TWI834399B - Developing device - Google Patents
Developing device Download PDFInfo
- Publication number
- TWI834399B TWI834399B TW111145350A TW111145350A TWI834399B TW I834399 B TWI834399 B TW I834399B TW 111145350 A TW111145350 A TW 111145350A TW 111145350 A TW111145350 A TW 111145350A TW I834399 B TWI834399 B TW I834399B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- developer
- nozzle
- developing device
- roller
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 131
- 239000007788 liquid Substances 0.000 claims abstract description 52
- 230000002093 peripheral effect Effects 0.000 claims abstract description 21
- 230000004323 axial length Effects 0.000 claims abstract 2
- 230000032258 transport Effects 0.000 claims description 41
- 238000011144 upstream manufacturing Methods 0.000 claims description 15
- 230000007246 mechanism Effects 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 2
- 238000011161 development Methods 0.000 abstract description 20
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 14
- 238000012546 transfer Methods 0.000 abstract description 8
- 230000018109 developmental process Effects 0.000 abstract 1
- 238000012545 processing Methods 0.000 description 33
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001868 water Inorganic materials 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3064—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3057—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the processing units other than the developing unit, e.g. washing units
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Wet Developing In Electrophotography (AREA)
Abstract
本發明提供一種顯影裝置,能夠有效地防止顯影處理時產生的泡經由搬送輥而附著於基板表面。顯影裝置包括:搬送輥,具有軸向上的長度為軸向上的基板的長度以上的圓筒形狀;噴嘴,設於搬送路徑的上方且比搬送輥更靠下游側的位置處,並朝向基板的上表面噴出顯影液;以及液體接收構件,設於搬送路徑的下方且噴嘴的正下方位置,並接收從噴嘴噴出的顯影液。液體接收構件的上端成為被精加工成薄板狀的刮板,所述刮板在比搬送路徑更靠下方處與搬送輥的周面隔開規定的空隙而配置,與搬送輥相反的一側的液體接收構件的表面延伸到超過噴嘴的正下方位置的位置,且成為至少在噴嘴的正下方位置至下端之間具有下坡坡度的傾斜面。The present invention provides a developing device that can effectively prevent bubbles generated during the development process from adhering to the surface of a substrate via a transport roller. The developing device includes a conveying roller having a cylindrical shape with an axial length equal to or greater than the length of the substrate in the axial direction; and a nozzle provided above the conveying path and downstream of the conveying roller and facing upward of the substrate. The developer is ejected from the surface; and the liquid receiving member is provided below the conveyance path and directly below the nozzle, and receives the developer ejected from the nozzle. The upper end of the liquid receiving member is a scraper finished into a thin plate shape. The scraper is disposed below the transfer path with a predetermined gap from the peripheral surface of the transfer roller. The surface of the liquid receiving member extends beyond the position directly below the nozzle and becomes an inclined surface having a downward slope from at least the position directly below the nozzle to the lower end.
Description
本發明是有關於一種藉由搬送輥來搬送基板並對基板表面供給顯影液來進行覆液的顯影裝置。再者,基板包含液晶顯示裝置或有機電致發光(Electroluminescence,EL)顯示裝置等的平板顯示器(Flat Panel Display,FPD)用玻璃基板、半導體晶片、光光罩(photo mask)用玻璃基板、彩色濾光器(color filter)用基板、記錄碟盤(disk)用基板、太陽能電池用基板、電子紙用基板等精密電子裝置用基板、半導體封裝用基板(以下,簡稱為“基板”)等。 The present invention relates to a developing device that transports a substrate using a transport roller and supplies a developer liquid to the surface of the substrate to coat the substrate surface with the liquid. In addition, the substrate includes a glass substrate for a flat panel display (FPD) such as a liquid crystal display device or an organic electroluminescence (EL) display device, a semiconductor wafer, a glass substrate for a photo mask, and a color substrate. Substrates for color filters, substrates for recording disks, substrates for solar cells, substrates for electronic paper and other precision electronic devices, substrates for semiconductor packaging (hereinafter referred to as "substrates"), etc.
在藉由搬送輥來搬送表面盛有顯影液的基板的期間內對基板執行顯影處理的顯影裝置有時作為基板處理系統的一構成部件而被組入所述系統中。例如專利文獻1中,顯影裝置與清洗裝置、脫水烘烤裝置、抗蝕劑塗布裝置、減壓乾燥裝置、預烘烤裝置、曝光裝置、以及後烘烤裝置一起作為處理裝置而設於基板處理系統中。另外,基板處理系統具有這些處理裝置、以及進行基板向所述裝置群的出入的移載器(indexer)部。
A developing device that performs a development process on the substrate while the substrate containing the developer on the surface is transported by a transport roller may be incorporated into the substrate processing system as a component of the system. For example, in
在移載器部中,載置收納多個基板的匣盒(cassette)。由配設於移載器部的移載器機器人從匣盒取出的基板首先在清洗 裝置中受到清洗。結束了清洗裝置中的處理的基板被搬送至脫水烘烤裝置,進行脫水烘烤處理。進行了脫水烘烤處理的基板繼而被搬送到抗蝕劑塗布裝置,實施抗蝕劑塗布處理。實施了抗蝕劑塗布處理的基板繼而被搬送到減壓乾燥裝置,藉由減壓來使塗布於基板表面的抗蝕劑液的溶媒蒸發,而使基板乾燥。實施了減壓乾燥的基板繼而被搬送到預烘烤裝置,被實施加熱處理以使基板表面的抗蝕劑成分固化。實施了加熱處理的基板繼而被搬送到曝光裝置,被實施曝光處理。 In the transfer unit, a cassette accommodating a plurality of substrates is placed. The substrate taken out from the cassette by the transfer robot installed in the transfer unit is first cleaned The device is being cleaned. The substrate that has completed the processing in the cleaning device is transported to the dehydration and baking device, and is subjected to dehydration and baking processing. The substrate that has been subjected to the dehydration baking process is then transferred to a resist coating device, and a resist coating process is performed. The substrate subjected to the resist coating process is then transported to a reduced pressure drying device, and the solvent of the resist liquid applied on the surface of the substrate is evaporated by reduced pressure, thereby drying the substrate. The substrate dried under reduced pressure is then transferred to a prebaking device, and heat treatment is performed to solidify the resist component on the surface of the substrate. The substrate that has been subjected to the heat treatment is then transported to an exposure device and exposed.
結束了這些處理的基板被搬送到顯影裝置,進行顯影處理。結束了顯影處理的基板被送往後烘烤裝置,實施加熱處理。其後,所述基板藉由移載器機器人而被收容到載置於移載器部的原本的匣盒內。 The substrate that has completed these processes is transported to a developing device, and developed. The substrate that has completed the development process is sent to a post-baking device and heat-processed. Thereafter, the substrate is stored in the original cassette placed on the transfer unit by the transfer robot.
[專利文獻1]日本專利特開2016-167475號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-167475
在專利文獻1中記載的基板處理系統中,為了沿著從顯影裝置朝向後烘烤裝置的搬送路徑來搬送基板,使用了多個搬送輥。即,以使盛有顯影液的基板的表面朝向上方的水平姿勢來藉由多個搬送輥從下方支撐基板並搬送所述基板。近年來,在基板搬送過程中確認到下述現象,即,伴隨顯影處理而溶有抗蝕劑成分的顯
影液起泡,其一部分附著於搬送輥。當附著於搬送輥的泡彼此凝聚並以堆積的狀態附著於搬送輥的周面時,伴隨搬送輥的旋轉,所述泡保持堆積的狀態而移動至基板的搬送路徑。因此,搬送輥上的泡不僅附著於基板的背面而且還附著於表面。結果,有時產生下述問題:顯影處理變得不均勻,從而導致顯影品質的下降。
In the substrate processing system described in
另外,在朝向基板噴出顯影液的噴嘴的正下方位置處,基板不通過的期間內所噴出的顯影液落下到裝置的底面時,產生飛沫或泡,這些有可能附著於搬送輥,從而產生同樣的問題。 In addition, if the developer sprayed directly below the nozzle that sprays the developer toward the substrate falls to the bottom of the device while the substrate is not passing, splashes or bubbles may be generated, which may adhere to the conveyor roller, causing the same problem. problem.
本發明是鑒於所述課題而成,目的在於提供一種能夠有效地防止顯影處理時產生的泡經由搬送輥而附著於基板表面的顯影裝置。 The present invention was made in view of the above problems, and an object thereof is to provide a developing device that can effectively prevent bubbles generated during the development process from adhering to the surface of the substrate via the transport roller.
本發明的一形態是搬送基板並進行利用顯影液的覆液的顯影裝置,所述顯影裝置包括:搬送輥,具有軸向上的長度為所述軸向上的基板的長度以上的圓筒形狀,並繞水平的旋轉軸旋轉,且在從下方支撐所述基板的同時搬送所述基板;噴嘴,設於所述搬送輥搬送所述基板的搬送路徑的上方且比所述搬送輥更靠下游側的位置處,並朝向所述基板的上表面噴出所述顯影液;以及液體接收構件,設於所述搬送路徑的下方且所述噴嘴的正下方位置,並接收從所述噴嘴噴出的所述顯影液。此處,在所述液體接收構件的表面中,面對所述噴嘴的上表面是構成為傾斜面。所述傾斜面是夾著所述噴嘴的正下方位置,從所述基板的搬送方向的所述正下方位 置的上游側延伸設置到下游側,且具有從所述上游側的端部的上端朝向下游側的端部的下端的下坡坡度。且在所述上游側的端部,所述液體接收構件是構成為刮板,所述刮板沿著所述軸向延伸被精加工成薄板狀,且在比所述搬送路徑更靠下方處與所述搬送輥的周面隔開規定的空隙而配置,除去附著在所述搬送輥的表面的泡。 One aspect of the present invention is a developing device that conveys a substrate and performs coating with a developer. The developing device includes a conveying roller having a cylindrical shape whose length in the axial direction is equal to or longer than the length of the substrate in the axial direction, and The nozzle is provided above the conveyance path through which the conveyance roller conveys the substrate and on the downstream side of the conveyance roller. position, and sprays the developer toward the upper surface of the substrate; and a liquid receiving member, which is provided below the conveyance path and directly below the nozzle, and receives the developer sprayed from the nozzle. liquid. Here, among the surfaces of the liquid receiving member, an upper surface facing the nozzle is configured as an inclined surface. The inclined surface is a position directly below the nozzle, from the position directly below the conveyance direction of the substrate. The upstream side of the device extends to the downstream side, and has a downward slope from the upper end of the upstream end toward the lower end of the downstream end. In addition, at the upstream side end, the liquid receiving member is configured as a scraper, the scraper being finely processed into a thin plate shape extending in the axial direction, and is located below the conveyance path. It is arranged with a predetermined gap from the peripheral surface of the conveyance roller, and removes bubbles adhering to the surface of the conveyance roller.
在如此構成的發明中,液體接收構件兼具下述功能:去除附著於搬送輥周面的泡的功能;以及抑制由從噴嘴流下的顯影液所產生的飛沫或泡附著於搬送輥的功能。 In the invention thus constituted, the liquid receiving member has both the function of removing bubbles adhering to the peripheral surface of the conveying roller and the function of suppressing the adhesion of droplets or bubbles generated by the developer flowing down from the nozzle to the conveying roller.
即,液體接收構件的上端成為與搬送輥的周面隔開規定的空隙而配置的刮板,能夠使附著於搬送輥周面的泡移行到刮板並加以去除。此處,無需去除附著的全部泡,只要能夠防止泡在搬送輥周面上堆積而蔓延到基板表面就足夠了。因此,無需使刮板與搬送輥抵接。 That is, the upper end of the liquid receiving member becomes a scraper arranged with a predetermined gap from the peripheral surface of the conveying roller, so that bubbles adhering to the peripheral surface of the conveying roller can be transferred to the scraper and removed. Here, it is not necessary to remove all the adhered bubbles, but it is sufficient to prevent bubbles from being accumulated on the peripheral surface of the conveying roller and spreading to the substrate surface. Therefore, there is no need to bring the scraper and the conveyance roller into contact.
另一方面,關於液體接收構件的表面,在噴嘴的正下方位置處,表面成為傾斜面。因此,基板不位於噴嘴正下方位置時從噴嘴流下的顯影液由液體接收構件的傾斜面接住,並沿著所述傾斜面被進一步向下方引導。由此,與顯影液直接落下到底面的情況相比,能夠抑制飛沫或泡的產生,並能夠抑制這些附著於搬送輥或基板。 On the other hand, regarding the surface of the liquid receiving member, the surface becomes an inclined surface at a position directly below the nozzle. Therefore, the developer flowing down from the nozzle when the substrate is not located directly under the nozzle is caught by the inclined surface of the liquid receiving member and guided further downward along the inclined surface. Accordingly, compared with a case where the developer drops directly to the bottom surface, it is possible to suppress the generation of droplets and bubbles, and to suppress these from adhering to the conveyance roller or the substrate.
如以上所述,根據本發明,液體接收構件具有下述功能: 去除附著於搬送輥周面的泡的功能;以及抑制從噴嘴未供給到基板而是直接流下的顯影液所產生的飛沫或泡的功能。因此,能夠解決泡附著於被搬送的基板的表面而顯影品質下降的問題。而且,由於所述液體接收構件與搬送輥不接觸地配置,因此搬送輥不會因液體接收構件而受到損傷,能夠穩定地搬送基板。 As described above, according to the present invention, the liquid receiving member has the following functions: It has the function of removing bubbles adhering to the peripheral surface of the conveying roller, and the function of suppressing the generation of splashes or bubbles caused by the developer flowing down directly from the nozzle without being supplied to the substrate. Therefore, it is possible to solve the problem of bubbles adhering to the surface of the conveyed substrate and deteriorating development quality. Furthermore, since the liquid receiving member is arranged without contact with the conveying roller, the conveying roller is not damaged by the liquid receiving member, and the substrate can be conveyed stably.
1:顯影裝置 1:Developing device
2:處理室 2: Processing room
3:基板搬送裝置 3:Substrate transport device
4:顯影液噴嘴(噴嘴) 4:Developer nozzle (nozzle)
4a:顯影液噴嘴 4a:Developer nozzle
4b:顯影液噴嘴 4b:Developer nozzle
5:顯影液供給部 5:Developer supply part
6:配管 6:Piping
7:除泡構件(液體接收構件) 7: Defoaming member (liquid receiving member)
7A:除泡構件 7A: Defoaming components
7B:除泡構件 7B: Defoaming components
8:空隙調整機構 8: Gap adjustment mechanism
21:底面 21: Bottom
22:排出機構 22: Discharge mechanism
23:傾斜板 23:tilt plate
31:搬送輥 31:Conveying roller
31a:搬送輥 31a:Conveying roller
31b:搬送輥 31b:Conveying roller
31c:搬送輥 31c:Conveying roller
31d:搬送輥 31d:Conveying roller
41:噴出口 41:Spout
71:(除泡構件的)上端 71: (the upper end of the defoaming member)
72:(除泡構件的)表面(主表面) 72: Surface (main surface) (of the defoaming member)
73:(除泡構件的)下端 73: (The lower end of the defoaming member)
311:軸 311:Shaft
312:UPE輥 312:UPE roller
313:周面 313: Surround surface
AX:旋轉軸 AX: axis of rotation
B:泡 B: bubble
G:空隙 G: Gap
L:顯影液 L: developer
R:方向/旋轉方向 R: direction/rotation direction
S:基板 S:Substrate
Sb:下表面 Sb: lower surface
Sf:(基板的)表面 Sf: Surface (of substrate)
V:速度向量 V: velocity vector
V1:向量成分 V1: vector component
V2:向量成分 V2: vector component
W1:長度 W1: length
W2:長度 W2: length
W3:寬度 W3: Width
W4:寬度 W4: Width
X、Y、Z:座標軸 X, Y, Z: coordinate axes
α:角度 α: angle
β:傾斜角 β: tilt angle
γ:傾斜角 γ: tilt angle
圖1是表示本發明的顯影裝置的一實施方式的結構的側面圖。 FIG. 1 is a side view showing the structure of an embodiment of the developing device of the present invention.
圖2是放大表示顯影裝置的一部分的立體圖。 FIG. 2 is an enlarged perspective view showing a part of the developing device.
圖3(a)、圖3(b)是說明因產生泡而導致的問題的圖。 3(a) and 3(b) are diagrams illustrating problems caused by bubble generation.
圖4(a)、圖4(b)是表示搬送輥與除泡構件的尺寸關係的圖。 4(a) and 4(b) are diagrams showing the dimensional relationship between the conveyance roller and the defoaming member.
圖5(a)~圖5(d)是表示搬送輥與除泡構件的配置的圖。 5(a) to 5(d) are diagrams showing the arrangement of the conveyance roller and the defoaming member.
圖6是表示顯影裝置的變形例的圖。 FIG. 6 is a diagram showing a modified example of the developing device.
圖1是表示本發明的顯影裝置的一實施方式的結構的側面圖。另外,圖2是放大表示顯影裝置的一部分的立體圖。在以下各圖中,為了統一表示方向,如圖1所示那樣,設定XYZ正交座標。此處,XY平面是水平面,Z軸表示鉛垂方向。更具體而言,(-Z)方向表示鉛垂向下方向。 FIG. 1 is a side view showing the structure of an embodiment of the developing device of the present invention. In addition, FIG. 2 is an enlarged perspective view showing a part of the developing device. In the following figures, in order to express directions uniformly, XYZ orthogonal coordinates are set as shown in Figure 1. Here, the XY plane is the horizontal plane, and the Z axis represents the vertical direction. More specifically, the (-Z) direction represents the vertical downward direction.
顯影裝置1是下述裝置,即,對在表面Sf形成有經曝光處理的抗蝕劑膜(省略圖示)的半導體晶片等的基板S供給顯
影液而盛上顯影液之後,以使表面Sf朝向上方的水平姿勢來將基板S搬送到接下來的處理裝置(後烘烤裝置)。在所述基板搬送過程中,執行利用顯影液的顯影處理。在顯影裝置1中,將基板S從圖1的左方向朝向右方向水平搬送。即,將基板S以處理物件面朝上的狀態向(+Y)方向搬送。
The developing
顯影裝置1具有進行顯影處理的處理室2。處理室2在內部具有處理空間,在處理室2的上游側端部(圖1的左端部),設有搬入口(省略圖示),所述搬入口用於搬入藉由配置於顯影裝置1的上游側的曝光裝置而進行了曝光處理的基板S。另外,在處理室2的下游側端部(圖1的右端部),設有搬出口,所述搬出口用於將顯影處理已結束的基板S搬出到接下來的後烘烤裝置。另外,在處理室2的底面21,設有用於將處理室內使用後的顯影液排出的排出機構22。進而,在處理室2的底面的上方,設有沿著搬送方向Y來水平搬送基板S的基板搬送裝置3。
The developing
基板搬送裝置3包括多個搬送輥31以及使搬送輥31旋轉驅動的驅動部(省略圖示)。多個搬送輥31沿著基板S的搬送方向Y而排列,在處理室2內,將基板S從搬送方向Y的上游側(圖1的左側)朝向下游側(圖1的右側)予以搬送。在本說明書中,當需要區分這些搬送輥31時,對符號31適宜附加字母表小寫字母作為附加標注。
The
各搬送輥31是對不銹鋼制的軸311嵌入UPE(超高分子量聚乙烯:Ultra High Molecular Weight Poly Ethylene)輥312而
成的構件,並繞在與搬送方向(Y方向)正交的X方向上延伸的旋轉軸AX旋轉。搬送輥31在其頂部從下方對基板S進行支撐,同時在旋轉方向R上旋轉,由此將基板S向Y方向搬送。
Each
在由多個搬送輥31形成的基板S的搬送路徑的上方,配置顯影液噴嘴4。在所述例子中,在搬送方向(Y方向)上使位置不同地設有兩個顯影液噴嘴4。在本說明書中,當需要區別這些顯影液噴嘴4時,對在基板S的搬送方向上位於上游側、即(-Y)側的一者標注符號4a,對另一者標注符號4b。再者,顯影液噴嘴的配設數量並不限定於此,是任意的。
The
顯影液噴嘴4在處理室2的處理空間內與搬送輥31在Y方向上位置不同地配置。具體而言,顯影液噴嘴4a配置於沿著搬送路徑而相鄰配置的兩個搬送輥31a、31b之間的間隙空間的上方。例如,在兩個搬送輥31a、31b的中間位置的上方,配置顯影液噴嘴4a。換句話說,在顯影液噴嘴4a的正下方位置處不存在搬送輥31。顯影液噴嘴4b也同樣地配置於沿著搬送路徑而相鄰配置的兩個搬送輥31c、31d之間的間隙空間的上方。
The
顯影液噴嘴4對由所述基板搬送裝置3朝向下游側搬送的基板S的表面Sf噴出顯影液。顯影液噴嘴4是在與搬送方向正交的X方向(相對於圖1的紙面而垂直的方向)延伸,在其下表面(與基板S相向的面),形成有在X方向上細長地延伸的窄隙的噴出口41。即,在本實施方式中,使用狹縫噴嘴來作為顯影液噴嘴4。在所述顯影液噴嘴4中,噴出口41的X方向上的尺寸與基
板S的X方向上的尺寸(寬度尺寸)大致相同,或者稍大。
The
在顯影液噴嘴4,藉由配管6而連接有顯影液供給部5。顯影液供給部5具有泵或槽加壓等的壓送機構(省略圖示)。藉由所述壓送機構運行,顯影液L經由配管6而被壓送到顯影液噴嘴4。由此,從顯影液噴嘴4的噴出口41呈簾幕狀地噴出顯影液L,以對基板S的上表面供給顯影液L。
A
在本實施方式中,基板S的表面Sf與顯影液噴嘴4的噴出口41是設置規定的間隔而配置,借由基板S通過噴出口41的正下方,基板S的整個上表面成為利用表面張力而盛有顯影液L的狀態(即,形成有顯影液L的窪坑(puddle)的狀態)。其後,在藉由搬送輥31而搬出到後烘烤裝置的期間內,對基板S的表面Sf、即抗蝕劑膜實施顯影處理。作為此種顯影液L,本實施方式中使用以四甲基氫氧化銨(Tetramethylammonium Hydroxide,TMAH)與水作為主要成分的顯影液。當然,能夠使用除此以外的顯影液、例如以氫氧化鈉或氫氧化鉀與水為主成分的顯影液等。
In the present embodiment, the surface Sf of the substrate S and the
近年來,得知,根據抗蝕劑膜以及顯影液的組合,顯影液容易因顯影液中所含的表面活性劑或顯影處理中溶於顯影液的抗蝕劑材料等而起泡。尤其,當從基板S溢出的顯影液蔓延到搬送輥31與基板S之間時,因兩者的相對移動而顯影液被攪拌,由此產生大量的泡。泡不僅會附著於基板S的下表面,而且如下說明的那樣,可能會經由搬送輥31而附著於基板S的上表面、即作為處理對象面的表面Sf。
In recent years, it has been found that, depending on the combination of a resist film and a developer, the developer is prone to foaming due to surfactants contained in the developer or resist materials dissolved in the developer during the development process. In particular, when the developer overflowing from the substrate S spreads between the
圖3(a)、圖3(b)是說明因產生泡而導致的問題的圖。如圖3(a)所示,進入基板S的下表面Sb與搬送輥31之間的顯影液L成為泡B而附著於基板S的下表面Sb或搬送輥31的周面313。隨著搬送輥31的旋轉,泡B也被搬送,移動到與基板S抵接的頂部。
3(a) and 3(b) are diagrams illustrating problems caused by bubble generation. As shown in FIG. 3( a ), the developer L entering between the lower surface Sb of the substrate S and the
泡B彼此凝聚而成為大塊,由此有時會成為在搬送輥31的周面313上大量堆積的狀態,當將基板S朝向此種泡的塊搬送時,泡的一部分有時會蔓延到基板S的上表面(表面Sf)並附著。如此附著於基板表面Sf的泡成為產生顯影不均等顯影品質下降的原因。
The bubbles B aggregate together and form large blocks, and thus may accumulate in large quantities on the
因此,在本實施方式中,如圖3(b)所示,在比基板S的搬送路徑更靠下方處,相對於各搬送輥31的周面313近接配置除泡構件7,以刮取附著於搬送輥31的泡的方式來去除所述泡。除泡構件7的上端71與搬送輥31的周面313隔著規定的空隙而近接相向,作為對在搬送輥31的周面313上堆積得比空隙大的泡或其塊進行刮取的刮板發揮功能。關於空隙的大小,能夠藉由空隙調整機構8進行調整。
Therefore, in this embodiment, as shown in FIG. 3( b ), the
被刮取並移行到除泡構件7的表面的泡沿著所述表面流下。由於除泡構件7與搬送輥31不接觸,因此在搬送輥31的周面313可能會殘留一些泡。但是,小泡或小規模的泡的塊不會蔓延到基板S的上表面Sf,而是僅附著於下表面Sb,不會成為大的問題。
The bubbles scraped and moved to the surface of the
參照圖2及圖3(b)來更詳細地說明除泡構件7的結構。在本實施方式中,除泡構件7具有使一片薄的平板狀的原材料繞X軸彎曲而成的柱面形狀,且由連結於空隙調整機構8的支撐構件(省略圖示)支撐。除泡構件7的上端71沿著與旋轉軸AX平行的方向(X方向)呈直線狀延伸,並與搬送輥31的周面313隔開後述的規定的空隙而近接相向地配置。除泡構件7的上端71從下方朝上延伸,另一方面,所述上端71所相向的搬送輥31的周面313藉由搬送輥31向方向R的旋轉而從上向下移動。即,除泡構件7成為與搬送輥31的旋轉相反的方向、所謂的反向的配置。
The structure of the
除泡構件7的主表面中的、與朝向搬送輥31的面相反的一側的主表面(在以下的說明中,將此面稱為“表面”)72成為具有下坡坡度的光滑的曲面(傾斜面),隨著從上端71朝向下端73,坡度變小。因此,從搬送輥31移行到除泡構件7的上端71的泡最初沿著坡度較大的表面72以高速流下,隨著朝向下端73,坡度變緩,由此速度降低。最終,從除泡構件7的下端73朝向處理室2的底面21流下。因此,從搬送輥31刮取的泡不會滯留地沿著除泡構件7的平滑的表面72朝向處理室2的底面21流下。由此,防止大的泡或泡的塊由搬送輥31搬送而附著於基板S的表面Sf的情況。
Among the main surfaces of the
另外,如圖3(b)所示,相對於顯影液噴嘴4的正下方位置、更具體而言如虛線所示、為噴出口41的正下方位置且從噴出口41噴出的顯影液的流下路徑,在基板搬送方向(Y方向)上
觀察時,除泡構件7的上端71位於比所述正下方位置更靠上游側處,另一方面,下端73延伸到比所述正下方位置更靠下游側處。因此,如圖3(b)中的顯影液噴嘴4b那樣,當在正下方位置處不存在基板S時,從顯影液噴嘴4噴出的顯影液L藉由搬送路徑進一步落下,著落於作為除泡構件7的表面72的傾斜面。為了防止反彈的顯影液附著於搬送輥31,顯影液著落於除泡構件7的表面72的位置理想的是比搬送輥31的下端部更靠下方處。
In addition, as shown in FIG. 3( b ), the position directly below the
顯影液L沿著除泡構件7的表面72進一步流下,從除泡構件7的下端73落下到處理室2的底面21。當從顯影液噴嘴4噴出的顯影液直接落下到處理室2的底面21時,有可能產生顯影液的飛沫而附著於搬送輥31或基板S。另外,有可能因對滯留於處理室2的底面21的顯影液的廢液進行攪拌而產生新的泡。藉由利用除泡構件7的傾斜面接收顯影液而降低流速後,在低的位置使所述顯影液朝向底面21落下,從而能夠抑制此種飛沫或泡的產生。
The developer L further flows down along the
就此含義而言,除泡構件7的下端73優選為盡可能地延伸到靠近處理室2的底面21的位置。另外,如圖1及圖3(b)所示,藉由在除泡構件7的下端73與處理室2的底面21之間配置具有比除泡構件7的下端73附近的表面72的坡度更平緩的坡度的傾斜板23,能夠更有效地抑制飛沫或泡的產生。
In this sense, the
從搬送輥31刮取的泡以比較低的速度在除泡構件7的表面72流下,另一方面,從顯影液噴嘴4噴出的顯影液為更高的
速度且量也多。因此,關於傾斜板23,只要位於顯影液噴嘴4的正下方位置處所設的除泡構件7的下方即可,無需所有的除泡構件7均滿足此種條件。
The bubbles scraped from the
如此,本實施方式的除泡構件7除了具備去除附著於搬送輥31的周面313的泡的功能(除泡功能)以外,還具備作為接住從顯影液噴嘴4噴出的顯影液並將其安穩地引導到處理室2的底面21的“液體接收構件”的功能(液體接收功能)。這些功能均發揮下述效果、即、防止附著於搬送輥31的泡蔓延到基板S的表面Sf。由此,能夠事先避免泡附著於作為處理物件面的基板表面Sf而產生顯影不均等顯影品質的降低。
As described above, in addition to the function of removing bubbles adhering to the
再者,沿著搬送路徑排布的多個搬送輥31中的、可能產生由顯影液引起的泡的搬送輥31是設於搬送方向上比最上游側的顯影液噴嘴4a更靠下游側處。關於比顯影液噴嘴4a更靠上游側處的搬送輥31,無需設置除泡構件7。
Furthermore, among the plurality of conveying
但是,關於雖比顯影液噴嘴4a更靠上游側處但面對顯影液的流下路徑而設置的搬送輥31a,由於被供給到基板表面Sf的顯影液有可能蔓延出,另外需要接收從顯影液噴嘴4a流下的顯影液,因此,優選為與更靠下游側的搬送輥31b等同樣地設有除泡構件7。在此情況下,由於除泡構件7與搬送輥31a不接觸,因此也不會有下述擔憂、即、對搬送輥31a的旋轉造成影響、或者使搬送輥31a磨損。
However, regarding the conveying
以下,基於本申請發明者所獲得的見解,參照圖4(a)、 圖4(b)及圖5(a)~圖5(d),對用於使所述效果更可靠的各部分的尺寸關係及配置進行說明。圖4(a)、圖4(b)是表示搬送輥與除泡構件的尺寸關係的圖。另外,圖5(a)~圖5(d)是表示搬送輥與除泡構件的配置的圖。 Hereinafter, based on the findings obtained by the inventor of the present application, referring to Fig. 4(a), Figure 4(b) and Figures 5(a) to 5(d) illustrate the dimensional relationship and arrangement of each part for making the above effect more reliable. 4(a) and 4(b) are diagrams showing the dimensional relationship between the conveyance roller and the defoaming member. In addition, FIGS. 5(a) to 5(d) are views showing the arrangement of the conveyance roller and the defoaming member.
如圖4(a)所示,除泡構件7的上端71與搬送輥31的周面313隔開空隙G而不接觸地配置。為了滿足殘留附著於搬送輥31的泡不會蔓延到基板S的表面Sf這一條件,理想的是空隙G的大小小於基板S的厚度。具體而言,例如,能夠將空隙G設為1mm以下。
As shown in FIG. 4(a) , the
關於空隙G的調整,如圖2中虛線箭頭所示,能夠藉由空隙調整機構8使除泡構件7在Y方向上移動來實現。空隙調整機構8可由操作員手動操作,另外也可藉由使用馬達等致動器來自動調整所指定的空隙。
The gap G can be adjusted by moving the
再者,除泡構件7的上端71優選為被精加工成薄的刮板狀,但需要能夠防止因介隔存在於與搬送輥31之間的顯影液的表面張力而被吸引到搬送輥31側的程度的剛性。因此,關於上端71的厚度,例如也能夠設為1mm左右。關於材質,在本申請發明者的見解中,未在不銹鋼那樣的金屬板與聚酯那樣的樹脂板之間發現效果方面的非偶然的差異。
Furthermore, the
繼而,關於各部分的寬度、即X方向上的長度,如圖4(b)所示那樣。即,為了向基板S的表面Sf毫無遺漏地供給顯影液,顯影液噴嘴4的噴出口41的長度W1優選為基板S的寬度
W3以上。另外,為了沒有撓曲且穩定地搬送經覆液的基板S,搬送輥31的長度(更嚴密地說,是與基板S接觸的UPE輥312的長度)W2優選為大於基板S的寬度W3。進而,為了可靠地從搬送輥31去除泡,除泡構件7的寬度W4優選為大於搬送輥31的長度W2,且除泡構件7延伸到比搬送輥31的兩端更靠外側處。
Next, the width of each part, that is, the length in the X direction, is as shown in Fig. 4(b). That is, in order to completely supply the developer to the surface Sf of the substrate S, the length W1 of the
除泡構件7的寬度未必需要固定,但理想的是至少噴出口41的正下方位置處的寬度大於噴出口41的長度W1以便可靠地接住所噴出的顯影液,且除泡構件7延伸到比噴出口41的兩端更靠外側處。另外,為了可靠地將顯影液引導到下端73,理想的是在從所述位置至下端73之間不存在寬度減小的部分。
The width of the
除泡構件7相對於搬送輥31的配置形態如以下那樣。如圖5(a)所示,搬送輥31的周面313中的與除泡構件7的上端71最接近的位置(空隙位置)優選為從與基板S接觸的搬送輥31的頂部在旋轉方向R上觀察時的繞旋轉軸AX的角度α處於90度以上且小於180度、更優選為135度以下的範圍內。當除泡構件7的上端71位於所述範圍內時,可最順利地進行泡從搬送輥31向除泡構件7的移行。
The arrangement form of the
另外,關於除泡構件7的上端71的表面72的坡度,為如下那樣。如圖5(b)所示,優選為以如下方式規定表面72的坡度:當將由搬送輥31搬送的泡B在空隙位置處所具有的速度向量V分解為沿著除泡構件7的表面72的方向上的向量成分V1和與其正交的向量成分V2時,成分V1的大小大於成分V2的大小。
另外,若表面72的坡度過小,則從搬送輥31刮取的泡不會流落,有可能會滯留於除泡構件7的上端71附近。
In addition, the slope of the
根據這些情況,如圖5(c)所示,關於除泡構件7的上端71的表面72相對於水平面(雙點劃線)的傾斜角β,優選為在45度以上且90度以下的範圍內盡可能大。另一方面,在除泡構件7的下端73,如圖5(d)所示,關於相對於水平面的傾斜角γ,能夠設為大於0度且小於傾斜角β的值。
Based on these circumstances, as shown in FIG. 5(c) , the inclination angle β of the
如以上所述,在本實施方式中,利用除泡構件7去除附著於搬送輥31的泡中的比空隙G更高地堆積的部位。因此,能夠有效地防止附著於搬送輥31上的泡移行到基板S的表面Sf。而且,由於除泡構件7與搬送輥31不接觸地配置,因此搬送輥31不會因除泡構件7而受到損傷,能夠將基板S穩定地朝向後烘烤裝置搬送。
As described above, in this embodiment, the
另外,除泡構件7的下端73在基板搬送方向(Y方向)上超過顯影液噴嘴4(嚴密地說是噴出口41)的正下方位置而延伸到下游側。而且,在顯影液噴嘴4的正下方位置,除泡構件7的表面72成為朝向下端73而具有單調的下坡坡度的傾斜面。因此,當在顯影液噴嘴4的正下方位置處不存在基板S時,從顯影液噴嘴4噴出的顯影液由除泡構件7接住,並沿著其表面72流下而被向處理室2的底面21引導。由此,能夠抑制處理室2的底面21處的飛沫或泡的產生。
In addition, the
藉由這些結構,在本實施方式中,可防止因顯影液的起
泡而產生的泡經由搬送輥31的周面313而蔓延到基板S的表面Sf。因此,能夠事先避免由泡附著引起的顯影不均等顯影品質的降低。
With these structures, in this embodiment, it is possible to prevent
The bubbles generated by the bubbles spread to the surface Sf of the substrate S via the
再者,本發明並不限定於所述實施方式,只要不脫離其主旨,則除了所述實施方式以外還能夠進行各種變更。例如,在所述實施方式中,使一片板狀體彎曲而形成除泡構件7,因此除泡構件7的厚度固定,表面72和與其相反的一側且面對搬送輥31的一側的主表面基本上成為相同形狀。
In addition, the present invention is not limited to the above-described embodiments, and various changes other than the above-described embodiments can be made without departing from the gist of the invention. For example, in the above embodiment, since the
但是,在本發明中,雖然要求除泡構件的上端成為薄板狀的刮板,但在距離搬送輥31遠的位置沒有此種限制。因此,關於除泡構件7的剖面形狀,並不限定於所述形狀,例如,可為部分厚度不同的部位。
However, in the present invention, although the upper end of the defoaming member is required to be a thin plate-shaped scraper, there is no such restriction at a position far from the
另外,在所述實施方式中,除泡構件7的表面72呈從上端71至下端73為止連續的光滑的曲面,但例如即便表面為平面,也能夠獲得所述除泡功能及液體接收功能。在本實施方式中,藉由由在上端71坡度大且隨著朝向下端73坡度變小的那樣的曲面構成除泡構件7的表面72,從而提高下述效果:使泡從搬送輥31順利地移行到除泡構件7,另外,接住從下端73落下的顯影液並減弱其流動。再者,即便除泡構件的表面在其上端至下端之間的一部分中呈平面,也能夠獲得與所述實施方式同等的效果。
In addition, in the embodiment, the
另外,例如,在所述實施方式中,分別設於多個搬送輥31的除泡構件7的形狀均相同。由此,可使零件共通化,但在原
理上,關於上方沒有配置顯影液噴嘴4的除泡構件,液體接收功能不是必需的。根據此情況,也能夠設為以下那樣的變形例。
In addition, for example, in the above-mentioned embodiment, the
圖6是表示顯影裝置的變形例的圖。在所述變形例中,關於除泡構件以外的結構,能夠設為與圖1所示的實施方式相同。因此,對於與所述實施方式相同的結構,標注相同的符號,由此省略詳細的說明。 FIG. 6 is a diagram showing a modified example of the developing device. In the modification, the structure other than the bubble member can be the same as the embodiment shown in FIG. 1 . Therefore, the same structures as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
在圖6所示的變形例的顯影裝置1A中,在顯影液噴嘴4的正下方位置處配置有與所述實施方式的除泡構件7相同的除泡構件7A,另一方面,在上方沒有顯影液噴嘴4的位置處配置更小型的除泡構件7B。於在上方沒有顯影液噴嘴4的情況下,除泡構件7B只要具有刮取附著於搬送輥31的泡的功能就足夠了,不需要用於接住從顯影液噴嘴4流下的顯影液的功能。因此,能夠使用針對除泡功能而經特殊化的形狀的除泡構件7B。例如,藉由使其比除泡構件7A更小型,能夠減少材料的使用量。
In the developing
另外,在所述實施方式中,利用在軸311嵌入有UPE輥312的搬送輥31搬送基板S,但搬送輥31的結構並不限定於此,能夠使用以往常用的所有搬送輥。
In addition, in the above embodiment, the substrate S is transported using the
以上,如對具體的實施方式進行例示並加以說明那樣,在本發明的顯影裝置中,液體接收構件的表面也可構成為在噴嘴的正下方位置處位於比搬送輥更靠下方處。根據此種結構,從噴嘴流下的顯影液在比搬送輥更靠下方處著落於液體接收構件。因此,能夠抑制反彈的顯影液附著於搬送輥或基板。 As mentioned above, as the specific embodiments have been illustrated and described, in the developing device of the present invention, the surface of the liquid receiving member may be located directly below the nozzle and below the conveying roller. According to this structure, the developer flowing down from the nozzle lands on the liquid receiving member below the transport roller. Therefore, it is possible to suppress the rebound developer from adhering to the conveyance roller or the substrate.
另外,液體接收構件的表面也可為從上端至下端為止光滑的曲面,例如能夠設為柱面。根據此種結構,附著於液體接收構件表面的泡或顯影液被順利地引導到下端,從而防止這些滯留於液體接收構件的表面。 In addition, the surface of the liquid receiving member may be a smooth curved surface from the upper end to the lower end, and may be a cylindrical surface, for example. According to this structure, bubbles or developer attached to the surface of the liquid receiving member are smoothly guided to the lower end, thereby preventing them from remaining on the surface of the liquid receiving member.
另外,也可構成為表面的坡度從上端朝向下端單調減少。此處所述的“單調減少”是所謂的廣義上的單調減少,坡度在從上端至下端之間的一部分區間內可固定。根據此種結構,藉由表面的坡度減小而流下的顯影液的速度降低,因此能夠減少從液體接收構件的下端落下時的顯影液的反彈。 In addition, the slope of the surface may be configured such that the slope monotonically decreases from the upper end toward the lower end. The "monotonically decreasing" described here is a so-called monotonic decreasing in a broad sense, and the slope can be fixed in a part of the interval from the upper end to the lower end. According to this structure, since the velocity of the developer flowing down is reduced by reducing the slope of the surface, it is possible to reduce the rebound of the developer when it falls from the lower end of the liquid receiving member.
另外,上端的表面相對於水平面的傾斜角可為45度以上且90度以下。根據本申請發明者的見解,藉由設為此種結構,能夠使從搬送輥刮取的泡不滯留於上端部分而迅速流下。 In addition, the inclination angle of the upper end surface with respect to the horizontal plane may be 45 degrees or more and 90 degrees or less. According to the knowledge of the inventor of the present application, by having such a structure, the bubbles scraped off from the conveyance roller can be quickly flowed down without remaining in the upper end portion.
另外,液體接收構件的上端也可構成為在從搬送輥的頂部在旋轉方向上觀察時繞旋轉軸的角度為90度以上且135度以下的位置處與搬送輥的周面最接近。根據本申請發明者的見解,在設為此種結構時,泡從搬送輥向液體接收構件的移行最順利,能夠提高由液體接收構件帶來的搬送輥的除泡效果。 In addition, the upper end of the liquid receiving member may be configured to be closest to the peripheral surface of the conveying roller at a position where the angle around the rotation axis is 90 degrees or more and 135 degrees or less when viewed from the top of the conveying roller in the rotation direction. According to the findings of the present inventors, such a structure allows bubbles to move most smoothly from the transport roller to the liquid receiving member, thereby improving the defoaming effect of the transport roller by the liquid receiving member.
另外,關於沿著軸向的上端的長度,優選為搬送輥的長度以上,更優選為超過搬送輥的長度。根據此種結構,能夠在搬送輥的周面的整個區域中獲得除泡效果。 In addition, the length of the upper end along the axial direction is preferably greater than or equal to the length of the conveyor roller, and more preferably is greater than the length of the conveyor roller. According to this structure, the defoaming effect can be obtained in the entire peripheral surface of a conveyance roller.
另外,優選為在噴嘴的正下方位置處,液體接收構件相對於設於噴嘴且噴出顯影液的噴出口而延伸到軸向上的外側。根 據此種結構,能夠使從噴嘴流下的液體可靠地著落於液體接收構件。 In addition, it is preferable that the liquid receiving member extends to the outside in the axial direction with respect to the ejection port provided in the nozzle and ejecting the developer at a position directly below the nozzle. root According to this structure, the liquid flowing down from the nozzle can reliably land on the liquid receiving member.
另外,搬送輥與液體接收構件的空隙理想的是小於基板的厚度。因將液體接收構件與搬送輥不接觸地設置,因此比空隙小的泡或泡的塊不會被去除而是殘留於搬送輥的周面。但是,若基板的厚度大於此種泡的高度,則可避免泡蔓延到基板表面。 In addition, the gap between the transport roller and the liquid receiving member is preferably smaller than the thickness of the substrate. Since the liquid receiving member is provided so as not to contact the conveying roller, bubbles or lumps of bubbles smaller than the voids are not removed but remain on the peripheral surface of the conveying roller. However, if the thickness of the substrate is greater than the height of such bubbles, the bubbles can be prevented from spreading to the surface of the substrate.
另外,液體接收構件也可為從上端至下端為止呈一體的板狀體。根據此種結構,能夠使液體接收構件的表面光滑,並順利地進行泡或顯影液的流下。另外,表面形狀的調整也容易。 In addition, the liquid receiving member may be a plate-shaped body formed integrally from the upper end to the lower end. According to this structure, the surface of the liquid receiving member can be smoothed, and the bubbles or the developer can flow down smoothly. In addition, the surface shape is easy to adjust.
另外,也可進而設置使液體接收構件相對於搬送輥移動而使空隙變化的空隙調整機構。根據此種結構,可根據用途或目的來調整空隙,例如,即便在基板的厚度改變的情況下,也能夠靈活地應對。 In addition, a gap adjustment mechanism that moves the liquid receiving member relative to the conveyance roller to change the gap may be further provided. According to this structure, the gap can be adjusted according to the use or purpose. For example, even when the thickness of the substrate changes, it can be flexibly responded to.
[產業上的可利用性] [Industrial availability]
本發明能夠應用於藉由利用搬送輥搬送基板並且在表面覆液顯影液來進行顯影處理的顯影裝置,適宜作為在各種基板上藉由曝光形成圖案的製程的一部分。 The present invention can be applied to a developing device that carries out a development process by conveying a substrate using a conveying roller and coating the surface with a developer, and is suitable as a part of a process for forming patterns on various substrates by exposure.
7:除泡構件(液體接收構件) 7: Defoaming member (liquid receiving member)
8:空隙調整機構 8: Gap adjustment mechanism
31:搬送輥 31:Conveying roller
71:(除泡構件的)上端 71: (the upper end of the defoaming member)
72:(除泡構件的)表面(主表面) 72: Surface (main surface) (of the defoaming member)
73:(除泡構件的)下端 73: (The lower end of the defoaming member)
311:軸 311:Shaft
312:UPE輥 312:UPE roller
313:周面 313: Surround surface
AX:旋轉軸 AX: axis of rotation
R:方向/旋轉方向 R: direction/rotation direction
X、Y、Z:座標軸 X, Y, Z: coordinate axes
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022045095A JP7369227B2 (en) | 2022-03-22 | 2022-03-22 | developing device |
JP2022-045095 | 2022-03-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202338524A TW202338524A (en) | 2023-10-01 |
TWI834399B true TWI834399B (en) | 2024-03-01 |
Family
ID=88038005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111145350A TWI834399B (en) | 2022-03-22 | 2022-11-28 | Developing device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7369227B2 (en) |
KR (1) | KR102653152B1 (en) |
CN (1) | CN116794941B (en) |
TW (1) | TWI834399B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1501177A (en) * | 2002-11-15 | 2004-06-02 | 东京毅力科创株式会社 | Developing method and apparatus |
JP2021190499A (en) * | 2020-05-27 | 2021-12-13 | 東京エレクトロン株式会社 | Development processing device and development processing method |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3394649B2 (en) * | 1996-04-01 | 2003-04-07 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JP2004153033A (en) * | 2002-10-31 | 2004-05-27 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus |
JP2004241557A (en) * | 2003-02-05 | 2004-08-26 | Seiko Epson Corp | Apparatus and method of manufacturing semiconductor device |
JP2010186974A (en) * | 2009-02-13 | 2010-08-26 | Tokyo Electron Ltd | Liquid treatment device, liquid treatment method, and storage medium |
JP5383262B2 (en) * | 2009-03-11 | 2014-01-08 | パナソニック株式会社 | Slit coater preliminary discharge device |
JP2016167475A (en) | 2015-03-09 | 2016-09-15 | 株式会社Screenホールディングス | Substrate processing apparatus |
CN108885985B (en) * | 2016-03-22 | 2023-07-07 | 东京毅力科创株式会社 | Substrate cleaning device |
JP2022041256A (en) * | 2020-08-31 | 2022-03-11 | 株式会社Screenホールディングス | Substrate processing apparatus |
CN213634099U (en) * | 2020-11-17 | 2021-07-06 | 广东惠信浦电路有限公司 | Circuit developing machine with defoaming function |
-
2022
- 2022-03-22 JP JP2022045095A patent/JP7369227B2/en active Active
- 2022-11-21 CN CN202211453623.5A patent/CN116794941B/en active Active
- 2022-11-28 TW TW111145350A patent/TWI834399B/en active
-
2023
- 2023-01-12 KR KR1020230004554A patent/KR102653152B1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1501177A (en) * | 2002-11-15 | 2004-06-02 | 东京毅力科创株式会社 | Developing method and apparatus |
JP2021190499A (en) * | 2020-05-27 | 2021-12-13 | 東京エレクトロン株式会社 | Development processing device and development processing method |
Also Published As
Publication number | Publication date |
---|---|
KR102653152B1 (en) | 2024-04-01 |
JP7369227B2 (en) | 2023-10-25 |
KR20230137817A (en) | 2023-10-05 |
JP2023139524A (en) | 2023-10-04 |
TW202338524A (en) | 2023-10-01 |
CN116794941A (en) | 2023-09-22 |
CN116794941B (en) | 2024-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2008219043A (en) | Solution treatment apparatus and solution treatment method | |
KR100253834B1 (en) | Substrate processing apparatus | |
WO2013118550A1 (en) | Wiping pad, nozzle maintenance device using pad, and coating processing device | |
TWI546131B (en) | Substrate processing apparatus, nozzle and substrate processing method | |
TW201041066A (en) | Substrate processing apparatus | |
TWI834399B (en) | Developing device | |
KR20070093343A (en) | Substrate processing apparatus, substrate processing method and computer readable storage medium | |
TWI225676B (en) | Substrate treatment device | |
JP2002252200A (en) | System and method for processing substrate | |
KR102252536B1 (en) | Apparatus for processing substrate with developing solution | |
JP2006003036A (en) | Drying device | |
JP3957569B2 (en) | Liquid processing equipment | |
TWI809603B (en) | Substrate conveying device, developing device, and developing method | |
JP2009032868A (en) | Substrate processing apparatus | |
JP2011241038A (en) | Work conveyor roller in liquefied processing agent using processing device | |
JP7282064B2 (en) | Developing device and developing method | |
JP4153014B2 (en) | Liquid processing method | |
JP6916833B2 (en) | Coating device and coating method | |
TWI824281B (en) | Developing device and developing method | |
JPH1154891A (en) | Substrate washing device | |
JP2009008886A (en) | Developing method and developing device | |
JP2022049955A (en) | Development apparatus and development method | |
JP2003142450A (en) | Surface treatment apparatus and method therefor | |
JP2006126674A (en) | Developer applicator | |
JPH09283406A (en) | Substrate treatment device |