TWI832234B - Electronic device having antenna feed module - Google Patents
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- TWI832234B TWI832234B TW111117250A TW111117250A TWI832234B TW I832234 B TWI832234 B TW I832234B TW 111117250 A TW111117250 A TW 111117250A TW 111117250 A TW111117250 A TW 111117250A TW I832234 B TWI832234 B TW I832234B
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 239
- 239000002184 metal Substances 0.000 claims abstract description 239
- 230000008878 coupling Effects 0.000 claims description 378
- 238000010168 coupling process Methods 0.000 claims description 378
- 238000005859 coupling reaction Methods 0.000 claims description 378
- 238000010586 diagram Methods 0.000 description 69
- 239000010410 layer Substances 0.000 description 48
- 238000004891 communication Methods 0.000 description 38
- 238000005516 engineering process Methods 0.000 description 35
- 239000004020 conductor Substances 0.000 description 19
- 230000005855 radiation Effects 0.000 description 16
- 230000005540 biological transmission Effects 0.000 description 13
- 230000001808 coupling effect Effects 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000002955 isolation Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000004308 accommodation Effects 0.000 description 4
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000010295 mobile communication Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000002023 wood Substances 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052774 Proactinium Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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Abstract
Description
本申請涉及通訊技術領域，尤其涉及天線饋入耦合模組及電子裝置。 This application relates to the field of communication technology, and in particular to antenna feed coupling modules and electronic devices.
隨著無線通訊技術之進步，行動電話、個人數位助理等電子裝置不斷朝向功能多樣化、輕薄化、以及資料傳輸更快、更有效率等趨勢發展。然而其相對可容納天線之空間亦就越來越小，且隨著無線通訊技術之不斷發展，天線之頻寬需求不斷增加。因此，如何於有限之空間內設計出具有較寬頻寬及較佳效率之天線，係天線設計面臨之一項重要課題。 With the advancement of wireless communication technology, electronic devices such as mobile phones and personal digital assistants continue to develop towards trends such as diversified functions, thinness and lightness, and faster and more efficient data transmission. However, the space that can accommodate the antenna is getting smaller and smaller, and with the continuous development of wireless communication technology, the bandwidth requirement of the antenna continues to increase. Therefore, how to design an antenna with wider bandwidth and better efficiency in a limited space is an important issue faced by antenna design.
本申請提供一種具有天線饋入模組的電子裝置，天線饋入模組可設置於電子裝置內的多个位置，且與金屬輻射體配合，進而涵蓋多個頻段，以提升頻寬並兼具最佳天線效率。 The present application provides an electronic device with an antenna feed module. The antenna feed module can be installed at multiple locations in the electronic device and cooperates with a metal radiator to cover multiple frequency bands to increase bandwidth and have both Optimal antenna efficiency.
一種具有天線饋入模組的電子裝置，包括金屬邊框、中框及至少一天線饋入模組；金屬邊框包括依次連接的頂部金屬邊框、第一金屬側邊框、底部金屬邊框及第二金屬側邊框；第一金屬側邊框、所述第二金屬側邊框與所述中框間隔設置並形成狹縫；至少一天線饋入模組設置於所述狹縫中。 An electronic device with an antenna feed module, including a metal frame, a middle frame and at least one antenna feed module; the metal frame includes a top metal frame, a first metal side frame, a bottom metal frame and a second metal side connected in sequence Frame; the first metal side frame, the second metal side frame and the middle frame are spaced apart and form slits; at least one antenna feed module is disposed in the slits.
上述具有天線饋入模組的電子裝置可激發出多個輻射模態，進而涵蓋多個頻段，以提升頻寬並兼具最佳天線效率。 The above-mentioned electronic device with an antenna feed module can excite multiple radiation modes, thereby covering multiple frequency bands, so as to increase the bandwidth and achieve optimal antenna efficiency.
100:天線饋入耦合模組 100: Antenna feed coupling module
400:微型化天線饋入模組 400: Miniaturized antenna feed module
600:天線饋入模組 600: Antenna feed module
601:第一天線饋入模組 601: First antenna feed module
602:第二天線饋入模組 602: Second antenna feed module
603:第三天線饋入模組 603:Third antenna feed module
604:第四天線饋入模組 604: The fourth antenna feed module
605:第五天線饋入模組 605: The fifth antenna feed module
11、411:基體 11. 411: matrix
111、4111:第一表面 111, 4111: first surface
112、4112:第二表面 112, 4112: Second surface
113:穿孔、過孔 113: Perforation, via hole
Patch:耦合饋入單元 Patch: Coupling feed unit
Patch 1、Patch 41:第一耦合饋入單元 Patch 1, Patch 41: First coupling feed unit
Patch 2、Patch 42:第二耦合饋入單元 Patch 2, Patch 42: Second coupling feed unit
Patch 43:第三耦合饋入單元 Patch 43: Third coupling feed unit
Pa、Pb:路徑 Pa, Pb: path
121、41211、41212、41213:訊號饋電點 121, 41211, 41212, 41213: signal feed point
port1:第一訊號饋電點 port1: the first signal feed point
port2:第二訊號饋電點 port2: the second signal feed point
port3:第三訊號饋電點 port3: The third signal feed point
4122:切槽 4122: Grooving
13、413:主動電路 13. 413: Active circuit
131、4131:切換開關 131, 4131: Switch
132、4132:第一可調元件 132, 4132: first adjustable element
133、4133:第二可調元件 133, 4133: Second adjustable element
134、4134:第三可調元件 134, 4134: The third adjustable component
14、414:連接器 14. 414: Connector
7311:輻射體 7311:radiator
300、500、700:電子裝置 300, 500, 700: Electronic devices
303:電池 303:Battery
304、5304、7304:金屬邊框 304, 5304, 7304: metal frame
73041:頂部金屬邊框 73041:Top metal frame
73042:第一金屬側邊框 73042: The first metal side frame
73043:底部金屬邊框 73043: Bottom metal frame
73044:第二金屬側邊框 73044: Second metal side frame
305、5305:背板 305, 5305: Backplane
306、5306、7306:接地面 306, 5306, 7306: Ground plane
307、5307、7307:中框 307, 5307, 7307: middle frame
308:容置空間 308: Accommodation space
309、5309:狹縫 309, 5309: slit
5310、7310:縫隙 5310, 7310: gap
311:第一縫隙 311:The first gap
312:第二縫隙 312: The second gap
313、5313:第一部分 313, 5313: Part One
314、5314:第二部分 314, 5314: Part 2
315:第三部分 315:Part 3
316:接地點 316:Grounding point
151、4151:第一匹配單元 151, 4151: first matching unit
152、4152:第二匹配單元 152, 4152: Second matching unit
153、4153:第三匹配單元 153, 4153: The third matching unit
161、4161:第一饋入源 161, 4161: first feed source
162、4162:第二饋入源 162, 4162: Second feed source
163、4163:第三饋入源 163, 4163: Third feed source
P1、P2、P3、P4、P5:位置 P1, P2, P3, P4, P5: position
Ant#0、Ant#1、Ant#2、Ant#4:非模組天線 Ant#0, Ant#1, Ant#2, Ant#4: non-modular antenna
Ant#3、Ant#5、Ant#6:模組天線 Ant#3, Ant#5, Ant#6: Module antenna
圖1為本申請第一實施例提供之天線饋入耦合模組之示意圖；圖2為圖1所示天線饋入耦合模組於另一角度下之示意圖；圖3A至圖3C為本申請第一實施例提供之天線饋入耦合模組另一角度之示意圖；圖4為本申請第一實施例提供之天線饋入耦合模組設置於電子裝置的金屬邊框一側之示意圖；圖5為圖4所示天線饋入耦合模組與金屬邊框於另一角度下之示意圖；圖6為本申請第一實施例提供之天線饋入耦合模組應用至電子裝置之示意圖；圖7為圖6所示天線饋入耦合模組中主動電路之電路連接示意圖；圖8為圖6所示天線饋入耦合模組之電流路徑示意圖；圖9A至圖9C為圖3A至圖3C所示之天線饋入耦合模組之S參數(散射參數)曲線圖；圖10A至圖10C為圖3A至圖3C所示之天線饋入耦合模組之效率曲線圖；圖11為本申請第二實施例提供之微型化天線饋入模組之示意圖；圖12為圖11所示微型化天線饋入模組於另一角度下之示意圖；圖13A及圖13B為本申請第二實施例提供之微型化天線饋入模組另一角度之示意圖；圖14A至圖14C為本申請第二實施例提供之另一種微型化天線饋入模組之示意圖； 圖15A至圖15C為本申請第二實施例提供之另一種微型化天線饋入模組之示意圖；圖16A至圖16C為本申請第二實施例提供之另一種微型化天線饋入模組之示意圖；圖17為本申請第二實施例之微型化天線饋入模組與金屬邊框於另一角度下之示意圖；圖18為本申請第二實施例提供之微型化天線饋入模組應用至電子裝置之示意圖；圖19為圖18所示微型化天線饋入模組中主動電路之電路連接示意圖；圖20為圖13A至圖13B所示微型化天線饋入模組之S參數(散射參數)曲線圖；圖21為圖13A至圖13B所示微型化天線饋入模組之效率曲線圖；圖22A及圖22B為圖14A、圖15A及圖16A所示微型化天線饋入模組之S參數(散射參數)曲線圖；圖23A及圖23B為圖14A、圖15A及圖16A所示微型化天線饋入模組之效率曲線圖；圖24為本申請第三實施例提供之電子裝置之示意圖；圖25為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P1時之S參數(散射參數)曲線圖；圖26為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P1時之效率曲線圖；圖27A至圖27E為本申請第三實施例提供之電子裝置的天線饋入模組設置 為位置P1時之3D增益圖；圖28為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P2時之S參數(散射參數)曲線圖；圖29為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P2時之效率曲線圖；圖30A至圖30E為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P2時之3D增益圖；圖31為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P3時之S參數(散射參數)曲線圖；圖32為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P3時之效率曲線圖；圖33A至圖33E為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P3時之3D增益圖；圖34為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P4時之S參數(散射參數)曲線圖；圖35為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P4時之效率曲線圖；圖36A至圖36E為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P4時之3D增益圖；圖37為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P5時之S參數(散射參數)曲線圖；圖38為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P5 時之效率曲線圖；圖39A至圖39E為本申請第三實施例提供之電子裝置的天線饋入模組設置為位置P5時之3D增益圖；圖40為本申請第三實施例提供之另一種具有天線饋入模組的電子裝置之示意圖；圖41A為本申請第三實施例提供之另一種電子裝置的下天線之S參數(散射參數)曲線圖；圖41B為本申請第三實施例提供之另一種電子裝置的下天線之效率曲線圖；圖41C為本申請第三實施例提供之另一種電子裝置的下天線與鄰近輻射體之隔離度曲線圖；圖42A為本申請第三實施例提供之另一種電子裝置的上天線之S參數(散射參數)曲線圖；圖42B為本申請第三實施例提供之另一種電子裝置的上天線之效率曲線圖；圖42C為本申請第三實施例提供之另一種電子裝置的上天線與鄰近輻射體之隔離度曲線圖。 FIG. 1 is a schematic diagram of the antenna feed coupling module provided by the first embodiment of the present application; FIG. 2 is a schematic diagram of the antenna feed coupling module shown in FIG. 1 from another angle; FIGS. 3A to 3C are the third embodiment of the present application. A schematic diagram of the antenna feed coupling module provided by one embodiment from another angle; Figure 4 is a schematic diagram of the antenna feed coupling module provided by the first embodiment of the present application, which is disposed on one side of the metal frame of an electronic device; Figure 5 is a diagram 4 is a schematic diagram of the antenna feed coupling module and the metal frame from another angle; Figure 6 is a schematic diagram of the antenna feed coupling module provided by the first embodiment of the present application applied to an electronic device; Figure 7 is a schematic diagram of the antenna feed coupling module shown in Figure 6 shows the circuit connection diagram of the active circuit in the antenna feed coupling module; Figure 8 is a schematic current path diagram of the antenna feed coupling module shown in Figure 6; Figures 9A to 9C show the antenna feed shown in Figures 3A to 3C The S-parameter (scattering parameter) curve of the coupling module; Figures 10A to 10C are efficiency curves of the antenna feeding into the coupling module shown in Figures 3A to 3C; Figure 11 is a microstructure provided by the second embodiment of the present application A schematic diagram of the miniaturized antenna feed module; Figure 12 is a schematic diagram of the miniaturized antenna feed module shown in Figure 11 from another angle; Figures 13A and 13B are the miniaturized antenna feed provided by the second embodiment of the present application A schematic diagram of the module from another angle; Figures 14A to 14C are schematic diagrams of another miniaturized antenna feed module provided by the second embodiment of the present application; 15A to 15C are schematic diagrams of another miniaturized antenna feed module provided by the second embodiment of the present application; FIGS. 16A to 16C are schematic diagrams of another miniaturized antenna feed module provided by the second embodiment of the present application. Schematic diagram; Figure 17 is a schematic diagram of the miniaturized antenna feed module and the metal frame in the second embodiment of the present application from another angle; Figure 18 is the application of the miniaturized antenna feed module provided by the second embodiment of the present application to Schematic diagram of the electronic device; Figure 19 is a circuit connection schematic diagram of the active circuit in the miniaturized antenna feed module shown in Figure 18; Figure 20 is the S parameter (scattering parameter) of the miniaturized antenna feed module shown in Figures 13A to 13B ) curve; Figure 21 is the efficiency curve of the miniaturized antenna feed module shown in Figures 13A to 13B; Figures 22A and 22B are the efficiency curves of the miniaturized antenna feed module shown in Figure 14A, Figure 15A and Figure 16A S parameter (scattering parameter) curve diagram; Figures 23A and 23B are efficiency curve diagrams of the miniaturized antenna feed module shown in Figure 14A, Figure 15A and Figure 16A; Figure 24 is an electronic device provided by the third embodiment of the present application schematic diagram; Figure 25 is an S parameter (scattering parameter) curve diagram when the antenna feed module of the electronic device provided by the third embodiment of the present application is set to position P1; Figure 26 is an electronic device provided by the third embodiment of the present application The efficiency curve when the antenna feed module is set to position P1; Figures 27A to 27E show the antenna feed module settings of the electronic device provided by the third embodiment of the present application is the 3D gain diagram at the position P1; Figure 28 is the S parameter (scattering parameter) curve diagram when the antenna feed module of the electronic device provided by the third embodiment of the present application is set to the position P2; Figure 29 is the third embodiment of the present application. The efficiency curve when the antenna feed module of the electronic device provided by the embodiment is set to position P2; Figures 30A to 30E show the efficiency curve when the antenna feed module of the electronic device provided by the third embodiment of the present application is set to position P2. 3D gain diagram; Figure 31 is an S parameter (scattering parameter) curve diagram when the antenna feed module of the electronic device provided by the third embodiment of the present application is set to position P3; Figure 32 is an electronic device provided by the third embodiment of the present application. The efficiency curve when the antenna feed module of the device is set to position P3; Figures 33A to 33E are 3D gain graphs when the antenna feed module of the electronic device provided by the third embodiment of the present application is set to position P3; Figures 34 is an S parameter (scattering parameter) curve diagram when the antenna feed module of the electronic device provided by the third embodiment of the present application is set to position P4; Figure 35 is the antenna feed of the electronic device provided by the third embodiment of the present application. The efficiency curve when the module is set to position P4; Figures 36A to 36E are 3D gain diagrams when the antenna feed module of the electronic device provided by the third embodiment of the present application is set to position P4; Figure 37 is the third embodiment of the present application. The S parameter (scattering parameter) curve when the antenna feed module of the electronic device provided by the third embodiment of the present application is set to position P5; Figure 38 shows the antenna feed module of the electronic device provided by the third embodiment of the present application is set to the position P5 P5 Efficiency curve diagram when; Figures 39A to 39E are 3D gain diagrams when the antenna feed module of the electronic device provided by the third embodiment of the present application is set to position P5; Figure 40 is another diagram provided by the third embodiment of the present application. A schematic diagram of an electronic device with an antenna feed module; Figure 41A is an S parameter (scattering parameter) curve diagram of the lower antenna of another electronic device provided in the third embodiment of the present application; Figure 41B is a third embodiment of the present application The efficiency curve of the lower antenna of another electronic device is provided; FIG. 41C is the isolation curve of the lower antenna and the adjacent radiator of another electronic device provided by the third embodiment of the present application; FIG. 42A is the third embodiment of the present application. The S parameter (scattering parameter) curve of an upper antenna of another electronic device is provided in the example; Figure 42B is an efficiency curve of the upper antenna of another electronic device provided by the third embodiment of the present application; Figure 42C is the efficiency curve of the upper antenna of another electronic device provided by the third embodiment of the present application; Figure 42C is a third embodiment of the present application. The embodiment provides a curve diagram of the isolation between the upper antenna and the adjacent radiator of another electronic device.
為使本申請實施例之目的、技術方案與優點更加清楚，下面將結合本申請實施例中之附圖，對本申請實施例中之技術方案進行清楚、完整地描述，顯然，所描述之實施例係本申請一部分實施例，而不係全部之實施例。基 於本申請中之實施例，所屬領域具有通常知識者於沒有做出創造性勞動前提下所獲得之所有其他實施例，均屬於本申請保護之範圍。 In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments These are part of the embodiments of the present application, but not all of them. base As for the embodiments in this application, all other embodiments obtained by those with ordinary knowledge in the art without any creative efforts shall fall within the scope of protection of this application.
需要說明的是，本申請實施例中“至少一個”係指一個或者多個，多個係指兩個或兩個以上。除非另有定義，本文所使用之所有之技術與科學術語與所屬領域具有通常知識者通常理解之含義相同。本申請之說明書中所使用之術語僅是為描述具體之實施例之目不是旨在於限制本申請。 It should be noted that “at least one” in the embodiments of this application refers to one or more, and multiple refers to two or more. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terms used in the description of the present application are only for describing specific embodiments and are not intended to limit the present application.
應理解，本申請中除非另有說明，“/”表示或的意思。例如，A/B可表示A或B。本申請中之“A與/或B”僅僅係一種描述關聯物件之關聯關係，表示可存於僅存於A、僅存於B以及存於A與B這三種關係。 It should be understood that in this application, "/" means or unless otherwise stated. For example, A/B can mean A or B. “A and/or B” in this application is merely an association relationship describing related objects, indicating that it can exist in three relationships: only A, only B, and A and B.
需要說明的是，本申請實施例中，“第一”、“第二”等詞彙，僅用於區分描述之目的，而不能理解為指示或暗示相對重要性，亦不能理解為指示或暗示順序。限定有“第一”、“第二”之特徵可明示或者隱含地包括一個或者更多個所述特徵。於本申請實施例之描述中，“示例性的”或者“例如”等詞用於表示作例子、例證或說明。本申請實施例中被描述為“示例性的”或者“例如”之任何實施例或設計方案不應被解釋為比其它實施例或設計方案更優選或更具優勢。確切而言，使用“示例性的”或者“例如”等詞旨於以具體方式呈現相關概念。 It should be noted that in the embodiments of this application, words such as "first" and "second" are only used for the purpose of distinguishing and describing, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying order. . Features defined as "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of the embodiments of this application, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "such as" in the embodiments of the present application is not to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the words "exemplary" or "such as" is intended to present the concepts in a specific manner.
需要說明的是，本申請實施例中，術語“高度”係指於垂直於參考地層之方向上之投影長度。術語“中心”、“上”、“下”、“前”、“後”、“左”、“右”、“豎直”、“水平”、“頂”、“底”、“內”、“外”等指示之方位或位置關係為基於附圖所示之方位或位置關係，僅係為便於描述本申請與簡化描述，而不是指示或暗示所指之裝置或元件必須具有特定之方位、以特定之方位構造與操作，因此不能理解為對本申請之限制。 It should be noted that in the embodiment of the present application, the term "height" refers to the projected length in the direction perpendicular to the reference stratum. The terms "center", "top", "bottom", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or component referred to must have a specific orientation. It is constructed and operated in a specific orientation and therefore cannot be construed as a limitation on this application.
第一實施例 First embodiment
請一併參閱圖1圖2及圖3B，可以理解，本申請第一實施例提供一種天線饋入耦合模組100。所述天線饋入耦合模組100包括基體11、至少一耦合饋入單元Patch、主動電路13(參圖2)、連接器14(參圖2)、金屬層15及非金屬層16(參圖3B)。 Please refer to FIG. 1 , FIG. 2 and FIG. 3B together, and it can be understood that the first embodiment of the present application provides an antenna feed coupling module 100 . The antenna feed coupling module 100 includes a base 11, at least one coupling feed unit Patch, an active circuit 13 (see Figure 2), a connector 14 (see Figure 2), a metal layer 15 and a non-metal layer 16 (see Figure 2). 3B).
所述基體11可為介質基板，例如，印刷電路板(printed circuit board，PCB)，陶瓷(ceramics)基體或其他介質基板，於此不做具體限定。所述基體11包括第一表面111及第二表面112，所述第二表面112與所述第一表面111相對設置。 The base 11 can be a dielectric substrate, such as a printed circuit board (PCB), ceramics (ceramics) base or other dielectric substrate, which is not specifically limited here. The base 11 includes a first surface 111 and a second surface 112 , and the second surface 112 is opposite to the first surface 111 .
請一併參閱圖3A，於本申請實施例中，天線饋入耦合模組100包括第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2。第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2整體呈金屬薄片狀。第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2設置於所述基體11之第一表面111。所述第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2可藉由穿孔(過孔)113連接至所述基體11之第二表面112。 Please also refer to FIG. 3A . In the embodiment of the present application, the antenna feed coupling module 100 includes a first coupling feed unit Patch 1 and a second coupling feed unit Patch 2 . The first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are in the shape of metal sheets as a whole. The first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are disposed on the first surface 111 of the base 11 . The first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 may be connected to the second surface 112 of the base 11 through a through hole (via hole) 113 .
請一併參閱圖3A，於其中一個實施例中，第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2均整體呈矩形貼片形狀，其表面並未設置任何縫隙、切槽、斷點等。第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2之一側均對應設置有至少一訊號饋電點121。所述訊號饋電點121用以藉由匹配電路(圖未示，參後詳述)通過穿孔(過孔)113電連接至相應之饋入源(圖未示，參後詳述)，進而將電訊號分別饋入至所述第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2。 Please refer to FIG. 3A together. In one embodiment, the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are both in the shape of a rectangular patch, and there are no gaps, cuts, or grooves on their surfaces. Breakpoints etc. Each side of the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 is provided with at least one signal feed point 121 correspondingly. The signal feed point 121 is used to be electrically connected to the corresponding feed source (not shown in the figure, please refer to the details below) through the through hole (via) 113 through the matching circuit (not shown in the figure, please refer to the details below), and then Electrical signals are fed into the first coupling feeding unit Patch 1 and the second coupling feeding unit Patch 2 respectively.
可以理解，於本申請實施例中，所述第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2為矩形貼片形狀，亦可根據不同的輻射頻率調整貼片的形狀及面積，並不對至少一耦合饋入單元Patch之具體形狀及結構進行限定。 It can be understood that in the embodiment of the present application, the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are in the shape of rectangular patches, and the shape and area of the patches can also be adjusted according to different radiation frequencies. The specific shape and structure of the at least one coupling feed unit Patch are not limited.
所述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2間隔設置。第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2之面積分配可依據頻寬需求做比例調整，如此藉由大面積提供較寬頻耦合效果。例如，第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2靠近輻射體(輻射體可為，但不局限於，金屬邊框、鐵件、PCB軟板上之銅箔、或LDS製程中的導體等等)時，兩者非接觸，如此可透過耦合將訊號傳遞至輻射體，並由輻射體來發射/接收無線訊號。顯然，當耦合饋入單元之面積分配越大，則透過耦合將訊號由輻射體發射/接收時，所得頻寬越寬，進而實現大面積提供較寬頻耦合效果。 The first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are arranged at intervals. The area allocation of the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 can be proportionally adjusted according to the bandwidth requirements, thus providing a wider frequency coupling effect through a large area. For example, the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are close to the radiator (the radiator can be, but is not limited to, a metal frame, iron parts, copper foil on a PCB soft board, or LDS process (conductor, etc.), the two are non-contact, so that the signal can be transmitted to the radiator through coupling, and the radiator can transmit/receive wireless signals. Obviously, when the area distribution of the coupling feed unit is larger, the resulting bandwidth will be wider when the signal is transmitted/received from the radiator through coupling, thereby achieving a wider frequency coupling effect over a large area.
可以理解，請再次參閱圖2及圖3A，於本申請實施例中，所述主動電路13設置於所述基體11之第二表面112上。所述基體11之第二表面112上佈設有連接線路(圖未示)。所述連接線路連接至所述主動電路13。所述主動電路13可包括切換開關，與/或其他可變換阻抗之可調元件(圖未示，參後詳述)。所述主動電路13可藉由所述連接線路電連接至所述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2及所述連接器14。例如，於其中一個實施例中，所述基體11上還設置有穿孔(過孔)113，所述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2可透過所述穿孔(過孔)113連接至所述基體11之第二表面112，並藉由所述第二表面112上之連接線路連接至所述主動電路13。 It can be understood that please refer to FIG. 2 and FIG. 3A again. In the embodiment of the present application, the active circuit 13 is disposed on the second surface 112 of the base 11 . The second surface 112 of the base 11 is provided with connection lines (not shown). The connection line is connected to the active circuit 13 . The active circuit 13 may include a switch and/or other adjustable components with variable impedance (not shown in the figure, see details below). The active circuit 13 can be electrically connected to the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 and the connector 14 through the connection line. For example, in one embodiment, the base 11 is also provided with a through hole (via hole) 113, and the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 can pass through the through hole (via hole). The holes) 113 are connected to the second surface 112 of the base body 11 and are connected to the active circuit 13 through the connection lines on the second surface 112 .
所述連接器14設置於所述基體11之第二表面112上，即設置於 所述主動電路13所在表面。於其中一些實施例中，所述連接器14可與所述主動電路13間隔設置，且彼此電連接。當然，於本申請實施例中，並不對所述連接器14與所述主動電路13之具體位置關係及連接關係等進行限制。例如，於其中一個實施例中，所述主動電路13可設置於所述連接器14內，即所述連接器14可用以***述主動電路13。所述連接器14電連接至所述主動電路13，且連接至相應之傳輸線，進而藉由所述傳輸線實現所述天線饋入耦合模組100之訊號傳輸，例如實現訊號之送出或送入。 The connector 14 is disposed on the second surface 112 of the base 11, that is, The active circuit 13 is located on the surface. In some embodiments, the connector 14 may be spaced apart from the active circuit 13 and electrically connected to each other. Of course, in the embodiment of the present application, the specific positional relationship and connection relationship between the connector 14 and the active circuit 13 are not limited. For example, in one embodiment, the active circuit 13 can be disposed in the connector 14 , that is, the connector 14 can be used to accommodate the active circuit 13 . The connector 14 is electrically connected to the active circuit 13 and to a corresponding transmission line, thereby realizing signal transmission of the antenna feed coupling module 100 through the transmission line, for example, realizing the sending or input of signals.
可以理解，所述傳輸線可為，但不局限於，同軸電纜(coaxial cable)，柔性印刷電路板(Flexible Printed Circuit Board，FPCB)或其他傳輸線等。 It can be understood that the transmission line may be, but is not limited to, a coaxial cable, a flexible printed circuit board (Flexible Printed Circuit Board, FPCB) or other transmission lines.
請一併參閱圖3B及圖3C，所述非導電層16設置於所述金屬層15與所述至少一耦合饋入單元Patch之間，並覆蓋所述至少一耦合饋入單元Patch。具體地，所述非導電層16覆蓋於所述基體11之第一表面111上，並覆蓋第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2。於其中一個實施例中，所述非導電層16可由非導電材料製成，例如，由耐燃材料FR4、氧化鋁(AL2O3)、Arlon材料、陶瓷(ceramics)等其中一種或多種形成，於此不做具體限定。 Please refer to FIG. 3B and FIG. 3C together. The non-conductive layer 16 is disposed between the metal layer 15 and the at least one coupling feed unit Patch, and covers the at least one coupling feed unit Patch. Specifically, the non-conductive layer 16 covers the first surface 111 of the base 11 and covers the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 . In one embodiment, the non-conductive layer 16 may be made of non-conductive material, for example, formed of one or more of flame-resistant material FR4, aluminum oxide (AL 2 O 3 ), Arlon material, ceramics, etc., There is no specific limitation here.
所述金屬層15對應非導電層16遠離基體11的一側設置。所述金屬層15可以根據訊號輻射的需求設置為不同的尺寸或形狀。於其中一個實施例中，請參閱圖3B，所述金屬層15對應非導電層16的尺寸設置，即所述金屬層15在第一方向上的投影面積與所述非導電層16在所述第一方向上的投影面積相同，且所述金屬層15在第一方向上的投影面積大於第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2在第一方向上的投影面積。其中，所述第一方向可以為所述金屬層15及所述非導電層16朝向基體11的方向，或者沿基體11的 厚度方向，參圖3B所示的X方向。於其中另一個實施例中，請參閱圖3C，所述金屬層15對應第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2的尺寸設置，即所述金屬層15在第一方向上的投影面積與第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2在所述第一方向上的投影面積大致相同，第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2在第一方向上的投影位置與金屬層15在第一方向上的投影位置對應，且第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2位於金屬層15在第一方向上的投影範圍內；所述金屬層15在第一方向上的投影面積小於所述非導電層16在第一方向上的投影面積，且所述金屬層15位於所述非導電層16在所述第一方向上的投影範圍內。 The metal layer 15 is disposed corresponding to the side of the non-conductive layer 16 away from the base 11 . The metal layer 15 can be configured in different sizes or shapes according to signal radiation requirements. In one embodiment, please refer to FIG. 3B , the size of the metal layer 15 corresponds to the non-conductive layer 16 , that is, the projected area of the metal layer 15 in the first direction is equal to the size of the non-conductive layer 16 in the first direction. The projected areas in the first direction are the same, and the projected areas of the metal layer 15 in the first direction are larger than the projected areas of the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 in the first direction. The first direction may be the direction in which the metal layer 15 and the non-conductive layer 16 face the base 11 , or along the direction of the base 11 For the thickness direction, refer to the X direction shown in Figure 3B. In another embodiment, please refer to FIG. 3C , the metal layer 15 is arranged corresponding to the size of the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2, that is, the metal layer 15 is on the first side. The upward projected area is approximately the same as the projected area of the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 in the first direction. The first coupling feed unit Patch 1 and the second coupling feed unit Patch 1 The projection position of Patch 2 in the first direction corresponds to the projection position of the metal layer 15 in the first direction, and the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are located in the first direction of the metal layer 15 Within the upward projection range; the projected area of the metal layer 15 in the first direction is smaller than the projected area of the non-conductive layer 16 in the first direction, and the metal layer 15 is located where the non-conductive layer 16 is. within the projection range in the first direction.
所述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2分別透過訊號饋電點121從所述主動電路13饋入電訊號，並將電訊號耦合至所述金屬層15，以使所述金屬層15可進一步傳導電訊號至輻射體(輻射體可為，但不局限於，金屬邊框、鐵件、PCB軟板上之銅箔、或LDS製程中的導體等等)。另外，所述天線饋入耦合模組100還可利用所述主動電路13之切換開關，以切換多模態，進而實現多個寬頻操作。 The first coupling feeding unit Patch 1 and the second coupling feeding unit Patch 2 respectively feed electrical signals from the active circuit 13 through the signal feeding point 121, and couple the electrical signals to the metal layer 15, so that The metal layer 15 can further conduct electrical signals to the radiator (the radiator can be, but is not limited to, a metal frame, iron parts, copper foil on a PCB soft board, or a conductor in the LDS process, etc.). In addition, the antenna feed coupling module 100 can also use the switch of the active circuit 13 to switch multiple modes, thereby achieving multiple broadband operations.
例如，於其中一個實施例中，第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2間隔設置，且藉由與所述金屬層15與輻射體抵接設置，進而可使輻射體用以接收4G/5G中頻訊號(頻率範圍為1.7GHz-2.2GHz)、高頻訊號(頻率範圍為2.3GHz-2.7GHz)、超高頻(ultra high band，UHB)訊號(頻率範圍為3.3GHz-5GHz)、GPS訊號(頻率範圍為1.5GHz-1.6GHz)、Wi-Fi訊號(頻率範圍為2.4GHz，5GHz)等。 For example, in one embodiment, the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are spaced apart, and are disposed in contact with the metal layer 15 and the radiator, so that the radiator can Used to receive 4G/5G mid-frequency signals (frequency range: 1.7GHz-2.2GHz), high-frequency signals (frequency range: 2.3GHz-2.7GHz), ultra high frequency (UHB) signals (frequency range: 3.3 GHz-5GHz), GPS signal (frequency range 1.5GHz-1.6GHz), Wi-Fi signal (frequency range 2.4GHz, 5GHz), etc.
當然，於本申請實施例中，並不對所述天線饋入耦合模組100之 頻率進行限制。例如，可藉由調整所述天線饋入耦合模組100之形狀、長度、寬度、面積等參數，以調整所需之頻率。另外，所述至少一耦合饋入單元Patch之形狀、長度、寬度、面積等參數，亦可根據所需之頻率進行調整。 Of course, in the embodiment of the present application, the antenna is not fed into the coupling module 100 Frequency is limited. For example, the required frequency can be adjusted by adjusting the shape, length, width, area and other parameters of the antenna feed coupling module 100 . In addition, the shape, length, width, area and other parameters of the at least one coupling feed unit Patch can also be adjusted according to the required frequency.
可以理解，請一併參閱圖4及圖5，所述天線饋入耦合模組100可以應用於具有金屬邊框304及至少一電子組件303的電子裝置300中。所述金屬邊框304與所述至少一電子組件303間隔設置形成一狹縫309。所述天線饋入耦合模組100可設置於所述狹縫309中。其中，所述天線饋入耦合模組100設置有金屬層15之一側朝向並抵接所述金屬邊框304設置，同時，至少一耦合饋入單元Patch(例如圖3A至圖3C所示之第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2)也朝向所述金屬邊框304設置，所述基體11設置有主動電路13及連接器14的一側間隔所述至少一電子組件303設置。 It can be understood that, please refer to FIG. 4 and FIG. 5 together, the antenna feed coupling module 100 can be applied to an electronic device 300 having a metal frame 304 and at least one electronic component 303 . The metal frame 304 is spaced apart from the at least one electronic component 303 to form a slit 309 . The antenna feed coupling module 100 may be disposed in the slit 309 . Among them, the side of the antenna feed coupling module 100 provided with the metal layer 15 faces and contacts the metal frame 304. At the same time, at least one coupling feed unit Patch (for example, the third coupling feed unit Patch shown in FIGS. 3A to 3C A coupling feed unit Patch 1 and a second coupling feed unit Patch 2) are also disposed toward the metal frame 304 , and the side of the base 11 provided with the active circuit 13 and the connector 14 is spaced apart from the at least one electronic component 303 settings.
可以理解，於本申請實施例中，並不對所述金屬邊框304之具體結構，與/或其與其他元件之連接關係等進行限制。例如，所述金屬邊框304可連接至地(即所述金屬邊框304接地處理)，或者不連接至地。又如，所述金屬邊框304上可設置或未設置任何斷點、斷槽、縫隙等。 It can be understood that in the embodiment of the present application, the specific structure of the metal frame 304 and/or its connection relationship with other components are not limited. For example, the metal frame 304 may be connected to the ground (that is, the metal frame 304 is grounded), or may not be connected to the ground. For another example, the metal frame 304 may or may not be provided with any break points, grooves, gaps, etc.
可以理解，請一併參閱圖6，於本申請實施例中，當所述天線饋入耦合模組100可應用於一電子裝置300時，天線饋入耦合模組100可致使所述電子裝置300發射、接收無線電波以傳遞、交換無線訊號。所述電子裝置300可為掌上型通訊裝置(例如行動電話)、折疊機、智慧穿戴裝置(例如手錶，耳機等)、平板電腦、個人數位助理(personal digital assistant，PDA)等，於此不做具體限制。 It can be understood that please refer to FIG. 6 together. In the embodiment of the present application, when the antenna feeding coupling module 100 can be applied to an electronic device 300, the antenna feeding coupling module 100 can cause the electronic device 300 to Transmit and receive radio waves to transmit and exchange wireless signals. The electronic device 300 may be a handheld communication device (such as a mobile phone), a folding machine, a smart wearable device (such as a watch, headphones, etc.), a tablet computer, a personal digital assistant (PDA), etc., which will not be discussed here. Specific restrictions.
可以理解，所述電子裝置300可採用以下一種或多種通訊技術： 藍牙(bluetooth，BT)通訊技術、全球定位系統(global positioning system，GPS)通訊技術、無線保真(wireless fidelity，Wi-Fi)通訊技術、全球移動通訊系統(global system for mobile communications，GSM)通訊技術、寬頻碼分多址(wideband code division multiple access，WCDMA)通訊技術、長期演進(long term evolution，LTE)通訊技術、5G通訊技術、SUB-6G通訊技術以及未來其他通訊技術等。 It can be understood that the electronic device 300 may adopt one or more of the following communication technologies: Bluetooth (BT) communication technology, global positioning system (GPS) communication technology, wireless fidelity (Wi-Fi) communication technology, global system for mobile communications (GSM) communication technology, wideband code division multiple access (WCDMA) communication technology, long term evolution (LTE) communication technology, 5G communication technology, SUB-6G communication technology and other communication technologies in the future.
於本申請實施例中，以所述電子裝置300為手機為例加以說明。 In the embodiment of the present application, the electronic device 300 is a mobile phone as an example for explanation.
請再次參閱圖6，於其中一實施例中，所述電子裝置300至少包括金屬邊框304、電池303、背板305、接地面306及中框307。 Please refer to FIG. 6 again. In one embodiment, the electronic device 300 at least includes a metal frame 304, a battery 303, a backplane 305, a ground plane 306 and a middle frame 307.
所述金屬邊框304由金屬或其他導電材料製成。所述背板305可由金屬或其他導電材料製成。所述金屬邊框304設置於所述背板305之邊緣，並與所述背板305共同形成一容置空間308。所述金屬邊框304相對所述背板305之一側設置有一開口(圖未標)，用於容置一顯示單元(圖未示)。所述顯示單元具有一顯示平面，該顯示平面裸露於該開口。可以理解，所述顯示單元可結合觸摸感測器組合成觸控屏。觸摸感測器又可稱為觸控面板或觸敏面板。 The metal frame 304 is made of metal or other conductive materials. The back plate 305 may be made of metal or other conductive materials. The metal frame 304 is disposed on the edge of the back plate 305 and forms an accommodation space 308 together with the back plate 305 . An opening (not shown) is provided on one side of the metal frame 304 opposite to the back plate 305 for accommodating a display unit (not shown). The display unit has a display plane exposed at the opening. It can be understood that the display unit can be combined with a touch sensor to form a touch screen. A touch sensor can also be called a touch panel or a touch-sensitive panel.
可以理解，於本申請實施例中，所述顯示單元具有高屏占比。即所述顯示單元之顯示平面之面積大於70%之電子裝置之正面面積，甚至可做到正面全螢幕。具體於本申請實施例中，所述全螢幕是指除了所述電子裝置300上開設之必要之槽孔以外，所述顯示單元之左側、右側、下側均可無縫隙地連接至所述金屬邊框304。 It can be understood that in the embodiment of the present application, the display unit has a high screen-to-body ratio. That is, the display plane area of the display unit is greater than 70% of the front area of the electronic device, and can even achieve a full front screen. Specifically in the embodiment of the present application, the full screen means that in addition to the necessary slots opened on the electronic device 300, the left, right and lower sides of the display unit can be seamlessly connected to the metal Border 304.
所述接地面306可由金屬或其他導電材料製成。所述接地面306可設置於所述金屬邊框304與所述背板305共同圍成之所述容置空間308內，且連接至所述背板305。 The ground plane 306 may be made of metal or other conductive materials. The ground plane 306 may be disposed in the accommodating space 308 formed by the metal frame 304 and the back plate 305 and connected to the back plate 305 .
所述中框307由金屬或其他導電材料製成。所述中框307之形狀及尺寸可小於所述接地面306。所述中框307疊設於所述接地面306上。於本實施例中，所述中框307為設置於所述顯示單元與所述接地面306之間之金屬片。所述中框307用於支撐所述顯示單元、提供電磁屏蔽、及提高所述電子裝置300之機構強度。 The middle frame 307 is made of metal or other conductive materials. The shape and size of the middle frame 307 may be smaller than the ground plane 306 . The middle frame 307 is stacked on the ground plane 306 . In this embodiment, the middle frame 307 is a metal piece disposed between the display unit and the ground plane 306 . The middle frame 307 is used to support the display unit, provide electromagnetic shielding, and improve the mechanical strength of the electronic device 300 .
可以理解，於本實施例中，所述金屬邊框304、所述背板305、所述接地面306及所述中框307可構成一體成型之金屬框體。所述背板305、所述接地面306及所述中框307為大面積金屬，因此可共同構成所述電子裝置300之系統接地面(圖未標)。 It can be understood that in this embodiment, the metal frame 304 , the back plate 305 , the ground plane 306 and the middle frame 307 can form an integrated metal frame. The backplane 305 , the ground plane 306 and the middle frame 307 are made of large-area metal, so they can jointly form a system ground plane (not labeled) of the electronic device 300 .
所述電池303設置於所述中框307上，用以為所述電子裝置300之電子元件、模組、電路等提供電能。所述電池303與所述金屬邊框304間隔設置，進而於兩者之間形成狹縫309。 The battery 303 is disposed on the middle frame 307 to provide electrical energy for electronic components, modules, circuits, etc. of the electronic device 300 . The battery 303 and the metal frame 304 are spaced apart, and a slit 309 is formed between them.
可以理解，於其他實施例中，所述電子裝置300還可包括以下一個或多個元件，例如處理器、電路板、記憶體、輸入輸出電路、音訊元件(例如麥克風及揚聲器等)、多媒體元件(例如前置攝像頭與/後置攝像頭)、感測器元件(例如接近感測器、距離感測器、環境光感測器、加速度感測器、陀螺儀、磁感測器、壓力感測器及/或溫度感測器等)等，於此不再贅述。 It can be understood that in other embodiments, the electronic device 300 may also include one or more of the following components, such as a processor, a circuit board, a memory, an input and output circuit, an audio component (such as a microphone and a speaker, etc.), and a multimedia component. (such as front camera and/or rear camera), sensor components (such as proximity sensor, distance sensor, ambient light sensor, acceleration sensor, gyroscope, magnetic sensor, pressure sensor device and/or temperature sensor, etc.), etc., which will not be described again here.
請一併參閱圖5及圖6，可以理解，當所述天線饋入耦合模組100應用至所述電子裝置300時，所述天線饋入耦合模組100可設置於所述狹縫309內，且大致垂直所述接地面306所在平面設置。所述金屬邊框304之一部分可構成輻射體。具體地，所述金屬邊框304上設置有第一縫隙311及第二縫隙312。所述第一縫隙311及第二縫隙312隔斷所述金屬邊框304，以將所述金屬邊框 304至少劃分為間隔設置之第一部分313、第二部分314及第三部分315。其中所述第一部分313、第二部分314及第三部分315均能夠用以輻射無線訊號。所述第二部分314可電連接至所述系統接地面，例如所述接地面306，即接地。 Please refer to FIGS. 5 and 6 together. It can be understood that when the antenna feed coupling module 100 is applied to the electronic device 300 , the antenna feed coupling module 100 can be disposed in the slit 309 , and is arranged approximately perpendicular to the plane where the ground plane 306 is located. A part of the metal frame 304 may constitute a radiator. Specifically, the metal frame 304 is provided with a first slit 311 and a second slit 312 . The first gap 311 and the second gap 312 separate the metal frame 304 so that the metal frame 304 is at least divided into a first part 313, a second part 314 and a third part 315 arranged at intervals. The first part 313, the second part 314 and the third part 315 can all be used to radiate wireless signals. The second portion 314 may be electrically connected to the system ground plane, such as the ground plane 306, ie, ground.
可以理解，於其中一個實施例中，所述第一縫隙311及第二縫隙312可與所述狹縫309連通，並填充有絕緣材料，例如塑膠、橡膠、玻璃、木材、陶瓷等，但不以此為限。 It can be understood that in one embodiment, the first gap 311 and the second gap 312 can be connected with the slit 309 and filled with insulating materials, such as plastic, rubber, glass, wood, ceramics, etc., but not This is the limit.
可以理解，於其中一個實施例中，所述第三部分315靠近所述第二縫隙312之一側設置有接地點316。所述接地點316之一端電連接至所述第三部分315，另一端電連接至所述中框307，即接地。而所述天線饋入耦合模組100設置於所述第一部分313與所述接地點316之間之所述狹縫309內，且大致垂直所述接地面306所在平面設置。 It can be understood that in one embodiment, a grounding point 316 is provided on one side of the third portion 315 close to the second gap 312 . One end of the ground point 316 is electrically connected to the third part 315, and the other end is electrically connected to the middle frame 307, that is, grounded. The antenna feed coupling module 100 is disposed in the slit 309 between the first part 313 and the ground point 316, and is substantially perpendicular to the plane of the ground plane 306.
可以理解，當所述天線饋入耦合模組100設置於所述狹縫309內時，所述天線饋入耦合模組100上之金屬層15朝向並抵接所述第一部分313，第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2朝向所述第一部分313。所述連接器14設置於所述基體11之另一表面，即背向所述第一部分313設置。所述連接器14之一端電連接至所述中框307，另一端與所述基體11電連接。 It can be understood that when the antenna feed coupling module 100 is disposed in the slit 309, the metal layer 15 on the antenna feed coupling module 100 faces and abuts the first part 313, and the first coupling The feeding unit Patch 1 and the second coupling feeding unit Patch 2 face the first part 313 . The connector 14 is disposed on the other surface of the base 11 , that is, disposed facing away from the first portion 313 . One end of the connector 14 is electrically connected to the middle frame 307 , and the other end is electrically connected to the base 11 .
在另一些實施例中，所述天線饋入耦合模組100對應第一部分313、第二縫隙312及第三部分315設置，天線饋入耦合模組100上之金屬層15朝向並抵接第一部分313及第三部分315，且第一耦合饋入單元Patch 1朝向第三部分315，第二耦合饋入單元Patch 2朝向第一部分313。從而使得天線饋入耦合模組100可同時向第一部分313和第三部分315饋入電訊號。 In other embodiments, the antenna feed coupling module 100 is disposed corresponding to the first part 313, the second gap 312 and the third part 315, and the metal layer 15 on the antenna feed coupling module 100 faces and contacts the first part. 313 and the third part 315, and the first coupling feed unit Patch 1 faces the third part 315, and the second coupling feed unit Patch 2 faces the first part 313. Therefore, the antenna feeding coupling module 100 can feed electrical signals to the first part 313 and the third part 315 at the same time.
請一併參閱圖6及圖7，第一耦合饋入單元Patch 1與第二耦合饋 入單元Patch 2包括相應之訊號饋電點(例如第一訊號饋電點port1、第二訊號饋電點port2，即前面所述之訊號饋電點121)。每一訊號饋電點121分別藉由相應之匹配單元電連接至相應之饋入源。例如，所述第一耦合饋入單元Patch 1之第一訊號饋電點port1藉由第一匹配單元151電連接至第一饋入源161。所述第二耦合饋入單元Patch 2之第二訊號饋電點port2藉由第二匹配單元152電連接至第二饋入源162。 Please refer to Figure 6 and Figure 7 together. The first coupled feed unit Patch 1 and the second coupled feed unit The input unit Patch 2 includes corresponding signal feed points (for example, the first signal feed point port1 and the second signal feed point port2, namely the aforementioned signal feed point 121). Each signal feed point 121 is electrically connected to a corresponding feed source through a corresponding matching unit. For example, the first signal feed point port1 of the first coupling feed unit Patch 1 is electrically connected to the first feed source 161 through the first matching unit 151 . The second signal feed point port2 of the second coupling feed unit Patch 2 is electrically connected to the second feed source 162 through the second matching unit 152 .
所述天線饋入耦合模組100中之主動電路13連接至所述連接器14。如圖7所示，所述主動電路13包括切換開關131及第一可調元件132、第二可調元件133。其中，所述切換開關131之一端電連接至所述連接器14，另一端藉由相應之第一可調元件132、第二可調元件133電連接至對應之饋入源。例如，所述切換開關131藉由第一可調元件132電連接至所述第一饋入源161，藉由第二可調元件133電連接至所述第二饋入源162。即，所述匹配電路至少包括第二匹配單元151及第二匹配單元152。 The active circuit 13 in the antenna feed coupling module 100 is connected to the connector 14 . As shown in FIG. 7 , the active circuit 13 includes a switch 131 and a first adjustable element 132 and a second adjustable element 133 . One end of the switch 131 is electrically connected to the connector 14 , and the other end is electrically connected to the corresponding feed source through the corresponding first adjustable element 132 and the second adjustable element 133 . For example, the switch 131 is electrically connected to the first feed source 161 through the first adjustable element 132 and is electrically connected to the second feed source 162 through the second adjustable element 133 . That is, the matching circuit at least includes the second matching unit 151 and the second matching unit 152 .
藉由所述第一耦合饋入單元Patch 1、第二耦合饋入單元Patch 2與所述金屬層15耦合電訊號，並藉由所述金屬層15傳導電訊號至所述第一部分313，並藉由所述第一部分313進一步耦合電訊號至第二部分314及第三部分315，所述第一耦合饋入單元Patch 1、第二耦合饋入單元Patch 2與所述第一部分313、第二部分314、第三部分315耦合共振出具有可調性之模態。另外，還可控制所述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2之間之耦合狀態，透過耦合分別產生可調性且天線效率佳之獨立模態。再者，藉由所述主動電路13中之切換開關131之切換，可切換多模態，並使用多個可調元件(例如第一可調元件132、第二可調元件133)實現多個頻段包覆。 Electrical signals are coupled to the metal layer 15 through the first coupling feed-in unit Patch 1 and the second coupling feed-in unit Patch 2, and the electrical signals are conducted to the first part 313 through the metal layer 15, and By further coupling electrical signals to the second part 314 and the third part 315 through the first part 313, the first coupling feed-in unit Patch 1 and the second coupling feed-in unit Patch 2 and the first part 313 and the second coupling feed-in unit Patch 2 Part 314 and the third part 315 couple and resonate to produce an adjustable mode. In addition, the coupling state between the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 can also be controlled, and independent modes with adjustability and good antenna efficiency are generated through coupling. Furthermore, by switching the switch 131 in the active circuit 13, multiple modes can be switched, and multiple adjustable elements (such as the first adjustable element 132, the second adjustable element 133) are used to realize multiple modes. Frequency band coverage.
請一併參閱圖8，為所述電子裝置300之電流路徑示意圖。其中，設置有訊號饋電點port1之第一耦合饋入單元Patch 1可激發中頻及高頻(參路徑Pa)模態，利用狹縫309可耦合共振出中頻及高頻頻段，兼具最佳天線效率，使得所述第一耦合饋入單元Patch 1之工作頻率範圍可涵蓋中頻頻段(1.71GHz-2.17GHz)及高頻頻段(2.3GHz-2.69GHz)。 Please also refer to FIG. 8 , which is a schematic diagram of the current path of the electronic device 300 . Among them, the first coupling feed unit Patch 1, which is provided with the signal feed point port1, can excite the intermediate frequency and high frequency (reference path Pa) modes, and the slit 309 can be used to couple and resonate out the intermediate frequency and high frequency bands. The optimal antenna efficiency enables the operating frequency range of the first coupling feed unit Patch 1 to cover the mid-frequency band (1.71GHz-2.17GHz) and the high-frequency band (2.3GHz-2.69GHz).
設置有訊號饋電點port2之第二耦合饋入單元Patch 2可激發超高頻(UHB)模態及5G Sub 6 NR模態(參路徑Pb)，利用狹縫309可耦合共振出UHB頻段及5G Sub 6 NR頻段，兼具最佳天線效率。使所述第二耦合饋入單元Patch 2之工作頻率範圍可涵蓋超高頻頻段(3.3GHz-5GHz)及5G Sub 6 NR頻段(例如，5G Sub 6 N77頻段(3.3GHz-4.2GHz)、5G Sub 6 N78頻段(3.3GHz-3.8GHz)與5G Sub 6 N79頻段(4.4GHz-5GHz)。 The second coupling feed unit Patch 2 provided with the signal feed point port2 can excite the ultra-high frequency (UHB) mode and the 5G Sub 6 NR mode (reference path Pb). The slit 309 can be used to couple and resonate out the UHB frequency band and 5G Sub 6 NR frequency band with the best antenna efficiency. The operating frequency range of the second coupling feed unit Patch 2 can cover the ultra-high frequency band (3.3GHz-5GHz) and the 5G Sub 6 NR frequency band (for example, the 5G Sub 6 N77 frequency band (3.3GHz-4.2GHz), 5G Sub 6 N78 frequency band (3.3GHz-3.8GHz) and 5G Sub 6 N79 frequency band (4.4GHz-5GHz).
在本發明一實施例，所述切換開關131為中頻、高頻、UHB及5G Sub 6 NR切換開關，用以切換中頻、高頻、UHB及5G Sub 6 NR頻段。 In one embodiment of the present invention, the switch 131 is a mid-frequency, high-frequency, UHB and 5G Sub 6 NR switch, used to switch between mid-frequency, high frequency, UHB and 5G Sub 6 NR frequency bands.
所述天線饋入耦合模組100可應用至電子裝置300中，以提升天線效率頻寬並具有最佳天線效率，且利用所述切換開關131之切換，可有效提升天線頻率覆蓋範圍。具體地，於其中一個實施例中，所述天線饋入耦合模組100適用之工作頻率範圍涵蓋中頻1.71GHz至2.17GHz、高頻2.3GHz至2.69GHz、超高頻3.3GHz至5GHz，並可支援5G Sub 6 N77/N78/N79頻段。 The antenna feed coupling module 100 can be applied to the electronic device 300 to improve the antenna efficiency bandwidth and have the best antenna efficiency, and using the switching of the switch 131, the antenna frequency coverage can be effectively improved. Specifically, in one embodiment, the applicable operating frequency range of the antenna feed coupling module 100 covers intermediate frequency 1.71GHz to 2.17GHz, high frequency 2.3GHz to 2.69GHz, ultra-high frequency 3.3GHz to 5GHz, and Can support 5G Sub 6 N77/N78/N79 frequency band.
所述天線饋入耦合模組100藉由將所述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2設置為獨立之片體，並在適當位置設置相應之訊號饋電點，並藉由所述金屬層15以及電子裝置300之金屬邊框304(例如，第一部分313)作為金屬輻射體，於狹縫309中由所述金屬層15及金屬邊框304與所 述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2耦合能量共振出模態，涵蓋中、高頻、超高頻、5G Sub 6 N77、5G Sub 6 N78、5G Sub 6 N79頻段，藉以大幅提升其頻寬與天線效率，亦可涵蓋全球常用5G之通訊頻段之應用，以及支援LTE-A(LTE-Advanced之簡稱，是LTE技術之後續演進)之載波聚合應用(Carrier Aggregation，CA)要求。 The antenna feed coupling module 100 is configured by configuring the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 as independent pieces, and setting corresponding signal feed points at appropriate positions. And by using the metal layer 15 and the metal frame 304 (for example, the first part 313) of the electronic device 300 as a metal radiator, the metal layer 15 and the metal frame 304 are connected to the slit 309. The coupling energy of the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 resonates out the mode, covering the medium, high frequency, ultra-high frequency, 5G Sub 6 N77, 5G Sub 6 N78, 5G Sub 6 N79 frequency bands , thereby greatly improving its bandwidth and antenna efficiency, it can also cover the application of commonly used 5G communication frequency bands around the world, as well as support the carrier aggregation application of LTE-A (abbreviation for LTE-Advanced, which is the subsequent evolution of LTE technology). CA) requirements.
請一併參閱圖9A至圖9C，為所述天線饋入耦合模組100之第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2設置不同之金屬層15(如圖3A未設置金屬層15及圖3B至圖3C所示之金屬層15)時之S參數(散射參數)曲線圖。其中，如圖9A所示，所述第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2未設置金屬層15，並藉由切換開關131切換以產生可調性且天線效率佳之獨立模態，以使第一耦合饋入單元Patch 1涵蓋中頻1.71GHz-2.17GHz及高頻2.3GHz-2.69GHz；使第二耦合饋入單元Patch 2涵蓋超高頻3.3GHz-5GHz及5G Sub 6 N77/N78/N79頻段。如圖9B所示，所述第一耦合饋入單元Patch 1、第二耦合饋入單元Patch 2及圖3B所示之金屬層15藉由切換開關131切換以產生可調性且天線效率佳之獨立模態，以使所述第一耦合饋入單元Patch 1涵蓋中頻1.71GHz-2.17GHz及高頻2.3GHz-2.69GHz；使所述第二耦合饋入單元Patch 2涵蓋超高頻3.3GHz-5GHz及5G Sub 6 N77/N78/N79頻段。如圖9C所示，所述第一耦合饋入單元Patch 1、第二耦合饋入單元Patch 2及圖3C所示之金屬層15藉由切換開關131切換以產生可調性且天線效率佳之獨立模態，以使所述第一耦合饋入單元Patch 1涵蓋中頻1.71GHz-2.17GHz及高頻2.3GHz-2.69GHz；使所述第二耦合饋入單元Patch 2涵蓋超高頻3.3GHz-5GHz及5G Sub 6 N77/N78/N79頻段。 Please refer to FIGS. 9A to 9C together. Different metal layers 15 are provided for the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 of the antenna feed coupling module 100 (not provided in FIG. 3A The S parameter (scattering parameter) curve of the metal layer 15 and the metal layer 15 shown in FIGS. 3B to 3C). Among them, as shown in FIG. 9A, the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are not provided with a metal layer 15, and are switched by a switch 131 to produce independent antennas with adjustability and good antenna efficiency. mode, so that the first coupling feed unit Patch 1 covers the intermediate frequency 1.71GHz-2.17GHz and the high frequency 2.3GHz-2.69GHz; the second coupling feed unit Patch 2 covers the ultra-high frequency 3.3GHz-5GHz and 5G Sub 6 N77/N78/N79 frequency band. As shown in FIG. 9B , the first coupling feed unit Patch 1 , the second coupling feed unit Patch 2 and the metal layer 15 shown in FIG. 3B are switched by the switch 131 to produce independent antennas with adjustability and good antenna efficiency. mode, so that the first coupling feed unit Patch 1 covers the intermediate frequency 1.71GHz-2.17GHz and the high frequency 2.3GHz-2.69GHz; the second coupling feed unit Patch 2 covers the ultra-high frequency 3.3GHz- 5GHz and 5G Sub 6 N77/N78/N79 frequency bands. As shown in FIG. 9C , the first coupling feed unit Patch 1 , the second coupling feed unit Patch 2 and the metal layer 15 shown in FIG. 3C are switched by the switch 131 to produce independent antennas with adjustability and good antenna efficiency. mode, so that the first coupling feed unit Patch 1 covers the intermediate frequency 1.71GHz-2.17GHz and the high frequency 2.3GHz-2.69GHz; the second coupling feed unit Patch 2 covers the ultra-high frequency 3.3GHz- 5GHz and 5G Sub 6 N77/N78/N79 frequency bands.
可以理解，藉由所述切換開關131切換至不同之訊號饋電點，可控制其頻率模態，以涵蓋中頻1.71GHz-2.17GHz、高頻2.3GHz-2.69GHz，超高頻3.3GHz-5GHz，並可支援5G Sub 6 N77/N78/N79頻段。 It can be understood that by switching the switch 131 to different signal feed points, its frequency mode can be controlled to cover the intermediate frequency 1.71GHz-2.17GHz, the high frequency 2.3GHz-2.69GHz, and the ultra-high frequency 3.3GHz- 5GHz, and can support 5G Sub 6 N77/N78/N79 frequency bands.
請一併參閱圖10A至圖10C，為所述天線饋入耦合模組100之第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2設置不同之金屬層15(如圖3A未設置金屬層15及圖3B至圖3C所示之金屬層15)時之效率曲線圖。其中，圖10A為所述天線饋入耦合模組100中所述第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2未設置金屬層15，並藉由切換開關131切換以產生可調性且天線效率佳之獨立模態時，各耦合餽入單元之輻射效率(圖中所示為Rad.)值及總效率(圖中所示為Tot.)值。圖10B為所述天線饋入耦合模組100中所述第一耦合饋入單元Patch 1、第二耦合饋入單元Patch 2及圖3B所示之金屬層15藉由切換開關131切換以產生可調性且天線效率佳之獨立模態時，各耦合餽入單元之輻射效率(圖中所示為Rad.)值及總效率(圖中所示為Tot.)值。圖10C為所述天線饋入耦合模組100中所述第一耦合饋入單元Patch 1、第二耦合饋入單元Patch 2及圖3C所示之金屬層15藉由切換開關131切換以產生可調性且天線效率佳之獨立模態時，各耦合饋入單元之輻射效率(圖中所示為Rad.)值及總效率(圖中所示為Tot.)值。 Please refer to FIGS. 10A to 10C together. Different metal layers 15 are provided for the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 of the antenna feed coupling module 100 (not provided in FIG. 3A The efficiency curve of the metal layer 15 and the metal layer 15 shown in Figures 3B to 3C). Among them, FIG. 10A shows that the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 in the antenna feed coupling module 100 are not provided with a metal layer 15, and are switched by a switch 131 to generate In the independent mode with good tonality and good antenna efficiency, the radiation efficiency (Rad. shown in the figure) value and the total efficiency (Tot. shown in the figure) value of each coupling feed unit. 10B shows that the first coupling feed unit Patch 1, the second coupling feed unit Patch 2 and the metal layer 15 shown in FIG. 3B in the antenna feed coupling module 100 are switched by the switch 131 to generate In the independent mode with good tonality and good antenna efficiency, the radiation efficiency (Rad. shown in the figure) value and the total efficiency (Tot. shown in the figure) value of each coupling feed unit. 10C shows that the first coupling feed unit Patch 1, the second coupling feed unit Patch 2 and the metal layer 15 shown in FIG. 3C in the antenna feed coupling module 100 are switched by the switch 131 to generate In the independent mode with good tonality and good antenna efficiency, the radiation efficiency (Rad. shown in the figure) value and the total efficiency (Tot. shown in the figure) value of each coupling feed unit.
顯然，藉由設置所述切換開關131，並使得所述切換開關131切換至不同之訊號饋電點，以控制頻率模態，進而在涵蓋至中頻(1.71GHz-2.17GHz)，高頻(2.3GHz-2.69GHz)，超高頻(3.3GHz-5GHz)，並可支援5G Sub 6 N77/N78/N79頻段時，具有較佳之輻射效率。 Obviously, by setting the switch 131 and switching the switch 131 to different signal feed points, the frequency mode is controlled, thereby covering medium frequency (1.71GHz-2.17GHz), high frequency ( 2.3GHz-2.69GHz), ultra-high frequency (3.3GHz-5GHz), and can support 5G Sub 6 N77/N78/N79 frequency bands, with better radiation efficiency.
第二實施例 Second embodiment
請一併參閱圖11及圖12，可以理解，本申請第二實施例提供一種微型化天線饋入模組400。所述微型化天線饋入模組400包括基體411、複數個耦合饋入單元Patch、主動電路413及連接器414。 Please refer to FIG. 11 and FIG. 12 together, and it can be understood that the second embodiment of the present application provides a miniaturized antenna feed module 400. The miniaturized antenna feed module 400 includes a base 411, a plurality of coupling feed unit patches, an active circuit 413 and a connector 414.
所述基體411可為介質基板，例如，印刷電路板(printed circuit board，PCB)、陶瓷(ceramics)基體或其他介質基板，於此不做具體限定。所述基體411包括第一表面4111及第二表面4112，所述第二表面4112與所述第一表面4111相對設置。 The base 411 can be a dielectric substrate, such as a printed circuit board (PCB), ceramics (ceramics) base or other dielectric substrate, which is not specifically limited here. The base 411 includes a first surface 4111 and a second surface 4112. The second surface 4112 is opposite to the first surface 4111.
請一併參閱圖13A及圖13B，於本申請實施例中，微型化天線饋入模組400包括第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43。第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43整體呈金屬薄片狀。第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43設置於所述基體411之第一表面4111。第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43可藉由穿孔(過孔)連接至所述基體411之第二表面4112。 Please refer to FIG. 13A and FIG. 13B together. In the embodiment of the present application, the miniaturized antenna feed module 400 includes a first coupling feed unit Patch 41, a second coupling feed unit Patch 42, and a third coupling feed unit. Patch 43. The first coupling-feeding unit Patch 41, the second coupling-feeding unit Patch 42 and the third coupling-feeding unit Patch 43 are in the shape of a metal sheet as a whole. The first coupling feed unit Patch 41 , the second coupling feed unit Patch 42 and the third coupling feed unit Patch 43 are disposed on the first surface 4111 of the base 411 . The first coupling feed unit Patch 41 , the second coupling feed unit Patch 42 and the third coupling feed unit Patch 43 may be connected to the second surface 4112 of the base 411 through through holes (via holes).
本發明一實施例中，第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43共面設置於所述基體411的第一表面4111，所述第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43相互間隔且互不重疊設置。所述第一耦合饋入單元Patch 41大致呈L形金屬薄片狀，第二耦合饋入單元Patch 42大致呈正方形金屬薄片狀，第三耦合饋入單元Patch 43大致呈矩形金屬薄片狀。三個所述耦合饋入單元Patch 41、Patch 42、Patch 43分別設置有相應之訊號饋電點41211、41212、41213， 進而分別為相應之耦合饋入單元饋入電訊號。 In one embodiment of the present invention, the first coupling feed unit Patch 41, the second coupling feed unit Patch 42 and the third coupling feed unit Patch 43 are coplanarly disposed on the first surface 4111 of the base 411, and the A coupling feed-in unit Patch 41, a second coupling-feed-in unit Patch 42 and a third coupling-feed-in unit Patch 43 are spaced apart from each other and do not overlap each other. The first coupling-feeding unit Patch 41 is generally in the shape of an L-shaped metal sheet, the second coupling-feeding unit Patch 42 is generally in the shape of a square metal sheet, and the third coupling-feeding unit Patch 43 is generally in the shape of a rectangular metal sheet. The three coupling feed units Patch 41, Patch 42, and Patch 43 are respectively provided with corresponding signal feed points 41211, 41212, and 41213. Then, the electrical signals are fed into the corresponding coupling feeding units respectively.
可以理解，於本申請實施例中，並不對耦合饋入單元Patch 41、Patch 42、Patch 43之具體形狀及結構進行限定。 It can be understood that in the embodiment of the present application, the specific shapes and structures of the coupling feed units Patch 41, Patch 42, and Patch 43 are not limited.
所述第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43間隔設置。第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43之面積分配可依據頻寬需求做比例調整，如此藉由大面積提供較寬頻耦合效果。例如，當第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43靠近輻射體(輻射體可為，但不局限於，電子裝置之金屬邊框、鐵件、PCB軟板上之銅箔、或LDS製程中的導體等等)時，兩者非接觸，如此可透過耦合將訊號傳遞至輻射體，並由輻射體來發射/接收無線訊號。顯然，當耦合饋入單元之面積分配越大，則透過耦合將訊號由輻射體發射/接收時，所得頻寬越寬，進而實現大面積提供較寬頻耦合效果。於本申請實施例中，第一耦合饋入單元Patch 41的面積大於第二耦合饋入單元Patch 42的面積，第二耦合饋入單元Patch 42的面積大於第三耦合饋入單元Patch 43的面積。於本申請實施例中，第一耦合饋入單元Patch 41在所述基體411的投影面積占所述基體411的面積大於40%，第二耦合饋入單元Patch 42在所述基體411的投影面積占所述基體411的面積小於10%，第三耦合饋入單元Patch 43在所述基體411的投影面積占所述基體411的面積小於10%。 The first coupling feeding unit Patch 41, the second coupling feeding unit Patch 42 and the third coupling feeding unit Patch 43 are arranged at intervals. The area allocation of the first coupling feed unit Patch 41, the second coupling feed unit Patch 42 and the third coupling feed unit Patch 43 can be proportionally adjusted according to the bandwidth requirement, thus providing a wider frequency coupling effect through a large area. For example, when the first coupling feed unit Patch 41, the second coupling feed unit Patch 42, and the third coupling feed unit Patch 43 are close to the radiator (the radiator may be, but is not limited to, a metal frame or iron frame of an electronic device components, copper foil on the PCB soft board, or conductors in the LDS process, etc.), the two are non-contact, so that the signal can be transmitted to the radiator through coupling, and the radiator can transmit/receive wireless signals. Obviously, when the area distribution of the coupling feed unit is larger, the resulting bandwidth will be wider when the signal is transmitted/received from the radiator through coupling, thereby achieving a wider frequency coupling effect over a large area. In the embodiment of the present application, the area of the first coupling feed-in unit Patch 41 is larger than the area of the second coupling-feed-in unit Patch 42 , and the area of the second coupling-feed-in unit Patch 42 is larger than the area of the third coupling feed-in unit Patch 43 . In the embodiment of the present application, the projected area of the first coupling feed unit Patch 41 on the base 411 accounts for more than 40% of the area of the base 411 , and the projected area of the second coupling feed unit Patch 42 on the base 411 The area of the base 411 is less than 10%, and the projected area of the third coupling feed unit Patch 43 on the base 411 is less than 10% of the area of the base 411 .
請再次參閱圖11、圖12、圖13A及圖13B，於本申請實施例中，所述主動電路413設置於所述基體411之第二表面4112上。所述基體411之第二表面4112上佈設有連接線路(圖未示)。所述連接線路連接至所述主動電路 413。所述主動電路413可包括切換開關，與/或其他可變換阻抗之可調元件(圖未示，參後詳述)。所述主動電路413可藉由所述連接線路電連接至所述第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42、第三耦合饋入單元Patch 43及所述連接器414。例如，於其中一個實施例中，所述基體411上還設置有過孔(圖未示)，所述第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43可透過所述過孔連接至所述基體411之第二表面4112，並藉由所述第二表面4112上之連接線路連接至所述主動電路413。 Please refer to FIGS. 11 , 12 , 13A and 13B again. In the embodiment of the present application, the active circuit 413 is disposed on the second surface 4112 of the base 411 . The second surface 4112 of the base 411 is provided with connection lines (not shown). The connection line is connected to the active circuit 413. The active circuit 413 may include a switch and/or other adjustable components with variable impedance (not shown in the figure, see details below). The active circuit 413 can be electrically connected to the first coupling feed unit Patch 41 , the second coupling feed unit Patch 42 , the third coupling feed unit Patch 43 and the connector 414 through the connection lines. For example, in one embodiment, the base 411 is also provided with via holes (not shown), and the first coupling feed unit Patch 41, the second coupling feed unit Patch 42 and the third coupling feed unit The unit patch 43 can be connected to the second surface 4112 of the base 411 through the via hole, and connected to the active circuit 413 through the connection lines on the second surface 4112.
所述連接器414設置於所述基體411之第二表面4112上，即設置於所述主動電路413所在表面。於其中一些實施例中，所述連接器414可與所述主動電路413間隔設置，且彼此電連接。當然，於本申請實施例中，並不對所述連接器414與所述主動電路413之具體位置關係及連接關係等進行限制。例如，於其中一個實施例中，所述主動電路413可設置於所述連接器414內，即所述連接器414可用以***述主動電路413。所述連接器414電連接至所述主動電路413，且連接至相應之傳輸線，進而藉由所述傳輸線實現所述微型化天線饋入模組400之訊號傳輸，例如實現訊號之送出或送入。 The connector 414 is disposed on the second surface 4112 of the base 411 , that is, on the surface where the active circuit 413 is located. In some embodiments, the connector 414 may be spaced apart from the active circuit 413 and electrically connected to each other. Of course, in the embodiment of the present application, the specific positional relationship and connection relationship between the connector 414 and the active circuit 413 are not limited. For example, in one embodiment, the active circuit 413 can be disposed in the connector 414 , that is, the connector 414 can be used to receive the active circuit 413 . The connector 414 is electrically connected to the active circuit 413 and to a corresponding transmission line, thereby realizing signal transmission of the miniaturized antenna feed module 400 through the transmission line, for example, realizing the sending or input of signals. .
可以理解，所述傳輸線可為，但不局限於，同軸電纜(coaxial cable)，柔性印刷電路板(Flexible Printed Circuit Board，FPCB)或其他傳輸線等。 It can be understood that the transmission line may be, but is not limited to, a coaxial cable, a flexible printed circuit board (Flexible Printed Circuit Board, FPCB) or other transmission lines.
第一排佈實施例 First arrangement embodiment
請一併參閱圖14A至圖14C，於本申請另一實施例中，所述微型化天線饋入模組400包括第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42。可以理解，第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42可由一整片金屬薄片透過開設切槽4122，以形成多個獨立之耦合饋入單元。例如， 於圖14A所示實施例中，所述切槽4122大致呈L形。於本申請實施例中，其中一個耦合饋入單元(例如第一耦合饋入單元Patch 41)呈L形，另外一個耦合饋入單元(例如第二耦合饋入單元Patch 42)呈矩形。第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42分別設置有相應之訊號饋電點41211、41212，進而分別為相應之耦合饋入單元饋入電訊號。於圖14A至14C所示之實施例中，第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42設置於所述基體411之第一表面4111，即第一耦合饋入單元Patch 41與第二耦合饋入單元Patch 42共面且互不重疊，可分別藉由穿孔(過孔)連接至所述基體411之第二表面4112。 Please refer to FIGS. 14A to 14C together. In another embodiment of the present application, the miniaturized antenna feed module 400 includes a first coupling feed unit Patch 41 and a second coupling feed unit Patch 42 . It can be understood that the first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 can be made of a whole piece of metal sheet through opening the slot 4122 to form multiple independent coupling feed units. For example, In the embodiment shown in FIG. 14A , the slot 4122 is generally L-shaped. In the embodiment of the present application, one coupling feed unit (for example, the first coupling feed unit Patch 41) is L-shaped, and the other coupling feed unit (for example, the second coupling feed unit Patch 42) is rectangular. The first coupling feeding unit Patch 41 and the second coupling feeding unit Patch 42 are respectively provided with corresponding signal feeding points 41211 and 41212, and then feed electrical signals to the corresponding coupling feeding units respectively. In the embodiment shown in FIGS. 14A to 14C , the first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 are disposed on the first surface 4111 of the base 411 , that is, the first coupling feed unit Patch 41 The second coupling feed unit Patch 42 is coplanar and does not overlap each other, and can be connected to the second surface 4112 of the base 411 through holes (vias) respectively.
在一些實施例中，請參圖14A至14C，第一耦合饋入單元Patch 41與第二耦合饋入單元Patch 42在第一方向上的投影互不重疊，且共面於第二方向與第三方向所形成的平面。所述第一方向為第一耦合饋入單元Patch 41與第二耦合饋入單元Patch 42朝向基體411之第二表面4112的方向，或者沿基體411之厚度方向，請參圖14C所示之X軸方向。所述第二方向為沿或者平行於基體411之第一表面4111的延伸方向，或者基體411之第一表面4111的長度方向，請參圖14A至14C所示之Y軸方向。所述第一方向與第二方向大致垂直。所述第三方向為所述第二方向為沿或者平行於基體411之第一表面4111的延伸方向，或者基體411之第一表面4111的寬度方向，請參圖14A及圖14B所示之Z軸方向。所述第三方向大致垂直第一方向及第二方向。 In some embodiments, please refer to FIGS. 14A to 14C , the projections of the first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 in the first direction do not overlap with each other, and are coplanar with the second coupling feed unit Patch 41 in the second direction. A plane formed by three directions. The first direction is the direction in which the first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 face the second surface 4112 of the base 411, or along the thickness direction of the base 411, please refer to X shown in FIG. 14C axis direction. The second direction is along or parallel to the extension direction of the first surface 4111 of the base 411, or the length direction of the first surface 4111 of the base 411, please refer to the Y-axis direction shown in FIGS. 14A to 14C. The first direction is substantially perpendicular to the second direction. The third direction is that the second direction is along or parallel to the extension direction of the first surface 4111 of the base 411, or the width direction of the first surface 4111 of the base 411, please refer to Z shown in Figure 14A and Figure 14B axis direction. The third direction is substantially perpendicular to the first direction and the second direction.
可以理解，於本申請實施例中，並不對耦合饋入單元Patch 41、Patch 42之具體形狀及結構進行限定。 It can be understood that in the embodiment of the present application, the specific shapes and structures of the coupling feed units Patch 41 and Patch 42 are not limited.
所述第一耦合饋入單元Patch 41與第二耦合饋入單元Patch 42共面且間隔設置。第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42之面 積分配可依據頻寬需求做比例調整，如此藉由大面積提供較寬頻耦合效果。例如，當使得第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42靠近輻射體(例如電子裝置之金屬邊框)時，兩者非接觸，如此可透過耦合將訊號傳遞至輻射體，並由輻射體來發射/接收無線訊號。顯然，當耦合饋入單元之面積分配越大，則透過耦合將訊號由輻射體發射/接收時，所得頻寬越寬，進而實現大面積提供較寬頻耦合效果。於本申請實施例中，第一耦合饋入單元Patch 41的面積大於第二耦合饋入單元Patch 42的面積。於本申請實施例中，第一耦合饋入單元Patch 41在所述基體411的投影面積占所述基體411的面積大於40%，第二耦合饋入單元Patch 42在所述基體411的投影面積占所述基體411的面積小於10%。 The first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 are coplanar and spaced apart. The surface of the first coupling feed-in unit Patch 41 and the second coupling feed-in unit Patch 42 The integral distribution can be proportionally adjusted according to the bandwidth requirements, thus providing a wider frequency coupling effect through a large area. For example, when the first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 are brought close to the radiator (such as the metal frame of the electronic device), they are not in contact, so that the signal can be transmitted to the radiator through coupling. And the radiator transmits/receives wireless signals. Obviously, when the area distribution of the coupling feed unit is larger, the resulting bandwidth will be wider when the signal is transmitted/received from the radiator through coupling, thereby achieving a wider frequency coupling effect over a large area. In the embodiment of the present application, the area of the first coupling feed unit Patch 41 is larger than the area of the second coupling feed unit Patch 42 . In the embodiment of the present application, the projected area of the first coupling feed unit Patch 41 on the base 411 accounts for more than 40% of the area of the base 411 , and the projected area of the second coupling feed unit Patch 42 on the base 411 It occupies less than 10% of the area of the base 411 .
可以理解，於本申請實施例中，所述主動電路413設置於所述基體411之第二表面4112上。所述基體411之第二表面4112上佈設有連接線路(圖未示)。所述連接線路連接至所述主動電路413。所述主動電路413可包括切換開關，與/或其他可變換阻抗之可調元件(圖未示，參後詳述)。所述主動電路413可藉由所述連接線路電連接至所述第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及所述連接器414。例如，於其中一個實施例中，所述基體411上還設置有過孔(如圖14C所示連接主動電路413與第一耦合饋入單元Patch 41之間之線段)，所述第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42可透過所述過孔連接至所述基體411之第二表面4112，並藉由所述第二表面4112上之連接線路連接至所述主動電路413。 It can be understood that in this embodiment of the present application, the active circuit 413 is disposed on the second surface 4112 of the base 411 . The second surface 4112 of the base 411 is provided with connection lines (not shown). The connection line is connected to the active circuit 413 . The active circuit 413 may include a switch and/or other adjustable components with variable impedance (not shown in the figure, see details below). The active circuit 413 can be electrically connected to the first coupling feed unit Patch 41 , the second coupling feed unit Patch 42 and the connector 414 through the connection lines. For example, in one embodiment, the base 411 is also provided with a via hole (the line segment connecting the active circuit 413 and the first coupling feed unit Patch 41 as shown in FIG. 14C), and the first coupling feed unit The input unit Patch 41 and the second coupling feed unit Patch 42 can be connected to the second surface 4112 of the base 411 through the via hole, and connected to the active circuit through the connection lines on the second surface 4112 413.
請一併參閱圖12，所述連接器414設置於所述基體411之第二表面4112上，即設置於所述主動電路413所在表面。於其中一些實施例中，所述 連接器414可與所述主動電路413間隔設置，且彼此電連接。當然，於本申請實施例中，並不對所述連接器414與所述主動電路413之具體位置關係及連接關係等進行限制。例如，於其中一個實施例中，所述主動電路413可設置於所述連接器414內，即所述連接器414可用以***述主動電路413。所述連接器414電連接至所述主動電路413，且連接至相應之傳輸線，進而藉由所述傳輸線實現所述微型化天線饋入模組400之訊號傳輸，例如實現訊號之送出或送入。 Please also refer to FIG. 12 . The connector 414 is disposed on the second surface 4112 of the base 411 , that is, the connector 414 is disposed on the surface where the active circuit 413 is located. In some of these embodiments, the The connector 414 may be spaced apart from the active circuit 413 and electrically connected to each other. Of course, in the embodiment of the present application, the specific positional relationship and connection relationship between the connector 414 and the active circuit 413 are not limited. For example, in one embodiment, the active circuit 413 can be disposed in the connector 414 , that is, the connector 414 can be used to receive the active circuit 413 . The connector 414 is electrically connected to the active circuit 413 and to a corresponding transmission line, thereby realizing signal transmission of the miniaturized antenna feed module 400 through the transmission line, for example, realizing the sending or input of signals. .
可以理解，所述傳輸線可為，但不局限於，同軸電纜(coaxial cable)，柔性印刷電路板(Flexible Printed Circuit Board，FPCB)或其他傳輸線等。 It can be understood that the transmission line may be, but is not limited to, a coaxial cable, a flexible printed circuit board (Flexible Printed Circuit Board, FPCB) or other transmission lines.
第二排佈實施例 Second arrangement embodiment
請一併參閱圖15A至圖15C，於本申請另一實施例中，所述微型化天線饋入模組400包括第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42。第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42在第二方向(參圖15C所示之Y軸方向)上不共面且在第一方向(參圖15C所示之X軸方向)上部分投影重疊設置。其中，對於第一方向及第二方向可參前述圖14C之相關描述。具體地，第二耦合饋入單元Patch 42設置於所述基體411之第一表面4111，第一耦合饋入單元Patch 41設置於所述基體411之第一表面4111以內，並靠近第一表面4111設置，以使第一耦合饋入單元Patch 41與第二耦合饋入單元Patch 42在第二表面4112上的投影部分重疊。在一些實施例中，所述基體411可由多層基板堆疊形成，第一耦合饋入單元Patch 41設置於基體411之表層(例如第一表面4111)的基板，第二耦合饋入單元Patch 42設置於基體411之內層的基板。第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42可分別藉由穿孔(過孔)連接至所述基體411之第二表面4112。於本申請實施例中，其中一個 耦合饋入單元(例如第一耦合饋入單元Patch 41)呈L形，另外一個耦合饋入單元(例如第二耦合饋入單元Patch 42)呈矩形。第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42分別設置有相應之訊號饋電點41211、41212，進而分別為相應之耦合饋入單元饋入電訊號。 Please refer to FIGS. 15A to 15C together. In another embodiment of the present application, the miniaturized antenna feed module 400 includes a first coupling feed unit Patch 41 and a second coupling feed unit Patch 42 . The first coupling feed-in unit Patch 41 and the second coupling feed-in unit Patch 42 are not coplanar in the second direction (refer to the Y-axis direction shown in FIG. 15C) and are not coplanar in the first direction (refer to the X-axis direction shown in FIG. 15C). direction), the upper part of the projection overlap setting. For the first direction and the second direction, please refer to the related description of FIG. 14C . Specifically, the second coupling feed unit Patch 42 is disposed on the first surface 4111 of the base 411, and the first coupling feed unit Patch 41 is disposed within the first surface 4111 of the base 411 and close to the first surface 4111. It is arranged so that the projections of the first coupling feed-in unit Patch 41 and the second coupling feed-in unit Patch 42 on the second surface 4112 partially overlap. In some embodiments, the base 411 may be formed by a stack of multi-layer substrates. The first coupling feed unit Patch 41 is disposed on the substrate on the surface layer of the base 411 (for example, the first surface 4111), and the second coupling feed unit Patch 42 is disposed on the substrate. The inner layer of the substrate 411. The first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 may be connected to the second surface 4112 of the base 411 through through holes (via holes) respectively. In the embodiment of this application, one of The coupling feeding unit (for example, the first coupling feeding unit Patch 41) is L-shaped, and the other coupling feeding unit (for example, the second coupling feeding unit Patch 42) is rectangular. The first coupling feeding unit Patch 41 and the second coupling feeding unit Patch 42 are respectively provided with corresponding signal feeding points 41211 and 41212, and then feed electrical signals to the corresponding coupling feeding units respectively.
可以理解，於本申請實施例中，並不對耦合饋入單元Patch 41、Patch 42之具體形狀及結構進行限定。 It can be understood that in the embodiment of the present application, the specific shapes and structures of the coupling feed units Patch 41 and Patch 42 are not limited.
所述第一耦合饋入單元Patch 41與第二耦合饋入單元Patch 42不共面且部分投影重疊設置。第一耦合饋入單元Patch 41與第二耦合饋入單元Patch 42之面積分配可依據頻寬需求做比例調整，如此藉由大面積提供較寬頻耦合效果。例如，當使得第一耦合饋入單元Patch 41與第二耦合饋入單元Patch 42靠近輻射體(輻射體可以為，但不限於，鐵件、PCB軟板上之銅箔、LDS製程中的導體、電子裝置之金屬邊框等等)時，兩者非接觸，如此可透過耦合將訊號傳遞至輻射體，並由輻射體來發射/接收無線訊號。顯然，當耦合饋入單元之面積分配越大，則透過耦合將訊號由輻射體發射/接收時，所得頻寬越寬，進而實現大面積提供較寬頻耦合效果。於本申請實施例中，第一耦合饋入單元Patch 41的面積大於第二耦合饋入單元Patch 42的面積。於本申請實施例中，第一耦合饋入單元Patch 41在所述基體411的投影面積占所述基體411的面積大於40%，第二耦合饋入單元Patch 42在所述基體411的投影面積占所述基體411的面積小於10%。 The first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 are not coplanar and partially overlapped in projection. The area allocation of the first coupling feed-in unit Patch 41 and the second coupling feed-in unit Patch 42 can be proportionally adjusted according to the bandwidth requirement, thus providing a wider frequency coupling effect through a large area. For example, when the first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 are brought close to the radiator (the radiator can be, but is not limited to, iron parts, copper foil on a PCB soft board, conductors in the LDS process , metal frames of electronic devices, etc.), the two are non-contact, so that the signal can be transmitted to the radiator through coupling, and the radiator can transmit/receive wireless signals. Obviously, when the area distribution of the coupling feed unit is larger, the resulting bandwidth will be wider when the signal is transmitted/received from the radiator through coupling, thereby achieving a wider frequency coupling effect over a large area. In the embodiment of the present application, the area of the first coupling feed unit Patch 41 is larger than the area of the second coupling feed unit Patch 42 . In the embodiment of the present application, the projected area of the first coupling feed unit Patch 41 on the base 411 accounts for more than 40% of the area of the base 411 , and the projected area of the second coupling feed unit Patch 42 on the base 411 It occupies less than 10% of the area of the base 411 .
可以理解，主動電路413的結構及功能、與連接器414的連接、連接器414的設置方式等，可參前述相關元件的詳細描述，在此不再累述。 It can be understood that the structure and function of the active circuit 413, the connection with the connector 414, the arrangement of the connector 414, etc. can be referred to the foregoing detailed description of the relevant components, and will not be described again here.
第三排佈實施例 Third arrangement embodiment
請一併參閱圖16A至圖16C，於本申請另一實施例中，所述微型化天線饋入模組400包括第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42。第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42在第二方向(參圖16C所示之Y軸方向)上不共面且在第一方向(參圖16C所示之X軸方向)上部分投影重疊設置。其中，對於第一方向及第二方向可參前述圖14C之相關描述。具體地，第一耦合饋入單元Patch 41設置於所述基體411之第一表面4111，第二耦合饋入單元Patch 42設置於所述基體411之第一表面4111以內，並靠近第一表面4111設置，以使第一耦合饋入單元Patch 41與第二耦合饋入單元Patch 42在第二表面4112上的投影部分重疊。第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42可分別藉由穿孔(過孔)連接至所述基體411之第二表面4112。於本申請實施例中，其中一個耦合饋入單元(例如第一耦合饋入單元Patch 41)呈L形，另外一個耦合饋入單元(例如第二耦合饋入單元Patch 42)呈矩形。第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42分別設置有相應之訊號饋電點41211、41212，進而分別為相應之耦合饋入單元饋入電訊號。 Please refer to FIGS. 16A to 16C together. In another embodiment of the present application, the miniaturized antenna feed module 400 includes a first coupling feed unit Patch 41 and a second coupling feed unit Patch 42 . The first coupling feed-in unit Patch 41 and the second coupling feed-in unit Patch 42 are not coplanar in the second direction (refer to the Y-axis direction shown in FIG. 16C) and are in the first direction (refer to the X-axis direction shown in FIG. 16C). direction), the upper part of the projection overlap setting. For the first direction and the second direction, please refer to the related description of FIG. 14C . Specifically, the first coupling feed unit Patch 41 is disposed on the first surface 4111 of the base 411, and the second coupling feed unit Patch 42 is disposed within the first surface 4111 of the base 411 and close to the first surface 4111. It is arranged so that the projections of the first coupling feed-in unit Patch 41 and the second coupling feed-in unit Patch 42 on the second surface 4112 partially overlap. The first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 may be connected to the second surface 4112 of the base 411 through through holes (via holes) respectively. In the embodiment of the present application, one coupling feed unit (for example, the first coupling feed unit Patch 41) is L-shaped, and the other coupling feed unit (for example, the second coupling feed unit Patch 42) is rectangular. The first coupling feeding unit Patch 41 and the second coupling feeding unit Patch 42 are respectively provided with corresponding signal feeding points 41211 and 41212, and then feed electrical signals to the corresponding coupling feeding units respectively.
可以理解，於本申請實施例中，並不對耦合饋入單元Patch 41、Patch 42之具體形狀及結構進行限定。 It can be understood that in the embodiment of the present application, the specific shapes and structures of the coupling feed units Patch 41 and Patch 42 are not limited.
所述第一耦合饋入單元Patch 41與第二耦合饋入單元Patch 42不共面且部分投影重疊設置。第一耦合饋入單元Patch 41與第二耦合饋入單元Patch 42之面積分配可依據頻寬需求做比例調整，如此藉由大面積提供較寬頻耦合效果。例如，當使得第一耦合饋入單元Patch 41與第二耦合饋入單元Patch 42靠近輻射體(例如電子裝置之金屬邊框)時，兩者非接觸，如此可透過耦合將訊號傳遞至輻射體，並由輻射體來發射/接收無線訊號。顯然，當耦合饋入單元 之面積分配越大，則透過耦合將訊號由輻射體發射/接收時，所得頻寬越寬，進而實現大面積提供較寬頻耦合效果。於本申請實施例中，第一耦合饋入單元Patch 41的面積大於第二耦合饋入單元Patch 42的面積。於本申請實施例中，第一耦合饋入單元Patch 41在所述基體411的投影面積占所述基體411的面積大於40%，第二耦合饋入單元Patch 42在所述基體411的投影面積占所述基體411的面積小於10%。 The first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 are not coplanar and partially overlapped in projection. The area allocation of the first coupling feed-in unit Patch 41 and the second coupling feed-in unit Patch 42 can be proportionally adjusted according to the bandwidth requirement, thus providing a wider frequency coupling effect through a large area. For example, when the first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 are brought close to the radiator (such as the metal frame of the electronic device), they are not in contact, so that the signal can be transmitted to the radiator through coupling. And the radiator transmits/receives wireless signals. Obviously, when the coupling feed unit The larger the area distribution, the wider the resulting bandwidth will be when the signal is transmitted/received from the radiator through coupling, thereby achieving a larger area to provide a wider frequency coupling effect. In the embodiment of the present application, the area of the first coupling feed unit Patch 41 is larger than the area of the second coupling feed unit Patch 42 . In the embodiment of the present application, the projected area of the first coupling feed unit Patch 41 on the base 411 accounts for more than 40% of the area of the base 411 , and the projected area of the second coupling feed unit Patch 42 on the base 411 It occupies less than 10% of the area of the base 411 .
可以理解，主動電路413的結構及功能、與連接器414的連接、連接器414的設置方式等，可參前述相關元件的詳細描述，在此不再累述。 It can be understood that the structure and function of the active circuit 413, the connection with the connector 414, the arrangement of the connector 414, etc. can be referred to the foregoing detailed description of the relevant components, and will not be described again here.
可理解，請一併參閱圖17及圖18，當使用所述微型化天線饋入模組400時，可將所述微型化天線饋入模組400設置於一金屬邊框5304之一側。其中，所述微型化天線饋入模組400設置有第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43之一側朝向所述金屬邊框5304設置。如此，可透過所述第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43與所述金屬邊框5304之耦合將訊號由所述金屬邊框5304進行發射與/或接收。另外，所述微型化天線饋入模組400還可利用所述主動電路413之切換開關，以切換多模態，進而實現多個寬頻操作。 It can be understood that, please refer to FIG. 17 and FIG. 18 together, when the miniaturized antenna feed module 400 is used, the miniaturized antenna feed module 400 can be disposed on one side of a metal frame 5304. Wherein, the miniaturized antenna feed module 400 is provided with a first coupling feed unit Patch 41, a second coupling feed unit Patch 42 and a third coupling feed unit Patch 43, with one side facing the metal frame 5304. . In this way, signals can be emitted from the metal frame 5304 through the coupling of the first coupling feed unit Patch 41, the second coupling feed unit Patch 42, and the third coupling feed unit Patch 43 to the metal frame 5304. and/or receive. In addition, the miniaturized antenna feed module 400 can also use the switch of the active circuit 413 to switch multiple modes, thereby achieving multiple broadband operations.
例如，於其中一個實施例中，當所述微型化天線饋入模組400中包括三個耦合饋入單元Patch 41、Patch 42、Patch 43，且設置有所述主動電路413時，三個耦合饋入單元Patch 41、Patch 42、Patch 43間隔設置，且藉由與所述金屬邊框5304間隔設置，進而可用以接收4G/5G中頻訊號(頻率範圍為1.7GHz-2.2GHz)、高頻訊號(頻率範圍為2.3GHz-2.7GHz)、超高頻(ultra high band，UHB)訊號(頻率範圍為3.3GHz-5GHz)、GPS訊號(頻率範圍為1.5GHz-1.6 GHz)、Wi-Fi訊號(頻率範圍為2.4GHz，5GHz)、5G-Sub 6訊號(頻率範圍為0.45GHz-6GHz)、5G-Sub 7訊號(頻率範圍為5.925GHz-7.125GHz)、Wi-Fi 6E(頻率範圍為5.925GHz-7.125GHz)等。 For example, in one embodiment, when the miniaturized antenna feed module 400 includes three coupling feed units Patch 41, Patch 42, and Patch 43, and the active circuit 413 is provided, the three coupling feed units The feed units Patch 41, Patch 42, and Patch 43 are spaced apart from each other, and by being spaced apart from the metal frame 5304, they can be used to receive 4G/5G mid-frequency signals (frequency range is 1.7GHz-2.2GHz) and high-frequency signals. (frequency range is 2.3GHz-2.7GHz), ultra high frequency (UHB) signal (frequency range is 3.3GHz-5GHz), GPS signal (frequency range is 1.5GHz-1.6 GHz), Wi-Fi signal (frequency range is 2.4GHz, 5GHz), 5G-Sub 6 signal (frequency range is 0.45GHz-6GHz), 5G-Sub 7 signal (frequency range is 5.925GHz-7.125GHz), Wi- Fi 6E (frequency range 5.925GHz-7.125GHz) etc.
當然，於本申請實施例中，並不對所述微型化天線饋入模組400之頻率進行限制。例如，可藉由調整所述微型化天線饋入模組400之形狀、長度、寬度、面積等參數，以調整所需之頻率。另外，所述耦合饋入單元Patch之形狀、長度、寬度、面積等參數，亦可根據所需之頻率進行調整。 Of course, in the embodiment of the present application, the frequency of the miniaturized antenna feed module 400 is not limited. For example, the required frequency can be adjusted by adjusting the shape, length, width, area and other parameters of the miniaturized antenna feed module 400 . In addition, the shape, length, width, area and other parameters of the coupling feed unit patch can also be adjusted according to the required frequency.
可理解，於本申請實施例中，所述金屬邊框5304還可以為任何導體，例如鐵件，PCB軟板上之銅箔，鐳射直接成型(Laser Direct Structuring，LDS)製程中之導體等，於此不做具體限定。例如，於其中一個實施例中，所述金屬邊框5304為一電子設備之金屬邊框，所述金屬邊框5304設置於一背板5305上，且與一電子元件，例如中框5307間隔設置，所述微型化天線饋入模組400設置於所述金屬邊框5304與所述中框5307之間。所述中框5307設置於所述背板5305上(參後詳述)。 It can be understood that in the embodiment of the present application, the metal frame 5304 can also be any conductor, such as iron parts, copper foil on a PCB flexible board, conductors in the laser direct structuring (LDS) process, etc., in This is not specifically limited. For example, in one embodiment, the metal frame 5304 is a metal frame of an electronic device. The metal frame 5304 is disposed on a back plate 5305 and is spaced apart from an electronic component, such as the middle frame 5307. The miniaturized antenna feed module 400 is disposed between the metal frame 5304 and the middle frame 5307 . The middle frame 5307 is disposed on the back plate 5305 (see details below).
可理解，於本申請實施例中，所述耦合饋入單元Patch與所述金屬邊框4304間隔設置。例如，所述耦合饋入單元Patch與所述金屬邊框5304平行設置。又如，所述耦合饋入單元Patch與所述金屬邊框5304間隔設置，但彼此不平行設置。當然，於其他實施例中，所述耦合饋入單元Patch亦可不連接所述金屬邊框5304。例如，於其中一個實施例中，所述耦合饋入單元Patch與所述金屬邊框5304間隔設置，且兩者之間無電性連接。 It can be understood that in this embodiment of the present application, the coupling feed unit Patch is spaced apart from the metal frame 4304 . For example, the coupling feed unit Patch is arranged parallel to the metal frame 5304 . For another example, the coupling feed unit Patch is spaced apart from the metal frame 5304 but not parallel to each other. Of course, in other embodiments, the coupling feed unit Patch may not be connected to the metal frame 5304. For example, in one embodiment, the coupling feed unit Patch is spaced apart from the metal frame 5304, and there is no electrical connection between the two.
可理解，於本申請實施例中，並不對所述金屬邊框5304之具體結構，與/或其與其他元件之連接關係等進行限制。例如，所述金屬邊框5304之側 端可連接至地(即所述金屬邊框5304接地處理)，或者不連接至地。又如，所述金屬邊框5304上可設置或未設置任何斷點、斷槽、縫隙等。 It can be understood that in the embodiment of the present application, the specific structure of the metal frame 5304 and/or its connection relationship with other components are not limited. For example, the side of the metal frame 5304 The terminal may be connected to the ground (that is, the metal frame 5304 is grounded), or may not be connected to the ground. For another example, the metal frame 5304 may or may not be provided with any break points, grooves, gaps, etc.
可以理解，請一併參閱圖17及圖18，於本申請實施例中，當所述微型化天線饋入模組400可應用於一電子裝置500時，可用以發射、接收無線電波以傳遞、交換無線訊號。所述電子裝置500可為掌上型通訊裝置(例如行動電話)、折疊機、智慧穿戴裝置(例如手錶，耳機等)、平板電腦、個人數位助理(personal digital assistant，PDA)等，於此不做具體限制。 It can be understood that please refer to FIG. 17 and FIG. 18 together. In the embodiment of the present application, when the miniaturized antenna feed module 400 can be applied to an electronic device 500, it can be used to transmit and receive radio waves to transmit, Exchange wireless signals. The electronic device 500 may be a handheld communication device (such as a mobile phone), a folding machine, a smart wearable device (such as a watch, headphones, etc.), a tablet computer, a personal digital assistant (PDA), etc., which will not be discussed here. Specific restrictions.
可以理解，所述電子裝置500可採用以下一種或多種通訊技術：藍牙(bluetooth，BT)通訊技術、全球定位系統(global positioning system，GPS)通訊技術、無線保真(wireless fidelity，Wi-Fi)通訊技術、全球移動通訊系統(global system for mobile communications，GSM)通訊技術、寬頻碼分多址(wideband code division multiple access，WCDMA)通訊技術、長期演進(long term evolution，LTE)通訊技術、5G通訊技術、SUB-6G通訊技術以及未來其他通訊技術等。 It can be understood that the electronic device 500 can adopt one or more of the following communication technologies: Bluetooth (BT) communication technology, global positioning system (GPS) communication technology, wireless fidelity (Wi-Fi) Communication technology, global system for mobile communications (GSM) communication technology, wideband code division multiple access (WCDMA) communication technology, long term evolution (LTE) communication technology, 5G communication technology, SUB-6G communication technology and other future communication technologies, etc.
於本申請實施例中，以所述電子裝置500為手機為例加以說明。 In the embodiment of the present application, the electronic device 500 is a mobile phone as an example for explanation.
請再次參閱圖17及圖18，於其中一實施例中，所述電子裝置500至少包括金屬邊框5304、背板5305、接地面5306及中框5307。 Please refer to FIG. 17 and FIG. 18 again. In one embodiment, the electronic device 500 at least includes a metal frame 5304, a backplane 5305, a ground plane 5306 and a middle frame 5307.
所述金屬邊框5304由金屬或其他導電材料製成。所述背板5305可由金屬或其他導電材料製成。所述金屬邊框5304設置於所述背板5305之邊緣，並與所述背板5305共同形成一容置空間(圖未示)。所述金屬邊框5304相對所述背板5305之一側設置有一開口(圖未標)，用於容置一顯示單元(圖未示)。所述顯示單元具有一顯示平面，該顯示平面裸露於該開口。可以理解，所述顯示單元可結合觸摸感測器組合成觸控屏。觸摸感測器又可稱為觸控面板 或觸敏面板。 The metal frame 5304 is made of metal or other conductive materials. The backplane 5305 may be made of metal or other conductive materials. The metal frame 5304 is disposed on the edge of the back plate 5305, and together with the back plate 5305 forms an accommodation space (not shown). An opening (not shown) is provided on one side of the metal frame 5304 opposite to the back plate 5305 for accommodating a display unit (not shown). The display unit has a display plane exposed at the opening. It can be understood that the display unit can be combined with a touch sensor to form a touch screen. Touch sensor is also called touch panel Or touch-sensitive panels.
可以理解，於本申請實施例中，所述顯示單元具有高屏占比。即所述顯示單元之顯示平面之面積大於70%之電子裝置之正面面積，甚至可做到正面全螢幕。具體於本申請實施例中，所述全螢幕是指除了所述電子裝置500上開設之必要之槽孔以外，所述顯示單元之左側、右側、下側均可無縫隙地連接至所述金屬邊框5304。 It can be understood that in the embodiment of the present application, the display unit has a high screen-to-body ratio. That is, the area of the display plane of the display unit is greater than 70% of the front area of the electronic device, and can even achieve a full front screen. Specifically in the embodiment of the present application, the full screen means that in addition to the necessary slots opened on the electronic device 500, the left, right and lower sides of the display unit can be seamlessly connected to the metal Border 5304.
所述接地面5306可由金屬或其他導電材料製成。所述接地面5306可設置於所述金屬邊框5304與所述背板5305共同圍成之所述容置空間內，且連接至所述背板5305。 The ground plane 5306 may be made of metal or other conductive materials. The ground plane 5306 may be disposed in the accommodating space formed by the metal frame 5304 and the back plate 5305, and be connected to the back plate 5305.
所述中框5307由金屬或其他導電材料製成。所述中框5307之形狀及尺寸可小於或大於所述接地面5306。所述中框5307疊設於所述接地面5306上。於本實施例中，所述中框5307為設置於所述顯示單元與所述接地面5306之間之金屬片。所述中框5307用於支撐所述顯示單元、提供電磁屏蔽、及提高所述電子裝置500之機構強度。 The middle frame 5307 is made of metal or other conductive materials. The shape and size of the middle frame 5307 may be smaller or larger than the ground plane 5306 . The middle frame 5307 is stacked on the ground plane 5306 . In this embodiment, the middle frame 5307 is a metal piece disposed between the display unit and the ground plane 5306 . The middle frame 5307 is used to support the display unit, provide electromagnetic shielding, and improve the mechanical strength of the electronic device 500 .
可以理解，於本實施例中，所述金屬邊框5304、所述背板5305、所述接地面5306及所述中框5307可構成一體成型之金屬框體。所述背板5305、所述接地面5306及所述中框5307為大面積金屬，因此可共同構成所述電子裝置500之系統接地面(圖未標)。 It can be understood that in this embodiment, the metal frame 5304, the back plate 5305, the ground plane 5306 and the middle frame 5307 can form an integrated metal frame. The backplane 5305 , the ground plane 5306 and the middle frame 5307 are made of large-area metal, and therefore can jointly form a system ground plane (not labeled) of the electronic device 500 .
所述中框5307與所述金屬邊框5304間隔設置，進而於兩者之間形成狹縫5309。 The middle frame 5307 is spaced apart from the metal frame 5304, and a slit 5309 is formed between them.
可以理解，當所述微型化天線饋入模組400應用至所述電子裝置500時，所述微型化天線饋入模組400可設置於所述狹縫5309內，且大致垂直 所述接地面5306所在平面設置。所述金屬邊框5304之一部分可構成輻射體。具體地，所述金屬邊框5304上設置有至少一縫隙5310。所述縫隙5310隔斷所述金屬邊框5304，以將所述金屬邊框5304至少劃分為間隔設置之第一部分5313及第二部分5314。其中所述第一部分5313及第二部分5314均能夠用以輻射無線訊號。所述第二部分5314可電連接至所述系統接地面，例如所述接地面5306，即接地。 It can be understood that when the miniaturized antenna feed module 400 is applied to the electronic device 500, the miniaturized antenna feed module 400 can be disposed in the slit 5309 and be substantially vertical. The ground plane 5306 is located on a plane. A part of the metal frame 5304 may constitute a radiator. Specifically, at least one gap 5310 is provided on the metal frame 5304. The gap 5310 separates the metal frame 5304 to divide the metal frame 5304 into at least a first part 5313 and a second part 5314 that are spaced apart. The first part 5313 and the second part 5314 can both be used to radiate wireless signals. The second portion 5314 may be electrically connected to the system ground plane, such as the ground plane 5306, ie, ground.
可以理解，於其中一個實施例中，所述縫隙5310可與所述狹縫5309連通，並填充有絕緣材料，例如塑膠、橡膠、玻璃、木材、陶瓷等，但不以此為限。 It can be understood that in one embodiment, the slit 5310 can be connected with the slit 5309 and filled with insulating materials, such as plastic, rubber, glass, wood, ceramics, etc., but is not limited thereto.
可以理解，當所述微型化天線饋入模組400設置於所述狹縫5309內時，所述微型化天線饋入模組400上之耦合饋入單元Patch 41、Patch 42、Patch 43朝向所述第一部分5313，且與所述第一部分5313間隔設置。所述連接器414設置於所述基體411之另一表面，即背向所述第一部分5313設置。所述連接器414之一端電連接至所述中框5307，另一端與所述基體411電連接。 It can be understood that when the miniaturized antenna feed module 400 is disposed in the slit 5309, the coupling feed units Patch 41, Patch 42, and Patch 43 on the miniaturized antenna feed module 400 face the direction of the slit 5309. The first part 5313 is located at a distance from the first part 5313. The connector 414 is disposed on the other surface of the base 411 , that is, disposed facing away from the first portion 5313 . One end of the connector 414 is electrically connected to the middle frame 5307 , and the other end is electrically connected to the base 411 .
在另一些實施例中，所述微型化天線饋入模組400對應第一部分5313、縫隙5310及第二部分5314設置，微型化天線饋入模組400之第一耦合饋入單元Patch 41朝向第一部分5313，第二耦合饋入單元Patch 42及/或第三耦合饋入單元Patch 43朝向第二部分5314。從而使得天線饋入耦合模組100可同時向第一部分5313和第二部分5314饋入電訊號。 In other embodiments, the miniaturized antenna feed module 400 is arranged corresponding to the first part 5313, the gap 5310 and the second part 5314, and the first coupling feed unit Patch 41 of the miniaturized antenna feed module 400 faces the first part 5313, the gap 5310, and the second part 5314. In one part 5313 , the second coupling feed-in unit Patch 42 and/or the third coupling feed-in unit Patch 43 faces the second part 5314 . Therefore, the antenna feeding coupling module 100 can feed electrical signals to the first part 5313 and the second part 5314 at the same time.
請一併參閱圖19，於接下來之實施例中，以所述微型化天線饋入模組400的第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43均包括相應之訊號饋電點(例如第一訊號饋電點port1、第二 訊號饋電點port2及第三訊號饋電點port3，即前面所述之訊號饋電點41211、41212、41213)。每一訊號饋電點分別藉由相應之匹配單元電連接至相應之饋入源。例如，所述第一耦合饋入單元Patch1之第一訊號饋電點port1藉由第一匹配單4151電連接至饋入源4161。所述第二耦合饋入單元Patch2之第二訊號饋電點port2藉由第二匹配單元4152電連接至饋入源4162。所述第三耦合饋入單元Patch3之第三訊號饋電點port3藉由第三匹配單元4153電連接至饋入源4163。 Please refer to Figure 19 together. In the following embodiment, the first coupling feed unit Patch 41, the second coupling feed unit Patch 42 and the third coupling feed unit of the miniaturized antenna feed module 400 are used. Each unit Patch 43 includes corresponding signal feed points (for example, the first signal feed point port1, the second The signal feed point port2 and the third signal feed point port3 are the signal feed points 41211, 41212, and 41213 mentioned above). Each signal feed point is electrically connected to a corresponding feed source through a corresponding matching unit. For example, the first signal feed point port1 of the first coupling feed unit Patch1 is electrically connected to the feed source 4161 through the first matching unit 4151. The second signal feed point port2 of the second coupling feed unit Patch2 is electrically connected to the feed source 4162 through the second matching unit 4152. The third signal feed point port3 of the third coupling feed unit Patch3 is electrically connected to the feed source 4163 through the third matching unit 4153.
另外，所述微型化天線饋入模組400中之主動電路413間隔設置於所述連接器414。如圖19所示，所述主動電路413包括切換開關4131及第一可調元件4132、第二可調元件4133及第三可調元件4134。其中，所述切換開關4131之一端電連接至所述連接器414，另一端藉由相應之可調元件4132、4133、4134電連接至對應之饋入源。例如，所述切換開關4131藉由第一可調元件4132電連接至所述第一饋入源4161，藉由第二可調元件4133電連接至所述第二饋入源4162，藉由第三可調元件4134電連接至所述第三饋入源4163。即，所述匹配電路至少包括第一匹配單元4151、第二匹配單元4152及第三匹配單元4153。 In addition, the active circuit 413 in the miniaturized antenna feed module 400 is spaced apart from the connector 414 . As shown in FIG. 19 , the active circuit 413 includes a switch 4131 and a first adjustable element 4132 , a second adjustable element 4133 and a third adjustable element 4134 . One end of the switch 4131 is electrically connected to the connector 414, and the other end is electrically connected to the corresponding feed source through corresponding adjustable components 4132, 4133, and 4134. For example, the switch 4131 is electrically connected to the first feed source 4161 through the first adjustable element 4132, and is electrically connected to the second feed source 4162 through the second adjustable element 4133. Three adjustable elements 4134 are electrically connected to the third feed source 4163. That is, the matching circuit at least includes a first matching unit 4151, a second matching unit 4152, and a third matching unit 4153.
如此，藉由設置所述第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42、第三耦合饋入單元Patch 43均與所述第一部分5313耦合共振出具有可調性之模態。另外，還可控制相鄰兩個耦合饋入單元之間之耦合狀態，透過耦合分別產生可調性且天線效率佳之獨立模態。再者，藉由所述主動電路413中之切換開關4131之切換，可切換多模態，並使用多個可調元件(例如可調元件4132、可調元件4133、可調元件4134)實現多個頻段包覆。 In this way, by arranging the first coupling feed unit Patch 41, the second coupling feed unit Patch 42, and the third coupling feed unit Patch 43, they are all coupled and resonated with the first part 5313 to produce an adjustable mode. . In addition, the coupling state between two adjacent coupling feed units can also be controlled, and independent modes with adjustability and good antenna efficiency can be generated through coupling. Furthermore, by switching the switch 4131 in the active circuit 413, multiple modes can be switched, and multiple adjustable components (such as the adjustable component 4132, the adjustable component 4133, and the adjustable component 4134) are used to achieve multiple modes. frequency band coverage.
顯然，所述切換開關4131為中高頻/UHB及NR/Wi-Fi 2.4G、Wi-Fi 5G與LAA切換開關，用以切換中高頻/UHB及NR/Wi-Fi 2.4G與Wi-Fi 5G頻段。 Obviously, the switch 4131 is medium and high frequency/UHB and NR/Wi-Fi 2.4G, Wi-Fi 5G and LAA switch to switch between mid-high frequency/UHB and NR/Wi-Fi 2.4G and Wi-Fi 5G frequency bands.
亦就是說，本申請中之微型化天線饋入模組400可應用至電子裝置500中，以提升天線效率頻寬並具有最佳天線效率，且利用所述切換開關4131之切換，可有效提升天線頻率覆蓋範圍。具體地，於其中一個實施例中，所述微型化天線饋入模組400適用之工作頻率範圍涵蓋中頻1.71GHz至2.17GHz、高頻2.3GHz-2.69GHz、超高頻3.4GHz至3.8GHz、Wi-Fi 2.4G、Wi-Fi 5G，並可支援5G Sub 6 N77/N78/N79、5G Sub 7、Wi-Fi 6E頻段。 That is to say, the miniaturized antenna feed module 400 in this application can be applied to the electronic device 500 to improve the antenna efficiency bandwidth and have the best antenna efficiency, and by using the switching of the switch 4131, the antenna efficiency can be effectively improved. Antenna frequency coverage. Specifically, in one embodiment, the applicable operating frequency range of the miniaturized antenna feed module 400 covers intermediate frequency 1.71GHz to 2.17GHz, high frequency 2.3GHz-2.69GHz, and ultra-high frequency 3.4GHz to 3.8GHz. , Wi-Fi 2.4G, Wi-Fi 5G, and can support 5G Sub 6 N77/N78/N79, 5G Sub 7, Wi-Fi 6E frequency bands.
即，所述微型化天線饋入模組400藉由將所述耦合饋入單元Patch1、Patch 42、Patch 43設置為獨立之片體，並於所述耦合饋入單元Patch1、Patch 42、Patch 43之適當位置設置相應之訊號饋電點，並藉由所述輻射體(亦可為電子設備500之金屬邊框，例如第一部分5313)作為金屬輻射體，於狹縫5309中由所述輻射體與所述微型化天線饋入模組400耦合能量共振出模態，涵蓋中、高頻、超高頻、5G Sub 6 N77、5G Sub 6 N78、5G Sub 6 N79、Wi-Fi 2.4G、Wi-Fi 5G、5G Sub 7、Wi-Fi 6E頻段，藉以大幅提升其頻寬與天線效率，亦可涵蓋全球常用5G之通訊頻段之應用，以及支援LTE-A(LTE-Advanced之簡稱，是LTE技術之後續演進)之載波聚合應用(Carrier Aggregation，CA)要求。 That is, the miniaturized antenna feed module 400 is configured by configuring the coupling feed units Patch1, Patch 42, and Patch 43 as independent pieces, and connecting the coupling feed units Patch1, Patch 42, and Patch 43 to each other. A corresponding signal feed point is set at an appropriate position, and the radiator (which can also be a metal frame of the electronic device 500, such as the first part 5313) is used as a metal radiator, and the radiator and the radiator are connected in the slit 5309. The miniaturized antenna feed module 400 couples energy to resonate into modes, covering medium, high frequency, ultra-high frequency, 5G Sub 6 N77, 5G Sub 6 N78, 5G Sub 6 N79, Wi-Fi 2.4G, Wi-Fi Fi 5G, 5G Sub 7, and Wi-Fi 6E frequency bands can greatly improve its bandwidth and antenna efficiency, and can also cover the application of commonly used 5G communication frequency bands around the world, and support LTE-A (abbreviation for LTE-Advanced, which is LTE technology Carrier Aggregation (CA) requirements for subsequent evolution).
請一併參閱圖20，為所述微型化天線饋入模組400的多個所述耦合饋入單元Patch 41、Patch 42、Patch 43分別輻射無線訊號時之S參數(散射參數)曲線圖。其中，圖20為微型化天線饋入模組400中如圖13A及圖13B所示的第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43輻射無線訊號時之S參數。 Please also refer to FIG. 20 , which is a graph of S parameters (scattering parameters) when the plurality of coupling feed units Patch 41 , Patch 42 , and Patch 43 of the miniaturized antenna feed module 400 respectively radiate wireless signals. Among them, Figure 20 shows the radiation of the first coupling feed unit Patch 41, the second coupling feed unit Patch 42 and the third coupling feed unit Patch 43 shown in Figures 13A and 13B in the miniaturized antenna feed module 400. S parameters of wireless signals.
可理解，藉由所述切換開關4131切換至不同之訊號饋電點，可控 制其頻率模態，以涵蓋中頻1.71GHz-2.17GHz、高頻2.3GHz-2.69GHz、超高頻3.4GHz-3.8GHz、GPS、Wi-Fi 2.4G、Wi-Fi 5G頻段，並可支援5G Sub 6 N77/N78/N79、5G Sub 7、Wi-Fi 6E頻段。 It can be understood that by switching to different signal feed points through the switch 4131, the controllable Customize its frequency mode to cover mid-frequency 1.71GHz-2.17GHz, high-frequency 2.3GHz-2.69GHz, ultra-high frequency 3.4GHz-3.8GHz, GPS, Wi-Fi 2.4G, Wi-Fi 5G frequency bands, and can support 5G Sub 6 N77/N78/N79, 5G Sub 7, Wi-Fi 6E frequency band.
請一併參閱圖21，為所述微型化天線饋入模組400的多個所述耦合饋入單元Patch 41、Patch 42、Patch 43分別輻射無線訊號時之效率曲線圖。其中，圖21為微型化天線饋入模組400中如圖13A及圖13B所示的第一耦合饋入單元Patch 41、第二耦合饋入單元Patch 42及第三耦合饋入單元Patch 43輻射無線訊號時之效率曲線圖。 Please also refer to FIG. 21 , which is an efficiency curve diagram when the coupling feed units Patch 41 , Patch 42 , and Patch 43 of the miniaturized antenna feed module 400 respectively radiate wireless signals. Among them, Figure 21 shows the radiation of the first coupling feed unit Patch 41, the second coupling feed unit Patch 42 and the third coupling feed unit Patch 43 shown in Figures 13A and 13B in the miniaturized antenna feed module 400. Efficiency curve for wireless signals.
請一併參閱圖22A，為所述微型化天線饋入模組400的所述第一耦合饋入單元Patch 41分別設置為如圖14A架構之第一排佈實施例、圖15A架構之第二排佈實施例、圖16A架構之第一排佈實施例並輻射無線訊號時之S參數(散射參數)曲線圖。其中，圖22A為所述微型化天線饋入模組400的所述第一耦合饋入單元Patch 41在如圖14A所示第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42設置於第一表面4111、如圖15A所示第一耦合饋入單元Patch 41設置在第一表面4111以內及第二耦合饋入單元Patch 42設置於第一表面4111、如圖16A第一耦合饋入單元Patch 41設置在第一表面4111及第二耦合饋入單元Patch 42設置在第一表面4111以內時之S參數。 Please refer to FIG. 22A together. The first coupling feed unit Patch 41 of the miniaturized antenna feed module 400 is respectively configured as the first arrangement embodiment of the structure of FIG. 14A and the second arrangement of the structure of FIG. 15A. Arrangement embodiment, the first arrangement embodiment of the structure in Figure 16A and the S parameter (scattering parameter) curve when radiating wireless signals. 22A shows that the first coupling feeding unit Patch 41 of the miniaturized antenna feeding module 400 is arranged in the first coupling feeding unit Patch 41 and the second coupling feeding unit Patch 42 as shown in FIG. 14A On the first surface 4111, as shown in FIG. 15A, the first coupling feed unit Patch 41 is disposed within the first surface 4111, and the second coupling feed unit Patch 42 is disposed on the first surface 4111, as shown in FIG. 16A. The S parameter when the unit Patch 41 is disposed on the first surface 4111 and the second coupling feed unit Patch 42 is disposed within the first surface 4111.
請一併參閱圖22B，為所述微型化天線饋入模組400的所述第二耦合饋入單元Patch 42分別設置為如圖14A架構之第一排佈實施例、圖15A架構之第二排佈實施例、圖16A架構之第三排佈實施例並輻射無線訊號時之S參數(散射參數)曲線圖。其中，圖22B為所述微型化天線饋入模組400的所述第二耦合饋入單元Patch 42在如圖14A所示第一耦合饋入單元Patch 41及第二耦 合饋入單元Patch 42設置於第一表面4111、如圖15A所示第一耦合饋入單元Patch 41設置在第一表面4111以內及第二耦合饋入單元Patch 42設置於第一表面4111、如圖16A第一耦合饋入單元Patch1設置在第一表面4111及第二耦合饋入單元Patch 42設置在第一表面4111以內時之S參數。 Please refer to FIG. 22B as well. The second coupling feed unit Patch 42 of the miniaturized antenna feed module 400 is respectively configured as the first arrangement embodiment of the structure of FIG. 14A and the second arrangement of the structure of FIG. 15A. Arrangement embodiment, the third arrangement embodiment of the structure in Figure 16A and the S parameter (scattering parameter) curve when radiating wireless signals. 22B shows the second coupling feed unit Patch 42 of the miniaturized antenna feed module 400 in the first coupling feed unit Patch 41 and the second coupling feed unit as shown in FIG. 14A. The combined feed-in unit Patch 42 is disposed on the first surface 4111, as shown in FIG. 15A. The first coupling feed-in unit Patch 41 is disposed within the first surface 4111, and the second coupling feed-in unit Patch 42 is disposed on the first surface 4111, as shown in FIG. Figure 16A shows the S parameters when the first coupling feed unit Patch1 is disposed on the first surface 4111 and the second coupling feed unit Patch 42 is disposed within the first surface 4111.
可理解，藉由所述切換開關4131切換至不同之訊號饋電點，可控制其頻率模態，以涵蓋中頻1.71GHz-2.17GHz、高頻2.3GHz-2.69GHz、超高頻3.4GHz-3.8GHz，GPS、Wi-Fi 2.4G、Wi-Fi 5G頻段，並可支援5G Sub 6 N77/N78/N79、5G Sub 7、Wi-Fi 6E頻段。 It can be understood that by switching the switch 4131 to different signal feed points, its frequency mode can be controlled to cover the intermediate frequency 1.71GHz-2.17GHz, the high frequency 2.3GHz-2.69GHz, and the ultra-high frequency 3.4GHz- 3.8GHz, GPS, Wi-Fi 2.4G, Wi-Fi 5G frequency bands, and can support 5G Sub 6 N77/N78/N79, 5G Sub 7, Wi-Fi 6E frequency bands.
請一併參閱圖23A，為所述微型化天線饋入模組400的所述第一耦合饋入單元Patch 41分別設置為如圖14A架構之第一排佈實施例、圖15A架構之第二排佈實施例、圖16A架構之第一排佈實施例並輻射無線訊號時之效率曲線圖。其中，圖23A為所述微型化天線饋入模組400的所述第一耦合饋入單元Patch1在如圖14A所示第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42設置於第一表面4111、如圖15A所示第一耦合饋入單元Patch 41設置在第一表面4111以內及第二耦合饋入單元Patch 42設置於第一表面4111、如圖16A第一耦合饋入單元Patch 41設置在第一表面4111及第二耦合饋入單元Patch 42設置在第一表面4111以內時之輻射效率(圖中所示為Rad.)值及總效率(圖中所示為Tot.)值。 Please refer to FIG. 23A together. The first coupling feed unit Patch 41 of the miniaturized antenna feed module 400 is respectively configured as the first arrangement embodiment of the structure of FIG. 14A and the second arrangement of the structure of FIG. 15A. Arrangement embodiment, the first arrangement embodiment of the structure of Figure 16A and the efficiency curve when radiating wireless signals. 23A shows the first coupling feed unit Patch1 of the miniaturized antenna feed module 400. As shown in FIG. 14A, the first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 are disposed at The first surface 4111, as shown in Figure 15A, the first coupling feed-in unit Patch 41 is disposed within the first surface 4111, and the second coupling feed-in unit Patch 42 is disposed on the first surface 4111, as shown in Figure 16A, the first coupling feed-in unit The radiation efficiency (Rad. shown in the figure) value and the total efficiency (Tot. shown in the figure) when Patch 41 is disposed on the first surface 4111 and the second coupling feed unit Patch 42 is disposed within the first surface 4111. value.
請一併參閱圖23B，為所述微型化天線饋入模組400的所述第二耦合饋入單元Patch 42分別設置為圖14A架構之第一排佈實施例、圖15A架構之第二排佈實施例、圖16A架構之第二排佈實施例並輻射無線訊號時之效率曲線圖。其中，圖23B為所述微型化天線饋入模組400的所述第二耦合饋入單元Patch 42在如圖14A所示第一耦合饋入單元Patch 41及第二耦合饋入單元Patch 42設置於第一表面4111、如圖15A所示第一耦合饋入單元Patch 41設置在第一表面4111以內及第二耦合饋入單元Patch 42設置於第一表面4111、如圖16A第一耦合饋入單元Patch 41設置在第一表面4111及第二耦合饋入單元Patch 42設置在第一表面4111以內時之輻射效率(圖中所示為Rad.)值及總效率(圖中所示為Tot.)值。 Please also refer to FIG. 23B. The second coupling feed unit Patch 42 of the miniaturized antenna feed module 400 is respectively configured as the first arrangement embodiment of the structure of FIG. 14A and the second row of the structure of FIG. 15A. The efficiency curve of the second arrangement embodiment of the structure shown in Figure 16A and radiating wireless signals. 23B shows the second coupling feed unit Patch of the miniaturized antenna feed module 400. 42. As shown in FIG. 14A, the first coupling feed unit Patch 41 and the second coupling feed unit Patch 42 are disposed on the first surface 4111. As shown in FIG. 15A, the first coupling feed unit Patch 41 is disposed on the first surface 4111. and the second coupling feed-in unit Patch 42 is disposed on the first surface 4111. As shown in Figure 16A, the first coupling feed-in unit Patch 41 is disposed on the first surface 4111 and the second coupling feed-in unit Patch 42 is disposed on the first surface 4111. The radiation efficiency (Rad. shown in the figure) value and the total efficiency (Tot. shown in the figure) value at that time.
顯然，藉由設置所述切換開關4131，並使得所述切換開關131切換至不同之訊號饋電點，以控制頻率模態，進而涵蓋至中頻(1.71GHz-2.17GHz)、高頻(2.3GHz-2.69GHz)、超高頻(3.4GHz-3.8GHz)、Wi-Fi 2.4G、Wi-Fi 5G及LAA，並可支援5G Sub 6 N77/N78/N79、5G Sub 7、Wi-Fi 6E頻段。 Obviously, by setting the switch 4131 and switching the switch 131 to different signal feed points, the frequency mode is controlled, thereby covering medium frequency (1.71GHz-2.17GHz), high frequency (2.3 GHz-2.69GHz), ultra high frequency (3.4GHz-3.8GHz), Wi-Fi 2.4G, Wi-Fi 5G and LAA, and can support 5G Sub 6 N77/N78/N79, 5G Sub 7, Wi-Fi 6E frequency band.
第三實施例 Third embodiment
請一併參閱圖24，可以理解，本申請第三實施例提供一種具有至少一天線饋入模組600的電子裝置700。所述至少一天線饋入模組600可以為第一實施例的天線饋入耦合模組100或第二實施例的微型化天線饋入模組400中的一種。當電子裝置700包括複數個天線饋入模組600時，所述天線饋入模組600可以為第一實施例的天線饋入耦合模組100、第二實施例的微型化天線饋入模組400中的一種、或者兩者的組合。 Please refer to FIG. 24 together, and it can be understood that the third embodiment of the present application provides an electronic device 700 having at least one antenna feed module 600. The at least one antenna feed module 600 may be one of the antenna feed coupling module 100 of the first embodiment or the miniaturized antenna feed module 400 of the second embodiment. When the electronic device 700 includes a plurality of antenna feed modules 600, the antenna feed modules 600 may be the antenna feed coupling module 100 of the first embodiment or the miniaturized antenna feed module of the second embodiment. 400, or a combination of both.
可以理解，請一併參閱圖24，於本申請實施例中，當所述天線饋入模組600應用於電子裝置700時，可用以饋入電訊號，並與電子裝置的金屬邊框協同發射、接收無線電波以傳遞、交換無線訊號。所述電子裝置700可為掌上型通訊裝置(例如行動電話)、折疊機、智慧穿戴裝置(例如手錶，耳機等)、平板電腦、個人數位助理(personal digital assistant，PDA)等，於此不做 具體限制。 It can be understood that please refer to FIG. 24 together. In the embodiment of the present application, when the antenna feed module 600 is applied to the electronic device 700, it can be used to feed electrical signals and transmit and receive in cooperation with the metal frame of the electronic device. Radio waves are used to transmit and exchange wireless signals. The electronic device 700 may be a handheld communication device (such as a mobile phone), a folding machine, a smart wearable device (such as a watch, headphones, etc.), a tablet computer, a personal digital assistant (PDA), etc., which will not be discussed here. Specific restrictions.
可以理解，所述電子裝置700可採用以下一種或多種通訊技術：藍牙(bluetooth，BT)通訊技術、全球定位系統(global positioning system，GPS)通訊技術、無線保真(wireless fidelity，Wi-Fi)通訊技術、全球移動通訊系統(global system for mobile communications，GSM)通訊技術、寬頻碼分多址(wideband code division multiple access，WCDMA)通訊技術、長期演進(long term evolution，LTE)通訊技術、5G通訊技術、SUB-6G通訊技術以及未來其他通訊技術等。 It can be understood that the electronic device 700 may adopt one or more of the following communication technologies: Bluetooth (BT) communication technology, global positioning system (GPS) communication technology, wireless fidelity (Wi-Fi) Communication technology, global system for mobile communications (GSM) communication technology, wideband code division multiple access (WCDMA) communication technology, long term evolution (LTE) communication technology, 5G communication technology, SUB-6G communication technology and other future communication technologies, etc.
於本申請實施例中，以所述電子裝置700為手機為例加以說明。 In the embodiment of the present application, the electronic device 700 is a mobile phone as an example for explanation.
請再次參閱圖24，於其中一實施例中，所述電子裝置700至少包括金屬邊框7304、接地面7306及中框7307。 Please refer to FIG. 24 again. In one embodiment, the electronic device 700 at least includes a metal frame 7304, a ground plane 7306, and a middle frame 7307.
所述金屬邊框7304由金屬或其他導電材料製成。可以理解，電子裝置700還可包括背板(圖未示)。所述背板可由金屬或其他導電材料製成。所述金屬邊框7304設置於所述背板之邊緣，並與所述背板共同形成一容置空間(圖未示)。所述金屬邊框7304相對所述背板之一側設置有一開口(圖未示)，用於容置一顯示單元(圖未示)。所述顯示單元具有一顯示平面，該顯示平面裸露於該開口。可以理解，所述顯示單元可結合觸摸感測器組合成觸控屏。觸摸感測器又可稱為觸控面板或觸敏面板。 The metal frame 7304 is made of metal or other conductive materials. It can be understood that the electronic device 700 may also include a backplane (not shown). The backplane can be made of metal or other conductive materials. The metal frame 7304 is disposed on the edge of the back panel, and together with the back panel, forms an accommodation space (not shown). The metal frame 7304 is provided with an opening (not shown) on one side opposite to the backplane for accommodating a display unit (not shown). The display unit has a display plane exposed at the opening. It can be understood that the display unit can be combined with a touch sensor to form a touch screen. A touch sensor can also be called a touch panel or a touch-sensitive panel.
請一併參閱圖24，於本申請實施例中，所述金屬邊7304大致呈矩形。所述金屬邊框7304包括依次連接的頂部金屬邊框73041、第一金屬側邊框73042、底部金屬邊框73043及第二金屬側邊框73044。 Please also refer to Figure 24. In the embodiment of the present application, the metal edge 7304 is generally rectangular. The metal frame 7304 includes a top metal frame 73041, a first metal side frame 73042, a bottom metal frame 73043 and a second metal side frame 73044 connected in sequence.
可以理解，於本申請實施例中，所述顯示單元具有高屏占比。即所述顯示單元之顯示平面之面積大於70%之電子裝置之正面面積，甚至可做到 正面全螢幕。具體於本申請實施例中，所述全螢幕是指除了所述電子裝置700上開設之必要之槽孔以外，所述顯示單元之左側、右側、下側均可無縫隙地連接至所述金屬邊框7304。 It can be understood that in the embodiment of the present application, the display unit has a high screen-to-body ratio. That is, the area of the display plane of the display unit is greater than 70% of the front area of the electronic device, and it can even be achieved Full screen front. Specifically in the embodiment of the present application, the full screen means that in addition to the necessary slots opened on the electronic device 700, the left, right and lower sides of the display unit can be seamlessly connected to the metal Border 7304.
所述接地面7306可由金屬或其他導電材料製成。所述接地面7306可設置於所述金屬邊框7304與所述背板共同圍成之所述容置空間內，且連接至所述背板。 The ground plane 7306 may be made of metal or other conductive materials. The ground plane 7306 may be disposed in the accommodating space formed by the metal frame 7304 and the backplane, and be connected to the backplane.
所述中框7307由金屬或其他導電材料製成。所述中框7307之形狀及尺寸可小於或大於所述接地面7306。所述中框7307疊設於所述接地面7306上。於本實施例中，所述中框7307為設置於所述顯示單元與所述接地面7306之間之金屬片。所述中框7307用於支撐所述顯示單元、提供電磁屏蔽、及提高所述電子裝置700之機構強度。 The middle frame 7307 is made of metal or other conductive materials. The shape and size of the middle frame 7307 may be smaller or larger than the ground plane 7306 . The middle frame 7307 is stacked on the ground plane 7306. In this embodiment, the middle frame 7307 is a metal piece disposed between the display unit and the ground plane 7306. The middle frame 7307 is used to support the display unit, provide electromagnetic shielding, and improve the mechanical strength of the electronic device 700 .
可以理解，於本實施例中，所述金屬邊框7304、所述背板、所述接地面7306及所述中框7307可構成一體成型之金屬框體。所述背板、所述接地面7306及所述中框7307為大面積金屬，因此可共同構成所述電子裝置700之系統接地面(圖未標)。 It can be understood that in this embodiment, the metal frame 7304, the back plate, the ground plane 7306 and the middle frame 7307 can form an integrally formed metal frame. The backplane, the ground plane 7306 and the middle frame 7307 are made of large-area metal, so they can jointly form the system ground plane of the electronic device 700 (not labeled).
所述中框7307與所述金屬邊框7304間隔設置，進而於兩者之間形成狹縫7309。具體地，所述中框7307與所述第一金屬側邊框73042及第二金屬側邊框73044形成狹縫7309。 The middle frame 7307 is spaced apart from the metal frame 7304, and a slit 7309 is formed between them. Specifically, the middle frame 7307 forms a slit 7309 with the first metal side frame 73042 and the second metal side frame 73044.
所述電子裝置700包括複數個天線饋入模組600時，複數個天線饋入模組600可以間隔設置，並對應所述第一金屬側邊框73042和/或第二金屬側邊框73044。 When the electronic device 700 includes a plurality of antenna feed modules 600, the plurality of antenna feed modules 600 may be arranged at intervals and corresponding to the first metal side frame 73042 and/or the second metal side frame 73044.
當複數個天線饋入模組600為第一實施例的天線饋入耦合模組100 時，所述複數個天線饋入模組600與所述第一金屬側邊框73042和/或第二金屬側邊框73044接觸。複數個天線饋入模組600分別向第一金屬側邊框73042和/或第二金屬側邊框73044饋入電訊號。 When the plurality of antenna feed modules 600 are the antenna feed coupling modules 100 of the first embodiment, At this time, the plurality of antenna feed modules 600 are in contact with the first metal side frame 73042 and/or the second metal side frame 73044. The plurality of antenna feeding modules 600 feed electrical signals to the first metal side frame 73042 and/or the second metal side frame 73044 respectively.
當複數個天線饋入模組600為第二實施例的微型化天線饋入模組400時，所述複數個天線饋入模組600與所述第一金屬側邊框73042和/或第二金屬側邊框73044間隔設置。複數個天線饋入模組600分別向第一金屬側邊框73042和/或第二金屬側邊框73044透過耦合饋入電訊號。 When the plurality of antenna feed modules 600 are the miniaturized antenna feed modules 400 of the second embodiment, the plurality of antenna feed modules 600 and the first metal side frame 73042 and/or the second metal Side border 73044 interval setting. The plurality of antenna feed modules 600 respectively feed electrical signals to the first metal side frame 73042 and/or the second metal side frame 73044 through coupling.
當複數個天線饋入模組600可以為第一實施例的天線饋入耦合模組100與第二實施例的微型化天線饋入模組400的組合時，複數個天線饋入模組600中部分為第一實施例的天線饋入耦合模組100的天線饋入模組600與所述第一金屬側邊框73042和/或第二金屬側邊框73044接觸，以分別向第一金屬側邊框73042和/或第二金屬側邊框73044饋入電訊號。複數個天線饋入模組600中部分為第二實施例的微型化天線饋入模組400的天線饋入模組600與所述第一金屬側邊框73042和/或第二金屬側邊框73044間隔設置，以分別向第一金屬側邊框73042和/或第二金屬側邊框73044透過耦合饋入電訊號。 When the plurality of antenna feeding modules 600 can be a combination of the antenna feeding coupling module 100 of the first embodiment and the miniaturized antenna feeding module 400 of the second embodiment, the plurality of antenna feeding modules 600 The antenna feed module 600 , which is partly the antenna feed coupling module 100 of the first embodiment, is in contact with the first metal side frame 73042 and/or the second metal side frame 73044 to feed the first metal side frame 73042 respectively. And/or the second metal side frame 73044 feeds electrical signals. Among the plurality of antenna feed modules 600, some of the antenna feed modules 600 are the miniaturized antenna feed modules 400 of the second embodiment and are spaced apart from the first metal side frame 73042 and/or the second metal side frame 73044. Set up to feed electrical signals through coupling to the first metal side frame 73042 and/or the second metal side frame 73044 respectively.
於本申請實施例中，複數個天線饋入模組600中，對應設置於所述第一金屬側邊框73042的天線饋入模組600之數量與所述對應設置於所述第二金屬側邊框73044的天線饋入模組600之數量可以相同或不同。 In the embodiment of the present application, among the plurality of antenna feed modules 600, the number of antenna feed modules 600 corresponding to the first metal side frame 73042 is equal to the number of antenna feed modules 600 corresponding to the second metal side frame 73042. The number of antenna feed modules 600 of the 73044 can be the same or different.
請一併參閱圖24，於本申請第三實施例中，電子裝置700包括五個天線饋入模組600，例如第一天線饋入模組601、第二天線饋入模組602、第三天線饋入模組603、第四天線饋入模組604及第五天線饋入模組605，分別對應第一金屬側邊框73042和/或第二金屬側邊框73044的五個位置設置。其中， 第一天線饋入模組601對應設置於第一金屬邊框73042靠近頂部金屬邊框73041的一側，並可標記為位置P1。第二天線饋入模組602對應設置於第一金屬邊框73042靠近底部金屬邊框73043的一側，並可標記為位置P2。第三天線饋入模組603、第四天線饋入模組604、第五天線饋入模組605分別沿第二金屬邊框73044對應設置，並可分別標記為位置P3、P4、P5。 Please refer to FIG. 24 together. In the third embodiment of the present application, the electronic device 700 includes five antenna feed modules 600, such as a first antenna feed module 601, a second antenna feed module 602, The third antenna feed module 603, the fourth antenna feed module 604 and the fifth antenna feed module 605 are respectively arranged corresponding to five positions of the first metal side frame 73042 and/or the second metal side frame 73044. in, The first antenna feed module 601 is correspondingly disposed on the side of the first metal frame 73042 close to the top metal frame 73041, and can be marked as position P1. The second antenna feed module 602 is correspondingly disposed on the side of the first metal frame 73042 close to the bottom metal frame 73043, and can be marked as position P2. The third antenna feed module 603, the fourth antenna feed module 604, and the fifth antenna feed module 605 are respectively disposed correspondingly along the second metal frame 73044, and can be marked as positions P3, P4, and P5 respectively.
請一併參閱圖24，於本申請實施例中，金屬邊框7304的第一金屬側邊框73042及第二金屬側邊框73044上均間隔開設有複數個縫隙7310。複數個縫隙7310隔斷所述第一金屬側邊框73042及第二金屬側邊框73044，以將第一金屬側邊框73042及第二金屬側邊框73044劃分為間隔設置之複數個輻射體7311。 Please refer to FIG. 24 together. In the embodiment of the present application, a plurality of gaps 7310 are spaced on the first metal side frame 73042 and the second metal side frame 73044 of the metal frame 7304. A plurality of gaps 7310 separate the first metal side frame 73042 and the second metal side frame 73044, so as to divide the first metal side frame 73042 and the second metal side frame 73044 into a plurality of spaced apart radiators 7311.
可以理解，於其中一個實施例中，所述縫隙7310可與所述狹縫7309連通，並填充有絕緣材料，例如塑膠、橡膠、玻璃、木材、陶瓷等，但不以此為限。 It can be understood that in one embodiment, the slit 7310 can be connected with the slit 7309 and filled with insulating material, such as plastic, rubber, glass, wood, ceramics, etc., but is not limited thereto.
當電子裝置700包括至少一天線饋入模組600時，至少一天線饋入模組600可對應複數個輻射體7311中的任一個，用於為對應之所述輻射體7311耦合饋入電訊號，以使所述輻射體7311輻射無線訊號。 When the electronic device 700 includes at least one antenna feed module 600, the at least one antenna feed module 600 can correspond to any one of the plurality of radiators 7311, and is used to couple and feed the electrical signal to the corresponding radiator 7311, So that the radiator 7311 radiates wireless signals.
至少一天線饋入模組600也可對應複數個縫隙7310中的任一個，用於為對應之所述縫隙7310兩側的輻射體7311耦合饋入電訊號，以使所述縫隙7310兩側的輻射體7311輻射無線訊號。 At least one antenna feed module 600 can also correspond to any one of the plurality of slots 7310, and is used to couple and feed electrical signals to the radiators 7311 on both sides of the corresponding slot 7310, so that the radiation on both sides of the slot 7310 Body 7311 radiates wireless signals.
當電子裝置700包括複數個天線饋入模組600時，複數個天線饋入模組600可分別對應所述複數個輻射體7311，分別用於為對應之所述輻射體7311耦合饋入電訊號，以使所述複數個輻射體7311輻射無線訊號。 When the electronic device 700 includes a plurality of antenna feed modules 600, the plurality of antenna feed modules 600 can respectively correspond to the plurality of radiators 7311, and are respectively used to couple and feed electrical signals to the corresponding radiators 7311. So that the plurality of radiators 7311 radiate wireless signals.
於另一些實施例中，電子裝置700包括複數個天線饋入模組600時，可設置任意組合數量，例如兩個、三個、四個等天線饋入模組600對應第一金屬側邊框73042及第二金屬側邊框73044設置，以提升天線效率頻寬並具有最佳天線效率，可有效提升天線頻率覆蓋範圍。 In other embodiments, when the electronic device 700 includes a plurality of antenna feed modules 600 , any combination number can be set, for example, two, three, four, etc. antenna feed modules 600 corresponding to the first metal side frame 73042 And the second metal side frame 73044 is set to improve the antenna efficiency bandwidth and have the best antenna efficiency, which can effectively improve the antenna frequency coverage.
請一併參閱圖25，為天線饋入模組600設置為圖24的第一天線饋入模組601的位置P1時之S參數(散射參數)曲線圖。其中，圖25為天線饋入模組600設置為圖24的第一天線饋入模組601的位置P1且透過主動電路13、413切換至不同的組態(圖中所示為Case1a-1、Case2a、Case3a)時覆蓋中頻及高頻頻段、5G Sub 6 N77/N78及超高頻(UHB)頻段、5G Sub 6 N79及CA應用頻段之S參數。 Please also refer to FIG. 25 , which is a graph of S parameters (scattering parameters) when the antenna feed module 600 is set to the position P1 of the first antenna feed module 601 in FIG. 24 . Among them, FIG. 25 shows that the antenna feed module 600 is set to the position P1 of the first antenna feed module 601 of FIG. 24 and is switched to different configurations through the active circuits 13 and 413 (shown in the figure is Case 1a-1 , Case2a, Case3a), covering S parameters of mid-frequency and high-frequency bands, 5G Sub 6 N77/N78 and ultra-high frequency (UHB) bands, 5G Sub 6 N79 and CA application bands.
可理解，藉由天線饋入模組600設置為圖24的第一天線饋入模組601的位置P1時，可以涵蓋中頻、高頻、超高頻、5G Sub 6 N77/N78/N79頻段。 It can be understood that when the antenna feed module 600 is set to the position P1 of the first antenna feed module 601 in Figure 24, it can cover medium frequency, high frequency, ultra-high frequency, and 5G Sub 6 N77/N78/N79 frequency band.
請一併參閱圖26，為天線饋入模組600設置為圖24的第一天線饋入模組601的位置P1時之效率曲線圖。其中，圖26為天線饋入模組600設置為圖24的第一天線饋入模組601的位置P1且透過主動電路13、413切換至不同的組態(圖中所示為Case1a-1、Case2a、Case3a)時覆蓋中頻及高頻頻段、5G Sub 6 N77/N78及超高頻(UHB)頻段、5G Sub 6 N79及CA應用頻段的之效率曲線圖。 Please also refer to FIG. 26 , which is an efficiency curve when the antenna feed module 600 is set to the position P1 of the first antenna feed module 601 in FIG. 24 . Among them, Figure 26 shows that the antenna feed module 600 is set to the position P1 of the first antenna feed module 601 of Figure 24 and is switched to different configurations through the active circuits 13 and 413 (shown in the figure is Case1a-1 , Case2a, Case3a), the efficiency curve covers the mid-frequency and high-frequency bands, 5G Sub 6 N77/N78 and ultra-high frequency (UHB) bands, 5G Sub 6 N79 and CA application bands.
請一併參閱圖27A至27E，為天線饋入模組600設置為圖24的第一天線饋入模組601的位置P1時之3D增益圖。其中，圖27A為第一天線饋入模組601覆蓋中頻頻段(1.9GHz)之3D增益圖。圖27B為第一天線饋入模組601覆蓋高頻頻段(2.5GHz)之3D增益圖。圖27C為第一天線饋入模組601 覆蓋超高頻及5G Sub 6 N78頻段(3.5GHz)之3D增益圖。圖27D為第一天線饋入模組601覆蓋5G Sub 6 N77頻段(3.7GHz)之3D增益圖。圖27E為第一天線饋入模組601覆蓋5G Sub 6 N79頻段(4.7GHz)之3D增益圖。 Please refer to FIGS. 27A to 27E together, which are 3D gain diagrams when the antenna feed module 600 is set to the position P1 of the first antenna feed module 601 in FIG. 24 . Among them, FIG. 27A is a 3D gain diagram of the first antenna feed module 601 covering the intermediate frequency band (1.9GHz). Figure 27B is a 3D gain diagram of the first antenna feed module 601 covering the high frequency band (2.5GHz). Figure 27C shows the first antenna feed module 601 3D gain map covering UHF and 5G Sub 6 N78 frequency band (3.5GHz). Figure 27D is a 3D gain diagram of the first antenna feed module 601 covering the 5G Sub 6 N77 frequency band (3.7GHz). Figure 27E is a 3D gain diagram of the first antenna feed module 601 covering the 5G Sub 6 N79 frequency band (4.7GHz).
請參閱表1，為天線饋入模組600設置為圖24的第一天線饋入模組601的位置P1時之S參數預設目標值、S參數、效率預設目標值及效率表。 Please refer to Table 1 for the S parameter preset target value, S parameter, efficiency preset target value and efficiency table when the antenna feed module 600 is set to the position P1 of the first antenna feed module 601 in FIG. 24 .
由表1可知，為天線饋入模組600設置為圖24的第一天線饋入模組601的位置P1時，Case1a-1適合5G Sub 6 N77/N78及超高頻頻段，Case2a適合中頻及高頻頻段，Case3a適合5G Sub 6 N79及寬頻CA應用頻段。第一天線饋入模組601在中頻/高頻/5G Sub 6 N77/N78及超高頻/N79頻段的天線效率分別為-5.6dB/-4.2dB/-4.7dB/-4.2dB/-4.3dB。 It can be seen from Table 1 that when the antenna feed module 600 is set to the position P1 of the first antenna feed module 601 in Figure 24, Case1a-1 is suitable for 5G Sub 6 N77/N78 and ultra-high frequency bands, and Case2a is suitable for the mid-range frequency band. Frequency and high frequency bands, Case3a is suitable for 5G Sub 6 N79 and broadband CA application bands. The antenna efficiency of the first antenna feed module 601 in the medium frequency/high frequency/5G Sub 6 N77/N78 and ultra high frequency/N79 frequency bands is -5.6dB/-4.2dB/-4.7dB/-4.2dB/ respectively. -4.3dB.
請一併參閱圖28，為天線饋入模組600設置為圖24的第二天線饋入模組602的位置P2時之S參數(散射參數)曲線圖。其中，圖28為天線饋入模組600設置為圖24的第二天線饋入模組602的位置P2且透過主動電路13、 413切換至不同的組態(圖中所示為Case1a、Case2a-1、Case3a、Case4)時覆蓋中頻及高頻頻段、5G Sub 6 N77/N78及超高頻(UHB)頻段、5G Sub 6 N79及CA應用頻段之S參數。 Please also refer to FIG. 28 , which is a graph of S parameters (scattering parameters) when the antenna feed module 600 is set to the position P2 of the second antenna feed module 602 in FIG. 24 . Among them, FIG. 28 shows that the antenna feed module 600 is set to the position P2 of the second antenna feed module 602 of FIG. 24 and passes through the active circuit 13, When 413 switches to different configurations (shown in the figure are Case1a, Case2a-1, Case3a, and Case4), it covers mid-frequency and high-frequency bands, 5G Sub 6 N77/N78 and ultra-high frequency (UHB) bands, 5G Sub 6 S parameters of N79 and CA application frequency bands.
請一併參閱圖29，為天線饋入模組600設置為圖24的第二天線饋入模組602的位置P2時之效率曲線圖。其中，圖29為天線饋入模組600設置為圖24的第二天線饋入模組602的位置P2且透過主動電路13、413切換至不同的組態(圖中所示為Case1a、Case2a-1、Case3a、Case4)時覆蓋中頻及高頻頻段、5G Sub 6 N77/N78及超高頻(UHB)頻段、5G Sub 6 N79及CA應用頻段之效率曲線圖。 Please also refer to FIG. 29 , which is an efficiency curve diagram when the antenna feed module 600 is set to the position P2 of the second antenna feed module 602 in FIG. 24 . Among them, Figure 29 shows that the antenna feed module 600 is set to the position P2 of the second antenna feed module 602 of Figure 24 and is switched to different configurations through the active circuits 13 and 413 (shown in the figure are Case1a and Case2a -1. Efficiency curve chart covering mid-frequency and high-frequency bands, 5G Sub 6 N77/N78 and ultra-high frequency (UHB) bands, 5G Sub 6 N79 and CA application bands in Case3a, Case4).
請一併參閱圖30A至30E，為天線饋入模組600設置為圖24的第二天線饋入模組602的位置P2時之3D增益圖。其中，圖30A為第二天線饋入模組602覆蓋中頻頻段(1.9GHz)之3D增益圖。圖30B為第二天線饋入模組602覆蓋高頻頻段(2.5GHz)之3D增益圖。圖30C為第二天線饋入模組602覆蓋超高頻及5G Sub 6 N78頻段(3.5GHz)之3D增益圖。圖30D為第二天線饋入模組602覆蓋5G Sub 6 N77頻段(3.7GHz)之3D增益圖。圖30E為第二天線饋入模組602覆蓋5G Sub 6 N79頻段(4.7GHz)之3D增益圖。 Please refer to FIGS. 30A to 30E together, which are 3D gain diagrams when the antenna feed module 600 is set to the position P2 of the second antenna feed module 602 of FIG. 24 . Among them, FIG. 30A is a 3D gain diagram of the second antenna feed module 602 covering the intermediate frequency band (1.9GHz). Figure 30B is a 3D gain diagram of the second antenna feed module 602 covering the high frequency band (2.5GHz). Figure 30C is a 3D gain diagram of the second antenna feed module 602 covering UHF and 5G Sub 6 N78 frequency band (3.5GHz). Figure 30D is a 3D gain diagram of the second antenna feed module 602 covering the 5G Sub 6 N77 frequency band (3.7GHz). Figure 30E is a 3D gain diagram of the second antenna feed module 602 covering the 5G Sub 6 N79 frequency band (4.7GHz).
請參閱表2，為天線饋入模組600設置為圖24的第二天線饋入模組602的位置P2時之S參數預設目標值、S參數、效率預設目標值及效率表。 Please refer to Table 2 for the S parameter preset target value, S parameter, efficiency preset target value and efficiency table when the antenna feed module 600 is set to the position P2 of the second antenna feed module 602 in FIG. 24 .
由表2可知，為天線饋入模組600設置為圖24的第二天線饋入模組602的位置P2時，Case1a適合中頻頻段，Case2a-1適合5G Sub 6 N77/N78及超高頻頻段，Case3a適合5G Sub 6 N79及寬頻CA應用頻段，Case4a適合高頻頻段。第二天線饋入模組602在中頻/高頻/5G Sub 6 N77/N78及超高頻/N79頻段的天線效率分別為-6.2dB/-5.3dB/-5.4dB/-5.1dB/-5.1dB。 As can be seen from Table 2, when the antenna feed module 600 is set to the position P2 of the second antenna feed module 602 in Figure 24, Case1a is suitable for the mid-frequency band, and Case2a-1 is suitable for 5G Sub 6 N77/N78 and ultra-high frequency bands. Frequency bands, Case3a is suitable for 5G Sub 6 N79 and broadband CA application bands, and Case4a is suitable for high-frequency bands. The antenna efficiency of the second antenna feed module 602 in the medium frequency/high frequency/5G Sub 6 N77/N78 and ultra high frequency/N79 frequency bands is -6.2dB/-5.3dB/-5.4dB/-5.1dB/ respectively. -5.1dB.
請一併參閱圖31，為天線饋入模組600設置為圖24的第三天線饋入模組603的位置P3時之S參數(散射參數)曲線圖。其中，圖31為天線饋入模組603設置為圖24的第三天線饋入模組603的位置P3且透過主動電路13、413切換至不同的組態(圖中所示為Case1a、Case2a-1、Case3a)時覆蓋中頻及高頻頻段、5G Sub 6 N77/N78及超高頻(UHB)頻段、5G Sub 6 N79及CA應用頻段之S參數。 Please also refer to FIG. 31 , which is a graph of S parameters (scattering parameters) when the antenna feed module 600 is set to the position P3 of the third antenna feed module 603 in FIG. 24 . Among them, Figure 31 shows that the antenna feed module 603 is set to the position P3 of the third antenna feed module 603 of Figure 24 and is switched to different configurations through the active circuits 13 and 413 (shown in the figure are Case1a, Case2a- 1. Case3a) covers S parameters of mid-frequency and high-frequency bands, 5G Sub 6 N77/N78 and ultra-high frequency (UHB) bands, 5G Sub 6 N79 and CA application bands.
請一併參閱圖32，為天線饋入模組600設置為圖24的第三天線饋入模組603的位置P3時之效率曲線圖。其中，圖32為天線饋入模組600設置為圖24的第三天線饋入模組603的位置P3且透過主動電路13、413切換至不同的組態(圖中所示為Case1a、Case2a-1、Case3a)時覆蓋中頻及高頻頻段、5G Sub 6 N77/N78及超高頻(UHB)頻段、5G Sub 6 N79及CA應用頻段之效率曲 線圖。 Please also refer to FIG. 32 , which is an efficiency curve when the antenna feed module 600 is set to the position P3 of the third antenna feed module 603 in FIG. 24 . Among them, FIG. 32 shows that the antenna feed module 600 is set to the position P3 of the third antenna feed module 603 of FIG. 24 and is switched to different configurations through the active circuits 13 and 413 (shown in the figure are Case1a, Case2a- 1. Case3a) covers the efficiency curve of mid-frequency and high-frequency bands, 5G Sub 6 N77/N78 and ultra-high frequency (UHB) bands, 5G Sub 6 N79 and CA application bands line graph.
請一併參閱圖33A至33E，為天線饋入模組600設置為圖24的第三天線饋入模組603的位置P3時之3D增益圖。其中，圖33A為第三天線饋入模組603覆蓋中頻頻段(1.9GHz)之3D增益圖。圖33B為第三天線饋入模組603覆蓋高頻頻段(2.5GHz)之3D增益圖。圖33C為第三天線饋入模組603覆蓋超高頻及5G Sub 6 N78頻段(3.5GHz)之3D增益圖。圖33D為第三天線饋入模組603覆蓋5G Sub 6 N77頻段(3.7GHz)之3D增益圖。圖33E為第三天線饋入模組603覆蓋5G Sub 6 N79頻段(4.7GHz)之3D增益圖。 Please refer to FIGS. 33A to 33E together, which are 3D gain diagrams when the antenna feed module 600 is set to the position P3 of the third antenna feed module 603 in FIG. 24 . Among them, FIG. 33A is a 3D gain diagram of the third antenna feed module 603 covering the intermediate frequency band (1.9GHz). Figure 33B is a 3D gain diagram of the third antenna feed module 603 covering the high frequency band (2.5GHz). Figure 33C is a 3D gain diagram of the third antenna feed module 603 covering UHF and 5G Sub 6 N78 frequency band (3.5GHz). Figure 33D is a 3D gain diagram of the third antenna feed module 603 covering the 5G Sub 6 N77 frequency band (3.7GHz). Figure 33E is a 3D gain diagram of the third antenna feed module 603 covering the 5G Sub 6 N79 frequency band (4.7GHz).
請參閱表3，為天線饋入模組600設置為圖24的第三天線饋入模組603的位置P3時之S參數預設目標值、S參數、效率預設目標值及效率表。 Please refer to Table 3 for the S parameter preset target value, S parameter, efficiency preset target value and efficiency table when the antenna feed module 600 is set to the position P3 of the third antenna feed module 603 in FIG. 24 .
由表3可知，為天線饋入模組600設置為圖24的第三天線饋入模組603的位置P3時，Case1a適合中頻及高頻頻段，Case2a-1適合5G Sub 6 N77/N78及超高頻頻段，Case3a適合5G Sub 6 N79及寬頻CA應用頻段。第三 天線饋入模組603在中頻/高頻/5G Sub 6 N77/N78及超高頻/N79頻段的天線效率分別為-6dB/-5.4dB/-4.9dB/-4.6dB/-4.9dB。 It can be seen from Table 3 that when the antenna feed module 600 is set to the position P3 of the third antenna feed module 603 in Figure 24, Case1a is suitable for mid-frequency and high-frequency bands, and Case2a-1 is suitable for 5G Sub 6 N77/N78 and Ultra-high frequency band, Case3a is suitable for 5G Sub 6 N79 and broadband CA application bands. third The antenna efficiency of the antenna feed module 603 in the medium frequency/high frequency/5G Sub 6 N77/N78 and ultra high frequency/N79 frequency bands is -6dB/-5.4dB/-4.9dB/-4.6dB/-4.9dB respectively.
請一併參閱圖34，為天線饋入模組600設置為圖24的第四天線饋入模組604的位置P4時之S參數(散射參數)曲線圖。其中，圖34為天線饋入模組600設置為圖24的第四天線饋入模組604的位置P4且透過主動電路13、413切換至不同的組態(圖中所示為Case1a-1、Case2、Case3a)時覆蓋中頻及高頻頻段、5G Sub 6 N77/N78及超高頻(UHB)頻段、5G Sub 6 N79及CA應用頻段之S參數曲線圖。 Please also refer to FIG. 34 , which is a graph of S parameters (scattering parameters) when the antenna feed module 600 is set to the position P4 of the fourth antenna feed module 604 in FIG. 24 . Among them, FIG. 34 shows that the antenna feed module 600 is set to the position P4 of the fourth antenna feed module 604 of FIG. 24 and is switched to different configurations through the active circuits 13 and 413 (shown in the figure are Case1a-1, Case2 and Case3a) cover S-parameter curves of mid-frequency and high-frequency bands, 5G Sub 6 N77/N78 and ultra-high frequency (UHB) bands, 5G Sub 6 N79 and CA application bands.
請一併參閱圖35，為天線饋入模組600設置為圖24的第四天線饋入模組604的位置P4時之效率曲線圖。其中，圖35為天線饋入模組600設置為圖24的第四天線饋入模組604的位置P4且透過主動電路13、413切換至不同的組態(圖中所示為Case1a-1、Case2、Case3a)時覆蓋中頻及高頻頻段、5G Sub 6 N77/N78及超高頻(UHB)頻段、5G Sub 6 N79及CA應用頻段之效率曲線圖。 Please also refer to FIG. 35 , which is an efficiency curve when the antenna feed module 600 is set to the position P4 of the fourth antenna feed module 604 in FIG. 24 . Among them, Figure 35 shows that the antenna feed module 600 is set to the position P4 of the fourth antenna feed module 604 of Figure 24 and is switched to different configurations through the active circuits 13 and 413 (shown in the figure are Case1a-1, Case2, Case3a) cover the efficiency curves of mid-frequency and high-frequency bands, 5G Sub 6 N77/N78 and ultra-high frequency (UHB) bands, 5G Sub 6 N79 and CA application bands.
請一併參閱圖36A至36E，為天線饋入模組600設置為圖24的第四天線饋入模組604的位置P4時之3D增益圖。其中，圖36A為第四天線饋入模組604覆蓋中頻頻段(1.9GHz)之3D增益圖。圖36B為第四天線饋入模組604覆蓋高頻頻段(2.5GHz)之3D增益圖。圖36C為第四天線饋入模組604覆蓋超高頻及5G Sub 6 N78頻段(3.5GHz)之3D增益圖。圖36D為第四天線饋入模組604覆蓋5G Sub 6 N77頻段(3.7GHz)之3D增益圖。圖36E為第四天線饋入模組604覆蓋5G Sub 6 N79頻段(4.7GHz)之3D增益圖。 Please refer to FIGS. 36A to 36E together, which are 3D gain diagrams when the antenna feed module 600 is set to the position P4 of the fourth antenna feed module 604 in FIG. 24 . Among them, FIG. 36A is a 3D gain diagram of the fourth antenna feed module 604 covering the intermediate frequency band (1.9GHz). Figure 36B is a 3D gain diagram of the fourth antenna feed module 604 covering the high frequency band (2.5GHz). Figure 36C is a 3D gain diagram of the fourth antenna feed module 604 covering UHF and 5G Sub 6 N78 frequency band (3.5GHz). Figure 36D is a 3D gain diagram of the fourth antenna feed module 604 covering the 5G Sub 6 N77 frequency band (3.7GHz). Figure 36E is a 3D gain diagram of the fourth antenna feed module 604 covering the 5G Sub 6 N79 frequency band (4.7GHz).
請參閱表4，為天線饋入模組600設置為圖24的第四天線饋入模 組604的位置P4時之S參數預設目標值、S參數、效率預設目標值及效率表。 Referring to Table 4, the antenna feed module 600 is set to the fourth antenna feed mode of FIG. 24. The S parameter preset target value, S parameter, efficiency preset target value and efficiency table at position P4 of group 604 .
由表4可知，為天線饋入模組600設置為圖24的第四天線饋入模組604的位置P4時，Case1a-1適合5G Sub 6 N77/N78及超高頻/N79頻段，Case2a適合中頻及高頻頻段，Case3a適合寬頻CA應用頻段。第四天線饋入模組604在中頻/高頻/5G Sub 6 N77/N78及超高頻/N79頻段的天線效率分別為-5.6dB/-3.9dB/-4.4dB/-3.9dB/-4.4dB。 It can be seen from Table 4 that when the antenna feed module 600 is set to the position P4 of the fourth antenna feed module 604 in Figure 24, Case1a-1 is suitable for the 5G Sub 6 N77/N78 and UHF/N79 frequency bands, and Case2a is suitable For mid-frequency and high-frequency bands, Case3a is suitable for wide-band CA application bands. The antenna efficiency of the fourth antenna feed module 604 in the medium frequency/high frequency/5G Sub 6 N77/N78 and ultra high frequency/N79 frequency bands is -5.6dB/-3.9dB/-4.4dB/-3.9dB/- respectively. 4.4dB.
請一併參閱圖37，為天線饋入模組600設置為圖24的第五天線饋入模組605的位置P5時之S參數(散射參數)曲線圖。其中，圖37為天線饋入模組600設置為圖24的第五天線饋入模組605的位置P5且透過主動電路13、413切換至不同的組態(圖中所示為Case1a-1、Case2、Case3a)時覆蓋中頻及高頻頻段、5G Sub 6 N77/N78及超高頻(UHB)頻段、5G Sub 6 N79及CA應用頻段之S參數曲線圖。 Please also refer to FIG. 37 , which is a graph of S parameters (scattering parameters) when the antenna feed module 600 is set to the position P5 of the fifth antenna feed module 605 in FIG. 24 . Among them, Figure 37 shows that the antenna feed module 600 is set to the position P5 of the fifth antenna feed module 605 of Figure 24 and is switched to different configurations through the active circuits 13 and 413 (shown in the figure are Case1a-1, Case2 and Case3a) cover S-parameter curves of mid-frequency and high-frequency bands, 5G Sub 6 N77/N78 and ultra-high frequency (UHB) bands, 5G Sub 6 N79 and CA application bands.
請一併參閱圖38，為天線饋入模組600設置為圖24的第五天線饋 入模組605的位置P5時之效率曲線圖。其中，圖38為天線饋入模組600設置為圖24的第五天線饋入模組605的位置P5且透過主動電路13、413切換至不同的組態(圖中所示為Case1a-1、Case2、Case3a)時覆蓋中頻及高頻頻段、5G Sub 6 N77/N78及超高頻(UHB)頻段、5G Sub N79及CA應用頻段之效率曲線圖。 Please refer to Figure 38 as well. The antenna feed module 600 is configured as the fifth antenna feed of Figure 24. The efficiency curve when entering module 605 at position P5. Among them, FIG. 38 shows that the antenna feed module 600 is set to the position P5 of the fifth antenna feed module 605 of FIG. 24 and is switched to different configurations through the active circuits 13 and 413 (shown in the figure are Case1a-1, Case2, Case3a) cover the efficiency curves of mid-frequency and high-frequency bands, 5G Sub 6 N77/N78 and ultra-high frequency (UHB) bands, 5G Sub N79 and CA application bands.
請一併參閱圖39A至39E，為天線饋入模組600設置為圖24的第五天線饋入模組605的位置P5時之3D增益圖。其中，圖39A為第五天線饋入模組605覆蓋中頻頻段(1.9GHz)之3D增益圖。圖39B為第五天線饋入模組605覆蓋高頻頻段(2.5GHz)之3D增益圖。圖39C為第五天線饋入模組605覆蓋超高頻及5G Sub 6 N78頻段(35GHz)之3D增益圖。圖39D為第五天線饋入模組605覆蓋5G Sub 6 N77頻段(3.7GHz)之3D增益圖。圖39E為第五天線饋入模組605覆蓋5G Sub 6 N79頻段(4.7GHz)之3D增益圖。 Please refer to FIGS. 39A to 39E together, which are 3D gain diagrams when the antenna feed module 600 is set to the position P5 of the fifth antenna feed module 605 in FIG. 24 . Among them, Figure 39A is a 3D gain diagram of the fifth antenna feed module 605 covering the intermediate frequency band (1.9GHz). Figure 39B is a 3D gain diagram of the fifth antenna feed module 605 covering the high frequency band (2.5GHz). Figure 39C is a 3D gain diagram of the fifth antenna feed module 605 covering UHF and 5G Sub 6 N78 frequency band (35GHz). Figure 39D is a 3D gain diagram of the fifth antenna feed module 605 covering the 5G Sub 6 N77 frequency band (3.7GHz). Figure 39E is a 3D gain diagram of the fifth antenna feed module 605 covering the 5G Sub 6 N79 frequency band (4.7GHz).
請參閱表5，為天線饋入模組600設置為圖24的第五天線饋入模組605的位置P5時之S參數預設目標值、S參數、效率預設目標值及效率表。 Please refer to Table 5 for the S parameter preset target value, S parameter, efficiency preset target value and efficiency table when the antenna feed module 600 is set to the position P5 of the fifth antenna feed module 605 in FIG. 24 .
由表5可知，為天線饋入模組600設置為圖24的第五天線饋入模組605的位置P5時，Case1a-1適合5G Sub 6 N77/N78及超高頻/N79頻段，Case2適合高頻頻段，Case3a適合中頻頻段及寬頻CA應用頻段。第五天線饋入模組605在中頻/高頻/5G Sub 6 N77/N78及超高頻/N79頻段的天線效率分別為-6.5dB/-3.3dB/-4.8dB/-4.5dB/-5dB。 It can be seen from Table 5 that when the antenna feed module 600 is set to the position P5 of the fifth antenna feed module 605 in Figure 24, Case1a-1 is suitable for the 5G Sub 6 N77/N78 and UHF/N79 frequency bands, and Case2 is suitable For high-frequency bands, Case3a is suitable for mid-frequency bands and wide-band CA application bands. The antenna efficiency of the fifth antenna feed module 605 in the medium frequency/high frequency/5G Sub 6 N77/N78 and ultra high frequency/N79 frequency bands is -6.5dB/-3.3dB/-4.8dB/-4.5dB/- respectively. 5dB.
請一併參閱圖40，本申請第三實施例提供另一種具有三個天線饋入模組600的電子裝置700。電子裝置700可以包括第一天線饋入模組601、第二天線饋入模組602及第三天線饋入模組603，這些天線饋入模組可以為第一實施例的天線饋入耦合模組100或第二實施例的微型化天線饋入模組400中的一種、或者兩者的組合。 Please refer to FIG. 40 as well. The third embodiment of the present application provides another electronic device 700 with three antenna feed modules 600 . The electronic device 700 may include a first antenna feed module 601, a second antenna feed module 602, and a third antenna feed module 603. These antenna feed modules may be the antenna feed modules of the first embodiment. One of the coupling module 100 or the miniaturized antenna feeding module 400 of the second embodiment, or a combination of both.
所述電子裝置700至少包括金屬邊框7304。所述金屬邊框7304由金屬或其他導電材料製成。金屬邊框7304間隔開設有複數個縫隙7310，以將金屬邊框7304劃分為間隔設置之複數個輻射體。 The electronic device 700 at least includes a metal frame 7304. The metal frame 7304 is made of metal or other conductive materials. The metal frame 7304 has a plurality of gaps 7310 spaced apart to divide the metal frame 7304 into a plurality of spaced apart radiators.
在本實施例中，所述電子裝置700至少包括複數個模組天線與複數個非模組天線，其中模組天線為利用天線饋入模組與輻射體而形成的天線，天線饋入模組可以為第一實施例的天線饋入耦合模組100或第二實施例的微型化天線饋入模組400中的一種、或者兩者的組合；輻射體可以為，但不限於，金屬邊框之部份或其他導電金屬。其中非模組天線為上述模組天線以外的其他天線類型。例如，非模組天線可以為，但不限於，金屬邊框天線。於一實施例中，所述電子裝置700設置有非模組天線ANT#0、非模組天線ANT#1、非模組天線ANT#2以及非模組天線ANT#4；以及模組天線ANT#3、模組天線ANT#5 以及模組天線ANT#6。第一天線饋入模組601與其中一個輻射體對應設置以形成模組天線Ant#5，第二天線饋入模組602與其中另一個輻射體對應設置以形成模組天線Ant#3，第三天線饋入模組603與又另一個輻射體對應設置以形成模組天線Ant#6。天線饋入模組601、第二天線饋入模組602及第三天線饋入模組603可以分別為對應的輻射體耦合饋入電訊號，以使對應之輻射體輻射無線訊號以形成模組天線。其中，非模組天線Ant#0、非模組天線Ant#2與模組天線Ant#6可以構成電子裝置700的下天線；非模組天線Ant#1、非模組天線Ant#4、模組天線Ant#3與模組天線Ant#5可以構成電子裝置700的上天線。 In this embodiment, the electronic device 700 at least includes a plurality of modular antennas and a plurality of non-modular antennas. The modular antenna is an antenna formed by using an antenna feed module and a radiator. The antenna feed module It may be one of the antenna feed coupling module 100 of the first embodiment or the miniaturized antenna feed module 400 of the second embodiment, or a combination of both; the radiator may be, but is not limited to, a metal frame. parts or other conductive metals. The non-modular antennas are antenna types other than the above-mentioned modular antennas. For example, the non-modular antenna may be, but is not limited to, a metal frame antenna. In one embodiment, the electronic device 700 is provided with non-modular antenna ANT#0, non-modular antenna ANT#1, non-modular antenna ANT#2 and non-modular antenna ANT#4; and modular antenna ANT #3. Module antenna ANT#5 and modular antenna ANT#6. The first antenna feeding module 601 is arranged corresponding to one of the radiators to form the module antenna Ant#5, and the second antenna feeding module 602 is arranged corresponding to the other radiator to form the module antenna Ant#3. , the third antenna feed module 603 is arranged correspondingly with another radiator to form the module antenna Ant#6. The antenna feed module 601, the second antenna feed module 602 and the third antenna feed module 603 can couple and feed electrical signals to the corresponding radiators respectively, so that the corresponding radiators radiate wireless signals to form a module. antenna. Among them, the non-modular antenna Ant#0, the non-modular antenna Ant#2, and the modular antenna Ant#6 may constitute the lower antenna of the electronic device 700; the non-modular antenna Ant#1, the non-modular antenna Ant#4, and the modular antenna The group antenna Ant#3 and the module antenna Ant#5 may constitute the upper antenna of the electronic device 700 .
請一併參閱圖41A，為電子裝置700的下天線，即第三天線饋入模組603對應之模組天線Ant#6之S參數(散射參數)曲線圖。其中，圖41A為第三天線饋入模組603對應之模組天線Ant#6且透過主動電路13、413切換至不同的組態(圖中所示為RF1_#0-B12、RF2_#0-B12、RF2+3_#0-B12、RF1_#0-B8、RF2_#0-B8、RF2+3_#0-B8)時覆蓋高頻頻段、5G Sub 6 N41/N77/N78/N79頻段之S參數。 Please also refer to FIG. 41A , which is a graph of S parameters (scattering parameters) of the module antenna Ant #6 corresponding to the lower antenna of the electronic device 700 , that is, the third antenna feed module 603 . Among them, Figure 41A shows the module antenna Ant#6 corresponding to the third antenna feed module 603 and is switched to different configurations through the active circuits 13 and 413 (shown in the figure are RF1_#0-B12, RF2_#0- B12, RF2+3_#0-B12, RF1_#0-B8, RF2_#0-B8, RF2+3_#0-B8) covering the high frequency band, 5G Sub 6 N41/N77/N78/N79 band S parameters .
請一併參閱圖41B，為電子裝置700的下天線，即第三天線饋入模組603對應之模組天線Ant#6之輻射效率圖。其中，圖41 B為第三天線饋入模組603對應之模組天線Ant#6且透過主動電路13、413切換至不同的組態(圖中所示為RF1_#0-B12、RF2_#0-B12、RF2+3_#0-B12、RF1_#0-B8、RF2_#0-B8、RF2+3_#0-B8)時覆蓋高頻頻段、5G Sub 6 N41/N77/N78/N79頻段之輻射效率圖。 Please also refer to FIG. 41B , which is a radiation efficiency diagram of the lower antenna of the electronic device 700 , that is, the module antenna Ant#6 corresponding to the third antenna feed module 603 . Among them, Figure 41 B shows the module antenna Ant#6 corresponding to the third antenna feed module 603 and is switched to different configurations through the active circuits 13 and 413 (shown in the figure are RF1_#0-B12, RF2_#0 -B12, RF2+3_#0-B12, RF1_#0-B8, RF2_#0-B8, RF2+3_#0-B8), covering the radiation of high frequency band, 5G Sub 6 N41/N77/N78/N79 band Efficiency graph.
請一併參閱圖41C，為電子裝置700的下天線，即第三天線饋入模組603對應之模組天線Ant#6，與鄰近天線之隔離度曲線圖。其中，圖41C為第 三天線饋入模組603對應之模組天線Ant#6與非模組天線Ant#0、非模組天線Ant#2且透過主動電路13、413切換至不同的組態(圖中所示為ANT_#0-B12_ANT#2、ANT_#0-B8_ANT#2、ANT_#0-B12_ANT#6-RF1、ANT_#0-B12_ANT#6-RF2、ANT_#0-B12_ANT#6-RF2+3)時在中頻頻段、高頻頻段、5G Sub 6 N41/N77/N78/N79頻段之隔離度。 Please also refer to FIG. 41C , which is a graph of isolation between the lower antenna of the electronic device 700 , that is, the module antenna Ant#6 corresponding to the third antenna feed module 603 , and adjacent antennas. Among them, Figure 41C is the The three antennas feed into the module antenna Ant#6 corresponding to the module 603, and the non-module antenna Ant#0 and the non-module antenna Ant#2 are switched to different configurations through the active circuits 13 and 413 (shown in the figure: ANT_#0-B12_ANT#2, ANT_#0-B8_ANT#2, ANT_#0-B12_ANT#6-RF1, ANT_#0-B12_ANT#6-RF2, ANT_#0-B12_ANT#6-RF2+3) Isolation of mid-frequency band, high-frequency band, and 5G Sub 6 N41/N77/N78/N79 frequency band.
請一併參閱圖42A，為電子裝置700的上天線，即第二天線饋入模組602對應之模組天線Ant#3、以及第一天線饋入模組601對應之模組天線Ant#5之S參數(散射參數)曲線圖。其中，圖42A為第二天線饋入模組602對應之模組天線Ant#3、以及第一天線饋入模組601對應之模組天線Ant#5且透過主動電路13、413切換至不同的組態(圖中所示為ANT#3_Cond.1、ANT#3_Cond.2、ANT#3_Cond.3、ANT#3_Cond.4、ANT#5_Cond.1、ANT#5_Cond.2、ANT#5_Cond.3、ANT#5_Cond.4、ANT#5_Cond.5)時覆蓋GPS頻段、中頻頻段、高頻頻段、5G Sub 6 N41頻段、WIFI 2.4G頻段、5G Sub 6 N77/N78/N79頻段、WIFI 5G頻段、WIFI 6E頻段之S參數。 Please also refer to FIG. 42A , which shows the upper antenna of the electronic device 700 , that is, the module antenna Ant #3 corresponding to the second antenna feed module 602 and the module antenna Ant corresponding to the first antenna feed module 601 #5 S parameter (scattering parameter) graph. Among them, Figure 42A shows the module antenna Ant#3 corresponding to the second antenna feed module 602, and the module antenna Ant#5 corresponding to the first antenna feed module 601, which are switched to Different configurations (shown in the figure are ANT#3_Cond.1, ANT#3_Cond.2, ANT#3_Cond.3, ANT#3_Cond.4, ANT#5_Cond.1, ANT#5_Cond.2, ANT#5_Cond. 3. ANT#5_Cond.4, ANT#5_Cond.5) covers GPS band, medium frequency band, high frequency band, 5G Sub 6 N41 frequency band, WIFI 2.4G frequency band, 5G Sub 6 N77/N78/N79 frequency band, WIFI 5G Frequency band, S parameter of WIFI 6E band.
請一併參閱圖42B，為電子裝置700的上天線，即第二天線饋入模組602對應之模組天線Ant#3、以及第一天線饋入模組601對應之模組天線Ant#5之輻射效率圖。其中，圖42B為第二天線饋入模組602對應之模組天線Ant#3、以及第一天線饋入模組601對應之模組天線Ant#5且透過主動電路13、413切換至不同的組態(圖中所示為ANT#3_Cond.1、ANT#3_Cond.2、ANT#3_Cond.3、ANT#3_Cond.4、ANT#5_Cond.1、ANT#5_Cond.2、ANT#5_Cond.3、ANT#5_Cond.4、ANT#5_Cond.5)時覆蓋GPS頻段、中頻頻段、高頻頻段、5G Sub 6 N41頻段、WIFI 2.4G頻段、5G Sub 6 N77/N78/N79頻段、WIFI 5G頻段、WIFI 6E頻段之 輻射效率。 Please also refer to FIG. 42B , which shows the upper antenna of the electronic device 700 , that is, the module antenna Ant #3 corresponding to the second antenna feed module 602 and the module antenna Ant corresponding to the first antenna feed module 601 #5 Radiation Efficiency Chart. Among them, Figure 42B shows the module antenna Ant#3 corresponding to the second antenna feed module 602, and the module antenna Ant#5 corresponding to the first antenna feed module 601, which are switched to Different configurations (shown in the figure are ANT#3_Cond.1, ANT#3_Cond.2, ANT#3_Cond.3, ANT#3_Cond.4, ANT#5_Cond.1, ANT#5_Cond.2, ANT#5_Cond. 3. ANT#5_Cond.4, ANT#5_Cond.5) covers GPS band, medium frequency band, high frequency band, 5G Sub 6 N41 frequency band, WIFI 2.4G frequency band, 5G Sub 6 N77/N78/N79 frequency band, WIFI 5G Frequency band, WIFI 6E frequency band Radiation efficiency.
請一併參閱圖42C，為電子裝置700的上天線，即第二天線饋入模組602對應之模組天線Ant#3、以及第一天線饋入模組601對應之模組天線Ant#5，與鄰近天線之隔離度曲線圖。其中，圖42C為為電子裝置700的上天線，即第二天線饋入模組602對應之模組天線Ant#3、以及第一天線饋入模組601對應之模組天線Ant#5，與非模組天線Ant#4(圖中所示為ANT#4-ANT#3、ANT#4-ANT#5、ANT#3-ANT#5)在GPS頻段、中頻頻段、高頻頻段、5G Sub 6 N41頻段、WIFI 2.4G頻段、5G Sub 6 N77/N78/N79頻段、WIFI 5G頻段、WIFI 6E頻段之隔離度。 Please also refer to FIG. 42C , which shows the upper antenna of the electronic device 700 , that is, the module antenna Ant #3 corresponding to the second antenna feeding module 602 and the module antenna Ant corresponding to the first antenna feeding module 601 #5, Isolation curve from adjacent antennas. Among them, Figure 42C shows the upper antenna of the electronic device 700, that is, the module antenna Ant#3 corresponding to the second antenna feed module 602, and the module antenna Ant#5 corresponding to the first antenna feed module 601. , and non-module antenna Ant#4 (shown as ANT#4-ANT#3, ANT#4-ANT#5, ANT#3-ANT#5 in the figure) in the GPS band, medium frequency band, and high frequency band , 5G Sub 6 N41 frequency band, WIFI 2.4G frequency band, 5G Sub 6 N77/N78/N79 frequency band, WIFI 5G frequency band, WIFI 6E frequency band isolation.
以上所述，僅為本發明的較佳實施例，並非是對本發明作任何形式上的限定。另外，本領域技術人員還可在本發明精神內做其它變化，當然，這些依據本發明精神所做的變化，都應包含在本發明所要求保護的範圍之內。 The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention in any form. In addition, those skilled in the art can also make other changes within the spirit of the present invention. Of course, these changes made based on the spirit of the present invention should be included in the scope of protection claimed by the present invention.
700:電子裝置 700: Electronic devices
600:天線饋入模組 600: Antenna feed module
601:第一天線饋入模組 601: First antenna feed module
602:第二天線饋入模組 602: Second antenna feed module
603:第三天線饋入模組 603:Third antenna feed module
604:第四天線饋入模組 604: The fourth antenna feed module
605:第五天線饋入模組 605: The fifth antenna feed module
7304:金屬邊框 7304:Metal frame
73041:頂部金屬邊框 73041:Top metal frame
73042:第一金屬側邊框 73042: The first metal side frame
73043:底部金屬邊框 73043: Bottom metal frame
73044:第二金屬側邊框 73044: Second metal side frame
7306:接地面 7306: Ground plane
7307:中框 7307: middle frame
7309:狹縫 7309:Slit
7310:縫隙 7310:Gap
7311:輻射體 7311:radiator
P1、P2、P3、P4、P5:位置 P1, P2, P3, P4, P5: position
Claims (8)
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| CN109088160A (en) * | 2018-08-12 | 2018-12-25 | 瑞声科技（南京）有限公司 | antenna system and mobile terminal |
| TW201947814A (en) * | 2018-05-08 | 2019-12-16 | 群邁通訊股份有限公司 | Antenna structure and wireless communication device with same |
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| TW201947814A (en) * | 2018-05-08 | 2019-12-16 | 群邁通訊股份有限公司 | Antenna structure and wireless communication device with same |
| CN109088160A (en) * | 2018-08-12 | 2018-12-25 | 瑞声科技（南京）有限公司 | antenna system and mobile terminal |
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