回收吸嘴15吸取工件9後至將工件9放置於暫放收納裝置5中前，皆保持接觸工件9。 Referring to FIG. 1A and FIG. 4 , when the vacuum suction nozzle 11 of the vacuum pick-and-place tool 1 sucks the workpiece 9 from the feed carrier 2 and places it on the transport carrier 3 (see path W1), if there is a workpiece 9 that cannot be sucked by the vacuum suction nozzle 11 of the vacuum pick-and-place tool 1, that is, the suction fails, the vacuum suction nozzle 11 of the vacuum pick-and-place tool 1 will continue to suck the remaining workpieces 9 from the feed carrier 2 and place them on the transport carrier 3 until all the workpieces 9 that can be correctly sucked in the feed carrier 2 are sucked and placed on the transport carrier 3, the vacuum suction nozzle 11 of the vacuum pick-and-place tool 1 will be retracted and the recovery suction nozzle 15 will be activated, and the recovery suction nozzle 15 can suck the workpiece 9 that cannot be successfully sucked by the vacuum suction nozzle 11 of the vacuum pick-and-place tool 1 from the feed carrier 2 and place it in the temporary storage device 5 (see path W2). Thus, once the vacuum suction nozzle 11 of the vacuum pick-and-place tool 1 fails to successfully suck the workpiece 9 from the feed carrier 2 (sucking failure), there is no need to shut down the test system 100 to remove the failed workpieces 9. In some embodiments of the present disclosure, the temporary storage device 5 is a recovery device. The recovery suction nozzle 15 of the vacuum pick-and-place tool 1 keeps in contact with the workpiece 9 after sucking the workpiece 9 and before placing the workpiece 9 in the temporary storage device 5.

當真空取放工具1之真空吸嘴11將已吸取之工件9放置在運送載具3時，若真空取放工具1之真空吸嘴11無法正確且精準地將工件9擺正於運送載具3上，真空取放工具1之真空吸嘴11會被收回並啟動回收吸嘴15，而回收吸嘴15可將未被擺正於運送載具3上之工件9吸取並將其放置至暫放收納裝置5中(參路徑W3)。如此，一旦真空取放工具1之真空吸嘴11無法將工件9擺正於運送載具3上，無須將測試系統100關閉以排除該些未被擺正之工件9。而在真空取放工具1之回收吸嘴15吸取工件9後至將工件9放置於暫放收納裝置5中前，皆保持接觸工件9。 When the vacuum nozzle 11 of the vacuum pick-and-place tool 1 places the sucked workpiece 9 on the transport carrier 3, if the vacuum nozzle 11 of the vacuum pick-and-place tool 1 cannot correctly and accurately place the workpiece 9 on the transport carrier 3, the vacuum nozzle 11 of the vacuum pick-and-place tool 1 will be retracted and the recovery nozzle 15 will be activated, and the recovery nozzle 15 can suck the workpiece 9 that is not placed on the transport carrier 3 and place it in the temporary storage device 5 (see path W3). In this way, once the vacuum nozzle 11 of the vacuum pick-and-place tool 1 cannot place the workpiece 9 on the transport carrier 3, there is no need to shut down the test system 100 to exclude those workpieces 9 that are not placed correctly. After the recovery nozzle 15 of the vacuum pick-and-place tool 1 sucks the workpiece 9 and before the workpiece 9 is placed in the temporary storage device 5, it keeps in contact with the workpiece 9.

如此可提高產能，且利用回收吸嘴15排除未能被真空吸嘴11所吸取或未能真空吸嘴11所被擺正之工件9，相較於以人工排除之、可節省人員尋找異常處及手動排除的時間。 This can improve productivity, and use the recovery nozzle 15 to remove the workpiece 9 that cannot be sucked by the vacuum nozzle 11 or cannot be placed by the vacuum nozzle 11. Compared with manual removal, it can save personnel time in finding abnormalities and manually removing them.

根據以上，真空吸嘴11對裝載於進料承載裝置2之工件9施予負壓時，其不會接觸進料承載裝置2；回收吸嘴15對裝載於進料承載裝置2之工件9施予負壓時，其會接觸進料承載裝置2。又，真空吸嘴11在將工件9放置在運送載具3上時不會接觸到運送載具3，回收吸嘴15在將工件9自運送載具3吸取時會接觸到運送載具3。 According to the above, when the vacuum suction nozzle 11 applies negative pressure to the workpiece 9 loaded on the feed carrier 2, it will not contact the feed carrier 2; when the recovery suction nozzle 15 applies negative pressure to the workpiece 9 loaded on the feed carrier 2, it will contact the feed carrier 2. In addition, when the vacuum suction nozzle 11 places the workpiece 9 on the transport carrier 3, it will not contact the transport carrier 3, and when the recovery suction nozzle 15 sucks the workpiece 9 from the transport carrier 3, it will contact the transport carrier 3.

在工件9被放置於運送載具3後，運送載具3可移動至使其靠近測試裝置4；如圖4所示，運送載具3可沿P1方向移動，以使得裝載於其上之工件9自靠近進料承載裝置2處移動至靠近測試裝置4處。當工件9被移動至靠近測試裝置4處後，測試機器臂41便會驅動真空取放工具1'將工件9自運送載具3上吸取，並使工件9放置於測試裝置4中以進行測試(參 路徑W4)。在本揭露的一些實施例中，真空取放工具1'係相同或相似於真空取放工具1，因此，真空取放工具1'具有相同或相似於真空吸嘴11之真空吸嘴與相同或相似於回收吸嘴15之回收吸嘴。故，真空取放工具1'之真空吸嘴會將工件9自運送載具3上吸取，並放置於測試裝置4。在本揭露的一些實施例中，也可以由真空取放工具1'之回收吸嘴將未被擺正於運送載具3上之工件9吸取並將其放置至暫放收納裝置5中(參路徑W3)。在真空取放工具1'吸取工件9後至將工件9放置於測試裝置4中或放置於暫放收納裝置5中前，皆保持接觸工件9。 After the workpiece 9 is placed on the transport carrier 3, the transport carrier 3 can be moved to make it close to the testing device 4; as shown in FIG4 , the transport carrier 3 can be moved along the P1 direction so that the workpiece 9 loaded thereon moves from the position close to the feed carrier 2 to the position close to the testing device 4. When the workpiece 9 is moved close to the testing device 4, the testing machine arm 41 will drive the vacuum pick-and-place tool 1' to suck the workpiece 9 from the transport carrier 3 and place the workpiece 9 in the testing device 4 for testing (see path W4). In some embodiments of the present disclosure, the vacuum pick-and-place tool 1' is the same as or similar to the vacuum pick-and-place tool 1, and therefore, the vacuum pick-and-place tool 1' has a vacuum nozzle that is the same as or similar to the vacuum nozzle 11 and a recovery nozzle that is the same as or similar to the recovery nozzle 15. Therefore, the vacuum nozzle of the vacuum pick-and-place tool 1' will pick up the workpiece 9 from the transport carrier 3 and place it in the test device 4. In some embodiments of the present disclosure, the recovery nozzle of the vacuum pick-and-place tool 1' can also pick up the workpiece 9 that is not placed on the transport carrier 3 and place it in the temporary storage device 5 (see path W3). After the vacuum pick-and-place tool 1' picks up the workpiece 9 and before the workpiece 9 is placed in the test device 4 or in the temporary storage device 5, it keeps in contact with the workpiece 9.

當工件9在測試裝置4中被測試完成後，真空取放工具1'之真空吸嘴會將工件9自測試裝置4吸取，並將工件9放置於運送載具3上(參路徑W5)；如之前所述，工件9需要被正確的擺放於運送載具3上，若測試機械臂41之控制的精準度或穩定度不佳，真空取放工具1'之真空吸嘴則無法將工件9擺正於運送載具3上。若真空取放工具1'之真空吸嘴無法正確且精準地將工件9擺正於運送載具3上，真空取放工具1'之真空吸嘴會被收回並啟動回收吸嘴，而回收吸嘴可將未被擺正於運送載具3上之工件9吸取並將其放置至暫放收納裝置5中(參路徑W6)。如此，一旦真空取放工具1'之真空吸嘴無法將工件9擺正於運送載具3上，無須將測試系統100關閉以排除該些未被擺正之工件9。 After the workpiece 9 is tested in the test device 4, the vacuum nozzle of the vacuum pick-and-place tool 1' will suck the workpiece 9 from the test device 4 and place the workpiece 9 on the transport carrier 3 (see path W5); as mentioned above, the workpiece 9 needs to be correctly placed on the transport carrier 3. If the control accuracy or stability of the test robot 41 is not good, the vacuum nozzle of the vacuum pick-and-place tool 1' will not be able to place the workpiece 9 on the transport carrier 3. If the vacuum nozzle of the vacuum pick-and-place tool 1' cannot correctly and accurately place the workpiece 9 on the transport carrier 3, the vacuum nozzle of the vacuum pick-and-place tool 1' will be retracted and the recovery nozzle will be activated, and the recovery nozzle can suck the workpiece 9 that is not placed on the transport carrier 3 and place it in the temporary storage device 5 (see path W6). In this way, once the vacuum nozzle of the vacuum pick-and-place tool 1' fails to place the workpiece 9 on the transport carrier 3, there is no need to shut down the testing system 100 to remove the workpieces 9 that have not been placed properly.

在本揭露的一些實施例中，若在使用真空取放工具1'將工件9自運送載具3放置至測試裝置4之過程中出現吸取失敗或放置失敗之情事，亦可使用真空取放工具1'之回收吸嘴將吸取失敗或放置失敗之工件9移除。 In some embodiments of the present disclosure, if a workpiece 9 fails to be picked up or placed when the vacuum pick-and-place tool 1' is used to place the workpiece 9 from the transport carrier 3 to the test device 4, the recovery nozzle of the vacuum pick-and-place tool 1' can be used to remove the workpiece 9 that failed to be picked up or placed.

在被測試過之工件9被放置於運送載具3後，運送載具3可 移動至使其靠近出料承載裝置6。在本揭露的一些實施例中，出料承載裝置6包括一出料承載托盤；如圖4所示，運送載具3可沿P2方向移動，以使得裝載於其上之工件9自靠近測試裝置4處移動至靠近出料承載裝置6處。當工件9被移動至靠近出料承載裝置6處後，出料機器臂61便會驅動真空取放工具1"將工件9自運送載具3上吸取，並使工件9放置於出料承載裝置6(參路徑W7)。在本揭露的一些實施例中，真空取放工具1"係相同或相似於真空取放工具1，因此，真空取放工具1"具有相同或相似於真空吸嘴11之真空吸嘴與相同或相似於回收吸嘴15之回收吸嘴。故，真空取放工具1"之真空吸嘴會將工件9自運送載具3上吸取，並放置於出料承載裝置6。 After the tested workpiece 9 is placed on the transport carrier 3, the transport carrier 3 can be moved to be close to the discharge carrier 6. In some embodiments of the present disclosure, the discharge carrier 6 includes a discharge carrier tray; as shown in FIG. 4 , the transport carrier 3 can be moved along the P2 direction so that the workpiece 9 loaded thereon moves from a position close to the testing device 4 to a position close to the discharge carrier 6. When the workpiece 9 is moved to a position close to the discharge carrier 6, the discharge machine arm 61 will drive the vacuum pick-and-place tool 1" to suck the workpiece 9 from the transport carrier 3 and place the workpiece 9 on the discharge carrier 6 (see path W7). In some embodiments of the present disclosure, the vacuum pick-and-place tool 1" is the same as or similar to the vacuum pick-and-place tool 1, so the vacuum pick-and-place tool 1" has a vacuum nozzle that is the same as or similar to the vacuum nozzle 11 and a recovery nozzle that is the same as or similar to the recovery nozzle 15. Therefore, the vacuum nozzle of the vacuum pick-and-place tool 1" will suck the workpiece 9 from the transport carrier 3 and place it on the discharge carrier 6.

在本揭露的一些實施例中，若在使用真空取放工具1"將工件9自運送載具3放置至出料承載裝置6之過程中出現吸取失敗或放置失敗之情事，亦可使用真空取放工具1"之回收吸嘴將吸取失敗或放置失敗之工件9移除。 In some embodiments of the present disclosure, if a workpiece 9 fails to be sucked or placed when the vacuum pick-and-place tool 1" is used to place the workpiece 9 from the transport carrier 3 to the discharge carrier 6, the recovery nozzle of the vacuum pick-and-place tool 1" can be used to remove the workpiece 9 that failed to be sucked or placed.

圖5A所示為根據本揭露之實施例之測試系統100之執行步驟之流程圖，其中包含吸貨失敗時的處理流程，尤其係關於圖4中之路徑W1及路徑W2之操作。 FIG. 5A is a flow chart showing the execution steps of the test system 100 according to the embodiment of the present disclosure, including the processing flow when the absorption of goods fails, especially the operation of the path W1 and the path W2 in FIG. 4.

參圖1A、圖4，與圖5A，在步驟701中，測試系統100開始啟動以開始進行工件9之測試程序。其中，真空取放工具1之真空吸嘴11開始吸取排列於進料承載裝置2之工件9，以將裝載於進料承載裝置2放置至運送載具3上。 Referring to FIG. 1A, FIG. 4, and FIG. 5A, in step 701, the test system 100 starts to start the test procedure of the workpiece 9. The vacuum nozzle 11 of the vacuum pick-and-place tool 1 starts to suck the workpiece 9 arranged on the feed carrier 2 to place the workpiece 9 loaded on the feed carrier 2 on the transport carrier 3.

在步驟702中，真空取放工具1之真空吸嘴11因控制的穩定度或定位精準度不佳而無法成功地自進料承載裝置2吸取工件9。 In step 702, the vacuum nozzle 11 of the vacuum pick-and-place tool 1 cannot successfully pick up the workpiece 9 from the feed carrier 2 due to poor control stability or positioning accuracy.

在步驟703中，真空取放工具1之真空吸嘴11會自動重新嘗 試將未能成功吸取之工件9再次吸取。 In step 703, the vacuum nozzle 11 of the vacuum pick-and-place tool 1 will automatically retry to pick up the workpiece 9 that failed to be picked up successfully.

在步驟704中，判斷真空吸嘴11是否能成功吸取工件9，若真空吸嘴11能成功吸取工件9，則會進入步驟709，測試系統100將繼續進行測試程序。若真空吸嘴11在重新嘗試後仍無法吸取工件9，則會進入步驟705，真空取放工具1之真空吸嘴11持續將仍排列於進料承載裝置2中之其餘工件9吸取並放置至運送載具3上，直至進料承載裝置2中已無可被真空吸嘴吸取之工件9。 In step 704, it is determined whether the vacuum suction nozzle 11 can successfully absorb the workpiece 9. If the vacuum suction nozzle 11 can successfully absorb the workpiece 9, it will enter step 709 and the test system 100 will continue the test procedure. If the vacuum suction nozzle 11 still cannot absorb the workpiece 9 after retrying, it will enter step 705, and the vacuum suction nozzle 11 of the vacuum pick-and-place tool 1 will continue to absorb the remaining workpieces 9 still arranged in the feed carrier 2 and place them on the transport carrier 3 until there are no workpieces 9 in the feed carrier 2 that can be absorbed by the vacuum suction nozzle.

步驟704可藉由減少暫停真空吸嘴11運作的次數以縮短暫停時間，可提高產能，且因進料承載裝置2上的工件9排列較為密集，如此一來，之後回收吸嘴15在運作時也不會吸取到鄰近無法被吸取的工件9的其餘正常工件9。 Step 704 can reduce the number of pauses of the vacuum suction nozzle 11 to shorten the pause time, thereby improving productivity. Moreover, since the workpieces 9 on the feeding carrier 2 are arranged more densely, the recovery suction nozzle 15 will not suck up the remaining normal workpieces 9 adjacent to the workpiece 9 that cannot be sucked when it is in operation.

隨後，在步驟706中，真空取放工具1之回收吸嘴15則會開始啟動，以吸取在進料承載裝置2中未能被真空取放工具1之真空吸嘴11吸取之工件9。 Then, in step 706, the recovery nozzle 15 of the vacuum pick-and-place tool 1 will start to pick up the workpiece 9 in the feed carrier 2 that cannot be picked up by the vacuum nozzle 11 of the vacuum pick-and-place tool 1.

在步驟707中，判斷回收吸嘴15是否能成功吸取工件9，若回收吸嘴15可成功地吸取該些在進料承載裝置2中未能被真空取放工具1之真空吸嘴11吸取之工件9，則會進入步驟708，回收吸嘴15會將該些工件9吸取並放置至暫放收納裝置5中(參圖4之路徑W2)。反之，若回收吸嘴15未能成功地吸取該些在進料承載裝置2中未能被真空取放工具1之真空吸嘴11吸取之工件9，則會進入步驟710，測試系統100則會發出警告並停止運作，然後以人工之方式排除該些工件9。如上所述，可利用如圖3D所示之偵測裝置157偵測回收吸嘴15內部之內部管路151(見圖3D)的壓力變化，以判斷回收吸嘴15是否成功吸取工件9。 In step 707, it is determined whether the recovery nozzle 15 can successfully absorb the workpiece 9. If the recovery nozzle 15 can successfully absorb the workpiece 9 that cannot be absorbed by the vacuum nozzle 11 of the vacuum pick-and-place tool 1 in the feed carrier 2, the process proceeds to step 708, where the recovery nozzle 15 absorbs and places the workpiece 9 in the temporary storage device 5 (see path W2 in FIG. 4 ). On the contrary, if the recovery nozzle 15 cannot successfully absorb the workpiece 9 that cannot be absorbed by the vacuum nozzle 11 of the vacuum pick-and-place tool 1 in the feed carrier 2, the process proceeds to step 710, where the test system 100 issues a warning and stops operating, and then manually removes the workpiece 9. As described above, the detection device 157 shown in FIG. 3D can be used to detect the pressure change of the internal pipeline 151 (see FIG. 3D) inside the recovery nozzle 15 to determine whether the recovery nozzle 15 successfully absorbs the workpiece 9.

當未能被真空取放工具1之真空吸嘴11吸取之工件9被回收吸嘴15所吸取並放置至暫放收納裝置5中後，則會進入步驟709，測試系統100繼續進行測試程序。 When the workpiece 9 that cannot be sucked by the vacuum nozzle 11 of the vacuum pick-and-place tool 1 is sucked by the recovery nozzle 15 and placed in the temporary storage device 5, it will enter step 709 and the test system 100 will continue the test procedure.

根據以上可了解，若真空取放工具1之真空吸嘴11未能成功地將進料承載裝置2中之工件9吸取，可利用真空取放工具1之回收吸嘴15將其移除，無須關閉測試系統100以移除之。 Based on the above, it can be understood that if the vacuum nozzle 11 of the vacuum pick-and-place tool 1 fails to successfully pick up the workpiece 9 in the feed carrier 2, the recovery nozzle 15 of the vacuum pick-and-place tool 1 can be used to remove it without shutting down the test system 100 to remove it.

圖5B所示為根據本揭露之實施例之測試系統100之執行步驟之流程圖，其中包含放貨不正時的處理流程，尤其係關於圖4中之路徑W1及路徑W3之操作。 FIG. 5B is a flow chart showing the execution steps of the test system 100 according to the embodiment of the present disclosure, which includes the processing flow for improper delivery, especially the operation of path W1 and path W3 in FIG. 4 .

在步驟801中，測試系統100進行工件9之測試程序。其中，真空取放工具1之真空吸嘴11將自進料承載裝置2所吸取之工件9放置於運送載具3上。 In step 801, the testing system 100 performs a testing procedure on the workpiece 9. The vacuum nozzle 11 of the vacuum pick-and-place tool 1 places the workpiece 9 sucked from the feed carrier 2 on the transport carrier 3.

在步驟802中，真空取放工具1之真空吸嘴11因控制的穩定度或定位精準度不佳而無法將工件9擺正於運送載具3上。 In step 802, the vacuum nozzle 11 of the vacuum pick-and-place tool 1 is unable to place the workpiece 9 on the transport carrier 3 due to poor control stability or positioning accuracy.

在步驟803中，當運送載具3發現被擺放於其上之工件9並未被擺正時，則會啟動震盪器以嘗試將工件9擺正。如上所述，運送載具3可具有光感測器以判斷擺設於其上之工件9是否擺正。 In step 803, when the transport carrier 3 finds that the workpiece 9 placed thereon is not aligned, the vibrator is activated to try to align the workpiece 9. As described above, the transport carrier 3 may have a photo sensor to determine whether the workpiece 9 placed thereon is aligned.

在步驟804中，判斷工件9是否已被震盪器擺正，若經震盪器啟動後可將工件9擺正，則會進入步驟809，測試系統100將繼續進行測試程序。若經震盪器啟動仍無法將工件9擺正，則會進入步驟805。 In step 804, it is determined whether the workpiece 9 has been aligned by the vibrator. If the workpiece 9 can be aligned after the vibrator is activated, the process proceeds to step 809, and the test system 100 continues the test procedure. If the workpiece 9 still cannot be aligned after the vibrator is activated, the process proceeds to step 805.

在步驟805中，真空取放工具1之回收吸嘴15則會開始啟動，以吸取在運送載具3上未能被擺正之工件9。 In step 805, the recovery nozzle 15 of the vacuum pick-and-place tool 1 will start to pick up the workpiece 9 that has not been placed properly on the transport carrier 3.

在步驟806中，判斷回收吸嘴15是否能成功吸取工件9，若 回收吸嘴15可成功地吸取在運送載具3上未能被擺正之工件9，則會進入步驟807，回收吸嘴15會將工件9吸取並放置至暫放收納裝置5中(參圖4之路徑W3)。反之，若回收吸嘴15未能成功地吸取在運送載具3上未能被擺正之工件9，則會進入步驟810，測試系統100則會發出警告並停止運作，然後以人工之方式排除該些工件9。如上所述，可利用如圖3D所示之偵測裝置157偵測回收吸嘴15內部之內部管路151(見圖3D)的壓力變化，以判斷回收吸嘴15是否成功吸取工件9。 In step 806, it is determined whether the recovery nozzle 15 can successfully absorb the workpiece 9. If the recovery nozzle 15 can successfully absorb the workpiece 9 that cannot be placed on the transport carrier 3, it will enter step 807, and the recovery nozzle 15 will absorb the workpiece 9 and place it in the temporary storage device 5 (see path W3 in Figure 4). On the contrary, if the recovery nozzle 15 fails to successfully absorb the workpiece 9 that cannot be placed on the transport carrier 3, it will enter step 810, and the test system 100 will issue a warning and stop operating, and then manually remove the workpieces 9. As described above, the detection device 157 shown in Figure 3D can be used to detect the pressure change of the internal pipeline 151 (see Figure 3D) inside the recovery nozzle 15 to determine whether the recovery nozzle 15 successfully absorbs the workpiece 9.

在步驟808中，運送載具3可進一步確認是否仍存有未被擺正之工件9；如上所述，運送載具3可利用光感測器判斷擺設於其上之工件9是否擺正。若運送載具3已無未被擺正之工件9，則會進入步驟809，測試系統100持續進行測試程序。若運送載具3上仍有未被擺正之工件9，則會進入步驟810，測試系統100則會發出警告並停止運作，然後以人工之方式排除該些工件9。 In step 808, the transport carrier 3 can further confirm whether there are still any workpieces 9 that have not been properly placed; as described above, the transport carrier 3 can use a photo sensor to determine whether the workpiece 9 placed on it is properly placed. If there are no workpieces 9 that have not been properly placed on the transport carrier 3, it will enter step 809, and the test system 100 will continue the test procedure. If there are still workpieces 9 that have not been properly placed on the transport carrier 3, it will enter step 810, and the test system 100 will issue a warning and stop operating, and then remove these workpieces 9 manually.

根據以上可了解，若真空取放工具1之真空吸嘴11未能將工件9擺正於運送載具3上，可利用真空取放工具1之回收吸嘴15將其移除，無須關閉測試系統100以移除之。 Based on the above, it can be understood that if the vacuum nozzle 11 of the vacuum pick-and-place tool 1 fails to place the workpiece 9 on the transport carrier 3, the recovery nozzle 15 of the vacuum pick-and-place tool 1 can be used to remove it without shutting down the test system 100 to remove it.

本文所公開的具體結構和功能細節僅僅是代表性的，並且是用於描述本發明的示例性實施例的目的。但是本發明可以通過許多替換形式來具體實現，並且不應當被解釋成僅僅受限於這裏所闡述的實施例。 The specific structural and functional details disclosed herein are representative only and are for the purpose of describing exemplary embodiments of the present invention. However, the present invention may be embodied in many alternative forms and should not be construed as being limited to only the embodiments described herein.

術語「第一」、「第二」僅用於描述目的，而不能理解為指示或暗示相對重要性或者隱含指明所指示的技術特徵的數量。由此，限定有「第一」、「第二」的特徵可以明示或者隱含地包括一個或者更多個該特徵。在本文的描述中，除非另有說明，「多個」的含義是兩個或兩個以 上。另外，術語「包括」及其任何變形，意圖在於覆蓋不排他的包含。 The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this article, unless otherwise specified, the meaning of "plurality" is two or more. In addition, the term "including" and any variations thereof are intended to cover non-exclusive inclusions.

此外，為了方便描述，可在本文中使用空間相對術語(諸如「下面」、「下方」、「下」、「上方」、「上」、「上面」及其類似者)來描述一元件或構件與另一(些)元件或構件之關係，如圖中所繪示。除圖中所描繪之定向之外，空間相對術語亦意欲涵蓋裝置在使用或操作中之不同定向。設備可依其他方式定向(旋轉90度或依其他定向)，且亦可據此解譯本文中所使用之空間相對描述詞。 In addition, for ease of description, spatially relative terms (such as "below", "beneath", "down", "above", "upper", "above" and the like) may be used herein to describe the relationship of one element or component to another element or components, as shown in the figures. In addition to the orientation depicted in the figures, spatially relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may also be interpreted accordingly.

如本文中所使用，術語「大致」、「實質上」、「實質」及「約」用於描述及解釋小變動。當結合一事件或狀況使用時，術語可涉及其中精確發生該事件或狀況之例項以及其中非常近似發生該事件或狀況之例項。例如，當結合一數值使用時，術語可涉及小於或等於該數值之±10%之一變動範圍，諸如小於或等於±5%，小於或等於±4%，小於或等於±3%，小於或等於±2%，小於或等於±1%，小於或等於±0.5%，小於或等於±0.1%，或小於或等於±0.05%。例如，若兩個數值之間的一差小於或等於該等值之一平均值之±10%(諸如小於或等於±5%，小於或等於±4%，小於或等於±3%，小於或等於±2%，小於或等於±1%，小於或等於±0.5%，小於或等於±0.1%，或小於或等於±0.05%)，則該等值可被視為「實質上」相同或相等。例如，「實質上」平行可涉及小於或等於±10°之相對於0°之一角變動範圍，諸如小於或等於±5°，小於或等於±4°，小於或等於±3°，小於或等於±2°，小於或等於±1°，小於或等於±0.5°，小於或等於±0.1°，或小於或等於±0.05°。例如，「實質上」垂直可涉及小於或等於±10°之相對於90°之一角變動範圍，諸如小於或等於±5°，小於或等於±4°，小於或等於±3°，小於或等於±2°，小於或等於±1°，小於或等於 ±0.5°，小於或等於±0.1°，或小於或等於±0.05°。 As used herein, the terms "substantially," "substantially," "essentially," and "about" are used to describe and explain small variations. When used in conjunction with an event or condition, the terms may relate to instances in which the event or condition occurred exactly as well as instances in which the event or condition occurred very approximately. For example, when used in conjunction with a numerical value, the terms may relate to a range of variation of less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two values may be considered "substantially" the same or equal if the difference between them is less than or equal to ±10% of a mean of the values (e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%). For example, "substantially" parallelism may involve an angular variation of less than or equal to ±10° relative to 0°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, "substantially" perpendicular may involve an angular variation of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

上文已概述若干實施例之特徵，使得熟習技術者可較佳理解本揭露之態樣。熟習技術者應瞭解，其可易於將本揭露用作用於設計或修改其他程序及結構的一基礎以實施相同目的及/或達成本文中所引入之實施例之相同優點。熟習技術者亦應意識到，此等等效構造不應背離本揭露之精神及範疇，且其可對本文作出各種改變、置換及變更。 The features of several embodiments have been summarized above so that those skilled in the art can better understand the state of the present disclosure. Those skilled in the art should understand that they can easily use the present disclosure as a basis for designing or modifying other procedures and structures to implement the same purpose and/or achieve the same advantages of the embodiments introduced in this article. Those skilled in the art should also realize that such equivalent structures should not deviate from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and modifications to this article.

1:取放工具 1: Pick-and-place tools

10:主體 10: Subject

11:真空吸嘴 11: Vacuum nozzle

15:回收吸嘴 15: Recycling nozzle

Claims (18)

一種取放工具，其包括：一第一吸嘴，其經組態以吸取位於一第一承載裝置上之一工件；及一第二吸嘴，其中，該第二吸嘴經組態以於該工件無法被該第一吸嘴自該第一承載裝置吸取時，自該第一承載裝置吸取該工件；其中該第一吸嘴的一有效吸取範圍小於該工件之一投影面積，該第二吸嘴之一有效吸取範圍大於該第一吸嘴之該有效吸取範圍。 A pick-and-place tool includes: a first suction nozzle configured to pick up a workpiece on a first carrier; and a second suction nozzle, wherein the second suction nozzle is configured to pick up the workpiece from the first carrier when the workpiece cannot be picked up from the first carrier by the first suction nozzle; wherein an effective suction range of the first suction nozzle is smaller than a projected area of the workpiece, and an effective suction range of the second suction nozzle is larger than the effective suction range of the first suction nozzle. 一種取放工具，其包括：一第一吸嘴，其經組態以將一工件放置於一第二承載裝置上；及一第二吸嘴，其中，該第二吸嘴經組態以於該工件無法被該第一吸嘴正確地放置於該第二承載裝置上時，自該第二承載裝置吸取該工件；其中該第一吸嘴的一有效吸取範圍小於該工件之一投影面積，該第二吸嘴之一有效吸取範圍大於該第一吸嘴之該有效吸取範圍。 A pick-and-place tool includes: a first suction nozzle configured to place a workpiece on a second carrier; and a second suction nozzle, wherein the second suction nozzle is configured to pick up the workpiece from the second carrier when the workpiece cannot be correctly placed on the second carrier by the first suction nozzle; wherein an effective suction range of the first suction nozzle is smaller than a projected area of the workpiece, and an effective suction range of the second suction nozzle is larger than the effective suction range of the first suction nozzle. 如請求項1或2之取放工具，其中該第二吸嘴可建立之一負壓大於該第一吸嘴可建立之一負壓。 A pick-and-place tool as claimed in claim 1 or 2, wherein the second nozzle can establish a negative pressure greater than the negative pressure that the first nozzle can establish. 如請求項1或2之取放工具，其中該第二吸嘴之一有效吸取範圍大於該工件之一投影面積。 A pick-and-place tool as claimed in claim 1 or 2, wherein an effective suction range of the second suction nozzle is larger than a projected area of the workpiece. 一種取放工具，其包括： 一第一吸嘴，其經組態以吸取位於一第一承載裝置上之一工件；及一第二吸嘴，其中，該第二吸嘴經組態以於該工件無法被該第一吸嘴自該第一承載裝置吸取時，自該第一承載裝置吸取該工件；其中該第二吸嘴經組態以於吸取該工件之過程中，使位於該第二吸嘴中之一真空路徑與位在該第二吸嘴周圍之一外部流體連通。 A pick-and-place tool, comprising: a first suction nozzle configured to pick up a workpiece on a first carrier; and a second suction nozzle, wherein the second suction nozzle is configured to pick up the workpiece from the first carrier when the workpiece cannot be picked up from the first carrier by the first suction nozzle; wherein the second suction nozzle is configured to connect a vacuum path in the second suction nozzle to an external fluid around the second suction nozzle during the process of picking up the workpiece. 一種取放工具，其包括：一第一吸嘴，其經組態以將一工件放置於一第二承載裝置上；及一第二吸嘴，其中，該第二吸嘴經組態以於該工件無法被該第一吸嘴正確地放置於該第二承載裝置上時，自該第二承載裝置吸取該工件；其中該第二吸嘴經組態以於吸取該工件之過程中，使位於該第二吸嘴中之一真空路徑與位在該第二吸嘴周圍之一外部流體連通。 A pick-and-place tool includes: a first suction nozzle configured to place a workpiece on a second carrier; and a second suction nozzle, wherein the second suction nozzle is configured to pick up the workpiece from the second carrier when the workpiece cannot be correctly placed on the second carrier by the first suction nozzle; wherein the second suction nozzle is configured to connect a vacuum path in the second suction nozzle to an external fluid around the second suction nozzle during the process of picking up the workpiece. 一種測試系統，其包括：一第一承載裝置；一第二承載裝置，其與該第一承載裝置隔開設置；一回收裝置，其與該第一承載裝置及該第二承載裝置間隔開設置，該回收裝置經組態以存放一工件；及一取放工具，經組態以將該工件自該第一承載裝置吸取並擺放至該第二承載裝置，及將該工件自該第一承載裝置吸取並擺放至該回收裝置；其中該取放工具包括一經組態以自該第一承載裝置吸取該工件的第一吸嘴，及一經組態以當該第一吸嘴無法自該第一承載裝置吸取該工件時，吸取該工件的第二吸嘴； 其中該第一吸嘴進一步經組態以在建立一負壓時不接觸該第一承載裝置，該第二吸嘴進一步經組態以在建立一負壓時接觸該第一承載裝置。 A testing system includes: a first carrier; a second carrier, which is separated from the first carrier; a recovery device, which is separated from the first carrier and the second carrier, the recovery device is configured to store a workpiece; and a pick-and-place tool, which is configured to suck the workpiece from the first carrier and place it on the second carrier, and suck the workpiece from the first carrier and place it on the second carrier. The recovery device; wherein the pick-and-place tool includes a first suction nozzle configured to pick up the workpiece from the first carrier, and a second suction nozzle configured to pick up the workpiece when the first suction nozzle cannot pick up the workpiece from the first carrier; wherein the first suction nozzle is further configured not to contact the first carrier when a negative pressure is established, and the second suction nozzle is further configured to contact the first carrier when a negative pressure is established. 如請求項7之測試系統，其中該第一承載裝置形成有開口朝上的凹槽，可供該第二吸嘴的內部透過該凹槽連通位在該第二吸嘴周圍之一外部流體。 As in the test system of claim 7, the first carrier is formed with a groove with an opening facing upward, so that the interior of the second nozzle can be connected to an external fluid located around the second nozzle through the groove. 一種測試系統，其包括：一第一承載裝置；一第二承載裝置，其與該第一承載裝置隔開設置；一回收裝置，其與該第一承載裝置及該第二承載裝置間隔開設置，該回收裝置經組態以存放一工件；及一取放工具，經組態以將該工件自該第一承載裝置吸取並擺放至該第二承載裝置，及將該工件自該第一承載裝置吸取並擺放至該回收裝置；其中該取放工具包括一經組態以將自該第一承載裝置所吸取之該工件放置於該第二承載裝置上之第三吸嘴，及一經組態以將該工件自該第二承載裝置吸取並擺放至該回收裝置的第四吸嘴。 A testing system includes: a first carrier; a second carrier, which is separated from the first carrier; a recovery device, which is separated from the first carrier and the second carrier, and the recovery device is configured to store a workpiece; and a pick-and-place tool, which is configured to suck the workpiece from the first carrier and place it on the second carrier, and suck the workpiece from the first carrier and place it on the recovery device; wherein the pick-and-place tool includes a third suction nozzle configured to place the workpiece sucked from the first carrier on the second carrier, and a fourth suction nozzle configured to suck the workpiece from the second carrier and place it on the recovery device. 如請求項9之測試系統，其中該第四吸嘴經組態以吸取無法由該第三吸嘴正確地擺放於該第二承載裝置上之該工件。 A test system as claimed in claim 9, wherein the fourth nozzle is configured to pick up the workpiece that cannot be correctly placed on the second carrier by the third nozzle. 如請求項9之測試系統，其中該第三吸嘴經組態以在擺放該工件時不接觸該第二承載裝置，該第四吸嘴經組態以在吸取該工件時接觸該第二承 載裝置。 A test system as claimed in claim 9, wherein the third nozzle is configured not to contact the second carrier when placing the workpiece, and the fourth nozzle is configured to contact the second carrier when sucking the workpiece. 一種測試方法，其包含：一第一步驟，包括使用一取放工具拾取一位於一第一位置之工件並擺放至一測試裝置；及一第二步驟，包括使用該取放工具拾取無法自該第一位置拾取之該工件並擺放至一第二位置。 A testing method, comprising: a first step, including using a pick-and-place tool to pick up a workpiece at a first position and place it on a testing device; and a second step, including using the pick-and-place tool to pick up the workpiece that cannot be picked up from the first position and place it on a second position. 如請求項12之測試方法，其中該第二步驟是在該第一步驟結束後執行。 The test method of claim 12, wherein the second step is performed after the first step is completed. 如請求項13之測試方法，其中該第一位置裝載有複數個該工件，更包含重複該第一步驟直至該第一位置上無可被該取放工具所拾取之該等工件時，執行該第二步驟。 The test method of claim 13, wherein the first position is loaded with a plurality of the workpieces, further comprising repeating the first step until there are no workpieces on the first position that can be picked up by the pick-and-place tool, and then executing the second step. 如請求項12之測試方法，其中在該第一步驟中，包括以該取放工具接觸該工件產生負壓以拾取該工件，且其中在該第二步驟中，包括以該取放工具不接觸該工件即產生負壓以拾取該工件。 The test method of claim 12, wherein in the first step, the pick-and-place tool is contacted with the workpiece to generate negative pressure to pick up the workpiece, and wherein in the second step, the pick-and-place tool is not contacted with the workpiece to generate negative pressure to pick up the workpiece. 如請求項15之測試方法，其中在該第二步驟中，該取放工具在吸取該工件後至放置該工件前保持接觸該工件。 As in the test method of claim 15, wherein in the second step, the pick-and-place tool maintains contact with the workpiece after picking up the workpiece and before placing the workpiece. 如請求項12之測試方法，其中該第一步驟更包括使用該取放工具之 一第一拾取件將自該第一位置所拾取之該工件擺放至該測試裝置，且其中該第二步驟更包括使用該取放工具之一第二拾取件將無法被該第一拾取件正確擺放之該工件自該測試裝置拾取並擺放至該第二位置。 The test method of claim 12, wherein the first step further includes using a first pick-up member of the pick-and-place tool to place the workpiece picked up from the first position to the test device, and wherein the second step further includes using a second pick-up member of the pick-and-place tool to pick up the workpiece that cannot be correctly placed by the first pick-up member from the test device and place it to the second position. 如請求項17之測試方法，更包含在執行該第一步驟後感測該工件的放置狀態以判斷是否進行該第二步驟。 The test method of claim 17 further includes sensing the placement status of the workpiece after executing the first step to determine whether to perform the second step.

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