TW202345453A - Antenna feed couple module and electronic device with same - Google Patents

Abstract

An antenna feed couple module applied in an electronic device having a metal frame and at least one electronic component. The metal frame and the at least one electronic component are spaced from each other and form a slot for receiving the antenna feed couple module. The antenna feed couple module includes a substrate, at least one couple feed portion, an active circuit, a metal layer, and a non-metal layer. The at least one couple feed portion and the active circuit are both arranged on the substrate. The at least one couple feed portion faces the metal layer. At least one signal feeding point is arranged on one side of the radiation portion to feed electrical signals to the at least one couple feed portion. The metal layer is configured to couple feed in feed electric signals and conduct the current to the metal frame, the metal frame radiates wireless signals. The non-metal layer is arranged between the metal layer and the at least one couple feed portion. The active circuit is electrically connected to the at least one couple feed portion to switch the feed electric signals of the at least one couple feed portion. The application also provides an electronic device with the antenna feed couple module.

Description

天線饋入耦合模組及電子裝置Antenna feed coupling module and electronic device

本申請涉及通訊技術領域，尤其涉及天線饋入耦合模組及電子裝置。This application relates to the field of communication technology, and in particular to antenna feed coupling modules and electronic devices.

隨著無線通訊技術之進步，行動電話、個人數位助理等電子裝置不斷朝向功能多樣化、輕薄化、以及資料傳輸更快、更有效率等趨勢發展。然而其相對可容納天線之空間亦就越來越小，且隨著無線通訊技術之不斷發展，天線之頻寬需求不斷增加。因此，如何於有限之空間內設計出具有較寬頻寬及較佳效率之天線，係天線設計面臨之一項重要課題。With the advancement of wireless communication technology, electronic devices such as mobile phones and personal digital assistants continue to develop towards trends such as diversified functions, thinness and lightness, and faster and more efficient data transmission. However, the space that can accommodate the antenna is getting smaller and smaller, and with the continuous development of wireless communication technology, the bandwidth requirement of the antenna continues to increase. Therefore, how to design an antenna with wider bandwidth and better efficiency in a limited space is an important issue faced by antenna design.

本申請提供一種天線饋入耦合模組及電子裝置，所述天線饋入耦合模組可設置於電子裝置內，且與金屬輻射體配合，進而涵蓋多個頻段，以提升頻寬並兼具最佳天線效率。The present application provides an antenna feed-in coupling module and an electronic device. The antenna feed-in coupling module can be installed in an electronic device and cooperates with a metal radiator to cover multiple frequency bands to increase bandwidth and have the best performance. Best antenna efficiency.

一種天線饋入耦合模組，應用於具有金屬邊框及至少一電子組件的電子裝置中，金屬邊框與至少一電子組件間隔設置形成一狹縫，天線饋入耦合模組設置於狹縫中，天線饋入耦合模組包括基體、至少一耦合饋入單元、主動電路、金屬層及非導電層；至少一耦合饋入單元與主動電路分別設置於基體相對的兩個表面，且至少一耦合饋入單元朝向金屬層而設置，至少一耦合饋入單元之一側設置有至少一訊號饋電點，訊號饋電點電性連接至主動電路，至少一耦合饋入單元為金屬層耦合饋入電訊號，所述金屬層傳導所述電訊號至所述金屬邊框，以使金屬邊框輻射無線訊號；非導電層設置於金屬層與至少一耦合饋入單元之間，並覆蓋至少一耦合饋入單元；主動電路用以切換至少一耦合饋入單元的饋入電訊號。An antenna feed coupling module is used in an electronic device with a metal frame and at least one electronic component. The metal frame and the at least one electronic component are spaced apart to form a slit. The antenna feed coupling module is disposed in the slit. The antenna The feed coupling module includes a base body, at least one coupling feed unit, an active circuit, a metal layer and a non-conductive layer; at least one coupling feed unit and the active circuit are respectively disposed on two opposite surfaces of the base body, and at least one coupling feed unit The unit is arranged toward the metal layer, and at least one signal feed point is provided on one side of the at least one coupling feed unit. The signal feed point is electrically connected to the active circuit. The at least one coupling feed unit couples and feeds electrical signals to the metal layer. The metal layer conducts the electrical signal to the metal frame, so that the metal frame radiates the wireless signal; the non-conductive layer is disposed between the metal layer and at least one coupling feed unit, and covers at least one coupling feed unit; active The circuit is used to switch the feed electrical signal of at least one coupling feed unit.

一種電子裝置，包括上述之天線饋入耦合模組。An electronic device includes the above-mentioned antenna feed coupling module.

上述天線饋入耦合模組及電子裝置可激發出多個輻射模態，進而涵蓋多個頻段，以提升頻寬並兼具最佳天線效率。The above-mentioned antenna feed coupling module and electronic device can excite multiple radiation modes, thereby covering multiple frequency bands, so as to increase the bandwidth and achieve optimal antenna efficiency.

為使本申請實施例之目的、技術方案與優點更加清楚，下面將結合本申請實施例中之附圖，對本申請實施例中之技術方案進行清楚、完整地描述，顯然，所描述之實施例係本申請一部分實施例，而不係全部之實施例。基於本申請中之實施例，所屬領域具有通常知識者於沒有做出創造性勞動前提下所獲得之所有其他實施例，均屬於本申請保護之範圍。In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments These are part of the embodiments of the present application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by those with ordinary knowledge in the art without any creative work shall fall within the scope of protection of this application.

需要說明的是，本申請實施例中“至少一個”係指一個或者多個，多個係指兩個或兩個以上。除非另有定義，本文所使用之所有之技術與科學術語與所屬領域具有通常知識者通常理解之含義相同。本申請之說明書中所使用之術語僅是為描述具體之實施例之目不是旨在於限制本申請。It should be noted that “at least one” in the embodiments of this application refers to one or more, and multiple refers to two or more. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terms used in the description of the present application are only for describing specific embodiments and are not intended to limit the present application.

應理解，本申請中除非另有說明，“/”表示或的意思。例如，A/B可表示A或B。本申請中之“A與/或B”僅僅係一種描述關聯物件之關聯關係，表示可存於僅存於A、僅存於B以及存於A與B這三種關係。It should be understood that in this application, "/" means or unless otherwise stated. For example, A/B can mean A or B. “A and/or B” in this application is merely an association relationship describing related objects, indicating that it can exist in three relationships: only A, only B, and A and B.

需要說明的是，本申請實施例中，“第一”、“第二”等詞彙，僅用於區分描述之目的，而不能理解為指示或暗示相對重要性，亦不能理解為指示或暗示順序。限定有“第一”、“第二”之特徵可明示或者隱含地包括一個或者更多個所述特徵。於本申請實施例之描述中，“示例性的”或者“例如”等詞用於表示作例子、例證或說明。本申請實施例中被描述為“示例性的”或者“例如”之任何實施例或設計方案不應被解釋為比其它實施例或設計方案更優選或更具優勢。確切而言，使用“示例性的”或者“例如”等詞旨於以具體方式呈現相關概念。It should be noted that in the embodiments of this application, words such as "first" and "second" are only used for the purpose of distinguishing and describing, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying order. . Features defined as "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of the embodiments of this application, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "such as" in the embodiments of the present application is not to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the words "exemplary" or "such as" is intended to present the concepts in a specific manner.

需要說明的是，本申請實施例中，術語“高度”係指於垂直於參考地層之方向上之投影長度。術語“中心”、“上”、“下”、“前”、“後”、“左”、“右”、“豎直”、“水平”、“頂”、“底”、“內”、“外”等指示之方位或位置關係為基於附圖所示之方位或位置關係，僅係為便於描述本申請與簡化描述，而不是指示或暗示所指之裝置或元件必須具有特定之方位、以特定之方位構造與操作，因此不能理解為對本申請之限制。It should be noted that in the embodiment of the present application, the term "height" refers to the projected length in the direction perpendicular to the reference stratum. The terms "center", "top", "bottom", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or component referred to must have a specific orientation. It is constructed and operated in a specific orientation and therefore cannot be construed as a limitation on this application.

請一併參閱圖1圖2及圖3B，可以理解，本申請較佳實施例提供一種天線饋入耦合模組100。所述天線饋入耦合模組100包括基體11、至少一耦合饋入單元Patch、主動電路13（參圖2）、連接器14（參圖2）、金屬層15及非金屬層16（參圖3B）。Please refer to FIG. 1 , FIG. 2 and FIG. 3B together, and it can be understood that a preferred embodiment of the present application provides an antenna feed coupling module 100 . The antenna feed coupling module 100 includes a base 11, at least one coupling feed unit Patch, an active circuit 13 (see Figure 2), a connector 14 (see Figure 2), a metal layer 15 and a non-metal layer 16 (see Figure 2). 3B).

所述基體11可為介質基板，例如，印刷電路板（printed circuit board，PCB），陶瓷（ceramics）基體或其他介質基板，於此不做具體限定。所述基體11包括第一表面111及第二表面112，所述第二表面112與所述第一表面111相對設置。The base 11 can be a dielectric substrate, such as a printed circuit board (PCB), ceramics (ceramics) base or other dielectric substrate, which is not specifically limited here. The base 11 includes a first surface 111 and a second surface 112 , and the second surface 112 is opposite to the first surface 111 .

請一併參閱圖3A，於本申請實施例中，天線饋入耦合模組100包括第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2。第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2整體呈金屬薄片狀。第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2設置於所述基體11之第一表面111。所述第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2可藉由穿孔（過孔）113連接至所述基體11之第二表面112。Please also refer to FIG. 3A . In the embodiment of the present application, the antenna feed coupling module 100 includes a first coupling feed unit Patch 1 and a second coupling feed unit Patch 2 . The first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are in the shape of metal sheets as a whole. The first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are disposed on the first surface 111 of the base 11 . The first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 may be connected to the second surface 112 of the base 11 through a through hole (via hole) 113 .

請一併參閱圖3A，於其中一個實施例中，第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2均整體呈矩形貼片形狀，其表面並未設置任何縫隙、切槽、斷點等。第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2之一側均對應設置有至少一訊號饋電點121。所述訊號饋電點121用以藉由匹配電路（圖未示，參後詳述）通過穿孔（過孔）113電連接至相應之饋入源（圖未示，參後詳述），進而將電訊號分別饋入至所述第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2。Please refer to FIG. 3A together. In one embodiment, the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are both in the shape of a rectangular patch, and there are no gaps, cuts, or grooves on their surfaces. Breakpoints etc. Each side of the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 is provided with at least one signal feed point 121 correspondingly. The signal feed point 121 is used to be electrically connected to the corresponding feed source (not shown in the figure, please refer to the details below) through the through hole (via) 113 through the matching circuit (not shown in the figure, please refer to the details below), and then Electrical signals are fed into the first coupling feeding unit Patch 1 and the second coupling feeding unit Patch 2 respectively.

可以理解，於本申請實施例中，所述第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2為矩形貼片形狀，亦可根據不同的輻射頻率調整貼片的形狀及面積，並不對至少一耦合饋入單元Patch之具體形狀及結構進行限定。It can be understood that in the embodiment of the present application, the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are in the shape of rectangular patches, and the shape and area of the patches can also be adjusted according to different radiation frequencies. The specific shape and structure of the at least one coupling feed unit Patch are not limited.

所述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2間隔設置。第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2之面積分配可依據頻寬需求做比例調整，如此藉由大面積提供較寬頻耦合效果。例如，第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2靠近輻射體（輻射體可為，但不局限於，金屬邊框、鐵件、PCB軟板上之銅箔、或LDS製程中的導體等等）時，兩者非接觸，如此可透過耦合將訊號傳遞至輻射體，並由輻射體來發射/接收無線訊號。顯然，當耦合饋入單元之面積分配越大，則透過耦合將訊號由輻射體發射/接收時，所得頻寬越寬，進而實現大面積提供較寬頻耦合效果。The first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are arranged at intervals. The area allocation of the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 can be proportionally adjusted according to the bandwidth requirements, thus providing a wider frequency coupling effect through a large area. For example, the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are close to the radiator (the radiator can be, but is not limited to, a metal frame, iron parts, copper foil on a PCB soft board, or LDS process (conductor, etc.), the two are non-contact, so that the signal can be transmitted to the radiator through coupling, and the radiator can transmit/receive wireless signals. Obviously, when the area distribution of the coupling feed unit is larger, the resulting bandwidth will be wider when the signal is transmitted/received from the radiator through coupling, thereby achieving a wider frequency coupling effect over a large area.

可以理解，請再次參閱圖2及圖3A，於本申請實施例中，所述主動電路13設置於所述基體11之第二表面112上。所述基體11之第二表面112上佈設有連接線路（圖未示）。所述連接線路連接至所述主動電路13。所述主動電路13可包括切換開關，與/或其他可變換阻抗之可調元件（圖未示，參後詳述）。所述主動電路13可藉由所述連接線路電連接至所述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2及所述連接器14。例如，於其中一個實施例中，所述基體11上還設置有穿孔（過孔）113，所述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2可透過所述穿孔（過孔）113連接至所述基體11之第二表面112，並藉由所述第二表面112上之連接線路連接至所述主動電路13。It can be understood that please refer to FIG. 2 and FIG. 3A again. In the embodiment of the present application, the active circuit 13 is disposed on the second surface 112 of the base 11 . The second surface 112 of the base 11 is provided with connection lines (not shown). The connection line is connected to the active circuit 13 . The active circuit 13 may include a switch and/or other adjustable components with variable impedance (not shown in the figure, see details below). The active circuit 13 can be electrically connected to the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 and the connector 14 through the connection line. For example, in one embodiment, the base 11 is also provided with a through hole (via hole) 113, and the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 can pass through the through hole (via hole). hole) 113 is connected to the second surface 112 of the base body 11 and is connected to the active circuit 13 through the connection lines on the second surface 112 .

所述連接器14設置於所述基體11之第二表面112上，即設置於所述主動電路13所在表面。於其中一些實施例中，所述連接器14可與所述主動電路13間隔設置，且彼此電連接。當然，於本申請實施例中，並不對所述連接器14與所述主動電路13之具體位置關係及連接關係等進行限制。例如，於其中一個實施例中，所述主動電路13可設置於所述連接器14內，即所述連接器14可用以***述主動電路13。所述連接器14電連接至所述主動電路13，且連接至相應之傳輸線，進而藉由所述傳輸線實現所述天線饋入耦合模組100之訊號傳輸，例如實現訊號之送出或送入。The connector 14 is disposed on the second surface 112 of the base 11 , that is, on the surface where the active circuit 13 is located. In some embodiments, the connector 14 may be spaced apart from the active circuit 13 and electrically connected to each other. Of course, in the embodiment of the present application, the specific positional relationship and connection relationship between the connector 14 and the active circuit 13 are not limited. For example, in one embodiment, the active circuit 13 can be disposed in the connector 14 , that is, the connector 14 can be used to accommodate the active circuit 13 . The connector 14 is electrically connected to the active circuit 13 and to a corresponding transmission line, thereby realizing signal transmission of the antenna feed coupling module 100 through the transmission line, for example, realizing the sending or input of signals.

可以理解，所述傳輸線可為，但不局限於，同軸電纜（coaxial cable），柔性印刷電路板（Flexible Printed Circuit Board，FPCB）或其他傳輸線等。It can be understood that the transmission line may be, but is not limited to, a coaxial cable, a flexible printed circuit board (Flexible Printed Circuit Board, FPCB) or other transmission lines.

請一併參閱圖3B及圖3C，所述非導電層16設置於所述金屬層15與所述至少一耦合饋入單元Patch之間，並覆蓋所述至少一耦合饋入單元Patch。具體地，所述非導電層16覆蓋於所述基體11之第一表面111上，並覆蓋第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2。於其中一個實施例中，所述非導電層16可由非導電材料製成，例如，由耐燃材料FR4、氧化鋁（AL ₂O ₃）、Arlon材料、陶瓷（ceramics）等其中一種或多種形成，於此不做具體限定。 Please refer to FIG. 3B and FIG. 3C together. The non-conductive layer 16 is disposed between the metal layer 15 and the at least one coupling feed unit Patch, and covers the at least one coupling feed unit Patch. Specifically, the non-conductive layer 16 covers the first surface 111 of the base 11 and covers the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 . In one embodiment, the non-conductive layer 16 may be made of non-conductive material, for example, formed of one or more of flame-resistant material FR4, aluminum oxide (AL ₂ O ₃ ), Arlon material, ceramics, etc., There is no specific limitation here.

所述金屬層15對應非導電層16遠離基體11的一側設置。所述金屬層15可以根據訊號輻射的需求設置為不同的尺寸或形狀。於其中一個實施例中，請參閱圖3B，所述金屬層15對應非導電層16的尺寸設置，即所述金屬層15在第一方向上的投影面積與所述非導電層16在所述第一方向上的投影面積相同，且所述金屬層15在第一方向上的投影面積大於第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2在第一方向上的投影面積。其中，所述第一方向可以為所述金屬層15及所述非導電層16朝向基體11的方向，或者沿基體11的厚度方向，參圖3B所示的X方向。於其中另一個實施例中，請參閱圖3C，所述金屬層15對應第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2的尺寸設置，即所述金屬層15在第一方向上的投影面積與第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2在所述第一方向上的投影面積大致相同，第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2在第一方向上的投影位置與金屬層15在第一方向上的投影位置對應，且第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2位於金屬層15在第一方向上的投影範圍內；所述金屬層15在第一方向上的投影面積小於所述非導電層16在第一方向上的投影面積，且所述金屬層15位於所述非導電層16在所述第一方向上的投影範圍內。The metal layer 15 is disposed corresponding to the side of the non-conductive layer 16 away from the base 11 . The metal layer 15 can be configured in different sizes or shapes according to signal radiation requirements. In one embodiment, please refer to FIG. 3B , the size of the metal layer 15 corresponds to the non-conductive layer 16 , that is, the projected area of the metal layer 15 in the first direction is equal to the size of the non-conductive layer 16 in the first direction. The projected areas in the first direction are the same, and the projected areas of the metal layer 15 in the first direction are larger than the projected areas of the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 in the first direction. The first direction may be the direction in which the metal layer 15 and the non-conductive layer 16 face the base 11 , or along the thickness direction of the base 11 , refer to the X direction shown in FIG. 3B . In another embodiment, please refer to FIG. 3C , the metal layer 15 is arranged corresponding to the size of the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2, that is, the metal layer 15 is on the first side. The upward projected area is approximately the same as the projected area of the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 in the first direction. The first coupling feed unit Patch 1 and the second coupling feed unit Patch 1 The projection position of Patch 2 in the first direction corresponds to the projection position of the metal layer 15 in the first direction, and the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are located in the first direction of the metal layer 15 Within the upward projection range; the projected area of the metal layer 15 in the first direction is smaller than the projected area of the non-conductive layer 16 in the first direction, and the metal layer 15 is located where the non-conductive layer 16 is. within the projection range in the first direction.

所述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2分別透過訊號饋電點121從所述主動電路13饋入電訊號，並將電訊號耦合至所述金屬層15，以使所述金屬層15可進一步傳導電訊號至輻射體（輻射體可為，但不局限於，金屬邊框、鐵件、PCB軟板上之銅箔、或LDS製程中的導體等等）。另外，所述天線饋入耦合模組100還可利用所述主動電路13之切換開關，以切換多模態，進而實現多個寬頻操作。The first coupling feeding unit Patch 1 and the second coupling feeding unit Patch 2 respectively feed electrical signals from the active circuit 13 through the signal feeding point 121, and couple the electrical signals to the metal layer 15, so that The metal layer 15 can further conduct electrical signals to the radiator (the radiator can be, but is not limited to, a metal frame, iron parts, copper foil on a PCB soft board, or a conductor in the LDS process, etc.). In addition, the antenna feed coupling module 100 can also use the switch of the active circuit 13 to switch multiple modes, thereby achieving multiple broadband operations.

例如，於其中一個實施例中，第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2間隔設置，且藉由與所述金屬層15與輻射體抵接設置，進而可使輻射體用以接收4G/5G中頻訊號（頻率範圍為1.7GHz-2.2GHz）、高頻訊號（頻率範圍為2.3GHz-2.7GHz）、超高頻（ultra high band，UHB）訊號（頻率範圍為3.3GHz-5GHz）、GPS訊號（頻率範圍為1.5GHz-1.6GHz）、Wi-Fi訊號（頻率範圍為2.4GHz，5GHz）等。For example, in one embodiment, the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are spaced apart, and are disposed in contact with the metal layer 15 and the radiator, so that the radiator can Used to receive 4G/5G mid-frequency signals (frequency range: 1.7GHz-2.2GHz), high-frequency signals (frequency range: 2.3GHz-2.7GHz), ultra high frequency (ultra high band, UHB) signals (frequency range: 3.3 GHz-5GHz), GPS signal (frequency range 1.5GHz-1.6GHz), Wi-Fi signal (frequency range 2.4GHz, 5GHz), etc.

當然，於本申請實施例中，並不對所述天線饋入耦合模組100之頻率進行限制。例如，可藉由調整所述天線饋入耦合模組100之形狀、長度、寬度、面積等參數，以調整所需之頻率。另外，所述至少一耦合饋入單元Patch之形狀、長度、寬度、面積等參數，亦可根據所需之頻率進行調整。Of course, in the embodiment of the present application, the frequency of the antenna feeding into the coupling module 100 is not limited. For example, the required frequency can be adjusted by adjusting the shape, length, width, area and other parameters of the antenna feed coupling module 100 . In addition, the shape, length, width, area and other parameters of the at least one coupling feed unit Patch can also be adjusted according to the required frequency.

可以理解，請一併參閱圖4及圖5，所述天線饋入耦合模組100可以應用於具有金屬邊框304及至少一電子組件303的電子裝置300中。所述金屬邊框304與所述至少一電子組件303間隔設置形成一狹縫309。所述天線饋入耦合模組100可設置於所述狹縫309中。其中，所述天線饋入耦合模組100設置有金屬層15之一側朝向並抵接所述金屬邊框304設置，同時，至少一耦合饋入單元Patch（例如圖3A至圖3C所示之第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2）也朝向所述金屬邊框304設置，所述基體11設置有主動電路13及連接器14的一側間隔所述至少一電子組件303設置。It can be understood that, please refer to FIG. 4 and FIG. 5 together, the antenna feed coupling module 100 can be applied to an electronic device 300 having a metal frame 304 and at least one electronic component 303 . The metal frame 304 is spaced apart from the at least one electronic component 303 to form a slit 309 . The antenna feed coupling module 100 may be disposed in the slit 309 . Among them, the side of the antenna feed coupling module 100 provided with the metal layer 15 faces and is disposed in contact with the metal frame 304. At the same time, at least one coupling feed unit Patch (for example, the third coupling feed unit Patch shown in FIGS. 3A to 3C A coupling feed unit Patch 1 and a second coupling feed unit Patch 2) are also provided toward the metal frame 304 , and the side of the base 11 provided with the active circuit 13 and the connector 14 is spaced apart from the at least one electronic component 303 settings.

可以理解，於本申請實施例中，並不對所述金屬邊框304之具體結構，與/或其與其他元件之連接關係等進行限制。例如，所述金屬邊框304可連接至地（即所述金屬邊框304接地處理），或者不連接至地。又如，所述金屬邊框304上可設置或未設置任何斷點、斷槽、縫隙等。It can be understood that in the embodiment of the present application, the specific structure of the metal frame 304 and/or its connection relationship with other components are not limited. For example, the metal frame 304 may be connected to the ground (that is, the metal frame 304 is grounded), or may not be connected to the ground. For another example, the metal frame 304 may or may not be provided with any break points, grooves, gaps, etc.

可以理解，請一併參閱圖6，於本申請實施例中，當所述天線饋入耦合模組100可應用於一電子裝置300時，天線饋入耦合模組100可致使所述電子裝置300發射、接收無線電波以傳遞、交換無線訊號。所述電子裝置300可為掌上型通訊裝置（例如行動電話）、折疊機、智慧穿戴裝置（例如手錶，耳機等）、平板電腦、個人數位助理（personal digital assistant，PDA）等，於此不做具體限制。It can be understood that please refer to FIG. 6 together. In the embodiment of the present application, when the antenna feeding coupling module 100 can be applied to an electronic device 300, the antenna feeding coupling module 100 can cause the electronic device 300 to Transmit and receive radio waves to transmit and exchange wireless signals. The electronic device 300 may be a handheld communication device (such as a mobile phone), a folding machine, a smart wearable device (such as a watch, headphones, etc.), a tablet computer, a personal digital assistant (PDA), etc., which will not be discussed here. Specific restrictions.

可以理解，所述電子裝置300可採用以下一種或多種通訊技術：藍牙（bluetooth，BT）通訊技術、全球定位系統（global positioning system，GPS）通訊技術、無線保真（wireless fidelity，Wi-Fi）通訊技術、全球移動通訊系統（global system for mobile communications，GSM）通訊技術、寬頻碼分多址（wideband code division multiple access，WCDMA）通訊技術、長期演進（long term evolution，LTE）通訊技術、5G通訊技術、SUB-6G通訊技術以及未來其他通訊技術等。It can be understood that the electronic device 300 can adopt one or more of the following communication technologies: Bluetooth (BT) communication technology, global positioning system (GPS) communication technology, wireless fidelity (Wi-Fi) Communication technology, global system for mobile communications (GSM) communication technology, wideband code division multiple access (WCDMA) communication technology, long term evolution (LTE) communication technology, 5G communication technology, SUB-6G communication technology and other future communication technologies, etc.

於本申請實施例中，以所述電子裝置300為手機為例加以說明。In the embodiment of the present application, the electronic device 300 is a mobile phone as an example for explanation.

請再次參閱圖6，於其中一實施例中，所述電子裝置300至少包括金屬邊框304、電池303、背板305、接地面306及中框307。Please refer to FIG. 6 again. In one embodiment, the electronic device 300 at least includes a metal frame 304, a battery 303, a backplane 305, a ground plane 306 and a middle frame 307.

所述金屬邊框304由金屬或其他導電材料製成。所述背板305可由金屬或其他導電材料製成。所述金屬邊框304設置於所述背板305之邊緣，並與所述背板305共同形成一容置空間308。所述金屬邊框304相對所述背板305之一側設置有一開口（圖未標），用於容置一顯示單元（圖未示）。所述顯示單元具有一顯示平面，該顯示平面裸露於該開口。可以理解，所述顯示單元可結合觸摸感測器組合成觸控屏。觸摸感測器又可稱為觸控面板或觸敏面板。The metal frame 304 is made of metal or other conductive materials. The back plate 305 may be made of metal or other conductive materials. The metal frame 304 is disposed on the edge of the back plate 305 and together with the back plate 305 forms an accommodation space 308 . An opening (not shown) is provided on one side of the metal frame 304 opposite to the back plate 305 for accommodating a display unit (not shown). The display unit has a display plane exposed at the opening. It can be understood that the display unit can be combined with a touch sensor to form a touch screen. A touch sensor can also be called a touch panel or a touch-sensitive panel.

可以理解，於本申請實施例中，所述顯示單元具有高屏占比。即所述顯示單元之顯示平面之面積大於70%之電子裝置之正面面積，甚至可做到正面全螢幕。具體於本申請實施例中，所述全螢幕是指除了所述電子裝置300上開設之必要之槽孔以外，所述顯示單元之左側、右側、下側均可無縫隙地連接至所述金屬邊框304。It can be understood that in the embodiment of the present application, the display unit has a high screen-to-body ratio. That is, the area of the display plane of the display unit is greater than 70% of the front area of the electronic device, and can even achieve a full front screen. Specifically in the embodiment of the present application, the full screen means that in addition to the necessary slots opened on the electronic device 300, the left, right and lower sides of the display unit can be seamlessly connected to the metal Border 304.

所述接地面306可由金屬或其他導電材料製成。所述接地面306可設置於所述金屬邊框304與所述背板305共同圍成之所述容置空間308內，且連接至所述背板305。The ground plane 306 may be made of metal or other conductive materials. The ground plane 306 may be disposed in the accommodating space 308 formed by the metal frame 304 and the back plate 305 and connected to the back plate 305 .

所述中框307由金屬或其他導電材料製成。所述中框307之形狀及尺寸可小於所述接地面306。所述中框307疊設於所述接地面306上。於本實施例中，所述中框307為設置於所述顯示單元與所述接地面306之間之金屬片。所述中框307用於支撐所述顯示單元、提供電磁屏蔽、及提高所述電子裝置300之機構強度。The middle frame 307 is made of metal or other conductive materials. The shape and size of the middle frame 307 may be smaller than the ground plane 306 . The middle frame 307 is stacked on the ground plane 306 . In this embodiment, the middle frame 307 is a metal piece disposed between the display unit and the ground plane 306 . The middle frame 307 is used to support the display unit, provide electromagnetic shielding, and improve the mechanical strength of the electronic device 300 .

可以理解，於本實施例中，所述金屬邊框304、所述背板305、所述接地面306及所述中框307可構成一體成型之金屬框體。所述背板305、所述接地面306及所述中框307為大面積金屬，因此可共同構成所述電子裝置300之系統接地面（圖未標）。It can be understood that in this embodiment, the metal frame 304 , the back plate 305 , the ground plane 306 and the middle frame 307 can form an integrated metal frame. The back plate 305 , the ground plane 306 and the middle frame 307 are made of large-area metal, so they can jointly form the system ground plane of the electronic device 300 (not labeled in the figure).

所述電池303設置於所述中框307上，用以為所述電子裝置300之電子元件、模組、電路等提供電能。所述電池303與所述金屬邊框304間隔設置，進而於兩者之間形成狹縫309。The battery 303 is disposed on the middle frame 307 to provide electrical energy for electronic components, modules, circuits, etc. of the electronic device 300 . The battery 303 and the metal frame 304 are spaced apart, and a slit 309 is formed between them.

可以理解，於其他實施例中，所述電子裝置300還可包括以下一個或多個元件，例如處理器、電路板、記憶體、輸入輸出電路、音訊元件（例如麥克風及揚聲器等）、多媒體元件（例如前置攝像頭與/後置攝像頭）、感測器元件（例如接近感測器、距離感測器、環境光感測器、加速度感測器、陀螺儀、磁感測器、壓力感測器及/或溫度感測器等）等，於此不再贅述。It can be understood that in other embodiments, the electronic device 300 may also include one or more of the following components, such as a processor, a circuit board, a memory, an input and output circuit, an audio component (such as a microphone and a speaker, etc.), and a multimedia component. (such as front camera and/or rear camera), sensor components (such as proximity sensor, distance sensor, ambient light sensor, acceleration sensor, gyroscope, magnetic sensor, pressure sensor device and/or temperature sensor, etc.), etc., which will not be described again here.

請一併參閱圖5及圖6，可以理解，當所述天線饋入耦合模組100應用至所述電子裝置300時，所述天線饋入耦合模組100可設置於所述狹縫309內，且大致垂直所述接地面306所在平面設置。所述金屬邊框304之一部分可構成輻射體。具體地，所述金屬邊框304上設置有第一縫隙311及第二縫隙312。所述第一縫隙311及第二縫隙312隔斷所述金屬邊框304，以將所述金屬邊框304至少劃分為間隔設置之第一部分313、第二部分314及第三部分315。其中所述第一部分313、第二部分314及第三部分315均能夠用以輻射無線訊號。所述第二部分314可電連接至所述系統接地面，例如所述接地面306，即接地。Please refer to FIGS. 5 and 6 together. It can be understood that when the antenna feed coupling module 100 is applied to the electronic device 300 , the antenna feed coupling module 100 can be disposed in the slit 309 , and is arranged approximately perpendicular to the plane where the ground plane 306 is located. A part of the metal frame 304 may constitute a radiator. Specifically, the metal frame 304 is provided with a first slit 311 and a second slit 312 . The first slit 311 and the second slit 312 separate the metal frame 304 so as to divide the metal frame 304 into at least a first part 313, a second part 314 and a third part 315 arranged at intervals. The first part 313, the second part 314 and the third part 315 can all be used to radiate wireless signals. The second portion 314 may be electrically connected to the system ground plane, such as the ground plane 306, ie, ground.

可以理解，於其中一個實施例中，所述第一縫隙311及第二縫隙312可與所述狹縫309連通，並填充有絕緣材料，例如塑膠、橡膠、玻璃、木材、陶瓷等，但不以此為限。It can be understood that in one embodiment, the first gap 311 and the second gap 312 can be connected with the slit 309 and filled with insulating materials, such as plastic, rubber, glass, wood, ceramics, etc., but not This is the limit.

可以理解，於其中一個實施例中，所述第三部分315靠近所述第二縫隙312之一側設置有接地點316。所述接地點316之一端電連接至所述第三部分315，另一端電連接至所述中框307，即接地。而所述天線饋入耦合模組100設置於所述第一部分313與所述接地點316之間之所述狹縫309內，且大致垂直所述接地面306所在平面設置。It can be understood that in one embodiment, a grounding point 316 is provided on one side of the third portion 315 close to the second gap 312 . One end of the ground point 316 is electrically connected to the third part 315, and the other end is electrically connected to the middle frame 307, that is, grounded. The antenna feed coupling module 100 is disposed in the slit 309 between the first part 313 and the ground point 316, and is substantially perpendicular to the plane of the ground plane 306.

可以理解，當所述天線饋入耦合模組100設置於所述狹縫309內時，所述天線饋入耦合模組100上之金屬層15朝向並抵接所述第一部分313，第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2朝向所述第一部分313。所述連接器14設置於所述基體11之另一表面，即背向所述第一部分313設置。所述連接器14之一端電連接至所述中框307，另一端與所述基體11電連接。It can be understood that when the antenna feed coupling module 100 is disposed in the slit 309, the metal layer 15 on the antenna feed coupling module 100 faces and abuts the first part 313, and the first coupling The feeding unit Patch 1 and the second coupling feeding unit Patch 2 face the first part 313 . The connector 14 is disposed on the other surface of the base 11 , that is, disposed facing away from the first portion 313 . One end of the connector 14 is electrically connected to the middle frame 307 , and the other end is electrically connected to the base 11 .

在另一些實施例中，所述天線饋入耦合模組100對應第一部分313、第二縫隙312及第三部分315設置，天線饋入耦合模組100上之金屬層15朝向並抵接第一部分313及第三部分315，且第一耦合饋入單元Patch 1朝向第三部分315，第二耦合饋入單元Patch 2朝向第一部分313。從而使得天線饋入耦合模組100可同時向第一部分313和第三部分315饋入電訊號。In other embodiments, the antenna feed coupling module 100 is disposed corresponding to the first part 313, the second gap 312 and the third part 315, and the metal layer 15 on the antenna feed coupling module 100 faces and contacts the first part. 313 and the third part 315, and the first coupling feed unit Patch 1 faces the third part 315, and the second coupling feed unit Patch 2 faces the first part 313. Therefore, the antenna feeding coupling module 100 can feed electrical signals to the first part 313 and the third part 315 at the same time.

請一併參閱圖6及圖7，第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2包括相應之訊號饋電點（例如第一訊號饋電點port1、第二訊號饋電點port2，即前面所述之訊號饋電點121）。每一訊號饋電點121分別藉由相應之匹配單元電連接至相應之饋入源。例如，所述第一耦合饋入單元Patch 1之第一訊號饋電點port1藉由第一匹配單元151電連接至第一饋入源161。所述第二耦合饋入單元Patch 2之第二訊號饋電點port2藉由第二匹配單元152電連接至第二饋入源162。Please refer to Figure 6 and Figure 7 together. The first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 include corresponding signal feed points (for example, the first signal feed point port1, the second signal feed point port2, which is the signal feed point 121 mentioned above). Each signal feed point 121 is electrically connected to a corresponding feed source through a corresponding matching unit. For example, the first signal feed point port1 of the first coupling feed unit Patch 1 is electrically connected to the first feed source 161 through the first matching unit 151 . The second signal feed point port2 of the second coupling feed unit Patch 2 is electrically connected to the second feed source 162 through the second matching unit 152 .

所述天線饋入耦合模組100中之主動電路13連接至所述連接器14。如圖7所示，所述主動電路13包括切換開關131及第一可調元件132、第二可調元件133。其中，所述切換開關131之一端電連接至所述連接器14，另一端藉由相應之第一可調元件132、第二可調元件133電連接至對應之饋入源。例如，所述切換開關131藉由第一可調元件132電連接至所述第一饋入源161，藉由第二可調元件133電連接至所述第二饋入源162。即，所述匹配電路至少包括第二匹配單元151及第二匹配單元152。The active circuit 13 in the antenna feed coupling module 100 is connected to the connector 14 . As shown in FIG. 7 , the active circuit 13 includes a switch 131 and a first adjustable element 132 and a second adjustable element 133 . One end of the switch 131 is electrically connected to the connector 14 , and the other end is electrically connected to the corresponding feed source through the corresponding first adjustable element 132 and the second adjustable element 133 . For example, the switch 131 is electrically connected to the first feed source 161 through the first adjustable element 132 and is electrically connected to the second feed source 162 through the second adjustable element 133 . That is, the matching circuit at least includes the second matching unit 151 and the second matching unit 152 .

藉由所述第一耦合饋入單元Patch 1、第二耦合饋入單元Patch 2與所述金屬層15耦合電訊號，並藉由所述金屬層15傳導電訊號至所述第一部分313，並藉由所述第一部分313進一步耦合電訊號至第二部分314及第三部分315，所述第一耦合饋入單元Patch 1、第二耦合饋入單元Patch 2與所述第一部分313、第二部分314、第三部分315耦合共振出具有可調性之模態。另外，還可控制所述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2之間之耦合狀態，透過耦合分別產生可調性且天線效率佳之獨立模態。再者，藉由所述主動電路13中之切換開關131之切換，可切換多模態，並使用多個可調元件（例如第一可調元件132、第二可調元件133）實現多個頻段包覆。Electrical signals are coupled to the metal layer 15 through the first coupling feed-in unit Patch 1 and the second coupling feed-in unit Patch 2, and the electrical signals are conducted to the first part 313 through the metal layer 15, and By further coupling electrical signals to the second part 314 and the third part 315 through the first part 313, the first coupling feed-in unit Patch 1 and the second coupling feed-in unit Patch 2 and the first part 313 and the second coupling feed-in unit Patch 2 Part 314 and the third part 315 couple and resonate to produce an adjustable mode. In addition, the coupling state between the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 can also be controlled, and independent modes with adjustability and good antenna efficiency are generated through coupling. Furthermore, by switching the switch 131 in the active circuit 13, multiple modes can be switched, and multiple adjustable elements (such as the first adjustable element 132, the second adjustable element 133) can be used to realize multiple modes. Frequency band coverage.

請一併參閱圖8，為所述電子裝置300之電流路徑示意圖。其中，設置有訊號饋電點port1之第一耦合饋入單元Patch 1可激發中頻及高頻（參路徑Pa）模態，利用狹縫309可耦合共振出中頻及高頻頻段，兼具最佳天線效率，使得所述第一耦合饋入單元Patch 1之工作頻率範圍可涵蓋中頻頻段（1.71 GHz-2.17 GHz）及高頻頻段（2.3 GHz - 2.69 GHz）。Please also refer to FIG. 8 , which is a schematic diagram of the current path of the electronic device 300 . Among them, the first coupling feed unit Patch 1 with a signal feed point port1 can excite the intermediate frequency and high frequency (reference path Pa) modes, and the slit 309 can be used to couple and resonate out the intermediate frequency and high frequency bands, both of which The optimal antenna efficiency enables the operating frequency range of the first coupling feed unit Patch 1 to cover the mid-frequency band (1.71 GHz-2.17 GHz) and high-frequency band (2.3 GHz - 2.69 GHz).

設置有訊號饋電點port2之第二耦合饋入單元Patch 2可激發超高頻（UHB）模態及5G Sub 6 NR模態（參路徑Pb），利用狹縫309可耦合共振出UHB頻段及5G Sub 6 NR頻段，兼具最佳天線效率。使所述第二耦合饋入單元Patch 2之工作頻率範圍可涵蓋超高頻頻段（3.3 GHz- 5 GHz）及5G Sub 6 NR頻段（例如，5G Sub 6 N77頻段（3.3 GHz-4. 2GHz）、5G Sub 6 N78頻段（3.3 GHz-3.8 GHz）與5G Sub 6 N79頻段（4.4 GHz-5 GHz）。The second coupling feed unit Patch 2 provided with signal feed point port2 can excite the ultra-high frequency (UHB) mode and the 5G Sub 6 NR mode (reference path Pb). The slit 309 can be used to couple and resonate out the UHB frequency band and 5G Sub 6 NR frequency band with the best antenna efficiency. The operating frequency range of the second coupling feed unit Patch 2 can cover the ultra-high frequency band (3.3 GHz-5 GHz) and the 5G Sub 6 NR frequency band (for example, the 5G Sub 6 N77 frequency band (3.3 GHz-4. 2GHz) , 5G Sub 6 N78 frequency band (3.3 GHz-3.8 GHz) and 5G Sub 6 N79 frequency band (4.4 GHz-5 GHz).

在本發明一實施例，所述切換開關131為中頻、高頻、UHB及5G Sub 6 NR切換開關，用以切換中頻、高頻、UHB及5G Sub 6 NR頻段。In one embodiment of the present invention, the switch 131 is a mid-frequency, high-frequency, UHB and 5G Sub 6 NR switch, used to switch between mid-frequency, high frequency, UHB and 5G Sub 6 NR frequency bands.

所述天線饋入耦合模組100可應用至電子裝置300中，以提升天線效率頻寬並具有最佳天線效率，且利用所述切換開關131之切換，可有效提升天線頻率覆蓋範圍。具體地，於其中一個實施例中，所述天線饋入耦合模組100適用之工作頻率範圍涵蓋中頻1.71 GHz至2.17 GHz、高頻2.3 GHz至2.69 GHz、超高頻3.3 GHz至5 GHz，並可支援5G Sub 6 N77/N78/N79頻段。The antenna feed coupling module 100 can be applied to the electronic device 300 to improve the antenna efficiency bandwidth and have the best antenna efficiency, and using the switching of the switch 131, the antenna frequency coverage can be effectively improved. Specifically, in one embodiment, the applicable operating frequency range of the antenna feed coupling module 100 covers intermediate frequency 1.71 GHz to 2.17 GHz, high frequency 2.3 GHz to 2.69 GHz, and ultra-high frequency 3.3 GHz to 5 GHz. And can support 5G Sub 6 N77/N78/N79 frequency bands.

所述天線饋入耦合模組100藉由將所述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2設置為獨立之片體，並在適當位置設置相應之訊號饋電點，並藉由所述金屬層15以及電子裝置300之金屬邊框304(例如，第一部分313）作為金屬輻射體，於狹縫309中由所述金屬層15及金屬邊框304與所述第一耦合饋入單元Patch 1與第二耦合饋入單元Patch 2耦合能量共振出模態，涵蓋中、高頻、超高頻、5G Sub 6 N77、5G Sub 6 N78、5G Sub 6 N79頻段，藉以大幅提升其頻寬與天線效率，亦可涵蓋全球常用5G之通訊頻段之應用，以及支援LTE-A（LTE-Advanced之簡稱，是LTE技術之後續演進）之載波聚合應用（Carrier Aggregation，CA）要求。The antenna feed coupling module 100 is configured by configuring the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 as independent pieces, and setting corresponding signal feed points at appropriate positions. And by using the metal layer 15 and the metal frame 304 (for example, the first part 313) of the electronic device 300 as a metal radiator, the metal layer 15 and the metal frame 304 are connected to the first coupling feed in the slit 309. The coupling energy of the input unit Patch 1 and the second coupling feed unit Patch 2 resonates out the mode, covering the medium, high frequency, ultra-high frequency, 5G Sub 6 N77, 5G Sub 6 N78, 5G Sub 6 N79 frequency bands, thereby greatly improving its The bandwidth and antenna efficiency can also cover the application of commonly used 5G communication frequency bands around the world, as well as support the carrier aggregation application (Carrier Aggregation, CA) requirements of LTE-A (abbreviation for LTE-Advanced, the subsequent evolution of LTE technology).

請一併參閱圖9A至圖9C，為所述天線饋入耦合模組100之第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2設置不同之金屬層15（如圖3A未設置金屬層15及圖3B至圖3C所示之金屬層15）時之S參數（散射參數）曲線圖。其中，如圖9A所示，所述第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2未設置金屬層15，並藉由切換開關131切換以產生可調性且天線效率佳之獨立模態，以使第一耦合饋入單元Patch 1涵蓋中頻1.71 GHz-2.17 GHz及高頻2.3 GHz-2.69 GHz；使第二耦合饋入單元Patch 2涵蓋超高頻3.3 GHz-5 GHz及5G Sub 6 N77/N78/N79頻段。如圖9B所示，所述第一耦合饋入單元Patch 1、第二耦合饋入單元Patch 2及圖3B所示之金屬層15藉由切換開關131切換以產生可調性且天線效率佳之獨立模態，以使所述第一耦合饋入單元Patch 1涵蓋中頻1.71 GHz-2.17 GHz及高頻2.3 GHz-2.69 GHz；使所述第二耦合饋入單元Patch 2涵蓋超高頻3.3 GHz-5 GHz及5G Sub 6 N77/N78/N79頻段。如圖9C所示，所述第一耦合饋入單元Patch 1、第二耦合饋入單元Patch 2及圖3C所示之金屬層15藉由切換開關131切換以產生可調性且天線效率佳之獨立模態，以使所述第一耦合饋入單元Patch 1涵蓋中頻1.71 GHz-2.17 GHz及高頻2.3 GHz-2.69 GHz；使所述第二耦合饋入單元Patch 2涵蓋超高頻3.3 GHz-5 GHz及5G Sub 6 N77/N78/N79頻段。Please refer to FIGS. 9A to 9C together. Different metal layers 15 are provided for the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 of the antenna feed coupling module 100 (not provided in FIG. 3A The S parameter (scattering parameter) curve of the metal layer 15 and the metal layer 15 shown in Figures 3B to 3C). Among them, as shown in FIG. 9A, the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 are not provided with a metal layer 15, and are switched by a switch 131 to produce independent antennas with adjustability and good antenna efficiency. mode, so that the first coupling feed unit Patch 1 covers the mid-frequency 1.71 GHz-2.17 GHz and the high frequency 2.3 GHz-2.69 GHz; the second coupling feed unit Patch 2 covers the ultra-high frequency 3.3 GHz-5 GHz and 5G Sub 6 N77/N78/N79 band. As shown in FIG. 9B , the first coupling feed unit Patch 1 , the second coupling feed unit Patch 2 and the metal layer 15 shown in FIG. 3B are switched by the switch 131 to produce independent antennas with adjustability and good antenna efficiency. mode, so that the first coupling feed unit Patch 1 covers the intermediate frequency 1.71 GHz-2.17 GHz and the high frequency 2.3 GHz-2.69 GHz; the second coupling feed unit Patch 2 covers the ultra-high frequency 3.3 GHz- 5 GHz and 5G Sub 6 N77/N78/N79 frequency bands. As shown in FIG. 9C , the first coupling feed unit Patch 1 , the second coupling feed unit Patch 2 and the metal layer 15 shown in FIG. 3C are switched by the switch 131 to produce independent antennas with adjustability and good antenna efficiency. mode, so that the first coupling feed unit Patch 1 covers the intermediate frequency 1.71 GHz-2.17 GHz and the high frequency 2.3 GHz-2.69 GHz; the second coupling feed unit Patch 2 covers the ultra-high frequency 3.3 GHz- 5 GHz and 5G Sub 6 N77/N78/N79 frequency bands.

可以理解，藉由所述切換開關131切換至不同之訊號饋電點，可控制其頻率模態，以涵蓋中頻1.71 GHz-2.17 GHz、高頻2.3 GHz-2.69 GHz，超高頻3.3 GHz-5 GHz，並可支援5G Sub 6 N77/N78/N79頻段。It can be understood that by switching the switch 131 to different signal feed points, its frequency mode can be controlled to cover the intermediate frequency 1.71 GHz-2.17 GHz, the high frequency 2.3 GHz-2.69 GHz, and the ultra-high frequency 3.3 GHz- 5 GHz, and can support 5G Sub 6 N77/N78/N79 frequency bands.

請一併參閱圖10A至圖10C，為所述天線饋入耦合模組100之第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2設置不同之金屬層15（如圖3A未設置金屬層15及圖3B至圖3C所示之金屬層15）時之效率曲線圖。其中，圖10A為所述天線饋入耦合模組100中所述第一耦合饋入單元Patch 1及第二耦合饋入單元Patch 2未設置金屬層15，並藉由切換開關131切換以產生可調性且天線效率佳之獨立模態時，各耦合餽入單元之輻射效率（圖中所示為Rad.）值及總效率（圖中所示為Tot.）值。圖10B為所述天線饋入耦合模組100中所述第一耦合饋入單元Patch 1、第二耦合饋入單元Patch 2及圖3B所示之金屬層15藉由切換開關131切換以產生可調性且天線效率佳之獨立模態時，各耦合餽入單元之輻射效率（圖中所示為Rad.）值及總效率（圖中所示為Tot.）值。圖10C為所述天線饋入耦合模組100中所述第一耦合饋入單元Patch 1、第二耦合饋入單元Patch 2及圖3C所示之金屬層15藉由切換開關131切換以產生可調性且天線效率佳之獨立模態時，各耦合饋入單元之輻射效率（圖中所示為Rad.）值及總效率（圖中所示為Tot.）值。Please refer to FIGS. 10A to 10C together. Different metal layers 15 are provided for the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 of the antenna feed coupling module 100 (not provided in FIG. 3A The efficiency curve of the metal layer 15 and the metal layer 15 shown in Figures 3B to 3C). Among them, FIG. 10A shows that the first coupling feed unit Patch 1 and the second coupling feed unit Patch 2 in the antenna feed coupling module 100 are not provided with a metal layer 15, and are switched by a switch 131 to generate In the independent mode with good tonality and good antenna efficiency, the radiation efficiency (Rad. shown in the figure) value and the total efficiency (Tot. shown in the figure) value of each coupling feed unit. 10B shows that the first coupling feed unit Patch 1, the second coupling feed unit Patch 2 and the metal layer 15 shown in FIG. 3B in the antenna feed coupling module 100 are switched by the switch 131 to generate In the independent mode with good tonality and good antenna efficiency, the radiation efficiency (Rad. shown in the figure) value and the total efficiency (Tot. shown in the figure) value of each coupling feed unit. 10C shows that the first coupling feed unit Patch 1, the second coupling feed unit Patch 2 and the metal layer 15 shown in FIG. 3C in the antenna feed coupling module 100 are switched by the switch 131 to generate In the independent mode with good tonality and good antenna efficiency, the radiation efficiency (Rad. shown in the figure) value and the total efficiency (Tot. shown in the figure) value of each coupling feed unit.

顯然，藉由設置所述切換開關131，並使得所述切換開關131切換至不同之訊號饋電點，以控制頻率模態，進而在涵蓋至中頻（1.71 GHz-2.17 GHz），高頻（2.3 GHz-2.69 GHz），超高頻（3.3 GHz- 5 GHz），並可支援5G Sub 6 N77/N78/N79頻段時，具有較佳之輻射效率。Obviously, by setting the switch 131 and switching the switch 131 to different signal feed points, the frequency mode is controlled, thereby covering the medium frequency (1.71 GHz-2.17 GHz), high frequency ( 2.3 GHz-2.69 GHz), ultra-high frequency (3.3 GHz-5 GHz), and can support 5G Sub 6 N77/N78/N79 frequency bands, with better radiation efficiency.

以上所述，僅為本發明的較佳實施例，並非是對本發明作任何形式上的限定。另外，本領域技術人員還可在本發明精神內做其它變化，當然，這些依據本發明精神所做的變化，都應包含在本發明所要求保護的範圍之內。The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention in any form. In addition, those skilled in the art can also make other changes within the spirit of the present invention. Of course, these changes made based on the spirit of the present invention should be included in the scope of protection claimed by the present invention.

100:天線饋入耦合模組 11:基體 111:第一表面 112:第二表面 113:穿孔、過孔 Patch:耦合饋入單元 Patch 1:第一耦合饋入單元 Patch 2:第二耦合饋入單元 Pa、Pb:路徑 121:訊號饋電點 port1:第一訊號饋電點 port2:第二訊號饋電點 13:主動電路 131:切換開關 132:第一可調元件 133:第二可調元件 14:連接器 300:電子裝置 303:電池 304:金屬邊框 305:背板 306:接地面 307:中框 308:容置空間 309:狹縫 311:第一縫隙 312:第二縫隙 313:第一部分 314:第二部分 315:第三部分 316:接地點 151:第一匹配單元 152:第二匹配單元 161:第一饋入源 162:第二饋入源 100: Antenna feed coupling module 11:Matrix 111: First surface 112: Second surface 113: Perforation, via hole Patch: Coupling feed unit Patch 1: First coupling feed unit Patch 2: Second coupling feed unit Pa, Pb: path 121:Signal feed point port1: the first signal feed point port2: the second signal feed point 13:Active circuit 131:toggle switch 132: First adjustable element 133: Second adjustable element 14:Connector 300: Electronic devices 303:Battery 304:Metal frame 305:Back plate 306: Ground plane 307: middle frame 308: Accommodation space 309:Slit 311:The first gap 312: The second gap 313:Part One 314:Part 2 315:Part 3 316:Grounding point 151: First matching unit 152: Second matching unit 161: First feed source 162: Second feed source

圖1為本申請較佳實施例提供之天線饋入耦合模組之示意圖； 圖2為圖1所示天線饋入耦合模組於另一角度下之示意圖； 圖3A至圖3C為本申請較佳實施例提供之天線饋入耦合模組另一角度之示意圖； 圖4為本申請較佳實施例提供之天線饋入耦合模組設置於電子裝置的金屬邊框一側之示意圖； 圖5為圖4所示天線饋入耦合模組與金屬邊框於另一角度下之示意圖； 圖6為本申請較佳實施例提供之天線饋入耦合模組應用至電子裝置之示意圖； 圖7為圖6所示天線饋入耦合模組中主動電路之電路連接示意圖； 圖8為圖6所示天線饋入耦合模組之電流路徑示意圖； 圖9A至圖9C為圖3A至圖3C所示之天線饋入耦合模組之S參數（散射參數）曲線圖； 圖10A至圖10C為圖3A至圖3C所示之天線饋入耦合模組之效率曲線圖。 Figure 1 is a schematic diagram of an antenna feed coupling module provided by a preferred embodiment of the present application; Figure 2 is a schematic diagram of the antenna feed coupling module shown in Figure 1 from another angle; 3A to 3C are schematic diagrams of the antenna feed coupling module provided by the preferred embodiment of the present application from another angle; Figure 4 is a schematic diagram of an antenna feed coupling module provided on one side of a metal frame of an electronic device according to a preferred embodiment of the present application; Figure 5 is a schematic diagram of the antenna feed coupling module and metal frame shown in Figure 4 from another angle; Figure 6 is a schematic diagram of the application of the antenna feed coupling module provided by the preferred embodiment of the present application to an electronic device; Figure 7 is a circuit connection diagram of the active circuit in the antenna feed coupling module shown in Figure 6; Figure 8 is a schematic diagram of the current path of the antenna feeding into the coupling module shown in Figure 6; Figures 9A to 9C are S-parameter (scattering parameter) curves of the antenna feed coupling module shown in Figures 3A to 3C; FIGS. 10A to 10C are efficiency curves of the antenna feed coupling module shown in FIGS. 3A to 3C .

無without

11:基體 11:Matrix

111:第一表面 111: First surface

112:第二表面 112: Second surface

113:穿孔、過孔 113: Perforation, via hole

Patch1:第一耦合饋入單元 Patch1: First coupling feed unit

Patch2:第二耦合饋入單元 Patch2: Second coupling feed unit

13:主動電路 13:Active circuit

14:連接器 14:Connector

15:金屬層 15:Metal layer

16:非金屬層 16:Non-metallic layer

Claims (10)

一種天線饋入耦合模組，應用於具有金屬邊框及至少一電子組件的電子裝置中，所述金屬邊框與所述至少一電子組件間隔設置形成一狹縫，所述天線饋入耦合模組設置於所述狹縫中，其改良在於，所述天線饋入耦合模組包括基體、至少一耦合饋入單元、主動電路、金屬層及非導電層； 所述至少一耦合饋入單元與所述主動電路分別設置於所述基體相對的兩個表面，且所述至少一耦合饋入單元朝向所述金屬層設置，所述至少一耦合饋入單元之一側設置有至少一訊號饋電點，所述至少一訊號饋電點電性連接至所述主動電路，所述至少一耦合饋入單元為所述金屬層耦合饋入電訊號，所述金屬層傳導所述電訊號至所述金屬邊框，以使所述金屬邊框輻射無線訊號； 所述非導電層設置於所述金屬層與所述至少一耦合饋入單元之間，並覆蓋所述至少一耦合饋入單元；以及 所述主動電路用以切換所述至少一耦合饋入單元的饋入電訊號。 An antenna feed coupling module is used in an electronic device having a metal frame and at least one electronic component. The metal frame is spaced apart from the at least one electronic component to form a slit. The antenna feed coupling module is configured In the slit, the improvement is that the antenna feed coupling module includes a base body, at least one coupling feed unit, an active circuit, a metal layer and a non-conductive layer; The at least one coupling feed unit and the active circuit are respectively disposed on two opposite surfaces of the base body, and the at least one coupling feed unit is disposed toward the metal layer. At least one signal feed point is provided on one side. The at least one signal feed point is electrically connected to the active circuit. The at least one coupling feed unit couples and feeds electrical signals to the metal layer. The metal layer conduct the electrical signal to the metal frame so that the metal frame radiates the wireless signal; The non-conductive layer is disposed between the metal layer and the at least one coupling feed unit and covers the at least one coupling feed unit; and The active circuit is used to switch the feed electrical signal of the at least one coupling feed unit. 如請求項1所述之天線饋入耦合模組，其中所述基體包括第一表面及第二表面，所述第一表面朝向所述金屬層設置，所述第二表面與所述第一表面相對設置，所述耦合饋入單元設置於所述第一表面上，所述天線饋入耦合模組還包括連接器，所述主動電路與所述連接器設置於所述第二表面上。The antenna feed coupling module according to claim 1, wherein the base body includes a first surface and a second surface, the first surface is disposed toward the metal layer, and the second surface and the first surface Oppositely, the coupling feed unit is disposed on the first surface, the antenna feed coupling module further includes a connector, and the active circuit and the connector are disposed on the second surface. 如請求項2所述之天線饋入耦合模組，其中所述基體設置有貫通所述第一表面與所述第二表面之至少一通孔，所述至少一耦合饋入單元通過所述至少一通孔電性連接至所述主動電路。The antenna feed coupling module according to claim 2, wherein the base body is provided with at least one through hole penetrating the first surface and the second surface, and the at least one coupling feed unit passes through the at least one through hole. The hole is electrically connected to the active circuit. 如請求項1所述之天線饋入耦合模組，其中所述主動電路包括切換開關及多個可調元件，藉由將切換開關切換至相應之可調元件及所述至少一訊號饋電點，進而控制所述天線饋入耦合模組之頻率模態，以涵蓋中頻頻段、高頻頻段、超高頻（UHB）頻段、GPS頻段、Wi-Fi 2.4G頻段、Wi-Fi 5G頻段、授權頻譜輔助接入（LAA）頻段、及5G Sub 6 NR頻段。The antenna feed coupling module according to claim 1, wherein the active circuit includes a switch and a plurality of adjustable components, by switching the switch to the corresponding adjustable component and the at least one signal feed point , and then control the frequency mode of the antenna fed into the coupling module to cover the mid-frequency band, high-frequency band, ultra-high frequency (UHB) band, GPS band, Wi-Fi 2.4G band, Wi-Fi 5G band, Licensed spectrum assisted access (LAA) frequency band, and 5G Sub 6 NR frequency band. 如請求項1所述之天線饋入耦合模組，其中所述金屬層在一第一方向上的投影面積與所述非導電層在所述第一方向上的投影面積相同。The antenna feed coupling module according to claim 1, wherein the projected area of the metal layer in a first direction is the same as the projected area of the non-conductive layer in the first direction. 如請求項1所述之天線饋入耦合模組，其中所述金屬層位於所述非導電層在所述第一方向上的投影範圍內。The antenna feed coupling module according to claim 1, wherein the metal layer is located within the projection range of the non-conductive layer in the first direction. 如請求項1所述之天線饋入耦合模組，其中所述金屬層在一第一方向上的投影覆蓋所述至少一耦合饋入單元在所述第一方向上的投影。The antenna feed coupling module according to claim 1, wherein the projection of the metal layer in a first direction covers the projection of the at least one coupling feed unit in the first direction. 如請求項1所述之天線饋入耦合模組，其中所述非導電層由耐燃材料FR4、氧化鋁、Arlon材料、陶瓷等其中一種或多種形成。The antenna feed coupling module according to claim 1, wherein the non-conductive layer is formed of one or more of flame-resistant material FR4, alumina, Arlon material, ceramics, and the like. 如請求項1所述之天線饋入耦合模組，其中所述至少一耦合饋入單元為完整之導電片體。The antenna feed coupling module according to claim 1, wherein the at least one coupling feed unit is a complete conductive sheet. 一種電子裝置，其改良在於，所述電子裝置包括如請求項1至9中任一項所述之天線饋入耦合模組。An electronic device is improved in that the electronic device includes the antenna feed coupling module according to any one of claims 1 to 9.

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