JPH09283406A - Substrate treatment device - Google Patents
Substrate treatment deviceInfo
- Publication number
- JPH09283406A JPH09283406A JP8976296A JP8976296A JPH09283406A JP H09283406 A JPH09283406 A JP H09283406A JP 8976296 A JP8976296 A JP 8976296A JP 8976296 A JP8976296 A JP 8976296A JP H09283406 A JPH09283406 A JP H09283406A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- liquid
- chemical
- roller
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フォトレジスト塗
布液、感光性ポリイミド樹脂、カラーフィルター用の染
色剤等からなる薄膜が主面に形成された液晶用のガラス
基板、フォトマスク用のガラス基板等を対象とし、これ
ら基板の主面に所定の処理液を供給することによって処
理する基板処理装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate for a liquid crystal, a glass substrate for a photomask, and a glass substrate for a photomask, which has a thin film made of a photoresist coating solution, a photosensitive polyimide resin, a dyeing agent for a color filter, etc. formed on its main surface. The present invention relates to a substrate processing apparatus for processing by supplying a predetermined processing liquid to the main surfaces of these substrates.
【０００２】[0002]
【従来の技術】従来、基板に薬液供給処理が施された
後、洗浄水による洗浄処理を施してから後工程に搬送す
るようにした基板処理装置が知られている。かかる基板
処理装置は、薬液処理部、水洗部および乾燥部が直列に
配設されて形成されている。これら薬液処理部、水洗部
および乾燥部を貫通するように基板の搬送手段が敷設さ
れ、基板はこの搬送手段によって基板処理装置内を薬液
処理部、水洗部および乾燥部の順に搬送されつつ処理さ
れる。2. Description of the Related Art Conventionally, there is known a substrate processing apparatus in which a substrate is subjected to a chemical solution supply process, then subjected to cleaning treatment with cleaning water, and then conveyed to a subsequent process. Such a substrate processing apparatus is formed by arranging a chemical treatment section, a water washing section and a drying section in series. A substrate transfer means is laid so as to penetrate through the chemical solution processing section, the water washing section and the drying section, and the substrate is processed while being transferred in the substrate processing apparatus in this order by the chemical solution processing section, the water washing section and the drying section. It
【０００３】そして基板は、薬液処理部においてアルカ
リ洗浄液、現像液、エッチング液あるいは剥離液等の薬
液が主面に供給されて所定の処理が施され、ついで水洗
部において水洗処理が施され、最後に乾燥部において気
体の噴射等による乾燥処理が行われるようになってい
る。Then, the substrate is subjected to a predetermined treatment by supplying a chemical solution such as an alkali cleaning solution, a developing solution, an etching solution or a stripping solution to the main surface in a chemical solution treating section, and then a water rinsing treatment in a water rinsing section. In addition, a drying process such as gas injection is performed in the drying section.
【０００４】ところで、薬液処理部で薬液による所定の
処理が施された基板は、その主面に薬液が付着した状態
になっているため、そのまま薬液処理部から水洗部に移
されると、水洗部内に薬液が持ち込まれることになり、
循環使用される洗浄水が薬液の混入によって汚染され、
洗浄性能の維持を図ることができなくなるという不都合
が生じる。By the way, the substrate which has been subjected to the predetermined treatment with the chemical liquid in the chemical liquid treatment unit has the chemical liquid adhered to the main surface thereof, and therefore when it is transferred from the chemical liquid treatment unit to the water washing unit as it is, the inside of the water washing unit The drug solution will be brought to
The cleaning water that is circulated is contaminated by the mixture of chemicals,
There is an inconvenience that the cleaning performance cannot be maintained.
【０００５】また水洗部においては、通常、第１の水洗
部と第２の水洗部とによる少なくとも２段階の水洗処理
が施され、水洗処理の完全を期すようになされている
が、薬液処理部の薬液によって汚染された状態になり易
い第１の水洗部の洗浄水が、第２の水洗部の高度に清浄
な洗浄水に混入し、汚染されるという上記同様の問題点
を有している。Further, in the water washing section, usually, at least two steps of water washing treatment are carried out by the first water washing section and the second water washing section to complete the water washing treatment. The cleaning water of the first water washing section, which is likely to be contaminated by the chemical solution of (1), mixes with the highly clean cleaning water of the second water washing section and is contaminated, which has the same problem as described above. .
【０００６】かかる不都合を解消するために、従来、薬
液処理部と水洗部との境界部分に配設されたエアーナイ
フから基板の主面に帯状の気体を吹き付け、基板の主面
が乾燥しない程度に薬液を薬液処理部内に向けて吹き飛
ばすことによって薬液の水洗部への持ち込みを防止する
ようにしていたが、近年、基板の大型化に伴い、基板が
薬液処理部と水洗部とに跨った状態で薬液と洗浄水の供
給を同時に受ける工程の重複が生じるようになり、基板
の主面を通って薬液が洗浄部に入り込んだり、逆に洗浄
水が薬液処理部に移動したりすることがあり、境界部分
で液の確実な置換が行われなくなるという問題点が発生
するようになった。In order to eliminate such inconvenience, conventionally, a band-shaped gas is blown onto the main surface of the substrate from an air knife arranged at the boundary between the chemical solution treating section and the water washing section so that the main surface of the substrate is not dried. In order to prevent the chemical solution from being brought into the water washing section by blowing the chemical solution into the chemical solution treating section, the state where the substrate straddles the chemical solution treating section and the water washing section in recent years due to the increase in size of the substrate. Therefore, the process of receiving the supply of the chemical solution and the cleaning water at the same time may occur, and the chemical solution may enter the cleaning section through the main surface of the substrate, or conversely the cleaning water may move to the chemical solution processing section. However, there is a problem that the liquid cannot be reliably replaced at the boundary.
【０００７】以上、薬液処理部と水洗部との間で起こる
問題点について述べたが、第１の水洗部と第２の水洗部
との間でも同様の問題点が発生する。The problems that occur between the chemical solution treating section and the water washing section have been described above, but similar problems also occur between the first water washing section and the second water washing section.
【０００８】かかる問題点を解消するために、薬液処理
部と第１の水洗部との間および第１の水洗部と第２の水
洗部との間に未処理搬送部を設け、この部分では基板に
いずれの処理液も供給されないようにすることが考えら
れるが、このようにすると処理槽を搬送方向に長くしな
ければならず、設備コストが嵩むという新たな問題点が
発生する。In order to solve such a problem, an untreated transfer section is provided between the chemical solution treating section and the first water washing section and between the first water washing section and the second water washing section. It is possible to prevent any processing liquid from being supplied to the substrate. However, in this case, the processing tank must be lengthened in the carrying direction, which causes a new problem that the equipment cost increases.
【０００９】一方、処理槽が長尺化することによって、
上記境界部分でエアーナイフから基板の表面に吐出され
る気体により基板の表面が薬液成分を含んだ状態で乾燥
してしまうことがあり、基板の表面が乾燥すると、その
部分にシミが生じる。そして、このシミは水洗処理によ
っても取り除くことができず、最終的に基板が乾燥処理
された後にこのシミからパーティクルが発生し、これに
よって基板の表面が再汚染されるという問題点も有して
いる。On the other hand, by making the processing tank longer,
The gas discharged from the air knife to the surface of the substrate at the boundary portion may dry the surface of the substrate containing the chemical liquid component. When the surface of the substrate is dried, stains are generated on the portion. This stain cannot be removed even by washing with water, and there is also a problem that after the substrate is finally dried, particles are generated from this stain and the surface of the substrate is re-contaminated. There is.
【００１０】そこで、近年、基板を搬送方向に直交した
面内で水平方向に対して傾斜した傾斜姿勢で搬送し、搬
送中の基板の傾斜面に薬液を供給することにより、供給
された薬液が基板の傾斜に沿って流下するようにした基
板処理装置が提案されている（特開平１−２５０９５８
号公報）。このようにすると、エアーナイフを用いなく
ても液切りが良好に行われるため、エアーナイフを用い
ない分、設備コストや運転コストが低減されるととも
に、基板主面の部分乾燥も回避される。Therefore, in recent years, a substrate is transported in an inclined posture inclined with respect to the horizontal direction in a plane orthogonal to the transport direction, and a chemical solution is supplied to the inclined surface of the substrate being transported. A substrate processing apparatus has been proposed in which the substrate is made to flow down along the inclination of the substrate (Japanese Patent Laid-Open No. 1-250958).
Issue). In this case, the liquid can be satisfactorily drained without using the air knife, so that the equipment cost and the operating cost can be reduced because the air knife is not used, and the partial drying of the main surface of the substrate can be avoided.
【００１１】[0011]
【発明が解決しようとする課題】ところで、基板を傾斜
姿勢で搬送しつつ、その主面に薬液を供給した場合、基
板の下位側端縁部に、基板搬送方向の全長に亘って表面
張力に起因して処理液が残留する、いわゆる液溜りが形
成される。そして、基板は、この液溜りが形成された状
態で水洗部に搬送されるため、水洗部への薬液の持込み
量を液溜りの量以下に抑えることができないという問題
点が存在する。By the way, when a substrate is transported in an inclined posture and a chemical solution is supplied to its main surface, the surface tension is applied to the lower edge of the substrate over the entire length in the substrate transport direction. As a result, a so-called liquid pool in which the processing liquid remains is formed. Further, since the substrate is conveyed to the water washing section in the state where the liquid pool is formed, there is a problem that the carry-in amount of the chemical solution to the water washing section cannot be suppressed to be equal to or less than the amount of the liquid pool.
【００１２】かかる問題点を解消するために、実公平７
−９１５２号公報には、水平姿勢で搬送中の基板を一旦
停止させてから傾斜姿勢に変え、停止状態で現像液を供
給するとともに、基板の下位側端縁に向けて気体を噴射
するようにし、これによって基板の下位側端縁に形成さ
れた液溜りを吹き飛ばし、ついで基板を元の水平姿勢に
戻して搬出するようにしたものが提案されている。しか
しながら、気体を噴射すると、基板の主面が部分乾燥す
るという上記のエアーナイフを採用した場合と同様の問
題点が発生し易く、基板の再汚染を効果的に防止し得な
くなる。In order to solve such a problem, the fairness 7
In Japanese Patent Laid-Open No. 9152, a substrate being conveyed in a horizontal posture is temporarily stopped and then changed to an inclined posture, a developing solution is supplied in a stopped state, and a gas is jetted toward a lower edge of the substrate. It is proposed that the liquid pool formed on the lower edge of the substrate is blown away by this, and then the substrate is returned to the original horizontal position and carried out. However, when the gas is jetted, the same problem as in the case of using the above air knife that the main surface of the substrate is partially dried easily occurs, and recontamination of the substrate cannot be effectively prevented.
【００１３】本発明は、上記のような問題点を解決する
ためになされたものであり、基板の主面の部分乾燥を抑
えた上で、搬送中の基板の下位側端縁に形成される液溜
りを確実に取り除くことが可能な基板処理装置を提供す
ることを目的としている。The present invention has been made in order to solve the above-mentioned problems, and is formed on the lower side edge of the substrate which is being transported, while suppressing partial drying of the main surface of the substrate. An object of the present invention is to provide a substrate processing apparatus capable of reliably removing a liquid pool.
【００１４】[0014]
【課題を解決するための手段】請求項１記載の発明は、
搬送方向と直交する面内で水平方向に対して傾斜した基
板載置面上を搬送される基板の主面に、処理液供給手段
から供給される処理液によって処理を施す基板処理装置
において、上記処理液供給手段の下流側であって、か
つ、上記基板載置面の表側および裏側の内の少なくとも
一方側に、搬送中の基板の下位側端縁との間に微小の隙
間が形成されるように配設された液除去部材を設けたこ
とを特徴とするものである。According to the first aspect of the present invention,
In the substrate processing apparatus, the main surface of the substrate transported on the substrate mounting surface inclined with respect to the horizontal direction in the plane orthogonal to the transport direction is processed by the processing liquid supplied from the processing liquid supply means. A minute gap is formed between the processing liquid supply means and at least one of the front side and the back side of the substrate mounting surface with the lower edge of the substrate being transported. The liquid removing member thus arranged is provided.
【００１５】この発明によれば、傾斜姿勢で搬送中の基
板に、処理液供給手段から搬送中の基板に向けて吐出さ
れた処理液は、基板の主面を処理しつつ傾斜に沿って流
下し、基板の下位側端縁に液溜りが形成されるが、この
液溜りは、基板の搬送方向への移動によって液除去部材
により取り除かれ、基板は液溜りが除去された状態で下
流側の工程に搬送されるため、処理液の下流側への持込
み量が減少する。According to the present invention, the processing liquid discharged from the processing liquid supply means toward the substrate being transferred to the substrate being transferred in the inclined posture flows down along the inclination while processing the main surface of the substrate. Then, a liquid pool is formed on the lower side edge of the substrate, but this liquid pool is removed by the liquid removing member by the movement of the substrate in the transport direction, and the substrate is placed on the downstream side with the liquid pool removed. Since it is transported to the process, the carry-in amount of the processing liquid to the downstream side is reduced.
【００１６】請求項２記載の発明は、請求項１記載の発
明において、上記液除去部材は、上記基板載置面を搬送
方向と直交する横断方向に設けられた支持軸に回転自在
に軸支された液取りローラであることを特徴とするもの
である。According to a second aspect of the present invention, in the first aspect of the present invention, the liquid removing member is rotatably supported by a support shaft provided in a transverse direction orthogonal to the transport direction on the substrate mounting surface. It is characterized in that it is a liquid taking roller.
【００１７】この発明によれば、液取りローラは支持軸
回りに回転するため、液取りローラと基板主面とが摺接
状態にはならず、従って、両者がこすれ合うことによる
基板主面の損傷が防止される。According to the present invention, since the liquid take-up roller rotates about the support shaft, the liquid take-up roller and the main surface of the substrate do not come into sliding contact with each other, and therefore the main surface of the substrate is rubbed against each other. Damage is prevented.
【００１８】請求項３記載の発明は、請求項２記載の発
明において、上記液取りローラは、基板の下位側端縁の
非有効部に当接するフランジ部を有していることを特徴
とするものである。According to a third aspect of the invention, in the second aspect of the invention, the liquid take-up roller has a flange portion that abuts an ineffective portion of the lower edge of the substrate. It is a thing.
【００１９】この発明によれば、液取りローラのフラン
ジ部を、搬送中の基板の下位側非有効部に当接させるこ
とにより、液切り部と基板主面の有効部分との隙間が一
定寸法に維持される。According to the present invention, the flange portion of the liquid take-off roller is brought into contact with the lower-side ineffective portion of the substrate being conveyed, so that the gap between the liquid draining portion and the effective portion of the main surface of the substrate is constant. Maintained at.
【００２０】請求項４記載の発明は、請求項１乃至３の
いずれかに記載の発明において、上記液除去部材は、搬
送中の基板を挟むように対向配置されていることを特徴
とするものである。According to a fourth aspect of the invention, in the invention according to any one of the first to third aspects, the liquid removing members are arranged to face each other so as to sandwich the substrate being conveyed. Is.
【００２１】この発明によれば、搬送中の基板の下位側
端縁に形成された液溜りは、基板を挟むように対向配置
された液除去部材によって基板の表裏で取り除かれる。According to the present invention, the liquid pool formed on the lower edge of the substrate being transported is removed on the front and back sides of the substrate by the liquid removing members opposed to each other so as to sandwich the substrate.
【００２２】[0022]
【発明の実施の形態】図１は、本発明に係る基板処理装
置が適用された基板処理装置群の一実施形態を示す説明
図である。基板処理装置群１は、基板の表裏面に所定の
薬液を供給して処理する薬液処理部２、この薬液処理部
２で薬洗処理の施された基板Ｂを水洗する水洗部３、お
よびこの水洗部３で水洗処理の施された基板Ｂを乾燥す
る乾燥部４が直列に上流側から順次配設されて形成され
ている。水洗部３は、第１水洗部３ａと、第２水洗部３
ｂとからなっている。1 is an explanatory diagram showing an embodiment of a substrate processing apparatus group to which a substrate processing apparatus according to the present invention is applied. The substrate processing apparatus group 1 includes a chemical liquid processing unit 2 that supplies and processes a predetermined chemical liquid on the front and back surfaces of a substrate, a water cleaning unit 3 that rinses a substrate B that has been subjected to chemical cleaning processing by the chemical liquid processing unit 2, and a A drying unit 4 for drying the substrate B that has been subjected to the water washing treatment in the water washing unit 3 is formed by being sequentially arranged in series from the upstream side. The water washing unit 3 includes a first water washing unit 3a and a second water washing unit 3a.
It consists of b and.
【００２３】薬液処理部２、第１水洗部３ａ、第２水洗
部３ｂおよび乾燥部４は、それぞれ箱型の薬液処理槽２
１、第１水洗槽３１、第２水洗槽３２および乾燥槽４１
を備えて形成されている。各槽２１，３１，３２，４１
の上流壁および下流壁には水平方向で互いに対向した基
板通過口１１が開口され、この基板通過口１１を通して
基板Ｂが各槽２１，３１，３２，４１に入出されるよう
になっている。本実施形態においては、薬液処理部２で
使用される処理液（薬液）として洗剤の混入された洗浄
液が用いられ、水洗部３における処理液として、第１水
洗部３ａでは通常の洗浄水が用いられ、第２水洗部３ｂ
では純水やイオン交換水等の高度に清浄化処理された水
が用いられている。The chemical solution treating section 2, the first water washing section 3a, the second water washing section 3b and the drying section 4 are respectively box-shaped chemical solution treating tanks 2.
1, first washing tank 31, second washing tank 32 and drying tank 41
Is formed. Each tank 21, 31, 32, 41
Substrate passing ports 11 that are opposed to each other in the horizontal direction are opened on the upstream wall and the downstream wall, and the substrate B is put into and out of the baths 21, 31, 32, 41 through the substrate passing ports 11. In the present embodiment, a cleaning liquid mixed with a detergent is used as the processing liquid (chemical liquid) used in the chemical liquid processing unit 2, and normal cleaning water is used in the first water cleaning unit 3a as the processing liquid in the water washing unit 3. The second water washing section 3b
In this, highly purified water such as pure water or ion-exchanged water is used.
【００２４】基板Ｂを各槽２１，３１，３２，４１内で
搬送する搬送手段としてはローラコンベアが適用されて
いる。このローラコンベアは、基板Ｂの搬送方向と直交
する面内で水平方向に対して傾斜した支持軸を有する搬
送ローラ５が搬送方向にほぼ等ピッチで並設配置されて
基板載置面を形成しており、図略の駆動手段の駆動によ
り同一方向に同期回転されるようになっている。従っ
て、基板Ｂの各槽２１，３１，３２，４１内における搬
送路は、搬送方向に対して全体的に幅方向に傾斜してお
り、基板Ｂはこの傾斜搬送路の基板載置面に沿って傾斜
姿勢で搬送されつつ、各槽２１，３１，３２，４１内で
所定の処理が施される。本実施形態においては、基板Ｂ
の水平面に対する傾斜角度α（図３）が略５°に設定さ
れている。A roller conveyor is used as a transfer means for transferring the substrate B in each tank 21, 31, 32, 41. In this roller conveyor, transport rollers 5 having support shafts inclined with respect to the horizontal direction in a plane orthogonal to the transport direction of the substrate B are arranged in parallel in the transport direction at substantially equal pitches to form a substrate mounting surface. The driving means (not shown) is driven to synchronously rotate in the same direction. Therefore, the transport path of the substrate B in each tank 21, 31, 32, 41 is inclined in the width direction as a whole with respect to the transport direction, and the substrate B is along the substrate mounting surface of this inclined transport path. While being conveyed in an inclined posture, predetermined processing is performed in each tank 21, 31, 32, 41. In this embodiment, the substrate B
The inclination angle α with respect to the horizontal plane (FIG. 3) is set to approximately 5 °.
【００２５】基板Ｂは、前工程から図略の上流側引継ぎ
手段を介して傾斜姿勢に姿勢変更された後、薬液処理槽
２１の上流側に配設された搬送ローラ５に移載され、つ
いで搬送ローラ５の駆動によって基板処理装置群１内に
導入され、ここで搬送ローラ５によって搬送方向（図１
の右方）に向けて搬送されつつ薬液処理槽２１内におい
て液吐出手段６からの薬液の供給による所定の薬洗処理
が施され、ついで水洗部３内において液吐出手段６や純
水供給ノズル３３等からの洗浄水の供給による水洗処理
が施され、最後の乾燥槽４１においてエアーナイフ４２
からの気体噴射供給による乾燥処理が施された後、乾燥
槽４１の直ぐ下流側に配設された図略の下流側引継ぎ手
段を介して元の水平姿勢に戻され、次工程に向けて導出
されるようになっている。なお、上記液吐出手段６は、
基板搬送方向に所定長を有するスリット状の吐出口が形
成されたものである。The substrate B is tilted from the previous step through an unillustrated upstream-side take-up means, and is then transferred to the transport roller 5 arranged upstream of the chemical treatment tank 21, and then transferred. It is introduced into the substrate processing apparatus group 1 by the driving of the carrying roller 5, and the carrying direction of the carrying roller 5 (see FIG.
While being transported toward the right side), a predetermined chemical washing treatment is performed by supplying the chemical liquid from the liquid ejection means 6 in the chemical liquid treatment tank 21, and then the liquid ejection means 6 and the pure water supply nozzle are provided in the water washing part 3. The washing process is performed by supplying washing water from 33 or the like, and the air knife 42 is placed in the last drying tank 41.
After being subjected to a drying process by gas injection supply from the above, it is returned to the original horizontal posture through a downstream side take-over means (not shown) arranged immediately downstream of the drying tank 41, and is led out to the next step. It is supposed to be done. The liquid discharging means 6 is
A slit-shaped discharge port having a predetermined length in the substrate transport direction is formed.
【００２６】本発明に係る基板処理装置１０は、本実施
形態においては上記第１水洗部３ａの一部および薬液処
理部２に適用されている。以下本発明に係る基板処理装
置１０を薬液処理部２に適用されたもので説明する。図
２は、薬液処理部２の薬液処理槽２１の一実施形態を示
す一部切欠き斜視図である。The substrate processing apparatus 10 according to the present invention is applied to a part of the first water washing section 3a and the chemical solution processing section 2 in this embodiment. Hereinafter, the substrate processing apparatus 10 according to the present invention will be described by applying it to the chemical liquid processing section 2. FIG. 2 is a partially cutaway perspective view showing an embodiment of the chemical liquid processing tank 21 of the chemical liquid processing unit 2.
【００２７】この図に示すように、薬液処理槽２１内に
は、上流側および下流側の基板通過口１１間に、同一傾
斜レベルで搬送方向（右方）に向かって５本の搬送ロー
ラ５が配設され、図略の駆動手段による各搬送ローラ５
の同一方向の同期回転によって上流側の基板通過口１１
から薬液処理槽２１内に導入された基板Ｂは、下流側の
基板通過口１１に向けて薬液処理槽２１内を搬送されつ
つ、表裏面に液吐出手段６からの薬液Ｌの供給を受けて
薬液処理され、ついで液吐出手段６の下流側に設けられ
た液取りローラ７によって下位側端縁に残留した液溜り
が除去されるようになっている。As shown in the figure, in the chemical treatment tank 21, between the upstream and downstream substrate passage ports 11, at the same inclination level, five transport rollers 5 are directed toward the transport direction (rightward). Is provided, and each transport roller 5 is driven by an unillustrated driving means.
By the synchronous rotation in the same direction of
The substrate B introduced from the inside into the chemical solution processing tank 21 is conveyed in the chemical solution processing tank 21 toward the substrate passage port 11 on the downstream side, and receives the chemical solution L from the liquid discharge means 6 on the front and back surfaces. The liquid is treated, and then the liquid collecting roller 7 provided on the downstream side of the liquid discharge means 6 removes the liquid pool remaining on the lower edge.
【００２８】上記搬送ローラ５は、薬液処理槽２１内の
側壁間に自軸心回りに回転可能に架橋されたローラ軸５
１と、このローラ軸５１の左右両側部にローラ軸５１と
共回り可能に設けられた左右一対の側部ローラ５２と、
ローラ軸５１の中央部に設けられた中央ローラ５３とか
ら形成された、いわゆる部分支持型ローラが採用されて
いる。かかる部分支持型ローラを適用することにより、
撓みを規制し得るとともに搬送ローラ５による基板Ｂ裏
面の接触域を少なくし、基板Ｂの裏面への洗浄水や気体
の供給を良好に行い得るとともに、洗浄工程や乾燥工程
での搬送ローラ５との接触による基板Ｂの裏面の汚染を
最小限に抑えることが可能になる。The carrying roller 5 is a roller shaft 5 which is bridged between side walls in the chemical solution processing tank 21 so as to be rotatable about its own axis.
1, a pair of left and right side rollers 52 provided on both left and right sides of the roller shaft 51 so as to be rotatable with the roller shaft 51,
A so-called partially supported roller formed by a central roller 53 provided in the central portion of the roller shaft 51 is used. By applying such a partially supported roller,
The flexure can be regulated, the contact area of the back surface of the substrate B by the transport roller 5 can be reduced, and cleaning water and gas can be satisfactorily supplied to the back surface of the substrate B. It is possible to minimize the contamination of the back surface of the substrate B due to the contact of the.
【００２９】上記左右の側部ローラ５２は、各々その外
方側部に側部ローラ５２と一体の鍔部５２ａを有してお
り、この鍔部５２ａによって各ローラ５２，５３上に載
置されて搬送される基板Ｂの横ずれを防止するととも
に、特に下位側の鍔部５２ａによって基板Ｂが搬送路の
傾斜面に沿って滑落するのを防止している。また、各ロ
ーラ５２，５３にはゴム等の柔軟性材料からなる緩衝材
としてのＯリング５４が外嵌されており、このＯリング
５４の滑り止め作用によって基板Ｂの搬送を確実に行い
得るようにしている。Each of the left and right side rollers 52 has a flange portion 52a integral with the side roller 52 on the outer side thereof, and is mounted on each of the rollers 52, 53 by this flange portion 52a. The lateral deviation of the substrate B being conveyed is prevented, and in particular, the lower flange 52a prevents the substrate B from sliding down along the inclined surface of the conveying path. Further, an O-ring 54 made of a flexible material such as rubber is fitted on each of the rollers 52 and 53 so that the substrate B can be reliably transported by the non-slip action of the O-ring 54. I have to.
【００３０】薬液処理槽２１内には、搬送方向の略中央
部であって、搬送ローラ５の上位側の側壁（図２では左
方の側壁）の、搬送ローラ５よりも上方に上部支持枠体
２５が設けられ、これら上部支持枠体２５間に一つの液
吐出手段６（上部液吐出手段６ａ）が取り付けられてい
る。また、上記側壁の搬送ローラ５より下方の部分に、
上記上部支持枠体２５に対向した一対の下部支持枠体２
６が、薬液処理槽２１内の基板搬送方向の中央部に設け
られた搬送ローラ５を避けるように設けられ、これら各
下部支持枠体２６に一対の液吐出手段６（下部液吐出手
段６ｂ）が取り付けられている。In the chemical treatment tank 21, the upper support frame is located on the upper side wall (the left side wall in FIG. 2) of the upper side of the transfer roller 5 at a substantially central portion in the transfer direction, above the transfer roller 5. A body 25 is provided, and one liquid ejecting means 6 (upper liquid ejecting means 6a) is attached between the upper support frame bodies 25. In addition, in the portion of the side wall below the conveying roller 5,
A pair of lower support frames 2 facing the upper support frame 25
6 are provided so as to avoid the transport rollers 5 provided in the central portion of the chemical treatment tank 21 in the substrate transport direction, and a pair of liquid ejecting means 6 (lower liquid ejecting means 6b) is provided on each of these lower support frames 26. Is attached.
【００３１】上記上部液吐出手段６ａは、基板搬送方向
に延びる吐出口が基板Ｂの上位側の表面側端縁に対向す
るように上部支持枠体２５に取り付けられているととも
に、一対の下部液吐出手段６ｂは、基板搬送方向に延び
る吐出口が基板Ｂの上位側の裏面側端縁に斜めに対向し
て吐出液が基板Ｂの下位側に向かうように各下部支持枠
体２６に取り付けられている。The upper liquid ejecting means 6a is attached to the upper support frame 25 so that the ejection port extending in the substrate carrying direction faces the upper surface side edge of the substrate B, and a pair of lower liquid ejecting means 6a. The ejection means 6b is attached to each lower support frame 26 so that the ejection port extending in the substrate transport direction diagonally faces the upper edge of the back side of the substrate B and the ejection liquid is directed to the lower side of the substrate B. ing.
【００３２】そして、基板Ｂが搬送ローラ５により薬液
処理槽２１内に導入された状態で、図２に示すように、
基板Ｂの表裏面を横断するように液吐出手段６から吐出
された薬液Ｌの液流による処理液吐出域Ａが形成される
ようにしている。Then, with the substrate B being introduced into the chemical treatment tank 21 by the transport roller 5, as shown in FIG.
The processing liquid discharge area A is formed by the liquid flow of the chemical liquid L discharged from the liquid discharge means 6 so as to cross the front and back surfaces of the substrate B.
【００３３】一方、薬液処理槽２１の近傍には上記液吐
出手段６に供給するための薬液Ｌを貯留する薬液貯留槽
２２が配設されている。この薬液貯留槽２２と上記液吐
出手段６との間に薬液管路２２ａが配設されているとと
もに、薬液処理槽２１の底部と薬液貯留槽２２の上部と
の間には薬液戻り管路２２ｂが配設され、これら薬液管
路２２ａおよび薬液戻り管路２２ｂによって薬液貯留槽
２２内の薬液Ｌを液吐出手段６を介して循環させる循環
管路が形成されている。On the other hand, in the vicinity of the chemical liquid processing tank 21, a chemical liquid storage tank 22 for storing the chemical liquid L to be supplied to the liquid discharge means 6 is arranged. A chemical liquid conduit 22a is provided between the chemical liquid storage tank 22 and the liquid discharge means 6, and a chemical liquid return conduit 22b is provided between the bottom of the chemical liquid processing tank 21 and the upper portion of the chemical liquid storage tank 22. The chemical liquid conduit 22a and the chemical liquid return conduit 22b form a circulation conduit for circulating the chemical liquid L in the chemical liquid storage tank 22 via the liquid discharge means 6.
【００３４】また、上記薬液貯留槽２２の直ぐ下流側の
薬液管路２２ａには薬液ポンプ２３が設けられていると
ともに、薬液ポンプ２３の直ぐ下流側にはフィルター２
４が設けられている。従って、薬液ポンプ２３を駆動す
ることにより、薬液貯留槽２２内の薬液Ｌは、薬液管路
２２ａを通してまずフィルター２４で清浄化され、つい
で上部液吐出手段６ａから搬送ローラ５上の傾斜姿勢の
基板Ｂ表面の上位側端縁に向けて吐出されるともに、下
部液吐出手段６ｂからは基板Ｂ裏面の上位側に向けて吐
出され、基板Ｂの傾斜に沿って流下しながら基板Ｂの表
裏面に所定の処理を施した後、基板Ｂの下位側端縁から
薬液処理槽２１の底部に落下し、薬液戻り管路２２ｂを
介して薬液貯留槽２２に戻され、以後、循環使用され
る。なお、本実施形態では、薬液Ｌに洗浄液を用いた洗
浄処理で実施しているため、基板Ｂの表裏面を洗浄する
必要があることから、基板Ｂの裏面側にも下部液吐出手
段６ｂを設けている（第１水洗部３ａの場合も同様）
が、現像液、エッチング液、剥離液等を用いる薬液処理
の場合は、基板Ｂの表面の処理だけでよいので、基板Ｂ
裏面側の下部液吐出手段６ｂは不要となる。A chemical liquid pump 23 is provided in the chemical liquid conduit 22a immediately downstream of the chemical liquid storage tank 22, and a filter 2 is provided immediately downstream of the chemical liquid pump 23.
4 are provided. Therefore, by driving the chemical liquid pump 23, the chemical liquid L in the chemical liquid storage tank 22 is first cleaned by the filter 24 through the chemical liquid pipe 22a, and then the substrate in the inclined posture on the transport roller 5 from the upper liquid discharge means 6a. The liquid is ejected toward the upper edge of the front side of B, and is ejected from the lower liquid ejecting means 6b toward the upper side of the back side of substrate B, flowing down along the inclination of substrate B to the front and back sides of substrate B. After performing a predetermined process, it drops from the lower side edge of the substrate B to the bottom of the chemical liquid processing tank 21, is returned to the chemical liquid storage tank 22 via the chemical liquid return pipe line 22b, and is thereafter circulated for reuse. In the present embodiment, since the cleaning process using the cleaning liquid as the chemical liquid L is performed, it is necessary to clean the front and back surfaces of the substrate B. Therefore, the lower liquid ejecting means 6b is also provided on the back surface side of the substrate B. Provided (same for the first water washing section 3a)
However, in the case of chemical treatment using a developing solution, an etching solution, a stripping solution, etc., only the surface treatment of the substrate B is required.
The lower liquid discharging means 6b on the back surface side is unnecessary.
【００３５】図３は、液取りローラ７の一位置実施形態
を示す一部切欠き斜視図であり、図４は、図３における
液取りローラ７のＸ線矢視図である。図３、図４および
図２に示すように、薬液処理槽２１内には、液吐出手段
６よりも下流側に各側部ローラ５２および中央ローラ５
３の上部に形成される基板載置面を挟むように、上下一
対の液取りローラ（液除去部材）７（上部液取りローラ
７ａおよび下部液取りローラ７ｂ）が設けられている。
各液取りローラ７ａ，ｂは、基板搬送方向に直交し、か
つ、基板載置面を横断するように配設された支持軸７
１、この支持軸７１回りに回転自在に軸支されたフラン
ジ部７２、およびフランジ部７２に同心で一体に延設さ
れた円筒状の液切り部７３を備えて形成されている。FIG. 3 is a partially cutaway perspective view showing an embodiment of the liquid removing roller 7 in one position, and FIG. 4 is a view of the liquid removing roller 7 in FIG. As shown in FIGS. 3, 4 and 2, each side roller 52 and the central roller 5 are located downstream of the liquid discharge means 6 in the chemical treatment tank 21.
A pair of upper and lower liquid removing rollers (liquid removing members) 7 (an upper liquid removing roller 7a and a lower liquid removing roller 7b) are provided so as to sandwich the substrate mounting surface formed on the upper part of 3.
Each of the liquid removing rollers 7a and 7b is a support shaft 7 which is arranged so as to be orthogonal to the substrate transport direction and to traverse the substrate mounting surface.
1, a flange portion 72 that is rotatably supported around the support shaft 71, and a cylindrical liquid draining portion 73 that is concentrically and integrally extended with the flange portion 72.
【００３６】そして、上部液取りローラ７ａのフランジ
部７２は、外周面が搬送中の基板Ｂの表面側の下位側端
縁に当接するとともに、下部液取りローラ７ｂは上部液
取りローラ７ａと基板搬送方向の同一位置に設けられ、
かつ、その外周面が搬送中の基板Ｂの裏面側の下位側端
縁に当接するように設置位置が設定され、各フランジ部
７２から基板搬送路の中心線方向に向けて液切り部７３
が延設されている。The outer peripheral surface of the flange portion 72 of the upper liquid removing roller 7a is in contact with the lower edge of the front side of the substrate B being conveyed, and the lower liquid removing roller 7b is connected to the upper liquid removing roller 7a and the substrate. Provided at the same position in the transport direction,
The installation position is set so that the outer peripheral surface of the substrate B is in contact with the lower edge on the back surface side of the substrate B being transported, and the liquid draining portion 73 is provided from each flange portion 72 toward the center line direction of the substrate transporting path.
Has been extended.
【００３７】また、上記各フランジ部７２は、その厚み
寸法が基板Ｂの中央部の有効部分に達しない寸法に設定
されているとともに、上記各液切り部７３は、その径寸
法がフランジ部７２の径寸法よりも小さく設定され、か
つ、基板Ｂの有効部分にまで所定寸法だけ入り込んだ状
態になっている。The thickness of each of the flange portions 72 is set so that it does not reach the effective portion of the central portion of the substrate B, and the diameter of each of the liquid draining portions 73 is the flange portion 72. Is set to be smaller than the diameter dimension of the substrate B, and a predetermined dimension is inserted into the effective portion of the substrate B.
【００３８】従って、薬液処理槽２１内において搬送ロ
ーラ５により搬送される基板Ｂは、まず、その表裏面が
各液吐出手段６ａ，６ｂから吐出される薬液Ｌによって
処理され、ついで、基板Ｂの進行により下位側の端縁が
液吐出手段６の下流側で液取りローラ７の上下のフラン
ジ部７２に挟持され、基板Ｂの下位側に残留した液溜り
が上下の液切り部７３によって除去されることになる。Therefore, the substrate B transported by the transport rollers 5 in the chemical treatment tank 21 is first treated on its front and back surfaces with the chemical L discharged from each of the liquid discharge means 6a and 6b, and then the substrate B is discharged. As it advances, the lower edge is clamped by the upper and lower flanges 72 of the liquid take-off roller 7 on the downstream side of the liquid discharge means 6, and the liquid pool remaining on the lower side of the substrate B is removed by the upper and lower liquid drainers 73. Will be.
【００３９】そして、本実施形態においては、液切り部
７３の幅方向の長さ寸法Ｓが１０〜５０ｍｍに設定され
ているとともに、基板Ｂの表裏面と、同表裏面に対向し
た液切り部７３の外周面との間の隙間寸法ｄが０．１〜
１．０ｍｍに設定され、これによって液溜りの液切り効
果を良好にしている（図４）。In this embodiment, the length dimension S of the drainage portion 73 in the width direction is set to 10 to 50 mm, and the front and back surfaces of the substrate B are opposed to the drainage portion. The gap dimension d between the outer peripheral surface of 73 is 0.1
It is set to 1.0 mm, which improves the drainage effect of the liquid pool (FIG. 4).
【００４０】液切り部７３の幅方向の長さ寸法Ｓが１０
〜５０ｍｍに設定されているのは、基板Ｂの下位側端縁
の液溜りは、端縁から基板の中心方向に向けて１０〜２
０ｍｍの範囲内に形成されるため、液切り部７３が１０
ｍｍ未満であると、液溜りを確実に除去することができ
なくなり、また、液切り部７３が５０ｍｍを越えると、
搬送中の基板または液切りローラ７の中央部が撓んだ場
合、基板Ｂの有効部分が液切り部７３に接触し、基板Ｂ
の有効部分が損傷され易くなるからである。The length dimension S of the drainage portion 73 in the width direction is 10
The liquid pool at the lower edge of the substrate B is set to ˜50 mm by 10 to 2 from the edge toward the center of the substrate.
Since it is formed within the range of 0 mm, the drainage portion 73 has 10
If it is less than mm, the liquid pool cannot be reliably removed, and if the liquid draining portion 73 exceeds 50 mm,
When the substrate being transported or the central portion of the liquid draining roller 7 is bent, the effective portion of the substrate B contacts the liquid draining portion 73,
This is because the effective part of is easily damaged.
【００４１】また、基板Ｂの表裏面と、液切り部７３の
外周面との間の隙間寸法ｄが０．１〜１．０ｍｍに設定
されるのは、隙間寸法ｄが０．１ｍｍ未満であると、高
い精度で隙間寸法を維持するのが困難になり、その結
果、液切り部７３の外周面が基板Ｂの有効部分に接触す
る場合も考えられ、そうなると基板Ｂの有効部分が損傷
するからであり、隙間寸法ｄが１．０ｍｍを越えると、
液溜りが隙間を通って外方に漏洩し良好な液切り効果が
得られなくなるからである。The gap dimension d between the front and back surfaces of the substrate B and the outer peripheral surface of the liquid draining portion 73 is set to 0.1 to 1.0 mm when the gap dimension d is less than 0.1 mm. If so, it becomes difficult to maintain the clearance dimension with high accuracy, and as a result, the outer peripheral surface of the liquid draining portion 73 may contact the effective portion of the substrate B. In that case, the effective portion of the substrate B is damaged. And when the gap dimension d exceeds 1.0 mm,
This is because the liquid pool leaks to the outside through the gap and a good liquid draining effect cannot be obtained.
【００４２】図５は、本発明の作用を説明するための液
取りローラ７の部分斜視図であり、（イ）は基板Ｂの下
位側下流端が上下の液取りローラ７の液切り部７３間に
突入する直前の状態、（ロ）は基板Ｂの下位側端縁に形
成された液溜りＬ１が除去されつつある状態、（ハ）は
基板Ｂの液溜りＬ１が除去された状態をそれぞれ示して
いる。FIG. 5 is a partial perspective view of the liquid removing roller 7 for explaining the operation of the present invention. FIG. 5A shows the liquid draining portion 73 of the liquid removing roller 7 in which the lower downstream end of the substrate B is upper and lower. Immediately before entering into the space, (B) shows a state where the liquid pool L1 formed on the lower edge of the substrate B is being removed, and (C) shows a state where the liquid pool L1 of the substrate B is removed. Shows.
【００４３】まず、搬送ローラ５の駆動により上流側
（左方）の基板通過口１１を介して薬液処理槽２１内に
導入されて基板処理域Ａに侵入した基板Ｂは、その下流
側先端部の上位側に薬液ポンプ２３（図１、図２）の駆
動で薬液管路２２ａを通して液吐出手段６の薬液吐出口
６５から吐出された薬液Ｌが供給され、基板Ｂの表裏面
を上位側から下位側に向けて薬液Ｌが流下し、これによ
って基板Ｂの表裏面が薬液処理されるとともに、処理液
吐出域Ａを通過した基板Ｂの下位側端縁には、図５の
（イ）に示すように、液溜りＬ１が形成された状態にな
っている。First, the substrate B introduced into the chemical treatment bath 21 through the substrate passage port 11 on the upstream side (left side) by driving the transport roller 5 and entering the substrate treatment area A has its downstream end portion. The chemical liquid L discharged from the chemical liquid discharge port 65 of the liquid discharge means 6 is supplied to the upper side of the substrate through the chemical liquid pipe 22a by driving the chemical liquid pump 23 (FIGS. 1 and 2), and the front and back surfaces of the substrate B are arranged from the upper side. The chemical liquid L flows down toward the lower side, whereby the front and back surfaces of the substrate B are processed by the chemical liquid, and the lower side edge of the substrate B that has passed through the processing liquid discharge area A is shown in FIG. As shown, the liquid pool L1 is formed.
【００４４】ついで、図５の（ロ）に示すように、搬送
ローラ５の駆動によって基板Ｂの下位側端縁が上下の液
取りローラ７の液切り部７３間に突入した状態では、基
板Ｂの端縁部分が上下のフランジ部７２によって挟持さ
れ、基板Ｂの進行に伴い上下のフランジ部７２を介して
上下の液切り部７３が互いに逆方向に回転しつつ、各フ
ランジ部７２および液切り部７３に当接した液溜りＬ１
が基板Ｂの下位側端縁から順次取り除かれる。Then, as shown in FIG. 5B, when the lower edge of the substrate B is projected between the liquid draining portions 73 of the upper and lower liquid removing rollers 7 by the driving of the transport roller 5, the substrate B Edge portions are sandwiched by the upper and lower flange portions 72, and the upper and lower liquid draining portions 73 rotate in opposite directions via the upper and lower flange portions 72 as the substrate B advances, Liquid pool L1 that is in contact with the portion 73
Are sequentially removed from the lower edge of the substrate B.
【００４５】そしてこの場合、上下のフランジ部７２に
よる基板Ｂの下位側端縁の挟持によって、上下の液切り
部７３の外周面と基板Ｂの表裏面との間の隙間寸法ｄ
（図４）が確実に確保された状態で液溜りＬ１が除去さ
れるため、液切り部７３の外周面が基板Ｂの有効部分に
接触することがなく、基板Ｂの損傷が確実に防止され
る。In this case, by sandwiching the lower end edges of the substrate B by the upper and lower flange portions 72, the gap dimension d between the outer peripheral surfaces of the upper and lower liquid draining portions 73 and the front and back surfaces of the substrate B.
Since the liquid pool L1 is removed in the state where (FIG. 4) is reliably ensured, the outer peripheral surface of the liquid draining portion 73 does not come into contact with the effective portion of the substrate B, and damage to the substrate B is reliably prevented. It
【００４６】そして、基板Ｂが両液取りローラ７ａ，７
ｂ間を通過した状態では、図５の（ハ）に示すように、
液溜りＬ１は完全に除去され、かつ、基板Ｂの表面には
極めて薄い薄膜状態の薬液Ｌが存在するのみの液切れ状
態になっているため、次工程である水洗部３（図１）で
の水洗処理時に薬液Ｌの洗浄水への混入量を最小限に抑
えることができるとともに、基板Ｂの表面が部分乾燥す
ることによる薬液Ｌに起因したパーティクルの発生を確
実に抑制することが可能になる。Then, the substrate B is replaced by the two liquid removing rollers 7a, 7a.
In the state of passing between b, as shown in (c) of FIG.
Since the liquid pool L1 is completely removed and the surface of the substrate B is in a liquid-runout state in which only a very thin thin film chemical liquid L is present, the water washing section 3 (FIG. 1) which is the next step is performed. It is possible to minimize the mixing amount of the chemical liquid L into the cleaning water during the water washing process, and to reliably suppress the generation of particles due to the chemical liquid L due to the partial drying of the surface of the substrate B. Become.
【００４７】本実施形態は、以上詳述したように、基板
Ｂの搬送方向と直交する面内で水平方向に対して傾斜配
置された搬送ローラ５によって薬液処理槽２１内を傾斜
姿勢で搬送するに際し、基板Ｂの上位側の端縁に液吐出
手段６からの薬液Ｌを帯状で供給するとともに、液吐出
手段６の下流側に基板Ｂの下位側端縁を挾持するように
上下一対の液取りローラ７ａ，７ｂを設け、これらの液
取りローラ７ａ，７ｂによって基板Ｂの下位側端縁に残
留した液溜りＬ１を取り除くものであるため、従来、除
去するのが困難であった上記液溜りＬ１を確実に取り除
くことができるようになる。In the present embodiment, as described in detail above, the inside of the chemical treatment tank 21 is conveyed in an inclined posture by the conveyance roller 5 which is inclined with respect to the horizontal direction in the plane orthogonal to the conveyance direction of the substrate B. At this time, the liquid chemical L from the liquid discharge means 6 is supplied in a strip shape to the upper edge of the substrate B, and a pair of upper and lower liquids are held so as to hold the lower edge of the substrate B downstream of the liquid discharge means 6. Since the collecting rollers 7a and 7b are provided and the liquid pool L1 remaining on the lower side edge of the substrate B is removed by these liquid collecting rollers 7a and 7b, it is difficult to remove the above-mentioned liquid pool. It becomes possible to reliably remove L1.
【００４８】従って、従来のように、薬液処理槽２１と
第１水洗槽３１との境界部分に、エアーナイフ等の液除
去部材を設けることなく、基板Ｂの液切り処理が確実に
行われることになり、設備コストの低減を図ることが可
能になるとともに、液取りローラ７を通過した後の基板
Ｂの表面には極めて薄い薬液Ｌの薄膜層が形成されてい
るため、基板Ｂの表面が部分的に乾燥し、これによって
パーティクルが発生する等の不都合が生じず、基板の汚
染を有効に抑制する上での効果も大きい。Therefore, unlike the conventional case, the liquid draining process of the substrate B can be surely performed without providing a liquid removing member such as an air knife at the boundary portion between the chemical liquid processing bath 21 and the first water washing bath 31. Therefore, it is possible to reduce the equipment cost, and since the thin film layer of the chemical liquid L is formed on the surface of the substrate B after passing through the liquid removing roller 7, the surface of the substrate B is Partial drying does not cause inconvenience such as generation of particles, and the effect of effectively suppressing the contamination of the substrate is large.
【００４９】本発明は、上記の実施形態に限定されるも
のではなく、以下の内容をも包含するものである。The present invention is not limited to the above-mentioned embodiment, but also includes the following contents.
【００５０】（１）上記の実施形態においては、基板処
理装置１０として薬液処理槽２１が適用されているが、
薬液処理槽２１に適用することに限定されるものではな
く、第１水洗槽３１に適用してもよい。ただし、第１水
洗槽３１に適用する場合は、薬液処理槽２１の直後で行
われる第１段階の水洗処理に適用し、循環使用する洗浄
水をその後の水洗処理の洗浄水とは別系統にするのが好
ましい。(1) In the above embodiment, the chemical liquid processing tank 21 is applied as the substrate processing apparatus 10, but
The invention is not limited to being applied to the chemical treatment tank 21, but may be applied to the first water washing tank 31. However, when it is applied to the first washing tank 31, it is applied to the first-step washing treatment performed immediately after the chemical liquid treatment tank 21, and the washing water that is circulated is separated from the washing water of the subsequent washing treatment. Preferably.
【００５１】（２）上記の実施形態においては、処理液
として基板Ｂの表面を洗浄する洗剤等を含む薬液Ｌが用
いられているが、かかる薬液Ｌに代えて、処理液は、現
像液、エッチング液、基板Ｂから薬液Ｌや現像液やエッ
チング液を洗い流す洗浄水、エッチング処理された基板
Ｂの表面に被着したレジスト膜を剥離する剥離液、ある
いは剥離液を置換するイソプロピルアルコール等の置換
液または剥離液を洗い流す純水であってもよい。(2) In the above embodiment, the chemical liquid L containing a detergent or the like for cleaning the surface of the substrate B is used as the processing liquid, but instead of the chemical liquid L, the processing liquid is a developing solution, Etching solution, cleaning water for washing away the chemical solution L, developing solution or etching solution from the substrate B, stripping solution for stripping the resist film deposited on the surface of the etched substrate B, or replacement of isopropyl alcohol for stripping the stripping solution It may be pure water for rinsing the liquid or the stripping liquid.
【００５２】（３）上記の実施形態においては、基板処
理域Ａに液吐出手段６から薬液Ｌを供給するようにして
いるが、本発明は、処理液供給手段として液吐出手段６
を用いることに限定されるものではなく、スポットノズ
ル、コーンノズル、扇状ノズル等から基板Ｂに処理液を
供給するようにしてもよい。また、液吐出手段６と、ス
ポットノズル、コーンノズル、扇状ノズル等のいずれか
とを併用してもよい。(3) In the above embodiment, the chemical liquid L is supplied to the substrate processing area A from the liquid ejecting means 6, but the present invention serves as the processing liquid supplying means.
However, the processing liquid may be supplied to the substrate B from a spot nozzle, a cone nozzle, a fan-shaped nozzle, or the like. Further, the liquid ejecting means 6 may be used in combination with any one of a spot nozzle, a cone nozzle, a fan-shaped nozzle and the like.
【００５３】（４）上記の実施形態においては、液吐出
手段６は上部液吐出手段６ａおよび下部液吐出手段６ｂ
が採用され、これら各液吐出手段６ａ，６ｂによって基
板Ｂの表裏面に処理液が供給されるようにしているが、
上部液吐出手段６ａおよび下部液吐出手段６ｂの内のい
ずれか一方のみを設け、基板Ｂの表裏面のいずれか一方
のみを処理するようにしてもよい。(4) In the above embodiment, the liquid ejecting means 6 is the upper liquid ejecting means 6a and the lower liquid ejecting means 6b.
Is adopted, and the processing liquid is supplied to the front and back surfaces of the substrate B by these liquid discharge means 6a and 6b.
It is also possible to provide only one of the upper liquid ejecting means 6a and the lower liquid ejecting means 6b and process only one of the front and back surfaces of the substrate B.
【００５４】（５）上記の実施形態においては、液取り
ローラ７は上部液取りローラ７ａおよび下部液取りロー
ラ７ｂが採用され、これら各液取りローラ７ａ，７ｂに
よって基板Ｂの表裏面に処理液が供給されるようにして
いるが、上部液取りローラ７ａおよび下部液取りローラ
７ｂの内のいずれか一方のみを設け、基板Ｂの下位側の
表裏面のいずれか一方の液溜りＬ１を除去するようにし
てもよい。(5) In the above embodiment, the liquid removing roller 7 is composed of the upper liquid removing roller 7a and the lower liquid removing roller 7b. However, only one of the upper liquid removing roller 7a and the lower liquid removing roller 7b is provided to remove the liquid pool L1 on either the lower surface or the lower surface of the substrate B. You may do it.
【００５５】（６）上記の実施形態においては、基板処
理装置群１内において搬送ローラ５により傾斜姿勢で搬
送する基板Ｂの傾斜角度は略５°に設定されているが、
本発明は基板Ｂの傾斜角度を略５°に設定することに限
定されるものではなく、基板Ｂの搬送速度、薬液Ｌの吐
出量や粘度等の要素を考慮して３°〜４０°に設定して
もよい。(6) In the above embodiment, the inclination angle of the substrate B conveyed in the inclined posture by the conveying roller 5 in the substrate processing apparatus group 1 is set to about 5 °.
The present invention is not limited to setting the inclination angle of the substrate B to approximately 5 °, but may be set to 3 ° to 40 ° in consideration of factors such as the transport speed of the substrate B, the discharge amount of the chemical liquid L, and the viscosity. You may set it.
【００５６】（７）上記の実施形態においては、液除去
部材として液取りローラ７が採用されているが、液取り
ローラ７に代えて液切り板を基板載置面を横断する方向
に延びるように設け、この液切り板の先端部が搬送中の
基板の下位側端縁に対し僅かな隙間で対向するように位
置設定してもよい。また、液切り板に代えて液切りロッ
ドを設けてもよい。(7) In the above embodiment, the liquid removing roller 7 is used as the liquid removing member, but instead of the liquid removing roller 7, a liquid draining plate extends in a direction crossing the substrate mounting surface. The liquid draining plate may be provided at a position such that the front end portion of the draining plate faces the lower edge of the substrate being conveyed with a slight gap. Further, a draining rod may be provided instead of the draining plate.
【００５７】（８）上記に実施形態においては、液取り
ローラ７のフランジ部７２と液切り部７３とは一体に接
続され、液切り部７３はフランジ部７２に共回りするよ
うにしているが、こうする代わりに、フランジ部７２と
液切り部７３とを分離し、液切り部７３を支持軸７１に
遊嵌することによって支持軸７１回りに回転自在にして
もよい。こうすることによって、搬送中の基板の端縁に
外周面が当接したフランジ部７２が基板の進行によって
回転しても、液切り部７３を共回りしないようにするこ
とができ、これによって、液切り部７３が基板上の処理
液を基板Ｂの下流側に押し出すようには回転しなくなる
ため、基板下流側への処理液の漏洩がより確実に防止さ
れる。(8) In the above embodiment, the flange portion 72 and the liquid draining portion 73 of the liquid removing roller 7 are integrally connected, and the liquid draining portion 73 rotates together with the flange portion 72. Alternatively, the flange portion 72 and the liquid draining portion 73 may be separated, and the liquid draining portion 73 may be freely fitted around the support shaft 71 so as to be rotatable around the support shaft 71. By doing so, even if the flange portion 72 whose outer peripheral surface is in contact with the end edge of the substrate being transported is rotated by the progress of the substrate, it is possible to prevent the liquid draining portion 73 from rotating together. Since the liquid draining unit 73 does not rotate so as to push the processing liquid on the substrate to the downstream side of the substrate B, leakage of the processing liquid to the downstream side of the substrate is more reliably prevented.
【００５８】（９）上記の実施形態においては、液取り
ローラ７は、基板Ｂの搬送方向と直交するように設けら
れているが、こうする代わりに、液取りローラ７を液取
りローラ７に当接した液溜りＬ１が基板Ｂの下位側端縁
から外れる方向に誘導するように傾斜させてもよい。(9) In the above-mentioned embodiment, the liquid removing roller 7 is provided so as to be orthogonal to the substrate B transport direction, but instead of this, the liquid removing roller 7 is replaced by the liquid removing roller 7. The contacting liquid pool L1 may be inclined so as to guide it in a direction away from the lower edge of the substrate B.
【００５９】[0059]
【発明の効果】請求項１記載の発明によれば、処理液供
給手段の下流側であって、かつ、上記基板載置面の表側
および裏側の内の少なくとも一方側に、傾斜姿勢で搬送
中の基板の下位側端縁との間に微小の隙間が形成される
ように対向した液除去部材を設け、この液除去部材によ
って基板の下位側端縁に流下して形成した液溜りを除去
するようにしており、上記液溜りは、基板の搬送による
搬送方向への移動によって液除去部材に当接して取り除
かれて下流側の工程に搬送されるため、基板に伴った処
理液の下流側工程への持込み量を確実に減少させること
が可能になる。According to the first aspect of the present invention, it is being conveyed in a tilted posture on the downstream side of the processing liquid supply means and on at least one of the front side and the back side of the substrate mounting surface. A liquid removing member is provided so as to form a minute gap between the substrate and the lower edge of the substrate, and the liquid removing member removes the liquid pool formed by flowing down to the lower edge of the substrate. Since the liquid pool contacts the liquid removing member and is removed by the movement of the substrate in the transport direction by the transport of the substrate and is transported to the downstream process, the downstream process of the processing liquid accompanying the substrate is performed. It is possible to reliably reduce the carry-in amount.
【００６０】従って、従来のように下流側の処理装置と
の間にエアーナイフ等の液除去部材を設ける必要はなく
なり、その分、設備コストの低減を図ることができると
ともに、基板の主面に薄膜状態で処理液が残留すること
により基板主面の乾燥が抑制され、基板主面が部分的に
乾燥することによるパーティクルの発生を確実に防止す
ることができ、その結果パーティクルに起因した基板の
再汚染を確実に防止することができる。Therefore, there is no need to provide a liquid removing member such as an air knife between the processing apparatus on the downstream side as in the conventional case, and the equipment cost can be reduced accordingly, and the main surface of the substrate can be reduced. Drying of the substrate main surface is suppressed by the treatment liquid remaining in a thin film state, and it is possible to reliably prevent generation of particles due to partial drying of the substrate main surface. Recontamination can be reliably prevented.
【００６１】請求項２記載の発明によれば、液除去部材
として支持軸回りに回転自在に軸支された液取りローラ
を用いているため、液取りローラは支持軸回りに回転
し、液取りローラと基板主面とが摺接状態にはならず、
従って、両者がこすれ合うことによる基板主面の損傷を
防止することができる。According to the second aspect of the invention, since the liquid removing roller rotatably supported about the support shaft is used as the liquid removing member, the liquid removing roller rotates about the support shaft to remove the liquid. The roller does not come into sliding contact with the main surface of the substrate,
Therefore, it is possible to prevent damage to the main surface of the substrate due to the rubbing of both.
【００６２】請求項３記載の発明によれば、液取りロー
ラは、基板の下位側端縁の非有効部に当接するフランジ
部を有しているため、液取りローラのフランジ部を、搬
送中の基板の下位側端縁部に当接させることにより、液
切り部と基板主面の有効部分との隙間寸法が一定寸法に
維持され、液取りローラの外周面が基板の有効部分に接
触することはなく、基板の損傷を確実に防止する上での
効果は大きい。According to the third aspect of the present invention, since the liquid removing roller has the flange portion that comes into contact with the ineffective portion of the lower edge of the substrate, the flange portion of the liquid removing roller is being conveyed. By contacting the lower edge of the substrate, the gap between the liquid draining portion and the effective portion of the main surface of the substrate is maintained at a constant dimension, and the outer peripheral surface of the liquid removing roller contacts the effective portion of the substrate. In that case, the effect of surely preventing the damage of the substrate is great.
【００６３】請求項４記載の発明によれば、液除去部材
は、搬送中の基板を挟むように対向配置されているた
め、搬送中の基板の下位側端縁に形成された液溜りが、
上記対向配置された液除去部材によって基板の表裏で取
り除かれ、処理液の次工程への持込み量をさらに少なく
することができる。According to the fourth aspect of the present invention, since the liquid removing members are arranged so as to sandwich the substrate being conveyed, the liquid pool formed at the lower edge of the substrate being conveyed is
By the liquid removing members arranged facing each other, the liquid can be removed from the front and back of the substrate, and the amount of the processing liquid carried into the next step can be further reduced.
【図１】本発明に係る基板処理装置が適用された基板処
理装置群の一実施形態を示す説明図である。FIG. 1 is an explanatory diagram showing an embodiment of a substrate processing apparatus group to which a substrate processing apparatus according to the present invention is applied.
【図２】薬液処理槽の一実施形態を示す一部切欠き斜視
図である。FIG. 2 is a partially cutaway perspective view showing an embodiment of a chemical liquid processing tank.
【図３】液取りローラの一実施形態を示す一部切欠き斜
視図である。FIG. 3 is a partially cutaway perspective view showing an embodiment of a liquid removal roller.
【図４】図３における液取りローラのＸ線矢視図であ
る。FIG. 4 is an X-ray arrow view of the liquid removal roller in FIG.
【図５】（イ）〜（ハ）は、本発明の作用を説明するた
めの液取りローラの部分斜視図である。FIGS. 5A to 5C are partial perspective views of the liquid take-up roller for explaining the operation of the present invention.
１ 基板処理装置群 １０ 基板処理装置 １１ 基板通過口 ２ 薬液処理部 ２１ 薬液処理槽 ２２ 薬液貯留槽 ２２ａ 薬液管路 ２２ｂ 薬液戻り管路 ２３ 薬液ポンプ ２４ フィルター ３ 水洗部 ３ａ 第１水洗部 ３ｂ 第２水洗部 ３１ 第１水洗槽 ３２ 第２水洗槽 ３３ 純水供給ノズル ４ 乾燥部 ４１ 乾燥槽 ４２ エアーナイフ ５ 搬送ローラ ５１ ローラ軸 ５２ 側部ローラ ５２ａ 鍔部 ５３ 中央ローラ ５４ Ｏリング ６ 液吐出手段（処理液供給手段） ６ａ 上部液吐出手段 ６ｂ 下部液吐出手段 ７ 液取りローラ ７ａ 上部液取りローラ ７ｂ 下部液取りローラ ７１ 支持軸 ７２ フランジ部 ７３ 液切り部 Ａ 処理液吐出域 Ｂ 基板 1 Substrate Processing Device Group 10 Substrate Processing Device 11 Substrate Passage Port 2 Chemical Solution Processing Section 21 Chemical Solution Processing Tank 22 Chemical Solution Storage Tank 22a Chemical Solution Pipeline 22b Chemical Solution Return Pipeline 23 Chemical Solution Pump 24 Filter 3 Water Washing Section 3a First Water Washing Section 3b Second Water washing section 31 First water washing tank 32 Second water washing tank 33 Pure water supply nozzle 4 Drying section 41 Drying tank 42 Air knife 5 Conveying roller 51 Roller shaft 52 Side roller 52a Collar section 53 Central roller 54 O-ring 6 Liquid discharging means ( Processing liquid supply means) 6a Upper liquid discharging means 6b Lower liquid discharging means 7 Liquid collecting roller 7a Upper liquid collecting roller 7b Lower liquid collecting roller 71 Support shaft 72 Flange portion 73 Liquid draining area A Processing liquid discharging area B Substrate
Claims (4)
して傾斜した基板載置面上を搬送される基板の主面に、
処理液供給手段から供給される処理液によって処理を施
す基板処理装置において、 上記処理液供給手段の下流側であって、かつ、上記基板
載置面の表側および裏側の内の少なくとも一方側に、搬
送中の基板の下位側端縁との間に微小の隙間が形成され
るように配設された液除去部材を設けたことを特徴とす
る基板処理装置。1. A main surface of a substrate to be transported on a substrate mounting surface inclined with respect to a horizontal direction in a plane orthogonal to the transport direction,
In a substrate processing apparatus that performs processing with a processing liquid supplied from a processing liquid supply means, on the downstream side of the processing liquid supply means, and on at least one of the front side and the back side of the substrate mounting surface, A substrate processing apparatus comprising a liquid removing member arranged so that a minute gap is formed between the substrate and a lower edge of the substrate being transported.
送方向と直交する横断方向に設けられた支持軸に回転自
在に軸支された液取りローラであることを特徴とする請
求項１記載の基板処理装置。2. The liquid removing member is a liquid removing roller rotatably supported by a support shaft provided on the substrate mounting surface in a transverse direction orthogonal to the transport direction. 1. The substrate processing apparatus according to 1.
の非有効部に当接するフランジ部を有していることを特
徴とする請求項２記載の基板処理装置。3. The substrate processing apparatus according to claim 2, wherein the liquid take-up roller has a flange portion that abuts an ineffective portion of a lower edge of the substrate.
ように対向配置されていることを特徴とする請求項１乃
至３のいずれかに記載の基板処理装置。4. The substrate processing apparatus according to claim 1, wherein the liquid removing members are arranged so as to face each other so as to sandwich the substrate being conveyed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08976296A JP3666983B2 (en) | 1996-04-11 | 1996-04-11 | Substrate processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08976296A JP3666983B2 (en) | 1996-04-11 | 1996-04-11 | Substrate processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09283406A true JPH09283406A (en) | 1997-10-31 |
| JP3666983B2 JP3666983B2 (en) | 2005-06-29 |
Family
ID=13979731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08976296A Expired - Fee Related JP3666983B2 (en) | 1996-04-11 | 1996-04-11 | Substrate processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3666983B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11202473A (en) * | 1998-01-16 | 1999-07-30 | Dainippon Printing Co Ltd | Mask preparation device |
-
1996
- 1996-04-11 JP JP08976296A patent/JP3666983B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11202473A (en) * | 1998-01-16 | 1999-07-30 | Dainippon Printing Co Ltd | Mask preparation device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3666983B2 (en) | 2005-06-29 |
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